A vacuum type large panel semiconductor detector

Abstract

The application provides a vacuum type large panel semiconductor detector and relates to the field of semiconductor detectors. The application comprises a detector cavity, two ends of the detector cavity are respectively provided with a front end plate and a rear end plate which are detachably connected with the detector cavity, an end face of the front end plate towards the outside of the detector cavity is provided with a vacuum adapter plate, the vacuum adapter plate is used for connecting an external sample cavity; a front panel is arranged on the vacuum adapter plate, the front panel is provided with a beam flow via hole and a plurality of front end modules, the beam flow via hole is located between two adjacent front end modules; the vacuum type large panel semiconductor detector further comprises a beam flow pipe, one end of the beam flow pipe is arranged in the vacuum adapter plate and is in communication with the beam flow via hole, the other end of the beam flow pipe penetrates through the rear end plate; a rear end electronic component is further arranged in the inner cavity of the detector cavity. The application can collect signals of a higher scattering angle, thereby improving the ultimate resolution of structure analysis of a coherent diffraction experiment.

Description

Technical Field

[0001] This invention relates to the field of semiconductor detectors, and in particular to a vacuum-type large-panel semiconductor detector. Background Technology

[0002] Surface detectors are a term used to describe commonly used two-dimensional detectors on advanced light source large-scale scientific platforms (such as synchrotron radiation sources (SR) and X-ray free-electron lasers (XFEL)). Detectors using similar naming conventions include point detectors (i.e., zero-dimensional detectors, such as photodiodes and silicon drift chambers) and line detectors (i.e., one-dimensional detectors, such as silicon microstrip detectors). Currently, surface detectors widely used in advanced light sources, unless otherwise specified, generally refer to pixel array detectors (PADs). These are high-granularity semiconductor detectors that can achieve the segmentation of detector sensitive cells, the extraction of detector signals, and high-speed signal processing and transmission within a spacing of hundreds of micrometers or even micrometers. They possess excellent performance characteristics such as high spatial resolution (intrinsic resolution ≤ 10 µm), fast time response (signal scale ≤ 10 ns), and strong radiation resistance.

[0003] Scientific experiments on advanced light source large-scale scientific platforms can be broadly categorized into three types: imaging, scattering, and spectroscopy. Today, PADs have become indispensable main detectors for scattering and imaging experiments, and are also commonly used detectors for grating- or crystal-based spectroscopic experiments. In specific scientific applications, PADs are key core equipment for many cutting-edge scientific research areas, including the control and observation of small molecule chemical reactions, the study of biomolecular structures and dynamic molecular imaging, the dynamics, structure, and function of biological assembly in near-realistic environments, and atomic-scale time resolution of biomolecules. In particular, when combined with fully coherent, high-repetition-rate X-ray free-electron lasers (XFELs), PADs can help achieve atomic-level spatial resolution and femtosecond-level time resolution for single molecules / particles, enabling dynamic three-dimensional imaging and structural analysis at the molecular level. Furthermore, when combined with pump lasers, PADs can facilitate real-time observation of chemical reactions at the atomic scale, study the energy and charge transfer patterns at the femtosecond level, and perform instantaneous structural imaging.

[0004] These novel, cutting-edge scientific experiments generally require detectors to have: on the one hand, sufficiently high spatial resolution (on the order of 100 µm) to accurately measure the position of the diffraction spot; and on the other hand, a sufficiently large detection area (tens of centimeters). 2To obtain large-angle diffraction data, the area detector needs both small pixel size to achieve high spatial resolution and a large number of pixels to achieve a large detection area. Theoretically, to reduce the detection dead zone, the detection panel of the area detector should ideally be entirely filled with a pixel array. However, due to limitations in integrated circuit fabrication and packaging processes, the detection panel cannot be fabricated from a single wafer. A tile-like method is generally used to obtain a large detection area. These "tiles" are called front end modules (FEMs). To reduce the tile dead zone, the area of ​​the front end module should be as large as possible.

[0005] A single front-end module, coupled with a back-end readout system, mechanics, and DAQ software, can form the most commonly used single-module detector. These detectors are widely used in scattering and diffraction experiments in light sources and laboratories. To obtain better imaging resolution, scientists have developed more complex experimental methods, such as coherent diffraction imaging and serial crystallography, which place larger demands on the detector panel. Taking coherent diffraction imaging as an example, its diffraction signal is mainly divided into a high count rate region from the detector center (low spatial frequency) to a low count rate region from the detector edge (high spatial frequency), exhibiting exponential decay from the center to the edge. The completeness of the low spatial frequency diffraction signal acquisition determines whether three-dimensional reconstruction of the diffraction pattern can be achieved, while the intensity and signal-to-noise ratio (single-photon sensitivity) of the high spatial frequency diffraction signal determine the imaging resolution of the detector system. Detectors with large arrays and large panels can acquire signals at higher scattering angles, thereby improving the ultimate resolution of structural analysis in coherent diffraction experiments. Of course, the requirements of scientific experiments for the detector panel are not only related to the experimental method but also directly related to the sample type, sample size, and distance from the sample to the detector.

[0006] In summary, there is an urgent need for a vacuum-type large-panel semiconductor detector. Summary of the Invention

[0007] To address the aforementioned issues, this invention provides a vacuum-type large-panel semiconductor detector capable of acquiring signals with higher scattering angles, thereby improving the ultimate resolution of structural analysis in coherent diffraction experiments.

[0008] The first aspect of this invention provides a vacuum-type large-panel semiconductor detector, comprising a detector cavity, a front end plate and a rear end plate detachably connected to the detector cavity at both ends, a vacuum adapter plate on the end face of the front end plate facing the outside of the detector cavity, the vacuum adapter plate being used to connect to an external sample cavity; a front panel on the vacuum adapter plate, the front panel having a beam through-hole and a plurality of front end modules, the beam through-hole being located between two adjacent front end modules; the vacuum-type large-panel semiconductor detector further comprising a beam tube, one end of the beam tube being disposed in the vacuum adapter plate and communicating with the beam through-hole, the other end of the beam tube extending out of the rear end plate; a rear end electronics assembly is also disposed in the inner cavity of the detector cavity; the front end modules are connected to the rear end electronics assembly via cables passing through the front panel and the vacuum adapter plate, and the rear end electronics assembly is connected to an external data acquisition system via cables passing through the rear end plate.

