Miniaturized WIFI module

Abstract

The invention relates to a miniaturized WIFI (Wireless Fidelity) module. The miniaturized WIFI module comprises a PCB and a transmission module, the transmission module comprises a first onboard antenna unit, a second onboard antenna unit and a third onboard antenna unit, and the first onboard antenna unit, the second onboard antenna unit and the third onboard antenna unit are arranged on the PCB at intervals. According to the scheme provided by the invention, the antenna can be integrated, so that the size of the WIFI module is reduced, and the intelligent motor is lighter and thinner.

Description

Technical Field

[0001] This invention relates to the field of WIFI technology, and in particular to a miniaturized WIFI module. Background Technology

[0002] In related technologies, the Wi-Fi module is a crucial component of current smart TVs. However, most current smart TVs use external antennas for their Wi-Fi modules. This design increases the thickness of the TV, hindering the pursuit of a thinner and lighter design. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a miniaturized WIFI module that integrates the antenna, thereby reducing the size of the WIFI module and making the smart motor thinner and lighter.

[0004] The objective of this invention is achieved through the following technical solution: The first aspect of this application provides a miniaturized WIFI module, including: a PCB board; and a transmission module including a first onboard antenna unit, a second onboard antenna unit, and a third onboard antenna unit, wherein the first onboard antenna unit, the second onboard antenna unit, and the third onboard antenna unit are respectively disposed at intervals on the PCB board.

[0005] The first onboard antenna unit includes capacitor C97, inductor L1, capacitor C99, inductor L3, resistor R9, capacitor C60, resistor R17, capacitor C53, and antenna ANT3. The first terminal of capacitor C97 is electrically connected to the first terminal of inductor L1, and the second terminal of capacitor C97 is grounded. The second terminal of inductor L1 is electrically connected to the first terminal of capacitor C99, and the second terminal of capacitor C99 is grounded. The first terminal of inductor L3 is electrically connected to the first terminal of capacitor C99, and the second terminal of inductor L3 is electrically connected to the first terminal of resistor R9, and the second terminal of resistor R9 is grounded. The first terminal of capacitor C60 is electrically connected to the first terminal of inductor L3, and the second terminal of capacitor C60 is grounded. The first terminal of resistor R17 is electrically connected to the first terminal of capacitor C60, and the second terminal of resistor R17 is electrically connected to the first terminal of capacitor C53 and antenna ANT3, respectively, and the second terminal of capacitor C53 is grounded.

[0006] The second onboard antenna unit includes an inductor L4, a capacitor C8, a resistor R4, an inductor L5, a capacitor C18, an inductor L7, an inductor L9, and a chip DX1. The first end of the inductor L4 is electrically connected to the first end of the capacitor C8, and the second end of the capacitor C8 is grounded. The second end of the inductor L4 is electrically connected to the first end of the resistor R4, and the second end of the resistor R4 is electrically connected to the first end of the inductor L5, which is grounded. The first end of the inductor L5 is also electrically connected to the chip DX1. The first end of the capacitor C18 is electrically connected to the first end of the inductor L7, and the second end of the capacitor C18 is grounded. The second end of the inductor L7 is electrically connected to the first end of the inductor L9, which is grounded. The first end of the inductor L9 is also electrically connected to the chip DX1.

[0007] The second onboard antenna unit further includes capacitor C15, inductor L6, diode D11, capacitor C54, resistor R18, capacitor C55, and antenna ANT2. The first terminal of capacitor C15 is electrically connected to chip DX1, and the second terminal of capacitor C15 is grounded. The first terminal of inductor L6 is electrically connected to the first terminal of capacitor C15. The second terminal of inductor L6 is electrically connected to the first terminal of diode D11, and the second terminal of diode D11 is grounded. The first terminal of capacitor C54 is electrically connected to the first terminal of diode D11, and the second terminal of capacitor C54 is grounded. The first terminal of resistor R18 is electrically connected to the first terminal of resistor R54, and the second terminal of resistor R54 is grounded. The second terminal of resistor R18 is electrically connected to the first terminal of capacitor C55 and antenna ANT2, respectively, and the second terminal of capacitor C55 is grounded.

