Core layer equipment, photoelectric component and communication network

Abstract

Provided are a core layer device, a photoelectric component and a communication network, relating to the field of communications, the core layer device and an access layer device being capable of realizing passive connection, thereby reducing the deployment cost of the network, enabling a deployment scheme to be more flexible, higher in compatibility and convenient to operate and maintain. The core layer equipment comprises at least one photoelectric component; the core layer equipment is used for being connected with the access layer equipment through a photoelectric component; the photoelectric component is used for acquiring a plurality of first electric signals to be transmitted by the core layer equipment and receiving optical carriers of a plurality of wavelengths output by the light source; the photoelectric assembly is also used for modulating the plurality of first electric signals to optical carriers with a plurality of wavelengths to generate a plurality of first optical carrier signals, and one first electric signal is correspondingly modulated on the optical carrier with each wavelength; the photoelectric component is used for receiving a plurality of second optical carrier signals transmitted by a plurality of access layer devices; the photoelectric assembly is also used for obtaining a plurality of second electric signals from the plurality of second optical carrier signals. The embodiment of the invention is used for communication.

Description

Technical Field

[0001] This application relates to the field of communications, and more particularly to a core layer device, an optoelectronic component, and a communication network. Background Technology

[0002] Generally speaking, a communication network (or simply network) includes multiple communication devices or apparatuses (collectively referred to as network devices). Through these network devices, data transmission can occur within the network, thereby enabling communication.

[0003] In a network, multiple network devices are typically deployed in different locations, resulting in different network architectures. Taking a campus network (such as those in enterprises, schools, or hospitals) as an example, a campus often includes multiple buildings. A campus network typically employs a three-layer architecture: a core layer, an aggregation layer, and an access layer. Each layer includes one or more communication devices or equipment. Specifically, core layer network devices are usually deployed in the campus's data center, aggregation layer network devices are usually deployed in the low-voltage electrical rooms of each building, and access layer network devices are usually deployed in the low-voltage electrical rooms of each building and each floor. This traditional three-layer network architecture provides clear network hierarchy, ease of use, good network transmission performance, and allows for management of nodes at each layer. However, since the aggregation layer equipment is an active device, an uninterruptible power supply (UPS) needs to be configured in the low-voltage room of each building where the aggregation layer equipment is deployed to ensure power supply, and air conditioning and other equipment for temperature control need to be deployed to maintain the operation of the aggregation layer equipment in the low-voltage room. This will result in high network deployment costs and poor compatibility. At the same time, the access layer equipment in the low-voltage rooms of each floor and different terminal devices deployed in different locations on the floor (e.g., different rooms) need to be connected through transmission media (e.g., copper cables), resulting in high network cabling costs and complex operation and maintenance.

[0004] Based on the above problems, there is an urgent need for a technical solution that can address issues such as high network deployment costs, poor compatibility, and complex operation and maintenance. Summary of the Invention

[0005] Embodiments of this application relate to a core layer device, optoelectronic components, and a communication network. This core layer device enables passive connection with access layer devices, eliminating the need for additional power supplies, temperature control, and other equipment required for active devices in the communication network, thereby effectively reducing deployment costs. Furthermore, the passive connection networking method allows for more flexible network deployment schemes, higher compatibility, and easier operation and maintenance.

[0006] In a first aspect, a core layer device is provided. The core layer device includes at least one optoelectronic component; the core layer device is used to connect to an access layer device via the optoelectronic component; the optoelectronic component is used to acquire a plurality of first electrical signals to be transmitted by the core layer device, and to receive optical carriers of multiple wavelengths output by a light source; the optoelectronic component is further used to modulate the plurality of first electrical signals onto the optical carriers of multiple wavelengths respectively to generate a plurality of first optical carrier signals, wherein each wavelength of the optical carrier corresponds to one first electrical signal; and the optoelectronic component is used to receive a plurality of second optical carrier signals transmitted by the multiple access layer devices; the optoelectronic component is further used to acquire a plurality of second electrical signals from the plurality of second optical carrier signals respectively, wherein the plurality of second optical carrier signals have different wavelengths.

[0007] Structurally, the core layer device in the above scheme can achieve passive connection with the access layer device through optoelectronic components. Specifically, the optoelectronic components can acquire multiple electrical signals (i.e., first electrical signals) to be transmitted by the core layer device and receive multiple wavelengths of optical carriers output by the light source. The optoelectronic components can also modulate the multiple first optical signals onto the multiple wavelengths of optical carriers respectively, generating multiple optical carrier signals (i.e., first optical carrier signals). Further, the optoelectronic components transmit the generated multiple first optical carrier signals to the access layer device. In one possible implementation, the first electrical signals carry the service data or other valid data to be transmitted by the core layer device. In this way, in the downlink direction, each electrical signal to be transmitted by the core layer device can be transmitted to the access layer device through the optical carrier signals generated by the optoelectronic components, thereby realizing data transmission from the core layer device to the access layer device, i.e., signal transmission in the downlink direction. Similarly, the optoelectronic components can receive multiple optical carrier signals (i.e., second optical carrier signals) transmitted by multiple access layer devices, wherein the multiple second optical carrier signals have different wavelengths. The optoelectronic components can also acquire multiple electrical signals (i.e., second electrical signals) from the multiple second optical carrier signals respectively. Furthermore, the core layer device can acquire multiple second electrical signals through optoelectronic components. In one possible implementation, the second electrical signals carry service data or other valid data to be transmitted by the access layer device. Thus, in the uplink direction, the core layer device can receive the second optical carrier signal transmitted by the access layer device through the optoelectronic components and acquire the second electrical signal carried by the second optical carrier signal, thereby realizing data transmission from the access layer device to the core layer device, i.e., signal transmission in the uplink direction. Therefore, through the above scheme, the core layer device can achieve passive connection with the access layer device through the optoelectronic components, eliminating the need for additional power supplies, temperature control, and other equipment required for active devices in the network, thereby effectively reducing deployment costs. Simultaneously, based on the above scheme, the network deployment scheme can be made more flexible, more compatible, and easier to maintain. It is easy to understand that, in the downlink direction, the embodiments of this application do not limit the number of optical carriers of multiple wavelengths received by the optoelectronic components from the light source; similarly, in the uplink direction, the embodiments of this application do not limit the number of second optical carrier signals of different wavelengths received by the optoelectronic components from the access layer device. In this way, the aforementioned core layer equipment can be applied to different types of communication networks and achieve passive connection with access layer equipment, resulting in high compatibility. For example, the core layer equipment described above can be applied to communication networks with different transmission bandwidths, such as passive optical network (PON) networks, GPON (gigabit-capable PON) networks, 10GPON (10-gigabit-capable PON) networks, and 50GPON (50-gigabit-capable PON) networks.

[0008] In one possible implementation, the optoelectronic component includes: a transmitting module and a receiving module; the transmitting module includes an input terminal, an output terminal, and a predetermined number of electrical interfaces; wherein, the input terminal of the transmitting module is used to connect to a light source, and the output terminal of the transmitting module is used to connect to an access layer device via a first optical fiber; the transmitting module acquires a first electrical signal to be transmitted by the core layer device through the electrical interfaces, and receives an optical carrier wave including multiple wavelengths output by the light source; the transmitting module modulates the first electrical signal onto an optical carrier wave of one wavelength to generate a first optical carrier signal; the transmitting module transmits the first optical carrier signal to the access layer device through the first optical fiber; the receiving module includes an input terminal and a predetermined number of electrical interfaces; wherein, the input terminal of the receiving module is used to connect to the access layer device through a second optical fiber; the receiving module receives a second optical carrier signal transmitted by the access layer device through the second optical fiber; the receiving module acquires a second electrical signal based on the second optical carrier signal; the core layer device acquires the second electrical signal through the electrical interfaces of the receiving module.

[0009] The optoelectronic components in the above scheme include a transmitting module and a receiving module. Specifically, in the downlink direction, the core layer device, through the transmitting module in the optoelectronic components, can acquire the electrical signal (i.e., the first electrical signal) to be transmitted by the core layer device (via an electrical interface); simultaneously, the transmitting module can also receive optical carriers of multiple wavelengths output by the light source. The transmitting module then modulates the first electrical signal onto an optical carrier of one wavelength to generate an optical carrier signal (i.e., the first optical carrier signal), and transmits the generated first optical carrier signal to the access layer device through an optical fiber (i.e., the first optical fiber). In this way, the electrical signal to be transmitted in the downlink direction by the core layer device can be transmitted to the access layer device through the transmitting module in the optoelectronic components. In the uplink direction, the core layer device, through the receiving module in the optoelectronic components, can receive the optical carrier signal (i.e., the second optical carrier signal) transmitted by the access layer device through an optical fiber (i.e., the second optical fiber). The receiving module then acquires the second electrical signal based on the second optical carrier signal. Through the electrical interface of the receiving module, the core layer device can acquire the second electrical signal transmitted by the access layer device. In this way, the core layer device can acquire electrical signals based on the optical carrier signals transmitted by the access layer device in the uplink direction through the receiving module in the optoelectronic component. Therefore, through the optoelectronic component including the receiving module and the transmitting module in the above scheme, the core layer device and the access layer device can realize signal transmission in both the uplink and downlink directions, that is, realize communication.

