Heat-conducting interface material as well as preparation method and application thereof
By introducing naphthyl groups into the hydrogen-containing polysiloxane structure and combining it with low-volatility vinyl silicone oil and other components, the volatility problem of thermally conductive interface materials under high-temperature environments is solved, achieving high thermal stability and low volatility, making it suitable for security equipment and semiconductor equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-29
- Publication Date
- 2026-03-20
AI Technical Summary
Existing thermally conductive interface materials cause volatile substances to accumulate in the camera lens before and after curing, resulting in unclear images and insufficient thermal stability.
By introducing a high-temperature resistant aromatic ring (naphthyl) into the hydrogen-containing polysiloxane structure, and combining it with low-volatile vinyl silicone oil, thermally conductive filler, platinum catalyst and inhibitor, the metal ion content and ash content are controlled to prepare a thermally stable thermally conductive interface material.
It effectively reduces the volatile small molecules of thermally conductive interface materials under high-temperature environments, ensuring the thermal stability of the material before and after curing, avoiding the accumulation of volatile substances, and meeting the precision requirements of security equipment and semiconductor equipment.
Smart Images
Figure CN121699403A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of thermally conductive interface materials technology, and specifically relates to a thermally conductive interface material, its preparation method, and its application. Background Technology
[0002] Low-volatile thermal interface materials are used in security and semiconductor equipment, requiring low volatile content, high thermal conductivity, low thermal resistance, and low stress. Commonly used thermal interface materials include thermal conductive gels, thermal conductive greases, and thermal conductive silicone sheets. Among them, thermal conductive silicone gels offer advantages such as adjustable thermal conductivity, good temperature resistance, vibration and pump-out resistance, low stress, and automated dispensing. However, due to the inherent properties of their base polymers, additives, and fillers, these conventional thermal interface materials contain volatile substances before and after curing. When applied to camera lenses, these volatile substances can accumulate on the lens, leading to problems such as unclear images.
[0003] Therefore, it is of great significance to provide a thermally conductive interface material with good thermal stability and low volatile content before and after curing. Summary of the Invention
[0004] The present invention aims to solve one or more technical problems existing in the prior art, and at least provide a beneficial solution. Specifically, the present invention provides a thermally conductive interface material with good thermal stability and low volatile content before and after curing.
[0005] The inventive concept of this invention: The thermally conductive interface material of this invention comprises component A and component B; component A includes vinyl silicone oil, thermally conductive filler, and catalyst; component B includes vinyl silicone oil, modified hydrogen-containing polysiloxane, inhibitor, and thermally conductive filler; The raw materials for preparing the modified hydrogen-containing polysiloxane include hydrogen-containing silane monomers, methyl silane monomers, and aryl silane monomers.
[0006] This invention effectively improves the thermal stability of hydrogen-containing polysiloxanes by introducing a high-temperature resistant aromatic ring (naphthyl) into the structure of the hydrogen-containing polysiloxane, avoiding the volatile small molecules caused by the degradation of the main chain of the hydrogen-containing polysiloxane under long-term high-temperature environment. Combined with the synergistic effect of other components, the thermally conductive interface material has the advantages of good thermal stability and low volatile content before and after curing.
[0007] Therefore, a first aspect of the present invention provides a thermally conductive interface material.
[0008] Specifically, the thermally conductive interface material includes component A and component B; Component A includes vinyl silicone oil, thermally conductive filler, and catalyst; Component B includes vinyl silicone oil, modified hydrogen-containing polysiloxane, inhibitor, and thermally conductive filler; The raw materials for preparing the modified hydrogen-containing polysiloxane include hydrogen-containing silane monomers, methyl silane monomers, and aryl silane monomers.
[0009] Preferably, in the thermally conductive interface material, the molar ratio of hydrogen-containing functional groups to vinyl functional groups (Si-H and Si-Vi molar ratio) is (0.3-0.5):1.
[0010] Preferably, the vinyl silicone oil includes at least one of single-ended vinyl silicone oil and double-ended vinyl silicone oil.
[0011] Preferably, the volatile matter content of the vinyl silicone oil is ≤0.05wt%.
[0012] Preferably, the viscosity of the vinyl silicone oil is ≤1000cps at 25°C; more preferably, the viscosity of the vinyl silicone oil is ≤350cps at 25°C.
[0013] Preferably, the content of metal ions in the vinyl silicone oil is ≤2ppm.
