Circuit board processing and manufacturing method and circuit board

Abstract

The invention relates to a circuit board processing and manufacturing method and a circuit board, and the method comprises the steps: providing a circuit board with at least one stepped groove, each stepped groove at least comprises a groove top plane and a groove bottom plane, and the groove top plane is higher than the groove bottom plane; the method comprises the following steps: respectively setting a first pattern printed on a tank top, tank top printing parameters, a second pattern printed on a tank bottom and tank bottom printing parameters, respectively carrying out 3D printing on the first pattern on a tank top plane and carrying out 3D printing on the second pattern on a tank bottom plane by adopting an anti-plating material, and then electroplating a circuit pattern, at the moment, only copper and tin are plated on the circuit pattern due to the action of the anti-plating material, finally, the anti-plating material is removed and washed, and alkaline etching is carried out on the first pattern area and the second pattern area, so that the corresponding circuit pattern can be obtained on the groove top plane and the groove bottom plane; according to the circuit board processing and manufacturing method provided by the invention, the transfer of a plurality of patterns on different planes can be completed at the same time.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, and in particular to circuit board processing and manufacturing methods and circuit boards. Background Technology

[0002] With the development of electronic products, the demand for multifunctionality is increasing. To improve product performance, assembly density, and reduce weight and size, circuit board design is constantly being improved. Currently, a new processing technology for circuit boards is the stepped slot process. These circuit boards are mostly used in devices with interconnect functions. Conventional circuit board manufacturing processes cannot simultaneously print different planes of the stepped slot or complete the pattern transfer of multiple planes at the same time. Therefore, the development of new circuit board processing technologies is necessary. Summary of the Invention

[0003] Therefore, it is necessary to provide a circuit board processing and manufacturing method and circuit board to address the problem that conventional circuit board manufacturing processes cannot simultaneously complete the transfer of patterns across multiple planes.

[0004] A method for manufacturing a circuit board, the method comprising:

[0005] A circuit board is provided having at least one stepped slot, each stepped slot having at least a top surface and a bottom surface, the top surface being higher than the bottom surface.

[0006] Set the first pattern for printing on the top of the tank, the printing parameters for the top of the tank, the second pattern for printing on the bottom of the tank, and the printing parameters for the bottom of the tank. Use an anti-plating material to 3D print the first pattern on the top plane of the tank and / or 3D print the second pattern on the bottom plane of the tank. The first pattern covers the area on the top plane of the tank except for the circuit pattern, and the second pattern covers the area on the bottom plane of the tank except for the circuit pattern.

[0007] In one embodiment, the top printing parameters include at least one of a first height, a first printing temperature, and a first printing voltage;

[0008] The printing parameters for the bottom of the groove include at least one of the following: second height, second printing temperature, and second printing voltage.

[0009] Wherein, the first height is less than or equal to the second height, and / or the first printing temperature is greater than or equal to the second printing temperature, and / or the first printing voltage is less than or equal to the second printing voltage.

[0010] In one embodiment, the first height position is 1mm-1.5mm higher than the top plane of the groove, and the second height position is 1.5mm-2mm higher than the bottom plane of the groove.

[0011] In one embodiment, the first height is equal to the second height, and the first height is located 1mm-1.5mm above the top plane of the groove.

[0012] In one embodiment, the first printing temperature is 47°C-50°C, and the second printing temperature is 40°C-43°C.

[0013] In one embodiment, the first printing voltage is 5V-8V, and the second printing voltage is 5.5V-8.5V.

[0014] In one embodiment, the depth of the stepped groove is less than or equal to 2 mm.

[0015] In one embodiment, the step of providing a circuit board having at least one stepped slot includes:

[0016] The circuit board core board and the prepreg are pressed together to form a multi-layer circuit board.

[0017] Stepped grooves are machined on the circuit board using mechanical deep milling or laser ablation.

[0018] In one embodiment, the circuit board manufacturing method includes: forming microstructures on the bottom plane and / or the top plane of the slot, and metallizing the microstructures and the surface of the circuit board.

