Pump-driven two-phase flow cooling loop for high heat flow feed source

Abstract

The invention provides a pump-driven two-phase flow cooling loop for a high heat flow feed source. The pump-driven two-phase flow cooling loop comprises a feed source cover, a feed source cylinder shell, an antenna unit, a TR assembly, a supporting structure, a wave-controlled power supply combination, a self-sealing fluid connector, a pipeline and a pump set. The device is high in efficiency, light in weight, compact in structure and highly integrated with an antenna structure, a pump set is directly hung on the back of a reflecting surface, a pipe network is pre-embedded in a folding and unfolding truss of an antenna, and a two-phase micro flow channel is directly machined in a TR supporting structure; the liquid cooling plate is tightly attached to the heating surface of a TR assembly and other heat sources, so that the heat transfer path is more reasonable, and the heat exchange efficiency is further improved by combining the vapor-liquid phase change latent heat of an HFE-7100 working medium with the parallel snakelike micro flow channels; a group of combined heat exchangers based on semiconductor refrigeration are installed in a two-phase loop, the net positive suction head of a pump set is improved, the dryness of a working medium in a flow channel can be maintained between 0 and 0.4, the power consumption limitation of a traditional feed source is greatly broken through, meanwhile, the temperature consistency of a TR assembly is remarkably improved, and the thermal control problem of the high heat flow feed source is solved.

Description

Technical Field

[0001] This invention relates to the field of antenna technology, and more specifically to a pump-driven two-phase flow cooling circuit for a high heat flux feed source. Background Technology

[0002] Although increasing the radiating aperture can effectively improve the performance of reflector antennas, the strict space constraints of spaceborne, vehicle-mounted, and shipborne platforms, coupled with the bottleneck constraints of deployable reflector technology, mean that the reflector aperture size cannot be increased indefinitely. This has prompted antenna feeds to evolve towards high power, phased array, and multi-functionality. However, the rapidly increasing heat dissipation has brought huge challenges to feed thermal control. First, the internal space of the feed is enclosed and highly compact, with a large number of TR components concentrated in one place, resulting in extremely high core heat flux density. Secondly, the large-diameter reflector creates a strong thermal radiation focusing effect on the feed housing; Third, traditional air-cooling or conductive heat dissipation methods can no longer meet the stringent thermal control requirements.

[0003] Therefore, a thermal control structure is needed to solve the heat dissipation problem of high-density heat flow feed sources. Summary of the Invention

[0004] This invention addresses the challenge of feed heat control for high heat flux reflector antennas within compact space and lightweight design requirements. It provides a pump-driven two-phase flow cooling circuit for high heat flux feeds, capable of handling antennas with heat flux levels up to 1120 W / m. 2 Under solar thermal radiation density and ambient temperature conditions of -40~55℃, the total heat loss of the feed TR module and power module is 200~600W and 100W / cm². 2 Effective control of peak heat flux density ensures that the temperature of each module housing remains stable below 85°C, thereby guaranteeing the reliable operation of the antenna system.

[0005] This invention provides a pump-driven two-phase flow cooling circuit for a high heat flux feed, including a feed cover and a feed cylinder shell connected together, an antenna unit, a TR assembly, a support structure, and a wave control power supply assembly connected sequentially inside the feed cylinder shell from top to bottom via connectors, self-sealing fluid connectors connected to both ends of the wave control power supply assembly, a pipeline passing through the feed cylinder shell and connected to the two self-sealing fluid connectors respectively, and a pump group connected to the pipeline. The support structure includes a cold plate body, a microchannel connected in the cold plate body and facing the TR component, and at least two slots connected through the cold plate body. The two ends of the microchannel are respectively connected to two self-sealing fluid connectors. The slots are connector clearance holes. The microchannel, self-sealing fluid connectors, pipelines and pump sets form a fully enclosed vapor-liquid two-phase circulation loop. The pump unit includes a first heat exchanger connected to a pipeline, a circulating pump connected to the hot end inlet of the first heat exchanger, a second heat exchanger connected to the cold end outlet of the first heat exchanger, a fan coil unit connected to the hot end outlet of the second heat exchanger, and a liquid storage tank connected to the cold end inlet of the second heat exchanger. The hot end outlet and cold end inlet of the first heat exchanger are respectively connected to two sections of the pipeline. The outlet of the fan coil unit is connected to the inlet of the liquid storage tank. The liquid storage tank stores the vapor-liquid phase change working fluid.

