High-transparency aluminum oxide ceramic plate for semiconductor packaging and preparation method of high-transparency aluminum oxide ceramic plate

Abstract

The invention relates to the technical field of ceramic materials, in particular to a high-transparency aluminum oxide ceramic plate for semiconductor packaging and a preparation method of the high-transparency aluminum oxide ceramic plate. The ceramic plate comprises the following components in parts by weight: 90-95 parts of aluminum oxide powder, 1.2-3 parts of a composite modified sintering aid, 3-8 parts of a polyvinyl butyral-acrylic resin composite binder, 1-5 parts of a plasticizer and 0.5-1 part of a dispersant. According to the high-transparency aluminum oxide ceramic plate for semiconductor packaging, the light transmittance, the density, the mechanical strength and the process stability of aluminum oxide ceramic are remarkably improved through a composite modified sintering aid and organic-inorganic hybrid composite binder system in combination with a refined slurry treatment and sintering process, and the high-transparency aluminum oxide ceramic plate is suitable for the field of semiconductor packaging.

Description

Technical Field

[0001] This invention relates to the field of ceramic materials technology, specifically to a high-transparency alumina ceramic plate for semiconductor packaging and its preparation method. Background Technology

[0002] With the rapid development of semiconductor technology, packaging technology has placed higher demands on the performance of key materials. High-transparency alumina ceramics, due to their excellent electrical insulation, high thermal conductivity, good mechanical strength, and optical transmittance, have shown great application potential in LED packaging, laser windows, and high-voltage electrical modules. The key to achieving high transmittance lies in obtaining a microstructure with high purity, high density, and clean grain boundaries. The core challenge is how to simultaneously optimize the sintering process and the slurry forming process.

[0003] In existing technologies, a small amount of rare earth or alkaline earth metal oxides are typically added to alumina powder as sintering aids to form a liquid phase at high temperatures, promoting material transport and densification, and inhibiting abnormal grain growth. However, traditional physical mixing methods have several drawbacks. First, it is difficult to achieve highly uniform dispersion of nanoscale aid powders in the alumina matrix. Agglomeration can easily lead to localized grain boundary phase segregation or impurity enrichment regions, which become light scattering centers and significantly reduce the linear transmittance of the ceramic. Second, poor bonding between the aid and the main phase interface may weaken the overall mechanical properties of the material.

[0004] In terms of forming processes, tape casting is the mainstream method for preparing thin-layer alumina ceramic substrates, and its core lies in the organic binder and plasticizer system. While the widely used polyvinyl butyral (PVB) / phthalate system provides basic film-forming properties, it faces a series of problems when casting alumina slurries with high solids content and fine particle size, including poor dispersion stability, high slurry viscosity, cracking and deformation of the green body due to uncoordinated softening or decomposition of the binder during the binder removal process, and residual carbon affecting the final ceramic purity and transparency. In particular, the lack of effective interfacial compatibility and interaction between conventional binder systems and the aforementioned inorganic sintering aids further restricts the preparation of highly homogeneous, defect-free green bodies.

[0005] Therefore, there is an urgent need to develop an alumina ceramic plate that can improve density, light transmittance, mechanical strength, and preparation stability. Summary of the Invention

[0006] To address the problems of existing technologies, this invention provides a high-transparency alumina ceramic substrate for semiconductor packaging and its preparation method. The high-transparency alumina ceramic substrate for semiconductor packaging of this invention significantly improves the light transmittance, density, mechanical strength and process stability of alumina ceramics by combining a composite modified sintering aid and an organic-inorganic hybrid composite binder system with refined slurry treatment and sintering process, making it suitable for the semiconductor packaging field.

[0007] The technical solution of the present invention to solve the above problems is as follows: A high-transparency alumina ceramic plate for semiconductor packaging comprises, by weight: 90-95 parts alumina powder, 1.2-3 parts composite modified sintering aid, 3-8 parts polyvinyl butyral-acrylic resin composite binder, 1-5 parts plasticizer, and 0.5-1 parts dispersant. The preparation method of the composite modified sintering aid is as follows: Step a: Add yttrium nitrate hexahydrate, lanthanum(III) nitrate hexahydrate, and magnesium nitrate hexahydrate to deionized water and stir at 300-400 rpm until dissolved to obtain a metal salt solution; dissolve ammonium bicarbonate in deionized water to obtain an ammonium bicarbonate aqueous solution, then add ammonia water and stir to mix evenly to obtain a precipitant; at 13-18℃ and 400-500 rpm, add the precipitant dropwise to the metal salt solution at a rate of 1.8-2.2 mL / min, continue stirring for 20-40 min after the addition is complete, let stand for 1.8-2.2 h, purify and dry, then keep warm at 270-290℃ for 0.8-1.2 h and at 850-950℃ for 1.5-2.5 h to obtain composite nanopowder; Step b: Add the composite nanopowder to ethanol to obtain a dispersion. Dissolve aluminum isopropoxide and acetylacetone in ethanol to obtain an aluminum precursor solution. Under a nitrogen atmosphere at 50-60℃, add the aluminum precursor solution dropwise to the dispersion at a rate of 0.9-1.1 mL / min. After the addition is complete, reflux at 75-85℃ for 9-11 hours. Then purify to obtain the intermediate. Step c: Calcine the intermediate obtained in step b at 445-455℃ for 2-2.5h, cool it in the furnace, then add the cooled intermediate to the mixed solvent, mix well, then add the silane coupling agent KH-570, reflux at 75-85℃ for 13-15h, then add acrylic acid and azobisisobutyronitrile, continue the reaction for 5.5-6.5h, and purify to obtain the final product.

[0008] Preferably, in step a, the mass-to-volume ratio of yttrium nitrate hexahydrate, lanthanum(III) nitrate hexahydrate, magnesium nitrate hexahydrate, and deionized water in the metal salt solution is 140-160g: 75-85g: 38-42g: 1.6-2L; the mass-to-volume ratio of ammonium bicarbonate, ammonia, and deionized water in the precipitant is 105-112g: 430-470mL: 400-600mL; the concentration of ammonia is 25-28%; and the mass ratio of yttrium nitrate hexahydrate to ammonium bicarbonate is 14-16: 10.5-11.

[0009] Preferably, in step b, the mass-to-volume ratio of the composite nanopowder obtained in step a, aluminum isopropoxide, and acetylacetone is 100g:47-51g:10.5-11.5mL; in the dispersion, the mass-to-volume ratio of the composite nanopowder to ethanol is 100g:0.95-1.05L; and in the aluminum precursor solution, the volume ratio of acetylacetone to ethanol is 1:18-22.

