Contact array based adhesive verification apparatus and method

Abstract

The application belongs to the technical field of aviation industry, and discloses a kind of based on contact array's cementation checking device and method.The device includes contact working system, including contact unit, contact grid, contact locking device and contact support;Contact locking device includes: locking mechanism and locking knob;Base support system includes contact base, pin, device support leg;Contact unit is through on contact grid, and is through contact support, the end of contact unit is in contact with cementing piece, locking mechanism for limiting the movement of contact unit is also provided on contact grid, locking mechanism is installed with locking knob for driving locking mechanism to limit the movement of contact unit;Locking knob is installed in the side wall of contact support.The present application uses rigid contact displacement collection, three-dimensional data modeling to replace flexible verification film physical imprint, and realizes accurate detection of gap and quantitative filling of adhesive film through digital means.

Description

Technical Field

[0001] This invention belongs to the field of aerospace technology, and particularly relates to a bonding verification device and method based on a contact array. Background Technology

[0002] In the aerospace industry, composite metal-bonded sandwich structures (composed of metal panels, back plates, and foam / honeycomb cores) have become the core choice for core load-bearing components such as wings, tails, and fuselages due to their weight reduction, high strength, and fatigue resistance.

[0003] However, because both the metal panel and the core material have a certain degree of rigidity, their contact is rigid, lacking any elastic buffer space, resulting in a hard-on-hard bonding scenario. Furthermore, different structures undergo different processing steps, leading to various deviations. These deviations ultimately create irregular gaps at the bonding surface. Directly applying adhesive can cause uneven adhesive layer thickness and incomplete curing, or even reduce bond strength, cause stress cracking, and threaten the flight safety of aerospace components, becoming the core issue affecting bonding quality.

[0004] To address the adhesive gap issue caused by mismatched surfaces, the industry now universally employs calibration film testing as the only feasible solution. This involves creating a calibration film using the same adhesive film as the part, following the same curing process, and then marking the gap after bonding to guide adhesive filling. This solution has two core functions: first, it acts as a flexible intermediary for bonding rigid surfaces, transforming the abstract surface shape into physical imprints on the film, visually indicating the location and approximate extent of the gap; second, the imprints guide adhesive filling, preventing overfilling that leads to excessive part weight gain or underfilling that results in localized areas without adhesive. This is a crucial step in ensuring bonding quality in traditional processes, and also the reason why calibration film testing is indispensable in metal sandwich bonding.

[0005] However, as the aerospace manufacturing industry places increasing demands on efficiency, cost, and precision, the pain points of the calibration membrane process have become increasingly prominent: First, the cost of consumables is high. Calibration membranes need to be customized for different models and curvatures of parts, and they are for single use only. The cost of consumable procurement accounts for a significant proportion of production costs when producing multiple batches. Second, the production efficiency is low. From calibration membrane production and high-temperature curing to manual bonding, marking, and gap estimation, the cycle time for a single process is usually 8 hours, which can easily cause production line shutdowns. Third, the detection accuracy is poor. It relies on workers to observe the marks to judge the gap size, which has a large subjective error (the upper limit of accuracy is only 0.1mm). This makes it difficult to meet the stringent requirements of aerospace parts for bonding precision and has become a bottleneck restricting process upgrades. Summary of the Invention

[0006] To overcome the problems existing in related technologies, the present invention discloses an adhesive bonding verification device and method based on a contact array.

[0007] The technical solution is as follows: a bonding verification device based on a contact array, the device comprising a contact working system and a base support system;

[0008] The contact working system includes a contact unit, a contact grid, a contact locking device, and a contact support; the contact locking device includes a locking mechanism and a locking knob;

[0009] The base support system includes a contact base, pins, and device legs;

[0010] The contact unit extends through the contact grid and through the contact support. The end of the contact unit contacts the adhesive component. The contact grid is also provided with a locking mechanism for restricting the movement of the contact unit. A locking knob is installed on the locking mechanism to drive the locking mechanism to restrict the movement of the contact unit. The locking knob is installed on the side wall of the contact support.

[0011] The contact grid is installed on top of the contact support, which is fixed to the contact base by pins. The contact base is equipped with support legs that are supported on the ground.

[0012] Furthermore, the contact grid has through holes to accommodate the contact units passing through.