[0009] In one feasible embodiment of the present invention, one or more front-end modules form a front-end module group, and the remaining front-end modules form a front-end module group two; the front-end module group one and the front-end module group two are symmetrical about each other with the beam aperture as the symmetry point, or are symmetrical about each other up and down; the splicing accuracy within the front-end module group one and the front-end module group two is <100 µm; and / or, the diameter of the beam aperture is 15 mm.

[0010] In one feasible embodiment of the present invention, the frame refresh rate of the large-panel semiconductor detector is ≥1kHz, and the dynamic range is ≥10. 4 Ph. / pixel / pulse @ 12keV, with single-photon sensitivity, S / N≥5 @12keV, pixel size ≤200µm×200µm, number of pixels ≥1 million, sensitive area ≥10cm×10cm, quantum efficiency ≥80% @12keV, and response energy range of 6keV~20keV.

[0011] In one feasible embodiment of the present invention, the front panel is provided with the same number of positioning holes as the front-end modules, and each front-end module covers one positioning hole; each front-end module is equipped with an adapter and a cable, and the adapter is connected to the front-end module in the positioning hole.

[0012] In one feasible embodiment of the present invention, a vacuum flange is provided on the end face of the vacuum adapter plate facing the inside of the detector cavity, and the cable of each front-end module passes through the vacuum flange and is connected to the back-end electronic components.

[0013] In one feasible embodiment of the present invention, the front panel is further provided with a cooling pipe, which surrounds all the positioning holes; the vacuum adapter plate is provided with a coolant outlet pipe and a coolant inlet pipe, which both extend through the side wall of the detector cavity; the inlet and outlet ends of the cooling pipe are respectively connected to the coolant inlet pipe and the coolant outlet pipe.

[0014] In one feasible embodiment of the present invention, the cooling pipeline includes several interconnected circumferential cooling sections, each of which is arranged around a positioning hole.

[0015] In one feasible embodiment of the present invention, the bottom of the detector cavity is provided with a plurality of bottom ventilation arrays, the bottom ventilation arrays including a plurality of bottom ventilation holes arranged in sequence; the top of the detector cavity is provided with a plurality of top ventilation arrays, the top ventilation arrays including a plurality of top ventilation holes arranged in sequence.

[0016] A second aspect of this invention provides a vacuum-type large-panel semiconductor detection system, comprising the vacuum-type large-panel semiconductor detector provided in the first aspect of this invention, and further comprising: a sample chamber and a vacuum pump assembly, wherein the working end of the vacuum pump assembly is located in the inner cavity of the sample chamber, a vacuum adapter plate is connected to the sample chamber via a flange, and the front-end module is located in the inner cavity of the sample chamber; the vacuum degree of the sample chamber during operation is ≤10. -6 mBar.

[0017] The front-end module of the vacuum-type large-panel semiconductor detector provided by this invention is fabricated using a front-end module manufacturing process, which includes the following steps:

[0018] Step 1): Connect the sensor and ASIC to form a ChipAssembly;

[0019] Step 2): Secure the Holder to the Mounting Block;

[0020] Step 3): Install the MountingBlock with the Holder fixed on it onto the positioning and pressurizing fixture, then fix the positioning and pressurizing fixture onto the dispensing machine, and use the dispensing machine to dispense adhesive onto the surface of the Holder.

[0021] Step 4): Use a tool to place the WireBonding Board onto the Holder's adhesive and apply even pressure to the surface of the WireBonding Board with a torque wrench; then, dry the WireBonding Board and allow it to cool naturally to room temperature.

[0022] Step 5): Apply adhesive to the MountingBlock surface from Step 4) using a dispensing machine;

[0023] Step 6): Place the ChipAssembly from Step 1) onto the surface of the WireBondingBoard with glue applied in Step 5) using a pick-and-place machine;

[0024] Step 7): Dry the Mounting Block from Step 6) and allow it to cool naturally to room temperature;

[0025] Step 8): Use a wire bonding machine to bond the Mounting Block from Step 7);

[0026] Step 9): Use the tool to remove the Holder from the MountingBlock, thus completing the front-end module (5).

[0027] The present invention also provides a method for assembling a vacuum-type large-panel semiconductor detector, comprising the following steps:

[0028] Step 1) Assemble the back-end electronics components and install them into the inner cavity of the detector housing;

[0029] Step 2) Install the vacuum adapter plate onto the front panel, and then install the front panel onto the vacuum adapter plate;

[0030] Step 3) Install the front-end modules onto the front panel in sequence;

[0031] Step 4) Connect the front-end module and the back-end electronics components using adapters and cables;

[0032] Step 5) Mount one end of the beam tube onto the vacuum adapter plate;

[0033] Step 6) Install other accessories, and finally install the front end plate and rear end plate at both ends of the detector cavity.

[0034] The vacuum-type large-panel semiconductor detector provided by this invention has the following beneficial effects:

[0035] 1) The working end of the vacuum-type large-panel semiconductor detector designed in this invention, namely the detector panel, is composed of multiple front-end modules sequentially spliced ​​together. The typical size of a single front-end module is approximately 10.6cm × 3cm. Furthermore, according to the needs of different scientific experiments, a specified number of front-end modules can be spliced ​​together to achieve the required size of the detector panel. A typical design consists of four front-end modules spliced ​​together to form a megapixel-level detector with 1024 × 1024 pixels and a detector panel size > 10cm × 10cm.

