Backboard signal connection pin protection device for communication transmission access equipment

Abstract

The invention discloses a communication transmission access equipment backboard signal connection pin protection device, which replaces a common false panel on an equipment spare slot position, and comprises a protection cover body, a base body cover plate and a heat dissipation connecting piece, and the protection cover body is used for wrapping a backboard signal connection pin of a spare service slot position and absorbing heat of the backboard signal connection pin; the base body cover plate is used for dissipating heat conducted by the heat dissipation connecting piece. The heat dissipation connecting piece is used for connecting the protective cover body and the base body cover plate and conducting heat of the protective cover body to the base body cover plate. The protective cover body physically isolates the contact between the contact pin and corrosive gas, and the base body cover plate can dissipate the heat conducted by the heat dissipation connecting piece, so that heat accumulation caused by the addition of the protective cover body is avoided, the heat dissipation capability of the back plate area is enhanced, and the risk of faults caused by overheating of equipment is reduced.

Description

Technical Field

[0001] This invention belongs to the field of communication equipment, and specifically relates to a protective device for signal connection pins on the backplane of a communication transmission access device. Background Technology

[0002] Many communication transmission equipment (such as SDH, OTN, and OLT) have unused service slots, and their backplane signal connection pins are exposed to the internal environment of the equipment chassis for extended periods, leading to oxidation and corrosion and causing equipment expansion failures. Replacing the entire equipment backplane is extremely costly and complex, thus hindering business development and affecting the safe and stable operation of power grid communication equipment.

[0003] Currently, the most common technology uses dummy panels or blind plates provided by the equipment manufacturer. This conventional dummy panel technology has limited functionality and two drawbacks:

[0004] 1. It only prevents dust but not corrosion, and cannot isolate corrosive gases inside the chassis, leading to oxidation and corrosion of the backplane pins.

[0005] 2. It has no heat dissipation function. Ordinary plastic material does not conduct heat and cannot improve heat dissipation in the back panel area.

[0006] Therefore, traditional false panels are a passive and negative protective measure. They solve the problem of preventing large objects from entering, but they are completely unable to deal with gas corrosion and heat accumulation, two key factors that lead to equipment failure and shortened lifespan.

[0007] The main solutions for improving existing technologies are as follows:

[0008] 1. Adding sealing strips to the edges of traditional false panels attempts to improve their sealing performance and better isolate dust and moisture. However, the pins are still exposed to harmful gases in the confined space, making the protection incomplete.

[0009] 2. Apply a protective agent (such as rust inhibitor or contact lubricant) to the backplate pins to isolate them from air and moisture. However, these protective agents can evaporate, dry out, or attract dust, requiring periodic reapplication. This is costly and unreliable, and some chemicals may affect electrical performance, resulting in poor reliability. This solution is purely chemical protection and has nothing to do with heat dissipation.

[0010] 3. To improve heat dissipation, a dummy panel with ventilation holes was used to promote air convection. While the openings improved heat dissipation, they completely sacrificed protective performance, introducing more dust and corrosive gases. Summary of the Invention

[0011] To address the shortcomings of existing technologies, the technical problem to be solved by this invention is to provide a protective device for signal connection pins on the backplane of a communication transmission access device. This device transforms the traditional, single-function dustproof dummy panel into a multi-functional, integrated device that combines pin sealing protection and auxiliary heat dissipation, aiming to replace the ordinary dummy panel on the empty slots of the device.

[0012] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0013] A protective device for signal connection pins on the backplane of a communication transmission access device, comprising:

[0014] The protective cover is used to cover the backplane signal connection pins of the unused service slots and absorb the heat of the backplane signal connection pins.

[0015] The base cover is used to dissipate the heat conducted from the heat dissipation connectors;

[0016] Heat dissipation connectors are used to connect the protective cover and the base cover plate, and to conduct heat from the protective cover to the base cover plate.

[0017] Preferably, the protective cover includes a covering frame that covers the outside of the signal connection pin slot frame on the backplane and an insulating filler material that fills the covering frame.

[0018] Preferably, the covering frame is made of aluminum alloy; and / or, the insulating filler material is epoxy resin.

[0019] Preferably, the base cover plate is formed by extrusion or die casting of aluminum alloy.