[0014] Specifically, this invention introduces low-volatility single-ended vinyl silicone oil and / or double-ended vinyl silicone oil into the thermally conductive interface material, resulting in extremely low volatility of the vinyl silicone oil component before and after curing. Before curing, no volatile components are released at 150-200℃ for 12 hours. Simultaneously, by controlling the metal ion content in the vinyl silicone oil, the degradation of the siloxane backbone under high-temperature aerobic conditions is effectively reduced, further decreasing the volatile small molecules resulting from the degradation of the vinyl silicone oil backbone before and after curing.
[0015] Preferably, by weight, component A comprises 0 to 200 parts vinyl silicone oil, 150-800 parts thermally conductive filler, and 0.5-3 parts catalyst; component B comprises 0 to 200 parts vinyl silicone oil, 1-25 parts modified hydrogen-containing polysiloxane, 0.05-0.25 parts inhibitor, and 150-800 parts thermally conductive filler.
[0016] Preferably, the vinyl silicone oil includes single-ended vinyl silicone oil and double-ended vinyl silicone oil; and by weight, component A includes more than 0 parts and less than or equal to 100 parts of single-ended vinyl silicone oil, more than 0 parts and less than or equal to 100 parts of double-ended vinyl silicone oil, 150-800 parts of thermally conductive filler, and 0.5-3 parts of catalyst; component B includes more than 0 parts and less than or equal to 100 parts of single-ended vinyl silicone oil, more than 0 parts and less than or equal to 100 parts of double-ended vinyl silicone oil, 1-25 parts of modified hydrogen-containing polysiloxane, 0.05-0.25 parts of inhibitor, and 150-800 parts of thermally conductive filler.
[0017] Preferably, the thermally conductive filler comprises at least one of aluminum hydroxide, alumina, silica powder, vinyltrialkoxysilane-treated aluminum hydroxide, vinyltrialkoxysilane-treated alumina, and vinyltrialkoxysilane-treated silica powder. The ash content of the thermally conductive filler is less than 0.05%, and the metal ion content is less than 2 ppm.
[0018] Preferably, the catalyst comprises a platinum catalyst.
[0019] Specifically, the platinum catalyst is a 5000ppm castor catalyst, and the diluent silicone oil is a single-ended vinyl silicone oil or a double-ended vinyl silicone oil with low cyclic content.
[0020] Preferably, the inhibitor comprises at least one of tetramethyltetravinylcyclotetrasiloxane, divinyltetramethyldisiloxane, polyvinyl silicone oil, and organosilicon-modified alkynol; more preferably, the inhibitor comprises at least one of low-cyclic polyvinyl silicone oil and low-cyclic organosilicon-modified alkynol.
[0021] Specifically, by controlling the impurity ion content and ash content in the thermally conductive filler, and using low-volatility platinum catalysts and inhibitors, the volatile content of the thermally conductive interface material before and after curing was further reduced.
[0022] Preferably, the raw materials for preparing the modified hydrogen-containing polysiloxane include 3-35 parts of hydrogen-containing silane monomer, 40-75 parts of methyl silane monomer and 20-30 parts of aryl silane monomer, by weight.
[0023] Preferably, the raw materials for preparing the modified hydrogen-containing polysiloxane further include an acid solution; and by weight, the raw materials for preparing the modified hydrogen-containing polysiloxane include 3-35 parts of hydrogen-containing silane monomer, 40-75 parts of methyl silane monomer, 20-30 parts of aryl silane monomer, and 2.8-5 parts of acid solution.
[0024] Specifically, by introducing a high-temperature resistant aromatic ring (naphthyl) into the structure of hydrogen-containing polysiloxane, the thermal stability of hydrogen-containing polysiloxane is effectively improved, avoiding the volatile small molecules caused by the degradation of the main chain of hydrogen-containing polysiloxane under long-term high-temperature environment.
[0025] Preferably, the hydrogen content in the modified hydrogen-containing polysiloxane is ≤0.5% by mass.
[0026] Preferably, the hydrogen-containing silane monomer includes tetramethyldisiloxane, tetramethylcyclotetrasiloxane, and high-hydrogen-content silicone oil.
[0027] Preferably, the high-hydrogen silicone oil has a viscosity of 20-30 cps at 25°C and a hydrogen content of 1.5-1.6 wt%.
[0028] Preferably, the methylsilane monomer comprises at least one of hexamethyldisiloxane, a mixed cyclic form of dimethylsiloxane, dimethyldimethoxysilane, dimethyldiethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, tetramethoxysilane, and tetraethoxysilane.