[0006] In a preferred embodiment of the pump-driven two-phase flow cooling circuit for a high heat flux feed source described in this invention, both the first heat exchanger and the second heat exchanger are combined heat exchangers based on semiconductor refrigeration, each including a cooling section and a heating section. The second heat exchanger is also provided with a semiconductor refrigeration chip, which pre-cools the vapor-liquid phase change working fluid entering the circulating pump and prevents cavitation. The second heat exchanger uses the waste heat of the working fluid to precool the working fluid before the pump in order to improve the net positive suction head (NPSH). The first heat exchanger uses the waste heat of the working fluid to preheat the working fluid after the pump in order to regulate the flow state of the vapor-liquid mixture. The dryness of the vapor-liquid phase change working fluid in the microchannel is 0~0.4, and the feed heat control is carried out by nucleoboiling flow heat exchange. It also includes the heat tracing cable connected inside the storage tank.

[0007] In a preferred embodiment of the pump-driven two-phase flow cooling circuit for a high heat flux feed source described in this invention, the cooling section of the first heat exchanger is maintained at the boiling point of the working fluid under the internal gas pressure of the pump-driven two-phase flow cooling circuit. The fan coil unit cools the working fluid in the storage tank to a subcooled state. The cooling section of the second heat exchanger further cools the working fluid output from the storage tank, reducing its dryness to below -0.2. The heating section of the first heat exchanger heats the working fluid after the circulating pump to a specified dryness. The working fluid flowing out of the microchannel is a gas-liquid two-phase mixture with a dryness greater than 0.2. When it flows through the cooling section of the first heat exchanger, it transfers heat to the subcooled working fluid pumped into the heating section of the first heat exchanger by the circulating pump. At the same time, the working fluid flowing out of the microchannel is initially cooled and its dryness decreases. The working fluid after the circulating pump is heated and its dryness increases. The working fluid flowing out of the cooling section of the first heat exchanger carries away the waste heat generated when the semiconductor refrigeration chip is working in the heating section of the second heat exchanger and enters the fan coil unit.

[0008] In a preferred embodiment of the pump-driven two-phase flow cooling circuit for a high heat flux feed source described in this invention, the feed source shell includes an upper cylinder and a lower cylinder, with the bottom of the lower cylinder having a planar structure. The antenna unit includes an antenna unit body, a support plate, and a bracket connected in sequence. The support plate is provided with connector clearance holes, and the bracket is a downward protruding structure connected to the bottom of the support plate. The TR assembly, support structure, and wave-controlled power supply assembly all have openings in the middle for the support bracket to pass through. The wave-controlled power supply assembly is connected to the bottom plane of the lower cylinder, and the support plate rests on the lower cylinder. The size of the cold plate body is larger than the external size of the wave-controlled power supply assembly, and the microchannels are parallel serpentine microchannels.

[0009] In a preferred embodiment of the pump-driven two-phase flow cooling circuit for a high heat flux feed source described in this invention, the four sides of the cold plate body extend downward to the bottom of the lower cylinder, and the cold plate body covers the wave-controlled power supply assembly in a semi-enclosed manner.

[0010] The pump-driven two-phase flow cooling circuit for a high heat flux feed source described in this invention, as a preferred embodiment, uses a self-sealing fluid connector for through-chamber sealing and liquid supply to the flow channel. The pipeline is pre-embedded in the antenna's retraction truss, and the pump unit is externally mounted on the back of the antenna's reflector.

[0011] In the pump-driven two-phase flow cooling circuit for a high heat flux feed source described in this invention, the preferred embodiment is HFE7100 as the vapor-liquid phase change working fluid. The air pressure in the pump-driven two-phase flow cooling circuit is 1.1 ± 0.1 atmospheres.