[0036] 2) Furthermore, the front-end modules in this invention employ high-precision splicing. The splicing accuracy within the upper and lower groups of front-end modules is less than 100 µm, i.e., one pixel, and the diameter of the beam aperture is less than 15 mm. All front-end modules can operate independently and simultaneously under the control of timing and trigger signals, enabling precise measurement of large panels. Moreover, if a front-end module is damaged or its performance degrades due to irradiation damage, it can be easily and independently replaced.

[0037] 3) The back-end electronics components in this invention adopt a standardized design and can use an MTCA chassis, which simplifies power supply and heat dissipation, while also ensuring the compactness of the overall detector design.

[0038] 4) The vacuum-type large-panel semiconductor detector designed in this invention uses materials with low gas release rates (e.g., the cable sheathing material uses THV material, and the adapter board uses ceramic instead of FR4 material, etc.), and can operate in a vacuum of ≤10. -6 In an mBar vacuum environment, and to ensure good heat dissipation, adapter plates and adhesives with good thermal conductivity are used, and liquid cooling is employed. Attached Figure Description

[0039] Figure 1 This is a schematic diagram of the overall structure of the vacuum-type large-panel semiconductor detector of the present invention.

[0040] Figure 2 This is a schematic diagram of the overall structure of the vacuum-type large-panel semiconductor detector of the present invention after the sidewalls of the detector cavity have been removed.

[0041] Figure 3 This is a bottom view of the vacuum-type large-panel semiconductor detector of the present invention.

[0042] Figure 4 This is a front view of the vacuum-type large-panel semiconductor detector of the present invention.

[0043] Figure 5 This is a cross-sectional view of the front panel of the vacuum-type large-panel semiconductor detector of the present invention.

[0044] Figure 6 This is a top view of the vacuum-type large-panel semiconductor detector of the present invention after the sidewalls of the detector cavity have been removed.

[0045] Figure 7 This is a schematic diagram of the front-end module in this invention.

[0046] Figure 8 This is a process flow diagram for the front-end module in this invention.

[0047] Figure 9 This is a schematic diagram of the adhesive on the Holder surface in the front-end module of this invention.

[0048] Figure 10 This is a schematic diagram of the rectangular adhesive application on the MountingBlock surface in this invention.

[0049] Figure Labels

[0050] Detector cavity 1

[0051] Bottom ventilation array 11

[0052] Top ventilation array 12

[0053] Front end board 2

[0054] Positioning hole 21

[0055] Back end board 3

[0056] Vacuum Adapter 4

[0057] Coolant outlet pipe 41

[0058] Coolant inlet pipe 42

[0059] Front panel 5

[0060] Beam through-hole 51

[0061] Cooling pipe 52

[0062] 52.1 Surround cooling section

[0063] Front-end module 6

[0064] Beam tube 7

[0065] Backend electronics components 8 Detailed Implementation

[0066] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. In the description of the present invention, it should be noted that the terms "left side", "right side", "upper side", "lower side", "above", "below", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0067] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0068] Furthermore, in the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0069] This invention provides a vacuum-type large-panel semiconductor detector capable of operating in a vacuum environment to detect X-ray photons and electrons. (See also...) Figure 1 and Figure 2 The vacuum-type large-panel semiconductor detector includes a detector cavity 1. A front end plate 2 and a rear end plate 3, detachably connected to the detector cavity 1, are respectively provided at both ends of the detector cavity 1. A vacuum adapter plate 4 is provided on the end face of the front panel 5 facing the outside of the detector cavity 1. The vacuum adapter plate 4 typically has connection holes of various specifications, allowing it to not only connect to the sample cavity but also to install various accessories. When connected to the sample cavity, the vacuum adapter plate 4 is typically connected to an access flange on the side wall of the sample cavity. (Continue reading...) Figure 1 and Figure 2 The vacuum adapter plate 4 is equipped with a front panel 5, which has a beam through-hole 51 and several front-end modules 6. The beam through-hole 51 allows the laser beam to pass through. The beam through-hole 51 is located between two adjacent front-end modules 6. When detecting X-ray photons and electrons, the energy of the laser's central beam is extremely high, so it must pass through the beam through-hole 51 to propagate it backward and prevent the central laser beam from directly irradiating the front-end modules 6. (Continue reading...) Figures 4-6 The vacuum-type large-panel semiconductor detector also includes a beam tube 7. One end of the beam tube 7 is disposed in the vacuum adapter plate 4 and connected to the beam through-hole 51. The other end of the beam tube 7 extends out of the rear end plate 3. The beam tube 7 is used to guide the laser center beam passing through the beam through-hole 51 to the outside of the detector cavity, preventing the laser center beam from damaging other components. The detector cavity 1 also has a rear-end electronics assembly 8. The front-end module 6 is connected to the rear-end electronics assembly 8 via a cable passing through the front panel 5 and the vacuum adapter plate. The rear-end electronics assembly 8 is connected to an external data acquisition system via a cable passing through the rear end plate 3.

[0070] Specifically, the front-end module 6 and the back-end electronics component 8 are two core components of the vacuum-type large-panel semiconductor detector. The front-end module 6 receives X-ray photon and electron signals, and the back-end electronics component 8 is used to process the signals fed back by the front-end module 6. The two complement each other and are indispensable.

[0071] Regarding front-end module 6: See [link / reference] Figure 2 and Figure 4 The front-end modules 6 are typically arranged longitudinally on the front panel 5, and the working ends of the front-end modules 6 are kept flush, meaning that the working ends of the front-end modules 6 are all on the same longitudinal section. Each front-end module 6 is rectangular, and the larger rectangle formed by multiple front-end modules 6 constitutes the working end of the vacuum-type large-panel semiconductor detector. Note that the front-end modules 6 must not touch other front-end modules 6 during installation; therefore, the front-end modules 6 must be spliced ​​using external tooling. In one feasible splicing method, the front panel 5 has various holes, namely pin positioning holes, mounting holes, and tooling holes. When splicing the front-end modules 6, first, two positioning rods are passed through the tooling holes, and then the positioning rods are connected to the front-end modules 6; then, the front-end modules 6 are pulled along the positioning rods onto the front panel 5, and the front-end modules 6 are precisely positioned onto the front panel 5 by driving pins into the pin positioning holes; then, the front-end modules 6 are securely installed onto the front panel 5 through the mounting holes; finally, the positioning rods are removed from the tooling holes. This allows the front-end module 6 to be installed onto the front panel 5 with high precision, and ensures that the splicing accuracy between the front-end modules 6 is ≤100 µm.