[0029] Preferably, the arylsilane monomer includes at least one of naphthyltrimethoxysilane, naphthyltriethoxysilane, dinaphthyldimethoxysilane, and dinaphthyldiethoxysilane.
[0030] Preferably, the acid solution comprises an aqueous solution of hydrochloric acid.
[0031] Preferably, the hydrochloric acid aqueous solution has a mass fraction of 1-5%.
[0032] A second aspect of the present invention provides a method for preparing the thermally conductive interface material described in the first aspect of the present invention.
[0033] Specifically, the preparation method of the thermally conductive interface material includes the following steps: The raw material components of component A are mixed to obtain component A; The raw material components of component B are mixed to obtain component B; The components A and B constitute the thermally conductive interface material.
[0034] Preferably, the preparation method of component A includes the following steps: mixing vinyl silicone oil and thermally conductive filler of component A, and vacuum degassing; then adding a catalyst and vacuum degassing to obtain component A.
[0035] Preferably, during the preparation of component A, the vacuum degree of the vacuum de-lowering is above -0.09 MPa, the vacuum de-lowering temperature is 100-130°C, and the vacuum de-lowering time is 1.5-2.5 h.
[0036] Preferably, in the preparation process of component A, after vacuum decooling, the temperature is first lowered to below 50°C, and then the catalyst is added.
[0037] Preferably, during the preparation of component A, the vacuum degree of the vacuum degassing is above -0.09 MPa, and the vacuum degassing time is 5-30 min.
[0038] Preferably, the preparation method of component B includes the following steps: mixing vinyl silicone oil and thermally conductive filler of component B, and vacuum degassing; then adding modified hydrogen-containing polysiloxane and inhibitor, and vacuum degassing to obtain component B.
[0039] Preferably, in the preparation process of component B, the vacuum degree of the vacuum de-descaling is above -0.09 MPa, the vacuum de-descaling temperature is 100-130℃, and the vacuum de-descaling time is 1.5-2.5 h.
[0040] Preferably, during the preparation of component B, after vacuum de-lowering, the temperature is first lowered to below 35°C, and then the modified hydrogen-containing polysiloxane and inhibitor are added.
[0041] Preferably, during the preparation of component B, the vacuum degree of the vacuum degassing is above -0.09 MPa, and the vacuum degassing time is 5-15 min.
[0042] Preferably, the method for preparing the modified hydrogen-containing polysiloxane includes the following steps: The mixture of hydrogen-containing silane monomer, methyl silane monomer and aryl silane monomer is heated, acid solution is added, and the mixture is reacted to obtain the final product.
[0043] Preferably, the temperature after heating is 25-45℃.
[0044] Preferably, the reaction temperature is 30-45°C and the reaction time is 3-6 hours.
[0045] Preferably, after the reaction, the mixture is separated into liquid and calcium carbonate and anhydrous sodium sulfate are added to the organic phase to neutralize to pH=7, then filtered, and low molecular weight molecules are removed under reduced pressure to obtain the modified hydrogen-containing polysiloxane.
[0046] A third aspect of the present invention provides an apparatus.
[0047] Specifically, the device includes the thermally conductive interface material described in the first aspect of the present invention.
[0048] Specifically, the device includes security equipment or semiconductor equipment.
[0049] Compared with the prior art, the beneficial effects of the technical solution provided by the present invention are as follows: (1) By introducing a high-temperature resistant aromatic ring (naphthyl) into the structure of hydrogen-containing polysiloxane, the present invention effectively improves the thermal stability of hydrogen-containing polysiloxane and avoids the volatile small molecules caused by the degradation of the main chain of hydrogen-containing polysiloxane under long-term high-temperature environment.
[0050] (2) The present invention introduces low-volatility single-ended vinyl silicone oil or / and double-ended vinyl silicone oil into the thermal interface material, so that the volatile content of the vinyl silicone oil component is extremely low before and after curing. Before curing, no volatile components are released at 150-200℃ for 12h. At the same time, the metal ion content in the vinyl silicone oil is controlled, which effectively reduces the degradation of the siloxane backbone under high temperature and oxygen environment, and further reduces the volatile small molecules caused by the degradation of the vinyl silicone oil backbone before and after curing.
