5G communication module mainboard test carrier with plugging mechanism and test loading method thereof

Abstract

The invention relates to a 5G communication module mainboard test carrier with a plugging mechanism and a test loading method thereof. The 5G communication module mainboard test carrier comprises a base; a guide column is mounted on the base; the device further comprises a movable frame, and a sliding sleeve is installed on the movable frame. A wiring module; the wiring module is mounted on one side of the base; the clamping mechanism comprises an upper pressing plate and a lower pressing plate; the upper pressing plate is rotationally mounted on the movable frame; the lower pressing plate is in sliding connection with the movable frame; the lower pressing plate is connected with the base through a supporting piece. The upper pressing plate can rotate to get close to the lower pressing plate so as to clamp the mainboard; the device further comprises a plugging mechanism, and the plugging mechanism can drive the moving frame to move towards the wiring module, thereby driving the mainboard to move synchronously, and enabling the mainboard to be in butt joint with the wiring module. The butt joint of the mainboard and the wiring module can be more accurate, and the risk of connection errors or poor contact is reduced; and the process of inserting the mainboard into the wiring module is elastic contact, so that the impact damage during butt joint can be reduced.

Description

Technical Field

[0001] This invention relates to a motherboard testing carrier, specifically a 5G communication module motherboard testing carrier with a plug-in mechanism and its testing loading method. Background Technology

[0002] 5G communication module motherboard testing includes RF performance (transmit power, receive sensitivity), electromagnetic compatibility, and environmental reliability (high / low temperature, damp heat cycling, insertion / removal stability). Testing can expose potential faults early and optimize the performance of the baseband chip, RF front-end, and antenna. During testing, a test fixture is often required to secure the motherboard and interface it with the test module.

[0003] Common test fixtures include clamps (including support plates and pressure plates (flip-top type) that are slidably (rail type) or rotatably connected to the support plates), wiring modules (which can establish communication with the motherboard), and plug-in mechanisms (used to move the clamps closer to or away from the wiring modules to complete the docking between the motherboard and the wiring modules).

[0004] Since all signals between the wiring module and the motherboard are transmitted through the gold fingers, common test fixtures adjust the horizontal position of the support plate and the wiring module in advance (there is a certain height difference between the two) to ensure a tight connection when connecting the motherboard and the wiring module. Common plugging and unplugging mechanisms all use rigid docking (screw drive, hydraulic drive), and the instantaneous kinetic energy during docking is relatively large. The crystal oscillator, ceramic capacitor, and some chip packages on the motherboard are brittle materials. The large instantaneous impact force during docking is like a hammer hitting them, causing internal micro-cracks or direct breakage. Even if there is no external damage, internal damage may lead to electrical performance failure. Summary of the Invention

[0005] The purpose of this invention is to provide a 5G communication module motherboard test carrier with a plug-in mechanism and its test loading method, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: A 5G communication module motherboard test carrier with a plug-in mechanism includes a base; multiple sets of symmetrically arranged guide pillars are installed on the base. It also includes a movable frame on which a sliding sleeve is mounted to slide and engage with the guide post; Wiring module; the wiring module is installed on one side of the base; The clamping mechanism includes an upper pressure plate and a lower pressure plate; wherein the upper pressure plate is rotatably mounted on the movable frame; the lower pressure plate is slidably connected to the movable frame; and the lower pressure plate is connected to the base through a support member; the upper pressure plate can rotate to approach the lower pressure plate to clamp the main board; It also includes a plug-in mechanism, which can drive the movable frame to move toward the wiring module, thereby driving the motherboard to move synchronously to dock with the wiring module.

[0007] As a further aspect of the present invention: the clamping mechanism further includes a movable sleeve slidably mounted on the sliding sleeve, and a hinge rod rotatably mounted on the movable sleeve and rotatably connected to the upper pressure plate; a first fixed post is mounted on the movable sleeve; a second fixed post is mounted on the hinge rod; and the first fixed post and the second fixed post are connected by a tension spring.

