Satellite communication antenna device and vehicle-mounted satellite navigation system

Abstract

The invention provides a satellite communication antenna device and a vehicle-mounted satellite navigation system.The satellite communication antenna device comprises a shell and a communication antenna assembly, the communication antenna assembly comprises a board end connector, an antenna circuit board and a welding layer, the board end connector is provided with a signal transmission line, and the signal transmission line is used for being electrically connected with the grounding end of the antenna circuit board; the board end connector is connected to the antenna circuit board, at least one surface of the antenna circuit board is provided with a copper exposing area, a welding gap exists between the end surface of the board end connector and at least part of the copper exposing area, the welding layer is arranged in the copper exposing area, and the welding layer blocks the welding gap. After the antenna circuit board and the board end connector are assembled, tin soldering is carried out at the connection position between the antenna circuit board and the board end connector, so that signals leaked by the signal transmission line are effectively isolated by the tin soldering, self-excitation caused by GNSS antenna receiving due to signal leakage is avoided, the problem of impedance mismatch is effectively solved, and the antenna quality is improved. Therefore, vehicle positioning precision and navigation system stability are ensured.

Description

Technical Field

[0001] This disclosure relates to the field of communication antenna technology, and in particular to a satellite communication antenna device and a vehicle-mounted satellite navigation system. Background Technology

[0002] GNSS (Global Navigation Satellite System) antennas are key components of automotive positioning and navigation systems. They are mainly used to receive signals from global navigation satellite systems (such as GPS, BeiDou, Galileo, etc.) to provide vehicles with location, speed, and time information.

[0003] The GNSS antenna is mounted on the edge of the circuit board of the satellite communication antenna device via a board-end connector, as shown in the specific structure below. Figure 1 As shown, the signal transmission line 11 of the board-end connector 13 is not soldered to the ground of the circuit board 12, and there is a gap 14 between the circuit board 12 and the board-end connector 13. This situation leads to impedance mismatch, causing the transmitted signal to leak from the gap. Subsequently, some of the signal is amplified and received by the GNSS antenna. The signal received by the GNSS antenna also includes the signal leaked from the signal transmission line, which in turn causes self-excitation distortion in the antenna. This phenomenon directly leads to two core problems: first, the satellite communication antenna device cannot properly receive and process external satellite signals; second, the received effective satellite signal is superimposed with self-excited noise, causing signal distortion, ultimately affecting the vehicle's positioning accuracy (such as drift, weak signal, etc.) and the stability of the navigation system. Summary of the Invention

[0004] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide a satellite communication antenna device and vehicle-mounted satellite navigation system that reduce the probability of self-excitation and ensure vehicle positioning accuracy.

[0005] The purpose of this disclosure is achieved through the following technical solution: A satellite communication antenna device, comprising: The outer casing has an accommodating cavity; A communication antenna assembly, at least a portion of which is located within the accommodating cavity, includes a board-end connector, an antenna circuit board, and a solder layer. The board-end connector has a signal transmission line for electrical connection to the ground terminal of the antenna circuit board. The board-end connector is connected to the antenna circuit board. At least one side of the antenna circuit board has an exposed copper area. A solder gap exists between the end face of the board-end connector and at least a portion of the exposed copper area. The solder layer is disposed on the exposed copper area and seals the solder gap.

[0006] In one embodiment, the exposed copper area includes a surface bare copper area and a side bare copper area that are connected. The surface bare copper area is disposed on one side of the antenna circuit board in the surface direction, and the side bare copper area is disposed on one side of the antenna circuit board in the thickness direction. The solder layer is attached to portions of the surface bare copper area and the side bare copper area.

[0007] In one embodiment, the weld gap is formed between the end face of the board-end connector and the side bare copper area.

[0008] In one embodiment, the bare copper area is disposed on the side of the antenna circuit board opposite to the signal transmission line.

[0009] In one embodiment, the side bare copper area includes x+1 side copper partitions and x side non-copper partitions, the side copper partitions and the side non-copper partitions are alternately arranged, the solder gap is formed between the end face of the board end connector and the x+1 side copper partitions, and a portion of the solder layer is located in the plurality of side copper partitions; wherein, x≥1.