[0051] (3) By controlling the metal ion content and ash content of the thermally conductive filler, and by using low-volatility platinum catalysts and inhibitors, the present invention further reduces the volatile content of the thermally conductive interface material before and after curing. Attached Figure Description
[0052] Figure 1 This is a graph showing the test results of the thermal stability and volatility of the thermally conductive interface material in Example 1 of the present invention; Figure 2 The figure shows the test results of thermal stability and volatility of the thermally conductive interface material in Comparative Example 1. Detailed Implementation
[0053] To enable those skilled in the art to more clearly understand the technical solutions described in this invention, the following embodiments are provided for illustration. It should be noted that the following embodiments do not constitute a limitation on the scope of protection claimed by this invention.
[0054] Unless otherwise specified, the raw materials, reagents or devices used in the following examples are available from conventional commercial sources or can be obtained by existing known methods.
[0055] The information on the relevant raw material components in this embodiment of the invention is as follows: Dual-terminated vinyl silicone oil: C-3 (100) from Guangzhou Jietai Chemical Co., Ltd. Thermally conductive filler aluminum hydroxide: Guangdong Jingge New Material Co., Ltd. FA-090; Platinum catalyst (Cast catalyst with a platinum content of 5000ppm): Jiangxi Betterley New Materials Co., Ltd. CSAT-F60050; Inhibitor polyvinyl silicone oil: Guangzhou Jietai Chemical Co., Ltd. C-3 (50); Dimethylsiloxane mixed cyclic compound (DMC): Zhejiang Xin'an Chemical Group Co., Ltd.
[0056] Example 1 This embodiment provides a thermally conductive interface material, which is composed of component A and component B; By weight, component A consists of 45 parts of dual-end vinyl silicone oil (viscosity 300 cps at 25°C, vinyl content 0.57 wt%, D3-D20 < 100 ppm), 253.8 parts of aluminum hydroxide, and 1.2 parts of platinum catalyst (5000 ppm, diluted with low-cyclic silicone oil). By weight, component B consists of 43.74 parts of dual-end vinyl silicone oil (viscosity 300 cps, vinyl content 0.57 wt%, D3-D20 content less than 100 ppm), 1.95 parts of modified hydrogen-containing polysiloxane, 254.26 parts of aluminum hydroxide, and 0.05 parts of polyvinyl silicone oil (vinyl content 2.0 wt%, viscosity 30 cps at 25°C, D3-D20 content less than 100 ppm).
[0057] This embodiment also provides a method for preparing the above-mentioned thermally conductive interface material, the steps of which are as follows: The double-ended vinyl silicone oil and thermally conductive filler were vacuum degassed at -0.09 MPa and 110°C for 2 hours, then cooled to 48°C, and a platinum catalyst was added. The mixture was then vacuum degassed at -0.09 MPa for 30 minutes and discharged to obtain component A. The double-ended vinyl silicone oil and thermally conductive filler were mixed and vacuum degassed at -0.09 MPa and 110°C for 2 hours. The mixture was then cooled to 33°C, and modified hydrogen-containing polysiloxane and inhibitor were added. The mixture was then vacuum degassed at -0.09 MPa for 15 minutes and discharged to obtain component B. Component A and component B are mixed in a 1:1 mass ratio to form a thermally conductive interface material.
[0058] The preparation process of modified hydrogen-containing polysiloxane is as follows: By weight, 29.3 parts of dinoxydimethoxysilane, 7.9 parts of hexamethyldisiloxane, 51.0 parts of a mixed cyclic compound of dimethylsiloxane, and 10.8 parts of tetramethylcyclotetrasiloxane were mixed, heated to 30°C, and 3.6 parts of 2wt% hydrochloric acid aqueous solution were added dropwise. The mixture was stirred at 45°C for 4 hours, neutralized with calcium carbonate to pH=7, filtered, and the solvent was removed under reduced pressure. The cyclic compound content was 100ppm, yielding naphthyl-modified hydrogen-containing silicone oil, i.e., modified hydrogen-containing polysiloxane, with a hydrogen mass content of 0.18% and a viscosity of 20cps at 25°C.
[0059] Example 2 The difference between Example 2 and Example 1 is that the amount of modified hydrogen-containing polysiloxane in the thermal interface material is 1.17 parts, and the modified hydrogen-containing polysiloxane is different; otherwise, they are the same as in Example 1.