[0010] In one possible implementation, the transmitting module includes: a first optical waveguide and a plurality of micro-ring modulators; wherein the first optical waveguide is connected between the input and output ends of the transmitting module, the input end of the first optical waveguide is connected to the input end of the transmitting module, and the output end of the first optical waveguide is connected to the output end of the transmitting module; the plurality of micro-ring modulators are coupled between the input and output ends of the first optical waveguide; the micro-ring modulators have modulation electrodes, and the modulation electrodes are connected to the electrical interface of the transmitting module.

[0011] Based on the above scheme, the transmitting module of the optoelectronic component includes: an optical waveguide (i.e., a first optical waveguide) connected between the input and output ends of the transmitting module, and multiple micro-ring modulators coupled between the input and output ends of the first optical waveguide. Each micro-ring modulator includes a modulation electrode connected to the electrical interface of the transmitting module. Specifically, the input end of the first optical waveguide receives optical carriers of multiple wavelengths output from a light source through the input end of the transmitting module connected thereto, and transmits these optical carriers to the multiple micro-ring modulators respectively. The micro-ring modulators, through modulation electrodes, modulate the electrical signal (i.e., a first electrical signal) acquired by the electrical interface of the transmitting module onto an optical carrier of a single wavelength, generating an optical radio frequency signal (i.e., a first optical carrier signal). In one possible implementation, the first optical waveguide can transmit optical carriers of multiple wavelengths to a micro-ring modulator, which then modulates the first electrical signal onto an optical carrier of a single wavelength. Of course, the embodiments of this application do not limit the wavelength values ​​or the number of wavelengths of the multiple optical carriers. Therefore, through the above scheme, the core layer device can carry the first electrical signal to be transmitted on the optical carrier through the transmitting module in the optoelectronic component and transmit it to the access layer device, that is, the core layer device and the access layer device realize signal transmission in the downlink direction.

[0012] In one possible implementation, the transmitting module further includes multiple driving circuits; the driving circuits are connected between the electrical interface of the transmitting module and the modulation electrode.

[0013] In the above scheme, the transmitting module in the optoelectronic component further includes a driving circuit connected between the electrical interface of the transmitting module and the modulation electrode of the micro-ring modulator. Based on the other schemes described above, the electrical interface of the transmitting module can acquire the first electrical signal to be transmitted from the core layer device, and the micro-ring modulator can receive multiple wavelengths of optical carriers output by the light source through the first optical waveguide. Specifically, the driving circuit provides voltage to the modulation electrode, enabling the modulation electrode of the micro-ring modulator to modulate the first electrical signal onto an optical carrier of one wavelength, generating a first optical carrier signal. Of course, in other examples, the driving circuit may also provide current to the modulation electrode of the micro-ring modulator to drive the modulation electrode to modulate the corresponding signal; this embodiment of the application does not limit this. Through the above scheme, the transmitting module can provide energy to the micro-ring modulator through the driving circuit, enabling the micro-ring modulator to carry the first electrical signal to be transmitted onto the optical carrier, thereby ensuring signal transmission between the core layer device and the access layer device in the downlink direction.

[0014] In one possible implementation, the receiving module includes: a second optical waveguide, multiple detection circuits, and multiple micro-ring filters; wherein the second optical waveguide includes an input end and an output end, and the input end of the second optical waveguide is connected to the input end of the receiving module; multiple micro-ring filters are coupled between the input end and the output end of the second optical waveguide; the detection circuits are coupled between the micro-ring filters and the electrical interface of the receiving module; the micro-ring filters are used to receive a second optical carrier signal transmitted by the access layer device through the second optical waveguide; the detection circuits are used to perform photoelectric conversion on the second optical carrier signal received from the micro-ring filters to obtain a second electrical signal.

[0015] Based on the above scheme, the receiving module in the optoelectronic component includes: an optical waveguide (i.e., a second optical waveguide) connected between the input and output ends of the receiving module, and multiple micro-ring filters coupled between the input and output ends of the second optical waveguide. A detection circuit is also coupled between the micro-ring filters and the electrical interface of the receiving module. Specifically, the input end of the second optical waveguide receives the optical carrier signal (i.e., the second optical carrier signal) transmitted by the access layer device through the input end of the receiving module connected to it. The detection circuit then performs photoelectric conversion on the second optical carrier signal to obtain a second electrical signal. Further, the core layer device obtains the second electrical signal transmitted by the access layer device through the receiving module. In one possible implementation, the second electrical signal carries service data transmitted from the access layer device to the core layer device. Of course, the embodiments of this application do not limit the wavelength value or number of wavelengths of the second optical carrier signal. Therefore, the core layer device in the above scheme can receive the second optical carrier signal transmitted by the access layer device through the second optical waveguide in the receiving module of the optoelectronic component. The detection circuit can obtain the second electrical signal based on the second optical carrier signal. In this way, core layer devices and access layer devices can transmit signals in the uplink direction.

[0016] In one possible implementation, the receiving module includes: a second optical waveguide, a demultiplexer, and multiple detection circuits; wherein the second optical waveguide includes an input terminal and an output terminal, and the demultiplexer includes an input terminal and multiple output terminals; the input terminal of the demultiplexer is used to connect to an access layer device, and the output terminal of the demultiplexer is connected to the input terminal of the second optical waveguide; the detection circuits are coupled between the electrical interface of the second optical waveguide and the receiving module; the demultiplexer is used to transmit a second optical carrier signal of one wavelength received from the access layer device to the second optical waveguide according to the wavelength; the detection circuits are used to perform photoelectric conversion on the second optical carrier signal of one wavelength received from the second optical waveguide to obtain a second electrical signal.

[0017] Based on the above scheme, the receiving module in the optoelectronic component includes: an optical waveguide (i.e., a second optical waveguide) with an input and an output end, a demultiplexer whose output end is connected to the input end of the second optical waveguide, and multiple detection circuits coupled between the second optical waveguide and the electrical interface of the receiving module. The input end of the demultiplexer is connected to the access layer device. Specifically, the input end of the demultiplexer can receive the optical carrier signal (i.e., the second optical carrier signal) transmitted by the access layer device, and then transmit the second optical carrier signal of one wavelength received from the access layer device to the second optical waveguide according to its wavelength. The detection circuit can perform photoelectric conversion on the second optical carrier signal of one wavelength received from the second optical waveguide to obtain a second electrical signal. Optionally, the second electrical signal carries service data transmitted from the access layer device to the core layer device. Of course, the embodiments of this application do not limit the wavelength value or number of wavelengths of the second optical carrier signal. Therefore, the core layer device in the above scheme can receive the second optical carrier signal transmitted by the access layer device through the demultiplexer in the receiving module of the optoelectronic component. The detection circuit in the receiving module can obtain the second electrical signal based on the second optical carrier signal. In this way, core layer devices and access layer devices can transmit signals in the uplink direction.

[0018] In one possible implementation, the receiving module further includes an amplifier circuit; the amplifier circuit is connected between the detection circuit and the electrical interface of the receiving module.

[0019] Therefore, in the core layer device of the above scheme, the receiving module of the optoelectronic component structurally includes an amplification circuit connected between the detection circuit and the electrical interface of the receiving module. Specifically, the detection circuit acquires a second electrical signal based on a second optical carrier signal of a certain wavelength and transmits the acquired second electrical signal to the amplification circuit connected to the detection circuit. The amplification circuit amplifies the second electrical signal and then transmits it to the electrical interface of the receiving module. Further, the receiving module can output the second electrical signal through the electrical interface. In one possible implementation, the receiving module can also transmit the second electrical signal to other devices or functional units in the core layer device through the electrical interface, so that the core layer device can acquire the second optical signal; the embodiments of this application do not limit this. Thus, the core layer device in the above scheme, through the amplification circuit in the receiving module of the optoelectronic component, can amplify the acquired second electrical signal, thereby ensuring the quality of signal transmission between the core layer device and the access layer device in the uplink direction.

[0020] In one possible implementation, the optoelectronic component further includes an optical amplifier, the input of which is connected to a light source, and the output of which is connected to the input of the transmitting module.

[0021] Therefore, in the core layer equipment of the above scheme, the optoelectronic component structurally includes an optical amplifier connected to the input end of the light source and the transmitting module. Specifically, the optical amplifier receives optical carriers of multiple wavelengths output by the light source, amplifies the received optical carriers, and then transmits them to the input end of the transmitting module. Further, the transmitting module can modulate the received first electrical signal onto an optical carrier of one wavelength to generate a first optical carrier signal. Thus, in the above scheme, the optical amplifier in the optoelectronic component amplifies the optical carriers used to generate the optical carrier signal, thereby ensuring the quality of signal transmission between the core layer equipment and the access layer equipment in the downlink direction.

[0022] In one possible implementation, the light source includes any of the following: a distributed Bragg grating array laser, a mode-locked laser, an optical frequency comb, or a Kerr comb.

[0023] In the above scheme, the light source can be implemented by any of the following: a distributed feedback bragg grating (DFB) array laser, a mode-locked laser, an optical frequency comb, and a Kerr comb, used to output optical signals including multiple wavelengths to the transmitting module of the optoelectronic component. Further, the core layer device can modulate the second electrical signal to be transmitted onto the received optical carrier through the optoelectronic component, and transmit the generated optical carrier signal to the access layer device. Of course, this is only an example of the above-mentioned light sources; in some examples, the light source may also include other possible devices or equipment, and the embodiments of this application do not limit this. For example, the above-mentioned light source can be implemented using a multi-wavelength light source, that is, a light source capable of outputting a series of optical carriers with multiple wavelength intervals. The multi-wavelength characteristics of the multi-wavelength light source enable the networking architecture provided by the embodiments of this application to have higher integration and more wavelength channels, and each wavelength optical carrier can be used to carry different high-speed information. It is easy to understand that the above-mentioned different types of light sources can have different characteristics, therefore, those skilled in the art can flexibly choose according to actual needs or specific application scenarios in practical applications. Therefore, the above solution can output optical carriers of multiple wavelengths through different types of light sources. These carriers are then used by optoelectronic components in the core layer device to generate multiple optical carrier signals based on the received signals, which are then transmitted to the access layer device. Because there are many types of light sources to choose from, the solution can be selected as needed in practical applications, thus offering greater compatibility.

