Defect detection apparatus and detection system

Abstract

This invention discloses a defect detection device and system, comprising: a clamping device, including a clamping mechanism for clamping a wafer and a Z-axis module for driving the clamping mechanism to move up and down; a first detection device, located below the clamping device, including a vision mechanism and a first X-axis module for driving the vision mechanism to move, the vision mechanism including a mounting frame, a camera module and a light source module mounted on the mounting frame; the mounting frame is provided with a mounting shaft, a first transmission component and a second transmission component rotatably mounted on the mounting shaft, the camera module being fixedly connected to the first transmission component, and the light source module being fixedly connected to the second transmission component; the vision mechanism includes an adjustment component mounted on the mounting frame, the adjustment component being adapted to drive the first transmission component and the second transmission component to rotate in opposite directions around the mounting shaft. This invention, employing the above structure, enables angle adjustment of the camera module and vision module during detection, and the intersection point of their optical axes is less prone to shifting, improving the reliability of the detection process.

Description

Technical Field

[0001] This invention relates to the field of appearance inspection technology, and in particular to a defect detection device and system. Background Technology

[0002] Currently, for defect detection on the back side of wafers, a clamping mechanism is commonly used to grab the wafer and move it above a vision mechanism. The vision mechanism includes a light source module and a camera module. The light source module is used to illuminate the back side of the wafer, and the camera module is used to photograph the back side of the wafer to obtain its shape information.

[0003] To achieve ideal detection results, the angles of the light source module and camera module are usually adjustable. For example, Chinese invention patent CN202211558349.8 discloses an automatic photographing device for the surface of a flexible solar array, which includes a mounting base, fixing components, a camera, and a light source. There are two fixing components, both of which are set on the mounting base. The fixing components are provided with U-shaped holes, and the camera and light source are respectively mounted on different fixing components through the U-shaped holes, thereby realizing fine-tuning of the angle.

[0004] However, with the aforementioned angle adjustment structure, the camera and light source rely on manual adjustment, making it impossible to achieve rapid and automatic switching. The machine must be stopped and manual intervention is required. Angle adjustment cannot be performed during the detection process, which severely restricts the production cycle and automation level of the equipment. In addition, the existing light source and camera usually rotate independently around different axes to adjust the angle. Therefore, after adjustment, it is easy to cause uncontrollable displacement of the intersection point of their optical axes. At the same time, the adjustment process of the light source and camera is very cumbersome.

[0005] Therefore, it is necessary to improve the existing technology to overcome the aforementioned defects. Summary of the Invention

[0006] The purpose of this invention is to provide a defect detection device and detection system that can adjust the angle of the camera module and vision module during the detection process, and the intersection point of their optical axes is not easily shifted, thereby improving the reliability of the detection process.

[0007] The objective of this invention is achieved through the following technical solution: a defect detection device, comprising:

[0008] The clamping device includes a clamping mechanism for clamping a wafer and a Z-axis module for driving the clamping mechanism to move up and down along the Z-axis direction;

[0009] The first detection device is located below the clamping device and includes a vision mechanism and a first X-axis module that drives the vision mechanism to move along the X-axis direction. The vision mechanism includes a mounting frame, a camera module and a light source module disposed on the mounting frame.

[0010] The mounting frame includes a mounting shaft, a first transmission component and a second transmission component rotatably mounted on the mounting shaft, a camera module fixedly connected to the first transmission component, and a light source module fixedly connected to the second transmission component. The vision mechanism includes an adjustment component mounted on the mounting frame, which is adapted to drive the first transmission component and the second transmission component to rotate in opposite directions around the mounting shaft.

[0011] Furthermore, the camera module and the light source module are located below the mounting axis, and the intersection point of the optical axes of the camera module and the light source module is on the axis of the mounting axis.

[0012] Furthermore, the adjustment component includes:

[0013] The drive shaft is rotatably mounted on the mounting bracket, and a first transmission gear is fixedly sleeved on it;

[0014] A first drive shaft is rotatably mounted on the mounting bracket, and a second drive gear that meshes with the first drive gear is fixedly sleeved on it;

[0015] The second drive shaft is rotatably mounted on the mounting bracket, and a third drive gear that meshes with the second drive gear is fixedly sleeved on it;

[0016] A drive motor is mounted on the mounting bracket and is connected to the drive shaft via a transmission.

[0017] The first drive shaft is connected to the first drive component, and the second drive shaft is connected to the second drive component.

[0018] Furthermore, both the first drive shaft and the second drive shaft are worm gear structures. The outer contours of the first transmission member and the second transmission member are arc-shaped structures coaxial with the mounting shaft, and both have teeth on their outer edges. The first transmission member meshes with the first drive shaft, and the second transmission member meshes with the second drive shaft.

[0019] Furthermore, the axial direction of the mounting shaft and the axial direction of the drive shaft are both parallel to the Y-axis direction, and the axial directions of the first transmission shaft and the second transmission shaft are both parallel to the X-axis direction.