[0010] In one embodiment, the board-end connector includes a connector and a power connector that are electrically connected to each other. The connector is located within the accommodating cavity, and at least a portion of the power connector is located within the accommodating cavity. The signal transmission line is disposed on the power connector, and the antenna circuit board is electrically connected to the connector.

[0011] In one embodiment, the antenna circuit board has a limiting hole, and the connector has a connecting post protruding from it, the connecting post passing through the limiting hole.

[0012] In one embodiment, the bare copper area includes a first bare copper area and a second bare copper area that are connected to each other. The limiting hole is located in the second bare copper area. A portion of the solder layer is located in the first bare copper area and the second bare copper area, respectively. The solder layer also blocks the limiting hole.

[0013] In one embodiment, the antenna circuit board includes a circuit board body, an antenna integrator, and a shielding cover. The exposed copper area is formed on the circuit board body, the antenna integrator is disposed on one side of the circuit board body, the shielding cover is disposed on the other side of the circuit board body, and the signal transmission line is electrically connected to the ground terminal of the circuit board body.

[0014] A vehicle-mounted satellite navigation system includes any of the satellite communication antenna devices described in the above embodiments.

[0015] Compared with the prior art, this disclosure has at least the following advantages: In the aforementioned satellite communication antenna device, after assembling the antenna circuit board and board-end connector, soldering is performed at the connection position between the antenna circuit board and the board-end connector. Specifically, the soldering is used to form a solder layer to seal the solder gap, and the solder layer covers the exposed copper area. This effectively isolates the signal leakage from the signal transmission line, preventing self-oscillation caused by GNSS antenna reception due to signal leakage. This effectively solves the impedance mismatch problem, thereby ensuring vehicle positioning accuracy and navigation system stability. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram illustrating the specific structure of a board-end connector connected to a circuit board in the prior art. Figure 2 This is a schematic diagram of the structure of a satellite communication antenna device in one embodiment; Figure 3 for Figure 2 A magnified view of the satellite communication antenna device at point A shown; Figure 4 for Figure 1 The diagram shows a cross-sectional view of the satellite communication antenna device. Figure 5 for Figure 4 A magnified view of the satellite communication antenna device at point B; Figure 6 for Figure 1 The image shows a cross-sectional view of the satellite communication antenna device from another angle. Figure 7 for Figure 6 A magnified view of the satellite communication antenna device at point C shown; Figure 8 for Figure 1 A partial structural schematic diagram of the satellite communication antenna device shown. Figure 9 for Figure 1 The diagram shows a partial structural view of the satellite communication antenna device from another angle. Figure 10 for Figure 9 The image shows a partial enlarged view of the satellite communication antenna device at point D. Figure 11 for Figure 10Another enlarged view of the satellite communication antenna device at point D, where the soldering step has been completed; Figure 12 for Figure 1 The diagram shows the actual antenna circuit board in the satellite communication antenna device, which reveals the exposed copper area. Figure 13 for Figure 1 The image shown is a physical view of the antenna circuit board in the satellite communication antenna device from another angle, which shows the bare copper area on the side of the exposed copper area; Figure 14 for Figure 1 The image shows the actual product after the antenna circuit board and board-end connectors of the satellite communication antenna device have been soldered. Figure 15 This is a standing wave test curve of a satellite communication antenna device in one embodiment; Figure 16 This is a standing wave test curve of a satellite communication antenna device in another embodiment.

[0018] Reference numerals: 10, Satellite communication antenna device; 100, Housing; 101, Receiving cavity; 110, Upper housing; 111, Snap-fit ​​part; 1111, Snap-fit ​​through-hole; 1112, Guide part; 112, Upper locking plate; 120, Lower housing; 1201, Snap-fit ​​groove; 121, Snap-fit ​​protrusion; 122, Lower locking plate; 123, Positioning post; 200, Communication antenna assembly; 210, Board-end connector; 2101, Signal transmission line; 211, Connector; 2111, Connecting post; 212, Electrical connector; 220, Antenna circuit board; 2201, Exposed copper area; 2 2011, Surface bare copper area; 22011a, First Surface Bare Copper Zone; 22011b, Second Surface Bare Copper Zone; 22012, Side Bare Copper Area; 22012a, First Side Copper Zone; 22012b, First Side Non-Copper Zone; 22012c, Second Side Copper Zone; 22012d, Second Side Non-Copper Zone; 22012e, Third Side Copper Zone; 2202, Solder Seam; 2203, Limiting Hole; 2204, Positioning Hole; 221, Circuit Board Body; 222, Antenna Integrator; 223, Shielding Cover; 230, Solder Layer. Detailed Implementation

