High-power water-cooling power supply applied to film and television photography illumination

Abstract

The invention discloses a high-power water-cooling power supply applied to film and television photography illumination. The high-power water-cooling power supply comprises a main shell, an upper cover plate, a bottom cover plate, a PCBA mainboard module, a PFC module, a water-cooling flow channel, heat dissipation fins, a water inlet, a water outlet and a fluid connector. The main shell is integrally formed through a die-casting process, two adjacent cavities are formed in the main shell, the first cavity is used for placing and fixing the hardware module, and the second cavity is a water-cooling flow channel cavity. The water cooling flow channel is arranged in the second cavity, a plurality of first heat dissipation fins are arranged in the water cooling flow channel, and the first heat dissipation fins and the main shell are integrally formed through a die-casting technology. The bottom cover plate is fixed to the bottom of the main shell in a sealed mode in a friction welding mode, and the bottom cover plate and the main shell jointly define a sealed water cooling flow channel. Thus, through the design of a multi-cavity structure integrally formed through die casting, a hardware module cavity is physically isolated from a water-cooling flow channel cavity, the design targets of high power density, efficient heat dissipation, small size and light weight are achieved, and the multi-cavity structure is suitable for film and television shooting scenes.

Description

Technical Field

[0001] This application relates to the field of film and television photography lighting technology, and in particular to a high-power water-cooled power supply for use in film and television photography lighting. Background Technology

[0002] Currently, in the field of film and television lighting, the power supply is usually included in the product's lighting control system. This results in a corresponding increase in the size of the entire product's lighting control system, and the weight cannot be reduced, making it inconvenient for consumers to carry. This presents the following technical problems: 1. Outdated heat dissipation methods: Traditional power supplies mainly use natural convection or air cooling solutions, which have low heat dissipation efficiency and cannot meet the design requirements of high power density. In addition, air cooling solutions also have the problem of high noise, which affects the recording quality on the shooting site.

[0003] 2. Low power density: Due to limited heat dissipation capacity, the power density of existing power supply products is generally around 0.75W / m², which is difficult to improve further.

[0004] 3. Limitations of existing solutions: Although water-cooling solutions exist in the market, traditional water-cooled power supplies require separate water-cooling radiator components connected by water-cooling pipes, which increases the complexity, size and cost of the system.

[0005] 4. Structural and process limitations: Traditional aluminum extrusion profile forming processes must maintain a cross-sectional shape extending in the same direction, which cannot realize complex multi-cavity functional area structures and limits the innovative design of products.

[0006] Therefore, designing a power supply product with high power density and small size has become an urgent problem to be solved. Summary of the Invention

[0007] This application provides a high-power water-cooled power supply for film and television photography lighting, addressing the technical problems of existing high-power power supplies such as large size, heavy weight, low heat dissipation efficiency, and low power density, thereby achieving the technical goals of high power density, small size, light weight, and efficient heat dissipation. The specific technical solution of this application is as follows: A high-power water-cooled power supply for film and television photography lighting includes: The power supply housing is integrally formed by die casting and has a first cavity and a second cavity inside. The first cavity is used to place and fix the hardware module, and the second cavity is provided with water cooling channels. The first cavity and the second cavity are separated by the main housing material. The hardware module, located in the first cavity, includes a printed circuit board assembly (PCBA) mainboard module and a power factor correction (PFC) module. The PCBA mainboard module is fixed on a screw post located inside the main housing. A thermally conductive silicone pad is placed at the bottom of the PCBA mainboard module to conduct heat to the bottom water-cooling channel. A water-cooled flow channel is set in the second cavity. The water-cooled flow channel is designed vertically along the high-temperature device of the hardware module. The flow channel has a tubular cross-section and a smooth inner wall surface, which can reduce the resistance of fluid flow and reduce energy loss. The first heat dissipation fins are evenly distributed in the water cooling channel. The first heat dissipation fins are integrally formed with the power supply housing by die casting. The fins have a trapezoidal structure, which is narrow at the top and wide at the bottom, and has a draft angle of 1-3°. The first heat dissipation fins have a uniform height and are spaced apart from each other. The length of the fins is adjusted according to the position of high-temperature components in the hardware module and the smoothness of fluid flow. A fluid connector, located on the same side of the power supply housing, includes an inlet and an outlet for connecting a water pump and a water tank to form a water-cooled circulation system. The inlet is a coolant inlet with a lower temperature, and the outlet is a coolant outlet with a higher temperature after absorbing heat from the PCBA motherboard module and PFC module.

[0008] Furthermore, the first heat dissipation fin has a height of 18mm, a width of 3mm, a spacing of 5-8mm, and a length of 15-25mm; at the bends in the flow channel, the fin spacing and length are adjusted accordingly based on the smoothness of fluid flow; the first heat dissipation fin increases the contact area of ​​the fluid medium, enabling more efficient heat conduction.