[0019] In one embodiment, the circuit board manufacturing method includes: electroplating the circuit patterns on the top and bottom planes of the slot, such that the circuit patterns on the top and bottom planes of the slot are plated with copper and tin.

[0020] In one embodiment, the circuit board manufacturing method includes: removing the anti-plating material and performing alkaline etching on the first pattern area and the second pattern area to obtain corresponding circuit patterns on the top plane and the bottom plane of the tank, respectively.

[0021] In one embodiment, the circuit board has two or more stepped slots.

[0022] A circuit board, characterized in that a stepped groove is formed on the circuit board so that the surface of the circuit board has a groove top plane and a groove bottom plane, and circuit patterns are respectively provided on the groove top plane and the groove bottom plane, and the circuit patterns are made by the circuit board processing and manufacturing method according to any one of claims 1-7.

[0023] The aforementioned circuit board manufacturing method and circuit board first form a multilayer circuit board through a lamination process, and then create stepped grooves on the multilayer circuit board. Next, a first pattern is 3D printed on the top plane of the groove and a second pattern is 3D printed on the bottom plane of the groove using an anti-plating material. Then, electroplating is performed on the circuit patterns. Due to the anti-plating material, copper and tin are plated only on the circuit patterns. Finally, the anti-plating material is removed, and alkaline etching is performed on the first and second pattern areas. This allows for the acquisition of corresponding circuit patterns on the top and bottom planes of the groove, meaning that the circuit board manufacturing method of this application can simultaneously transfer patterns from multiple different planes. Specifically, this application first forms a multilayer circuit board through a lamination process, creates stepped grooves on the multilayer circuit board, and then transfers circuit patterns on the top and bottom planes of the stepped grooves. Compared to the method of using a motherboard and daughterboard with microstructures or blind vias for alignment and lamination to create a multilayer circuit board with stepped grooves, this application avoids the misalignment defects that exist during the alignment and lamination process of the motherboard and daughterboard, improves product yield, and enhances product quality. Attached Figure Description

[0024] Figure 1 This is a flowchart of a circuit board processing and manufacturing method in one embodiment.

[0025] Figure 2 This is a schematic diagram of the structure of the laminated circuit board in one embodiment.

[0026] Figure 3 This is a schematic diagram of a circuit board with stepped grooves in one embodiment.

[0027] Figure 4 This is a schematic diagram of a circuit board with microstructures in one embodiment.

[0028] Figure 5 This is a schematic diagram of the circuit board structure after copper plating and electroplating metallization in one embodiment.

[0029] Figure 6 This is a schematic diagram of the structure of a completed circuit board in one embodiment.

[0030] Figure 7 This is a graph showing the linear variation of ink temperature with the height of the step in one embodiment.

[0031] Reference numerals: 100, circuit board; 110, stepped groove; 120, microstructure; 130, top plane of the groove; 140, bottom plane of the groove. Detailed Implementation

[0032] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0033] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0034] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0035] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0036] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0037] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0038] See Figures 1-7 An embodiment of this application provides a method for manufacturing a circuit board 100, the method comprising:

[0039] A circuit board 100 is provided having at least one stepped slot 110, each stepped slot 110 forming a slot top plane 130 and a slot bottom plane 140 on the circuit board, the slot top plane 130 being higher than the slot bottom plane 140;

[0040] Set the first pattern for printing on the top of the tank, the printing parameters for the top of the tank, the second pattern for printing on the bottom of the tank, and the printing parameters for the bottom of the tank. Use an anti-plating material to 3D print the first pattern on the top plane 130 of the tank and / or 3D print the second pattern on the bottom plane 140 of the tank. The first pattern covers the area on the top plane 130 of the tank except for the circuit pattern, and the second pattern covers the area on the bottom plane 140 of the tank except for the circuit pattern.