[0012] The present invention discloses a pump-driven two-phase flow cooling circuit for a high heat flux feed source. As a preferred embodiment, the thermal control method for the pump-driven two-phase flow cooling circuit includes the following steps: S1. When the ambient temperature is 37.2℃~55℃, the pump-driven two-phase flow cooling circuit is in high-temperature circulation mode, and proceed to step S2. When the ambient temperature is 18.4℃~37.2℃, the pump-driven two-phase flow cooling circuit is in medium-temperature circulation mode, and proceeds to step S3; When the ambient temperature is -40℃ to 18.4℃, the pump-driven two-phase flow cooling circuit is in low-temperature circulation mode, and proceeds to step S4; S2. The fan coil unit cools the vapor-liquid phase change working fluid in the storage tank to a subcooled state. Then, the working fluid is cooled to a dryness fraction below -0.2 by the cooling section of the second heat exchanger. Next, the circulating pump delivers the working fluid to the heating section of the first heat exchanger, and the dryness fraction of the working fluid is adjusted to 0. Subsequently, the working fluid enters the microchannel through the self-sealing connector, absorbs the heat generated by the TR component and the wave-controlled power supply combination, and exchanges heat in the nucleo-boiling flow state. The dryness gradually increases from 0 along the flow direction, the working fluid leaves the microchannel, and the temperature of the TR component shell stabilizes. Afterwards, the working fluid enters the cooling section of the first heat exchanger, where its dryness decreases. Then, it passes through the heating section of the second heat exchanger, where it absorbs the heat generated by the operation of the semiconductor cooling chip. Finally, it enters the fan coil unit to complete the cycle. S3. The fan coil unit controls the dryness of the working fluid in the storage tank to the dryness target of the second heat exchanger cooling section in step S2. The semiconductor refrigeration chip operates in a low-power state or does not operate. The rest of the process is the same as the high-temperature cycle mode. S4. The fan coil unit and the semiconductor cooling chip operate at low power or not at all. The heating tape starts first after the power is turned on. The heat generated by the TR component will raise the dryness of the working fluid in the storage tank to the dryness target of the second heat exchanger cooling section in step S2. After stabilization, the rest of the process is the same as the high temperature cycle mode.

[0013] In the preferred embodiment of the pump-driven two-phase flow cooling circuit for high heat flux feed source described in this invention, in step S2, the subcooled state is a dryness fraction of less than 0, and the target dryness fraction of the cooling section of the second heat exchanger is -0.2.

[0014] In the preferred embodiment of the pump-driven two-phase flow cooling circuit for high heat flux feed source described in this invention, in step S2, the working fluid leaves the microchannel at a temperature of 61°C and a dryness fraction of 0.4, the shell temperature of the TR component is stabilized at 65°C, and the dryness fraction of the working fluid flowing out of the heating section of the first heat exchanger is 0.2.

[0015] Therefore, pump-driven vapor-liquid two-phase cooling technology, with its unique latent heat characteristics of working fluid vapor-liquid phase change and nucleation boiling enhanced heat transfer mechanism, provides an innovative solution to the problem of heat dissipation in high-density heat flow and has become an ideal choice for feed source thermal control.

[0016] The technical solution of this invention is as follows: The antenna as a whole adopts an integrated design concept of mechanism, structure and thermal control, with the thermal control components highly integrated into each structure of the antenna. First, high heat-dissipating devices such as TR components, wave controllers, and power modules installed on the support structure are designed with cableless plug-in connection. The heating surfaces of all devices are installed close to the support structure, so that the micro-channels processed in the support structure will achieve a relatively optimal overall system thermal resistance. Second, considering the need for folding and storage of the reflector during transportation, the liquid supply pipeline and pump group are pre-embedded or conformally externally mounted as much as possible, without exceeding the motion envelope of the retraction mechanism. Finally, the vapor-liquid phase change working fluid is HFE7100, and a pair of combined heat exchangers based on semiconductor refrigeration are used to improve the net positive suction head (NPSH) and regulate the working fluid flow state, ensuring that the dryness of the working fluid in the micro-channel is maintained between 0 and 0.4, and heat exchange is carried out in a vigorous nucleo-boiling flow state, ultimately achieving the thermal control purpose of the feed.

[0017] In this invention, the reflector antenna adopts an integrated design of mechanism, structure and thermal control. For example, the pump group is directly mounted on the back of the reflector within the folded envelope area, the liquid supply pipeline is pre-embedded in the truss, and the flow channel is directly machined into the support structure that is close to the TR component, so as to minimize the change in the appearance of the reflector antenna and reduce the impact of the thermal control component on the antenna deployment and storage.