[0009] Furthermore, the power supply casing itself can act as a radiator to exchange heat with the air, reducing or eliminating the need for a separate water-cooling radiator component; a second heat dissipation fin can be added to the surface of the power supply casing according to heat dissipation requirements to improve the heat exchange efficiency with the air; when set up separately, a second heat dissipation fin can be added to the surface of the casing to achieve a certain degree of heat exchange between the radiator component and the air, reducing the use of radiator components.

[0010] Furthermore, the first cavity is provided with a separate inner cavity partition space for installing the PFC module. The PFC module is installed in an inverted manner, with the printed circuit board (PCB) side facing upwards and the plug side facing downwards, and is placed in the inner cavity partition space. Heat conduction and fixation are achieved by filling with potting compound. Since the water cooling channel is at the bottom of the main housing, the inverted installation of the PFC module device with the plug side facing downwards is conducive to efficient heat conduction to the water cooling channel at the bottom of the main housing for heat exchange.

[0011] Furthermore, the power supply housing includes a main housing, an upper cover, and a bottom cover. The main housing is formed by die casting and has a space for installing the PCBA motherboard module and PFC module at the top vertically. A water-cooling channel is provided at the bottom of the main housing. The bottom cover is made of aluminum, but the forming process is different. The shape of the bottom cover matches the water-cooling channel at the bottom of the main housing. The main housing has a recessed groove for installing the bottom cover, which is placed flat and flush. The bottom cover is welded to the main housing using friction welding technology to form a sealed water-cooling channel. After the friction welding process is completed, the welded water-cooling channel is inspected by X-ray and the airtightness is tested to ensure that the water-cooling channel is sealed and free of impurities.

[0012] Furthermore, the top cover is fixed to the top of the main housing with screws, and the main housing is provided with corresponding screw posts; in order to achieve better waterproof performance, a groove is provided on the inner side of the top cover, and a sealing silicone rubber ring is installed in the groove; when the cover is installed and fixed to the main housing, the screw torque squeezes the sealing ring to deform and fill the gap to achieve a sealing effect, which can prevent liquid from entering the power supply and causing short circuit problems, achieving an IP67 protection level.

[0013] Furthermore, the power supply can be integrated into the main light control system and connected to the water pump and water tank inside the main light control system via water cooling pipes; the water pump and water tank can be set up separately or integrated into the main light control system; if the power supply is set in the main light control system, the second heat dissipation fins on the surface of the outer shell can be retained, reduced or reduced, and heat exchange can be carried out through contact conduction between the power supply and the main light control system, thereby reducing the use of radiator components.

[0014] Furthermore, the fluid connector uses a 1 / 4-inch pagoda-type connector with a fluid flow rate of 5.5-6 L / min, offering cost-effectiveness; one end of the water-cooling pipe is installed on the pagoda connector, and the other end is installed in the water pump and water tank.

[0015] Furthermore, the power supply casing has mounting through holes at both ends for installing IP67 waterproof cable fixing heads; AC lines (i.e., AC lines), DC lines (i.e., DC lines) or communication lines are led out from both ends through the waterproof cable fixing heads to ensure that the overall protection level reaches IP67.

[0016] Furthermore, the main housing has protruding mounting brackets on both sides, with through holes for fixing the entire power supply product, such as when it is installed in a light control system.

[0017] Furthermore, the internal cavity of the power supply is filled with thermally conductive silicone to form a thermally conductive structure. Thermally conductive silicone has good thermal conductivity and insulation properties, which can improve heat dissipation efficiency in daily environments and can also serve as a heat transfer medium between the water-cooling structure and the PCB board, thereby improving the efficiency of water cooling.

[0018] It should be noted that, in the absence of conflict, the features in the above-described multiple embodiments can be combined with each other, and any combination of features in different embodiments is also within the scope of protection of this application. In other words, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0019] Through the aforementioned innovative design, this application achieves the design goals of high power density, small size, and light weight. Compared with existing technologies, this application has the following beneficial effects: 1. Multi-cavity integrated molding structure: The solution of this application realizes the multi-cavity integrated molding of the power supply shell through die casting process, including hardware module cavity and water cooling channel cavity, realizing a complex internal structure design.

[0020] 2. High-efficiency water-cooling solution: This application applies water-cooling technology to the power supply casing, differing from the natural convection and air cooling commonly used in power supplies in the film and television lighting market. It adopts a water-cooling solution with significantly higher heat dissipation efficiency. Water-cooling is far more efficient than traditional methods, meeting the requirements of high power density designs. Furthermore, the noise from the water pump in the water-cooling component is lower than that of the fan in air-cooling solutions, ensuring no impact on recording quality during filming.

[0021] 3. Reduced cooling radiator components: The proposed solution uses an integrated aluminum power supply casing, which enables heat exchange between the internal coolant and air. The power supply does not require a separate water-cooled radiator component, simplifying the system structure, reducing costs, and decreasing size.

