A smart alignment and bonding system for a precision optical element array

Abstract

This invention discloses an intelligent alignment and bonding system for precision optical element arrays, comprising a quantum dot encoding module, a multi-parameter acquisition and analysis module, an additive manufacturing dynamic printing module, a closed-loop control module, a mechanical execution module, and a bonding module. The system constructs multi-level quantum dot encoding on the surface of the optical elements as a unified information carrier and benchmark. The multi-parameter acquisition and analysis module excites and analyzes the encoded signals to simultaneously acquire nanoscale coordinate data and physical property data of the optical elements. The additive manufacturing dynamic printing module dynamically plans and prints a bonding buffer layer based on the physical property data, and performs real-time monitoring and path correction based on the quantum dot encoding during the printing process. The closed-loop control module coordinates the various modules, and finally, the mechanical execution module and the bonding module complete the precise alignment and bonding. This invention effectively solves the collaborative problem of high-precision alignment and interface stress matching, improving bonding accuracy, consistency, and efficiency.

Description

Technical Field

[0001] This invention relates to the field of precision optical manufacturing and automation technology, and in particular to an intelligent alignment and bonding system for precision optical element arrays. Background Technology

[0002] Precision optical element arrays are widely used in high-end displays, optical communications, and precision imaging. Their manufacturing process involves multiple assembly and connection steps at the micro- and nano-scale. Among these, alignment accuracy and bonding quality directly affect the imaging consistency, light transmission efficiency, and long-term stability of the optical system. Therefore, alignment and bonding processes have always been key factors restricting the large-scale manufacturing and performance improvement of precision optical element arrays.

[0003] In existing manufacturing processes, the alignment of optical components typically relies on external inspection and positioning methods to obtain the component's position information in space to guide subsequent assembly operations. However, as the size of optical components continues to shrink and the array density continues to increase, alignment methods based solely on position coordinates are gradually revealing insufficient precision redundancy. Especially in scenarios involving multiple stacked components or high-consistency assembly, minute deviations can easily accumulate and be amplified, thus affecting the final optical performance.

[0004] Meanwhile, optical components inevitably exhibit individual differences during manufacturing and processing, such as variations in surface morphology, dimensional tolerance fluctuations, and the dispersion of material physical properties. These differences often have a significant impact on stress distribution and structural stability during the bonding process. However, in existing processes, this information is usually scattered across different inspection stages, making it difficult to acquire and utilize it simultaneously during alignment and bonding, resulting in a lack of targeted adjustment of assembly parameters.

[0005] Furthermore, to alleviate the mechanical or thermal stress generated during bonding, buffer structures are typically introduced between optical elements. However, existing buffer structures are mostly formed using preset or uniform specifications, making it difficult to dynamically match them according to the actual state of individual optical elements. As a result, problems such as localized stress concentration, structural deformation, or performance degradation may still occur in some application scenarios.

[0006] From the perspective of the overall process flow, alignment, testing, buffer structure formation, and bonding operations are often completed by different equipment or independent processes, resulting in insufficient coordination between the various stages. Process parameter adjustments mainly rely on preset experience or offline calibration results, lacking the ability to perceive and correct deviations in real time during manufacturing. This not only limits assembly efficiency but also increases the impact of process fluctuations on the consistency and yield of finished products.

[0007] Therefore, how to effectively acquire and utilize the state information of optical components without increasing the complexity of the process, and how to form a collaborative linkage and dynamic adjustment mechanism in the alignment and bonding process to improve assembly accuracy, stability and overall manufacturing efficiency, remains a technical problem that urgently needs to be solved in the field of precision optical component array manufacturing. Summary of the Invention

[0008] To address the shortcomings of existing technologies, the present invention aims to provide an intelligent alignment and bonding system for precision optical element arrays. This system uses quantum dot encoding as a unified information carrier and sensing benchmark to simultaneously achieve nanoscale alignment of optical elements, in-situ detection of physical properties, dynamic customization of buffer layers, and real-time error correction in a single process, thereby synergistically improving assembly accuracy, interface quality, and manufacturing efficiency.

[0009] To achieve the above objectives, the present invention provides the following technical solution: an intelligent alignment and bonding system for a precision optical element array, comprising:

[0010] A quantum dot encoding module for constructing multi-level quantum dot encodings on the surface of optical components;

[0011] A multi-parameter acquisition and analysis module, connected to the quantum dot encoding module, is used to excite and acquire the optical signals encoded by the multi-level quantum dots, and to analyze the coordinate data and physical property data of the optical element based on the optical signals.

[0012] The additive manufacturing dynamic printing module is connected to the multi-parameter acquisition and analysis module. It is used to plan the printing parameters of a bonding buffer layer based on the physical property data, control the printing position based on the coordinate data to form the bonding buffer layer on the optical element, and generate the offset signal of the printing path based on the real-time monitoring results of the preset marks in the multi-level quantum dot encoding during the printing process.

[0013] The closed-loop control module is connected to the multi-parameter acquisition and analysis module and the additive manufacturing dynamic printing module respectively. The closed-loop control module is used to receive the coordinate data, the physical property data and the offset signal, and generate control commands for correcting the printing path to the additive manufacturing dynamic printing module based on the offset signal, as well as coordinate the operation timing of each module.

[0014] A mechanical actuation module, connected to the closed-loop control module, is used to operate the optical element to perform spatial pose adjustment based on the instructions of the closed-loop control module and the coordinate data;

[0015] A bonding module, connected to the closed-loop control module, is used to perform a bonding operation on the optical element after its pose adjustment at the bonding buffer layer.

[0016] Furthermore, the quantum dot encoding module includes a basic information encoding unit, a physical characteristic sensing unit, and a print quality feedback unit that are stacked sequentially and functionally coordinated, wherein:

[0017] The basic information encoding unit is used to carry the identity information of the optical element through the first quantum dot array, and serves as the spatial reference point for the three-dimensional coordinate positioning of the multi-parameter acquisition and analysis module.

[0018] The physical characteristic sensing unit is connected to and covers the basic information encoding unit, and is used to characterize at least one physical characteristic parameter of the optical element through the fluorescence optical signal of the second quantum dot. The signal characteristics of the fluorescence optical signal are associated with a preset physical characteristic parameter threshold, so that the acquisition of the physical characteristic parameter can be completed in situ and non-contactly before bonding.

[0019] The print quality feedback unit is connected to and disposed on the surface of the physical property sensing unit, and is used to provide a real-time position reference signal during printing in the additive manufacturing dynamic printing module through a third quantum dot marker.

[0020] Furthermore, the first quantum dot has a temperature resistance characteristic that is not lower than the bonding process temperature threshold;

[0021] The fluorescence intensity of the second quantum dot is positively correlated with the surface flatness or dimensional deviation of the optical element, and / or the spectral shift of the second quantum dot is associated with the material stress threshold of the optical element;

[0022] The basic information encoding unit, the physical characteristic sensing unit, and the print quality feedback unit together constitute a composite encoding structure. The overall thickness of the composite encoding structure does not exceed a preset thickness threshold, and its adhesion to the optical element substrate is not lower than a preset adhesion threshold, so as to ensure that the embedded sensor can withstand the bonding process environment throughout the entire process.

[0023] Furthermore, the multi-parameter acquisition and analysis module includes:

[0024] The signal excitation and acquisition unit is used to emit excitation beams of different wavelengths to the multi-layer quantum dot encoding and acquire the fluorescence signals generated therefrom;

[0025] The data analysis and parsing unit, connected to the signal excitation and acquisition unit, is used to receive and process the fluorescence signal to parse out the coordinate data and the physical property data;

[0026] The signal excitation and acquisition unit includes:

[0027] An excitation light source subunit is used to provide at least two different wavelengths of excitation light, wherein the first wavelength of excitation light is adapted to excite the basic information encoding unit, and the second wavelength of excitation light is adapted to excite the physical characteristic sensing unit.

[0028] An optical sensing subunit, connected to the excitation source subunit, is used to synchronously acquire fluorescence spatial images and fluorescence spectral signals encoded by the multi-level quantum dots and excited by the excitation source subunit;

[0029] The data analysis and parsing unit includes:

[0030] A coordinate mapping subunit is used to calculate the coordinate data of the optical element based on the fluorescence spatial image using a sub-pixel positioning algorithm;

[0031] The physical property association subunit is used to match at least one characteristic parameter of the fluorescence spectral signal with a pre-stored feature-physical property association database to obtain the physical property data.

