Head-mounted display device

Abstract

The invention discloses head-mounted display equipment, and relates to the technical field of intelligent display equipment, and the head-mounted display equipment comprises a system-in-package main board, an auxiliary circuit board, a conductive part which is electrically connected with the system-in-package main board and the auxiliary circuit board, and a mirror frame. The system-in-package main board and the auxiliary circuit board are arranged on the two sides of the mirror frame respectively. According to the technical scheme provided by the invention, the system-in-package mainboard with a higher integration level is adopted, and the system-in-package mainboard is arranged in the mirror frame and is electrically connected with the auxiliary circuit board through the conductive piece; compared with the prior art, the overall size of the head-mounted display device can be optimized, and the internal space of the device is saved.

Description

Technical Field

[0001] This invention relates to the field of intelligent display device technology, and in particular to a head-mounted display device. Background Technology

[0002] Head-mounted displays (HMDs) are display devices installed on the head and are widely used in fields such as virtual reality (VR), augmented reality (AR), and mixed reality (MR). Depending on the technology and application scenario, HMDs can be categorized into several types. In HMDs, weight and size are often key factors affecting user comfort; miniaturization is a mainstream trend in HMD design, therefore, optimizing the size of existing HMDs is a technical problem that needs to be solved. Summary of the Invention

[0003] The main objective of this invention is to provide a head-mounted display device that reduces the size of the head-mounted display device, thereby providing good wearing comfort and improving the user experience.

[0004] To achieve the above objectives, the present invention provides a head-mounted display device comprising:

[0005] The integrated components include a system-in-package (SiP) motherboard and a secondary circuit board, and conductive elements electrically connecting the SiP motherboard and the secondary circuit board; and

[0006] The integrated components are arranged inside the frame, and the system-in-package mainboard and the sub-circuit board are respectively arranged on both sides of the frame.

[0007] In one embodiment, each side of the frame is provided with a mounting portion, the mounting portion having a mounting cavity, and the frame is also provided with a wiring channel connecting the two mounting cavities. The system-in-package main board and the sub-circuit board are respectively disposed in one of the mounting cavities, and the conductive component is disposed in the wiring channel.

[0008] In one embodiment, the conductive element is configured as a flexible circuit board, and the wire passage is located at the top of the frame.

[0009] In one embodiment, the system-in-package motherboard is bonded and fixed to the mounting cavity.

[0010] In one embodiment, the head-mounted display device further includes a wearing member connected to the mounting portion.

[0011] In one embodiment, the wearable device includes a battery that is electrically connected to the integrated component.

[0012] In one embodiment, the wearable device also includes a speaker electrically connected to the battery.

[0013] In one embodiment, the wearable device is configured as two temples connected to the mounting portion, and the speaker comprises two speakers, each disposed within one of the temples.

[0014] In one embodiment, a battery and a speaker are sequentially disposed within each of the two temples, with the speaker being closer to the end of the temple than the battery.

[0015] In one embodiment, the eyeglass frame includes two frame portions and a nose pad disposed between the two frame portions; the system-in-package mainboard and the sub-circuit board are respectively arranged on the outside of the frame portions, and the conductive element passes through the two frame portions.

[0016] The technical solution of this invention employs a more integrated system-in-package (SoC) motherboard, which is placed inside the frame and electrically connected to a secondary circuit board via conductive components. Compared to existing solutions, this optimizes the overall size of the head-mounted display device and saves internal space. In traditional eyeglass-style head-mounted displays, the motherboard is relatively large, requiring significant installation space. To accommodate this, the motherboard is placed inside the temples, which also house other components, making the device bulky. This solution, using a more integrated SoC motherboard, reduces overall size and weight, thus providing better wearing comfort. By increasing the motherboard's integration and placing it inside the frame, the eyeglass-style head-mounted display device becomes lighter and more durable, while also enhancing the user experience and making it a more attractive product. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of an embodiment of the integrated component in the head-mounted display device provided by the present invention;

[0019] Figure 2 This is a cross-sectional structural diagram of the head-mounted display device provided by the present invention.

[0020] Explanation of icon numbers:

[0021] 10. System-in-package mainboard; 20. Sub-circuit board; 30. Conductive component; 40. Frame; 41. Frame part; 42. Mounting part; 421. Mounting cavity; 422. Cable routing channel; 50. Temple; 60. Battery; 70. Speaker.

[0022] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0024] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0025] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0026] Head-mounted displays (HMDs) are display devices installed on the head and are widely used in fields such as virtual reality (VR), augmented reality (AR), and mixed reality (MR). Depending on the technology and application, HMDs can be categorized into several types. In HMDs, weight and size are typically key factors affecting user comfort.

[0027] Therefore, taking AR as an example, this invention proposes a head-mounted display device to reduce the size of the head-mounted display device, thereby providing good wearing comfort and improving user experience.