[0041] It should be noted that a circuit board refers to a structure used for interconnecting chips or circuit devices, including but not limited to PCB boards and ceramic circuit boards. The following explanation uses a PCB board as an example. A circuit diagram is a circuit diagram on a PCB board used for interconnecting chips or circuit devices and for leading out packaged pins. The ultimate goal of this application is to electroplate circuit diagrams on the top plane 130 and / or bottom plane 140 of the stepped groove 110. The first pattern is the area on the top plane 130 excluding the circuit pattern, and the second pattern is the area on the bottom plane 140 excluding the circuit pattern. The stepped groove 110 is a recess formed on the circuit board 100.

[0042] 3D printing includes, but is not limited to, resist printing, character printing, solder mask printing, and direct circuit forming. In this application, 3D printing refers to resist printing.

[0043] Specifically, anti-plating materials include, but are not limited to, anti-plating inks and anti-plating resins.

[0044] In this embodiment, a multilayer circuit board 100 is first formed by a lamination process, and stepped grooves are fabricated on the multilayer circuit board 100. Then, a first pattern is 3D printed on the top plane 130 of the groove and a second pattern is 3D printed on the bottom plane 140 of the groove using an anti-plating material. Next, electroplating is performed on the circuit patterns. At this time, due to the effect of the anti-plating material, copper and tin are plated only on the circuit patterns. Finally, the anti-plating material is removed, and alkaline etching is performed on the first pattern area and the second pattern area. That is, the corresponding circuit patterns can be obtained on the top plane 130 and the bottom plane 140 of the groove. In other words, the circuit board processing and manufacturing method of this application can simultaneously complete the transfer of patterns on multiple different planes.

[0045] This application first forms a multilayer circuit board 100 through a lamination process, then creates stepped grooves on the multilayer circuit board 100, and finally transfers circuit diagrams onto the top plane 130 and bottom plane 140 of the stepped grooves respectively. Compared with the method of fabricating a multilayer circuit board with stepped grooves by aligning and laminating a mother board and a daughter board with microstructures, this application can avoid defects caused by misalignment during the alignment and lamination process of the mother board and the daughter board, improve product yield, and enhance product quality.

[0046] In some embodiments, combined with Figure 4 Before printing the first and second patterns, the process further includes the step of forming microstructures 120 on the top plane 130 and / or the bottom plane 140 of the slot, respectively, and metallizing the microstructures 120 and the surface of the circuit board 100. Figure 5 This is a schematic diagram of the circuit board structure after copper plating and electroplating in one embodiment. It is understood that the microstructures include vias, blind vias, or wiring channels. The metallization of the microstructure 120 and the circuit board 100 is used to enable the circuit board 100 to conduct electricity along its thickness direction.

[0047] In some embodiments, after printing the first pattern and the second pattern, the circuit patterns on the top surface 130 and the bottom surface 140 of the tank are electroplated, so that the circuit patterns on the top surface 130 and the bottom surface 140 of the tank are plated with copper and tin, that is, circuit patterns are formed on the top surface 130 and the bottom surface 140 of the tank respectively.

[0048] In this embodiment, the printing patterns and printing parameters of the top plane 130 and the bottom plane 140 of the groove are set before 3D printing. That is, during 3D printing, the printing nozzle can print the first pattern on the top plane 130 and the second pattern on the bottom plane 140 in sequence. After printing, copper and tin can be plated on the circuit pattern on the top plane 130 and the circuit pattern on the bottom plane 140 at the same time. That is, the transfer of the two circuit patterns on the two planes can be completed at the same time, and the processing flow is short.

[0049] In some embodiments, combined with Figure 6 After electroplating the circuit patterns on the top plane 130 and bottom plane 140 of the tank, the process also includes removing the anti-plating material and performing alkaline etching on the first pattern area and the second pattern area to obtain the corresponding circuit patterns on the top plane 130 and bottom plane 140 of the tank, respectively.

[0050] In some embodiments, the top printing parameters include a first height, and the bottom printing parameters include a second height; the first height is less than the second height.

