Wafer storage and transmission systems, wafer fabrication process systems, methods, and computer-readable storage media

Abstract

This invention provides a wafer storage and transfer system, a wafer fabrication process system, a method, and a computer-readable storage medium. The wafer storage and transfer system includes: a frame with a receiving space; one or more shelves connected to the frame for storing wafer cassettes, the wafer cassettes accommodating wafers; each shelf includes one or more switches that can be triggered when a wafer cassette is placed on the shelf; each shelf includes a first vacuum chuck and a second vacuum chuck, which can respectively conform to the inlet and outlet of the wafer cassette; the first vacuum chuck is connected to an inlet pipe, and the second vacuum chuck is connected to an outlet pipe; a master controller is connected to the switches, and when the switches are triggered, the master controller is configured to control the opening of the inlet pipe to inject nitrogen gas into the wafer cassette through the inlet via the first vacuum chuck; the gas inside the wafer cassette can be discharged through the outlet. This invention enables the storage, transfer, cleaning, low-oxygen, and controlled storage of wafers within a wafer cassette.

Description

Technical Field

[0001] This invention relates generally to the field of semiconductor technology, and more particularly to a wafer storage and transmission system, a wafer manufacturing process system, a method, and a computer-readable storage medium. Background Technology

[0002] Throughout the various process flows of a wafer, surface cleanliness and controlled oxygen levels are among the core factors for chip performance, yield, and reliability. Any minute particulate contaminants or uncontrolled oxygen exposure can lead to decreased chip yield, reduced performance, or even scrap. Improving wafer cleanliness at each process stage is a common challenge for the semiconductor equipment industry.

[0003] Traditional wafer storage and transmission systems are limited to basic functions such as storing and transmitting wafer cassettes. Therefore, how to achieve clean and low-oxygen control of wafers within the wafer cassette is a technical problem that this invention aims to solve.

[0004] The content of the background section is merely the technology known to the inventor and does not necessarily represent the prior art in this field. Summary of the Invention

[0005] In view of one or more of the problems existing in the prior art, the present invention provides a wafer storage and transmission system, a wafer manufacturing process system, a method, and a computer-readable storage medium, which can realize the storage, transmission, cleaning, low oxygen, and control of wafers in a wafer cassette.

[0006] According to a first aspect of the present invention, a wafer storage and transfer system is provided. The wafer storage and transfer system includes: a frame including a receiving space; one or more shelves connected to the frame for storing a wafer cassette, the wafer cassette accommodating the wafer; each shelf including one or more switches triggerable when the wafer cassette is placed on the shelf; each shelf including a first vacuum chuck and a second vacuum chuck, the first and second vacuum chucks respectively conforming to an air inlet and an air outlet of the wafer cassette; the first vacuum chuck connected to an air inlet conduit, the second vacuum chuck connected to an air outlet conduit; and a master controller connected to the switches, wherein when the switches are triggered, the master controller is configured to control the air inlet conduit to open, so as to inject nitrogen gas into the wafer cassette through the first vacuum chuck via the air inlet; the gas inside the wafer cassette can be discharged through the air outlet.

[0007] Optionally, the wafer storage and transmission system further includes a front stage conveying module connected to the main controller, the front stage conveying module including a stage capable of carrying the wafer cassette; the stage includes a switch that can be triggered when the wafer cassette is placed on the stage.

[0008] Optionally, the wafer storage and transmission system further includes a gate assembly connected to the main controller. The gate assembly includes multiple channels, and the main controller is configured to control the opening or closing of the channels based on the switching of the stage, so as to control the wafer cassette to enter and exit the wafer storage and transmission system.

[0009] Optionally, the wafer storage and transmission system further includes a robotic arm connected to the main controller. The robotic arm includes a picking module configured to pick up wafer cassettes on the stage and place them on an empty shelf.

[0010] Optionally, the shelf includes an opening, which is generally C-shaped, and the pickup module is configured to move up and down through the opening.

[0011] Optionally, the robotic arm also includes an R-axis, which is arranged vertically.

[0012] Optionally, the first vacuum suction cup and the second vacuum suction cup are respectively connected to the air inlet pipe and the air outlet pipe via L-shaped quick-connect plugs.

[0013] Optionally, the intake line includes a flow meter connected to the main controller, the flow meter being configured to monitor and control the flow rate of the nitrogen.

[0014] Optionally, the flow meter is configured to first inflate the wafer cell based on a first flow rate, and then inflate the wafer cell based on a second flow rate, wherein the first flow rate is greater than the second flow rate.

[0015] Optionally, the wafer storage and transmission system further includes a front-opening interface mechanical standard unit connected to the main controller. The pickup module is configured to pick up the wafer cassette on the shelf and place it on the platform of the front-opening interface mechanical standard unit. The front-opening interface mechanical standard unit is configured to open the door of the wafer cassette to expose the wafer inside the wafer cassette to the vertical furnace.

