Manufacturing method of double-color-temperature light source

Abstract

The invention relates to a manufacturing method of a double-color-temperature light source. The manufacturing method comprises the steps that a high-color-temperature chip and a low-color-temperature chip are arranged on a support in a die bonding mode; coating silica gel on the surfaces, deviating from the bracket, of the high-color-temperature chip and the low-color-temperature chip to form a silica gel layer and a first fluorescent gel layer; carrying out curing treatment on the silica gel layer and the first fluorescent glue layer at a first preset temperature; and coating the surfaces of the high-color-temperature chip and the low-color-temperature chip with second fluorescent glue to form a second fluorescent glue layer, and performing curing treatment at a second preset temperature to obtain the double-color-temperature light source. Visibly, the surface, deviating from the bracket, of the high-color-temperature chip is coated with the silica gel, so that the fluorescent powder can be prevented from absorbing the blue light component emitted by the fluorescent powder, and the high-color-temperature characteristic of the high-color-temperature chip is ensured to be maintained. The surface, away from the support, of the low-color-temperature chip is coated with the fluorescent glue, part of blue light emitted by the low-color-temperature chip can be converted into yellow light or red light, and then the color temperature is reduced to the preset target range. The manufacturing process effectively widens the color temperature adjusting range of the double-color-temperature light source.

Description

Technical Field

[0001] This application relates to the field of light source manufacturing, and in particular to a method for manufacturing a dual-color temperature light source. Background Technology

[0002] With the rapid development of lighting and display technologies, the functional and adaptability requirements of light sources are becoming increasingly diversified. Single-color-temperature light sources are no longer sufficient to meet the requirements of lighting comfort, color reproduction, and specific functions in different scenarios. Dual-color-temperature light sources, due to their adjustable color temperature, can adapt to the needs of different application scenarios by switching or mixing high and low color-temperature light, and have been widely used in indoor lighting, photography and videography, security monitoring, automotive lighting, and medical lighting. However, there are significant differences in color temperature and light intensity between dual-color-temperature light sources produced by different manufacturing processes.

[0003] Currently, the main technology for producing dual-color temperature light sources is the double-layer dispensing method. Specifically, high-precision dispensing equipment is used to coat two layers of a specific adhesive onto the surfaces of a low-color-temperature chip and a high-color-temperature chip, followed by curing to obtain the dual-color-temperature light source.

[0004] However, when the same adhesive is applied to both the high color temperature chip and the low color temperature chip, the initial color temperature of the low color temperature chip may be too high, which in turn leads to a narrowing of the color temperature range of the dual color temperature chips and makes it impossible to accurately achieve the target color temperature requirement. Summary of the Invention

[0005] This application provides a method for manufacturing a dual-color temperature light source, which aims to solve the technical problem that coating high-color-temperature chips and low-color-temperature chips with the same adhesive results in a reduction in the color temperature range of dual-color temperature.

[0006] In a first aspect, embodiments of this application provide a method for manufacturing a dual-color temperature light source, comprising:

[0007] The high color temperature chip and the low color temperature chip are respectively die-bonded onto the substrate;

[0008] Silicone is coated on the surface of the high color temperature chip facing away from the bracket to form a silicone layer;

[0009] A first fluorescent adhesive is coated on the surface of the low color temperature chip facing away from the bracket to form a first fluorescent adhesive layer;

[0010] The silicone layer and the first fluorescent adhesive layer are cured at a first preset temperature;

[0011] A second phosphor is coated on the surface of the high color temperature chip and the surface of the low color temperature chip to form a second phosphor layer;

[0012] The second fluorescent adhesive layer is cured at a second preset temperature to obtain the dual-color temperature light source.

[0013] Optionally, the first fluorescent adhesive includes a first fluorescent powder, wherein the first fluorescent powder accounts for 50%-75% of the total mass of the first fluorescent adhesive.

