Chip testing machine capable of automatically marking dead pixels

Abstract

The invention provides a chip testing machine capable of automatically marking dead pixels, and relates to the field of chip testing. The chip testing machine capable of automatically marking the dead pixels comprises a conveying cabinet structure, a multi-position moving structure, a negative pressure grabbing structure, a chip dead pixel imaging device, a marking structure and a chip power-on testing structure. The multi-position moving structure can drive the negative pressure grabbing structure to move in the front-back direction. And the chip dead pixel imaging device is installed at the other installation position of the movable end of the multi-position moving structure, the chip dead pixel imaging device faces a chip conveyed by the conveying cabinet structure, and the multi-position moving structure can drive the negative pressure grabbing structure and the chip dead pixel imaging device to move left and right and up and down. According to the chip testing machine capable of automatically marking the dead pixels, assembly line work is formed by dead pixel detection, marking and power-on testing of the chips, manual intervention is reduced, and automation of chip detection is conveniently established.

Description

Technical Field

[0001] This application relates to the field of chip testing technology, and more specifically, to a chip testing machine that automatically marks defective pixels. Background Technology

[0002] Chip testing machines that mark defects play a crucial role in the chip manufacturing process. They can detect whether the chip's performance and functionality meet standards and mark defective chips (defective pixels) for subsequent processing. These machines use miniature CT imaging to visualize the inside of the package and detect defective pixels, then mark the number and size of these pixels to facilitate further processing of the defective chips.

[0003] In related technologies, chip testing machines that automatically mark defects often perform defect marking and electrical testing separately. They first test for physical defects and then perform electrical testing on the chip. How to integrate defect marking and electrical testing into an unmanned production line is a technical problem that needs to be solved. Summary of the Invention

[0004] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes an automatic defect marking chip testing machine, which integrates defect detection, marking, and electrical testing of chips into an assembly line operation, reducing human intervention and facilitating the automation of chip testing.

[0005] The chip testing machine for automatically marking defects according to an embodiment of this application includes: a conveyor cabinet structure, a multi-position moving structure, a negative pressure gripping structure, a chip defect imaging device, a marking structure, and a chip power-on testing structure.

[0006] The conveyor cabinet structure is used to convey chips with marking stickers attached, with the side bearing the marking stickers facing upwards; the multi-position moving structure is located inside the rear side of the conveyor cabinet structure; the negative pressure gripping structure is located at one mounting position of the movable end of the multi-position moving structure, and the multi-position moving structure can drive the negative pressure gripping structure to move forward and backward; the chip defect imaging device is installed at another mounting position of the movable end of the multi-position moving structure, and the chip defect imaging device faces the chip conveyed by the conveyor cabinet structure; the multi-position moving structure can drive the negative pressure gripping structure and the chip defect imaging device to move left and right and up and down; the marking structure is located above the conveying position of the conveyor cabinet structure, and the marking structure is used to mark defects on the marking stickers; the chip power-on test structure is used for power-on testing of the chip.

[0007] According to some embodiments of this application, the conveyor cabinet structure includes a cabinet and a conveying mechanism. The conveying mechanism is disposed on the front side inside the cabinet, the marking structure is disposed on the upper side of the conveying mechanism, and the multi-position moving structure is located on the rear side of the conveying mechanism.

[0008] According to some embodiments of this application, the conveying mechanism includes a conveyor, a limiting frame, a positioning plate, and a guide plate. The conveyor is disposed on the front side inside the cabinet. The limiting frames are symmetrically disposed on both sides inside the conveyor. A feed inlet with a larger front and smaller rear is formed between the front ends of the two limiting frames. The rear end of the feed inlet is a conveying channel. The positioning plate is disposed at the front end of the conveying channel. The guide plates are symmetrically disposed above the rear ends of the two limiting frames. The two guide plates form a guide opening with a larger top and a smaller bottom. The marking structure is disposed between the positioning plate and the guide plate.

[0009] According to some embodiments of this application, the multi-position moving structure includes a support frame, a left-right translation mechanism, a mounting plate, a right-right movement mechanism, a gripping bracket, a mounting frame, and a front-back movement mechanism. The left-right translation mechanism is mounted on the front side of the upper end of the support frame. The mounting plate is fixedly connected to the slider of the left-right translation mechanism. There are two right-right movement mechanisms, which are respectively located on the front sides of the left and right ends of the mounting plate. The gripping bracket is fixedly connected to the slider of the left right right right right right right right right left right right movement mechanism. The front-back movement mechanism is mounted on the lower side of the gripping bracket. The main body of the negative pressure gripping structure is mounted on the slider of the front-back movement mechanism. The chip defect imaging device is mounted on the mounting frame.

[0010] According to some embodiments of this application, the negative pressure gripping structure includes a negative pressure gripping mechanism, a bad pixel detection degassing frame, a power-on test degassing frame, and a transfer position degassing frame. The negative pressure gripping mechanism is installed at one mounting position on the movable end of the multi-position moving structure. The bad pixel detection degassing frame is installed at the front end of the upper side of the marking structure. The power-on test degassing frame is installed at the rear end of the chip power-on test structure. The chip power-on test structure is located to the left of the bad pixel detection degassing frame. The transfer position degassing frame is fixedly connected to the right end above the conveyor position of the conveyor cabinet structure. The bad pixel detection degassing frame, the power-on test degassing frame, and the transfer position degassing frame can all resist the negative pressure gripping mechanism to release the negative pressure adsorption.

