Camera module, packaging method thereof and electronic equipment

Abstract

The invention provides a camera module, a packaging method thereof and electronic equipment. The camera module comprises a circuit board, an image sensor, a packaging piece and a lens assembly. The circuit board is provided with a first area, a second area and a third area which are sequentially connected, the second area surrounds the first area, and the third area surrounds the second area; the image sensor is fixed in the first area, one part of the packaging piece is fixed in the second area, and the other part is fixed on the edge of the image sensor; a part of the lens assembly is fixedly connected with the part, fixedly connected with the third area of the circuit board, of the packaging piece. The packaging piece is arranged in the second area, close to the center, of the circuit board, so that the lens assembly can be directly connected with the circuit board, the situation that the packaging piece increases the height of the camera module is avoided, the shoulder height of the camera module is reduced, and miniaturization of the camera module is facilitated.

Description

Technical Field

[0001] This application relates to the field of camera module technology, specifically to a camera module and its packaging method, and electronic equipment. Background Technology

[0002] Camera modules are important components of electronic devices (such as mobile phones, tablets, or laptops). Camera modules are usually packaged using Molding On Chip (MOC) packaging technology. Specifically, the entire surface of the circuit board is injection molded to form a package, and then the lens assembly is bonded to the injection molded part using Active Alignment (AA) process technology to complete the packaging.

[0003] However, the packaging significantly affects the shoulder height of the camera module, which is detrimental to the miniaturization of the camera module. Summary of the Invention

[0004] This application provides a camera module and its packaging method, as well as an electronic device. The camera module includes a circuit board, an image sensor, a package, and a lens assembly. By placing the package in the central area of ​​the circuit board, the lens assembly can cover the package and connect to the circuit board, avoiding the package increasing the height of the camera module, reducing the back focal space of the camera module, and lowering the shoulder height of the camera module, which is beneficial to the miniaturization of the camera module.

[0005] In a first aspect, this application provides a camera module. The camera module includes a circuit board, an image sensor, a package, and a lens assembly; the circuit board has a first region, a second region, and a third region connected in sequence, the second region surrounding the first region, and the third region surrounding the second region; the image sensor is fixed to the first region, a portion of the package is fixed to the second region, and a portion is fixed to the edge of the image sensor; a portion of the lens assembly is fixedly connected to the third region of the circuit board, and a portion is fixedly connected to the package, and the image sensor is located on the light-emitting side of the lens assembly.

[0006] In this application, since the package can be directly injection molded on the circuit board, the package does not need to be fixed to the circuit board by means of adhesive or other means, and there is no need to set up a clearance structure to avoid other structures on the circuit board. This is conducive to the simplification and miniaturization of the package, thereby reducing the board area of ​​the circuit board, which in turn is conducive to the overall miniaturization of the camera module.

[0007] In this application, because the package is located only in a portion of the circuit board near the center, the lens assembly can be directly connected to the area near the edge of the circuit board. This allows the package to be located within the mounting space, without occupying the overall thickness of the camera module, thus reducing the overall thickness of the camera module and facilitating its miniaturization. Furthermore, since the lens assembly is directly connected to the circuit board, the distance between the lens and the image sensor in the lens assembly is reduced, thereby decreasing the back focus space of the camera module.

[0008] In this application, a portion of the package can be fixed to the second region, and a portion can be fixed to the edge of the image sensor, so that the package can encapsulate the image sensor onto the circuit board, thereby improving the installation stability of the image sensor.

[0009] In this application, since the lens assembly can be connected to the portion of the circuit board located in the third region, the lens assembly can bypass the package and achieve direct connection with the circuit board. Compared with the prior art where the lens assembly is mounted on the package, this implementation can avoid the package occupying the overall thickness of the camera module, thereby reducing the shoulder height of the camera module, which is conducive to the miniaturization of the camera module and thus to the thinning of electronic devices.

[0010] In some possible implementations, the camera module also includes encapsulating adhesive, part of which bonds the lens assembly to the circuit board, and part of which bonds the lens assembly to the encapsulation.

[0011] In this implementation, the encapsulating adhesive bonds both the lens assembly and the portion of the circuit board located in the third region, as well as the lens assembly and the package, improving the bonding stability of the lens assembly and contributing to the overall stability of the camera module's packaging. Furthermore, since the package is injection molded onto the circuit board, securing it to the board, there is a direct connection between the encapsulating adhesive, the lens assembly, and the package. This allows the lens assembly to be stably fixed to the circuit board, enhancing the structural stability of the camera module.

[0012] In some possible implementations, the lens assembly and the circuit board enclose a mounting space, within which the image sensor and its package are located.

[0013] In some possible implementations, the edges of the package are provided with connecting strips that extend from the edge of the package to the edge of the circuit board, and the lens assembly is also connected to the connecting strips.

[0014] In this implementation, after the injection-molded part is formed, the connecting material can be retained to reduce process difficulty, shorten process time, and thus reduce process costs. The connecting material connects to the edge of the package and extends to the edge of the circuit board. Since the injection-molded part is integrally formed, the connecting material and the package are integrated, which improves the connection strength between the package and the circuit board. Alternatively, since the thickness of the connecting material is less than the thickness of the package, the design depth of the second groove on the circuit board can be reduced, minimizing structural interference with the circuit board and facilitating the mating connection between the lens assembly and the circuit board.

[0015] In some possible implementations, the lens assembly is provided with a first groove, the opening of the first groove facing the circuit board, and the connecting material is disposed in the first groove.

[0016] In this implementation, the lens assembly has a first groove, which allows it to accommodate the connecting material after the lens assembly is mounted on the circuit board, thus preventing the connecting material from interfering with the lens assembly's installation. The design of the first groove eliminates the need to remove the connecting material after injection molding, reducing process difficulty, shortening process time, and ultimately lowering process costs.

[0017] The encapsulating adhesive can also bond the connector to the lens assembly. Specifically, the encapsulating adhesive bonds the inner wall of the first groove to the connector, which not only improves the stability of the lens assembly mounted on the circuit board, but also seals the first groove, thus improving the packaging stability of the camera module.

[0018] In some other possible implementations, the circuit board is provided with a second groove, the opening of which faces the lens assembly, and the connecting material is disposed within the second groove.

[0019] In this implementation, the circuit board has a second groove, which accommodates the connecting material after the lens assembly is mounted on the circuit board, thus preventing the connecting material from interfering with the assembly's installation. Due to the design of the second groove, the connecting material does not need to be removed after injection molding, reducing process difficulty, shortening process time, and consequently reducing process costs.

[0020] The encapsulating adhesive can also bond the connector to the lens assembly. Specifically, the encapsulating adhesive can bond the surface of the connector exposed in the second groove to the lens assembly, which not only improves the stability of the lens assembly mounted on the circuit board, but also seals the second groove, thus improving the packaging stability of the camera module.

[0021] The surface of the connecting material can be flush with the surface of the circuit board to improve the flatness of the circuit board surface, which is beneficial for the lens assembly to be mounted on the circuit board.

[0022] In some possible implementations, the thickness of the connecting material is less than the thickness of the package along the arrangement direction of the circuit board and the lens assembly.

[0023] In this implementation, the thickness of the connecting material is less than the thickness of the package, which helps reduce the difficulty of connecting material removal and improves the efficiency of connecting material removal. Because the thickness of the connecting material is less than the thickness of the package, it helps to reduce the design depth of the first groove on the lens assembly, thereby reducing structural interference with the lens assembly and facilitating the connection between the lens assembly and the circuit board.

[0024] In some possible implementations, an insulating layer is provided on the surface of the circuit board facing the lens assembly, and the insulating layer has slots that extend from the edge of the package to the edge of the circuit board.

[0025] In this implementation, the slotted design of the insulating layer ensures that the bridging material is located at the slot after the injection-molded part is formed. Since the insulating layer is removed at the slot, the metal portion of the circuit board is exposed. Due to the relatively weak bonding between the injection-molded plastic and the metal, the bridging material is easily removed at the slot; for example, it can be removed by mechanical force, reducing the difficulty of bridging material removal, shortening the time spent on bridging material removal, and lowering production costs. Furthermore, since only a portion of the insulating layer on the surface of the circuit board is removed without damaging the circuit board structure, the integrity of the circuit board is maintained. Additionally, because the bridging material is removed, there is no need for avoidance structures on the lens assembly and circuit board to accommodate it, ensuring the overall integrity of the camera module and contributing to the stability of the camera module packaging.

[0026] In some possible implementations, the image sensor is electrically connected to the circuit board via a wiring harness, and the wiring harness is encapsulated in a package.

[0027] In this implementation, encapsulating the wire harness with a package helps protect it from external corrosion and prevents it from swinging. This improves the stability of the electrical connection between the wire harness and the image sensor and the board body, and also enhances the quality of electrical signal transmission.

[0028] In some possible implementations, the image sensor has an imaging area and a non-imaging area, with the non-imaging area surrounding the imaging area, and a package connecting at least a portion of the image sensor located in the non-imaging area.

[0029] In this implementation, at least a portion of the image sensor located in the non-imaging area is connected by a package, which can improve the package stability of the image sensor and reduce the impact of the package on the image sensor's imaging.

[0030] In some possible implementations, the circuit board includes a board body and a reinforcing plate. The board body is mounted on the reinforcing plate and has a first through hole. The reinforcing plate covers one side of the first through hole. An image sensor is located in the first through hole and mounted on the reinforcing plate. There is a gap between the edge of the image sensor and the inner wall of the first through hole. One end of a wire harness is electrically connected to the image sensor, the wire harness passes through the gap, and the other end of the wire harness is electrically connected to the board body. A portion of the package fills the gap to enclose the wire harness.

[0031] In this implementation, the image sensor is located within the first through-hole, which improves the installation stability of the image sensor and protects it. A gap is provided to allow for installation space, facilitating the sensor's mounting. A wiring harness is used to facilitate electrical connection between the image sensor and the board body across the gap. Filling the gap with a package enhances the connection strength between the package and the image sensor, improving the image sensor's packaging stability.

[0032] In some possible implementations, the package includes a first sub-package and a second sub-package. The first sub-package is positioned closer to the image sensor than the second sub-package, and the second sub-package covers at least a portion of the first sub-package. The flexural modulus of the first sub-package is smaller than that of the second sub-package to improve warping issues and reduce the risk of image sensor warping caused by curing of the first sub-package.

[0033] In some possible implementations, the molding shrinkage stress of the first sub-package is less than that of the second sub-package, so as to reduce the shrinkage stress of the first sub-package during the curing imaging process, thereby reducing the risk of image sensor warping caused by the curing of the first sub-package.

[0034] In some possible implementations, the package includes a first sub-package and a second sub-package. The first sub-package is positioned closer to the image sensor than the second sub-package, and the second sub-package covers at least a portion of the first sub-package. The optical reflectivity of the first sub-package is less than that of the second sub-package to reduce the risk of stray light generated by the reflected light from the first sub-package, thereby reducing stray light interference with the image sensor's imaging.

[0035] In some possible implementations, the package includes a first sub-package and a second sub-package. The first sub-package is positioned closer to the image sensor than the second sub-package, and the second sub-package covers at least a portion of the first sub-package. The second sub-package has a higher hardness than the first sub-package to ensure the overall structural strength of the package. In addition, the higher hardness of the second sub-package is beneficial to improving the impact resistance and better protecting the filter.

[0036] In some possible implementations, the first sub-package is made of thermosetting plastic; the second sub-package is also made of thermosetting plastic, such that the first and second sub-packages are formed sequentially by two injection molding processes.

[0037] In some other possible implementations, the first sub-package is made of thermosetting plastic, and the second sub-package is made of metal, so that the hardness of the second sub-package is higher than that of the first sub-package, thereby enabling the shockproof design of the filter.

[0038] In some possible implementations, the image sensor is electrically connected to the circuit board via a wiring harness, a first sub-package covers the periphery of the image sensor and is mounted on the circuit board, and the first sub-package encloses the wiring harness.

[0039] In this implementation, the first and second sub-packages are formed sequentially through two injection molding processes. The first sub-package is designed to cover the periphery of the image sensor and be mounted on the circuit board, ensuring stable encapsulation of the image sensor. This allows for connection between the image sensor, the first sub-package, and the circuit board, improving overall stability and facilitating the formation of the second sub-package during the second injection molding. Furthermore, by wrapping the wire harness with the first sub-package, the wire harness is protected after the first injection molding, preventing wobbling during subsequent processes and reducing the risk of damage.

[0040] In some possible implementations, the camera module also includes a filter, which is located on the object side of the image sensor and is positioned directly opposite the image sensor; a portion of the second sub-package covers the first sub-package, another portion of the second sub-package is mounted on the circuit board, and the filter is mounted on the second sub-package.

[0041] In this implementation, connecting the first sub-package to the circuit board via the second sub-package strengthens the connection between the package and the circuit board, thereby enhancing the structural stability of the package and improving the stability of the image sensor and filter. Furthermore, mounting the filter to the second sub-package improves the stability of the filter's support.

[0042] The first sub-package may include a first part, a second part, and a third part. The first part of the first sub-package may cover the periphery of the image sensor. The third part of the first sub-package may be connected to the board body. The second part of the first sub-package may be connected between the first part and the third part of the first sub-package, and the second part of the first sub-package may fill the gap between the image sensor and the board body.