[0014] Optionally, the thickness of the first fluorescent adhesive layer is 60-100 μm.

[0015] Optionally, the second fluorescent adhesive includes a second phosphor, wherein the second phosphor accounts for 20%-60% of the total mass of the second fluorescent adhesive.

[0016] Optionally, the thickness of the second fluorescent adhesive layer is 380-700 μm.

[0017] Optionally, the silica gel includes an anti-precipitation powder, which accounts for 3%-25% of the total mass of the silica gel.

[0018] Optionally, the thickness of the silicone layer is 60-80 μm.

[0019] Optionally, the method further includes:

[0020] Measure the photoelectric parameters of the dual-color temperature light source;

[0021] The proportion of the anti-precipitation powder in the total mass of the silicone is adjusted according to the photoelectric parameters, and / or the thickness of the silicone layer is adjusted according to the photoelectric parameters.

[0022] Optionally, the photoelectric parameters include color temperature and brightness; adjusting the proportion of the anti-deposition powder in the total mass of the silicone according to the photoelectric parameters, and / or adjusting the thickness of the silicone layer according to the photoelectric parameters, includes:

[0023] The illumination intensity of the dual-color temperature light source is determined based on the color temperature and the brightness.

[0024] The proportion of the anti-precipitation powder in the total mass of the silicone is adjusted according to the light intensity, and / or the thickness of the silicone layer is adjusted according to the light intensity.

[0025] Optionally, adjusting the proportion of the anti-settling powder in the total mass of the silicone according to the light intensity, and / or adjusting the thickness of the silicone layer according to the light intensity, includes:

[0026] Determine whether the light intensity is greater than a preset light intensity threshold;

[0027] If so, reduce the proportion of the anti-settling powder in the total mass of the silicone, and / or reduce the thickness of the silicone layer;

[0028] If not, increase the proportion of the anti-precipitation powder in the total mass of the silicone, and / or increase the thickness of the silicone layer.

[0029] This application provides a method for manufacturing a dual-color temperature light source. The method includes: die-bonding a high color temperature chip and a low color temperature chip onto a substrate; coating the surface of the high color temperature chip facing away from the substrate with silicone to form a silicone layer; coating the surface of the low color temperature chip facing away from the substrate with a first phosphor to form a first phosphor layer; curing the silicone layer and the first phosphor layer at a first preset temperature; coating the surfaces of the high color temperature chip and the low color temperature chip with a second phosphor to form a second phosphor layer; and curing the second phosphor layer at a second preset temperature to obtain the dual-color temperature light source. Therefore, in this application, the high color temperature chip and the low color temperature chip are die-bonded onto a substrate. Then, silicone is coated on the surface of the high color temperature chip facing away from the substrate to form a silicone layer; and a first phosphor is coated on the surface of the low color temperature chip facing away from the substrate to form a first phosphor layer. Furthermore, the silicone layer and the first phosphor layer are cured at a first preset temperature, and a second phosphor layer is coated on the surfaces of the high color temperature chip and the low color temperature chip to form a second phosphor layer. Finally, the second phosphor layer is cured at a second preset temperature to obtain a dual-color temperature light source. Therefore, in this application's technical solution, by coating the surface of the high color temperature chip away from the support with silicone, the absorption of the emitted blue light component by the phosphor can be avoided, ensuring that the high color temperature chip maintains its high color temperature characteristics. Coating the surface of the low color temperature chip away from the support with phosphor can convert some of its emitted blue light into yellow or red light, thereby reducing the color temperature to a preset target range. This manufacturing process, through the aforementioned differentiated coating design, can effectively broaden the color temperature adjustment range of the dual-color temperature light source, thereby significantly improving its color temperature control accuracy and flexibility. Attached Figure Description

[0030] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0031] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0033] Figure 1 A schematic flowchart illustrating a method for manufacturing a dual-color temperature light source according to an embodiment of this application;

[0034] Figure 2 This is one of the schematic diagrams illustrating a method for manufacturing a dual-color temperature light source provided in an embodiment of this application;

[0035] Figure 3 This is a second schematic diagram of a method for manufacturing a dual-color temperature light source provided in an embodiment of this application. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0038] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0039] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0040] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0041] As used in this specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrases "if determined" or "if [the described condition or event] is detected" may be interpreted, depending on the context, as "once determined," "in response to determination," "once [the described condition or event] is detected," or "in response to detection of [the described condition or event]."