[0024] In one possible implementation, the core layer device is also used to connect to a passive aggregation device; wherein the passive aggregation device includes a common terminal and multiple branch terminals, the common terminal of the passive aggregation device is used to connect to optoelectronic components, and the branch terminals of the passive aggregation device are used to connect to access layer devices.

[0025] In the above scheme, the core layer equipment is connected to the access layer equipment via a passive aggregation device. Specifically, the optoelectronic components in the core layer equipment are connected to the common terminal of the passive aggregation device, and the access layer equipment is connected to the branch terminals of the passive aggregation device. Generally, a communication network includes one core layer equipment and multiple access layer equipment. In the downlink direction, the common terminal of the passive aggregation device receives multiple first optical carrier signals generated and output by the optoelectronic components in the core layer equipment, and then transmits one of these first optical carrier signals to the corresponding access layer equipment through multiple branch terminals. Similarly, in the uplink direction, the passive aggregation device receives second optical carrier signals output by multiple access layer equipment through multiple branch terminals, and then transmits them to the optoelectronic components in the core layer equipment through the common terminal. It is easy to understand that in the downlink direction, the passive aggregation device can split the multiple first optical carrier signals output by the core layer equipment, transmitting one first optical carrier signal to the corresponding access layer equipment. In the uplink direction, the passive aggregation device can combine the multiple second optical carrier signals output by multiple access layer equipment, transmitting the multiple second optical carrier signals to the core layer equipment. Based on the above scheme, the core layer equipment and the access layer equipment can combine and split multiple optical carrier signals through the passive aggregation equipment they are connected to, thus achieving passive connection between the core layer equipment and the access layer equipment, thereby ensuring signal transmission in both the uplink and downlink directions.

[0026] In one possible implementation, the passive convergence device includes any of the following: a multiplexer / demultiplexer, or an optical splitter.

[0027] Therefore, in the above scheme, the passive aggregation device can be implemented using a multiplexer / demultiplexer or an optical splitter. For example, if the passive aggregation device is implemented using a multiplexer / demultiplexer, the multiplexer / demultiplexer will split the received multiple first optical carrier signals in the downlink direction according to wavelength, so that the first optical carrier signal generated corresponding to one wavelength of optical carrier is transmitted to the corresponding access layer device. As another example, if the passive aggregation device is implemented using an optical splitter, the optical splitter will split the received multiple first optical carrier signals in the downlink direction according to power, so that one first optical carrier signal is transmitted to the corresponding access layer device. Of course, the passive aggregation device can also implement the corresponding function using other possible devices or equipment, and the embodiments of this application do not limit this. Thus, through the above scheme, the passive aggregation device can split multiple first optical carrier signals received from the core layer device according to different splitting methods, and transmit the first optical carrier signal output by the core layer device to the access layer device.

[0028] Secondly, an optoelectronic component is provided. The optoelectronic component includes: a transmitting module and a receiving module; the transmitting module includes an input end, an output end, and a predetermined number of electrical interfaces; wherein, the input end of the transmitting module is used to connect to a light source, and the output end of the transmitting module is used to connect to an access layer device via a first optical fiber; the transmitting module acquires a first electrical signal to be transmitted by the core layer device through the electrical interfaces, and receives an optical carrier wave including multiple wavelengths output by the light source; the transmitting module modulates the first electrical signal onto an optical carrier wave of one wavelength to generate a first optical carrier signal; the transmitting module transmits the first optical carrier signal to the access layer device through the first optical fiber; the receiving module includes an input end and a predetermined number of electrical interfaces; wherein, the input end of the receiving module is used to connect to the access layer device through a second optical fiber; the receiving module receives a second optical carrier signal transmitted by the access layer device through the second optical fiber; the receiving module acquires a second electrical signal based on the second optical carrier signal; the receiving module outputs the acquired second electrical signal through the electrical interfaces.

[0029] In one possible implementation, the aforementioned transmitting module includes: a first optical waveguide and a plurality of micro-ring modulators; wherein the first optical waveguide is connected between the input and output ends of the transmitting module, the input end of the first optical waveguide is connected to the input end of the transmitting module, and the output end of the first optical waveguide is connected to the output end of the transmitting module; the plurality of micro-ring modulators are coupled between the input and output ends of the first optical waveguide; each micro-ring modulator has a modulation electrode, which is connected to the electrical interface of the transmitting module.

[0030] In one possible implementation, the aforementioned transmitting module further includes multiple driving circuits; the driving circuits are connected between the electrical interface of the transmitting module and the modulation electrode.

[0031] In one possible implementation, the receiving module includes: a second optical waveguide, multiple detection circuits, and multiple micro-ring filters; wherein the second optical waveguide includes an input end and an output end, and the input end of the second optical waveguide is connected to the input end of the receiving module; multiple micro-ring filters are coupled between the input end and the output end of the second optical waveguide; the detection circuits are coupled between the micro-ring filters and the electrical interface of the receiving module; the micro-ring filters are used to receive a second optical carrier signal transmitted by the access layer device through the second optical waveguide; the detection circuits are used to perform photoelectric conversion on the second optical carrier signal received from the micro-ring filters to obtain a second electrical signal.

[0032] In one possible implementation, the receiving module includes: a second optical waveguide, a demultiplexer, and multiple detection circuits; wherein the second optical waveguide includes an input terminal and an output terminal, and the demultiplexer includes an input terminal and multiple output terminals; the input terminal of the demultiplexer is used to connect to an access layer device, and the output terminal of the demultiplexer is connected to the input terminal of the second optical waveguide; the detection circuits are coupled between the electrical interface of the second optical waveguide and the receiving module; the demultiplexer is used to transmit a second optical carrier signal of one wavelength received from the access layer device to the second optical waveguide according to the wavelength; the detection circuits are used to perform photoelectric conversion on the second optical carrier signal of one wavelength to obtain a second electrical signal.

[0033] In one possible implementation, the receiving module further includes an amplifier circuit; the amplifier circuit is connected between the detection circuit and the electrical interface of the receiving module.

[0034] In one possible implementation, the aforementioned optoelectronic component further includes an optical amplifier, the input of which is connected to a light source, and the output of which is connected to the input of the transmitting module.

[0035] In one possible implementation, the light source mentioned above includes any of the following: a distributed Bragg grating array laser, a mode-locked laser, an optical frequency comb, or a Kerr comb.

[0036] Thirdly, a communication network is provided. The communication network includes: at least one access layer device and a core layer device as described in any of the first aspects; the core layer device includes at least one optoelectronic component, and the core layer device is used to connect to the access layer device via the optoelectronic component.

[0037] In one possible implementation, the aforementioned communication network further includes: a passive aggregation device; the passive aggregation device includes a common terminal and multiple branch terminals, the common terminal of the passive aggregation device is used to connect to optoelectronic components in the core layer device, and the branch terminals of the passive aggregation device are used to connect to access layer devices.

[0038] The technical effects of any of the possible design methods in the second and third aspects mentioned above can be compared with the technical effects of different design methods in the first aspect, and will not be elaborated here. Attached Figure Description

[0039] Figure 1 A schematic diagram of a network architecture provided for an embodiment of this application;

[0040] Figure 2 A schematic diagram of a networking architecture provided for another embodiment of this application;

[0041] Figure 3 A schematic diagram of a networking architecture provided for yet another embodiment of this application;

[0042] Figure 4 A schematic diagram of a core layer device provided for an embodiment of this application;

[0043] Figure 5 A schematic diagram of an optoelectronic component provided for an embodiment of this application;

[0044] Figure 6 A schematic diagram of the structure of an optoelectronic component provided for an embodiment of this application;

[0045] Figure 7 A schematic diagram of an optoelectronic component provided for another embodiment of this application;

[0046] Figure 8 A schematic diagram of a communication network provided for an embodiment of this application;

[0047] Figure 9 A schematic diagram of a multiplexer / demultiplexer provided for an embodiment of this application;

[0048] Figure 10 A schematic diagram of an optical power divider provided for an embodiment of this application;

[0049] Figure 11 This is a schematic diagram of a communication network provided for another embodiment of this application. Detailed Implementation

[0050] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0051] Unless otherwise defined, all technical terms used herein have the same meaning as those known to one of ordinary skill in the art. In the embodiments of this application, the terms "first," "second," etc., do not limit the quantity or order. In the embodiments of this application, "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone, where A and B can be singular or plural.

[0052] It should be noted that, in this application, the terms "exemplary" or "for example" are used to indicate that something is being described as an example, illustration, or illustration. Any embodiment or design described as "exemplary" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or design solutions. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0053] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0054] A communication network (also called a network) typically includes multiple communication devices or communication apparatuses (also called network devices). These network devices communicate with each other through data transmission. Generally, multiple network devices are deployed in different locations within the network, resulting in different network architectures.