[0018] This invention incorporates a support structure and its microchannel structure. The support structure allows for close integration and assembly with heat-generating devices such as TR components and wave-controlled power supplies. Furthermore, the HFE-7100 achieves a heat transfer coefficient exceeding 30,000 W / m² under nucleo-boiling conditions. 2 For flow channels in the K-order range, the flow path only needs to ensure that the vapor-liquid mixture covers the heat source with low flow resistance and high stability. Therefore, it is designed as a parallel serpentine channel.

[0019] The pump unit of this invention is equipped with a set of combined heat exchangers based on semiconductor refrigeration. It makes full use of the waste heat of the working fluid to pre-cool the working fluid before the pump to improve the net positive suction head (NPSH) and preheat the working fluid after the pump to regulate the flow state of the gas-liquid mixture, so as to meet the thermal control requirements of the antenna under extreme ambient temperatures to the greatest extent.

[0020] The present invention has the following advantages: (1) The micro-channel cold plate of the present invention serves as both a carrier for the vapor-liquid phase change working medium and an assembly carrier for the feed structure. The pump group, with its compact structure and light weight, can be highly integrated with the reflector. In addition, the pipelines pre-embedded in the truss of the retraction mechanism enable the thermal control and the mechanism and structure to achieve an integrated shared design, saving design space and reducing weight for the overall antenna structure.

[0021] (2) The cooling circuit of the present invention uses a set of combined heat exchangers based on semiconductor refrigeration as the core device for flow regulation. On the one hand, it can keep the working fluid in the micro-channel vigorous nucleus boiling, so the channel topology does not need to be too complicated. On the other hand, it significantly improves the NPSH of the pump group under high temperature conditions, and increases the safety and service life of the two-phase circuit. Attached Figure Description

[0022] Figure 1 This is a diagram showing the installation relationship of a pump-driven two-phase flow cooling circuit for a high heat flux feed source. Figure 2 An exploded view of the feed and two-phase flow cooling circuit structure for a pump-driven two-phase flow cooling circuit used for high heat flux feed sources. Figure 3 A cross-sectional view of a microchannel in the support structure of a pump-driven two-phase flow cooling circuit for a high heat flux feed source. Figure 4 This is a schematic diagram of a pump-driven two-phase flow cooling circuit for a high heat flux feed source.

[0023] Figure label: 1. Feed shroud; 2. Feed cylinder shell; 21. Upper cylinder; 22. Lower cylinder; 200. Penetration attack module; 3. Antenna unit; 31. Antenna unit body; 32. Support plate; 33. Bracket; 4. TR assembly; 5. Support structure; 51. Cold plate body; 52. Microchannel; 53. Slot; 6. Wave-controlled power supply assembly; 7. Self-sealing fluid connector; 8. Piping; 9. Pump set; 91. First heat exchanger; 92. Circulating pump; 93. Second heat exchanger; 94. Fan coil unit; 95. Liquid storage tank; 96. Semiconductor cooling chip; 97. Heating tape. Detailed Implementation

[0024] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Example 1

[0025] A pump-driven two-phase flow cooling circuit for high heat flux feed sources. Figure 1 This diagram shows the installation relationship between the reflector antenna and the cooling circuit, which clarifies the external structural form of the reflector antenna.

[0026] Figure 2 This is an exploded view of the feed and pump-driven two-phase flow cooling circuit structure, which clarifies the structural design of the feed and pump-driven two-phase flow cooling circuit. The feed cover 1 and the feed cylinder shell 2 form a relatively enclosed and narrow space. In this space, the antenna element 3 is a passive device, while the TR component 4 and the wave control power supply combination 6 are high heat dissipation active devices. The two are interconnected wirelessly through the support structure 5. The micro-channel is also processed in the support structure 5. The self-sealing fluid connector 7 serves the functions of through-pack sealing and supplying liquid to the channel. The main body of the pipeline 8 is embedded in the truss, and its two ends are connected to the connector 7 and the pump group 9, respectively, forming a fully enclosed gas-liquid two-phase circulation loop.

