Directional sounding touch display screen and preparation process thereof

Abstract

The invention discloses a directional sounding touch display screen and a preparation process thereof.The touch display screen comprises a vibration layer and a non-vibration layer, the vibration layer comprises a touch cover plate layer and a display sounding layer, the display sounding layer comprises a display layer and a sounding layer, the display layer is located between the touch cover plate layer and the sounding layer, and the non-vibration layer is located between the touch cover plate layer and the sounding layer. The sound production layer comprises a first substrate, a first conductive layer, an insulating layer and a first hydrophobic anti-corrosion layer; the non-vibration layer comprises a second substrate, a microstructure, a second conductive layer and a second hydrophobic anti-corrosion layer, the microstructure is formed by integrally processing the second substrate, the upper end part, close to the vibration layer, of the microstructure is embedded and fixed in the first hydrophobic anti-corrosion layer, and an air gap is formed between the vibration layer and the non-vibration layer through the remaining protruding parts; and the vibration layer vibrates up and down under the action of externally applied driving voltage to carry out directional sound production. According to the directional sounding touch display screen, multiple functions of directional sounding, touch display and the like of the directional sounding touch display screen are achieved, the overall working reliability of the product is improved, and the directional sounding touch display screen is suitable for being mounted on a vehicle.

Description

Technical Field

[0001] This invention relates to the field of directional sound technology for screens, and specifically to a directional sound-emitting touch display screen and its manufacturing process. Background Technology

[0002] With the development of display technology, consumers are not only demanding high-quality and clear images from display devices, but are also increasingly focusing on sound output effects. They tend to prefer display devices that can achieve perfect integration of sound and image, seamlessly blending the displayed image with the played sound.

[0003] Existing technologies for achieving sound and image integration in display devices utilize screen-based sound generation technology. The principle behind this is to use vibrating elements to drive the screen to vibrate and produce sound. For example, a resonant screen-based sound generation solution involves attaching a vibrating device to the bottom of the screen or the frame of the device. When the device operates, it vibrates, ultimately causing the screen to vibrate and produce sound. Another example is a direct-drive screen-based sound generation solution, where the device consists of two parts: one part is directly attached to the screen, and the other part is fixed to the frame. When the device operates, the two parts generate mutual attraction or repulsion, thereby driving the screen to vibrate and produce sound. Compared to the resonant screen-based sound generation solution, this method offers improved conversion efficiency.

[0004] Touch panels can recognize touch points input by a human hand or a separate input unit and transmit corresponding information to the display device above. Based on their contact sensing method, touch panels are classified into resistive, capacitive, and infrared sensing types. Capacitive touch panels are currently receiving widespread attention due to their ease of manufacturing and strong sensing capabilities.

[0005] Therefore, how to combine screen directional sound with touch and display, so that the display can integrate screen directional sound, display and touch functions into one, and how to make the combination suitable for automotive application scenarios, are problems that need to be solved. Summary of the Invention

[0006] The purpose of this invention is to provide a directional sound-emitting touch display screen that combines a touch display screen with a directional sound-emitting screen, suitable for vehicle use, and its manufacturing process.

[0007] To achieve the above objectives, the present invention proposes a directional sound-emitting touch display screen, comprising:

[0008] A vibration layer, comprising a touch cover layer and a display sound layer, the display sound layer comprising a display layer and a sound layer, the display layer being located between the touch cover layer and the sound layer, the sound layer comprising a first substrate, a first conductive layer, an insulating layer and a first hydrophobic anti-corrosion layer, the first substrate being disposed on the surface of the display layer away from the client, the first conductive layer being disposed on the surface of the first substrate away from the display layer, the insulating layer being disposed on the surface of the first conductive layer away from the first substrate, and the first hydrophobic anti-corrosion layer being disposed on the surface of the insulating layer away from the first conductive layer;

[0009] The non-vibration layer includes a second substrate, a microstructure, a second conductive layer, and a second hydrophobic anti-corrosion layer. The microstructure is integrally formed on the second substrate and consists of multiple protrusions arranged in an array. The second conductive layer is disposed on the surface of the second substrate except for the microstructure. The second hydrophobic anti-corrosion layer is disposed on the second conductive layer. The microstructure protrudes from the surface of the second hydrophobic anti-corrosion layer, and its upper part near the vibration layer is embedded and fixed in the first hydrophobic anti-corrosion layer. The remaining protruding part forms an air gap between the vibration layer and the non-vibration layer.

[0010] The vibrating layer vibrates up and down under the action of an externally applied driving voltage to produce directional sound.

[0011] In a preferred embodiment, the first hydrophobic anti-corrosion layer is a porous aerogel layer, and / or the density of the porous aerogel layer is at least 22 mg / cm³. 3 And / or, the porous aerogel layer is formed at least twice, and is non-adhesive in the last forming process, while is adhesive in the remaining forming processes to fix the embedded microstructure; and / or, each forming process of the porous aerogel layer is UV curing, thermosetting, or 3D printing, and the temperature of UV curing and thermosetting is below 100°.

[0012] Alternatively, the first hydrophobic anti-corrosion layer comprises a thermoplastic polyurethane rubber layer and a waterproof layer, wherein the thermoplastic polyurethane rubber layer is disposed on the surface of the insulating layer away from the first conductive layer, the waterproof layer is disposed on the surface of the thermoplastic polyurethane rubber layer away from the insulating layer, and / or the Young's modulus of the thermoplastic polyurethane rubber layer is less than 100 Pa.

[0013] In a preferred embodiment, the microstructure is formed by processing the surface of the second substrate near the vibration layer using laser and photolithography processes; and / or, the second substrate is a cover glass or I-line glass with a thickness of 300um to 1.1mm or an ultrathin glass UTG with a thickness of 100um to 300um; and / or, the third substrate is a cover glass.

[0014] In a preferred embodiment, the touch cover layer includes a third substrate and an ITO layer with a conductive pattern, the ITO layer being disposed on the surface of the third substrate near or away from the client.

[0015] Alternatively, the touch cover layer includes a third substrate, an upper ITO layer and a lower ITO layer, both with conductive patterns, wherein the upper ITO layer and the lower ITO layer are respectively disposed on the upper surface of the third substrate near the client and the lower surface away from the client.

