Breast pump system and method for providing cold compress for breast region using breast pump system

Abstract

The invention discloses a breast pump system and a method for providing cold compress for a breast area through the breast pump system, and relates to the technical field of breast pumps, and the breast pump system comprises a breast pump which comprises a flange used for making contact with the breast area; the charging box comprises a box body and a refrigeration module integrated in the box body, and the charging box is configured to contain the breast pump and charge and refrigerate the breast pump; the refrigeration module comprises a refrigeration assembly, a heat dissipation assembly and a control unit. The refrigeration assembly is provided with a contact surface used for conducting cold energy, and when the breast pump is placed in the charging box, the flange is attached to the contact surface; the heat dissipation assembly is used for dissipating heat of the refrigeration assembly; the control unit is used for controlling the working state of the refrigeration module; according to the technical scheme, the semiconductor chilling plate is arranged in the box body, the breast pump is placed in the box body, the semiconductor chilling plate directly conducts cold to the flange, cold compress of extra preparation parts to the skin is omitted, and convenience and use experience feeling are improved.

Description

Technical Field

[0001] This invention relates to the field of breast pump technology, and in particular to a breast pump system and a method for providing cold compresses to the breast area using the breast pump system. Background Technology

[0002] During or after breastfeeding, breast engorgement and blocked milk ducts can cause discomfort. Cold compresses are needed before and after pumping to relieve the pain. Most of these are achieved with breast pumps, such as wearable breast pumps, which require the use of external tools such as cold towels, ice packs, or pre-cooled gel pads. These methods of achieving cold compresses are mostly separate from the breast pump system, which leads to problems such as cumbersome preparation, uncontrollable cold compress temperature, and short duration of coldness. They also fail to provide an immediate, proactive, efficient, and convenient cold compress experience. Summary of the Invention

[0003] The main objective of this invention is to provide a breast pump system and a method for applying cold compresses to the breast area using the breast pump system, aiming to solve the problem that existing cold compresses require additional external tools, resulting in a poor cold compress experience.

[0004] To achieve the above objectives, the present invention provides a breast pump system comprising: Breast pump, including a flange for contact with the breast area; and A charging case, including a case body and a cooling module integrated within the case body, the charging case being configured to house the breast pump and to charge and cool the breast pump; The refrigeration module includes a refrigeration component, a heat dissipation component, and a control unit; The cooling component has a contact surface for conducting cold energy, and the flange fits against the contact surface when the breast pump is placed in the charging box; The heat dissipation component is used to dissipate heat from the cooling component; and The control unit is used to control the working status of the refrigeration module.

[0005] In one embodiment, the cooling assembly includes a semiconductor cooling chip and a heat-conducting element, the heat-conducting element being connected to the cold side of the semiconductor cooling chip, and the contact surface being disposed on the heat-conducting element.

[0006] In one embodiment, the heat-conducting element is a cold plate having a first surface and a second surface disposed opposite to each other, the first surface being connected to the cold surface of the thermoelectric cooler, and the second surface being configured as a contact surface that fits against the flange.

[0007] In one embodiment, the flange is flared and has an inner wall surface; the second surface of the cold plate is a concave curved surface adapted to the inner wall surface.

[0008] In one embodiment, the contour of the first surface of the cold plate is adapted to the contour of the cold surface of the thermoelectric cooler, and the area of ​​the first surface is larger than the area of ​​the cold surface, so that the cold plate covers and fits tightly against the thermoelectric cooler.

[0009] In one embodiment, the heat dissipation component is connected to the hot side of the semiconductor cooling chip, and the housing has ventilation holes through which the airflow generated by the heat dissipation component is discharged.

[0010] In one embodiment, the control unit includes a cooling start button disposed on the charging box and a status indicator light for indicating the cooling status.

[0011] In one embodiment, when the flange is fitted onto the contact surface, a thermally conductive medium is filled between the flange and the contact surface.

[0012] A method for applying cold compresses to the breast area using a breast pump system includes: Place the breast pump inside the charging box and ensure that the flange of the breast pump is in contact with the contact surface of the cooling module; The cooling module is activated to cool the flange; After the flange has been cooled to the target temperature range, the breast pump is removed from the charging case; and Apply the flange of the removed breast pump to the breast area for a cold compress.