[0022] 4. Increased Power Density: Based on ample thermal redundancy, this application's solution enables the design of higher-density driver power supply hardware modules, further reducing size. Compared to the customer's existing power supply with a power density of 0.75W / m², the new hardware module achieves 1.0W / m², an improvement of 33%. Through the product's efficient water-cooling design, the heat dissipation section has more redundancy, meeting various product performance indicators and ensuring product efficiency, lifespan, and stability.

[0023] 5. Optimized Flow Channel Design: The flow channel design in this application is based on the location of high-temperature components in the hardware module, resulting in a tubular cross-section after sealing. The tubular flow channel has a relatively small cross-sectional area, leading to a faster fluid velocity under the same pump power compared to a box-type flow channel with a larger cross-sectional area. The fluid is accelerated by the narrow tubular flow channel, passing through the heat dissipation fins and being diverted on both sides, but then steadily converges and propels under pump pressure. The fluid movement exhibits a certain regularity, more closely resembling laminar flow. Simultaneously, the smooth inner wall surface of the flow channel reduces fluid flow resistance, minimizes energy loss, and allows the pump to convert more power into effective flow.

[0024] 6. Fin Design: This application incorporates raised fins inside the flow channel, increasing the heat dissipation area and facilitating rapid heat absorption and conduction by the fluid. Simultaneously, it reduces the formation of localized vortices at flow channel corners due to abrupt changes in direction, which can decrease fluid velocity and consequently reduce heat exchange efficiency. The fins can also be integrally molded with the outer shell using a die-casting process to further enhance heat transfer efficiency.

[0025] 7. Inverted PFC Module Design: The solution in this application forms a separate module for the PFC device integrated in the PCBA motherboard module, and inverts the plug-in side with the larger heat generation towards the bottom water cooling channel, which is more conducive to heat dissipation of the PFC module and improves the heat dissipation efficiency of the PFC module.

[0026] 8. Sealed and waterproof design: The solution in this application adopts friction welding technology to seal the bottom cover, the top cover is sealed with a sealing silicone rubber ring, and the cable interface adopts IP67 waterproof cable fixing head. The overall protection level reaches IP67, which can meet the needs of film and television photography and outdoor shooting.

[0027] 9. Highly Adaptable Heat Dissipation Modes: This application provides flexible combinations of multiple heat dissipation modes. The power supply casing itself can act as a radiator for heat exchange with the air; heat dissipation fins can be added to the casing surface to improve heat dissipation efficiency; it can be integrated into the main light control system for system-wide heat dissipation; or it can be connected to an independent water pump and water tank system. In this way, the power supply can adapt to different application scenarios and heat dissipation requirements. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a bottom view schematic diagram of a high-power water-cooled power supply provided in an embodiment of this application; Figure 2 This is an exploded bottom view of a high-power water-cooled power supply provided in an embodiment of this application; Figure 3 This is a top view schematic diagram of a high-power water-cooled power supply provided in an embodiment of this application; Figure 4 This is a top-view exploded view of a high-power water-cooled power supply provided in an embodiment of this application; Figure 5 This is a cross-sectional schematic diagram of a high-power water-cooled power supply provided in an embodiment of this application; Figure 6 This is a schematic diagram of the connection structure between a water pump and a water tank provided in an embodiment of this application; Figure 7 This is a schematic diagram of a high-power water-cooled power supply housing provided in an embodiment of this application; Figure 8 This is a schematic diagram of a light-controlling body provided in an embodiment of this application; Figure 9 This is a schematic diagram of a water-cooling flow channel in a high-power water-cooled power supply provided in an embodiment of this application; Figure 10 This is a schematic diagram of the bottom cover plate of a high-power water-cooled power supply provided in an embodiment of this application; Figure 11 This is a schematic diagram of the first cavity in a high-power water-cooled power supply provided in an embodiment of this application; Figure 12 This is a top view schematic diagram of another high-power water-cooled power supply provided in the embodiments of this application; Figure 13 This is a schematic diagram of a hardware module in a high-power water-cooled power supply provided in an embodiment of this application.

[0030] Explanation of reference numerals in the attached drawings: 1-Main housing; 101-First cavity; 102-Second cavity; 2-Upper cover plate; 201-Groove; 3-Bottom cover plate; 301-Recessed groove; 4-PCBA mainboard module; 5-PFC module; 6-Water cooling channel; 701-First heat dissipation fin; 702-Second heat dissipation fin; 8-Water inlet; 9-Water outlet; 10-Fluid connector; 11-Screw post; 12-Thermal conductive silicone pad; 13-Sealing silicone rubber ring; 14-Waterproof cable fixing head; 1401-Mounting through hole; 15-Mounting bracket; 16-Inner cavity partition space; 17-Light control body; 18-Water cooling pipe; 19-Water pump; 20-Water tank. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0032] Example 1: Basic structure example.

