Electronic device and vehicle

Abstract

The invention discloses an electronic device and a vehicle, and relates to the technical field of electronic devices. The electronic device includes a base body and a piezoelectric member. Wherein the base body comprises at least two bearing parts, every two adjacent bearing parts are connected through a vibration reduction structure, and the vibration reduction structures are used for reducing vibration transmission between every two adjacent bearing parts; each bearing part is provided with a piezoelectric piece, and any two piezoelectric pieces are different in vibration frequency and / or amplitude.

Description

[0001] Cross-references to related applications

[0002] This application is based on and claims priority to Chinese Patent Application No. 202411215456.X, filed on August 30, 2024, entitled “An Electronic Device and a Vehicle”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of piezoelectric technology, and more particularly to an electronic device and a vehicle. Background Technology

[0004] Piezoelectric devices, such as piezoelectric ceramic sheets, manufactured based on the piezoelectric effect, can be used not only as sensors but also as actuators. For example, when used as a sensor, a piezoelectric ceramic sheet can detect vibrations; when used as an actuator, it can drive structural components to vibrate, thereby enabling the components to produce sound. Summary of the Invention

[0005] One embodiment of this application provides an electronic device, which includes a substrate and at least two piezoelectric elements disposed on the substrate. A vibration damping structure is provided in the region between the two piezoelectric elements on the substrate. The electronic device can generate sounds of different frequency bands with little mutual interference between different frequency bands, thereby improving the acoustic performance of the electronic device.

[0006] Another embodiment of this application provides an electronic device in which the vibration damping structure includes at least one of vibration damping through holes, vibration damping corrugations, and elastic elements. The transmission of vibration between two adjacent load-bearing parts can be reduced by any at least one vibration damping structure, thereby reducing the mutual influence between two adjacent load-bearing parts, and further reducing the mutual influence between two adjacent piezoelectric elements, which is beneficial to improving the sound effect of the sound emitted when the structure vibrates.

[0007] Another embodiment of this application provides an electronic device in which a circuit board is provided. The electronic device can be electrically connected to a controller of a target device via the circuit board, and the circuit board can be electrically connected to a piezoelectric element via a connecting circuit. On one hand, compared to the related art where the controller and piezoelectric element are electrically connected via cylindrical wires with an insulating layer, the pull-out force on the piezoelectric element can meet the usage requirements. On the other hand, the area and thickness of the solder joints welded to the wire harness on the piezoelectric element can be reduced, thereby reducing the influence of the wires electrically connected to the piezoelectric element on the vibration of the piezoelectric element, which is beneficial for better control of the acoustic performance of the piezoelectric element.

[0008] Another embodiment of this application provides an electronic device in which a piezoelectric element is electrically connected to a circuit board via a lightweight connecting circuit. When the piezoelectric element vibrates, the connecting circuit can absorb and reduce the transmission of vibration through the connecting circuit, thereby not only reducing the noise generated when the connecting circuit vibrates, but also reducing the damage to the connecting circuit caused by high-frequency vibration, and thus improving the reliability of the electrical connection between the piezoelectric element and the circuit board.

[0009] Another embodiment of this application provides an electronic device in which a connecting circuit is bonded to a substrate by a first adhesive. The first adhesive can fix the connecting circuit to the substrate, thereby utilizing the flexibility and elasticity of the first adhesive to reduce the transmission of vibration of the substrate to the connecting circuit. This is beneficial to reducing the change of the electromagnetic field inside the connecting circuit caused by vibration, thereby reducing the impact of vibration on the electrical signals transmitted through the connecting circuit.

[0010] Another embodiment of this application provides an electronic device in which a through-hole matching a connection circuit is provided on a substrate. The connection circuit can be extended from a first surface of the substrate to a second surface of the substrate through the through-hole, which helps to reduce the length of the connection circuit.

[0011] Another embodiment of this application provides an electronic device, wherein the electronic device includes a first piezoelectric element, a second piezoelectric element, and a third piezoelectric element. Since the second piezoelectric element with a smaller vibration amplitude is disposed between the first piezoelectric element and the third piezoelectric element with a larger vibration amplitude, the distance between the first piezoelectric element and the third piezoelectric element can be increased, which is beneficial to reducing the mutual interference between the vibrations generated by the first piezoelectric element and the third piezoelectric element.

[0012] Another embodiment of this application provides an electronic device in which at least two piezoelectric elements have different structures and different properties, or at least two piezoelectric elements are connected to a structural element in different ways, so that each piezoelectric element can drive the structural element to vibrate at different frequencies and / or amplitudes, thereby enabling the structural element to emit sounds in different frequency bands.

[0013] Another embodiment of this application provides an electronic device in which a frequency divider circuit is provided. The frequency divider circuit can apply sub-signals of different frequency bands of electrical signals to corresponding piezoelectric elements, thereby enabling each piezoelectric element to vibrate within its own optimal operating frequency range, which is beneficial to improving the acoustic performance of the electronic device.

[0014] To achieve one or more of the above objectives, the electronic device provided in the first aspect of this application includes a substrate and a piezoelectric element. The substrate includes at least two support portions, adjacent support portions are connected by a vibration damping structure, the vibration damping structure being used to reduce the transmission of vibration between adjacent support portions; each support portion is provided with a piezoelectric element, and any two piezoelectric elements have different vibration frequencies and / or amplitudes.

[0015] The technical solution of this application embodiment includes a substrate comprising at least two support portions, each on which a piezoelectric element is disposed. Since any two piezoelectric elements have different vibration frequencies and / or amplitudes, voltages can be applied to multiple piezoelectric elements to generate vibrations with different amplitudes and frequencies. Thus, when this electronic device is installed on the structural components of a target device, it can drive the structural components to vibrate with different amplitudes and / or frequencies, thereby enabling the structural components to simultaneously produce sounds of different frequencies, such as low, mid, or high frequencies. Furthermore, a vibration damping structure is provided between adjacent support portions. This reduces the mutual transmission of vibrations between adjacent support portions, thereby mitigating the mutual influence of multiple piezoelectric elements during vibration. This helps reduce the mutual interference between sounds of different frequencies emitted simultaneously by the structural components of the target device, thus improving the sound quality of the sound emitted by the structural components. Therefore, the electronic device provided in this application embodiment can not only generate sounds across multiple frequency bands but also improve the acoustic performance of the electronic device.

[0016] In a second aspect, the vehicle provided in this application includes a vehicle body and electronic devices provided in any of the above embodiments. The vehicle body includes multiple body panels, multiple interior trim pieces, and vehicle components connected to the body panels and / or interior trim pieces; at least one of the body panels, interior trim pieces, and vehicle components is provided with electronic devices. Attached Figure Description

[0017] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0018] Figure 1 This is a schematic diagram illustrating the application of the electronic device provided in the embodiments of this application;

[0019] Figure 2 A top view of the electronic device provided in the embodiments of this application. Figure 1 ;

[0020] Figure 3A bottom view of the electronic device provided in the embodiments of this application;

[0021] Figure 4 This is a side view of the substrate structure in an electronic device provided in an embodiment of this application;

[0022] Figure 5 A schematic cross-sectional view of the substrate along the AA direction in an electronic device provided in an embodiment of this application;

[0023] Figure 6 A top view of the electronic device provided in the embodiments of this application. Figure 2 .

[0024] Explanation of reference numerals in the attached figures:

[0025] 1-Substrate; 11-First load-bearing part; 12-Second load-bearing part; 13-First vibration damping structure; 131-First vibration damping through hole; 132-First vibration damping corrugation; 14-Through hole; 15-Third load-bearing part; 16-Second vibration damping structure; 161-Second vibration damping through hole; 162-Second vibration damping corrugation; 17-First surface; 18-Second surface; 2-First piezoelectric element; 3-Second piezoelectric element; 4-Circuit board; 41-Pad; 51-First flexible circuit board; 52-Second flexible circuit board; 53-Third flexible circuit board; 61-First adhesive; 62-Second adhesive; 63-Third adhesive; 7-Third piezoelectric element; 8-Vehicle; 81-Controller; 82-Door; 83-Fender; 9-Electronic device; Y-Arrangement direction; Z-Thickness direction. Detailed Implementation

[0026] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this application; the terms “comprising” and “having”, and any variations thereof, in the specification and the foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0028] In the description of the embodiments of this application, technical terms such as "first," "second," and "third" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0029] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0030] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects are in an "or" relationship.

