Coreless current sensor module, current sensor module and power module

Abstract

The invention relates to a coreless current sensor module, a current sensor module, and a power module. The coreless current sensor module includes: a support member; a first current sensor that is mounted on a first surface of the support member and has at least one magnetoelectric conversion element that outputs a signal corresponding to the magnitude of a magnetic field; an insulator that surrounds at least the first current sensor in a spaced state when viewed from a first direction intersecting the first surface, and at least a portion of which overlaps the first current sensor when viewed from a second direction along the first surface; and a first bus bar through which a current that generates a magnetic field detected by the first current sensor flows, and at least one of the insulator and the support member is present between the first current sensor and the first bus bar.

Description

Technical Field

[0001] This invention relates to a coreless current sensor module, a current sensor module, and a power module. Background Technology

[0002] Patent Document 1 describes a sensor element positioned opposite a housing in which a busbar is embedded. Patent Document 2 describes a current sensor positioned above or below a printed circuit board in which a conductor is embedded. Patent Document 3 describes a busbar positioned between two shielding plates filled with molding resin and a magnetic detection element positioned at the through-hole of the busbar.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-70563

[0006] Patent Document 2: International Publication No. 2023 / 038725

[0007] Patent Document 3: Japanese Patent Application Publication No. 2017-187300 Summary of the Invention

[0008] The problem that the invention aims to solve

[0009] The goal is to shorten the distance between the current sensor and the busbar while ensuring the insulation between them.

[0010] Methods for solving problems

[0011] One aspect of the coreless current sensor module of the present invention may include: a support member; and a first current sensor mounted on a first surface of the support member, having at least one magnetoelectric conversion element that outputs a signal corresponding to the magnitude of a magnetic field. The coreless current sensor module may include an insulator that, when viewed from a first direction intersecting the first surface, at least surrounds the first current sensor with a gap, and when viewed from a second direction along the first surface, at least a portion of the insulator overlaps with the first current sensor. The coreless current sensor module may include a first busbar for current flow that generates the magnetic field detected by the first current sensor. At least one of the insulator and the support member may be present between the first current sensor and the first busbar.

[0012] The supporting member may be a substrate. The first busbar may be spaced apart from the substrate. The insulator may be present between the first current sensor and the first busbar.

[0013] In the coreless current sensor module, a direction along the substrate and intersecting the second direction can be designated as a third direction. When viewed from the first direction or the third direction, at least a portion of the first busbar overlaps with the first current sensor.

[0014] In any of the aforementioned coreless current sensor modules, the first busbar may include a pair of first conductor portions extending in the second direction and arranged opposite to each other in a third direction along the substrate and intersecting the second direction, separated by the first current sensor. The insulator may be disposed at least between each of the first conductor portions of the pair of first conductor portions and the first current sensor, spaced apart from the first current sensor.

[0015] In any of the coreless current sensor modules, the first busbar may include a pair of first connecting portions respectively connected to both ends of the pair of first conductor portions. When viewed from the first direction, the first current sensor may be surrounded by the pair of first conductor portions and the pair of first connecting portions.

[0016] In any of the coreless current sensor modules, the insulator may also be disposed between the substrate and each of the first conductor portions of the pair of first conductor portions.

[0017] In any of the coreless current sensor modules, the first busbar may be in contact with the insulator.

[0018] In any of the coreless current sensor modules, the insulator may also be configured to cover the side of the first current sensor opposite to the side mounted on the substrate, with a gap between it and the first current sensor in the first direction.

[0019] In any of the coreless current sensor modules, the insulator may have an opening that exposes the side of the first current sensor opposite to the side mounted on the substrate.

[0020] In any of the aforementioned coreless current sensor modules, the first busbar may include a pair of first conductor portions extending upward along the substrate and intersecting the second direction, and arranged opposite to each other in the first direction, separated by the first current sensor. The insulator may also be disposed with a gap between one of the pair of first conductor portions and the first current sensor, separated from the first current sensor.

[0021] In any of the coreless current sensor modules, the first busbar may include a pair of first connecting portions respectively connected to both ends of the pair of first conductor portions. When viewed from the second direction, the first current sensor may be surrounded by the pair of first conductor portions and the pair of first connecting portions.

[0022] Any of the coreless current sensor modules may include a second current sensor mounted on the first surface of the substrate, having at least one magnetoelectric conversion element that outputs a signal corresponding to the magnitude of the magnetic field. The coreless current sensor module may include a second busbar spaced apart from the substrate for current flow to generate the magnetic field detected by the second current sensor. When viewed from the first direction, the insulator may also surround the second current sensor in a spaced-apart state, and when viewed from the second direction, at least a portion of the insulator overlaps with the second current sensor.

[0023] In any of the coreless current sensor modules, the first busbar may include a pair of first conductor portions extending in the second direction and facing each other upwards along a third surface intersecting the second direction, separated by the first current sensor. The second busbar may include a pair of second conductor portions extending in the second direction and facing each other upwards along a third surface, separated by the second current sensor. The insulator may be spaced apart from the first current sensor and at least disposed between each of the first conductor portions of the pair of first conductor portions and the first current sensor, and spaced apart from the second current sensor and at least disposed between each of the second conductor portions of the pair of second conductor portions and the second current sensor.

[0024] In any of the coreless current sensor modules, the first busbar may include a pair of first connecting portions respectively connected to both ends of the pair of first conductor portions. The second busbar may include a pair of second connecting portions respectively connected to both ends of the pair of second conductor portions. When viewed from the first direction, the first current sensor may be surrounded by the pair of first conductor portions and the pair of first connecting portions. When viewed from the first direction, the second current sensor may be surrounded by the pair of second conductor portions and the pair of second connecting portions.

[0025] In any of the coreless current sensor modules, the first current sensor and the second current sensor may be arranged in a third-direction upward arrangement along the substrate and intersecting the second direction.

[0026] In any of the coreless current sensor modules, the portion of the insulator disposed between the first busbar and the second busbar may include a portion of a first thickness extending from the first surface of the substrate and a portion of a second thickness extending from the first surface of the substrate, which is different from the first thickness.

[0027] In any of the coreless current sensor modules described above, the insulator may have: a first insulator that, when viewed from the first direction, surrounds the first current sensor with a gap, and when viewed from the second direction, at least a portion of the first current sensor overlaps with it; and a second insulator that, when viewed from the first direction, surrounds the second current sensor with a gap, and when viewed from the second direction, at least a portion of the second insulator overlaps with it. Alternatively, when viewed from the first direction, a gap may exist at least partially between the first insulator and the second insulator.