[0027] As an active device that generates a significant amount of heat, the wave-controlled power supply assembly 6 needs to be connected to the TR component 4 via an RF connector to achieve signal transmission and power supply functions. Therefore, a large area of ​​slots 53 and through holes needs to be reserved on the upper surface of the support structure 5 to meet the connector arrangement requirements.

[0028] The RF connector itself is quite precise and has limited mechanical load-bearing capacity. The four sides of the cold plate body 51 of the support structure 5 extend downward to the bottom of the lower cylinder 22 of the feed barrel housing 2, so that the feed barrel housing 2 bears the main structural load and reduces the mechanical impact on the connector. This design allows the support structure 5 to actually cover the wave control power supply assembly 6 in a "semi-enclosed" form.

[0029] The feed cylinder shell 2 includes an upper cylinder 21 and a lower cylinder 22, with the bottom of the lower cylinder 22 having a planar structure; Antenna unit 3 includes antenna unit body 31, support plate 32 and bracket 33 connected in sequence. The support plate 32 is provided with connector clearance holes, and the bracket 33 is a downward protruding structure connected to the lower bottom of the support plate 32. The TR assembly 4, the support structure 5, and the wave-controlled power supply assembly 6 are all provided with openings in the middle for the bracket 33 to pass through. The wave-controlled power supply assembly 6 is connected to the bottom plane of the lower cylinder 22, and the support plate 32 rests on the lower cylinder 22. The size of the cold plate body 51 is larger than the external size of the wave-controlled power supply assembly 6, and the microchannel 52 is a parallel serpentine microchannel.

[0030] Figure 3 The figure illustrates the form of the microchannel 52 supporting structure 5. The specific form of the microchannel 52's topology is clearly defined in the figure. From... Figure 3 The cross-section of the support structure 5 shown reveals slots 53 for the connectors. Regarding flow channel design, since the heat transfer coefficient of single-phase forced convection is typically low, complex flow channels are often required to enhance fluid turbulence. However, in this product, because the flow boiling heat transfer coefficient can reach several times or even hundreds of times that of single-phase convection, there is no need to pursue excessively complex flow channel configurations. The current microchannel 52 uses a mirror-arranged parallel serpentine flow channel to cover the same number of heat sources, which is sufficient to meet the heat dissipation requirements.

[0031] Figure 4 The diagram shows the schematic of the pump-driven two-phase flow cooling circuit for the feed, which clarifies the design scheme of the pump-driven two-phase flow cooling circuit. The phase change working fluid charged in the circuit is HFE7100, which has a boiling point of 61.2℃ under standard atmospheric pressure, and the circuit basically maintains operation under this pressure.

[0032] When the ambient temperature is between 37.2℃ and 55℃, the two-phase circuit operates in a high-temperature circulation mode: First, the fan coil unit 94 cools the working fluid in the storage tank 95 to a subcooled state with a dryness of less than 0. Then, the working fluid is further cooled to a dryness of -0.2 via the pre-cooling section 9 of the semiconductor refrigeration heat exchanger. Next, the circulation pump 92 delivers the working fluid to the heating section of the waste heat preheater (first heat exchanger 91), during which the dryness of the working fluid is precisely adjusted to 0. Subsequently, the working fluid enters the microchannel 52 through the self-sealing connector 7, absorbing heat generated by components such as the TR component 4. In the channel, the working fluid mainly undergoes nucleobubble boiling, and its dryness gradually rises from 0 to 0.4 along the flow direction before leaving the cold plate. The shell temperature of the TR component 4 can be stabilized at around 65℃. Afterward, the working fluid enters the cooling section of the first heat exchanger 91, where its dryness drops to approximately 0.2. Finally, the heat generated by the semiconductor refrigeration chip 96 during operation is also carried by the working fluid into the fan coil unit 94 to complete the circulation.

[0033] When the ambient temperature is 18.4℃~37.2℃, the two-phase circuit operates in medium-temperature cycle mode: at this time the ambient temperature is low, the fan coil unit 94 can directly control the dryness of the working fluid in the liquid storage tank 95 to -0.2, the semiconductor cooling chip 96 can operate in low power state or even not operate, and the rest of the process is basically the same as the high-temperature cycle mode.