[0051] In this embodiment, the first height and the second height are the heights of the print head of the 3D printing equipment relative to the top and bottom planes of the groove, respectively. Since the top plane 130 is higher than the bottom plane 140, after printing on the top plane 130 is completed, the height of the print head is lowered to reduce the second height of the print head to a new second height, and then printing is performed on the bottom plane 140. Lowering the height of the print head helps improve the printing accuracy of the second pattern on the bottom plane 140, avoids ink splatter defects during printing, and ensures that the first and second patterns have the same or similar printing clarity.

[0052] In some embodiments, the first height position is 1mm-1.5mm higher than the top plane of the tank, and the second height position is 1.5mm-2mm higher than the bottom plane of the tank.

[0053] In this embodiment, when the height of the print head relative to the top plane 130 or the bottom plane 140 of the tank is 1mm-1.5mm, a first pattern and a second pattern with clear boundaries can be printed on the top plane 130 and the bottom plane 140, facilitating the subsequent plating of a high-precision circuit diagram on the top plane 130. Specifically, after printing on the top plane 130 is completed, the height of the print head is reduced to a new second height of 1mm-1.5mm, and then printing is performed on the bottom plane 140, thereby printing patterns with clear boundaries and consistent or similar clarity on both the top plane 130 and the bottom plane 140.

[0054] In some embodiments, when the height of the print head relative to the top plane 130 or the bottom plane 140 of the groove is 1mm-1.2mm, the printing accuracy of the first pattern or the second pattern can be further guaranteed.

[0055] In some embodiments, the printing parameters for the top of the slot further include a first printing temperature of the print head; the printing parameters for the bottom of the slot further include a second printing temperature of the print head; the first printing temperature is greater than or equal to the second printing temperature.

[0056] In this embodiment, the heights from the top plane 130 and the bottom plane 140 of the printing groove to the print head are different. Setting different printing temperatures during actual printing helps improve the printing accuracy of different printing planes. Specifically, in conjunction with... Figure 7 The printing temperature is negatively correlated with the height of the printhead. Lower printing temperatures result in higher viscosity of the resist material, meaning less ink scattering during printing; conversely, higher printhead heights lead to more ink scattering. Therefore, when printing the first pattern on the top plane 130 of the groove, the printing temperature is higher due to the smaller distance between the printhead and the top plane 130. When printing the second pattern on the bottom plane 140 of the groove, the greater distance between the printhead and the bottom plane 140 allows for a lower printing temperature and increased viscosity of the resist material to prevent ink scattering. This lower second printing temperature compared to the first is beneficial for providing similar or identical printing accuracy across different layers of the stepped groove, thus improving product quality.

[0057] In some embodiments, the first printing temperature is 47°C-50°C, and the second printing temperature is 40°C-43°C.

[0058] When the first printing temperature is 47℃-50℃, a clear first pattern can be printed on the top plane 130 of the tank, which facilitates the subsequent plating of a high-precision circuit diagram on the top plane 130 of the tank. When the second printing temperature is 40℃-43℃, a clear second pattern can be printed on the bottom plane 140 of the tank, which facilitates the subsequent plating of a high-precision circuit diagram on the bottom plane 140 of the tank.

[0059] In some embodiments, the printing parameters for the top of the slot further include a first printing voltage of the print head; the printing parameters for the bottom of the slot further include a second printing voltage of the print head; the first printing voltage is less than or equal to the second printing voltage.

[0060] In this embodiment, since the heights from the top plane 130 and the bottom plane 140 of the groove to the print head are different, setting different printing voltages during actual printing is beneficial for improving the printing accuracy of different printing planes. Specifically, the printing voltage is positively correlated with the height of the print head; the higher the printing height, the higher the voltage, and the less likely ink splattering will occur. Therefore, when printing the first pattern on the top plane 130 of the groove, the first printing voltage is lower because the distance between the print head and the top plane 130 is small. When printing the second pattern on the bottom plane 140 of the groove, the distance between the print head and the bottom plane 140 is larger, and to prevent ink splattering, the printing voltage can be increased, i.e., the second printing voltage is higher than the first printing voltage. This is beneficial for providing the same or similar printing accuracy for different layers of the stepped groove, thereby improving product quality.