[0028] In any of the coreless current sensor modules, the interval between the first current sensor and the first busbar can be greater than 0 mm and less than 5 mm.

[0029] One aspect of the present invention relates to a coreless current sensor module comprising: a substrate; and a first current sensor mounted on a first surface of the substrate, having at least one magnetoelectric conversion element that outputs a signal corresponding to the magnitude of a magnetic field. The coreless current sensor module may include a first busbar extending upward along a second direction of the substrate or along the substrate and intersecting the second direction, comprising a pair of first conductor portions, which, when viewed from the first or second direction intersecting the substrate, are arranged facing each other across the first current sensor. The first busbar and the substrate are spaced apart for current flow to generate the magnetic field detected by the first current sensor. The coreless current sensor module may include an insulator, which, when viewed from the first or second direction, is spaced apart from the first current sensor and disposed at least between the pair of first conductor portions and the first current sensor.

[0030] In the coreless current sensor module, the first busbar may include a pair of first connecting portions respectively connected to both ends of the pair of first conductor portions. When viewed from the first direction or the second direction, the first current sensor may be surrounded by the pair of first conductor portions and the pair of first connecting portions.

[0031] In any of the coreless current sensor modules, when viewed from the third direction, the pair of first conductor portions may at least partially overlap with the first current sensor.

[0032] In any of the coreless current sensor modules, when viewed from the first direction, the insulator can at least surround the first current sensor in a spaced-apart state.

[0033] In any coreless current sensor module, the support member may have a first part integrally formed with the insulator.

[0034] In any coreless current sensor module, the support member may further have a second portion including a substrate on which the first current sensor is mounted.

[0035] In any coreless current sensor module, the second portion of the support member can be fixed to the first portion of the support member via an adhesive layer.

[0036] In any coreless current sensor module, the insulator may be configured on the first surface of the support member such that it surrounds the second portion and the first current sensor in a state spaced apart from the first current sensor when viewed from the first direction.

[0037] In any coreless current sensor module, the first busbar may include: a pair of first conductor portions extending in the second direction and arranged opposite each other across the first current sensor in a third direction along the first surface and intersecting the second direction; and a pair of first connecting portions respectively connected to the two ends of the pair of first conductor portions. At least a portion of the support member and the insulator may be disposed within a through-hole of the first busbar surrounded by the pair of first conductor portions and the pair of first connecting portions.

[0038] In any coreless current sensor module, the first current sensor may be configured at a position where a plane traverses the center of the first direction passing through the pair of first conductor portions and the pair of first connecting portions.

[0039] In any coreless current sensor module, the support member may be made of resin together with the insulator.

[0040] One embodiment of the power module of the present invention may include: the coreless current sensor module; an input terminal section; an output terminal section including the first busbar; and a plurality of power semiconductors that convert DC input from the input terminal section into AC and output it to the output terminal section.

[0041] One aspect of the current sensor module of the present invention may include: a substrate; and a first current sensor mounted on a first surface of the substrate, having at least one magnetoelectric conversion element that outputs a signal corresponding to the magnitude of a magnetic field. The current sensor module may include an insulator that, when viewed from a first direction intersecting the first surface, at least surrounds the first current sensor with a gap, and when viewed from a second direction along the first surface, at least a portion of the insulator overlaps with the first current sensor. The current sensor module may include a first busbar spaced apart from the substrate for current flow to generate the magnetic field detected by the first current sensor. The current sensor module may include a magnetic collecting plate spaced apart from the first current sensor in the first direction and positioned facing the side of the first current sensor opposite to the surface mounted on the substrate. The insulator may be present between the first current sensor and the first busbar.

[0042] One aspect of the present invention provides a current sensor module comprising: a substrate; and a first current sensor mounted on a first surface of the substrate, having at least one magnetoelectric conversion element that outputs a signal corresponding to the magnitude of a magnetic field. The current sensor module may include an insulator that, when viewed from a first direction intersecting the first surface, at least surrounds the first current sensor with a gap, and when viewed from a second direction along the first surface, at least a portion of the insulator overlaps with the first current sensor. The current sensor module may include a first busbar spaced apart from the substrate for current flow that generates the magnetic field detected by the first current sensor. The current sensor module may include a second current sensor mounted on the first surface of the substrate, having at least one magnetoelectric conversion element that outputs a signal corresponding to the magnitude of a magnetic field. The current sensor module may also include a second busbar spaced apart from the substrate for current flow that generates the magnetic field detected by the second current sensor. The current sensor module may include a wall portion comprising a magnetic material protruding from the first surface of the substrate between the first and second busbars. The insulator may be present between the first current sensor and the first busbar. Specifically, when viewed from the first direction, the insulator may also surround the second current sensor with a gap, and when viewed from the second direction, at least a portion of the insulator may overlap with the second current sensor.

[0043] It should be noted that the above summary of the invention does not list all the features of the invention. Furthermore, sub-combinations of these feature groups can also constitute inventions. Attached Figure Description

[0044] Figure 1 This is a perspective view of the power module in the first embodiment.

[0045] Figure 2 This is a perspective view of the power module in the first embodiment with the substrate removed.

[0046] Figure 3 yes Figure 2 An enlarged view of the current sensor section is shown.

[0047] Figure 4 This is a perspective view of the power module in the first embodiment with the substrate and insulator removed.

[0048] Figure 5 It was removed when viewed from the positive side along the z-axis. Figure 4 A top view of the power module showing the state of the substrate and insulators.

[0049] Figure 6 This is a schematic diagram of a cross-section of the portion containing the current sensor when viewed from the y-axis direction of the current sensor module of the first embodiment.

[0050] Figure 7 This is a schematic diagram of a cross-section of the current sensor module of the first modified example, when viewed from the y-axis direction, showing the portion containing the current sensor 140.

[0051] Figure 8 This is a schematic diagram of a cross-section of the current sensor module of the second variation, when viewed from the y-axis direction, showing the portion containing the current sensor 140.

[0052] Figure 9 This is a schematic diagram of a cross-section of the current sensor module of the third variation, when viewed from the y-axis direction, showing the portion containing the current sensor 140.

[0053] Figure 10 This is a perspective view of the power module in the second embodiment.

[0054] Figure 11 It was removed. Figure 10 A perspective view of the power module showing the state of the insulator.

[0055] Figure 12 This is a side view of the current sensor module of the second embodiment, viewed from the positive y-axis direction.

[0056] Figure 13 This is a perspective view of the power module in the third embodiment.