[0013] In one embodiment, the step of activating the cooling module includes: Press the cooling start button on the charging box to enable the control unit to operate the cooling component.

[0014] The technical solution of this invention incorporates a semiconductor cooling chip within the breast pump charging case. When the breast pump is placed inside the case, its flange directly contacts the semiconductor cooling chip, allowing the chip to conduct heat directly to the flange. This enables the cooled flange to directly contact the user's skin for a cooling effect during breast pump use. Furthermore, the direct cooling of the flange via the semiconductor cooling chip eliminates the need for additional components for skin cooling. The timely cooling of the flange through the semiconductor cooling chip significantly improves convenience and user experience. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of an embodiment of the breast pump system provided by the present invention; Figure 2 A schematic diagram of another embodiment of the breast pump system provided by the present invention; Figure 3 for Figure 2 Enlarged cross-sectional view at point AA; Figure 4 A schematic diagram of a semiconductor cooling chip structure of an embodiment of the breast pump system provided by the present invention; Figure 5 This is a schematic diagram of the heat-conducting component structure of an embodiment of the breast pump system provided by the present invention; Figure 6 for Figure 3 A magnified view of a section at point B in the middle; Figure 7 This is an exploded structural diagram of an embodiment of the breast pump system provided by the present invention; Figure 8 A schematic flowchart of an embodiment of the method for providing cold compresses to the breast area using a breast pump system provided by the present invention; Figure 9 This is a schematic flowchart of another embodiment of the method for providing cold compresses to the breast area using a breast pump system provided by the present invention.

[0017] Explanation of icon numbers: 10. Box body; 11. Cold compress start button; 12. Storage space; 20. Breast pump; 21. Flange; 211. Inner wall surface; 30. Cooling component; 40. Semiconductor cooling chip; 41. Through hole; 42. Hot surface; 43. Cold surface; 50. Heat dissipation component; 60. Ventilation hole; 70. Second surface; 80. First surface.

[0018] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0020] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0021] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0022] During or after breastfeeding, breast engorgement and blocked milk ducts can cause discomfort. Cold compresses are needed before and after pumping to relieve the pain. Most of these are achieved with breast pumps, such as wearable breast pumps, which require the use of external tools such as cold towels, ice packs, or pre-cooled gel pads. These methods of achieving cold compresses are mostly separate from the breast pump system, which leads to problems such as cumbersome preparation, uncontrollable cold compress temperature, and short duration of coldness. They also fail to provide an immediate, proactive, efficient, and convenient cold compress experience.

[0023] This invention proposes a breast pump system.

[0024] Please see Figure 1 In one embodiment of the present invention, the breast pump system includes: Breast pump 20, including flange 21 for contacting the breast area; and The charging case includes a case body 10 and a cooling module integrated within the case body 10. The charging case is configured to accommodate the breast pump 20 and to charge and cool the breast pump 20. The cooling module includes a cooling component 30, a heat dissipation component 50, and a control unit. The cooling assembly 30 has a contact surface for conducting cold energy, and the flange 21 fits against the contact surface when the breast pump 20 is placed in the charging box. Heat dissipation component 50 is used to dissipate heat from cooling component 30; and The control unit is used to control the operating status of the refrigeration module.

[0025] like Figure 1 As shown, the box body 10 includes a box body and a box lid. The box body has an accommodating space 12. The box lid is rotatably connected to the box body. The box lid rotates and snaps onto the box body, thus sealing the accommodating space.

[0026] In order to charge the breast pump 20 placed in the housing 12, the housing 10 is equipped with a control unit and a battery.

[0027] It is understandable that the box 10 is equipped with a charging module, which is connected to the battery. When the breast pump 20 is placed inside the box 10, the breast pump 20 is connected to the charging module so that the breast pump 20 can be charged directly.

[0028] Furthermore, the control unit is connected to the battery and the cooling assembly 30, and the cooling assembly 30 is connected to the battery.

[0029] When it is necessary to cool the flange 21 of the breast pump 20, the control unit controls the battery to supply power to the cooling component 30, thereby achieving cold conduction between the cooling component 30 and the flange 21 to cool the flange 21.