[0011] According to some embodiments of this application, the negative pressure gripping mechanism includes a vent pipe, a flexible suction cup, a vent box, an exhaust seal plate, and an air inlet seal plate. The flexible suction cup is fixedly sleeved on the lower end of the vent pipe, and the vent box is fixedly connected to the upper end of the vent pipe. The interior of the flexible suction cup is connected to the vent box through the vent pipe. The left and right sides of the vent box are shaped like a top-smaller, bottom-larger shape, and the front and rear ends of the vent box are shaped like a top-larger, bottom-smaller shape. Exhaust holes are provided on both the left and right sides of the vent box, and air inlets are provided on both the front and rear ends of the vent box. The exhaust seal plate... The plates are respectively hinged to the outer walls of the left and right sides of the vent box. The exhaust sealing plate adheres to the outer wall of the vent box under the action of gravity to seal the exhaust hole. The air inlet sealing plate is respectively hinged to the inner walls of the front and rear ends of the vent box. The air inlet sealing plate adheres to the inner wall of the vent box under the action of gravity to seal the air inlet hole. The degassing frame of the defect detection position and the degassing frame of the transfer position can abut against the air inlet sealing plate at the front end of the vent box to allow the vent box to ventilate. The degassing frame of the power-on test position can abut against the air inlet sealing plate at the rear end of the vent box to allow the vent box to ventilate.

[0012] According to some embodiments of this application, the degassing frame for the defect detection position includes a base and a wedge-shaped degassing plate. The wedge-shaped degassing plate is fixedly connected to the upper end of the base. The wedge-shaped degassing plate can resist the negative pressure gripping mechanism to release the negative pressure adsorption. The degassing frame for the defect detection position, the degassing frame for the power-on test position, and the degassing frame for the transfer position have the same structure.

[0013] According to some embodiments of this application, the marking structure includes a chip marking plate, a front-to-back moving mechanism, a left-to-right moving mechanism, a movable block, and a marking pen mechanism. The chip marking plate is fixedly connected above the conveyor position of the conveyor cabinet structure. A chip slot is formed on the upper side of the chip marking plate. The front-to-back moving mechanism is disposed on the upper side of the chip marking plate and is located on the left and right sides of the chip slot. The left-to-right moving mechanism is disposed on the slider of the front-to-back moving mechanism. The movable block is disposed on the left-to-right moving mechanism and can drive the movable block to move left and right. The marking pen mechanism is mounted on the movable block and marks the defective points of the chip on the marking sticker.

[0014] According to some embodiments of this application, the marking pen mechanism includes an electric push rod, a pressure plate, a baffle frame, a positioning cylinder, a marking pen, a limiting ring, and a compression spring. The electric push rod is fixedly connected to the upper side of the movable block, the pressure plate is fixedly connected to the top end of the output end of the electric push rod, the baffle frame is fixedly connected to the lower side of the pressure plate, the positioning cylinder is fixedly connected to the movable block, and the limiting ring is fixedly sleeved on the marking pen. The marking pen slides through the pressure plate, the baffle frame, and the positioning cylinder. The compression spring is sleeved on the marking pen, and both ends of the compression spring press the pressure plate and the limiting ring respectively. The lower end of the compression spring presses the limiting ring onto the baffle frame.

[0015] According to some embodiments of this application, the chip power-on test structure includes a mounting base and a chip power-on test socket. The chip power-on test socket is fixedly connected to the mounting base, and a test slot is provided on the chip power-on test socket. The chip falls into the test slot to perform a power-on test on the chip.

[0016] The beneficial effects of this application are as follows: The conveyor cabinet structure conveys the chip with the marking sticker to the gripping position. The multi-position moving structure drives the negative pressure gripping structure to the chip gripping position. The negative pressure gripping structure moves downward and gradually presses the chip. The negative pressure gripping structure exhausts air to generate negative pressure and attract the chip. The negative pressure gripping structure drives the chip upward. The multi-position moving structure drives the negative pressure gripping structure and the chip to the marking structure. The negative pressure gripping structure vents to release the negative pressure, and the chip falls into the marking structure. The chip defect imaging device detects defects in the chip. The detected defects are automatically marked by the marking structure. After detection, the chip is re-absorbed by the negative pressure gripping structure with the ventilation position staggered. The chip is attached and moved onto the chip power-on test structure. The negative pressure gripping structure releases the negative pressure, allowing the chip to fall into the test structure. The negative pressure gripping structure then shifts away from the venting position and continues to move downwards, pressing the chip firmly into the test structure to reduce the occurrence of poor contact. The chip is then tested using the power-on test structure. After testing, the chip is re-grabbed by the negative pressure gripping structure and transferred to a conveyor position within the conveyor cabinet structure. The negative pressure gripping structure then transfers the chip to the discharge position to the right of the marking structure, allowing the chip to be conveyed out of the conveyor cabinet structure. This automatic defect-marking chip testing machine streamlines defect detection, marking, and power-on testing into an assembly line operation, reducing human intervention and facilitating the automation of chip testing.

[0017] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a three-dimensional structural schematic diagram of a chip testing machine for automatically marking defective points according to an embodiment of this application; Figure 2 This is a three-dimensional structural diagram of the conveyor cabinet structure according to an embodiment of this application; Figure 3 This is a three-dimensional structural diagram of a multi-position moving structure according to an embodiment of this application; Figure 4 This is a layout diagram of the negative pressure gripping structure according to an embodiment of this application; Figure 5 This is a three-dimensional structural schematic diagram of the negative pressure gripping mechanism according to an embodiment of this application; Figure 6 This is a cross-sectional view of the negative pressure gripping mechanism according to an embodiment of this application; Figure 7 This is a three-dimensional structural diagram of the marking structure according to an embodiment of this application; Figure 8 According to the embodiments of this application Figure 7 Enlarged structural diagram at point A; Figure 9 This is a three-dimensional structural diagram of the chip power-on test structure according to an embodiment of this application.