[0016] Optionally, the wafer storage and transmission system further includes a fan filter unit located at the top of the frame, the fan filter unit being configured to blow filtered air into the frame; the frame includes a cutout portion, the cutout portion being configured to discharge air from the frame and particulate matter mixed in the air through the cutout portion.

[0017] A second aspect of the present invention provides a wafer fabrication process system. The wafer fabrication process system includes: a wafer storage and transport system as described above; a fab crane system connected to the wafer storage and transport system and configured to transport wafer cassettes to the wafer storage and transport system; and a vertical furnace connected to the wafer storage and transport system and configured to remove wafers from the wafer storage and transport system for processing; return the processed wafers to the wafer storage and transport system; and the wafer storage and transport system is further configured to output the wafers returned from the vertical furnace to the fab crane system.

[0018] A third aspect of the present invention provides a method performed by the wafer storage and transmission system described above. The method includes: determining whether a wafer cassette is placed on the shelf based on whether a switch on the shelf is triggered; when the switch is triggered, controlling the opening of an inlet pipe to inject nitrogen gas into the wafer cassette through a first vacuum chuck via the inlet, thereby discharging gas inside the wafer cassette through the outlet.

[0019] A fourth aspect of the present invention provides a computer-readable storage medium. The computer-readable storage medium includes computer-executable instructions stored thereon, which, when executed by a processor, perform the method described above.

[0020] The wafer storage and transmission system, wafer manufacturing process system, and method of the present invention can achieve efficient and safe storage, transmission, cleanliness, low oxygen, and control of wafers in a wafer cassette, which helps to improve the yield and reliability of wafer and chip production, and the overall size of the machine is small. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the following description of the embodiments will be provided as examples. The drawings described below are merely embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort. The drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation of the present invention.

[0022] Figure 1 A perspective schematic diagram of a wafer storage and transmission system according to some embodiments of the present invention is shown.

[0023] Figure 2 A side view schematic diagram of a wafer storage and transmission system according to some embodiments of the present invention is shown.

[0024] Figure 3 A partial schematic diagram of a wafer storage and transmission system according to some embodiments of the present invention is shown.

[0025] Figure 4 A schematic diagram of the structure of a layer plate according to some embodiments of the present invention is shown.

[0026] Figure 5 A partial structural schematic diagram of a layer plate according to some embodiments of the present invention is shown.

[0027] Figure 6 A schematic diagram of the gas path principle is shown according to some embodiments of the present invention.

[0028] Figure 7 A schematic diagram of the structure of a front platform conveyor module according to some embodiments of the present invention is shown.

[0029] Figure 8 A schematic diagram of the structure of a gate assembly according to some embodiments of the present invention is shown.

[0030] Figure 9 A schematic diagram of the structure of a robotic arm according to some embodiments of the present invention is shown.

[0031] Figure 10 A schematic diagram of the traditional R-axis arrangement is shown.

[0032] Figure 11 A schematic diagram showing the R-axis arrangement according to some embodiments of the present invention is provided.

[0033] Figure 12 A perspective view of a pickup module moving up and down through an opening, according to some embodiments of the present invention, is shown.

[0034] Figure 13 A top view schematic diagram of the lifting and lowering movement of a pickup module through an opening, according to some embodiments of the present invention.

[0035] Figure 14 A schematic diagram of a human-computer interaction system according to some embodiments of the present invention is shown.

[0036] Figure 15 A schematic diagram of a wafer fabrication process system according to some embodiments of the present invention is shown.

[0037] Figure 16 A flowchart illustrating a method performed by a wafer storage and transmission system according to some embodiments of the present invention is shown. Detailed Implementation

[0038] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of the invention. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0039] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0040] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "coupling" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows for communication; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0041] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0042] The following provides many different embodiments or examples for implementing various structures of the invention. To simplify the invention, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0043] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0044] This invention provides a wafer storage and transfer system. The wafer storage and transfer system includes a frame, one or more shelves, and a central controller. The frame includes a receiving space. One or more shelves are connected to the frame and can store wafer cassettes. The wafer cassettes can hold wafers. Each shelf includes one or more switches. The switches can be triggered when a wafer cassette is placed on a shelf. Each shelf includes a first vacuum chuck and a second vacuum chuck. The first and second vacuum chucks can respectively conform to the gas inlet and gas outlet of the wafer cassette. The first vacuum chuck is connected to an inlet pipe. The second vacuum chuck is connected to an outlet pipe. The central controller is connected to the switches. When the switches are triggered, the central controller is configured to control the opening of the inlet pipe to inject nitrogen gas into the wafer cassette through the first vacuum chuck and the inlet; the gas inside the wafer cassette can be discharged through the outlet. This wafer storage and transfer system can achieve storage, transfer, cleaning, low-oxygen, and control of wafers within a wafer cassette.