[0032] Furthermore, the additive manufacturing dynamic printing module includes:

[0033] The printing parameter planning unit is connected to the multi-parameter acquisition and analysis module. It is used to receive the physical property data and generate customized printing parameters for the bonding buffer layer based on the surface morphology data and material stress threshold contained in the physical property data. The customized printing parameters include at least a micro-morphology distribution model and a material type selection instruction.

[0034] A dynamic printing execution unit, connected to the printing parameter planning unit and the quantum dot encoding module, is used to perform printing based on the customized printing parameters and the coordinate data, and generate the offset signal based on real-time monitoring of the multi-level quantum dot encoding during the printing process.

[0035] Furthermore, the printing parameter planning unit includes:

[0036] The topography modeling subunit is used to generate a micro-topography distribution model of the bonding buffer layer that is inversely matched with the surface concave and convex features of the optical element based on the surface topography data.

[0037] The material decision subunit is used to compare the material stress threshold with a preset threshold, and output the material type selection instruction to select a high compliance material or a high rigidity material based on the comparison result;

[0038] The dynamic printing execution unit includes:

[0039] The microdroplet jet printing subunit is used to jet and deposit printing material on the surface of the optical element with a positioning accuracy not lower than a preset printing accuracy threshold, according to the micromorphological distribution model and the material type selection instruction.

[0040] The real-time tracking and correction subunit is used to calculate the offset between the printing path and the preset reference in real time by tracking the position of the quantum dot marker in the printing quality feedback unit during the printing process. When the offset exceeds the preset offset threshold, the subunit generates the offset signal and sends it to the closed-loop control module to trigger real-time correction of the printing path.

[0041] Furthermore, the closed-loop control module includes:

[0042] A control command generation unit, connected to the additive manufacturing dynamic printing module, is used to receive the offset signal and generate the control command for correcting the printing path based on a preset control algorithm.

[0043] The timing coordination management unit is connected to the multi-parameter acquisition and analysis module, the additive manufacturing dynamic printing module, the mechanical execution module, and the bonding module, respectively. It is used to send coordination instructions to each module to coordinate the analysis of coordinate data and physical property data, the dynamic printing of the bonding buffer layer, the pose adjustment of the optical element, and the execution timing of the bonding operation.

[0044] Furthermore, the control command generation unit includes:

[0045] The offset correction subunit is used to calculate the adjustment parameters of the spatial coordinates and material ejection amount of the print head in the additive manufacturing dynamic printing module according to the proportional-integral-derivative control algorithm when the offset indicated by the offset signal exceeds the preset offset threshold, so as to form the control command.

[0046] The timing coordination management unit includes:

[0047] The timing scheduling subunit is used to allocate and trigger the working cycles of the multi-parameter acquisition and analysis module, the additive manufacturing dynamic printing module, the mechanical execution module and the bonding module according to the preset process sequence. The working cycle of the additive manufacturing dynamic printing module starts after the multi-parameter acquisition and analysis module completes data parsing, and the working cycle of the bonding operation starts after the dynamic printing is completed and the quality is verified.

[0048] Furthermore, the mechanical actuation module includes:

[0049] A macroscopic positioning unit, connected to the closed-loop control module, is used to move the optical element to the target working area based on the coordinate data;

[0050] The component handling unit, connected to the macroscopic positioning unit, is used to perform the picking, transferring and placing operations of the optical components;

[0051] A precision attitude adjustment unit is connected to the macro positioning unit and the closed-loop control module, respectively, and is used to perform nanometer-level precision angle fine-tuning of the optical element based on the coordinate data.

[0052] The macroscopic positioning unit includes:

[0053] The platform moving subunit is used to drive the optical element to perform two-dimensional translation in the horizontal plane with a repeatability accuracy not lower than a preset positioning accuracy threshold.

[0054] The adsorption and fixing subunit is used to stably fix the optical element to the platform moving subunit with a controllable adsorption force during movement and adjustment.

[0055] Furthermore, the component handling unit includes:

[0056] A robot motion subunit is used to transfer the optical element in three-dimensional space with a repeatability accuracy not lower than a preset handling accuracy threshold.

[0057] A flexible gripper subunit is disposed at the end of the robot motion subunit, used to adaptively adhere to and hold the optical element during the picking and placing process, and its material hardness is lower than that of the surface material of the optical element;

[0058] The precision attitude adjustment unit includes:

[0059] The micro-displacement driving subunit is used to drive the optical element to perform micro-movements in a direction perpendicular to the horizontal plane with a displacement resolution not lower than a preset resolution threshold.

[0060] An angle calculation and control subunit is used to calculate the driving amount required by the micro-displacement drive subunit for each point based on the angle deviation information contained in the coordinate data, so as to adjust the pitch angle and roll angle of the optical element, and the adjustment accuracy is not lower than the preset angle accuracy threshold.

[0061] The beneficial effects of this invention are:

[0062] This invention achieves an integrated closed loop of information perception, decision-making, and execution by using quantum dot encoding as a unified data carrier and benchmark, and has the following beneficial effects:

[0063] 1. Achieve high precision and personalized adaptation: Based on in-situ, non-contact measurement using quantum dot encoding, the nanoscale coordinates and physical property data of the components are acquired simultaneously, and a matching bonding buffer layer is dynamically generated accordingly, thereby improving alignment accuracy and optimizing interface stress from the source.

[0064] 2. Enhance process synergy and intelligence: Through the closed-loop control module, multiple processes such as positioning, detection, printing, and bonding are seamlessly connected to form a closed-loop process of real-time perception and correction, which effectively avoids the accumulation of errors in traditional discrete processes and significantly improves the consistency and yield of bonding.

[0065] 3. Enhanced System Integration and Quality Control: The highly integrated functional modules form a unified intelligent solution. Simultaneously, quantum dot encoding carries the identity of components and complete process data, providing a technological foundation for accurate quality traceability. Attached Figure Description

[0066] Figure 1 This is a schematic diagram of the intelligent alignment and bonding system for the precision optical element array in this invention;

[0067] Figure 2 This is a schematic diagram of the signal excitation and acquisition unit in this invention;

[0068] Figure 3 This is a schematic diagram of the data analysis and parsing unit in this invention;

[0069] Figure 4 This is a schematic diagram of the printing parameter planning unit in this invention;

[0070] Figure 5 This is a schematic diagram of the structure of the dynamic printing execution unit in this invention;

[0071] Figure 6 This is a schematic diagram of the control instruction generation unit in this invention;

[0072] Figure 7 This is a schematic diagram of the timing coordination management unit in this invention;

[0073] Figure 8 This is a schematic diagram of the macroscopic positioning unit in this invention;

[0074] Figure 9 This is a schematic diagram of the component handling unit in this invention;

[0075] Figure 10 This is a schematic diagram of the precision attitude adjustment unit in this invention.

[0076] Figure reference numerals: 1. Quantum dot encoding module; 11. Basic information encoding unit; 12. Physical property sensing unit; 13. Printing quality feedback unit; 2. Multi-parameter acquisition and analysis module; 21. Signal excitation and acquisition unit; 211. Excitation source subunit; 212. Optical sensing subunit; 22. Data analysis and analysis unit; 221. Coordinate mapping subunit; 222. Physical property correlation subunit; 3. Additive manufacturing dynamic printing module; 31. Printing parameter planning unit; 311. Morphology modeling subunit; 312. Material decision-making subunit; 32. Dynamic printing execution unit; 321. Micro 3. Droplet jet printing subunit; 4. Real-time tracking and correction subunit; 5. Closed-loop control module; 6. Control command generation unit; 7. Offset correction subunit; 8. Timing coordination management unit; 9. Timing scheduling subunit; 10. Mechanical execution module; 11. Macro positioning unit; 12. Platform movement subunit; 13. Adsorption and fixing subunit; 14. Component handling unit; 15. Robot motion subunit; 16. Flexible fixture subunit; 17. Precision attitude adjustment unit; 18. Micro-displacement drive subunit; 19. Angle calculation and control subunit; 20. Bonding module. Detailed Implementation

[0077] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Identical components are denoted by the same reference numerals. It should be noted that the terms "front," "rear," "left," "right," "upper," and "lower" used in the following description refer to directions in the accompanying drawings, and the terms "bottom surface," "top surface," "inner," and "outer" refer to directions toward or away from the geometric center of a specific component, respectively.