[0031] In the description of the embodiments of this application, the technical terms "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed, operated or used in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0032] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0033] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical term "contact" should be interpreted broadly, and can be direct contact, contact through an intermediate medium layer, contact between two contacting parties with substantially no interaction force, or contact between two contacting parties with interaction force.

[0034] Based on the inverse piezoelectric effect, piezoelectric sound-producing resonators can be manufactured. These resonators can be placed in sound-producing devices, such as car body panels, laptops, mobile phones, all-in-one computers, PDAs, tablets, or other portable devices and IoT devices. By applying voltage to the piezoelectric resonator, it causes the sound-producing device to vibrate, thus generating sound. Traditional loudspeakers can produce bass, midrange, and treble frequencies, which work together to provide a rich audio experience. However, using a piezoelectric resonator as a driver to drive a sound-producing device to produce both bass and treble frequencies while maintaining the quality of both is not easy to achieve. This is because bass frequencies are low and have high energy, while treble frequencies are high and have low energy. Bass frequencies produced by the same piezoelectric resonator can easily disrupt the treble frequencies produced, resulting in a deterioration in the treble quality of the sound produced by that piezoelectric resonator.

[0035] Furthermore, when applying piezoelectric acoustic transducers to target equipment, to ensure the connection between the transducer and the wiring harness meets the requirements of frontal pull-out force, a thicker wiring harness is often required. This thicker harness is then electrically connected to the transducer via welding, resulting in a large and thick weld joint. During the vibration of the transducer, it drives the heavier weld joint and the heavier wiring harness to vibrate together. This leads to a deterioration in the acoustic performance of the transducer and makes it more difficult to control its acoustic performance, thus affecting the consistency and stability of its acoustic performance.

[0036] Reference Figure 1 , Figure 1 The schematic diagram of the application of the electronic device provided in this application embodiment shows that the piezoelectric sound-generating vibrator (electronic device 9) can be applied to a vehicle 8 to drive the structural components of the vehicle 8 to vibrate and produce sound. The structural components can be body panels constituting the vehicle body of the vehicle 8, interior and exterior trim parts, or vehicle accessories connected to the body panels, interior trim parts, or exterior trim parts. For example, the electronic device 9 can be installed on structural components such as the fender 83, door 82, window, hood, trunk lid, and roof of the vehicle 8. The circuit board in the electronic device 9 can be electrically connected to the controller 81 in the vehicle via wires. The controller 81 in the vehicle 8 may include an Electronic Control Unit (ECU), which can issue control commands to the electronic device 9 to control different parts of the electronic device 9 to perform their respective actions. That is, the ECU can control the vibration of each piezoelectric element in the electronic device 9 to drive the vibration of various structural components in the vehicle 8.

[0037] This application provides an electronic device that can drive structural components of a target device to generate sound across multiple frequency bands, and also improves the acoustic performance of the electronic device. For ease of description and explanation, the target device is a vehicle, as an example, to illustrate the electronic device provided in this application. However, this does not limit the application of the electronic device to vehicles; it can be used in any device or equipment that requires vibration to generate sound. (Refer to...) Figure 2 , Figure 3 and Figure 4 , Figure 2 A top view of the electronic device provided in the embodiments of this application. Figure 1 , Figure 3 This is a bottom view of the electronic device provided in an embodiment of this application. Figure 4 This is a side view of the substrate structure of the electronic device provided in the embodiments of this application.

[0038] The electronic device provided in this application includes a substrate 1, a first piezoelectric element 2, and a second piezoelectric element 3. The substrate 1 has a first support portion 11 and a second support portion 12, which are connected by a first vibration damping structure 13 to reduce vibration transmission between the first support portion 11 and the second support portion 12. The first piezoelectric element 2 is disposed on the first support portion 11 and electrically connected to a circuit board 4. The second piezoelectric element 3 is disposed on the second support portion 12 and electrically connected to the circuit board 4. The first piezoelectric element 2 and the second piezoelectric element 3 have different structures or properties, resulting in different vibration frequencies and / or amplitudes.

[0039] In the embodiments of this application, such as Figure 1 As shown, the substrate 1 is used to mount and support other components in the electronic device. For example, the substrate 1 can be configured as a square, circular, or irregularly shaped plate or sheet structure. The substrate 1 can be made of rigid materials; for example, it can be made of metals such as stainless steel or aluminum, or it can be made of rigid plastics such as polycarbonate (PC), polystyrene (PS), or polyformaldehyde (POM). This application does not limit the specific material of the substrate 1.

[0040] For example, the substrate 1 can be configured to include a first support portion 11 and a second support portion 12, so that the first piezoelectric element 2 and the second piezoelectric element 3 can be mounted on the first support portion 11 and the second support portion 12 respectively. For example, the first support portion 11 can be configured as a sheet similar in shape to the first piezoelectric element 2, and the area of ​​the first support portion 11 is larger than the area of ​​the first piezoelectric element 2. The first piezoelectric element 2 can be fixed to the first support portion 11 by adhesive bonding. The second support portion 12 can be configured as a sheet similar in shape to the second piezoelectric element 3, and the area of ​​the second support portion 12 is larger than the area of ​​the second piezoelectric element 3. The second piezoelectric element 3 can also be fixed to the second support portion 12 by adhesive bonding.

[0041] In this embodiment, the first support portion 11 and the second support portion 12 can be an integral structure, meaning there are no other connecting structures between them. For example, the base 1 can be a single, integrally formed thin plate with identical structure and shape throughout. Two regions on this thin plate can be used as the first support portion 11 and the second support portion 12, respectively.

[0042] In this embodiment, a vibration damping structure can be provided in the substrate 1, connecting two adjacent load-bearing parts in the substrate 1. This damping structure reduces the mutual transmission of vibrations between the two adjacent load-bearing parts, thereby reducing the impact of piezoelectric elements on each of the two load-bearing parts during vibration. For example, as... Figure 2 As shown, when the base 1 includes two support parts, a first support part 11 and a second support part 12, a first vibration damping structure 13 can be provided between the first support part 11 and the second support part 12. The first vibration damping structure 13 can be integrally formed with the first support part 11 and the second support part 12. Alternatively, the first vibration damping structure 13 can be integrally formed with the first support part 11, and the first vibration damping structure 13 and the second support part 12 can be fixedly connected by welding, bonding, threaded connection, riveting, or other methods. Alternatively, the first vibration damping structure 13 and the second support part 12 can be integrally formed, and the first vibration damping structure 13 and the first support part 11 can be fixedly connected by welding, bonding, threaded connection, riveting, or other methods. Alternatively, the first support part 11, the second support part 12, and the first vibration damping structure 13 can all be separate structures, and the first vibration damping structure 13 can be fixedly connected to the first support part 11 and the second support part 12 by welding, bonding, threaded connection, riveting, or other methods.

[0043] For example, the vibration damping structure may include vibration damping through-holes. (e.g.) Figure 2 and Figure 3As shown, a first vibration-damping through-hole 131 can be provided between the first support portion 11 and the second support portion 12, serving as the first vibration-damping structure 13. For example, the first vibration-damping through-hole 131 can be a large rectangular through-hole, or it can be a structure comprising multiple smaller through-holes arranged in a matrix. These smaller through-holes can be circular, rectangular, or prismatic. Optionally, the length of the first vibration-damping through-hole 131 (the dimension perpendicular to the arrangement direction Y of the first support portion 11 and the second support portion 12) can be greater than, equal to, or less than the length of the first piezoelectric element 2, and also greater than, equal to, or less than the length of the second piezoelectric element 3. Preferably, the length of the first vibration-damping through-hole 131 can be greater than or equal to the length of the longer of two adjacent piezoelectric elements. By using the first vibration damping through hole 131 as the first vibration damping structure 13, the connection area between the first bearing part 11 and the second bearing part 12 on the base 1 can be reduced through the first vibration damping through hole 131, thereby reducing the mutual transmission of vibration between the first bearing part 11 and the second bearing part 12.