[0008] The third onboard antenna unit includes an inductor L10, a capacitor C16, a resistor R57, an inductor L14, a capacitor C17, an inductor L8, an inductor L13, and a chip DX2. The first end of the inductor L10 is electrically connected to the first end of the capacitor C16, and the second end of the capacitor C16 is grounded. The second end of the inductor L10 is electrically connected to the first end of the resistor R57, and the second end of the resistor R57 is electrically connected to the first end of the inductor L14, which is grounded. The first end of the inductor L14 is also electrically connected to the chip DX2. The first end of the capacitor C17 is electrically connected to the first end of the inductor L8, and the second end of the capacitor C17 is grounded. The second end of the inductor L8 is electrically connected to the first end of the inductor L13, which is grounded. The first end of the inductor L13 is also electrically connected to the chip DX2.

[0009] The third onboard antenna unit further includes capacitor C22, inductor L12, diode D10, capacitor C56, resistor R19, capacitor C57, and antenna ANT1. The first end of capacitor C22 is electrically connected to chip DX2, and the second end of capacitor C22 is grounded. The first end of inductor L12 is electrically connected to the first end of capacitor C22. The second end of inductor L12 is electrically connected to the first end of diode D10, and the second end of diode D10 is grounded. The first segment of capacitor C56 is electrically connected to the first end of diode D10, and the second end of capacitor C56 is grounded. The first end of resistor R19 is electrically connected to the first end of resistor R54, and the second end of resistor R54 is grounded. The second end of resistor R19 is electrically connected to the first end of capacitor C57 and antenna ANT1, and the second end of capacitor C57 is grounded.

[0010] It also includes a light-sensing module, which is disposed on the PCB board. The light-sensing module includes an optical sensor LS1, resistors R14 and R13, diodes D18, R11, D7, R12, and D6. Resistors R14 and R13 are electrically connected to the optical sensor LS1. The first terminal of diode D18 is electrically connected to the optical sensor LS1, and the second terminal of diode D18 is grounded. The first terminal of resistor R11 is electrically connected to the optical sensor LS1, and the second terminal of resistor R11 is electrically connected to diode D7. The first terminal of resistor R12 is electrically connected to the optical sensor LS1, and the second terminal of resistor R12 is electrically connected to diode D6.

[0011] It also includes an infrared module, which is disposed on the PCB board. The infrared module includes a chip IR1, a capacitor C7 and a resistor R16. The first end of the capacitor C7 is electrically connected to the chip IR1, the second end of the capacitor C7 is grounded, and the resistor R16 is electrically connected to the chip IR1.

[0012] It also includes a lighting module, which is mounted on the PCB board. The lighting module includes a capacitor C111, a resistor R10, an LED1, a transistor Q2, a resistor R7, and a diode D8. The first terminal of the capacitor C111 is electrically connected to the first terminal of the resistor R10, and the second terminal of the capacitor C111 is grounded. The second terminal of the resistor R10 is electrically connected to the first terminal of the LED1, and the second terminal of the LED1 is electrically connected to the transistor Q2. The first terminal of the resistor R7 is electrically connected to the transistor Q2, and the second terminal of the resistor R7 is electrically connected to the first terminal of the diode D8. The second terminal of the diode D8 is grounded.

[0013] It also includes a button module, which is disposed on the PCB board. The button module includes a capacitor C112, a switch K2 and a diode D19. The first end of the capacitor C112 is electrically connected to the diode D19 and the switch K2 respectively, and the second end of the capacitor C112 is grounded.

[0014] Compared with the prior art, the present invention has at least the following advantages: This application integrates multiple onboard antenna units directly onto a single PCB board, replacing the traditional external antenna, thereby reducing the size of the WIFI module and making the smart motor thinner and lighter. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly described below.