[0078] like Figure 1 As shown in Embodiment 1, an intelligent alignment and bonding system for a precision optical element array is applied to the optical element array bonding of a Mini LED display panel.

[0079] I. System structure adopted in Example 1;

[0080] The intelligent alignment and bonding system of precision optical element array used in this embodiment includes the following functional modules: quantum dot encoding module 1, multi-parameter acquisition and analysis module 2, additive manufacturing dynamic printing module 3, closed-loop control module 4, mechanical execution module 5, and bonding module 6.

[0081] The above modules work together under the unified coordination of the closed-loop control module 4 to achieve high-precision alignment, individualized buffer layer construction, and stable bonding of the Mini LED optical element array during the bonding process.

[0082] II. Parameters of the optical components to be processed and the bonding objects;

[0083] In this embodiment, the object to be processed and the bonding target are set as follows:

[0084] Optical components: Mini LED chip array; size: 10mm × 10mm; thickness: 0.5mm; chip spacing: 50μm; surface flatness requirement: ≤0.3μm; substrate: glass substrate; size: 15mm × 15mm; thickness: 1.0mm; surface roughness: Ra≤0.01μm;

[0085] Bonding performance requirements: alignment deviation: ≤5nm; bonding buffer layer thickness: 5–20μm; overall light transmittance after bonding: ≥95%; residual stress after bonding: ≤8MPa;

[0086] The aforementioned thresholds are used as target parameters for system operation and process control and are written into the control logic of the closed-loop control module 4.

[0087] III. Hardware selection and working environment for each module;

[0088] 1. Quantum dot encoding module 1;

[0089] The encoding method is multi-level quantum dot encoding;

[0090] The base layer quantum dots are of type CdSe / ZnS core-shell quantum dots; the average particle size is 5 nm; the arrangement is a 3×3 array; the array spacing is 1 mm.

[0091] Extended layer quantum dots: emission wavelengths of 600nm and 700nm; acquisition using a hybrid coating method;

[0092] Feedback layer quantum dots: with a spacing of 200μm, used for real-time monitoring of printing and alignment offset.

[0093] The coating equipment uses high-precision inkjet printing equipment, and the curing method is low-temperature ultraviolet curing; the coding layer thickness is about 1.5μm; the coding layer transmittance is 98.5%.

[0094] 2. Multi-parameter acquisition and analysis module 2;

[0095] The excitation source is a 405nm semiconductor laser with an output power of 15mW; a 488nm LED light source is used with an output power of 8mW.

[0096] The imaging and detection hardware includes: a CMOS camera with a resolution of 4096×3000 and a frame rate of 30fps; and a spectrometer with an integration time of 10ms and a wavelength resolution of ≤0.5nm.

[0097] Parameter types for analysis: three-dimensional spatial coordinate data (X, Y, Z), surface flatness, dimensional deviation, and material stress threshold.

[0098] 3. Additive Manufacturing Dynamic Printing Module 3;

[0099] Printing method: Jet additive manufacturing;

[0100] Nozzle parameters: nozzle diameter 50μm; spray frequency 5kHz; single droplet volume 10pL;

[0101] Printing material selection rules:

[0102] Areas with surface smoothness ≤0.2μm: acrylic resin;

[0103] Regions with surface smoothness > 0.2 μm: silicon-based composite material;

[0104] Printing control method: The printing position is controlled based on coordinate data and the printing path offset signal is generated in real time based on the quantum dots of the feedback layer.

[0105] 4. Closed-loop control module 4;

[0106] Control core: Industrial real-time controller + FPGA coprocessor unit;

[0107] Functions: Receive coordinate data, physical property data, and offset signals; generate print path correction instructions in real time; and coordinate the timing of multi-parameter acquisition, printing, pose adjustment, and bonding.

[0108] 5. Mechanical Actuation Module 5;

[0109] The actuators include a six-degree-of-freedom precision motion platform with a minimum displacement resolution of 1 nm.

[0110] The module's function is to adjust the spatial pose of optical elements based on the instructions of the closed-loop control module 4, so as to achieve nanometer-level translation and micro-angle rotation.

[0111] 6. Bonding module 6;

[0112] Bonding method: thermocompression bonding;

[0113] Process parameters: bonding pressure is 1.0 MPa; bonding temperature is 120℃; holding time is 8 s.

[0114] IV. Working principle of Example 1;

[0115] The working principle of this embodiment is as follows:

[0116] First, a multi-level quantum dot encoding structure is constructed on the surface of the Mini LED chip array using quantum dot encoding module 1. Quantum dots at different levels emit optical signals of different wavelengths under specific excitation conditions, which are used to carry spatial position information and physical property mapping information of the optical components.

[0117] Subsequently, the multi-parameter acquisition and analysis module 2 excites and acquires signals from the quantum dot encoding. Through comprehensive analysis of spectral characteristics, spatial distribution, and intensity variations, it simultaneously obtains the coordinate data of the Mini LED chip array, as well as physical property data such as surface flatness, dimensional deviation, and stress threshold. In this embodiment, the obtained three-dimensional coordinates are: X=10.2345mm, Y=10.1234mm, Z=0.5002mm, surface flatness is 0.18μm, dimensional deviation is 0.12μm, and stress threshold is 45MPa.

[0118] Based on the above analysis results, the closed-loop control module 4 calls the additive manufacturing dynamic printing module 3 to plan the printing material and thickness parameters of the bonding buffer layer according to the physical characteristics of different regions. In this embodiment, the target thickness of the buffer layer is set to 8μm.

[0119] During the printing process, the quantum dots in the feedback layer are continuously monitored. When an offset between the printing path and the expected path is detected, the closed-loop control module 4 generates an offset correction signal for the printing path in real time and sends it to the additive manufacturing dynamic printing module 3 to achieve dynamic correction of the printing path. In this embodiment, the maximum correction offset during the printing process is 0.3 μm, ensuring the forming accuracy of the buffer layer.

[0120] After the buffer layer is printed, the mechanical execution module 5, under the control of the closed-loop control module 4, adjusts the spatial pose of the Mini LED chip array to achieve high-precision alignment with the glass substrate. The final alignment deviation is controlled at 2.8nm, which meets the bonding requirement of ≤5nm.

[0121] Finally, the bonding module 6 performs a thermo-bonding operation at the bonding buffer layer to complete the stable connection between the optical element array and the substrate.

[0122] In this embodiment, the multi-parameter acquisition and analysis module 2, the additive manufacturing dynamic printing module 3, and the closed-loop control module 4 do not operate independently of each other. Instead, they form a continuous data flow and control flow around the same quantum dot encoding structure, thereby constructing a real-time closed-loop control logic based on a unified information carrier.

[0123] (a) A direct mapping mechanism from physical characteristic data to compensation actions;

[0124] Unlike the segmented process of "detection-analysis-manual or offline setting of process parameters" in the existing technology, in this embodiment, the multi-parameter acquisition and analysis module 2 simultaneously outputs the three-dimensional coordinate data and physical characteristic data of the optical element when analyzing the quantum dot encoded optical signal.

[0125] The physical property data is not only used for quality assessment, but is directly used as input parameters for the additive manufacturing dynamic printing module 3 to generate the microstructure distribution model of the bonding buffer layer and material type selection instructions.

[0126] Specifically, data such as the surface flatness, dimensional deviation, and material stress threshold of optical components are mapped in real time to the thickness adjustment strategy and material selection strategy of the buffer layer in different areas, making the printing process itself an active compensation process for individual differences of optical components.

[0127] This technology chain enables the automatic transformation from "physical characteristic data" to "customized printing parameters" and then to "actual compensation actions," forming a "detection equals compensation" process mode.

[0128] (ii) Real-time deviation feedback closed loop based on unified quantum dot encoding;

[0129] In this embodiment, quantum dot encoding is not only used for front-end positioning and parameter analysis, but its feedback layer quantum dots also serve as a real-time monitoring benchmark for the printing path during the printing process.