[0030] Understandably, placing the breast pump in the charging case allows for cooling of the flange 21, enabling users to apply a cold compress when using the breast pump, greatly improving ease of use.

[0031] It should be noted that the flange 21 of the breast pump 20 is the part that directly contacts the user's skin during use, and the surface of the flange 21 that contacts the cooling component 30 is the surface that contacts the skin.

[0032] like Figure 2 As shown, the cooling component 30 is disposed on the bottom surface of the accommodating space 12.

[0033] Understandably, when placing the breast pump 20 into the box 10, the breast pump 20 can be placed upside down on the cooling component 30, which facilitates the placement of the breast pump 20 and also facilitates the contact cooling of the flange 21.

[0034] It should be noted that flange 21 serves as a medium for receiving, storing, and transferring cold energy. When the refrigeration component 30 conducts cold energy to flange 21, it receives the cold energy. When the refrigeration component 30 stops refrigeration, flange 21 stores the received cold energy. When flange 21 comes into contact with the user, it transfers the stored cold energy to the user's skin, thereby achieving cold compress.

[0035] The technical solution of this invention incorporates a cooling component 30 within the breast pump charging case. This allows the flange 21 of the breast pump 20 to directly contact the cooling component 30 when the breast pump is placed inside the case 10. Consequently, the cooling component 30 directly conducts cold to the flange 21, enabling the user to directly apply a cooling compress to the user's skin after the flange 21 has cooled down. Furthermore, the cooling component 30 directly cools the flange 21, eliminating the need for additional components for skin cooling. The timely cooling of the flange 21 by the cooling component 30 greatly enhances convenience and user experience.

[0036] In one embodiment, the cooling assembly 30 includes a semiconductor cooling chip 40 and a heat-conducting element, the heat-conducting element being connected to the cold surface 43 of the semiconductor cooling chip 40, and the contact surface being disposed on the heat-conducting element.

[0037] like Figure 6 and Figure 7 As shown, the heat-conducting component is disposed between the flange 21 and the thermoelectric cooler 40, and the flange 21, the heat-conducting component and the thermoelectric cooler 40 are stacked in sequence.

[0038] It is understandable that the thermoelectric cooler 40 is a cooling element, and the heat-conducting component is used to conduct the cooling capacity of the thermoelectric cooler 40 to the flange 21. The flange 21 is used to store and transfer the cooling capacity.

[0039] Furthermore, the thermoelectric cooler 40 is installed on the bottom surface of the housing space and connected to the control unit and the battery. The control unit controls the start-up and shutdown of the thermoelectric cooler 40 and the power control, while the battery provides power for the operation of the thermoelectric cooler 40.

[0040] The heat-conducting component is used to transfer the cold energy generated by the thermoelectric cooler 40 to the flange 21. In order to ensure the efficiency of the cold energy transfer of the heat-conducting component, the heat-conducting component must be in close contact with the flange 21, and the contact surface of the heat-conducting component must also be in close contact with the thermoelectric cooler 40.

[0041] It is understandable that the heat-conducting components are clamped by the semiconductor cooling chip 40 and the flange 21, and the heat-conducting components are in close contact with the semiconductor cooling chip 40 and the flange 21, thereby increasing the efficiency of cold energy conduction through large-area contact.

[0042] To ensure the stability of the connection between the thermoelectric cooler 40 and the heat-conducting component, multiple connectors are connected between the thermoelectric cooler 40 and the heat-conducting component. The heat-conducting component and the thermoelectric cooler are pressed together by the connectors, thereby avoiding the impact on the quality of cold conduction due to the unstable connection between the heat-conducting component and the thermoelectric cooler 40.

[0043] In one embodiment, the connector can be a nylon screw, with connecting holes provided on both the heat-conducting component and the semiconductor cooling chip 40. When the threaded hole on the heat-conducting component is aligned with the connecting hole on the semiconductor cooling chip 40, the nylon screw passes through the two connecting holes to achieve clamping and fixing between the heat-conducting component and the semiconductor cooling chip 40.

[0044] It should be noted that the connectors are made of insulating material.

[0045] In one embodiment, the preload of the connector is controlled at 5-8N.

