Display device

Abstract

The present invention relates to a display device in which a crack prevention structure is provided in an outer region of a pad unit, thereby making it possible to reduce crack defects without degrading the reliability of a panel. With reference to a display device according to an embodiment of the present invention, a flexible printed circuit board and a data driver may be disposed to be spaced apart from each other in a non-active area of a display panel, a first pad unit may be disposed below the flexible printed circuit board, a second pad unit may be disposed below the data driver, and a third pad unit may be disposed below the data driver. A dummy bump line may be disposed to surround an outside of the input pad and the one or more output pads of the second pad unit, and a branch line of the dummy bump line may be disposed to pass between the COP wiring, the first scan line, the second and third scan lines, and the data line.

Description

Technical Field

[0001] This specification relates to display devices, and more particularly to display devices that prevent cracking during the chip-on-plastic (COP) process. Background Technology

[0002] The organic light-emitting display device adopts a structure that enables the current flowing through the organic light-emitting diode to display images when using multiple thin-film transistors (or TFTs), and allows for touch operation when using touch electrodes formed on the panel.

[0003] Such organic light-emitting display devices can be folded or bent to have various shapes when using a flexible substrate. To expand the active area of ​​the display device and reduce the bezel area, the pads to which the printed circuit board is connected can be positioned behind the active area. For this purpose, a bending region where the flexible substrate is bent can be provided.

[0004] This bending region allows the flexible substrate, along with the wiring and insulating film disposed on the substrate, to be bent together. To enable the panel to bend, a minimal amount of insulating film and wiring can be disposed in the bending portion.

[0005] In organic light-emitting display devices, drivers can be fabricated as chips and mounted in the non-active (NA) area of ​​the display panel. Examples of mounting methods include chip-on-glass (COG) / chip-on-plastic (COP), tape-on-coating (TCP), chip-on-film (COF), etc.

[0006] The PO (Plastic OLED) model using the COP process compresses the driver chip (D-IC) by bonding it to the FOP (Flat Panel On Film) pads located in the non-active area.

[0007] Recently, in order to provide differentiated display devices, the thickness of inorganic films in curved sections has been reduced to improve strain structure; however, there is a drawback that cracks occur in the pad area during the bonding process of the driver chip (D-IC) on the upper side of the flexible substrate due to the increase in step height caused by the pressure on the substrate with low elastic modulus. Summary of the Invention

[0008] In order to eliminate the above-mentioned drawbacks, the inventors of the present invention have invented a display device in which a crack prevention structure is provided in the outer area of ​​the pad portion, thereby mitigating crack defects without reducing the reliability of the panel.

[0009] Furthermore, the objective of this specification is to provide a display device in which unused dummy bump lines are provided in the outer region of the pad portion where sparse metal wiring (low wiring density) is provided, just as the metal wiring is uniformly provided in the middle region of the pad portion (high wiring density), thereby enabling it to withstand the pressure generated during the bonding process and preventing cracking.

[0010] The objectives of this invention are not limited to those described above, and other objectives and advantages not mentioned herein may be understood from the following description and will become clearer as to embodiments of the invention are described. Furthermore, it will be readily understood that the objectives and advantages of this disclosure can be achieved through the means and combinations thereof presented in the technical features of this invention.

[0011] A display device according to an embodiment of the present disclosure may include a flexible printed circuit board (FPCB) and a data driver (D-IC) spaced apart from each other in a non-active area of ​​a display panel. A first pad unit (FOP_PAD) may be disposed below the flexible printed circuit board (FPCB), and a second pad unit (COP_PAD) may be disposed below the data driver (D-IC). Dummy bump lines (DBLs) may be disposed around the input pads and one or more output pads of the second pad unit (COP_PAD), and branch lines of the dummy bump lines may be disposed to pass between the COP wiring, the first scan line (Scan 1), the second and third scan lines (Scan 2,3), and the data lines (Data).

[0012] Furthermore, the display device according to embodiments of this specification may include: a plurality of light-emitting elements, each light-emitting element being connected to one or more transistors in an active region of the display panel; a gate driver (GIP) supplying gate signals to the display panel; a data driver (D-IC) disposed in an active region of the display panel spaced apart from the flexible printed circuit board (FPCB); an insulating layer disposed on the plurality of light-emitting elements; a plurality of touch electrodes disposed on the insulating layer in an active region; a plurality of adhesive layers, each adhesive layer disposed on the plurality of touch electrodes; a first pad unit (FOP_PAD) disposed on one side of an adhesive layer among the plurality of adhesive layers beneath the flexible printed circuit board (FPCB); a second pad unit (COP_PAD) disposed on the other side of an adhesive layer among the plurality of adhesive layers beneath the data driver (D-IC); dummy bump lines (DBLs) may be configured to surround the input pads and one or more output pads of the second pad unit (COP_PAD), and branch lines of the dummy bump lines may be configured to be connected to the COP wiring and the first scan line (Scan). 1) It passes between the second and third scan lines (Scan 2,3) and the data line (Data).

[0013] Specific details of other implementation methods are included in the detailed embodiments and accompanying drawings.

[0014] This disclosure may also include other means of achieving purposes other than those described above, and those skilled in the art will clearly recognize these means from the following description.

[0015] The display device according to the embodiments of this specification has the following effect: by providing dummy bump lines on the pad portion in the non-active area of ​​the display panel, the pressure generated during the bonding of the pad portion is absorbed.

[0016] Furthermore, the display device according to the embodiments of this specification has the following effect: by providing dummy bump lines in the outer region of the pad portion such that the metal wiring density therein is similar to the metal wiring density in the middle region of the pad portion in the non-active region of the display panel, cracks are prevented from occurring in the pad portion.

[0017] Furthermore, the display device according to the embodiments of this specification enables the prevention of cracks in the touch portion by buffering interference caused by bumps when using an insulating film.

[0018] Furthermore, according to the embodiments described in this specification, the following effect can be achieved: a display device including a display panel with improved yield can be realized by preventing cracks from occurring in the pad portion during the COP process.

[0019] Furthermore, according to embodiments of this specification, the quality of the display device can be improved by preventing defects from occurring, such as cracks in the pad portions of the non-active areas of the display panel.

[0020] Furthermore, according to the embodiments described in this specification, a narrow bezel effect can be achieved because the quality of the display device can be improved, thereby ensuring reliability.

[0021] This disclosure may also have other effects besides those described above, which will become apparent to those skilled in the art from the following description.