[0060] In Example 2, the preparation process of the modified hydrogen-containing polysiloxane was as follows: 29.7 parts by weight of dinoxydimethoxysilane, 8 parts by weight of hexamethyldisiloxane, 44.2 parts by weight of a mixed cyclic form of dimethylsiloxane, and 17.9 parts by weight of tetramethylcyclotetrasiloxane were mixed, heated to 30°C, and 3.6 parts by weight of 2% hydrochloric acid aqueous solution were added dropwise. The mixture was stirred at 45°C for 4 hours, neutralized with calcium carbonate to pH=7, filtered, and the solvent was removed under reduced pressure. The cyclic content was 90 ppm, yielding naphthyl-modified hydrogen-containing silicone oil, i.e., modified hydrogen-containing polysiloxane, with a hydrogen mass content of 0.3% and a viscosity of 22.5 cps at 25°C.
[0061] Example 3 The difference between Example 3 and Example 1 is that the modified hydrogen-containing polysiloxane is different, but otherwise the same as Example 1.
[0062] In Example 3, the preparation process of the modified hydrogen-containing polysiloxane was as follows: 25.5 parts by weight of naphthyltrimethoxysilane, 6.9 parts by weight of tetramethyldisiloxane, 64 parts by weight of dimethylsiloxane mixed cyclic compound, and 3.6 parts by weight of tetramethylcyclotetrasiloxane were mixed and heated to 30°C. 3.7 parts by weight of 2% hydrochloric acid aqueous solution were added dropwise, and the mixture was stirred at 45°C for 4 hours. The mixture was neutralized with calcium carbonate to pH=7, filtered, and the solvent was removed under reduced pressure. The cyclic compound content was 85 ppm, yielding naphthyl-modified hydrogen-containing silicone oil, i.e., modified hydrogen-containing polysiloxane, with a hydrogen mass content of 0.18% and a viscosity of 35 cps at 25°C.
[0063] Example 4 The difference between Example 4 and Example 1 is that the amount of modified hydrogen-containing polysiloxane in the thermal interface material is 1.17 parts, and the modified hydrogen-containing polysiloxane is different; otherwise, it is the same as Example 1.
[0064] The preparation process of the modified hydrogen-containing polysiloxane in Example 4 is as follows: By weight, 24 parts of naphthyltrimethoxysilane, 12.9 parts of tetramethyldisiloxane, 57.8 parts of a mixed cyclic dimethylsiloxane, and 5.2 parts of tetramethylcyclotetrasiloxane are mixed and heated to 30°C. 2.8 parts of a 2% hydrochloric acid aqueous solution are added dropwise, and the mixture is stirred at 45°C for 4 hours. The mixture is neutralized with calcium carbonate to pH=7, filtered, and the solvent is removed under reduced pressure. The cyclic content is 90 ppm, yielding naphthyl-modified hydrogen-containing silicone oil, i.e., modified hydrogen-containing polysiloxane, with a hydrogen content of 0.3% and a viscosity of 32.5 cps at 25°C. Other steps are the same as in Example 1.
[0065] Comparative Example 1 The difference between Comparative Example 1 and Example 1 is that Comparative Example 1 uses a conventional methyl hydrogen-containing silicone oil with a hydrogen content of 0.18 wt% (cyclic content of 90 ppm) to replace the modified hydrogen-containing polysiloxane in Example 1 in equal amounts, while the rest is the same as in Example 1.
[0066] Performance testing The A and B components of the thermally conductive interface materials of Example 1 and Comparative Example 1 were passed through an AB mixing tube. 10 grams of the mixture of components A and B (mass ratio of 1:1) was placed in a 1L wide-mouth glass conical flask. The mouth of the flask was covered with a 1mm optical glass plate and placed on a heating platform. It was placed at 160°C for 16 hours to observe whether fog was generated, thereby judging the thermal stability and volatility.
[0067] The test results of thermal stability and volatility of the thermally conductive interface materials in Example 1 and Comparative Example 1 are as follows: Figure 1 and 2 As shown.
[0068] Depend on Figure 1 and Figure 2 As can be seen, after being placed at a high temperature of 160℃ for 16 hours, the surface of the optical glass slide of the thermally conductive interface material of the present invention remained clear without any fogging. In contrast, the thermally conductive interface material of Comparative Example 1 showed fogging on the surface of the optical glass slide after being placed at a high temperature. This indicates that the thermally conductive interface material of the present invention still has good thermal stability after being placed at high temperatures, and its volatility is low under high temperature conditions, which can meet the volatility requirements of precision equipment such as security lenses and semiconductor chips.