[0055] For example, the network architecture can be a three-layer network architecture. This three-layer architecture includes a core layer, an aggregation layer, and an access layer, and each layer needs to communicate through one or more deployed communication devices or communication apparatuses. For example, refer to... Figure 1 As shown in the diagram, an embodiment of this application provides a schematic diagram of a network architecture, illustrating a possible three-layer network architecture. Combined with... Figure 1 As shown, this network architecture includes: core layer devices (refer to...) Figure 1 The core switch 101 and multiple aggregation layer devices (refer to...) Figure 1 Aggregation switches 102-1 to 102-4 and multiple access layer devices (see reference) Figure 1 Access switches 103-1 to 103-4 and terminals 104-1 to 104-8 are included in this configuration.

[0056] Specifically, the core layer device (i.e., core switch 101) is connected to multiple aggregation layer devices (i.e., aggregation switches 102-1 to 102-4). Any one of the aggregation switches (i.e., any one of aggregation switches 102-1 to 102-4) is connected to multiple access layer devices (i.e., access switches 103-1 to 103-4). Each access layer device is connected to multiple terminals. For example, access switch 103-2 is connected to terminals 104-1 to 104-4, and access switch 103-3 is connected to terminals 104-5 to 104-8.

[0057] Reference Figure 1 As shown, in one possible implementation, the core layer devices can be implemented using a core switch. Similarly, the aggregation layer devices can be implemented using an aggregation switch. Optionally, the access layer devices include access switches and terminal devices connected to the access switches. Optionally, the terminal devices can be various terminals or wireless access points (APs). It is easy to understand that this is only used as an example... Figure 1 The network architecture shown is an example and should not be used to limit the embodiments of this application.

[0058] Specifically, refer to Figure 1As shown, in the downlink direction: the signal output by the core switch 101 in the core layer is transmitted to the aggregation switch in the aggregation layer (e.g., aggregation switch 102-2). After processing the received signal, aggregation switch 102-2 transmits it to the access switch in the access layer (e.g., access switch 103-2). Access switch 103-2 then transmits the signal to each terminal (including terminals 104-1 to 104-4). Similarly, the signal transmission process in the uplink direction of this network architecture can refer to the above process, and will not be repeated here.

[0059] Based on the above scheme, the three-layer network architecture has a clear hierarchy, making it easy to apply. At the same time, this network architecture can manage the communication nodes (including communication devices or communication equipment) at each layer, ensuring network transmission performance.

[0060] Taking enterprise, school, and hospital campuses as examples, these campuses typically consist of one or more buildings. Generally, when deploying a communication network, the core layer equipment is deployed in the campus's data center server room, the aggregation layer equipment is deployed in the low-voltage electrical rooms of each building, and the access layer equipment is deployed in the low-voltage electrical rooms of each building and each floor. Of course, the aforementioned campus scenarios also include other possible scenarios such as offices, medical facilities, and educational institutions, and the embodiments of this application do not limit these scenarios.

[0061] Combination Figure 1 In one possible implementation of the architecture shown, the core switch 101 is deployed in the data center server room, aggregation switches 102-1 to 102-4 are deployed in the low-voltage rooms of each building, and access switches 103-1 to 103-4 are deployed in the low-voltage rooms of each building and each floor.

[0062] However, aggregation layer devices are active devices, and they are typically deployed in the low-voltage electrical rooms of each building. Therefore, corresponding equipment or devices need to be configured in these rooms to maintain the normal operation of the aggregation layer devices. For example, to provide power to the aggregation layer devices (e.g., electricity), a UPS needs to be configured in the low-voltage electrical room to ensure their operation. Another example is the need for air conditioning to regulate the ambient temperature of the aggregation layer devices. This significantly increases network deployment costs and reduces compatibility. Furthermore, the access layer devices in the low-voltage electrical rooms on each floor and different terminal devices deployed in different locations within the floor (e.g., different rooms) need to be connected via appropriate transmission media (e.g., copper cables), which increases network cabling costs and complicates maintenance.

[0063] Based on the above issues, PON technology can usually be used to design and deploy the network architecture, which does not include any electronic components or power supply.

[0064] For example, refer to Figure 2 As shown in the diagram, an embodiment of this application provides a schematic diagram of a network architecture, illustrating a network architecture employing PON technology (also known as a PON network). Combined with... Figure 2 As shown, this network architecture includes: an optical line terminal (OLT) (see reference). Figure 2 The OLT 201 and optical distribution network (ODN) are mentioned. Figure 2 ODN 202), multiple optical network units (ONUs) (see reference) Figure 2 ONU 203-1 to ONU 203-5 and multiple terminals (see reference) Figure 2 (Terminals 204-1 to 204-8 in the example). Each ONU can be connected to multiple terminals. For example, ONU 203-2 is connected to terminals 204-1 to 204-4, and ONU 203-4 is connected to terminals 204-5 to 204-8.

[0065] PON networks are point-to-multipoint fiber optic transmission networks. Typically, the OLT (Optical Line Terminal) is located at the central office (e.g., a central control station) to centralize network access and perform photoelectric conversion, bandwidth allocation, and control of channel connections for received optical signals. It also provides real-time monitoring, management, and maintenance functions. The ONU (Online User Unit) is usually located on the user side, handling and managing various electrical signals and providing user-side interfaces.

[0066] It is not difficult to understand that this is only based on Figure 2 The network architecture shown is an example and should not be construed as limiting the embodiments of this application. For example, the network architecture described above may also include other possible communication devices or apparatuses. For example, the terminal device described above may also be implemented using an access point (AP).

[0067] In one possible implementation, the OLT can be a Layer 2 (L2) switch or a Layer 3 (L3) router. Alternatively, the ONU can also be implemented using communication devices or apparatuses capable of similar functionality, such as an optical network terminal (ONT). It is easy to understand that the ONT performs similar functions to the ONU and is generally considered a component of the ONU. Therefore, for ease of explanation, Figure 2 In the network architecture shown, the user side only uses ONU as an example, and this should not be used to limit the types and number of devices included in the PON network.

[0068] In one possible implementation, the ODN 202 includes one or more passive optical splitters for distributing downlink data and concentrating uplink data. Optionally, the ODN may also include multi-stage splitters, i.e., multiple splitters are provided to achieve multi-stage splitting of the optical signal. In other examples, the splitters may include more or fewer output ports. The embodiments of this application do not limit the number of splitters included in the ODN, nor the number of output ports of each splitter.

[0069] Specifically, refer to Figure 2 As shown, in the downlink direction: OLT 201 transmits optical signals to ODN 202, where ODN 202 transmits optical signals from different output terminals to different ONUs (including ONU 203-1 to ONU 203-5, such as ONU 203-2). ONU 203-2 receives the optical signals and processes them to obtain data, which is then transmitted to the connected terminal.

[0070] In the uplink direction: ONU 203-2 can also generate optical signals that need to be sent to OLT 201, and then transmit the optical signals to OLT 201 through ODN 202. It is easy to understand that in the uplink direction, the optical signals sent by any ONU will only be transmitted to the OLT and will not be transmitted to other ONUs.

[0071] Typically, to avoid data conflicts and improve network efficiency, PON networks employ time division multiplexing (TDM) technology in the uplink direction, and manage the transmission process of each ONU through time division multiple access (TDMA) access.

[0072] It is easy to understand that, as a fiber optic transmission system, passive fiber optic networks typically use optical fiber (or other possible optical transmission media) as the connection medium to achieve signal transmission. For example, refer to... Figure 2 In the network architecture shown, OLT201, ODN 202 and multiple ONUs are all connected by optical fibers. Optical signals can be transmitted in either the downlink or uplink direction in these optical fibers, that is, the PON network is a single-fiber bidirectional system.

[0073] As a passive optical network (also known as an all-optical local area network, PON network enables more flexible network architecture, easier deployment, and easier operation and maintenance management.

[0074] However, when transmitting in the downlink direction, the interface bandwidth of a PON network is shared. Therefore, the higher the splitting ratio (i.e., the number of devices requiring splitting, such as ONUs or ONTs), the lower the average bandwidth for the user's actual terminal. Thus, the above network architecture struggles to meet the service transmission requirements of certain scenarios. For example, when high-concurrency services (multiple services requiring high bandwidth to be transmitted simultaneously) occur, the POL network's capacity is limited, making service transmission difficult. Furthermore, the above network architecture struggles to meet the service transmission requirements as PON networks evolve from GPON to 10GPON, and even to 50GPON. Therefore, to meet service transmission demands, adaptive adjustments to the corresponding devices in this network architecture are necessary, which increases network deployment costs.

[0075] Based on the above issues, coarse wavelength division multiplexing (CWDM) technology can also be used to design and deploy the network architecture.

[0076] For example, refer to Figure 3 As shown in the diagram, an embodiment of this application provides a schematic diagram of a network architecture, illustrating a network architecture employing CWDM technology (also known as a CWDM network). Combined with... Figure 3 As shown, this network architecture also includes: core layer devices (refer to...) Figure 3 The core switch 301), aggregation layer devices, and multiple access layer devices (see reference) Figure 3 Access switches 303-1 to 303-4 are included. Each access layer device can be connected to multiple terminals. For example, access switch 303-2 is connected to terminals 304-1 to 304-4, and access switch 303-3 is connected to terminals 304-5 to 304-8.

[0077] Reference Figure 3 As shown, optionally, the convergence layer device includes wavelength division multiplexing / demultiplexer 302-1 and wavelength division multiplexing / demultiplexer 302-2.