[0020] Icons: 100 - Conveyor cabinet structure; 110 - Cabinet; 120 - Conveying mechanism; 121 - Conveyor; 122 - Limiting frame; 123 - Positioning plate; 124 - Guide plate; 200 - Multi-position moving structure; 210 - Support frame; 220 - Left and right translation mechanism; 230 - Mounting plate; 240 - Up and down moving mechanism; 250 - Gripping bracket; 260 - Mounting frame; 270 - Forward and backward moving mechanism; 300 - Negative pressure gripping structure; 310 - Negative pressure gripping mechanism; 311 - Vent pipe; 312 - Flexible suction cup; 313 - Vent box; 314 - Exhaust port; 315 - Air inlet; 316 - Exhaust sealing plate; 317 - Air inlet sealing plate; 318 - Contact rod ; 319-Torsion Spring; 320-Degassing Frame for Defect Detection Position; 321-Base; 322-Wedge-shaped Degassing Plate; 330-Degassing Frame for Power-on Test Position; 340-Degassing Frame for Transfer Position; 400-Chip Defect Imaging Equipment; 500-Marking Structure; 510-Chip Marking Position Plate; 520-Front-Back Position Moving Mechanism; 530-Left-Right Position Moving Mechanism; 540-Moving Block; 550-Marking Pen Mechanism; 551-Electric Push Rod; 552-Pressure Plate; 553-Baffle Frame; 554-Positioning Cylinder; 555-Marking Pen; 556-Limiting Ring; 557-Compression Spring; 600-Chip Power-on Test Structure; 610-Mounting Base; 620-Chip Power-on Test Base. Detailed Implementation

[0021] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, not all of them. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0023] The following description, with reference to the accompanying drawings, describes an automatic defect marking chip testing machine according to an embodiment of this application.

[0024] Please see Figures 1 to 9 The chip testing machine for automatically marking defects according to an embodiment of this application includes: a conveyor cabinet structure 100, a multi-position moving structure 200, a negative pressure gripping structure 300, a chip defect imaging device 400, a marking structure 500, and a chip power-on testing structure 600.

[0025] Please see Figure 1The conveyor cabinet structure 100 is used to convey chips with marking stickers attached, with the side with the marking stickers facing upwards; a multi-position moving structure 200 is located inside the rear side of the conveyor cabinet structure 100; a negative pressure gripping structure 300 is located at one mounting position of the movable end of the multi-position moving structure 200, and the multi-position moving structure 200 can drive the negative pressure gripping structure 300 to move forward and backward; a chip defect imaging device 400 is installed at another mounting position of the movable end of the multi-position moving structure 200, and the chip defect imaging device 400 faces the chip conveyed by the conveyor cabinet structure 100, and the multi-position moving structure 200 can drive the negative pressure gripping structure 300 and the chip defect imaging device 400 to move left and right and up and down; a marking structure 500 is located above the conveying position of the conveyor cabinet structure 100, and the marking structure 500 is used to mark defects on the marking stickers; a chip power-on test structure 600 is used for power-on testing of the chip. The chip defect imaging device 400 is used for imaging and detecting chip defects, employing X-ray inspection to visualize the internal components of the package (e.g., broken solder balls, delamination of leads). A conveyor cabinet structure 100 transports chips with marking stickers to the gripping position. A multi-position moving structure 200 drives a negative pressure gripping structure 300 to the chip gripping position. The negative pressure gripping structure 300 moves downward, gradually pressing the chip. Exhausting air from the negative pressure gripping structure 300 creates negative pressure that adheres to the chip. The negative pressure gripping structure 300 then moves the chip upward. The multi-position moving structure 200 moves the negative pressure gripping structure 300 and the chip to a marking structure 500. The negative pressure gripping structure 300 vents to release the negative pressure, and the chip falls into the marking structure 500. The chip defect imaging device 400 detects defects on the chip, and the detected defects are automatically marked by the marking structure 500. After detection, the chip is re-adsorbed by the negative pressure gripping structure 300 through a staggered ventilation position. The chip is moved onto the chip power-on test structure 600. The negative pressure gripping structure 300 is vented to release the negative pressure, allowing the chip to fall into the chip power-on test structure 600. The negative pressure gripping structure 300 is then offset from the venting position and continues to move downwards, pressing the chip into the chip power-on test structure 600 to reduce the occurrence of poor chip contact. The chip is then tested for power-on properties using the chip power-on test structure 600. After testing, the chip is picked up again by the negative pressure gripping structure 300 and transferred to the conveyor position within the conveyor cabinet structure 100. The negative pressure gripping structure 300 then transfers the chip to the chip outlet position on the right side of the marking structure 500, allowing the chip to be conveyed out of the conveyor cabinet structure 100 along with the conveyor position. This automatic defect-marking chip testing machine streamlines defect detection, marking, and power-on testing into an assembly line operation, reducing human intervention and facilitating the automation of chip testing.

[0026] Please see Figures 1 to 2The conveyor cabinet structure 100 includes a cabinet 110 and a conveying mechanism 120. The conveying mechanism 120 is located inside the cabinet 110 at the front. A marking structure 500 is located on the upper side of the conveying mechanism 120, and a multi-position moving structure 200 is located at the rear side of the conveying mechanism 120. The conveying mechanism 120 is the conveying position of the conveyor cabinet structure 100. Chips are conveyed along with the conveying mechanism 120. The left end of the marking structure 500 on the conveying mechanism 120 is the chip gripping position, and the right end of the marking structure 500 on the conveying mechanism 120 is the chip discharging position.