[0043] The second sub-package may include a first part and a second part. The first part of the second sub-package may cover the surface of the first sub-package facing away from the circuit board. The first part of the second sub-package has an L-shaped structure. The first part of the second sub-package and the first sub-package can together form a boss for mounting a filter. The second part of the second sub-package can be connected to the first part of the second sub-package and connected to the board body.

[0044] In some possible implementations, the camera module also includes a filter, which is located on the object side of the image sensor and is positioned directly opposite the image sensor; a second sub-package is stacked on top of the first sub-package, and the second sub-package is spaced apart from the circuit board, with the filter mounted on the second sub-package.

[0045] In this implementation, since the bending modulus and / or molding shrinkage stress of the first sub-package is less than that of the second sub-package, by spacing the second sub-package from the circuit board and directly connecting the image sensor to the board body with the first sub-package, the stress interference received by the image sensor can be reduced, thereby lowering the risk of image sensor warping. Furthermore, mounting the filter on the second sub-package improves the stability of the filter's support.

[0046] In some possible implementations, the camera module also includes a filter, which is located on the object side of the image sensor and is positioned directly opposite the image sensor; the filter is mounted on a first sub-package, a portion of a second sub-package covers the first sub-package, and another portion of the second sub-package is mounted on a circuit board.

[0047] In this implementation, since the optical reflectivity of the first sub-package is lower than that of the second sub-package, using the first sub-package to carry the filter reduces the risk of stray light near the filter, thereby improving the stray light problem, enhancing the filter's filtering effect, and ultimately improving the image quality of the image sensor. Furthermore, connecting the first sub-package to the circuit board via the second sub-package strengthens the connection between the package as a whole and the circuit board, thus enhancing the structural stability of the package and improving the stability of both the image sensor and the filter.

[0048] The second sub-package may include a first part and a second part. The first part of the second sub-package may cover the surface of the first sub-package facing away from the circuit board. The second part of the second sub-package may be connected to the first part of the second sub-package and connected to the board body.

[0049] The portion of the first sub-package that is not covered by the second sub-package can form a boss for mounting a filter.

[0050] In some possible implementations, the camera module also includes a filter, which is located on the object side of the image sensor and is positioned directly opposite the image sensor; the filter is mounted on a first sub-package, a second sub-package is stacked on top of the first sub-package, and the second sub-package is spaced apart from the circuit board.

[0051] In this implementation, since the optical reflectivity of the first sub-package is lower than that of the second sub-package, using the first sub-package to carry the filter reduces the risk of stray light near the filter, thereby improving the stray light problem, enhancing the filter's filtering effect, and ultimately improving the image sensor's imaging quality. Because the flexural modulus and / or molding shrinkage stress of the first sub-package are lower than those of the second sub-package, by spacing the second sub-package from the circuit board and directly connecting the image sensor to the board body using the first sub-package, stress interference received by the image sensor can be reduced, thus lowering the risk of image sensor warping.

[0052] The portion of the first sub-package that is not covered by the second sub-package can form a boss for mounting a filter.

[0053] In some possible implementations, the camera module also includes a filter, which is located on the object side of the image sensor and is positioned directly opposite the image sensor; the package has a second through-hole, in which the image sensor is located and mounted on the circuit board, and the filter is located in the second through-hole and mounted on the package.

[0054] In this implementation, the filter is located on the object side of the image sensor and is positioned directly opposite the image sensor to filter light and improve the imaging quality of the image sensor. By positioning the filter within the second through-hole, it is beneficial to protect the filter through the encapsulation, preventing damage to the filter from impacts.

[0055] In some possible implementations, the package has a boss that is circumferentially disposed along the inner wall of the second through hole, and the filter and the image sensor are mounted on opposite sides of the boss, with the boss covering the periphery of the image sensor.

[0056] In this implementation, the boss divides the second through hole into a connected first sub-hole and a second sub-hole. The first sub-hole accommodates the image sensor. The boss and the rib together form an L-shaped restraint on the image sensor, further improving the encapsulation strength and stability of the image sensor. The filter and the image sensor are mounted on opposite sides of the boss, allowing for a spaced arrangement between them. The boss improves the consistency of the spacing between the filter and the image sensor, simplifying filter installation and enhancing the filter's filtering effect, thereby improving the image quality of the image sensor.

[0057] The protrusion can abut against the non-imaging area of ​​the image sensor to reduce the risk of imaging interference to the image sensor.

[0058] In some possible implementations, the surface of the filter facing away from the circuit board is located within a second through-hole.

[0059] In this implementation, by positioning the filter within the second through-hole, the packaged component effectively protects the filter, preventing damage from impacts. The surface of the filter facing away from the circuit board can be located within the second through-hole; that is, the entire filter is situated within the second through-hole. This allows the packaged component to better protect the filter, further reducing the risk of damage.

[0060] The package includes clearance grooves to provide mounting space for the filter, facilitating its installation and removal. Furthermore, the clearance grooves also provide overflow space. Specifically, during filter mounting, the adhesive is fluid before curing to form a third adhesive. After the filter is mounted on the boss, the adhesive may overflow under pressure. The clearance grooves provide overflow space, allowing the overflowing adhesive to flow into the grooves, reducing the risk of adhesive spilling onto the filter and image sensor, thus minimizing interference with filtering and imaging.

[0061] Secondly, this application provides a packaging method for a camera module. The packaging method includes:

[0062] A circuit board is provided, having a first region, a second region, and a third region connected in sequence, the second region surrounding the first region and the third region surrounding the second region;

[0063] Mount the image sensor to the first area;

[0064] A package is formed on the circuit board, with a portion of the package fixed to the second region and a portion fixed to the edge of the image sensor;

[0065] Additionally, a portion of the lens assembly is fixedly connected to the third region of the circuit board, and another portion is connected to the package. The image sensor is located on the light-emitting side of the lens assembly.

[0066] In this application, since the package can be directly injection molded on the circuit board, the package does not need to be fixed to the circuit board by means of adhesive or other means, and there is no need to set up a clearance structure to avoid other structures on the circuit board. This is conducive to the simplification and miniaturization of the package, thereby reducing the board area of ​​the circuit board, which in turn is conducive to the overall miniaturization of the camera module.

[0067] In this application, because the package is located only in a portion of the circuit board near the center, the lens assembly can be directly connected to the area near the edge of the circuit board. This allows the package to be located within the mounting space, without occupying the overall thickness of the camera module, thus reducing the overall thickness of the camera module and facilitating its miniaturization. Furthermore, since the lens assembly is directly connected to the circuit board, the distance between the lens and the image sensor in the lens assembly is reduced, thereby decreasing the back focus space of the camera module.

[0068] In this application, a portion of the package can be fixed to the second region, and a portion can be fixed to the edge of the image sensor, so that the package can encapsulate the image sensor onto the circuit board, thereby improving the installation stability of the image sensor.

[0069] In this application, since the lens assembly can be connected to the portion of the circuit board located in the third region, the lens assembly can bypass the package and achieve direct connection with the circuit board. Compared with the prior art where the lens assembly is mounted on the package, this implementation can avoid the package occupying the overall thickness of the camera module, thereby reducing the shoulder height of the camera module, which is conducive to the miniaturization of the camera module and thus to the thinning of electronic devices.

[0070] Some possible implementations include forming a package in the second region, including:

[0071] Injection molding forms a soft gel, part of which covers the second area and the edge of the image sensor, and another part of which extends to the edge of the circuit board. The soft gel is attached to the circuit board.

[0072] The curing soft colloid forms an encapsulation and a connecting material. Part of the encapsulation is fixed to the second region, and part of it is fixed to the edge of the image sensor. The connecting material extends from the edge of the encapsulation to the edge of the circuit board.

[0073] And, remove the continuous material.

[0074] In this implementation, since the connecting material is removed, there is no need to set up avoidance structures for the connecting material on the lens assembly and the circuit board, which can ensure the overall integrity of the camera module and help ensure the stability of the camera module packaging.

[0075] In some possible implementations, the encapsulation method removes the brittle material by laser, water jet, or ion beam polishing.

[0076] In some possible implementations, the packaging method further includes the following steps before the step of forming the package on the circuit board:

[0077] A slot is formed by removing part of the insulating layer on the surface of the circuit board, and the slot extends from the edge of the second region to the edge of the circuit board.

[0078] The packaging method removes the connecting material using mechanical force.

[0079] In this implementation, the slotted design of the insulating layer ensures that the bridging material is located at the slot after the injection-molded part is formed. Since the insulating layer is removed at the slot, the metal portion of the circuit board is exposed. Due to the relatively weak adhesion between the injection-molded material and the metal, the bridging material is easily removed at the slot; for example, it can be removed using mechanical force. This reduces the difficulty of bridging material removal, shortens the time spent on bridging material removal, and lowers production costs. Furthermore, since only a portion of the insulating layer on the surface of the circuit board is removed without damaging the circuit board structure, the integrity of the circuit board can be maintained.

[0080] Some possible implementations involve forming a package on a circuit board, including:

[0081] The first soft gel is formed by injection molding. Part of the first soft gel covers the second region and the edge of the image sensor. Another part of the first soft gel extends to the edge of the circuit board. The first soft gel is connected to the circuit board.

[0082] The first soft colloid is cured to form a first sub-package and a first connecting material. A portion of the first sub-package is fixed to the second region and a portion is fixed to the edge of the image sensor. The first connecting material extends from the edge of the first sub-package to the edge of the circuit board.

[0083] Remove the first batch of material;

[0084] Injection molding forms a second soft gel, which covers and connects to the first sub-package, and another portion of the second soft gel extends to the edge of the circuit board.

[0085] The second soft colloid is cured to form a second sub-package and a second connector, the second sub-package covering at least a portion of the first sub-package, and the second connector extending from the edge of the second sub-package to the edge of the circuit board.

[0086] And, remove the second batch of material.

[0087] In this implementation, a first sub-encapsulation and a second sub-encapsulation are formed through two injection molding processes, and the two injection molding processes are followed by a continuous material treatment. Because two injection molding processes are used, the materials used in the two processes can be different. Specifically, thermosetting plastics with different properties can be used to form a first soft gel and a second soft gel, respectively. Specifically, the flexural modulus of the first sub-encapsulation is less than that of the second sub-encapsulation, and / or, the shrinkage stress of the first soft gel solidified to form the first sub-encapsulation is less than that of the second soft gel solidified to form the second sub-encapsulation, and / or, the optical reflectivity of the first sub-encapsulation is less than that of the second sub-encapsulation, and / or, the hardness of the second sub-encapsulation is greater than that of the first sub-encapsulation.

[0088] In some possible implementations, the encapsulation method uses thermosetting plastic injection molding to form a first soft gel, and the encapsulation method uses thermosetting plastic injection molding to form a second soft gel.

[0089] In some possible implementations, the encapsulation method uses thermosetting plastics with different properties to injection mold a first soft colloid and a second soft colloid, respectively; wherein the flexural modulus of the first sub-encapsulation is less than that of the second sub-encapsulation, in order to improve the warping problem and reduce the risk of image sensor warping caused by the curing of the first sub-encapsulation.

[0090] In some possible implementations, the shrinkage stress of the first soft colloid solidified to form the first sub-encapsulation is less than the shrinkage stress of the second soft colloid solidified to form the second sub-encapsulation, thereby reducing the shrinkage stress of the first sub-encapsulation during the solidification imaging process and thus reducing the risk of image sensor warping caused by the solidification of the first sub-encapsulation.

[0091] In some possible implementations, the optical reflectivity of the first sub-package is less than that of the second sub-package to reduce the risk of stray light generated by the reflected light from the first sub-package, thereby reducing the interference of stray light on the image sensor's imaging.

[0092] In some possible implementations, the hardness of the second sub-package is greater than that of the first sub-package to ensure the overall structural strength of the package. In addition, the higher hardness of the second sub-package is beneficial to improving the impact resistance and can better protect the filter.

[0093] Some possible implementations involve forming a package on a circuit board, including:

[0094] Injection molding forms a soft gel, part of which covers the second area and the edge of the image sensor, and another part of which extends to the edge of the circuit board. The soft gel is connected to the circuit board.

[0095] In addition, the curing soft colloid forms a package and a connecting material, a portion of the package is fixed to the second region, a portion is fixed to the edge of the image sensor, and the connecting material extends from the edge of the package to the edge of the circuit board.

[0096] The lens assembly has a first recess that securely connects a portion of the lens assembly to a third region of the circuit board, including:

[0097] Align the first groove of the lens assembly with the connecting material;

[0098] In addition, the lens assembly is mounted in the third region of the circuit board, and the first groove accommodates the connecting material.

[0099] In this implementation, the lens assembly has a first groove, which allows it to accommodate the connecting material after the lens assembly is mounted on the circuit board, thus preventing the connecting material from interfering with the lens assembly's installation. The design of the first groove eliminates the need to remove the connecting material after injection molding, reducing process difficulty, shortening process time, and ultimately lowering process costs.

[0100] In some possible implementations, the circuit board has a second recess extending from the edge of the second region to the edge of the circuit board, forming a package on the circuit board, including:

[0101] Injection molding forms a soft gel, part of which covers the second area and the edge of the image sensor, while another part of the soft gel is located in the second groove. The soft gel is connected to the circuit board.

[0102] Additionally, a curing soft colloid is formed to create an encapsulation and a connecting material. A portion of the encapsulation is fixed to the second region, and a portion is fixed to the edge of the image sensor. The connecting material is housed in the second groove.