[0013] The contact unit has rounded ends for mounting sensors, and a raised area in the middle that engages with the through holes in the contact grid.

[0014] During production, different contact units of different lengths are selected according to the different configurations of the adhesive parts, and different cemented carbide materials are selected for the contact units according to the hardness requirements.

[0015] The diameter of the through hole is the same as the diameter of the contact unit, and the spacing between the through holes is a fixed value. The contact units are placed in the through holes to form a contact array.

[0016] The locking mechanism is used to restrict the movement of the contact units, so that the contact units are no longer in a free state. The locking mechanism has grooves that correspond one-to-one with the contact units, and there are two upright blocks on the upper side that are connected to the locking knob. In the locked state, the grooves fit tightly with the contact units, thereby restricting the movement of the contact units.

[0017] Adhesive-bonded parts are components with variable curvature surfaces;

[0018] The contact support is used to support the entire contact working system. It has a side round hole. The locking knob is inserted into the side round hole. The contact support has uniform support round holes that are consistent with the contact grid. The contact unit passes through the support round hole. The upper side of the contact support is connected and locked to the contact grid. The bottom of the contact support is connected to the contact base as a whole through four support pin holes.

[0019] The contact base is used to support the entire contact working system. The upper surface has a base pin hole, which is connected to the contact support as a whole by the pin.

[0020] The device's support legs are used to adjust the height of the contact base; several support leg pin holes are provided on one side.

[0021] Another object of the present invention is to provide a bonding verification method based on a contact array bonding verification device, comprising:

[0022] S1, Contact Array Layout and Inspection: Based on the profile drawing of the parts to be bonded, determine the contact unit density and different lengths of the contact units to form a contact array; fix the contact units constituting the contact array and the contact grid to the contact support using magnetic fixtures; assemble the contact working system and the base support system together; check whether the connection status between the contact units and the contact grid is qualified, ensuring that each through hole of the contact grid is filled with contact units and there are no obvious gaps between the through holes and the contact units. In addition, the contact units can slide up and down in the through holes in a free state, and when the contact units are locked by the contact locking device, they can withstand a local pressure of at least 135N at a minimum interval of 300mm without slippage.

[0023] S2, Surface Fitting Simulation; The adhesive component to be tested is precisely placed below the contact array, and the pressure module is activated to make the adhesive component completely fit the contact array;

[0024] S3, compare gaps; after pressurization, turn off the pressurization module, remove the adhesive bonding verification device based on the contact array in sequence, check the indentations remaining on the adhesive film on the adhesive parts, and use the presence of clear contact marks on the adhesive film as the judgment standard. If there are clear indentations, it is qualified; otherwise, it is unqualified. Use a square with the contact as the center and the contact spacing as the side length to divide the area and mark each unqualified area.

[0025] S4, Precise Adhesive Application and Re-inspection; Based on the adhesive application list, apply adhesive film with a thickness matching the gap in the corresponding area of ​​the core, controlling the area filled in a single application to ≤20cm². 2 After the glue application is completed, place the glued parts and the core with the glue film back on the contact array, repeat the pressure application in step S2 and the data acquisition and evaluation process in step S3 to confirm the elimination of gaps. When all contacts have clear indentations, they are considered qualified. No additional calibration film or curing treatment is required, and the process can proceed directly to the gluing stage.

[0026] Combining all the above technical solutions, the beneficial effects of this invention are as follows:

[0027] This invention overcomes the limitations of traditional processes by proposing a contact array alternative. Its core logic is to replace the physical imprint of the flexible calibration membrane with rigid contact displacement acquisition and 3D data modeling, achieving precise gap detection and quantitative filling of the adhesive film through digital means. This invention achieves triple cost savings, primarily reflected in three aspects based on practical application data: First, it saves on consumable costs; the contact array device can be reused for more than 3 years, adapts to multiple parts models, completely replaces disposable calibration membranes, and reduces consumable expenditure by 50% during multi-batch production. Second, it saves on time costs; the entire process of detection and adhesive filling is compressed to within 30 minutes, improving efficiency by 80% and effectively reducing production line downtime. Third, it saves on material waste; by using quantitative gap data to guide precise adhesive filling, the adhesive film loss rate is reduced from 15%-20% in traditional processes to less than 3%, while avoiding rework costs due to improper adhesive filling, resulting in significant overall cost advantages.