[0042] To address the technical problem that coating high-color-temperature chips and low-color-temperature chips with the same adhesive in existing technologies leads to a narrowing of the color-temperature range of dual-color-temperature light sources, this application provides a method for manufacturing dual-color-temperature light sources that can broaden the color-temperature adjustment range of dual-color-temperature light sources.

[0043] Figure 1 This is a schematic flowchart illustrating a method for manufacturing a dual-color temperature light source, provided in an embodiment of this application. In one embodiment, the method includes:

[0044] S101. The high color temperature chip and the low color temperature chip are respectively die-bonded onto the substrate.

[0045] Specifically, in this embodiment, the high color temperature chip and the low color temperature chip are respectively die-bonded onto the corresponding die-bonding area of ​​the bracket.

[0046] S102. Coat the surface of the high color temperature chip away from the bracket with silicone to form a silicone layer.

[0047] Please see Figures 2-3 , Figure 2 This is one of the schematic diagrams illustrating a method for manufacturing a dual-color temperature light source provided in an embodiment of this application. Figure 3 This is a second schematic diagram illustrating a method for fabricating a dual-color temperature light source according to an embodiment of this application. It should be noted that in this embodiment, silicone is coated only on the surface of the high color temperature chip facing away from the support. The silicone includes anti-deposition powder. The anti-deposition powder accounts for 3%-25% of the total mass of the silicone. Preferably, the thickness of the silicone layer is 60-80 μm.

[0048] S103. Coat the surface of the low color temperature chip away from the bracket with a first fluorescent adhesive to form a first fluorescent adhesive layer.

[0049] It should be noted that the first fluorescent adhesive is a specific type of fluorescent adhesive. Specifically, the first fluorescent adhesive includes a first phosphor, which accounts for 50%-75% of the total mass of the first fluorescent adhesive. The first phosphor is a common phosphor.

[0050] Preferably, the thickness of the first fluorescent adhesive layer is 60-100 μm.

[0051] S104. At the first preset temperature, the silicone layer and the first fluorescent adhesive layer are cured.

[0052] The first preset temperature is 80-100℃. That is, in this embodiment, the silicone layer and the first fluorescent adhesive layer are baked and cured at a temperature of 80-100℃. Preferably, the curing time is half an hour to one hour. It should be noted that the first preset temperature and curing time in this embodiment are set by the applicant based on actual experience, which can effectively avoid the occurrence of color temperature drop and brightness loss caused by over-baking.

[0053] S105. A second phosphor is coated on the surface of the high color temperature chip and the surface of the low color temperature chip to form a second phosphor layer.

[0054] It should be noted that the second fluorescent adhesive includes a second phosphor. The second phosphor is the same as the first phosphor. This will not be elaborated further in this application.

[0055] Preferably, the proportion of the second phosphor to the total mass of the second fluorescent adhesive is 20%-60%.

[0056] It should be noted that the second phosphor layer needs to cover the surfaces of both the high color temperature chip and the low color temperature chip. Simultaneously, the second phosphor layer also covers the silicone layer and the first phosphor layer, ensuring that the second phosphor layer is flush with the inner wall of the support cup. Preferably, the thickness of the second phosphor layer is 380-700 μm.

[0057] S106. At the second preset temperature, the second fluorescent adhesive layer is cured to obtain a dual-color temperature light source.