[0103] In this implementation, the circuit board has a second groove, which accommodates the connecting material after the lens assembly is mounted on the circuit board, thus preventing the connecting material from interfering with the assembly's installation. Due to the design of the second groove, the connecting material does not need to be removed after injection molding, reducing process difficulty, shortening process time, and consequently reducing process costs.

[0104] Thirdly, this application provides an electronic device. The electronic device includes a housing and a camera module as described above, the camera module being mounted on the housing.

[0105] In this application, since the lens assembly can be connected to the portion of the circuit board located in the third region, the lens assembly can bypass the package and achieve direct connection with the circuit board. Compared with the prior art where the lens assembly is mounted on the package, this implementation can avoid the package occupying the overall thickness of the camera module, thereby reducing the shoulder height of the camera module, which is conducive to the miniaturization of the camera module and thus to the thinning of electronic devices. Attached Figure Description

[0106] FIG. 1A This is a schematic diagram of the structure of the electronic device provided in some embodiments of this application;

[0107] FIG. 1B yes FIG. 1A A partially exploded structural diagram of the electronic device shown.

[0108] FIG. 2 yes FIG. 1A The diagram shows a schematic representation of the camera module in some embodiments of the electronic device shown.

[0109] FIG. 3 yes FIG. 2 The diagram shows a partial structural exploded view of the camera module in some embodiments.

[0110] FIG. 4 yes FIG. 2 The diagram shows a partial structural schematic of the camera module cut along line AA in some embodiments.

[0111] FIG. 5 yes FIG. 2 The diagram shows the structural schematic of the plate body in some embodiments of the camera module.

[0112] FIG. 6 It includes FIG. 5 The schematic diagram of the circuit board of the board body shown in some embodiments;

[0113] FIG. 7 yes FIG. 6 The circuit board shown is an exploded view in some embodiments;

[0114] FIG. 8 yes FIG. 6 The diagram shown is a cross-section of the circuit board along line BB in some embodiments.

[0115] FIG. 9 yes FIG. 6 The diagram shows a schematic representation of a circuit board mounting an image sensor in some embodiments.

[0116] FIG. 10 yes FIG. 9 The diagram shown is a partially exploded view of the structure in some embodiments.

[0117] FIG. 11 yes FIG. 9 The diagram shows a cross-section of the circuit board along line CC in some embodiments;

[0118] FIG. 12 yes FIG. 9 The diagram shown illustrates a structure that forms an encapsulation in some embodiments.

[0119] FIG. 13 yes FIG. 12 The diagram shown is a partially exploded view of the structure in some embodiments.

[0120] FIG. 14A yes FIG. 12 The diagram shows the structure of the package in some embodiments;

[0121] FIG. 14B yes FIG. 14A A schematic diagram of the package shown from another perspective;

[0122] FIG. 15 yes FIG. 12 The diagram shown is a cross-section along line DD in some embodiments.

[0123] FIG. 16 This is a schematic diagram of an injection-molded package in some embodiments;

[0124] FIG. 17 yes FIG. 9 The structure shown is a schematic diagram of the package formed in some other embodiments;

[0125] FIG. 18 yes FIG. 12 The diagram shown is a schematic representation of the structure after the filter is installed in some embodiments.

[0126] FIG. 19 yes FIG. 18 A partially exploded diagram of the structure shown.

[0127] FIG. 20 yes FIG. 18 The diagram shown is a cross-section along line EE in some embodiments.

[0128] FIG. 21A yes FIG. 18 The diagram shown is a cross-section of the structure along line EE in some other embodiments;

[0129] FIG. 21B yes FIG. 18 The diagram shown is a cross-section of the structure along line EE in some other embodiments;

[0130] FIG. 22A yes FIG. 18 The diagram shown is a cross-section along line EE in some other embodiments.

[0131] FIG. 22B yes FIG. 18 The diagram shown is a cross-section along line EE in some other embodiments.

[0132] FIG. 23A yes FIG. 2 A schematic diagram of the motor in some embodiments of the camera module shown;

[0133] FIG. 23B yes FIG. 23A The diagram shown is a cross-section of the motor along line FF in some embodiments.

[0134] FIG. 24 yes FIG. 2 A schematic diagram of the lens in some embodiments of the camera module shown;

[0135] FIG. 25 yes FIG. 23A Motor installation shown FIG. 24 A schematic diagram of the lens assembly formed by the lens shown.

[0136] FIG. 26 yes FIG. 25 The diagram shows a partial structural exploded view of the lens assembly in some embodiments.

[0137] FIG. 27 yes FIG. 25 The diagram shown is a cross-section of the lens assembly along line GG in some embodiments.

[0138] FIG. 2 yes FIG. 4 The diagram shows a partial structural exploded view of the camera module in some other embodiments;

[0139] FIG. 28 yes FIG. 28 The diagram shows a partial structural schematic of the camera module shown, cut along line AA in some other embodiments;

[0140] FIG. 2 yes FIG. 28 A schematic diagram of the camera module in some other embodiments of the electronic device shown;

[0141] FIG. 3 yes FIG. 28 The diagram shows a partial structural exploded view of the camera module in some embodiments.

[0142] FIG. 3 yes FIG. 29 The diagram shown is a cross-section of the camera module along line HH in some embodiments.

[0143] FIG. 29 yes FIG. 2 The diagram shows a schematic representation of a circuit board surface forming an injection molded part in some embodiments of the camera module shown.

[0144] FIG. 29 yes FIG. 4 The diagram shown is a cross-section along line II in some embodiments.

[0145] FIG. 21A to FIG. 23B yes FIG. 4 A schematic diagram of the camera module in some embodiments of the electronic device shown;

[0146] FIG. 21A to FIG. 23B yes FIG. 29 The diagram shows a partial structural exploded view of the camera module in some embodiments.

[0147] FIG. 30 to FIG. 32 yes FIG. 30The diagram shows a cross-section of the camera module along line JJ in some embodiments;

[0148] FIG. 1A yes FIG. 31 The diagram shows a schematic representation of a circuit board surface forming an injection molded part in some embodiments of the camera module shown.

[0149] FIG. 30 yes FIG. 32 The diagram shown is a partial structural breakdown of the structure in some embodiments.

[0150] FIG. 30 yes FIG. 30 The diagram shown is a cross-section along line KK in some embodiments.

[0151] FIG. 2 This is a schematic flowchart of a camera module packaging method provided in an embodiment of this application;

[0152] FIG. 32 to FIG. 34 yes FIG. 33 The diagram shows a process flow diagram of forming a package in some embodiments of the camera module packaging method.

[0153] FIG. 30 yes FIG. 34 The diagram shows a process flow diagram in some embodiments of the packaging method for the camera module, which involves processing the surface of the circuit board.

[0154] FIG. 33 yes FIG. 33 The diagram shows a process flow diagram of forming the package in some other embodiments of the packaging method for the camera module shown;

[0155] FIG. 34 yes FIG. 2 to FIG. 29 A flowchart illustrating the process of forming a package in a method for packaging a camera module, as shown in some embodiments;

[0156] FIG. 16 yes FIG. 35 to FIG. 37 The diagram shows a flow chart in some embodiments of the camera module packaging method for connecting the lens assembly and the circuit board.

[0157] FIG. 35 yes FIG. 1A The diagram illustrates the process of forming the package in the packaging method of the camera module shown in some other embodiments. Detailed Implementation

[0158] The embodiments of this application are described below with reference to the accompanying drawings.

[0159] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Multiple" refers to at least two.

[0160] The directional terms mentioned in the embodiments of this application, such as "upper", "lower", "inner", "outer", "top", "bottom", "side", etc., are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0161] In the embodiments of this application, the relative positional relationships mentioned, such as parallel, perpendicular, and aligned, are defined in relation to the current technological level, rather than being absolutely strict. Slight deviations are permissible; approximations of parallelism, perpendicularity, or alignment are all acceptable. For example, "A and B are parallel" means that A and B are parallel or approximately parallel, and the angle between A and B can be between 0 and 10 degrees. Similarly, "A and B are perpendicular" means that A and B are perpendicular or approximately perpendicular, and the angle between A and B can be between 80 and 100 degrees.

[0162] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," and "fourth" may explicitly or implicitly include one or more of that feature.

[0163] Please refer to the following: FIG. 36 and FIG. 35 , FIG. 37 This is a schematic diagram of the structure of the electronic device 100 provided in some embodiments of this application; FIG. 35 yes FIG. 35 A partially exploded structural diagram of the electronic device 100 shown.

[0164] In some embodiments, the electronic device 100 may be a mobile phone, tablet personal computer, laptop computer, smart screen, personal digital assistant (PDA), camera, personal computer, laptop computer, in-vehicle equipment, wearable device, augmented reality (AR) glasses, AR helmet, virtual reality (VR) glasses, or VR helmet, or other devices with camera functions. FIG. 2 In this embodiment, the electronic device 100 is a mobile phone as an example for description. Of course, other types of electronic devices 100 can also adopt a similar structure, which will not be described in detail below.

[0165] Understandable FIG. 38 to FIG. 40 and FIG. 38 The electronic device 100 is shown only schematically, and the actual shape, size, location, and construction of these components are not subject to change. FIG. 35 and FIG. 39 Due to limitations, electronic device 100 may also include, compared to FIG. 38 and FIG. 40 More or fewer parts.

[0166] In some embodiments, the electronic device 100 may include a camera module 10, a screen 20, and a housing 30. The screen 20 is used to display images, videos, etc. The screen 20 may include a light-transmitting panel 201 and a display screen 202. The light-transmitting panel 201 and the display screen 202 are stacked and fixedly connected. The light-transmitting panel 201 mainly serves to protect the display screen 202 from dust. The material of the light-transmitting panel 201 includes, but is not limited to, glass. The display screen 202 may be a flexible display screen or a rigid display screen. For example, the display screen 202 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (MLED) display screen, a micro organic light-emitting diode (MOLED) display screen, a quantum dot light-emitting diode (QLED) display screen, a liquid crystal display (LCD), etc.

[0167] For example, the housing 30 is used to protect the internal electronic components of the electronic device 100. The housing 30 may include a cover plate 301, a frame 302, and a camera trim 303. The cover plate 301 is located on the side of the display screen 202 away from the light-transmitting panel 201, and is stacked with the light-transmitting panel 201 and the display screen 202. The frame 302 is fixed to the cover plate 301. For example, the frame 302 can be fixedly connected to the cover plate 301 by adhesive. The frame 302 may also be integrally formed with the cover plate 301, that is, the frame 302 and the cover plate 301 are a single structure. The frame 302 is located between the cover plate 301 and the light-transmitting panel 201. The light-transmitting panel 201 can be fixed to the frame 302 by adhesive. The light-transmitting panel 201, the cover plate 301, and the frame 302 form an internal accommodating space of the electronic device 100. This internal accommodating space houses the display screen 202. The cover plate 301 can be made of materials such as metal, plastic, or glass. The cover plate 301 can be a plate made of a single material or a plate body 11 structure made of multiple materials and spliced ​​together from multiple plates. The cover plate 301 is provided with an installation port, and the camera decorative piece 303 covers and is fixed to the installation port.

[0168] For example, camera module 10 is used to capture photos / videos. For example, camera module 10 is mounted within housing 30, located within the internal accommodating space of electronic device 100. Camera module 10 can be used as a rear-facing camera. For example, the light-incident surface of camera module 10 faces camera trim 303. Camera trim 303 is used to protect camera module 10.

[0169] In some embodiments, the camera trim 303 protrudes from the side of the cover plate 301 away from the light-transmitting panel 201. This increases the space for the camera module 10 in the thickness direction of the electronic device 100. In other embodiments, the camera trim 303 may be flush with the cover plate 301 or recessed into the internal accommodating space of the electronic device 100.

[0170] The camera decorative element 303 has a light-transmitting hole 3031. The light-transmitting hole 3031 allows light from objects to enter the light-receiving surface of the camera module 10. In some other embodiments, the electronic device 100 may not include the camera decorative element 303. In this case, the cover plate 301 no longer has a mounting opening, but the light-transmitting hole 3031 is provided on the cover plate 301, allowing light from objects to enter the light-receiving surface of the camera module 10.

[0171] In some embodiments, the camera module 10 can also be used as a front-facing camera. For example, the light-incident surface of the camera module 10 faces the light-transmitting panel 201. The display screen 202 is provided with a light-path obstruction hole. This light-path obstruction hole allows light from the scene to pass through the light-transmitting panel 201 and then enter the light-incident surface of the camera module 10. In some embodiments, the electronic device 100 may also include one or more other camera modules (not shown in the figures), which are not strictly limited in this application.

[0172] In some embodiments, such as FIG. 38 As shown, the electronic device 100 may further include a circuit assembly 40 and an image processor 50, which are located within the internal accommodating space of the electronic device 100. The image processor 50 is fixed to and electrically connected to the circuit assembly 40. The image processor 50 is communicatively connected to the camera module 10. The image processor 50 is used to acquire image data from the camera module 10 and process the image data. The communication connection between the camera module 10 and the image processor 50 may include data transmission via electrical connections such as wiring, or data transmission via coupling. It is understood that the camera module 10 and the image processor 50 may also be connected via other methods capable of data transmission.