[0057] Figure 14It is Figure 13 The diagram shows a partial view of the internal structure of the power module.

[0058] Figure 15 It was removed. Figure 13 A perspective view of the power module's appearance in the state of the substrate shown.

[0059] Figure 16 It is Figure 15 A magnified view of part of the current sensor.

[0060] Figure 17 This diagram illustrates a case where a substrate with a current sensor mounted on it is disposed on an insulator.

[0061] Figure 18A This is a top view of the current sensor module according to the fourth embodiment.

[0062] Figure 18B yes Figure 18B The AA section view shown.

[0063] Figure 19 It means and Figure 18A The diagram shows a configuration where the current sensor module has other substrates electrically connected to it, positioned above the busbar.

[0064] Figure 20 This is a cross-sectional view of the current sensor module of the first variation of the fourth embodiment.

[0065] Figure 21 This is a cross-sectional view of the current sensor module of the second variation of the fourth embodiment.

[0066] Figure 22 This is a cross-sectional view of the current sensor module of the third variation of the fourth embodiment.

[0067] Explanation of reference numerals in the attached figures

[0068] 10 power modules

[0069] 20 outer frame

[0070] 100 Current Sensor Module

[0071] 110 support plate

[0072] 110a surface

[0073] Busbars 120, 120a, 120b, and 120c

[0074] Conductor sections 121a, 121b, and 121c

[0075] Connection parts 122a, 122b, and 122c

[0076] 125a, 125b, 125c through-hole

[0077] 130, 130a, 130b, 130c insulators

[0078] Gap between 132, 132a, 132b, and 132c

[0079] Openings 134a, 134b, and 134c

[0080] 140, 140a, 140b, 140c current sensors

[0081] 150 substrates

[0082] 150a surface

[0083] 160 wall section

[0084] 170a, 170b, 170c magnetic plates

[0085] 180 support components

[0086] 182 pedestal

[0087] 184 wall

[0088] 200 power semiconductor units

[0089] 202 housing

[0090] 220 Input Terminal Section Detailed Implementation

[0091] The present invention will now be described through embodiments thereof, but these embodiments do not limit the invention as defined in the claims. Furthermore, the combinations of features described in the embodiments are not necessarily all necessary for the solutions provided by the invention.

[0092] Figure 1 This is a perspective view of the power module 10 according to the first embodiment. The power module 10 includes a current sensor module 100 and a power semiconductor unit 200. The power module 10 can be a three-phase inverter that converts DC to three-phase AC. The three-phase AC output from the power module 10 can be supplied to a motor that is a three-phase AC motor. The motor can be a power source for a mobile vehicle. The power module 10 can be installed in a mobile vehicle such as a hybrid electric vehicle or an electric vehicle. The power module 10 can also be a single-phase inverter that converts DC to AC depending on the application.

[0093] Regarding coordinates, Figure 1In this diagram, the x-axis direction is defined as parallel to the paper and diagonally downward to the right; the y-axis direction is defined as parallel to the paper and diagonally upward to the right; and the z-axis direction is defined as parallel to the paper and upward from the bottom. The z-axis direction is an example of the first direction, the y-axis direction is an example of the second direction, and the x-axis direction is an example of the third direction.

[0094] The power semiconductor unit 200 includes: a plurality of power semiconductors housed in an insulating housing 202; an input terminal section 220 electrically connected to the plurality of power semiconductors, including a plurality of input terminals exposed from the housing 202; and a plurality of busbars 120a, 120b, and 120c electrically connected to the plurality of power semiconductors. The power semiconductor unit 200 may include, for example, six power semiconductors; an input terminal section 220 including six input terminals electrically connected to the six power semiconductors; and three busbars 120a, 120b, and 120c. The power semiconductors may be, for example, MOSFETs or IGBTs. Hereinafter, the plurality of busbars 120a, 120b, and 120c will sometimes be collectively referred to as busbar 120. Busbar 120 is an example of a first busbar and a second busbar. The input terminal section 220 is an example of an input terminal section of a power module 10. Busbar 120 is an example of an output terminal section of a power module 10.

[0095] The current sensor module 100 includes a substrate 150 equipped with multiple current sensors that measure the current flowing in multiple busbars 120a, 120b, and 120c respectively.

[0096] Figure 2 This is a perspective view of the power module 10 with the substrate 150 removed. The current sensor module 100 has multiple current sensors 140a, 140b, and 140c. The multiple current sensors 140a, 140b, and 140c output signals corresponding to the magnitude of the magnetic field. Hereinafter, the multiple current sensors 140a, 140b, and 140c will sometimes be collectively referred to as current sensor 140. The multiple current sensors 140a, 140b, and 140c are mounted on the surface of the substrate 150 facing the busbar 120.

[0097] The current sensor 140 has at least one magnetoelectric conversion element that outputs a signal corresponding to the magnitude of the magnetic field. The current sensor 140 can be a coreless current sensor, and the current sensor module 100 can be a coreless current sensor module. In this specification, a coreless current sensor is a sensor having at least one magnetoelectric conversion element that outputs a signal corresponding to the magnitude of the magnetic field flowing in a conductor; it is a current sensor without a magnetic core arranged to surround the magnetoelectric conversion element or the current conductor. The magnetic core amplifies the magnetic flux density passing through the magnetoelectric conversion element.

[0098] The current sensor 140 may, for example, have two magnetoelectric conversion elements. The current sensor module 100 has a signal processing circuit. The signal processing circuit, for example, reduces the noise components contained in the output signals of the two magnetoelectric conversion elements based on the difference between them, thereby canceling the noise components caused by the common external magnetic field. It then amplifies the noise-reduced output signals of the two magnetoelectric conversion elements, calculates the current value flowing through the busbar 120 based on the amplified output signals, and outputs an output signal representing the current value. The magnetoelectric conversion element may, for example, be a Hall element utilizing the Hall effect, having a sensitivity axis in the direction intersecting the magnetically sensitive surface.

[0099] The current sensor 140 detects the magnetic field generated by the current flowing through the busbar 120. Therefore, to accurately measure the current flowing through the busbar 120, the current sensor 140 is preferably configured adjacent to the busbar 120. However, the busbar 120 is sometimes subjected to high voltages of several hundred volts or more, so if the current sensor 140 is placed too close to the busbar 120, it may be impossible to ensure the insulation between the busbar 120 and the current sensor 140.