[0016] Figure 1 This is a schematic diagram of the structure of a miniaturized WIFI module according to an embodiment of the present invention; Figure 2 This is a circuit diagram of the first onboard antenna unit of a miniaturized WIFI module in one embodiment of the present invention. Figure 3 This is a circuit diagram of the second onboard antenna unit of a miniaturized WIFI module according to an embodiment of the present invention. Figure 4 This is a circuit diagram of the third onboard antenna unit of a miniaturized WIFI module in one embodiment of the present invention. Figure 5 This is a circuit diagram of the optical sensing module of a miniaturized WIFI module according to an embodiment of the present invention. Figure 6 This is a circuit diagram of the infrared module of a miniaturized WIFI module according to an embodiment of the present invention. Figure 7 This is a circuit diagram of the lighting module of a miniaturized WIFI module according to an embodiment of the present invention. Figure 8 This is a circuit diagram of the button module of a miniaturized WIFI module according to an embodiment of the present invention. Figure 9 This is a DC-DC step-down circuit diagram of a miniaturized WIFI module according to an embodiment of the present invention. Detailed Implementation

[0017] Embodiments of this application will now be described in more detail with reference to the accompanying drawings. While embodiments of this application are shown in the drawings, it should be understood that this application may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to make this application more thorough and complete, and to fully convey the scope of this application to those skilled in the art.

[0018] It should be understood that although the terms "first," "second," "third," etc., may be used in this application to describe various information, this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0019] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0020] The technical solutions of the embodiments of this application are described in detail below with reference to the accompanying drawings.

[0021] See Figure 1 A miniaturized WIFI module includes a PCB board 100 and a transmission module 200. The transmission module includes a first onboard antenna unit 210, a second onboard antenna unit 220 and a third onboard antenna unit 230, which are respectively disposed on the PCB board 100 at intervals.

[0022] It should be noted that the first onboard antenna unit 210 is a Bluetooth antenna, while the second onboard antenna unit 220 and the third onboard antenna unit 230 are both Wi-Fi antennas. This application integrates multiple onboard antenna units directly onto a single PCB board, replacing traditional external antennas, thereby reducing the size of the Wi-Fi module and making the smart motor thinner and lighter.

[0023] See Figure 2In one embodiment, the first onboard antenna unit 210 includes a capacitor C97, an inductor L1, a capacitor C99, an inductor L3, a resistor R9, a capacitor C60, a resistor R17, a capacitor C53, and an antenna ANT3. The first terminal of capacitor C97 is electrically connected to the first terminal of inductor L1, and the second terminal of capacitor C97 is grounded. The second terminal of inductor L1 is electrically connected to the first terminal of capacitor C99, and the second terminal of capacitor C99 is grounded. The first terminal of inductor L3 is electrically connected to the first terminal of capacitor C99, and the second terminal of inductor L3 is electrically connected to the first terminal of resistor R9, and the second terminal of resistor R9 is grounded. The first terminal of capacitor C60 is electrically connected to the first terminal of inductor L3, and the second terminal of capacitor C60 is grounded. The first terminal of resistor R17 is electrically connected to the first terminal of capacitor C60, and the second terminal of resistor R17 is electrically connected to the first terminal of capacitor C53 and the antenna ANT3, respectively. The second terminal of capacitor C53 is grounded.

[0024] It should be noted that capacitor C97, inductor L1, and capacitor C99 form a π-type low-pass filter network to filter high-frequency noise interference in the RF signal. They also act as impedance matching elements, adjusting the characteristic impedance of the transmission line to be closer to the impedance of the downstream circuit, reducing signal reflection. Inductor L3 and resistor R9 form the RF grounding path. Inductor L3 is a high-frequency choke, presenting high impedance to RF signals, blocking RF signals from flowing into the ground line while allowing DC or low-frequency signals to pass through. R9 is a 0Ω resistor, equivalent to a conductor, used to stabilize the grounding path and ensure the reliability of the RF ground. Resistor R17 is a 0Ω resistor, acting as a conductor for the RF transmission line, used to adjust the physical length of the circuit layout and avoid parasitic inductance of high-frequency signals. Capacitors C60 and C53 are reserved filter capacitor pads; additional capacitors can be soldered according to the actual interference situation to further filter noise at specific frequencies. Antenna ANT3 is the RF signal transmitting / receiving antenna.

