Electrical / electronic component and method for manufacturing electrical / electronic component

Abstract

The present invention is an electrical / electronic component provided with a substrate having a mounting surface with a first direction as a normal direction, and a position detection device mounted on the mounting surface, the position detection device comprising: a first main body part having a first fixing part fixed to a pad provided on the mounting surface by solder; a second main body part which can be displaced relative to the first main body part and can fix the detection object part; a detection mechanism for measuring the relative displacement between the first body part and the second body part; and a first reference portion extending from the first body portion and having a reference surface having a first direction as an in-plane direction, the reference surface having a second-direction-side reference surface facing one of second directions, the second direction being one of the in-plane directions of an intersecting surface intersecting the first direction, the substrate including an abutting portion abutting against the reference surface, and the first reference portion including a second-direction-side reference surface facing the other of the first direction and the second direction being one of the in-plane directions of the intersecting surface intersecting the first direction. The contact portion has a second direction-side contact portion that is in contact with the second direction-side reference surface and positions the detection mechanism. As a result, it is possible to appropriately position the position detection device and the substrate.

Description

TECHNICAL FIELD

[0001] The present application relates to an electric / electronic part and a manufacturing method of an electric / electronic part. BACKGROUND

[0002] In Patent Literature 1, as an electronic part capable of being properly mounted to a printed board, an electronic part is disclosed which has a housing having an opening portion formed in a front surface and a terminal member led toward a rear, and a frame having a pair of board mounting pieces at positions corresponding to side surfaces of the housing and mounted to the housing in a manner of covering the opening portion, the electronic part being mounted to a cutout portion formed in a rim portion of a printed board through the terminal member and the board mounting pieces. In this electronic part, a flat surface portion which makes surface contact with a surface of the printed board is formed in the terminal member, and on the other hand, the board mounting pieces are shaped to allow the flat surface portion to make surface contact with the printed board.

[0003] PRIOR ART DOCUMENTS PATENT LITERATURE Patent Literature 1: Japanese Patent Application Publication No. 2009-272195 SUMMARY

[0004] PROBLEMS TO BE SOLVED BY THE INVENTION In a case where an electronic part is soldered to a board, a positional shift of the electronic part can occur due to a tension of molten solder. If the solder solidifies in a state where the electronic part is shifted in position, a shift occurs between a position at the time of mounting the electronic part to the board and a position after the solder is fixed. In an electronic part in which position detection is performed, in a case where a main body of the electronic part (for example, an outer surface of a housing) is used as a reference for position detection, the position of the electronic part is shifted due to soldering, thereby affecting the accuracy of position detection.

[0005] An object of the present application is to provide an electric / electronic part and a manufacturing method of an electric / electronic part in which a position detection device and a board are properly positioned.

[0006] MEANS FOR SOLVING THE PROBLEMS One embodiment of the present application is an electrical / electronic component including: a substrate having a mounting surface that is normal to a first direction; and a position detection device mounted to the mounting surface, wherein the position detection device includes: a first body portion having a first fixing portion fixed to a land provided on the mounting surface by solder; a second body portion relatively displaceable with respect to the first body portion and capable of fixing a detection target member; a detection mechanism that measures relative displacement of the first body portion and the second body portion; and a first reference portion extending from the first body portion and having a reference surface that is in-plane with the first direction, the reference surface having a second direction side reference surface facing in a second direction, the second direction being one of the in-plane directions of an intersecting surface intersecting the first direction, the substrate having an abutting portion abutting the reference surface, the abutting portion having a second direction side abutting portion that abuts the second direction side reference surface to position the detection mechanism.

[0007] According to such a configuration, when the position detection device is fixed to the land provided on the mounting surface of the substrate by solder, the position detection device is appropriately positioned with respect to the substrate by abutment of the abutting portion of the substrate and the reference surface of the position detection device and abutment of the second direction side abutting portion of the substrate and the second direction side reference surface of the position detection device.

[0008] In the electrical / electronic component described above, the second body portion can have an engaging portion that is rotatable with respect to the first body portion about a rotation axis along the first direction and that can engage the detection target member, the detection mechanism can measure relative displacement in a rotation direction centered on the rotation axis, and the second direction side abutting portion can be a positioning reference in the rotation direction centered on the rotation axis. Thus, the position detection device is appropriately positioned in the rotation direction with respect to the substrate.

[0009] In the electrical / electronic component described above, the second direction side abutting portion can extend in a direction intersecting the first direction and the second direction. Thus, the second direction side reference surface and the second direction side abutting portion are stably positioned by abutment of the surfaces.

[0010] In the electrical / electronic component described above, the position detection device can further include a second reference portion extending from a position of the first body portion different from the first reference portion and having another second direction side reference surface facing in the second direction, the substrate can have another second direction side abutting portion that abuts the other second direction side reference surface to position the detection mechanism in the second direction, and the other second direction side abutting portion can be a positioning reference in a rotation direction centered on a rotation axis of the detection mechanism. Thus, the position detection device is stably positioned in the rotation direction with respect to the substrate.

[0011] In the above-described electric / electronic part, the second direction side reference surface can be constituted by an outer side surface of the first reference portion, and the second direction side abutting portion can be provided to an inner wall of the reference hole receding from the mounting surface toward the first direction. Thus, the first reference portion of the position detection device is fitted into the reference hole of the substrate, and the position detection device is properly positioned with respect to the substrate by abutment of the outer side surface of the first reference portion against the inner wall of the reference hole.