[0016] In a preferred embodiment, the non-AA regions of the vibrating layer and the non-vibrating layer are bonded together, and the non-AA regions are provided with at least one vent hole; and / or, the sheet resistance of the first conductive layer is less than 10Ω, and the thickness is in the nanometer range; and / or, the insulating layer is an organic-inorganic composite material with a dielectric constant between 2 and 6 at 1MHz, and the organic-inorganic composite material is doped with boron nitride micro-nano particles; and / or, the first conductive layer and the second conductive layer are steel alloy conductive layers, silicon steel alloy conductive layers, carbon nanotube conductive layers, or graphene conductive layers; and / or, after the vibrating layer and the non-vibrating layer are bonded together, the distance between the first conductive layer and the second conductive layer is less than 30µm.

[0017] In a preferred embodiment, the display layer includes a polarizing layer with pressure-sensitive adhesive, an encapsulation layer, and a thin-film transistor layer. The polarizing layer is disposed between the touch cover layer and the encapsulation layer, and the thin-film transistor layer is disposed between the encapsulation layer and the sound-emitting layer.

[0018] In a preferred embodiment, both the encapsulation layer and the thin-film transistor layer are formed by low-temperature chemical or physical vapor deposition on the first substrate.

[0019] In a preferred embodiment, the touch cover layer further includes an optical layer, the thickness of which is less than 5 μm, and which is a composite layer of one or more of the following: anti-glare, anti-reflection, and anti-fingerprint properties; and / or, the thickness of the second conductive layer is less than 1 μm; and / or, the thickness of the second hydrophobic and anti-corrosion layer is less than 1 μm, and the water droplet angle is greater than 105°; and / or, the directional sound-emitting touch display is used in vehicles.

[0020] In a preferred embodiment, the total thickness of the vibration layer is between 195 μm and 660 μm, the height of the remaining protruding portion of the microstructure is between 5 μm and 10 μm, the spacing between two adjacent microstructures is between 4 mm and 10 mm, and each microstructure is a single-point structure with a diameter between 50 μm and 2 mm or a multi-point structure with a total diameter of less than 2 mm. The thickness of the insulating layer is between 6 μm and 8 μm, the thickness of the first hydrophobic and anti-corrosion layer is less than 6 μm, and the distance between the first conductive layer and the second conductive layer is less than 30 μm.

[0021] In a preferred embodiment, the total thickness of the vibration layer is 395µm to 405µm, the height of the remaining protruding portion of the microstructure is 6µm and the spacing between two adjacent microstructures is 7.5mm, the thickness of the insulating layer is 6µm, and the thickness of the first hydrophobic anti-corrosion layer is 6µm; or, the total thickness of the vibration layer is 640µm to 660µm, the height of the remaining protruding portion of the microstructure is 5µm and the spacing between two adjacent microstructures is 8.5mm, the thickness of the insulating layer is 6µm, and the thickness of the first hydrophobic anti-corrosion layer is... 5µm; or, the total thickness of the vibration layer is 195µm~205µm, the height of the remaining protruding portion of the microstructure is 8µm and the spacing between two adjacent microstructures is 4mm, and the thickness of the insulating layer is 6µm, and the thickness of the first hydrophobic anti-corrosion layer is 6µm; or, the total thickness of the vibration layer is 250µm~270µm, the height of the remaining protruding portion of the microstructure is 8µm and the spacing between two adjacent microstructures is 4.3mm, and the thickness of the insulating layer is 6µm, and the thickness of the first hydrophobic anti-corrosion layer is 6µm.

[0022] On the other hand, the present invention also discloses a manufacturing process for a directional sound-emitting touch display screen, comprising:

[0023] S1, Preparing the vibration layer, including:

[0024] S11, Prepare the touch cover layer;

[0025] S12, fabricating a display sound-emitting layer, including: forming a first conductive layer on the surface of the first substrate away from the client, forming an insulating layer on the surface of the first conductive layer away from the first substrate, and forming a display layer on the surface of the first substrate close to the client;

[0026] S13, the surface of the touch cover layer away from the client in S11 is attached to the surface of the display layer near the client in S12, and a first hydrophobic and anti-corrosion layer is formed on the surface of the insulating layer away from the client.

[0027] S2, fabricating a non-vibration layer, including: integrally forming a microstructure on the surface of the second substrate near the client, forming a second conductive layer on the surface of the second substrate near the client and other than the microstructure, forming a second hydrophobic anti-corrosion layer on the surface of the second conductive layer near the client, and binding an FPC signal line electrically connected to the second conductive layer in the non-AA area of ​​the non-vibration layer.

[0028] S3, the vibrating layer and the non-AA area of ​​the non-vibrating layer are bonded together, the upper part of the microstructure near the vibrating layer is embedded in the first hydrophobic anti-corrosion layer, a DC bias voltage is applied between the first conductive layer and the second conductive layer, and the first hydrophobic anti-corrosion layer is cured.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] 1. This invention provides a novel directional sound-emitting screen integrated under a touch display screen, forming a new type of directional sound-emitting touch display screen that combines a directional sound-emitting screen with a touch display screen. Through combined improvements to the structure, materials, processing technology, and distribution of the sound-emitting and non-vibrating layers of the vibrating layer, as well as innovative designs for the materials and processing technology of the microstructure, the overall reliability of the product is improved while achieving multiple functions such as directional sound emission and touch display in the directional sound-emitting touch display screen.

[0031] 2. The innovative feature of this invention is the addition of a hydrophobic and anti-corrosion layer to both the vibrating and non-vibrating layers. This layer not only serves to fix the microstructure and prevent Z-axis separation between the vibrating and non-vibrating layers, but also effectively achieves waterproofing and shock absorption, improving product reliability. Furthermore, the hydrophobic and anti-corrosion layer is made of low-density porous material, which can effectively reduce the mass of the vibrating layer, thereby increasing its vibration efficiency. The porous material can also eliminate subtle noises caused by uneven vibration, effectively reducing total harmonic distortion.