[0173] In some embodiments, the electronic device 100 may further include an analog-to-digital converter (also known as an A / D converter, not shown in the figure). The analog-to-digital converter is connected between the camera module 10 and the image processor 50. The analog-to-digital converter is used to convert the signal generated by the camera module 10 into a digital image signal and transmit it to the image processor 50, whereby the image processor 50 processes the digital image signal and finally displays the image or video on the screen 20.

[0174] In some embodiments, the electronic device 100 may further include a memory (not shown in the figure), which is communicatively connected to the image processor 50. The image processor 50 processes the digital image signal and then transmits the image to the memory so that the image can be retrieved from the memory and displayed on the screen 20 at any time when it is needed to view the image. In some embodiments, the image processor 50 may also compress the processed digital image signal before storing it in the memory to save memory space.

[0175] In some other embodiments, the electronic device 100 may also not include the screen 20.

[0176] Understandable FIG. 38 to FIG. 40 and FIG. 2 to FIG. 29 The installation position of the camera module 10 in the illustrated embodiment of the electronic device 100 is merely illustrative, and this application does not strictly limit the installation position of the camera module 10. In some other embodiments, the camera module 10 may also be installed in other locations on the electronic device 100, such as the upper middle or upper right corner of the back of the electronic device 100. In some other embodiments, the electronic device 100 may include a terminal body and an auxiliary component that can rotate, move, or be detached relative to the terminal body, and the camera module 10 may also be disposed on the auxiliary component.

[0177] Please refer to the following: FIG. 16 , FIG. 41 yes FIG. 41 A schematic diagram of the camera module 10 in some embodiments of the electronic device 100 shown; FIG. 6 yes FIG. 9 The image sensor module 10 shown is partially exploded in some embodiments; FIG. 10 yes FIG. 12 to FIG. 15 The diagram shows a partial structural schematic of the camera module 10 cut along line AA in some embodiments.

[0178] In some embodiments, the camera module 10 may include a circuit board 1, an image sensor 2, a package 3A, a filter 4, and a lens assembly 5.

[0179] For example, the circuit board 1 may include a board body 11 and a reinforcing plate 12. The board body 11 may be mounted on the reinforcing plate 12, which provides structural support for the board body 11, thereby enhancing the overall structural strength of the circuit board 1.

[0180] The plate body 11 can be installed on the reinforcing plate 12 using the first adhesive 6.

[0181] The board body 11 can be a flexible printed circuit board (FPC) or a printed circuit board (PCB), etc.

[0182] For example, the image sensor 2 can be mounted on the circuit board 1 using the second adhesive 7.

[0183] For example, package 3A can be mounted on circuit board 1. Package 3A can be formed directly on circuit board 1 by injection molding to connect to circuit board 1.

[0184] In this embodiment, since the package 3A can be directly injection molded on the circuit board 1, the package 3A does not need to be fixed to the circuit board 1 by means of adhesive or other means, and there is no need to set up a clearance structure to avoid other structures on the circuit board 1. This is conducive to the simplification and miniaturization of the package 3A, thereby reducing the board area of ​​the circuit board 1, and thus contributing to the overall miniaturization of the camera module 10.

[0185] The package 3A can be formed by injection molding only in a portion of the circuit board 1 near the center, so that the package 3A does not cover the area of ​​the circuit board 1 near the edge.

[0186] For example, the filter 4 can be mounted to the package 3A using a third adhesive 8. The filter 4 is located on the object side of the image sensor 2 and is positioned directly opposite the image sensor 2 to filter light and improve the imaging quality of the image sensor 2. It should be noted that the filter 4 being positioned directly opposite the image sensor 2 means that the orthogonal projection of the filter 4 on the circuit board 1 covers at least a portion of the image sensor 2.

[0187] For example, the lens assembly 5 can be bonded to the circuit board 1 using encapsulating adhesive 9. The lens assembly 5 and the circuit board 1 can enclose a mounting space 101 to accommodate the image sensor 2, the package 3A, and the filter 4. The image sensor 2 is located on the light-emitting side of the lens assembly 5.

[0188] The lens assembly 5 may include a lens 51 and a motor 52. The lens 51 may be installed inside the motor 52, and the motor 52 may be used to drive the lens 51 to extend and retract, thereby realizing functions such as zooming and focusing. In some other embodiments, the lens assembly 5 may not include the motor 52, and the lens assembly 5 may include a lens 51 and a housing, with the lens 51 installed in the housing.

[0189] In this embodiment, since the package 3A is located only in a portion of the circuit board 1 near the center, the lens assembly 5 can be directly connected to the area near the edge of the circuit board 1. This allows the package 3A to be located inside the mounting space 101, without occupying the overall thickness of the camera module 10, thereby reducing the overall thickness of the camera module 10 and facilitating its miniaturization. Furthermore, since the lens assembly 5 is directly connected to the circuit board 1, the distance between the lens 51 and the image sensor 2 in the lens assembly 5 is reduced, thus decreasing the back focus space of the camera module 10.

[0190] It should be noted that in some other embodiments, the camera module 10 may include more or fewer structures. For example, the camera module 10 may also not include a filter.

[0191] Please see FIG. 2 , FIG. 4 yes FIG. 29 The diagram shows the structure of the plate body 11 in some embodiments of the camera module 10.

[0192] In some embodiments, the plate body 11 may have a first through hole 111, which may penetrate the plate body 11 along the thickness direction of the plate body 11.

[0193] Please refer to the following: FIG. 2 , FIG. 4 It includes FIG. 28 A schematic diagram of the circuit board 1 of the board body 11 shown in some embodiments; FIG. 18 to FIG. 20 yes FIG. 42 An exploded view of circuit board 1 in some embodiments; FIG. 42 yes FIG. 41 The diagram shown is a cross-section of circuit board 1 along line BB in some embodiments.

[0194] In some embodiments, the reinforcing plate 12 may cover one side of the first through hole 111 to form a mounting groove 13 for the circuit board 1. The first adhesive 6 may have a through hole communicating with the first through hole 111, so that the portion of the reinforcing plate 12 exposed through the first through hole 111 is free of the first adhesive 6. It should be noted that during the process of bonding the reinforcing plate 12 to the board body 11 with the first adhesive 6, a small amount of adhesive may overflow and be exposed through the first through hole 111.

[0195] In some embodiments, the circuit board 1 may have a first region 1a, a second region 1b, and a third region 1c connected in sequence, wherein the second region 1b may surround the first region 1a, and the third region 1c may surround the second region 1b. In other words, the circuit board 1 may be divided into three regions from the center to the edge, with the region located at the very center of the circuit board 1 being the first region 1a, the region located at the periphery of the circuit board 1 being the third region 1c, and the region located between the first region 1a and the third region 1c being the second region 1b.

[0196] For example, the first region 1a can be the mounting groove 13 of the circuit board 1, and the edge of the mounting groove 13 can be the boundary line between the first region 1a and the second region 1b. FIG. 16 The dashed line in the middle is a schematic diagram of the boundary line between the second region 1b and the third region 1c. It can be understood that in other embodiments, the boundary line between the second region 1b and the third region 1c may be located elsewhere.

[0197] Please refer to the following: FIG. 33 , FIG. 34 yes FIG. 12 to FIG. 15 The circuit board 1 shown is a schematic diagram of the structure in some embodiments where the image sensor 2 is mounted. FIG. 43 yes FIG. 43 The diagram shown is a partially exploded view of the structure in some embodiments. FIG. 41 yes FIG. 17 The diagram shown is a cross-section of circuit board 1 along line CC in some embodiments.

[0198] In some embodiments, the image sensor 2 may be mounted in the first region 1a.

[0199] For example, the image sensor 2 can be installed in the first through hole 111 (i.e., in the mounting groove 13), and the image sensor 2 can be bonded to the reinforcing plate 12 with the second adhesive 7 to fix the image sensor 2. In this embodiment, the image sensor 2 is located in the first through hole 111, which is beneficial to the installation stability of the image sensor 2 and also helps to protect the image sensor 2.

[0200] The image sensor 2 can be connected to the board body 11 via the wire harness 21 to electrically connect the image sensor 2 and the board body 11, thereby realizing the electrical signal communication between the image sensor 2 and the board body 11.

[0201] In this embodiment, a gap 14 may be provided between the edge of the image sensor 2 and the inner wall of the first through hole 111. One end of the wiring harness 21 is electrically connected to the image sensor 2, the wiring harness 21 passes through the gap 14, and the other end of the wiring harness 21 is electrically connected to the board body 11. In this embodiment, the gap 14 is provided to provide installation space 101 for the image sensor 2, which facilitates the installation of the image sensor 2. The wiring harness 21 is also provided to facilitate the electrical connection between the image sensor 2 and the board body 11 by crossing the gap 14.

[0202] The wiring harness 21 that electrically connects the image sensor 2 to the board body 11 is also called a gold wire.

[0203] It should be noted that, FIG. 44 The number of wire harnesses 21 connecting the image sensor 2 and the board body 11 is only for illustration and does not limit the number of wire harnesses 21 or the connection form of the wire harnesses 21.

[0204] Please refer to the following: FIG. 44 and FIG. 41 , FIG. 21A to FIG. 22B yes FIG. 32 to FIG. 34 The structure shown is a schematic diagram of the package 3A formed in some embodiments; FIG. 45 yes FIG. 46 The diagram shown is a partially exploded view of the structure in some embodiments.

[0205] In some embodiments, the package 3A can be mounted in the second region 1b so that the package 3A can be positioned around the image sensor 2. It should be noted that... FIG. 45 The dashed line in the middle represents the boundary between the second region 1b and the third region 1c. In other embodiments, the boundary between the second region 1b and the third region 1c may be located elsewhere.

[0206] In some embodiments, a portion of the package 3A may be fixed to the second region 1b, and a portion may be fixed to the edge of the image sensor 2, so that the package 3A can encapsulate the image sensor 2 onto the circuit board 1, thereby improving the installation stability of the image sensor 2.

[0207] For example, the image sensor 2 may include an imaging area 2a and a non-imaging area 2b, the non-imaging area 2b may surround the imaging area 2a, and the package 3A may connect at least a portion of the image sensor 2 located in the non-imaging area 2b.

[0208] In this embodiment, by connecting at least a portion of the image sensor 2 located in the non-imaging area 2b through the package 3A, the packaging stability of the image sensor 2 can be improved, and the influence of the package 3A on the imaging of the image sensor 2 can be reduced.

[0209] It should be noted that, FIG. 41 and FIG. 46The central cross symbol indicates the imaging area 2a of the image sensor 2.

[0210] Please refer to the following: FIG. 41 , FIG. 30 to FIG. 34 yes FIG. 47 The diagram shown is a schematic representation of the package 3A in some embodiments. FIG. 47 yes FIG. 41 A schematic diagram of the package 3A shown from another perspective; ​ yes ​ The diagram shown is a cross-section along line DD in some embodiments.

[0211] In some embodiments, the package 3A may have a second through hole 31, which may penetrate the package 3A along its thickness direction.

[0212] In some embodiments, the package 3A may partially fill the gap 14 to enclose the wire harness 21.

[0213] In this embodiment, by filling the gap 14 with the encapsulation component 3A, the connection strength between the encapsulation component 3A and the image sensor 2 can be improved, which is beneficial to improving the encapsulation stability of the image sensor 2. By wrapping the wire harness 21 with the encapsulation component 3A, the wire harness 21 can be protected from external corrosion. Furthermore, by fixing the wire harness 21 with the encapsulation component 3A, the wire harness 21 can be prevented from swinging, which improves the stability of the electrical connection between the wire harness 21 and the image sensor 2 and the board body 11, and is beneficial to improving the quality of electrical signal transmission.

[0214] For example, the package 3A may have a rib 32 that protrudes toward the circuit board 1 and fills the gap 14.

[0215] For example, the package 3A may have a boss 33, which may be circumferentially disposed along the inner wall of the second through hole 31.

[0216] In this embodiment, the second through hole 31 can be divided into a first sub-hole 311 and a second sub-hole 312 that are connected by the boss 33. The first sub-hole 311 accommodates the image sensor 2. The boss 33 and the rib 32 can jointly form an L-shaped limit for the image sensor 2, so as to further improve the packaging strength of the package 3A for the image sensor 2 and improve the packaging stability of the image sensor 2.

[0217] The protrusion 33 can abut against the non-imaging area 2b of the image sensor 2 to reduce the risk of imaging interference to the image sensor 2.

[0218] For example, the package 3A may have a clearance groove 34, which is disposed on the side surface of the package 3A facing away from the circuit board 1, and the clearance groove 34 communicates with the second through hole 31.

[0219] The clearance groove 34 may be partially located on the boss 33.

[0220] Please refer to the following: ​ and ​ , ​ This is a schematic diagram of the injection-molded package 3A in some embodiments. It should be noted that... ​ The dashed line with an arrow in the middle represents the flow of the injection molding material.

[0221] In some embodiments, an injection molding module (not shown) is used in conjunction with the circuit board 1 to form an injection molding channel 200 on the surface of the circuit board 1. The injection molding channel 200 may include a feed inlet 2001. After the injection plastic flows in through the feed inlet 2001, it can fill the injection molding channel 200 and solidify within the injection molding channel 200 to form an injection molded part 3. The injection molded part 3 may include a package 3A and a connecting material 3B. By removing the connecting material 3B, only the package 3A can be retained, for example... ​ The structure shown.

[0222] For example, the bonding material 3B can be removed by polishing with a laser, water jet, or ion beam to improve the flatness of the surface of the circuit board 1 without the package 3A.