[0072] In one feasible embodiment, one or more front-end modules 6 form a front-end module group, and the remaining front-end modules 6 form a second front-end module group; the first and second front-end module groups are symmetrical about each other horizontally or vertically with the beam through-hole 51 as the symmetry point. Specifically, the number of front-end modules 6 is 2, 4, 6, 8 or more; it can also be 3, 5, 7, 9 or more. In an exemplary embodiment, see [reference needed]. Figure 4 The first and second sets of front-end modules are symmetrical about the beam through-hole 51. The first set of front-end modules includes two front-end modules, and the second set of front-end modules also includes two front-end modules. The splicing accuracy between the two front-end modules in the first set is <100 µm, and the splicing accuracy between the two front-end modules in the second set is <100 µm. In another specific embodiment, the diameter of the beam through-hole 51 is 15 mm.

[0073] Regarding backend electronics component 8: See [link / reference] Figure 2 and Figure 6The back-end electronics component 8 may include various electronic devices such as power supplies, processing chips, readout boards, and interfaces of various types. Alternatively, the back-end electronics component 8 may directly use a commercially available MTCA chassis. The advantage of the MTCA chassis is that it integrates numerous electronic devices, including power supplies, processing chips, and readout boards, and specifies the interface types and signal transmission protocols for each electronic device, such as standard power standards, mechanical standards, and electrical standards. When using the MTCA chassis as the back-end electronics component 8, some software adjustments should be made to ensure signal consistency between the front-end module 6 and the MTCA chassis. For example, the signals of several independent front-end modules 6 may be integrated. It is particularly emphasized that the software part of the back-end electronics component 8 does not affect the structural integrity of this invention; therefore, the software part is protected as a trade secret and will not be described in detail. For illustration, using an MTCA chassis simplifies power supply and heat dissipation, while also ensuring the compactness of the overall detector design.

[0074] In one specific embodiment, see Figure 4 and Figure 5 The front panel 5 has the same number of positioning holes 21 as the front-end modules 6, with each front-end module 6 covering one positioning hole 21. Each front-end module 6 is equipped with an adapter and a cable, and the adapter is connected to the front-end module 6 through the positioning hole 21. Preferably, the positioning holes 21 are arranged sequentially along the longitudinal direction of the front panel 5 so that the front-end modules 6 can also be arranged sequentially along the longitudinal direction of the front panel 5.

[0075] In the vacuum-type large-panel semiconductor detector provided in this embodiment of the invention, the front-end module 6 and the back-end electronic components 8 are connected by high-density cables and adapters. When the front-end module 6 is working, the ASIC chip therein releases a lot of heat. At the same time, because the splicing accuracy between the front-end modules 6 must be ≤100 µm, the heat released by the ASIC chip can easily accumulate in a local area of ​​the front panel 5, usually at the center of the front panel 5. Excessive heat accumulation can not only cause a significant decrease in the working efficiency of the front-end module 6, but may even cause irreversible physical damage to the front-end module 6. Therefore, it is necessary to solve the problem of heat accumulation in the front-end during operation.

[0076] Therefore, this invention designs a water-cooling method to dissipate heat from the front panel 5. Specifically, see [link to relevant documentation]. Figure 4The front panel 5 is also provided with a cooling pipe 52, which surrounds all the positioning holes 21. The vacuum adapter plate 4 is provided with a coolant outlet pipe 41 and a coolant inlet pipe 42, both of which extend through the side wall of the detector cavity 1. The side wall of the detector cavity 1 is usually provided with through holes to allow the coolant outlet pipe 41 and the coolant inlet pipe 42 to pass through. The inlet and outlet ends of the cooling pipe 52 are respectively connected to the coolant inlet pipe 42 and the coolant outlet pipe 41. Specifically, after the coolant outlet pipe 41 and the coolant inlet pipe 42 extend through the side wall of the detector cavity 1, they can be connected to an adapter. The adapter can be connected to a coolant circulation pump via a hose, thereby realizing the circulation of coolant in the cooling pipe 52. It is particularly important to emphasize that conventional cooling designs typically disconnect the cooling pipes when disassembling or assembling the body being cooled. Therefore, it is necessary to completely remove the coolant before disassembly or assembly; otherwise, coolant leakage will occur from the disconnected points during disassembly or assembly. The cooling pipes 52, coolant outlet pipe 41, and coolant inlet pipe 42 designed in this invention exist independently of the body being cooled, i.e., independently of the front-end module 6, ensuring the independence of cooling during the disassembly or assembly of the front-end module 6. Specifically, the disassembly or assembly of the front-end module 6 or the rear-end electronic components 8 does not involve the disassembly or assembly of the front panel 5 or the vacuum adapter board 4. Therefore, it is not necessary to specifically remove the coolant from the cooling pipes 52, coolant inlet pipe 42, and coolant outlet pipe 41, and coolant leakage during disassembly or assembly is completely prevented, ensuring the safety and reliability of the vacuum-type large-panel semiconductor detector.

[0077] Further reading Figure 4 The cooling pipe 52 includes several interconnected, surrounding cooling sections 52.1, each of which surrounds a positioning hole 21. Specifically, the distance between the surrounding cooling section 52.1 and the edge of the positioning hole 21 is short, effectively preventing heat from dissipating outward. It should be emphasized that, based on the cooling pipe 52, the surrounding cooling section 52.1 provides heat dissipation for each high-density cable adapter, further dispersing the heat accumulated on the front panel 5.