[0010] Preferably, in step c, the mass ratio of the intermediate obtained in step b, the silane coupling agent KH-570, acrylic acid, and azobisisobutyronitrile is 100:4.6-4.9:0.85-0.95:0.055-0.065, the mass-volume ratio of the intermediate obtained in step b to the mixed solvent is 100g:820-870mL, and the mixed solvent is a mixture of toluene and ethanol with a mass ratio of 2.8-3.2:1.

[0011] Preferably, the preparation method of the polyvinyl butyral-acrylic resin composite adhesive is as follows: Step 1: Add polyvinyl butyral resin to a mixed solvent and stir at 45-50℃ and 300-400 rpm for 2.5-3.5 hours. Then, raise the temperature to 60-65℃ and add hexamethylene diisocyanate crosslinking agent dropwise at a rate of 2.0-3.0 mL / min. Simultaneously, add dibutyltin dilaurate catalyst and react for 2.0-3.0 hours. Then, cool the temperature to 25-30℃ to obtain a pre-crosslinked PVB solution. Step 2: Add toluene and methyl ethyl ketone to the reaction vessel and stir to obtain a mixed solvent. Add the initiator azobisisobutyronitrile to the mixed solvent for the first time and stir to dissolve. Premix methyl methacrylate, butyl acrylate, and acrylic acid to obtain a monomer mixture. Then, add the monomer mixture dropwise to the reactants in the reaction vessel at a rate of 5-8 mL / min and maintain the temperature at 70-75℃. After the addition is complete, continue the reaction for 3.0-4.0 h. Add the initiator azobisisobutyronitrile for the second time and continue the reaction for 2-3 h. Cool down to below 40℃ to obtain an acrylate copolymer solution. Step 3: Dissolve the hyperbranched polyester in a portion of tetrahydrofuran, add maleic anhydride, and react at 200-300 rpm and 60-65℃ for 2.0-2.5 h to obtain material 1. Mix the pre-crosslinked PVB solution, acrylate copolymer solution, and a portion of tetrahydrofuran at 50-55℃ and 300-400 rpm for 30-40 min to obtain material 2. Then, add material 1 dropwise to material 2 at a rate of 3.0-4.0 mL / min, while simultaneously adding antioxidant 1010 and the remaining tetrahydrofuran. Keep the temperature constant and increase the stirring speed to 800-1000 rpm, mixing for 1.5-2.0 h. Then, evaporate the solvent and perform vacuum degassing to obtain the final product.

[0012] Preferably, in step 1, the mass ratio of polyvinyl butyral, hexamethylene diisocyanate, dibutyltin dilaurate, and the mixed solvent is 100:3.0-5.0:0.10-0.25:500-650, and the mixed solvent is a mixture of butanone and isopropanol, with a mass ratio of butanone to isopropanol of 1.5-3:1.

[0013] Preferably, in step 2, the mass ratio of methyl methacrylate, butyl acrylate, acrylic acid, mixed solvent, the first addition of azobisisobutyronitrile, and the second addition of azobisisobutyronitrile is 50-60:30-40:8-12:300-400:0.5-1.0:0.1-0.2, and the mass ratio of toluene and butanone in the mixed solvent is 2-2.5:1-1.5.

[0014] Preferably, in step 3, the total mass ratio of the pre-crosslinked PVB solution, acrylate copolymer solution, hyperbranched polyester, maleic anhydride, antioxidant 1010, and tetrahydrofuran is 480-520: 300-350: 5.0-8.0: 0.3-0.5: 0.1-0.3, 150-200. In material 1, the amount of tetrahydrofuran is 50-60% of the total amount of tetrahydrofuran, and in material 2, the amount of tetrahydrofuran is 20-25% of the total amount of tetrahydrofuran.

[0015] Preferably, the plasticizer is polyethylene glycol, and the dispersant is one or both of ammonium polyacrylate and ammonium citrate.

[0016] The preparation method of the above-mentioned high-transparency alumina ceramic substrate for semiconductor packaging is as follows: First, alumina powder, composite modified sintering aid, polyvinyl butyral-acrylic resin composite binder, plasticizer, and dispersant are weighed according to the specified ratio and added to a solvent. The mixture is stirred and mixed to obtain a slurry. The solvent is one or more of methyl ethyl ketone, isopropanol, and toluene. The solid content of the slurry is 50-55%. Then, the slurry is ball-milled at a speed of 200-300 rpm for 24-48 hours. Finally, the ball-milled slurry is subjected to a vacuum of ≤-0.095 MPa. The slurry is then defoamed for 30-90 minutes. It is then cast onto a release film using a casting machine. The release film with the wet film is dried for 8-16 hours at 40-60℃ and 30-50% humidity to obtain alumina ceramic green body. The green body is then placed in a debinding furnace, heated to 400-600℃, and held for 2-6 hours for debinding. The temperature is then raised to 1750-1850℃ and sintered at high temperature for 3-6 hours. After cooling and polishing, the final product is obtained.

[0017] Preferably, the solvent is a mixture of butanone, isopropanol, and toluene, with a mass ratio of 40-50:22-28:28-35.