[0223] The thickness of the connecting material 3B is less than that of the package 3A, which helps to reduce the difficulty of removing the connecting material 3B and improve the removal efficiency of the connecting material 3B.

[0224] For example, the injection channel 200 on the surface of the circuit board 1 may include a plurality of inlets 2001, and the same number of connecting materials 3B are formed corresponding to the inlets 2001.

[0225] For example, the injection channel 200 on the surface of the circuit board 1 may also include one or more outlets 2002, and the same number of connecting materials 3B as the outlets 2002 will be formed accordingly. That is, the total number of connecting materials 3B is equal to the number of inlets 2001 plus the number of outlets 2002.

[0226] In some embodiments, an injection molding module (not shown) can be used in conjunction with the circuit board 300 to form multiple injection channels 200 on the surface of the circuit board 300. Each injection channel 200 includes a feed inlet 2001. The injection molding material can fill multiple injection channels 200 in one go and solidify within the injection channels 200 to form multiple injection molded parts 3. By cutting the circuit board 300, multiple circuit boards 1 can be formed, and each circuit board 1 corresponds to one injection molded part 3.

[0227] In this embodiment, multiple injection molded parts 3 are formed by injection molding in one step, which helps to improve injection molding efficiency, shorten the packaging time of the camera module 10, and thus reduce production costs.

[0228] Please refer to the following: ​ and ​ , ​ yes ​ The structure shown is a schematic diagram of the package 3A formed in some other embodiments.

[0229] In some embodiments, an insulating layer 15 may be provided on the surface of the circuit board 1. The insulating layer 15 has a slot 151 that extends from the edge of the package 3A to the edge of the circuit board 1, that is, the slot 151 extends from the boundary between the second region 1b and the third region 1c to the edge of the circuit board 1. The feed port 2001 may communicate with the slot 151 and feed material from the slot 151.

[0230] In this embodiment, the slot 151 of the insulating layer 15 allows the connecting material 3B to be located at the slot 151 after the injection molded part 3 is formed. Since the insulating layer 15 is removed at the slot 151, exposing the metal portion of the circuit board 1, and due to the poor bonding between the injection molded plastic and the metal, the connecting material 3B is easily removed at the slot 151. For example, it can be removed by mechanical force, reducing the difficulty of removing the connecting material 3B, shortening the time spent removing it, and lowering production costs. Furthermore, since only a portion of the insulating layer 15 on the surface of the circuit board 1 is removed without damaging the structure of the circuit board 1, the integrity of the circuit board 1 can be maintained.

[0231] It should be noted that the thickness of the insulating layer 15 on the surface of circuit board 1 is not visible to the naked eye, therefore the depth of the slot 151 is difficult to see with the naked eye. ​ For ease of observation, the groove 151 has been enlarged, but the specific depth of the groove 151 is not shown. ​ The diagram uses grid lines to illustrate the insulating layer 15. The groove 151 can be obtained by partially scraping away the insulating layer 15.

[0232] Please refer to the following: ​ , ​ yes ​ The diagram shown is a structural schematic of the structure after the filter 4 is installed in some embodiments. ​ yes ​ A partially exploded diagram of the structure shown. ​ yes ​ The diagram shown is a cross-section along line EE in some embodiments.

[0233] In some embodiments, the filter 4 may be located within the second through-hole 31 and mounted on the package 3A.

[0234] In this embodiment, by setting the filter 4 inside the second through hole 31, it is beneficial to protect the filter 4 through the encapsulation 3A and prevent the filter 4 from being damaged by collision.

[0235] For example, the surface of the filter 4 facing away from the circuit board 1 can be located within the second through hole 31, that is, the entire filter 4 is located within the second through hole 31, so that the package 3A can better protect the filter 4 and further reduce the risk of damage to the filter 4.

[0236] For example, the filter 4 can be mounted on the boss 33, which helps to improve the stability of the filter 4 mounted on the package 3A.

[0237] The filter 4 and the image sensor 2 are mounted on opposite sides of the boss 33, so that the filter 4 and the image sensor 2 can be spaced apart. The boss 33 can improve the consistency of the spacing between the filter 4 and the image sensor 2 at various points, which simplifies the installation of the filter 4 and is beneficial to the filtering effect of the filter 4, thereby improving the imaging quality of the image sensor 2.

[0238] For example, the third adhesive 8 can be bonded to the surface of the boss 33 facing away from the circuit board 1 to bond the filter 4 to the boss 33.

[0239] The third adhesive 8 may have a notch 81, and the notch 81 is provided corresponding to the relief groove 34. It should be noted that the notch 81 being provided corresponding to the relief groove 34 means that the orthographic projection of the notch 81 on the boss 33 at least partially falls within the relief groove 34.

[0240] In this embodiment, the package 3A is provided with a clearance groove 34, which provides mounting space for the filter 4, facilitating the installation and removal of the filter 4 on the package 3A. Furthermore, the clearance groove 34 also provides overflow space. Specifically, during the installation of the filter 4, the adhesive is fluid before curing to form the third adhesive 8. After the filter 4 is mounted on the boss 33, the adhesive may overflow under pressure. By providing the clearance groove 34, overflow space is provided for the adhesive. The overflowing adhesive flows into the clearance groove 34, reducing the risk of adhesive overflowing onto the filter 4 and image sensor 2, thereby reducing the risk of interference with filtering and imaging.

[0241] Please see ​ , ​ yes ​ The diagram shown is a cross-section along line EE in some other embodiments.

[0242] In some embodiments, package 3A may include a first sub-package 35 and a second sub-package 36. The first sub-package 35 may be disposed close to the image sensor 2, and the second sub-package 36 covers at least a portion of the first sub-package 35.

[0243] For example, the flexural modulus of the first sub-package 35 may be less than that of the second sub-package 36 to improve the warping problem and reduce the risk of warping of the image sensor 2 caused by the curing of the first sub-package 35.

[0244] The first sub-package 35 has a flexural modulus of 1000 kgf / mm² at room temperature. 2 Up to 3000 kgf / mm 2 Within a certain range, for example, the flexural modulus of the first sub-package 35 at room temperature can be, but is not limited to, 1000 kgf / mm². 2 or 1400 kgf / mm 2 or 1800 kgf / mm 2 or 2200 kgf / mm 2 or 2600 kgf / mm 2 or 3000 kgf / mm 2 or 1000 kgf / mm 2 Up to 3000 kgf / mm 2 Other values ​​between.

[0245] For example, the molding shrinkage stress of the first sub-package 35 can be less than that of the second sub-package 36 to reduce the shrinkage stress of the first sub-package 35 during the curing imaging process, thereby reducing the risk of warping of the image sensor 2 caused by the curing of the first sub-package 35.

[0246] The molding shrinkage rate of the first sub-package 35 can be less than 0.5%. For example, the imaging shrinkage rate of the first sub-package 35 can be 0.48%, 0.45%, 0.40%, 0.38%, 0.32%, 0.2%, or other values ​​less than 0.5%.

[0247] For example, the optical reflectivity of the first sub-package 35 may be less than that of the second sub-package 36 to reduce the risk of stray light generated by the reflected light from the first sub-package 35, thereby reducing the interference of stray light on the imaging of the image sensor 2.

[0248] The optical reflectivity of the first sub-package 35 may be less than 5%. For example, the optical reflectivity of the first sub-package 35 may be 4.8%, 4.5%, 4%, 3.8%, 3.2%, 2%, or other values ​​less than 5%.

[0249] For example, the hardness of the second sub-package 36 can be greater than that of the first sub-package 35 to ensure the overall structural strength of the package 3A. In addition, the higher hardness of the second sub-package 36 is beneficial to improving the impact resistance and can better protect the filter 4.

[0250] For example, the material of the first sub-package 35 can be a thermosetting plastic, and the material of the second sub-package 36 can also be a thermosetting plastic. The first sub-package 35 and the second sub-package 36 are formed sequentially through two injection molding processes. That is, in this embodiment, the package 3A has a double-layer structure, and its cross-section shows the boundary line between the first sub-package 35 and the second sub-package 36.

[0251] The thermosetting plastic is a composite material consisting of an epoxy resin matrix, fillers, and additives. Its physical properties can be altered by adjusting the composition and ratio. The thermosetting plastic used in the first sub-encapsulation 35 and the thermosetting plastic used in the second sub-encapsulation 36 can have different compositions and ratios to achieve different physical properties.

[0252] For example, compared to the thermosetting plastic used in the second sub-package 36, the thermosetting plastic used in the first sub-package 35 can use a higher proportion of talc, and / or carbon fiber, and / or silicone powder as filler, so that the first sub-package 35 can have a lower flexural modulus and molding shrinkage stress compared to the second sub-package 36.

[0253] For example, compared to the thermosetting plastic used in the second sub-package 36, the thermosetting plastic used in the first sub-package 35 can use a higher proportion of rare earth oxides (such as Sm2O3) and / or graphene as fillers, so that the first sub-package 35 can have a lower optical reflectivity than the second sub-package 36.

[0254] For example, compared to the thermosetting plastic used in the first sub-package 35, the thermosetting plastic used in the second sub-package 36 may use a higher proportion of alumina, and / or silicates, etc., so that the second sub-package 36 has higher hardness than the first sub-package 35.

[0255] It should be noted that the above design of the first sub-package 35 and the second sub-package 36 is only illustrative. Other filler designs or additive designs can also be used to make the first sub-package 35 and the second sub-package 36 have the above different physical properties.

[0256] In some other embodiments, the material of the first sub-package 35 can be a thermosetting plastic, and the material of the second sub-package 36 can be a metal, so that the hardness of the second sub-package 36 is higher than that of the first sub-package 35, thereby enabling the anti-collision design of the filter 4.

[0257] In some embodiments, the first sub-package 35 may cover the periphery of the image sensor 2 and be mounted on the circuit board 1, and the first sub-package 35 may wrap the wire harness 21.

[0258] In this embodiment, since the package 3A is formed sequentially into a first sub-package 35 and a second sub-package 36 through two injection molding processes, the first sub-package 35 is designed to cover the periphery of the image sensor 2 and be mounted on the circuit board 1. This allows the first sub-package 35 to stably encapsulate the image sensor 2, ensuring a connection between the image sensor 2, the first sub-package 35, and the circuit board 1, thus improving overall stability and facilitating the formation of the second sub-package 36 through the second injection molding. Furthermore, by wrapping the wire harness 21 with the first sub-package 35, the wire harness 21 is protected after the first injection molding, preventing it from wobbling during subsequent processes and reducing the risk of damage to the wire harness 21.

[0259] For example, a portion of the second sub-package 36 may cover the first sub-package 35, another portion of the second sub-package 36 may be mounted on the circuit board 1, and the filter 4 may be mounted on the second sub-package 36.

[0260] In this embodiment, connecting the first sub-package 35 to the circuit board 1 via the second sub-package 36 strengthens the connection between the package 3A and the circuit board 1, thereby enhancing the structural stability of the package 3A and improving the stability of the image sensor 2 and the filter 4. Furthermore, mounting the filter 4 to the second sub-package 36 improves the stability of the support for the filter 4.

[0261] The first sub-package 35 may include a first part 35a, a second part 35b, and a third part 35c. The first part 35a of the first sub-package 35 may cover the periphery of the image sensor 2. The third part 35c of the first sub-package 35 may be connected to the board body 11. The second part 35b of the first sub-package 35 may be connected between the first part 35a and the third part 35c of the first sub-package 35, and the second part 35b of the first sub-package 35 may fill the gap 14 between the image sensor 2 and the board body 11.

[0262] The second sub-package 36 may include a first portion 36a and a second portion 36b. The first portion 36a of the second sub-package 36 may cover the surface of the first sub-package 35 facing away from the circuit board 1. The first portion 36a of the second sub-package 36 has an L-shaped structure. The first portion 36a and the first sub-package 35 can together form a boss 33 for mounting the filter 4. The second portion 36b of the second sub-package 36 may connect to the first portion 36a of the second sub-package 36 and connect to the board body 11.

[0263] It should be noted that, ​ The dashed lines in the diagram represent the boundary lines between the first portion 35a, the second portion 35b, and the third portion 35c of the first sub-package 35. In other embodiments, the boundary lines between the first portion 35a, the second portion 35b, and the third portion 35c of the first sub-package 35 may be located elsewhere. ​ The dashed line in the diagram represents the boundary between the first portion 36a and the second portion 36b of the second sub-package 36. In other embodiments, the boundary between the first portion 36a and the second portion 36b of the second sub-package 36 may be located elsewhere.

[0264] Please refer to the following: ​ , ​ yes ​ The diagram shown is a cross-section of the structure along line EE in some other embodiments; ​ yes ​ The diagram shown is a cross-section along line EE in some other embodiments. ​ yes ​ The diagram shown is a cross-section along line EE in some embodiments. It should be noted that... ​ In the illustrated embodiment, package 3A may include ​ Most of the features of package 3A in the illustrated embodiment are the same, and will not be repeated here.

[0265] In some embodiments (see...) ​ The second sub-package 36 and the first sub-package 35 can be stacked. The second sub-package 36 can be spaced apart from the circuit board 1. The filter 4 can be installed on the second sub-package 36.

