Automatic intelligent film tearing machine

Abstract

The invention provides an automatic intelligent film tearing machine applied to the technical field of printed circuit manufacturing and automatic equipment. The automatic intelligent film tearing machine comprises a rack, an adhesive tape mechanism, an executing mechanism, a turnover mechanism, a bearing mechanism, a transfer platform, a picking mechanism, a turnover platform, a film tearing detection mechanism, a feeding mechanism, a discharging mechanism and a film tearing mechanism. The film tearing mechanism comprises an overturning mechanism, an overturning platform, a picking mechanism, a bearing mechanism, a film tearing detection mechanism, an executing mechanism and an adhesive tape mechanism. The executing mechanism adheres a film coating layer on the ASIC printed circuit board through an adhesive tape and tears the film coating layer through traction action. According to the invention, the actuating mechanism with the compression roller and the film tearing shovel plate is matched with the adhesive tape mechanism, and a composite film tearing mode of rolling and laminating of the compression roller and traction stripping of the edge of the film tearing shovel plate is adopted, so that the problems of film breakage and residue easily caused by a traditional film tearing mode are solved.

Description

Technical Field

[0001] This application relates to the field of printed circuit manufacturing and automation equipment technology, and in particular to an automated intelligent film-peeling machine. Background Technology

[0002] During the production and transportation of ASIC printed circuit boards, a protective film is typically applied to the surface to protect the circuitry, solder joints, and other critical structures, preventing scratches, contamination, or oxidation. This protective film must be completely removed before subsequent assembly and soldering processes to ensure the smooth operation of these processes.

[0003] Current methods for removing film mainly rely on manual labor or semi-automatic equipment; Among them, manual feeding, film tearing, inspection and unloading all rely on manual operation, which has high labor costs and low work efficiency, making it difficult to adapt to the needs of large-scale production. Although semi-automatic equipment can assist in completing the film-tearing action, manual intervention is still required to inspect the film-tearing effect and sort out defective products. Manual visual inspection is easily affected by fatigue and subjective factors, resulting in low detection accuracy and a high risk of defective products being mixed with qualified products. Meanwhile, the existing film-peeling mechanism is poorly designed, often using a direct pulling method to peel off the film, which can easily lead to film breakage, residue, or damage to the surface structure of the ASIC printed circuit board, resulting in poor film-peeling stability.

[0004] Therefore, an automated intelligent film-tearing machine is proposed to solve the above problems. Summary of the Invention

[0005] The purpose of this application is to address the technical problems of existing film-peeling methods, such as high reliance on manual labor, poor film-peeling stability, low detection accuracy, and inconsistent process connections. Compared with existing technologies, this application provides an automated intelligent film-peeling machine, comprising: The transfer platform consists of two sets of transfer platforms arranged parallel and longitudinally on the rack. One set of transfer platforms is used to transport ASIC printed circuit boards with the coating attached, and the other set is used to transport ASIC printed circuit boards with the coating removed. The feeding mechanism, located at one end of the transfer platform, is used to provide the transfer platform with ASIC printed circuit boards with a film. The unloading mechanism, located at the other end of the transfer platform, is used to transfer ASIC printed circuit boards with the film removed from the transfer platform. The film-tearing mechanism consists of multiple sets of film-tearing mechanisms arranged equidistantly and perpendicularly to the transfer platform, and includes the following components in sequence according to the film-tearing process: A flipping mechanism that picks up and flips up ASIC printed circuit boards with the film to be peeled off from the transfer platform; A flipping platform for carrying flipped ASIC printed circuit boards and ASIC printed circuit boards with the film removed; Pick-up mechanism for picking up ASIC printed circuit boards with peel-off film from a flipping platform; A support mechanism for carrying ASIC printed circuit boards from a pickup mechanism; A tear-off inspection mechanism for visual inspection; An actuator used to perform the film-tearing action on a support mechanism; A tape mechanism for providing tape to an actuator that uses tape to adhere a coating layer on an ASIC printed circuit board and uses a traction action to remove the coating layer.

[0006] Furthermore, the transfer platform includes a transfer X-direction module, and a transfer fixture is fixed at the output end of the transfer X-direction module. Multiple sets of transfer slots are arranged equidistantly along the transfer fixture's conveying direction on the transfer fixture. The number of transfer slots is equal to the number of film-tearing mechanisms.

[0007] Furthermore, the flipping mechanism includes a flipping Y-axis module, which is slidably connected to the frame along the conveying direction of the vertical transfer platform. A flipping Z-axis module is fixed to the output end of the flipping Y-axis module, and a flipping base plate is fixed to the output end of the flipping Z-axis module. Two sets of symmetrically arranged L-shaped brackets are provided on the flipping base plate, and the L-shaped brackets are rotatably connected to the flipping base plate. An adjusting cylinder is fixed to the bottom of the L-shaped bracket, and a vacuum suction cup is fixed to the output end of the adjusting cylinder. A flipping motor for driving the L-shaped brackets to reciprocate at ° is also fixed on the flipping base plate. The relative distance between the two sets of vacuum suction cups is equal to the relative distance between adjacent transfer slots on the two sets of transfer platforms.

