Method and system for measuring out-of-plane displacement and in-plane displacement based on cooperation of double devices

Abstract

The invention provides a method and a system for measuring out-of-plane displacement and in-plane displacement through double-device cooperation, and belongs to the technical field of vibration and deformation measurement. The method comprises the following steps: S1, establishing an off-plane three-dimensional coordinate system; s2, coordinates of the centers of the two microwave measuring instruments in a coordinate system are obtained; and S3, reconstructing to obtain out-of-plane displacement and in-plane displacement information of the measured target or the measuring point. According to the distance information of the two microwave measuring instruments and the sight line direction displacement measurement and space positioning information of the measuring points, high-precision measurement of out-of-plane displacement and in-plane displacement of the measuring points is achieved through decoupling, and the limitation that only displacement in the sight line direction can be measured through an existing microwave displacement measuring method is overcome; therefore, all-time and all-weather multi-measuring-point synchronous rapid displacement monitoring is realized. Meanwhile, according to the double-equipment collaborative off-plane displacement and in-plane displacement measurement method and system provided by the invention, only two microwave measurement instruments and simple pre-installation calibration are needed, so that the construction and equipment cost is greatly reduced, and the maintenance is convenient.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of vibration and deformation measurement, and in particular relates to a method and system for measuring out-of-plane displacement and in-plane displacement in cooperation with two devices. BACKGROUND

[0002] In key fields such as bridge health detection and aerospace, it is often necessary to monitor the vibration and deformation state of an object or system in a specific dimension (such as out-of-plane displacement), which relies on high-precision measurement of displacement in the corresponding direction. However, traditional vibration measurement focuses on single-dimensional displacement.

[0003] Current mainstream measurement techniques mainly include accelerometers, laser Doppler vibrometers, and vision-based displacement measurement methods. Among them, accelerometers require sensor wiring and networking on the surface of the test object, and obtain displacement signals by measuring acceleration and integration, which is a contact measurement method with the problems of complex wiring and poor flexibility. Laser Doppler vibrometers and vision measurement techniques are non-contact, but require multiple sensing heads to work together, and are sensitive to environmental conditions such as lighting in the test scene, making it difficult to ensure ideal working conditions when measuring outdoors, and introducing significant measurement errors.

[0004] As a new non-contact vibration and deformation displacement measurement method, the new technology and method of multi-point, full-field displacement measurement based on microwave perception has good adaptability to harsh environments, but a single microwave transceiver device can only obtain one-dimensional vibration displacement in the line-of-sight direction, and cannot decouple the out-of-plane and in-plane displacement of each measurement point.

[0005] In addition, related prior art includes: Chinese patent application document with publication number CN118882538A discloses a two-dimensional displacement measurement method and system based on two microwave transceivers. The two-dimensional measurement method based on two microwave transceivers can partially decouple the measurement of two-dimensional displacement, but this method requires the installation position of the fixed device to be fixed, and then the two-dimensional motion direction of the measurement point is calibrated in advance by moving the device synchronously. In large-scale measurement, not only is it required that the two devices are distributed at a large interval, but also it is required that the two devices move synchronously along the two-dimensional motion direction during calibration. The construction and installation, as well as the cost and complexity of the system, are significantly increased.

[0006] Although microwave perception displacement measurement technology has achieved related applications in other fields, there are still problems in the field of out-of-plane displacement and in-plane displacement measurement that need to be addressed: 1. It can only measure displacement along the line-of-sight direction (i.e., the direction of the connection between the measurement point and the device). Even with prior knowledge including installation geometry, it is not possible to decouple and achieve high-precision measurement of out-of-plane displacement and in-plane displacement of the measurement point, resulting in the inability of microwave perception-based displacement measurement methods to be applied to out-of-plane displacement and in-plane displacement monitoring.

[0007] 2. While existing two-dimensional measurement methods based on two microwave transceivers can partially decouple the measurement of two-dimensional displacement, these methods require pre-calibration of the two-dimensional motion direction of the measurement point by synchronously moving the equipment after fixing its installation position. For large-scale measurements, this requires not only maintaining a large interval between the two devices but also ensuring that the two devices move synchronously along the measured two-dimensional motion direction during calibration. In actual measurements, ensuring synchronous movement of the equipment along the two-dimensional plane during calibration is difficult, significantly impacting measurement errors.