[0266] In this embodiment, since the flexural modulus and / or molding shrinkage stress of the first sub-package 35 are less than those of the second sub-package 36, by spacing the second sub-package 36 from the circuit board 1 and directly connecting the image sensor 2 to the board body 11 with the first sub-package 35, the stress interference received by the image sensor 2 can be reduced, thereby reducing the risk of warping of the image sensor 2. Furthermore, mounting the filter 4 on the second sub-package 36 helps improve the stability of the support for the filter 4.

[0267] The second sub-package 36 can cover the surface of the first sub-package 35 facing away from the circuit board 1. The first part 36a of the second sub-package 36 has an L-shaped structure. The second sub-package 36 and the first sub-package 35 can together form a boss 33 to install the filter 4.

[0268] It should be noted that, ​ The dashed lines in the diagram represent the boundary lines between the first portion 35a, the second portion 35b, and the third portion 35c of the first sub-package 35. In other embodiments, the boundary lines between the first portion 35a, the second portion 35b, and the third portion 35c of the first sub-package 35 may be located elsewhere.

[0269] In other embodiments (see ​ The filter 4 can be installed on the first sub-package 35, the second sub-package 36 can partially cover the first sub-package 35, and the other part of the second sub-package 36 can be installed on the circuit board 1.

[0270] In this embodiment, since the optical reflectivity of the first sub-package 35 is lower than that of the second sub-package 36, the first sub-package 35 carries the filter 4, which reduces the risk of stray light near the filter 4, thereby improving the stray light problem, enhancing the filtering effect of the filter 4, and ultimately improving the imaging quality of the image sensor 2. Furthermore, connecting the first sub-package 35 to the circuit board 1 via the second sub-package 36 strengthens the connection between the package 3A and the circuit board 1, thereby enhancing the structural stability of the package 3A and improving the stability of the image sensor 2 and the filter 4.

[0271] The second sub-package 36 may include a first part 36a and a second part 36b. The first part 36a of the second sub-package 36 may cover the part of the first sub-package 35 facing away from the circuit board 1. The second part 36b of the second sub-package 36 may be connected to the first part 36a of the second sub-package 36 and connected to the board body 11.

[0272] The portion of the first sub-package 35 not covered by the second sub-package 36 can form a boss 33 for mounting the filter 4.

[0273] It should be noted that, ​ The dashed lines in the diagram represent the boundary lines between the first portion 35a, the second portion 35b, and the third portion 35c of the first sub-package 35. In other embodiments, the boundary lines between the first portion 35a, the second portion 35b, and the third portion 35c of the first sub-package 35 may be located elsewhere. ​ The dashed line in the diagram represents the boundary between the first portion 36a and the second portion 36b of the second sub-package 36. In other embodiments, the boundary between the first portion 36a and the second portion 36b of the second sub-package 36 may be located elsewhere.

[0274] In some other embodiments, (see also...) ​ The filter 4 can be installed on the first sub-package 35, and the second sub-package 36 can be stacked with the first sub-package 35 and spaced apart from the circuit board 1.

[0275] In this embodiment, since the optical reflectivity of the first sub-package 35 is lower than that of the second sub-package 36, the first sub-package 35 carries the filter 4, which reduces the risk of stray light near the filter 4, thereby improving the stray light problem, enhancing the filtering effect of the filter 4, and ultimately improving the imaging quality of the image sensor 2. Since the flexural modulus and / or molding shrinkage stress of the first sub-package 35 are lower than those of the second sub-package 36, by spacing the second sub-package 36 from the circuit board 1 and directly connecting the image sensor 2 to the board body 11 with the first sub-package 35, the stress interference received by the image sensor 2 can be reduced, thereby lowering the risk of warping of the image sensor 2.

[0276] The portion of the first sub-package 35 not covered by the second sub-package 36 can form a boss 33 for mounting the filter 4.

[0277] It should be noted that, ​ The dashed lines in the diagram represent the boundary lines between the first portion 35a, the second portion 35b, and the third portion 35c of the first sub-package 35. In other embodiments, the boundary lines between the first portion 35a, the second portion 35b, and the third portion 35c of the first sub-package 35 may be located elsewhere.

[0278] Please refer to the following: ​ and ​ , ​ yes ​ A schematic diagram of the motor 52 in some embodiments of the camera module 10 shown; ​ yes ​ The diagram shows a cross-section of the motor 52 along line FF in some embodiments.

[0279] In some embodiments, the motor 52 may have a mounting hole 521. The motor 52 may have a first surface 522 and a second surface 523 disposed opposite to each other, with the mounting hole 521 penetrating through the first surface 522 and the second surface 523. The opening size of the mounting hole 521 on the first surface 522 is smaller than the size of the mounting hole 521 on the second surface 523.

[0280] Please refer to the following: ​ and ​ , ​ yes ​ The diagram shows the structure of lens 51 in some embodiments of the camera module 10.

[0281] In some embodiments, the lens 51 may have a square structure. Specifically, the lens 51 may include a lens group and a lens barrel, with the lens group mounted inside the lens barrel, and the cross-section of the lens barrel perpendicular to the optical axis of the lens group having a square structure. It should be noted that a square structure refers to a generally square outline and is not limited to a square.

[0282] In this embodiment, by setting the lens 51 to a square structure, it is equivalent to cutting off the four sides of the lens 51 to form a square structure based on the traditional cylindrical lens 51 structure, thereby reducing the lateral dimension of the lens 51.

[0283] Please refer to the following: ​ , ​ yes ​ The motor 52 shown is installed ​ A schematic diagram of the structure of the lens assembly 5 formed by the lens 51 shown; ​ yes ​ The lens assembly 5 shown is a partially exploded structural diagram in some embodiments. ​ yes ​ The diagram shown is a cross-section of the lens assembly 5 along line GG in some embodiments.

[0284] In some embodiments, the lens 51 may be mounted in the mounting hole 521 and connected to the motor 52.

[0285] In this embodiment, since the lens 51 is set as a square structure, the lateral dimension of the lens 51 is reduced, thereby improving the space utilization of the mounting hole 521, which is conducive to the miniaturization of the motor 52.

[0286] The lens 51 can be exposed through the mounting hole 521 in the opening of the first surface 522 for receiving light.

[0287] Please refer to the following: ​ , ​ and ​ , ​ yes ​The diagram shows a partial structural exploded view of the camera module 10 in some other embodiments. It should be noted that... ​ The camera module 10 shown is ​ The camera module 10 shown is decomposed in different ways. ​ The camera module 10 in the illustrated embodiment and ​ The camera module 10 in the illustrated embodiment can be the same camera module 10.

[0288] In some embodiments, the lens assembly 5 can be connected to a portion of the circuit board 1 located in the third region 1c. The lens assembly 5 and the circuit board 1 can enclose a mounting space 101 to accommodate the image sensor 2, the package 3A, and the filter 4. The encapsulating adhesive 9 bonds the lens assembly 5 to the circuit board 1.

[0289] In this embodiment, since the lens assembly 5 can be connected to the portion of the circuit board 1 located in the third region 1c, the lens assembly 5 can bypass the package 3A and achieve a direct connection with the circuit board 1. Compared to the prior art where the lens assembly 5 is mounted on the package 3A, this embodiment avoids the package 3A occupying the overall thickness of the camera module 10, thereby reducing the shoulder height of the camera module 10, which is beneficial for the miniaturization of the camera module 10 and, consequently, for the thinner and lighter electronic device 100. Furthermore, since the connecting material 3B is removed, there is no need to set a clearance structure for the connecting material on either the lens assembly 5 or the circuit board 1, ensuring the overall integrity of the camera module 10 and contributing to the stability of the camera module 10's packaging.

[0290] In some embodiments, a dustproof adhesive (not shown in the figure) may be provided in the mounting space 101 to prevent dust and protect the internal components of the camera module 10.

[0291] For example, the dustproof adhesive can be applied to the surface of the package 3A, and / or the inner wall surface of the lens assembly 5, and / or the surface of the circuit board 1, and / or the surface edge of the filter 4, etc.

[0292] The dustproof adhesive can also have low reflectivity to improve stray light and reduce the risk of stray light interfering with imaging. Specifically, the optical reflectivity of the dustproof adhesive can be less than 5%, for example, it can be 4.8%, 4.5%, 4%, 3.8%, 3.2%, 2%, or other values ​​less than 5%.

[0293] Please see ​ , ​ yes ​ The diagram shows a partial structural representation of the camera module 10 cut along line AA in some other embodiments. It should be noted that... ​ The camera module 10 shown may include ​Most of the features of the camera module 10 shown are the same, and will not be repeated here.

[0294] In some embodiments, the encapsulating adhesive 9 can also bond the lens assembly 5 to the encapsulation component 3A.

[0295] In this embodiment, the encapsulating adhesive 9 bonds both the lens assembly 5 to the portion of the circuit board 1 located in the third region 1c and to the package 3A, improving the bonding stability of the lens assembly 5 and contributing to the overall packaging stability of the camera module 10. Furthermore, since the package 3A is injection molded onto the circuit board 1, thus fixing the package 3A to the circuit board 1, there is a direct connection between the encapsulating adhesive 9, the lens assembly 5, and the package 3A. This allows the lens assembly 5 to be stably fixed to the circuit board 1, improving the structural stability of the camera module 10.

[0296] It should be noted that, ​ The package 3A of the embodiment shown can be adopted ​ In the packaging method of the embodiment shown, the package 3A and the lens assembly 5 are not bonded together using encapsulating adhesive 9. ​ The package 3A shown in the embodiment can also be adopted ​ In the encapsulation method of the embodiment shown, the encapsulation component 3A and the lens assembly 5 are bonded together with encapsulating adhesive 9, which is not limited here.

[0297] Please refer to the following: ​ , ​ yes ​ A schematic diagram of the camera module 10 in some other embodiments of the electronic device 100 shown; ​ yes ​ The image sensor module 10 shown is partially exploded in some embodiments; ​ yes ​ The diagram shown is a cross-section of the camera module 10 along line HH in some embodiments. It should be noted that... ​ The camera module 10 shown may include ​ Most of the features of the module shown are the same, and will not be repeated here.

[0298] In some embodiments, the edge of the package 3A may be provided with a connecting material 3B, which extends from the edge of the package 3A to the edge of the circuit board 1, and the lens assembly 5 is also connected to the connecting material 3B.

[0299] In this embodiment, after the injection molded part 3 is formed, the continuous material 3B can be retained to reduce the difficulty of the process, shorten the process time, and thus reduce the process cost.

[0300] For example, the lens assembly 5 may be provided with a first groove 53, the opening of the first groove 53 facing the circuit board 1, and the connecting material 3B is disposed in the first groove 53.

[0301] In this embodiment, the lens assembly 5 is provided with a first groove 53 so that after the lens assembly 5 is installed on the circuit board 1, the first groove 53 can accommodate the connecting material 3B, thereby preventing the connecting material 3B from interfering with the installation of the lens assembly 5. Due to the design of the first groove 53, it is not necessary to remove the connecting material 3B after the injection molded part 3 is formed, which reduces the process difficulty, shortens the process time, and thus reduces the process cost.

[0302] The encapsulating adhesive 9 can also bond the connecting material 3B to the lens assembly 5. Specifically, the encapsulating adhesive 9 bonds the inner wall of the first groove 53 to the connecting material 3B, which not only improves the stability of the lens assembly 5 mounted on the circuit board 1, but also seals the first groove 53, which is beneficial to improving the encapsulation stability of the camera module 10.

[0303] Please refer to the following: ​ , ​ yes ​ The schematic diagram of the structure of the injection molded part 3 formed on the surface of the circuit board 1 in the camera module 10 shown in some embodiments; ​ yes ​ The diagram shown is a cross-section along line II in some embodiments. It should be noted that... ​ and ​ The package 3A shown may include ​ Most of the features of the 3A package are the same, and will not be repeated here.

[0304] In this embodiment, according to as follows ​ The injection molding method shown allows the injection-molded material to solidify on the surface of the circuit board 1 to form an injection molded part 3. The connecting material 3B is attached to the edge of the package 3A and extends to the edge of the circuit board 1. Since the injection molded part 3 is formed integrally, the connecting material 3B and the package 3A are integrated, which helps to improve the connection strength between the package 3A and the circuit board 1.

[0305] In this embodiment, since the thickness of the connecting material 3B is less than the thickness of the package 3A, it is beneficial to reduce the design depth of the first groove 53 on the lens assembly 5, so as to reduce the structural interference of the lens assembly 5 and facilitate the connection between the lens assembly 5 and the circuit board 1.

[0306] Please refer to the following: ​ , ​ yes ​ A schematic diagram of the structure of the camera module 10 in some embodiments of the electronic device 100 shown; ​ yes ​The image sensor module 10 shown is partially exploded in some embodiments; ​ yes ​ The diagram shown is a cross-section of the camera module 10 along line JJ in some embodiments. It should be noted that... ​ The camera module 10 shown may include ​ Most of the features of the module shown are the same, and will not be repeated here.

[0307] In some embodiments, the circuit board 1 may be provided with a second groove 16, the opening of the second groove 16 facing the lens assembly 5, and the connecting material 3B is disposed in the second groove 16.

[0308] In this embodiment, the circuit board 1 is provided with a second groove 16 so that after the lens assembly 5 is installed on the circuit board 1, the second groove 16 can accommodate the connecting material 3B to avoid the connecting material 3B interfering with the installation of the assembly. Due to the design of the second groove 16, it is not necessary to remove the connecting material 3B after the injection molded part 3 is formed, which reduces the process difficulty, helps to shorten the process time, and thus reduces the process cost.