[0044] Another example is that vibration-damping structures can also include vibration-damping corrugations. For example... Figure 2 and Figure 3 As shown, a first damping corrugation 132 can be provided on the substrate 1 along the arrangement direction Y perpendicular to the first bearing portion 11 and the second bearing portion 12. That is, the first bearing portion 11 and the second bearing portion 12 are connected by the first damping corrugation 132, and the first damping corrugation 132 serves as the first damping structure 13. For example, the first damping corrugation 132 can be configured as a structure of multiple grooves and ridges arranged in a continuous alternating pattern, with the axis of each groove and each ridge being perpendicular or nearly perpendicular to the arrangement direction Y of the first bearing portion 11 and the second bearing portion 12.

[0045] Among them, such as Figure 4 As shown, adjacent grooves and protrusions can be continuous curved surfaces. For example, the first damping corrugation 132 can be made to protrude entirely toward the first surface 17 of the substrate 1, so that the first damping corrugation 132 is recessed downward on the second surface 18 of the substrate 1; or, the side of the first damping corrugation 132 near the first surface 17 of the substrate 1 can be recessed downward relative to the first surface 17, and the side of the first damping corrugation 132 near the second surface 18 of the substrate 1 can be recessed downward relative to the second surface; or, the side of the first damping corrugation 132 near the first surface 17 of the substrate 1 can be flush with the first surface 17, and the side of the first damping corrugation 132 near the second surface 18 of the substrate 1 can be recessed downward relative to the second surface 18. For example, the side of the first damping corrugation 132 near the second surface 18 of the substrate 1 is recessed 1 mm to 2 mm downward relative to the second surface 18 toward the first surface 17.

[0046] For example, the first damping corrugation 132 can protrude from the second surface 18. Thus, when the electronic device is mounted on the structural component of the target device, a gap is required between the first damping corrugation 132 protruding from the second surface 18 and the structural component, such as a gap of 1mm to 2mm. The first surface 17 and the second surface 18 are two surfaces on the substrate 1 that are opposite to each other along the thickness direction Z of the substrate 1, and the second surface 18 can be connected to the structural component of the target device. For example, when the substrate 1 is made of metal, the first damping corrugation 132 can be formed on the substrate 1 by stamping, so that the first support portion 11, the second support portion 12, and the first damping corrugation 132 are an integral structure; or, the first support portion 11 and the first damping corrugation 132 can be an integral structure, while the second support portion 12 and the first damping corrugation 132 are welded together; or, the second support portion 12 and the first damping corrugation 132 can be an integral structure, while the first support portion 11 and the first damping corrugation 132 are welded together. In this way, the mutual transmission of vibration between the first support portion 11 and the second support portion 12 can be reduced by the first damping corrugation 132.

[0047] As another example, a vibration damping structure can also include a combination of vibration damping through holes and vibration damping corrugations. For example... Figure 2 and Figure 3 As shown, a first vibration damping through hole 131 and a first vibration damping corrugation 132 can be simultaneously provided between the first support portion 11 and the second support portion 12, and the first vibration damping through hole 131 and the first vibration damping corrugation 132 together serve as the first vibration damping structure 13. For example, the first vibration damping through hole 131 can be provided in a region near the center of the base 1; along the Y direction perpendicular to the arrangement direction of the first support portion 11 and the second support portion 12, the first vibration damping corrugation 132 can be provided on both sides of the edge of the first vibration damping through hole 131 on the base 1, or the first vibration damping corrugation 132 can be provided on one side of the edge of the first vibration damping through hole 131 on the base 1.

[0048] In another example, the first vibration damping structure 13 can employ elastic elements such as elastic sheets or springs, connecting the first bearing portion 11 and the second bearing portion 12 via parts with good elastic deformation capabilities. For instance, the two ends of the sheet or spring can be fixedly connected to the first bearing portion 11 and the second bearing portion 12 by welding or bonding. Thus, when the first bearing portion 11 vibrates under the influence of the first piezoelectric element 2, and / or when the second bearing portion 12 vibrates under the influence of the second piezoelectric element 3, the elastic elements can absorb the vibrations generated by the first bearing portion 11 and the second bearing portion 12, thereby reducing the mutual influence between them.

[0049] In this embodiment, the piezoelectric element is a component made of piezoelectric material, exhibiting both piezoelectric and inverse piezoelectric effects. For example, the piezoelectric element can be a lead zirconate titanate (PZT) piezoelectric ceramic sheet. By designing the connection methods between the first piezoelectric element 2 and the second piezoelectric element 3 and the structural components of the target device, the first piezoelectric element 2 and the second piezoelectric element 3 can respectively drive the structural components to produce sounds of different pitches. Alternatively, by designing the structure or properties of the first piezoelectric element 2 and the second piezoelectric element 3, the first piezoelectric element 2 and the second piezoelectric element 3 can respectively drive the structural components to produce sounds of different pitches. Thus, when a voltage is applied to the first piezoelectric element 2 and the second piezoelectric element 3, the first piezoelectric element 2 and the second piezoelectric element 3 can respectively generate vibrations with different amplitudes and / or frequencies. Therefore, the first piezoelectric element 2 can drive the first bearing part 11, and the second piezoelectric element 3 can drive the second bearing part 12 to produce vibrations with different amplitudes and / or frequencies, which means that the structural components can produce sounds of different pitches. For example, by designing the connection method between the first piezoelectric element 2 and the second piezoelectric element 3 and the structural components of the target device, and / or by designing the structure or properties of the first piezoelectric element 2 and the second piezoelectric element 3, the vibration frequency of the second piezoelectric element 3 can be made greater than the vibration frequency of the first piezoelectric element 2.

[0050] For example, a gap can be created between the first piezoelectric element 2 and the structural component of the target device. This means the base 1 is fixedly connected to the structural component, while maintaining a certain distance between the first piezoelectric element 2 and the structural component. For instance, the area on the first support portion 11 where the first piezoelectric element 2 is not located can be bonded to the structural component to create a gap between them. The connection area between the first piezoelectric element 2 and the structural component can be located on either side or at the edge of the first support portion 11. The second piezoelectric element 3 can be fixedly connected to the structural component, such as by bonding the side of the second piezoelectric element 3 away from the second support portion 12 to the structural component. This allows the first piezoelectric element 2 and the second piezoelectric element 3 to drive the structural component to vibrate with different frequencies and / or amplitudes during vibration.

[0051] In another example, the structures of the first piezoelectric element 2 and the second piezoelectric element 3 can be the same or different; that is, one or more of the following may be the same or different: the number of stacked layers, the area, or the size of the two piezoelectric elements. For example, the first piezoelectric element 2 may be composed of at least two layers of piezoelectric ceramic sheets, and the second piezoelectric element 3 may include one layer of piezoelectric ceramic sheet. Alternatively, along the arrangement direction Y of the first support portion 11 and the second support portion 12, the length of the first piezoelectric element 2 may be greater than or equal to the length of the second piezoelectric element 3. Or, along the arrangement direction Y perpendicular to the first support portion 11 and the second support portion 12, the length of the first piezoelectric element 2 may be greater than or equal to the length of the second piezoelectric element 3. For example, the first piezoelectric element 2 may be configured as a long rectangular sheet, while the second piezoelectric element 3 may be configured as a short rectangular or approximately square sheet, with the projected area of ​​the first piezoelectric element 2 on the first support portion 11 being greater than the projected area of ​​the second piezoelectric element 3 on the second support portion 12. This is beneficial for the first piezoelectric element 2 to drive the structural component to produce bass, and for the second piezoelectric element 3 to drive the structural component to produce treble, and it also helps to save costs.

[0052] Another example, such as Figure 1 and Figure 2 As shown, the first piezoelectric element 2 and the second piezoelectric element 3 can be disposed on the first support portion 11 and the second support portion 12 in different distribution patterns. For example, a piezoelectric ceramic sheet can be disposed on each of the two opposite surfaces of the first support portion 11, and these two piezoelectric ceramic sheets together serve as the first piezoelectric element 2; alternatively, a piezoelectric ceramic sheet serving as the first piezoelectric element 2 can be disposed on one surface of the first support portion 11, and a piezoelectric ceramic sheet serving as the second piezoelectric element 3 can be disposed on one surface of the second support portion 12.

