Protection method for exposed bonding pad of ESOP device

By using a non-contact protection method with a fixture plate and Blu-Tack, the mechanical damage and contamination of exposed pads of ESOP devices in non-soldering processes are solved, improving soldering reliability and production efficiency, and avoiding the cost and reliability issues caused by applying film.

CN121752028APending Publication Date: 2026-03-27ZHENGZHOU XINGHANG TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-26
Publication Date
2026-03-27

AI Technical Summary

Technical Problem

In existing technologies, the exposed pads of ESOP devices are susceptible to mechanical scratches, foreign matter contamination, and electrostatic adsorption during non-soldering processes. Furthermore, the film protection method increases labor costs and affects soldering reliability and production efficiency.

Method used

The fixture board and adhesive block structure are matched with ESOP devices. The exposed pads on the back of the device are fixed in the groove of the fixture board, and the Blu-Tack adhesive blocks are used for non-contact protection to avoid mechanical scratches and contamination, ensuring that the pads are suspended.

Benefits of technology

It achieves protection without additional processes, improves the soldering reliability and production yield of ESOP devices, reduces adhesive residue, and improves overall operational efficiency.

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  • Figure CN121752028A_ABST
    Figure CN121752028A_ABST
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Abstract

The invention discloses a protection method for an exposed bonding pad of an ESOP device. The method provided by the invention comprises the following steps of: providing a clamp plate matched with a lead frame of the ESOP device, and arranging an array type groove matched with the position of a bonding pad of the ESOP device on the clamp plate; a plurality of rubber blocks are arranged on the frame of the clamp plate; the front face of the ESOP device faces upwards, a lead frame of the ESOP device is placed on the clamp plate, the frame of the lead frame and the frame of the clamp plate are bonded and fixed, and a plastic package body of the ESOP device is embedded into the corresponding groove; and after the subsequent processing procedure is completed, the ESOP device is separated from the clamp plate. According to the invention, continuous and effective physical isolation protection can be carried out on the exposed bonding pad, so that mechanical scraping and impurity pollution are prevented, and the welding reliability, the production yield and the overall operation efficiency of the ESOP device are improved.
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