[0018] The present invention has the following beneficial effects: The high-transparency alumina ceramic substrate for semiconductor packaging of the present invention significantly improves the light transmittance, density, mechanical strength, and process stability of alumina ceramics through a composite modified sintering aid and an organic-inorganic hybrid composite binder system, combined with refined slurry treatment and sintering processes, making it suitable for the semiconductor packaging field. Simultaneously, during its preparation, due to the synergistic effect of the composite modified sintering aid and the composite binder, the green blank removal process is stable and free from bubbling and cracking, significantly improving the yield and demonstrating feasibility for large-scale production. Specifically, in step a, the composite modified sintering aid undergoes co-precipitation of ammonium bicarbonate and ammonia at low temperature, effectively avoiding the thermal decomposition of ammonium bicarbonate and ensuring the purity of Y. 3+ La 3+ Mg 2+ The simultaneous and uniform precipitation of NH4 forms a homogeneous hydroxide / basic carbonate precursor. Subsequently, holding at 270–290℃ promotes the precipitation of NH4. + CO3 2-Complete decomposition and preliminary crystallization are followed by calcination at 850–950℃ to generate well-crystallized Y / La / Mg composite oxides. This process suppresses elemental segregation, allowing the additives to be uniformly distributed at the grain boundaries during subsequent co-sintering with alumina, effectively inhibiting abnormal grain growth, promoting densification, reducing grain boundary width and impurity scattering centers, thereby improving light transmittance. In step b, utilizing the hydrolysis characteristics of aluminum isopropoxide under acidic conditions, it is dropwise added to an ethanol dispersion containing composite nanoparticles under nitrogen atmosphere protection, forming a continuous and uniform coating layer on the surface of Y / La / Mg composite particles through in-situ hydrolysis-condensation reaction. This coating layer not only enhances the bonding force between inorganic particles, but more importantly, it acts as a "skeleton" to guide the directional growth of alumina grains in the early stages of sintering, playing a dual role in liquid-phase sintering fluxing and grain boundary purification, and also reducing light scattering. In step c, after calcination to remove organic matter, the intermediate surface is rich in hydroxyl groups, which can undergo hydrolysis and condensation reactions with the methoxysilane of KH-570 to form stable covalent bonds. The double bond at the other end of KH-570 then undergoes free radical copolymerization with acrylic acid and initiator to construct an organic long-chain network grafted onto the surface of inorganic particles. This "core-shell-brush" structure significantly improves the dispersion stability and interfacial compatibility of the composite additive in organic slurry, preventing its agglomeration during casting and ensuring low viscosity and high fluidity of the slurry with high solids content. This sintering aid not only possesses the grain boundary engineering function of traditional additives, but also solves the technical problem of easy agglomeration of nanoparticles in organic media through surface organic modification.

[0019] In step 1 of the composite adhesive of this invention, a stepwise polymerization reaction is carried out between the hydroxyl groups at the ends of the PVB molecular chains and the isocyanate groups of hexamethylene diisocyanate to generate a urethane crosslinking network. This reaction is catalyzed by dibutyltin dilaurate to form a crosslinking network structure, enhancing the thermal stability and modulus of the adhesive and preventing film deformation or cracking due to softening flow in the initial stage of adhesive release. In step 2, a methyl methacrylate-butyl acrylate-acrylic acid terpolymer is synthesized through free radical polymerization. Methyl methacrylate provides a rigid framework, butyl acrylate imparts flexibility and extensibility, and acrylic acid introduces carboxyl groups to enhance polarity and adhesion. Azobisisobutyronitrile (AIBN) is used in a phased initiation process to ensure uniform molecular weight distribution. The resulting copolymer has an adjustable glass transition temperature and forms a complementary system with PVB, effectively alleviating sintering shrinkage stress. In step 3, hyperbranched polyester undergoes esterification / anhydride ring-opening reaction with maleic anhydride, introducing some polymerizable double bonds. This product is then mixed with PVB and acrylate copolymer under high-speed shear. On the one hand, the compatibility between the two phases is improved through similar-like dissolution and hydrogen bonding, inhibiting macroscopic phase separation. On the other hand, the maleic anhydride derivative can serve as a secondary crosslinking point, forming an interpenetrating network during subsequent solvent evaporation or mild heat treatment, significantly improving the green body strength and crack resistance. This composite binder system has high cohesive strength, excellent flexibility, good interfacial bonding force, and controllable binder removal, providing a stable "organic framework" for tape casting, ensuring the integrity of the green body and the final optical quality of the ceramic.

[0020] The composite sintering aid of this invention, after surface modification with KH-570-acrylic acid, exhibits hydrogen bonding and van der Waals interactions between its outer organic segments and the polar groups in the PVB-acrylic binder, forming a "quasi-homogeneous" dispersion system. This significantly reduces slurry viscosity, substantially delays sedimentation, and ensures uniform film thickness and a smooth surface. During sintering, the organic binder gradually decomposes, generating gas and shrinkage stress. The pre-embedded Y / La / Mg composite oxide at the grain boundaries promotes alumina densification, matches organic removal, and reduces microcrack formation. Simultaneously, the flexible acrylic segments and hyperbranched polyester elastic nodes absorb strain, while the PVB micro-crosslinked framework provides initial strength; both work together to prevent "bonding cracking." Furthermore, the surface-organized sintering aid transforms into a grain boundary phase after sintering. Its chemical composition and structure become more consistent due to the influence of the previous organic coating layer, resulting in narrow grain boundaries, fewer impurities, and significantly reduced light scattering loss. The reduction in residual carbon in the binder further enhances the purity and transparency of the ceramic. This inorganic-organic integration breaks the limitation of the independent relationship between powder and binder in traditional processes, and achieves performance optimization throughout the entire process from slurry to sintering. Attached Figure Description

[0021] Figure 1 The graph shows the linear transmittance test results for Examples 1-3 and Comparative Examples 1-3. Figure 2 The figures show the fracture toughness test results of Examples 1-3 and Comparative Examples 1-3. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0023] All of the following raw materials are commercially available.

[0024] Alumina powder, density 3.9-4.0 g / cm³ 3 Gongyi Fuquan Refractory Materials Co., Ltd.; Polyethylene glycol, molecular weight 400, active ingredient content 99%, brand: Saudi Arabia; Jinan Xinke Chemical Co., Ltd.; Polyvinyl butyral resin (PVB), white powder, density 1.08 g / cm³. 3 Mitsui Chemicals (Shandong) Co., Ltd.; Hyperbranched polyester, using terminal hydroxyl hyperbranched polyester, with an effective ingredient content of 95%, Guangdong Fangxin Biotechnology Co., Ltd.; Butanone, i.e., methyl ethyl ketone.

[0025] Example 1 A high-transparency alumina ceramic substrate for semiconductor packaging comprises, by weight: 92 parts alumina powder, 2 parts composite modified sintering aid, 5 parts polyvinyl butyral-acrylic resin composite binder, 3 parts plasticizer, and 0.6 parts dispersant. The plasticizer is polyethylene glycol, and the dispersant is ammonium polyacrylate and ammonium citrate in a mass ratio of 2.5:1.