[0019] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0020] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0022] To better understand the technical solutions and beneficial effects of this disclosure, the following detailed description is provided in conjunction with specific embodiments: Please see Figures 2 to 11 This is a satellite communication antenna device 10 according to an embodiment of the present invention, comprising a housing 100 and a communication antenna assembly 200. The housing 100 has an accommodating cavity 101. At least a portion of the structure of the communication antenna assembly 200 is located within the accommodating cavity 101, that is, part or all of the structure of the communication antenna assembly 200 is located within the accommodating cavity 101. The communication antenna assembly 200 includes a board-end connector 210, an antenna circuit board 220, and a solder layer 230. The board-end connector 210 has a signal transmission line 2101, which is used to connect to the antenna circuit board 220. The ground terminal of 20 is electrically connected. The board-end connector 210 is connected to the antenna circuit board 220. At least one side of the antenna circuit board 220 has an exposed copper area 2201. At least a portion of the end face of the board-end connector 210 and the exposed copper area 2201 have a solder gap 2202. The solder layer 230 is disposed on the exposed copper area 2201, and the solder layer 230 seals the solder gap 2202 to prevent signal amplification and reception caused by leakage of the signal transmitted from the signal transmission line 2101 through the solder gap 2202, thereby preventing the GNSS antenna from self-energizing. The specific structure is as follows: Figure 5 , Figures 7 to 11 As shown. In this embodiment, the exposed copper area 2201 is positioned away from the ground terminal of the antenna circuit board 220 to better avoid self-oscillation caused by leakage signals received by the GNSS antenna.

[0023] Furthermore, the antenna circuit board 220 and the solder layer 230 are both located within the accommodating cavity 101, and part or all of the structure of the board-end connector 210 is located within the accommodating cavity 101.

[0024] In the above embodiments, after assembling the antenna circuit board 220 and the board-end connector 210, soldering is performed at the connection position between the antenna circuit board 220 and the board-end connector 210. Specifically, the soldering gap 2202 is sealed by forming a solder layer 230, and the solder layer 230 covers the exposed copper area 2201. This effectively isolates the signal leaked by the signal transmission line 2101, avoids self-oscillation caused by GNSS antenna reception due to signal leakage, and effectively solves the impedance mismatch problem, thereby ensuring vehicle positioning accuracy and navigation system stability.

[0025] It is understandable that, before soldering is performed at the connection point between the antenna circuit board 220 and the board-end connector 210, as described in the background art, at least one side of the antenna circuit board 220 has a gap with the end face of the board-end connector 210. The transmitted signal of the signal transmission line 2101 will leak out from the gap, and then be continuously amplified and received by the antenna, resulting in an antenna self-energizing waveform. The specific standing wave distribution diagram is shown in the figure below. Figure 15 As shown, when self-oscillation occurs, the peak value of its standing wave ratio (VSWR) exceeds 11, reaching 6.8384 at a frequency signal of 1.164 GHz. An excessively high VSWR will cause signal distortion. To address this issue, at least one side of the antenna circuit board 220 is exposed to form an exposed copper area 2201. After assembling the antenna circuit board 220 and the board-end connector 210, solder is applied at the connection point between them. Specifically, the solder covers the exposed copper area 2201 and seals the solder gap 2202 formed between the end face of the board-end connector 210 and at least a portion of the exposed copper area 2201. This isolates the signal transmitted through the signal transmission line 2101, grounding it and preventing signal leakage from the solder gap 2202, which could cause cyclic amplification and antenna self-oscillation. After the solder solidifies, a solder layer 230 is formed. The specific structure is shown in the diagram below. Figure 5 , Figure 7 and Figure 11 As shown in the figure, the specific standing wave distribution diagram in subsequent tests is as follows: Figure 16 As shown, the highest VSWR value does not exceed 2. For example, the VSWR reaches 1.2247 for a frequency signal of 1.164 GHz, 1.0750 for a frequency signal of 1.559 GHz, and 1.0872 for a frequency signal of 1.575 GHz. This effectively reduces the probability of GNSS antenna self-excitation and ensures vehicle positioning accuracy.