[0061] In some embodiments, the first printing voltage is 5V-8V; the second printing voltage is 5.5V-8.5V.

[0062] When the first printing voltage is 5V-8V, a clear first pattern can be printed on the top plane 130 of the tank, which facilitates the subsequent plating of a high-precision circuit diagram on the top plane 130 of the tank. When the second printing voltage is 5.5V-8.5V, a clear second pattern can be printed on the bottom plane 140 of the tank, which facilitates the subsequent plating of a high-precision circuit diagram on the bottom plane 140 of the tank.

[0063] In other embodiments, when the first height position is 1mm-1.5mm higher than the top plane of the groove and the first printing voltage is 5V-8V, the pattern printing accuracy on the top plane 130 of the groove can be further improved; when the second height position is 1.5mm-2mm higher than the bottom plane of the groove and the second printing voltage is 5.5V-8.5V, the pattern printing accuracy on the bottom plane 140 of the groove can be further improved.

[0064] In other embodiments, the first height position is 1mm-1.5mm higher than the top plane of the tank, the first printing temperature is 47℃-50℃, and the first printing voltage is 5V-8V, which can further improve the quality of the first pattern and facilitate the subsequent plating of a circuit diagram with higher precision on the top plane 130 of the tank. The second height position is 1.5mm-2mm higher than the bottom plane of the tank, the second printing temperature is 40℃-43℃, and the second printing voltage is 5.5V-8.5V, which can further improve the quality of the second pattern and facilitate the subsequent plating of a circuit diagram with higher precision on the bottom plane 140 of the tank.

[0065] Alternatively, the first height position can be 1mm-1.5mm higher than the top plane of the groove, and the first printing temperature can be 47℃-50℃, which can further improve the printing accuracy of the pattern on the top plane 130 of the groove; the second height position can be 1.5mm-2mm higher than the bottom plane of the groove, and the second printing temperature can be 40℃-43℃, which can further improve the printing accuracy of the pattern on the bottom plane 140 of the groove.

[0066] Alternatively, the first printing temperature is 47℃-50℃, and the first printing voltage is 5V-8V, which can further improve the printing accuracy of the pattern on the top plane 130 of the groove; the second printing temperature is 40℃-43℃, and the second printing voltage is 5.5V-8.5V, which can further improve the printing accuracy of the pattern on the bottom plane 140 of the groove.

[0067] Through the above description of the embodiments, it can be understood that the inventors of the present invention have discovered that when creating circuit diagrams for different layers of a stepped groove on a circuit board, by setting a first printing parameter and / or a second printing parameter, i.e., adjusting at least one set of parameters among the first and second heights of the printing nozzle during 3D printing, the first printing temperature and the second printing temperature, the first printing voltage and the second printing voltage, it is beneficial to provide the same or similar printing accuracy for different layers of the stepped groove, which facilitates the formation of higher accuracy circuit diagrams on the top and bottom planes of the groove, thereby improving product quality.

[0068] In some embodiments, the depth of the stepped groove 110 is less than or equal to 2 mm.

[0069] In this embodiment, the smaller the depth of the stepped groove 110, the better it is to ensure the quality of the second pattern on the bottom plane 140 of the groove. Here, the maximum depth of the stepped groove 110 is limited to 2mm, which can ensure the quality of the second pattern on the bottom plane 140 of the groove.

[0070] Specifically, the depth of the stepped groove 110 is less than or equal to 1.8 mm, which can further ensure the quality of the second pattern on the bottom plane 140 of the groove.

[0071] In some embodiments, the step of providing the circuit board 100 having the stepped groove 110 includes: combining Figure 2 The circuit board core board and the prepreg are pressed together to form a complete multilayer circuit board 100; combined with Figure 3 The stepped groove 110 is machined on the circuit board 100 by mechanical deep milling or laser ablation.