[0026] The preparation method of the composite modified sintering aid is as follows: Step a: Add yttrium nitrate hexahydrate, lanthanum(III) nitrate hexahydrate, and magnesium nitrate hexahydrate to deionized water and stir at 350 rpm until dissolved to obtain a metal salt solution; dissolve ammonium bicarbonate in deionized water to obtain an ammonium bicarbonate aqueous solution, then add ammonia water and stir until well mixed to obtain a precipitant; at 15℃ and 450 rpm, add the precipitant dropwise to the metal salt solution at a rate of 2 mL / min. After the addition is complete, continue stirring for 30 min, let stand for 2 h, then centrifuge at 6000 rpm for 15 min, discard the supernatant, then wash three times with deionized water and once with ethanol, dry at 80℃ for 12 h, and crush through a 100-mesh sieve. The mixture is sieved, then kept at 280℃ for 1 hour, then at 900℃ for 2 hours, cooled to ≤60℃, and then dispersed by a nitrogen gas flow to obtain composite nanoparticles. In the metal salt solution, the mass-to-volume ratio of yttrium nitrate hexahydrate (Y(NO3)3·6H2O), lanthanum(III) nitrate hexahydrate (La(NO3)3·6H2O), magnesium nitrate hexahydrate, and deionized water is 150g:80g:40g:1.8L. In the precipitant, the mass-to-volume ratio of ammonium bicarbonate to ammonia and deionized water is 110g:450mL:500mL, the ammonia concentration is 28%, and the mass ratio of yttrium nitrate hexahydrate to ammonium bicarbonate is 15:10.8. Step b: The composite nanoparticles are added to ethanol and ultrasonically dispersed at 280W for 42 min to obtain a dispersion. Aluminum isopropoxide and acetylacetone are dissolved in ethanol to obtain an aluminum precursor solution. Under a nitrogen atmosphere at 55℃, the aluminum precursor solution is added dropwise to the dispersion at 1.0 mL / min. After the addition is complete, the temperature is raised to 80℃ and refluxed for 10 h. Then, the mixture is centrifuged at 5500 rpm for 16 min, washed three times with ethanol, and vacuum dried at 80℃ for 11 h to obtain an intermediate. The mass-to-volume ratio of the composite nanoparticles, aluminum isopropoxide, and acetylacetone obtained in step a is 100 g: 50 g: 11 mL. The mass-to-volume ratio of the composite nanoparticles to ethanol in the dispersion is 100 g: 1 L. The volume ratio of acetylacetone to ethanol in the aluminum precursor solution is 1:20. Step c: Calcine the intermediate obtained in step b at 450℃ for 2.2 h, cool it in the furnace, then add the cooled intermediate to the mixed solvent, mix well, add silane coupling agent KH-570, reflux at 80℃ for 14 h, then add acrylic acid and azobisisobutyronitrile, continue the reaction for 6 h, centrifuge at 5000 rpm for 15 min, wash twice with toluene, vacuum dry at 60℃ for 8 h, and pass through a 500-mesh sieve to obtain the final product; wherein, the mass ratio of the intermediate obtained in step b, silane coupling agent KH-570, acrylic acid, and azobisisobutyronitrile is 100:4.8:0.9:0.06, the mass-volume ratio of the intermediate obtained in step b to the mixed solvent is 100 g:850 mL, and the mixed solvent is a mixture of toluene and ethanol in a mass ratio of 3:1.

[0027] The preparation method of the polyvinyl butyral-acrylic resin composite adhesive is as follows: Step 1: Polyvinyl butyral resin is added to a mixed solvent and stirred at 48°C and 350 rpm for 3 hours until the solution is completely transparent. Then, the temperature is raised to 62°C, and hexamethylene diisocyanate crosslinking agent is added dropwise at a rate of 2.5 mL / min. Simultaneously, dibutyltin dilaurate catalyst is added, and the reaction is carried out for 2.5 hours. The temperature is then lowered to 28°C to obtain a pre-crosslinked PVB solution with a solid content of 20%. The mass ratio of polyvinyl butyral, hexamethylene diisocyanate, dibutyltin dilaurate, and mixed solvent is 100:4.0:0.2:600. The mixed solvent is a mixture of butanone and isopropanol, with a mass ratio of butanone to isopropanol of 2.2:1. Step 2: Toluene and methyl ethyl ketone (MEK) are added to the reactor and stirred at 250 rpm to obtain a mixed solvent. The initiator azobisisobutyronitrile (AIBN) is added to the mixed solvent for the first time and stirred until dissolved. Methyl methacrylate, butyl acrylate, and acrylic acid are pre-mixed to obtain a monomer mixture. This monomer mixture is then added dropwise to the reactants in the reactor at a rate of 6 mL / min, maintaining the temperature at 72°C. After the addition is complete, the reaction continues for 3.5 h. The initiator azobisisobutyronitrile (AIBN) is added a second time (to ensure complete reaction), and the reaction continues for another 2.5 h. The temperature is then lowered to below 40°C to obtain an acrylate copolymer solution with a solid content of 28%. The mass ratio of methyl methacrylate, butyl acrylate, acrylic acid, the mixed solvent, the first addition of ABObisisobutyronitrile, and the second addition of ABObisisobutyronitrile is 55:35:10:350:0.8:0.15, and the mass ratio of toluene to MEK in the mixed solvent is 2.2:1.2. Step 3: Dissolve the hyperbranched polyester in a portion of tetrahydrofuran, add maleic anhydride, and react at 250 rpm and 62°C for 2.2 h to obtain material 1. Mix the pre-crosslinked PVB solution, acrylate copolymer solution, and a portion of tetrahydrofuran at 52°C and 350 rpm for 35 min to obtain material 2. Then, add material 1 dropwise to material 2 at a rate of 3.5 mL / min, while simultaneously adding antioxidant 1010 and the remaining tetrahydrofuran. Keep the temperature constant, increase the stirring speed to 900 rpm, and mix for 1.8 h. The solvent is evaporated by holding the solution at 40℃ for 35 min, 60℃ for 60 min, and 80℃ for 35 min, followed by vacuum degassing at -0.08 MPa for 35 min to obtain the final product. The mass ratio of the pre-crosslinked PVB solution, acrylate copolymer solution, hyperbranched polyester, maleic anhydride, antioxidant 1010, and tetrahydrofuran is 500:320:7:0.4:0.2:180. In material 1, the amount of tetrahydrofuran is 55% of the total tetrahydrofuran, and in material 2, the amount of tetrahydrofuran is 22% of the total tetrahydrofuran.

[0028] The preparation method of the above-mentioned high-transparency alumina ceramic substrate for semiconductor packaging is as follows: First, alumina powder, composite modified sintering aid, polyvinyl butyral-acrylic resin composite binder, plasticizer, and dispersant are weighed according to the specified ratio, added to a solvent, and stirred and mixed to obtain a slurry. The solvent is a mixture of methyl ethyl ketone (MEK), isopropanol, and toluene, with a mass ratio of 45:25:30. The solid content of the slurry is 50-55%. Then, the slurry is ball-milled at a speed of 250 r / min. The slurry is milled for 30 hours, then defoamed under vacuum of ≤-0.095MPa for 60 minutes. The slurry is then cast onto a release film using a casting machine. The release film with the wet film is dried at 50℃ and 40% humidity for 12 hours to obtain alumina ceramic green body. The green body is placed in a debinding furnace, heated to 500℃ and held for 4 hours for debinding, then heated to 1800℃ and sintered at high temperature for 5 hours. After cooling and polishing, the final product is obtained.