[0026] Specifically, the soldering assembly process of the satellite communication antenna device 10 includes some or all of the following steps: S101, Perform a copper exposure step on the edge of the antenna circuit board 220 to form a copper exposure area 2201; S102, assembling antenna circuit board 220 and board end connector 210; S103. A soldering sealing step is performed at the connection position between the antenna circuit board 220 and the board-end connector 210, and a solder layer 230 is formed after curing to obtain the communication antenna assembly 200. The solder layer 230 is located covering the exposed copper area 2201, and the solder layer 230 partially seals the solder gap 2202. Further, the soldering step is performed by wave soldering.

[0027] S104. Assemble the housing 100 and the communication antenna assembly 200 to obtain the satellite communication antenna device 10.

[0028] In this embodiment, as Figure 8 As shown, the exposed copper area 2201 includes a surface bare copper area 22011 and a side bare copper area 22012 that are connected. The surface bare copper area 22011 is disposed on one side of the antenna circuit board 220 in the surface direction, and the side bare copper area 22012 is disposed on one side of the antenna circuit board 220 in the thickness direction. The solder layer 230 is attached to the surface bare copper area 22011 and the side bare copper area 22012, so that the solder layer 230 closes the gap between the end face of the board connector 210 and the side bare copper area 22012 and / or the surface bare copper area 22011, and prevents the signal leaked by the signal transmission line 2101 from being continuously amplified and received, which would cause antenna self-oscillation.

[0029] Furthermore, combined Figure 5 and Figure 7 As shown, the solder gap 2202 is formed between the end face of the board-end connector 210 and the side bare copper area 22012. During soldering, this gap seals the area between the end face of the board-end connector 210 and the side bare copper area 22012, preventing signal leakage from the signal transmission line 2101 at this location. This prevents the leaked signal from being amplified and received, thus preventing antenna self-energization. Furthermore, the surface bare copper area 22011 is located on the side of the antenna circuit board 220 facing away from the signal transmission line 2101, preventing solder interference during subsequent soldering steps from causing signal transmission abnormalities in the signal transmission line 2101.

[0030] Furthermore, such as Figure 8As shown, the side bare copper area 22012 includes x+1 side copper partitions and x side non-copper partitions, which are alternately arranged. The solder gap 2202 is formed between the end face of the board connector 210 and the x+1 side copper partitions, and the side non-copper partitions abut against the end face of the board connector 210. A portion of the solder layer 230 is located in the plurality of side copper partitions; wherein, x≥1. It is understood that the board-end connector 210 has one or more signal transmission lines 2101. To avoid the signal transmission lines 2101 from contacting the sides, copper is exposed at intervals on one side of the antenna circuit board 220 in the thickness direction to form multiple side copper partitions and multiple side non-copper partitions. In cross-section, the signal transmission lines 2101 are positioned to avoid the side copper partitions to prevent short circuits caused by the signal transmission lines 2101 contacting the side copper partitions. The solder layer 230 seals the gaps between the multiple side copper partitions and the end face of the board-end connector 210. This can prevent short circuits of the signal transmission lines 2101 and also prevent signal leakage transmitted by the signal transmission lines 2101, ensuring vehicle positioning accuracy and navigation system stability. For example, when the number of signal transmission lines 2101 of the board-end connector 210 is two, the side bare copper area 22012 includes three side copper partitions and two side non-copper partitions, specifically including a first side copper partition 22012a, a first side non-copper partition 22012b, a second side copper partition 22012c, a second side non-copper partition 22012d, and a third side copper partition 22012e arranged sequentially, as shown in the specific structural diagram. Figure 8 As shown, the first side non-copper partition 22012b and the second side non-copper partition 22012d are used to avoid the two signal transmission lines 2101, so as to prevent the board end connector 210 from being directly connected to the copper layer and causing a short circuit.