[0028] This invention breaks through traditional misconceptions. First, it dispels the notion that rigid structural surface inspection must rely on flexible membranes, proving that by using rigid contacts with a diameter of 0.8-1.2mm and displacement data modeling, higher inspection accuracy (0.05mm vs 0.1mm) can be achieved than calibration membranes, while avoiding deviations caused by the stretching of flexible membranes. Second, it dispels the notion that multi-model part inspection must rely on customized consumables. Through adjustable density and magnetic fixation, a single array device can adapt to multiple models of parts, from simple planes to complex curved surfaces, eliminating the need for separate consumables for each part. Third, it dispels the notion that adhesive filling accuracy must rely on human experience, transforming adhesive filling from subjective estimation to data-driven processes. System quantitative output ensures consistency in adhesive filling, significantly reducing human error and providing a feasible path for the digital upgrade of aerospace adhesive bonding processes.

[0029] In terms of cost reduction, this device can be reused for more than 3 years, is compatible with multiple parts models, and replaces disposable calibration membranes, reducing consumable costs by 50%, achieving low-cost manufacturing for similar products in the industry. In terms of efficiency improvement, the entire calibration and adhesive replenishment process is reduced from 2 hours to 30 minutes, increasing efficiency by 80% and alleviating production line downtime. It eliminates the dependence on high-investment autoclaves for calibration membranes, lowers the operational threshold for calibration membranes, and releases equipment capacity. In terms of product quality, it reduces potential bonding quality issues. It achieves a triple benefit of cost reduction, efficiency improvement, and quality enhancement.

[0030] This invention enables precise detection of adhesive gaps in rigid structural surfaces. It utilizes replaceable contacts and magnetic fixation, and a single device is adaptable to parts ranging from flat surfaces to complex variable curvatures, eliminating the need for customized consumables. It achieves a closed-loop process and eliminates the need for additional autoclave equipment for membrane curing.

[0031] This invention solves the problem of relying on flexible calibration films for testing rigid adhesive surfaces, eliminating dependence on disposable consumables and achieving higher testing accuracy; it also solves the problem of requiring customized calibration consumables for multiple parts models, with one device adaptable to all types of parts, breaking model limitations; it solves the problem of relying on manual experience for adhesive patching, using contact indentations to accurately mark areas and achieve data-driven standardized patching; and it solves the problem of time-consuming calibration processes, eliminating the calibration film manufacturing and curing steps, significantly improving production efficiency. Attached Figure Description

[0032] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure;

[0033] Figure 1 This is a schematic diagram of an adhesive bonding verification device based on a contact array provided in an embodiment of the present invention;

[0034] Figure 2 This is an exploded view of the contact unit, contact grid, and locking mechanism provided in an embodiment of the present invention;

[0035] Figure 3 This is a schematic diagram of the contact unit provided in an embodiment of the present invention;

[0036] Figure 4 These are schematic diagrams of contact units of different lengths provided in embodiments of the present invention;

[0037] Figure 5 This is a schematic diagram of the contact grid provided in an embodiment of the present invention;

[0038] Figure 6 This is a schematic diagram of the locking mechanism provided in an embodiment of the present invention;

[0039] Figure 7 This is a schematic diagram of the locking knob provided in an embodiment of the present invention;

[0040] Figure 8 This is a schematic diagram of the contact locking device connection provided in an embodiment of the present invention;

[0041] Figure 9 yes Figure 8 Enlarged view of the center locking knob;

[0042] Figure 10 This is a schematic diagram of the locking state of the contact locking device provided in an embodiment of the present invention;

[0043] Figure 11 yes Figure 10 Enlarged schematic diagram of the locking process of the contact locking device;

[0044] Figure 12 A schematic diagram of a contact support provided in an embodiment of the present invention;

[0045] Figure 13 This is a schematic diagram of the contact base provided in an embodiment of the present invention;

[0046] Figure 14 A schematic diagram of a pin provided in an embodiment of the present invention;

[0047] Figure 15 This is a schematic diagram of the base support legs provided in an embodiment of the present invention;