[0100] Therefore, the power module 10 of this embodiment includes an insulator 130 disposed between the busbar 120 and the current sensor 140. This brings the distance between the current sensor 140 and the busbar 120 closer and ensures insulation between the busbar 120 and the current sensor 140.

[0101] Here, the insulator 130 can be, for example, a thermosetting epoxy resin or a thermoplastic resin such as a liquid crystal polymer containing added silica. The insulator 130 made of such a material may expand and contract due to temperature changes. Therefore, when the insulator 130 is brought into close contact with the current sensor 140, the stress caused by the expansion and contraction of the insulator 130 due to temperature changes is applied to the current sensor 140, potentially affecting the measurement of the current by the current sensor 140. Due to the application of such stress, measurement errors may occur in the output value of the current sensor 140, for example.

[0102] Therefore, in order to prevent stress from being applied to the current sensor 140 due to the expansion and contraction of the insulator 130 associated with temperature changes, such as Figure 3 As shown, the insulator 130 is disposed with a gap 132 between it and the current sensor 140 (current sensor 140b). The insulator 130 at least surrounds the current sensor 140 with the gap 132 between it and the current sensor 140, and at least a portion of the insulator 130 overlaps with the current sensor 140 when viewed from the x-axis or y-axis direction.

[0103] Figure 4This is a perspective view of the power module 10 with the substrate 150 and insulator 130 removed. The support plate 110 supports multiple busbars 120a, 120b, and 120c. Each busbar 120a, 120b, and 120c has a through-hole 125a, 125b, and 125c, and current sensors 140a, 140b, and 140c are disposed within each through-hole 125a, 125b, and 125c. The spacing between the current sensors 140a, 140b, and 140c and the busbars 120a, 120b, and 120c can be greater than 0 mm and less than 5 mm.

[0104] Figure 5 It was removed when viewed from the positive side along the z-axis. Figure 4 This is a top view of the power module 10 showing the state of the substrate 150 and insulator 130. Busbars 120a, 120b, and 120c include: a pair of conductor portions 121a, 121b, and 121c extending along the y-axis and facing each other in the x-axis direction, separated by current sensors 140a, 140b, and 140c; and a pair of connecting portions 122a, 122b, and 122c, respectively connected to the two ends of the pair of conductor portions 121a, 121b, and 121c. The pair of conductor portions 121a, 121b, and 121c is an example of a pair of first conductor portions and a pair of second conductor portions. The pair of connecting portions 122a, 122b, and 122c is an example of a pair of first connecting portions and a pair of second connecting portions. When viewed from the z-axis direction, current sensors 140a, 140b, and 140c are surrounded by a pair of conductor portions 121a, 121b, and 121c and a pair of connecting portions 122a, 122b, and 122c.

[0105] Figure 6 This is a schematic diagram of a cross-section of the portion including the current sensor 140 when viewed from the y-axis direction of the current sensor module 100.

[0106] Current sensors 140a, 140b, and 140c are spaced apart in the x-axis direction on the surface 150a of the substrate 150 opposite the support plate 110. Surface 150a is an example of a first surface. The support plate 110 is spaced apart in the z-axis direction, facing the surface 150a of the substrate 150. On the surface 110a of the support plate 110 opposite the substrate 150, when viewed from the z-axis direction, busbars 120a, 120b, and 120c extending along the y-axis direction are arranged to surround the current sensors 140a, 140b, and 140c. When viewed from the x-axis or y-axis direction, at least a portion of the busbars 120a, 120b, and 120c overlaps with the current sensors 140a, 140b, and 140c. Busbars 120a, 120b, and 120c are spaced apart from the substrate 150 in the z-axis direction, through which current flows, generating a magnetic field detected by current sensors 140a, 140b, and 140c.

[0107] An insulator 130 is disposed between the substrate 150 and the support plate 110, spaced 132 apart from the current sensors 140a, 140b, and 140c. The insulator 130 contacts the busbars 120a, 120b, and 120c. On the other hand, the insulator 130 does not contact the current sensors 140a, 140b, and 140c. The insulator 130 is disposed at least between a pair of conductor portions 121a, 121b, and 121c and each of the current sensors 140a, 140b, and 140c, spaced 132 apart. When viewed from the z-axis direction, the insulator 130 at least surrounds the current sensors 140a, 140b, and 140c with the gaps 132 between them. When viewed from the x-axis or y-axis direction, at least a portion of the insulator overlaps with the current sensors 140a, 140b, and 140c. Insulator 130 is also disposed between substrate 150 and each of the pair of conductor portions 121a, 121b, 121c. Insulator is also configured to cover the surfaces 141a, 141b, 141c of current sensors 140a, 140b, 140c opposite to the surface 150a mounted on substrate 150, in a state that is spaced apart from current sensors 140a, 140b, 140c in the z-axis direction.

[0108] Busbars 120 are spaced apart along the x-axis on the support plate 110, and insulators 130 with openings or slots formed on the portions where current sensors 140 are mounted are disposed on the busbars 120 and the support plate 110. Then, a substrate 150 carrying the current sensor 140 is disposed on the insulator 130 such that the current sensor 140 is housed within the openings or slots. Thus, a current sensor module 100 can be constructed.

[0109] According to the current sensor module 100 of the first embodiment, by providing an insulator 130 between the current sensor 140 and the busbar 120, the distance between the current sensor 140 and the busbar 120 can be brought closer, and the insulation between the busbar 120 and the current sensor 140 can be ensured. Furthermore, since a gap is left between the insulator 130 and the current sensor 140, stress caused by the expansion or contraction of the insulator 130 due to temperature changes caused by changes in the environment surrounding the power module 10 or the application of a large current to the busbar can be prevented from being transmitted to the current sensor 140, thus preventing stress from affecting the measurement of the current sensor 140.

[0110] Figure 7 This is a schematic diagram of a cross-section of the portion containing the current sensor 140 of the current sensor module 100 in the first modified example, viewed from the y-axis direction. Figure 7 The current sensor module 100 shown is... Figure 6 The difference in the current sensor module 100 shown is that the insulator 130 is not configured to cover the surfaces 141a, 141b, 141c of the current sensors 140a, 140b, 140c opposite to the surface 150a mounted on the substrate 150, in a state that is spaced apart from the current sensors 140a, 140b, 140c in the z-axis direction. That is, the insulator 130 has openings that expose the surfaces 141a, 141b, 141c of the current sensors 140a, 140b, 140c opposite to the surface mounted on the substrate 150. The insulator 130 may also have a gap with the busbar 120. That is, the insulator 130 may have: a first insulator that surrounds the current sensor 120a with a gap when viewed from the z-axis direction, and at least partially overlaps the current sensor 120a when viewed from the x-axis direction; a second insulator that surrounds the current sensor 120b with a gap when viewed from the z-axis direction, and at least partially overlaps the current sensor 120b when viewed from the x-axis direction; and a third insulator that surrounds the current sensor 120c with a gap when viewed from the z-axis direction, and at least partially overlaps the current sensor 120c when viewed from the x-axis direction. Gaps may exist at least partially between the first and second insulators, and between the second and third insulators when viewed from the z-axis direction. The first and second insulators, and between the second and third insulators, may be separable. The first, second, and third insulators may be individual insulators. At least a portion of the first, second, and third insulators may also be connected. The first insulator, the second insulator, and the third insulator can also be constructed as a single unit.