[0012] In this case, it is preferable that a separation distance in the second direction between the second direction side reference surface in the first reference portion and an outer side surface on the side opposite the second direction side reference surface be longer than a hole diameter of the reference hole in the second direction by 400 μm or more. Thus, a sufficient gap is created when the first reference portion of the position detection device is fitted into the reference hole of the substrate.

[0013] In the above-described electric / electronic part, the second direction side reference surface can be constituted by one of two surfaces of the first reference portion that oppose in the second direction, and the second direction side abutting portion can be provided to a wall portion of a reference protrusion protruding from the mounting surface toward the first direction. Thus, the position detection device is properly positioned with respect to the substrate by abutment of the first reference portion of the position detection device against the wall portion of the reference protrusion of the substrate.

[0014] In this case, it is preferable that a separation distance in the second direction between the second direction side reference surface in the first reference portion and the other of the two surfaces that oppose in the second direction be longer than a length of the reference protrusion in the second direction by 400 μm or more. Thus, a sufficient gap is created when the first reference portion of the position detection device abuts against the wall portion of the reference protrusion of the substrate.

[0015] In the above-described electric / electronic part, the second direction side abutting portion can be provided to a side wall of a cutout receding from a side surface of the substrate toward the second direction. Thus, the position detection device is properly positioned with respect to the substrate by abutment of the first reference portion of the position detection device against the cutout side wall of the substrate.

[0016] In the above-described electric / electronic part, the first center, which is the center of the first fixed portion, and the second center, which is the center of the land, can be located at the same position when viewed in the first direction, or the second center can be located on the second direction side of the first center.

[0017] In this case, it is preferable that the position detection device have a plurality of first fixed portions, and the substrate have a plurality of lands corresponding to the plurality of first fixed portions, respectively.

[0018] In the above-described electric / electronic part, the reference surface can have a third-direction-side reference surface toward one of the third direction, which is one of the in-plane directions of the intersecting surface and is a direction intersecting the second direction, and the abutting portion can have a third-direction-side abutting portion that abuts against the third-direction-side reference surface to position the detection mechanism with respect to the substrate in the third direction. Thus, the position detection device is appropriately positioned with respect to the substrate by the abutment of the abutting portion of the substrate against the reference surface of the position detection device, the abutment of the second-direction-side abutting portion of the substrate against the second-direction-side reference surface of the position detection device, and the abutment of the third-direction-side abutting portion of the substrate against the third-direction-side reference surface of the position detection device.

[0019] In this case, it is preferable that, when viewed in the first direction, a first center that is the center of the first fixed portion and a second center that is the center of the pad be located at the same position, or the second center be located at a position that is on the one side of the second direction than the first center and is on the one side of the third direction than the first center.

[0020] In the above-described electric / electronic part, the second-direction-side reference surface can extend in a direction intersecting the first direction and the second direction. Thus, positioning is stable by the abutment of the second-direction-side reference surface against the face of the second-direction-side abutting portion.

[0021] In the above-described electric / electronic part, when viewed in the first direction in the first orientation toward the mounting surface, an end portion of the second-direction-side reference surface can be visually recognized. Thus, when the position detection device is mounted to the mounting surface of the substrate, the arrangement of the first reference portion becomes easy by visually recognizing the end portion of the second-direction-side reference surface from the first direction.

[0022] In the above-described electric / electronic part, when viewed in the first direction in the first orientation toward the mounting surface, an end portion of the other second-direction-side reference surface can be visually recognized. Thus, when the position detection device is mounted to the mounting surface of the substrate, the arrangement of the second reference portion becomes easy by visually recognizing the end portion of the other second-direction-side reference surface from the first direction.

[0023] Another aspect of the present application is a method of manufacturing an electrical / electronic component, the electrical / electronic component including: a substrate having a mounting surface with a first direction as a normal direction; and a position detection device mounted to the mounting surface, wherein the position detection device includes: a first body portion having a first fixing portion fixed to a land provided on the mounting surface by solder; a second body portion relatively displaceable with respect to the first body portion and capable of fixing a detection target member; a detection mechanism measuring relative displacement of the first body portion and the second body portion; and a first reference portion extending from the first body portion in a direction intersecting the first direction and having a reference surface with the first direction as an in-plane direction, the reference surface having a second direction side reference surface toward one of the second directions, the second directions being in-plane directions of an intersecting surface intersecting the first direction, the substrate having an abutting portion abutting the reference surface, the abutting portion having a second direction side abutting portion abutting the second direction side reference surface to position the detection mechanism, the method of manufacturing the electrical / electronic component including: a mounting step of disposing the position detection device on the mounting surface of the substrate so that the land and the first fixing portion face each other with the solder interposed therebetween; and a reflow soldering step of melting and solidifying the solder to fix the first fixing portion to the land via the solder, the second direction side reference surface not being in contact with the second direction side abutting portion at an end time of the mounting step, a second center as a center of the land being located on a side closer to the second direction than a first center as a center of the first fixing portion, the first center being located on a side closer to the second direction than a position at the end time of the mounting step at an end time of the reflow soldering step, the second direction side reference surface being in contact with the second direction side abutting portion, and the detection mechanism being in a positioned state.