[0008] 3. When calibrating a two-dimensional measurement method, the layout of the measuring points must be completely consistent with that during the measurement, and the positional relationship of the points cannot be changed during the measurement process. The accuracy of two-dimensional measurements depends entirely on the calibration coefficient, which limits the practicality of this two-dimensional measurement method for large-scale outdoor measurements.

[0009] Therefore, there is an urgent need for a simple measurement method and system that can measure displacements both out of and in the plane to solve the above-mentioned technical problems. Summary of the Invention

[0010] To address the shortcomings of existing technologies, the purpose of this invention is to provide a method and system for measuring out-of-plane and in-plane displacements using dual-device collaborative methods.

[0011] The present invention provides a method for measuring out-of-plane and in-plane displacements using dual-device collaboration, characterized in that it includes: Step S1: Establish an out-of-plane three-dimensional coordinate system; Step S2: Obtain the coordinates of the centers of the two microwave measuring instruments in the coordinate system; Step S3: Reconstruct the out-of-plane displacement and in-plane displacement information of the measured target or measuring point.

[0012] Preferably, step S1 includes: mounting the microwave tester on the bracket of the equipment support module, adjusting the bracket to ensure that the target under test is within the beam radiation range of the two microwave measuring instruments; denoting the lower microwave measuring instrument as device 1 and the upper microwave measuring instrument as device 2; the positive Z-axis of the coordinate system points from device 1 to device 2, the XOY plane is the plane where the target under test is located, the positive X-axis is the azimuth direction of device 1 and points to the half-space where the target measuring point is located, and the positive Y-axis satisfies the right-hand coordinate system criterion; in the constructed coordinate system, the i-th target measuring point P... i The coordinates are as Where n is the number of target measurement points. The center of the microwave measuring instrument refers to the measurement reference position of the microwave measuring instrument, which can be configured as the geometric center of the instrument or other reference positions as needed.

[0013] Preferably, in step S2, different measurement target points P are obtained. i Vibration displacement information , target measurement point P i distance to microwave measuring instrument and distance from the center of the two microwave measuring instruments to the XOY plane and , Wherein, t represents, at t time, i represents the target measurement point number, and the lower subscript 1, 2 represents for device 1, device 2 respectively.

[0014] Preferably, in the step S3, according to the different measurement target measurement point P i vibration displacement information , target measurement point P i distance to microwave measuring instrument and distance from the center of the two microwave measuring instruments to the XOY plane and ; target measurement point P i out-of-plane vibration displacement time sequence and target measurement point XOY plane in-plane vibration displacement time sequence The solution method of any t time is as follows:

[0015] target measurement point P i out-of-plane coordinates and XOY plane in-plane radius value The calculation method is as follows: It can be written in matrix form as:

[0016] Wherein, i indicates the target measurement point number, indicates different two functions (j=1, 2);

[0017] Finally, the out-of-plane vibration displacement time sequence of the measured target or measurement point along the out-of-plane three-dimensional coordinate system constructed in step S1 and target measurement point XOY plane in-plane vibration displacement time sequence .

[0018] According to the double device cooperative out-of-plane displacement and in-plane displacement measurement system provided by the application, it comprises a microwave transceiver module, a device supporting module and a signal processing module. The device supporting module is used for mounting, fixing and angle adjustment of the microwave transceiver module. The microwave transceiver module is used for transmitting and receiving frequency-modulated continuous wave microwave signals and outputting baseband signals, and comprises two microwave measuring instruments. The signal processing module establishes a measurement coordinate system based on the settings of the microwave transceiver module, obtains signal and spatial position relationship between the two microwave measuring instruments and the measurement point, and calculates the off-plane and in-plane displacement information of the measured target or measurement point.

[0019] Preferably, the device supporting module supports the installation of the two microwave measuring instruments at intervals, can adjust the beam direction so that the measured target or measurement point is within the range of the microwave measuring instrument beam, and fixes and locks the position of the two microwave measuring instruments to prevent the position of the microwave measuring instrument from changing during measurement.