[0111] Figure 8This is a schematic cross-sectional view of the portion including the current sensor 140 of the current sensor module 100 in the second modification example, viewed from the y-axis direction. The current sensor module 100 of the second modification example and... Figure 6 The difference in the current sensor module 100 shown is that the insulator 130 between busbars 120a and 120b, and between busbars 120b and 120c, is provided with a step 131. That is, in the current sensor module 100 of the second variation, the portion of the insulator 130 disposed between busbars 120a and 120b, and between busbars 120b and 120c, includes a portion h1 of a first thickness extending from the surface 150a of the substrate 150, and a portion h2 of a second thickness different from the first thickness h1 extending from the surface 150a of the substrate 150. This extends the surface distance between busbars 120a and 120b, and between busbars 120b and 120c, further ensuring insulation between busbars 120a and 120b, and between busbars 120b and 120c.

[0112] Furthermore, the current sensor module 100 of the second modification and Figure 6 The difference in the current sensor module 100 shown is that it has a wall portion 160 containing a magnetic material protruding from surface 150a of the substrate 150 between busbars 120a and 120b, and between busbars 120b and 120c. The wall portion 160 can be constructed of a magnetic shielding plate containing a soft magnetic material containing iron group elements such as Fe, Co, and Ni. That is, in this specification, the current sensor module 100 of the second variation is not a coreless current sensor module, and the current sensor 140 in the current sensor module 100 is not a coreless current sensor. Therefore, the current sensor 140 is less susceptible to the influence of the magnetic field generated by the current flowing through the busbar 120 other than the busbar 120 through which the current flowing through the object being measured passes.

[0113] Figure 9 This is a schematic cross-sectional view of the portion including the current sensor 140 of the current sensor module 100 in the third modification, viewed from the y-axis direction. The current sensor module 100 of the third modification and... Figure 6The difference in the current sensor module 100 shown is that, at positions opposite to the surfaces 141a, 141b, 141c on the substrate 150, opposite to the surface 150a of the current sensors 140a, 140b, 140c, magnetic collecting plates 170a, 170b, 170c are provided at intervals along the z-axis direction from the current sensors 140a, 140b, 140c. That is, in this specification, the current sensor module 100 of the second variation is not a coreless current sensor module, and the current sensor 140 in the current sensor module 100 is not a coreless current sensor. The magnetic collecting plates 170a, 170b, 170c can be made of magnetic alloys such as ferrite substrates, sheets made by mixing magnetic powders such as ferrite powder with resin, Fe-Si alloys, Fe-based or Co-based amorphous alloys, or microcrystalline soft magnetic alloys. By setting magnetic collecting plates 170a, 170b, and 170c, current sensors 140a, 140b, and 140c can easily detect the magnetic field generated by current flowing through busbars 120a, 120b, and 120c. Magnetic collecting plates 170a, 170b, and 170c can be built into insulator 130 or positioned between insulator 130 and support plate 110. Figure 9 As shown, when the insulator 130 has an opening that exposes the surfaces 141a, 141b, 141c of the current sensors 140a, 140b, 140c opposite to the surfaces mounted on the substrate 150, magnetic collecting plates 170a, 170b, 170c may also be provided on the support plate 110 at positions opposite to the surfaces 141a, 141b, 141c of the current sensors 140a, 140b, 140c.

[0114] Figure 10 This is a perspective view of the power module 10 according to the second embodiment. The shapes of the busbars 120a, 120b, and 120c in the power module 10 of the second embodiment are different from those in the power module 10 of the first embodiment. Furthermore, the positional relationships between the busbars 120a, 120b, and 120c and the current sensors 140a, 140b, and 140c in the power module 10 of the second embodiment are different from those in the power module 10 of the first embodiment.

[0115] In the power module 10 of the second embodiment, current sensors 140a, 140b, and 140c are covered on the substrate 150. Figure 10 Insulators 130a, 130b, and 130c are set in a manner not shown in the figure.

[0116] The current sensor module 100 and the power semiconductor unit 200 are housed within the outer frame 20.

[0117] Figure 11 It was removed. Figure 10 The power module 10 is shown in a perspective view of its external appearance with insulators 130a, 130b, and 130c exposed. That is, it is a perspective view of the power module 10 with current sensors 140a, 140b, and 140c, which are arranged at intervals along the x-axis on the substrate 150, exposed.

[0118] Figure 12 This is a side view of the current sensor module 100 of the second embodiment, viewed from the positive y-axis direction. Busbars 120a, 120b, and 120c include a pair of conductor portions 121a, 121b, and 121c extending along the z-axis and arranged opposite to current sensors 140a, 140b, and 140c in the x-axis direction. Furthermore, busbars 120a, 120b, and 120c include a pair of connecting portions 122a, 122b, and 122c, each connecting to one end of the pair of conductor portions 121a, 121b, and 121c. When viewed from the y-axis direction, current sensors 140a, 140b, and 140c are surrounded by the pair of conductor portions 121a, 121b, and 121c and the pair of connecting portions 122a, 122b, and 122c. When viewed from the x-axis direction, a pair of conductor portions 121a, 121b, 121c overlap at least partially with current sensors 140a, 140b, 140c. The spacing between current sensors 140a, 140b, 140c and busbars 120a, 120b, 120c can be greater than 0 mm and less than 5 mm.

[0119] When viewed from the z-axis direction, insulators 130a, 130b, and 130c surround current sensors 140a, 140b, and 140c with gaps 132a, 132b, and 132c between them. When viewed from the x-axis or y-axis direction, at least a portion of insulators 130a, 130b, and 130c overlaps with current sensors 140a, 140b, and 140c.