[0008] As a further embodiment of the present invention: a buffer spring is wrapped around the sliding sleeve; one end of the buffer spring abuts against the sliding sleeve; and the other end of the spring abuts against the movable sleeve.

[0009] As a further embodiment of the present invention: the support member includes a telescopic sleeve mounted on the base; a support plate is provided on the base, a telescopic column is mounted on the support plate and slidably engaged with the telescopic sleeve, a support spring is provided inside the telescopic sleeve, the two ends of the support spring respectively abut against the telescopic column and the base, a guide rail is mounted on the support plate, and a slider is mounted on the lower pressure plate and slidably engaged with the guide rail.

[0010] As a further aspect of the present invention: the elastic force of the tension spring is always greater than the elastic force of the support spring and the buffer spring.

[0011] As a further embodiment of the present invention: the insertion and removal mechanism includes a motor mounted on the base, a lead screw is mounted on the output end of the motor, and a threaded sleeve connected to the movable frame is threadedly connected to the lead screw; the threaded sleeve is slidably connected to the base.

[0012] As a further embodiment of the present invention: the insertion and extraction mechanism further includes a baffle mounted on the lead screw; a first spring and a second spring are wrapped around the lead screw; wherein the two ends of the first spring abut against the threaded sleeve and the movable frame respectively, and the two ends of the second spring abut against the baffle and the movable frame respectively.

[0013] As a further embodiment of the present invention: the lower pressure plate is parallel to the wiring module.

[0014] As a further aspect of the present invention: a slot is provided on the upper pressure plate, and the slot is used to protect the motherboard.

[0015] A loading method for testing a 5G communication module motherboard using a test carrier with a plug-in mechanism as described above includes the following steps: Step 1: Place the motherboard to be tested on the pressure plate and adjust its position; Step 2: Secure the motherboard to the lower pressure plate using the clamping mechanism; Step 3: Adjust the motherboard's horizontal height using the support components to align the motherboard with the wiring module; Step 4: Control the insertion and removal mechanism to move the motherboard closer to the wiring module via the pressure plate.

[0016] Compared with the prior art, the beneficial effects of the present invention are: The clamping mechanism secures the motherboard, significantly increasing the difficulty of displacement during the insertion / removal mechanism. This prevents misalignment during insertion / removal that could lead to poor contact and affect the accuracy of test results, as well as motherboard damage. The insertion / removal mechanism brings the motherboard closer to and inserts it into the wiring module, ensuring more precise connection and reducing the risk of connection errors or poor contact. The buffering effect of the first and second springs reduces the instantaneous kinetic energy of the motherboard during connection with the wiring module, preventing damage to the motherboard during rapid movement and extending the lifespan of both the carrier and the motherboard. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of an embodiment of a 5G communication module motherboard test carrier with a plug-in mechanism and its test loading method.

[0018] Figure 2 This is a schematic diagram of another perspective of an embodiment of a 5G communication module motherboard test carrier with a plug-in mechanism and its test loading method.

[0019] Figure 3 for Figure 2 A structural schematic diagram from a cross-sectional perspective.

[0020] Figure 4 for Figure 3 A schematic diagram of the structure at point A in the middle.

[0021] Figure 5 This is a schematic diagram of the structure of the plug-in mechanism in one embodiment of a 5G communication module motherboard test carrier with a plug-in mechanism and its test loading method.

[0022] Figure 6 This is a schematic diagram of the support structure in one embodiment of a 5G communication module motherboard test carrier with a plug-in mechanism and its test loading method.

[0023] Figure 7 for Figure 6 A structural diagram from the perspective of an explosion.

[0024] Figure 8 This is a schematic diagram of the clamping mechanism in one embodiment of a 5G communication module motherboard test carrier with a plug-in mechanism and its test loading method.

[0025] Figure 9 for Figure 8 A structural diagram from the perspective of an explosion.

