Atmospheric large panel semiconductor detector

Abstract

The application provides an atmospheric large-panel semiconductor detector and relates to the field of semiconductor detectors.The application comprises a bottom plate, a shielding box, a front panel and a back plate are arranged on the bottom plate, and the front panel and the back plate are detachably connected with two ends of the shielding box; a plurality of front-end modules are further arranged on the front panel, and a rear-end electronic component is further arranged in the shielding box; the front-end modules are connected with the rear-end electronic component through cables penetrating through the front panel, and the rear-end electronic component is connected with an external data acquisition system through cables penetrating through the back plate.The atmospheric large-panel semiconductor detector provided by the application can collect signals of a higher scattering angle, thereby improving the ultimate resolution of structure analysis of a coherent diffraction experiment.

Claims

1. An atmospheric large-panel semiconductor detector, characterized in that: The large panel semiconductor detector includes a base plate (1), on which a shielding box (2), a front panel (3) and a back plate (4) are provided. The front panel (3) and the back plate (4) are detachably connected to both ends of the shielding box (2). The front panel (3) is also provided with several front-end modules (5), and the shielding box (2) is also provided with a back-end electronic component (6); the front-end module (5) is connected to the back-end electronic component (6) through the front panel (3) by a cable, and the back-end electronic component (6) is connected to the external data acquisition system through the back plate (4) by a cable; The front-end module (5) is prepared using the manufacturing process of the front-end module (5), which includes the following steps: Step 1): Connect the sensor and ASIC to form a ChipAssembly; Step 2): Secure the Holder to the Mounting Block; Step 3): Install the MountingBlock with the Holder fixed on it onto the positioning and pressurizing fixture, then fix the positioning and pressurizing fixture onto the dispensing machine, and use the dispensing machine to dispense adhesive onto the surface of the Holder. Step 4): Use a tool to place the WireBonding Board onto the Holder's adhesive and apply even pressure to the surface of the WireBonding Board with a torque wrench; then, dry the WireBonding Board and allow it to cool naturally to room temperature. Step 5): Apply adhesive to the MountingBlock surface from Step 4) using a dispensing machine; Step 6): Place the ChipAssembly from Step 1) onto the surface of the WireBondingBoard with glue applied in Step 5) using a pick-and-place machine; Step 7): Dry the Mounting Block from Step 6) and allow it to cool naturally to room temperature; Step 8): Use a wire bonding machine to bond the Mounting Block from Step 7); Step 9): Use a tool to remove the Holder from the MountingBlock, thus completing the front-end module (5).

2. The atmospheric large-panel semiconductor detector according to claim 1, characterized in that: The frame refresh frequency of the large-panel semiconductor detector is greater than or equal to 1 kHz, and the dynamic range is greater than or equal to 10 4 ph. / pixel / pulse @ 12keV, with single-photon sensitivity, S / N greater than or equal to 5 @ 12keV, pixel size less than or equal to 200µm×200µm, pixel number greater than or equal to 1 million, sensitive area greater than or equal to 10cm×10cm, quantum efficiency greater than or equal to 80% @ 12keV, and response energy region of 6keV~20keV.

3. The atmospheric large-panel semiconductor detector according to claim 1, characterized in that: The front panel (3) is provided with a number of positioning holes (31), the number of which is the same as the number of front-end modules (5). The cables of each front-end module (5) pass through their respective positioning holes (31) and are connected to the rear-end electronic components (6).

4. The atmospheric large-panel semiconductor detector according to claim 2, characterized in that: The front panel (3) is also provided with a cooling pipe (32), which surrounds all the positioning holes (31); the base plate (1) is provided with a coolant inlet pipe (11) and a coolant outlet pipe (12), which are aligned with and connected to the inlet and outlet ends of the cooling pipe (32) respectively.

5. The atmospheric large-panel semiconductor detector according to claim 4, characterized in that: The cooling pipe (32) includes several interconnected circumferential cooling sections (32.1), each of which is arranged around a positioning hole (31).

6. The atmospheric large-panel semiconductor detector according to claim 1, characterized in that: The base plate (1) is provided with several bottom ventilation arrays (13), the bottom ventilation arrays (13) include multiple bottom ventilation holes arranged in sequence; the top of the shielding box (2) is provided with several top ventilation arrays (21), the top ventilation arrays (21) include multiple top ventilation holes arranged in sequence.

7. The atmospheric large-panel semiconductor detector according to claim 1, characterized in that: Several reinforcing ribs (7) are provided between the front panel (3) and the back panel (4), and each reinforcing rib (7) is located outside the shielding box (2).

8. The atmospheric large-panel semiconductor detector according to claim 1, characterized in that: The front panel (3) is also provided with a protective block (8), and a shielding plate (81) is detachably provided on the protective block (8); and / or, the bottom of the base plate (1) is also provided with a foot pad (14); and / or, the bottom of the base plate (1) is also provided with a base frame (15) detachable from the base plate (1).

9. A method for assembling an atmospheric large-panel semiconductor detector as described in any one of claims 1 to 8, characterized in that, Includes the following steps: Step 1) Assemble the front panel (3) and back panel (4) onto the base plate (1); Step 2) Align the front-end module (5) with the corresponding positioning hole (31) and install it onto the front panel (3) in sequence; Step 3) Assemble the back-end electronics component (6) and place the back-end electronics component (6) on the base plate (1); Step 4) Connect the front-end module (5) and the back-end electronics component (6) with cables, and connect the various cables leading out from the back-end electronics component (6) to the backplane (4); Step 5) Place the shielding box (2) on the base plate (1) so that the back-end electronic components (6) are located inside it; Step 6) Install other accessories.

Images