[0072] In this embodiment, the circuit board core board and the prepreg are directly pressed together to form a complete multilayer circuit board 100, and then slots are made on the circuit board 100. Compared with the method of first slotting some of the sub-boards and mother boards separately, and then aligning and pressing multiple sub-boards and mother boards together to make a circuit board with a slotted structure, the slotting method of this application is simple, time-saving, and will not cause misalignment after pressing, which is beneficial to improving product quality.

[0073] When the product structure limits the circuit board to an irregular shape, such as a protruding part, a stepped groove 110 that matches the protruding part needs to be made on the circuit board 100. At the same time, circuit patterns need to be set on the top plane 130 and the bottom plane 140 of the groove.

[0074] Specifically, the steps of providing a circuit board having at least one stepped slot include:

[0075] The circuit board core board and the prepreg are pressed together to form a multilayer circuit board 100;

[0076] Slots are cut into the multilayer circuit board, and the bottom of the slots is cleaned to remove debris. Specifically, the slotting methods include, but are not limited to, controlled depth milling or laser ablation.

[0077] Remove the adhesive generated during the grooving process; specific adhesive removal methods include, but are not limited to, chemical adhesive removal methods.

[0078] Using the top plane 130 of the tank as a reference plane, microstructure 120 is fabricated on the top plane 130 of the tank, and / or, using the bottom plane 140 of the tank as a reference plane, microstructure 120 is fabricated on the bottom plane 140 of the tank.

[0079] After the microstructure is formed, the circuit board is subjected to copper plating and full-board electroplating to metallize the surface of the microstructure 120 and the circuit board 100. Metallization is used to make the top and bottom areas of the trench conductive along the thickness direction of the circuit board 100.

[0080] On a 3D printing device, a first pattern for printing on the top of the tank, printing parameters for the top of the tank, a second pattern for printing on the bottom of the tank, and printing parameters for the bottom of the tank are set respectively. An anti-plating material is used to 3D print the first pattern on the top plane 130 of the tank and / or to 3D print the second pattern on the bottom plane 140 of the tank. The first pattern covers the area on the top plane 130 of the tank except for the circuit pattern, and the second pattern covers the area on the bottom plane 140 of the tank except for the circuit pattern.

[0081] The first and second patterns are cured; specifically, the curing method includes at least one of UV light curing and thermal curing.

[0082] Electroplating of the circuit pattern is performed on the circuit board 100, so that the final circuit pattern is plated with copper and tin.

[0083] The printed ink is removed by soaking and rinsing with a removal solution;

[0084] Remove the copper surface on the first pattern area and the second pattern area to obtain the corresponding circuit patterns on the top plane 130 and the bottom plane 140 of the trench, respectively. Specifically, the method of removing the copper surface includes, but is not limited to, using alkaline etching to remove the copper surface.

[0085] In this application, the board surface is first plated with copper to achieve metallization, and then the pattern is printed. This can avoid the ink being corroded by the strong alkaline high-temperature solution (usually KMnO4 or NaMnO4 solution) in the copper plating process, thereby preventing the pattern from being damaged.

[0086] This application uses ink printing, which can replace the complex process of first applying film, then exposing, and finally developing in the circuit board processing of related technologies. This simplifies the processing flow, reduces equipment and the space occupied by the equipment, saves manpower and resources, and improves the degree of automation in the processing.

[0087] It should be noted that multiple stepped grooves 110 can be formed on the circuit board 100, thereby creating multiple groove bottom planes 140 on the circuit board 100. The depths of the different stepped grooves 110 can be the same or different. When there are multiple stepped grooves 110, it is only necessary to upload all the patterns before 3D printing and set different printing parameters according to the height of each groove top plane and groove bottom plane relative to the printing nozzle; other steps remain unchanged. That is, the method of this application can realize the processing of multiple different planes and various circuit patterns on the circuit board 100.