[0008] Furthermore, the flipping platform includes two sets of symmetrically arranged support plates. Each support plate has a top plate fixed to its top. The top plate is detachably connected to a platform fixture. The platform fixture is provided with a material trough for placing ASIC printed circuit boards. A U-shaped notch is also provided on one side of the material trough. The U-shaped notch is used for a vacuum suction cup to adsorb and insert the ASIC printed circuit board after it has been flipped. The relative distance between the two sets of U-shaped notches is equal to the relative distance between the two sets of vacuum suction cups.

[0009] Furthermore, the picking mechanism includes a Y-axis picking module, which is slidably connected to the frame in the direction perpendicular to the conveying direction of the transfer platform. A Z-axis picking module is fixed to the output end of the Y-axis picking module, and a vacuum suction cup is fixed to the output end of the Z-axis picking module.

[0010] Furthermore, the supporting mechanism includes a Y-axis supporting module, the output end of which is fixed with a supporting seat. The running direction of the supporting seat is perpendicular to the conveying direction of the transfer platform. A supporting fixture is also fixed on the supporting seat. The top of the supporting fixture is provided with a supporting groove, and the supporting groove is also provided with a negative pressure hole for adsorbing ASIC printed circuit boards.

[0011] Furthermore, the actuator includes a film-tearing Z-axis module fixed to the frame, a film-tearing X-axis module fixed to the output end of the film-tearing Z-axis module, a film-tearing X-axis substrate fixed to the output end of the film-tearing X-axis module, a lower guide roller and a film-tearing spatula fixed to one side of the film-tearing X-axis substrate, a roller pressing X-axis module fixed to the film-tearing X-axis substrate, a film-tearing cylinder fixed to the output end of the roller pressing X-axis module, a film-tearing Z-axis substrate fixed to the output end of the film-tearing cylinder, and a pressure roller provided at the bottom of the film-tearing Z-axis substrate.

[0012] Furthermore, the tape mechanism includes a gantry fixed to the frame, on which tape delivery rollers and tape return rollers are symmetrically arranged. The gantry has a left guide roller at the bottom of the tape delivery roller and a right guide roller at the bottom of the tape return roller. The gantry is located at the end of the supporting mechanism away from the overturning mechanism, and the actuator is located between the conveyor belt discharge roller and the conveyor belt rewind roller.

[0013] Furthermore, unused tape is wound on the tape discharge roller, with the adhesive side of the tape facing downwards. One end of the tape passes sequentially over the bottom of the left guide roller, the top of the lower guide roller, the bottom of the film-tearing shovel, the top of the pressure roller, and the bottom of the right guide roller, and is fixed to the tape rewind roller.

[0014] Furthermore, the film tearing detection mechanism is located above the flipping platform, and a feeding detection mechanism is also located above the feeding mechanism.

[0015] Compared to existing technologies, the advantages of this application are: This invention solves the problem of film breakage and residue caused by traditional film tearing methods by using an actuator with pressure rollers and a film-tearing spade in conjunction with a tape mechanism. Multiple film-tearing mechanisms work in parallel, in conjunction with the synchronous conveying of dual transfer platforms, enabling the simultaneous processing of multiple ASIC printed circuit boards, significantly increasing the throughput per unit time and effectively improving production efficiency. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall external structure of this application; Figure 2This is a schematic diagram of the overall internal structure of this application; Figure 3 This is a front structural diagram of the film-tearing mechanism proposed in this application; Figure 4 This is a side view of the film-tearing mechanism proposed in this application; Figure 5 for Figure 4 Enlarged structural diagram of section A in the middle; Figure 6 for Figure 4 Enlarged structural diagram of section B in the middle; Figure 7 for Figure 4 Enlarged structural diagram of section C; Figure 8 This is a schematic diagram of the supporting institution proposed in this application; Figure 9 This is a schematic diagram of the tape mechanism proposed in this application; Figure 10 This is a frontal structural diagram of the implementing mechanism proposed in this application; Figure 11 This is a schematic diagram of the bottom structure of the actuator proposed in this application; Figure 12 This is a schematic diagram showing the state comparison when the pressure roller moves downward as proposed in this application; Figure 13 This is a schematic diagram showing the state comparison during the translation of the pressure roller as proposed in this application.

[0017] Explanation of the labels in the diagram: 1. Rack; 2. Belt conveyor mechanism; 201. Belt; 21. Gantry; 22. Belt discharge roller; 23. Left guide roller; 24. Belt rewind roller; 25. Right guide roller; 3. Actuator; 31. Film-tearing Z-axis module; 32. Film-tearing X-axis module; 33. Film-tearing X-axis substrate; 331. Roller X-axis module; 34. Film-tearing cylinder; 341. Film-tearing Z-axis substrate; 342. Pressure roller; 35. Lower guide roller; 36. Film-tearing spatula; 4. Flipping mechanism; 41. Flipping Y-axis module; 42. Flipping Z-axis module; 43. Flipping base plate; 44. L-shaped bracket; 45. Adjusting cylinder; 451. Vacuum suction cup one; 46. Flipping motor; 5. Supporting mechanism; 51. Bearing Y-axis module; 52. Bearing seat; 53. Supporting fixture; 531. Supporting groove; 532. Negative pressure hole; 6. Transfer platform; 61. Transfer X-axis module; 62. Transfer fixture; 63. Transfer trough; 7. Pickup mechanism; 71. Pickup Y-axis module; 72. Pickup Z-axis module; 73. Vacuum suction cup II; 8. Tilting platform; 81. Support plate; 82. Top plate; 83. Platform fixture; 84. Material trough; 85. U-shaped notch; 9. Film tear testing agency; 10. ASIC printed circuit board; 101. Coating layer. Detailed Implementation

[0018] The embodiments will be described clearly and completely with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments in this application without creative effort are within the scope of protection of this application.