[0130] When performing printing, the additive manufacturing dynamic printing module 3 continuously acquires the offset of the printing path relative to the preset reference by real-time monitoring of the quantum dots in the feedback layer, and immediately feeds the offset signal to the closed-loop control module 4.

[0131] After receiving the offset signal, the closed-loop control module 4 generates control commands to correct the printing path, dynamically adjusting the spatial position of the print head and the amount of material ejected, thereby suppressing the accumulation of deviations before printing is completed.

[0132] In this process, the alignment reference, execution reference, and verification reference are all derived from the same quantum dot encoding structure, avoiding conversion errors between different references. This makes the printing path correction no longer entirely dependent on mechanical positioning accuracy, but rather transforms into a problem of tracking and feedback control of high-precision optical signals.

[0133] (III) The formation of a nanoscale integrated closed loop of "benchmark-execution-verification";

[0134] Through the above design, this embodiment conceptually realizes a nanoscale closed-loop control mode with a high degree of unity between "benchmark-execution-verification":

[0135] Quantum dot encoding serves as a spatial reference, providing three-dimensional coordinates and physical property information;

[0136] The additive manufacturing dynamic printing module 3 performs customized compensation printing based on this benchmark;

[0137] During the printing process, the execution results are verified and corrected in real time using the same benchmark.

[0138] This closed-loop mechanism enables the system to proactively "smooth out" individual differences between optical components before bonding, rather than passively accepting the risk of defects caused by stress concentration or morphological mismatch after bonding is completed.

[0139] (iv) Non-linear improvement in overall technical performance;

[0140] Through closed-loop collaborative control based on a unified information carrier, this embodiment not only achieves nanometer-level alignment accuracy, but also significantly reduces residual stress and structural inconsistencies by dynamically customizing the buffer layer before bonding.

[0141] The aforementioned technical effects are not achieved by simply adding up the functions of each module, but rather by the deep integration of data flow, control flow, and execution flow on the same information carrier, thereby simultaneously improving bonding yield and consistency while ensuring process efficiency.

[0142] V. Implementation Results;

[0143] The Mini LED display panel that has been successfully bonded was tested, and the results are as follows:

[0144] Buffer layer quality: uniform fluorescence signal distribution, no breaks or defects; alignment accuracy: 2.8 nm; transmittance after bonding: 96.2% (≥95%); residual stress: 6.5 MPa (≤8 MPa).

[0145] The results for process efficiency are as follows: single-piece process time: 13.8s; bonding yield: 99.9% (only 1 out of 1000 samples was defective).

[0146] The results regarding optical performance are as follows:

[0147] The uniformity of light emission was improved by about 15%, and no obvious optical distortion was observed.

[0148] VI. Overall technical effects of Example 1;

[0149] This embodiment demonstrates that the present invention achieves synchronous acquisition of spatial position and physical characteristic data of optical elements through multi-level quantum dot encoding and multi-parameter analysis; realizes individualized customization and real-time correction of bonding buffer layers through additive manufacturing dynamic printing and closed-loop control; and significantly improves bonding yield and production efficiency while ensuring nanometer-level alignment accuracy through the coordinated cooperation of mechanical execution module 5 and bonding module 6.

[0150] Example 2 is the second embodiment of the present invention.

[0151] I. Overview of the system configuration in Example 2;

[0152] The intelligent alignment and bonding system of the precision optical element array used in this embodiment further refines the structure and limits the functions of the quantum dot encoding module 1 and the multi-parameter acquisition and analysis module 2.

[0153] The system as a whole still includes: quantum dot encoding module 1, multi-parameter acquisition and analysis module 2, additive manufacturing dynamic printing module 3, closed-loop control module 4, mechanical execution module 5, and bonding module 6.

[0154] This embodiment focuses on explaining the hierarchical structure of the quantum dot encoding module 1 and the signal analysis mechanism of the multi-parameter acquisition and analysis module 2.

[0155] II. The composite coding structure of quantum dot coding module 1;

[0156] In this embodiment, the quantum dot encoding module 1 is constructed as a multi-level composite encoding structure and is sequentially stacked on the non-functional regions of the optical element surface. This composite encoding structure consists of three functional units, which function synergistically:

[0157] (a) Basic information coding unit 11;

[0158] The basic information encoding unit 11 is used to carry the identity information of the optical element and to provide a stable spatial reference for subsequent three-dimensional spatial coordinate analysis.

[0159] Encoding method: The model, batch or sequence information of the optical element is encoded by the positional arrangement of the first quantum dot array.

[0160] Material properties of the first quantum dot: Material: CdSe / ZnS core-shell structure quantum dot; Particle size range: 5–10 nm; Temperature resistance: ≥200℃, not lower than the bonding process temperature threshold; Pressure resistance: ≤5 MPa.

[0161] Spatial Function: The first quantum dot array serves as a spatial reference point for three-dimensional coordinate positioning in the multi-parameter acquisition and analysis module 2, and is used for sub-pixel level positioning calculations.

[0162] (ii) Physical characteristic sensing unit 12;

[0163] The physical characteristic sensing unit 12 is connected to and covers the basic information encoding unit 11, and is used to acquire the physical characteristic parameters of the optical element in an in-situ, non-contact manner before bonding.

[0164] Second quantum dot configuration: band coverage: 400–800nm; an extended layer is formed by mixing quantum dots with different emission wavelengths.

[0165] Physical property correlation: The fluorescence intensity of the second quantum dot is positively correlated with the surface flatness or dimensional deviation of the optical element, and the fluorescence spectral shift of the second quantum dot is related to the material stress threshold of the optical element.

[0166] Thresholds and accuracy: Surface flatness resolution accuracy: ±0.1μm; Dimensional deviation resolution accuracy: ±0.2μm; Material stress threshold resolution accuracy: ±5MPa.

[0167] The aforementioned correlations are established through a feature-physical property correlation database created by prior calibration experiments and then invoked in the data analysis and parsing unit 22.

[0168] (iii) Print quality feedback unit 13;

[0169] The print quality feedback unit 13 is disposed on the surface of the physical property sensing unit 12 and is used to provide a real-time position reference signal during the operation of the additive manufacturing dynamic printing module 3.

[0170] Third quantum dot configuration: low-concentration sparse coating; mass fraction: ≤0.05%.

[0171] Functional positioning: During the printing process of the buffer layer, it serves as a real-time monitoring marker for printing path offset and printing accuracy, and is used to generate the offset signal of the printing path.

[0172] (iv) Overall parameters of the composite coding structure;

[0173] The aforementioned basic information encoding unit 11, physical characteristic sensing unit 12, and print quality feedback unit 13 together constitute a composite encoding structure, the overall parameters of which are as follows:

[0174] Overall thickness threshold: ≤2μm; transmittance: ≥98%; adhesion threshold to optical element substrate: ≥5N / cm 2 Process tolerance: Temperature: ≤200℃; Pressure: ≤5MPa; This composite coding structure continuously functions as an embedded sensor throughout the bonding process.

[0175] In this embodiment, the quantum dot encoding module 1 is not a single-function identifier or a simple detection structure, but is designed as a highly integrated information carrier structure. Through the stacking of the basic information encoding unit 11, the physical characteristic sensing unit 12 and the print quality feedback unit 13, a "three-in-one" multi-level composite encoding structure is formed.

[0176] Unlike existing technologies that use barcodes, QR codes, crosshair markers, or independently attached sensor structures solely for identification, the composite coding structure in this embodiment simultaneously carries and collaboratively achieves the following three core functions within an overall thickness of no more than 2μm:

[0177] 1. Identity information carrying function: Through the spatial arrangement of the first quantum dot array in the basic information encoding unit 11, the model, batch and sequence information of the optical element are encoded, so that the optical element has a traceable identity attribute throughout the entire manufacturing process;

[0178] 2. Spatial coordinate reference function: The first quantum dot array also serves as the reference point for the multi-parameter acquisition and analysis module 2 to perform three-dimensional spatial coordinate calculations, providing a stable and repeatable optical reference for sub-pixel level coordinate mapping;

[0179] 3. In-situ sensing function of physical characteristics: Through the physical characteristic sensing unit 12 covering the basic information encoding unit 11, the surface flatness, dimensional deviation and material stress threshold of the optical element can be characterized and analyzed in an optical manner.

