Printing method and electronic device
By acquiring product and quality impact parameters during the solder paste printing process, a pre-built impact relationship model is used to quickly identify the causes of defects. Problems and suggestions are displayed through a human-computer interaction interface, which solves the subjectivity and inefficiency of traditional manual analysis and improves the production efficiency of solder paste printing and the accuracy of defect cause identification.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- INSPUR SUZHOU INTELLIGENT TECH CO LTD
- Filing Date
- 2026-02-02
- Publication Date
- 2026-06-12
AI Technical Summary
Solder paste printing defect analysis mainly relies on manual experience and comparison with discrete data, which makes it difficult to pinpoint the cause of defects, leads to repeated occurrences of defects, and reduces the production efficiency of solder paste printing.
By acquiring product parameters and quality impact parameters during the solder paste printing process, and utilizing a pre-built impact relationship model, the causes of defects can be quickly and accurately identified. The defects, target impact factors, impact degree, and pre-operation suggestions are displayed through a human-computer interaction interface.
It improved the production efficiency of solder paste printing, significantly enhanced the accuracy and timeliness of defect identification, reduced the occurrence of recurring defects, and ensured the efficient and stable operation of the SMT production line.
Smart Images

Figure CN121614510B_ABST