[0032] 3. Compared with the existing touch layer set in the display screen structure, the present invention innovatively places the touch layer on the cover plate far away from the display screen. Without adding thickening material between the touch layer and the sound layer, it can also ensure a distance of more than 100um between the touch layer and the sound layer, thereby avoiding the generation of interference signals and improving the sound generation efficiency of the vibration layer.

[0033] 4. By adding a hydrophobic and anti-corrosion layer to both the vibrating and non-vibrating layers, the non-AA areas of the vibrating and non-vibrating layers do not require a fully sealed design or hot-pressed waterproof adhesive and side-sealed waterproof adhesive. This avoids problems such as deformation of the vibrating layer, separation of the vibrating and non-vibrating layers, and reduced product reliability caused by the unbalanced air pressure difference between the inside and outside of the product due to the fully sealed design. Furthermore, it simplifies the overall structure and processing technology of the product while ensuring product reliability.

[0034] 5. This invention innovatively uses cover glass or I-line glass as the substrate material for the touch cover layer and the substrate material for the non-vibration layer, and forms microstructures by processing the cover glass or I-line glass and other materials using laser or photolithography. The resulting microstructures have high structural strength, preventing the product from deforming over a long period of time, thus improving reliability and making them suitable for automotive applications where product reliability is a high priority. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of the structure of a directional sound-emitting touch screen (with the vibration layer and non-vibration layer not bonded) in one embodiment of the present invention;

[0036] Figure 2 This is a schematic diagram of the structure of a directional sound-emitting touch display screen (after the vibrating layer and the non-vibrating layer are bonded together) in one embodiment of the present invention;

[0037] Figure 3 This is a schematic flowchart illustrating the manufacturing process of the directional sound-emitting touch display screen of the present invention.

[0038] The attached figures are labeled as follows:

[0039] 1. Vibration layer; 11. Touch cover layer; 111. Third substrate; 112. Upper ITO layer; 113. Lower ITO layer; 12. Display sound layer; 121. Display layer; 1211. Polarizing layer; 1212. Encapsulation layer; 1213. Thin film transistor layer; 122. Sound layer; 1221. First substrate; 1222. First conductive layer; 1223. Insulating layer; 1224. First hydrophobic anti-corrosion layer; 114. Optical layer; 2. Non-vibration layer; 21. Second substrate; 22. Microstructure; 23. Second conductive layer; 24. Second hydrophobic anti-corrosion layer; 4. Air gap; 5. FPC signal line. Detailed Implementation

[0040] The specific embodiments of the present invention will be described in detail below, but it should be understood that the scope of protection of the present invention is not limited to the specific embodiments.

[0041] Unless otherwise expressly stated, throughout the specification and claims, the term "comprising" or its variations such as "including" or "comprising" shall be understood to include the stated elements or components without excluding other elements or other components.

[0042] Combination Figure 1 and Figure 2 As shown, the present invention discloses a directional sound-emitting touch display screen, including a vibrating layer 1 and a non-vibrating layer 2. The non-AA areas of the vibrating layer 1 and the non-vibrating layer 2 are attached together, and an air gap 4 is formed between them for the vibrating layer to vibrate. Under the action of an externally loaded ultrasonic signal, the vibrating layer 1 vibrates back and forth in the direction of approaching or moving away from the non-vibrating layer 2, thereby directional sound emission, and also has a touch display function.

[0043] Specifically, in this embodiment, the vibration layer 1 includes a touch cover layer 11 and a display sound-emitting layer 12. The display sound-emitting layer 12 specifically includes a display layer 121 and a sound-emitting layer 122, with the display layer 121 located between the touch cover layer 11 and the sound-emitting layer 122. In implementation, the touch cover layer 11 can be either a single-layer conductive layer touch scheme or a double-layer conductive layer touch scheme. Specifically, when the touch cover layer 11 is a single-layer conductive layer touch scheme, i.e., only a single-sided ITO conductive pattern design is used, the touch cover layer 11 specifically includes a third substrate 111 and an ITO layer with a conductive pattern, wherein the ITO layer is disposed on the surface of the third substrate 111 near or away from the client. Alternatively, when the touch cover layer is a dual-layer conductive touch solution, the touch cover layer specifically includes a third substrate 111, an upper ITO layer 112 and a lower ITO layer 113, both with conductive patterns. The upper ITO layer 112 and the lower ITO layer 113 are respectively disposed on the upper surface of the third substrate 111 near the client and the lower surface away from the client. Preferably, the third substrate 111 of the present invention is made of cover glass CG, and its thickness is generally between 300um and 500um. It should be noted that existing third substrates 111 are generally made of polyethylene terephthalate (PET), cellulose triacetate (TAC), transparent polyimide (CPI), or ultra-thin flexible glass (UTG). These materials are typically less than 200µm thick. To ensure the material does not creep or shrink during vibration, a certain amount of shear and tensile force needs to be applied to the horizontal and vertical (XY) directions of the vibrating layer. Currently, this force is permanently fixed by adhesive and / or strips at the edges of the vibrating layer 1 and the non-vibrating layer 2. Otherwise, the vibrating layer 1 will experience some creep in high-temperature and high-humidity environments, resulting in poor appearance and functionality. Therefore, this invention innovatively uses cover glass (CG) with a thickness of 300µm or more to achieve the third substrate 111. Because cover glass (CG) has high modulus and low coefficient of thermal expansion (CTE), even without hot-pressing waterproof strips and side-sealing waterproof adhesive at the edges of the vibrating layer 1 and the non-vibrating layer 2, it is possible to ensure that the vibrating layer 1 does not require additional horizontal and vertical (XY) tensile force during bonding. The thickness of the upper ITO layer 112 and the lower ITO layer 113 is preferably between 30µm and 300µm. Therefore, this invention is preferably suitable for automotive applications with high reliability, because automotive applications have lower requirements for the total thickness of the screen, and the thickness of the third substrate 111 of the touch cover layer 11 can be designed to be as thick as 300µm to 500µm. The thicker the material, the higher its processing yield, and the higher the overall mechanical strength of the device. It will not cause wrinkles in the vibration layer, and the vibration unit is more uniform, resulting in higher reliability.Of course, in other alternative embodiments, the third substrate 111 can also be an ultra-thin flexible glass UTG with a thickness of 100um. However, in this embodiment, it is preferable to add a buffer layer (not shown) on the optical layer below. The thickness of the buffer layer can be designed according to the anti-splash function of different scenarios. The thicker the layer, the better the anti-splash effect. In one embodiment, the thickness of the buffer layer is set to 10um~20um.