[0048] In the diagram: 01, contact unit; 01-1, round head; 01-2, boss area; 02, contact grid; 02-1, through hole; 03, locking mechanism; 03-1, groove; 03-2, upright block; 04, locking knob; 05, adhesive joint; 06, contact support; 06-1, side round hole; 06-2, support round hole; 07, contact base; 07-1, base pin hole; 08, pin; 09, device leg; 09-1, leg pin hole. Detailed Implementation

[0049] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0050] The innovation of this invention lies in its use of a rigid contact array to replace the traditional disposable flexible calibration membrane, integrating a replaceable contact unit 01 and a locking anti-slip structure to adapt to multi-configuration variable curvature adhesive joints 05. This constructs an integrated closed-loop process of deployment, bonding, comparison, and adhesive replenishment, eliminating the calibration membrane manufacturing and curing steps. This enables precise detection and quantitative adhesive replenishment of adhesive gaps, improving detection accuracy while significantly reducing costs and increasing efficiency, providing a completely new technical approach for rigid adhesive joint gap calibration.

[0051] Example 1, as Figures 1-13 As shown, the adhesive bonding verification device based on contact array provided in this embodiment of the invention includes a contact working system and a base support system.

[0052] The contact working system can be further divided into contact unit 01, contact grid 02, contact locking device, and contact support 06; the contact locking device includes: locking mechanism 03 and locking knob 04, such as Figure 2 ;

[0053] The base support system includes contact base 07, pin 08, and device support leg 09;

[0054] The contact unit 01 extends through the contact grid 02 and through the contact support 06. The end of the contact unit 01 contacts the adhesive component 05. The contact grid 02 is also provided with a locking mechanism 03 for restricting the movement of the contact unit 01. A locking knob 04 is installed on the locking mechanism 03 to drive the locking mechanism 03 to restrict the movement of the contact unit 01. The locking knob 04 is installed on the side wall of the contact support 06.

[0055] The contact grid 02 is installed on the contact support 06, which is fixed to the contact base 07 by a pin 08. The contact base 07 is equipped with a support leg 09 that is supported on the ground.

[0056] The contact grille 02 has a through hole 02-1 to accommodate the contact unit 01 passing through it;

[0057] like Figure 3 As shown, the contact unit 01, the core component of the device, is made of aerospace-grade hard alloy (hardness HRC60+), which has the characteristics of wear resistance, deformation resistance and long service life. Both ends are designed with round heads 01-1, which can be used to install sensors. There is a boss area 01-2 in the middle, which is snapped onto the through hole 02-1 opened on the contact grid 02.

[0058] This prevents the contact unit 01 from slipping out in its free state. Furthermore, in actual production, different lengths of contact units 01 can be selected for adhesive bonding parts 05 with different configurations, such as... Figure 4 As shown; since contact points of different lengths have different hardness requirements, different aerospace-grade cemented carbide materials (such as steels of different hardness, cobalt alloys, titanium alloys, etc.) can be selected based on the needs of hardness and production costs.

[0059] like Figure 5 As shown, the contact grid 02 is used to assemble the contact unit 01. It is a square plate with regular through holes 02-1 inside. The size of the through holes 02-1 is the same as that of the contact unit 01, and the spacing of the through holes 02-1 is a fixed value (which can be adjusted according to the actual accuracy requirements). The contact unit 01 can be placed in the through holes 02-1 to form an array.

[0060] like Figure 6 As shown, the locking mechanism 03 is used to restrict the movement of the contact unit 01, preventing it from being in a free state and ensuring it remains stably positioned on the actual part surface. The locking mechanism 03 has grooves 03-1 that correspond one-to-one with the contact units 01, and two upright blocks 03-2 on its upper side that can connect to the locking knob 04. In the locked state, the grooves 03-1 are tightly fitted to the contact units 01, thus restricting their movement.

[0061] like Figure 7 The locking knob 04 can be rotated and twisted, and is connected to the locking mechanism 03 to form a locking device, such as... Figure 8 Schematic diagram of locking device connection; Figure 9 yes Figure 8 Enlarged view of the locking knob; as the locking knob 04 is turned, it causes the locking mechanism 03 to slide forward.

[0062] This allows the locking mechanism 03 to lock the contact unit 01, such as Figure 10 A schematic diagram of the contact locking device in the locking state. Figure 11 yes Figure 10 A magnified schematic diagram of the locking process of the contact locking device. Figure 11 The left-middle image shows a schematic diagram of the locking device in its free state. Figure 11 The middle image shows a schematic diagram of the locking device rotating the locking knob 04. Figure 11 The right figure shows the locking state of the locking device;

[0063] For example, adhesive component 05 is a typical specific part with a variable curvature surface.