[0045] Figure 1 A perspective schematic diagram of a wafer storage and transmission system according to some embodiments of the present invention is shown. Figure 2 A side view schematic diagram of a wafer storage and transmission system according to some embodiments of the present invention is shown. Figure 3 A partial schematic diagram of a wafer storage and transmission system according to some embodiments of the present invention is shown. Figure 4 A schematic diagram of the structure of a layer plate according to some embodiments of the present invention is shown. Figure 5 A partial structural schematic diagram of a layer plate according to some embodiments of the present invention is shown. Figure 6 A schematic diagram of the gas path principle according to some embodiments of the present invention is shown. Refer to the following first... Figure 1-6 Let me introduce it.

[0046] like Figure 1-6As shown, the wafer storage and transfer system 10 includes a frame 1, one or more shelves 2, and a main controller 3. The frame 1 includes a receiving space. The shelves 2 are connected to the frame 1. The shelves 2 and the frame 1 are connected by screws. The shelves 2 are storage platforms for wafer pods (FOUPs), which can store wafer pods. The wafer pods (FOUPs) can hold wafers. The shelves 2 include one or more switches 21. The switches 21 can be triggered when the wafer pods (FOUPs) are placed on the shelves 2. The shelves 2 include a first vacuum chuck 22-1 and a second vacuum chuck 22-2. The first vacuum chuck 22-1 and the second vacuum chuck 22-2 can respectively conform to the air inlet (in) and air outlet (out) of the wafer pods (FOUPs). The first vacuum chuck 22-1 is connected to the air inlet line (Lin). The second vacuum chuck 22-2 is connected to the air outlet line (Lout). The main controller 3 is connected to the switches 21. When switch 21 is triggered, the main controller 3 can control the opening of the air inlet pipe to inject nitrogen (N2) into the wafer pod FOUP through the first vacuum chuck 22-1 and the air inlet. The gas inside the wafer pod FOUP can be discharged through the air outlet.

[0047] In some embodiments, the main controller 3 may include a control circuit, a central processing unit (CPU), a microcontroller unit (MCU), a digital signal processor (DSP), a graphics processing unit (GPU), an accelerator, a neural processing unit (NPU), a tensor processing unit (TPU), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, gate devices, or transistor logic devices, or similar devices.

[0048] In some embodiments, the wafer storage and transmission system 10 may further include a memory coupled to the main controller 3. The memory may store information such as system operating status and program instructions. In some embodiments, the memory may include random access memory (RAM) or non-volatile memory (NVM). Further, the memory may include at least one of phase-change random access memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), read-only memory (ROM), and electrically erasable programmable read-only memory (EEPROM).

[0049] In some embodiments, one layer 2 can form a storage location for storing one wafer foyer FOUP. In some embodiments, the number of layers 2 can be an even number. For example, 18 layers 2 are arranged with 5 layers at the front and 4 layers at the back, with 2 layers per layer, forming a total of 18 storage locations that can store 18 wafer foyer FOUPs. It should be noted that the present invention does not limit the specific number of layers 2. In some embodiments, the number of layers 2 can be other even numbers, such as 16, 20, 22, 24, 26, etc. In some embodiments, the number of layers 2 can be an odd number. Furthermore, the present invention does not limit the arrangement of layers 2. In practical applications, the number of front layers, the number of back layers, and the number of layers per layer can be adjusted according to requirements.

[0050] In some embodiments, the shelf 2 includes a switch 21, a first vacuum suction cup 22-1, a second vacuum suction cup 22-2, a positioning pin 23, a bracket 24, a FOUP shelf 25, screws 26, a suction cup mounting base 27, and a quick-connect connector 28. The switch 21 may include a micro switch. There may be multiple switches 21. The quick-connect connector 28 may include an L-shaped quick-connect plug. The first vacuum suction cup 22-1 and the second vacuum suction cup 22-2 are respectively connected to the air inlet and outlet pipes via the L-shaped quick-connect connector 28, allowing the air pipes to be arranged horizontally, minimizing encroachment on vertical space.

[0051] In some embodiments, when the wafer foup is placed into shelf 2, the first vacuum chuck 22-1 and the second vacuum chuck 22-2 are in contact with the air inlet (in) and exhaust outlet (out) at the bottom of the wafer foup. The wafer foup presses down switch 21, triggering switch 21. The main controller 3 is connected to switch 21 and detects the triggering state of switch 21 in real time, identifying whether the wafer foup has been placed into shelf 2 based on the triggering state. For example, if the main controller 3 detects the trigger signal of switch 21 (triggered), it identifies that the wafer foup has been placed into shelf 2. Alternatively, if the main controller 3 does not detect the trigger signal of switch 21 (not triggered), it identifies that the wafer foup has not been placed into shelf 2. The reverse is also possible. In some embodiments, the main controller 3 can combine an image sensor and switch 21 to identify whether the wafer foup has been placed into shelf 2.