[0078] In one specific embodiment, see Figure 5 The detector cavity 1 has several bottom ventilation arrays 11 at its bottom, each including multiple bottom ventilation holes arranged in sequence; and several top ventilation arrays 12 at its top, each including multiple top ventilation holes arranged in sequence. Specifically, the back-end electronics assembly 8 typically includes a fan, so when the fan is working, the bottom ventilation arrays 11 and top ventilation arrays 12 can effectively disperse heat to the outside of the vacuum-type large-panel semiconductor detector via thermal convection.

[0079] This invention also provides a vacuum-type large-panel semiconductor detection system, including the vacuum-type large-panel semiconductor detector as described above, and further including: a sample chamber and a vacuum pump assembly, wherein the working end of the vacuum pump assembly is located in the inner cavity of the sample chamber, the vacuum adapter plate 4 is connected to the side wall of the sample chamber, and the front-end module 6 is located in the inner cavity of the sample chamber; the vacuum degree of the detector chamber during operation is ≤10. -6 mBar. In addition, a vacuum pipeline can be installed on the vacuum adapter plate 4, and the vacuum pipeline is equipped with a vacuum pump group, so that the vacuum type large panel semiconductor detector can realize the vacuum function by itself, without relying on the vacuum of the sample chamber.

[0080] In this invention, the front-end module 6 is a core component, and its importance is self-evident. Therefore, this invention also provides a manufacturing process for the front-end module 6, and the structure of the front-end module 6 can be found in [reference needed]. Figure 7 For the manufacturing process of front-end module 6, please refer to [link / reference]. Figure 8 It includes the following steps:

[0081] Step 1): Connect the Sensor and ASIC to form a ChipAssembly. For illustration, the Sensor is a sensor chip that converts incident photon signals into electrical signals. The ASIC is an electronics front-end readout chip that further amplifies, filters, shapes, and digitizes the electrical signals. The ChipAssembly is a chip module that packages the Sensor and ASIC together.

[0082] Step 2): Secure the Holder to the Mounting Block. For illustration, the Holder is a mechanical support that provides support and also functions as a heat-conducting module for heat dissipation. The Mounting Block is the operating fixture for the front-end module; see another patent of this applicant for details, patent title: A PCB Precision Positioning and Pressurization Device and Its Usage Method, patent application number: 202410706453X.

[0083] Step 3): Install the Mounting Block with the Holder fixed onto the positioning and pressurizing fixture, then fix the positioning and pressurizing fixture onto the dispensing machine, and use the dispensing machine to dispense adhesive onto the Holder surface. (Refer to...) Figure 9 For illustrative purposes, the positioning and pressurizing fixture is detailed in another patent of the applicant, entitled "A Precise Positioning and Pressurizing Device for PCB and Its Usage Method," application number: 202410706453X. The purpose of applying adhesive to the holder surface is twofold.

[0084] The first objective: is to firmly paste the WireBondingBoard onto the Holder. There is a large connector at the center of the WireBondingBoard, so the center of the Holder needs to be hollowed out to accommodate the large connector. Additionally, grooves are designed on the Holder to accommodate components such as low-dropout linear regulators (LDOs), resistors, or filter capacitors on the back of the WireBondingBoard. Therefore, the area on the surface of the Holder where glue can be actually applied is limited. At the same time, the number of pins of large connectors is generally large, and relatively large force is applied when inserting and removing cables. So, a glue with sufficient adhesiveness should be selected to ensure that the WireBondingBoard will not loosen due to frequent insertion and removal of cables after being pasted onto the Holder.

[0085] The second objective: is to achieve good heat conduction. The heat of the heat-generating components on the ASIC and the WireBondingBoard is dissipated through the Holder. Therefore, a glue with high thermal conductivity needs to be selected.

[0086] Step 4): Use a fixture to place the WireBondingBoard onto the glue on the Holder, and apply uniform pressure on the surface of the WireBondingBoard with a torque wrench; then, dry the WireBondingBoard and wait for it to cool naturally to room temperature. As an illustration, the WireBondingBoard is a wire bonding board that realizes connecting the signals of the ASIC to the electronics back-end readout board through leads and high-density adapters. There are no components on the front of the WireBondingBoard, only wire bonding pads corresponding to the ASIC pads, and pads for introducing high voltage to the Sensor. There are multiple components and a large connector on the back of the WireBondingBoard, and the components include low-dropout linear regulators (LDOs), resistors, or filter capacitors, etc.

[0087] Step 5): Use a dispensing machine to dispense glue on the surface of the MountingBlock in Step 4). As an illustration, two points need to be noted for the glue dispensing in this step. The first point is that the glue coverage area should be large enough to fully contact the ASIC chip and improve the heat dissipation effect. The second point is that the glue thickness should be large enough to adjust and buffer the warpage of the WireBondingBoard and the chip, and reduce the stress on the flip chip bonding. Therefore, the final selection is the "square frame" type of glue dispensing instead of the conventional "cross" type. The glue area should cover the ASIC size as much as possible without overflowing to the splicing seam of the ASIC, as shown in Figure 10 .

[0088] Step 6): Place the ChipAssembly from Step 1) onto the surface of the WireBondingBoard with adhesive applied in Step 5) using a pick-and-place machine. For illustration, the pick-and-place machine is detailed in another patent of the applicant, entitled "A Wafer-Level Semiconductor Device Placement Apparatus," patent application number: 2024110246406.

[0089] Step 7): Dry the Mounting Block from Step 6) and allow it to cool naturally to room temperature;

[0090] Step 8): Use a wire bonding machine to bond the Mounting Block from Step 7);

[0091] Step 9): Use the tool to remove the Holder from the Mounting Block, thus completing the front-end module 6.