[0020] Furthermore, the mounting bracket is provided with a mounting seat on both sides in the Y-axis direction, and a coaxial mounting shaft is fixedly connected in each mounting seat. The first transmission component corresponds one-to-one with the mounting shaft and is respectively housed in different mounting seats. The second transmission component corresponds one-to-one with the mounting shaft and is respectively housed in different mounting seats.

[0021] Both the camera module and the light source module are housed in the receiving space between the two mounting bases. The camera module is connected to different first transmission components at both ends in the Y-axis direction, and the light source module is connected to different second transmission components at both ends in the Y-axis direction.

[0022] Furthermore, there are two first drive shafts, each housed in a different mounting base. The first drive shafts are arranged one-to-one below the first transmission member. There are also two second drive shafts, each housed in a different mounting base. The second drive shafts are arranged one-to-one below the second transmission member. Each first drive shaft is provided with a second transmission gear, and each second drive shaft is provided with a third transmission gear. The two ends of the drive shaft extend into different mounting bases, and the two ends of the drive shaft are fitted with the first transmission gears to correspond one-to-one with the second transmission gears.

[0023] Furthermore, the first transmission member is closer to the camera module and / or the light source module than the second transmission member;

[0024] Both mounting bases have clearance holes on opposite sides. The first transmission member has a first connector that passes through the clearance hole and connects to the end of the camera module. The first transmission member has a clearance portion. The second transmission member has a second connector that passes through the clearance portion and the clearance hole and connects to the end of the light source module.

[0025] Furthermore, the camera module is a line array camera with its length direction parallel to the Y-axis direction, and the light source module is a strip light source adapted to the camera module.

[0026] In addition, the present invention also provides a detection system, including the aforementioned defect detection device;

[0027] The support device includes a rotary table mechanism for supporting and rotating the wafer and a second X-axis module for driving the rotary table mechanism to move along the X-axis direction to a first inspection station or a second inspection station. When the rotary table mechanism is at the first inspection station, the clamping device is located directly above the rotary table mechanism.

[0028] The second testing device is located at the second testing station;

[0029] The rotary table mechanism, the vision mechanism, and the clamping mechanism are arranged sequentially from bottom to top along the Z-axis, and the rotary table mechanism and the vision mechanism are adapted to move along the X-axis direction so that the projections of the rotary table mechanism, the vision mechanism, and the clamping mechanism in the Z-axis direction do not overlap.

[0030] Compared with existing technologies, the present invention has the following advantages: The structure described above eliminates the need for manual intervention and machine shutdown when adjusting the angles of the camera module and light source module. This allows for automatic adjustment based on actual testing needs, significantly improving the production cycle time and automation level of the equipment. The camera module and light source module rotate in opposite directions around the same axis, fundamentally eliminating the optical path disorder caused by independent rotation around different axes in existing technologies. This enables precise and continuous control of the angle between their optical axes, adapting to different defect detection modes and ensuring that the angle remains stable at the intersection of the two optical axes on the wafer surface during adjustment, avoiding field-of-view shift and guaranteeing the consistency and repeatability of the detection. Simultaneously, this mechanically forced synchronous motion simplifies the cumbersome operation of finely adjusting two degrees of freedom into a coordinated movement of a single control signal, making operation extremely simple and reliable. This automated coordinated adjustment capability provides a hardware foundation for online parameter optimization and multi-mode hybrid detection, significantly expanding the application range of the equipment and improving defect detection accuracy. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the defect detection device of the present invention.

[0032] Figure 2 This is a schematic diagram of the clamping mechanism in this invention.

[0033] Figure 3 This is a top view schematic diagram of the clamping mechanism in this invention.

[0034] Figure 4 This is an exploded structural diagram of the clamping mechanism and the wafer in this invention.

[0035] Figure 5 This is a schematic diagram of the clamping component in this invention.

[0036] Figure 6 This is a schematic diagram of the state when the clamping block holds the wafer in this invention.

[0037] Figure 7 This is a schematic diagram of the clamping block in this invention.

[0038] Figure 8 This is a schematic diagram of the structure of the first detection device in this invention.

[0039] Figure 9 This is a schematic diagram of the vision mechanism in this invention.

[0040] Figure 10 This is a partial exploded structural diagram of the vision mechanism in this invention.

[0041] Figure 11 This is a partial schematic diagram of the vision mechanism in this invention.

[0042] Figure 12 This is a cross-sectional schematic diagram of the vision mechanism in this invention.

[0043] Figure 13 This is a schematic diagram of the detection system of the present invention.

[0044] Figure 14 This is a schematic diagram of the installation of the bearing device and the second detection device in this invention.