[0053] As another example, the properties of the first piezoelectric element 2 and the second piezoelectric element 3 can also be different, including capacitance and dielectric constant. For instance, the first piezoelectric element 2 can be made of a piezoelectric material with a capacitance greater than that of the second piezoelectric element 3. Alternatively, the first piezoelectric element 2 can be made of a piezoelectric material with a dielectric constant greater than that of the second piezoelectric element 3. In this way, when the same voltage is applied to the first piezoelectric element 2 and the second piezoelectric element 3, the first piezoelectric element 2 can produce a larger amplitude vibration, thereby enabling the first piezoelectric element 2 to drive the structural component to vibrate and produce a lower frequency bass sound; the second piezoelectric element 3 can produce a smaller amplitude vibration, thereby enabling the second piezoelectric element 3 to drive the structural component to vibrate and produce a higher frequency treble sound.

[0054] The electronic device provided in this application embodiment has a first piezoelectric element 2 and a second piezoelectric element 3 respectively disposed on the first support portion 11 and the second support portion 12. Since the first piezoelectric element 2 and the second piezoelectric element 3 have different structures or properties, applying voltage to the first piezoelectric element 2 and the second piezoelectric element 3 can cause them to generate vibrations with different amplitudes and / or frequencies. Thus, when this electronic device is installed on a structural component of a target device, it can drive the structural component to generate vibrations with different amplitudes and / or frequencies, thereby enabling the structural component to simultaneously produce sounds of different frequencies, such as simultaneously producing low, mid, or high frequencies. Simultaneously, a first vibration damping structure 13 is disposed between the first support portion 11 and the second support portion 12. This first vibration damping structure 13 reduces the mutual transmission of vibrations between the first support portion 11 and the second support portion 12, thereby reducing the mutual influence of the first piezoelectric element 2 and the second piezoelectric element 3 during vibration. This helps to reduce the mutual interference between sounds of different frequencies emitted simultaneously by the structural component, thus improving the sound effect of the sound emitted by the structural component. Therefore, the electronic device provided in this application embodiment can not only generate sound in multiple frequency bands, but also improve the acoustic performance of the electronic device.

[0055] In some possible embodiments of this application, such as Figure 1 As shown, the electronic device also includes a circuit board 4, and each piezoelectric element is electrically connected to the circuit board 4. The circuit board 4 is used to electrically connect to the target device.

[0056] In this embodiment, a circuit board 4 can be disposed in the electronic device, and the circuit board 4 can be disposed on the second carrier 12. The circuit board 4 can be a printed circuit board (PCB). For example, the PCB can be glued to the second carrier 12, or the PCB can be soldered to the substrate 1 through solder pads on the PCB. The first piezoelectric element 2 and the circuit board 4 can be electrically connected by wires, and the second piezoelectric element 3 and the circuit board 4 can also be electrically connected by wires, so as to apply voltage to the first piezoelectric element 2 and the second piezoelectric element 3 through the circuit board 4. In this way, the first piezoelectric element 2 and the second piezoelectric element 3 are electrically connected to the circuit board 4 respectively, which facilitates the electrical connection between the electronic device and the controller of the target device through the circuit board 4. The target device can be a portable computer program device attached to or controlled by the electronic device, including but not limited to vehicles, smart home devices (such as access control devices, camera devices, smart home appliances, smart terminals, etc.), etc., and the controller can include but is not limited to electronic control units (ECUs), microcontroller units (MCUs), access control controllers, etc.

[0057] In some possible embodiments of this application, such as Figure 1 As shown, the electronic device also includes a connection circuit, in which the first piezoelectric element 2 and the circuit board 4 are electrically connected, and the second piezoelectric element 3 and the circuit board 4 are electrically connected.

[0058] In this embodiment, a lightweight and highly flexible connection circuit can be used to electrically connect the piezoelectric element to the circuit board 4. For example, the connection circuit can be a structure including wires and / or a flexible printed circuit (FPC). Two flexible circuit boards can be provided in the connection circuit to electrically connect the first piezoelectric element 2 and the second piezoelectric element 3 to the circuit board 4 through the two flexible circuit boards respectively.

[0059] For example, such as Figure 2 and Figure 3 As shown, when the first piezoelectric element 2 includes two piezoelectric ceramic sheets, the first flexible circuit board 51 can be configured to include four copper foil wires, so that both piezoelectric ceramic sheets can be electrically connected to the circuit board 4 through the first flexible circuit board 51. The two piezoelectric ceramic sheets in the first piezoelectric element 2 each serve as a piezoelectric component of the first piezoelectric element 2. The routing paths of the four copper foil wires of the first flexible circuit board 51 can be determined according to the positions of the two piezoelectric ceramic sheets and the circuit board 4 on the substrate 1. For example, when the circuit board 4 is fixed to the second support portion 12, two larger pads 41 can be provided on the circuit board 4. The two larger pads 41 can be through-hole shaped, allowing connectors to be mounted on the circuit board 4. The two larger pads 41 can also be disc shaped, allowing copper foil wires to be directly soldered onto the larger pads 41. Furthermore, four smaller pads 41 corresponding to the four copper foil wires on the first flexible circuit board 51 can be provided on the circuit board 4. Two of the four smaller pads 41 are electrically connected to the same larger pad 41, and the other two smaller pads 41 are electrically connected to the other larger pad 41.

[0060] like Figure 2 As shown, the piezoelectric ceramic sheet disposed on the first surface 17 of the first carrier portion 11 in the first piezoelectric element 2 can be electrically connected to two smaller pads 41 on the circuit board 4 via two copper foil wires in the first flexible circuit board 51. Figure 3As shown, the piezoelectric ceramic sheet disposed on the second surface 18 of the first support portion 11 in the first piezoelectric element 2 can be electrically connected to two smaller pads 41 on the circuit board 4 via two additional copper foil wires in the first flexible circuit board 51. Furthermore, the positive terminals of both piezoelectric ceramic sheets in the first piezoelectric element 2 are electrically connected to the same larger pad 41 on the circuit board 4, and the negative terminals of both piezoelectric ceramic sheets in the first piezoelectric element 2 are electrically connected to another larger pad 41 on the circuit board 4. In this way, when electrically connecting the electronic device to a target device using the electronic device, both piezoelectric ceramic sheets in the first piezoelectric element 2 can be electrically connected to the target device via the two larger pads 41, which helps reduce the number of wires connecting the electronic device and the target device. Moreover, fixing the first piezoelectric element 2, the circuit board 4, and the connecting circuit to the base 1 provides good fixation for the connecting circuit, reducing movement of the connecting circuit relative to the base 1, thereby reducing the pull-out force on the connecting circuit and improving the reliability of the electrical connection between the first piezoelectric element 2 and the circuit board 4.

[0061] It should be noted that the first piezoelectric element 2 can also be disposed on one surface of the first support portion 11. For example, the first piezoelectric element 2 can be disposed in the region of the first support portion 11 on the first surface 17 of the substrate 1.

[0062] In another example, the second flexible circuit board 52 can be configured to include two copper foil wires to electrically connect the piezoelectric ceramic sheet in the second piezoelectric element 3 to the circuit board 4. The routing paths of the two copper foil wires of the second flexible circuit board 52 can be determined based on the positions of the second piezoelectric element 3 and the circuit board 4 on the substrate 1. For example, as... Figure 2 and Figure 3 As shown, when the circuit board 4 is fixed on the second support portion 12, two additional smaller pads can be provided on the circuit board 4, each corresponding to one of the two copper foil wires on the second flexible circuit board 52. Thus, the positive and negative terminals of the piezoelectric ceramic sheet, which serves as the second piezoelectric element 3, are electrically connected to the two additional smaller pads on the circuit board 4 via the two copper foil wires in the second flexible circuit board 52.

[0063] In the above embodiments, by using a lightweight connection circuit to electrically connect the piezoelectric element to the circuit board 4, on the one hand, compared with the commonly used cylindrical wires with insulation layers, the area and thickness of the solder joints on the piezoelectric element and the wire harness can be reduced. This reduces the influence of the wires electrically connected to the piezoelectric element on the vibration of the piezoelectric element, which is beneficial for better control of the acoustic performance of the piezoelectric element. On the other hand, because the flexible circuit board in the connection circuit has good flexibility, when the piezoelectric element vibrates, the connection circuit can absorb and reduce the transmission of vibration through the connection circuit. This not only reduces the noise generated when the connection circuit vibrates, but also reduces the damage to the connection circuit caused by high-frequency vibration, thereby improving the reliability of the electrical connection between the piezoelectric element and the circuit board 4.