[0088] An embodiment of this application also provides a circuit board 100, on which a stepped groove 110 is formed, so that the surface of the circuit board 100 has a groove top plane 130 and a groove bottom plane 140, and circuit patterns are respectively provided on the groove top plane 130 and the groove bottom plane 140, and the circuit patterns are made by the above-described circuit board 100 processing and manufacturing method.

[0089] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0090] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for manufacturing a circuit board, characterized in that, The circuit board processing and manufacturing method includes: A circuit board is provided having at least one stepped slot, each stepped slot having at least a top surface and a bottom surface, the top surface being higher than the bottom surface. Set the first pattern for printing on the top of the tank, the printing parameters for the top of the tank, the second pattern for printing on the bottom of the tank, and the printing parameters for the bottom of the tank. Use an anti-plating material to 3D print the first pattern on the top plane of the tank and / or 3D print the second pattern on the bottom plane of the tank. The first pattern covers the area on the top plane of the tank except for the circuit pattern, and the second pattern covers the area on the bottom plane of the tank except for the circuit pattern.

2. The circuit board processing and manufacturing method according to claim 1, characterized in that, The printing parameters for the top of the groove include at least one of a first height, a first printing temperature, and a first printing voltage; The printing parameters for the bottom of the groove include at least one of the following: second height, second printing temperature, and second printing voltage. Wherein, the first height is less than or equal to the second height, and / or the first printing temperature is greater than or equal to the second printing temperature, and / or the first printing voltage is less than or equal to the second printing voltage.

3. The circuit board processing and manufacturing method according to claim 2, characterized in that, The first height position is 1mm-1.5mm higher than the top plane of the tank, and the second height position is 1.5mm-2mm higher than the bottom plane of the tank.

4. The circuit board processing and manufacturing method according to claim 2, characterized in that, The first height is equal to the second height, and the position of the first height is 1mm-1.5mm higher than the top plane of the groove.

5. The circuit board processing and manufacturing method according to claim 2, characterized in that, The first printing temperature is 47℃-50℃, and the second printing temperature is 40℃-43℃.

6. The circuit board processing and manufacturing method according to claim 2, characterized in that, The first printing voltage is 5V-8V, and the second printing voltage is 5.5V-8.5V.

7. The circuit board processing and manufacturing method according to claim 1, characterized in that, The depth of the stepped groove is less than or equal to 2 mm.

8. The circuit board processing and manufacturing method according to claim 1, characterized in that, The step of providing a circuit board having at least one stepped slot includes: The circuit board core board and the prepreg are pressed together to form a multi-layer circuit board. Stepped grooves are machined on the circuit board, and the machining methods for the stepped grooves include mechanical controlled deep milling or laser ablation.

9. The circuit board processing and manufacturing method according to claim 1, characterized in that, The circuit board processing and manufacturing method includes: forming microstructures on the bottom plane and / or the top plane of the slot, and metallizing the microstructures and the surface of the circuit board.

10. The circuit board processing and manufacturing method according to claim 1, characterized in that, The circuit board manufacturing method includes: electroplating the circuit patterns on the top plane and the bottom plane of the slot, so that the circuit patterns on the top plane and the bottom plane of the slot are plated with copper and tin.

11. The circuit board processing and manufacturing method according to claim 1, characterized in that, The circuit board manufacturing method includes: removing the anti-plating material and performing alkaline etching on the first pattern area and the second pattern area to obtain corresponding circuit patterns on the top plane and the bottom plane of the tank, respectively.

12. The circuit board processing and manufacturing method according to claim 1, characterized in that, The circuit board has two or more stepped slots.

13. A circuit board, characterized in that, The circuit board has stepped grooves so that the surface of the circuit board has a groove top plane and a groove bottom plane. Circuit patterns are respectively provided on the groove top plane and the groove bottom plane. The circuit patterns are made by the circuit board processing and manufacturing method according to any one of claims 1-12.

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