[0045] 100. Clamping device; 110. Clamping mechanism; 120. Z-axis module; 130. Clamping unit; 140. Clamping assembly; 150. Clamping component; 151. Base; 1511. Mounting part; 1512. Adjustment groove; 1513. First adjusting hole; 152. Clamping block; 1521. Upper clamping surface; 1522. Lower clamping surface; 153. Adjusting block; 1531. Second connecting hole; 1532. Second adjusting hole; 154. Adjusting bolt; 160. Elastic element; 170. Drive cylinder; 180. Base; 181. Slide rail assembly; 182. Mounting block; 183. Leveling plate; 191. First adjusting screw; 192. Limiting post; 193. Second adjusting screw; 200. First detection device; 210. Vision mechanism; 220. First X-axis module; 230. Mounting bracket; 231. Mounting shaft; 232. Base plate; 233. Mounting seat; 234. First side plate; 2341. Clearance hole ; 235, Second side plate; 236, Third side plate; 237, Fourth side plate; 238, Outer cover; 240, Camera module; 241, First transmission component; 2411, Clearance part; 242, First connecting component; 250, Light source module; 251, Second transmission component; 252, Second connecting component; 260, Adjustment assembly; 261, Drive shaft; 262, First transmission shaft; 263, Second transmission shaft; 264, Drive motor; 265, First transmission gear; 266, Second transmission gear; 267, Third transmission gear; 300, Bearing device; 310, Rotary table mechanism; 320, Second X-axis module; 400, Second detection device; 500, Wafer; 510, Chamfer. Detailed Implementation

[0046] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not the entire structure. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0047] The terms “comprising” and “having”, and any variations thereof, used in this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus.

[0048] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0049] Please see Figure 1 , Figure 8 ,and Figure 9 As shown, a defect detection device corresponding to a preferred embodiment of the present invention includes: a clamping device 100, including a clamping mechanism 110 for clamping a wafer 500 and a Z-axis module 120 for driving the clamping mechanism 110 to move up and down along the Z-axis direction; and a first detection device 200 located below the clamping device 100, which includes a vision mechanism 210 and a first X-axis module 220 for driving the vision mechanism 210 to move along the X-axis direction. The vision mechanism 210 includes a mounting frame 230 and a camera module 240 disposed on the mounting frame 230. The system includes a light source module 250; wherein, the mounting frame 230 is provided with a mounting shaft 231, a first transmission member 241 and a second transmission member 251 rotatably sleeved on the mounting shaft 231, the camera module 240 is fixedly connected to the first transmission member 241, and the light source module 250 is fixedly connected to the second transmission member 251; the vision mechanism 210 includes an adjustment component 260 provided on the mounting frame 230, the adjustment component 260 being adapted to drive the first transmission member 241 and the second transmission member 251 to rotate around the mounting shaft 231 in opposite directions.

[0050] The present invention employs the aforementioned structure, enabling the angle adjustment of the camera module 240 and the light source module 250 to be completed automatically without manual intervention or machine shutdown, based on actual inspection needs. This significantly improves the production cycle time and automation level of the equipment. The camera module 240 and the light source module 250 rotate in opposite directions around the same axis, fundamentally eliminating the optical path disturbances caused by independent rotation around different axes in existing technologies. This allows for precise and continuous control of the angle between their optical axes, adapting to different defect detection modes. It ensures that the angle remains stable at the intersection area of ​​the two optical axes on the wafer 500 surface during adjustment, avoiding field-of-view shifts and guaranteeing the consistency and repeatability of the inspection. Simultaneously, this mechanically forced synchronous motion simplifies the previously cumbersome operation of finely adjusting two degrees of freedom into a coordinated movement of a single control signal, making operation extremely simple and reliable. This automated coordinated adjustment capability provides a hardware foundation for online parameter optimization and multi-mode hybrid inspection, significantly broadening the application range of the equipment and improving defect detection accuracy.

[0051] Furthermore, referring to Figure 12 As shown, the camera module 240 and the light source module 250 are located below the mounting axis 231 and arranged opposite each other along the X-axis. The optical axes of both the camera module 240 and the light source module 250 are inclined upwards towards the measured surface (back side) of the wafer 500 and intersect at this surface. The intersection point of the optical axes of the camera module 240 and the light source module 250 is located on the axis of the mounting axis 231. The wafer 500 can be moved along the Z-axis to a preset height under the action of the clamping device 100, so that the intersection point is located on the back side of the wafer 500. In this embodiment, the camera module 240 is a line scan camera, and the light source module 250 is a strip light source adapted to the camera module 240. The intersection line of the camera module 240 and the light source module 250 is collinear with the axis of the mounting axis 231.

[0052] Because the intersection point of the optical axes of the camera module 240 and the light source module 250 is designed to be completely coincident with their common mechanical rotation axis, the rotation center itself is located on the surface of the wafer 500 being inspected. When the adjustment component 260 drives the two to rotate in opposite directions around this axis to change the angle between the optical axes, no matter how the angle changes, the two optical axes will inevitably intersect on this fixed axis to avoid lateral drift of the scanning field of view caused by angle adjustment. This feature allows the angle parameter to be seamlessly and dynamically adjusted during scanning or batch switching without interrupting the inspection or performing any complex visual repositioning and motion compensation, thereby ensuring the absolute continuity of the inspection process and the high repeatability of the results.