[0025] See Figure 3 In one embodiment, the second onboard antenna unit 220 includes an inductor L4, a capacitor C8, a resistor R4, an inductor L5, a capacitor C18, an inductor L7, an inductor L9, and a chip DX1. The first end of the inductor L4 is electrically connected to the first end of the capacitor C8, and the second end of the capacitor C8 is grounded. The second end of the inductor L4 is electrically connected to the first end of the resistor R4, and the second end of the resistor R4 is electrically connected to the first end of the inductor L5. The second end of the inductor L5 is grounded, and the first end of the inductor L5 is electrically connected to the chip DX1. The first end of the capacitor C18 is electrically connected to the first end of the inductor L7, and the second end of the capacitor C18 is grounded. The second end of the inductor L7 is electrically connected to the first end of the inductor L9, and the second end of the inductor L9 is grounded. The first end of the inductor L9 is also electrically connected to the chip DX1.

[0026] Specifically, the second onboard antenna unit 220 also includes capacitor C15, inductor L6, diode D11, capacitor C54, resistor R18, capacitor C55, and antenna ANT2. The first end of capacitor C15 is electrically connected to chip DX1, and the second end of capacitor C15 is grounded. The first end of inductor L6 is electrically connected to the first end of capacitor C15, and the second end of inductor L6 is electrically connected to the first end of diode D11, and the second end of diode D11 is grounded. The first end of capacitor C54 is electrically connected to the first end of diode D11, and the second end of capacitor C54 is grounded. The first end of resistor R18 is electrically connected to the first end of resistor R54, and the second end of resistor R54 is grounded. The second end of resistor R18 is electrically connected to the first end of capacitor C55 and antenna ANT2, respectively, and the second end of capacitor C55 is grounded.

[0027] It should be noted that the DX1 chip is an RF switch chip used for signal switching between the 2.4G and 5G frequency bands, enabling time-division multiplexing of dual-band signals. Inductor L4 and capacitor C8 form a bandpass filter network to filter out noise outside the 2.4G band, allowing only 2.4G signals to pass. Resistor R4 acts as the "wire" of the RF transmission line, adjusting the physical length of the circuit to ensure impedance matching of the 2.4G signal. Inductor L5 presents high impedance to the 2.4G signal, blocking signal leakage to unrelated branches and stabilizing the RF ground of the 2.4G path. Capacitor C18 and inductor L7 form a bandpass filter network to filter out noise outside the 5G band, allowing only 5G signals to pass. Inductor L9 presents high impedance to the 5G signal, blocking signal leakage and stabilizing the RF ground of the 5G path. Capacitor C15 and inductor L6 form an antenna matching network, adjusting the impedance between antenna ANT2 and the RF switch output to maximize signal transmission efficiency and reduce reflection loss. Diode D11 is an electrostatic discharge (ESD) protection device to prevent external ESD from damaging the back-end circuitry through the antenna. Capacitor C54, resistor R18, and capacitor C55 are also included. Resistor R18 is a 0Ω resistor used to adjust the physical length of the matching network. Capacitors C54 and C55 are reserved pads for filter capacitors, which can be soldered in place as needed to further optimize signal purity. Furthermore, the 2.4G signal is input from WF0_RFIO_G, and the 5G signal is input from WF0_RFIO_A, entering the corresponding frequency band's filter branch. Chip DX1 selects the 2.4G or 5G path according to control commands, directing the signal of the corresponding frequency band to the antenna side. After matching network optimization, the signal is transmitted through antenna ANT2. Simultaneously, external WiFi signals received by the antenna are also transmitted back to the WiFi module through this path, completing bidirectional communication.