[0027] Please see Figures 1 to 2 The conveying mechanism 120 includes a conveyor 121, a limiting frame 122, a positioning plate 123, and a guide plate 124. The conveyor 121 is located on the front side inside the cabinet 110. The limiting frames 122 are symmetrically arranged on both sides inside the conveyor 121. A feed inlet with a larger front and smaller rear is formed between the front ends of the two limiting frames 122. The rear end of the feed inlet is a conveying channel. The positioning plate 123 is located at the front end of the conveying channel. The guide plates 124 are symmetrically arranged above the rear ends of the two limiting frames 122. The two guide plates 124 form a guide opening with a larger upper part and a smaller lower part. A marking structure 500 is located between the positioning plate 123 and the guide plate 124. The chip is placed on the conveyor 121 and moves from left to right with the conveyor 121. The chip is guided to be aligned by the feed port between the two limit frames 122, which is larger at the front and smaller at the back, so that the chip moves along the conveyor channel. When the chip is blocked by the positioning plate 123, the chip is located at the chip gripping position on the conveyor 121. After the chip passes the defect test and power-on test, the chip is transferred to the right side of the marking structure 500 above the guide port of the guide plate 124, which is larger at the top and smaller at the bottom. The chip is guided by the guide port and falls into the chip discharge position on the conveyor 121, so that the chip is output from the cabinet 110 with the conveyor 121.

[0028] Please see Figures 1 to 3The multi-position moving structure 200 includes a support frame 210, a left-right translation mechanism 220, a mounting plate 230, a right-right moving mechanism 240, a gripping bracket 250, a mounting frame 260, and a front-back moving mechanism 270. The left-right translation mechanism 220 is mounted on the front side of the upper end of the support frame 210. The mounting plate 230 is fixedly connected to the slider of the left-right translation mechanism 220. There are two right-right moving mechanisms 240, which are respectively located on the front side of the left and right ends of the mounting plate 230. The gripping bracket 250 is fixedly connected to the slider of the left right right up-down moving mechanism 240. The mounting frame 260 is fixedly connected to the slider of the right right up-down moving mechanism 240. The front-back moving mechanism 270 is mounted on the lower side of the gripping bracket 250. The main body of the negative pressure gripping structure 300 is mounted on the slider of the front-back moving mechanism 270. The chip defect imaging device 400 is mounted on the mounting frame 260. The negative pressure gripping structure 300 uses negative pressure to adsorb the chip at the chip gripping position. The up-and-down moving mechanism 240 moves the negative pressure gripping structure 300 upward via the gripping bracket 250, causing the chip to rise. The left-right translation mechanism 220 moves the up-and-down moving mechanism 240 and the negative pressure gripping structure 300 to the right onto the marking structure 500, where the negative pressure gripping structure 300 places the chip into the marking structure 500. The up-and-down moving mechanism 240 then moves the negative pressure gripping structure 300 upward. The left-right translation mechanism 220 moves the chip defect imaging device 400 toward the chip, detecting defects on the chip. After defect detection, the left-right translation mechanism 220 moves the negative pressure gripping structure 300 above the chip. At this time, the negative pressure gripping structure 300 is offset to the left from the vent position on the marking structure 500 and aligns with the vent position on the chip power-on test structure 600. The up-down movement mechanism 240 moves the negative pressure gripping structure 300 downward. The chip is re-adsorbed by negative pressure. The up-and-down moving mechanism 240 drives the negative pressure gripping structure 300 and the chip to rise. The back-and-forth moving mechanism 270 drives the negative pressure gripping structure 300 and the chip to move backward onto the chip power-on test structure 600. The negative pressure gripping structure 300 descends and places the chip into the chip power-on test structure 600. The negative pressure gripping structure 300 moves to the right to offset the vent on the chip power-on test structure 600. The negative pressure gripping structure 300 continues to descend and press the chip onto the chip... Inside the power-on test structure 600, the chip power-on test structure 600 performs a power-on test on the chip. After the chip power-on test, the negative pressure gripping structure 300 drives the chip to rise. Through the linkage of the front and rear moving mechanism 270 and the left and right translation mechanism 220, the chip is transferred to the guide port above the guide plate 124, which is larger at the top and smaller at the bottom. The negative pressure gripping structure 300 releases the chip, allowing the chip to fall into the chip discharge position on the conveyor 121 through the guide port, so that the chip is output from the cabinet 110 with the conveyor 121.

[0029] Please see Figures 1 to 4The negative pressure gripping structure 300 includes a negative pressure gripping mechanism 310, a bad spot detection degassing frame 320, a power-on test degassing frame 330, and a transfer position degassing frame 340. The negative pressure gripping mechanism 310 is installed at one of the installation positions on the movable end of the multi-position moving structure 200. The bad spot detection degassing frame 320 is installed at the front end of the upper side of the marking structure 500. The power-on test degassing frame 330 is installed at the rear end of the chip power-on test structure 600, which is located to the left of the bad spot detection degassing frame 320. The transfer position degassing frame 340 is fixedly connected to the right end above the conveyor position of the conveyor cabinet structure 100. The bad spot detection degassing frame 320, the power-on test degassing frame 330, and the transfer position degassing frame 340 can all resist the negative pressure gripping mechanism 310 to release the negative pressure adsorption. When the negative pressure gripping structure 300 places the chip into the marking structure 500, the negative pressure gripping structure 300 falls, and the degassing bracket 320 at the defect detection position gradually contacts the negative pressure gripping mechanism 310. The negative pressure gripping mechanism 310 then releases air to dissipate the negative pressure adsorption on the chip, allowing the chip to fall into the marking structure 500. When the negative pressure gripping structure 300 grips the chip in the marking structure 500, the negative pressure gripping mechanism 310 moves to the left to avoid contact with the negative pressure gripping bracket 320 at the defect detection position. When the negative pressure gripping structure 300 places the chip into the chip power-on test structure 600, the negative pressure gripping structure 300 falls, and the degassing bracket 330 at the power-on test position gradually contacts the negative pressure gripping mechanism 310. The negative pressure gripping mechanism 310 then releases air to dissipate the negative pressure adsorption on the chip, allowing the chip to fall into the chip power-on test structure 600. When the negative pressure gripping structure 300 grips the chip within the chip power-on test structure 600, it moves to the right to avoid contact between the power-on test position degassing frame 330 and the negative pressure gripping mechanism 310. After the chip is transferred to the guide port of the guide plate 124 (larger at the top and smaller at the bottom), the negative pressure gripping structure 300 falls, and the transfer position degassing frame 340 gradually contacts the negative pressure gripping mechanism 310. The negative pressure gripping mechanism 310 then releases the negative pressure adsorption on the chip, allowing the chip to fall into the conveyor 121 through the guide port.