[0092] In the manufacturing process of the front-end module provided by this invention, step 1) further includes any one of the following technical features:

[0093] 1) Perform quality screening on the sensors and enter them into the front-end module database. The preferred sensor screening criterion is that the breakdown voltage of the current collection ring is ≥200V.

[0094] 2) Perform quality screening on ASICs and enter the data into the front-end module database. Preferably, the screening criterion for ASICs is that the number of bad pixels is ≤50.

[0095] 3) Perform quality screening on ChipAssembles and enter them into the front-end module database. For the best quality, perform visual screening on ChipAssembles. The screening criterion for ChipAssembly is that the number of short-circuited pixel rows and columns is ≤5.

[0096] 4) The sensor pixel size is ≤200μm×200μm, preferably 200μm×200μm; the number of sensors is ≥65536, preferably 65536; and the actual effective area of ​​the sensor is ≥106mm×28mm, preferably 106mm×28mm. Note that to reduce the stitching dead zone, the sensor design should be as large as possible; typically, only 5 sensors can be placed on an 8-inch wafer.

[0097] 5) The pixel size of the ASIC is ≤200μm×200μm, preferably 200μm×200μm, the number of pixels of the ASIC is ≥4096, preferably 4096, and the size of the ASIC is ≥12.8mm×14.4mm, preferably 12.8mm×14.4mm.

[0098] 6) The pixels of the sensor and the pixels of the ASIC are electrically interconnected through flip-chip bonding. Because the ASIC is smaller than the sensor, multiple ASICs need to be flip-chip bonded onto the sensor sequentially. Preferably, 2×8 ASICs are flip-chip bonded sequentially. Furthermore, the solder bumps for flip-chip bonding between the sensor and the ASIC are copper pillars with solder caps. The diameter of the solder bumps is 20~40µm, preferably 30µm, and the height is 40~50µm, preferably 47µm. The minimum spacing between adjacent solder bumps is 50~70µm, preferably 60µm.

[0099] In the manufacturing process of the front-end module provided by this invention, step 2) further includes any one of the following technical features:

[0100] 1) Enter the Holder's number into the front-end module database.

[0101] 2) Use alcohol to perform ultrasonic cleaning on the Holder. Preferably, the ultrasonic frequency is 20~60kHz and the ultrasonic time is 10~20min.

[0102] 3) Use alcohol to perform ultrasonic cleaning on MountingBlock. Preferably, the ultrasonic frequency is 20~60kHz and the ultrasonic time is 10~20min.

[0103] In the manufacturing process of the front-end module provided by this invention, step 4) further includes any one of the following technical features:

[0104] 1) Place the WireBondingBoard and the positioning and pressurizing fixture together in an oven to dry. Preferably, the oven temperature is 90°C and the drying time is 30 minutes.

[0105] 2) The size of the Holder is the same as that of the WireBondingBoard, with redundancy of ≤100µm on each of the four sides, preferably 100µm.

[0106] 3) The size of the Holder is ≥107.26mm×30.76mm, preferably 107.26mm×30.76mm.

[0107] 4) The holder is made of aluminum.

[0108] 5) Steps are also provided on the two long sides of the Holder.

[0109] 6) Laser engraving is done on the holder to indicate the location and number of each ASIC chip.

[0110] 7) The torque of the torque wrench is ≥5 N*m.

[0111] 8) The bending of the WireBondingBoard is ≤50µm.

[0112] 9) The number of printing plates in the WireBondingBoard is ≥6, preferably 6.

[0113] 10) The size of the WireBondingBoard is ≥107.06mm×30.56mm, preferably 107.06mm×30.56mm. This size is a circuit board with a relatively large aspect ratio.

[0114] In the manufacturing process of the front-end module provided by this invention, step 5) further includes any one of the following technical features:

[0115] In step 5): the adhesive selected is a non-conductive adhesive with high bonding strength and high thermal conductivity;

[0116] In step 5): The grooves in the Holder are glued using a zigzag pattern, and the surface of the Holder is glued using a linear pattern.

[0117] In the manufacturing process of the front-end module provided by this invention, step 6) further includes any one of the following technical features:

[0118] In step 6): The front of the WireBondingBoard is provided with wire bonding pads corresponding to the ASIC pads. Preferably, each ASIC has 111 leads to the wire bonding pads.

[0119] In step 6): the ASIC leads are gold wires;

[0120] In step 6): the ASIC and the Wire Bonding Board are bonded together by ultrasonic thermocompression bonding;

[0121] In step 6): The back of the WireBondingBoard is equipped with a large connector, preferably with 180 pins;

[0122] In step 6): The back of the WireBondingBoard has the same number of LDOs as the ASIC.

[0123] For illustrative purposes, if step 6) uses the chip mounter described in application number 2024110246406, entitled "A Wafer-Level Semiconductor Device Mounting Apparatus", then the specific mounting process in step 6) is as follows:

[0124] Powering on: Turn on the compressed air, turn on the power, turn on the computer, and open the operating software.

[0125] Loading: Place the ChipAssembly onto the loading unit using anti-static vacuum tweezers, ensuring that the long and short sides of the ChipAssembly are firmly attached to the first positioning pins. Place the WireBondingBoard (actually a sample module with mechanical support) onto the stage, ensuring that the long and short sides of the WireBondingBoard are firmly attached to the second positioning pins. Turn on the vacuum generator to hold the WireBondingBoard in place.

[0126] Material suction: Move the suction nozzle along the first guide rail (X-axis) above the loading unit; press the suction nozzle down along the second guide rail (Z-axis) to pick up the ChipAssembly on the loading unit. Normally, the suction nozzle is set to stop when it is close to the surface of the ChipAssembly, and then slowly press down on the ChipAssembly to prevent over-pressure and damage to the ChipAssembly.

[0127] Material handling: After the suction nozzle picks up the ChipAssembly and lifts it along the second guide rail (Z-axis), it moves it along the first guide rail (X-axis) to the position of the stage.