[0028] See Figure 4In one embodiment, the third onboard antenna unit 230 includes an inductor L10, a capacitor C16, a resistor R57, an inductor L14, a capacitor C17, an inductor L8, an inductor L13, and a chip DX2. The first end of the inductor L10 is electrically connected to the first end of the capacitor C16, and the second end of the capacitor C16 is grounded. The second end of the inductor L10 is electrically connected to the first end of the resistor R57, and the second end of the resistor R57 is electrically connected to the first end of the inductor L14, and the second end of the inductor L14 is grounded. The first end of the inductor L14 is electrically connected to the chip DX2. The first end of the capacitor C17 is electrically connected to the first end of the inductor L8, and the second end of the capacitor C17 is grounded. The second end of the inductor L8 is electrically connected to the first end of the inductor L13, and the second end of the inductor L13 is grounded. The first end of the inductor L13 is also electrically connected to the chip DX2. Specifically, the third onboard antenna unit 230 also includes capacitor C22, inductor L12, diode D10, capacitor C56, resistor R19, capacitor C57, and antenna ANT1. The first end of capacitor C22 is electrically connected to chip DX2, and the second end of capacitor C22 is grounded. The first end of inductor L12 is electrically connected to the first end of capacitor C22. The second end of inductor L12 is electrically connected to the first end of diode D10, and the second end of diode D10 is grounded. The first segment of capacitor C56 is electrically connected to the first end of diode D10, and the second end of capacitor C56 is grounded. The first end of resistor R19 is electrically connected to the first end of resistor R54, and the second end of resistor R54 is grounded. The second end of resistor R19 is electrically connected to the first end of capacitor C57 and antenna ANT1, respectively, and the second end of capacitor C57 is grounded.

[0029] It should be noted that the DX2 chip is an RF switch chip used for signal switching between the 2.4G and 5G frequency bands, enabling time-division transmission of dual-band signals. Inductor L10 and capacitor C16 form a bandpass filter network to filter out noise outside the 2.4G band, allowing only the 2.4G signal to pass. Resistor R57 acts as the "conductor" of the RF transmission line, adjusting the physical length of the circuit to ensure impedance matching of the 2.4G signal. Inductor L14 presents high impedance to the 2.4G signal, blocking signal leakage to unrelated branches and stabilizing the RF ground of the 2.4G path. Capacitor C17 and inductor L8 form a bandpass filter network to filter out noise outside the 5G band, allowing only the 5G signal to pass. Inductor L13 is a reserved choke pad, which can be soldered on as needed based on actual interference scenarios to further optimize the purity of the 5G signal. Capacitor C22 and inductor L12 form the antenna matching network, adjusting the impedance between antenna ANT2 and the RF switch output to maximize signal transmission efficiency and reduce reflection loss. Diode D10 is an electrostatic discharge (ESD) protection device to prevent external ESD from damaging the back-end circuitry through the antenna. Capacitor C56, resistor R19, and capacitor C57 are also included. Resistor R19 is a 0Ω resistor used to adjust the physical length of the matching network. Capacitors C56 and C57 are reserved filter capacitor pads, which can be soldered in place as needed to further optimize signal purity. Furthermore, the 2.4G signal is input from WF0_RFIO_G, and the 5G signal is input from WF0_RFIO_A, entering the corresponding frequency band's filter branch. Chip DX2 selects the 2.4G or 5G path according to control instructions, directing the signal of the corresponding frequency band to the antenna side. After optimization by the matching network, the signal is transmitted through antenna ANT1. Simultaneously, external WiFi signals received by the antenna are also transmitted back to the WiFi module through this path, completing bidirectional communication.