[0024] According to such a configuration, in the mounting step, when the position detection device is disposed on the mounting surface of the substrate so that the land and the first fixing portion face each other with the solder interposed therebetween, the second direction side reference surface can not be in contact with the second direction side abutting portion, and rough positioning mounting can be performed. In the reflow soldering step, the second direction side reference surface is brought into contact with the second direction side abutting portion by surface tension generated by melting of the solder, positioning of the detection mechanism is performed, and the solder is solidified in this state.

[0025] In the manufacturing method of the electrical / electronic component described above, the reference surface can have a third direction side reference surface facing the one side in the third direction, the third direction being one of the in-plane directions of the intersecting surfaces and being a direction intersecting the second direction, the abutment portion can have a third direction side abutment portion abutting against the third direction side reference surface to position the detection mechanism in the third direction, at the end time of the mounting step, the second direction side reference surface can not be in contact with the second direction side abutment portion, and the third direction side reference surface can not be in contact with the third direction side abutment portion, the second center can be located at a position on the one side in the second direction and on the one side in the third direction from the first center, at the end time of the reflow soldering step, the first center can be located at a position on the one side in the second direction and on the one side in the third direction from the position at the end time of the mounting step, the second direction side reference surface can be in contact with the second direction side abutment portion, the third direction side reference surface can be in contact with the third direction side abutment portion, and the detection mechanism can be in a state of being positioned with respect to the substrate in the second direction and in the third direction.

[0026] Thus, in the mounting step, the second direction side reference surface can not be in contact with the second direction side abutment portion, and a rough positioning mounting can be performed, and in the reflow soldering step, positioning of the detection mechanism can be performed by contact of the second direction side reference surface with the second direction side abutment portion and contact of the third direction side reference surface with the third direction side abutment portion using surface tension generated by melting of the solder, and the solder can be solidified in this state.

[0027] Effects of Invention According to the present application, an electrical / electronic component and a manufacturing method of an electrical / electronic component in which appropriate positioning of a position detection device and a substrate is performed can be provided. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 is a perspective view illustrating an electrical / electronic component of the present embodiment.

[0029] Figure 2 is a plan view illustrating an electrical / electronic component of the present embodiment.

[0030] Figure 3 is a side view illustrating a position detection device.

[0031] Figure 4 is a perspective view illustrating a position detection device.

[0032] Figure 5 is a plan view illustrating a substrate.

[0033] Figure 6 is a view explaining a manufacturing method of an electrical / electronic component of the present embodiment.

[0034] Figure 7 is a view explaining a manufacturing method of an electrical / electronic component of the present embodiment.

[0035] Figure 8 Fig. 1 is a view for explaining a manufacturing method of an electrical / electronic part according to the present embodiment.

[0036] Figure 9 Fig. 1 is a view for explaining a manufacturing method of an electrical / electronic part according to the present embodiment. DETAILED DESCRIPTION

[0037] Hereinafter, an embodiment of the present application will be described in detail with reference to the drawings. In addition, in the following description, the same components are denoted by the same reference numerals, and the description of components already described once is appropriately omitted.

[0038] (Electrical / Electronic Part) Figure 1 Fig. 1 is a view for explaining a manufacturing method of an electrical / electronic part according to the present embodiment.

[0039] Figure 2 Fig. 1 is a view for explaining a manufacturing method of an electrical / electronic part according to the present embodiment.

[0040] The electrical / electronic part (hereinafter, also referred to as "electronic part") 1 of the present embodiment is provided with a substrate 10 and a position detection device 20. The substrate 10 has a mounting surface 10a which has a first direction as a normal direction. In the present embodiment, as an example, the first direction is set as a Z1-Z2 direction. A land 15 for fixing the position detection device 20 by solder is provided on the mounting surface 10a. The land 15 is provided at a position opposed to a terminal 25 of the position detection device 20 to be soldered.

[0041] The position detection device 20 is provided with a first main body portion 21 having the terminal 25 fixed to the land 15 provided on the mounting surface 10a by solder, and a second main body portion 22 capable of relative displacement with respect to the first main body portion 21 and capable of fixing a detection target component. In the present embodiment, the terminal 25 is an example of a first fixing portion. In addition, an example of the first main body portion 21 is an outer case, and an example of the second main body portion 22 is a shaft holding portion provided so as to be rotatable with respect to the case. An operation hole 22h into which a rotation operation shaft S is inserted and fitted is provided on the second main body portion 22. With rotation of the rotation operation shaft S, the shaft holding portion which is an example of the second main body portion 22 rotates with respect to the case which is an example of the first main body portion 21. The rotation operation shaft S is an example of the detection target component, and the operation hole 22h is an example of an engagement portion into which the detection target component is engaged. For example, it can be that the detection target component is a component having a hole, and the engagement portion is a shaft engaged with the hole of the component.

[0042] Further, the position detection device 20 is provided with a detection mechanism 23 that measures the relative displacement of the first body portion 21 and the second body portion 22. The detection mechanism 23 is housed in the first body portion 21, for example. The detection mechanism 23 detects the relative displacement of the first body portion 21 and the second body portion 22 by a change in resistance value, for example. In the position detection device 20 of the present embodiment, the detection mechanism 23 detects the relative displacement of the first body portion 21 and the second body portion 22 in the rotational direction about the rotational axis O in the first direction (Z1-Z2 direction).