[0044] In addition, the touch cover layer may also include an optical layer 114, which is located on the outermost layer (i.e., the outermost side closest to the client) and has a thickness generally less than 5µm, such as between 1µm and 5µm. In implementation, it can be a composite layer combining one or more of the following: anti-glare (AG), anti-reflective (AR), and anti-fingerprint (AF). Of course, this layer may or may not be included depending on actual needs. During processing, the optical layer 114 can be formed on the upper surface of the aforementioned upper ITO layer 112 using wet and dry processes.

[0045] The display layer 121 specifically includes a polarizing layer (POL) 1211 with pressure-sensitive adhesive (PSA), an encapsulation layer (TFE) 1212, and a thin-film transistor layer (TFT) 1213. The polarizing layer 1211 is disposed between the touch cover layer 11 and the encapsulation layer 1212. In this embodiment, it is specifically a polarizing layer with pressure-sensitive adhesive on both sides. Ideally, its thickness should be as low as possible, generally less than 80 μm; currently, a minimum thickness of 60 μm with adhesive on both sides is achievable. The thin-film transistor layer 1213 is disposed between the encapsulation layer 1212 and the sound-emitting layer 122. In practice, the thickness of the encapsulation layer 1212 is generally less than or equal to 15 μm, and the thickness of the thin film transistor layer 1213 is generally less than or equal to 10 μm. Both the encapsulation layer 1212 and the thin film transistor layer 1213 are formed by low-temperature (e.g., 100°C to 300°C) chemical vapor deposition (CVD) or physical vapor deposition (PVD) on the first substrate described below. Both can be implemented using existing mature encapsulation layers and thin film transistor layers, which will not be elaborated here.

[0046] The sound-emitting layer 122 specifically includes a first substrate 1221, a first conductive layer 1222, an insulating layer 1223, and a first hydrophobic anti-corrosion layer 1224. The first substrate 1221 is disposed on the surface of the display layer (specifically, the thin film transistor layer of the display layer) 121 away from the client. The first conductive layer 1222 is disposed on the surface of the first substrate 1221 away from the display layer 121. The insulating layer 1223 is disposed on the surface of the first conductive layer 1222 away from the first substrate 1221. The first hydrophobic anti-corrosion layer 1224 is disposed on the surface of the insulating layer 1223 away from the first conductive layer 1222. In practice, the lower the thickness of the first substrate 1221, the better it is to improve the vibration and sound generation efficiency. It is generally set to 15um~25um, preferably 15um, and the material can be polyimide (PI). Of course, glass can also be used, which has the advantages of low process difficulty and a thickness generally higher than 300um. If the first substrate 1221 is glass, the thickness of the third substrate 111 needs to be reduced. The third substrate 111 is preferably made of 100um ultrathin flexible glass UTG, so as to ensure that the overall thickness of the vibration layer 1 is below 600um.

[0047] The thickness of the first conductive layer 1222 is preferably less than 1 μm, and the material is preferably a copper alloy or a silicon steel alloy. A lower sheet resistance results in a higher load power on the sound-generating screen, preferably in the milliohm range, and a low dielectric loss, which can be below 10Ω. Compared with existing ITO materials, copper alloys or silicon steel alloys have the characteristics of high strength, corrosion resistance, and heat resistance, which are beneficial to improving the overall reliability of the vibrating layer. Of course, the material of the first conductive layer 1222 can also be preferably conductive materials such as carbon nanotubes or graphene.

[0048] The insulating layer 1223 is preferably an organic-inorganic composite material with fast heat dissipation, low loss, and a dielectric constant between 2 and 6 at 1MHz. A certain proportion of boron nitride micro-nano particles can be doped into the organic-inorganic composite material. The thickness of the insulating layer 1223 is related to the insulation properties of its material. Generally, under the driving voltage conditions of 300V~500V DC and 150V~200V AC, a material thickness of 6μm or more for the insulating layer 1223 can ensure that the device does not break down.

[0049] It should be noted that in existing solutions, the touch layer is disposed on the display layer 121 (specifically, on the thin-film transistor layer TFT). In this solution, signal interference occurs when the distance between the touch layer and the first conductive layer 1222 of the sound-emitting layer 122 is less than 100µm. To maintain the touch functionality of the display layer 121 without signal interference, existing solutions require the addition of a thickened material and grounding between the surface of the thin-film transistor layer 1213 away from the client and the first conductive layer 1222. However, this thickened material increases the weight of the vibrating layer, thus affecting its sound generation efficiency. Preferably, this invention creatively integrates the touch layer from the display layer 121 onto the third substrate 111. This ensures a distance greater than 100µm between the touch layer and the sound-emitting layer 122 without adding a thickened material, thereby avoiding interference signals and improving the sound generation efficiency of the vibrating layer.

[0050] Preferably, the present invention adds the aforementioned first hydrophobic and anti-corrosion layer 1224 to the sound-generating layer 122. In practice, the first hydrophobic and anti-corrosion layer 1224 is preferably a porous aerogel layer. This is because the porous aerogel layer has a low elastic modulus in the horizontal direction (i.e., the XY direction), ensuring that the vibrating layer 1 and the non-vibrating layer 2 will not shift horizontally in harsh environments after being bonded together. This prevents the non-vibrating layer 2 (especially its microstructure) from separating from the vibrating layer 1 in the Z direction, while also ensuring matching of the coefficient of thermal expansion (CTE) in the XY direction. Furthermore, due to the porous nature of the aerogel material, the waterproof and shock-absorbing function of the first hydrophobic and anti-corrosion layer 1224 can be effectively achieved by adjusting the porosity. To a certain extent, this ensures that the first conductive layer 1222 and the second conductive layer described below are not corroded by moisture, improving device reliability. Moreover, the porous structure can eliminate subtle noises caused by uneven vibration, effectively reducing total harmonic distortion (THD) to a certain extent. The density of the aerogel material can be as low as 22 mg / cm³. 3 Its density is 0.012 times that of the lightest carbon fiber backplate for foldable screens. The low density can effectively reduce the mass of the vibration layer and effectively increase the vibration efficiency.