[0030] See Figure 5 In one embodiment, the system further includes a light-sensing module disposed on a PCB board. The light-sensing module includes an optical sensor LS1, resistors R14 and R13, diode D18, resistor R11, diode D7, resistor R12, and diode D6. Resistors R14 and R13 are electrically connected to the optical sensor LS1, the first terminal of diode D18 is electrically connected to the optical sensor LS1, and the second terminal of diode D18 is grounded. The first terminal of resistor R11 is electrically connected to the optical sensor LS1, and the second terminal of resistor R11 is electrically connected to diode D7. The first terminal of resistor R12 is electrically connected to the optical sensor LS1, and the second terminal of resistor R12 is electrically connected to diode D6.

[0031] It should be noted that the optical sensor LS1 can be model JSA1146. Resistors R14 and R13 are reserved pull-down and pull-up resistors. Diode D18 provides overcurrent protection. Resistors R11 and R12 are current-limiting resistors, and diodes D7 and D6 are clamping protection devices that limit the voltage levels of the SDA and SCL lines within a safe range to prevent damage to the device from abnormal voltages such as electrostatic discharge and surges. The 3V3_STB power supply, filtered by C51, powers the JSA1146. After the sensor completes initialization and enters the working state, the TV main control chip sends commands to the JSA1146 through the SCL (clock) and SDA (data) pins of the I2C bus. The sensor then sends the detected light intensity data back to the TV main control chip through the SDA pin.

[0032] See Figure 6 In one embodiment, an infrared module is also included. The infrared module is disposed on the PCB board. The infrared module includes a chip IR1, a capacitor C7 and a resistor R16. The first end of the capacitor C7 is electrically connected to the chip IR1, the second end of the capacitor C7 is grounded, and the resistor R16 is electrically connected to the chip IR1.

[0033] It should be noted that the model number of chip IR1 can be HRM136KJ7D04H. Resistor R16 is a current-limiting resistor, and capacitor C7 is a filter capacitor. After the 3V3_STB power supply is current-limited by R16 and filtered by C7, it powers HRM136KJ7D04H, and chip IR1 initializes and enters the infrared signal receiving state.

[0034] See Figure 7 In one embodiment, the system further includes a lighting module mounted on a PCB board. The lighting module includes a capacitor C111, a resistor R10, an LED1, a transistor Q2, a resistor R7, and a diode D8. The first terminal of the capacitor C111 is electrically connected to the first terminal of the resistor R10, and the second terminal of the capacitor C111 is grounded. The second terminal of the resistor R10 is electrically connected to the first terminal of the LED1, and the second terminal of the LED1 is electrically connected to the transistor Q2. The first terminal of the resistor R7 is electrically connected to the transistor Q2, and the second terminal of the resistor R7 is electrically connected to the first terminal of the diode D8. The second terminal of the diode D8 is grounded.

[0035] It should be noted that LED1 is a light-emitting diode, transistor Q2 is the switching driver for LED1, resistor R10 is a current-limiting resistor, diode D8 is a clamping protection element, and capacitor C111 is a reserved filter capacitor. When the LED_R control signal is high, the current flows into the base of transistor Q2 after being limited by resistor R7, causing transistor Q2 to saturate and conduct. At this time, the anode of LED1 is connected to the 3V3_STB power supply through resistor R10, and the cathode is grounded through the emitter of transistor Q2, forming a complete circuit, and LED1 lights up. When the LED_R control signal is low, there is insufficient driving current at the base of transistor Q2, and transistor Q2 is cut off. The cathode of LED1 has no grounding path, the circuit is broken, and LED1 is turned off.

[0036] See Figure 8 In one embodiment, the device further includes a button module disposed on a PCB board. The button module includes a capacitor C112, a switch K2, and a diode D19. The first end of the capacitor C112 is electrically connected to the diode D19 and the switch K2, respectively, and the second end of the capacitor C112 is grounded.