[0026] In the diagram: 1. Base; 101. Telescopic sleeve; 2. Support plate; 201. Telescopic column; 202. Guide rail; 3. Guide post; 4. Moving frame; 401. Sliding sleeve; 5. Lower pressure plate; 501. Slider; 6. Support spring; 7. Movable sleeve; 701. First fixed post; 8. Hinge rod; 801. Second fixed post; 9. Upper pressure plate; 10. Tension spring; 11. Buffer spring; 12. Electric motor; 13. Lead screw column; 14. Threaded sleeve; 1401. Baffle; 15. The first spring; 16. The second spring; 17. Wiring module. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] Furthermore, elements in this invention are referred to as being "fixed to" or "set on" another element, which may be directly on the other element or may also include an intervening element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or may also include an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementations.

[0029] Please see Figures 1-9 In this embodiment of the invention, a 5G communication module motherboard test carrier with a plug-in mechanism includes a base 1; multiple sets of symmetrically arranged guide posts 3 are installed on the base 1. It also includes a movable frame 4, on which a sliding sleeve 401 is mounted to slide and engage with the guide post 3; Wiring module 17; the wiring module 17 is installed on one side of the base 1; The clamping mechanism includes an upper pressure plate 9 and a lower pressure plate 5; wherein the upper pressure plate 9 is rotatably mounted on the movable frame 4; the lower pressure plate 5 is slidably connected to the movable frame 4; and the lower pressure plate 5 is connected to the base 1 through a support member; the upper pressure plate 9 can rotate to approach the lower pressure plate 5 to clamp the main board; It also includes a plug-in mechanism, which can drive the movable frame 4 to move toward the wiring module 17, thereby driving the motherboard to move synchronously to dock with the wiring module 17.

[0030] Taking the embodiment combining all the features described in this application as an example, when using it, the motherboard is placed horizontally on the lower pressure plate 5 and its position is adjusted.

[0031] The motherboard is then secured to the lower pressure plate 5 by a clamping mechanism. This is achieved by applying external force to rotate the upper pressure plate 9, bringing it closer to the motherboard. Once the upper pressure plate 9 has rotated past its equilibrium position, it will rotate autonomously (without external force) until it comes into contact with the motherboard (the motherboard is located between the upper pressure plate 9 and the lower pressure plate 5, and all three are parallel to each other). At this point, the clamping action of the upper pressure plate 9 and the lower pressure plate 5 on the motherboard greatly increases the difficulty of displacement of the motherboard during the insertion and removal mechanism. This prevents poor contact due to misalignment during insertion and removal, which could affect the accuracy of the test results and also prevent damage to the motherboard.

[0032] Furthermore, during the clamping process, the support will adjust the position of the motherboard. That is, the rotating upper pressure plate 9 will squeeze the motherboard, thereby squeezing the lower pressure plate 5, so that it moves closer to the base 1 on the moving frame 4, thereby aligning the motherboard with the wiring module 17. On the one hand, this can avoid damage to the motherboard due to excessive clamping force; on the other hand, it can align the motherboard with the wiring module 17, thereby protecting the motherboard and the wiring module 17 and improving the service life of the carrier.

[0033] After the motherboard is secured, the control insertion mechanism is activated, which moves the moving frame 4 closer to the wiring module 17, thereby bringing the motherboard closer to and inserting it into the wiring module 17. This makes the connection between the motherboard and the wiring module 17 more precise, reducing the risk of connection errors or poor contact. Furthermore, since the process of inserting the motherboard into the wiring module 17 is an elastic contact, it can reduce impact damage during the connection.

[0034] In another embodiment of the present invention, the clamping mechanism further includes a movable sleeve 7 slidably mounted on the sliding sleeve 401, and a hinge rod 8 rotatably mounted on the movable sleeve 7 and rotatably connected to the upper pressure plate 9; a first fixing post 701 is mounted on the movable sleeve 7; a second fixing post 801 is mounted on the hinge rod 8; the first fixing post 701 and the second fixing post 801 are connected by a tension spring 10.