[0029] Example 2 A high-transparency alumina ceramic substrate for semiconductor packaging comprises, by weight: 90 parts alumina powder, 3 parts composite modified sintering aid, 8 parts polyvinyl butyral-acrylic resin composite binder, 5 parts plasticizer, and 0.5 parts dispersant. The plasticizer is polyethylene glycol, and the dispersant is ammonium polyacrylate and ammonium citrate in a mass ratio of 2:1.

[0030] The preparation method of the composite modified sintering aid is as follows: Step a: Add yttrium nitrate hexahydrate, lanthanum(III) nitrate hexahydrate, and magnesium nitrate hexahydrate to deionized water and stir at 300 rpm until dissolved to obtain a metal salt solution; dissolve ammonium bicarbonate in deionized water to obtain an ammonium bicarbonate aqueous solution, then add ammonia water and stir until well mixed to obtain a precipitant; at 13℃ and 500 rpm, add the precipitant dropwise to the metal salt solution at a rate of 1.8 mL / min. After the addition is complete, continue stirring for 40 min, then let stand for 1.8-2.2 h, then centrifuge at 6000 rpm for 15 min, discard the supernatant, then wash three times with deionized water and once with ethanol, dry at 80℃ for 12 h, and crush. The mixture is sieved through a 00-mesh sieve, kept at 270℃ for 1.2 hours, then at 850℃ for 2.5 hours, cooled to ≤60℃, and then dispersed by a nitrogen gas flow to obtain composite nanoparticles. In the metal salt solution, the mass-to-volume ratio of yttrium nitrate hexahydrate (Y(NO3)3·6H2O), lanthanum(III) nitrate hexahydrate (La(NO3)3·6H2O), magnesium nitrate hexahydrate, and deionized water is 160g:85g:38g:1.6. In the precipitant, the mass-to-volume ratio of ammonium bicarbonate to ammonia and deionized water is 105g:470mL:600mL, the ammonia concentration is 28%, and the mass ratio of yttrium nitrate hexahydrate to ammonium bicarbonate is 16:11. Step b: The composite nanoparticles are added to ethanol and ultrasonically dispersed at 250W for 45 min to obtain a dispersion. Aluminum isopropoxide and acetylacetone are dissolved in ethanol to obtain an aluminum precursor solution. Under a nitrogen atmosphere at 50℃, the aluminum precursor solution is added dropwise to the dispersion at a rate of 0.9 mL / min. After the addition is complete, the temperature is raised to 85℃ and refluxed for 9 h. Then, the mixture is centrifuged at 5500 rpm for 18 min, washed three times with ethanol, and vacuum dried at 85℃ for 10 h to obtain an intermediate. The mass-to-volume ratio of the composite nanoparticles, aluminum isopropoxide, and acetylacetone obtained in step a is 100 g: 47 g: 11.5 mL. The mass-to-volume ratio of the composite nanoparticles to ethanol in the dispersion is 100 g: 0.95 L. The volume ratio of acetylacetone to ethanol in the aluminum precursor solution is 1:18. Step c: Calcine the intermediate obtained in step b at 455℃ for 2 hours, cool it in the furnace, then add the cooled intermediate to the mixed solvent, mix well, add silane coupling agent KH-570, reflux at 75℃ for 15 hours, then add acrylic acid and azobisisobutyronitrile, continue the reaction for 6.5 hours, centrifuge at 5500 rpm for 15 minutes, wash twice with toluene, vacuum dry at 65℃ for 7 hours, and pass through a 500-mesh sieve to obtain the final product; wherein, the mass ratio of the intermediate obtained in step b, silane coupling agent KH-570, acrylic acid, and azobisisobutyronitrile is 100:4.6:0.95:0.055, the mass-volume ratio of the intermediate obtained in step b to the mixed solvent is 100g:870mL, and the mixed solvent is a mixture of toluene and ethanol with a mass ratio of 2.8:1.

[0031] The preparation method of the polyvinyl butyral-acrylic resin composite adhesive is as follows: Step 1: Polyvinyl butyral resin is added to a mixed solvent and stirred at 50°C and 300 rpm for 2.5 hours until the solution is completely transparent. Then, the temperature is raised to 65°C, and hexamethylene diisocyanate crosslinking agent is added dropwise at a rate of 3.0 mL / min. Simultaneously, dibutyltin dilaurate catalyst is added, and the reaction is carried out for 2.0 hours. The temperature is then lowered to 30°C to obtain a pre-crosslinked PVB solution with a solid content of 18%. The mass ratio of polyvinyl butyral, hexamethylene diisocyanate, dibutyltin dilaurate, and mixed solvent is 100:3.0:0.25:500. The mixed solvent is a mixture of butanone and isopropanol, with a mass ratio of butanone to isopropanol of 1.5:1. Step 2: Toluene and methyl ethyl ketone (MEK) are added to the reactor and stirred at 300 rpm to obtain a mixed solvent. The initiator azobisisobutyronitrile (AIBN) is added to the mixed solvent for the first time and stirred until dissolved. Methyl methacrylate, butyl acrylate, and acrylic acid are pre-mixed to obtain a monomer mixture. This monomer mixture is then added dropwise to the reactants in the reactor at a rate of 8 mL / min, maintaining the temperature at 75°C. After the addition is complete, the reaction continues for 4.0 h. The initiator azobisisobutyronitrile (AIBN) is added a second time (to ensure complete reaction), and the reaction continues for 2 h. The temperature is then lowered to below 40°C to obtain an acrylate copolymer solution with a solid content of 30%. The mass ratio of methyl methacrylate, butyl acrylate, acrylic acid, the mixed solvent, the first addition of ABObisisobutyronitrile, and the second addition of ABObisisobutyronitrile is 60:30:12:300:1.0:0.1, and the mass ratio of toluene to MEK in the mixed solvent is 2.5:1. Step 3: Dissolve the hyperbranched polyester in a portion of tetrahydrofuran, add maleic anhydride, and react at 200 rpm and 65°C for 2.0 h to obtain material 1. Mix the pre-crosslinked PVB solution, acrylate copolymer solution, and a portion of tetrahydrofuran at 55°C and 300 rpm for 30 min to obtain material 2. Then, add material 1 dropwise to material 2 at a rate of 4.0 mL / min, while simultaneously adding antioxidant 1010 and the remaining tetrahydrofuran. Keep the temperature constant, increase the stirring speed to 1000 rpm, and mix for 1.5 h. Then, at 4... The solvent is evaporated by holding the solution at 0℃ for 40 min, 60℃ for 50 min, and 80℃ for 40 min, followed by vacuum degassing at -0.09 MPa for 40 min to obtain the final product. The mass ratio of the pre-crosslinked PVB solution, acrylate copolymer solution, hyperbranched polyester, maleic anhydride, antioxidant 1010, and tetrahydrofuran is 480:350:5.0:0.5:0.1, 200. In material 1, the amount of tetrahydrofuran is 60% of the total tetrahydrofuran content, and in material 2, the amount of tetrahydrofuran is 20% of the total tetrahydrofuran content.

