Inner flapping wing structure and separated heat pipe
By setting an internal flapping fin structure inside the riser section of the split heat pipe, the heat exchange efficiency is improved by utilizing the vibration of the piezoelectric ceramic component, which solves the problem of insufficient heat exchange capacity of the split heat pipe and achieves efficient fluid mixing and equipment flexibility.
Patent Information
- Application Number
- CN202511767163.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-27
- Publication Date
- 2026-03-20
AI Technical Summary
In the existing technology, the piezoelectric ceramic fan (flapping blade) heat exchange enhancement method has not been applied in the field of split heat pipes, resulting in insufficient heat exchange capacity.
An internal flapping structure, including an inner boss, a module fixing ring, and a piezoelectric ceramic component, is installed inside the riser section of the split heat pipe. The piezoelectric ceramic component vibrates under the action of an electric field, breaking the boundary layer, promoting fluid mixing, and improving heat exchange efficiency.
It significantly improves the heat exchange power of split heat pipes, enhances fluid temperature uniformity, extends equipment lifespan, and is suitable for power-constrained operating conditions.
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Figure CN121702215A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of heat exchanger technology, specifically to an internal flap structure and a split heat pipe. Background Technology
[0002] Among numerous heat transfer elements, heat pipes are among the most efficient, enabling long-distance passive transport of large amounts of heat over a small cross-sectional area. Heat pipes where the evaporator and condenser sections are arranged as independent devices and connected by insulated pipes to form a closed loop are called split-type heat pipes. Their greatest advantage lies in their separate arrangement for long-distance heat transfer and provides greater flexibility for the installation of related equipment.
[0003] Piezoelectric ceramic vibrators utilize the property of piezoelectric ceramic materials to deform under the influence of an electric field, converting electrical energy into mechanical vibration. Their working principle is the piezoelectric effect, where an applied electric field causes mechanical strain in the piezoelectric ceramic material, resulting in vibration. By applying an alternating voltage, periodic mechanical vibrations can be generated in the piezoelectric ceramic. Piezoelectric ceramic vibrators offer advantages such as high frequency stability, high response speed, and high precision, and are widely used in frequency control in electronic equipment, ultrasonic generators, sensors, microelectromechanical systems (MEMS), and medical devices.
[0004] Improving the heat transfer capacity of heat pipes has always been a key research focus in industry, and the technology of using piezoelectric ceramic fans (flapping blades) to enhance the heat transfer process has gradually become a research hotspot in recent years. Existing technologies include methods to improve the heat transfer capacity of heat pipes by setting up piezoelectric oscillating cavities, but these are primarily used for single-tube bundle heat pipes. The method of using piezoelectric ceramic fans (flapping blades) to enhance heat transfer has not been applied in the field of split-type heat pipes. Summary of the Invention
[0005] In view of this, the present invention provides an inner flapping fin structure and a split heat pipe to solve the problem that the method of enhancing heat transfer by electro-ceramic fans has not been applied in the field of split heat pipes.
[0006] In a first aspect, the present invention provides an inner flapping wing structure suitable for installation within a riser section, comprising: The inner boss is adapted to connect with the inner wall of the riser section.
[0007] A module fixing ring is connected to the inner boss, and the inner boss is configured as a ring structure adapted to the module fixing ring.
[0008] A piezoelectric ceramic assembly is provided in multiple forms, which are distributed circumferentially along the inner boss. The first end of each piezoelectric ceramic assembly is located between the module fixing ring and the inner boss. The module fixing ring is engaged with the inner boss to fix the piezoelectric ceramic assembly. The second end of each piezoelectric ceramic assembly is located within the annular channel formed by the module fixing ring and the inner boss.
[0009] Beneficial Effects: By incorporating the inner flap structure within the riser section of a split heat pipe, the heat transfer power of the split heat pipe can be significantly increased compared to a gravity heat pipe with the same structure. Due to the piezoelectric effect of the piezoelectric ceramic components, they deform under the influence of an electric field. By appropriately controlling the electric field, the piezoelectric ceramic components can generate minute vibrations. These vibrations help break down the boundary layer on the inner wall of the heat exchanger tube, reducing thermal resistance and thus improving heat transfer efficiency. Simultaneously, the vibrations generated by the circumferentially arranged piezoelectric ceramic components on the inner wall of the riser section promote fluid mixing, resulting in a more uniform fluid temperature and enhanced heat transfer. The piezoelectric ceramic components provide power through vibration within the riser section, rather than rotation, thus offering high reliability. The high electromechanical energy conversion efficiency and extremely low power requirement of the piezoelectric ceramic components make the split heat exchanger tube with the inner flap structure suitable for power-constrained operating conditions. The inner flap structure can be applied to existing equipment, thus providing outstanding flexibility.