[0033] See Figures 1 to 6 , Figure 1 This is a bottom view schematic diagram of a high-power water-cooled power supply provided in an embodiment of this application; Figure 2 This is an exploded bottom view diagram of a high-power water-cooled power supply provided in an embodiment of this application, which can be derived from... Figure 1 The high-power water-cooled power supply shown is obtained by disassembly. Figure 3 This is a top view schematic diagram of a high-power water-cooled power supply provided in an embodiment of this application; Figure 4 This is a top-view exploded view of a high-power water-cooled power supply provided in an embodiment of this application, which can be derived from... Figure 3The high-power water-cooled power supply shown is obtained through disassembly. Figure 5 This is a cross-sectional schematic diagram of a high-power water-cooled power supply provided in an embodiment of this application; Figure 6 This is a schematic diagram of the connection structure between a water pump and a water tank provided in an embodiment of this application.

[0034] like Figures 1 to 6 As shown in the figure, this application embodiment provides a high-power water-cooled power supply for film and television photography lighting, including the following components: 1. Power supply housing assembly: The power supply housing assembly includes a main housing 1, an upper cover 2, and a bottom cover 3. The main housing 1 is integrally formed by die casting and is made of aluminum alloy, which has good thermal conductivity and mechanical strength.

[0035] A first cavity 101 is designed vertically above the main housing 1 for mounting the printed circuit board assembly (PCBA) mainboard module 4 and the power factor correction (PFC) module 5. A second cavity 102 is provided at the bottom of the main housing 1, forming a water-cooling channel 6. The adjacent area of ​​the first cavity 101 and the second cavity 102 is filled and isolated by the main housing material to form a physical barrier, ensuring that the coolant does not leak into the hardware module area.

[0036] A number of screw posts 11 are provided in the first cavity 101 above the main housing 1. The screw posts 11 are integrally formed with the main housing 1 by die casting process and are used to fix the PCBA motherboard module 4.

[0037] A separate inner cavity partition space 16 is also provided in the first cavity 101 above the main housing 1. This space is specifically used for installing the PFC module 5. The dimensions of the inner cavity partition space 16 are designed according to the shape of the PFC module 5 to ensure that the PFC module 5 can fit tightly and facilitate the filling of potting compound.

[0038] The bottom of the main housing 1 has a recessed groove 301 for installing the bottom cover plate 3. The depth of the groove matches the thickness of the bottom cover plate 3, ensuring that the bottom cover plate 3 is flat and flush with the bottom surface of the main housing 1 after installation, without affecting the overall appearance and installation.

[0039] The main housing 1 has protruding mounting brackets 15 on both sides, and the mounting brackets 15 have through holes for bolt fixing. The mounting brackets 15 are used to fix the entire power supply product to the light control system or other supporting structure.

[0040] The main housing 1 has mounting through holes 1401 at both ends. The diameter of the mounting through holes 1401 is determined according to the specifications of the selected waterproof cable fixing head 14. Threads can be provided at the mounting through holes 1401 to facilitate the installation of the waterproof cable fixing head 14.

[0041] 2. Bottom cover plate 3 and friction welding: The bottom cover plate 3 is made of aluminum sheet by stamping. The shape of the bottom cover plate 3 matches the opening shape of the water cooling channel 6 at the bottom of the main housing 1 to ensure the sealing effect.

[0042] The bottom cover plate 3 is welded and sealed to the main shell 1 using friction welding technology. During the friction welding process, the stirring head is inserted into the workpiece joint, and the material is softened by friction and plastic deformation heat. The stirring head moves along the welding direction, causing the temperature of the welding area to rise to the point that the material's deformation resistance decreases, plasticity increases, and the oxide film at the interface breaks down. At the same time, under the pressure applied by the stirring shoulder, the material undergoes plastic deformation and flow, and welding is achieved through molecular diffusion and recrystallization at the interface.

[0043] After the friction welding process is completed, the welded water cooling channel 6 is first inspected by X-ray to check for welding defects, cracks or impurities; then an airtightness test is performed to ensure that the water cooling channel 6 is sealed and leak-free.

[0044] 3. Top cover plate 2 and sealing structure: The top cover plate 2 is made of aluminum plate or aluminum alloy plate, and a groove 201 is provided on the inner side. A sealing silicone rubber ring 13 is installed in the groove 201. The sealing silicone rubber ring 13 is made of silicone rubber or fluororubber and has good elasticity and sealing performance.

[0045] The top cover 2 is fixed to the top of the main housing 1 by screws. When the top cover 2 is installed and fixed to the main housing 1, the screw torque squeezes the sealing silicone rubber ring 13 to deform and fill the gap, achieving a reliable sealing effect. This can prevent liquid from entering the power supply and causing short circuit problems, achieving an IP67 protection level.