[0078] The core switch 301 has multiple colored optical modules on its ports, each capable of outputting optical carriers of multiple wavelengths. These colored optical modules are also used to connect to wavelength division multiplexing / demultiplexing units in the aggregation layer equipment. It's easy to understand that any access switch also has colored optical modules for signal transmission and reception during communication. Generally speaking, light of multiple wavelengths transmitted within a single optical fiber is called colored light.

[0079] Specifically, multiple colored optical modules on the core layer device (i.e., core switch 301) are connected to the branch ends of wavelength division multiplexing / demultiplexing unit 302-1 in the aggregation layer device. The common end of wavelength division multiplexing / demultiplexing unit 302-1 in the aggregation layer device is connected to the common end of wavelength division multiplexing / demultiplexing unit 302-2 in the aggregation layer device. The branch ends of wavelength division multiplexing / demultiplexing unit 302-2 in the aggregation layer device are connected to multiple access layer devices (i.e., access switches 303-1 to 303-4).

[0080] In one possible implementation, the core layer devices can be implemented using a core switch. For example, access layer devices include access switches and terminal devices connected to the access switches. For example, the terminal devices can be various terminals or access points (APs). It is easy to understand that this is only an example of... Figure 3 The network architecture shown is an example and should not be used to limit the embodiments of this application.

[0081] Specifically, refer to Figure 3 As shown, in the downlink direction: the core switch 301 can carry the service data to be transmitted on the optical carrier output by the colored optical module and transmit it to the aggregation layer device. The wavelength division multiplexer / demultiplexer 302-1 in the aggregation layer device can combine the optical signal carrying the service data into a single optical fiber for transmission to the wavelength division multiplexer / demultiplexer 302-2. The wavelength division multiplexer / demultiplexer 302-2 can transparently aggregate the received optical signals, that is, split the multiple optical signals transmitted in a single optical fiber and transmit them separately to access switches 303-1 to 303-4. Each access switch receives the optical signal through its configured colored optical module. Similarly, the transmission process in the uplink direction of this network architecture can refer to the above process, and will not be repeated here.

[0082] Typically, when light of the same wavelength propagates within a single optical fiber, interference occurs, leading to transmission errors. However, the CWDM network described above can transmit signals using light of different wavelengths, effectively avoiding transmission errors. However, due to the high cost of colored optical modules, this solution significantly increases network deployment costs. Furthermore, the aggregation layer equipment in this network architecture can only achieve a limited range (typically 18 channels) of passive aggregation, which is insufficient to meet user needs. In addition, this network architecture relies on colored optical modules and wavelength division multiplexing / demultiplexing units (WDMs), resulting in poor network compatibility. Moreover, as network architectures evolve towards dense wavelength division multiplexing (DWDM), the costs of colored optical modules and WDM / demultiplexing modules increase dramatically, making this network architecture difficult to deploy.

[0083] Based on the above problems, exemplarily, referring to Figure 4 As shown, an embodiment of this application provides a schematic diagram of a core layer device. For ease of explanation, in the following embodiments of this application, this core layer device is designated as core layer device 40, and this should not be construed as limiting the embodiments of this application. (In conjunction with...) Figure 4 As shown, the core layer device 40 includes: at least one optoelectronic component (refer to...) Figure 4 (Photoelectric component 401 in the middle). The core layer device 40 is connected to the access layer device (see reference 401) via the photoelectric component 401. Figure 4 Access layer device 402 in the middle.

[0084] Typically, a communication network includes multiple access layer devices, for example, Figure 4 The access layer device 402 includes access layer devices 402-1 to 402-4. It is easy to understand that this is only referred to as... Figure 4 The architecture shown is illustrative and should not be construed as limiting the embodiments of this application. For example, the optoelectronic component 401 can also be coupled with a light source (see reference...). Figure 4 The light source 403 in the middle is connected.

[0085] Specifically, refer to Figure 4 As shown, in the downward direction:

[0086] The optoelectronic component 401 can acquire multiple electrical signals (i.e., first electrical signals) to be transmitted from the core layer device 40, and receive multiple wavelength optical carriers output by the light source 403. The optoelectronic component 401 can modulate the multiple first electrical signals onto the multiple wavelength optical carriers respectively, generating multiple optical carrier signals (i.e., first optical carrier signals). Each wavelength of the optical carrier corresponds to one first electrical signal modulated onto it.

[0087] In the upward direction:

[0088] The optoelectronic component 401 receives multiple wavelength optical carrier signals (i.e., second optical carrier signals) transmitted by multiple access layer devices (including access layer devices 402-1 to 402-4), wherein the multiple second optical carrier signals have different wavelengths. The optoelectronic component 401 is capable of acquiring multiple electrical signals (i.e., second electrical signals) from the multiple second optical carrier signals respectively.

[0089] Optionally, the light source 403 includes any of the following: a distributed Bragg grating array laser, a mode-locked laser, an optical frequency comb, or a Kerr comb. Of course, in other examples, the above-mentioned light source can also be implemented using a multi-wavelength light source. For example, the above-mentioned light source can be implemented using a multi-wavelength light source capable of outputting a series of optical carriers with equal wavelength intervals. As another example, the above-mentioned light source can be implemented using a multi-wavelength light source capable of outputting a series of optical carriers with unequal wavelength intervals. Thus, through the multi-wavelength characteristics of the multi-wavelength light source, the above architecture can have higher integration and more wavelength channels, and each wavelength optical carrier can be used to carry different high-speed information. Optionally, in practical applications, considering the balance between performance and cost, the optical carrier output by the multi-wavelength light source is a single beam of light. Thus, during the transmission of this single beam of light to the optoelectronic component, only single-path coupling is required, greatly reducing optical path loss and hardware engineering difficulty.

[0090] Generally, the multiple optical carriers with different wavelengths output by the light source 403 have a certain wavelength spacing range, for example, around 200 gigahertz (GHz). In some examples, the wavelength spacing range can be from 150 GHz to 250 GHz, where the wavelength spacing can take other possible values ​​such as 150 GHz, 200 GHz, 250 GHz, or even 198 GHz. Of course, the wavelength range shown here is only an example and should not be construed as limiting the embodiments of this application.

[0091] Therefore, through the above solution, core layer devices can achieve passive connection with access layer devices through optoelectronic components. There is no need to configure additional power supply, temperature regulation and other equipment required for active devices in the network, thereby effectively reducing deployment costs. At the same time, it can make the network deployment scheme more flexible, more compatible and easier to maintain.

[0092] Furthermore, the embodiments of this application do not limit the number of optical carriers of multiple wavelengths received by the optoelectronic component from the light source, nor do they limit the number of second optical carrier signals of different wavelengths received by the optoelectronic component from the access layer device. Thus, the aforementioned core layer device can be applied to different types of communication networks and achieve passive connection with the access layer device, exhibiting high compatibility.

[0093] In one possible implementation, the core layer device 40 described above can be a core switch. It is easy to understand that the core layer device described above also includes other communication devices or communication apparatuses capable of performing similar functions. This application does not limit the device type or form of the core layer device provided in the above embodiments.

[0094] Optionally, the optoelectronic component 401 can be implemented by multiple integrated functional modules. For example, the optoelectronic component can be implemented by... Figure 5 The transmitting and receiving modules shown are implemented as described. It is easy to understand that the above-mentioned optoelectronic components can also be implemented in other possible ways, and the embodiments of this application do not limit the module form or number of optoelectronic components in the core layer device.

[0095] based on Figure 4 The architecture shown is exemplary, referencing Figure 5 As shown, an embodiment of this application provides a schematic diagram of an optoelectronic component. (In conjunction with...) Figure 5 As shown, the optoelectronic component 401 includes: a transmitting module (see reference) Figure 5 The transmitting module 401-1 and the receiving module (see reference) Figure 5 (Receiver module 401-2 in the middle).

[0096] In one possible implementation, refer to Figure 5 As shown, the transmitting module 401-1 and the receiving module 401-2 are two modules connected in contact. Optionally, the access layer device 402 includes access layer devices 402-1 to 402-4. It is easy to understand that this is only used as an example. Figure 5 The architecture shown is an example and should not be construed as limiting the embodiments of this application. For instance, the transmitting and receiving modules in the optoelectronic components can also be deployed using other methods, and the embodiments of this application do not limit this.

[0097] Specifically, in combination Figure 5 As shown, structurally: the transmitting module 401-1 includes an input terminal, an output terminal, and a predetermined number of electrical interfaces (see reference). Figure 5 The receiving module 401-2 includes multiple electrical interfaces (A); wherein, the input end of the transmitting module 401-1 is used to connect to the light source 403, and the output end of the transmitting module 401-1 is used to connect to the access layer device 402 (including access layer device 402-1 to access layer device 402-4) via the first optical fiber. The receiving module 401-2 includes an input end and a predetermined number of electrical interfaces (refer to...). Figure 5 Multiple electrical interfaces B in the receiver module 401-2; wherein the input end of the receiver module 401-2 is used to connect to the access layer device 402 (including access layer device 402-1 to access layer device 402-4) via the second optical fiber.

[0098] In one possible implementation, the optoelectronic component also includes an optical amplifier (see reference). Figure 5 The optical amplifier 404 is used to connect the input terminal of the optical amplifier to the light source 403, and the output terminal of the optical amplifier is connected to the input terminal of the transmitting module.