[0020] Preferably, in the microwave transceiver module, each microwave measuring instrument can obtain ranging positioning information or ranging and angle positioning information of one or more to-be-measured measurement points, The two microwave measuring instruments are not installed in close contact with each other; The microwave transceiver module measures and obtains the line-of-sight direction displacement and ranging positioning information of the to-be-measured measurement point and transmits them to the signal processing module.

[0021] Preferably, the signal processing module comprises a baseband signal processing unit and a displacement reconstruction unit. The baseband signal processing unit is used for processing the baseband signal received by the microwave measuring instrument and transmitted by itself, and processing the distance from the measurement target to the microwave measuring instrument and the displacement of the measurement target along the line-of-sight direction of the microwave measuring instrument. The displacement reconstruction unit is used for processing and reconstructing the off-plane displacement and in-plane displacement time series of the measured target or measurement point by using the processing result of the baseband signal processing unit.

[0022] Preferably, the double-device cooperative off-plane displacement and in-plane displacement measurement system further comprises a data display and access module. The signal processing module can be an edge computing module with separate external communication and computing functions or integrated into one of the microwave measuring instruments. The off-plane and in-plane displacement information of the to-be-measured measurement point calculated by the signal processing module is transmitted to the data display and access module for displaying and storing data.

[0023] Compared with the prior art, the present application has the following beneficial effects: 1. The application decouples the high-precision measurement of the key off-plane displacement and in-plane displacement of the measurement point according to the spacing information of two microwave measuring instruments, the line-of-sight direction displacement measurement and spatial positioning information of the measurement point, and breaks away from the limitation that the existing microwave displacement measurement method can only measure the displacement along the line-of-sight direction. 2. The application does not need to strictly synchronize the movement of the equipment for two-dimensional direction calibration before measurement, significantly reduces the requirements for the installation position and motion synchronization of the equipment, and solves the problems of complex calibration process and error sensitivity of the existing two-dimensional measurement method in wide range application. 3. The application allows the dynamic change of the position relationship of the measurement point during measurement, breaks through the dependence of the traditional two-dimensional measurement method on fixed calibration conditions, greatly improves the practicability and reliability of outdoor large-scale measurement, and expands the application in complex engineering scenes. 4. The application can realize the synchronous rapid displacement monitoring of multiple measurement points at all times and in all weather. 5. The off-plane displacement and in-plane displacement measurement method and system provided by the application only need two microwave measuring instruments and simple pre-installation calibration, and the construction and equipment cost is greatly reduced, and the maintenance is convenient. BRIEF DESCRIPTION OF DRAWINGS

[0024] Other features, objects and advantages of the application will become more apparent after reading the following detailed description of non-limiting embodiments with reference to the following drawings: Figure 1 The flowchart of the off-plane displacement and in-plane displacement measurement method of the double equipment cooperation of the application; Figure 2 The schematic diagram of the off-plane three-dimensional coordinate system (wherein the z-axis is the off-plane direction) of the embodiment of the application; Figure 3 The schematic diagram of the experimental test scene of the embodiment of the application; Figure 4 The schematic diagram of the experimental test effect of the embodiment of the application, wherein Figure 4 (a) is the off-plane displacement trajectory diagram obtained after reconstruction, Figure 4 (b) is the in-plane displacement trajectory diagram obtained after reconstruction; Figure 5 The schematic diagram of the off-plane displacement and in-plane displacement measurement system of the double equipment cooperation of the application. DETAILED DESCRIPTION

[0025] The application will be described in detail below with reference to specific embodiments. The following embodiments will help those skilled in the art to further understand the application, but do not limit the application in any form. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the application. These all belong to the protection scope of the application.

[0026] As Figure 5 The present application provides a dual-device cooperative out-of-plane displacement and in-plane displacement measurement system, comprising: a microwave transceiver module, a device support module, and a signal processing module. The device support module is used to mount, fix and adjust the angle of the microwave transceiver module. Specifically, it is used to adjust the angle of the two microwave measurement instruments to ensure that the measured target or measuring point is within the beam radiation range of the microwave measurement instrument, and to fix and lock the position of the microwave measurement instrument to prevent the position of the two microwave measurement instruments from changing during the measurement process.