[0022] In addition to the effects described above, the specific effects of the invention will now be described together with the specific details for practicing the invention. Attached Figure Description

[0023] Figure 1 This is a plan view illustrating a display device according to one embodiment of this specification;

[0024] Figure 2 This is a panel plan view of a display device according to an embodiment of this specification;

[0025] Figure 3 It means along Figure 2 A cross-sectional view of the section intercepted by line A-A' in the diagram;

[0026] Figure 4 This is a view illustrating an example configuration of a second pad cell according to an embodiment of this specification;

[0027] Figure 5 This is a plan view showing the setting of a first dummy bump line in a second pad cell according to an embodiment of this specification;

[0028] Figure 6 It is along Figure 5 A cross-sectional view taken from line B-B' in the specification, wherein a first dummy bump line is provided in the second pad cell according to an embodiment of this specification;

[0029] Figure 7A and Figure 7B This is a plan view of setting a second dummy bump line in a second pad unit according to another embodiment of this specification;

[0030] Figure 8 This is a plan view of a third dummy bump line provided on a second pad unit according to another embodiment of this specification;

[0031] Figure 9 This is a plan view of a fourth dummy bump line provided on a second pad unit according to another embodiment of this specification;

[0032] Figure 10 This is a plan view of a fifth dummy bump line provided on a second pad unit according to another embodiment of this specification; and

[0033] Figure 11 This is a plan view of a sixth dummy bump line provided on a second pad unit according to another embodiment of this specification. Detailed Implementation

[0034] See below for reference and appendix Figure 1 The advantages and features of this disclosure, as well as the methods for achieving these advantages and features, will become apparent from the following detailed description of the embodiments. However, this disclosure is not limited to the embodiments disclosed below, but can be implemented in various different forms. Therefore, these embodiments are described only to complete this disclosure and to fully inform those skilled in the art of the scope of this disclosure.

[0035] The shapes, dimensions, ratios, angles, numbers, etc., disclosed in the accompanying drawings used to illustrate embodiments of this disclosure are illustrative and the disclosure is not limited thereto. Throughout the detailed description, similar reference numerals refer to similar parts. Furthermore, in describing this disclosure, detailed descriptions of related known technologies will be omitted if it is determined that such detailed descriptions may unnecessarily obscure the essential points of this disclosure. When terms such as "comprising," "including," "having," and "configured" are used in this disclosure, the presence or addition of other elements is permissible unless the term "only" is used. When a component is described using a singular form, it may include the meaning of the plural form unless explicitly stated to the contrary.

[0036] It should be noted that even without its explicit description, any component will be interpreted as including tolerances or error ranges.

[0037] When describing the positional relationship between two elements, for example, when using terms such as “on top of,” “above,” “below,” “under,” and “next to,” one or more other elements may be placed between the two elements unless the terms “exactly,” “directly,” or “adjacent” are used.

[0038] When describing temporal relationships, such as when time sequence is described as “after,” “following,” “next,” and “before,” discontinuous cases may also be included unless the terms “exactly” or “just right” are used.

[0039] It should be understood that although the terms "first," "second," etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. Therefore, without departing from the technical spirit of this disclosure, the first element referred to in the following description may mean the second element.

[0040] In describing the components in this document, terms such as A, B, (a) or (b) may be used. These terms are intended only to distinguish one component from another and do not limit the nature, order, sequence, or number of components. When a component is described as being “connected to,” “coupled to,” “proximately to,” “attached to,” “adhere to,” or “glued” to another component, such a component may be directly connected to, coupled to, contact with, or attached to the other component, and, however, it should be understood that, unless explicitly stated to the contrary, they may be indirectly connected, coupled to, proximate, attached to, adhered to, or glued to each other, with an intervening component.

[0041] The expression "at least one" should be understood to include any combination of one or more of the associated components. For example, the meaning of "at least one of the first component, the second component, and the third component" can include not only the first component, the second component, or the third component, but also any combination of two or more of the first component, the second component, and the third component.

[0042] In this disclosure, "device" may include display devices, such as liquid crystal modules (LCMs), organic light-emitting diode (OLED) modules, etc., which include a display panel and a driver for driving the display panel. Furthermore, it may also include assemblies of electronic devices or equipment (or assemblies), such as notebook computers, televisions, computer monitors, vehicles, or automotive devices, or mobile electronic devices such as smartphones or tablets, which are complete products or end products including LCMs, OLED modules, etc.

[0043] Therefore, the equipment in this disclosure may include the display device itself, such as LCM, OLED module, etc., and may even include complete sets of equipment, which are application products or end-user equipment including LCM, OLED module, etc.

[0044] Furthermore, in some embodiments, an LCM or OLED module configured with a display panel, driver, etc., may be referred to as a "display device," and an electronic device that includes an LCM or OLED module as a complete product may be referred to differently as a "kit." For example, a display device may include a display panel of a liquid crystal display (LCD) or an organic light-emitting display (OLED) and a source PCB that serves as a controller for driving the display panel. A kit may also include a kit PCB, which is a kit controller electrically connected to the source PCB and drives the entire kit.

[0045] The display panel used in the embodiments of this disclosure can be any type of display panel, such as a liquid crystal display panel, an organic light-emitting diode (OLED) display panel, an electroluminescent display panel, etc. However, this is not an exhaustive list. For example, the display panel according to the embodiments of this disclosure can be a display panel capable of generating sound by being vibrated by a vibrating device. The display panel applied to the display device according to the embodiments of this disclosure is not limited to the shape or size of the display panel.

[0046] Individual features of the various embodiments of this disclosure may be partially or wholly coupled or combined with each other, thereby interconnecting and operating in various technical ways, and each embodiment may be implemented independently of each other or together in an associated relationship.

[0047] In the following description, embodiments of the present disclosure will be described with reference to the accompanying drawings and examples. For ease of explanation, the components depicted in the drawings are at different scales than actual scales and are not limited to the scale used in the drawings.

[0048] In the following description, a display device according to an embodiment of this specification will be described with reference to the accompanying drawings.

[0049] Figure 1 This is a plan view showing a display device according to one embodiment of this specification.

[0050] Reference Figure 1 The display device 10 according to the embodiments of this specification may include a flexible printed circuit board FPCB attached to a first pad unit FOP_PAD, a data driver D-IC attached to a second pad unit COP_PAD, and a display panel 10'.

[0051] The first pad unit FOP_PAD may include FOP bumps for bonding with a flexible printed circuit board (FPCB). In another example, the first pad unit FOP_PAD may be an FOP bump. The second pad unit COP_PAD may include COP bumps for bonding with a data driver (D-IC). In another example, the second pad unit COP_PAD may be a COP bump. Embodiments described in this specification are not limited thereto.