[0010] In one optional embodiment, the inner boss has a plurality of first module slots on its side, and the plurality of first module slots are spaced apart along the circumference of the inner boss.
[0011] The module fixing ring has multiple second module slots on its side, and these slots are spaced apart circumferentially along the module fixing ring.
[0012] Multiple first module slots and multiple second module slots are respectively provided in a one-to-one correspondence, and the corresponding first module slots and second module slots form a snap-fit groove, and the second end of the piezoelectric ceramic component is located in the snap-fit groove.
[0013] Beneficial effects: When installing piezoelectric ceramic components, after completing the installation of the piezoelectric ceramic components and the module base, the module base is placed into the first module slot, and then the module fixing ring and the inner boss are fastened and connected. This can fix the position of the piezoelectric ceramic components, while greatly reducing the installation difficulty and improving the installation efficiency.
[0014] In one alternative embodiment, a module base is disposed within the snap-fit groove, the module base being adapted to secure a first end of the piezoelectric ceramic assembly.
[0015] Beneficial effects: The modular base serves to support the slots and piezoelectric ceramic components, making the installation process more flexible.
[0016] In one optional embodiment, the cross-sectional area of the snap-fit groove perpendicular to the radial direction of the riser pipe section gradually decreases from the outside of the riser pipe section to the inside of the riser pipe section.
[0017] Beneficial effects: The snap-fit groove has a trapezoidal structure, with a small cross-sectional area at the end near the axis of the riser pipe section and a large cross-sectional area at the end near the pipe wall of the riser pipe section. At the same time, the module base is adapted to the shape of the snap-fit groove. This design can prevent the piezoelectric ceramic components from falling off and improve the installation stability between the two.
[0018] In one alternative embodiment, the piezoelectric ceramic assembly includes: The transducer is connected to the module base; The flapping wing is connected to the transducer, which is electrically connected to an external power supply via a circuit, so that the flapping wing vibrates within the annular channel.
[0019] Beneficial effects: The transducer is electrically connected to an external power supply, causing the flapping blades to vibrate within the riser section, thereby improving heat exchange efficiency. Simultaneously, the vibration of the piezoelectric ceramic assembly helps reduce scaling and corrosion on the inner wall of the heat exchange tube, thus extending the equipment's service life. This is because vibration helps disrupt the scale structure, preventing it from adhering to the tube wall and promoting the shedding of corrosion products.
[0020] In one alternative embodiment, when the flapping fin is in equilibrium, the leeward side of the flapping fin forms an obtuse angle with the direction of the working fluid flow in the riser section.
[0021] Beneficial effects: The leeward side of the flapping fin forms an obtuse angle with the flow direction of the working medium in the pipeline. When the flapping fin vibrates, it can accelerate the flow speed of the working medium while avoiding obstruction of the flow.
[0022] In one optional embodiment, the inner boss is provided with a first through hole, and the module fixing ring is provided with a second through hole. The first through hole and the second through hole are adapted to each other, and the module fixing ring is adapted to be connected to the inner boss by a connector inserted into the first through hole and the second through hole.
[0023] Beneficial effects: The first and second through holes are set as reserved holes, and then connected by connectors, which can greatly improve installation efficiency.
[0024] In one alternative implementation, the diameter of the module retaining ring is smaller than the inner diameter of the riser section.
[0025] Beneficial effects: The diameter of the module fixing ring is smaller than the inner diameter of the riser pipe section, so that after the module fixing ring is installed, there is a gap between the outer wall of the module fixing ring and the inner wall of the riser pipe section, which can expose the ring groove and facilitate the routing and connection of the circuit.
[0026] Secondly, the present invention also provides a split heat pipe, comprising: The evaporator, condenser, riser section, and downcomer section are connected to form a closed loop.
[0027] The inner flap structure described in any of the above items is disposed within the riser section.
[0028] Beneficial effects: Since the split heat pipe includes an inner flap structure, it has the same effect as the inner flap structure, which will not be elaborated here.
[0029] In one optional embodiment, the module base of the inner flapping wing structure is provided with a base wire hole, the inner protrusion of the inner flapping wing structure is provided with a ring wire groove, and the riser section is provided with a bus hole. The line for connecting the transducer of the inner flapping wing structure passes through the base wire hole, the ring groove and the bus hole and is electrically connected to an external power supply.