[0027] The microwave transceiver module is used to transmit and receive frequency-modulated continuous wave microwave signals and output baseband signals. It comprises two microwave measurement instruments. Specifically, when combined with the dual-device cooperative out-of-plane displacement and in-plane displacement measurement method of the present application, the module directly measures the distance from the target measuring point P i vibration displacement information , the target measuring point P i to the microwave measurement instrument and The distance from the center of the two microwave measurement instruments to the XOY plane and can also be directly measured.

[0028] The signal processing module establishes a measurement coordinate system based on the settings of the microwave transceiver module, obtains the signal from the microwave transceiver module, and determines the spatial position relationship between the two microwave measurement instruments and the measuring point to calculate the out-of-plane and in-plane displacement information of the measured target or measuring point. The signal processing module comprises a baseband signal processing unit and a displacement reconstruction unit. The baseband signal processing unit receives the baseband signal transmitted by the microwave measurement instrument, obtains the distance from the measuring target to the microwave measurement instrument, and obtains the displacement of the measuring target along the line-of-sight direction of the microwave measurement instrument. The processing content of the displacement reconstruction unit includes using the processing results of the baseband signal processing unit to reconstruct the out-of-plane displacement and in-plane displacement time series of the measured target or measuring point through step S3.

[0029] Further, the device support module supports the vertical spacing installation and fixation of the two microwave measurement instruments, and the two microwave measurement instruments can adjust the beam direction so that the detection range of the microwave measurement instrument can cover the measuring point to be measured. In the microwave transceiver module, each microwave measurement instrument can obtain ranging positioning information or ranging and angle positioning information of one or more measuring points to be measured. The two microwave measurement instruments are installed at a certain distance, i.e. not adjacent to each other, and the beams emitted by the two microwave measurement instruments can cover one or more measured targets or measuring points. The line-of-sight direction displacement and ranging positioning information of the measuring point to be measured measured by the microwave transceiver module are transmitted to the signal processing module.

[0030] Further, the test system further comprises a data display and access module; the signal processing module can be an edge computing module with separate external communication and calculation functions or integrated into one of the microwave measuring instruments; the off-surface and in-surface displacement information of the to-be-measured measuring points calculated by the signal processing module is transmitted to the data display and access module for displaying and storing data.

[0031] As shown in Figure 5 , the present application installs the sensing heads of two microwave measuring instruments at a certain interval by the measuring system, adjusts the azimuths to make the transmitting beams cover the measured area, and establishes a measuring coordinate system according to the arrangement positions of the microwave measuring instruments and the beam coverage area; then the interval information of the two microwave measuring instruments is obtained, and the distances from the target to the microwave measuring instruments are acquired; the line-of-sight direction displacement information of the two microwave measuring instruments is fused to solve and reconstruct the off-surface displacement and in-surface displacement of the target measuring point. That is, the method for fusing the line-of-sight direction displacement information of the two microwave measuring instruments to solve the off-surface and in-surface displacement of the measured target or measuring point is as follows: a three-dimensional off-surface displacement measuring coordinate system is established according to the spatial positions of the microwave measuring instruments, a decomposition model between the line-of-sight direction displacement and the off-surface and in-surface displacement is established according to the measured vibration displacement information of the measuring target, the distances from the target to the microwave measuring instruments and the coordinates of the centers of the two microwave measuring instruments in the coordinate system, and the off-surface and in-surface displacement components of the measuring point are reconstructed accordingly.

[0032] It should be noted that the microwave measuring instrument in the present application can be a product or device including radar, transceiver, processor and module. The related method can also be extended to optical measuring devices and means including vision and laser.