[0052] Display panel 10' may include multiple areas. For example, display panel 10' may include at least one active area AA and a non-active area NA other than the active area AA, wherein the active area AA is the area for displaying image. The active area AA has a pixel array PXL formed therein. At least one non-active area NA that does not display image may include a driving circuit portion and a dam portion, and may be disposed on one side of the active area AA. For example, the non-active area NA may be adjacent to one or more sides of the active area AA.

[0053] The non-active region NA can be located outside the rectangular active region AA to surround the rectangular active region AA. However, it should be understood that the shape of the active region AA and the adjacent arrangement of the non-active region NA and the active region AA are not specifically limited to... Figure 1 The illustrative display device 10 shown is illustrated. The active area AA and the non-active area NA can also form any shape of the display device 10. Non-limiting examples of such shapes may include pentagons, hexagons, circles, ellipses, etc.; however, this is not exhaustive.

[0054] Each pixel PX in the active region AA may include multiple sub-pixels, which can display colors such as red (R), green (G), blue (B), and white (W). Multiple sub-pixels are disposed in the active region AA, and each of the multiple sub-pixels may include one or more transistors. At least one transistor and a light-emitting element may be connected to each other.

[0055] Furthermore, pixels PX and subpixels can be associated with pixel circuits of one or more TFTs fabricated on the substrate of the display device 10. Each pixel circuit can be electrically connected to a gate line GL and a data line DL to communicate with one or more driving circuits, such as a gate driver GIP and a data driver D-IC located in the non-active region NA of the display device 10.

[0056] The gate driver GIP supplies the gate signal SCAN to the display panel 10'.

[0057] like Figure 1As shown, one or more driving circuits can be implemented using TFTs configured in the non-active region NA. For example, the gate driver GIP can be implemented using multiple TFTs on the substrate of the display device 10. Non-limiting examples of circuits that can be implemented using TFTs on the substrate may include inverter circuits, multiplexers, and electrostatic discharge (ESD) circuits, but embodiments of this disclosure are not limited thereto.

[0058] Some of the driving circuitry can be configured as integrated circuit (IC) chips and mounted in the non-active area NA of the display device 10 using chip-on-glass (COG) or other similar methods. Alternatively, some of the driving circuitry can be mounted on another substrate and coupled to connection interface pads / bumps and pins located in the non-active area NA using flexible printed circuit boards (FPCBs), chip-on-film (COF), tape-on-cable (TCP), or other suitable technologies.

[0059] In embodiments of this disclosure, at least two different types of TFTs are used in the TFT substrate for use in a display. The types of TFTs used in some pixel circuits and some driver circuits can vary depending on the requirements of the display.

[0060] For example, pixel circuits can be implemented using TFTs with oxide active layers (oxide TFTs), and driving circuits can be implemented using TFTs with low-temperature polysilicon active layers (LTPS TFTs) and TFTs with oxide active layers. Unlike LTPS TFTs, oxide TFTs do not experience pixel-to-pixel threshold voltage (Vth) variation. Uniform threshold voltage (Vth) can also be obtained in the array of pixel circuits used in a display. The uniformity of threshold voltage (Vth) between TFTs implementing the driving circuit will have a relatively small direct impact on the brightness uniformity of the pixels.

[0061] By using a driver circuit implemented with LTPS TFTs on the substrate, signals and data can be supplied to the pixels at a higher clock rate than when all TFTs in a TFT panel are formed using oxide TFTs. Therefore, a display capable of high-speed operation without blemishes such as mura can be provided. For example, oxide TFTs and LTPS TFTs can be selected based on each of their advantages, and the chosen TFT can be used in conjunction with the design of the TFT panel.

[0062] Reference Figure 1The low-potential drive voltage EVSS, touch signal Touch, and gate control signal GCS output from the flexible printed circuit board FPCB are applied to the display panel 10', and the high-potential drive voltage EVDD is applied to the display panel 10' through the data driver D-IC.

[0063] The flexible printed circuit board (FPCB) can be electrically connected to the display panel 10' and is located in the non-active area NA.

[0064] The data driver D-IC can be electrically connected to the display panel 10' and is located in the non-active area NA, spaced apart from the flexible printed circuit board FPCB. The data driver D-IC can apply a high-potential drive voltage EVDD and a data voltage Vdata to the display panel 10'.

[0065] The first pad unit FOP_PAD can be located in the non-active region NA below the flexible printed circuit board FPCB to be electrically connected to the flexible printed circuit board FPCB.

[0066] The second pad unit COP_PAD can be located in the non-active region NA below the data driver D-IC for electrical connection to the data driver D-IC.

[0067] The gate driver GIP can be equipped with a SCAN circuit and an EM circuit. The SCAN circuit is connected to the switching transistor of the pixel PX to send a gate signal SCAN to it to turn the switching transistor on / off. The EM circuit is connected to the emitter signal line EM of the pixel PX.

[0068] Figure 2 This is a panel plan view of a display device according to an embodiment of this specification.

[0069] Reference Figure 2 The display panel 10' includes an active region AA and an inactive region NA on a substrate, which implements a display in the display device 10.

[0070] The non-active area NA of the display panel 10' may include the area surrounding the active area AA, the pad wiring portion PADA, the FPCB connection portion FC, and the D-IC connection portion DC.

[0071] The FPCB connection portion FC may include a first pad unit FOP_PAD, and the D-IC connection portion DC may include a second pad unit COP_PAD. The first pad unit FOP_PAD can be connected to the second pad unit COP_PAD via multiple pad routing lines PDL.

[0072] In addition, the active area AA may include a camera hole CA in which a camera device can be installed.

[0073] The pad wiring portion PADA, the FPCB connection portion FC, and the D-IC connection portion DC of the display panel 10' may have a structure that allows them to bend toward the back of the display panel 10' to be positioned on the underside of the display panel 10'.

[0074] Figure 3 This is a cross-sectional view of the panel according to an embodiment of this specification, showing along... Figure 2 The cross section intercepted by line A-A' in the diagram.

[0075] Reference Figure 3 The display device 10 according to the embodiments of this specification may include a buffer layer 111 disposed on a substrate 100 in an active region NA, a first insulating layer 110 disposed on the buffer layer 111, and a first gate insulating layer 120 disposed on the first insulating layer 110.

[0076] In this document, substrate 100 may include a first polyimide layer PL-1, an intermediate layer IL on the first polyimide layer PL-1, and a second polyimide layer PL-2 on the intermediate layer IL. Buffer layer 111 may include a first buffer layer M-BUF and a second buffer layer A-BUF on the first buffer layer M-BUF.