[0051] Furthermore, during implementation, the porous aerogel layer is preferably formed at least twice during processing. Except for the final forming process, which is non-adhesive, the remaining forming processes are adhesive to fix the embedded microstructure. During processing, each forming process of the porous aerogel layer can employ UV curing, thermosetting, or 3D printing. The temperatures for both UV curing and thermosetting are below 100°C to prevent the display layer from malfunctioning due to excessive temperature. In other alternative embodiments, the porous aerogel layer can also be processed using a low-asset, solvent-free 3D printing device to prevent polarization failure and expansion / contraction caused by contact with acidic or alkaline water. In this embodiment, the porous aerogel layer specifically employs a two-step forming process. In the first forming process, the porous aerogel layer has high adhesiveness, allowing it to bond with the microstructure. After the second forming, the surface of the porous aerogel layer is non-adhesive, ensuring that it will not bond with the second hydrophobic anti-corrosion layer under certain conditions due to contact and will not spring back.

[0052] The non-vibration layer 2 specifically includes a second substrate 21, a microstructure 22, a second conductive layer 23, and a second hydrophobic anti-corrosion layer 24. In practice, the material of the second substrate 21 is preferably cover glass (CG) or I-line glass. If the touch display screen of this invention is used in automotive applications, the second substrate 21 is preferably cover glass or I-line glass with a thickness of 500µm, 1.1mm, or 300µm that has achieved high mass production. Of course, if there is a need for a thinner non-vibration layer 2, ultra-thin flexible glass (UTG) with a thickness between 100µm and 300µm can also be used.

[0053] Compared to existing methods that add microstructures 22 onto the second substrate 21 (i.e., additive methods), the microstructures 22 of this invention are preferably integrally formed onto the second substrate 21 (i.e., subtractive methods). Specifically, the microstructures 22 are formed by processing the surface of the second substrate 21 near the vibration layer 1 using laser and photolithography processes. The pattern of the formed microstructures 22 consists of multiple bumps arranged in an array. That is, the material of the microstructures 22 is the same as the material of the second substrate 21. In this embodiment, the material of the microstructures 22 is cover glass CG or I-line glass. Compared to existing microstructures 22 made of epoxy, polyester, or acrylic materials, the Young's modulus is more than 10 times larger, allowing for long-term deformation resistance and high reliability. In a specific embodiment, when the microstructures 22 are made of I-line glass, this type of glass can be used with a 365nm laser system or photolithography system. Unlike traditional soda-lime glass, this type of glass can utilize its own material to form microstructures through laser and photolithography processes, and the accuracy of the formed microstructures in the Z direction can reach ±1.5µm. Furthermore, since the microstructure 22 is made of cover glass CG or I-line glass, which has high hardness and high Young's modulus, each microstructure 22 (i.e. each protrusion) can be directly designed as a single-point structure with a diameter between 50um and 2mm, or it can be designed as a multi-point structure with a total diameter of less than 2mm.

[0054] The second conductive layer 23 is disposed on the surface of the second substrate 21 excluding the microstructure 22. In practice, its material and thickness can be the same as the first conductive layer 1222, i.e., its thickness is preferably less than 1 μm, its sheet resistance is in the milliohm range, and its dielectric loss is low. The most preferred material is copper alloy or silicon steel alloy, and the next most preferred conductive materials are carbon nanotubes or graphene. Preferably, after the vibrating layer 1 and the non-vibrating layer 2 are bonded together, the distance between the first conductive layer 1222 and the second conductive layer 23 is preferably less than 30 μm. In one specific embodiment, when the distance is 20 μm, the final product requires a combined driving voltage of 160V DC and 200V AC, and the sound pressure level at 1 kHz can reach 73 dB. In another alternative embodiment, when the distance is 30 μm, the final product requires a combined driving voltage of 300V~500V DC and 200V~250V AC to achieve a sound pressure level of 73 dB at 1 kHz.

[0055] Preferably, the present invention also adds a hydrophobic anti-corrosion layer on the non-vibration layer 2, namely the second hydrophobic anti-corrosion layer 24. The second hydrophobic anti-corrosion layer 24 is disposed on the second conductive layer 23. In practice, the lower the thickness of the second hydrophobic anti-corrosion layer 24, the better it is to improve the sound generation efficiency of the device. Preferably, it is less than 1 μm. Its material can be the same as or different from the first hydrophobic anti-corrosion layer 1224. Common waterproof materials are suitable for the present invention, and preferably, they can be processed by vapor deposition, 3D printing or magnetron sputtering. Moreover, the water droplet angle of the second hydrophobic anti-corrosion layer 24 is preferably greater than 105° to prevent the first hydrophobic anti-corrosion layer 1224 and the second hydrophobic anti-corrosion layer 24 from coming into contact without rebounding.

[0056] The microstructure 22 protrudes from the surface of the second hydrophobic anti-corrosion layer 24, and its upper part near the vibration layer 1 is embedded and fixed in the first hydrophobic anti-corrosion layer 1224. The remaining protruding part forms an air gap 4 between the vibration layer 1 and the non-vibration layer 2.

[0057] Furthermore, preferably, because the present invention adds a hydrophobic anti-corrosion layer to both the vibrating layer 1 and the non-vibrating layer 2, and improves the placement of the touch cover layer 11 and the material and process of the microstructure 22, the non-AA areas of the vibrating layer 1 and the non-vibrating layer 2 do not require a fully sealed design or a hot-pressed waterproof adhesive and side-sealed waterproof adhesive design. Preferably, the non-AA areas of the vibrating layer 1 and the non-vibrating layer 2 are bonded together and have at least one vent hole (not shown). In a specific embodiment, the non-AA areas of the vibrating layer 1 and the non-vibrating layer 2 are bonded together using multiple double-sided adhesives, each with a width of 1mm to 4mm and a thickness of less than 30um. This design can avoid the problems caused by the inability to balance the internal and external air pressure difference due to a fully sealed design, which could lead to deformation of the vibrating layer, separation of the vibrating layer and the non-vibrating layer, and reduced product reliability. It also simplifies the overall processing technology of the product while ensuring product reliability.