[0043] The position detection device 20 is provided with a first reference portion 30. The first reference portion 30 is provided extending from the first body portion 21, and has a reference surface 31 that is in the in-plane direction of the first direction (Z1-Z2 direction). The reference surface 31 has a second direction side reference surface 311 that faces one of the second direction, which is one of the in-plane directions that cross the first direction. In the present embodiment, as an example, the second direction is set as the Y1-Y2 direction, and one of the second direction is set as the Y1 side.

[0044] The position detection device 20 can also be provided with a second reference portion 40 that is provided extending from a position of the first body portion 21 that is different from the first reference portion 30. The second reference portion 40 has a reference surface 41 that is in the in-plane direction of the first direction (Z1-Z2 direction). The reference surface 41 has another second direction side reference surface 411 that faces one of the second direction (Y1-Y2 direction) (Y1 side).

[0045] Further, in the first reference portion 30 of the position detection device 20, the reference surface 31 can also have a third direction side reference surface 313 that faces one of the third direction (refer to FIG. 2). Figure 3 、 Figure 4 In the present embodiment, as an example, the third direction is set as the X1-X2 direction, and one of the third direction is set as the X1 side.

[0046] The substrate 10 on which the position detection device 20 is mounted is provided with an abutting portion 11 that abuts against the reference surface 31 of the first reference portion 30 of the position detection device 20. The abutting portion 11 has a second direction side abutting portion 111 that abuts against the second direction side reference surface 311 of the first reference portion 30 of the position detection device 20 to position the detection mechanism 23.

[0047] Further, in the case where the position detection device 20 is provided with the other second direction side reference surface 411, the substrate 10 has another second direction side abutting portion 112 that abuts against the other second direction side reference surface 411 (refer to FIG. 2). Figure 5 Further, in the case where the position detection device 20 is provided with the third direction side reference surface 313, the substrate 10 has a third direction side abutting portion 113 that abuts against the third direction side reference surface 313 (refer to FIG. 2).Figure 5 ).

[0048] If the mounting surface 10a of the substrate 10 is provided with the position detection device 20, and the position detection device 20 is fixed to the land 15 provided on the mounting surface 10a by solder, the position detection device 20 is properly positioned in the second direction with respect to the substrate 10 by the abutment of the abutment portion 11 of the substrate 10 and the reference surface 31 of the position detection device 20, specifically, by the abutment of the second direction side abutment portion 111 of the substrate 10 and the second direction side reference surface 311 of the position detection device 20.

[0049] In addition, in the case where the position detection device 20 is provided with another second direction side reference surface 411, proper positioning in the rotational direction of the position detection device 20 is performed by the abutment of the other second direction side reference surface 411 and the other second direction side abutment portion 112. Further, in the case where the position detection device 20 is provided with the third direction side reference surface 313, proper positioning in the third direction of the position detection device 20 is performed by the abutment with the third direction side abutment portion 113.

[0050] (Position detection device) Figure 3 is a side view illustrating the position detection device.

[0051] Figure 4 is a perspective view illustrating the position detection device.

[0052] Figure 3 is a side view illustrating the position detection device 20 as viewed from the Y1 side. Figure 4 is a perspective view illustrating the Y1 side and the X2 side of the position detection device 20 as viewed from the Z2 side in the Z1-Z2 direction.

[0053] The terminal 25 is provided, for example, in such a manner as to extend to the side from the first body portion 21. The lower surface of the terminal 25 opposes the upper surface of the land 15 of the substrate 10 shown in Figure 1 and is disposed so as to face each other when the position detection device 20 is mounted to the substrate 10.

[0054] The first reference portion 30 is provided so as to extend from the first body portion 21 to one side (the X1 side) in the third direction (the X1-X2 direction) which is another direction intersecting the first direction. Further, the first reference portion 30 is provided so as to extend downward (to the Z2 side in the Z1-Z2 direction) from the first body portion 21. The side wall surface of the first reference portion 30 is the reference surface 31, and one (the Y1 side) of two surfaces opposing each other in the second direction (the Y1-Y2 direction) in the side wall surface is the second direction side reference surface 311.

[0055] The end portion of the second-direction-side reference surface 311 in the first reference portion 30 is preferably provided so as to be visually recognizable when viewed in the first direction (Z1-Z2 direction) in the first orientation (Z2 orientation) toward the mounting surface 10a. Thus, as shown in FIG. 6, when the position detection device 20 is mounted to the mounting surface 10a of the substrate 10, the end portion of the second-direction-side reference surface 311 is easily visually recognized (for example, an image is acquired using a camera of a mounter and recognized) from the first direction (Z1-Z2 direction), and the configuration of the first reference portion 30 becomes easy. Figure 2

[0056] The face of the side wall surface of the first reference portion 30 that becomes the reference surface 31 in the one direction (X1 side) toward the third direction (X1-X2 direction) becomes a third-direction-side reference surface 313.

[0057] The second reference portion 40 is provided so as to extend from a position of the first main portion 21 different from the first reference portion 30. For example, in the case where the first reference portion 30 is provided so as to extend toward the X1-X2 direction X1 side of the first main portion 21, the second reference portion 40 is provided so as to extend toward the X1-X2 direction X2 side of the first main portion 21.

[0058] As an example, the second reference portion 40 is provided so as to extend from the first main portion 21 toward the other side (X2 side) of the third direction (X1-X2 direction). Also, the second reference portion 40 is provided so as to extend toward the lower side (Z1-Z2 direction Z2 side) of the first main portion 21. The side wall surface of the second reference portion 40 is a reference surface 41, and one of the two faces (for example, the Y1 side) of the side wall surface that face each other in the second direction (Y1-Y2 direction) becomes another second-direction-side reference surface 411.