[0077] Furthermore, in the non-active region NA of the display device 10, there may be a third buffer layer O-BUF disposed on the first gate insulating layer 120, a second gate insulating layer 150 disposed on the third buffer layer O-BUF, and a fourth insulating layer 160 disposed on the second gate insulating layer 150.

[0078] Furthermore, in the non-active region NA of the display device 10, a pad wiring PDL can be provided on the fourth insulating layer 160; a second planarization layer 180 can be provided on the pad wiring PDL; insulating layers 800 and 820 can be provided on the second planarization layer 180; and a group consisting of a first touch electrode TE1, a sealing layer SPAC, and a second touch electrode TE2 can be provided on the pad wiring PDL and the insulating layers 800 and 820.

[0079] In this document, insulating layers 800 and 820 may include touch buffer layer 800 and touch insulating layer 820, and are configured to completely cover the second planarization layer 180 on the pad wiring PDL.

[0080] In addition, in the non-active region NA, a first adhesive layer ACF1 can be provided on the first touch electrode TE1 and the sealing layer SPAC, a first pad unit FOP_PAD can be provided on the first adhesive layer ACF1, and a flexible printed circuit board FPCB can be provided on the first pad unit FOP_PAD.

[0081] Furthermore, in the non-active region NA, a second adhesive layer ACF2 can be provided on the second touch electrode TE2, a second pad unit COP_PAD can be provided on the second adhesive layer ACF2, and a data driver D-IC can be provided on the second pad unit COP_PAD.

[0082] Despite Figure 3 Although not shown in the figures, in the active region AA, insulating layers 800 and 820 may be disposed on the light-emitting element, which will be described later. In the non-active region NA, multiple touch electrodes TE1 and TE2 may be disposed on insulating layers 800 and 820, and multiple adhesive layers ACF1 and ACF2 may be disposed on the multiple touch electrodes TE1 and TE2 respectively. Although not shown in the figures, each of the multiple adhesive layers ACF1 and ACF2 may include an adhesive resin and multiple conductive particles disposed in the adhesive resin.

[0083] In the non-active region NA, the first pad unit FOP_PAD can be disposed on the first adhesive layer ACF1 located on one side below the flexible printed circuit board FPCB among the multiple adhesive layers, and the second pad unit COP_PAD can be disposed on the second adhesive layer ACF2 located on the other side below the data driver D-IC among the multiple adhesive layers.

[0084] A sealing layer SPAC positioned between the first adhesive layer ACF1 on one side and the insulating layers 800 and 820 can be disposed on the insulating layers 800 and 820 to contact the first touch electrode TE1 located on one side of the plurality of touch electrodes. The sealing layer SPAC can be formed to have a height greater than that of the first touch electrode TE1. However, embodiments of the present disclosure are not limited thereto. For example, the thickness of the sealing layer SPAC and the thickness of the first touch electrode TE1 can be equal to each other, such that the sealing layer SPAC and the first touch electrode TE1 can be formed to have the same height.

[0085] In this document, the sealing layer SPAC may include an insulating organic material. The insulating organic material may be formed from one or more of the following materials: benzocyclobutene (BCB), acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0086] The first pad unit FOP_PAD can be located in the non-active region NA below the flexible printed circuit board FPCB to be electrically connected to the flexible printed circuit board FPCB.

[0087] The second pad unit COP_PAD can be located in the non-active region NA below the data driver D-IC for electrical connection to the data driver D-IC.

[0088] The multiple touch electrodes TE1 and TE2 may include: a first touch electrode TE1, which is disposed on an insulating layer 800 and 820 on one side below the first pad unit FOP_PAD in the non-active region NA; and a second touch electrode TE2, which is disposed on an insulating layer 800 and 820 on the other side below the second pad unit COP_PAD in the non-active region NA.

[0089] A first adhesive layer ACF1 on one side can be disposed on the first touch electrode TE1 and the sealing layer SPAC on one side below the first pad unit FOP_PAD. A second adhesive layer ACF2 on the other side can be disposed on the insulating layers 800, 820 and the second touch electrode TE2 on the other side to cover the second touch electrode TE2 located on the other side below the second pad unit COP_PAD among the multiple touch electrodes.

[0090] Figure 4 This is a view illustrating an example configuration of a second pad cell according to an embodiment of this specification.

[0091] Reference Figure 4 According to the embodiments of this specification, the second pad unit COP_PAD may have an input pad In_PAD and one or more output pads Out_PAD1, Out_PAD2.

[0092] The input pad In_PAD and one or more output pads Out_PAD1, Out_PAD2 may each include COP routing, a first scan line Scan 1, second and third scan lines Scan 2, 3, and a data line Data.

[0093] According to an embodiment of this specification, the second pad unit COP_PAD may have a dummy bump line DBL, which is configured to surround the outside of the input pad In_PAD and one or more output pads Out_PAD1, Out_PAD2.

[0094] The branch line of the dummy bump line (DBL) can be configured to pass between the COP wiring, the first scan line Scan 1, the second and third scan lines Scan 2, 3, and the data line Data.

[0095] Figure 5 This is a plan view showing the setting of a first dummy bump line in the second pad unit according to an embodiment of this specification.

[0096] Reference Figure 5In the second pad unit COP_PAD according to the embodiment of this specification, the dummy bump line DBL may have: a first branch line ① disposed at the left end from top to bottom along a first direction, a second branch line ② disposed at the upper end from left to right along a second direction, a third branch line ③ disposed at the right end from top to bottom along the first direction, and a fourth branch line ④ disposed at the lower end from left to right along the second direction.

[0097] In the second pad unit COP_PAD, the dummy bump line DBL may have a fifth branch line ⑤, which is configured to extend from the second branch line ② along a first direction.

[0098] In the second pad unit COP_PAD, the dummy bump line DBL can have a sixth branch line ⑥, which is configured to extend from the second branch line ② along a first direction.

[0099] One side of the dummy bump line DBL can be configured to pass between the data line Data and the first scan line Scan 1. For example, in the dummy bump line DBL, the third branch line ③ can be configured to pass between the data line Data and the first scan line Scan 1 from top to bottom along a first direction.

[0100] At least one of the branch lines in the dummy bump line DBL can be configured to pass between the first scan line Scan 1 and the second and third scan lines Scan 2,3 in the first direction. For example, in the dummy bump line DBL, the sixth branch line ⑥ can be configured to pass between the first scan line Scan 1 and the second and third scan lines Scan 2,3 along the first direction from the second branch line ②.

[0101] In a Dummy Bump Line (DBL), at least one of the branch lines can be configured to pass between the COP wiring and the second and third scan lines Scan 2,3 in the first direction. For example, in a Dummy Bump Line (DBL), the fifth branch line ⑤ can be configured to pass between the COP wiring and the second and third scan lines Scan 2,3 along the first direction from the second branch line ②.