[0046] In one implementation, such as Figure 7 As shown, the heat-conducting component is a cold plate, which has a first surface 80 and a second surface 70 disposed opposite to each other. The first surface 80 is connected to the cold surface 43 of the semiconductor cooling chip 40, and the second surface 70 is configured as a contact surface that fits against the flange.

[0047] In one embodiment, the flange 21 is flared and has an inner wall surface 211; the second surface 70 of the cold plate is a concave curved surface adapted to the inner wall surface 211.

[0048] It should be noted that because the breast pump comes into direct contact with the user's breast during use, the flange 21 is flared.

[0049] Therefore, the second surface 70 of the heat conductor is a concave curved surface adapted to the inner wall surface 211, and the edge of the heat conductor extends in a plane away from the center.

[0050] When flange 21 is connected to the second surface 70 of the heat-conducting component, the concave curved second surface 70 directly contacts the flared flange 21, thereby increasing the contact area between flange 21 and refrigeration component 30, and thus improving the cold conduction efficiency of refrigeration component 30 to flange 21.

[0051] In one embodiment, the side of the flange 21 facing the breast has the same shape as the second surface 70 of the heat conductor, thereby increasing the effective contact area between the flange 21 and the heat conductor, which facilitates the rapid cooling of the flange 21 by the heat conductor.

[0052] Meanwhile, the cooling component 30 is installed in the bottom wall of the accommodating space. In order to improve the installation stability of the cooling component 30 in the box 10, the edge of the cooling component 30 extends in a plane away from the center of the cooling component 30 to form an installation plane.

[0053] In one embodiment, the second surface 70 of the heat-conducting element is curved and is used to attach the surface of the flange 21.

[0054] In order to ensure the contact area between the second surface 70 of the heat-conducting component and the flange 21, the shape of the second surface 70 is adapted to the inner wall surface 211 of the flange 21, thereby ensuring that the flange 21 and the cooling component 30 can fit tightly when the breast pump is placed on the cooling component 30.

[0055] To further improve the cold conduction efficiency of the heat-conducting component, aluminum nitride ceramic is selected, with a thermal conductivity between 180-220 W / (m·K).

[0056] In one embodiment, the cooling component 30 is centrally disposed through the flange 21 and extends into the breast pump 20, with the side of the cooling component 30 near the center in contact with the inner surface of the breast pump 20.

[0057] When using the breast pump 20, it is necessary to set up a space in the breast pump 20 to accommodate the nipple and to facilitate milk spraying during the pumping process.

[0058] In order to provide a closed space for breast pumping, the flange 21 needs to be in close contact with the skin of the breast and form a closed space as much as possible near the nipple.

[0059] The breast pump has a milk suction chamber with an opening on the breast pump. A flange 21 is installed at the opening of the milk suction chamber, and the flange 21 extends into the milk suction chamber.

[0060] Furthermore, when the breast pump is installed on the breast, the nipple extends into the milk suction chamber, and the flange 21 is in close contact with the breast skin, so that the milk suction chamber forms a closed space.

[0061] In order to facilitate the comprehensive application of cold compresses to the breast via flange 21, the portion of flange 21 extending into the milk suction cavity needs to be effectively cooled simultaneously.

[0062] like Figure 2 As shown, the cooling component 30 is centrally located through the flange 21 and extends into the breast pump 20, and the cooling component 30 is in close contact with the flange 21 located in the breast pumping chamber.

[0063] It is understandable that by inserting the central part of the cooling component 30 into the milk suction chamber and closely attaching it to the flange 21 located inside the milk suction chamber, the cooling component 30 improves the overall cooling of the flange 21 facing the breast surface, thereby ensuring cooling efficiency and quality.

[0064] In one embodiment, the outline of the first surface 80 of the cold plate is adapted to the outline of the cold surface 43 of the thermoelectric cooler 40, and the area of ​​the first surface 80 is larger than the area of ​​the cold surface 43, so that the cold plate covers and fits tightly against the thermoelectric cooler 40.

[0065] In order to ensure that the cooling generated by the thermoelectric cooler 40 can be conducted to the heat-conducting component, the heat-conducting component can be wrapped around the thermoelectric cooler 40.