[0099] Combination Figure 4 The architecture shown is detailed in the reference section. Figure 5As shown, in the downlink direction, the optoelectronic component 401 acquires the first electrical signal to be transmitted from the core layer device 40 via the electrical interface A of the transmitting module 401-1, and receives an optical carrier wave including multiple wavelengths output by the light source 403. The transmitting module 401-1 modulates the first electrical signal onto an optical carrier wave of one wavelength to generate a first optical carrier signal. The transmitting module 401-1 transmits the first optical carrier signal to the access layer device 402 (including access layer devices 402-1 to 402-4) via the first optical fiber.

[0100] In the uplink direction, the optoelectronic component 401 acquires a second electrical signal based on the second optical carrier signal received from the access layer device 402 (including any one of access layer devices 402-1 to 402-4) via the receiving module 401-2. The core layer device 40 acquires the second electrical signal through the electrical interface B of the receiving module 401-2.

[0101] It is easy to understand that the side of the aforementioned transmitting module 401-1 equipped with multiple electrical interfaces A, also known as the transmit (TX) end, is used by the corresponding device in the core layer equipment (e.g., a service board) to send the electrical signal to be transmitted to the optoelectronic component. Similarly, the side of the aforementioned receiving module 401-2 equipped with multiple electrical interfaces B, also known as the receive (RX) end, is used by the corresponding device in the core layer equipment to obtain the electrical signals transmitted by the access layer equipment.

[0102] Therefore, through the optoelectronic components including the receiving module and the transmitting module in the above scheme, the core layer equipment and the access layer equipment can realize signal transmission in the uplink and downlink directions, that is, realize communication.

[0103] Optionally, the transmitting module (i.e., transmitting module 401-1) and receiving module (i.e., receiving module 401-2) in the above-mentioned optoelectronic components can also be implemented using other possible structures. Based on Figure 5 The architecture shown is exemplary, referencing Figure 6 As shown, an embodiment of this application provides a structural schematic diagram of an optoelectronic component. Combined with... Figure 6 As shown, the transmitting module 401-1 includes: a first optical waveguide and multiple micro-ring modulators.

[0104] Reference Figure 6 As shown, structurally: a first optical waveguide is connected between the input and output terminals of the transmitting module 401-1; the input terminal of the first optical waveguide is connected to the input terminal of the transmitting module 401-1; and the output terminal of the first optical waveguide is connected to the output terminal of the transmitting module 401-1. Multiple micro-ring modulators are coupled between the input and output terminals of the first optical waveguide. Each micro-ring modulator has a modulation electrode, which is connected to the electrical interface of the transmitting module 401-1.

[0105] Specifically, based on Figure 5 and Figure 6 The architecture shown, in terms of functionality:

[0106] Transmitting module 401-1 can receive signals from light source 403, including signals of multiple wavelengths (see reference 403), via the first optical waveguide. Figure 6 The transmitting module 401-1, via electrical interface A, can also acquire the first electrical signal to be transmitted from the core layer device through the optical carrier (λ1 to λn) at the first optical waveguide. The transmitting module 401-1 modulates the acquired first electrical signal onto an optical carrier of a single wavelength using a micro-ring modulator, thereby generating the first optical carrier signal.

[0107] Optionally, the micro-ring modulator can modulate the first electrical signal onto an optical carrier of a specific wavelength using modulation electrodes. Further, the transmitting module 401-1 can transmit the generated first optical carrier signal to the access layer device 402 (including any one of access layer devices 402-1 to 402-4) via the first optical fiber.

[0108] Optional, combined Figure 6 As shown, the transmitting module 401-1 also includes multiple driving circuits. These driving circuits are connected between the electrical interface of the transmitting module 401-1 and the modulation electrode. Specifically, the driving circuits can provide voltage to the connected modulation electrode to drive the micro-ring modulator to modulate the first electrical signal acquired by the electrical interface of the transmitting module 401-1 onto an optical carrier of a specific wavelength through the modulation electrode. Of course, in other examples, the driving circuits may also provide current to the modulation electrode of the micro-ring modulator to drive the modulation electrode to modulate the corresponding signal; this embodiment of the application does not limit this approach.

[0109] Optionally, in practical applications, the aforementioned transmitting module can be implemented using a single integrated chip. For example, combined with... Figure 6 As shown, the transmitting module 401-1 includes an integrated electronic integrated circuit (EIC) circuit (also known as an electronic integrated chip) and a photonics integrated circuit (PIC) circuit (also known as a photonic integrated chip) implementation (see reference). Figure 6 (EIC-1 and PIC-1 in the transmitting module 401-1 shown).

[0110] Specifically, in combination Figure 6As shown, the EIC-1 chip mainly includes a drive circuit for (electro-optic) modulation of the first electrical signal. Of course, the EIC-1 chip can also integrate optical digital signal processing (ODSP) functionality at the TX end for signal processing of the acquired first electrical signal. The PIC-1 chip mainly includes a micro-ring bus (i.e., multiple micro-ring modulators), which can perform wavelength selection and electro-optic conversion. The wavelength selection performed by the micro-ring modulator needs to be matched with the light source 403. For example, if the light source 403 is a multi-wavelength light source, then each micro-ring modulator performs wavelength selection (selecting a specific wavelength) on the multiple wavelengths of optical carrier received from the first optical waveguide, which needs to correspond to a specific wavelength output from the multi-wavelength light source. The multiple first electrical signals acquired by the EIC-1 chip will be modulated onto optical carriers of different wavelengths by different micro-ring modulators, and the generated one or more first optical carrier signals will be output through the same optical fiber.

[0111] Therefore, based on the above architecture, the embodiments of this application can achieve multi-channel modulation by using the corresponding structure of the micro-ring bus in the downlink direction, thereby improving the transmission performance of the network.

[0112] Combination Figure 6 As shown, the receiving module 401-2 includes: a second optical waveguide, multiple detection circuits, and multiple micro-ring filters.

[0113] Reference Figure 6 As shown, structurally: the second optical waveguide includes an input end and an output end, with the input end of the second optical waveguide connected to the input end of the receiving module 401-2. Multiple micro-ring filters are coupled between the input end and the output end of the second optical waveguide. A detection circuit is coupled between the micro-ring filters and any electrical interface B of the receiving module 401-2.

[0114] Specifically, based on Figure 5 and Figure 6 The architecture shown, in terms of functionality:

[0115] The micro-ring filter can receive the second optical carrier signal transmitted by access layer device 402 (including any one of access layer devices 402-1 to 402-4) through the second optical waveguide. The detection circuit performs photoelectric conversion on the second optical carrier signal received from the micro-ring filter to obtain a second electrical signal. Note that the wavelength of the second optical carrier signal output by different access layer devices may be different; refer to... Figure 6 λ1 to λn at the second optical waveguide in the middle.

[0116] Optional, combined Figure 6As shown, the receiving module 401-2 also includes an amplifier circuit. This amplifier circuit is connected between the detection circuit and the electrical interface of the second optical waveguide. Specifically, the amplifier circuit amplifies the second electrical signal obtained by the detection circuit based on the second optical carrier signal. Furthermore, the amplified second electrical signal can be output through the electrical interface of the receiving module 401-2.

[0117] Optionally, in practical applications, the aforementioned receiving module can be implemented using a single integrated chip. For example, combined with... Figure 6 As shown, the aforementioned receiver module 401-2 can be implemented by an EIC chip and a PIC chip integrated together (see reference). Figure 6 (EIC-2 and PIC-2 in the receiver module 401-2 shown).

[0118] Specifically, in combination Figure 6 As shown, the EIC-2 chip mainly includes an amplifier circuit for amplifying the second electrical signal, such as a transimpedance amplifier (TIA) circuit. Of course, the EIC-2 chip can also integrate the digital signal processing (ODSP) function at the RX end for signal processing of the acquired second electrical signal. The PIC-2 chip includes a micro-ring bus (i.e., multiple micro-ring filters) and multiple detection circuits, enabling wavelength selection and electro-optical conversion. The micro-ring filters are only used for wavelength selection; the photoelectric conversion is performed by the detection circuits. Similar to the TX end in the transmitting module 401-1, the process of outputting the acquired second electrical signal at the RX end of the receiving module 401-2 is also completed within the same optical fiber (or micro-ring bus). For example, multiple second optical carrier signals transmitted by the access layer device have different wavelengths. Each micro-ring filter performs wavelength selection on the multiple second optical carrier signals received from the access layer device, selecting the second optical carrier signal with a specific wavelength. The detection circuit performs photoelectric conversion on the second optical carrier signal with the specific wavelength to obtain the second electrical signal. The electrical interface in the EIC-2 chip outputs the acquired second electrical signal through the same optical fiber.

[0119] In one possible implementation, the detection circuit in the above embodiments of this application can be implemented using a photodetector (PD).

[0120] Therefore, with the above solution, there is no need to deploy additional wavelength division multiplexing / demultiplexing units (e.g.) in the network. Figure 3 As shown, this can improve integration, reduce complexity, and thus reduce costs.

[0121] Based on the above architecture, as exemplified, refer to Figure 7 As shown, an embodiment of this application provides a schematic diagram of an optoelectronic component. Based on Figure 5 and Figure 6 The architecture shown, combined with Figure 7 As shown, the receiving module 401-2 includes: a second optical waveguide, a demultiplexer ( Figure 7 The demultiplexer 405 and multiple detection circuits are included.

[0122] Specifically, the second optical waveguide includes an input terminal and an output terminal, and the demultiplexer 405 includes one input terminal and multiple output terminals. The input terminal of the demultiplexer 405 is used to connect to the access layer device (i.e., access layer device 402), and the output terminal of the demultiplexer 405 is connected to the input terminal of the second optical waveguide. The detection circuit is coupled to the electrical interface between the second optical waveguide and the receiving module 401-2 (see reference). Figure 7 Between the electrical interfaces B and B in the middle.