[0128] Move the WireBondingBoard: Adjust the position of the stage on the third guide rail (Y-axis) so that the WireBondingBoard is roughly aligned with the ChipAssembly.

[0129] The piston structure of the control cylinder for moving the beam splitter prisms: causes the piston to eject the two beam splitters to the working position and turns on the LED lights at the top and bottom of the two beam splitters.

[0130] Coarse alignment: Observe the positioning marks (marks, one pair at each of the four corners) of ChipAssembly and WireBondingBoard on the monitor. Adjust the position of ChipAssembly and WireBondingBoard using the first guide rail (X-axis), the third guide rail (Y-axis), and the rotating unit (U-axis) so that the reference points of ChipAssembly and WireBondingBoard are aligned at both ends of the same long side, thereby achieving overall alignment of ChipAssembly pads and WireBondingBoard pads.

[0131] Remove the beam splitter: Control the cylinder piston structure, retract the piston, and drive the beam splitter to retract.

[0132] Press down: Press the nozzle down to the position set on the second guide rail (Z-axis) via the software.

[0133] Fine alignment: After coarse alignment of ChipAssembly and WireBondingBoard, turn on the LED lights on the gradient microscope to further observe the images of ChipAssembly and WireBondingBoard on the monitor. Adjust the positions of ChipAssembly and WireBondingBoard using the first guide rail (X-axis), the third guide rail (Y-axis), and the rotating unit (U-axis) to align the positioning marks at the two opposite corners along the long side of ChipAssembly and WireBondingBoard. Confirm the pad alignment, pad spacing, and feasibility of wire bonding to complete the fine alignment.

[0134] Patch Placement: The control module presses the nozzle down along the second guide rail (Z-axis) until the ChipAssembly is firmly attached to the WireBondingBoard. During patch placement, a pressure sensor on the nozzle detects the pressure applied. When the detected pressure is reached, the nozzle automatically stops pressing down to prevent damage to the ChipAssembly.

[0135] Release: After patching is completed, turn off the vacuum generator, remove the sample, and place it in an oven to dry the adhesive.

[0136] In step 7): MountingBlock is placed in an oven to dry. Preferably, the oven temperature is 90°C and the drying time is 30 minutes.

[0137] In step 8): Both sides of the bottom surface of the MountingBlock are provided with positioning holes that can match the wire bonding clamps used by the wire bonding machine. First, connect the positioning hole on one side of the bottom surface of the MountingBlock to the wire bonding clamp and wire bond half of the ASIC on the MountingBlock. Then, connect the positioning hole on the other side of the bottom surface of the MountingBlock to the wire bonding clamp and wire bond the other half of the ASIC on the MountingBlock.

[0138] In step 8): After all the ASIC wire bonding on MountingBlock is completed, check the ASIC wire bonding under a microscope.

[0139] In step 9): X-ray testing is performed on the front-end module, and the front-end module is graded in terms of quality. Preferably, the quality screening criteria for the front-end module is that there are no large-area bad spots, and the number of failed pixel rows and columns on a single ASIC is <5.

[0140] The contents of the aforementioned front-end module 6 are all included in the priority document, titled: A semiconductor detector and its manufacturing process, application number: 2024114110068.

[0141] The present invention also provides a method for assembling a vacuum-type large-panel semiconductor detector, comprising the following steps:

[0142] Step 1) Assemble the back-end electronics assembly 8 and install it inside the detector cavity 1. Specifically, the back-end electronics assembly 8 typically uses an integrated chassis, such as an MTCA chassis. MTCA chassis can be customized according to actual needs. A major advantage of the MTCA chassis is that it integrates numerous electronic components, including power supplies, processing chips, and readout boards, while specifying the interface models and signal transmission protocols for each electronic component, such as standard power standards, mechanical standards, and electrical standards. Furthermore, while ensuring functionality, a compact MTCA chassis can be selected to effectively reduce the size of the vacuum-type large-panel semiconductor detector.

[0143] Step 2) Install the vacuum adapter plate 4 onto the front panel 2, and install the front panel 5 onto the vacuum adapter plate 4. Specifically, both the vacuum adapter plate 4 and the front panel 5 are provided with screw holes. During installation, align the screw holes on the vacuum adapter plate 4 with the screw holes on the front panel 2, and then insert screws through them.

[0144] Step 3) Install the front-end modules 6 sequentially onto the front panel 5. Specifically, a special tooling can be used when installing the front-end modules 6 onto the front panel 5. After installation, the splicing accuracy should be maintained at ≤100 µm. The number of front-end modules 6 can be selected according to requirements, using a front panel 5 with a corresponding number of holes.

[0145] Step 4) Connect the front-end module 6 and the back-end electronics component 8 using adapters and cables. Specifically, the cables can be classified into the following categories according to their functions: power lines, high-voltage lines, optical fibers, trigger signal lines, timing lines, etc. Cables using the same signal transmission protocol and interface can be integrated on the back-end board 3 before being connected to the outside, which can effectively reduce the complexity of external cables.

[0146] Step 5) Install one end of the beam tube 7 onto the vacuum adapter plate 4. Specifically, the vacuum adapter plate 4 has mounting holes for installing the beam tube 7. Simply insert the beam tube 7 into the mounting holes. The position of the mounting holes corresponds to the position of the beamline through holes.

[0147] Step 6) Install other accessories, and finally install the front end plate 2 and the rear end plate 3 at both ends of the detector cavity 1. Specifically, when the vacuum-type large panel semiconductor detector is not connected to the sample cavity, the shielding plate can also be installed on the vacuum adapter plate 4.

[0148] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present invention, and these improvements and substitutions should also be considered within the scope of protection of the present invention.