[0032] The preparation method of the high-transparency alumina ceramic substrate for semiconductor packaging is the same as in Example 1.

[0033] Example 3 A high-transparency alumina ceramic substrate for semiconductor packaging comprises, by weight: 95 parts alumina powder, 1.2 parts composite modified sintering aid, 3 parts polyvinyl butyral-acrylic resin composite binder, 1 part plasticizer, and 1 part dispersant. The plasticizer is polyethylene glycol, and the dispersant is ammonium polyacrylate and ammonium citrate in a mass ratio of 3:1.

[0034] The preparation method of the composite modified sintering aid is as follows: Step a: Add yttrium nitrate hexahydrate, lanthanum(III) nitrate hexahydrate, and magnesium nitrate hexahydrate to deionized water and stir at 400 rpm until dissolved to obtain a metal salt solution; dissolve ammonium bicarbonate in deionized water to obtain an ammonium bicarbonate aqueous solution, then add ammonia water and stir until homogeneous to obtain a precipitant; at 18℃ and 400 rpm, add the precipitant dropwise to the metal salt solution at a rate of 2.2 mL / min. After the addition is complete, continue stirring for 20 min, then let stand for 2.2 h, then centrifuge at 6000 rpm for 15 min, discard the supernatant, then wash three times with deionized water and once with ethanol, dry at 80℃ for 12 h, and crush through 100... The mixture is sieved through a fine mesh, then kept at 290℃ for 0.8h, then at 950℃ for 1.5h, cooled to ≤60℃, and then dispersed by a nitrogen gas flow to obtain composite nanoparticles. In the metal salt solution, the mass-to-volume ratio of yttrium nitrate hexahydrate (Y(NO3)3·6H2O), lanthanum(III) nitrate hexahydrate (La(NO3)3·6H2O), magnesium nitrate hexahydrate, and deionized water is 140g:75g:42g:2L. In the precipitant, the mass-to-volume ratio of ammonium bicarbonate to ammonia and deionized water is 112g:430mL:400mL, the ammonia concentration is 28%, and the mass ratio of yttrium nitrate hexahydrate to ammonium bicarbonate is 14:10.5. Step b: The composite nanoparticles are added to ethanol and ultrasonically dispersed at 300W for 40 min to obtain a dispersion. Aluminum isopropoxide and acetylacetone are dissolved in ethanol to obtain an aluminum precursor solution. Under a nitrogen atmosphere at 60℃, the aluminum precursor solution is added dropwise to the dispersion at a rate of 1.1 mL / min. After the addition is complete, the temperature is raised to 75℃ and refluxed for 11 h. Then, the mixture is centrifuged at 6000 rpm for 15 min, washed three times with ethanol, and vacuum dried at 75℃ for 12 h to obtain an intermediate. The mass-to-volume ratio of the composite nanoparticles, aluminum isopropoxide, and acetylacetone obtained in step a is 100 g: 51 g: 10.5 mL. The mass-to-volume ratio of the composite nanoparticles to ethanol in the dispersion is 100 g: 1.05 L. The volume ratio of acetylacetone to ethanol in the aluminum precursor solution is 1:22. Step c: Calcine the intermediate obtained in step b at 445℃ for 2.5 h, cool it in the furnace, then add the cooled intermediate to the mixed solvent, mix well, add silane coupling agent KH-570, reflux at 85℃ for 13 h, then add acrylic acid and azobisisobutyronitrile, continue the reaction for 5.5 h, centrifuge at 5000 rpm for 15 min, wash twice with toluene, vacuum dry at 55℃ for 9 h, and pass through a 500-mesh sieve to obtain the final product; wherein, the mass ratio of the intermediate obtained in step b, silane coupling agent KH-570, acrylic acid, and azobisisobutyronitrile is 100:4.9:0.85:0.065, the mass-volume ratio of the intermediate obtained in step b to the mixed solvent is 100 g:820 mL, and the mixed solvent is a mixture of toluene and ethanol with a mass ratio of 3.2:1.

[0035] The preparation method of the polyvinyl butyral-acrylic resin composite adhesive is as follows: Step 1: Polyvinyl butyral resin is added to a mixed solvent and stirred at 45°C and 400 rpm for 3.5 hours until the solution is completely transparent. Then, the temperature is raised to 60°C, and hexamethylene diisocyanate crosslinking agent is added dropwise at a rate of 2.0 mL / min. Simultaneously, dibutyltin dilaurate catalyst is added, and the reaction is carried out for 3.0 hours. The temperature is then lowered to 25°C to obtain a pre-crosslinked PVB solution with a solid content of 22%. The mass ratio of polyvinyl butyral, hexamethylene diisocyanate, dibutyltin dilaurate, and mixed solvent is 100:5.0:0.10:650. The mixed solvent is a mixture of butanone and isopropanol, with a mass ratio of butanone to isopropanol of 3:1. Step 2: Toluene and methyl ethyl ketone (MEK) are added to the reactor and stirred at 200 rpm to obtain a mixed solvent. The initiator azobisisobutyronitrile (AIBN) is added to the mixed solvent for the first time and stirred until dissolved. Methyl methacrylate, butyl acrylate, and acrylic acid are pre-mixed to obtain a monomer mixture. This monomer mixture is then added dropwise to the reactants in the reactor at a rate of 5 mL / min, maintaining the temperature at 70°C. After the addition is complete, the reaction continues for 3.0 h. The initiator azobisisobutyronitrile (AIBN) is added a second time (to ensure complete reaction), and the reaction continues for another 3 h. The temperature is then lowered to below 40°C to obtain an acrylate copolymer solution with a solid content of 25%. The mass ratio of methyl methacrylate, butyl acrylate, acrylic acid, the mixed solvent, the first addition of AIBN, and the second addition of AIBN is 50:40:8:400:0.5:0.2. The mass ratio of toluene to MEK in the mixed solvent is 2:1. Step 3: Dissolve the hyperbranched polyester in a portion of tetrahydrofuran, add maleic anhydride, and react at 300 rpm and 60°C for 2.5 h to obtain material 1. Mix the pre-crosslinked PVB solution, acrylate copolymer solution, and a portion of tetrahydrofuran at 50°C and 400 rpm for 40 min to obtain material 2. Then, add material 1 dropwise to material 2 at a rate of 3.0 mL / min, while simultaneously adding antioxidant 1010 and the remaining tetrahydrofuran. Keep the temperature constant, increase the stirring speed to 800 rpm, and mix for 2.0 h. Then, in step 4... The solvent is evaporated by holding the solution at 0℃ for 30 min, 60℃ for 70 min, and 80℃ for 30 min, followed by vacuum degassing at -0.08 MPa for 30 min to obtain the final product. The mass ratio of the pre-crosslinked PVB solution, acrylate copolymer solution, hyperbranched polyester, maleic anhydride, antioxidant 1010, and tetrahydrofuran is 520:300:8.0:0.3:0.3, 150. In material 1, the amount of tetrahydrofuran is 50% of the total tetrahydrofuran content, and in material 2, the amount of tetrahydrofuran is 25% of the total tetrahydrofuran content.