[0120] Insulators 130a, 130b, and 130c do not contact current sensors 140a, 140b, and 140c. Insulators 130a, 130b, and 130c are disposed between at least one pair of conductor portions 121a, 121b, and 121c and current sensors 140a, 140b, and 140c, separated by gaps 132a, 132b, and 132c.

[0121] According to the current sensor module 100 of the second embodiment, by providing an insulator 130 between the current sensor 140 and the busbar 120, the distance between the current sensor 140 and the busbar 120 can be brought closer, and the insulation between the busbar 120 and the current sensor 140 can be ensured. Furthermore, since a gap is left between the insulator 130 and the current sensor 140, it is possible to prevent temperature changes due to variations in the surrounding environment of the power module 10, and to prevent stress caused by the expansion or contraction of the insulator 130 from being transmitted to the current sensor 140, thus preventing stress from affecting the measurement of the current sensor 140.

[0122] Figure 13 This is a perspective view of the power module 10 according to the third embodiment. Figure 14 It is Figure 13 The power module 10 shown is a partial perspective view of its internal structure. The power module 10 of the third embodiment differs from the power module 10 of the first embodiment in that the substrate 150 on which the current sensors 140a, 140b, and 140c are mounted also serves as the substrate on which the power semiconductor constituting the power semiconductor unit 200 is mounted.

[0123] Figure 15 It was removed. Figure 13 A perspective view of the power module 10 in the state of the substrate 150 shown. Figure 16 It is Figure 15 The diagram shows a partially enlarged view of the current sensor 140b. The insulator 130 may be part of a sealing portion made of molding resin that seals the circuits constituting the power module 10, which includes circuits such as power semiconductors constituting the power semiconductor unit 200. The insulator 130 has grooves larger than the width of the current sensors 140a, 140b, and 140c at the locations where they are positioned. This creates gaps 132a, 132b, and 132c between the current sensors 140a, 140b, and 140c and the insulator 130.

[0124] Figure 17 This describes a case where a substrate 150, on which current sensors 140a, 140b, and 140c are mounted, is disposed on an insulator 130. In the insulator 130, openings 134a, 134b, and 134c, larger than the current sensors 140a, 140b, and 140c, are provided at the positions where the current sensors 140a, 140b, and 140c are mounted. Furthermore, the substrate 150, on which the current sensors 140a, 140b, and 140c are mounted, is disposed and fixed to the insulator 130 such that the current sensors 140a, 140b, and 140c are housed within the openings 134a, 134b, and 134c.

[0125] It should be noted that in the third embodiment, an example was described in which a single substrate 150 constitutes both the control substrate constituting the current sensor module 100 and the control substrate constituting the power semiconductor unit 200 within the insulator 130 constituting the sealing portion. However, the control substrate constituting the current sensor module 100 and the control substrate constituting the power semiconductor unit 200 may also be configured as different substrates within the insulator 130.

[0126] Figure 18A This is a top view showing the current sensor module 100 according to the fourth embodiment. Figure 18B yes Figure 18B The AA sectional view shown. For example, Figure 1 The power module 10 shown may include the current sensor module 100 of the fourth embodiment.

[0127] The current sensor module 100 includes a busbar 120 and a current sensor 140 for measuring the current flowing through the busbar 120. The current sensor 140 can be a coreless current sensor, and the current sensor module 100 can be a coreless current sensor module. The current sensor module 100 may also include multiple busbars 120 and current sensors 140 for measuring the current flowing through multiple busbars 120.

[0128] Busbar 120 includes: a pair of conductor portions 121 extending along the y-axis and arranged opposite each other in the x-axis direction, separated by a current sensor 140; and a pair of connecting portions 122 connected to the two ends of the pair of conductor portions 121 respectively. The pair of conductor portions 121 is an example of a pair of first conductor portions. The pair of connecting portions 122 is an example of a pair of first connecting portions. When viewed from the z-axis direction, the current sensor 140 has a through-hole 125 surrounded by the pair of conductor portions 121 and the pair of connecting portions 122.

[0129] The current sensor module 100 also includes a support member 180 supporting the current sensor 140. The support member 180 has a base 182 and a surrounding wall 184 configured to surround the surface 180a of the base 182. The base 182 and the surrounding wall 184 can be integrally formed. The support member 180 can be made of an insulator. The insulator can be a resin, such as a thermosetting epoxy resin with added silica, or a thermoplastic resin such as a liquid crystal polymer. The surrounding wall 184 is an example of a first part of the support member 180.

[0130] A substrate 155 is disposed on surface 180a of the base 182 via an adhesive layer 158, and a current sensor 140 is disposed on the substrate 155. The adhesive layer 158 may be a chip bonding film. A surrounding wall 184 is disposed on surface 180a of the base 182 to surround the substrate 155 and the current sensor 140. The base 182 can be fixed to a receiving device. Figure 11The outer frame 20 of the current sensor module 100 is shown. The pedestal 182 and the base plate 155 are examples of the second part of the support member 180.

[0131] The base 182 can be used to adjust the height of the current sensor 140. For high-precision measurement of the current flowing through the busbar 120, the current sensor 140 is preferably positioned where a plane passing through the center of the pair of first conductor portions 121 and the pair of first connecting portions 122 in the z-axis direction is traversed. The magnetic sensing surface of the current sensor 140 can exist on the plane passing through the center of the pair of first conductor portions 121 and the pair of first connecting portions 122 in the z-axis direction. For even higher precision measurement of the current flowing through the busbar 140, it is more preferable that the magnetic sensing surface of the current sensor 140 is positioned in the central portion of the through-hole 125 of the busbar 120. For example, when the current sensor 140 has a longitudinal magnetic field detection element, i.e., a Hall element, as a magnetoelectric conversion element, the magnetic flux density in the z-axis direction of the magnetic flux generated by the current flowing through the pair of conductor portions 121 is higher in the central portion of the through-hole 125 of the busbar 120. Therefore, it is preferable that the magnetic sensing surface of the current sensor 120 is disposed in the central part of the through-hole 125 of the busbar 120.

[0132] The enclosure 184 is disposed on surface 180a of the pedestal 182 such that it surrounds the substrate 155 and the current sensor 140 at a distance from the current sensor 140 when viewed from the z-axis direction. By having the enclosure 184, which acts as an insulator, between the busbar 120 and the current sensor 140, insulation between them is ensured. The presence of the enclosure 184 also allows the distance between the current sensor 140 and the busbar 120 to be brought closer together, while ensuring insulation between them.

[0133] Figure 19 Showing with Figure 18A The current sensor module 100 shown is electrically connected to a substrate 155, which is positioned above the busbar 120. The substrate 155 can be electrically connected to the main substrate 150, which houses the control circuitry of the control power module 10, via a wiring harness 152.