[0030] Please see Figures 1 to 6The negative pressure gripping mechanism 310 includes a vent pipe 311, a flexible suction cup 312, a vent box 313, an exhaust seal plate 316, an air inlet seal plate 317, a contact rod 318, and a torsion spring 319. The flexible suction cup 312 is fixedly sleeved on the lower end of the vent pipe 311, and the vent box 313 is fixedly connected to the upper end of the vent pipe 311. The interior of the flexible suction cup 312 is connected to the vent box 313 through the vent pipe 311. The left and right sides of the vent box 313 are shaped like a top smaller than a bottom, and the front and rear ends of the vent box 313 are shaped like a top larger than a bottom. Exhaust holes 314 are provided on both the left and right sides of the vent box 313, and air inlets 315 are provided on both the front and rear ends of the vent box 313. The exhaust seal plate... 316 is hinged to the outer walls of the left and right sides of the vent box 313 respectively. Under the action of gravity, the exhaust sealing plate 316 adheres to the outer wall of the vent box 313 to seal the exhaust port 314. The air intake sealing plate 317 is hinged to the inner walls of the front and rear ends of the vent box 313 respectively. It should be noted that a torsion spring 319 is sleeved at the hinge of the air intake sealing plate 317. The torsion spring 319 presses the air intake sealing plate 317 against the inner wall of the vent box 313. The negative pressure inside the vent box 313 caused by the deformation of the flexible suction cup 312 has less force on the air intake sealing plate 317 than the elastic force of the torsion spring 319 on the air intake sealing plate 317. Therefore, the opening and closing of the air intake sealing plate 317 is not affected by the negative pressure caused by the deformation of the flexible suction cup 312. Under the influence of gravity, the air inlet sealing plate 317 adheres to the inner wall of the vent box 313, sealing the air inlet hole 315. The degassing bracket 320 at the defect detection position and the degassing bracket 340 at the transfer position can abut against the air inlet sealing plate 317 at the front end of the vent box 313, allowing the vent box 313 to ventilate. The degassing bracket 330 at the power-on test position can abut against the air inlet sealing plate 317 at the rear end of the vent box 313, allowing the vent box 313 to ventilate. The abutting rod 318 is fixedly connected to one side of the air inlet sealing plate 317. The abutting rod 318 extends through the air inlet hole 315 to the outside of the air inlet hole 315. The degassing bracket 320 at the defect detection position and the degassing bracket 340 at the transfer position can abut against the abutting rod 318 at the front end of the vent box 313, and the degassing bracket 330 at the power-on test position can abut against the abutting rod 318 at the rear end of the vent box 313. When the negative pressure gripping structure 300 places the chip into the marking structure 500, the up-down moving mechanism 240 moves the ventilation box 313 downward. The degassing frame 320 of the defect detection position gradually comes into contact with the contact rod 318. The contact rod 318 pushes the air intake sealing plate 317 to flip, and the air intake hole 315 is opened to allow ventilation. As the air intake hole 315 is opened, the negative pressure adsorption effect of the flexible suction cup 312 on the chip is released due to deformation, and the chip is removed from the flexible suction cup 312 under the action of gravity.When the negative pressure gripping structure 300 grips the chip inside the marking structure 500, the negative pressure gripping mechanism 310 moves to the left, and the contact rod 318 and the degassing frame 320 of the bad pixel detection position are misaligned, so that the degassing frame 320 of the bad pixel detection position cannot contact the contact rod 318, so that the flexible suction cup 312 can deform. The air pressure inside the flexible suction cup 312 and the ventilation box 313 increases, and the air pressure pushes the exhaust sealing plate 316, so that the gas is discharged through the exhaust hole 314. After the gas is discharged, the exhaust sealing plate 316 returns to its original position under the action of gravity and seals the exhaust hole 314. At the same time, because the flexible suction cup 312 has the tendency to recover its deformation, a negative pressure is generated inside the flexible suction cup 312 to adsorb the chip. There is no need for an external air pump to generate negative pressure, and the adsorption is simple. The principle of the negative pressure gripping structure 300 in gripping and dropping the chip at the chip power-on test structure 600, the chip gripping position, and the chip discharge position is the same as that of the negative pressure gripping structure 300 in gripping and dropping the chip at the marking structure 500 position. In addition, the negative pressure gripping structure 300 adopts a staggered gripping and dropping method for the chip at the marking structure 500 and the chip power-on test structure 600. When the chip is gripped, the degassing frame 320 at the defect detection position and the degassing frame 330 at the power-on test position do not contact the abutment rod 318. When the chip is dropped, the degassing frame 320 at the defect detection position and the degassing frame 330 at the power-on test position contact the abutment rod 318.

[0031] Please see Figures 1 to 7 The defect detection degassing frame 320 includes a base 321 and a wedge-shaped degassing plate 322. The wedge-shaped degassing plate 322 is fixedly connected to the upper end of the base 321. The wedge-shaped degassing plate 322 can resist the negative pressure gripping mechanism 310 to release the negative pressure adsorption. The defect detection degassing frame 320, the power-on test degassing frame 330, and the transfer degassing frame 340 have the same structure. The outer side of the wedge-shaped degassing plate 322 is inclined so that the contact rod 318 abuts against the inclined surface of the outer side of the wedge-shaped degassing plate 322. As the negative pressure gripping mechanism 310 falls, the inclined surface of the outer side of the wedge-shaped degassing plate 322 pushes the contact rod 318.