[0180] The above three types of functions are integrated in the same composite coding structure, which transforms the quantum dot coding module 1 from a "marker structure" in the traditional sense into a microscale, multifunctional information carrier and sensing node.

[0181] In this embodiment, the physical property sensing unit 12 is not used for post-event detection or offline analysis, but rather to acquire the physical properties of the optical element in situ before and during the bonding process by using the fluorescence optical signal of the second quantum dot.

[0182] Specifically: the fluorescence intensity change of the second quantum dot is positively correlated with the surface flatness or dimensional deviation of the optical element;

[0183] The fluorescence spectral shift of the second quantum dot is correlated with the stress state inside the optical element material and pre-correlates with the material stress threshold.

[0184] Through the aforementioned correlation mechanism, the physical characteristic parameters of optical components can be analyzed in real time via optical means during the alignment and bonding process without the need for contact measurement or independent detection equipment.

[0185] This design transforms the measurement mode of physical properties from the "offline, step-by-step, contact" method commonly found in existing technologies to an "online, continuous, non-contact, in-situ" acquisition method, providing the necessary data foundation for the subsequent dynamic customization of buffer layers and adaptive adjustment of process parameters.

[0186] To ensure that the composite coding structure can work stably throughout the bonding process, this embodiment fully considers the impact of the bonding process environment on the information carrier during the design, enabling it to have the process adaptability of an embedded sensor.

[0187] Specifically, this includes: the first quantum dot possessing a temperature resistance of not less than 200℃, capable of withstanding the bonding temperature threshold; the composite coding structure as a whole being able to withstand a process pressure of ≤5MPa; and the adhesion between the composite coding structure and the optical component substrate being not less than 5N / cm. 2 To prevent detachment or displacement during hot pressing or stress loading; the overall light transmittance of the coding structure is not less than 98%, and it is located in the non-functional area of ​​the optical element so as not to have an adverse effect on the optical performance.

[0188] Through the above-mentioned structural and material properties design, the quantum dot encoding module 1 can serve as an embedded sensing and reference structure that runs through the entire process of alignment, detection, printing and bonding, continuously providing a stable and continuous signal source for the closed-loop control module 4.

[0189] Based on the above design, the multi-level composite quantum dot encoding structure in this embodiment is no longer an isolated identification unit or auxiliary detection method, but constitutes the core of the data source for the entire intelligent alignment and bonding system. Its technical effects are reflected in:

[0190] Provides a unified, in-situ data entry point for the multi-parameter acquisition and analysis module 2;

[0191] Provides a real-time print quality feedback benchmark for the additive manufacturing dynamic printing module 3;

[0192] Provides continuous signal support for the closed-loop control module 4 to achieve dynamic compensation and path correction;

[0193] It supports the coordinated operation of "positioning, perception, customized printing, and closed-loop correction" at the system level.

[0194] This information carrier design breaks through the existing technology's approach of functional dispersion and data fragmentation, achieving deep integration of multiple functions at the microscale structural level, thereby significantly enhancing the systematicness and creativity of the overall technical solution of this invention.

[0195] III. Structure and working mechanism of multi-parameter acquisition and analysis module 2;

[0196] The multi-parameter acquisition and analysis module 2 is used to excite multi-level quantum dot encoding and analyze the coordinate data and physical property data of optical elements. Its structure includes a signal excitation and acquisition unit 21 and a data analysis and analysis unit 22.

[0197] (a) Signal excitation and acquisition unit 21;

[0198] The signal excitation and acquisition unit 21 is used to differentially excite quantum dots of different levels and simultaneously acquire their fluorescence signals.

[0199] Reference Figure 2 The signal excitation and acquisition unit 21 includes:

[0200] Excitation source subunit 211 is used to provide at least two different wavelengths of excitation light, wherein the first wavelength of excitation light is adapted to the excitation basic information encoding unit 11, and the second wavelength of excitation light is adapted to the excitation physical property sensing unit 12.

[0201] The first wavelength of the excitation light is 405nm, the light source is a laser diode, the power range of the laser diode is 10–20mW, and its purpose is to excite the basic information encoding unit 11.

[0202] The second wavelength excitation light has a wavelength of 488nm, is an LED light source, and has a power range of 5–10mW. Its purpose is to excite the physical property sensing unit 12.

[0203] The optical sensing subunit 212 is used to simultaneously acquire fluorescence spatial images and fluorescence spectral signals encoded by multi-level quantum dots, excited by the excitation source subunit 211.

[0204] The fluorescence imaging of the optical sensing subunit 212 uses a 12-megapixel CMOS camera with a frame rate of ≥30fps, a pixel size of 1.1μm, a microscope objective of 20×, and a numerical aperture of 0.5.

[0205] Spectral acquisition was performed using a fiber optic spectrometer, with key parameters including: wavelength resolution of 0.1 nm, detection range of 350–900 nm, and fiber optic probe diameter of 200 μm.

[0206] (II) Data Analysis and Analysis Unit 22;

[0207] The data analysis and interpretation unit 22 is connected to the signal excitation and acquisition unit 21 and is used to analyze the acquired fluorescence signal.

[0208] Reference Figure 3 The data analysis and parsing unit 22 includes:

[0209] The coordinate mapping subunit 221 is used to calculate the three-dimensional spatial coordinate data of the optical element based on the fluorescence spatial image and through the sub-pixel positioning algorithm, wherein the three-axis positioning accuracy is ±3nm;

[0210] The physical property association subunit 222 is used to match at least one characteristic parameter of the fluorescence spectrum signal with a pre-stored feature-physical property association database to obtain physical property data. The data preprocessing process is completed by the FPGA chip, and its response time is ≤1ms to ensure real-time performance.

[0211] IV. Working principle of Example 2;

[0212] In this embodiment, the system first constructs a multi-level composite coding structure on the surface of the optical element through the quantum dot coding module 1, so that the identity information, spatial positioning reference and physical characteristic mapping information of the optical element are integrated into the same carrier.

[0213] Before the alignment and bonding process begins, the multi-parameter acquisition and analysis module 2 selectively excites quantum dots at different levels using first-wavelength and second-wavelength excitation light, and simultaneously acquires fluorescence spatial images and fluorescence spectral signals. Through the coordinate mapping subunit 221, the system calculates the three-dimensional spatial coordinates of the optical element based on the fluorescence array image formed by the basic information encoding unit 11; through the physical property association subunit 222, the system matches the fluorescence intensity and spectral offset with a preset database to obtain the physical property data of the optical element.

[0214] In the subsequent additive manufacturing dynamic printing process, the third quantum dot mark formed by the printing quality feedback unit 13 is monitored in real time. When a deviation between the printing path and the expected path is detected, the closed-loop control module 4 dynamically corrects the printing path based on the offset signal, thereby ensuring the forming accuracy and bonding quality of the buffer layer.

[0215] Finally, after the mechanical actuation module 5 completes the nanometer-level pose adjustment, the bonding module 6 completes the stable bonding of the optical element array at the bonding buffer layer.

[0216] V. Technical effects of Example 2;

[0217] Through the above structure and working method, this embodiment achieves at least the following technical effects:

[0218] 1. Through multi-level composite quantum dot encoding, in-situ integration of optical element identity information, coordinate reference and physical characteristic data is achieved, avoiding the data fragmentation problem of multiple devices and multiple processes;

[0219] 2. Through the physical characteristic sensing unit 12, the surface flatness, dimensional deviation and material stress threshold of the optical element can be obtained non-contactly before bonding, thereby improving the matching accuracy of process parameters.

[0220] 3. Through the collaboration of the print quality feedback unit 13 and the closed-loop control, the print path of the buffer layer is corrected in real time, thereby improving the consistency of the buffer layer forming.

[0221] 4. Through the high-precision analysis capability of the multi-parameter acquisition and analysis module 2, a positioning accuracy of ±3nm in three-dimensional coordinates is achieved, providing a foundation for subsequent nanometer-level alignment and highly reliable bonding.

[0222] In summary, this embodiment further verifies the feasibility, stability, and significant technical effects of the system of the present invention in the application of precision optical element array alignment and bonding.