[0037] It should be noted that capacitor C112 mainly serves as a filter or auxiliary debouncing element, filtering out noise interference and reducing level fluctuations during button presses through its charging and discharging characteristics. Diode D19 is a clamping protection component, preventing damage to downstream circuits from abnormally high or low voltages. Switch K2 is a push-button switch.

[0038] Further, see Figure 9 This application also includes a DC-DC buck circuit for converting 5V voltage to 3.3V voltage.

[0039] The solution of this application has been described in detail above with reference to the accompanying drawings. In the above embodiments, the descriptions of each embodiment have different focuses; for parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments. Those skilled in the art should also understand that the actions and modules involved in the specification are not necessarily essential to this application. Furthermore, it is understood that the steps in the method of this application embodiment can be adjusted, combined, and deleted according to actual needs, and the modules in the device of this application embodiment can be combined, divided, and deleted according to actual needs. The various embodiments of this application have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A miniaturized WIFI module, characterized in that, include: PCB board; The transmission module includes a first onboard antenna unit, a second onboard antenna unit, and a third onboard antenna unit, which are respectively disposed at intervals on the PCB board.

2. The miniaturized WIFI module according to claim 1, characterized in that, The first onboard antenna unit includes capacitor C97, inductor L1, capacitor C99, inductor L3, resistor R9, capacitor C60, resistor R17, capacitor C53, and antenna ANT3. The first terminal of capacitor C97 is electrically connected to the first terminal of inductor L1, and the second terminal of capacitor C97 is grounded. The second terminal of inductor L1 is electrically connected to the first terminal of capacitor C99, and the second terminal of capacitor C99 is grounded. The first terminal of inductor L3 is electrically connected to the first terminal of capacitor C99, and the second terminal of inductor L3 is electrically connected to the first terminal of resistor R9, and the second terminal of resistor R9 is grounded. The first terminal of capacitor C60 is electrically connected to the first terminal of inductor L3, and the second terminal of capacitor C60 is grounded. The first terminal of resistor R17 is electrically connected to the first terminal of capacitor C60, and the second terminal of resistor R17 is electrically connected to the first terminal of capacitor C53 and antenna ANT3, respectively, and the second terminal of capacitor C53 is grounded.

3. The miniaturized WIFI module according to claim 1, characterized in that, The second onboard antenna unit includes an inductor L4, a capacitor C8, a resistor R4, an inductor L5, a capacitor C18, an inductor L7, an inductor L9, and a chip DX1. The first end of the inductor L4 is electrically connected to the first end of the capacitor C8, and the second end of the capacitor C8 is grounded. The second end of the inductor L4 is electrically connected to the first end of the resistor R4, and the second end of the resistor R4 is electrically connected to the first end of the inductor L5, which is grounded. The first end of the inductor L5 is also electrically connected to the chip DX1. The first end of the capacitor C18 is electrically connected to the first end of the inductor L7, and the second end of the capacitor C18 is grounded. The second end of the inductor L7 is electrically connected to the first end of the inductor L9, which is grounded. The first end of the inductor L9 is also electrically connected to the chip DX1.

4. The miniaturized WIFI module according to claim 3, characterized in that, The second onboard antenna unit further includes capacitor C15, inductor L6, diode D11, capacitor C54, resistor R18, capacitor C55, and antenna ANT2. The first terminal of capacitor C15 is electrically connected to chip DX1, and the second terminal of capacitor C15 is grounded. The first terminal of inductor L6 is electrically connected to the first terminal of capacitor C15. The second terminal of inductor L6 is electrically connected to the first terminal of diode D11, and the second terminal of diode D11 is grounded. The first terminal of capacitor C54 is electrically connected to the first terminal of diode D11, and the second terminal of capacitor C54 is grounded. The first terminal of resistor R18 is electrically connected to the first terminal of resistor R54, and the second terminal of resistor R54 is grounded. The second terminal of resistor R18 is electrically connected to the first terminal of capacitor C55 and antenna ANT2, respectively, and the second terminal of capacitor C55 is grounded.