[0066] It is understandable that the area of ​​the first surface 80 of the heat-conducting component is larger than the area of ​​the cold surface 43 of the thermoelectric cooler 40. Thus, when the heat-conducting component is connected to the thermoelectric cooler 40, the heat-conducting component fully covers the thermoelectric cooler 40, thereby transferring all the cold energy generated by the thermoelectric cooler 40 to the heat-conducting component and improving the cold conduction efficiency.

[0067] Furthermore, the profile of the first surface 80 of the cold plate is adapted to the profile of the cold surface 43 of the semiconductor cooling chip 40.

[0068] In this way, when the cold plate is connected to the thermoelectric cooler 40, the cold plate can completely cover the thermoelectric cooler and cover along the contour of the cold surface 43, thus achieving complete coverage and avoiding unnecessary edge extension of the cold plate, which would affect the placement of the cold plate in the housing 10.

[0069] In one embodiment, the heat dissipation component 50 is connected to the hot surface 42 of the semiconductor cooling chip 40, and the housing is provided with ventilation holes 60, through which the airflow generated by the heat dissipation component 50 is discharged.

[0070] The box 10 is equipped with a heat dissipation component 50, which is located on the side of the cooling component 30 facing the bottom of the box 10, and the bottom of the box 10 is provided with multiple ventilation holes 60.

[0071] like Figure 3 As shown, the cooling component 30 is projected onto the position of the housing 10 and the heat dissipation component 50 is disposed on the ventilation hole 60.

[0072] It is understandable that the thermoelectric cooler 40 is in close contact with the heat-conducting component, and the heat-conducting component is in close contact with the flange 21. This allows the thermoelectric cooler 40 to quickly cool the flange 21 through the heat-conducting component when it is working. At the same time, the heat dissipation component 50 quickly dissipates heat from the hot surface 42 of the thermoelectric cooler 40, thereby further improving the efficiency and quality of cooling.

[0073] In one embodiment, the heat dissipation component 50 is positioned opposite the through hole 41, and the heat dissipation component 50 is disposed on a plurality of ventilation holes 60.

[0074] Understandably, during the cooling process of the cooling component 30, the heat dissipation component 50 works to dissipate the heat generated by the semiconductor cooling chip 40 through multiple ventilation holes 60, thereby improving the efficiency of heat transfer.

[0075] To improve heat dissipation efficiency, the area of ​​the ventilation holes 60 is larger than the area of ​​the heat dissipation component 50 projected onto the bottom wall of the accommodating space.

[0076] Preferably, the multiple ventilation holes 60 are designed in a honeycomb pattern to prevent foreign objects from entering the box 10.

[0077] To ensure the stability of the heat dissipation component 50 when installed inside the housing 10, a slot is provided on the bottom wall of the accommodating space, and a positioning post is provided on the edge of the heat dissipation component 50, which is inserted into the slot.

[0078] It can be understood that the installation position of the heat dissipation component 50 is limited, and by fixing the installation position of the heat dissipation component 50, the air outlet of the heat dissipation component 50 is ensured to be directly opposite the opening of the charging case.

[0079] To prevent vibrations from affecting the stability of the heat dissipation component 50 during installation, a buffer is installed between the heat dissipation component 50 and the housing 10.

[0080] Furthermore, the buffer section is provided with ventilation holes.

[0081] Understandably, the buffer section provides vibration damping for the heat dissipation assembly 50 and prevents airflow leakage.

[0082] In another embodiment, ventilation holes are provided on the side of the housing 10.

[0083] Furthermore, the heat dissipation component 50 can be a fan.

[0084] It is understandable that when the fan is working, it drives the gas inside the housing 10 to flow towards the ventilation holes, thereby removing the heat from the hot surface and achieving rapid cooling of the thermoelectric cooler 40, thus ensuring the operating efficiency of the thermoelectric cooler 40.

[0085] In one embodiment, the control unit includes a cooling start button 11 disposed on the charging box and a status indicator light for indicating the cooling status.

[0086] like Figure 1 As shown, the box body is also equipped with a cold compress start button 11, which is connected to the control unit.

[0087] When the user operates the cooling start button 11 by pressing or touching, the cooling start button 11 generates a relevant signal so that the control unit controls the cooling component 30 to start conducting cold to the flange 21.