[0046] 4. Hardware Modules: PCBA motherboard module 4 is fixed to screw posts 11 inside the main housing 1. A thermally conductive silicone pad 12 is placed at the bottom of PCBA motherboard module 4 to conduct heat to the bottom water-cooling channel 6. The thermally conductive silicone pad 12 has good thermal conductivity and insulation properties, ensuring efficient heat conduction while preventing electrical short circuits.

[0047] PFC module 5 is installed in an inverted manner, with the printed circuit board (PCB) side facing upwards and the plug-in side facing downwards, inside the inner cavity partition space 16. The main heat-generating components of PFC module 5 (such as metal-oxide-semiconductor field-effect transistors (MOSFETs), diodes, inductors, etc.) are located on the plug-in side. The inverted installation brings these heat-generating components closer to the bottom water-cooling channel 6, which is beneficial for rapid heat conduction.

[0048] After the PFC module 5 is placed into the inner cavity partition space 16, it is filled with potting compound for fixation and thermal conductivity. The potting compound includes thermally conductive epoxy resin or silicone, which has moderate hardness after curing and can play a role in fixation and efficient heat conduction. The amount of potting compound filled is determined according to the volume of the inner cavity partition space 16 to ensure that the PFC module 5 is completely surrounded by potting compound without air bubbles or gaps.

[0049] 5. Water cooling channel 6 and first heat dissipation fin 701: The water-cooling channel 6 is located in the second cavity 102 at the bottom of the main housing 1. The channel's direction is customized according to the location of high-temperature components in the PCBA motherboard module 4 and PFC module 5. The channel starts at the inlet 8 and ends at the outlet 9, passing under all the main heat-generating components to ensure that heat can be efficiently carried away by the coolant.

[0050] Unlike box-shaped or cuboid flow channels, the water-cooled flow channel 6 has a tubular cross-section, which can be circular, elliptical, or trapezoidal. In this embodiment, the flow channel cross-section is trapezoidal. Compared to box-shaped flow channels, tubular flow channels have a smaller cross-sectional area, resulting in faster fluid velocity, closer to laminar flow, and higher heat exchange efficiency under the same pump power.

[0051] The inner wall of the water-cooled flow channel 6 is smooth, which reduces the resistance to fluid flow, reduces energy loss, and allows the water pump to convert more power into effective flow.

[0052] A number of first heat dissipation fins 701 are evenly distributed in the water cooling channel 6. The first heat dissipation fins 701 are integrally formed with the main shell 1 by die casting process. They have a trapezoidal structure that is narrow at the top and wide at the bottom, and have a draft angle of 1-3° to facilitate demolding of the die casting mold.

[0053] In this embodiment, the specific dimensions of the first heat dissipation fin 701 are set as follows: height 18mm, upper width 3mm, lower width 4-5mm (considering draft angle), and length 15-25mm. The spacing between multiple first heat dissipation fins 701 is set to 5-8mm to ensure smooth fluid flow and prevent the formation of dead zones.

[0054] The number and layout of the first heat dissipation fins 701 are determined based on the flow channel length and the distribution of heat-generating devices. In areas with high heat generation, the first heat dissipation fins 701 are arranged more densely and are longer; at bends in the flow channel, the spacing between the first heat dissipation fins 701 is appropriately increased and the length is appropriately shortened to avoid obstructing fluid flow.

[0055] The functions of the first heat dissipation fin 701 include: increasing the heat dissipation area and improving heat exchange efficiency; guiding fluid flow, reducing eddies at the corners of the flow channel, making the fluid movement more regular and closer to laminar flow, and improving heat dissipation efficiency; and enhancing structural strength to prevent the flow channel from deforming under water pressure.

[0056] 6. Fluid connector 10 and water cooling system: The fluid connector 10 is located on the same side of the main housing 1, specifically at the inlet 8 and the outlet 9. The fluid connector 10 is a 1 / 4-inch pagoda-type connector, made of brass or stainless steel, with a nickel-plated surface, providing excellent corrosion resistance.

[0057] Inlet 8 connects to the beginning of water-cooled channel 6 and is used to introduce cooler coolant. Outlet 9 connects to the end of water-cooled channel 6 and is used to discharge coolant that has absorbed heat and is now at a higher temperature.

[0058] One end of the water-cooling pipe 18 is installed on the pagoda connector and secured with clamps or hose clamps to ensure a firm connection that will not come loose or leak. The other end of the water-cooling pipe 18 is connected to the water pump 19 and the water tank 20, forming a closed water-cooling circulation system.

[0059] The coolant can be deionized water, antifreeze, or a special coolant, and has good thermal conductivity and corrosion resistance. The coolant flow rate is controlled at 5.5-6 L / min to ensure sufficient heat exchange without generating excessive flow noise.