[0020] Preferably, the substrate cover plate is provided with a heat dissipation structure, which includes heat dissipation fins.

[0021] Preferably, the heat dissipation connector includes a heat dissipation connecting plate that connects the protective cover and the base cover.

[0022] Preferably, the heat dissipation connector further includes a heat dissipation rod connecting the protective cover and the base cover plate, and the outer end of the heat dissipation rod extends outward from the base cover plate.

[0023] Preferably, a heat sink is fixed on the heat dissipation connecting plate, and the heat dissipation rod passes through the heat sink and carries away the heat from the heat sink.

[0024] Preferably, the heat dissipation connecting plate is made of aluminum alloy and is integrally formed with the base cover plate.

[0025] Preferably, the backplane signal connection pin protection device further includes a pull-out aid connected to the base cover plate.

[0026] The present invention, by adopting the above technical solution, has the following beneficial effects:

[0027] 1. The protective cover encloses the backplane signal connection pins of the unused service slots, physically isolating the pins from contact with corrosive gases, fundamentally preventing oxidation and corrosion, effectively ensuring the integrity of the backplane pins, extending the service life of the equipment by several years, and avoiding expensive backplane replacement costs.

[0028] 2. The heat dissipation connector connects the protective cover and the base cover plate, and conducts the heat of the protective cover to the base cover plate. The base cover plate can dissipate the heat conducted by the heat dissipation connector. Not only does it not accumulate heat due to the addition of the protective cover, it also enhances the heat dissipation capacity of the back plate area and reduces the risk of equipment failure due to overheating.

[0029] 3. The backplane signal connection pin protection device is composed of a protective cover, heat dissipation connectors and a base cover plate. It has a simple structure, low cost (far lower than the cost of replacing the backplane), and is easy to mass-produce and install on site.

[0030] Therefore, installing this backplane signal connection pin protection device enables preventative maintenance, avoiding huge potential losses with minimal investment, significantly improving the reliability and economic benefits of the communication network, achieving multiple positive effects, and possessing extremely high cost-effectiveness and promotional value.

[0031] These features and advantages of the present invention will be disclosed in detail in the following specific embodiments and accompanying drawings. Attached Figure Description

[0032] The invention will be further described below with reference to the accompanying drawings: Figure 1 This is a schematic diagram of the usage state structure of the backplane signal connection pin protection device for a communication transmission access device according to the present invention; Figure 2 This is a schematic diagram of the usage state structure of the backplane signal connection pin protection device for a communication transmission access device according to the present invention; Figure 3 This is a schematic diagram of the usage state structure of the backplane signal connection pin protection device for a communication transmission access device according to the present invention; Figure 4 This is a schematic diagram showing the integrated main structure of the protective cover, heat dissipation connector, and base cover plate in this invention: In the figure: backplane signal connection pin protection device 100, protective cover 110, cover frame 111, heat dissipation connector 120, heat dissipation connection plate 121, heat sink 122, heat dissipation rod 123, base cover plate 130, pull-out aid 140, communication transmission access device 200, backplane signal connection pin 210. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be explained and described below with reference to the accompanying drawings. However, the following embodiments are only preferred embodiments of the present invention and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments in the implementation methods without creative effort are all within the protection scope of the present invention.

[0034] Those skilled in the art will understand that, without conflict, the features in the following embodiments and implementations can be combined with each other.

[0035] The terminology used in this invention is for the purpose of describing specific embodiments only and is not intended to limit the invention. For example, terms such as "upper," "lower," "inner," and "outer" that indicate orientation or positional relationship are based solely on the orientation or positional relationship shown in the accompanying drawings and are used only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device / element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention.

[0036] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0037] In existing technologies, the backplane signal connection pins in unused slots of communication equipment are directly exposed to the air inside the equipment chassis. This leads to continuous contact between the metal surface of the pins and dust, moisture, and corrosive gases such as sulfides / halides. This causes electrochemical corrosion and oxidation of the pins, surface corrosion and oxidation, and potential accumulation of contaminants. Ultimately, when a new service board is inserted, the contact resistance increases sharply, resulting in poor contact. This leads to faults such as board recognition failure, equipment alarms, and service interruptions. Furthermore, repairs require replacing the entire backplane, which is extremely costly.