[0059] The end portion of the other second-direction-side reference surface 411 in the second reference portion 40 is preferably provided so as to be visually recognizable when viewed in the first direction (Z1-Z2 direction) in the first orientation (Z2 orientation) toward the mounting surface 10a. Thus, as shown in FIG. 6, when the position detection device 20 is mounted to the mounting surface 10a of the substrate 10, the end portion of the other second-direction-side reference surface 411 is easily visually recognized (for example, an image is acquired using a camera of a mounter and recognized) from the first direction (Z1-Z2 direction), and the configuration of the second reference portion 40 becomes easy. Figure 2

[0060] A central protrusion 50 can also be provided at the substantially central portion of the lower surface (Z1-Z2 direction Z2 side) of the first main portion 21. The central protrusion 50 is provided between the first reference portion 30 and the second reference portion 40. Thus, the substantially positioning when the position detection device 20 is mounted to the substrate 10 becomes easy.

[0061] (Substrate)​​ Figure 5 is a plan view of an example substrate.

[0062] A land 15 is provided on the mounting surface 10a of the substrate 10. In the present embodiment, four lands 15 are arranged to oppose four terminals 25 provided on the position detection device 20. The number of terminals 25 and lands 15 is not limited. The abutting portion 11 provided on the substrate 10 has a second direction side abutting portion 111 that abuts against a second direction side reference surface of the reference surface 31 of the position detection device 20.

[0063] In the present embodiment, in the inner wall of the reference hole 10h that recedes from the mounting surface 10a of the substrate 10 in the first direction (for example, the Z1-Z2 direction), a second direction side abutting portion 111 and another second direction side abutting portion 112 are provided on one side (for example, the Y1 side) in the second direction (for example, the Y1-Y2 direction). The second direction side abutting portion 111 and the other second direction side abutting portion 112 can also extend in the third direction (for example, the X1-X2 direction). In addition, on one side (the X1 side) in the third direction (for example, the X1-X2 direction) in the inner wall of the reference hole 10h, a third direction side abutting portion 113 is provided.

[0064] Thus, the first reference portion 30 of the position detection device 20 is inserted into the reference hole 10h of the substrate 10, and the position detection device 20 is properly positioned in the second direction (the Y1-Y2 direction) and the rotational direction with respect to the substrate 10 by the outer side surface (the second direction side reference surface 311) of the first reference portion 30 abutting against the second direction side abutting portion 111 that is the inner wall of the reference hole 10h.

[0065] Here, in the case where the second direction side abutting portion 111 of the substrate 10 extends in a direction (for example, the third direction (X1-X2 direction)) that intersects the first direction and the second direction, the positioning is stable by the second direction side reference surface 311 abutting against the surface of the second direction side abutting portion 111. That is, compared to suppression by a line, suppression by a surface is more capable of improving the function as a rotation stop, and thus becomes more effective as a positioning reference in the rotational direction.

[0066] In addition, the second reference portion 40 of the position detection device 20 is inserted into the reference hole 10h of the substrate 10, and the position detection device 20 is more properly positioned in the second direction (the Y1-Y2 direction) and the rotational direction with respect to the substrate 10 by the outer side surface (the other second direction side reference surface 411) of the second reference portion 40 abutting against the other second direction side abutting portion 112 that is the inner wall of the reference hole 10h.

[0067] In addition, in a case where the second direction side abutting portion 112 of the substrate 10 extends in a direction (for example, the third direction (X1-X2 direction)) intersecting the first direction and the second direction, positioning is stabilized by the second direction side reference surface 411 abutting against the surface of the second direction side abutting portion 112. That is, compared to suppression by a line, suppression by a surface is more capable of improving the function as a rotation stop, and thus becomes more effective as a positioning reference of the rotation direction.

[0068] Also, the first reference portion 30 of the position detection device 20 is fitted into the reference hole 10h of the substrate 10, and the third direction side reference surface 313 of the first reference portion 30 abuts against the third direction side abutting portion 113 of the reference hole 10h, whereby the position detection device 20 is appropriately positioned in one side (X1 side) of the third direction (X1-X2 direction) with respect to the substrate 10.

[0069] In a case where the lower surface of the first main portion 21 is provided with the central protrusion 50, the reference hole 10h is provided with a portion into which the central protrusion 50 is fitted. The portions of the reference hole 10h into which the first reference portion 30, the second reference portion 40, and the central protrusion 50 are fitted can be continuous, or any two of the portions can be continuous, or the portions can be provided independently.

[0070] Further, the second direction side reference surface 311 provided to the substrate 10 can also be provided to a wall portion of a reference protrusion (not shown) protruding from the mounting surface 10a toward the first direction (for example, the Z1-Z2 direction Z1 side).

[0071] In the position detection device 20, there is a case where the positioning reference of the detection mechanism 23 is defined based on the outer shape of the device (absolute linearity). In this case, from the viewpoint of improving detection accuracy, it is necessary to improve the assembly accuracy of the position detection device 20 with respect to the substrate 10. From this viewpoint, the process of positioning the position detection device 20 and the substrate 10 by fitting is performed, but when miniaturization of the device and automation of assembly are addressed, it is sometimes difficult to position the position detection device 20 and the substrate 10 by fitting. Even in such a case, in the present embodiment, the position detection device 20 and the substrate 10 can be appropriately positioned.