[0058] The second preset temperature can be the same as or different from the first preset temperature. Preferably, the second preset temperature is 80-100℃. In this embodiment, the second fluorescent adhesive layer is baked and cured at 80-100℃. Preferably, the curing time is half an hour to one hour. It should be noted that the second preset temperature and curing time in this embodiment are set by the applicant based on practical experience, which can effectively avoid the occurrence of color temperature drop and brightness loss caused by over-baking.

[0059] This application provides a method for manufacturing a dual-color temperature light source. The method includes: die-bonding a high color temperature chip and a low color temperature chip onto a substrate; coating the surface of the high color temperature chip facing away from the substrate with silicone to form a silicone layer; coating the surface of the low color temperature chip facing away from the substrate with a first phosphor to form a first phosphor layer; curing the silicone layer and the first phosphor layer at a first preset temperature; coating the surfaces of the high color temperature chip and the low color temperature chip with a second phosphor to form a second phosphor layer; and curing the second phosphor layer at a second preset temperature to obtain the dual-color temperature light source. Therefore, in this application, the high color temperature chip and the low color temperature chip are die-bonded onto a substrate. Then, silicone is coated on the surface of the high color temperature chip facing away from the substrate to form a silicone layer; and a first phosphor is coated on the surface of the low color temperature chip facing away from the substrate to form a first phosphor layer. Furthermore, the silicone layer and the first phosphor layer are cured at a first preset temperature, and a second phosphor layer is coated on the surfaces of the high color temperature chip and the low color temperature chip to form a second phosphor layer. Finally, the second phosphor layer is cured at a second preset temperature to obtain a dual-color temperature light source. Therefore, in this application's technical solution, by coating the surface of the high color temperature chip away from the support with silicone, the absorption of the emitted blue light component by the phosphor can be avoided, ensuring that the high color temperature chip maintains its high color temperature characteristics. Coating the surface of the low color temperature chip away from the support with phosphor can convert some of its emitted blue light into yellow or red light, thereby reducing the color temperature to a preset target range. This manufacturing process, through the aforementioned differentiated coating design, can effectively broaden the color temperature adjustment range of the dual-color temperature light source, thereby significantly improving its color temperature control accuracy and flexibility.

[0060] In one embodiment, the method further includes: S107-S108.

[0061] S107. Measure the photoelectric parameters of a dual-color temperature light source.

[0062] The photoelectric parameters include color temperature and brightness. In this embodiment, professional equipment is used to measure the color temperature and brightness of the dual-color temperature light source.

[0063] S108. Adjust the proportion of anti-precipitation powder in the total mass of silicone according to photoelectric parameters, and / or adjust the thickness of the silicone layer according to photoelectric parameters.

[0064] In one embodiment, S108 specifically includes the following steps:

[0065] S1081. Determine the illuminance of the dual-color temperature light source based on color temperature and brightness.

[0066] In this embodiment, the illumination intensity of the dual-color temperature light source is further determined based on color temperature and brightness.

[0067] S1082. Adjust the proportion of anti-settling powder in the total mass of silicone according to the light intensity, and / or adjust the thickness of the silicone layer according to the light intensity.

[0068] In one embodiment, S1082 specifically includes the following step: ac.

[0069] a) Determine if the light intensity is greater than the preset light intensity threshold. If yes, proceed to b; otherwise, proceed to c.

[0070] The preset light intensity threshold was set by the applicant based on practical experience. This application does not impose any restrictions on it.

[0071] b. Reduce the proportion of anti-settling powder in the total mass of silicone, and / or reduce the thickness of the silicone layer;

[0072] c. Increase the proportion of anti-precipitation powder in the total mass of the silicone, and / or increase the thickness of the silicone layer.

[0073] It should be noted that steps b-c are described in detail below in this application.