[0223] Example 3 is the third embodiment of the present invention.

[0224] I. System application scenarios and overall description of Example 3;

[0225] This third embodiment is based on the intelligent alignment and bonding system of the precision optical element array described in embodiments one and two, and further elaborates on the in-situ dynamic customized printing of the bonding buffer layer and the closed-loop correction control process for printing path deviation.

[0226] This embodiment focuses on describing the following technical aspects:

[0227] 1. The specific implementation methods of the printing parameter planning unit 31 and the dynamic printing execution unit 32 in the additive manufacturing dynamic printing module 3;

[0228] 2. The structure, construction steps, and role of the preset control algorithm and proportional-integral-derivative control algorithm in closed-loop control module 4 in printing path correction;

[0229] 3. The coupling control mechanism between print path offset, material ejection amount and print head spatial coordinates;

[0230] 4. Achieving comprehensive decision-making based on multi-parameter feedback data through complex mathematical models to improve printing accuracy, buffer layer adaptability, and system stability.

[0231] II. Detailed explanation of the structure and function of the additive manufacturing dynamic printing module 3;

[0232] (a) Printing parameter planning unit 31;

[0233] The printing parameter planning unit 31 is connected to the multi-parameter acquisition and analysis module 2, and is used to receive the surface morphology data and material stress threshold obtained by analysis, and generate customized printing parameters for the bonding buffer layer based on the above data.

[0234] Reference Figure 4 The printing parameter planning unit 31 includes a topography modeling subunit 311 and a material decision subunit 312.

[0235] The morphology modeling subunit 311 constructs a micro-morphology distribution model of the bonded buffer layer based on the surface morphology data. This model is used to make the buffer layer form an inverse matching relationship with the concave and convex features of the optical element surface at the microscale.

[0236] In this embodiment, the printing thickness of the buffer layer corresponding to the surface depression area is increased by 0.5–2 μm, while the printing thickness of the buffer layer corresponding to the surface protrusion area is reduced by 0.5–2 μm, thereby reducing stress concentration after bonding.

[0237] Material decision subunit 312 compares the analytically obtained material stress threshold with a preset threshold:

[0238] When the material stress threshold is >50MPa, output the material type selection command for high-compliance silicon-based composite materials;

[0239] When the material stress threshold is ≤50MPa, output the material type selection command for UV-curable acrylic resin.

[0240] (ii) Dynamic printing execution unit 32;

[0241] Reference Figure 5 The dynamic printing execution unit 32 includes a droplet jet printing subunit 321 and a real-time tracking and correction subunit 322.

[0242] The microdroplet jet printing subunit 321 uses the B33Y microdroplet jet additive manufacturing equipment, with a printhead orifice diameter of 50μm, a jetting frequency of 1–10kHz, a single droplet volume of 5–20pL, and a printing positioning accuracy of no less than ±1μm.

[0243] The real-time tracking and correction subunit 322 tracks the position of the quantum dot marker in the printing quality feedback unit 13 in the quantum dot encoding module 1 in real time through the fluorescence imaging unit during the printing process. When the offset of the printing path relative to the preset reference is detected to be ≥0.5μm, an offset signal is generated and sent to the closed-loop control module 4.

[0244] III. Structural definition of closed-loop control module 4 and preset control algorithm;

[0245] The closed-loop control module 4 serves as the core control unit of the system, including a control command generation unit 41 and a timing coordination management unit 42.

[0246] Reference Figure 6 The control command generation unit 41 includes:

[0247] The offset correction subunit 411 is used to calculate the adjustment parameters of the spatial coordinates and material ejection amount of the printing nozzle in the additive manufacturing dynamic printing module 3 according to the proportional-integral-derivative control algorithm when the offset indicated by the offset signal exceeds the preset offset threshold, so as to form a control command.

[0248] Reference Figure 7 The timing coordination management unit 42 includes:

[0249] The timing scheduling subunit 421 is used to allocate and trigger the working cycles of the multi-parameter acquisition and analysis module 2, the additive manufacturing dynamic printing module 3, the mechanical execution module 5 and the bonding module 6 according to the preset process sequence. The working cycle of the additive manufacturing dynamic printing module 3 is started after the multi-parameter acquisition and analysis module 2 completes data parsing, and the working cycle of the bonding operation is started after the dynamic printing is completed and the quality is verified.

[0250] (a) The overall structure of the preset control algorithm;

[0251] The preset control algorithm is used to comprehensively analyze multi-source offset data during the printing process and generate control instructions for correcting the printing path. Its construction steps include:

[0252] 1. Perform time series normalization processing on the offset signal output by the print quality feedback unit 13;

[0253] 2. Input the normalized offset data into the nonlinear error evaluation function to calculate the comprehensive deviation index of the printing path;

[0254] 4. When the overall deviation index exceeds the preset offset threshold, the proportional-integral-derivative control algorithm is triggered for fine adjustment.

[0255] IV. Formula for evaluating the overall deviation of the printing path;

[0256] In this embodiment, the overall deviation index of the printing path is calculated using the following integrated equation:

[0257] ;

[0258] in, The dimensionless normalized result of the comprehensive deviation index of the printing path is given by τ, where τ is the time window length of the printing process, u(t) is the instantaneous offset of the printing path acquired in real time, and σ is the offset normalization scale parameter obtained from system calibration. The error function is used to suppress random noise. For the Gamma function, To describe the dimensionless parameters of the viscoelastic response characteristics of the current printing material and to serve as input variables for the Gamma function, For Riemann Zeta function, To reflect the spatial complexity and nonlinearity of the printing path and to serve as the input variable for the Riemann Zeta function, K represents the total number of sampling points. For a Bessel function of the first kind, Let v(t) be the path frequency component corresponding to the kth spatial sampling point, and v(t) be the instantaneous velocity change of the print head.

[0259] Value range description: ,in The closer the value is to 1, the higher the stability of the printing path. The closer it is to 0, the greater the risk of cumulative offset.

[0260] This formula introduces error functions, Gamma functions, Riemann Zeta functions, and Bessel functions to jointly model the temporal continuity, spatial frequency characteristics, and material response properties of the printing path, providing a highly reliable basis for deviation evaluation for subsequent control algorithms.

[0261] V. Structure and computational model of proportional-integral-derivative control algorithm;

[0262] When the comprehensive deviation index Below the preset stability threshold At that time, the control command generation unit 41 calls the proportional-integral-derivative control algorithm to calculate the adjustment parameters of the spatial coordinates of the print head and the material ejection amount. The integrated expression is as follows:

[0263] ;

[0264] in, E(t) represents the overall adjustment and control quantity for the printhead, and E(t) represents the instantaneous error signal of the printing path. The exponential integral function is used to accumulate the effects of historical errors. Here, M represents the integral attenuation coefficient, and M represents the number of discrete samples within the control period. This is a Weierstrass elliptic function used to describe the periodic perturbations of the printing path at a microscopic scale. The spatial attitude perturbation parameters corresponding to the m-th sampling are... For system damping adjustment parameters, This is the derivative term of the printed path error over time, used to demonstrate the responsiveness of differential control to the trend of error changes.

[0265] Value range description: ∈(0,+∞), when A larger value indicates that a significant adjustment to the nozzle position or spray volume is required. A value close to 0 indicates that the system is in a stable printing state.

[0266] This control model achieves coordinated adjustment of instantaneous deviation, historical cumulative deviation, and deviation change rate by embedding proportional, integral, and derivative terms into a complex function framework, thereby enabling high-precision printing path correction without introducing oscillations.

[0267] VI. Summary of the working principle of Example 3;

[0268] In this embodiment, the system first acquires the surface morphology data and material stress threshold of the optical element based on the multi-parameter acquisition and analysis module 2, and then generates a customized micro-morphology distribution model and material selection instructions by the printing parameter planning unit 31.

[0269] Subsequently, the dynamic printing execution unit 32 tracks the quantum dot feedback signal in real time during the printing process and calculates the comprehensive deviation index of the printing path using Formula 1. When the deviation exceeds the stable range, the closed-loop control module 4 calls the proportional-integral-derivative control algorithm to generate adjustment parameters for the printhead spatial coordinates and material ejection amount using Formula 2, thereby achieving real-time correction of the printing path.