[0072] (Method for manufacturing electric / electronic parts) Figures 6 to 9 is a view for explaining the method for manufacturing electric / electronic parts of the present embodiment.

[0073] First, as Figure 6As shown, the substrate 10 and the position detection device 20 are prepared, and the position detection device 20 is disposed on the mounting surface 10a of the substrate 10. The solder 17 is provided in advance on the land 15 of the substrate 10, and by disposing the position detection device 20 on the mounting surface 10a of the substrate 10, the land 15 and the terminal 25 are brought into a state of facing each other with the solder 17 interposed therebetween (mounting step).

[0074] Figure 7 The positional relationship between the substrate 10 and the position detection device 20 when the position detection device 20 is disposed on the mounting surface 10a of the substrate 10 is shown. For ease of explanation, the position detection device 20 is shown by a double-dotted line. In the mounting step, when the position detection device 20 is disposed on the mounting surface 10a of the substrate 10, the first reference portion 30 is fitted into the reference hole 10h of the substrate 10. In addition, in the case where the second reference portion 40 is provided, the second reference portion 40 is also fitted into the reference hole 10h.

[0075] Here, the separation distance in the second direction (Y1-Y2 direction) between the second direction side reference surface 311 in the first reference portion 30 and the outer side surface 315 on the side opposite the second direction side reference surface 311 is shorter than the hole diameter in the second direction (Y1-Y2 direction) of the reference hole 10h. Specifically, it is preferable to be shorter by 400 μm or more. Thus, a sufficient gap is produced when the first reference portion 30 of the position detection device 20 is fitted into the reference hole 10h of the substrate 10.

[0076] In this mounting step, if the end portion of the second direction side reference surface 311 of the first reference portion 30 and the end portion of the other second direction side reference surface 411 of the second reference portion 40 are visually recognizable from the first direction (Z1-Z2 direction), it is easy to acquire and recognize the images of these end portions using, for example, a camera of a mounter, and the disposition of the first reference portion 30 and the second reference portion 40 becomes easy.

[0077] In the state where the first reference portion 30 is fitted into the reference hole 10h, that is, in the stage before the melting and solidification of the solder 17 are performed, the second direction side reference surface 311 in the first reference portion 30 and the second direction side abutting portion 111 that is the inner wall of the reference hole 10h are separated in the second direction (Y1-Y2 direction) (see gap dl in FIG. 10). Figure 7

[0078] In addition, in the case where the second reference portion 40 is provided, in the state where the second reference portion 40 is fitted into the reference hole 10h, the other second direction side reference surface 311 of the second reference portion 40 and the other second direction side abutting portion 112 of the reference hole 10h are separated in the second direction (Y1-Y2 direction) (see gap d2 in FIG. 10). Figure 7 ​The gap d2). Furthermore, when the first reference part 30 is provided with a third-direction reference surface 313, the third-direction reference surface 313 and the third-direction abutment part 113 of the reference hole 10h are separated in the third direction (X1-X2 direction) (see reference). Figure 7 The gap d3).

[0079] That is, such as Figure 7 As shown, at the end of the installation process, the first reference portion 30 and the second reference portion 40 are loosely fitted into the reference hole 10h. In this state, the second-direction side reference surface 311 does not contact the second-direction side abutment portion 111, the other second-direction side reference surface 411 does not contact the other second-direction side abutment portion 112, and the third-direction side reference surface 313 does not contact the third-direction side abutment portion 113. At this time, when viewed from the first direction (Z1-Z2 direction), the first center C1, which is the center of the terminal 25, is not aligned with the second center C2, which is the center of the pad 15. For example, the first center C1 is offset relative to the second center C2 in the XY plane.

[0080] Furthermore, when the first reference part 30 and the second reference part 40 are fitted into the reference hole 10h, the offset of the position detection device 20 in the direction along the mounting surface 10a (in the XY plane) and in the rotational direction around the normal of the mounting surface 10a is limited to some extent.

[0081] Next, after the solder 17 is melted, it is cured, and the terminal 25 is fixed to the pad 15 via the solder 17 (reflow soldering step). When the solder 17 melts in the reflow soldering step, due to the surface tension generated by the melting of the solder 17, the relative positions of the terminal 25 and the pad 15 are matched by the self-alignment effect of the solder 17. As a result, the first center C1 of the terminal 25 moves to a position closer to the second center C2 of the pad 15 than at the end of the installation step. By this movement, the first reference part 30 of the position detection device 20 also moves, and the second direction side reference surface 311 contacts the second direction side abutment part 111. The detection mechanism 23 is positioned by the contact between the second direction side reference surface 311 and the second direction side abutment part 111, and the solder 17 is cured in this state.

[0082] With the second reference part 40 provided, the second reference part 40 also moves in the same way as the first reference part 30, and another second-direction side reference surface 411 comes into contact with the second-direction side abutment part 112. The first reference part 30 abuts with the second-direction side abutment part 111, and the second reference part 40 abuts with the other second-direction side abutment part 112, thereby, the positioning in the XY direction and the positioning in the rotation direction of the position detection device 20 are also performed more appropriately.

[0083] Furthermore, when the first reference part 30 is provided with a third-direction side reference surface 313, the third-direction side reference surface 313 contacts the third-direction side abutment part 113 of the reference hole 10h. As a result, the position detection device 20 is appropriately positioned in the third direction (X1-X2 direction) (X1 side).