[0032] Please see Figures 1 to 7The marking structure 500 includes a chip marking plate 510, a front-to-back moving mechanism 520, a left-to-right moving mechanism 530, a movable block 540, and a marking pen mechanism 550. The chip marking plate 510 is fixedly connected above the conveyor position of the conveyor cabinet structure 100. A chip slot is provided on the upper side of the chip marking plate 510. The front-to-back moving mechanism 520 is located on the upper side of the chip marking plate 510 and is located on the left and right sides of the chip slot. The left-to-right moving mechanism 530 is located on the slider of the front-to-back moving mechanism 520. The movable block 540 is located on the left-to-right moving mechanism 530 and can drive the movable block 540 to move left and right. The marking pen mechanism 550 is installed on the movable block 540 and marks the bad points of the chip on the marking sticker. When marking defective pixels, the front-to-back movement mechanism 520 controls the marking pen mechanism 550 to move in the front-to-back direction, and the left-to-right movement mechanism 530 controls the marking pen mechanism 550 to move in the left-to-right direction, so that the marking pen mechanism 550 marks the defective pixels of the chip on the plane of the marking sticker.

[0033] Please see Figures 1 to 8 The marker pen mechanism 550 includes an electric push rod 551, a pressure plate 552, a baffle frame 553, a positioning cylinder 554, a marker pen 555, a limiting ring 556, and a compression spring 557. The electric push rod 551 is fixedly connected to the upper side of the movable block 540. The pressure plate 552 is fixedly connected to the top end of the output end of the electric push rod 551. The baffle frame 553 is fixedly connected to the lower side of the pressure plate 552. The positioning cylinder 554 is fixedly connected to the movable block 540. The limiting ring 556 is fixedly sleeved on the marker pen 555. The marker pen 555 slides through the pressure plate 552, the baffle frame 553, and the positioning cylinder 554. The compression spring 557 is sleeved on the marker pen 555. The two ends of the compression spring 557 press the pressure plate 552 and the limiting ring 556 respectively. The lower end of the compression spring 557 presses the limiting ring 556 onto the baffle frame 553. When the pen is placed, the electric push rod 551 moves the marker pen 555 downward. After the marker pen 555 touches the marking sticker on the chip, it slides along the pressure plate 552, the baffle frame 553 and the positioning cylinder 554. The limiting ring 556 presses the compression spring 557, and the compression spring 557 applies the pen force to the marker pen 555. During the movement of the marker pen 555, the position of the pen is limited by the pressure plate 552, the baffle frame 553 and the positioning cylinder 554, making the pen movement more stable.

[0034] Please see Figures 1 to 9The chip power-on test structure 600 includes a mounting base 610 and a chip power-on test socket 620. The chip power-on test socket 620 is fixedly connected to the mounting base 610 and has a test slot. The chip falls into the test slot for power-on testing. The chip power-on test structure 600 is fixed to the mounting base 610 on the side away from the marking structure 500, and the chip power-on test structure 600 abuts against the contact rod 318 at the rear end of the vent box 313, while the defect detection degassing bracket 320 abuts against the contact rod 318 at the front end of the vent box 313. Guide ramps are provided around the upper sides of the chip slot and the test slot to facilitate the chip falling into the chip slot and test slot and to automatically correct the chip's position. The chip power-on test socket 620 is a key tool for functional testing or performance verification after chip packaging and before assembly. It provides a stable power and signal connection for the chip and verifies its electrical performance (such as power consumption, frequency, I / O functions, etc.).

[0035] Specifically, the working principle of this automatic defect-marking chip testing machine is as follows: During use, the chip is placed on the conveyor 121, which moves from left to right. The chip is guided to align itself through the feed inlet (larger at the front, smaller at the back) between two limit frames 122, allowing it to move along the conveyor channel. When the chip is blocked by the positioning plate 123, it is positioned at the chip gripping position on the conveyor 121. The up-and-down moving mechanism 240 drives the flexible suction cup 312 downwards via the gripping bracket 250. The flexible suction cup 312 gradually presses down on the chip, causing it to deform. This increases the air pressure inside the flexible suction cup 312 and the vent box 313, pushing the exhaust sealing plate 316 and allowing gas to escape through the exhaust hole 314. After the gas is exhausted, the exhaust sealing plate 316 returns to its original position under gravity, sealing the exhaust hole 314. Simultaneously, due to the tendency of the flexible suction cup 312 to recover its deformation, a negative pressure is generated inside the flexible suction cup 312 to adsorb the chip. No external air pump is needed to generate negative pressure, making adsorption simple. The up-and-down moving mechanism 240 moves the flexible suction cup 312 and the chip upwards. The left-right moving mechanism 220 moves the flexible suction cup 312 and the chip to above the chip slot of the chip marking plate 510. The up-and-down moving mechanism 240 moves the flexible suction cup 312 and the chip downwards. As the up-and-down moving mechanism 240 moves downwards, the venting box 313 moves downwards, and the degassing bracket 320 of the defect detection position gradually comes into contact with the contact rod 318. The contact rod 318 pushes the air inlet sealing plate 317 to flip, and the air inlet 315 is opened to allow air to pass through. As the air inlet 315 is opened, the flexible suction cup 312 releases the negative pressure adsorption effect on the chip due to deformation. The chip detaches from the flexible suction cup 312 under the action of gravity and falls into the chip slot. The up-and-down moving mechanism 240 moves the flexible suction cup 312 upwards. The chip defect imaging device 400 detects defects in the chip, and the defect locations are marked on the chip's marking sticker by the marking pen 555. During defect marking, the front-to-back movement mechanism 520 controls the marking pen mechanism 550 to move in the front-to-back direction, and the left-to-right movement mechanism 530 controls the marking pen mechanism 550 to move in the left-to-right direction, so that the marking pen mechanism 550 marks the chip defect on the plane of the marking sticker. When the pen touches the chip, the electric push rod 551 moves the marking pen 555 downward. After the marking pen 555 touches the marking sticker on the chip, it slides along the pressure plate 552, the baffle frame 553, and the positioning cylinder 554. The limiting ring 556 presses the compression spring 557, which applies the pen force to the marking pen 555. During the movement of the marking pen 555, the position of the pen is limited by the pressure plate 552, the baffle frame 553, and the positioning cylinder 554, making the pen movement more stable.