[0052] In some embodiments, the shelf 2 can inject high-purity nitrogen into the wafer foyer storage unit (FOUP) stored thereon, filling and expelling internal gases to achieve cleanliness, low oxygen levels, and humidity control inside the FOUP. For example, the shelf 2 first performs a large-flow filling and venting process into the wafer foyer storage unit, replacing the internal gas and expelling any existing oxygen and particulate matter. Then, a small-flow filling and venting process is performed, ensuring the internal pressure of the wafer foyer storage unit is slightly higher than the external pressure, preventing external oxygen and particulate matter from entering and contaminating the FOUP.

[0053] In some embodiments, refer to Figure 6 The intake piping includes a flow meter connected to the main controller 3. The flow meter monitors and controls the flow rate of nitrogen (N2). By converting the gas flow state into a readable signal, the gas flow meter enables real-time measurement and precise control of the gas flow rate, ensuring stable system operation. For example, the flow meter first fills the wafer pod FOUP with gas based on a first flow rate, and then fills the wafer pod FOUP with gas based on a second flow rate. The first flow rate is greater than the second flow rate.

[0054] In some embodiments, the gas flow meter may include a mass flow controller (MFC). MFC offers fast response, high accuracy, and low power consumption, supporting real-time gas flow monitoring, rapid adjustment, and data communication. For example, the gas flow meter can communicate flow data to the main controller 3 in real time, allowing the main controller 3 to monitor the gas flow status.

[0055] In some embodiments, the gas flow meter may include a differential pressure gas flow meter, a velocity gas flow meter, a thermal gas flow meter, a volumetric gas flow meter, etc. A differential pressure gas flow meter calculates the flow rate based on the pressure difference before and after a throttling device (e.g., an orifice plate flow meter). A velocity gas flow meter utilizes the relationship between flow velocity and flow rate (e.g., a turbine flow meter). A thermal gas flow meter calculates the flow rate based on the gas cooling effect (e.g., a hot-wire anemometer). A volumetric gas flow meter can measure the gas volume per unit time (e.g., an elliptical gear flow meter). It should be noted that this invention does not limit the specific type of gas flow meter; in practical applications, a suitable flow meter can be selected according to requirements.

[0056] In some embodiments, refer to Figure 6 The intake piping also includes a main valve, a filter, and branch valves. For example, the main valve includes, but is not limited to, electric valves and pneumatic valves, which can communicate with and be controlled by the main controller 3 to open or close. Similarly, branch valves include, but are not limited to, pneumatic diaphragm valves and electric diaphragm valves, which can communicate with and be controlled by the main controller 3 to open or close.

[0057] In some embodiments, the high-purity nitrogen (N2) used for inflation can be supplied by the fab plant. The flow rate, opening and closing, and quality of the inflation are controlled via valves, filters, flow meters, pneumatic diaphragm valves, and filters. High-purity nitrogen (N2) is injected into the wafer pod FOUP through the inlet (in) of the first vacuum chuck 22-1. Exhaust gas inside the wafer pod FOUP is discharged through the outlet (out) and discharged into the fab plant's exhaust gas pipeline via the outlet pipe (exhaust gas pipe) through the second vacuum chuck 22-2 for exhaust gas recovery. It should be noted that... Figure 6 The air path shown is merely an illustrative example, and the present invention is not limited thereto. In practical applications, the location, quantity, and selection of each component of the intake pipe can be adjusted according to requirements.

[0058] Traditional wafer storage and transmission systems are limited to basic functions such as storing and transmitting wafer cassettes. Unlike traditional solutions, this invention enables effective clean and low-oxygen control within the wafer cassette, contributing to improved wafer and chip yield, performance, and reliability.

[0059] In some embodiments, such as Figure 1 , 2 As shown, the wafer storage and transmission system 10 also includes a front stage transfer module 4 connected to the main controller 3. In some embodiments, the front stage transfer module 4 can be connected to the frame 1 by screws. The front stage transfer module 4 can be used to receive wafer pods (FOUPs) transported from the Fab crane system and transfer the wafer pods (FOUPs) into the wafer storage and transmission system 10.

[0060] Figure 7 A schematic diagram of a front stage transfer module according to some embodiments of the present invention is shown. The front stage transfer module 4 includes a stage 41 capable of carrying a wafer pod FOUP. The front stage transfer module 4 includes multiple channels, one stage 41 per channel, supporting multi-channel entry and exit of the wafer pod FOUP into and out of the wafer storage and transfer system 10, improving machine operating efficiency. In some embodiments, reference is made to… Figure 7 The front stage conveyor module 4 includes a dual-channel stage 41, supporting dual-channel entry and exit of the wafer pod FOUP, thus improving operating efficiency. This invention is not limited to this; the front stage conveyor module 4 may also include a three-channel stage, a four-channel stage, or any other channel stage, depending on actual requirements.