[0084] Figure 9 (a) shows a side view illustrating the position of the position detection device 20 after the installation step. Figure 9 (b) shows a side view illustrating the position of the position detection device 20 after the reflow soldering step.

[0085] exist Figure 9 After the installation step shown in (a), since the first reference portion 30 and the second reference portion 40 are loosely fitted into the reference hole 10h, the position detection device 20 is misaligned relative to the substrate 10 within the range of the gap between the reference hole 10h and the first reference portion 30 and the second reference portion 40. In this state, the first center C1, which is the center of the terminal 25, is located at a position offset from the second center C2, which is the center of the pad 15.

[0086] exist Figure 9 After the reflow soldering step shown in (b), the position detection device 20 moves in the direction where the first center C1 of the terminal 25 is aligned with the second center C2 of the pad 15 due to the self-alignment effect generated by the surface tension of the solder 17 during melting (see Figure 1b). Figure 9 (b) Arrow). As the position detection device 20 moves, the first reference part 30 and the second reference part 40 abut against the inner wall of the reference hole 10h, thereby restricting the movement of the position detection device 20 (movement stops). In this state, the solder 17 solidifies, thereby fixing the position detection device 20 at the position where the first center C1 of the terminal 25 is aligned with the second center C2 of the pad 15.

[0087] That is, in this embodiment, during the installation of the position detection device 20 onto the substrate 10 in the installation step, the alignment accuracy of the first reference portion 30 being loosely fitted into the reference hole 10h is allowed, thus achieving easy installation. On the other hand, in the reflow soldering step, the position detection device 20 can be intentionally moved in a predetermined direction by utilizing the self-aligning effect of the solder 17. This movement causes the first reference portion 30 and the second reference portion 40 to abut against the inner wall of the reference hole 10h, thereby achieving proper positioning of the position detection device 20 onto the substrate 10. After the reflow soldering step, at the first center C1 of the terminal 25 (refer to...) Figure 8 ) and the second center C2 of pad 15 (refer to Figure 8 The position is aligned and the position detection device 20 is fixed.

[0088] According to the present embodiment, an electrical / electronic component 1 in which the position detecting device 20 is appropriately positioned with respect to the substrate 10 and a manufacturing method of the electrical / electronic component 1 can be provided.

[0089] In addition, the present embodiment has been described above, but the present application is not limited to these examples. For example, the second direction side abutting portion 111 can also be provided to the side wall of the cutout that retreats in the second direction from the side surface of the substrate 10. Thereby, the first reference portion 30 of the position detecting device 20 is abutted against the cutout side wall of the substrate 10, and thus the position detecting device 20 is appropriately positioned with respect to the substrate 10. In addition, with respect to each of the above-described embodiments, the addition, deletion, design change of the constituent elements, the appropriate combination of the features of the constituent examples of each of the embodiments by the person skilled in the art are included in the scope of the present application as long as the gist of the present application is possessed.

[0090] Explanation of Reference Numerals 1 … Electrical / electronic component 10 … Substrate 10a … Mounting surface 10h … Reference hole 11 … Abutting portion 15 … Pad 17 … Solder 20 … Position detecting device 21 … First body portion 22 … Second body portion 22h … Operation hole (engagement portion) 23 … Detecting mechanism 25 … Terminal 30 … First reference portion 31, 41 … Reference surface 40 … Second reference portion 50 … Central protrusion 111 … Second direction side abutting portion 112 … Another second direction side abutting portion 113 … Third direction side abutting portion 311 … Second direction side reference surface 313 … Third direction side reference surface 315 … Outer side surface 411 … Another second direction side reference surface C1 … First center C2 … Second center O … Rotation axis d1, d2, d3 … Gap S … Rotation operation axis (detecting object member)

Claims

1. An electrical / electronic component comprising: a substrate having a mounting surface with a first direction as its normal direction; and a position detection device mounted on said mounting surface, characterized in that, The position detection device includes: The first main body has a first fixing part that is fixed to a solder pad provided on the mounting surface by solder; The second main body is capable of relative displacement with respect to the first main body and is capable of fixing the detection target component. The testing agency measures the relative displacement between the first main body and the second main body; as well as A first reference portion extends from the first main body portion and has a reference plane with the first direction as its in-plane direction. The reference plane has a second-direction side reference plane facing a second direction, which is one of the in-plane directions of an intersecting plane that intersects the first direction. The substrate has an abutting portion that abuts against the reference surface. The abutting portion has a second-direction-side abutting portion that abuts against the second-direction-side reference surface to position the detection mechanism.

2. The electrical / electronic component according to claim 1, wherein, The second main body has a locking portion that is rotatable relative to the first main body about a rotation axis and is capable of engaging with the detection object component, the rotation axis being along the first direction. The detection mechanism measures the relative displacement in the direction of rotation centered on the rotation axis. The second directional side abutment portion is a positioning reference for the rotational direction centered on the rotation axis.

3. The electrical / electronic component according to claim 2, wherein, The second direction side abutment portion extends in a direction that intersects with the first direction and the second direction.

4. The electrical / electronic component according to claim 2, wherein, The position detection device further includes a second reference portion, which extends from the first main body at a position different from the first reference portion, and has a second-direction side reference surface facing the first direction. The substrate has a second-direction-side abutment portion that abuts against the other second-direction-side reference surface to position the detection mechanism in the second direction. The other second-direction side abutment is the positioning reference of the detection mechanism in the rotation direction centered on the rotation axis.