[0035] Taking the embodiment combining all the features described in this application as an example, when in use, the balance position is: the second fixed post 801 is located on the extension line of the line connecting the rotation center of the first fixed post 701 and the hinge rod 8.

[0036] In the initial position, the second fixing post 801 is located on the side away from the wiring module 17 in the balance position, and the tension spring 10 is in a stretched state. Under the elastic force of the tension spring 10, the upper pressure plate 9 is located away from the lower pressure plate 5, which facilitates the placement and position adjustment of the main board.

[0037] After the motherboard is placed, an external force is applied to make the upper pressure plate 9 rotate closer to the lower pressure plate 5. During this process, the rotating upper pressure plate 9 will drive the movable sleeve 7 to slide on the sliding sleeve 401 through the hinge rod 8 (the included angle between the hinge rod 8 and the upper pressure plate 9 and the movable sleeve 7 changes), thereby making the second fixed column 801 gradually approach the equilibrium position.

[0038] When the second fixed post 801 passes the equilibrium position, the elastic force of the tension spring 10 will cause the second fixed post 801 to gradually move away from the equilibrium position, thereby causing the hinge rod 8 to rotate, so that the upper pressure plate 9 continues to rotate and moves closer to the lower pressure plate 5, thereby causing the movable sleeve 7 to continue to slide. During this process, no external force is required, so the motherboard can be fastened with relatively little effort. At this time, the clamping action of the upper pressure plate 9 and the lower pressure plate 5 on the motherboard makes it much more difficult for the motherboard to move when the insertion and removal mechanism is activated, avoiding poor contact due to misalignment when inserting and removing the motherboard, which would affect the accuracy of the test results and also prevent damage to the motherboard.

[0039] In another embodiment of the present invention, a buffer spring 11 is wrapped around the sliding sleeve 401; one end of the buffer spring 11 abuts against the sliding sleeve 401; and the other end may abut against the movable sleeve 7.

[0040] Taking the embodiment combining all the features described in this application as an example, during use, the movable sleeve 7 will contact the buffer spring 11 during the clamping process; then the movable sleeve 7 will squeeze the buffer spring 11, causing it to gradually compress; through the buffering effect of the buffer spring 11, the instantaneous kinetic energy of the upper pressure plate 9 contacting the motherboard can be reduced, avoiding excessive instantaneous kinetic energy from damaging the motherboard and affecting subsequent testing of the motherboard.

[0041] In another embodiment of the present invention, the support member includes a telescopic sleeve 101 mounted on the base 1; a support plate 2 is provided on the base 1, and a telescopic column 201 that slides and engages with the telescopic sleeve 101 is mounted on the support plate 2; a support spring 6 is provided inside the telescopic sleeve 101, and the two ends of the support spring 6 respectively abut against the telescopic column 201 and the base 1; a guide rail 202 is mounted on the support plate 2; and a slider 501 that slides and engages with the guide rail 202 is mounted on the lower pressure plate 5.

[0042] In another embodiment of the present invention, the elastic force of the tension spring 10 is always greater than the elastic force of the support spring 6 and the buffer spring 11.

[0043] Taking the embodiment combining all the features described in this application as an example, in the initial state, the pressure plate 5 is flush with the moving frame 4.

[0044] During the clamping process, the rotating upper pressure plate 9 will contact the motherboard. The pressure of the upper pressure plate 9 on the motherboard will cause the lower pressure plate 5 to slide inward within the moving frame 4, thereby causing the motherboard to sink. During this process, the lower pressure plate 5 will drive the support plate 2 to move closer to the base 1 through the guide rail 202 and the slider 501, thereby causing the telescopic column 201 to slide inward within the telescopic sleeve 101 to compress the support spring 6.