[0064] In some possible embodiments of this application, such as Figure 2 and Figure 3 As shown, the connecting circuit is bonded to the substrate 1 via a first adhesive member 61, which is made of a flexible material. A relatively soft first adhesive member 61 can be used to bond the connecting circuit to the substrate 1. For example, the first adhesive member 61 can be double-sided adhesive. Specifically, the double-sided adhesive can be shaped similarly to the first flexible circuit board 51. The first flexible circuit board 51 can be bonded to both the first support portion 11 and the second support portion 12 using double-sided adhesive. Where the first flexible circuit board 51 passes through the first vibration damping structure 13, double-sided adhesive can also be placed between the first vibration damping structure 13 and the first flexible circuit board 51 to reduce the relative displacement between the first flexible circuit board 51 and the first vibration damping structure 13. Alternatively, a flexible single-sided adhesive can be provided between the portion of the first flexible circuit board 51 that passes through the first vibration damping structure 13 and the first vibration damping structure 13 to bond the single-sided adhesive to the first flexible circuit board 51. This can create a gap between the single-sided adhesive and the first vibration damping structure 13. For example, the single-sided adhesive can be set as an arch shape that is recessed away from the first vibration damping structure 13, thereby reducing the contact between the first vibration damping structure 13 and the first flexible circuit board 51 through the single-sided adhesive.

[0065] In the above embodiments, since the connecting circuit is bonded to the substrate 1 via the first adhesive member 61, the connecting circuit can be fixed to the substrate 1, which helps to reduce the pull-out force on the connecting circuit. The flexibility and elasticity of the first adhesive member 61 can also reduce the transmission of vibration from the substrate 1 to the connecting circuit, which helps to reduce the change in the internal electromagnetic field of the connecting circuit caused by vibration, thereby reducing the impact of vibration on the electrical signals (such as voltage) transmitted through the connecting circuit.

[0066] In some possible embodiments of this application, reference is made to Figure 5 , Figure 5This is a cross-sectional view of the substrate along the AA direction in an electronic device provided in an embodiment of this application. The substrate 1 has a through-hole 14 that matches the connection circuit, and at least a portion of the connection circuit extends between two opposing surfaces of the substrate 1 through the through-hole 14.

[0067] In the embodiments of this application, such as Figure 2 and Figure 3 As shown, the first piezoelectric element 2 can employ at least two piezoelectric ceramic sheets, with the two piezoelectric ceramic sheets respectively disposed on two opposing surfaces of the first support portion 11. This requires a portion of the first flexible circuit board 51 to extend from the first surface 17 of the substrate 1 to the second surface 18, where the first surface 17 and the second surface 18 are two opposing surfaces of the substrate 1.

[0068] For example, such as Figure 2 and Figure 3 As shown, a through-hole 14 can be provided on the first support portion 11, which is adjacent to the welding point of the piezoelectric ceramic sheet located on the second surface 18 of the first piezoelectric element 2. For example, the extension direction of the through-hole 14 is perpendicular or nearly perpendicular to the thickness direction Z of the substrate 1. Two copper foil wires in the first flexible circuit board 51 can then pass through the through-hole 14 from the first surface 17, extending to the second surface 18, to facilitate the arrangement of the first flexible circuit board 51.

[0069] In another example, when the circuit board 4 is disposed on the first surface 17 of the substrate 1 and the second piezoelectric element 3 is disposed on the second surface 18 of the substrate 1, a through-hole 14 corresponding to the second flexible circuit board 52 can also be provided on the second support portion 12. The through-hole 14 on the second support portion 12 can communicate with the first damping through-hole 131 in the first damping structure 13; the through-hole 14 on the second support portion 12 can also be an independent through-hole. Thus, the second flexible circuit board 52 can pass through the through-hole 14 from the first surface 17, extending the second flexible circuit board 52 to the second surface 18, facilitating the arrangement of the second flexible circuit board 52.

[0070] Another example, such as Figure 5As shown, the extension direction of the through-hole 14 can be made to form an acute angle with the thickness direction Z of the substrate 1. For example, the extension direction of the through-hole 14 can be set to be similar to the tilt direction of the flexible circuit board as it naturally extends through the through-hole 14. If the piezoelectric element is closer to the center of the substrate 1 than the circuit board 4, and the circuit board 4 is disposed on the first surface 17 of the substrate 1, the end of the through-hole 14 located on the second surface 18 can be closer to the center of the substrate 1 than the end of the through-hole 14 located on the first surface 17. For example, the extension direction of the through-hole 14 can be made to form an angle of 45 degrees, 60 degrees, etc., with the thickness direction Z of the substrate 1. In this way, along the extension direction of the connecting circuit, the angle between the edge of the through-hole 14 and the first surface 17 and the second surface 18 of the substrate 1 can be increased, so that the edge of the through-hole 14 transitions more smoothly with the first surface 17 and the second surface 18. This structural design increases the bending radius of the connecting circuit when it passes through the through hole 14, which helps the connecting circuit to pass through the through hole 14 with less bending deformation, and also reduces the wear of the connecting circuit at the edge of the through hole 14.

[0071] Another example, such as Figure 3 As shown, the through-hole 14 can be positioned on the substrate 1 closer to the connection point between the connecting circuit and the piezoelectric element. For example, when the through-hole 14 is inclined at an acute angle to the thickness direction Z of the substrate 1, the connection point between the connecting circuit and the piezoelectric element can be positioned within the orthographic projection area of ​​the extension path of the through-hole 14 onto the piezoelectric element. That is, after the connecting circuit passes through the through-hole 14, under the constraint of the through-hole 14 on the extension direction of the connecting circuit, the orthographic projection of the connecting circuit outside the through-hole 14 onto the piezoelectric element covers the connection point between the connecting circuit and the piezoelectric element when the connecting circuit extends naturally. In this way, the connecting circuit can connect to the connection point on the piezoelectric element without bending after passing through the through-hole 14, which helps to reduce the number of bends in the connecting circuit.

[0072] Alternatively, the connection point between the connecting circuit and the piezoelectric element can be located on the piezoelectric element adjacent to the extension path of the through-hole 14. For example, a bent solder joint can be provided at the end of the connecting circuit that connects to the piezoelectric element. After the connecting circuit passes through the through-hole 14, due to the restriction of the extension direction of the main body of the connecting circuit by the through-hole 14, the solder joint of the connecting circuit located outside the through-hole 14 coincides with the connection point on the piezoelectric element when it extends naturally. In this way, the connecting circuit can connect to the connection point on the piezoelectric element when it extends naturally after passing through the through-hole 14, which helps to reduce the tensile or bending stress on the connecting circuit.

[0073] In some possible embodiments of this application, reference is made to Figure 6 , Figure 6 A top view of the electronic device provided in the embodiments of this application. Figure 2 The electronic device also includes a third carrier part 15 and a third piezoelectric element 7. The third carrier part 15 is connected to the second carrier part 12 or the first carrier part 11. The third piezoelectric element 7 is disposed on the third carrier part 15 and electrically connected to the circuit board 4. The vibration frequencies and / or amplitudes of any two of the third piezoelectric element 7, the first piezoelectric element 2 and the second piezoelectric element 3 are different.

[0074] In the embodiments of this application, such as Figure 6 As shown, a third piezoelectric element 7 can also be provided in the electronic device to enable the electronic device to generate vibrations with more different vibration frequencies and / or amplitudes. For example, a third support portion 15 can be provided on the side of the second support portion 12 away from the first support portion 11, so that the third piezoelectric element 7 can be provided on the third support portion 15.

[0075] For example, the third support portion 15 and the second support portion 12 can be an integral structure or two separate structural components. Regardless of whether the third support portion 15 and the second support portion 12 are integral or separate, they can be connected by the second vibration damping structure 16.

[0076] In another example, when the third support portion 15 and the second support portion 12 are integrated, a second vibration damping through hole 161 can be provided on the base 1 between the third support portion 15 and the second support portion 12. The length of the second vibration damping through hole 161 can be greater than or equal to the length of the longer of the two piezoelectric elements adjacent to the second vibration damping through hole 161. The second vibration damping through hole 161 serves as a second vibration damping structure 16. The connection area between the third support portion 15 and the second support portion 12 can be reduced by using the second vibration damping through hole 161, which helps to reduce the mutual transmission of vibration between the third support portion 15 and the second support portion 12.