[0030] Beneficial effects: The pre-fabricated ring grooves, bus holes, and base holes make it easier to connect the piezoelectric ceramic components to an external power source. Attached Figure Description
[0031] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0032] Figure 1 This is a schematic diagram of a split heat pipe according to an embodiment of the present invention; Figure 2 This is a schematic diagram of another inner flapping wing structure according to an embodiment of the present invention; Figure 3 This is a cross-sectional view of the inner flapping wing structure in an embodiment of the present invention; Figure 4 This is a top view of the inner flapping wing structure in an embodiment of the present invention; Figure 5 This is a top view of the inner boss in an embodiment of the present invention; Figure 6 This is a schematic diagram of the module fixing ring in an embodiment of the present invention; Figure 7 This is a schematic diagram of the piezoelectric ceramic component in an embodiment of the present invention.
[0033] Explanation of reference numerals in the attached figures: 1. Inner boss; 2. Module fixing ring; 3. First module slot; 4. Second module slot; 5. Module base; 6. Transducer; 7. Flapping fin; 8. First through hole; 9. Second through hole; 10. Evaporator; 11. Condenser; 12. Rising pipe section; 13. Falling pipe section; 14. Base wire hole; 15. Circular wire groove; 16. Main bus hole. Detailed Implementation
[0034] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0035] The following is combined with Figures 1 to 7 The following describes embodiments of the present invention.
[0036] According to an embodiment of the present invention, in one aspect, an inner flap structure is provided, which is suitable for being disposed within a riser section 12, including: an inner boss 1, a module fixing ring 2, and a piezoelectric ceramic assembly.
[0037] The inner boss 1 is adapted to connect to the inner wall of the riser section 12. The connection between the inner boss 1 and the riser section 12 can be either welding or bolting. When using bolting, sealing is required.
[0038] The module fixing ring 2 is connected to the inner boss 1, and the inner boss 1 is configured as a ring structure adapted to the module fixing ring 2. By configuring both the module fixing ring 2 and the inner boss 1 as ring structures, the parameters of multiple piezoelectric ceramic components can be fixed during installation, thereby improving the synchronous stability of multiple piezoelectric ceramic components during vibration.
[0039] Multiple piezoelectric ceramic components are provided, distributed circumferentially along the inner boss 1, and can be arranged at equal intervals. The first end of each piezoelectric ceramic component is located between the module fixing ring 2 and the inner boss 1, with the module fixing ring 2 engaging with the inner boss 1 to secure the piezoelectric ceramic component. The second end of each piezoelectric ceramic component is located within the annular channel formed by the module fixing ring 2 and the inner boss 1. In some embodiments, a gap may be left between the module fixing ring 2 and the inner boss 1, or they may be in a mating state, as long as the module fixing ring 2 and the inner boss 1 are clamped to the module base 5.
[0040] In this embodiment, the inner flapping fin structure is arranged within the riser section 12 of the split heat pipe, significantly increasing the heat exchange power compared to a gravity heat pipe with the same structure. Because piezoelectric ceramic components exhibit the piezoelectric effect, they deform under an electric field. By appropriately controlling the electric field, the piezoelectric ceramic components can generate minute vibrations. These vibrations help break the boundary layer on the inner wall of the heat exchange tube, reducing thermal resistance and thus improving heat exchange efficiency. Simultaneously, the vibrations generated by the circumferentially arranged piezoelectric ceramic components on the inner wall of the riser section 12 promote fluid mixing, resulting in a more uniform fluid temperature and enhanced heat exchange. The piezoelectric ceramic components within the riser section 12 provide power through vibration, rather than rotation, thus offering high reliability. The piezoelectric ceramic components have high electromechanical energy conversion efficiency and extremely low power requirements, making the split heat exchange tube with the inner flapping fin structure suitable for power-constrained operating conditions. The inner flapping fin structure can be applied to existing equipment, thus providing outstanding flexibility.
[0041] In some embodiments, the inner boss 1 is provided with a plurality of first module slots 3 on its side, and the plurality of first module slots 3 are spaced apart along the circumferential direction of the inner boss 1. The module fixing ring 2 has multiple second module slots 4 on its side, and the multiple second module slots 4 are spaced apart along the circumference of the module fixing ring 2. Multiple first module slots 3 and multiple second module slots 4 are respectively set one-to-one, and the corresponding first module slots 3 and second module slots 4 form a snap-fit groove, and the second end of the piezoelectric ceramic component is located in the snap-fit groove.