[0028] Please see Figures 1 to 2 In one embodiment of the present invention, the head-mounted display device includes an integrated component and a frame 40. The integrated component includes a system-in-package (SiP) motherboard 10, a sub-circuit board 20, and a conductive element 30 electrically connecting the SiP motherboard 10 and the sub-circuit board 20. The integrated component is arranged inside the frame 40, and the package and the printed circuit board are respectively arranged on both sides of the frame 40. The shape of the frame 40 is not limited; it can be a frame 40 with two lens rings, a half-frame, or a frameless frame; it can also be an eye mask type, completely covering the user's eyes. The frame 40 can be connected to a wearing device to fix the frame 40 in front of the user's eyes.

[0029] The technical solution of this invention employs a more integrated system-in-package (SoC) motherboard 10, which is placed within the frame 40 and electrically connected to the sub-circuit board 20 via conductive components 30. Compared to existing solutions, this optimizes the overall size of the head-mounted display device and saves internal space. Taking glasses as an example, traditional solutions have a large motherboard size, requiring more installation space. To accommodate the motherboard, it is placed within the temple 50, which also needs to house other components, making the device bulky. This solution, using a more integrated SoC motherboard 10, reduces the overall size and weight, thus providing better wearing comfort. By increasing the integration of the motherboard and placing it within the frame 40, AR glasses become lighter and more durable, while also enhancing the user experience and making them a more attractive product.

[0030] The system-in-package motherboard 10 adopts SiP (System-in-Package) packaging technology. It generally integrates a processor / CPU as the core of computing, which processes data and instructions; a memory (RAM / ROM) that provides storage space for data and programs to ensure efficient read and write during operation; a communication module that enables wireless communication functions such as Wi-Fi, Bluetooth, and NFC; an audio codec that processes audio input and output, such as the signals from the microphone and speaker 70; and a display driver chip that controls the screen display and processes image signals.

[0031] The secondary motherboard typically encapsulates components that the system-in-package motherboard 10 cannot or is inconvenient to integrate. These components may include high-performance audio processing circuitry, which may require large space and complex wiring for analog circuitry; large-capacity batteries 60 or heat sinks, which are bulky, heavy, or require direct contact with the heat dissipation structure; USB, HDMI, etc., which typically require robust physical connections and interfaces and connectors with large contact areas; antennas may require specific layouts and space for optimized signal transmission, making them difficult to encapsulate simply in the system-in-package motherboard 10; buttons, switches, and mechanical parts that connect to the casing or structural components.

[0032] The separate setup of the system-in-package motherboard 10 and the sub-circuit board 20 can also solve the heat dissipation problem caused by high-density integration, so as to meet the additional heat dissipation design required for high-power or high-heat components; at the same time, it reduces production costs and manufacturing difficulty.

[0033] To facilitate the installation of integrated components, each side of the frame 40 is provided with a mounting portion 42, which has a mounting cavity 421. The frame 40 also has a wiring channel 422 connecting the two mounting cavities 421. The system-in-package main board 10 and the sub-circuit board 20 are respectively disposed in one mounting cavity 421, and the conductive component 30 is disposed in the wiring channel 422. The mounting portion 42 is designed as a closed cavity to ensure that the main board and the sub-circuit board 20 are well protected. The wiring channel 422 is used to connect the system-in-package main board 10 and the sub-circuit board 20 in the two mounting cavities 421 to ensure the electrical connection between them. Hiding the wiring inside the frame 40 also improves the appearance and security. After the integrated components are arranged in the frame 40, the space inside the temple 50 is saved, which facilitates the miniaturization of AR glasses and improves the user's wearing comfort.

[0034] Reference Figure 2 In this embodiment, the eyeglass frame 40 includes two frame portions 41 and a nose pad disposed between the two frame portions 41. The nose pad is integrated on a flexible circuit board, and a charging port is also provided between the nose pads. The system-in-package main board 10 and the sub-circuit board 20 are respectively arranged on the outer side of the frame portions 41, and the conductive component 30 passes through the two frame portions 41. The system-in-package main board 10 and the sub-circuit board 20 are respectively arranged on the outer side of the frame portions 41. This design can make full use of space and is conducive to heat dissipation.

[0035] The conductive component 30 is configured as a flexible circuit board; the flexible circuit board can be bent and twisted to adapt to the space constraints inside the frame 40 without being damaged by slight bending or pressure on the frame 40. The top wiring channel 422 utilizes the space at the top of the frame 40, which is typically a relatively empty area, thus freeing up more space for other important components. Furthermore, the design of the top wiring channel 422 conceals wiring, resulting in a cleaner overall appearance for the glasses, without any messy exposed wires. The design of the top wiring channel 422 can increase the structural strength of the glasses without adding extra weight, as the top is one of the most robust parts of the glasses structure.