[0102] In the first dummy bump line DBL1, the routing configured to surround the input pad In_PAD and one or more output pads Out_PAD1, Out_PAD2 may have a width greater than the width of the branch lines of the first dummy bump line DBL1. For example, in the first dummy bump line DBL1, the first branch lines ① to the fourth branch line ④ and the sixth branch line ⑥ may have a width greater than the width of the fifth branch line ⑤.

[0103] Figure 6 It is along Figure 5A cross-sectional view taken from line B-B' in the specification, wherein a first dummy bump line is provided in the second pad unit according to an embodiment of this specification.

[0104] Reference Figure 6 According to embodiments of this specification, the second pad unit COP_PAD may include: a buffer layer 111 on a substrate 100; a first insulating layer 110 on the buffer layer 111; and a gate wiring on the first insulating layer 110.

[0105] The substrate 100 may include a first polyimide layer PL-1, an intermediate layer IL on the first polyimide layer PL-1, and a second polyimide layer PL-2 on the intermediate layer IL. The buffer layer 111 may include a first buffer layer M-BUF and a second buffer layer A-BUF on the first buffer layer M-BUF.

[0106] The second pad unit COP_PAD may include a first gate insulating layer 120 on the first insulating layer 110 and the gate wiring Gate; a third buffer layer O-BUF on the first gate insulating layer 120; and a second gate insulating layer 150 on the third buffer layer O-BUF.

[0107] In the second pad unit COP_PAD, a fourth insulating layer 160 can be provided on the second gate insulating layer 150, and a branch line SD1' of the first line SD1 of the COP wiring and the first dummy bump line DBL1 can be provided on the fourth insulating layer 160 (⑤).

[0108] In the second pad unit COP_PAD, a second wiring SD2 can be set on the branch line SD1'(⑤) of the first wiring SD1 of the COP wiring and the first dummy bump line DBL1, and a second planarization layer 180 can be set on the fourth insulating layer 160, the second wiring SD2 of the COP wiring and the second wiring SD2 of the first dummy bump line DBL1.

[0109] In this paper, the first wiring SD1 of the COP wiring can be electrically connected to the gate wiring Gate through the corresponding contact hole.

[0110] Figure 7A and Figure 7B This is a plan view of a second dummy bump line provided in a second pad unit according to another embodiment of this specification.

[0111] Reference Figure 7A and Figure 7B In a second pad unit COP_PAD according to another embodiment of this specification, one or more output pads may include a first output pad Out_PAD1 and a second output pad Out_PAD2.

[0112] The input pad In_PAD, the first output pad Out_PAD1, and the second output pad Out_PAD2 can be set in the first direction, which is the vertical direction.

[0113] At least one of the branches of the second dummy bump line DBL2, which is configured in the second direction (i.e., the horizontal direction), can be configured between the input pad In_PAD and the first output pad Out_PAD1. For example, in the second dummy bump line DBL2, the seventh branch line ⑦ can be configured to extend in the second direction, which is the horizontal direction, between the input pad In_PAD and the first output pad Out_PAD1.

[0114] At least one of the branches of the second dummy bump line DBL2 can be positioned between the first output pad Out_PAD1 and the second output pad Out_PAD2 in the second direction. For example, in the second dummy bump line DBL2, the eighth branch line ⑧ can be positioned to extend along the second direction between the first output pad Out_PAD1 and the second output pad Out_PAD2.

[0115] Figure 7A and Figure 7B The second dummy bump line DBL2 shown is... Figure 5 The difference between the first dummy bump lines DBL1 shown is that, as Figure 7B As shown, the seventh branch line ⑦ is located between the input pad In_PAD and the first output pad Out_PAD1, and the eighth branch line ⑧ is located between the first output pad Out_PAD1 and the second output pad Out_PAD2.

[0116] In the second dummy bump line DBL2, the routing configured to surround the input pad In_PAD and one or more output pads Out_PAD1, Out_PAD2 can have a width greater than the width of the branch lines of the second dummy bump line DBL2. For example, in the second dummy bump line DBL2, the first branch lines ① to the fourth branch line ④ and the sixth branch line ⑥ can have a width greater than the corresponding widths of the fifth branch line ⑤, the seventh branch line ⑦, and the eighth branch line ⑧.

[0117] According to another embodiment of this specification, the second dummy bump line DBL2 may include a first branch line ① to an eighth branch line ⑧ relative to the input pad In_PAD, the first output pad Out_PAD1, and the second output pad Out_PAD2.

[0118] The second dummy bump line DBL2 may include: a first branch line ① located at the left end; a second branch line ② located at the upper end; a fourth branch line ④ located at the lower end; a third branch line ③ located between the first scan line Scan 1 and the data line Data; a fifth branch line ⑤ located between the COP routing and the second and third scan lines Scan 2,3; a sixth branch line ⑥ located between the first scan line Scan 1 and the second and third scan lines Scan 2,3; a seventh branch line ⑦ located between the input pad In_PAD and the first output pad Out_PAD1; and an eighth branch line ⑧ located between the first output pad Out_PAD1 and the second output pad Out_PAD2.

[0119] Figure 8 This is a plan view of a third dummy bump line provided on a second pad unit according to another embodiment of this specification. Figure 9 This is a plan view of a fourth dummy bump line provided on a second pad unit according to another embodiment of this specification.

[0120] Reference Figure 8 According to another embodiment of this specification, the third dummy bump line DBL3 may include at least one or more branch lines ① to ⑧.

[0121] At least one or more branch lines ① to ⑧ can connect the COP wiring, the first scan line Scan 1, the second and third scan lines Scan 2,3, and the data line Data of the first output pad Out_PAD1 to the COP wiring, the first scan line Scan 1, the second and third scan lines Scan 2,3, and the data line Data of the input pad In_PAD along a first direction between the first output pad Out_PAD1 and the first output pad Out_PAD2, and connect the COP wiring, the first scan line Scan 1, the second and third scan lines Scan 2,3, and the data line Data of the second output pad Out_PAD2 to the COP wiring, the first scan line Scan 1, the second and third scan lines Scan 2,3, and the data line Data of the first output pad Out_PAD1 along a first direction between the first output pad Out_PAD1 and the second output pad Out_PAD2.

[0122] Reference Figure 9In a fourth dummy bump line DBL4 according to another embodiment of this specification, one of the at least one or more branch lines ⑨ may be disposed along a second direction between the input pad In_PAD and the first output pad Out_PAD1, and another of the at least one or more branch lines ⑩ may be disposed to extend along a second direction between the first output pad Out_PAD1 and the second output pad Out_PAD2.