[0036] After the defect detection mark is made, the venting box 313 is moved by the left-right translation mechanism 220, so that the degassing frame 320 of the defect detection position and the contact rod 318 at the front end of the venting box 313 are misaligned. The contact rod 318 is located to the left of the degassing frame 320 of the defect detection position, and the contact rod 318 at the rear end of the venting box 313 is aligned with the degassing frame 330 of the power-on test position, so that the contact rod 318 at the rear end of the venting box 313 can contact the degassing frame 330 of the power-on test position. The up-down movement mechanism 240 moves the flexible suction cup 312 down to adsorb the chip. The up-down movement mechanism 240 moves the flexible suction cup 312 and the chip up. Then, the front-back movement mechanism 270 moves the chip backward to above the test slot of the chip power-on test socket 620. The up-down movement mechanism 240 moves the chip down. The degassing bracket 330 of the power-on test position contacts the contact rod 318 at the rear end of the venting box 313, allowing air to circulate inside the venting box 313. This releases the flexible suction cup 312 from adsorbing the chip. The principle of releasing adsorption is the same as that of the degassing bracket 320 of the defect detection position. Under the action of gravity, the chip falls into the test slot of the chip power-on test holder 620. The left-right translation mechanism 220 moves the venting box 313 to the right, causing the degassing bracket 330 of the power-on test position and the contact rod 318 at the rear end of the venting box 313 to be misaligned. The up-down movement mechanism 240 moves the flexible suction cup 312 down to press the chip, pressing the chip into the chip power-on test structure 600 to reduce the occurrence of poor chip contact. The chip is then tested for power-on through the chip power-on test structure 600.

[0037] After the chip is powered on for testing, the up-and-down moving mechanism 240 lifts the flexible suction cup 312 and the chip. Through the combined action of the front-and-back moving mechanism 270 and the left-and-right translating mechanism 220, the chip is transferred to the guide port of the guide plate 124 (larger at the top, smaller at the bottom). The up-and-down moving mechanism 240 then lowers the flexible suction cup 312 and the chip. The degassing frame 340 at the transfer position contacts the abutment rod 318 at the front end of the venting box 313, allowing air to circulate inside the venting box 313. This releases the flexible suction cup 312 from the chip, similar to the degassing frame 320 at the defect detection position. The chip falls under gravity, guided by the guide port, and enters the conveyor 121, exiting the cabinet 110 with the conveyor 121. This automatic defect-marking chip testing machine streamlines defect detection, marking, and power-on testing into a production line, reducing human intervention and facilitating automation of chip testing. The above are merely embodiments of this application and are not intended to limit the scope of protection of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application. It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

Claims

1. A chip tester that automatically marks bad points, characterized by, The utility model relates to a chip bad point marking and imaging device, including: Conveyer cabinet structure (100) for conveying the chip pasted with mark sticker and with the side with mark sticker upwardly; Multi-position moving structure (200) is arranged in the rear side inside conveyer cabinet structure (100); Negative pressure grabbing structure (300) is arranged in one mounting position of the movable end of multi-position moving structure (200), and multi-position moving structure (200) can drive negative pressure grabbing structure (300) to move in the front and back direction; Chip bad point imaging equipment (400) is installed in another mounting position of the movable end of multi-position moving structure (200), and chip bad point imaging equipment (400) is towards the chip conveyed by conveyer cabinet structure (100), and multi-position moving structure (200) can drive negative pressure grabbing structure (300) and chip bad point imaging equipment (400) to move left and right and up and down; Marking structure (500) is arranged above the conveying position of conveyer cabinet structure (100), and marking structure (500) is used to mark bad point on mark sticker; Chip power-on test structure (600) is used for the power-on test of chip.

2. The chip tester of claim 1, wherein, Conveyer cabinet structure (100) includes cabinet (110) and conveying mechanism (120), and conveying mechanism (120) is arranged in the front side inside cabinet (110), and marking structure (500) is arranged on the upper side of conveying mechanism (120), and multi-position moving structure (200) is located at the rear side of conveying mechanism (120).

3. The chip tester of claim 2, wherein, Conveying mechanism (120) includes conveyer (121), limiting frame (122), positioning plate (123) and guide plate (124), conveyer (121) is arranged in the front side inside cabinet (110), limiting frame (122) is symmetrically arranged in the both sides inside conveyer (121), and the front end between two limiting frames (122) forms the feeding port of big front and small rear, the rear end of feeding port is conveying channel, positioning plate (123) is arranged in the front end of conveying channel, guide plate (124) is symmetrically arranged above the rear end of two limiting frames (122), and two guide plates (124) form the guide port of big up and small down, and marking structure (500) is arranged between positioning plate (123) and guide plate (124).