Claims

1. A vacuum-type large-panel semiconductor detector, characterized in that: The device includes a detector cavity (1), with a front end plate (2) and a rear end plate (3) detachably connected to the detector cavity (1) at both ends. A vacuum adapter plate (4) is provided on the end face of the front end plate (2) facing the outside of the detector cavity (1). The vacuum adapter plate (4) is used to connect to an external sample cavity. A front panel (5) is provided on the vacuum adapter plate (4). A beam through hole (51) and several front end modules (6) are provided on the front panel (5). The beam through hole (51) is located between two adjacent front end modules (6). The vacuum-type large panel semiconductor detector also includes a beam tube (7), one end of which is located in the vacuum adapter plate (4) and connected to the beam through hole (51), and the other end of which extends out of the rear end plate (3). The detector cavity (1) is also provided with a back-end electronic component (8); the front-end module (6) is connected to the back-end electronic component (8) through the front panel (5) and the vacuum adapter plate via a cable, and the back-end electronic component (8) is connected to the external data acquisition system through the back-end plate (3) via a cable. The front-end module (6) is prepared using the manufacturing process of the front-end module (6), which includes the following steps: Step 1): Connect the sensor and ASIC to form a ChipAssembly; Step 2): Secure the Holder to the Mounting Block; Step 3): Install the MountingBlock with the Holder fixed on it onto the positioning and pressurizing fixture, then fix the positioning and pressurizing fixture onto the dispensing machine, and use the dispensing machine to dispense adhesive onto the surface of the Holder. Step 4): Use a tool to place the WireBonding Board onto the Holder's adhesive and apply even pressure to the surface of the WireBonding Board with a torque wrench; then, dry the WireBonding Board and allow it to cool naturally to room temperature. Step 5): Apply adhesive to the MountingBlock surface from Step 4) using a dispensing machine; Step 6): Place the ChipAssembly from Step 1) onto the surface of the WireBondingBoard with glue applied in Step 5) using a pick-and-place machine; Step 7): Dry the Mounting Block from Step 6) and allow it to cool naturally to room temperature; Step 8): Use a wire bonding machine to bond the Mounting Block from Step 7); Step 9): Use a tool to remove the Holder from the MountingBlock, thus completing the front-end module (6).

2. The vacuum-type large-panel semiconductor detector according to claim 1, characterized in that: One or more front-end modules (6) form a front-end module group, and the remaining front-end modules (6) form a front-end module group two; the front-end module group one and the front-end module group two are symmetrical about each other with the beam through-hole (51) as the symmetry point; the splicing accuracy within the front-end module group one and the front-end module group two is <100 µm; and / or, the diameter of the beam through-hole (51) is 15 mm.

3. The vacuum-type large-panel semiconductor detector according to claim 1, characterized in that: The frame refresh frequency of the large-panel semiconductor detector is greater than or equal to 1 kHz, and the dynamic range is greater than or equal to 10 4 ph. / pixel / pulse @ 12keV, with single-photon sensitivity, S / N greater than or equal to 5 @ 12keV, pixel size less than or equal to 200µm×200µm, pixel number greater than or equal to 1 million, sensitive area greater than or equal to 10cm×10cm, quantum efficiency greater than or equal to 80% @ 12keV, and response energy region of 6keV~20keV.

4. The vacuum-type large-panel semiconductor detector according to claim 1, characterized in that: The front panel (5) is provided with the same number of positioning holes (21) as the front-end modules (6), and each front-end module (6) covers one positioning hole (21); each front-end module (6) is equipped with an adapter and a cable, and the adapter is connected to the front-end module (6) in the positioning hole (21).

5. The vacuum-type large-panel semiconductor detector according to claim 1, characterized in that: The vacuum adapter plate (4) has a vacuum flange on its end face facing the inside of the detector cavity (1). The cables of each front-end module (6) pass through the vacuum flange and are connected to the back-end electronic components (8). And / or, the bottom of the detector cavity (1) is provided with a plurality of bottom ventilation arrays (11), the bottom ventilation arrays (11) including a plurality of bottom ventilation holes arranged in sequence; the top of the detector cavity (1) is provided with a plurality of top ventilation arrays (12), the top ventilation arrays (12) including a plurality of top ventilation holes arranged in sequence.

6. The vacuum-type large-panel semiconductor detector according to claim 4, characterized in that: The front panel (5) is also provided with a cooling pipe (52), which surrounds all the positioning holes (21); the vacuum adapter plate (4) is provided with a coolant outlet pipe (41) and a coolant inlet pipe (42), which both extend out of the side wall of the detector cavity (1); the inlet and outlet ends of the cooling pipe (52) are connected to the coolant inlet pipe (42) and the coolant outlet pipe (41) respectively.

7. The vacuum-type large-panel semiconductor detector according to claim 6, characterized in that: The cooling pipeline (52) includes several interconnected circumferential cooling sections (52.1), each of which is arranged around a positioning hole (21).

8. A vacuum-type large-panel semiconductor detection system, characterized in that, The detector includes a large-panel vacuum semiconductor detector as described in any one of claims 1 to 7, further comprising: a sample chamber and a vacuum pump assembly, wherein the working end of the vacuum pump assembly is located in the inner cavity of the sample chamber, the vacuum adapter plate (4) is connected to the sample chamber via a flange, and the front-end module (6) is located in the inner cavity of the sample chamber; the vacuum degree of the detector chamber during operation is ≤10. -6 mBar.

9. A method for assembling a vacuum-type large-panel semiconductor detector as described in any one of claims 1 to 7, characterized in that, Includes the following steps: Step 1) Assemble the back-end electronics assembly (8) and install the back-end electronics assembly (8) into the inner cavity of the detector cavity (1); Step 2) Install the vacuum adapter plate (4) onto the front end plate (2), and install the front panel (5) onto the vacuum adapter plate (4); Step 3) Install the front-end module (6) onto the front panel (5) in sequence; Step 4) Connect the front-end module (6) and the back-end electronics components (8) using adapters and cables; Step 5) Install one end of the beam tube (7) onto the vacuum adapter plate (4); Step 6) Install other accessories, and finally install the front end plate (2) and the rear end plate (3) at both ends of the detector cavity (1).

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