[0088] Furthermore, the box body is provided with multiple prompts, which are connected to the cooling start button 11 or the cooling component 30.

[0089] When the cooling start button 11 is touched to control the cooling component 30 to start cooling operation, multiple prompts will activate to indicate that the cooling component 30 has started working, so that the operating status of the equipment can be directly observed.

[0090] In one embodiment, the prompting part is a status indicator light, and multiple status indicator lights are spaced apart on the surface of the box body.

[0091] In another embodiment, the control unit is connected to the heat dissipation assembly to control the operation of the heat dissipation assembly.

[0092] In one embodiment, when the flange is fitted onto the contact surface, a heat-conducting medium is filled between the flange and the contact surface.

[0093] It should be noted that when the breast pump is placed inside the box 10 for charging, there is a gap between the flange 21 and the heat-conducting component. The presence of air in this gap affects the efficiency of cold energy conduction.

[0094] To reduce contact thermal resistance, a high thermal conductivity medium is filled between the heat-conducting component and the flange 21 to ensure that the heat-conducting component can quickly and efficiently transfer the cold energy to the flange.

[0095] In one embodiment, the thermally conductive medium may be silicone grease or gel.

[0096] In one embodiment, the edge of the semiconductor cooling chip 40 is flat, and the center of the semiconductor cooling chip 40 is provided with a through hole 41.

[0097] It should be noted that when the semiconductor cooling chip 40 is installed on the bottom wall of the accommodating space, and the breast pump 20 is placed on the heat-conducting component, the breast pump 20 supports the heat-conducting component and the semiconductor cooling chip 40. In order to ensure the charging stability and cooling quality of the breast pump 20, it is necessary to ensure the stability of the support for the breast pump 20.

[0098] like Figure 4 As shown, the edge of the thermoelectric cooler 40 is flat and extends in a direction away from the center of the thermoelectric cooler 40.

[0099] It is understandable that the thermoelectric cooler 40 is mounted on the bottom wall of the receiving space via its edge plane, and the stability of the mounted thermoelectric cooler 40 is ensured by increasing the contact area between the thermoelectric cooler 40 and the bottom wall of the receiving space.

[0100] Furthermore, to improve its adaptability to the receiving space, the planar edge of the semiconductor cooling chip 40 is adapted to the edge of the bottom wall of the receiving space.

[0101] It is understandable that when the thermoelectric cooler 40 is installed in the receiving space, the plane of the thermoelectric cooler 40 is in contact with the bottom wall of the receiving space, and the edge of the plane of the thermoelectric cooler 40 is in contact with the edge of the bottom wall of the receiving space.

[0102] In another embodiment, the edge plane of the heat-conducting element extends so that when the heat-conducting element is mounted on the surface of the thermoelectric cooler 40, the edge plane of the heat-conducting element is in close contact with the plane of the thermoelectric cooler 40.

[0103] It is understandable that the heat-conducting component and the thermoelectric cooler are connected in a planar manner to achieve a stable connection between the heat-conducting component and the thermoelectric cooler.

[0104] Furthermore, a connector is provided between the heat-conducting component and the thermoelectric cooler, and the connector is disposed on the plane of the heat-conducting component and the plane of the thermoelectric cooler.

[0105] It is understandable that the connector is located between two planes. When the connector is tightened, the two planes are in close contact with each other, and the gap between the heat-conducting component and the semiconductor cooling chip 40 is less than 1mm.

[0106] It is understandable that by reducing the gap between the heat-conducting component and the thermoelectric cooler 40, the air medium between the heat-conducting component and the thermoelectric cooler 40 is reduced, thereby ensuring the contact surface between the heat-conducting component and the thermoelectric cooler 40 and the efficiency of cold energy conduction.

[0107] like Figure 4 As shown, a through hole 41 is provided in the middle of the thermoelectric cooler 40. When the heat-conducting component comes into contact with the thermoelectric cooler 40, the through hole 41 is provided to expose the center of the heat-conducting component.