[0053] Furthermore, referring to Figures 9 to 11As shown, the adjustment assembly 260 includes a drive shaft 261, a first transmission shaft 262, a second transmission shaft 263, and a drive motor 264. The drive shaft 261 is rotatably mounted on the mounting bracket 230, and a first transmission gear 265 is fixedly sleeved on it. The first transmission shaft 262 is rotatably mounted on the mounting bracket 230, and a second transmission gear 266 is fixedly sleeved on it, with the first transmission gear 265 and the second transmission gear 266 meshing. The second transmission shaft 263 is rotatably mounted on the mounting bracket 230, and a third transmission gear 267 is fixedly sleeved on it, meshing with the second transmission gear 266. The drive motor 264 is mounted on the mounting bracket 230 and is drively connected to the drive shaft 261. The first transmission shaft 262 is drively connected to the first transmission component 241, and the second transmission shaft 263 is drively connected to the second transmission component 251. When the drive motor 264 drives the drive shaft 261 to rotate, it can drive the first transmission shaft 262 and the second transmission shaft 263 to rotate in opposite directions, thereby driving the first transmission component 241 and the second transmission component 251 to rotate in opposite directions around the mounting shaft 231.

[0054] Specifically, in this embodiment, the axis of the drive shaft 261 is parallel to the Y-axis, and the axes of the first drive shaft 262 and the second drive shaft 263 are parallel to the X-axis. Both the first drive shaft 262 and the second drive shaft 263 are worm gear structures. The outer contours of the first transmission member 241 and the second transmission member 251 are arc-shaped structures coaxial with the mounting shaft 231, and their outer edges are provided with teeth. The first transmission member 241 meshes with the first drive shaft 262 through its teeth, and the second transmission member 251 meshes with the second drive shaft 263 through its teeth.

[0055] Furthermore, the mounting bracket 230 is a long strip structure with its length direction parallel to the Y-axis. The mounting bracket 230 includes a substrate 232 and two mounting seats 233, which are located on opposite sides of the substrate 232 in the Y-axis direction. Each mounting seat 233 is fixedly connected to a mounting shaft 231, and the two mounting shafts 231 are coaxial. The two mounting seats 233 form a receiving space for accommodating the light source module 250 and the camera module 240. The mounting seat 233 is a box-shaped structure with an open top, which includes a first side plate 234, a second side plate 235, a third side plate 236, and a fourth side plate 237 connected in sequence. The first side plate 234 and the third side plate 236 are arranged opposite each other in the Y-axis direction, and the second side plate 235 and the fourth side plate 237 are arranged opposite each other in the X-axis direction.

[0056] The two ends of the mounting shaft 231 are fixed to the first side plate 234 and the third side plate 236, respectively. The aforementioned receiving space is formed between the first side plates 234 of the two mounting bases 233. Preferably, the tops of the second side plate 235 and the third side plate 236 are recessed downwards to form notches, facilitating the assembly of the components within the mounting base 233. Preferably, an outer cover 238 is detachably provided around the mounting base 233 to enclose the components installed within the mounting base 233.

[0057] Furthermore, the first transmission member 241 is closer to the camera module 240 and / or the light source module 250 than the second transmission member 251. The first side plates 234 of both mounting bases 233 each have a through hole 2341 formed along the Y-axis. A first connector 242 is provided on the first transmission member 241, passing through the through hole 2341 and connecting to the end of the camera module 240. The first transmission member 241 has a clearance portion 2411, and the second transmission member 251 has a second connector 252, which passes through the clearance portion 2411 and the clearance hole 2341 in sequence, and connects to the end of the light source module 250. In this embodiment, both the clearance hole 2341 and the clearance portion 2411 are strip-shaped clearance structures extending along the rotation direction of the first transmission member 241 and the second transmission member 251, to avoid obstructing the first transmission member 241 and the second transmission member 251 on their rotation path.

[0058] Furthermore, the first transmission member 241 corresponds one-to-one with the mounting shaft 231 and is respectively housed in different mounting bases 233, and the second transmission member 251 corresponds one-to-one with the mounting shaft 231 and is respectively housed in different mounting bases 233. The camera module 240 is connected to different first transmission members 241 at both ends in the Y-axis direction, and the light source module 250 is connected to different second transmission members 251 at both ends in the Y-axis direction.

[0059] There are two first drive shafts 262, each housed in a different mounting base 233. Each first drive shaft 262 is arranged below the first transmission member 241, and each first drive shaft 262 is equipped with a second transmission gear 266. There are also two second drive shafts 263, each housed in a different mounting base 233. Each second drive shaft 263 is arranged below the second transmission member 251, and each second drive shaft 263 is equipped with a third transmission gear 267. A drive shaft 261 is located below the first drive shafts 262 and 263, situated between two opposing first side plates 234, with both ends extending through the first side plates 234 into different mounting bases 233. Each end of the drive shaft 261 is fitted with a first transmission gear 265, corresponding one-to-one with the second transmission gear 266.