[0036] In other embodiments, the conductive element 30 can also take many different forms to realize the electrical connection between electronic components. For example, it can be a simple metal sheet or spring-loaded contact; or, a fabric containing conductive fibers can be used as the connector.

[0037] The system-in-package (SoC) motherboard 10 can be secured within the mounting cavity 421 in various ways. In this embodiment, the SoC motherboard 10 is secured within the mounting cavity 421 by adhesive bonding. Since no additional fasteners are required, bonding can make more efficient use of space in the compact space of AR glasses. Moreover, the cost of bonding is relatively low, which can reduce the overall manufacturing cost.

[0038] In other embodiments, clips made of plastic or metal can be used to secure the motherboard within the mounting cavity 421. Alternatively, screws can be used to secure the motherboard within the mounting cavity 421, but this requires tools for installation and removal, potentially increasing assembly difficulty and cost.

[0039] To facilitate user comfort, the head-mounted display device also includes a wearing strap, which can serve as a head-mounted restraint. To enable the device to function, a battery 60 is integrated within the wearing strap, electrically connected to an integrated component. The battery 60, electrically connected to the integrated component (i.e., the system-in-package motherboard 10 and other electronic components), powers the entire system. Integrating the battery 60 within the wearing strap helps to balance weight distribution, making the glasses more comfortable to wear. Additionally, a speaker 70, electrically connected to the battery 60, is also integrated within the wearing strap; this integration saves space, making the head-mounted display device more compact and lightweight.

[0040] Reference Figure 2Specifically, in this embodiment, the wearable device is configured with two temples 50, which are connected to the mounting part 42. Each temple 50 contains a battery 60 and a speaker 70 sequentially. The speaker 70 is closer to the end of the temple 50 than the battery 60. This dual-battery design in the temple 50 improves battery life and provides a better user experience. Furthermore, the speaker 70, located closer to the end of each temple 50 than the battery 60, ensures that sound is directly transmitted to the user's ears, improving the audio experience while reducing external interference. The sequential arrangement of the battery 60 and speaker 70 in each temple 50 further balances the weight and improves wearing comfort.

[0041] When the head-mounted display device is AR glasses, it also includes a display for displaying virtual images, a lens for projecting the image from the display onto the user's retina, and a camera for capturing images and videos of the user's surroundings. The imaging principle is as follows: When the user wears the AR glasses, the camera captures the user's surroundings. The processor combines this information with the virtual image the user is viewing and sends it to the display. The lens projects the image from the display onto the user's retina, allowing the user to see both the real world and the virtual image simultaneously. This provides an immersive augmented reality experience. Furthermore, because the system-in-package motherboard 10, the sub-circuit board 20, and the conductive components 30 electrically connecting the system-in-package motherboard 10 and the sub-circuit board 20 are all located on the frame 40, the size and weight of the AR glasses can be reduced, providing a better user experience.

[0042] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A head-mounted display device, comprising: The application relates to a head-mounted display device. The head-mounted display device comprises an integrated assembly, a mirror frame and a wearing part. The integrated assembly comprises a system-in-package mainboard, a sub-circuit board and a conductive piece electrically connecting the system-in-package mainboard and the sub-circuit board. The mirror frame is arranged with the integrated assembly, and the system-in-package mainboard and the sub-circuit board are arranged on two sides of the mirror frame respectively.

2. The head-mounted display device of claim 1, wherein, Each of the two sides of the mirror frame is provided with a mounting part having a mounting cavity.

3. The head-mounted display device of claim 2, wherein, The mirror frame is further provided with a wire passage communicating the two mounting cavities.

4. The head-mounted display device of claim 2, wherein, The system-in-package mainboard and the sub-circuit board are arranged in the mounting cavities respectively, and the conductive piece is arranged in the wire passage.

5. The head-mounted display device of claim 2, wherein, The conductive piece is configured as a flexible circuit board, and the wire passage is arranged at the top of the mirror frame.

6. The head-mounted display device of claim 5, wherein, The system-in-package mainboard is fixedly connected to the mounting cavity.

7. The head-mounted display device of claim 6, wherein, The head-mounted display device further comprises the wearing part connected to the mounting part.

8. The head-mounted display device of claim 7, wherein, The wearing part is provided with a battery electrically connected to the integrated assembly.

9. The head-mounted display device of claim 8, wherein, The wearing part is further provided with a loudspeaker electrically connected to the battery.

10. The head-mounted display device of claim 1, wherein, The wearing part is configured as two legs connected to the mounting part. The loudspeaker comprises two loudspeakers arranged in the two legs respectively. The two legs are sequentially provided with the battery and the loudspeaker. The loudspeaker is closer to the end of the leg than the battery. The mirror frame comprises two frame parts and a bridge arranged between the two frame parts. The system-in-package mainboard and the sub-circuit board are arranged on the outer sides of the frame parts respectively, and the conductive piece passes through the two frame parts.

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