[0061] In some embodiments, stage 41 includes a switch 410. Switch 410 can be triggered when a wafer foyer FOUP is placed on stage 41. Switch 410 may include a microswitch. The main controller 3 is connected to switch 410 and detects the trigger state of switch 410 in real time, identifying whether the wafer foyer FOUP has been placed on stage 41 based on the trigger state. This is the same as or similar to the main controller 3 detecting the trigger state of switch 21 in real time and identifying whether the wafer foyer FOUP has been placed on shelf 2 based on the trigger state. The front stage conveyor module 4 also includes a linear guide rail 42, a linear drive module 43, a base 44, and a positioning pin 45. The positioning pin 45 is used to position the wafer foyer FOUP precisely so that the main controller 3 can accurately sense whether the wafer foyer FOUP is placed on stage 41. When the wafer foup is placed on the stage 41, the switch 410 is triggered, and the main controller 3 controls the linear drive module 43 to start, driving the stage 41 to reciprocate along the linear guide rail 42, transporting the stage 41 together with the wafer foup on it to the inside of the wafer storage and transmission system 10.

[0062] In some embodiments, such as Figure 1 , 2 As shown, the wafer storage and transmission system 10 also includes a gate assembly 5 connected to the main controller 3. In some embodiments, the gate assembly 5 may be connected to the frame 1 by screws. Figure 8 A schematic diagram of the structure of a gate assembly 5 according to some embodiments of the present invention is shown. Figure 8 As shown, the gate assembly 5 is the entrance / exit for the wafer pod FOUP entering and exiting the wafer storage and transmission system 10, used for opening and closing control of the entrance / exit. The gate assembly 5 includes multiple channels. The number of channels in the gate assembly 5 corresponds to the number of channels in the front stage conveyor module 4. In some embodiments, both the front stage conveyor module 4 and the gate assembly 5 are dual-channel designs. The invention is not limited to this; the multiple channels can also be three channels, four channels, or any other type, depending on the actual requirements.

[0063] In some embodiments, the main controller 3 can control the opening or closing of the channel of the gate assembly 5 based on the switch 410 of the stage 41 to control the entry and exit of the wafer pod FOUP into and out of the wafer storage and transmission system 10. For example, when the switch 410 is triggered, the main controller 3 detects that the wafer pod FOUP is placed in the stage 41 and controls the channel of the gate assembly 5 to open, thereby controlling the entry and exit of the wafer pod FOUP into and out of the wafer storage and transmission system 10. For example, the main controller 3 can monitor the status of the wafer pod FOUP entering and exiting the wafer storage and transmission system 10. When it is detected that the wafer pod FOUP has successfully entered or exited the wafer storage and transmission system 10, the main controller 3 controls the channel of the gate assembly 5 to close. For example, when the switch 410 is not triggered, the main controller 3 detects that the wafer pod FOUP is not placed in the stage 41 and controls the gate assembly 5 to remain closed.

[0064] In some embodiments, such as Figure 8 As shown, the gate assembly 5 includes a cylinder 51, a mounting plate 52, a buffer 53, a guide shaft 54, and a door plate 55. The main controller 3 can control the cylinder 51 to move linearly to control the opening or closing of the channel of the gate assembly 5. For example, when switch 410 is triggered, the main controller 3 controls the cylinder 51 to move linearly in a first direction, pulling up the door plate 55 of the corresponding channel of the gate assembly 5. At this time, the channel is open, the entrance and exit of the wafer storage and transmission system 10 are opened, and the platform 41 of the corresponding channel, along with the wafer pods FOUP on it, can enter and exit the wafer storage and transmission system 10. For example, the main controller 3 can monitor the status of the wafer pods FOUP entering and exiting the wafer storage and transmission system 10. When it is detected that the wafer pods FOUP have successfully entered and exited the wafer storage and transmission system 10, the main controller 3 controls the cylinder 51 to move linearly in a second direction, pulling down the door plate 55 of the corresponding channel. At this time, the channel of the gate assembly 5 to enter and exit the wafer storage and transmission system 10 is closed. The second direction is opposite to the first direction. For example, if switch 410 is not triggered, the main controller 3 detects that the wafer pod FOUP is not placed on stage 41, and can control cylinder 51 to not move.

[0065] In some embodiments, such as Figure 1 , 2 As shown, the wafer storage and transmission system 10 also includes a robotic arm 6 connected to the main controller 3. Figure 9 A schematic diagram of a robotic arm according to some embodiments of the present invention is shown. In some embodiments, the robotic arm 6 may be connected to the frame 1 by screws. Figure 1-9 As shown, the robotic arm 6 can transfer wafer foie assemblies (FOUPs) between the front stage transfer module 4 and the shelf 2. The robotic arm 6 includes a pick-up module 61. The pick-up module 61 picks up the wafer foie assemblies (FOUPs) on the stage 41 of the front stage transfer module 4 and places them on an empty shelf 2.