[0045] By utilizing the elastic force of the supporting spring 6 and the tension spring 10, the upper pressure plate 9 and the lower pressure plate 5 can be made to make close contact with the motherboard, thereby greatly increasing the difficulty of displacing the motherboard and avoiding overpressure or impact, thus protecting the motherboard and wiring module 17 from damage.

[0046] In another embodiment of the present invention, the insertion and removal mechanism includes a motor 12 mounted on the base 1, a lead screw 13 mounted on the output end of the motor 12, and a threaded sleeve 14 connected to the movable frame 4 threadedly connected to the lead screw 13; the threaded sleeve 14 is slidably connected to the base 1.

[0047] Taking the embodiment combining all the features described in this application as an example, when in use, after the main board is fastened to the lower pressure plate 5, the control motor 12 rotates, thereby causing the lead screw column 13 to rotate, and through the threaded engagement, the threaded sleeve 14 moves along the length direction of the lead screw column 13 to approach the wiring module 17; during this process, the threaded sleeve 14 will drive the moving frame 4 to approach the wiring module 17, thereby driving the main board to approach and insert into the wiring module 17. The moving frame 4 is driven by the insertion and removal mechanism to realize the automatic insertion and removal of the main board, reducing manual operation and improving testing efficiency and production throughput (that is, it can ensure that the insertion depth of the main board is consistent each time, thereby improving the accuracy of testing).

[0048] In another embodiment of the present invention, the insertion and extraction mechanism further includes a baffle 1401 mounted on the lead screw 13; a first spring 15 and a second spring 16 are wrapped around the lead screw 13; wherein the two ends of the first spring 15 abut against the threaded sleeve 14 and the movable frame 4 respectively, and the two ends of the second spring 16 abut against the baffle 1401 and the movable frame 4 respectively.

[0049] Taking the embodiment combining all the features described in this application as an example, during use, the threaded sleeve 14 moves on the lead screw 13, and the moving frame 4 is driven to move by the first spring 15. During the movement, the compression of the first spring 15 and the second spring 16 gradually increases.

[0050] The buffering effect of the first spring 15 and the second spring 16 can reduce the instantaneous kinetic energy of the motherboard and the wiring module 17 during connection, prevent the motherboard from being damaged during rapid movement, and extend the service life of the carrier and the motherboard.

[0051] In another embodiment of the present invention, the lower pressure plate 5 is parallel to the wiring module 17.

[0052] Taking the embodiment combining all the features described in this application as an example, when in use, after the motherboard is placed on the lower pressure plate 5, the lower pressure plate 5 of the parallel wiring module 17 can align the motherboard and the wiring module 17 with each other. This prevents the motherboard from being inserted into the wiring module 17 at an angle, thereby protecting the motherboard and the wiring module 17.

[0053] In another embodiment of the present invention, the upper pressure plate 9 is provided with a slot, which is used to protect the motherboard.

[0054] Taking the embodiment combining all the features described in this application as an example, when in use, the opening of the slot can prevent the components soldered on the motherboard from contacting the upper pressure plate 9, thereby ensuring that the performance of the motherboard is not damaged, and thus improving the accuracy of the test.

[0055] A loading method for testing a 5G communication module motherboard using a test carrier with a plug-in mechanism as described above includes the following steps: Step 1: Place the motherboard to be tested on the pressure plate 5 and adjust its position; Step 2: Secure the motherboard to the lower pressure plate 5 using the clamping mechanism; Step 3: Adjust the horizontal height of the motherboard using the support to align the motherboard with the wiring module 17; Step 4: Control the insertion and removal mechanism to move the main board closer to and insert it into the wiring module 17 via the pressure plate 5.