[0031] like Figures 4 to 6As shown, in one embodiment, the board-end connector 210 includes a connector 211 and a power connector 212 electrically connected to each other. The connector 211 is located within the receiving cavity 101, and at least a portion of the power connector 212 is located within the receiving cavity 101. That is, the connector 211 is located within the receiving cavity 101, and part or all of the structure of the power connector 212 is located within the receiving cavity 101. The signal transmission line 2101 is disposed on the power connector 212, and the antenna circuit board 220 is connected to the connector 211. Further, the antenna circuit board 220 has a limiting hole 2203, and the connector 211 has a protruding connecting post 2111. The connecting post 2111 passes through the limiting hole 2203 to initially fix the connector 211. Furthermore, the surface bare copper area 22011 includes a first surface bare copper partition 22011a and a second surface bare copper partition 22011b that are connected to each other. The limiting hole 2203 is located in the second surface bare copper partition 22011b. A portion of the solder layer 230 is located in the first surface bare copper partition 22011a and the second surface bare copper partition 22011b respectively. The solder layer 230 also blocks the limiting hole 2203 to further fix the connector 211 and prevent the board end connector 210 from moving on its own.

[0032] Furthermore, the connector 211 and the electrical connector 212 are integrally formed, making the connection between the connector 211 and the electrical connector 212 more reliable.

[0033] like Figure 6 As shown, in one embodiment, the antenna circuit board 220 includes a circuit board body 221, an antenna integrator 222, and a shielding cover 223, as described above. Figure 9 As shown, the exposed copper area 2201 is formed on the circuit board body 221, the antenna integrator 222 is disposed on one side of the circuit board body 221, the shielding cover 223 is disposed on the other side of the circuit board body 221, and the signal transmission line 2101 is electrically connected to the ground terminal of the circuit board body 221. Furthermore, when the antenna integrator 222 is working, the shielding cover 223 is used to shield external interference signals to ensure the stability of the GNSS antenna signal, thereby ensuring vehicle positioning accuracy and navigation system stability. In this embodiment, the surface exposed copper area 22011, the side exposed copper area 22012, and the limiting hole 2203 are formed on the circuit board body 221.

[0034] like Figure 2 and Figure 3 As shown, in one embodiment, the outer shell 100 includes an upper shell 110 and a lower shell 120 connected to each other, and the accommodating cavity 101 is formed in the upper shell 110 and the lower shell 120.

[0035] Furthermore, such as Figure 3As shown, the upper shell 110 has a protruding snap-fit ​​part 111, the lower shell 120 has a snap-fit ​​groove 1201, and the lower shell 120 has a snap-fit ​​protrusion 121. The snap-fit ​​protrusion 121 is located in the snap-fit ​​groove 1201, and the snap-fit ​​part 111 is engaged with the snap-fit ​​protrusion 121 so that the upper shell 110 and the lower shell 120 are engaged through the snap-fit ​​protrusion 121 and the snap-fit ​​part 111.

[0036] Furthermore, such as Figure 3 As shown, the buckle part 111 has a buckle through hole 1111, and the buckle protrusion 121 is used to pass through the buckle through hole 1111 when the upper shell 110 and the lower shell 120 are fastened together, and abut against the inner wall of the buckle through hole 1111 to ensure the stability of the fastening between the upper shell 110 and the lower shell 120.

[0037] Furthermore, such as Figure 3 As shown, the snap-fit ​​part 111 has a guide part 1112, the guide part 1112 has a first inclined area, and the snap-fit ​​protrusion 121 has a second inclined area. The first inclined area and the second inclined area are arranged parallel to each other. The first inclined area is used to abut against the second inclined area during the snap-fit ​​process of the upper shell 110 and the lower shell 120, so as to reduce the difficulty of snap-fit ​​between the upper shell 110 and the lower shell 120.

[0038] Furthermore, such as Figure 6 As shown, the inner wall of the upper shell 110 is provided with a plurality of upper locking plates 112, and the inner wall of the lower shell 120 is provided with a plurality of lower locking plates 122. The plurality of upper locking plates 112 abut against one side of the antenna circuit board 220, and the plurality of lower locking plates 122 abut against the other side of the antenna circuit board 220, so that the upper locking plates 112 and the lower locking plates 122 together restrict the movement of the antenna circuit board 220, and also ensure the sealing performance of the connection position between the antenna circuit board 220 and the board end connector 210, preventing signal leakage caused by gaps.