5. The electrical / electronic component according to claim 1, wherein, The second directional reference plane is formed by the outer surface of the first reference portion. The second direction side abutment portion is provided on the inner wall of the reference hole that is recessed from the mounting surface in the first direction.

6. The electrical / electronic component according to claim 5, wherein, The separation distance between the second direction side reference surface in the first reference part and the outer side surface opposite to the second direction side reference surface in the second direction is more than 400 μm shorter than the aperture in the second direction of the reference hole.

7. The electrical / electronic component according to claim 1, wherein, The second direction-side reference plane is formed by one of two surfaces located opposite each other in the second direction and disposed on the first reference portion. The second direction side abutment is provided on the wall of a reference protrusion that protrudes from the mounting surface in the first direction.

8. The electrical / electronic component according to claim 7, wherein, The separation distance between the second direction side reference surface in the first reference portion and the other surface of the two opposing surfaces in the second direction in the second direction is more than 400 μm longer than the length of the reference protrusion in the second direction.

9. The electrical / electronic component according to claim 1, wherein, The second direction side abutment portion is provided on the sidewall of the cut that moves backward from the side of the substrate in the second direction.

10. The electrical / electronic component according to claim 1, wherein, When viewed in the first direction, The first center, which is the center of the first fixing part, and the second center, which is the center of the solder pad, are located at the same position. Alternatively, the second center may be located on the side of the second direction that is closer to the first center.

11. The electrical / electronic component according to claim 10, wherein, The position detection device has a plurality of first fixing parts, and the substrate has a plurality of solder pads corresponding to the plurality of first fixing parts.

12. The electrical / electronic component according to claim 1, wherein, The reference plane has a third-direction side reference plane facing a third direction, wherein the third direction is one of the in-plane directions of the intersecting plane and is a direction that intersects the second direction. The abutting portion has a third-direction abutting portion, which abuts against the third-direction reference surface to position the detection mechanism relative to the substrate in the third direction.

13. The electrical / electronic component according to claim 12, wherein, When viewed in the first direction, The first center, which is the center of the first fixing part, and the second center, which is the center of the solder pad, are located at the same position. Alternatively, the second center may be located on the side of the second direction that is closer to the first center and on the side of the third direction that is closer to the first center.

14. The electrical / electronic component according to claim 2, wherein, The second direction side reference plane extends in a direction that intersects the first direction and the second direction.

15. The electrical / electronic component according to claim 1, wherein, The end of the second direction side reference surface can be visually identified when viewed in the first direction toward the mounting surface.

16. The electrical / electronic component according to claim 4, wherein, The end of the other second-direction side reference surface can be visually identified when viewed in the first orientation toward the mounting surface in the first direction.

17. A method for manufacturing an electrical / electronic component, the electrical / electronic component comprising: a substrate having a mounting surface with a first direction as its normal direction; and a position detection device mounted on the mounting surface, characterized in that, The position detection device includes: The first main body has a first fixing part that is fixed to a solder pad provided on the mounting surface by solder; The second main body is capable of relative displacement with respect to the first main body and is capable of fixing the detection target component. The testing agency measures the relative displacement between the first main body and the second main body; as well as A first reference portion extends from the first main body portion in a direction intersecting the first direction and has a reference plane with the first direction as its in-plane direction. The reference plane has a second-direction side reference plane facing a second direction, which is one of the in-plane directions of an intersecting plane that intersects the first direction. The substrate has an abutment portion that contacts the reference surface. The abutting portion has a second-direction-side abutting portion that abuts against the second-direction-side reference surface to position the detection mechanism. Manufacturing the electrical / electronic component includes the following steps: In the installation step, the position detection device is disposed on the mounting surface of the substrate, such that the pad is positioned opposite the first fixing part through solder. as well as The reflow soldering step melts and solidifies the solder, thereby fixing the first fixing part to the pad. At the end of the installation step, the reference surface on the second direction side is not in contact with the abutment portion on the second direction side, and the second center, which is the center of the pad, is located on the side of the second direction side closer than the first center, which is the center of the first fixing portion. At the end of the reflow soldering step, the first center is located on one side of the second direction, which is closer to the position at the end of the installation step than the position at the end of the installation step. The reference surface on the second direction side is in contact with the abutment portion on the second direction side, and the detection mechanism is in a positioned state.

18. The method for manufacturing an electrical / electronic component according to claim 17, wherein, The reference plane has a third-direction side reference plane facing a third direction, wherein the third direction is one of the in-plane directions of the intersecting plane and is a direction that intersects the second direction. The abutment portion has a third-party abutment portion that abuts against the third-party reference surface to position the detection mechanism upward on the third side. At the end of the installation step, the second-direction reference surface and the second-direction abutment portion are not in contact, and the third-direction reference surface and the third-direction abutment portion are not in contact. The second center is located on the side of the second direction and the side of the third direction that is closer to the first center than the first center. At the end of the reflow soldering step, the first center is located on one side of the second direction and on one side of the third direction, which is closer than the position at the end of the mounting step. The reference surface on the second direction side is in contact with the abutment portion on the second direction side, and the reference surface on the third direction side is in contact with the abutment portion on the third direction side. The detection mechanism is in a state of being positioned relative to the substrate in the second direction and the third direction.

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