5. The miniaturized WIFI module according to claim 1, characterized in that, The third onboard antenna unit includes an inductor L10, a capacitor C16, a resistor R57, an inductor L14, a capacitor C17, an inductor L8, an inductor L13, and a chip DX2. The first end of the inductor L10 is electrically connected to the first end of the capacitor C16, and the second end of the capacitor C16 is grounded. The second end of the inductor L10 is electrically connected to the first end of the resistor R57, and the second end of the resistor R57 is electrically connected to the first end of the inductor L14, which is grounded. The first end of the inductor L14 is also electrically connected to the chip DX2. The first end of the capacitor C17 is electrically connected to the first end of the inductor L8, and the second end of the capacitor C17 is grounded. The second end of the inductor L8 is electrically connected to the first end of the inductor L13, which is grounded. The first end of the inductor L13 is also electrically connected to the chip DX2.

6. The miniaturized WIFI module according to claim 5, characterized in that, The third onboard antenna unit further includes capacitor C22, inductor L12, diode D10, capacitor C56, resistor R19, capacitor C57, and antenna ANT1. The first end of capacitor C22 is electrically connected to chip DX2, and the second end of capacitor C22 is grounded. The first end of inductor L12 is electrically connected to the first end of capacitor C22. The second end of inductor L12 is electrically connected to the first end of diode D10, and the second end of diode D10 is grounded. The first segment of capacitor C56 is electrically connected to the first end of diode D10, and the second end of capacitor C56 is grounded. The first end of resistor R19 is electrically connected to the first end of resistor R54, and the second end of resistor R54 is grounded. The second end of resistor R19 is electrically connected to the first end of capacitor C57 and antenna ANT1, and the second end of capacitor C57 is grounded.

7. The miniaturized WIFI module according to claim 1, characterized in that, It also includes a light-sensing module, which is disposed on the PCB board. The light-sensing module includes an optical sensor LS1, resistors R14 and R13, diodes D18, R11, D7, R12, and D6. Resistors R14 and R13 are electrically connected to the optical sensor LS1. The first terminal of diode D18 is electrically connected to the optical sensor LS1, and the second terminal of diode D18 is grounded. The first terminal of resistor R11 is electrically connected to the optical sensor LS1, and the second terminal of resistor R11 is electrically connected to diode D7. The first terminal of resistor R12 is electrically connected to the optical sensor LS1, and the second terminal of resistor R12 is electrically connected to diode D6.

8. The miniaturized WIFI module according to claim 1, characterized in that, It also includes an infrared module, which is disposed on the PCB board. The infrared module includes a chip IR1, a capacitor C7 and a resistor R16. The first end of the capacitor C7 is electrically connected to the chip IR1, the second end of the capacitor C7 is grounded, and the resistor R16 is electrically connected to the chip IR1.

9. The miniaturized WIFI module according to claim 1, characterized in that, It also includes a lighting module, which is mounted on the PCB board. The lighting module includes a capacitor C111, a resistor R10, an LED1, a transistor Q2, a resistor R7, and a diode D8. The first terminal of the capacitor C111 is electrically connected to the first terminal of the resistor R10, and the second terminal of the capacitor C111 is grounded. The second terminal of the resistor R10 is electrically connected to the first terminal of the LED1, and the second terminal of the LED1 is electrically connected to the transistor Q2. The first terminal of the resistor R7 is electrically connected to the transistor Q2, and the second terminal of the resistor R7 is electrically connected to the first terminal of the diode D8. The second terminal of the diode D8 is grounded.

10. The miniaturized WIFI module according to claim 1, characterized in that, It also includes a button module, which is disposed on the PCB board. The button module includes a capacitor C112, a switch K2 and a diode D19. The first end of the capacitor C112 is electrically connected to the diode D19 and the switch K2 respectively, and the second end of the capacitor C112 is grounded.

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