[0123] Reference Figure 5 and Figure 6 As shown, combined with Figure 7 As shown, in terms of function:

[0124] The demultiplexer 405 can transmit a second optical carrier signal of one wavelength received from the access layer device 402 to the second optical waveguide according to the wavelength. The detection circuit can perform photoelectric conversion on the second optical carrier signal of one wavelength received from the second optical waveguide to obtain a second electrical signal.

[0125] Based on the above description, the transmitting module of the aforementioned optoelectronic component can modulate multiple first electrical signals (including high-speed digital signals or SERDES signals) onto optical carriers of different wavelengths, generating multiple first optical carrier signals. Furthermore, the optoelectronic component can transmit these multiple first optical carrier signals to the access layer device via a first optical fiber.

[0126] Among them, multi-channel modulation (i.e., multiple channels modulate optical carriers of different wavelengths) adopts the micro-ring bus (i.e., includes multiple micro-ring modulators), which can directly operate each optical carrier of wavelength individually without the need for wave splitting and combining through corresponding devices.

[0127] In addition, the receiving module of the aforementioned optoelectronic component can also detect multiple second optical carrier signals (usually with different wavelengths and carrying different electrical signals to be transmitted by the access layer device) received from the access layer device, acquire multiple second electrical signals, and then transmit them to the corresponding structure of the core layer device (e.g., the main switching chip) through the electrical interface.

[0128] For example, refer to Figure 8 The diagram shown illustrates a communication network. (Combined with...) Figure 8 As shown, the communication network includes: at least one access layer device (refer to...) Figure 8Access switches 802-1 to 802-4, and core layer devices as provided in the embodiments of this application. The core layer devices (refer to...) Figure 8 The core switch 801 in the middle includes at least one optoelectronic component (refer to...) Figure 8 The optoelectronic components 801-1 to 801-n are used in the core switch 801 to connect to the access layer devices through the optoelectronic components.

[0129] In one possible implementation, combining Figure 8 As shown, the communication network includes multiple terminal devices (refer to...). Figure 8 Terminals 804-1 to 804-16 are included; these terminal devices can be implemented using different types of terminals or access points (APs). Optionally, the core layer devices mentioned above can be implemented using a core switch. It is easy to understand that, for ease of explanation, only [the specific example mentioned here] is used. Figure 8 The architecture shown is illustrative and should not be construed as limiting the embodiments of this application. For example, the access layer device described above includes one or more access switches.

[0130] Optional, refer to Figure 8 As shown, the aforementioned communication network also includes: a passive aggregation device (see reference). Figure 8 The passive aggregation device 803 includes a common terminal and multiple branch terminals. The common terminal of the passive aggregation device 803 is used to connect to the optoelectronic components (including optoelectronic components 801-1 to 801-n) in the core layer device (i.e., core switch 801), and the branch terminals of the passive aggregation device 803 are used to connect to the access layer device (including access switches 802-1 to 802-4).

[0131] In one possible implementation, the passive focusing device 803 described above includes any of the following: a multiplexer / demultiplexer or a splitter.

[0132] Specifically, in combination Figure 8 As shown, in the downlink direction: the core switch 801 generates and outputs multiple first optical carrier signals through optoelectronic components (including optoelectronic components 801-1 to 801-n). Through the passive aggregation device 803, the multiple first optical carrier signals are transmitted to access switches 802-1 to 802-4 respectively. Further, each access switch transmits the received first optical carrier signal to different terminals (including terminals 804-1 to 804-16). The process of the communication network transmitting signals in the uplink direction (from terminal to core switch) can be referred to the above process and will not be repeated here.

[0133] Based on the above architecture, the optoelectronic components (including transmitting and receiving modules) in the core layer equipment can transmit optical carrier signals to the passive aggregation equipment via single or dual optical fibers, thus achieving interconnection. Meanwhile, since passive aggregation equipment is typically deployed in the building's or floor's low-voltage electrical room, this solution reduces the number of optical fibers and lowers construction difficulty.

[0134] In one possible implementation, the aforementioned multiplexer / demultiplexer can be implemented using an optical wavelength division multiplexing / demultiplexer. Based on Figure 8 The architecture shown is exemplary, referencing Figure 9 The diagram shows a schematic of a multiplexer / demultiplexer, illustrating a 1:N optical wavelength division multiplexing / demultiplexer. Combined with... Figure 9 As shown, this optical wavelength division multiplexer / demultiplexer includes a common terminal (see reference). Figure 9 One port of the G end in the middle), and multiple branch ends (see Figure 9 (Multiple ports on the F end). Among them, one port on the G end is connected to a fiber optic cable, and any port on the F end is connected to a fiber optic cable.

[0135] In one possible implementation, combining Figure 9 As shown, the ratio of the number of ports on the G end to the number of ports on the F end is 1:N. It's easy to understand that, for ease of explanation, only 1:N is used here. Figure 9 The architecture shown is illustrative and should not be construed as limiting the embodiments of this application. For example, Figure 9 The optical wavelength division multiplexer / demultiplexer shown can also include more branches.

[0136] Specifically, in combination Figure 8 and Figure 9 As shown, in the downward direction:

[0137] The G-end, through a single connected optical fiber, can receive multiple optical signals of different wavelengths (e.g., N different wavelength optical carrier signals). When the multiple optical carrier signals input from the G-end are output from the F-end, they will be split, meaning that optical carrier signals of different wavelengths will be output to different access layer devices (i.e., access switches 802-1 to 802-4) through different ports of the G-end.

[0138] Similarly, combined Figure 8 and Figure 9 As shown, in the upward direction:

[0139] Multiple optical signals of different wavelengths (e.g., N different wavelength optical carrier signals) can be input through different ports of the F end. The N different wavelength optical carrier signals will be combined, that is, multiple optical carrier signals are output from a single optical fiber connected to the G end.

[0140] Based on the above scheme, each branch of the F-end uses only one wavelength when transmitting and receiving signals. Therefore, the access layer device does not need to perform filtering before converting the received optical carrier signal into an electrical signal. This scheme enables the passive aggregation device to split (divide into multiple single-wavelength optical signals) or combine received optical signals of multiple wavelengths according to their wavelengths without filtering, thus reducing losses.

[0141] For example, the aforementioned beam splitter can be implemented using an optical power splitter. See, for instance... Figure 10 The diagram shows a schematic of a beam splitter, illustrating a 1:N optical power splitter. Combined with... Figure 10 As shown, the optical power divider includes a common terminal (see reference). Figure 10 One port of the P end in the diagram), and multiple branch ends (see reference). Figure 10 (Multiple ports on the Q end of the P end). One port on the P end is connected to a fiber optic cable, and any port on the Q end is connected to a fiber optic cable.

[0142] In one possible implementation, combining Figure 10 As shown, the ratio of the number of ports on the P side to the number of ports on the Q side is 1:N. It's easy to understand that, for ease of explanation, only 1:N is used here. Figure 10 The architecture shown is illustrative and should not be construed as limiting the embodiments of this application. For example, Figure 10 The optical power splitter shown can also include more branches.

[0143] Specifically, in combination Figure 8 and Figure 10 As shown, in the downward direction:

[0144] The P-end, connected to a single optical fiber, can receive multiple optical signals of different wavelengths (e.g., N different wavelength optical carrier signals). When these multiple optical carrier signals input from the P-end are output from the Q-end, they will be split, meaning that optical carrier signals of the same wavelength will be output to different access layer devices (i.e., access switches 802-1 to 802-4) through different ports of the G-end. The wavelength type of the optical carrier signal output from any port of the Q-end is consistent with the wavelength type of the multiple different wavelength optical signals received by the P-end.

[0145] Similarly, combined Figure 8 and Figure 9 As shown, in the upward direction:

[0146] Multiple optical signals of different wavelengths (e.g., N different wavelength optical carrier signals) can be input through different ports on the Q end. The N different wavelength optical carrier signals will be combined, that is, multiple optical carrier signals are all output from a single optical fiber connected to the P end.

[0147] Based on the above scheme, since each port at the Q end has multiple wavelengths, the access layer device needs to filter the received optical carrier signal before performing photoelectric conversion to obtain an electrical signal, thereby selecting the optical carrier signal of the corresponding wavelength. Therefore, this scheme enables the passive aggregation device to split (divide into multiple paths of multiple wavelengths) or combine the received optical signals of multiple wavelengths according to power, thus ensuring transmission quality.

[0148] It should be noted that the access layer device described in the above embodiments of this application may include a corresponding colored optical module to ensure that the access layer device can achieve interconnection with the corresponding wavelength channel. Based on Figure 7 and Figure 8 The architecture shown is exemplary, referencing Figure 11 As shown, an embodiment of this application also provides a schematic diagram of a communication network.

[0149] based on Figure 7 and Figure 8 The architecture shown includes one or more color optical modules in the communication network (see reference). Figure 11 (Colored light modules 1 to n in the middle). Among them, combined with Figure 11 As shown, this colored optical module is installed in an access layer device (e.g., an access switch, see reference). Figure 11 The optical ports of access switches 1 to n are used to receive optical signals (i.e., optical carrier signals) of different wavelengths from the core layer devices, and at the same time send optical signals (i.e., optical carrier signals) of different wavelengths to the core layer devices.

[0150] Generally, the type of colored optical module is determined by the number of wavelength channels. In practical applications, it is necessary to match the optical fiber color with the corresponding optoelectronic components for the wavelength.