[0033] As shown in Figure 1 , the present application further provides a double-device cooperative off-surface displacement and in-surface displacement measuring method, which can be realized by using the double-device cooperative off-surface displacement and in-surface displacement measuring system provided by the present application, and the method comprises the following steps. Step S1: establishing an off-surface three-dimensional coordinate system, wherein the z-axis is the off-surface direction; Specifically, the microwave measuring instrument is installed on the support of the device support module, and the support is adjusted to ensure that the measured target is within the beam radiation range of the two microwave measuring instruments; the microwave measuring instrument located below is recorded as device 1, and the microwave measuring instrument located above is recorded as device 2. More specifically, the construction method of the coordinate system is as shown in Figure 2 : the positive direction of the Z-axis points from the device 1 to the device 2, the XOY plane is the plane where the measured target is located, the positive direction of the X-axis is the azimuth angle direction of the device 1 and points to the half space where the target measuring point is located, and the positive direction of the Y-axis satisfies the right-hand coordinate system criterion. In the constructed coordinate system, the coordinates of the i-th target are recorded as , wherein n is the number of target measuring points; Step S2: measuring the different measuring target measuring points P iVibration displacement information Target measurement point P i Distance to microwave measuring instrument and The coordinates of the centers of the two microwave measuring instruments in the coordinate system were obtained through various methods (including but not limited to measurement, calibration, and installation methods). and The center of the microwave measuring instrument refers to the measurement reference position of the microwave measuring instrument, which can be configured as the geometric center of the instrument or other reference positions as needed.

[0034] Furthermore, different measurement target points P i Vibration displacement information Target measurement point P i Distance to microwave measuring instrument and Different target measurement points can be calculated or measured using methods including baseband signal beat frequency estimation. P i The distances between device 1 and device 2 are denoted as follows: Where i is the sequence of target measurement points; by transmitting and receiving frequency-modulated continuous wave microwave signals through device 1 and device 2 and receiving the corresponding echo signals, different target measurement points are extracted from the baseband signal. P i The displacement time series to device 1 and device 2 are denoted as follows: ; Step S3: Reconstruct the out-of-plane and in-plane displacement information of the measured target or measuring point; specifically, based on the different measurement target and measuring point P obtained in step S2... i Vibration displacement information Target measurement point P i Distance to microwave measuring instrument and Distance from the centers of the two microwave measuring instruments to the XOY plane and ; Target measurement point P i Time series of out-of-plane vibration displacement In-plane vibration displacement time series of the target measuring point in the XOY plane The solution method for any time t is as follows:

[0035] Among them, target measurement points P i Out-of-plane coordinates and the in-plane radius value of the XOY plane The calculation method is as follows: It can be written in matrix form as follows:

[0036] in, i For the target measurement point number, Referring to different functions and ;

[0037] Finally, the out-of-plane vibration displacement time series of the measured target or measuring point along the out-of-plane three-dimensional coordinate system constructed in step S1 is calculated. In-plane vibration displacement time series of the target measuring point in the XOY plane .

[0038] Regarding the coordinates of the centers of the two microwave measuring instruments in the coordinate system obtained in step S2... and The method described below, in conjunction with specific embodiments, further illustrates the present invention. It should be noted that the method for obtaining the center coordinates of the measuring instruments in actual measurements is not limited to the methods described below. Method one: The distance from the centers of two microwave measuring instruments to the XOY plane can be directly measured. and Method two allows for the calibration of the coordinates of the centers of the two microwave measuring instruments in the coordinate system. The specific implementation steps of this calibration method are as follows: specifically, it includes: based on the measured target point P... i Vibration displacement information and the distance from the target to the microwave measuring instrument and This allows the reflecting target to be moved a specific distance with high precision along the z-axis; and based on this specific distance and the target measurement points... P i Coordinates in the out-of-plane three-dimensional coordinate system constructed in step S1 By combining the first-order expansion of the formula and simplification of the motion characteristics in the calibration, the distance from the center of the two microwave measuring instruments to the XOY plane can be obtained. and .