[0064] like Figure 12 As shown, the contact support 06 is used to support the entire contact working system. It has a side circular hole 06-1, into which the locking knob 04 can be inserted. The contact support 06 has uniform support circular holes 06-2 that are the same as those of the contact grid 02, so that the contact unit 01 can pass through the support circular holes 06-2. The upper side of the contact support 06 can be connected and locked to the contact grid 02. The bottom of the contact support 06 is connected to the contact base 07 as a whole through four support pin holes through which pins 08 pass.

[0065] like Figure 13 The contact base 07 is used to support the entire contact working system. The upper surface has four base pin holes 07-1, which can be connected to the contact support 06 as a whole by pins 08. The four legs of the contact base 07 are fixed to the device support legs 09 by several table leg pin holes.

[0066] like Figure 14 Pin 08 is used to connect contact support 06 and contact base 07.

[0067] like Figure 15 The support leg 09 is used to adjust the height of the contact base 07. Several support leg pin holes 09-1 are provided on one side. During production, different height holes can be selected to match and position the contact base 07 according to actual needs, so as to achieve the best matching degree between the contact working system and the part surface.

[0068] For example, contact unit 01 balances accuracy and workpiece protection;

[0069] Contact unit 01 is the core sensing element, made of aerospace-grade hard alloy material (hardness HRC60+) to ensure wear resistance and deformation resistance, with a service life of over 5000 cycles. The design features rounded ends (01-1) with a diameter controlled between 0.8-1.2mm. This size ensures clear indentation while avoiding the loss of fine gaps due to excessively thick contacts and bending damage due to excessively thin contacts. Each contact is equipped with a high-precision displacement sensor (resolution 0.001mm) that can record X / Y / Z axis displacement data in real time after extrusion, providing accurate data for surface modeling.

[0070] Contact unit 01 is a contact array layout: adaptable to surface complexity;

[0071] The contact array layout of contact unit 01 follows the principle of densification as needed, and the contact density is adjusted according to the curvature of the surface of the adhesive component 05 (such as skin): for complex areas with curvature > 15° (such as the leading edge of the wing, the transition section of the corner of the part), the contact density is set to 5~9 contacts / cm. 2 The spacing is 3-8mm to ensure the capture of subtle surface undulations; for gentle areas with curvature <5° (such as the mid-plane of the wing), the density is increased to 2-4 per square centimeter with a spacing of 9-14mm to avoid data redundancy while ensuring accuracy; the contact array of contact unit 01 is fixed by magnetic fixtures, which is convenient to install and can be quickly disassembled, and the calibration error is strictly controlled within 0.02mm to ensure the consistency of the benchmark for each test.

[0072] For example, the pressurization module simulates the stress experienced during actual assembly;

[0073] The pressure module uses a water-ball-like design, its core function being to simulate the assembly force during the actual bonding of component 05, ensuring full contact between the contact array and the bonding surface of component 05. The pressure module is placed above the contact array, and its pressure can freely adjust according to the actual state of the contact array, ensuring that it provides uniform and sufficient assembly force (simulated force) to the contact array. Regarding process parameters, the applied force should not exceed 45N of local pressure within a minimum 300mm interval: for rigid workpieces such as aluminum alloy skins, the local pressure can be up to 45N; for easily deformable workpieces such as composite material skins, it should be adjusted to around 30N. This avoids both insufficient contact contact due to excessively low local pressure and damage to the workpiece due to excessively high local pressure, ensuring that the test results are consistent with the actual bonding scenario.

[0074] Example 2: The adhesive bonding verification method of the adhesive bonding verification device based on contact array consists of four steps. The device is simple to operate and can be seamlessly integrated with the production line, as detailed below:

[0075] S1, Contact array layout and inspection; Based on the profile drawing of the adhesive part 05 to be bonded, determine the density of the through holes 02-1 of the contact grid 02 and the support round holes 06-2 of the contact support 06; based on the density of the through holes 02-1 of the contact grid 02 and the support round holes 06-2 of the contact support 06, determine the density of the contact unit 01 (e.g., 9 units / square centimeter for the leading edge of the wing and 3 units / square centimeter for the middle of the wing); and based on the profile drawing of the adhesive part 05 to be bonded, determine the different lengths of the contact unit 01; and construct a contact array based on the multiple determined contact unit 01 densities and the determined contact unit 01 of different lengths.