[0034] When the ambient temperature is between -40℃ and 18.4℃, the two-phase circuit operates in low-temperature cycling mode: At this low ambient temperature, the fan coil unit 94 and the semiconductor cooling chip 96 can operate at low power or even not at all. The heating tape 97 starts first after startup, and together with the heat generated by the TR component 4, it raises the dryness of the working fluid in the storage tank 95 to -0.2 within minutes. After stabilization, the remaining processes are basically the same as in the high-temperature cycling mode. The characteristics of this two-phase circuit are: full utilization of the waste heat of the working fluid, improving the NPSH of the pump group, the heat exchange efficiency of the working fluid in the microchannel, and the boiling stability.

[0035] like Figure 4 As shown, this system recovers and utilizes the waste heat of the working fluid through a two-stage process.

[0036] The first stage of utilization occurs after the main loop enters stable operation. At this time, the working fluid flowing out of microchannel 52 is a gas-liquid two-phase mixture with a dryness of approximately 0.4. Under a pressure of approximately 1 bar inside the system, the temperature of this mixture is approximately 61°C. When flowing through the cooling section of the first heat exchanger 91, it transfers heat to the working fluid pumped in by the circulating pump 92 on the other side. This working fluid is in a highly subcooled state, with a dryness not exceeding -0.2. Through this heat exchange, the subcooled working fluid is heated to 61°C, and its dryness is increased to 0; while the working fluid at the outlet of microchannel 52 is initially cooled, and its dryness decreases from 0.4 to 0.2, achieving initial energy recovery.

[0037] The second level of utilization is Figure 4 The second heat exchanger 93 and the thermoelectric cooler 96 are incorporated within the system. The thermoelectric cooler 96 pre-cools the working fluid entering the circulating pump 92 to prevent cavitation; however, it generates waste heat on its hot side during operation. This design utilizes the working fluid with a dryness fraction of 0.2 flowing out from the cooling section of the second heat exchanger 93, carrying away this waste heat as it passes through this component, and ultimately delivering it to the fan coil unit 94 and the liquid storage tank 95, thus achieving the reuse of waste heat.

[0038] The heat tracing cable 12 is located in the liquid storage tank 95. It will only start when the machine is turned on under low temperature conditions, and will not participate in the two-phase circuit operation at other times.

[0039] The first heat exchanger 91 is heated to 61°C by the waste liquid of the liquid-cooled plate. The maximum temperature that the subcooled working fluid can be heated to can only approach 61°C but not exceed it. This characteristic is used to adjust the dryness of the working fluid of the cold plate to 0°C.

[0040] This invention discloses the principle and structural form of a pump-driven two-phase flow cooling circuit for high heat flux feed sources, including... Figure 1 The installation relationship between the reflector antenna and the cooling circuit is shown. Figure 2 The exploded view of the feed and two-phase flow cooling circuit structure shown is as follows. Figure 3 The diagram shows a cross-sectional view of the support structure 5 microchannel 52. Figure 4 The diagram shows the principle of the two-phase flow cooling circuit driven by the feed pump. This two-phase flow circuit is highly efficient, lightweight, and compact, and can be highly integrated with the antenna structure. For example, the pump group 9 is directly mounted on the back of the reflector, the pipe 8 is pre-embedded in the antenna's retraction truss, and the two-phase microchannel 52 is directly machined into the TR support structure 5. The liquid cooling plate is installed close to the heating surface of the heat source such as the TR component 4, making the heat transfer path more reasonable. The latent heat of vapor-liquid phase change of the HFE-7100 working fluid combined with the parallel serpentine microchannel further improves the heat exchange efficiency. A pair of combined heat exchangers based on semiconductor refrigeration are installed in the two-phase circuit. In addition to improving the pump group's net positive suction head (NPSH), it can also ensure that the dryness of the working fluid in the flow channel is maintained between 0 and 0.4. While significantly breaking through the power consumption limitations of traditional feeds, it significantly improves the temperature consistency of the TR component 4, thereby solving the thermal control problem of high heat flux feeds.