[0019] Example: This invention provides an automated intelligent film-peeling machine. Please refer to [link / reference]. Figure 1 - Figure 13 The system includes a frame 1, a tape mechanism 2, an actuator 3, a flipping mechanism 4, a support mechanism 5, a transfer platform 6, a pickup mechanism 7, a flipping platform 8, a film tearing detection mechanism 9, a feeding mechanism, an unloading mechanism, and a defective product placement area (not shown). The various mechanisms work together to achieve fully automated film tearing and sorting of ASIC printed circuit boards. For details, please refer to the following: Figure 1 - Figure 3 The frame 1 is the basic support component of the entire equipment. All functional mechanisms are directly or indirectly fixed to the frame 1, providing stable support for the installation and coordinated operation of each mechanism and ensuring the structural stability of the equipment during operation. The transfer platform 6 is provided in two sets. The two sets of transfer platforms 6 are arranged in parallel and longitudinally on the frame 1 to form a dual conveying channel for feeding and discharging. One set of transfer platforms 6 is used to transport ASIC printed circuit boards 10 with the film layer 101 attached to them to be peeled off, and the other set is used to transport qualified ASIC printed circuit boards 10 after the film layer 101 has been peeled off.

[0020] The transfer platform 6 includes a transfer X-direction module 61. A transfer fixture 62 is fixed at the output end of the transfer X-direction module 61. Multiple transfer slots 63 are arranged equidistantly along the conveying direction of the transfer fixture 62. The transfer slots 63 are used to position and place the ASIC printed circuit board 10 to prevent displacement during the conveying process.

[0021] It should be noted that the number of transfer tanks 63 is equal to the number of film-tearing mechanisms, ensuring that multiple film-tearing mechanisms can simultaneously process multiple ASIC printed circuit boards 10, thereby improving processing efficiency. The inner wall of the transfer tank 63 is provided with a flexible protective layer to prevent damage caused by collision between the ASIC printed circuit board 10 and the tank wall.

[0022] The feeding mechanism is located at one end of the transfer platform 6 and is used to automatically transfer the ASIC printed circuit board 10 in the material box to the transfer groove 63 of the transfer platform 6 to be peeled off. During the transfer process, the flexible clamping structure prevents the ASIC printed circuit board 10 from deforming or being damaged on the surface.

[0023] Above the feeding mechanism is a feeding inspection mechanism, which is used to visually inspect the appearance of the ASIC printed circuit board 10 and the adhesion of the film layer 101 before peeling off the film, and to initially screen out defective products with damaged appearance, severely wrinkled or displaced film layer 101.

[0024] The unloading mechanism is located at the other end of the transfer platform 6. It is used to transfer qualified ASIC printed circuit boards 10 with the film removed from the transfer platform 6 to the finished product box, completing the unloading process. The unloading mechanism is also equipped with a box positioning component to ensure that the finished product boards are neatly arranged. It also has a full material detection function, which automatically issues a prompt signal when the finished product box is full.

[0025] The equipment is also equipped with a defective product placement area, which is used to place defective products detected before and after film removal, so as to achieve automatic sorting and avoid confusion between defective and qualified products.

[0026] Please refer to this first. Figure 2 - Figure 4 Multiple film-tearing mechanisms are arranged equidistantly and perpendicularly to the transfer platform 6, and can simultaneously process multiple ASIC printed circuit boards 10. According to the film-tearing process, they include a flipping mechanism 4, a flipping platform 8, a picking mechanism 7, a supporting mechanism 5, a film-tearing detection mechanism 9, an execution mechanism 3, and a tape mechanism 2.

[0027] Please refer to this first. Figure 5The flipping mechanism 4 is used to pick up the ASIC printed circuit board 10 to be peeled from the transfer platform 6 and flip it so that the film layer 101 of the ASIC printed circuit board 10 faces upward, facilitating subsequent film peeling operations. The flipping mechanism 4 includes a flipping Y-axis module 41, which is slidably connected to the frame 1 along the conveying direction perpendicular to the transfer platform 6. A flipping Z-axis module 42 is fixed to the output end of the flipping Y-axis module 41, and a flipping base plate 43 is fixed to the output end of the flipping Z-axis module 42. Two sets of symmetrically arranged L-shaped brackets 44 are provided on the flipping base plate 43. The L-shaped brackets 44 are rotatably connected to the flipping base plate 43. An adjusting cylinder 45 is fixed to the bottom of the L-shaped bracket 44, and a vacuum suction cup 451 is fixed to the output end of the adjusting cylinder 45 for adsorbing and fixing the ASIC printed circuit board 10. A flipping motor 46 is also fixed on the flipping base plate 43 for driving the L-shaped brackets 44 to rotate 180° back and forth to realize the flipping of the ASIC printed circuit board 10. The relative distance between the two sets of vacuum suction cups 451 is equal to the relative distance between adjacent transfer slots 63 on the two sets of transfer platforms 6, ensuring that the flipping mechanism 4 can accurately pick up and place the ASIC printed circuit board 10. The negative pressure of the vacuum suction cups 451 can be adaptively adjusted according to the weight of the ASIC printed circuit board 10 to avoid damage to the board due to excessive suction force or drop due to insufficient suction force.