[0060] The water pump 19 can be a DC brushless water pump, and the water tank 20 is made of plastic or stainless steel. It can be equipped with heat dissipation fins or a radiator for heat exchange between the coolant and the air.

[0061] 7. Waterproof cable fixing head 14: The waterproof cable fixing head 14 is installed at the through holes at both ends of the main housing 1, with a protection rating of IP67. The waterproof cable fixing head 14 includes components such as fixing nuts, sealing rings, and clamping parts, which can reliably fix the cable and provide a good waterproof sealing effect.

[0062] The AC line is led out from the waterproof cable fixing head 14 at one end and connected to an external AC power source. The voltage range is typically 100-240V, and the frequency is 50Hz or 60Hz. The DC line is led out from the waterproof cable fixing head 14 at the other end and connected to the main light control fixture (such as an LED light fixture). The output voltage is determined according to the requirements of the light fixture and is typically 24V, 36V, or 48V.

[0063] The communication line can also be led out from the waterproof cable fixing head 14 for communication with the light control body 17 or other control equipment.

[0064] Example 2: A second heat dissipation fin 702 is added to the surface of the outer casing.

[0065] Figure 7 This is a schematic diagram of a high-power water-cooled power supply housing provided in an embodiment of this application. Figure 7 As shown, based on Embodiment 1, this embodiment can add a second heat dissipation fin 702 to the outer surface of the main housing 1 to further improve heat dissipation efficiency.

[0066] The second heat dissipation fin 702 can be integrally formed with the main housing 1 by die casting, or it can be made separately from aluminum extrusion profile and then fixed to the outer surface of the main housing 1 by thermally conductive adhesive or bolts.

[0067] The second heat dissipation fins 702 are evenly distributed on the side and top surfaces of the main housing 1, with the fin direction perpendicular to the ground, which is conducive to natural convection heat dissipation.

[0068] By adding a second heat dissipation fin 702, the main housing 1 itself can act as a radiator to exchange heat with the air. When the ambient temperature is not high (e.g., below 30°C) and the power supply is not large (e.g., below 500W), the heat dissipation requirements can be met by relying solely on natural convection without using a water cooling system.

[0069] When using a water-cooling system, the second heat dissipation fin 702 on the outer casing surface can serve as an auxiliary heat dissipation method to further reduce the power supply temperature, increase heat dissipation redundancy, and extend the power supply life.

[0070] Example 3: Integrated into the main light control system.

[0071] Figure 8 This is a schematic diagram of a light-controlling subject provided in an embodiment of this application. Figure 8 As shown, the light control unit 17 is the core control device of the film and television lighting system. It typically includes control circuits, a display screen, operation buttons, communication interfaces, etc., and is used to control parameters such as brightness, color temperature, and special effects of LED lights. The light control unit 17 usually adopts a box structure with a large internal space, which can integrate components such as power supply, water pump 19, and water tank 20.

[0072] The power supply is fixed to the inner wall of the light control body 17 via the mounting bracket 15. The power supply's water inlet 8 and outlet 9 are connected to the water pump 19 and water tank 20 inside the light control body 17 via water cooling pipe 18, forming a closed water cooling circulation system.

[0073] The housing of the light control body 17 can be made of aluminum alloy, which has good thermal conductivity. The main housing 1 of the power supply is in contact with the inner wall of the housing of the light control body 17. Thermal conduction can be enhanced by thermally conductive silicone pads or thermally conductive gaskets, so that the heat of the power supply can be conducted to the housing of the light control body 17, and then exchanged with the air through the surface of the housing.

[0074] In this integrated solution, the second heat dissipation fins 702 on the surface of the power supply casing can be reduced or eliminated, because the housing of the light control body 17 itself is a large heat sink with a heat dissipation area much larger than that of the power supply casing. This can further reduce the size of the power supply and lower costs.

[0075] The surface of the light control unit 17 can be equipped with a second heat dissipation fin 702, or high-efficiency heat dissipation technologies such as heat pipes and vapor chambers can be used to further improve heat dissipation efficiency. A larger water tank 20 can be designed inside the light control unit 17, and a radiator or cooling fan can be integrated to achieve stronger heat dissipation capabilities.

[0076] This system integration solution integrates the power supply and the light control unit 17 into a single unit, which not only saves space and reduces costs, but also improves heat dissipation efficiency and system reliability, making it ideal for professional film and television photography lighting applications.

[0077] Example 4: Optimization of flow channel design.

[0078] This embodiment details the optimized design scheme of the water-cooled flow channel 6.

[0079] The water-cooling channel 6 is designed according to the layout of PCBA motherboard module 4 and PFC module 5. The water-cooling channel 6 is located directly below the main heat-generating components, including power MOSFETs, rectifier diodes, inductors, transformers, etc.

[0080] The flow channel length is determined based on the dimensions of the main housing 1 and the distribution of the heating elements. The flow channel length should not be too long, otherwise it will increase flow resistance and reduce flow velocity; the flow channel length should also not be too short, otherwise it will not be able to cover all the heating elements.