[0077] Another example, such as Figure 6 As shown, in the arrangement direction Y perpendicular to the third piezoelectric element 7 and the second piezoelectric element 3, a second damping corrugation 162 can also be provided between the second support portion 12 and the third support portion 15 on the substrate 1. The second damping corrugation 162 can be a structure of multiple grooves and protrusions arranged in a continuous alternating pattern, with the axis of each groove and each protrusion perpendicular or nearly perpendicular to the arrangement direction Y of the third support portion 15 and the second support portion 12. In this way, the mutual transmission of vibration between the third support portion 15 and the second support portion 12 can be reduced by the second damping corrugation 162.

[0078] In another example, a second vibration damping through-hole 161 and a second vibration damping corrugation 162 can be simultaneously provided between the third support portion 15 and the second support portion 12, and the second vibration damping through-hole 161 and the second vibration damping corrugation 162 together serve as the second vibration damping structure 16. For example, the second vibration damping through-hole 161 can be provided in the region near the center of the base 1 between the third support portion 15 and the second support portion 12; along the Y direction perpendicular to the arrangement direction of the third support portion 15 and the second support portion 12, the second vibration damping corrugation 162 can be provided on both edges of the second vibration damping through-hole 161 on the base 1, or the second vibration damping corrugation 162 can be provided on one edge of the second vibration damping through-hole 161 on the base 1.

[0079] In another example, the third support portion 15 and the second support portion 12 can also be separate structures, and the independent third support portion 15 and the second support portion 12 can be connected by elastic elements such as elastic sheets or springs. The elastic element is used as the second damping structure 16 to achieve the connection between the third support portion 15 and the second support portion 12. For example, the two ends of the sheet or spring can be fixedly connected to the third support portion 15 and the second support portion 12 by welding or bonding, respectively.

[0080] In this embodiment, the first piezoelectric element 2, the second piezoelectric element 3, and the third piezoelectric element 7 have different structures, including one or more of the following: the structure of the three piezoelectric elements themselves, the area of ​​the three piezoelectric elements, and the connection method of the three piezoelectric elements to the structural components in the target device using the electronic device. The first piezoelectric element 2, the second piezoelectric element 3, and the third piezoelectric element 7 have different properties, including at least one difference in the capacitance value or dielectric constant of the three piezoelectric elements.

[0081] For example, when the first piezoelectric element 2 causes the structural component to produce low frequencies (e.g., vibrations with a frequency between 40Hz and 150Hz), and the second piezoelectric element 3 causes the structural component to produce high frequencies (e.g., vibrations with a frequency greater than 8000Hz), by setting the structure (e.g., material composition), area, capacitance value, and dielectric constant of the third piezoelectric element 7, the amplitude and frequency of the vibrations produced by the third piezoelectric element 7 can be made to be between the amplitude and frequency of the vibrations produced by the first piezoelectric element 2 and the second piezoelectric element 3, respectively. This allows the third piezoelectric element 7 to drive the structural component to produce mid-range frequencies (e.g., vibrations with a frequency between 500Hz and 2000Hz). For instance, the vibration frequency of the second piezoelectric element 3 can be made greater than the vibration frequency of the third piezoelectric element 7, and the vibration frequency of the third piezoelectric element 7 can be made greater than the vibration frequency of the first piezoelectric element 2.

[0082] In another example, along the arrangement direction Y of the first piezoelectric element 2 and the second piezoelectric element 3, the first piezoelectric element 2, the second piezoelectric element 3, and the third piezoelectric element 7 can be sequentially arranged on the three support portions of the substrate 1, or the first piezoelectric element 2, the third piezoelectric element 7, and the second piezoelectric element 3 can be sequentially arranged on the three support portions of the substrate 1. This application embodiment does not limit the arrangement order or specific position of the three piezoelectric elements on the substrate 1.

[0083] In the embodiments of this application, such as Figure 6 As shown, the third piezoelectric element 7 can be electrically connected to the circuit board 4 via the third flexible circuit board 53. For example, two smaller pads 41 that match the third flexible circuit board 53 can be provided on the side of the circuit board 4 near the third piezoelectric element 7.

[0084] For example, when the third piezoelectric element 7 is disposed on the second surface 18 of the substrate 1 (third support portion 15), the third flexible circuit board 53 can be configured to include two copper foil wires. One end of the two copper foil wires in the third flexible circuit board 53 is soldered to two smaller pads 41 on the circuit board 4, and the other end of the two copper foil wires in the third flexible circuit board 53 is soldered to the positive and negative electrodes on the piezoelectric ceramic sheet that serves as the third piezoelectric element 7, so that the third piezoelectric element 7 is electrically connected to the circuit board 4 through the third flexible circuit board 53.

[0085] In the above embodiments, since a third piezoelectric element 7 is also provided in the electronic device, the third piezoelectric element 7 generates vibrations with amplitudes and / or frequencies different from those of the first piezoelectric element 2 and the second piezoelectric element 3. This allows the structural component to simultaneously generate sounds of more different frequencies, such as simultaneously generating bass, mid-range, and treble. Furthermore, the third support portion 15, where the third piezoelectric element 7 is provided, is connected to the first support portion 11 or the second support portion 12 via a second vibration damping structure 16. The second vibration damping structure 16 reduces the mutual transmission of vibrations between the second support portion 12 and the third support portion 15, thereby reducing the mutual influence between the second piezoelectric element 3 and the third piezoelectric element 7 during vibration. This helps to reduce the mutual interference between sounds of different frequencies emitted simultaneously by the structural component.

[0086] In some possible embodiments of this application, such as Figure 3 As shown, a second adhesive member 62 is provided on the second surface 18 of the substrate 1, and the substrate 1 can be bonded and fixed to the structural component of the target device through the second adhesive member 62.

[0087] In the embodiments of this application, such as Figure 2 As shown, the first support portion 11 can be configured to have an area larger than that of the first piezoelectric element 2, and the second support portion 12 can be configured to have an area larger than that of the second piezoelectric element 3. In this way, a portion of the connection area for bonding with the structural component can be reserved on both the first support portion 11 and the second support portion 12.

[0088] For example, along the Y-direction perpendicular to the arrangement direction of the first piezoelectric element 2 and the second piezoelectric element 3, a piezoelectric ceramic sheet of the first piezoelectric element 2 can be bonded and fixed to the middle region of the first support portion 11 (on the second surface 18), and two connection regions can be reserved on both sides of the first support portion 11. For example, these two connection regions are approximately rectangular areas. Similarly, a piezoelectric ceramic sheet serving as the second piezoelectric element 3 can be bonded and fixed to the middle region of the second support portion 12 (on the second surface 18), and two connection regions can be reserved on both sides of the second support portion 12. For example, these two connection regions are approximately square areas. Furthermore, the area where the third support portion 15 of the second surface 18 on the substrate 1 is located is not provided with a circuit board 4, etc. Connection regions can also be provided on the third support portion 15 (on the second surface 18). At least one second adhesive 62 can be provided in each connection region. For example, the second adhesive 62 can be double-sided adhesive, epoxy resin adhesive, polyurethane adhesive, phenolic resin adhesive, etc. In this way, the substrate 1 can be bonded and fixed to the structural components of the target device through the second adhesive 62, so as to fix the electronic device on the structural components.

[0089] Another example, such as Figure 3 As shown, a third adhesive member 63 can be provided on the surface of the second piezoelectric element 3 away from the second support portion 12. For example, the size and shape of the third adhesive member 63 can be similar to the size and shape of the second piezoelectric element 3 so that the third adhesive member 63 can cover the entire surface of the second piezoelectric element 3; or, the area of ​​the third adhesive member 63 can be smaller than the area of ​​the second piezoelectric element 3. The third adhesive member 63 can be made of a harder double-sided adhesive, and the hardness of the third adhesive member 63 is less than that of the second adhesive member 62. The second piezoelectric element 3 can then be directly bonded and fixed to the structural components of the target device using this harder double-sided adhesive. When the second piezoelectric element 3 is a piezoelectric ceramic sheet that generates high frequencies, the second piezoelectric element 3 can be bonded to the structural component through the third adhesive 63. In this way, when the second piezoelectric element 3 vibrates along the thickness direction Z of the substrate 1, the bending deformation of the second piezoelectric element 3 itself can be effectively reduced, and the second piezoelectric element 3 as a whole can generate reciprocating vibration along the thickness direction Z of the substrate 1, which is beneficial to suppressing the low frequencies generated when the second piezoelectric element 3 drives the structural component to vibrate.