[0060] The adjustment process of the vision mechanism 210 of the present invention is as follows: the drive motor 264 drives the active shaft 261 to rotate around the Y-axis, which can drive the first transmission shaft 262 to rotate around the Y-axis. The first transmission shaft 262 can drive the second transmission shaft 263 to rotate around the Y-axis in the opposite direction, thereby driving the first transmission component 241 and the second transmission component 251 to rotate around the Y-axis in the opposite direction, so as to realize the synchronous reverse rotation of the camera module 240 and the light source module 250.

[0061] Furthermore, referring to Figure 2 As shown, the clamping mechanism 110 includes a plurality of clamping units 130 equally spaced along the circumference of the wafer 500. Each clamping unit 130 includes at least one clamping assembly 140. The clamping assembly 140 includes a clamping member 150, an elastic member 160, and a drive cylinder 170. The clamping member 150 can move closer to or further away from the periphery of the wafer 500 along the radial direction of the wafer 500. When the piston rod of the drive cylinder 170 extends, it can drive the clamping member 150 away from the wafer 500 and stretch the elastic member 160. When the drive cylinder 170 removes the driving action on the clamping member 150, the elastic member 160 rebounds, thereby driving the clamping member 150 to clamp the wafer 500. The clamping member 150 is configured to form a line contact with the periphery of the wafer 500.

[0062] The present invention employs the above-described structure. The clamping device 100, through the synergistic action of the drive cylinder 170 and the elastic element 160, provides effective buffering during the clamping and releasing of the wafer 500 by the extension and retraction of the elastic element 160, preventing edge chipping or micro-cracks in the wafer 500 caused by rigid collisions. The continuous and flexible clamping force provided by the elastic element 160 ensures a stable relative position between the wafer 500 and the clamping element 150 during transfer, emergency stops, or trajectory changes, eliminating friction caused by minute slippage or vibration. Damage; the clamping element 150 forms line contact with the periphery of the wafer 500, which greatly reduces the contact area compared with the traditional surface contact clamping, significantly reducing the risk of scratches or contaminant particles on the surface of the wafer 500 during clamping. In addition, multiple clamping units 130 are evenly distributed along the circumference of the wafer 500. Combined with the line contact method, the clamping force can be evenly distributed on the edge of the wafer 500, avoiding local stress concentration and preventing the wafer 500 from bending or deforming during clamping. This is especially important for large-size thin wafers 500.

[0063] Furthermore, referring to Figures 5 to 7As shown, the clamping member 150 includes at least one clamping surface inclined to the Z-axis, which is configured to form line contact with a corresponding edge of the periphery of the wafer 500. The edge of the wafer 500 may be formed by the intersection of the end face of the wafer 500 and the periphery of the wafer 500. When there is one clamping surface, it may contact the upper edge or the lower edge of the wafer 500; when there are two clamping surfaces, each clamping surface contacts the upper edge and the lower edge of the wafer 500, respectively.

[0064] Admittedly, in other embodiments, the periphery of the wafer 500 is provided with a chamfer 510, such that the beveled surface where the chamfer 510 is located forms an edge line with both the end face of the wafer 500 and the periphery of the wafer 500. At least one clamping surface is in contact with the edge line formed by the chamfer 510. Preferably, in this embodiment, chamfers 510 are provided on both the upper and lower sides of the wafer 500, that is, four edge lines are formed on the periphery of the wafer 500, and each clamping surface can selectively contact one edge line.

[0065] By adopting the above structure, the bevel of chamfer 510 provides a natural guide surface for the clamping process, enabling the clamping component 150 to be positioned more smoothly and accurately to the contact edge, improving the alignment tolerance and operational stability of the clamping. The contact position is transferred from the sharp and fragile original edge to the bevel edge of the chamfer 510 after grinding, effectively eliminating the "knife-edge effect" and significantly reducing the risk of chipping at the edge of the wafer 500 through better stress distribution. The chamfer 510 area is usually the non-active area of ​​the wafer 500. Contacting here can maximize the distance from the core area of ​​the chip, and the chamfer surface itself is smoother, thereby significantly reducing the amount of contaminant particles generated and adhering to the active area during the clamping process.

[0066] Furthermore, the clamping member 150 includes an upper clamping surface 1521 and a lower clamping surface 1522 arranged at an angle. Both the upper clamping surface 1521 and the lower clamping surface 1522 are inclined to the Z-axis, and the upper clamping surface 1521 and the lower clamping surface 1522 respectively form line contact with different edges corresponding to the periphery of the wafer 500.

[0067] The upper clamping surface 1521 and lower clamping surface 1522, arranged at an angle, simultaneously form line contact with the two corresponding upper and lower edges of the wafer 500's periphery, creating a stable spatial constraint. This effectively limits the displacement and sway of the wafer 500 along the Z-axis during clamping, significantly improving the rigidity and stability of the clamping, making it particularly suitable for high-speed transport and emergency stop conditions. The wedge-shaped or V-shaped structure formed by the dual clamping surfaces provides radial clamping force while generating a slight axial component force, which helps the wafer 500 to automatically center radially and adhere tightly to the fixed position. The dual-line contact system provides a reference point, ensuring repeatability of the detection pose. Compared to single-line contact, dual-line contact distributes the clamping force more evenly across the upper and lower edges of the wafer 500, greatly reducing local stress concentration. Combined with the small contact area of ​​the line contact itself, this further reduces the risk of indentation, chipping, or micro-cracks on the wafer 500 edge. In addition, this structure has a certain degree of adaptability to the tolerances of wafer 500 thickness and edge morphology, enhancing the equipment's compatibility and clamping reliability for different batches of wafer 500.