[0081] The flow channel uses a rounded transition at bends to avoid right-angle turns that could cause poor fluid flow and eddy currents. At bends, the fin spacing and length are adjusted accordingly to ensure smooth fluid flow. For example, the spacing of the first heat dissipation fins 701 can be appropriately increased to 8-10 mm, and the length shortened to 10-15 mm to ensure smooth fluid flow.

[0082] In some implementations, branched flow channels can be designed in areas with particularly high heat generation from the power source, allowing the coolant to flow through them separately and increasing the cooling effect in those areas. The branched flow channels converge downstream and continue flowing towards the outlet 9. The design of the branched flow channels takes into account flow distribution to ensure that the flow rate of each branch is basically balanced.

[0083] Through the above-mentioned optimized design, the water-cooling channel 6 can efficiently cover all heat-generating components, ensuring smooth fluid flow and high heat exchange efficiency, thus meeting the heat dissipation requirements of high power density power supplies.

[0084] Example 5: Schematic diagram.

[0085] like Figures 9 to 13 A schematic diagram of a high-power water-cooled power supply is shown together.

[0086] Figure 9 This is a schematic diagram of the water cooling flow channel in a high-power water-cooled power supply provided in an embodiment of this application. Figure 9 As can be seen, the water-cooling channel 6 has a tubular cross-section design with a smooth inner wall surface. Several trapezoidal second heat dissipation fins 702 are evenly distributed within the channel, integrally formed with the main housing 1 through die-casting. At channel bends, the fin spacing is appropriately increased and the length appropriately shortened to ensure smooth fluid flow. The channel layout is customized based on the location of the heat-generating components in the PCBA motherboard module 4 and PFC module 5. The channel starts at the inlet 8 and ends at the outlet 9, passing beneath all major heat-generating areas.

[0087] Figure 10 This is a schematic diagram of the bottom cover plate of a high-power water-cooled power supply provided in an embodiment of this application. Figure 10 As can be seen, the bottom cover plate 3 is made of aluminum sheet by stamping. The shape of the bottom cover plate 3 is completely consistent with the opening shape of the water cooling channel 6 at the bottom of the main shell 1. The edges are flat and it forms an integrated structure with the main shell 1.

[0088] Figure 11 This is a schematic diagram of the first cavity in a high-power water-cooled power supply provided in an embodiment of this application. Figure 11 As can be seen, the first cavity 101 is located above the main housing 1 and is used to house and fix the hardware modules. A separate internal partition space 16 is provided on one side of the first cavity 101, which is specifically used to install the PFC module 5. The first cavity 101 and the second cavity 102 are separated by the main housing material, forming a physical partition to ensure that coolant does not leak into the hardware module area. The bottom of the first cavity 101 is flat and smooth, facilitating the placement of the thermally conductive silicone pad 12 to ensure efficient heat conduction.

[0089] Figure 12 This is a top view schematic diagram of another high-power water-cooled power supply provided in an embodiment of this application. Figure 12As can be seen, the power supply casing has a rectangular structure, and the main casing 1 has protruding mounting brackets 15 on both sides. The brackets have through holes for bolting the entire power supply product. Waterproof cable fixing heads 14 are provided at both ends of the main casing 1, one end for AC line introduction and the other end for DC line exit. A fluid connector 10 is provided on the same side of the main casing 1, including a water inlet 8 and a water outlet 9. The water inlet 8 and the water outlet 9 adopt 1 / 4-inch pagoda-type connectors to facilitate the connection of water cooling pipes 18.

[0090] Figure 13 This is a schematic diagram of a hardware module in a high-power water-cooled power supply provided in an embodiment of this application. Figure 13 As can be seen, the main heat-generating components are distributed on the PCBA motherboard module 4, including power MOSFETs, rectifier diodes, inductors, transformers, etc.; the PCBA motherboard module 4 is provided with mounting holes for fixing to the screw posts 11 inside the main housing 1; the PFC module 5 is an independent PCB board, which is installed in an inverted manner, with the PCB board facing vertically upward and the plug-in side facing downward, and is placed in the inner cavity partition space 16.

[0091] The high-power water-cooled power supply for film and television photography lighting provided in this application has the advantages of high power density, small size, light weight, efficient heat dissipation, low noise, and high reliability, making it very suitable for mobile shooting scenarios in film and television photography.

[0092] Specific application products include, but are not limited to: Light control main control box: an integrated device that combines power supply, control circuit, and water cooling system; Independent power supply box: A power supply product that can be used independently or used with lighting fixtures; Integrated lighting unit: A compact product in which the power supply is integrated inside the lighting fixture; Mobile lighting vehicle: Power module for vehicle-mounted film and television lighting system.