[0039] Next, the invention will be further described with reference to a more specific embodiment. Figure 3 and Figure 4 Experimental test results of an embodiment of the measurement method provided by the present invention are shown. For example... Figure 3As shown, two microwave measuring instruments are fixed on both sides of the connecting bracket, forming an out-of-plane three-dimensional coordinate system (where the z-axis is the out-of-plane direction). At this time, a lifting slide is set to generate a displacement cycle sequence with a peak-to-peak value of 10 mm, causing the rigid body to reciprocate along the Z-direction. The out-of-plane displacement trajectory is reconstructed using the above method. Figure 4 As shown in (a), the reconstruction error of the measurement system for each measuring point is within 0.2 mm. It can be seen that the above method accurately reconstructs the motion trajectory of the measured target, obtaining high-precision out-of-plane displacement information. Two displacement cycle sequences with peak-to-peak values ​​of 1 mm and 10 mm are generated by setting a two-dimensional sliding table, causing the rigid body to reciprocate along the X-direction. The in-plane displacement trajectories obtained before and after using the above method are shown. Figure 4 As shown in (b), the peak-to-peak values ​​of the displacements at each measuring point obtained by reconstruction are between 9.94 and 9.99 mm, with a maximum absolute error of 0.06 mm. It can be seen that the motion trajectory of the measured target was accurately restored using the above method, and high-precision in-plane displacement information was obtained.

[0040] The working principle of this invention is as follows: Compared with existing technologies, the wiring and networking of accelerometers for on-site measurement is cumbersome and inconvenient; laser Doppler vibration meters and visual measurement technologies have high requirements for lighting conditions in the test scene and poor adaptability to harsh environments. Existing displacement measurement methods based on microwave sensing can only obtain one-dimensional vibration displacement along the line of sight with a single microwave measuring instrument, and cannot simultaneously achieve high-precision measurement of out-of-plane and in-plane displacement. This invention proposes a method for measuring out-of-plane and in-plane displacement based on two microwave measuring instruments; by using the displacement of the target measuring point along the line of sight of the microwave measuring instruments and the distance between the target measuring point and the two microwave measuring instruments respectively measured by the two microwave measuring instruments, the coordinates of the centers of the two microwave measuring instruments in the coordinate system are obtained by calibration measurement, and then the key out-of-plane vibration displacement time series and in-plane vibration displacement time series of the target measuring point are reconstructed.

[0041] In summary, this invention provides a method and system for measuring out-of-plane and in-plane displacements using a dual-device collaborative approach. Based on two microwave measuring instruments (sensing heads), and utilizing the spacing information between the two instruments, displacement measurement along the line of sight, and spatial positioning information of the measuring points, high-precision measurement of out-of-plane and in-plane displacements is achieved through decoupling. This overcomes the limitation of existing microwave displacement measurement methods, which can only measure displacement along the line of sight. It enables rapid, synchronous displacement monitoring of multiple measuring points around the clock and in all weather conditions. The dual-device collaborative out-of-plane and in-plane displacement measurement method and system provided by this invention requires only two microwave measuring instruments and simple pre-installation calibration, significantly reducing construction and equipment costs and facilitating maintenance.

[0042] Those skilled in the art will understand that, besides implementing the system and its various devices, modules, and units provided by this invention in the form of purely computer-readable program code, the same functions can be achieved entirely through logical programming of the method steps, making the system and its various devices, modules, and units of this invention function in the form of logic gates, switches, application-specific integrated circuits, programmable logic controllers, and embedded microcontrollers. Therefore, the system and its various devices, modules, and units provided by this invention can be considered as a hardware component, and the devices, modules, and units included therein for implementing various functions can also be considered as structures within the hardware component; alternatively, the devices, modules, and units for implementing various functions can be considered as both software modules implementing the method and structures within the hardware component.

[0043] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0044] Specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art can make various changes or modifications within the scope of the claims, which do not affect the essence of the present invention. Unless otherwise specified, the embodiments and features described in this application can be arbitrarily combined with each other.

Claims

1. A method for measuring out-of-plane and in-plane displacements using dual-device collaboration, characterized in that, include: Step S1: Establish an out-of-plane three-dimensional coordinate system; Step S2: Obtain the coordinates of the centers of the two microwave measuring instruments in the coordinate system; Step S3: Reconstruct the out-of-plane displacement and in-plane displacement information of the measured target or measuring point.

2. The method for measuring out-of-plane and in-plane displacements using dual-device collaboration according to claim 1, characterized in that, Step S1 includes: mounting the microwave tester on the bracket of the equipment support module, adjusting the bracket to ensure that the target under test is within the beam radiation range of the two microwave measuring instruments; denoting the lower microwave measuring instrument as device 1 and the upper microwave measuring instrument as device 2; the positive Z-axis of the coordinate system points from device 1 to device 2, the XOY plane is the plane where the target under test is located, the positive X-axis is the azimuth direction of device 1 and points to the half-space where the target measurement point is located, and the positive Y-axis satisfies the right-hand coordinate system criterion; in the constructed coordinate system, the i-th target measurement point P... i The coordinates are as , where n is the number of target measurement points.