[0309] For example, the encapsulating adhesive 9 can also bond the connector 3B to the lens assembly 5. Specifically, the encapsulating adhesive 9 can bond the surface of the connector 3B exposed in the second groove 16 to the lens assembly 5, which not only improves the stability of the lens assembly 5 mounted on the circuit board 1, but also seals the second groove 16, which is beneficial to improving the encapsulation stability of the camera module 10.

[0310] Among them, the surface of the connecting material 3B can be flush with the surface of the circuit board 1 to improve the surface flatness of the circuit board 1, which is conducive to the installation of the lens assembly 5 on the circuit board 1.

[0311] Please refer to the following: ​ , ​ yes ​ The schematic diagram of the structure of the injection molded part 3 formed on the surface of the circuit board 1 in the camera module 10 shown in some embodiments; ​ yes ​ The diagram shown is a partial structural breakdown of the structure in some embodiments. ​ yes ​ The diagram shown is a cross-section along line KK in some embodiments. It should be noted that... ​ The package 3A shown may include ​ Most of the features of the 3A package are the same, and will not be repeated here.

[0312] In this embodiment, according to as follows ​In the injection molding method shown, the injection molding material cures on the surface of the circuit board 1 to form a package 3A, and cures in the second groove 16 to form a connecting material 3B. The connecting material 3B connects to the edge of the package 3A and extends to the edge of the circuit board 1. Because the injection molded part 3 is integrally injection molded, the connecting material 3B and the package 3A form a single structure, which helps to improve the connection strength between the package 3A and the circuit board 1.

[0313] In this embodiment, since the thickness of the connecting material 3B is less than the thickness of the package 3A, it is beneficial to reduce the design depth of the second groove 16 on the circuit board 1, so as to reduce the structural interference of the circuit board 1 and facilitate the connection between the lens assembly 5 and the circuit board 1.

[0314] The packaging method of the camera module 10 provided in the above embodiments will be introduced next.

[0315] Please refer to the following: ​ , ​ This is a schematic flowchart of the packaging method of the camera module 10 provided in one embodiment of this application.

[0316] In some embodiments, the packaging method of the camera module 10 may include steps S10, S20, S30 and S40.

[0317] S10 provides circuit board 1.

[0318] The circuit board 1 has a first region 1a, a second region 1b and a third region 1c connected in sequence, with the second region 1b surrounding the first region 1a and the third region 1c surrounding the second region 1b.

[0319] In this embodiment, the circuit board 1 can be divided into three regions from the center to the edge. The region located at the very center of the circuit board 1 is the first region 1a, the region located at the periphery of the circuit board 1 is the third region 1c, and the region located between the first region 1a and the third region 1c is the second region 1b. For details, please refer to the relevant documentation. ​ .

[0320] S20, mount image sensor 2 to first region 1a.

[0321] In this embodiment, the image sensor 2 can be installed in the first through hole 111 of the plate body 11, and then bonded to the reinforcing plate 12 using the second adhesive 7. For details, please refer to the relevant documentation. ​ and ​ It should be noted that after mounting the image sensor 2, the image sensor 2 and the circuit board 1 need to be electrically connected using the wiring harness 21.

[0322] S30, a package 3A is formed on circuit board 1.

[0323] In this embodiment, a portion of the encapsulation component 3A is fixed to the second region 1b, and a portion is fixed to the edge of the image sensor 2 to encapsulate the image sensor 2. For details, please refer to the relevant documentation. ​ .

[0324] S40, a portion of the lens assembly 5 is fixedly connected to the third region 1c of the circuit board 1, and a portion is fixedly connected to the package 3A.

[0325] The lens assembly 5 and the circuit board 1 enclose an installation space 101 to accommodate the image sensor 2, the package 3A and the filter 4.

[0326] In this embodiment, the encapsulating adhesive 9 enables the connection between the lens assembly 5 and the circuit board 1. Simultaneously, the encapsulating adhesive 9 bonds the lens assembly 5 to the package 3A, thereby completing the encapsulation of the camera module 10 and improving the encapsulation strength of the camera module 10. For details, please refer to the relevant documentation. ​ , ​ and ​ .

[0327] In some other embodiments, the encapsulating adhesive 9 can be used to connect only the lens assembly 5 to the circuit board 1, thereby completing the encapsulation of the camera module 10. See the attached document for details. ​ , ​ and ​ .

[0328] In some other embodiments, between steps S30 and S40, the filter 4 can be mounted on the package 3A so that the filter 4 is positioned directly opposite the image sensor 2. See the attached document for details. ​ .

[0329] Please see ​ , ​ yes ​ The diagram shows a process flow diagram in some embodiments of the packaging method for forming the package 3A in the camera module 10 shown.

[0330] In some embodiments, step S30 may include steps S311, S312 and S313.

[0331] S311, injection molding forms a soft gel.

[0332] The soft gel portion covers the edge of the second region 1b and the image sensor 2, while the other portion of the soft gel extends to the edge of the circuit board 1, and the soft gel is connected to the circuit board 1.

[0333] In this embodiment, an injection molding module (not shown in the figure) can be used in conjunction with the circuit board 1 to form an injection channel 200 on the surface of the circuit board 1. The injection channel 200 may include a feed inlet 2001. After the injection plastic flows in through the feed inlet 2001, it can fill the injection channel 200, thereby forming a soft gel. See the reference for details. ​ .

[0334] S312, curing soft colloid to form encapsulation 3A and connecting material 3B.

[0335] Among them, a portion of the package 3A is fixed to the second region 1b, and a portion is fixed to the edge of the image sensor 2. The connecting material 3B extends from the edge of the package 3A to the edge of the circuit board 1.

[0336] In this embodiment, the soft colloid, after curing, can form an injection molded part 3. The injection molded part 3 includes an encapsulation component 3A and a connecting component 3B. The encapsulation component 3A is used to encapsulate the image sensor 2 and provide support for the filter 4. The connecting component 3B extends from the edge of the encapsulation component 3A to the edge of the circuit board 1. For details, please refer to the relevant documentation. ​ and ​ .

[0337] S313, remove continuous material 3B.

[0338] In this embodiment, the bonding material 3B can be removed by laser, water jet, or ion beam polishing, leaving only the package 3A on the surface of the circuit board 1. See the attached document for details. ​ .

[0339] Please refer to the following: ​ , ​ yes ​ The process of processing the surface of the circuit board 1 in the packaging method of the camera module 10 shown is illustrated in some embodiments.

[0340] In some embodiments, the encapsulation method may further include step S101 before step S30.

[0341] S101, a portion of the insulating layer 15 on the surface of the circuit board 1 is removed to form a slot 151, which extends from the edge of the second region 1b to the edge of the circuit board 1.

[0342] In this embodiment, a slot 151 is formed by removing part of the insulating layer 15, exposing the metal portion of the circuit board 1. Because the bonding force between the injection molding compound and the metal is relatively poor, the connecting material 3B is easily removed at the slot 151. For example, the connecting material 3B can be removed by mechanical force, reducing the difficulty of removing the connecting material 3B. See the attached reference for details. ​ .

[0343] Please see ​ ,​ yes ​ The diagram shows a process flow diagram of forming package 3A in the packaging method of the camera module 10 shown in some other embodiments.

[0344] In some embodiments, step S30 may include steps S321, S322, S323, S324, S325 and S326.

[0345] S321, a first soft gel is formed by injection molding. A portion of the first soft gel covers the second region 1b and the edge of the image sensor 2. Another portion of the first soft gel extends to the edge of the circuit board 1. The first soft gel is connected to the circuit board 1.

[0346] S322, the first soft colloid is cured to form a first sub-package 35 and a first connecting material. A portion of the first sub-package 35 is fixed to the second region 1b, and a portion is fixed to the edge of the image sensor 2. The first connecting material extends from the edge of the first sub-package 35 to the edge of the circuit board 1.

[0347] S323, remove the first batch of material.

[0348] S324, injection molding forms a second soft gel, the second soft gel covers and connects to the first sub-package 35, and another part of the second soft gel extends to the edge of the circuit board 1.

[0349] S325, the second soft colloid is cured to form a second sub-package 36 and a second connector. The second sub-package 36 covers at least a portion of the first sub-package 35, and the second connector extends from the edge of the second sub-package 36 to the edge of the circuit board 1.

[0350] S326, Remove the second batch of material.

[0351] In this embodiment, the first sub-encapsulation 35 and the second sub-encapsulation 36 are formed by two injection molding processes, and a continuous material 3B treatment is performed on the two injection molding processes. Because two injection molding processes are used, the materials used in the two injection molding processes can be different. Specifically, thermosetting plastics with different properties can be used to form the first soft gel and the second soft gel, respectively. Specifically, the flexural modulus of the first sub-encapsulation 35 is less than that of the second sub-encapsulation 36, and / or, the shrinkage stress of the first soft gel solidified to form the first sub-encapsulation 35 is less than that of the second soft gel solidified to form the second sub-encapsulation 36, and / or, the optical reflectivity of the first sub-encapsulation 35 is less than that of the second sub-encapsulation 36, and / or, the hardness of the second sub-encapsulation 36 is greater than that of the first sub-encapsulation 35. For details, please refer to the relevant references. ​ .

[0352] In other embodiments, after step S325 is completed, step S326 may be omitted to retain the second connecting material. Furthermore, the first groove 53 in the lens assembly 5 can be provided to cooperate with the second connecting material, thereby reducing the connecting material 3B processing steps and lowering the process difficulty. For details, please refer to the relevant documentation. ​ .

[0353] In some other embodiments, steps S323 and S326 may not be included in the above steps. Specifically, a second groove 16 may be provided on the circuit board 1 to accommodate the first connecting material formed in the first injection molding. In the second injection molding, the second connecting material may be formed on the first connecting material, and a first groove 53 may be provided on the lens assembly 5 to cooperate with the second connecting material, so as to further reduce the connecting material 3B processing process and reduce the process difficulty.

[0354] In some other embodiments, the feed port 2001 of the first injection molding can be different from the feed port 2001 of the second injection molding, so that the positions of the first and second connecting materials 3B are different, and the first and / or second connecting materials can be removed accordingly, or the connecting material 3B process can be omitted.

[0355] It should be noted that in the above steps of removing the continuous material 3B, the method of processing the continuous material 3B in steps S313 and S101 can be adopted.

[0356] Please see ​ and ​ , ​ yes ​ A schematic flowchart of the packaging method for forming package 3A in some embodiments of the camera module 10 shown; ​ yes ​ The diagram shows a flow chart in some embodiments of the packaging method for the camera module 10, which connects the lens assembly 5 and the circuit board 1.

[0357] In some embodiments, step S30 may include steps S331 and S332.

[0358] S331, a soft gel is formed by injection molding. Part of the soft gel covers the edge of the second region 1b and the image sensor 2, and another part of the soft gel extends to the edge of the circuit board 1. The soft gel is connected to the circuit board 1.

[0359] S332, the soft colloid is cured to form a package 3A and a connector 3B. A portion of the package 3A is fixed to the second region 1b, and a portion is fixed to the edge of the image sensor 2. The connector 3B extends from the edge of the package 3A to the edge of the circuit board 1.

[0360] In this embodiment, after the injection molded part 3 is formed, the connecting material 3B is not processed. Accordingly, the lens assembly 5 may have a first groove 53. Step S40 may include steps S41 and S42.

[0361] S41, align the first groove 53 of the lens assembly 5 with the connecting material 3B.

[0362] S42, the lens assembly 5 is installed in the third region 1c of the circuit board 1, and the first groove 53 accommodates the connecting material 3B.

[0363] In this embodiment, by providing a first groove 53 in the lens assembly 5, the first groove 53 can accommodate the connecting material 3B after the lens assembly 5 is mounted on the circuit board 1, thus preventing the connecting material 3B from interfering with the mounting of the lens assembly 5. Due to the design of the first groove 53, it is not necessary to remove the connecting material 3B after the injection molded part 3 is formed, reducing the process difficulty, shortening the process time, and thereby reducing the process cost. For details, please refer to the relevant documentation. ​ .

[0364] Please see ​ , ​ yes ​ The diagram shows a process flow diagram of forming package 3A in the packaging method of the camera module 10 shown in some other embodiments.

[0365] In some embodiments, the circuit board 1 may have a second groove 16 extending from the edge of the second region 1b to the edge of the circuit board 1, and step S30 may include steps S341 and S342.

[0366] S341, a soft gel is formed by injection molding. Part of the soft gel covers the edge of the second region 1b and the image sensor 2, and another part of the soft gel is located in the second groove 16. The soft gel is connected to the circuit board 1.

[0367] S342, the soft gel is cured to form a package 3A and a connecting material 3B. A portion of the package 3A is fixed to the second region 1b and a portion is fixed to the edge of the image sensor 2. The connecting material 3B is received in the second groove 16.

[0368] In this embodiment, the circuit board 1 is provided with a second groove 16 so that after the lens assembly 5 is installed on the circuit board 1, the second groove 16 can accommodate the connecting material 3B to avoid the connecting material 3B interfering with the installation of the assembly. Due to the design of the second groove 16, it is not necessary to remove the connecting material 3B after the injection molded part 3 is formed, which reduces the process difficulty, helps to shorten the process time, and thus reduces the process cost.