[0039] In this embodiment, multiple upper locking plates 112 abut against one side of the circuit board body 221, and multiple lower locking plates 122 abut against the other side of the circuit board body 221, so that the upper locking plates 112 and the lower locking plates 122 together restrict the movement of the circuit board body 221.

[0040] Furthermore, combined Figure 6 , Figure 7 and Figure 9 As shown, the lower shell 120 has a protruding positioning post 123, and the antenna circuit board 220 has a positioning hole 2204. The positioning post 123 passes through the positioning hole 2204 to avoid misalignment or displacement when installing the antenna circuit board 220. In this embodiment, the positioning hole 2204 is formed in the circuit board body 221.

[0041] This disclosure also provides a vehicle-mounted satellite navigation system, including the satellite communication antenna device 10 described in any embodiment.

[0042] Compared with the prior art, this disclosure has at least the following advantages: After assembling the antenna circuit board 220 and the board-end connector 210, the satellite communication antenna device 10 described above performs soldering at the connection position between the antenna circuit board 220 and the board-end connector 210. Specifically, the soldering is performed to form a solder layer 230 to seal the solder gap 2202, and the solder layer 230 covers the exposed copper area 2201. This effectively isolates the signal leaked by the signal transmission line 2101, avoids self-oscillation caused by GNSS antenna reception due to signal leakage, and effectively solves the impedance mismatch problem, thereby ensuring vehicle positioning accuracy and navigation system stability.

[0043] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A satellite communication antenna device, characterized in that, include: The outer casing has a receiving cavity; A communication antenna assembly, at least a portion of which is located within the accommodating cavity, includes a board-end connector, an antenna circuit board, and a solder layer. The board-end connector has a signal transmission line for electrical connection to the ground terminal of the antenna circuit board. The board-end connector is connected to the antenna circuit board. At least one side of the antenna circuit board has an exposed copper area. A solder gap exists between the end face of the board-end connector and at least a portion of the exposed copper area. The solder layer is disposed on the exposed copper area and seals the solder gap.

2. The satellite communication antenna device according to claim 1, characterized in that, The exposed copper area includes a surface bare copper area and a side bare copper area that are connected. The surface bare copper area is disposed on one side of the antenna circuit board in the surface direction, and the side bare copper area is disposed on one side of the antenna circuit board in the thickness direction. The solder layer is attached to the surface bare copper area and the side bare copper area.

3. The satellite communication antenna device according to claim 2, characterized in that, The weld gap is formed between the end face of the board connector and the side bare copper area.

4. The satellite communication antenna device according to claim 2, characterized in that, The bare copper area is located on the side of the antenna circuit board opposite to the signal transmission line.

5. The satellite communication antenna device according to claim 2, characterized in that, The side bare copper area includes x+1 side copper partitions and x side non-copper partitions, which are alternately arranged. The welding gap is formed between the end face of the board connector and the x+1 side copper partitions. A portion of the welding layer is located in multiple side copper partitions; where x≥1.

6. The satellite communication antenna device according to claim 2, characterized in that, The board-end connector includes a connector and a power connector that are electrically connected to each other. The connector is located within the accommodating cavity, and at least a portion of the power connector is located within the accommodating cavity. The signal transmission line is disposed on the power connector, and the antenna circuit board is electrically connected to the connector.

7. The satellite communication antenna device according to claim 5, characterized in that, The antenna circuit board has a limiting hole, and the connector has a connecting post protruding from it, with the connecting post passing through the limiting hole.

8. The satellite communication antenna device according to claim 7, characterized in that, The bare copper area includes a first bare copper area and a second bare copper area that are connected to each other. The limiting hole is located in the second bare copper area. A portion of the solder layer is located in the first bare copper area and the second bare copper area. The solder layer also blocks the limiting hole.

9. The satellite communication antenna device according to claim 1, characterized in that, The antenna circuit board includes a circuit board body, an antenna integrator, and a shielding cover. The exposed copper area is formed on the circuit board body. The antenna integrator is disposed on one side of the circuit board body. The shielding cover is disposed on the other side of the circuit board body. The signal transmission line is electrically connected to the ground terminal of the circuit board body.

10. A vehicle-mounted satellite navigation system, characterized in that, Includes the satellite communication antenna device as described in any one of claims 1 to 9.

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