[0270] VII. Technical effects of Example 3;

[0271] The technical solution described in this embodiment can achieve the following technical effects:

[0272] 1. Achieve sub-micron level path stability control under micron-level printing accuracy requirements;

[0273] 2. Effectively suppresses cumulative errors caused by material switching and changes in jet frequency during the printing process;

[0274] 3. Improve the matching degree between the bonding buffer layer and the surface morphology of the optical element, and reduce the stress residue after bonding;

[0275] 4. Provides quantifiable, calculable, and verifiable control basis for high-yield and high-consistency bonding of the system.

[0276] Example 4 is the fourth embodiment of the present invention.

[0277] I. Application Background and General Description of Example 4;

[0278] This fourth embodiment is based on the intelligent alignment and bonding system of precision optical element arrays described in embodiments one to three above, and further details the loading, macroscopic positioning, precision handling, nanoscale attitude adjustment and final bonding process of optical elements.

[0279] In this embodiment, the system focuses on the coordinated operation of the mechanical execution module 5 and the closed-loop control module 4 to achieve multi-scale continuous control from millimeter-level spatial transfer to nanometer-level attitude adjustment, and works in conjunction with the bonding module 6 to complete a highly reliable precision bonding operation.

[0280] II. Structural composition and hardware configuration of mechanical actuation module 5;

[0281] The mechanical execution module 5 is used to realize the loading, positioning, handling and attitude adjustment of optical components. It includes a macro positioning unit 51, a component handling unit 52 and a precision attitude adjustment unit 53.

[0282] (a) Macro-positioning unit 51;

[0283] The macro positioning unit 51 is connected to the closed-loop control module 4 and is used to move the optical element to the target working area based on the coordinate data output by the multi-parameter acquisition and analysis module 2.

[0284] Reference Figure 8 The macro positioning unit 51 includes a platform moving subunit 511 and an adsorption fixing subunit 512.

[0285] The platform moving subunit 511 uses an air-floating precision platform as its stage, and its specific parameters are as follows:

[0286] X / Y axis travel: 100–300 mm;

[0287] Repeat positioning accuracy: ±2nm (as a preset positioning accuracy threshold);

[0288] Straightness: ≤0.5μm / m.

[0289] The platform is capable of driving optical elements to perform two-dimensional translation in the horizontal plane with a repeatability accuracy not lower than the preset positioning accuracy threshold.

[0290] The adsorption and fixation subunit 512 is disposed on the platform moving subunit 511 and includes a vacuum adsorption device with an adsorption force ranging from 0.1 to 0.3 MPa.

[0291] During the movement and attitude adjustment of optical components, the optical components are stably fixed to the platform surface by a controllable adsorption force to prevent relative displacement caused by inertia or vibration.

[0292] (ii) Component handling unit 52;

[0293] The component handling unit 52 is connected to the macro positioning unit 51 and is used to perform the picking, transferring and placing of optical components between different workstations.

[0294] Reference Figure 9 The component handling unit 52 includes a robot motion subunit 521 and a flexible fixture subunit 522.

[0295] The robot motion subunit 521 uses a SCARA robot, and its main parameters are as follows:

[0296] Repeat positioning accuracy: ±5μm (as a preset handling accuracy threshold);

[0297] Maximum load: 1kg;

[0298] Degrees of freedom of motion: meet the requirements for three-dimensional spatial transfer.

[0299] The robot is capable of transferring optical components in three-dimensional space with a repeatability accuracy not lower than the preset handling accuracy threshold.

[0300] The flexible gripper subunit 522 is located at the end of the robot motion subunit 521 and is made of silicone material, the hardness of which is lower than that of the surface material of the optical element.

[0301] During the picking and placing process, the flexible fixture can adaptively conform to the surface morphology of the optical element, thereby ensuring clamping stability while avoiding scratches or stress concentration on the surface of the optical element.

[0302] (iii) Precision attitude adjustment unit 53;

[0303] The precision attitude adjustment unit 53 is connected to the macro positioning unit 51 and the closed-loop control module 4 respectively, and is used to perform nanometer-level precision angle fine adjustment on the optical element after completing the macro positioning.

[0304] Reference Figure 10 The precision attitude adjustment unit 53 includes a micro-displacement driving subunit 531 and an angle calculation and control subunit 532.

[0305] The micro-displacement driving subunit 531 adopts a piezoelectric ceramic micro-displacement stage, the specific parameters of which are as follows:

[0306] Z-axis travel: 50μm;

[0307] Displacement resolution: 0.1nm (as a preset resolution threshold).

[0308] The micro-displacement drive subunit 531 is used to drive optical elements to make micro-movements in a direction perpendicular to the horizontal plane.

[0309] The angle calculation and control subunit 532 is used to calculate the driving amount required by the micro-displacement drive subunit 531 at different support points based on the angle deviation information contained in the coordinate data, thereby realizing the adjustment of the pitch angle and roll angle of the optical element.

[0310] In this embodiment, the attitude adjustment accuracy can reach ±0.1μrad, which is used as the preset angle accuracy threshold.

[0311] III. Structural composition and operating parameters of bonding module 6;

[0312] Bonding module 6 is used to perform precision bonding operations between optical components and the substrate after high-precision alignment and attitude adjustment are completed. Bonding module 6 includes a bonding pressure control unit, a temperature control unit, and a bonding quality detection unit.

[0313] (a) Bonding pressure control unit;

[0314] The bonding pressure control unit includes a pneumatic pressure sensor and a proportional valve, and its core control parameters are configured as follows:

[0315] Pressure adjustment range: 0.1–5 MPa;

[0316] Pressure measurement accuracy: ±0.01MPa.

[0317] Stable pressure loading during the bonding process is achieved through closed-loop regulation.

[0318] (ii) Temperature control unit;

[0319] The temperature control unit includes a heating plate and a thermocouple, and its core control parameters are configured as follows:

[0320] Temperature range: 25–200℃;

[0321] Temperature control accuracy: ±0.5℃;

[0322] Temperature measurement accuracy: ±0.1℃.

[0323] The above parameter configuration is used to ensure that the bonding process is completed within the preset temperature window.

[0324] (iii) Bonding quality testing unit;

[0325] The bonding quality detection unit detects the integrity of the fluorescence signal of the quantum dots in the feedback layer of the buffer layer through the spectral analysis unit.

[0326] When the fluorescence intensity decay is detected to be no more than 5%, it is determined that there are no gaps at the bonding interface and the bonding quality is qualified.

[0327] IV. Working principle of Example 4;

[0328] In this embodiment, the optical element is first picked up by the robot motion subunit 521 of the element handling unit 52, and then transferred to the platform of the macro positioning unit 51 after being safely clamped by the flexible clamping subunit 522.

[0329] Subsequently, under the coordination of the closed-loop control module 4, the platform moving subunit 511 moves the optical element to the target working area according to the coordinate data, and achieves stable fixation through the adsorption fixing subunit 512.

[0330] After completing the macroscopic positioning, the precision attitude adjustment unit 53 is activated. The angle calculation and control subunit 532 calculates the driving amount required by the micro-displacement drive subunit 531 based on the angle deviation information in the coordinate data, and then drives the piezoelectric ceramic micro-displacement stage to make micro-movements in the Z-axis direction, so as to realize the nanometer-level adjustment of the pitch angle and roll angle of the optical element.

[0331] Once the optical element reaches the preset spatial position and orientation, the bonding module 6 applies preset pressure and temperature conditions sequentially at the bonding buffer layer to complete the bonding operation.

[0332] After bonding is completed, the bonding quality detection unit verifies the integrity of the bonding interface by detecting the fluorescence signal of the quantum dots in the feedback layer.

[0333] V. Technical effects of Example 4;

[0334] Through the collaborative design of the mechanical actuation module 5 and the bonding module 6 described in this embodiment, the following technical effects can be achieved:

[0335] 1. Achieve continuous control of optical components from macroscopic space transfer to nanoscale attitude adjustment, avoiding error accumulation introduced by multi-level switching;

[0336] 2. By using flexible clamps and controllable adsorption fixation methods, the risk of damage to optical components during handling and positioning is significantly reduced;

[0337] 3. By using a piezoelectric ceramic micro-displacement stage and high-precision angle calculation, sub-micro-radian level adjustment of pitch and roll angles is achieved, ensuring high-precision alignment;

[0338] 4. By synergistically controlling bonding pressure, temperature, and fluorescence feedback, the uniformity and reliability of the bonding interface are improved, and the incidence of bonding defects is reduced.