[0134] Figure 20 This is a cross-sectional view of the current sensor module 100 of the first modification of the fourth embodiment. The current sensor module 100 involved in the first modification is similar to... Figure 18B The difference in the current sensor module 100 shown is that the base 182 has a protrusion 182a to support the busbar 120.

[0135] Figure 21This is a cross-sectional view of the current sensor module 100 of the second variation of the fourth embodiment. The structure of the support member 180 of the current sensor module 100 of the first variation is different from that of the current sensor module 100 of the fourth embodiment.

[0136] In the second variation of the current sensor module 100, the pedestal 182 is hollow. The support member 180 forms a box-shaped structure through the pedestal 182 and the surrounding wall 184. The support member 180 has a shelf portion 185 on its inner wall for supporting the substrate 155. The substrate 155 is fixed to the shelf portion 185 via an adhesive layer 158.

[0137] Figure 22 This is a cross-sectional view of the current sensor module 100 of the third modification of the fourth embodiment. The structure of the support member 180 of the current sensor module 100 of the third modification is different from that of the current sensor module 100 of the fourth embodiment.

[0138] In the third variation, the support member 180 is fixed to a protrusion 22 on the bottom surface of the housing, i.e., the outer frame 20, which houses the power module 10, via an adhesive layer 23. The protrusion 22 protrudes into the through-hole 125 of the busbar 120. The adhesive layer 23 may be a chip adhesive film. The support member 180, like the power module 10 of the fourth embodiment, has a base 182 and a surrounding wall 184. However, due to the presence of the protrusion 22, the thickness of the base 182 may be thinner than that of the base 182 of the fourth embodiment. The substrate 155, which mounts the current sensor 140, may be fixed to the base 182 via an adhesive layer 158. The support member 180 may also be provided on a heat sink instead of the outer frame 20. The support member 180 may be integrally formed with the heat sink. When the support member 180 is provided on the heat sink, an insulating member may be provided between the heat sink and the busbar 120.

[0139] As described above, the current sensor module 100 according to the first to third modifications of the fourth embodiment, similarly to the current sensor module 100 of the fourth embodiment, ensures insulation between the busbar 120 and the current sensor 140 by having a surrounding wall 184, which acts as an insulator, between them. The presence of the surrounding wall 184 allows the distance between the current sensor 140 and the busbar 120 to be brought closer, and ensures insulation between them.

[0140] The present invention has been described above using embodiments, but the technical scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various modifications or improvements can be made to the above embodiments. As can be seen from the claims, such modifications or improvements are also included within the technical scope of the present invention.

[0141] It should be noted that the execution order of actions, steps, processes, and stages in the apparatus, system, program, and method shown in the claims, specification, and drawings can be implemented in any order, unless specifically stated as "before" or "in advance," and unless the output of a previous process is used in a subsequent process. Even if the flow of actions in the claims, specification, and drawings is described using terms such as "firstly" or "next" for convenience, it does not mean that the actions must be performed in that order.

Claims

1. A coreless current sensor module, comprising: Supporting components; A first current sensor, mounted on the first surface of the support member, has at least one magnetoelectric conversion element that outputs a signal corresponding to the magnitude of the magnetic field; An insulator, when viewed from a first direction intersecting the first surface, at least surrounds the first current sensor in a spaced-apart state, and when viewed from a second direction along the first surface, at least a portion of the insulator overlaps with the first current sensor; and The first busbar supplies current flow to generate the magnetic field detected by the first current sensor. At least one of the insulator and the support member exists between the first current sensor and the first busbar.

2. The coreless current sensor module according to claim 1, wherein, The supporting member is a base plate. The first busbar is disposed at a distance from the substrate. The insulator exists between the first current sensor and the first busbar.

3. The coreless current sensor module according to claim 2, wherein, The direction along the substrate and intersecting the second direction is defined as the third direction. When viewed from the first direction or the third direction, at least a portion of the first busbar overlaps with the first current sensor.

4. The coreless current sensor module according to claim 2, wherein, The first busbar includes a pair of first conductor portions extending in the second direction and arranged opposite to each other across the first current sensor in a third direction along the substrate and intersecting the second direction. The insulator is disposed at least between each of the pair of first conductor portions and the first current sensor, with a gap separating it from the first current sensor.

5. The coreless current sensor module according to claim 4, wherein, The first busbar includes a pair of first connecting portions that are respectively connected to both ends of the pair of first conductor portions. When viewed from the first direction, the first current sensor is surrounded by the pair of first conductor portions and the pair of first connection portions.

6. The coreless current sensor module according to claim 4, wherein, The insulator is also disposed between the substrate and each of the first conductor portions of the pair of first conductor portions.

7. The coreless current sensor module according to claim 2, wherein, The first busbar is in contact with the insulator.

8. The coreless current sensor module according to claim 5, wherein, The insulator is further configured to cover the side of the first current sensor opposite to the side mounted on the substrate, in a state that is spaced apart from the first current sensor in the first direction.

9. The coreless current sensor module according to claim 5, wherein, The insulator has an opening that exposes the side of the first current sensor opposite to the side mounted on the substrate.

10. The coreless current sensor module according to claim 2, wherein, The first busbar includes a pair of first conductor portions that extend upward along the substrate and intersect the second direction, and are arranged opposite each other in the first direction, separated by the first current sensor. The insulator is also disposed between one of the pair of first conductor portions and the first current sensor, separated by a gap.

11. The coreless current sensor module according to claim 10, wherein, The first busbar includes a pair of first connecting portions that are respectively connected to both ends of the pair of first conductor portions. When viewed from the second direction, the first current sensor is surrounded by the pair of first conductor portions and the pair of first connecting portions.

12. The coreless current sensor module according to claim 2, wherein, The coreless current sensor module also includes: A second current sensor, mounted on the first surface of the substrate, has at least one magnetoelectric conversion element that outputs a signal corresponding to the magnitude of the magnetic field; and The second busbar, spaced apart from the substrate, allows current to flow to generate the magnetic field detected by the second current sensor. When viewed from the first direction, the insulator also surrounds the second current sensor with a gap, and when viewed from the second direction, at least a portion of the insulator overlaps with the second current sensor.