[0066] In some embodiments, the robotic arm 6 further includes an R-axis. The R-axis is used to move the pickup module 61 along the y-direction. In some embodiments, the robotic arm 6 further includes a Z-axis. The Z-axis is used to move the pickup module 61 along the z-direction. In some embodiments, the robotic arm 6 further includes an X-axis. The X-axis is used to move the pickup module 61 along the x-direction. The x-direction, y-direction, and z-direction intersect each other perpendicularly at point O.

[0067] Figure 10 This diagram illustrates a traditional R-axis arrangement. (For example...) Figure 10 As shown, in the traditional horizontal arrangement of the R-axis, the R-axis (first joint) encroaches on the space in the height direction, resulting in a large distance between adjacent upper and lower layers 2, which in turn leads to a large overall size of the wafer storage and transmission system 10. The multi-layer design of the layers 2 further increases the overall size.

[0068] Figure 11 A schematic diagram illustrating the R-axis arrangement according to some embodiments of the present invention is shown. Figure 11 As shown, the R-axis of this invention is vertically arranged, especially the first joint of the R-axis, so that the R-axis (first joint) does not occupy the height space between adjacent upper and lower layers 2, which can reduce the distance between adjacent upper and lower layers 2, reduce the space in the height direction, and thus reduce the overall size of the wafer storage and transmission system 10. At the same time, with the R-axis (first joint) vertically arranged, the pickup module 61 can utilize the lateral space between adjacent left and right layers 2 to pick up the wafer foyer FOUP. In this way, the space design for the pickup module 61 to pick up and place the wafer foyer FOUP from the layer 2 can be optimized.

[0069] In some embodiments, such as Figure 4 As shown, shelf 2 includes an opening KO. The opening KO is roughly C-shaped. The opening KO provides space for the lifting and lowering movement of the pickup module 61, reducing the encroachment on the height space. Figure 12 A perspective view of the lifting and lowering movement of the pickup module 61 via the opening KO according to some embodiments of the present invention is shown. Figure 13 A top view schematic diagram showing the lifting and lowering movement of the pickup module 61 via the opening KO according to some embodiments of the present invention is shown. Figure 12 , 13 As shown, the picking module 61 can pick up and put the wafer foup from the shelf 2 through the opening KO lifting motion. The robot arm 6 passes through and avoids the shelf 2, improving space utilization.

[0070] In some embodiments, such as Figure 1 , 2As shown, the wafer storage and transfer system 10 also includes a front-opening interface mechanical standard (FIMS) unit 7 connected to the main controller 3. In some embodiments, the FIMS unit 7 can be connected to the frame 1 via screws. In some embodiments, a robot arm 6 can transfer wafer pods (FOUPs) between the shelf 2 and the FIMS unit 7. For example, the pick-up module 61 can pick up the wafer pods (FOUPs) on the shelf 2 and place them on the platform of the FIMS unit 7. The FIMS unit 7 opens the door of the wafer pod (FOUP), exposing the wafers inside to the vertical furnace. The robot arm of the vertical furnace can then transport the wafers to the furnace for processing. In some embodiments, after the FIMS unit 7 opens the front door of the wafer pod (FOUP), it can purge the internal area of ​​the wafer pod (FOUP) with high-purity nitrogen to remove oxygen and particulate matter, thus helping to achieve clean, low-oxygen control. In some embodiments, the front-opening interface mechanical standard unit 7 can evacuate the area of ​​moving parts and the area where the wafer is located within the wafer pod FOUP, removing particulate matter and oxygen, which helps to achieve clean and low-oxygen control. In some embodiments, the stage of the front-opening interface mechanical standard unit 7 can be a multi-channel design, such as a dual-channel, triple-channel, or quad-channel design, to ensure the machine's operating efficiency.

[0071] In some embodiments, after the vertical furnace process is completed, the robot arm of the vertical furnace can place the wafer back into the wafer foup (FOUP) on the platform of the front-opening interface mechanical standard unit 7. The front-opening interface mechanical standard unit 7 can open the door of the wafer foup, purge with high-purity nitrogen, and then close the door. The pick-up module 61 of the robot arm 6 then transports the wafer foup containing the processed wafer to the shelf 2. When the wafer foup is placed on the shelf 2, switch 21 is triggered, and the main controller 3 controls the air inlet pipeline to open, injecting high-purity nitrogen into the wafer foup stored thereon through the first vacuum suction cup 22-1. First, a large flow rate of filling and venting is performed, followed by a small flow rate of filling and venting, to clean, reduce oxygen, and control humidity inside the wafer foup. At the same time, it waits for the fab crane system to retrieve the wafer foup.

[0072] In some embodiments, upon receiving a FOUP (Front-End Carrier Container) retrieval command from the Fab crane system, the main controller 3 controls the picking module 61 of the robotic arm 6 to transport the FOUP to the platform 41 of the front platform transfer module 4. Switch 410 is triggered, and the main controller 3 recognizes the FOUP being placed on the platform 41. It then controls the gate assembly 5 to open, the door panel 55 to open, and the front platform transfer module 4 to transport the FOUP to the outside of the wafer storage and transfer system 10. Afterwards, the gate assembly 5 closes, and the door panel 55 closes. The Fab crane system then removes the FOUP containing the completed wafers and transfers it to other process flows.