[0093] The high-power water-cooled power supply provided in this application embodiment can also be customized according to customer needs for power level (e.g., 300W-7200W), output voltage (e.g., 24V-48V) and control interface (e.g., DMX512 digital dimming protocol, lighting remote device management protocol RDM, Art-Net protocol, etc.) to meet the needs of different application scenarios.

[0094] The high-power water-cooled power supply provided in this application adopts a modular design, which facilitates production, maintenance, and upgrades. Major components (main housing 1, PCBA motherboard module 4, PFC module 5, water-cooling components, etc.) can be replaced independently, reducing maintenance costs. The die-casting process is suitable for mass production, with controllable costs, and has good prospects for industrial applications.

[0095] The above description is merely a preferred embodiment of the technical solution of this application and is not intended to limit the technical solution of this application. For those skilled in the art, the technical solution of this application can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the technical solution of this application should be included within the protection scope of the technical solution of this application.

[0096] For example, the cross-sectional shape of the flow channel can be circular, elliptical, rectangular, or other shapes; the heat dissipation fins can be straight, wavy, serrated, or other shapes; the coolant can be water, antifreeze, oil, or other media; the sealing method can be welding, adhesive bonding, mechanical seal, or other methods; all these variations are within the protection scope of the technical solution of this application.

Claims

1. A high-power water-cooled power supply for film and television photography lighting, characterized in that, include: The power supply housing is integrally formed by die casting process, and has a first cavity and a second cavity inside. The first cavity and the second cavity are separated by the main housing material at the adjacent part. The hardware module, disposed in the first cavity, includes a printed circuit board assembly (PCBA) mainboard module and a power factor correction (PFC) module. A water-cooled flow channel is disposed in the second cavity; A fluid connector, with an inlet and an outlet located on the same side of the power supply housing, is used to connect a water pump and a water tank to form a water-cooled circulation system; The water-cooling channel is designed along the vertical direction of the high-temperature components of the hardware module, and the channel cross-section is tubular with a smooth inner wall surface.

2. The high-power water-cooled power supply according to claim 1, characterized in that: The water-cooling channel is provided with a number of first heat dissipation fins. The first heat dissipation fins are integrally formed with the power supply housing by die casting process. The fins have a trapezoidal structure that is narrow at the top and wide at the bottom, and have a draft angle of 1-3°. The first heat dissipation fins are of uniform height and spaced apart from each other. The length of the fins is adjusted according to the position of the high-temperature components in the hardware module and the smoothness of fluid flow.

3. The high-power water-cooled power supply according to claim 2, characterized in that: The first heat dissipation fin has a height of 18mm, a width of 3mm, a spacing of 5-8mm, and a length of 15-25mm; At the bends in the flow channel, the fin spacing and length are adjusted accordingly to ensure smooth fluid flow.

4. The high-power water-cooled power supply according to claim 1, characterized in that: The power supply casing itself acts as a radiator for heat exchange with the air. Through the die-cast one-piece flow channel design, there is no need to set up an additional independent water-cooling radiator component, reducing the size and cost of the power supply. The power supply casing surface is equipped with a second heat dissipation fin to improve the heat exchange efficiency with the air.

5. The high-power water-cooled power supply according to claim 1, characterized in that: The first cavity has a separate internal partition space for installing the PFC module; The PFC module is installed in an inverted manner, with the PCB board facing vertically upwards and the plug-in side facing downwards, placed in the inner cavity partition space. Heat conduction and fixation are achieved by filling with potting compound.

6. The high-power water-cooled power supply according to claim 1, characterized in that: The power supply housing includes a main housing, an upper cover plate, and a bottom cover plate; The bottom cover plate is welded and sealed to the main shell by friction welding technology to form a sealed water cooling channel; The upper cover plate is fixed to the upper part of the main housing by screws. A groove is provided on the inner side of the upper cover plate, and a sealing silicone rubber ring is installed in the groove. The power supply enclosure has an IP67 protection rating.

7. The high-power water-cooled power supply according to claim 6, characterized in that: The PCBA motherboard module is fixed to a screw post inside the main housing. A thermally conductive silicone pad is placed at the bottom of the PCBA motherboard module to conduct heat to the bottom water-cooling channel.

8. The high-power water-cooled power supply according to claim 6, characterized in that: The main housing has protruding mounting brackets on both sides, and the mounting brackets have through holes for fixing the entire power supply product.

9. The high-power water-cooled power supply according to claim 1, characterized in that: The power supply housing has mounting through holes at both ends for installing waterproof cable fixing heads; AC lines, DC lines, or communication lines are led out from both ends through the waterproof cable fixing heads.

10. The high-power water-cooled power supply according to claim 1, characterized in that: The power supply can be integrated into the main light control system and connected to the water pump and water tank inside the main light control system via a water-cooling pipe; The power supply casing can conduct heat through contact with the light control body, using the light control body as a heat exchange medium to achieve heat dissipation redundancy.

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