3. The method for measuring out-of-plane and in-plane displacements using dual-device collaboration according to claim 2, characterized in that, In step S2, different measurement target points P are obtained. i Vibration displacement information Target measurement point P i Distance to microwave measuring instrument and Distance from the centers of the two microwave measuring instruments to the XOY plane and , Where t represents the target measurement point number at time t, and the subscripts 1 and 2 represent the device 1 and device 2 respectively.

4. The method for measuring out-of-plane and in-plane displacements using dual-device collaboration according to claim 3, characterized in that, In step S3, based on the different measurement target points P obtained in step S2 i Vibration displacement information Target measurement point P i Distance to microwave measuring instrument and Distance from the centers of the two microwave measuring instruments to the XOY plane and ; Target measurement point P i time series of out-of-plane vibration displacement In-plane vibration displacement time series of the target measuring point in the XOY plane The solution method for any time t is as follows: Target measurement point P i Out-of-plane coordinates and the in-plane radius value of the XOY plane The calculation method is as follows: It can be written in matrix form as follows: in, i Refers to the target measurement point number. Refers to two different functions, (j=1,2); Finally, the out-of-plane vibration displacement time series of the measured target or measuring point along the out-of-plane three-dimensional coordinate system constructed in step S1 is calculated. In-plane vibration displacement time series of the target measuring point in the XOY plane .

5. A dual-device collaborative out-of-plane and in-plane displacement measurement system, characterized in that, include: Microwave transceiver module, equipment support module, signal processing module; The device support module is used to install, fix, and adjust the angle of the microwave transceiver module; The microwave transceiver module is used to transmit and receive frequency-modulated continuous wave microwave signals and output baseband signals. The microwave transceiver module includes two microwave measuring instruments. The signal processing module establishes a measurement coordinate system based on the settings of the microwave transceiver module. Based on the signal obtained from the microwave transceiver module and the spatial positional relationship between the two microwave measuring instruments and the measuring point, it calculates the out-of-plane and in-plane displacement information of the measured target or measuring point.

6. The dual-device collaborative out-of-plane and in-plane displacement measurement system according to claim 5, characterized in that, The equipment support module supports two microwave measuring instruments installed vertically at intervals. The support module allows the beam orientation of the two microwave measuring instruments to be adjusted so that the target or measuring point is within the beam radiation range of the microwave measuring instruments. The module also locks the positions of the two microwave measuring instruments in place to prevent their positions from changing during the measurement process.

7. The dual-device collaborative out-of-plane and in-plane displacement measurement system according to claim 5, characterized in that, In the microwave transceiver module, each microwave measuring instrument can acquire ranging and positioning information or ranging and angle positioning information of one or more measurement points. The two microwave measuring instruments are not fitted together. The microwave transceiver module measures and acquires the line-of-sight displacement and ranging positioning information of the test point, and transmits it to the signal processing module.

8. The dual-device collaborative out-of-plane and in-plane displacement measurement system according to claim 5, characterized in that, The signal processing module includes: a baseband signal processing unit and a displacement reconstruction unit; The baseband signal processing unit is used to process the baseband signal received by the microwave measuring instrument and transmitted by itself, and to obtain the distance from the target to the microwave measuring instrument and the displacement of the target along the line of sight of the microwave measuring instrument. The displacement reconstruction unit is used to process and reconstruct the time series of out-of-plane displacement and in-plane displacement of the measured target or measuring point using the processing results of the baseband signal processing unit.

9. The dual-device collaborative out-of-plane and in-plane displacement measurement system according to claim 8, characterized in that, It also includes a data display and access module; The signal processing module can be a separate external edge computing module with communication and computing functions or integrated into one of the microwave measuring instruments; The displacement information of the test point above and below the surface calculated by the signal processing module is transmitted to the data display and storage module for display and storage.

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