[0108] This invention also proposes a method for providing cold compresses to the breast area using a breast pump system, comprising: S10, placing the breast pump 20 in a charging case and fitting the flange 21 of the breast pump 20 against the contact surface of the cooling module; S20, activating the cooling module to cool the flange 21; S30, removing the breast pump from the charging case after the flange 21 has been cooled to a target temperature range; and S40, applying the flange 21 of the removed breast pump 20 to the breast area for cold compresses. The specific structure of the breast pump system is as described in the above embodiments. Since this invention uses all the technical solutions of all the above embodiments to provide cold compresses to the breast area, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated here.

[0109] It is understandable that, such as Figure 8As shown, after the breast pump is placed in the charging box, the flange 21 is directly attached to the contact surface of the cooling component. At this time, the control unit enables the cooling component 30 and the heat dissipation component 50 to operate synchronously. The cooling component 30 generates cold energy and cools the flange 21 by means of cold conduction. Meanwhile, the heat dissipation component 50 works to dissipate heat for the operation of the cooling component 30.

[0110] Furthermore, once the flange 21 has been cooled, the breast pump can be taken out directly and worn for applying a cold compress to the breast area.

[0111] In one embodiment, the step of activating the cooling module includes: S21. Press the cooling start button 11 on the charging box to enable the control unit to control the operation of the cooling component 30.

[0112] like Figure 9 As shown, the cooling start button 11 is electrically connected to the control unit. By pressing the cooling start button 11, the user can operate the control unit to turn it on or off, thereby facilitating direct and effective start or stop of the cooling control of the cooling component 30.

[0113] The above description is merely an exemplary embodiment of the present invention and does not limit the scope of protection of the present invention. Any equivalent structural transformations made based on the technical concept of the present invention and the contents of the specification and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present invention.

Claims

1. A breast pump system, characterized in that, include: Breast pump, including a flange for contact with the breast area; as well as A charging case, including a case body and a cooling module integrated within the case body, the charging case being configured to house the breast pump and to charge and cool the breast pump; The refrigeration module includes a refrigeration component, a heat dissipation component, and a control unit; The cooling component has a contact surface for conducting cold energy, and the flange fits against the contact surface when the breast pump is placed in the charging box; The heat dissipation component is used to dissipate heat from the cooling component; and The control unit is used to control the working status of the refrigeration module.

2. The breast pump system as described in claim 1, characterized in that, The cooling assembly includes a semiconductor cooling chip and a heat-conducting component. The heat-conducting component is connected to the cold side of the semiconductor cooling chip, and the contact surface is disposed on the heat-conducting component.

3. The breast pump system as described in claim 2, characterized in that, The heat-conducting component is a cold plate, which has a first surface and a second surface disposed opposite to each other. The first surface is connected to the cold surface of the semiconductor cooling chip, and the second surface is configured as a contact surface that fits against the flange.

4. The breast pump system as described in claim 3, characterized in that, The flange is flared and has an inner wall surface; the second surface of the cold plate is a concave curved surface that matches the inner wall surface.

5. The breast pump system as described in claim 3, characterized in that, The contour of the first surface of the cold plate is adapted to the contour of the cold surface of the thermoelectric cooler, and the area of ​​the first surface is larger than the area of ​​the cold surface, so that the cold plate covers and fits tightly against the thermoelectric cooler.

6. The breast pump system as described in claim 2, characterized in that, The heat dissipation component is connected to the hot side of the semiconductor cooling chip, and the housing has ventilation holes through which the airflow generated by the heat dissipation component is discharged.

7. The breast pump system as described in claim 1, characterized in that, The control unit includes a cooling start button on the charging box and a status indicator light for indicating the cooling status.

8. The breast pump system as described in claim 1, characterized in that, When the flange is fitted onto the contact surface, a heat-conducting medium is filled between the flange and the contact surface.

9. A method for providing cold compresses to the breast area using a breast pump system as described in any one of claims 1-8, characterized in that, include: Place the breast pump inside the charging box and ensure that the flange of the breast pump is in contact with the contact surface of the cooling module; The cooling module is activated to cool the flange; After the flange has been cooled to the target temperature range, the breast pump is removed from the charging box; as well as Apply the flange of the removed breast pump to the breast area for a cold compress.

10. The method as described in claim 9, characterized in that, The steps for starting the cooling module include: Press the cooling start button on the charging box to enable the control unit to operate the cooling component.

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