[0058] In implementation, the total thickness of the vibration layer 1 is between 195um and 660um, the height of the remaining protruding part of the microstructure 22 is between 5um and 10um, and the spacing between two adjacent microstructures 22 is between 4mm and 10mm. Each microstructure 22 is a single-point structure with a diameter between 50um and 2mm or a multi-point structure with a total diameter of less than 2mm. The thickness of the insulating layer 1223 is 6um to 8um, the thickness of the first hydrophobic anti-corrosion layer 1224 is less than 6um, and the distance between the first conductive layer 1222 and the second conductive layer 23 is less than 30um. A screen larger than 10 inches can achieve a sound pressure level of 76dB at 1kHz.

[0059] In specific embodiments, the total thickness of the vibrating layer 1 is 395µm~405µm, specifically 400±5µm; the height of the remaining protruding portion of the microstructure 22 is 6µm and the spacing between two adjacent microstructures 22 is 7.5mm; the thickness of the insulating layer 1223 is 6µm; and the thickness of the first hydrophobic anti-corrosion layer 1224 is 6µm. Alternatively, the total thickness of the vibrating layer 1 is 640µm~660µm, specifically 650±10µm; the height of the remaining protruding portion of the microstructure 22 is 5µm and the spacing between two adjacent microstructures 22 is 8.5mm; the thickness of the insulating layer 1223 is 6µm; and the thickness of the first hydrophobic anti-corrosion layer 1224 is 5µm. In both embodiments, for a screen with a conventional aspect ratio of 12.3 inches, both embodiments can achieve a sound pressure level of 73dB at 1kHz, a total harmonic distortion (THD) of less than 5%, and a load power of less than 5W.

[0060] Alternatively, the total thickness of the vibrating layer 1 is 195µm~205µm, specifically 200±5µm, the height of the remaining protruding portion of the microstructure 22 is 8µm and the spacing between two adjacent microstructures 22 is 4mm, the thickness of the insulating layer 1223 is 6µm, and the thickness of the first hydrophobic anti-corrosion layer 1224 is 6µm; or, the total thickness of the vibrating layer 1 is 250µm~270µm, specifically 260±10µm, the height of the remaining protruding portion of the microstructure 22 is 8µm and the spacing between two adjacent microstructures 22 is 4.3mm, the thickness of the insulating layer 1223 is 6µm, and the thickness of the first hydrophobic anti-corrosion layer 1224 is 6µm. In both embodiments, for a screen with a conventional aspect ratio of 12.3 inches, both embodiments can achieve a sound pressure level of 75dB at 1kHz, a total harmonic distortion (THD) of less than 5%, and a load power of less than 5W.

[0061] Combination Figure 3 As shown, the preparation process of the present invention is as follows:

[0062] S1, Preparing vibration layer 1, including:

[0063] S11, Prepare the touch cover layer 11.

[0064] S11 specifically includes: forming an ITO layer on the surface of the third substrate 111 near and / or away from the client, and patterning the ITO layer. In a specific embodiment, ITO is magnetron sputtered on the surfaces of the cover glass near and away from the client to form an upper ITO layer 112 and a lower ITO layer 113, respectively. The upper ITO layer 112 and the lower ITO layer 113 are then patterned by exposure, development, and etching under yellow light. A metal coating for electrical connection is then deposited on the patterned upper ITO layer 112 and the lower ITO layer 113, and the metal coating is patterned by exposure, development, and etching under yellow light to form a touch cover layer 11 with touch functionality. Preferably, the upper ITO layer 112 near the client can also undergo 3A (anti-glare, anti-reflection, and anti-fingerprint) treatment using wet and dry processes. In other embodiments, the conductive layer on the surface of the third substrate 111 can also be a 3D-printed transparent carbon nanotube layer, followed by laser etching of a pattern on the transparent carbon nanotube layer, and then a 3D-printed metal coating on the surface of the patterned transparent carbon nanotube layer. Finally, a 3A (anti-glare, anti-reflection, and anti-fingerprint) treatment is performed on the end face of the transparent carbon nanotube layer near the client using a 3D printing process. The principles and processes of patterning the ITO layer or transparent carbon nanotube layer and the metal coating, and the 3A treatment, can refer to the existing touch layer processing technology, and will not be elaborated here.

[0065] S12, fabricating the display sound-emitting layer 12 includes: forming a first conductive layer 1222 on the surface of the first substrate 1221 away from the client, forming an insulating layer 1223 on the surface of the first conductive layer 1222 away from the first substrate 1221, and forming a display layer 121 on the surface of the first substrate 1221 close to the client.

[0066] The fabrication process of the display layer 121 specifically includes: forming a thin film transistor layer 1213 with circuitry on the surface of the first substrate 1221 near the client; forming an encapsulation layer 1212 on the surface of the thin film transistor layer 1213 near the client; and bonding the surface of the encapsulation layer 1212 near the client to a polarizer layer 1211 with pressure-sensitive adhesive.

[0067] In one specific embodiment, a first conductive layer 1222 is formed on the surface of the first substrate 1221 away from the client by vapor deposition, 3D printing, or magnetron sputtering. An insulating layer 1223 is formed on the surface of the first conductive layer 1222 away from the first substrate 1221 by 3D printing, vapor deposition, or slot coating. A thin film transistor layer 1213 with circuitry is formed on the surface of the first substrate 1221 near the client by exposure, development, and etching under yellow light. A multilayer encapsulation layer 1212 is deposited at low temperature on the surface of the thin film transistor layer 1213 near the client. Finally, the surface of the encapsulation layer 1212 near the client is bonded to a polarizer layer 1211 with pressure-sensitive adhesive.

[0068] S13, the surface of the touch cover layer 11 away from the client is attached to the surface of the display layer 121 near the client, and a first hydrophobic and anti-corrosion layer 1224 is formed on the surface of the insulating layer 1223 away from the client.

[0069] In one specific embodiment, the lower ITO layer 113 of the touch cover plate layer 11 is bonded to the surface of the polarizer layer 1211 near the client. After bonding, a degassing treatment is performed. Finally, a porous aerogel layer is formed on the surface of the insulating layer 1223 away from the client through 3D printing, vapor deposition, or slot coating. The porous aerogel layer is cured twice. In the first curing process, UV curing is used, and the curing energy is controlled within 4000mJ to prevent multilayer shrinkage and yellowing due to heat.