[0151] In one possible implementation, the aforementioned colored light module can be a currently available, mature colored light module / component, or a tunable optoelectronic component; the embodiments of this application do not limit this choice. The tunable optoelectronic component enables adaptive wavelength matching and manual configuration.

[0152] Specifically, in combination Figure 11 As shown, in the downlink direction: the single optical fiber connected to the common end of the passive aggregation device contains multiple optical signals (i.e., optical carrier signals) of different wavelengths, each carrying a different high-speed signal (i.e., electrical signal). The passive aggregation device enables each wavelength of optical carrier signal to enter a different channel, and finally transmit it through the optical fiber to different colored optical modules, which are then received by the corresponding access switch.

[0153] In the uplink direction: the optical signals (i.e., optical carrier signals) transmitted by each colored optical module have different wavelengths, and each is transmitted to the passive aggregation device via an independent optical fiber. The passive aggregation device can combine multiple optical carrier signals of different wavelengths into one, and then transmit it through a single optical fiber connected to its common end.

[0154] Therefore, by employing the optoelectronic components and core layer devices provided in the embodiments of this application, the above architecture can reduce the number of colored optical modules in the communication network, realize passive convergence of point-to-multipoint communication, and thus achieve point-to-multipoint communication. Simultaneously, since some components in this network architecture can reuse existing devices (e.g., colored optical modules installed in access layer devices),

[0155] Therefore, it can be applied to a variety of scenarios and has higher compatibility.

[0156] In the above embodiments, implementation can be achieved, in whole or in part, through software, hardware, firmware, or any combination thereof. When implemented using software programs, it can be implemented, in whole or in part, in the form of a computer program product. This computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that can be integrated with one or more media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., solid-state disk (SSD)). In embodiments of this application, the computer may include the aforementioned apparatus.

[0157] Although this application has been described herein in conjunction with various embodiments, those skilled in the art, by reviewing the accompanying drawings, disclosure, and appended claims, will understand and implement other variations of the disclosed embodiments in carrying out the claimed application. In the claims, the word "comprising" does not exclude other components or steps, and "a" or "an" does not exclude a plurality. A single processor or other unit can implement several functions listed in the claims. While different dependent claims may recite certain measures, this does not mean that these measures cannot be combined to produce good results.

[0158] Although this application has been described in conjunction with specific features and embodiments, it is obvious that various modifications and combinations can be made thereto without departing from the spirit and scope of this application. Accordingly, this specification and drawings are merely exemplary illustrations of this application as defined by the appended claims, and are considered to cover any and all modifications, variations, combinations, or equivalents within the scope of this application. Clearly, those skilled in the art can make various alterations and modifications to this application without departing from the spirit and scope of this application. Thus, if such modifications and modifications of this application fall within the scope of the claims of this application and their equivalents, this application is also intended to include such modifications and modifications.

Claims

1. A core layer device, characterized in that, The core layer device includes at least one optoelectronic component; the core layer device is used to connect to the access layer device through the optoelectronic component. The optoelectronic component is used to acquire multiple first electrical signals to be transmitted by the core layer device, and to receive multiple wavelengths of optical carriers output by the light source. The optoelectronic component is also used to modulate the plurality of first electrical signals onto the plurality of optical carriers of the plurality of wavelengths to generate a plurality of first optical carrier signals, wherein one first electrical signal is modulated onto each optical carrier of each wavelength; Furthermore, the optoelectronic component is used to receive multiple second optical carrier signals transmitted by multiple access layer devices; The optoelectronic component is also used to acquire multiple second electrical signals from multiple second optical carrier signals, wherein the multiple second optical carrier signals have different wavelengths.

2. The core layer device according to claim 1, characterized in that, The optoelectronic component includes: a transmitting module and a receiving module; The transmitting module includes an input terminal, an output terminal, and a predetermined number of electrical interfaces; wherein, the input terminal of the transmitting module is used to connect to a light source, and the output terminal of the transmitting module is used to connect to the access layer device through a first optical fiber; The transmitting module acquires the first electrical signal to be transmitted from the core layer device through an electrical interface, and receives an optical carrier wave including multiple wavelengths output by the light source; the transmitting module modulates the first electrical signal onto an optical carrier wave of one wavelength to generate a first optical carrier signal; the transmitting module transmits the first optical carrier signal to the access layer device through the first optical fiber; The receiving module includes an input terminal and a predetermined number of electrical interfaces; wherein, the input terminal of the receiving module is used to connect to the access layer device via a second optical fiber; The receiving module receives the second optical carrier signal transmitted by the access layer device through the second optical fiber; the receiving module obtains the second electrical signal based on the second optical carrier signal; The core layer device obtains the second electrical signal through the electrical interface of the receiving module.

3. The core layer device according to claim 2, characterized in that, The transmitting module includes: a first optical waveguide and multiple micro-ring modulators; The first optical waveguide is connected between the input and output terminals of the transmitting module, the input terminal of the first optical waveguide is connected to the input terminal of the transmitting module, and the output terminal of the first optical waveguide is connected to the output terminal of the transmitting module; the plurality of micro-ring modulators are coupled between the input terminal and the output terminal of the first optical waveguide. The micro-ring modulator has a modulation electrode, which is connected to the electrical interface of the transmitting module.

4. The core layer device according to claim 3, characterized in that, The transmitting module also includes multiple driving circuits; The driving circuit is connected between the electrical interface of the transmitting module and the modulation electrode.

5. The core layer device according to claim 2, characterized in that, The receiving module includes: a second optical waveguide, multiple detection circuits, and multiple micro-ring filters; The second optical waveguide includes an input end and an output end, with the input end of the second optical waveguide connected to the input end of the receiving module; the plurality of micro-ring filters are coupled between the input end and the output end of the second optical waveguide; and the detection circuit is coupled between the micro-ring filters and the electrical interface of the receiving module. The micro-ring filter is used to receive the second optical carrier signal transmitted by the access layer device through the second optical waveguide; The detection circuit is used to perform photoelectric conversion on the second optical carrier signal received from the micro-ring filter to obtain the second electrical signal.

6. The core layer device according to claim 2, characterized in that, The receiving module includes: a second optical waveguide, a demultiplexer, and multiple detection circuits; The second optical waveguide includes an input terminal and an output terminal, and the demultiplexer includes an input terminal and multiple output terminals. The input terminal of the demultiplexer is used to connect to the access layer device, and the output terminal of the demultiplexer is connected to the input terminal of the second optical waveguide. The detection circuit is coupled between the electrical interface of the second optical waveguide and the receiving module. The demultiplexer is used to transmit a second optical carrier signal, receiving a wavelength from the access layer device, to the second optical waveguide according to the wavelength. The detection circuit is used to perform photoelectric conversion on a second optical carrier signal of one wavelength to obtain the second electrical signal.

7. The core layer device according to claim 5 or 6, characterized in that, The receiving module also includes an amplifier circuit; The amplification circuit is connected between the detection circuit and the electrical interface of the second optical waveguide.

8. The core layer device according to any one of claims 1-7, characterized in that, The optoelectronic component also includes an optical amplifier. The input terminal of the optical amplifier is used to connect to the light source, and the output terminal of the optical amplifier is connected to the input terminal of the transmitting module.

9. The core layer device according to any one of claims 1-8, characterized in that, The light source includes any of the following: a distributed Bragg grating array laser, a mode-locked laser, an optical frequency comb, or a Kerr comb.

10. The core layer device according to any one of claims 1-9, characterized in that, The core layer device is also used to connect to a passive convergence device; The passive aggregation device includes a common terminal and multiple branch terminals. The common terminal of the passive aggregation device is used to connect to the optoelectronic component, and the branch terminals of the passive aggregation device are used to connect to the access layer device.

11. The core layer device according to claim 10, characterized in that, The passive focusing device includes any of the following: a multiplexer / demultiplexer, or a beam splitter.

12. A photoelectric component, characterized in that, The optoelectronic component includes: a transmitting module and a receiving module; The transmitting module includes an input terminal, an output terminal, and a predetermined number of electrical interfaces; wherein, the input terminal of the transmitting module is used to connect to a light source, and the output terminal of the transmitting module is used to connect to an access layer device via a first optical fiber; The transmitting module acquires the first electrical signal to be transmitted from the core layer device through the electrical interface, and receives the optical carrier including multiple wavelengths output by the light source through the input terminal; the transmitting module modulates the first electrical signal onto the optical carrier of one wavelength to generate a first optical carrier signal; the transmitting module transmits the first optical carrier signal to the access layer device through the first optical fiber; The receiving module includes an input terminal and a predetermined number of electrical interfaces; wherein, the input terminal of the receiving module is used to connect to the access layer device via a second optical fiber; The receiving module receives the second optical carrier signal transmitted by the access layer device through the second optical fiber; the receiving module obtains the second electrical signal based on the second optical carrier signal; The receiving module outputs the acquired second electrical signal through an electrical interface.

13. A communication network, characterized in that, The communication network includes: at least one access layer device, and a core layer device as described in any one of claims 1-11; The core layer device includes at least one optoelectronic component, and the core layer device is used to connect to the access layer device through the optoelectronic component.

14. The communication network according to claim 13, characterized in that, The communication network also includes: a passive aggregation device; The passive aggregation device includes a common terminal and multiple branch terminals. The common terminal of the passive aggregation device is used to connect to the optoelectronic components in the core layer device, and the branch terminals of the passive aggregation device are used to connect to the access layer device.

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