4. The chip tester of claim 1, wherein, The multi-position moving structure (200) comprises a support frame (210), left-right translation mechanisms (220), a mounting plate (230), up-down moving mechanisms (240), a grabbing support (250), a mounting frame (260) and front-back moving mechanisms (270), the left-right translation mechanisms (220) are installed on the front side of the upper end of the support frame (210), the mounting plate (230) is fixedly connected to the sliding block of the left-right translation mechanisms (220), the up-down moving mechanisms (240) are provided in two, and the two up-down moving mechanisms (240) are respectively arranged on the front side of the left and right ends of the mounting plate (230), the grabbing support (250) is fixedly connected to the sliding block of the left up-down moving mechanism (240), the mounting frame (260) is fixedly connected to the sliding block of the right up-down moving mechanism (240), the front-back moving mechanisms (270) are installed on the lower side of the grabbing support (250), the main body of the negative pressure grabbing structure (300) is installed on the sliding block of the front-back moving mechanism (270), and the chip defect imaging equipment (400) is installed on the mounting frame (260).

5. The chip tester of claim 1, wherein, The negative pressure grabbing structure (300) comprises a negative pressure grabbing mechanism (310), a defect detection position degassing frame (320), a power-on test position degassing frame (330) and a transfer position degassing frame (340), the negative pressure grabbing mechanism (310) is installed on one mounting position of the movable end of the multi-position moving structure (200), the defect detection position degassing frame (320) is installed on the front end of the upper side of the marking structure (500), the power-on test position degassing frame (330) is installed on the rear end of the chip power-on test structure (600), the chip power-on test structure (600) is located on the left side of the defect detection position degassing frame (320), and the transfer position degassing frame (340) is fixedly connected to the right end above the conveying position of the conveyor cabinet structure (100). The defect detection position degassing frame (320), the power-on test position degassing frame (330) and the transfer position degassing frame (340) can all resist the action of the negative pressure grabbing mechanism (310) to release the negative pressure adsorption.

6. The chip tester of claim 5, wherein, The negative pressure grabbing mechanism (310) comprises a vent pipe (311), a flexible suction cup (312), a vent box (313), an exhaust sealing plate (316) and an air inlet sealing plate (317), the flexible suction cup (312) is fixedly sleeved at the lower end of the vent pipe (311), the vent box (313) is fixedly connected to the upper end of the vent pipe (311), the inside of the flexible suction cup (312) is communicated with the vent box (313) through the vent pipe (311), the left and right sides of the vent box (313) are in the shape of small at the top and large at the bottom, the front and rear ends of the vent box (313) are in the shape of large at the top and small at the bottom, the left and right sides of the vent box (313) are provided with exhaust holes (314), the front and rear ends of the vent box (313) are provided with air inlet holes (315), the exhaust sealing plates (316) are respectively hinged to the outer walls of the left and right sides of the vent box (313), the exhaust sealing plates (316) are in close contact with the outer walls of the vent box (313) to seal the exhaust holes (314) under the action of gravity, the air inlet sealing plates (317) are respectively hinged to the inner walls of the front and rear ends of the vent box (313), the air inlet sealing plates (317) are in close contact with the inner walls of the vent box (313) to seal the air inlet holes (315) under the action of gravity, the bad point detection position degassing frame (320) and the transfer position degassing frame (340) can abut against the air inlet sealing plates (317) at the front end of the vent box (313), so that the vent box (313) is ventilated, and the power-on test position degassing frame (330) can abut against the air inlet sealing plates (317) at the rear end of the vent box (313), so that the vent box (313) is ventilated.

7. The chip tester of claim 5, wherein, The bad point detection position degassing frame (320) comprises a base (321) and a wedge-shaped degassing plate (322), the wedge-shaped degassing plate (322) is fixedly connected to the upper end of the base (321), and the wedge-shaped degassing plate (322) can abut against the negative pressure grabbing mechanism (310) to release the negative pressure adsorption, the bad point detection position degassing frame (320), the power-on test position degassing frame (330) and the transfer position degassing frame (340) are the same in structure.

8. The chip tester of claim 1, wherein, The marking structure (500) comprises a chip marking bit plate (510), a front-back moving mechanism (520), a left-right moving mechanism (530), a movable block (540) and a marking pen mechanism (550), the chip marking bit plate (510) is fixedly connected above the conveying bit of the conveyor cabinet structure (100), a chip groove is formed in the upper side of the chip marking bit plate (510), the front-back moving mechanism (520) is arranged on the upper side of the chip marking bit plate (510), the front-back moving mechanism (520) is located on the left and right sides of the chip groove, the left-right moving mechanism (530) is arranged on the slider of the front-back moving mechanism (520), the movable block (540) is arranged on the left-right moving mechanism (530), the left-right moving mechanism (530) can drive the movable block (540) to move left and right, and the marking pen mechanism (550) is installed on the movable block (540).

9. The chip tester of claim 8, wherein, The marking pen mechanism (550) comprises an electric push rod (551), a pressing plate (552), a baffle frame (553), a positioning cylinder (554), a marking pen (555), a limiting ring (556) and a compression spring (557), the electric push rod (551) is fixedly connected to the upper side of the movable block (540), the pressing plate (552) is fixedly connected to the top end of the output end of the electric push rod (551), the baffle frame (553) is fixedly connected to the lower side of the pressing plate (552), the positioning cylinder (554) is fixedly connected to the movable block (540), the limiting ring (556) is fixedly sleeved on the marking pen (555), the marking pen (555) slides through the pressing plate (552), the baffle frame (553) and the positioning cylinder (554), the compression spring (557) is sleeved on the marking pen (555), the two ends of the compression spring (557) are pressed against the pressing plate (552) and the limiting ring (556) respectively, and the lower end of the compression spring (557) presses the limiting ring (556) against the baffle frame (553).

10. The chip tester of claim 1, wherein, The chip power-on test structure (600) comprises a mounting seat (610) and a chip power-on test seat (620), the chip power-on test seat (620) is fixedly connected to the mounting seat (610), the chip power-on test seat (620) is provided with a test groove, and a chip falls into the test groove to perform power-on test on the chip.

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