[0070] S2, fabricating the non-vibration layer 2 includes: integrally forming a microstructure 22 on the surface of the second substrate 21 near the client, forming a second conductive layer 23 on the surface of the second substrate 21 near the client and other than the microstructure 22, forming a second hydrophobic anti-corrosion layer 24 on the surface of the second conductive layer 23 near the client, and binding an FPC signal line 5 electrically connected to the second conductive layer 23 in the non-AA area of ​​the non-vibration layer 2.

[0071] In one specific implementation, a microstructure 22 is laser-etched on the surface of the second substrate 21 near the client. Preferably, in order to prevent a conductive layer on the surface of the microstructure 22, a hydrolyzable process protection layer (not shown) is 3D-printed on the surface of the microstructure 22 before the formation of the second conductive layer 23. Then, the second conductive layer 23 is formed on the surface of the second substrate 21 near the client by vapor deposition, 3D printing or magnetron sputtering. After that, the process protection layer is hydrolyzed, and a second hydrophobic anti-corrosion layer 24 is formed on the surface of the second conductive layer 23 near the client by vapor deposition or 3D printing. The FPC (flexible circuit board) signal line 5, which is electrically connected to the second conductive layer 23, is bound in the non-AA area of ​​the non-vibration layer 2.

[0072] S3, the non-AA area of ​​the vibrating layer 1 and the non-vibrating layer 2 are bonded together, the upper part of the microstructure 22 near the vibrating layer 1 is embedded in the first hydrophobic anti-corrosion layer 1224, a DC bias voltage is applied between the first conductive layer 1222 and the second conductive layer 23, and the first hydrophobic anti-corrosion layer 1224 is cured.

[0073] In one specific embodiment, the vibrating layer 1 and the non-AA region of the non-vibrating layer 2 are bonded together. The upper portion of the microstructure 22 near the vibrating layer 1 is embedded in the first hydrophobic anti-corrosion layer 1224. A DC bias voltage of 200V~400V is applied between the first conductive layer 1222 and the second conductive layer 23, and the first hydrophobic anti-corrosion layer 1224 is UV-cured or thermally cured. Finally, the finished product is subjected to acoustic, electrical, and aging tests.

[0074] In addition, the design of the structure, materials and processing technology of the above layers can be referred to the description in the above directional sound-emitting touch display screen, and will not be repeated here.

[0075] The advantages of this invention are as follows: 1. This invention provides a novel directional sound-emitting screen integrated under a touch display screen, forming a novel directional sound-emitting touch display screen that combines a directional sound-emitting screen with a touch display screen. By combining and improving the structure, materials, processing technology, and distribution position of the sound-emitting and non-vibrating layers of the vibrating layer, as well as the innovative design of the materials and processing technology of the microstructure, the overall reliability of the product is improved while realizing the multi-functionality of the directional sound-emitting touch display screen, such as directional sound emission and touch display. 2. This invention innovatively adds a hydrophobic anti-corrosion layer to both the vibrating and non-vibrating layers. This layer can not only fix the microstructure to prevent the vibrating and non-vibrating layers from separating in the Z-direction, but also effectively achieve waterproof and shock-absorbing functions, improving product reliability. Moreover, the hydrophobic anti-corrosion layer uses a low-density porous material, which can effectively reduce the mass of the vibrating layer, thereby increasing the vibration efficiency of the vibrating layer. Furthermore, the porous material can eliminate the subtle noise caused by uneven vibration, effectively reducing total harmonic distortion. 3. Compared to existing touch layers located within the display screen structure, this invention innovatively places the touch layer on the cover plate, away from the display screen. Without adding thicker material between the touch layer and the sound-emitting layer, it maintains a distance greater than 100µm between them, thus avoiding interference signals and improving the sound generation efficiency of the vibrating layer. 4. By adding a hydrophobic and anti-corrosion layer to both the vibrating and non-vibrating layers, this invention eliminates the need for a fully sealed design in the non-AA areas of both layers, as well as the need for hot-pressed waterproof adhesive and side-sealing waterproof adhesive. This avoids the problems caused by an unbalanced internal and external air pressure difference due to a fully sealed design, which can lead to deformation of the vibrating layer, separation of the vibrating and non-vibrating layers, and reduced product reliability. Furthermore, it simplifies the overall structure and processing technology of the product while ensuring product reliability. 5. This invention innovatively uses cover glass or I-line glass as the substrate material for the touch cover layer and the substrate material for the non-vibration layer, and forms microstructures by processing the cover glass or I-line glass and other materials using laser or photolithography. The resulting microstructures have high structural strength, preventing the product from deforming over a long period of time, thus improving reliability and making them suitable for automotive applications where product reliability is a high priority.

[0076] The foregoing description of specific exemplary embodiments of the invention is for illustrative and explanatory purposes. These descriptions are not intended to limit the invention to the precise forms disclosed, and it will be apparent that many changes and variations can be made in accordance with the foregoing teachings. The exemplary embodiments were chosen and described in order to explain the specific principles of the invention and its practical application, thereby enabling those skilled in the art to implement and utilize various different exemplary embodiments of the invention, as well as various different choices and variations. The scope of the invention is intended to be defined by the claims and their equivalents.

Claims

1. A directional sound emitting touch display, characterized in that, The application relates to a directional sound emitting touch display screen, which comprises a vibration layer and a non-vibration layer. The vibration layer comprises a touch cover plate layer and a display sound emitting layer, the display sound emitting layer comprises a display layer and a sound emitting layer, the display layer is located between the touch cover plate layer and the sound emitting layer, the sound emitting layer comprises a first substrate, a first conductive layer, an insulating layer and a first hydrophobic corrosion resistant layer, the first substrate is arranged on the surface of the display layer away from the client, the first conductive layer is arranged on the surface of the first substrate away from the display layer, the insulating layer is arranged on the surface of the first conductive layer away from the first substrate, and the first hydrophobic corrosion resistant layer is arranged on the surface of the insulating layer away from the first conductive layer. The non-vibration layer comprises a second substrate, a microstructure, a second conductive layer and a second hydrophobic corrosion resistant layer, the microstructure is integrally formed on the second substrate and is an array of convex points, the second conductive layer is arranged on the surface of the second substrate except the microstructure, the second hydrophobic corrosion resistant layer is arranged on the second conductive layer, the microstructure protrudes from the surface of the second hydrophobic corrosion resistant layer, and the upper end part of the microstructure close to the vibration layer is embedded and fixed in the first hydrophobic corrosion resistant layer, and the remaining protruding part forms an air gap between the vibration layer and the non-vibration layer. The vibration layer vibrates up and down under the action of an externally applied driving voltage to emit directional sound.