[0028] Please refer to this first. Figure 6 The two sets of flipping platforms 8 are used to carry the flipped ASIC printed circuit board 10 and the ASIC printed circuit board 10 with the film removed, respectively, providing a stable pick-up and put-out reference for the flipping mechanism 4 and the picking mechanism 7.

[0029] The flipping platform 8 includes two sets of symmetrically arranged support plates 81. Each support plate 81 has a top plate 82 fixed to its top. The top plate 82 is detachably connected to a platform fixture 83. The platform fixture 83 is provided with a material slot 84 for placing the ASIC printed circuit board 10. A U-shaped notch 85 is also provided on one side of the material slot 84. The U-shaped notch 85 is used for the vacuum suction cup 451 to pick up the ASIC printed circuit board 10 and move it down to be inserted after flipping. At the same time, after the ASIC printed circuit board 10 with the film removed is placed in the material slot 84 by the picking mechanism 7, the vacuum suction cup 451 is inserted into the U-shaped notch 85 with the film removed and picks up the ASIC printed circuit board 10 with the film removed. After returning to its original position, it is flipped a second time to avoid interference between the vacuum suction cup 451 and the platform fixture 83.

[0030] The relative distance between the two sets of U-shaped notches 85 is equal to the relative distance between the two sets of vacuum suction cups 451, ensuring that the ASIC printed circuit board 10 can be accurately placed in the material tray 84. The platform fixture 83 adopts a detachable design, and the material tray 84 of the corresponding size can be replaced according to different specifications of ASIC printed circuit boards 10, improving the versatility of the equipment.

[0031] Please refer to this first. Figure 2 - Figure 4 The film-peeling detection mechanism 9 is located above the flipping platform 8 and is a visual inspection mechanism (including an inspection camera and an image processing system). It is used to perform secondary inspection on the flipped ASIC printed circuit board 10 before film peeling and effect inspection after film peeling, forming a dual visual inspection mechanism of pre-peeling positioning and post-peeling judgment.

[0032] Before peeling off the film, the detection camera captures images of the surface of the ASIC printed circuit board 10. The image processing system accurately identifies the edge position and adhesion status of the film layer 101, determines the starting peeling point of the film layer 101, and provides a precise coordinate reference for the peeling action of the actuator 3. After peeling off the film, the detection camera captures images again to analyze and judge whether the film layer 101 has been completely removed, whether there are any residues, and whether the surface of the ASIC printed circuit board 10 has been scratched or damaged due to peeling off the film.

[0033] Please refer to this first. Figure 7 The picking mechanism 7 is used to pick up the ASIC printed circuit board 10 to be peeled off from the flipping platform 8 and transfer it to the supporting mechanism 5. The picking mechanism 7 includes a Y-axis picking module 71, which is slidably connected to the frame 1 perpendicular to the conveying direction of the transfer platform 6. A Z-axis picking module 72 is fixed to the output end of the Y-axis picking module 71, and a vacuum suction cup 73 is fixed to the output end of the Z-axis picking module 72. The ASIC printed circuit board 10 is stably picked up and transferred through negative pressure adsorption. The arrangement of the vacuum suction cups 73 can be adjusted according to the size and weight of the ASIC printed circuit board 10 to ensure adsorption balance and avoid tilting of the board.

[0034] Please refer to this first. Figure 8 The support mechanism 5 is used to receive the ASIC printed circuit board 10 from the pickup mechanism 7 and fix the ASIC printed circuit board 10 during the film removal process to prevent displacement. The support mechanism 5 includes a Y-axis support module 51, and a support base 52 is fixed to the output end of the Y-axis support module 51. The running direction of the support base 52 is perpendicular to the conveying direction of the transfer platform 6, which can drive the ASIC printed circuit board 10 to the film removal station. A support fixture 53 is also fixed on the support base 52. The support fixture 53 has a support groove 531 on its top. The shape of the support groove 531 is adapted to the ASIC printed circuit board 10. A negative pressure hole 532 is also provided in the support groove 531. The ASIC printed circuit board 10 is fixed in the support groove 531 by negative pressure adsorption, ensuring the stability of the ASIC printed circuit board 10 during the film removal process. The support fixture 53 also adopts a detachable design, which can be quickly replaced to adapt to different specifications of ASIC printed circuit boards 10.