[0073] In some embodiments, such as Figure 1 , 2 As shown, the wafer storage and transmission system 10 also includes a fan filter unit 8 (FFU) located at the top of the frame 1. The fan filter unit 8 is connected to the frame 1 by screws. There can be one or more fan filter units 8. The fan filter unit 8 can blow filtered air from the top of the frame 1 into the interior. The frame 1 includes perforations. Air inside the frame 1, along with particulate matter mixed in with the air, is discharged through the perforations, maintaining a slightly positive pressure inside the frame 1 and keeping the interior clean.

[0074] In some embodiments, the wafer storage and transmission system 10 further includes a human-machine interface system 9. In some embodiments, the human-machine interface system 9 can be connected to the frame 1 via screws. The human-machine interface system 9 can display the operating status of each module of the wafer storage and transmission system 10, such as sensor data (e.g., flow meter), shelf occupancy status, internal air pressure of the frame 1, internal air pressure of the wafer pod FOUP, whether the wafer pod FOUP has shelf 2 placed on it, and whether the process has been completed. Simultaneously, the operator can perform specific actions through control devices such as buttons, touch screen all-in-one machines, and robot handheld devices to achieve human-machine interaction.

[0075] Figure 14 A schematic diagram of a human-computer interaction system 9 according to some embodiments of the present invention is shown. Figure 14As shown, the human-machine interaction system 9 includes a housing 91, a touch screen all-in-one machine 92, a status display panel 93, an emergency stop switch 94, an emergency stop switch 95, a status display panel 96, a touch screen all-in-one machine 97, a warning light 98, a push-button switch 99, an indicator light 910, a push-button switch 911, and a push-button switch 912. For example, the emergency stop switch 94 can control the entire wafer storage and transmission system 10 to stop suddenly. For example, the emergency stop switch 95 can control the robot arm 6 to stop suddenly. For example, the status display panels 93 and 96 can display the operating status of each module. It should be noted that this invention does not limit the number and function of each component of the human-machine interaction system 9; in practical applications, it can be configured according to requirements.

[0076] The present invention also provides a wafer fabrication process system. Figure 15 A schematic diagram of a wafer fabrication process system according to some embodiments of the present invention is shown. For example... Figure 15 As shown, the wafer fabrication process system 40 includes a wafer storage and transport system 10, a fab crane system 20, and a vertical furnace 30. The fab crane system 20 is connected to the wafer storage and transport system 10, transporting wafer pods (FOUPs) to the wafer storage and transport system 10. The vertical furnace 30 is connected to the wafer storage and transport system 10, removing wafers from the wafer storage and transport system 10 for processing; and returning the processed wafers to the wafer storage and transport system 10. The wafer storage and transport system 10 also outputs wafers returned from the vertical furnace 30 to the fab crane system 20. In some embodiments, the vertical furnace 30 includes a 12-inch vertical furnace.

[0077] The present invention also provides a method executed by a wafer storage and transmission system 10. Figure 16 A flowchart illustrating a method 50 performed by a wafer storage and transmission system 10 according to some embodiments of the present invention is shown. Figure 16 As shown, method 50 includes steps S51-S52. Step S51 determines whether the wafer pod FOUP is placed on the shelf 2 based on whether switch 21 of shelf 2 is triggered. Step S52, when switch 21 is triggered, the inlet pipe is opened to inject nitrogen gas into the wafer pod FOUP through the first vacuum chuck 22-1 via the inlet port in, causing the gas inside the wafer pod FOUP to be discharged through the outlet port out. In some embodiments, method 50 can be executed by the main controller 3.

[0078] The wafer storage and transmission system, wafer manufacturing process system, and method of the present invention can achieve efficient and safe storage, transmission, cleanliness, low oxygen, and control of wafers in a wafer cassette, which helps to improve the yield and reliability of wafer and chip production, and the overall size of the machine is small.

[0079] The present invention also provides a computer-readable storage medium. The computer-readable storage medium includes computer-executable instructions stored thereon, which, when executed by a processor, implement method 50.

[0080] In some embodiments, the present invention may take the form of a computer program product implemented on one or more storage media containing program code. Computer-usable storage media include permanent and non-permanent, removable and non-removable media, and information storage can be implemented by any method or technology. Information may be computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include, but are not limited to: PRAM, SRAM, DRAM, other types of RAM, ROM, EEPROM, flash memory or other memory technologies, compact disc read-only memory (CD-ROM), digital video disc (DVD) or other optical storage, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other non-transfer medium that can be used to store information accessible by a computing device.