[0068] Furthermore, the horizontal plane containing the intersection line of the upper clamping surface 1521 and the lower clamping surface 1522 has an angle α with respect to the upper clamping surface 1521, where 60° ≤ α < 90°. The horizontal plane containing the intersection line of the upper clamping surface 1521 and the lower clamping surface 1522 has an angle β with respect to the lower clamping surface 1522, where 15° ≤ β ≤ 30°. By limiting these angles, the optimal allocation of the three functions of constraint, clamping, and lifting on the upper clamping surface 1521 and the lower clamping surface 1522 can be achieved.

[0069] Furthermore, referring to Figures 2 to 5 As shown, the clamping mechanism 110 includes a base 180 that is driveably connected to the Z-axis module 120, and each clamping unit 130 is mounted on the top of the base 180. The clamping member 150 includes a seat 151 and a clamping block 152. A slide rail assembly 181 is provided on the base 180, and the seat 151 is disposed on the slide rail assembly 181 so as to be slidably connected to the base 180. The clamping block 152 is fixedly connected to the seat 151 and is located below the base 180. A mounting block 182 is provided on the top of the base 180, and the mounting block 182 corresponds one-to-one with the clamping member 150. An elastic member 160 is connected between the seat 151 and the mounting block 182.

[0070] In this embodiment, the seat 151 extends beyond the base 180 to form a mounting portion 1511. The mounting portion 1511 has an adjustment groove 1512 recessed inward on the outer side of the slide rail assembly 181 in the sliding direction. The adjustment groove 1512 penetrates the mounting portion 1511 downward along the Z-axis direction.

[0071] The clamping member 150 also includes an adjusting block 153, which is embedded in the adjusting groove 1512 and extends downward along the Z-axis beyond the adjusting groove 1512. The adjusting groove 1512 is adapted to guide the adjusting block 153 to move and adjust along the Z-axis. The mounting part 1511 has a first connecting hole at the bottom of the adjusting groove 1512, and the adjusting block 153 has a second connecting hole 1531 corresponding to the first connecting hole. The second connecting hole 1531 is a strip-shaped hole with its length direction parallel to the Z-axis. A threaded component connects the first connecting hole and the second connecting hole 1531 to fix the adjusting block 153 and the mounting part 1511. The clamping block 152 is fixedly connected to the portion of the adjusting block 153 that extends out of the adjusting groove 1512. The clamping block 152 can move synchronously with the adjusting block 153 along the Z-axis to accommodate wafers 500 of different thicknesses.

[0072] Preferably, the adjusting groove 1512 has a first adjusting hole 1513 extending through it along the Z-axis on the non-open side. The adjusting block 153 has a second adjusting hole 1532 recessed inwards on the side facing the first adjusting hole 1513. An adjusting bolt 154 is threaded between the first adjusting hole 1513 and the second adjusting hole 1532. The adjusting bolt 154 is inserted sequentially into the first adjusting hole 1513 and the second adjusting hole 1532 via the upper end of the first adjusting hole 1513. When the adjusting block 153 and the mounting part 1511 are loosened, rotating the adjusting bolt 154 drives the adjusting block 153 to make fine adjustments along the Z-axis, thereby improving the adjustment accuracy.

[0073] Furthermore, a limiting structure is provided between the mounting block 182 and the base 151, which is adapted to limit the ultimate clamping position of the clamping member 150. The limiting structure includes a first adjusting screw 191 threadedly connected to the base 151 and a limiting post 192 fixedly connected to the mounting block 182. The first adjusting screw 191 and the limiting post 192 are arranged opposite each other along the radial direction of the wafer 500, and their axial directions are both parallel to the sliding direction of the base 151. By rotating the first adjusting screw 191, the distance between the first adjusting screw 191 and the limiting post 192 can be adjusted to adjust the ultimate clamping position of the clamping member 150.

[0074] Furthermore, an adjustment structure for adjusting the stretching degree of the elastic element 160 is provided between the base 151 and the elastic element 160 and / or between the mounting block 182 and the elastic element 160. In this embodiment, the adjustment structure is a second adjusting screw 193 with its axis parallel to the sliding direction of the base 151. By providing the adjustment structure, the clamping force of the clamping member 150 can be adjusted to the optimal level, ensuring that the wafer 500 can be reliably clamped while preventing damage to the wafer 500 due to clamping.