[0035] Please refer to this first. Figure 9The tape mechanism 2 provides the tape 201 for tearing film to the actuator 3 and recycles the used tape 201. The tape mechanism 2 includes a gantry 21 fixed to the frame 1. A tape delivery roller 22 and a tape rewind roller 24 are symmetrically arranged on the gantry 21. A left guide roller 23 is located at the bottom of the tape delivery roller 22, and a right guide roller 25 is located at the bottom of the tape rewind roller 24. The gantry 21 is positioned at the end of the supporting mechanism 5 away from the flipping mechanism 4. The actuator 3 is positioned between the tape delivery roller 22 and the tape rewind roller 24, ensuring that the tape 201 can be stably conveyed to the actuator 3. Unused tape 201 is wound on the tape delivery roller 22, with the adhesive side of the tape 201 facing downwards. One end of the tape 201 passes sequentially over the bottom of the left guide roller 23, the top of the lower guide roller 35, the bottom of the film-tearing shovel 36, the top of the pressure roller 342, and the bottom of the right guide roller 25, and is fixed to the tape rewind roller 24, forming a complete tape 201 conveying and recycling loop. The tape mechanism 2 is also equipped with a tape tension adjustment component, which can adjust the tension of the tape 201 in real time to avoid excessive tension causing tape breakage, or insufficient tension affecting the peeling effect of the coating layer 101.

[0036] Please refer to this first. Figure 10 - Figure 11 The actuator 3 is used to perform a film-peeling action on the support mechanism 5, using the tape 201 to adhere to and peel off the film layer 101 on the ASIC printed circuit board 10. The actuator 3 includes a film-peeling Z-axis module 31 fixed to the frame 1, a film-peeling X-axis module 32 fixed to the output end of the film-peeling Z-axis module 31, a film-peeling X-axis substrate 33 fixed to the output end of the film-peeling X-axis module 32, a lower guide roller 35 and a film-peeling spatula 36 fixed to one side of the film-peeling X-axis substrate 33, used to guide the direction of the tape 201 and assist in peeling off the film layer 101. A roller pressing X-axis module 331 is also fixed on the film-peeling X-axis substrate 33, a film-peeling cylinder 34 fixed to the output end of the roller pressing X-axis module 331, a film-peeling Z-axis substrate 341 fixed to the output end of the film-peeling cylinder 34, and a pressure roller 342 is provided at the bottom of the film-peeling Z-axis substrate 341, used to roll and adhere the tape 201 to the edge of the film layer 101. The lower end of the film-tearing spatula 36 has a smooth structural design to avoid damaging the tape 201 and effectively prevent the tape 201 from breaking.

[0037] In use, the present invention involves placing a cassette containing the ASIC printed circuit boards 10 to be peeled onto the feeding mechanism. Upon starting the equipment, the feeding mechanism's picking component operates, using a flexible clamping structure to remove the ASIC printed circuit boards 10 one by one from the cassette and transfer them to the transfer groove 63 of the transfer platform 6 for peeling. The flexible protective layer on the inner wall of the transfer groove 63 effectively buffers the contact force between the picking component and the circuit board, preventing scratches or impacts to the circuit board surface and edges.

[0038] The transfer X-axis module 61 drives the transfer fixture 62 to move smoothly along the conveying direction, conveying the transfer slot 63 carrying the ASIC printed circuit board 10 to the material picking area of ​​the flipping mechanism 4. During the conveying process, the material feeding detection mechanism above the feeding mechanism is activated, and the detection camera captures the appearance image of the ASIC printed circuit board 10 from top to bottom, and the image data is transmitted to the image processing system.

[0039] The image processing system analyzes and processes the acquired images, comparing them with preset standard images to determine whether the ASIC printed circuit board 10 has initial defects such as appearance damage, missing corners, or exposed circuits. Simultaneously, it checks whether the coating layer 101 has severe wrinkles, displacement, or damage that prevents normal film removal. If the inspection result is a defective product, the system marks the ASIC printed circuit board 10 as initially defective and records its location in the transfer slot 63. In subsequent processes, it will be automatically sorted to the defective product placement position. If the inspection result is a qualified product, the system generates a qualified mark, allowing it to proceed to the next process.

[0040] After receiving a qualified signal from the system, the flipping mechanism 4 starts. The flipping Y-axis module 41 drives the flipping substrate 43 to move in a direction perpendicular to the transfer platform 6, and accurately positions it above the ASIC printed circuit board 10 to be picked up. The flipping Z-axis module 42 drives the flipping substrate 43 to move slowly downward, and the adjusting cylinder 45 extends, so that the vacuum chuck 451 is attached to the non-coated surface of the ASIC printed circuit board 10.

[0041] Vacuum suction cup 451 is connected to a negative pressure source, and the negative pressure is adaptively adjusted according to the weight of the ASIC printed circuit board 10 to ensure stable adsorption of the material board without causing damage. Then, the flipping Z-axis module 42 moves the material board up and away from the transfer groove 63; the flipping motor 46 is started, driving the L-shaped bracket 44 to rotate the ASIC printed circuit board 10 180°, so that the side of the originally downward-facing coating layer 101 faces upward, completing the flipping action.

[0042] The Y-axis flipping module 41 operates again, moving the flipped ASIC printed circuit board 10 above the flipping platform 8. The Z-axis flipping module 42 slowly moves downward, placing the ASIC printed circuit board 10 into the material slot 84 of the platform fixture 83. At this time, the vacuum chuck 451 precisely engages with the U-shaped notch 85 on one side of the material slot 84, avoiding interference with the platform fixture 83 and ensuring the stable placement of the board. Afterward, the vacuum chuck 451 releases the negative pressure, the adjusting cylinder 45 resets, and the flipping mechanism 4 returns to its initial position, ready for the next material retrieval.