[0123] Figure 10 This is a plan view of a fifth dummy bump line provided on a second pad unit according to another embodiment of this specification. Figure 11 This is a plan view of a sixth dummy bump line provided on a second pad unit according to another embodiment of this specification.

[0124] Reference Figure 10 According to another embodiment of this specification, the fifth dummy bump line DBL5 may include at least one or more branch lines ① to ⑧.

[0125] Relative to the input pad In_PAD, the first output pad Out_PAD1, and the second output pad Out_PAD2, at least one or more of the branch lines ① to ⑧ may include a first branch line ① located on the left side; a second branch line ② located on the upper side; a fourth branch line ④ located on the lower side; a third branch line ③ located on the right side; a fifth branch line ⑤ and a sixth branch line ⑥ extending from the second branch line ② along a first direction and located between the first branch line ① and the third branch line ③; a seventh branch line ⑦ extending along a second direction and located between the input pad In_PAD and the first output pad Out_PAD1; and an eighth branch line ⑧ extending along a second direction and located between the first output pad Out_PAD1 and the second output pad Out_PAD2.

[0126] In this paper, each of the third branch line ③, the fifth branch line ⑤, and the sixth branch line ⑥ can be set to overlap with each of the input pad In_PAD, the first output pad Out_PAD1, and the second output pad Out_PAD2.

[0127] Reference Figure 11 According to another embodiment of this specification, the sixth dummy bump line DBL6 can be plate-shaped and can be configured to cover the input pad In_PAD, the first output pad Out_PAD1, and the second output pad Out_PAD2.

[0128] As described above, according to the embodiments of this specification, a display device can be provided in which a crack prevention structure is provided in the outer area of ​​the pad portion, thereby mitigating crack defects without reducing the reliability of the panel.

[0129] Furthermore, according to the embodiments of this specification, a display device can be realized in which unused dummy bump lines (DBLs) are provided in the outer region of the pad portion where metal wiring is sparsely provided (low wiring density), just as metal wiring is uniformly provided in the middle region of the pad portion (high wiring density), thereby enabling it to withstand the pressure generated during the bonding process and preventing cracks from occurring.

[0130] The display device according to embodiments of the present disclosure can be described as follows.

[0131] A display device according to embodiments of the present disclosure may include: a display panel including an active region and an active region; a flexible printed circuit board (FPCB) electrically connected to the display panel and disposed in the active region; a data driver (D-IC) electrically connected to the display panel and disposed in the active region spaced apart from the flexible printed circuit board; a first pad unit (FOP_PAD) disposed below and electrically connected to the flexible printed circuit board in the active region; and a second pad unit (COP_PAD) disposed below and electrically connected to the data driver in the active region, and including an input pad and one or more output pads, wherein each of the input pad and one or more output pads may include COP wiring, a first scan line, a second and third scan line, and a data line, and wherein dummy bump lines (DBLs) may be configured to surround the outside of the input pad and one or more output pads, and branch lines of the dummy bump lines may be configured to pass between the COP wiring, the first scan line, the second and third scan line, and the data line.

[0132] According to some embodiments of this disclosure, one side of the dummy bump line can be configured to pass between the data line and the first scan line; a portion of the first direction of the branch line of the dummy bump line can be configured to pass between the first scan line and the second and third scan lines; and another portion of the first direction of the branch line of the dummy bump line can be configured to pass between the second and third scan lines and the COP wiring.

[0133] According to some embodiments of this disclosure, one or more output pads may include a first output pad and a second output pad; the input pad, the first output pad, and the second output pad may be disposed in a first direction; a portion of the second direction of the branch line of the dummy bump line may be disposed between the input pad and the first output pad; and another portion of the second direction of the branch line of the dummy bump line may be disposed between the first output pad and the second output pad.

[0134] According to some embodiments of this disclosure, in a dummy bump line, the wiring configured to surround the outside of an input pad and one or more output pads can have a width greater than the width of a branch line of the dummy bump line.

[0135] According to some embodiments of this disclosure, one or more output pads may include a first output pad and a second output pad; relative to the input pad, the first output pad, and the second output pad, the dummy bump line may include a first branch line disposed at the left end; a second branch line disposed at the upper end; a fourth branch line disposed at the lower end; a third branch line disposed between the first scan line and the data line; a fifth branch line disposed between the COP routing and the second and third scan lines; a sixth branch line disposed between the first scan line and the second and third scan lines; a seventh branch line disposed between the input pad and the first output pad; and an eighth branch line disposed between the first output pad and the second output pad.

[0136] According to some embodiments of this disclosure, one or more output pads may include a first output pad and a second output pad; and the dummy bump line may include at least one or more branch lines; at least one or more branch lines may connect the COP wiring, first scan line, second and third scan lines and data line of the first output pad to the COP wiring, first scan line, second and third scan lines and data line of the input pad along a first direction between the input pad and the first output pad, wherein the at least one or more branch lines connect the COP wiring, first scan line, second and third scan lines and data line of the second output pad to the COP wiring, first scan line, second and third scan lines and data line of the first output pad along a first direction between the first output pad and the second output pad.

[0137] According to some embodiments of this disclosure, one of the at least one or more branch lines may be disposed along a second direction between the input pad and the first output pad, and another branch line of at least one or more branch lines may be disposed to extend along a second direction between the first output pad and the second output pad.

[0138] According to some embodiments of this disclosure, relative to the input pad, the first output pad, and the second output pad, at least one or more branch lines may include: a first branch line disposed on the left side; a second branch line disposed on the upper side; a fourth branch line disposed on the lower side; a third branch line disposed on the right side; a fifth and a sixth branch line extending from the second branch line along a first direction to be disposed between the first and third branch lines; a seventh branch line extending along a second direction to be disposed between the input pad and the first output pad; and an eighth branch line extending along a second direction to be disposed between the first and second output pads, wherein each of the third, fifth, and sixth branch lines may be configured to overlap with each of the input pad, the first output pad, and the second output pad.

[0139] According to some embodiments of this disclosure, one or more output pads may include a first output pad and a second output pad, and the dummy bump line may be plate-shaped and configured to cover the input pad, the first output pad, and the second output pad.

[0140] According to some embodiments of this disclosure, the second pad unit may include: a buffer layer 111 on the substrate 100; a first insulating layer 110 on the buffer layer; a gate line on the first insulating layer; a first gate insulating layer 120 on the first insulating layer and the gate line; a second buffer layer O-BUF on the first gate insulating layer; a second gate insulating layer 150 on the second buffer layer; a fourth insulating layer 160 on the second gate insulating layer; a first wiring SD1 and a branch line SD1' (⑤) of the COP wiring on the third insulating layer; a second wiring SD2 on the first wiring of the COP wiring and the branch line of the dummy bump line; and a second planarization layer 180 on the third insulating layer, the second wiring of the COP wiring and the second wiring of the dummy bump line.