13. The coreless current sensor module according to claim 12, wherein, The first busbar includes a pair of first conductor portions extending in the second direction and arranged opposite to each other on a third direction along the first surface and intersecting the second direction, separated by the first current sensor. The second busbar includes a pair of second conductor portions extending in the second direction and arranged opposite to each other in the third direction, across the second current sensor. The insulator is disposed at least between the first conductor portion of the pair of first conductor portions and the first current sensor, and is disposed at least between the second conductor portion of the pair of second conductor portions and the second current sensor, with a gap between the insulator and the second current sensor.

14. The coreless current sensor module according to claim 13, wherein, The first busbar includes a pair of first connecting portions that are respectively connected to both ends of the pair of first conductor portions. The second busbar includes a pair of second connection portions that are respectively connected to both ends of the pair of second conductor portions. When viewed from the first direction, the first current sensor is surrounded by the pair of first conductor portions and the pair of first connecting portions. When viewed from the first direction, the second current sensor is surrounded by the pair of second conductor portions and the pair of second connecting portions.

15. The coreless current sensor module according to claim 12, wherein, The first current sensor and the second current sensor are arranged in a third-direction upward arrangement along the substrate and intersecting the second direction.

16. The coreless current sensor module according to claim 12, wherein, The portion of the insulator disposed between the first busbar and the second busbar includes a portion of first thickness extending from the first surface of the substrate and a portion of second thickness extending from the first surface of the substrate, which is different from the first thickness.

17. The coreless current sensor module according to claim 12, wherein, The insulator has: A first insulator surrounds the first current sensor with a gap when viewed from the first direction, and at least a portion of the first insulator overlaps with the first current sensor when viewed from the second direction. and A second insulator, when viewed from the first direction, surrounds the second current sensor with a gap, and when viewed from the second direction, at least a portion of the second insulator overlaps with the second current sensor. When viewed from the first direction, there is at least a partial gap between the first insulator and the second insulator.

18. The coreless current sensor module according to claim 2, wherein, The distance between the first current sensor and the first busbar is greater than 0 mm and less than 5 mm.

19. A coreless current sensor module, comprising: substrate; A first current sensor, mounted on a first surface of the substrate, has at least one magnetoelectric conversion element that outputs a signal corresponding to the magnitude of the magnetic field; A first busbar extends upward along a second direction of the substrate or along the substrate and intersecting the second direction, and includes a pair of first conductor portions that are arranged opposite each other with respect to the first current sensor when viewed from the first or second direction intersecting the substrate. The first busbar is spaced apart from the substrate to allow current flow that generates a magnetic field detected by the first current sensor. and An insulator, when viewed from the first direction or the second direction, is disposed at least between the pair of first conductor portions and the first current sensor, separated by a gap.

20. The coreless current sensor module according to claim 19, wherein, The first busbar includes a pair of first connecting portions that are respectively connected to both ends of the pair of first conductor portions. When viewed from the first direction or the second direction, the first current sensor is surrounded by the pair of first conductor portions and the pair of first connecting portions.

21. The coreless current sensor module according to claim 19, wherein, When viewed from the first direction or the third direction, the pair of first conductor portions overlap at least partially with the first current sensor.

22. The coreless current sensor module according to claim 19, wherein, When viewed from the first direction, the insulator at least surrounds the first current sensor in a spaced-apart state.

23. The coreless current sensor module according to claim 1, wherein, The support member has a first portion integrally formed with the insulator.

24. The coreless current sensor module according to claim 23, wherein, The support member also has a second portion including a substrate on which the first current sensor is mounted.

25. The coreless current sensor module according to claim 24, wherein, The second portion of the support member is fixed to the first portion of the support member via an adhesive layer.

26. The coreless current sensor module according to claim 24, wherein, The surface of the second portion of the support member is a part of the first surface of the support member. The insulator is disposed on the first surface of the support member such that it surrounds the second portion and the first current sensor in a manner that is spaced apart from the first current sensor when viewed from the first direction.

27. The coreless current sensor module according to claim 26, wherein, The first bus bar includes: A pair of first conductor portions, extending in the second direction, and configured opposite to each other on a third direction along the first surface and intersecting the second direction, separated by the first current sensor; and A pair of first connecting portions are respectively connected to both ends of the pair of first conductor portions. At least a portion of the support member and the insulator are disposed within the through-hole of the first busbar, which is surrounded by the pair of first conductor portions and the pair of first connecting portions.

28. The coreless current sensor module according to claim 27, wherein, The first current sensor is positioned at a location where a plane traverses the center of the first direction passing through the pair of first conductor portions and the pair of first connecting portions.

29. The coreless current sensor module according to claim 23, wherein, The support member, together with the insulator, is made of resin.

30. A power module, comprising: The coreless current sensor module according to any one of claims 1 to 29; Input terminal section; The output terminal section includes the first busbar; and Multiple power semiconductors convert the DC input from the input terminal into AC and output it to the output terminal.

31. A current sensor module, comprising: substrate; A first current sensor, mounted on a first surface of the substrate, has at least one magnetoelectric conversion element that outputs a signal corresponding to the magnitude of the magnetic field; An insulator, when viewed from a first direction intersecting the first surface, at least surrounds the first current sensor in a spaced-apart state, and when viewed from a second direction along the first surface, at least a portion of the insulator overlaps with the first current sensor; The first busbar is spaced apart from the substrate to allow current to flow in order to generate the magnetic field detected by the first current sensor. and A magnetic collecting plate is disposed in the first direction at a distance from the first current sensor, facing the side opposite to the surface of the first current sensor mounted on the substrate. The insulator exists between the first current sensor and the first busbar.

32. A current sensor module, comprising: substrate; A first current sensor, mounted on a first surface of the substrate, has at least one magnetoelectric conversion element that outputs a signal corresponding to the magnitude of the magnetic field; An insulator, when viewed from a first direction intersecting the first surface, at least surrounds the first current sensor in a spaced-apart state, and when viewed from a second direction along the first surface, at least a portion of the insulator overlaps with the first current sensor; The first busbar is spaced apart from the substrate to allow current to flow in order to generate the magnetic field detected by the first current sensor. The second current sensor, mounted on the first surface of the substrate, has at least one magnetoelectric conversion element that outputs a signal corresponding to the magnitude of the magnetic field. The second busbar is spaced apart from the substrate to allow current to flow in order to generate the magnetic field detected by the second current sensor. and A wall portion, including a magnetic element, protrudes from the first surface of the substrate between the first busbar and the second busbar. The insulator exists between the first current sensor and the first busbar. When viewed from the first direction, the insulator also surrounds the second current sensor with a gap, and when viewed from the second direction, at least a portion of the insulator overlaps with the second current sensor.

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