[0036] The preparation method of the high-transparency alumina ceramic substrate for semiconductor packaging is the same as in Example 1.

[0037] Comparative Example 1 A high-transparency alumina ceramic substrate for semiconductor packaging, wherein the composite modified sintering aid is replaced by the following method for preparation: Step a: Add yttrium nitrate hexahydrate, lanthanum(III) nitrate hexahydrate, and magnesium nitrate hexahydrate to deionized water and stir at 350 rpm until dissolved to obtain a metal salt solution; dissolve ammonium bicarbonate in deionized water to obtain an ammonium bicarbonate aqueous solution, then add ammonia water and stir until well mixed to obtain a precipitant; at 15℃ and 450 rpm, add the precipitant dropwise to the metal salt solution at a rate of 2 mL / min. After the addition is complete, continue stirring for 30 min, and then let stand for 2 h. Then, centrifuge at 6000 rpm for 15 min, discard the supernatant, wash three times with deionized water and once with ethanol, dry at 80℃ for 12 h, crush and pass through a 100-mesh sieve, then heat at 280℃ for 1 h, heat at 900℃ for 2 h, cool to ≤60℃, and then disperse with a nitrogen gas flow to obtain composite nanoparticles; wherein, in the metal salt solution, yttrium nitrate hexahydrate (Y(NO3)3·6H2O) and lanthanum(III) nitrate hexahydrate (La(NO3)3·6H2O) are present. 22O), the mass-to-volume ratio of magnesium nitrate hexahydrate and deionized water is 150g:80g:40g:1.8L, and the mass-to-volume ratio of ammonium bicarbonate, ammonia, and deionized water in the precipitant is 110g:450mL:500mL, the concentration of ammonia is 28%, and the mass ratio of yttrium nitrate hexahydrate to ammonium bicarbonate is 15:10.8; steps b and c are omitted.

[0038] The rest is the same as in Example 1.

[0039] Comparative Example 2 A high-transparency alumina ceramic substrate for semiconductor packaging, wherein the polyvinyl butyral-acrylic resin composite adhesive is replaced with a mixture of polyvinyl butyral and dibutyl phthalate plasticizer in a mass ratio of 5:2, and the rest is the same as in Example 1.

[0040] Comparative Example 3 A high-transparency alumina ceramic substrate for semiconductor packaging, wherein the composite modified sintering aid is replaced by the following method for preparation: Step a: Add yttrium nitrate hexahydrate, lanthanum(III) nitrate hexahydrate, and magnesium nitrate hexahydrate to deionized water and stir at 350 rpm until dissolved to obtain a metal salt solution; dissolve ammonium bicarbonate in deionized water to obtain an ammonium bicarbonate aqueous solution, then add ammonia water and stir until well mixed to obtain a precipitant; at 15℃ and 450 rpm, add the precipitant dropwise to the metal salt solution at a rate of 2 mL / min. After the addition is complete, continue stirring for 30 min, let stand for 2 h, then centrifuge at 6000 rpm for 15 min, discard the supernatant, then wash three times with deionized water and once with ethanol, dry at 80℃ for 12 h, crush and pass through a 100-mesh sieve, and then... The mixture was kept at 0℃ for 1 hour, then at 900℃ for 2 hours, cooled to ≤60℃, and then dispersed by a nitrogen gas stream to obtain composite nanoparticles. In the metal salt solution, the mass-to-volume ratio of yttrium nitrate hexahydrate (Y(NO3)3·6H2O), lanthanum(III) nitrate hexahydrate (La(NO3)3·6H2O), magnesium nitrate hexahydrate, and deionized water was 150g:80g:40g:1.8L. In the precipitant, the mass-to-volume ratio of ammonium bicarbonate to ammonia and deionized water was 110g:450mL:500mL, the ammonia concentration was 28%, and the mass ratio of yttrium nitrate hexahydrate to ammonium bicarbonate was 15:10.8. Steps b and c are omitted. The polyvinyl butyral-acrylic resin composite adhesive was replaced with a mixture of polyvinyl butyral and dibutyl phthalate plasticizer in a mass ratio of 5:2, and the rest was the same as in Example 1.

[0041] Performance testing: The bulk density was tested according to GB / T 25995-2010 "Test Method for Density and Apparent Porosity of Fine Ceramics"; The hardness was tested according to GB / T 16534-2009 "Test Method for Room Temperature Hardness of Fine Ceramics"; The linear transmittance of the double-sided polished sample was measured at 600 nm using a UV-Vis-NIR spectrophotometer. According to GB / T 6569-2006 "Test Method for Bending Strength of Fine Ceramics", the three-point bending strength was tested. Fracture toughness was tested according to GB / T 23806-2009 "Test Method for Fracture Toughness of Fine Ceramics - Single-sided Precracked Beam (SEPB) Method".