[0141] Meanwhile, a display device according to another embodiment of this specification may include: a display panel including an active region and an active region; a plurality of sub-pixels disposed in the active region, each of the plurality of sub-pixels including one or more transistors; a plurality of light-emitting elements respectively connected to one or more transistors; a flexible printed circuit board electrically connected to the display panel and disposed in the active region; a data driver electrically connected to the display panel and disposed in the active region spaced apart from the flexible printed circuit board; a gate driver supplying gate signals to the display panel; an insulating layer disposed on the plurality of light-emitting elements; a plurality of touch electrodes disposed on the insulating layer in the active region; a plurality of adhesive layers respectively disposed on the plurality of touch electrodes; and a first pad unit in the active region. The source region is disposed on one side of an adhesive layer among a plurality of adhesive layers beneath the flexible printed circuit board and electrically connected to the flexible printed circuit board; and the second pad unit is disposed on the other side of an adhesive layer among a plurality of adhesive layers beneath the data driver in the non-active region and electrically connected to the data driver, and includes an input pad and one or more output pads, wherein each of the input pad and one or more output pads may include COP wiring, a first scan line, a second and third scan line, and a data line, and wherein dummy bump lines (DBLs) may be configured to surround the outside of the input pad and one or more output pads, and branch lines of the dummy bump lines may be configured to pass between the COP wiring, the first scan line, the second and third scan lines, and the data line.

[0142] According to some embodiments of this disclosure, each of the plurality of adhesive layers may include an adhesive resin and a plurality of conductive particles disposed in the adhesive resin.

[0143] According to some embodiments of this disclosure, in the non-active region, the plurality of touch electrodes may include: a touch electrode on one side disposed on an insulating layer below the first pad unit in the non-active region; and a touch electrode on the other side disposed on an insulating layer below the second pad unit in the non-active region.

[0144] According to some embodiments of this disclosure, a sealing layer may be disposed between an adhesive layer and an insulating layer on one side, and the sealing layer may be disposed on the insulating layer to contact a touch electrode on one side of a plurality of touch electrodes.

[0145] According to some embodiments of this disclosure, an adhesive layer on one side is disposed on a touch electrode and a sealing layer on one side below the first pad unit, and an adhesive layer on the other side may be disposed on an insulating layer and a touch electrode on the other side to cover the touch electrode on the other side of a plurality of touch electrodes below the second pad unit.

[0146] According to some embodiments of the present disclosure, in the active region, a plurality of touch electrodes are disposed on an insulating layer. The plurality of touch electrodes may include a first touch electrode disposed on a touch buffer layer disposed on the insulating layer, a touch insulating layer disposed on the touch buffer layer and the first touch electrode, and a second touch electrode disposed on the touch insulating layer.

[0147] According to some embodiments of this disclosure, a touch line for transmitting touch signals may be disposed on a touch insulating layer, and the touch line may include the same material as the touch electrodes (such as a first touch electrode or a second touch electrode).

[0148] According to some embodiments of this disclosure, the display device may further include: a dam disposed in a non-active region; and a connecting line extending from the non-active region and at least partially overlapping the lower portion of the dam.

[0149] According to some embodiments of this disclosure, the non-active area may include a bent portion of the display panel, a first bent wiring and a second bent wiring disposed in the bent portion, wherein the first bent wiring may be connected to a link wire and the second bent wiring may be connected to a touch wire.

[0150] According to some embodiments of the present disclosure, the display device may further include: a third planarization layer on the second touch electrode; a protective layer disposed on the third planarization layer; and a cover glass disposed on the protective layer.

[0151] Although the invention has been described with reference to the accompanying drawings provided as examples, the invention is not limited to the drawings and embodiments disclosed herein, and it will be apparent to those skilled in the art that various modifications can be made without departing from the technical spirit of the invention. Furthermore, even if the operational effects of the configuration according to the invention are not explicitly described in the description of embodiments of the invention, the effects that can be predicted by this configuration should naturally be acknowledged.

[0152] Explanation of reference numerals in the attached figures

[0153] 10: Display device 10': Display panel

[0154] 100: Substrate; 111: Buffer layer

[0155] 110: First insulating layer; 120: First gate insulating layer

[0156] 150: Second gate insulating layer; 160: Fourth insulating layer

[0157] 180: Second planarization layer

[0158] AA: Active region; NA: Non-active region

[0159] FPCB: Flexible Printed Circuit Board; GCS: Gate Control Signal

[0160] D-IC: Data Driver; GIP: Gate Circuit Section

[0161] PX: Pixel; Touch: Touch signal

[0162] EVDD, EVSS: Drive voltage; PADA: Pad routing section

[0163] DBL1 to DBL6: Dummy bump lines In_PAD: Input pads

[0164] Out_PAD1, Out_PAD2: Output pads FOP_PAD: First pad unit COP_PAD: Second pad cell Gate: Gate wiring

Claims

1. A display device comprising: a display panel including an active area and a non-active area; a flexible printed circuit board electrically connected with the display panel and disposed in the non-active area; a data driver electrically connected with the display panel and disposed in the non-active area to be spaced apart from the flexible printed circuit board; a first pad unit disposed under the flexible printed circuit board in the non-active area and electrically connected with the flexible printed circuit board; and a second pad unit disposed under the data driver in the non-active area, electrically connected with the data driver, and including an input pad and one or more output pads, wherein each of the input pad and the one or more output pads includes a COP wiring, a first scan line, second and third scan lines, and a data line, and wherein a dummy bump line is disposed outside of the input pad and the one or more output pads, and a branch line of the dummy bump line is disposed to pass between the COP wiring, the first scan line, the second and third scan lines, and the data line. one side of the dummy bump line is disposed to pass between the data line and the first scan line, 2. The display device according to claim 1, wherein wherein a first direction of a portion of the branch line of the dummy bump line is disposed to pass between the first scan line and the second and third scan lines, and wherein a second direction of another portion of the branch line of the dummy bump line is disposed to pass between the second and third scan lines and the COP wiring. 3.The display device of claim 2, wherein: the one or more output pads include a first output pad and a second output pad; the input pad, the first output pad, and the second output pad are disposed in the first direction; a portion of a second direction of the branch line of the dummy bump line is disposed between the input pad and the first output pad; and another portion of the second direction of the branch line of the dummy bump line is disposed between the first output pad and the second output pad. In the dummy bump line, a wiring disposed outside of the input pad and the one or more output pads has a width greater than a width of the branch line of the dummy bump line.