[0090] In another example, the thickness of the second adhesive 62 on each connection area can be set based on the thickness of the second piezoelectric element 3, the thickness of the third adhesive 63, and the expected spacing between each connection area on the first support portion 11, the second support portion 12, and the third support portion 15 and the structural component. This ensures that the surfaces where the third adhesive 63 connects to the structural component, and the surfaces where each second adhesive 62 connects to the structural component, are approximately on the same plane. Alternatively, the distance between each component on the second surface 18 of the substrate 1 and the structural component in the electronic device can be determined based on the maximum amplitude of the first piezoelectric element 2 along the thickness direction Z perpendicular to the substrate 1. For example, when determining the thickness of the third adhesive 63, it is necessary that after the second piezoelectric element 3 is bonded and fixed to the structural component via the third adhesive 63, the distance between the first piezoelectric element 2 and the structural component is greater than the maximum amplitude of the first piezoelectric element 2 along the thickness direction Z perpendicular to the substrate 1. In this case, the thickness of the second adhesive 62 is equal to the distance between the connection area and the structural component. In this way, during the vibration of the first piezoelectric element 2, the piezoelectric ceramic sheet in the first piezoelectric element 2 that is close to the structural component will not come into contact with the structural component.

[0091] In the above embodiments, since a second adhesive member 62 is provided on the substrate 1, the substrate 1 can be bonded and fixed to the structural components of the target device through the second adhesive member 62, which facilitates the fixed installation of electronic devices on the target device. At the same time, a third adhesive member 63 is provided on the second piezoelectric element 3, which can bond and fix the second piezoelectric element 3 to the structural components through the third adhesive member 63, which helps to reduce the bending deformation of the second piezoelectric element 3 during vibration.

[0092] In some possible embodiments of this application, the electronic device further includes a signal processing circuit (not shown in the figure), which can be disposed on the circuit board 4 or fixed on the substrate 1. At least one of the first piezoelectric element 2, the second piezoelectric element 3, and the third piezoelectric element 7 is electrically connected to the signal processing circuit, which is electrically connected to other devices in the circuit board 4.

[0093] In this embodiment, the signal processing circuit can employ a filter, and a corresponding filter can be set for each piezoelectric element to reduce interference signals in the voltage signal applied to each piezoelectric element.

[0094] For example, a low-pass filter can be provided between the first piezoelectric element 2, which serves as a bass driver, and the circuit board 4. For instance, the low-pass filter can be fixed on the circuit board 4, and the first flexible circuit board 51, which is electrically connected to the first piezoelectric element 2, can be electrically connected to the low-pass filter to eliminate voltage signals in the voltage signal transmitted to the first piezoelectric element 2 whose frequency exceeds the cutoff frequency of the low-pass filter.

[0095] In another example, a high-pass filter can be provided between the second piezoelectric element 3, which serves as a tweeter, and the circuit board 4. For example, the high-pass filter can be fixed on the circuit board 4, and the second flexible circuit board 52, which is electrically connected to the second piezoelectric element 3, can be electrically connected to the high-pass filter to eliminate voltage signals with frequencies lower than the cutoff frequency of the high-pass filter in the voltage signal transmitted to the second piezoelectric element 3.

[0096] Thus, by electrically connecting at least one of the first piezoelectric element 2, the second piezoelectric element 3, and the third piezoelectric element 7 to the circuit board 4 through a filter, interference signals in the voltage signals applied to the first piezoelectric element 2, the second piezoelectric element 3, and the third piezoelectric element 7 can be reduced. This helps to improve the accuracy of vibration control of the first piezoelectric element 2, the second piezoelectric element 3, and the third piezoelectric element 7, thereby improving the clarity of the sound generated by the first piezoelectric element 2, the second piezoelectric element 3, and the third piezoelectric element 7.

[0097] In this embodiment, the signal processing circuit can also employ a frequency divider. The frequency divider can be mounted on circuit board 4, such as a three-way divider, which can divide the audio signal into three different frequency bands: bass, midrange, and treble. Correspondingly, the second piezoelectric element 3 can be electrically connected to the treble output of the three-way divider, the third piezoelectric element 7 can be electrically connected to the midrange output of the three-way divider, and the first piezoelectric element 2 can be electrically connected to the bass output of the three-way divider. Alternatively, if the electronic device includes two piezoelectric elements (first piezoelectric element 2 and second piezoelectric element 3), the frequency divider can be a two-way divider, which can divide the electrical signal into two different frequency bands: a first sub-signal and a second sub-signal. For example, the first sub-signal can be a bass audio signal, and the second sub-signal can be a treble audio signal. In this way, a three-way or two-way frequency divider can be used to separate audio signals of different frequency bands in the electrical signal, and apply the audio signals of each frequency band to the corresponding piezoelectric element, so that the different piezoelectric elements produce vibrations of the corresponding frequency, thereby causing the different piezoelectric elements to drive the structural components to vibrate and make the structural components emit sounds of different frequencies.

[0098] In addition, this application also provides a vehicle, which includes a vehicle body and the electronic devices provided in any of the above embodiments. The vehicle body includes multiple body panels, multiple interior trim pieces, and vehicle components connected to the body panels and / or interior trim pieces. At least one of the body panels, interior trim pieces, and vehicle components is provided with electronic devices.

[0099] In some possible embodiments of this application, the electronic devices provided in the embodiments of this application can be installed on a vehicle. The term "vehicle" or other similar terms used in the embodiments of this application include motor vehicles in a broad sense: for example, passenger / freight vehicles including SUVs, sedans, buses, off-road vehicles, tractors, trucks, special vehicles, buses, trucks, and various commercial vehicles; watercraft including various boats and ships, and aircraft; and including hybrid vehicles, electric vehicles, hybrid electric vehicles, hydrogen-powered vehicles, and other alternative fuel vehicles (e.g., fuels derived from resources other than petroleum). The embodiments of this application do not limit the type and structure of the vehicle.

[0100] For example, a vehicle typically includes a frame, body, powertrain, and electrical system. The body and powertrain are both mounted on the frame, while the electrical system is mounted on both the body and frame. The body typically includes multiple body panels, multiple interior trim pieces, and multiple vehicle components. These body panels can be assembled to form the overall structure of the vehicle, such as a cabin or cargo compartment. Examples of body panels include doors, windows, hood, trunk lid, roof, front bumper, rear bumper, and fenders. Interior trim pieces are installed in the cabin and cargo compartment to enhance vehicle comfort and provide interfaces and equipment. Vehicle components are located within the cabin and cargo compartment and include seats, steering wheel, instrument panel, center console screen, armrest, and license plate.

[0101] Another example is the installation of electronic devices on at least one of the vehicle's body panels, interior trim, and vehicle components, which are then fixed to the vehicle body by adhesive bonding. These electronic devices can be electrically connected to the vehicle's overall controller, allowing the controller to apply voltage signals to them. This causes the piezoelectric elements within the electronic devices to vibrate in response to the voltage signal, thereby causing the body panels, interior trim, or vehicle components to vibrate and produce sound.

[0102] The vehicle provided in this application embodiment has electronic devices installed on at least one of the body panel, interior parts, and vehicle components. Therefore, the electronic devices can drive the body panel, interior parts, or vehicle components in the vehicle body to vibrate, thereby causing the vehicle to emit sound. Furthermore, the vehicle can emit sounds of different frequency bands simultaneously with minimal interference between the different frequency bands, which is beneficial for improving the sound effect of the vehicle.

[0103] The above embodiments are merely illustrative of the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and all should be covered within the scope of the specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way.

Claims

1. An electronic device, characterized by comprising: The electronic device comprises a base body, the base body comprises at least two bearing parts, two adjacent bearing parts are connected by a damping structure, and the damping structure is used for reducing the transmission of vibration between the two adjacent bearing parts. A piezoelectric element is arranged on each bearing part, and the vibration frequency and / or amplitude of any two piezoelectric elements are different. The damping structure comprises a damping through hole located between the two adjacent bearing parts on the base body.