[0076] The contact unit 01, constituting the contact array, and the contact grid 02 are fixed to the contact support 06 using magnetic fixtures; the contact working system and the base support system are then assembled. The connection between the contact unit 01 and the contact grid 02 is checked to ensure it is acceptable, guaranteeing that each through hole 02-1 of the contact grid 02 is filled with the contact unit 01, and that there are no obvious gaps between the through hole 02-1 and the contact unit 01. Furthermore, the contact unit 01 can slide up and down within the through hole 02-1 in its free state, and when locked by the contact locking device, it can withstand a local pressure of at least 135N at a minimum interval of 300mm without slippage.

[0077] S2, Surface Fitting Simulation: The adhesive component 05 to be tested (such as skin) is precisely placed below the contact array. The entire device is adjusted to a suitable height using the contact base 07 and the device support leg 09. The through hole 02-1 of the contact grid 02 and the support round hole 06-2 of the contact support 06 are aligned. The pressure module is activated to make the adhesive component 05 (such as skin) completely fit the contact array and maintain it for at least 30 minutes.

[0078] S3, compare the gap; after the pressurization is completed, turn off the pressurization module, remove the adhesive bonding verification device based on the contact array in sequence, check the residual indentation on the adhesive film on the adhesive part 05 (such as the skin), and use the presence of clear contact marks on the adhesive film as the judgment standard. If there are clear indentations, it is qualified; otherwise, it is unqualified. Use a square with the contact as the center and the contact spacing as the side length to divide the area, mark each unqualified area, and provide clear guidance for subsequent operations.

[0079] S4, Precise glue application and re-inspection; According to the glue application list, apply glue film matching the gap thickness to the corresponding area of ​​the core (e.g., apply 0.8mm thick glue film for a 0.8mm gap), strictly controlling the single filling area to ≤20 square centimeters; After the glue application is completed, place the glued part 05 (e.g., skin) and the core with glue film on the contact array again, repeat the pressure application in step S2 and the data acquisition and evaluation process in step S3 to confirm the gap elimination. When all contacts can form clear indentations, it is qualified. There is no need to make an additional verification film or perform curing treatment, and you can directly enter the formal gluing stage.

[0080] To further illustrate the effects of the embodiments of the present invention, the following experiments were conducted. The same parts were bonded using both a traditional calibration film method and the method described in this invention. The differences between the two methods are shown in Table 1 below.

[0081] Table 1. Differences in bonding between traditional calibration films and the present invention.

[0082]

[0083] This invention is significantly superior to traditional calibration membrane solutions in terms of material usage, bonding efficiency, equipment utilization, and bonding quality.

[0084] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications, equivalent substitutions, and improvements made by those skilled in the art within the scope of the technology disclosed in the present invention, and within the spirit and principles of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A contact array based bond verification apparatus, comprising: The device includes a contact working system and a base support system; The contact working system includes a contact unit (01), a contact grid (02), a contact locking device, and a contact support (06); the contact locking device includes a locking mechanism (03) and a locking knob (04). The base support system includes a contact base (07), a pin (08), and device legs (09); The contact unit (01) extends through the contact grid (02) and through the contact support (06). The end of the contact unit (01) contacts the adhesive component (05). The contact grid (02) is also provided with a locking mechanism (03) for restricting the movement of the contact unit (01). A locking knob (04) for driving the locking mechanism (03) to restrict the movement of the contact unit (01) is installed on the locking mechanism (03). The locking knob (04) is installed on the side wall of the contact support (06). The contact grid (02) is installed on the top of the contact support (06), which is fixed to the contact base (07) by a pin (08). The contact base (07) is equipped with a device leg (09) that is supported on the ground.

2. The contact array based bond verification device of claim 1, wherein, The contact grid (02) has a through hole (02-1) for accommodating the contact unit (01) through it.

3. The contact array based bond verification device of claim 1, wherein, The contact unit (01) has rounded ends (01-1) for mounting sensors, and a boss area (01-2) in the middle. The boss area (01-2) is snapped onto the through hole (02-1) opened on the contact grid (02).