[0056] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0057] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A 5G communication module motherboard test carrier with a plug-in mechanism, comprising a base (1); wherein a plurality of symmetrically arranged guide posts (3) are installed on the base (1). Its features are, It also includes a movable frame (4), on which a sliding sleeve (401) is installed that slides into the guide post (3). Wiring module (17); the wiring module (17) is installed on one side of the base (1); The clamping mechanism includes an upper pressure plate (9) and a lower pressure plate (5); wherein the upper pressure plate (9) is rotatably mounted on the movable frame (4); the lower pressure plate (5) is slidably connected to the movable frame (4); and the lower pressure plate (5) is connected to the base (1) by a support member; the upper pressure plate (9) can rotate to approach the lower pressure plate (5) to clamp the main board; It also includes a plug-in mechanism, which can drive the moving frame (4) to move toward the wiring module (17), thereby driving the motherboard to move synchronously to dock with the wiring module (17).

2. The 5G communication module motherboard test carrier with a plug-in mechanism according to claim 1, characterized in that, The clamping mechanism further includes a movable sleeve (7) slidably mounted on the sliding sleeve (401), and a hinge rod (8) rotatably mounted on the movable sleeve (7) and rotatably connected to the upper pressure plate (9); a first fixed post (701) is mounted on the movable sleeve (7); a second fixed post (801) is mounted on the hinge rod (8); the first fixed post (701) and the second fixed post (801) are connected by a tension spring (10).

3. A 5G communication module motherboard test carrier with a plug-in mechanism according to claim 2, characterized in that, A buffer spring (11) is wrapped around the sliding sleeve (401); one end of the buffer spring (11) abuts against the sliding sleeve (401); the other end of the spring abuts against the movable sleeve (7).

4. A 5G communication module motherboard test carrier with a plug-in mechanism according to claim 3, characterized in that, The support includes a telescopic sleeve (101) mounted on the base (1); a support plate (2) is provided on the base (1), and a telescopic column (201) that slides and engages with the telescopic sleeve (101) is installed on the support plate (2). A support spring (6) is provided inside the telescopic sleeve (101), and the two ends of the support spring (6) abut against the telescopic column (201) and the base (1) respectively. A guide rail (202) is installed on the support plate (2), and a slider (501) that slides and engages with the guide rail (202) is installed on the lower pressure plate (5).

5. A 5G communication module motherboard test carrier with a plug-in mechanism according to claim 4, characterized in that, The elastic force of the tension spring (10) is always greater than that of the support spring (6) and the buffer spring (11).

6. A 5G communication module motherboard test carrier with a plug-in mechanism according to claim 2, characterized in that, The insertion and removal mechanism includes a motor (12) mounted on the base (1), a lead screw (13) mounted on the output end of the motor (12), and a threaded sleeve (14) connected to the movable frame (4) is threadedly connected to the lead screw (13); the threaded sleeve (14) is slidably connected to the base (1).

7. A 5G communication module motherboard test carrier with a plug-in mechanism according to claim 6, characterized in that, The insertion and extraction mechanism further includes a baffle (1401) mounted on the lead screw (13); a first spring (15) and a second spring (16) are wrapped around the lead screw (13); wherein the two ends of the first spring (15) abut against the threaded sleeve (14) and the moving frame (4) respectively, and the two ends of the second spring (16) abut against the baffle (1401) and the moving frame (4) respectively.

8. A 5G communication module motherboard test carrier with a plug-in mechanism according to claim 7, characterized in that, The lower pressure plate (5) is parallel to the wiring module (17).

9. A 5G communication module motherboard test carrier with a plug-in mechanism according to claim 1, characterized in that, The upper pressure plate (9) has a slot, which is used to protect the motherboard.

10. A loading method for testing a motherboard using a 5G communication module motherboard test carrier with a plug-in mechanism as described in any one of claims 1-9, characterized in that... It includes the following steps: Step 1: Place the motherboard to be tested on the pressure plate (5) and adjust its position; Step 2: Secure the mainboard to the lower pressure plate (5) using the clamping mechanism; Step 3: Adjust the horizontal height of the motherboard using the support (to align the motherboard with the wiring module (17)); Step 4: Control the plugging and unplugging mechanism to move the motherboard closer to and insert it into the wiring module (17) via the pressure plate (5).

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