[0081] It should be noted that this specification provides method operation steps as shown in the embodiments or diagrams, but based on conventional or non-inventive labor, more or fewer operation steps may be included. The order of steps listed in the embodiments is merely one possible execution order among many steps and does not represent the only execution order. In actual system or device products, the methods shown in the embodiments or flowcharts can be executed sequentially or in parallel.

[0082] It should be noted that although several modules of wafer storage and transmission systems / wafer fabrication process systems / methods / computer-readable storage media are mentioned in the detailed description above, this division is not mandatory. In fact, according to embodiments of the present invention, the features and functions of two or more modules described above can be implemented in one module. Conversely, the features and functions of one module described above can be further divided and embodied by multiple modules. Furthermore, the various modules mentioned in this invention can be implemented in hardware, in software, or a combination of hardware and software.

[0083] It should be noted that the present invention may include Figure 1-16 Any one or more features of any one or more embodiments. In other words, not all features shown in the figures need to be implemented simultaneously in the wafer storage and transmission system / wafer manufacturing process system / method / computer-readable storage medium of the present invention.

[0084] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A wafer storage and transmission system, characterized in that, include: The framework includes the space to accommodate it; One or more shelves, connected to the frame, are used to store wafer cassettes that can accommodate wafers; each shelf includes one or more switches that can be triggered when the wafer cassette is placed on the shelf; each shelf includes a first vacuum chuck and a second vacuum chuck, which can respectively conform to the air inlet and air outlet of the wafer cassette; the first vacuum chuck is connected to an air inlet pipe, and the second vacuum chuck is connected to an air outlet pipe. The main controller is connected to the switch. When the switch is triggered, the main controller is configured to control the opening of the air intake line so that nitrogen gas is injected into the wafer cassette through the first vacuum chuck and the air intake port. The gas inside the wafer cell can be discharged through the gas outlet; A front platform conveying module connected to the main controller includes a platform capable of carrying the wafer cassette, and the platform includes a switch that can be triggered when the wafer cassette is placed on the platform. A robotic arm connected to the main controller, the robotic arm including a picking module configured to pick up a wafer cassette on the stage and place it on an empty shelf; The shelf includes an opening, and the pickup module is configured to move up and down through the opening; the robotic arm also includes an R-axis, which is arranged vertically. and A gate assembly connected to the main controller, the gate assembly including multiple channels, the main controller being configured to control the opening or closing of the channels based on the switching of the platform, so as to control the wafer cassette entering and exiting the wafer storage and transmission system.

2. The wafer storage and transmission system according to claim 1, characterized in that, The opening is C-shaped.

3. The wafer storage and transmission system according to claim 1 or 2, characterized in that, The first vacuum suction cup and the second vacuum suction cup are respectively connected to the air inlet pipe and the air outlet pipe via L-shaped quick-connect plugs.

4. The wafer storage and transmission system according to claim 1 or 2, characterized in that, The intake line includes a flow meter connected to the main controller, the flow meter being configured to monitor and control the flow rate of the nitrogen.

5. The wafer storage and transmission system according to claim 4, characterized in that, The flow meter is configured to first inflate the wafer cell based on a first flow rate, and then inflate the wafer cell based on a second flow rate, wherein the first flow rate is greater than the second flow rate.

6. The wafer storage and transmission system according to claim 1 or 2, characterized in that, It also includes a front-opening interface mechanical standard unit connected to the main controller, wherein the pickup module is configured to pick up the wafer cassette on the shelf and place it on the platform of the front-opening interface mechanical standard unit; the front-opening interface mechanical standard unit is configured to open the door of the wafer cassette to expose the wafer inside the wafer cassette to the vertical furnace.

7. The wafer storage and transmission system according to claim 1 or 2, characterized in that, It also includes a fan filter unit located at the top of the frame, the fan filter unit being configured to blow filtered air into the interior of the frame; the frame includes a perforated portion, the perforated portion being configured to discharge air from the interior of the frame and particulate matter mixed in the air through the perforation.

8. A wafer fabrication process system, characterized in that, include: The wafer storage and transmission system as described in any one of claims 1-7; The Fab plant overhead crane system, connected to the wafer storage and transmission system, is configured to transport wafer cassettes to the wafer storage and transmission system; and A vertical furnace, connected to the wafer storage and transmission system, is configured to remove wafers from the wafer storage and transmission system for processing. The completed wafer is returned to the wafer storage and transmission system; The wafer storage and transfer system is also configured to output the wafers returned by the vertical furnace to the Fab plant overhead crane system.

9. A method performed by a wafer storage and transmission system as described in any one of claims 1-7, characterized in that, include: Whether the wafer cassette is placed on the shelf is determined based on whether the switch of the shelf is triggered; When the switch is triggered, the air intake pipe is opened to inject nitrogen gas into the wafer cassette through the first vacuum chuck via the air intake port, so that the gas inside the wafer cassette is discharged through the air outlet.

10. A computer-readable storage medium, characterized in that, Includes computer-executable instructions stored thereon, which, when executed by a processor, implement the method of claim 9.

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