[0042] In this embodiment, when installing the piezoelectric ceramic component, after completing the installation of the piezoelectric ceramic component and the module base 5, the module base 5 is placed into the first module slot 3, and then the module fixing ring 2 and the inner boss 1 are fastened and connected. This can fix the position of the piezoelectric ceramic component, while greatly reducing the installation difficulty and improving the installation efficiency.
[0043] In some embodiments, the first module slot 3 and the second module can also be configured as an arc structure or an irregular structure, as long as a limiting structure is provided between the module base 5 and the inner wall of the snap-fit slot.
[0044] In some embodiments, the module base 5 is disposed in a snap-fit groove, and the module base 5 is adapted to fix the first end of the piezoelectric ceramic assembly.
[0045] In this embodiment, the module base 5 serves to support the slot and piezoelectric ceramic components, making the installation process more flexible.
[0046] In some embodiments, the module base 5 and the piezoelectric ceramic component can be connected by a plug-in connection. That is, a through groove is opened on the end face of the module base 5, the first end of the piezoelectric ceramic component is inserted into the through groove, and the module base 5 is squeezed by the snap-fit action of the module fixing ring 2 and the inner boss 1, thereby realizing the module base 5 clamping and fixing the piezoelectric ceramic component.
[0047] In some embodiments, the cross-sectional area of the snap-fit groove perpendicular to the radial direction of the riser section 12 gradually decreases from the outside of the riser section 12 to the inside of the riser section 12.
[0048] In this embodiment, the snap-fit groove has a trapezoidal structure. The cross-sectional area is small at the end near the axis of the riser section 12 and large at the end near the pipe wall of the riser section 12. At the same time, the module base 5 is adapted to the shape of the snap-fit groove. This arrangement can prevent the piezoelectric ceramic components from falling off and improve the installation stability between the two.
[0049] In some embodiments, the piezoelectric ceramic assembly includes: The transducer 6 is connected to the module base 5; The flapping wing 7 is connected to the transducer 6, which is electrically connected to an external power supply via a circuit, so that the flapping wing 7 vibrates within the annular channel.
[0050] In this embodiment, the transducer 6 is electrically connected to an external power supply, causing the flapping blades 7 to vibrate within the riser section 12, thereby improving heat exchange efficiency. Simultaneously, the vibration of the piezoelectric ceramic assembly helps reduce scaling and corrosion on the inner wall of the heat exchange tube, thus extending the equipment's service life. This is because vibration helps disrupt the scale structure, preventing it from adhering to the tube wall, and promotes the shedding of corrosion products.
[0051] In some embodiments, when the flapping wing 7 is in equilibrium, the leeward side of the flapping wing 7 forms an obtuse angle with the direction of the working fluid flow in the riser section 12.
[0052] In this embodiment, the leeward side of the flapping wing 7 forms an obtuse angle with the flow direction of the working medium in the pipeline. When the flapping wing 7 vibrates, it can accelerate the flow speed of the working medium while avoiding obstruction of the flow of the working medium.
[0053] In some embodiments, the leeward side of the flapping wing 7 forms an obtuse angle with the flow direction of the working fluid inside the pipe, with the angle ranging from 90° to 95°.
[0054] In some embodiments, the inner boss 1 is provided with a first through hole 8, and the module fixing ring 2 is provided with a second through hole 9. The first through hole 8 and the second through hole 9 are adapted to each other, and the module fixing ring 2 is adapted to be connected to the inner boss 1 by a connector inserted into the first through hole 8 and the second through hole 9.
[0055] In this embodiment, the first through hole 8 and the second through hole 9 are set as reserved holes and then connected by a connector, which can greatly improve the installation efficiency.
[0056] In some embodiments, the diameter of the module fixing ring 2 is smaller than the inner diameter of the riser section 12.
[0057] In this embodiment, the diameter of the module fixing ring 2 is smaller than the inner diameter of the riser pipe section 12, so that after the module fixing ring 2 is installed, there is a gap between the outer wall of the module fixing ring 2 and the inner wall of the riser pipe section 12, which can expose the ring groove 15 and facilitate the routing and connection of the lines.
[0058] In some embodiments, a notch may be made at the edge of the module fixing ring 2 near the bus hole 16 to facilitate the uniform feeding of the lines into the bus hole 16.
[0059] According to an embodiment of the present invention, in another aspect, a split heat pipe is also provided, comprising: Evaporator 10, condenser 11, riser section 12 and downcomer section 13 are connected to form a closed loop; The inner flap structure of any of the above is installed inside the riser section 12.