[0043] The film-peeling detection mechanism 9 above the flipping platform 8 starts the positioning detection process. The detection camera captures the surface image of the film layer 101 of the ASIC printed circuit board 10. The image processing system uses an edge recognition algorithm to accurately locate the four edges of the film layer 101, determine the optimal starting peeling point, and at the same time detect the tightness of the adhesion between the film layer 101 and the ASIC printed circuit board 10, determine whether there is any local lifting, etc., and send the positioning data and adhesion status information to the control system to provide parameter support for the film-peeling action of the actuator 3.

[0044] After receiving the positioning completion signal from the control system, the picking mechanism 7 starts. The picking Y-axis module 71 drives the vacuum suction cup 73 to move above the flipping platform 8, and the picking Z-axis module 72 slowly moves down. The vacuum suction cup 73 adheres to one side of the coating layer 101 of the ASIC printed circuit board 10 and connects the negative pressure to adsorb and fix the material plate.

[0045] Picking Z-axis module 72 moves upward, causing the material plate to detach from the material trough 84. Picking Y-axis module 71 moves above the support fixture 53 of the support mechanism 5. Picking Z-axis module 72 slowly moves downward, placing the ASIC printed circuit board 10 stably in the support groove 531.

[0046] The negative pressure hole 532 in the support groove 531 is connected to the negative pressure source, generating a uniform suction force to firmly fix the ASIC printed circuit board 10 in the support groove 531, preventing the board from shifting horizontally or jumping vertically during the film removal process. The vacuum suction cup 73 releases the negative pressure, and the picking mechanism 7 returns to its initial position, completing the picking and transfer action.

[0047] The Y-axis module 51 drives the carrier seat 52 to move in a direction perpendicular to the transfer platform 6, and accurately delivers the support fixture 53 with the fixed ASIC printed circuit board 10 to the film peeling station of the actuator 3, so that the starting peeling point of the film layer 101 is aligned with the film peeling shovel 36 of the actuator 3, and waits for the film peeling action.

[0048] After the supporting mechanism 5 is in place, the tape mechanism 2 starts, and the tape rewind roller 24 rotates slowly under the drive of the motor, which drives the unused tape 201 on the tape discharge roller 22 to be released. Under the guidance of the left guide roller 23, the lower guide roller 35, the film tearing shovel 36, the pressure roller 342, and the right guide roller 25, the tape 201 forms a tensioned conveying circuit, and the adhesive surface of the tape 201 always faces downward, directly facing the film layer 101 of the ASIC printed circuit board 10.

[0049] The tape tension adjustment component monitors the tension of the tape 201 in real time. By adjusting the speed of the tape rewind roller 24 or the parameters of the tension controller, it ensures that the tension of the tape 201 is uniform and stable, so that the tape will not break due to excessive tension, nor will it become loose or wrinkled due to insufficient tension, thus affecting the adhesion effect.

[0050] According to the positioning data provided by the film-peeling detection mechanism 9, the actuator 3 adjusts the height of the film-peeling Z-axis module 31 to the X-axis substrate 33, aligning the end of the pressure roller 342 with the starting peel point of the coating layer 101. Simultaneously, the roller pressing X-axis module 331 moves the film-peeling cylinder 34 above the starting peel point, and the film-peeling cylinder 34 moves downward, driving the pressure roller 342 to press against the adhesive tape 201 and roll along the edge of the coating layer 101, tightly rolling and adhering the adhesive tape 201 to the starting peel point and surrounding area of ​​the coating layer 101. During the rolling process, the pressure of the pressure roller 342 is uniform, ensuring that the adhesive tape 201 and the coating layer 101 are in full contact, forming sufficient adhesion and laying the foundation for subsequent peeling actions.

[0051] After the roll bonding is completed, the film-peeling cylinder 34 moves upward, causing the pressure roller 342 to detach from the tape 201. The film-peeling X-axis module 32 is activated, causing the film-peeling X-axis to move uniformly towards the substrate 33 in a direction away from the center of the coating layer 101. The end of the film-peeling spatula 36 maintains a certain distance from the ASIC printed circuit board 10. As the film-peeling X-axis moves towards the substrate 33, the height of the film-peeling spatula 36 is used to make the tape 201 adhere to the coating layer 101 and move upward, causing the coating layer 101 to separate from the surface of the ASIC printed circuit board 10.

[0052] Because the adhesive force between the tape 201 and the coating layer 101 is much greater than the adhesion force between the coating layer 101 and the surface of the ASIC printed circuit board 10, under the traction of the film-peeling X-axis module 32, the tape 201 drives the coating layer 101 to gradually peel off from the initial peeling point to the other side. During the peeling process, the tape 201 remains taut, continuously providing a stable traction force to the coating layer 101, ensuring that the coating layer 101 is completely peeled off without breakage or residue.