4. The contact array based bond verification device of claim 1, wherein, In the production of the adhesive component (05), different lengths of contact units (01) are selected according to different configurations, and different hard alloy materials are selected for the contact units (01) in combination with the hardness requirements.

5. The contact array based bond verification device of claim 1, wherein, The diameter of the through hole (02-1) is the same as that of the contact unit (01), and the spacing between the through holes (02-1) is a fixed value. The contact unit (01) is placed in the through hole (02-1) to form a contact array.

6. The contact array based bond verification device of claim 1, wherein, The locking mechanism (03) is used to restrict the movement of the contact unit (01) so that the contact unit (01) is not in a free state. The locking mechanism (03) has a groove (03-1) that corresponds to the contact unit (01) one by one. There are two upright blocks (03-2) on the upper side that are connected to the locking knob (04). In the locked state, the groove (03-1) fits tightly with the contact unit (01) to restrict the movement of the contact unit (01).

7. The contact array based bond verification device of claim 1, wherein, The adhesive-bonded part (05) is a part with a variable curvature surface; The contact support (06) is used to support the entire contact working system. It has a side round hole (06-1) on the side. The locking knob (04) is inserted into the side round hole (06-1). The contact support (06) has a uniform support round hole (06-2) that is consistent with the contact grid (02). The contact unit (01) passes through the support round hole (06-2). The upper side of the contact support (06) is connected and locked to the contact grid (02). The bottom of the contact support (06) is connected to the contact base (07) as a whole after passing through the four support pin holes (08). The contact base (07) is used to support the entire contact working system. The upper surface has a base pin hole (07-1), which is connected to the contact support (06) as a whole by a pin (08). The device support leg (09) is used to adjust the height of the contact base (07); several support leg pin holes (09-1) are provided on one side.

8. A method of verifying bonding of a bonding verification device based on a contact array, the method comprising: applying a voltage to a first contact of the contact array; measuring a current flowing through the first contact; and determining whether the current is within a predetermined range of values. This method implements the adhesive bonding verification device based on contact array as described in any one of claims 1-7, the method comprising: S1, Contact array layout and inspection; S2, surface fitting simulation; S3, comparison gap; S4, precise glue replenishment and re-inspection.

9. The method of claim 8, wherein the method further comprises: In step S1, the contact array layout and inspection includes: determining the density of contact units (01) and the different lengths of contact units (01) according to the profile drawing of the adhesive part (05) to be bonded, and forming a contact array; fixing the contact units (01) forming the contact array and the contact grid (02) to the contact support (06) by magnetic suction fixture; combining the contact working system and the base support system together; checking whether the connection status of the contact units (01) and the contact grid (02) is qualified, ensuring that each through hole (02-1) of the contact grid (02) is filled by the contact units (01) and there is no obvious gap between the through hole (02-1) and the contact unit (01), in addition, the contact units (01) can slide up and down in the through hole (02-1) in the free state, and in the state of the contact units (01) locked by the contact locking device, they can withstand a local pressure of at least 135N at a minimum interval of 300mm without slippage; Step S2, surface bonding simulation, includes: accurately placing the adhesive component (05) to be tested below the contact array, activating the pressure module, so that the adhesive component (05) is completely bonded to the contact array.

10. The method of claim 8, wherein the method further comprises: Step S3 compares the gaps as follows: After pressurization is completed, the pressurization module is turned off, the adhesive bonding verification device based on the contact array is removed in sequence, and the indentations remaining on the adhesive film on the adhesive part (05) are checked. The presence of clear contact marks on the adhesive film is used as the judgment criterion. If there are clear indentations, it is qualified; otherwise, it is unqualified. A square with the contact as the center and the contact spacing as the side length is used to divide the area and mark each unqualified area. Step S4, precise glue application and re-inspection, includes: according to the glue application list, applying glue film with a thickness matching the gap in the corresponding area of ​​the core, controlling the area of ​​each application to be ≤20cm². 2 After the glue is applied, place the glued part (05) and the core with the glue film on the contact array again, repeat the pressure and data acquisition and evaluation process to confirm the elimination of gaps. When all contacts form clear indentations, it is qualified. There is no need to make an additional test film or perform curing treatment. It can directly enter the glue bonding stage.

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