[0042] Table 1. Test Results

[0043] From Table 1, Figure 1 , Figure 2 It can be seen that this invention successfully achieves a significant improvement in the comprehensive performance of high-transparency alumina ceramic plates through the synergistic effect of composite modified sintering aids and special composite binders. The ceramic plates obtained in Examples 1-3 exhibit excellent comprehensive performance, with their density, light transmittance, and mechanical properties all superior to those of Comparative Examples 1-3. Comparative Example 1, due to the lack of surface coating and grafting modification of the sintering aid, suffers from poor dispersion and interfacial bonding in the matrix. Although it still retains some function, the densification process is hindered, resulting in a simultaneous decline in transmittance and mechanical properties. Comparative Example 2 uses a traditional binder system, which lacks sufficient control over powder dispersion and green body uniformity, primarily affecting the structural integrity of the material and leading to a loss of mechanical properties, particularly strength and toughness. Comparative Example 3 lacks both core technologies, resulting in cumulative deterioration in multiple aspects of its performance, verifying the indispensable synergistic relationship between the two. In summary, composite modified sintering aids are the core for achieving high density and high light transmittance, while composite binders are the key to ensuring microstructural uniformity, thereby achieving high strength and high toughness. The combination of these two technologies enables the use of ceramic substrates to meet the semiconductor packaging requirements, resulting in a technical solution that demonstrates clear advancement and practicality.

[0044] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0045] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-transparency alumina ceramic plate for semiconductor packaging, characterized by, By weight parts include: alumina powder 90-95 parts, composite modified sintering aid 1.2-3 parts, polyvinyl butyral-acrylic resin composite binder 3-8 parts, plasticizer 1-5 parts, dispersing agent 0.5-1 parts; The preparation method of the composite modified sintering aid is as follows: Step a, the mass-volume ratio of yttrium nitrate hexahydrate, lanthanum nitrate (III) hexahydrate, magnesium nitrate hexahydrate and deionized water in the metal salt solution is 140-160g: 75-85g: 38-42g: 1.6-2L, the mass-volume ratio of ammonium bicarbonate, ammonia and deionized water in the precipitating agent is 105-112g: 430-470mL: 400-600mL, the concentration of the ammonia water is 25-28%, and the mass ratio of yttrium nitrate hexahydrate to ammonium bicarbonate is 14-16: 10.5-11. Step b, the mass-volume ratio of the composite nanometer powder, aluminum isopropyl alcohol and acetylacetone obtained in step a is 100g: 47-51g: 10.5-11.5mL, the mass-volume ratio of the composite nanometer powder and ethanol in the dispersion liquid is 100g: 0.95-1.05L, and the volume ratio of acetylacetone to ethanol in the aluminum precursor solution is 1: 18-22. Step b, the mass-volume ratio of the composite nanometer powder, aluminum isopropyl alcohol and acetylacetone obtained in step a is 100g: 47-51g: 10.5-11.5mL, the mass-volume ratio of the composite nanometer powder and ethanol in the dispersion liquid is 100g: 0.95-1.05L, and the volume ratio of acetylacetone to ethanol in the aluminum precursor solution is 1: 18-22.

2. The high-transparency alumina ceramic plate for semiconductor packaging according to claim 1, characterized by, ​ 3. The high-transparency alumina ceramic plate for semiconductor packaging according to claim 1, characterized by, ​ 4. The high-transparency alumina ceramic plate for semiconductor packaging according to claim 1, characterized by In step c, the mass ratio of the intermediate obtained in step b, silane coupling agent KH-570, acrylic acid, and azobisisobutyronitrile is 100:4.6-4.9:0.85-0.95:0.055-0.065, the mass-volume ratio of the intermediate obtained in step b to the mixed solvent is 100 g:820-870 mL, and the mixed solvent is a mixture of toluene and ethanol in a mass ratio of 2.8-3.2:

1.

5. The highly transparent alumina ceramic plate for semiconductor packaging according to claim 1, characterized by, The preparation method of the polyvinyl butyral-acrylic resin composite adhesive is as follows: In step 1, the polyvinyl butyral, hexamethylene diisocyanate, dibutyltin dilaurate, and the mixed solvent are in a mass ratio of 100:3.0-5.0:0.10-0.25:500-650, and the mixed solvent is a mixture of butanone and isopropanol in a mass ratio of 1.5-3:

1. In step 2, the mass ratio of methyl methacrylate, butyl acrylate, acrylic acid, the mixed solvent, the first added azobisisobutyronitrile, and the second added azobisisobutyronitrile is 50-60:30-40:8-12:300-400:0.5-1.0:0.1-0.2, and the mass ratio of toluene and butanone in the mixed solvent is 2-2.5:1-1.

5. ​ 6. The highly transparent alumina ceramic plate for semiconductor packaging according to claim 5, characterized by ​ 7. The highly transparent alumina ceramic plate for semiconductor packaging according to claim 5, characterized by, ​ 8. The high-transparency alumina ceramic plate for semiconductor packaging according to claim 5, characterized by In step 3, the total mass ratio of the pre-crosslinked PVB solution, the acrylate copolymer solution, the hyperbranched polyester, the maleic anhydride, the antioxidant 1010, and the tetrahydrofuran is 480-520:300-350:5.0-8.0:0.3-0.5:0.1-0.3, and the amount of tetrahydrofuran in material 1 is 50-60% of the total amount of tetrahydrofuran, and the amount of tetrahydrofuran in material 2 is 20-25% of the total amount of tetrahydrofuran.

9. The highly transparent alumina ceramic plate for semiconductor packaging according to claim 1, characterized by, The plasticizer is polyethylene glycol, and the dispersant is one or both of ammonium polyacrylate and ammonium citrate.

10. The method of producing a high-transparency alumina ceramic plate for semiconductor packaging according to any one of claims 1 to 9, wherein Specifically, First, the alumina powder, the composite modified sintering aid, the polyvinyl butyl-acrylic resin composite binder, the plasticizer, and the dispersant are weighed according to the proportion, added to the solvent, and stirred to obtain a slurry, wherein the solvent is one or more of butanone, isopropyl alcohol, and toluene, and the solid content of the slurry is 50-55%; then the slurry is ball milled at a speed of 200-300 rpm for 24-48 h, and then the ball milled slurry is subjected to debubbling treatment under a vacuum degree of ≤-0.095 MPa for 30-90 min; then the slurry is cast on a release film by a casting machine, and the release film with the wet film is dried at a temperature of 40-60℃ and a humidity of 30-50% for 8-16 h to obtain an alumina ceramic green body; the green body is placed in a degassing oven, heated to 400-600℃, and degassed for 2-6 h, then heated to 1750-1850℃ and sintered for 3-6 h, cooled and polished to obtain the product.

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