2. Electronic device according to claim 1, wherein, The length of the damping through hole is greater than or equal to the length of the piezoelectric element arranged on any one bearing part in the direction perpendicular to the arrangement direction of the two adjacent bearing parts.

3. The electronic device of claim 2, wherein, The damping structure comprises a damping wave, the damping wave is located between the two adjacent bearing parts on the base body, and the damping wave comprises a plurality of continuously and alternately arranged grooves and protrusions, the extension directions of the grooves and the protrusions are perpendicular to the arrangement direction of the two adjacent bearing parts.

4. Electronic device according to any one of claims 1 to 3, wherein, The damping wave and at least one of the two adjacent bearing parts are an integral structure or a fixed connection structure.

5. The electronic device of claim 4, wherein, The base body has a first surface and a second surface, the first surface and the second surface are two opposite surfaces of the base body which are perpendicular to the thickness direction of the base body, and the base body can be connected to the structural part of the target device through the second surface.

6. The electronic device of claim 4, wherein, In the direction perpendicular to the thickness direction of the base body, the side of the damping wave close to the second surface of the base body is recessed relative to the second surface and faces the first surface.

7. The electronic device of claim 6, wherein, The damping structure comprises an elastic element, and the two adjacent bearing parts are connected by the elastic element.

8. The electronic device of claim 1, wherein, The electronic device further comprises a circuit board, each piezoelectric element is electrically connected to the circuit board, the circuit board is used for being electrically connected to the controller of the target device, the base body comprises a first bearing part, the first bearing part is used for arranging a first piezoelectric element, and the circuit board is arranged in the area of the base body outside the first bearing part.

9. The electronic device of claim 1, wherein, The electronic device further comprises a connecting circuit, and the piezoelectric element and the circuit board are electrically connected through the connecting circuit.

10. Electronic device according to claim 9, wherein, The circuit board is arranged on the first surface of the base body, at least part of the piezoelectric element is arranged on the second surface of the base body, the base body has a wire passing through hole matched with the connecting circuit, one end of the connecting circuit is electrically connected to the circuit board, the other end extends from the first surface to the second surface through the wire passing through hole and is electrically connected to the piezoelectric element, the first surface and the second surface are two opposite surfaces of the base body which are perpendicular to the thickness direction of the base body, and the base body can be connected to the structural part of the target device through the second surface.

11. The electronic device of claim 10, wherein, The extension direction of the wire passing through hole and the thickness direction of the base body have an acute angle.

12. The electronic device of claim 11, wherein, The connection point of the piezoelectric element and the connecting circuit is located in the orthographic projection area of the extension path of the wire passing through hole on the piezoelectric element or adjacent to the extension path of the wire passing through hole.

13. The electronic device of claim 11, wherein, ​ 14. The electronic device of claim 10, wherein, One piezoelectric element includes at least two piezoelectric elements, the positive poles of the at least two piezoelectric elements are electrically connected to the same pad on the circuit board through the connecting circuit, and the negative poles of the at least two piezoelectric elements are electrically connected to another pad on the circuit board through the connecting circuit.

15. The electronic device of claim 10, wherein, The connecting circuit is adhered to the base through a first adhesive, and the first adhesive is a flexible adhesive.

16. The electronic device of claim 10, wherein, The electronic device further includes a signal processing circuit arranged on the circuit board, the connecting circuit is electrically connected to the signal processing circuit, and the signal processing circuit is configured to adjust an electrical signal applied to the piezoelectric element through the connecting circuit.

17. An electronic device according to any one of claims 1 to 3, wherein, The second surface of the base has a connecting area, a projection of the connecting area on the base does not overlap with an area occupied by the piezoelectric element on the bearing part, and the second surface is a surface of the base that is perpendicular to the thickness direction of the base. A second adhesive is arranged on the connecting area, and the second adhesive is configured to adhere the electronic device to a structural member of a target device.

18. The electronic device of claim 17, wherein, The electronic device includes a first piezoelectric element and a second piezoelectric element, the vibration frequency of the second piezoelectric element is greater than the vibration frequency of the first piezoelectric element, the base includes a first bearing part and a second bearing part, the first piezoelectric element is arranged on the first bearing part, and the second piezoelectric element is arranged on the second bearing part, and at least a part of the second piezoelectric element is located on the second surface.

19. The electronic device of claim 18, wherein, A third adhesive is arranged on a surface of the second piezoelectric element away from the second bearing part, the third adhesive is configured to adhere the second piezoelectric element to the structural member, and the hardness of the third adhesive is less than the hardness of the second adhesive.

20. The electronic device of claim 18, wherein, The electronic device further includes a third piezoelectric element, the vibration frequency of the second piezoelectric element is greater than the vibration frequency of the third piezoelectric element, and the vibration frequency of the third piezoelectric element is greater than the vibration frequency of the first piezoelectric element, the base further includes a third bearing part, and the third piezoelectric element is arranged on the third bearing part.

21. The electronic device of claim 20, wherein, The first bearing part, the second bearing part, and the third bearing part are arranged in sequence.

22. The electronic device of claim 18, wherein, The structures of the piezoelectric elements arranged on different bearing parts are different, and the structures include at least one of the following: The number of stacked layers of piezoelectric ceramic sheets in the piezoelectric element; The projection area of the piezoelectric element on the bearing part.

23. The electronic device of claim 22, wherein, The structures of the piezoelectric elements arranged on different bearing parts are different, and the structures include at least one of the following: The number of stacked layers of piezoelectric ceramic sheets in the first piezoelectric element is greater than the number of stacked layers of piezoelectric ceramic sheets in the third piezoelectric element on the third bearing part, the number of stacked layers of piezoelectric ceramic sheets in the third piezoelectric element on the third bearing part is greater than the number of stacked layers of piezoelectric ceramic sheets in the second piezoelectric element, the third piezoelectric element is another piezoelectric element arranged on the base and different from the first piezoelectric element and the second piezoelectric element; and / or, The first piezoelectric piece has a normal projection area on the first bearing part that is larger than a normal projection area of a third piezoelectric piece on a third bearing part, the third piezoelectric piece has a normal projection area on the third bearing part that is larger than a normal projection area of the second piezoelectric piece on the second bearing part, and the third piezoelectric piece is another piezoelectric piece provided on the base body and different from the first piezoelectric piece and the second piezoelectric piece.

24. The electronic device of claim 18, wherein, The piezoelectric pieces provided on different bearing parts have different connection relationships with structural members of the target device, and the connection relationships include at least one of the following: The piezoelectric pieces have a gap with the structural members. The piezoelectric pieces abut against the structural members.

25. The electronic device of claim 18, wherein, The piezoelectric pieces provided on different bearing parts have different properties, and the properties include a capacitance value or a dielectric constant.

26. The electronic device of claim 25, wherein, The properties of the piezoelectric pieces provided on different bearing parts are different, and include at least one of the following: The capacitance value of the first piezoelectric piece is greater than the capacitance value of a third piezoelectric piece, the capacitance value of the third piezoelectric piece is greater than the capacitance value of the second piezoelectric piece, and the third piezoelectric piece is another piezoelectric piece provided on the base body and different from the first piezoelectric piece and the second piezoelectric piece. The dielectric constant of the first piezoelectric piece is greater than the dielectric constant of a third piezoelectric piece, the dielectric constant of the third piezoelectric piece is greater than the dielectric constant of the second piezoelectric piece, and the third piezoelectric piece is another piezoelectric piece provided on the base body and different from the first piezoelectric piece and the second piezoelectric piece.

27. The electronic device of claim 18, wherein, The signal processing circuit of the electronic device includes a frequency division circuit, the first piezoelectric piece and the second piezoelectric piece are electrically connected to the frequency division circuit, the frequency division circuit is configured to divide an electrical signal applied to the first piezoelectric piece and the second piezoelectric piece into first and second sub-signals of different frequency bands, and transmit the first sub-signal to the first piezoelectric piece and the second sub-signal to the second piezoelectric piece, the frequency of the first sub-signal being less than the frequency of the second sub-signal.

28. A vehicle characterized by The electronic device includes: a vehicle body including a plurality of vehicle body panels, a plurality of interior components, and a vehicle component connected to the vehicle body panels and / or the interior components; the electronic device is provided on at least one of the vehicle body panels, the interior components, and the vehicle component.

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