[0075] Furthermore, the drive cylinder 170 is disposed on the base 180. It is a linear cylinder arranged along the sliding direction of the seat 151. Its piston rod can be fixedly connected to the seat 151 to push the seat 151, so that the clamping assembly 140 is in the released position. When the air supply to the drive cylinder 170 is stopped, the seat 151 moves to the clamping position under the rebound action of the elastic member 160, while pushing the piston rod to retract. Admittedly, in other embodiments, the piston rod may not be connected to the seat 151. When it extends, it can push the seat 151, so that the clamping assembly 140 is in the released position. When it is necessary to clamp the wafer 500, the piston rod of the drive cylinder 170 retracts to contact the push against the seat 151, so that the seat 151 moves to the clamping position under the rebound action of the elastic member 160.

[0076] Furthermore, there are three clamping units 130 arranged in a circular array on the base 180, with adjacent clamping units 130 spaced 120° apart. Each clamping unit 130 includes two clamping components 140 arranged at an acute angle, and the two clamping components 140 of the same clamping unit 130 gradually move away from each other in the direction from the center to the edge of the wafer 500. By adopting the above structure, the structure of the clamping device 100 can be greatly simplified while the clamping effect of the clamping device 100 is optimized.

[0077] Furthermore, a leveling disk 183 is fixed at the bottom of the base 180. The leveling disk 183 is a disc-shaped structure with the same axis as the wafer 500. The leveling disk 183 can fit against the upper surface of the wafer 500 to prevent the wafer 500 from warping during the clamping process.

[0078] Furthermore, the Z-axis module 120 is a conventional linear module, used to drive the clamping mechanism 110 to descend to the position of clamping the wafer 500 or to rise to the position of avoiding the inflow and outflow of the wafer 500.

[0079] Furthermore, referring to Figure 13 and Figure 14 As shown, the present invention also provides an inspection system, including a surface inspection device, a carrier device 300, and a second inspection device 400. The carrier device 300 includes a rotary table mechanism 310 for carrying and rotating a wafer 500, and a second X-axis module 320 for driving the rotary table mechanism 310 to move along the X-axis direction to a first inspection station or a second inspection station. When the rotary table mechanism 310 is in the first inspection station, the clamping device 100 is located directly above the rotary table mechanism 310, so that the clamping device 100 can clamp the wafer 500 and perform visual inspection of the lower end face under the action of the first inspection device 400.

[0080] The second inspection device 400 is located at the second inspection station and includes multiple inspection mechanisms to perform inspections on different items. When the rotary table mechanism 310 is at the second inspection station, the multiple inspection mechanisms are arranged at circumferential intervals around the rotary table mechanism 310. As the rotary table mechanism 310 drives the wafer 500 to rotate, each inspection mechanism can perform comprehensive inspections on the wafer 500.

[0081] Furthermore, the rotary stage mechanism 310, the vision mechanism 210, and the clamping mechanism 110 are arranged sequentially from bottom to top along the Z-axis so that the wafer 500 is not obstructed during its movement along the X-axis. The rotary stage mechanism 310 and the vision mechanism 210 are adapted to move along the X-axis so that the projections of the rotary stage mechanism 310, the vision mechanism 210, and the clamping mechanism 110 in the Z-axis direction do not overlap, ensuring that the vision mechanism 210 can successfully capture images of the lower surface of the wafer 500.

[0082] The working process of the detection system of the present invention is as follows: The rotary table mechanism 310 first moves to the second detection station under the drive of the second X-axis module 320 to receive the wafer 500 to be detected, and then drives the wafer 500 to rotate so that the second detection device 400 can detect the wafer 500; after the detection is completed, the rotary table mechanism 310 moves to the first detection station under the drive of the second X-axis module 320, and the clamping mechanism 110 moves downward under the drive of the Z-axis module 120 to clamp the wafer 500 and then rises to reset; then the rotary table mechanism 310 moves away from the first detection station under the drive of the second X-axis module 320. In the first inspection station, the vision mechanism 210 moves along the X-axis under the drive of the first X-axis module 220 to capture the entire lower surface of the wafer 500. During this process, the adjustment component 260 can adjust the angles of the light source module 250 and the camera module 240 to meet different inspection requirements. After the inspection is completed, the rotary table mechanism 310 moves back to the first inspection station, and the clamping mechanism 110 descends under the drive of the Z-axis module 120 to put the wafer 500 back into the rotary table mechanism 310. Then the rotary table mechanism 310 moves back to the second inspection station, and after the wafer 500 is removed, it receives a new wafer 500 to be inspected.