4. The display device according to any one of claims 1 to 3, wherein the one or more output pads include a first output pad and a second output pad, and 5. The display device according to claim 1, wherein ​ The dummy bump line includes, with respect to the input pad, the first output pad, and the second output pad, a first branch line disposed at a left end, a second branch line disposed at an upper end, a fourth branch line disposed at a lower end, a third branch line disposed between the first scan line and the data line, a fifth branch line disposed between the COP wiring and both the second and third scan lines, a sixth branch line disposed between the first scan line and both the second and third scan lines, a seventh branch line disposed between the input pad and the first output pad, and an eighth branch line disposed between the first output pad and the second output pad.

6. The display device according to claim 1, wherein The one or more output pads include a first output pad and a second output pad, and the dummy bump line includes at least one or more branch lines, wherein the at least one or more branch lines connect the COP wiring, the first scan line, the second and third scan lines, and the data line of the first output pad to the COP wiring, the first scan line, the second and third scan lines, and the data line of the input pad in a first direction between the input pad and the first output pad, and wherein the at least one or more branch lines connect the COP wiring, the first scan line, the second and third scan lines, and the data line of the second output pad to the COP wiring, the first scan line, the second and third scan lines, and the data line of the first output pad in the first direction between the first output pad and the second output pad.

7. The display device of claim 6, wherein, One of the at least one or more branch lines is disposed in a second direction between the input pad and the first output pad, and another of the at least one or more branch lines is disposed to extend in the second direction between the first output pad and the second output pad.

8. The display device of claim 7, wherein, The at least one or more branch lines include, with respect to the input pad, the first output pad, and the second output pad, a first branch line disposed at a left side, a second branch line disposed at an upper side, a fourth branch line disposed at a lower side, a third branch line disposed at a right side, a fifth branch line and a sixth branch line extending from the second branch line in the first direction to be disposed between the first branch line and the third branch line, a seventh branch line extending in the second direction to be disposed between the input pad and the first output pad, and an eighth branch line extending in the second direction to be disposed between the first output pad and the second output pad, and wherein each of the third branch line, the fifth branch line, and the sixth branch line is disposed to overlap each of the input pad, the first output pad, and the second output pad.

9. The display device according to claim 1, wherein The one or more output pads include a first output pad and a second output pad, and wherein the dummy bump line is plate-shaped and is disposed to cover the input pad, the first output pad, and the second output pad.

10. The display device according to claim 1, wherein The second pad unit includes: a buffer layer on a substrate; a first insulating layer on the buffer layer; a gate line on the first insulating layer; a first gate insulating layer on the first insulating layer and the gate line; a second buffer layer on the first gate insulating layer; a second gate insulating layer on the second buffer layer; a third insulating layer on the second gate insulating layer; a first wire of the COP wire and a branch wire of the dummy bump line on the third insulating layer; a second wire on the first wire of the COP wire and the branch wire of the dummy bump wire; and a second planarization layer on the third insulating layer, a second wire of the COP wire, and a second wire of the dummy bump line.

11. A display device, comprising: a display panel including an active area and a non-active area; a plurality of subpixels provided in the active area, each of the plurality of subpixels including one or more transistors; a plurality of light emitting elements respectively connected to the one or more transistors; a flexible printed circuit board electrically connected with the display panel and provided in the non-active area; a data driver electrically connected with the display panel and provided in the non-active area to be spaced apart from the flexible printed circuit board; a gate driver supplying a gate signal to the display panel; an insulating layer provided on the plurality of light emitting elements; a plurality of touch electrodes provided on the insulating layer in the non-active area; a plurality of adhesive layers respectively provided on the plurality of touch electrodes; a first pad unit provided on one side of an adhesive layer of the plurality of adhesive layers under the flexible printed circuit board in the non-active area and electrically connected to the flexible printed circuit board; and a second pad unit provided on the other side of the adhesive layer of the plurality of adhesive layers under the data driver in the non-active area and electrically connected to the data driver, and including an input pad and one or more output pads, wherein each of the input pad and the one or more output pads includes a COP wire, a first scan line, second and third scan lines, and a data line, and wherein a dummy bump line is provided outside of the input pad and the one or more output pads, and a branch wire of the dummy bump line is provided to pass between the COP wire, the first scan line, the second and third scan lines, and the data line. Each of the plurality of adhesive layers includes an adhesive resin and a plurality of conductive particles provided in the adhesive resin.

12. The display device of claim 11, wherein, In the non-active area, the plurality of touch electrodes can include: a touch electrode of the one side provided on the insulating layer under the first pad unit in the non-active area; and a touch electrode of the other side provided on the insulating layer under the second pad unit in the non-active area.

13. The display device of claim 11, wherein, In the non-active area, the plurality of touch electrodes can include: a touch electrode of the one side provided on the insulating layer under the first pad unit in the non-active area; and a touch electrode of the other side provided on the insulating layer under the second pad unit in the non-active area.

14. The display device of claim 13, wherein, a sealing layer is disposed between the adhesive layer of the one side and the insulating layer, and the sealing layer is disposed on the insulating layer to be in contact with the touch electrode of the one side among the plurality of touch electrodes, wherein the adhesive layer of the one side is disposed on the touch electrode of the one side under the first pad unit and the sealing layer, and wherein the adhesive layer of the other side is disposed on the insulating layer and the touch electrode of the other side to cover the touch electrode of the other side among the plurality of touch electrodes under the second pad unit.

15. The display device of claim 14, wherein, In the active area, a plurality of touch electrodes are disposed on the insulating layer, and wherein the plurality of touch electrodes include a first touch electrode disposed on a touch buffer layer disposed on the insulating layer, a touch insulating layer disposed on the touch buffer layer and the first touch electrode, and a second touch electrode disposed on the touch insulating layer.

16. The display device of claim 15, wherein, A touch line transmitting a touch signal is disposed on the touch insulating layer, and the touch line includes the same material as the touch electrode. 17.The display device of claim 16, further comprising: a dam disposed in the non-active area; and a link line extending from the non-active area and at least partially overlapping a lower portion of the dam.

18. The display device of claim 17, wherein, The non-active area includes a bending portion in which the display panel is bent, a first bending wire and a second bending wire disposed in the bending portion, and wherein the first bending wire is connected to the link line, and the second bending wire is connected to the touch line. 19.The display device of claim 15, further comprising: a third planarization layer on the second touch electrode; a protective layer disposed on the third planarization layer; and a cover glass disposed on the protective layer.

Images