2. The directional sound emitting touch display screen of claim 1, wherein, The first hydrophobic anticorrosion layer is a porous aerogel layer, and / or the density of the porous aerogel layer is at least 22 mg / cm 3 , and / or the porous aerogel layer is shaped at least twice, and is non-sticky in the last shaping process, and is sticky in the remaining shaping processes to fix the embedded microstructure; and / or each shaping process of the porous aerogel layer is UV curing shaping or thermal curing shaping or 3D printing shaping, and the temperature of the UV curing shaping and the thermal curing shaping is lower than 100°. Alternatively, the first hydrophobic corrosion resistant layer comprises a thermoplastic polyurethane rubber layer and a waterproof layer, the thermoplastic polyurethane rubber layer is arranged on the surface of the insulating layer away from the first conductive layer, and the waterproof layer is arranged on the surface of the thermoplastic polyurethane rubber layer away from the insulating layer.

3. The directional sound emitting touch display screen of claim 1, wherein, The microstructure is formed by laser and photoetching processes on the surface of the second substrate close to the vibration layer; and / or the second substrate is a cover plate glass or I-line glass with a thickness of 300um-1.1mm or an ultrathin glass (UTG) with a thickness of 100um-300um; and / or the third substrate is a cover plate glass.

4. The directional sound emitting touch display screen according to claim 1, wherein the touch cover plate layer comprises a third substrate and an ITO layer with a conductive pattern, and the ITO layer is arranged on the surface of the third substrate close to or away from the client. Alternatively, the touch cover plate layer comprises a third substrate, an upper ITO layer and a lower ITO layer both with a conductive pattern, and the upper ITO layer and the lower ITO layer are arranged on the upper surface of the third substrate close to the client and on the lower surface of the third substrate away from the client respectively. ​ 5. The directional sound emitting touch display screen of claim 1, wherein, The non-AA area of the vibration layer and the non-vibration layer is attached, and the non-AA area is provided with at least one air hole; and / or, the square resistance of the first conductive layer is lower than 10 Ω, and the thickness is nanoscale; and / or, the insulating layer adopts an organic-inorganic composite material with a dielectric constant between 2 and 6 at 1 MHz, and the organic-inorganic composite material is doped with boron nitride micro-nano particles; and / or, the first conductive layer and the second conductive layer are steel alloy conductive layers, silicon steel alloy conductive layers, carbon nanotube conductive layers or graphene conductive layers; and / or, after the vibration layer and the non-vibration layer are attached at the frame, the distance between the first conductive layer and the second conductive layer is less than 30 um.

6. The directional sound emitting touch display screen of claim 1, wherein, The display layer comprises a polarizing sheet layer with pressure-sensitive adhesive, an encapsulation layer and a thin film transistor layer, the polarizing sheet layer is arranged between the touch cover layer and the encapsulation layer, and the thin film transistor layer is arranged between the encapsulation layer and the sound emitting layer.

7. The directional sound emitting touch display screen of claim 6, wherein, The encapsulation layer and the thin film transistor layer are formed by low-temperature chemical or physical vapor deposition on the first substrate.

8. The directional sound emitting touch display screen of claim 1, wherein, The touch cover layer further comprises an optical layer, the thickness of the optical layer is less than 5 um, and the optical layer is one or a composite layer of more than two of anti-glare, anti-reflection and anti-fingerprint; and / or, the thickness of the second conductive layer is less than 1 um; and / or, the thickness of the second hydrophobic corrosion-resistant layer is less than 1 um, and the water drop angle is greater than 105°; and / or, the directional sound emitting touch display screen is used for vehicle.

9. The directional sound emitting touch display screen according to any one of claims 1-8, wherein, The total thickness of the vibration layer is between 195 um and 660 um, the height of the remaining convex part of the microstructure is between 5 um and 10 um, the distance between adjacent two microstructures is between 4 mm and 10 mm, each microstructure is a single point structure with a diameter of 50 um to 2 mm or a multi-point structure with a total diameter of less than 2 mm, the thickness of the insulating layer is 6 um to 8 um, the thickness of the first hydrophobic corrosion-resistant layer is less than 6 um, and the distance between the first conductive layer and the second conductive layer is less than 30 um.

10. A process for preparing a directional sound emitting touch display screen, characterized in that, The process comprises: S1, preparing a vibration layer, comprising: S11, preparing a touch cover layer; S12, preparing a display and sound emitting layer, comprising: forming a first conductive layer on the surface of a first substrate away from the client, forming an insulating layer on the surface of the first conductive layer away from the first substrate, and forming a display layer on the surface of the first substrate close to the client; S13, attaching the surface of the touch cover layer in S11 away from the client to the surface of the display layer in S12 close to the client, and forming a first hydrophobic corrosion-resistant layer on the surface of the insulating layer away from the client; S2, preparing a non-vibration layer, comprising: integrally forming a microstructure on the surface of a second substrate close to the client, forming a second conductive layer on the surface of the second substrate close to the client except the microstructure, forming a second hydrophobic corrosion-resistant layer on the surface of the second conductive layer close to the client, and binding an FPC signal line electrically connected to the second conductive layer in the non-AA area of the non-vibration layer; S3, the vibration layer is attached to the non-AA area of the non-vibration layer, the microstructure near the upper end of the vibration layer is embedded in the first hydrophobic anticorrosive layer, a direct current bias voltage is passed between the first conductive layer and the second conductive layer, and the first hydrophobic anticorrosive layer is cured.

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