[0083] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A defect detection device, characterized in that, include: The clamping device (100) includes a clamping mechanism (110) for clamping a wafer (500) and a Z-axis module (120) for driving the clamping mechanism (110) to move up and down along the Z-axis direction. The first detection device (200) is located below the clamping device (100), and includes a vision mechanism (210) and a first X-axis module (220) that drives the vision mechanism (210) to move along the X-axis direction. The vision mechanism (210) includes a mounting frame (230), a camera module (240) and a light source module (250) disposed on the mounting frame (230). The mounting frame (230) is provided with a mounting shaft (231), a first transmission member (241) and a second transmission member (251) rotatably sleeved on the mounting shaft (231). The camera module (240) is fixedly connected to the first transmission member (241), and the light source module (250) is fixedly connected to the second transmission member (251). The vision mechanism (210) includes an adjustment component (260) disposed on the mounting frame (230). The adjustment component (260) is adapted to drive the first transmission member (241) and the second transmission member (251) to rotate in opposite directions around the mounting shaft (231). The adjustment component (260) includes: The drive shaft (261) is rotatably mounted on the mounting bracket (230), and a first transmission gear (265) is fixedly sleeved on it. A first drive shaft (262) is rotatably mounted on the mounting bracket (230), and a second drive gear (266) that meshes with the first drive gear (265) is fixedly sleeved on it. The second drive shaft (263) is rotatably mounted on the mounting bracket (230), and a third drive gear (267) that meshes with the second drive gear (266) is fixedly sleeved on it. A drive motor (264) is mounted on the mounting bracket (230) and is connected to the drive shaft (261) in a transmission manner; The first drive shaft (262) is connected to the first drive component (241), and the second drive shaft (263) is connected to the second drive component (251). The axial direction of the mounting shaft (231) and the axial direction of the drive shaft (261) are both parallel to the Y-axis direction, and the axial directions of the first transmission shaft (262) and the second transmission shaft (263) are both parallel to the X-axis direction. The mounting bracket (230) has a mounting seat (233) on both sides in the Y-axis direction. Each mounting seat (233) has a coaxial mounting shaft (231) fixedly connected inside. The first transmission member (241) corresponds one-to-one with the mounting shaft (231) and is respectively housed in different mounting seats (233). The second transmission member (251) corresponds one-to-one with the mounting shaft (231) and is respectively housed in different mounting seats (233). Both the camera module (240) and the light source module (250) are housed in the housing space between the two mounting bases (233). The camera module (240) is connected to different first transmission components (241) at both ends in the Y-axis direction, and the light source module (250) is connected to different second transmission components (251) at both ends in the Y-axis direction.

2. The defect detection equipment as described in claim 1, characterized in that, The camera module (240) and the light source module (250) are located below the mounting shaft (231), and the intersection of the optical axes of the camera module (240) and the light source module (250) is on the axis of the mounting shaft (231).

3. The defect detection equipment as described in claim 1, characterized in that, Both the first drive shaft (262) and the second drive shaft (263) are worm gear structures. The outer contours of the first transmission member (241) and the second transmission member (251) are arc-shaped structures coaxial with the mounting shaft (231), and both have teeth on their outer edges. The first transmission member (241) meshes with the first drive shaft (262), and the second transmission member (251) meshes with the second drive shaft (263).

4. The defect detection equipment as described in claim 1, characterized in that, There are two first drive shafts (262), each housed in a different mounting base (233). The first drive shafts (262) are arranged one-to-one below the first transmission member (241). There are two second drive shafts (263), each housed in a different mounting base (233). The second drive shafts (263) are arranged one-to-one below the second transmission member (251). Each first drive shaft (262) is provided with a second transmission gear (266), and each second drive shaft (263) is provided with a third transmission gear (267). The two ends of the drive shaft (261) extend into different mounting bases (233). The two ends of the drive shaft (261) are fitted with the first transmission gear (265) to correspond one-to-one with the second transmission gear (266).

5. The defect detection equipment as described in claim 1, characterized in that, The first transmission member (241) is closer to the camera module (240) and / or the light source module (250) than the second transmission member (251). Both mounting bases (233) have clearance holes (2341) on opposite sides. The first transmission member (241) is provided with a first connector (242). The first connector (242) passes through the clearance hole (2341) and is connected to the end of the camera module (240). The first transmission member (241) is provided with a clearance part (2411). The second transmission member (251) is provided with a second connector (252). The second connector (252) passes through the clearance part (2411) and the clearance hole (2341) and is connected to the end of the light source module (250).

6. The defect detection equipment as described in claim 1, characterized in that, The camera module (240) is a line array camera with its length direction parallel to the Y-axis direction, and the light source module (250) is a strip light source adapted to the camera module (240).

7. A detection system, characterized in that, Includes the defect detection equipment as described in any one of claims 1 to 6; The support device (300) includes a rotary table mechanism (310) for supporting and rotating the wafer (500) and a second X-axis module (320) for driving the rotary table mechanism (310) to move along the X-axis direction to a first inspection station or a second inspection station. When the rotary table mechanism (310) is at the first inspection station, the clamping device (100) is located directly above the rotary table mechanism (310). The second detection device (400) is located at the second detection station; The rotary table mechanism (310), the vision mechanism (210), and the clamping mechanism (110) are arranged sequentially from bottom to top along the Z-axis, and the rotary table mechanism (310) and the vision mechanism (210) are adapted to move along the X-axis direction so that the projections of the rotary table mechanism (310), the vision mechanism (210), and the clamping mechanism (110) in the Z-axis direction do not overlap.

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