[0069] In summary, this invention effectively improves the thermal stability of hydrogen-containing polydimethylsiloxanes (PDMS) by introducing a high-temperature resistant aromatic ring (naphthyl group) into the structure of PMS or polysiloxanes, thus avoiding the release of volatile small molecules due to main-chain degradation under prolonged high-temperature conditions. By introducing low-volatility single-terminated vinyl silicone oil and / or double-terminated vinyl silicone oil into the thermally conductive interface material, the volatile content of the vinyl silicone oil component is extremely low before and after curing. Simultaneously, controlling the metal ion content in the vinyl silicone oil effectively reduces the degradation of the siloxane main chain under high-temperature aerobic conditions, further reducing the volatile small molecules resulting from the degradation of the vinyl silicone oil main chain before and after curing. Furthermore, by controlling the metal ion content and ash content in the thermally conductive filler, and employing low-volatility platinum catalysts and inhibitors, the volatile content of the thermally conductive interface material before and after curing is further reduced.
[0070] The above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the essence and scope of the technical solutions of the present invention.
Claims
1. A thermally conductive interface material, characterized in that, Includes component A and component B; Component A includes vinyl silicone oil, thermally conductive filler, and catalyst; Component B includes vinyl silicone oil, modified hydrogen-containing polysiloxane, inhibitor, and thermally conductive filler; The raw materials for preparing the modified hydrogen-containing polysiloxane include hydrogen-containing silane monomers, methyl silane monomers, and aryl silane monomers.
2. The thermally conductive interface material according to claim 1, characterized in that, The vinyl silicone oil includes at least one of single-ended vinyl silicone oil and double-ended vinyl silicone oil; And / or, the volatile matter content of the vinyl silicone oil is ≤0.05wt%; and / or, at 25°C, the viscosity of the vinyl silicone oil is ≤1000cps; and / or, the metal ion content in the vinyl silicone oil is ≤2ppm.
3. The thermally conductive interface material according to claim 1, characterized in that, By weight, component A comprises 0 to 200 parts vinyl silicone oil, 150-800 parts thermally conductive filler, and 0.5-3 parts catalyst; component B comprises 0 to 200 parts vinyl silicone oil, 1-25 parts modified hydrogen-containing polysiloxane, 0.05-0.25 parts inhibitor, and 150-800 parts thermally conductive filler.
4. The thermally conductive interface material according to claim 2, characterized in that, The vinyl silicone oil includes single-ended vinyl silicone oil and double-ended vinyl silicone oil; and by weight, component A includes more than 0 parts and less than or equal to 100 parts of single-ended vinyl silicone oil, more than 0 parts and less than or equal to 100 parts of double-ended vinyl silicone oil, 150-800 parts of thermally conductive filler, and 0.5-3 parts of catalyst; component B includes more than 0 parts and less than or equal to 100 parts of single-ended vinyl silicone oil, more than 0 parts and less than or equal to 100 parts of double-ended vinyl silicone oil, 1-25 parts of modified hydrogen-containing polysiloxane, 0.05-0.25 parts of inhibitor, and 150-800 parts of thermally conductive filler.
5. The thermally conductive interface material according to claim 1, characterized in that, The raw materials for preparing the modified hydrogen-containing polysiloxane, by weight, include 3-35 parts of hydrogen-containing silane monomer, 40-70 parts of methyl silane monomer, and 20-30 parts of aryl silane monomer.
6. The thermally conductive interface material according to claim 5, characterized in that, The raw materials for preparing the modified hydrogen-containing polysiloxane also include acid solution; and by weight, the raw materials for preparing the modified hydrogen-containing polysiloxane include 3-35 parts of hydrogen-containing silane monomer, 40-75 parts of methyl silane monomer, 20-30 parts of aryl silane monomer, and 2.8-5 parts of acid solution.
7. The thermally conductive interface material according to claim 5, characterized in that, The hydrogen content in the modified hydrogen-containing polysiloxane is ≤0.5% by mass.
8. The method for preparing the thermally conductive interface material according to any one of claims 1-7, characterized in that, The preparation method includes the following steps: The raw material components of component A are mixed to obtain component A; The raw material components of component B are mixed to obtain component B; The components A and B constitute the thermally conductive interface material.
9. The preparation method according to claim 8, characterized in that, The preparation method of the modified hydrogen-containing polysiloxane includes the following steps: The mixture of hydrogen-containing silane monomer, methyl silane monomer and aryl silane monomer is heated, acid solution is added, and the mixture is reacted to obtain the final product.
10. A device, characterized in that, Includes the thermally conductive interface material as described in any one of claims 1-7.