[0369] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of this application can be combined with each other, and any combination of features in different embodiments is also within the protection scope of this application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0370] It should be noted that all the above figures are exemplary illustrations of this application and do not represent the actual size of the product. Furthermore, the dimensional proportions between the components in the figures are not intended to limit the actual product of this application.

[0371] The above are merely some embodiments and implementation methods of this application. The scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An image capturing module (10), characterized by, The camera module (10) comprises a circuit board (1), an image sensor (2), a package (3A) and a lens assembly (5); The circuit board (1) has a first region (1a), a second region (1b) and a third region (1c) connected in sequence, the second region (1b) surrounds the first region (1a), and the third region (1c) surrounds the second region (1b); The image sensor (2) is fixed to the first region (1a), and a part of the package (3A) is fixed to the second region (1b) and a part is fixed to the edge of the image sensor (2); A part of the lens assembly (5) is fixedly connected with the third region (1c) of the circuit board (1), and a part is fixedly connected with the package (3A), and the image sensor (2) is located on the light-emitting side of the lens assembly (5).

2. The camera module (10) according to claim 1, characterized in that The camera module (10) further comprises a package adhesive (9), a part of the package adhesive (9) bonding the lens assembly (5) and the circuit board (1), and a part bonding the lens assembly (5) and the package (3A).

3. The camera module (10) according to claim 1 or 2, characterized in that The lens assembly (5) and the circuit board (1) enclose to form a mounting space (101), and the image sensor (2) and the package (3A) are located in the mounting space (101).

4. The camera module (10) according to any one of claims 1 to 3, characterized in that An edge of the package (3A) is provided with a connecting material (3B), the connecting material (3B) extends from the edge of the package (3A) to the edge of the circuit board (1), and the lens assembly (5) is further connected with the connecting material (3B).

5. The camera module (10) according to claim 4, characterized in that The lens assembly (5) is provided with a first groove (53), an opening of the first groove (53) faces the circuit board (1), and the connecting material (3B) is arranged in the first groove (53); Alternatively, the circuit board (1) is provided with a second groove (16), an opening of the second groove (16) faces the lens assembly (5), and the connecting material (3B) is arranged in the second groove (16).

6. The camera module (10) according to claim 4 or 5, characterized in that In the arrangement direction of the circuit board (1) and the lens assembly (5), the thickness of the connecting material (3B) is less than the thickness of the package (3A).

7. The camera module (10) according to any one of claims 1 to 3, characterized in that A surface of the circuit board (1) facing the lens assembly (5) is provided with an insulating layer (15), the insulating layer (15) has a slot (151) extending from the edge of the package (3A) to the edge of the circuit board (1).

8. The camera module (10) according to any one of claims 1 to 7, characterized in that The image sensor (2) is electrically connected to the circuit board (1) through a wire harness (21), and the package (3A) wraps the wire harness (21).

9. The camera module (10) as claimed in claim 8, characterized in that The image sensor (2) has an imaging area (2a) and a non-imaging area (2b), the non-imaging area (2b) surrounds the imaging area (2a), and the package (3A) is connected to at least part of the non-imaging area (2b) of the image sensor (2).

10. The camera module (10) according to claim 8 or 9, characterized in that The circuit board (1) comprises a board body (11) and a reinforcing plate (12), the board body (11) is mounted on the reinforcing plate (12), the board body (11) has a first through hole (111), the reinforcing plate (12) covers one side of the first through hole (111), the image sensor (2) is located in the first through hole (111) and mounted on the reinforcing plate (12), there is a gap (14) between the edge of the image sensor (2) and the inner wall of the first through hole (111), one end of the wire harness (21) is electrically connected to the image sensor (2), the wire harness (21) passes through the gap (14), and the other end of the wire harness (21) is electrically connected to the board body (11); Part of the package (3A) is filled in the gap (14) to wrap the wire harness (21).

11. The camera module (10) according to any one of claims 1 to 10, characterized in that The package (3A) comprises a first sub-package (35) and a second sub-package (36), compared with the second sub-package (36), the first sub-package (35) is arranged close to the image sensor (2), and the second sub-package (36) covers at least part of the first sub-package (35). The bending modulus of the first sub-package (35) is smaller than that of the second sub-package (36), and / or the forming shrinkage stress of the first sub-package (35) is smaller than that of the second sub-package (36).

12. The camera module (10) according to any one of claims 1 to 10, characterized in that The package (3A) comprises a first sub-package (35) and a second sub-package (36), compared with the second sub-package (36), the first sub-package (35) is arranged close to the image sensor (2), and the second sub-package (36) covers at least part of the first sub-package (35). The optical reflectivity of the first sub-package (35) is smaller than that of the second sub-package (36).

13. The camera module (10) according to any one of claims 1 to 10, characterized in that The package (3A) comprises a first sub-package (35) and a second sub-package (36), compared with the second sub-package (36), the first sub-package (35) is arranged close to the image sensor (2), and the second sub-package (36) covers at least part of the first sub-package (35). The hardness of the second sub-package (36) is greater than that of the first sub-package (35).

14. The camera module (10) according to any one of claims 11 to 13, characterized in that The material of the first sub-package (35) is thermosetting plastic; The material of the second sub-package (36) is thermosetting plastic, or the material of the second sub-package (36) is metal.

15. The camera module (10) according to any one of claims 11 to 14, characterized in that The image sensor (2) is electrically connected to the circuit board (1) through the wire harness (21), the first sub-package (35) covers the periphery of the image sensor (2) and is mounted on the circuit board (1), and the first sub-package (35) wraps the wire harness (21).

16. The camera module (10) of claim 15, characterized in that The camera module (10) further comprises an optical filter (4), the optical filter (4) is located on the object side of the image sensor (2) and is arranged opposite to the image sensor (2). Part of the second sub-package (36) covers the first sub-package (35), another part of the second sub-package (36) is mounted on the circuit board (1), and the optical filter (4) is mounted on the second sub-package (36).

17. The camera module (10) as claimed in claim 15, characterized in that The camera module (10) further comprises an optical filter (4), wherein the optical filter (4) is located on the object side of the image sensor (2) and is arranged opposite to the image sensor (2). The second sub-package (36) is arranged in a stack with the first sub-package (35), and the second sub-package (36) is arranged in a spaced manner with the circuit board (1), and the optical filter (4) is mounted on the second sub-package (36).

18. The camera module (10) as claimed in claim 15, characterized in that The camera module (10) further comprises an optical filter (4), wherein the optical filter (4) is located on the object side of the image sensor (2) and is arranged opposite to the image sensor (2). The optical filter (4) is mounted on the first sub-package (35), part of the second sub-package (36) covers the first sub-package (35), and another part of the second sub-package (36) is mounted on the circuit board (1).

19. The camera module (10) as claimed in claim 15, characterized in that The camera module (10) further comprises an optical filter (4), wherein the optical filter (4) is located on the object side of the image sensor (2) and is arranged opposite to the image sensor (2). The optical filter (4) is mounted on the first sub-package (35), the second sub-package (36) is arranged in a stack with the first sub-package (35), and the second sub-package (36) is arranged in a spaced manner with the circuit board (1).

20. The camera module (10) according to any one of claims 1 to 19, characterized in that The camera module (10) further comprises an optical filter (4), wherein the optical filter (4) is located on the object side of the image sensor (2) and is arranged opposite to the image sensor (2). The package (3A) has a second through hole (31), the image sensor (2) is located in the second through hole (31) and is mounted on the circuit board (1), and the optical filter (4) is located in the second through hole (31) and is mounted on the package (3A).

21. The camera module (10) of claim 20, characterized in that The package (3A) has a boss (33) arranged in a circumferential direction along an inner wall of the second through hole (31), the optical filter (4) and the image sensor (2) are mounted on opposite sides of the boss (33), and the boss (33) covers a peripheral edge of the image sensor (2).

22. The camera module (10) according to claim 20 or 21, characterized in that The surface of the optical filter (4) facing away from the circuit board (1) is located in the second through hole (31).

23. A packaging method of a camera module (10), characterized by, Comprise: A circuit board (1) is provided, which has a first region (1a), a second region (1b) and a third region (1c) connected in sequence, the second region (1b) surrounds the first region (1a), and the third region (1c) surrounds the second region (1b); An image sensor (2) is attached to the first region (1a); An image sensor (2) is attached to the first region (1a); Forming a package (3A) on the circuit board (1), a part of the package (3A) is fixed to the second area (1b), and a part is fixed to the edge of the image sensor (2); And a part of the lens assembly (5) is fixedly connected with the third area (1c) of the circuit board (1), and a part is connected with the package (3A), and the image sensor (2) is located on the light emitting side of the lens assembly (5).

24. The packaging method of claim 23, wherein, The package (3A) formed on the second area (1b) comprises: Injection molding to form a soft gel, part of the soft gel covers the second area (1b) and the edge of the image sensor (2), and another part of the soft gel extends to the edge of the circuit board (1), and the soft gel is connected to the circuit board (1); Curing the soft gel to form the package (3A) and the connecting material (3B), a part of the package (3A) is fixed to the second area (1b), and a part is fixed to the edge of the image sensor (2), and the connecting material (3B) extends from the edge of the package (3A) to the edge of the circuit board (1); And removing the connecting material (3B).

25. The packaging method of claim 24, wherein, The package method removes the connecting material (3B) by laser, or water jet, or ion beam polishing.

26. The packaging method of claim 24, wherein, Before the step of forming the package (3A) on the circuit board (1), the package method further comprises: Removing part of the insulating layer (15) on the surface of the circuit board (1) to form a slot (151), the slot (151) extends from the edge of the second area (1b) to the edge of the circuit board (1); The package method removes the connecting material (3B) by mechanical external force.

27. The packaging method of any one of claims 24 to 26, wherein, The package (3A) formed on the circuit board (1) comprises: Injection molding to form a first soft gel, part of the first soft gel covers the second area (1b) and the edge of the image sensor (2), and another part of the first soft gel extends to the edge of the circuit board (1), and the first soft gel is connected to the circuit board (1); Curing the first soft gel to form a first sub-package (35) and a first connecting material, a part of the first sub-package (35) is fixed to the second area (1b), and a part is fixed to the edge of the image sensor (2), and the first connecting material extends from the edge of the first sub-package (35) to the edge of the circuit board (1); Removing the first connecting material; Injection molding to form a second soft gel, the second soft gel covers and connects the first sub-package (35), and another part of the second soft gel extends to the edge of the circuit board (1); Curing the second soft gel to form a second sub-package (36) and a second connecting material, the second sub-package (36) covers at least part of the first sub-package (35), and the second connecting material extends from the edge of the second sub-package (36) to the edge of the circuit board (1); And removing the second connecting material.

28. The packaging method of claim 27, wherein, The encapsulation method adopts a thermosetting plastic to injection mold the first soft gel body, and adopts a thermosetting plastic to injection mold the second soft gel body.

29. The packaging method of claim 28, wherein, The encapsulation method adopts thermosetting plastics with different properties to injection mold the first soft gel body and the second soft gel body respectively; wherein, The bending modulus of the first sub-encapsulation member (35) is less than the bending modulus of the second sub-encapsulation member (36); And / or, the shrinkage stress of the first soft gel body solidified to form the first sub-encapsulation member (35) is less than the shrinkage stress of the second soft gel body solidified to form the second sub-encapsulation member (36); And / or, the optical reflectivity of the first sub-encapsulation member (35) is less than the optical reflectivity of the second sub-encapsulation member (36); And / or, the hardness of the second sub-encapsulation member (36) is greater than the hardness of the first sub-encapsulation member (35).

30. The packaging method of claim 23, wherein, The encapsulation member (3A) formed on the circuit board (1) comprises: Injection molding a soft gel body, part of the soft gel body covers the second area (1b) and the edge of the image sensor (2), another part of the soft gel body extends to the edge of the circuit board (1), and the soft gel body is connected to the circuit board (1); And, solidifying the soft gel body to form the encapsulation member (3A) and the connecting material (3B), part of the encapsulation member (3A) is fixed to the second area (1b), part of the encapsulation member (3A) is fixed to the edge of the image sensor (2), and the connecting material (3B) extends from the edge of the encapsulation member (3A) to the edge of the circuit board (1); The lens assembly (5) has a first groove (53), and the part of the lens assembly (5) is fixedly connected to the third area (1c) of the circuit board (1) by the following steps: Aligning the first groove (53) of the lens assembly (5) with the connecting material (3B); And, mounting the lens assembly (5) on the third area (1c) of the circuit board (1), and the first groove (53) accommodates the connecting material (3B).

31. The packaging method of claim 23, wherein, The circuit board (1) has a second groove (16) extending from the edge of the second area (1b) to the edge of the circuit board (1), and the encapsulation member (3A) formed on the circuit board (1) comprises: Injection molding a soft gel body, part of the soft gel body covers the second area (1b) and the edge of the image sensor (2), another part of the soft gel body is located in the second groove (16), and the soft gel body is connected to the circuit board (1); And, solidifying the soft gel body to form the encapsulation member (3A) and the connecting material (3B), part of the encapsulation member (3A) is fixed to the second area (1b), part of the encapsulation member (3A) is fixed to the edge of the image sensor (2), and the connecting material (3B) is accommodated in the second groove (16).

32. An electronic device (100), characterized by The electronic device (100) comprises a housing (30) and the camera module (10) according to any one of claims 1 to 22, and the camera module (10) is mounted on the housing (30).

Images