[0053] The peeled-off film layer 101 remains adhered to the tape 201 and is guided along with the tape 201 by the right guide roller 25, and then uniformly wound back by the tape rewind roller 24. During the recycling process, the tape 201 and the film layer 101 will not fall off, ensuring the cleanliness of the film peeling station and preventing waste from contaminating the equipment or affecting subsequent processes.

[0054] When the film-peeling X-axis module 32 moves to the other edge of the ASIC printed circuit board 10, and the film layer 101 is completely peeled off, the film-peeling X-axis module 32 moves in the opposite direction, driving the actuator 3 back to the initial position, ready for the next film-peeling action.

[0055] After the film is removed, the Y-axis module 51 drives the support fixture 53 to move back to the inspection area. The film removal inspection mechanism 9 starts the re-inspection process, and the inspection camera once again captures the surface image of the ASIC printed circuit board 10 and transmits it to the image processing system.

[0056] The image processing system analyzes the re-inspection image to determine whether the coating layer 101 has been completely removed: if no residual traces of the coating layer 101 are detected in the image, and there are no scratches, damages or other problems on the surface of the ASIC printed circuit board 10, the film removal is deemed qualified; if residual coating layer 101, surface scratches, circuit damage or other issues are detected, the film removal is deemed unsatisfactory.

[0057] When the ASIC printed circuit board 10 passes the initial inspection and the re-inspection, the negative pressure hole 532 of the support mechanism 5 releases the negative pressure, the pickup mechanism 7 starts again, and transfers the qualified product to another set of flipping platforms 8. The product is then picked up and flipped by another set of vacuum suction cups 451 on the flipping mechanism 4, and transferred to the transfer slot 63 of another set of transfer platforms 6, waiting to be unloaded. It should be noted that in this embodiment, the two sets of vacuum suction cups 451 on the flipping mechanism 4 are respectively on the two sets of flipping platforms 8, so that they can flip for loading and flip for unloading at the same time. When the ASIC printed circuit board 10 fails the initial inspection or the re-inspection, the flipping mechanism 4 transfers it to the equipment's preset defective product placement position. At the same time, the system records the quantity and type of defective products, which is convenient for operators to perform subsequent statistics and processing.

[0058] The transfer platform 6, loaded with qualified products, moves smoothly along the conveying direction to the unloading mechanism area via the transfer X-axis module 61, driving the transfer fixture 62.

[0059] The material handling component of the unloading mechanism removes the qualified ASIC printed circuit boards 10 one by one from the transfer slot 63 and transfers them to the finished product box.

[0060] The full-load detection component of the feeding mechanism monitors the loading status of the finished product bins in real time. When the bins are detected to be full, the equipment automatically issues a full-load warning signal and pauses the feeding operation, waiting for the operator to replace the bins. After the operator replaces the finished product bins and defective bins, the equipment resumes operation and enters the next film-tearing cycle.

[0061] This invention, through the cooperation of an actuator 3 with a pressure roller 342 and a film-tearing spade 36 and a tape mechanism 2, employs a composite film-tearing method using the pressure roller 342 for rolling and the film-tearing spade 36 for edge traction and peeling. This solves the problems of film breakage and residue that are easily caused by traditional film-tearing methods. The tape 201 ensures sufficient adhesion through rolling and bonding, while the traction peeling provides stable traction force, enabling the film layer to be completely peeled off from the edge to the whole, resulting in a high success rate. Multiple film-tearing mechanisms work in parallel, cooperating with the synchronous conveying of dual transfer platforms 6, to achieve simultaneous processing of multiple ASIC printed circuit boards 10, significantly increasing the processing capacity per unit time and effectively improving production efficiency.

[0062] The above description is merely the best implementation method adopted in light of current practical needs, but the scope of protection of this application is not limited thereto.

Claims

1. An automated intelligent film-peeling machine, characterized in that, include: Transfer platform (6), two sets of transfer platforms (6) are arranged in parallel and longitudinally on the rack (1). One set of transfer platforms (6) is used to transport ASIC printed circuit boards (10) with a film layer (101) attached, and the other set is used to transport ASIC printed circuit boards (10) with the film layer (101) removed. The feeding mechanism is located at one end of the transfer platform (6) and is used to provide the transfer platform (6) with a film-coated ASIC printed circuit board (10). The unloading mechanism is located at the other end of the transfer platform (6) and is used to transfer the ASIC printed circuit board (10) with the film removed from the transfer platform (6). The film-tearing mechanism consists of multiple sets of film-tearing mechanisms arranged equidistantly and perpendicularly to the transfer platform (6), and includes the following components in sequence according to the film-tearing process: A flipping mechanism (4) picks up the ASIC printed circuit board (10) to be peeled off from the transfer platform (6) and flips it. A flipping platform (8) for carrying the flipped ASIC printed circuit board (10) and the ASIC printed circuit board (10) with the film removed. Pick-up mechanism (7) for picking up the ASIC printed circuit board (10) to be peeled off from the flipping platform (8). Support mechanism (5) for carrying the ASIC printed circuit board (10) from the pick-up mechanism (7); Tearing detection mechanism for visual inspection (9); An actuator (3) for performing the film-tearing action on the support mechanism (5); Tape mechanism (2) for providing tape (201) to actuator (3), which uses tape (201) to adhere to the coating layer (101) on ASIC printed circuit board (10) and uses traction action to remove the coating layer (101).