[0038] Conventional dummy panels only achieve physical spatial isolation (preventing large objects from intruding), but fail to achieve airtight chemical isolation and thermal management, making them unable to cope with gas corrosion and heat accumulation, two key factors that lead to equipment failure and shortened lifespan.

[0039] In response to the above problems, combined with Figures 1 to 4As shown, this embodiment provides a backplane signal connection pin protection device 100 for communication transmission access equipment. It transforms the traditional, single-function dustproof dummy panel into a multi-functional, integrated device that combines pin sealing protection and auxiliary heat dissipation. It aims to replace ordinary dummy panels in unused slots of the equipment. The device includes:

[0040] The protective cover 110 is used to cover the backplane signal connection pins 210 of the unused service slots of the communication transmission access equipment 200 and absorb the heat of the backplane signal connection pins.

[0041] The base cover plate 130 is used to dissipate the heat conducted from the heat dissipation connector 120;

[0042] The heat dissipation connector 120 is used to connect the protective cover 110 and the base cover 130 and to conduct the heat of the protective cover to the base cover.

[0043] To address the issue of pins being exposed to corrosive gases, an insulating protective cover 110 is designed to achieve an interference fit with the pins. The protective cover 110 includes a covering frame 111 that covers the outside of the backplane signal connection pin slot frame and an insulating filler material filled within the covering frame. The insulating filler material can be epoxy resin, which, after molding, pre-forms the pinholes corresponding to the backplane signal connection pins, achieving an interference fit. Therefore, it has excellent insulation and sealing performance. Furthermore, the epoxy resin's thermal conductivity can be significantly improved by adding high thermal conductivity fillers, such as boron nitride, alumina, or nano-zinc, and optimizing the filler distribution. Thus, this protective cover, through the filling insulating material, tightly adheres to each pin, fundamentally physically isolating the pins from contact with harmful gases, effectively ensuring the integrity of the backplane pins, extending the equipment's service life by several years, and avoiding expensive backplane replacement costs.

[0044] The base cover plate 130 replaces the original false panel, serving as a seal, electromagnetic shield, and final heat dissipation unit. To improve heat dissipation, the base cover plate is equipped with a heat dissipation structure, such as heat dissipation fins. The base cover plate can dissipate the heat conducted from the heat dissipation connectors, preventing heat accumulation due to the added protective cover and instead enhancing the heat dissipation capacity of the back panel area, reducing the risk of equipment failure due to overheating.

[0045] In some embodiments, the heat dissipation connector 120 includes a heat dissipation connecting plate 121 connecting the protective cover and the base cover. Furthermore, the heat dissipation connector 120 also includes a heat dissipation rod 123 connecting the protective cover and the base cover, with the outer end of the heat dissipation rod extending outward from the base cover. The heat dissipation connecting plate is made of aluminum alloy, while the heat dissipation rod can be made of brass, and multiple heat dissipation rods can be provided. Brass has good heat dissipation performance, high thermal conductivity, and moderate cost. Both serve not only as structural fixation elements but also as the core heat conduction path for passive heat dissipation.

[0046] Furthermore, a heat sink 122 is fixed on the heat dissipation connecting plate 121, and the heat dissipation rod 123 passes through the heat sink and carries away the heat from it. Multiple heat sinks are fixed to the base plate, arranged perpendicular to the heat dissipation rod. The base plate can be fixed to the heat dissipation connecting plate using bolts or rivets, enhancing the heat dissipation effect. Addressing the issue that ordinary false panels lack heat dissipation functionality and that adding a sealing device might cause heat accumulation defects, an integrated heat dissipation connecting plate and base cover are designed to establish an efficient heat conduction path from the inside of the equipment to the outside. This not only compensates for the heat dissipation problems that might arise from adding a protective cover but also actively enhances the heat dissipation capacity of the back panel area, improving the long-term thermal stability of the equipment.

[0047] In some embodiments, the covering frame 111, the base cover plate 130, and the heat dissipation connecting plate 121 are all made of aluminum alloy. Figure 4 As shown, the heat dissipation connecting plate 121, the base cover plate 130, and the covering frame 111 are integrally formed structures. For example, they are formed by aluminum alloy extrusion or die casting.