[0074] When the light intensity of a dual-color temperature light source is relatively high, the proportion of anti-precipitation powder in the total mass of the silicone can be reduced, and / or the thickness of the silicone layer can be decreased, so that some blue light can directly contact the air and undergo total internal reflection, thereby reducing the light extraction efficiency.

[0075] When the light intensity of the dual-color temperature light source is relatively low, the proportion of anti-precipitation powder in the total mass of the silicone can be increased, and / or the thickness of the silicone layer can be increased to reduce total emission loss and thus improve light extraction efficiency.

[0076] It should be noted that, through S107-S108, this application can further optimize the proportion of anti-precipitation powder in the total mass of silicone and the thickness of the silicone layer used in the subsequent production of dual-color temperature light sources, so that the newly generated dual-color temperature light source can meet the expected dual-color temperature range. On the one hand, it can ensure the color temperature accuracy and consistency of the dual-color temperature light source, and on the other hand, it can reduce manual intervention and effectively improve production efficiency.

[0077] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0078] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Since these modifications and variations fall within the scope of the claims and their equivalents, this application also intends to include these modifications and variations.

[0079] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A method for manufacturing a dual-color temperature light source, characterized in that, include: The high color temperature chip and the low color temperature chip are respectively die-bonded onto the substrate; Silicone is coated on the surface of the high color temperature chip facing away from the bracket to form a silicone layer; A first fluorescent adhesive is coated on the surface of the low color temperature chip facing away from the bracket to form a first fluorescent adhesive layer; The silicone layer and the first fluorescent adhesive layer are cured at a first preset temperature; A second phosphor is coated on the surface of the high color temperature chip and the surface of the low color temperature chip to form a second phosphor layer; The second fluorescent adhesive layer is cured at a second preset temperature to obtain the dual-color temperature light source.

2. The method according to claim 1, characterized in that, The first fluorescent adhesive includes a first fluorescent powder, and the first fluorescent powder accounts for 50%-75% of the total mass of the first fluorescent adhesive.

3. The method according to claim 1, characterized in that, The thickness of the first fluorescent adhesive layer is 60-100 μm.

4. The method according to claim 1, characterized in that, The second fluorescent adhesive includes a second fluorescent powder, which accounts for 20%-60% of the total mass of the second fluorescent adhesive.

5. The method according to claim 1, characterized in that, The thickness of the second fluorescent adhesive layer is 380-700 μm.

6. The method according to claim 1, characterized in that, The thickness of the silicone layer is 60-80 μm.

7. The method according to any one of claims 1 to 6, characterized in that, The silica gel includes an anti-precipitation powder, which accounts for 3%-25% of the total mass of the silica gel.

8. The method according to claim 7, characterized in that, The method further includes: Measure the photoelectric parameters of the dual-color temperature light source; The proportion of the anti-precipitation powder in the total mass of the silicone is adjusted according to the photoelectric parameters, and / or the thickness of the silicone layer is adjusted according to the photoelectric parameters.

9. The method according to claim 8, characterized in that, The photoelectric parameters include color temperature and brightness. Adjusting the proportion of the anti-precipitation powder in the total mass of the silicone based on the photoelectric parameters, and / or adjusting the thickness of the silicone layer based on the photoelectric parameters, includes: The illumination intensity of the dual-color temperature light source is determined based on the color temperature and the brightness. The proportion of the anti-precipitation powder to the total mass of the silicone is adjusted according to the light intensity, and / or the thickness of the silicone layer is adjusted according to the light intensity.

10. The method according to claim 9, characterized in that, The step of adjusting the proportion of the anti-settling powder in the total mass of the silicone according to the light intensity, and / or adjusting the thickness of the silicone layer according to the light intensity, includes: Determine whether the light intensity is greater than a preset light intensity threshold; If so, reduce the proportion of the anti-settling powder in the total mass of the silicone, and / or reduce the thickness of the silicone layer; If not, increase the proportion of the anti-precipitation powder in the total mass of the silicone, and / or increase the thickness of the silicone layer.

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