[0041] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A pump-driven two-phase flow cooling circuit for a high heat flux feed source, characterized in that: The device includes a feed hood (1) and a feed cylinder housing (2), and from top to bottom, an antenna unit (3), a TR assembly (4), a support structure (5), and a wave control power supply assembly (6) connected to the inside of the feed cylinder housing (2) via connectors. It also includes self-sealing fluid connectors (7) connected to both ends of the wave control power supply assembly (6), pipes (8) that pass through the feed cylinder housing (2) and are respectively connected to the two self-sealing fluid connectors (7), and a pump group (9) connected to the pipes (8). The support structure (5) includes a cold plate body (51), a microchannel (52) connected in the cold plate body (51) and facing the TR component (4), and at least two slots (53) that pass through and connect to the cold plate body (51). The two ends of the microchannel (52) are respectively connected to two self-sealing fluid connectors (7). The slots (53) are connector clearance holes. The microchannel (52), the self-sealing fluid connector (7), the pipeline (8) and the pump group (9) form a fully enclosed vapor-liquid two-phase circulation loop. The pump set (9) includes a first heat exchanger (91) connected to the pipeline (8), a circulating pump (92) connected to the hot end inlet of the first heat exchanger (91), a second heat exchanger (93) connected to the cold end outlet of the first heat exchanger (91), a fan coil unit (94) connected to the hot end outlet of the second heat exchanger (93), and a liquid storage tank (95) connected to the cold end inlet of the second heat exchanger (93). The hot end outlet and cold end inlet of the first heat exchanger (91) are respectively connected to two sections of the pipeline (8). The outlet of the fan coil unit (94) is connected to the inlet of the liquid storage tank (95). The liquid storage tank (95) stores a vapor-liquid phase change working fluid.

2. The pump-driven two-phase flow cooling circuit for a high heat flux feed source according to claim 1, characterized in that: The first heat exchanger (91) and the second heat exchanger (93) together form a combined heat exchanger based on semiconductor refrigeration. Both include a cooling section and a heating section. The second heat exchanger (93) is also provided with a semiconductor refrigeration chip (96). The semiconductor refrigeration chip (96) precools the vapor-liquid phase change working fluid entering the circulating pump (92) and prevents cavitation. The second heat exchanger (93) uses the waste heat of the working fluid to pre-cool the working fluid before the pump to improve the net positive suction head (NPSH), and the first heat exchanger (91) uses the waste heat of the working fluid to pre-heat the working fluid after the pump to regulate the flow state of the vapor-liquid mixture. The dryness of the vapor-liquid phase change working fluid in the microchannel (52) is 0~0.4, and the feed heat control is carried out by nucleobubble boiling flow heat exchange. It also includes a heat tracing cable (97) connected inside the liquid storage tank (95).

3. A pump-driven two-phase flow cooling circuit for a high heat flux feed source according to claim 2, characterized in that: The cooling section of the first heat exchanger (91) is maintained at the boiling point of the working fluid under the internal gas pressure of the pump-driven two-phase flow cooling circuit; The fan coil unit (94) cools the working fluid in the storage tank (95) to a subcooled state. The cooling section of the second heat exchanger (93) further cools the working fluid output from the storage tank (95) and reduces its dryness to below -0.

2. The heating section of the first heat exchanger (91) heats the working fluid after the circulating pump (92) to a specified dryness. The working fluid flowing out of the microchannel (52) is a gas-liquid two-phase mixture with a dryness greater than 0.

2. When it flows through the cooling section of the first heat exchanger (91), it transfers heat to the subcooled working fluid pumped into the heating section of the first heat exchanger (91) by the circulating pump (92). At the same time, the working fluid flowing out of the microchannel (52) is initially cooled and its dryness decreases. The working fluid after the circulating pump (92) is heated and its dryness increases. The working fluid flowing out of the cooling section of the first heat exchanger (91) carries away the waste heat generated when the semiconductor refrigeration chip (96) is working in the heating section of the second heat exchanger (93) and enters the fan coil unit (94).

4. The pump-driven two-phase flow cooling circuit for a high heat flux feed source according to claim 1, characterized in that: The feed cylinder shell (2) includes an upper cylinder (21) and a lower cylinder (22), and the bottom of the lower cylinder (22) is a planar structure; The antenna unit (3) includes an antenna unit body (31), a support plate (32) and a bracket (33) connected in sequence. The support plate (32) is provided with connector clearance holes, and the bracket (33) is a downward protruding structure connected to the lower bottom of the support plate (32). The TR component (4), the support structure (5) and the wave-controlled power supply assembly (6) are all provided with openings in the middle for the bracket (33) to pass through. The wave-controlled power supply assembly (6) is connected to the bottom plane of the lower cylinder (22), and the support plate (32) is abutted on the lower cylinder (22). The size of the cold plate body (51) is larger than the external size of the wave-controlled power supply assembly (6), and the microchannel (52) is a parallel serpentine microchannel.