[0048] In addition, the backplane signal connection pin protection device 100 also includes a pull-out aid 140 connected to the base cover plate. The pull-out aid 140 adopts a mature product that is already available on the market, with one connected to each side of the base cover plate. Moreover, corresponding pull-out aid installation structures are provided on both sides of the base cover plate to facilitate the insertion and removal of the backplane signal connection pin protection device 100.

[0049] The core principle of this invention is the integrated design of pin-level encapsulation isolation and passive heat dissipation.

[0050] Protection Principle: The bottom of the protective cover is filled with epoxy resin, completely covering the exposed backplane signal connection pins. This covering structure physically forms a dense insulating barrier, fundamentally isolating the pins from corrosive gases and dust in the computer room environment, effectively terminating the electrochemical corrosion process, thereby preventing oxidation and ensuring the reliability of electrical connections during future capacity expansion.

[0051] Heat dissipation principle: A low-thermal-resistance heat conduction path is established between the protective cover and the external base cover plate through a metal connecting rod (plate) with high thermal conductivity. Heat from the backplate pins and surrounding air is absorbed by the protective cover and efficiently conducted to the base cover plate through the metal connecting rod. The base cover plate acts as a heat sink, and its heat dissipation structure dissipates heat through convection and radiation, thereby compensating for and enhancing the heat dissipation capacity of the backplate area and avoiding heat accumulation problems that might occur with the addition of the protective cover.

[0052] Therefore, this invention completely overturns the passive protection logic of traditional fake panels through four major means: isolation, fidelity preservation, heat dissipation, and prevention, bringing significant technical and economic benefits to enterprises.

[0053] The above description is merely a specific embodiment of the invention, but the scope of protection of the invention is not limited thereto. Those skilled in the art should understand that the invention includes, but is not limited to, the contents described in the accompanying drawings and the specific embodiments above. Any modifications that do not depart from the functional and structural principles of the invention will be included within the scope of the claims.

Claims

1. A protective device for signal connection pins on the backplane of a communication transmission access device, characterized in that, include: The protective cover is used to cover the backplane signal connection pins of the unused service slots and absorb the heat of the backplane signal connection pins. The base cover is used to dissipate the heat conducted from the heat dissipation connectors; Heat dissipation connectors are used to connect the protective cover and the base cover plate, and to conduct heat from the protective cover to the base cover plate.

2. The communication transmission access equipment backplane signal connection pin protection device according to claim 1, characterized in that, The protective cover includes a cover frame that covers the outside of the signal connection pin slot frame on the backplate and insulating filler material that fills the cover frame.

3. The backplane signal connection pin protection device for a communication transmission access device according to claim 2, characterized in that, The covering frame is made of aluminum alloy; and / or the insulating filler material is epoxy resin.

4. The backplane signal connection pin protection device for a communication transmission access device according to claim 1, characterized in that, The base cover plate is formed by extrusion or die casting of aluminum alloy.

5. A protective device for backplane signal connection pins of a communication transmission access device according to claim 4, characterized in that, The base cover plate is provided with a heat dissipation structure, which includes heat dissipation fins.

6. The backplane signal connection pin protection device for a communication transmission access device according to claim 1, characterized in that, The heat dissipation connector includes a heat dissipation connecting plate that connects the protective cover and the base cover.

7. A protective device for backplane signal connection pins of a communication transmission access device according to claim 6, characterized in that, The heat dissipation connector also includes a heat dissipation rod that connects the protective cover and the base cover plate, and the outer end of the heat dissipation rod extends outward from the base cover plate.

8. A protective device for backplane signal connection pins of a communication transmission access device according to claim 7, characterized in that, A heat sink is fixed on the heat dissipation connecting plate, and the heat dissipation rod passes through the heat sink and carries away the heat from the heat sink.

9. A protective device for backplane signal connection pins of a communication transmission access device according to claim 7, characterized in that, The heat dissipation connecting plate is made of aluminum alloy and is integrally formed with the base cover plate.

10. A protective device for backplane signal connection pins of a communication transmission access device according to claim 1, characterized in that, The backplane signal connection pin protection device also includes a pull-out aid connected to the base cover plate.

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