2. The automated intelligent film-tearing machine according to claim 1, characterized in that, The transfer platform (6) includes a transfer X-direction module (61), and a transfer fixture (62) is fixed at the output end of the transfer X-direction module (61). Multiple transfer slots (63) are arranged equidistantly along the conveying direction of the transfer fixture (62) on the transfer fixture (62). The number of transfer slots (63) is equal to the number of film-tearing mechanisms.

3. The automated intelligent film-tearing machine according to claim 2, characterized in that, The flipping mechanism (4) includes a flipping Y-axis module (41), which is slidably connected to the frame (1) along the conveying direction of the vertical transfer platform (6). A flipping Z-axis module (42) is fixed to the output end of the flipping Y-axis module (41), and a flipping base plate (43) is fixed to the output end of the flipping Z-axis module (42). Two sets of symmetrically arranged L-shaped brackets (44) are provided on the flipping base plate (43). The L-shaped brackets (44) are rotatably connected to the flipping base plate (43). An adjusting cylinder (45) is fixed to the bottom of the L-shaped bracket (44), and a vacuum suction cup (451) is fixed to the output end of the adjusting cylinder (45). A flipping motor (46) for driving the L-shaped bracket (44) to reciprocate 180° is also fixed on the flipping base plate (43). The relative distance between the two sets of vacuum suction cups (451) is equal to the relative distance between the adjacent transfer slots (63) on the two sets of transfer platforms (6).

4. The automated intelligent film-tearing machine according to claim 3, characterized in that, The flipping platform (8) includes two sets of symmetrically arranged support plates (81). The top of each support plate (81) is fixed with a top plate (82). The top plate (82) is detachably connected to a platform fixture (83). The platform fixture (83) is provided with a material slot (84) for placing the ASIC printed circuit board (10). A U-shaped notch (85) is also provided on one side of the material slot (84). The U-shaped notch (85) is used for vacuum suction cup (451) to adsorb the ASIC printed circuit board (10) after it is flipped and inserted into the lower part of the plate. The relative distance between the two sets of U-shaped notches (85) is equal to the relative distance between the two sets of vacuum suction cups (451).

5. An automated intelligent film-tearing machine according to claim 1, characterized in that, The picking mechanism (7) includes a Y-axis picking module (71), which is slidably connected to the frame (1) in the direction of conveying the transfer platform (6) vertically. A Z-axis picking module (72) is fixed to the output end of the Y-axis picking module (71), and a vacuum suction cup (73) is fixed to the output end of the Z-axis picking module (72).

6. The automated intelligent film-tearing machine according to claim 1, characterized in that, The supporting mechanism (5) includes a Y-axis carrying module (51), and a carrying seat (52) is fixed at the output end of the Y-axis carrying module (51). The running direction of the carrying seat (52) is perpendicular to the conveying direction of the transfer platform (6). A supporting fixture (53) is also fixed on the carrying seat (52). A supporting groove (531) is provided on the top of the supporting fixture (53). A negative pressure hole (532) for adsorbing the ASIC printed circuit board (10) is also provided in the supporting groove (531).

7. An automated intelligent film-tearing machine according to claim 1, characterized in that, The actuator (3) includes a film-tearing Z-axis module (31) fixed on the frame (1). A film-tearing X-axis module (32) is fixed at the output end of the film-tearing Z-axis module (31). A film-tearing X-axis substrate (33) is fixed at the output end of the film-tearing X-axis module (32). A lower guide roller (35) and a film-tearing spatula (36) are fixed on one side of the film-tearing X-axis substrate (33). A roller pressing X-axis module (331) is also fixed on the film-tearing X-axis substrate (33). A film-tearing cylinder (34) is fixed at the output end of the roller pressing X-axis module (331). A film-tearing Z-axis substrate (341) is fixed at the output end of the film-tearing cylinder (34). A pressure roller (342) is provided at the bottom of the film-tearing Z-axis substrate (341).

8. An automated intelligent film-tearing machine according to claim 7, characterized in that, The tape mechanism (2) includes a gantry (21) fixed on the frame (1). The gantry (21) is symmetrically provided with a tape discharge roller (22) and a tape rewind roller (24). The gantry (21) is provided with a left guide roller (23) at the bottom of the tape discharge roller (22) and a right guide roller (25) at the bottom of the tape rewind roller (24). The gantry (21) is located at the end of the support mechanism (5) away from the flipping mechanism (4), and the actuator (3) is located between the conveyor belt discharge roller (22) and the conveyor belt rewind roller (24).

9. An automated intelligent film-tearing machine according to claim 8, characterized in that, Unused tape (201) is wound on the tape discharge roller (22), with the adhesive side of the tape (201) facing down. One end of the tape (201) passes sequentially over the bottom of the left guide roller (23), the top of the lower guide roller (35), the bottom of the film tearing shovel (36), the top of the pressure roller (342), and the bottom of the right guide roller (25) and is fixed on the tape rewind roller (24).

10. An automated intelligent film-tearing machine according to claim 1, characterized in that, The film tearing detection mechanism (9) is located above the flipping platform (8), and a feeding detection mechanism is also located above the feeding mechanism.

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