[0060] In this embodiment, since the split heat pipe includes an inner flap structure, it has the same effect as the inner flap structure, and will not be described in detail here.
[0061] In some embodiments, the module base 5 of the inner flapping wing structure is provided with a base wire hole 14, the inner boss 1 of the inner flapping wing structure is provided with an annular wire groove 15, and the riser section 12 is provided with a bus hole 16. The wires for connecting the transducer 6 of the inner flapping wing structure pass through the base wire hole 14, the annular groove 15 and the bus hole 16 and are electrically connected to the external power supply.
[0062] In this embodiment, the prefabricated annular groove 15, bus hole 16 and base wire hole 14 make it easier to connect the piezoelectric ceramic assembly to an external power supply.
[0063] In some embodiments, the line may be sealed after passing through the bus hole 16.
[0064] Although embodiments of the invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations all fall within the scope defined by the appended claims.
Claims
1. An internal flapping wing structure, suitable for installation within a riser section (12), characterized in that, include: The inner boss (1) is adapted to connect with the inner wall of the rising pipe section (12); The module fixing ring (2) is connected to the inner boss (1), and the inner boss (1) is configured as a ring structure adapted to the module fixing ring (2); A piezoelectric ceramic assembly is provided in multiple forms, which are distributed circumferentially along the inner boss (1). The first end of the piezoelectric ceramic assembly is located between the module fixing ring (2) and the inner boss (1). The module fixing ring (2) is engaged with the inner boss (1) so that the module fixing ring (2) and the inner boss (1) fix the piezoelectric ceramic assembly. The second end of the piezoelectric ceramic assembly is located within the annular channel formed by the module fixing ring (2) and the inner boss (1).
2. The inward flapping wing structure according to claim 1, characterized in that: The inner boss (1) has a plurality of first module slots (3) on its side, and the plurality of first module slots (3) are spaced apart along the circumferential direction of the inner boss (1). The module fixing ring (2) has a plurality of second module slots (4) on its side, and the plurality of second module slots (4) are spaced apart along the circumferential direction of the module fixing ring (2); Multiple first module slots (3) and multiple second module slots (4) are respectively provided in a one-to-one correspondence, and the corresponding first module slots (3) and second module slots (4) form a snap-fit groove, and the second end of the piezoelectric ceramic component is located in the snap-fit groove.
3. The inward flapping wing structure according to claim 2, characterized in that, Also includes: A module base (5) is disposed in the snap-fit groove, and the module base (5) is adapted to fix the first end of the piezoelectric ceramic assembly.
4. The inward flapping wing structure according to claim 2, characterized in that: The cross-sectional area of the snap-fit groove perpendicular to the radius of the riser section (12) gradually decreases from the outside of the riser section (12) to the inside of the riser section (12).
5. The inward flapping wing structure according to claim 3, characterized in that, The piezoelectric ceramic assembly includes: The transducer (6) is connected to the module base (5); The flapping wing (7) is connected to the transducer (6), which is electrically connected to an external power supply via a circuit, so that the flapping wing (7) vibrates within the annular channel.
6. The inward flapping wing structure according to claim 5, characterized in that: When the flapping wing (7) is in equilibrium, the leeward side of the flapping wing (7) forms an obtuse angle with the flow direction of the working fluid in the riser section (12).
7. The inward flapping wing structure according to claim 1, characterized in that: The inner boss (1) is provided with a first through hole (8), and the module fixing ring (2) is provided with a second through hole (9). The first through hole (8) and the second through hole (9) are adapted to each other. The module fixing ring (2) is adapted to be connected to the inner boss (1) by a connector inserted into the first through hole (8) and the second through hole (9).
8. The inward flapping wing structure according to claim 1, characterized in that: The diameter of the module fixing ring (2) is smaller than the inner diameter of the rising pipe section (12).
9. A split heat pipe, characterized in that, include: Evaporator (10), condenser (11), riser section (12) and downcomer section (13), and the evaporator (10), the condenser (11), the riser section (12) and the downcomer section (13) are connected to form a closed loop; The inner flap structure according to any one of claims 1-8 is disposed within the riser section (12).
10. A split heat pipe according to claim 9, characterized in that: The module base (5) of the inner flapping wing structure is provided with a base wire hole (14), the inner boss (1) of the inner flapping wing structure is provided with a ring wire groove (15), and the riser section (12) is provided with a bus hole (16). The line used to connect the transducer (6) of the inner flapping wing structure passes through the base wire hole (14), the ring wire groove (15) and the bus hole (16) and is electrically connected to the external power supply.