5. A pump-driven two-phase flow cooling circuit for a high heat flux feed source according to claim 4, characterized in that: The four sides of the cold plate body (51) extend downward to the bottom of the lower cylinder (22), and the cold plate body (51) covers the wave-controlled power supply assembly (6) in a semi-enclosed manner.

6. A pump-driven two-phase flow cooling circuit for a high heat flux feed source according to claim 1, characterized in that: The self-sealing fluid connector (7) performs through-chamber sealing and supplies fluid to the flow channel; The pipeline (8) is embedded in the antenna's retraction truss, and the pump unit (9) is externally mounted on the back of the antenna's reflective surface.

7. A pump-driven two-phase flow cooling circuit for a high heat flux feed source according to claim 1, characterized in that: The vapor-liquid phase change working fluid is HFE7100; The air pressure in the pump-driven two-phase flow cooling circuit is 1.1 ± 0.1 atmospheres.

8. A pump-driven two-phase flow cooling circuit for a high heat flux feed source according to any one of claims 1 to 7, characterized in that: The thermal control method for a pump-driven two-phase flow cooling circuit includes the following steps: S1. When the ambient temperature is 37.2℃~55℃, the pump-driven two-phase flow cooling circuit is in high-temperature circulation mode, proceed to step S2; When the ambient temperature is 18.4℃~37.2℃, the pump-driven two-phase flow cooling circuit is in medium-temperature circulation mode, and proceeds to step S3; When the ambient temperature is -40℃ to 18.4℃, the pump-driven two-phase flow cooling circuit is in low-temperature circulation mode, and proceeds to step S4; S2. The fan coil unit (94) cools the vapor-liquid phase change working fluid in the storage tank (95) to a subcooled state. Then, the working fluid is cooled to a dryness of -0.1 or less via the cooling section of the second heat exchanger (93). Next, the circulating pump (92) delivers the working fluid to the heating section of the first heat exchanger (91), and the dryness of the working fluid is adjusted to 0. Subsequently, the working fluid enters the microchannel (52) through the self-sealing connector (7), absorbs the heat generated by the TR component (4) and the wave-controlled power supply combination (6), and exchanges heat in a nucleo-boiling flow state. The dryness gradually increases from 0 along the flow direction. The working fluid leaves the microchannel (52), and the shell temperature of the TR component (4) stabilizes. Afterwards, the working fluid enters the cooling section of the first heat exchanger (91), where the dryness decreases. Then, it passes through the heating section of the second heat exchanger (93) to absorb the heat generated by the operation of the semiconductor cooling chip (96), and then enters the fan coil unit (94) to complete the cycle. S3, the fan coil unit (94) controls the dryness of the working fluid in the liquid storage tank (95) to the dryness target of the cooling section of the second heat exchanger (93) in step S2, and the semiconductor refrigeration chip (96) operates in a low power state or does not operate. The rest of the process is the same as the high temperature cycle mode. S4. The fan coil unit (94) and the semiconductor cooling chip (96) operate in a low-power state or not at all. The heat tracing cable (97) starts first after power-on. The heat generated by the TR component (4) raises the dryness of the working fluid in the liquid storage tank (95) to the dryness target of the cooling section of the second heat exchanger (93) in step S2. After stabilization, the rest of the process is the same as the high-temperature cycle mode.

9. A pump-driven two-phase flow cooling circuit for a high heat flux feed source according to claim 8, characterized in that: In step S2, the subcooled state is a dryness degree of less than 0, and the dryness degree target of the cooling section of the second heat exchanger (93) is -0.

2.

10. A pump-driven two-phase flow cooling circuit for a high heat flux feed source according to claim 8, characterized in that: In step S2, the working fluid leaves the microchannel (52) at a temperature of 61°C and a dryness of 0.

4. The shell temperature of the TR component (4) is stable at 65°C, and the dryness of the working fluid flowing out of the heating section of the first heat exchanger (91) is 0.2.

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