[0339] In summary, this fourth embodiment further verifies the feasibility and significant technical effects of the system of the present invention in the application of precision optical element array alignment and bonding, from mechanical execution to the final bonding stage.

[0340] The above are merely preferred embodiments of the present invention. The scope of protection of the present invention is not limited to the above embodiments. All technical solutions falling within the scope of the present invention's concept are within the scope of protection of the present invention. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of the present invention should also be considered within the scope of protection of the present invention.

Claims

1. A smart alignment and bonding system for a precision optical element array, characterized in that, include: A quantum dot encoding module for constructing multi-level quantum dot encodings on the surface of optical components; A multi-parameter acquisition and analysis module, connected to the quantum dot encoding module, is used to excite and acquire the optical signals encoded by the multi-level quantum dots, and to analyze the coordinate data and physical property data of the optical element based on the optical signals. The additive manufacturing dynamic printing module is connected to the multi-parameter acquisition and analysis module. It is used to plan the printing parameters of a bonding buffer layer based on the physical property data, control the printing position based on the coordinate data to form the bonding buffer layer on the optical element, and generate the offset signal of the printing path based on the real-time monitoring results of the third quantum dot marker used to provide a real-time position reference signal in the multi-level quantum dot encoding during the printing process. The closed-loop control module is connected to the multi-parameter acquisition and analysis module and the additive manufacturing dynamic printing module respectively. The closed-loop control module is used to receive the coordinate data, the physical property data and the offset signal, and generate control commands for correcting the printing path to the additive manufacturing dynamic printing module based on the offset signal, as well as coordinate the operation timing of each module. A mechanical actuation module, connected to the closed-loop control module, is used to operate the optical element to perform spatial pose adjustment based on the instructions of the closed-loop control module and the coordinate data; A bonding module, connected to the closed-loop control module, is used to perform a bonding operation on the optical element after its pose adjustment at the bonding buffer layer.

2. The intelligent alignment and bonding system for a precision optical element array according to claim 1, characterized in that, The quantum dot encoding module includes a basic information encoding unit, a physical characteristic sensing unit, and a print quality feedback unit that are stacked sequentially and function synergistically, wherein: The basic information encoding unit is used to carry the identity information of the optical element through the first quantum dot array, and serves as the spatial reference point for the three-dimensional coordinate positioning of the multi-parameter acquisition and analysis module. The physical characteristic sensing unit is connected to and covers the basic information encoding unit, and is used to characterize at least one physical characteristic parameter of the optical element through the fluorescence optical signal of the second quantum dot. The signal characteristics of the fluorescence optical signal are associated with a preset physical characteristic parameter threshold, so that the acquisition of the physical characteristic parameter can be completed in situ and non-contactly before bonding. The print quality feedback unit is connected to and disposed on the surface of the physical property sensing unit, and is used to provide a real-time position reference signal during printing in the additive manufacturing dynamic printing module through a third quantum dot marker.

3. The intelligent alignment and bonding system for a precision optical element array according to claim 2, characterized in that, The first quantum dot has a temperature resistance characteristic that is not lower than the bonding process temperature threshold; The fluorescence intensity of the second quantum dot is positively correlated with the surface flatness or dimensional deviation of the optical element, and / or the spectral shift of the second quantum dot is associated with the material stress threshold of the optical element; The basic information encoding unit, the physical characteristic sensing unit, and the print quality feedback unit together constitute a composite encoding structure. The overall thickness of the composite encoding structure does not exceed a preset thickness threshold, and its adhesion to the optical element substrate is not lower than a preset adhesion threshold, so as to ensure that the embedded sensor can withstand the bonding process environment throughout the entire process.

4. The intelligent alignment and bonding system for a precision optical element array according to claim 2, characterized in that, The multi-parameter acquisition and analysis module includes: The signal excitation and acquisition unit is used to emit excitation beams of different wavelengths to the multi-level quantum dot encoding and acquire the fluorescence signals generated therefrom; The data analysis and parsing unit, connected to the signal excitation and acquisition unit, is used to receive and process the fluorescence signal to parse out the coordinate data and the physical property data; The signal excitation and acquisition unit includes: An excitation light source subunit is used to provide at least two different wavelengths of excitation light, wherein the first wavelength of excitation light is adapted to excite the basic information encoding unit, and the second wavelength of excitation light is adapted to excite the physical characteristic sensing unit. An optical sensing subunit, connected to the excitation source subunit, is used to synchronously acquire fluorescence spatial images and fluorescence spectral signals encoded by the multi-level quantum dots and excited by the excitation source subunit; The data analysis and parsing unit includes: A coordinate mapping subunit is used to calculate the coordinate data of the optical element based on the fluorescence spatial image using a sub-pixel positioning algorithm; The physical property association subunit is used to match at least one characteristic parameter of the fluorescence spectral signal with a pre-stored feature-physical property association database to obtain the physical property data.

5. The intelligent alignment and bonding system for a precision optical element array according to claim 2, characterized in that, The additive manufacturing dynamic printing module includes: The printing parameter planning unit is connected to the multi-parameter acquisition and analysis module. It is used to receive the physical property data and generate customized printing parameters for the bonding buffer layer based on the surface morphology data and material stress threshold contained in the physical property data. The customized printing parameters include at least a micro-morphology distribution model and a material type selection instruction. A dynamic printing execution unit, connected to the printing parameter planning unit and the quantum dot encoding module, is used to perform printing based on the customized printing parameters and the coordinate data, and generate the offset signal based on real-time monitoring of the multi-level quantum dot encoding during the printing process.

6. The intelligent alignment and bonding system for a precision optical element array according to claim 5, characterized in that, The printing parameter planning unit includes: The topography modeling subunit is used to generate a micro-topography distribution model of the bonding buffer layer that is inversely matched with the surface concave and convex features of the optical element based on the surface topography data. The material decision subunit is used to compare the material stress threshold with a preset threshold, and output the material type selection instruction to select a high compliance material or a high rigidity material based on the comparison result; The dynamic printing execution unit includes: The microdroplet jet printing subunit is used to jet and deposit printing material on the surface of the optical element with a positioning accuracy not lower than a preset printing accuracy threshold, according to the micromorphological distribution model and the material type selection instruction. The real-time tracking and correction subunit is used to calculate the offset between the printing path and the preset reference in real time by tracking the position of the quantum dot marker in the printing quality feedback unit during the printing process. When the offset exceeds the preset offset threshold, the subunit generates the offset signal and sends it to the closed-loop control module to trigger real-time correction of the printing path.

7. The intelligent alignment and bonding system for a precision optical element array according to claim 1, characterized in that, The closed-loop control module includes: A control command generation unit, connected to the additive manufacturing dynamic printing module, is used to receive the offset signal and generate the control command for correcting the printing path based on a preset control algorithm. The timing coordination management unit is connected to the multi-parameter acquisition and analysis module, the additive manufacturing dynamic printing module, the mechanical execution module, and the bonding module, respectively. It is used to send coordination instructions to each module to coordinate the analysis of coordinate data and physical property data, the dynamic printing of the bonding buffer layer, the pose adjustment of the optical element, and the execution timing of the bonding operation.

8. The intelligent alignment and bonding system for a precision optical element array according to claim 7, characterized in that, The control command generation unit includes: The offset correction subunit is used to calculate the adjustment parameters of the spatial coordinates and material ejection amount of the print head in the additive manufacturing dynamic printing module according to the proportional-integral-derivative control algorithm when the offset indicated by the offset signal exceeds the preset offset threshold, so as to form the control command. The timing coordination management unit includes: The timing scheduling subunit is used to allocate and trigger the working cycles of the multi-parameter acquisition and analysis module, the additive manufacturing dynamic printing module, the mechanical execution module and the bonding module according to the preset process sequence. The working cycle of the additive manufacturing dynamic printing module starts after the multi-parameter acquisition and analysis module completes data parsing, and the working cycle of the bonding operation starts after the dynamic printing is completed and the quality is verified.

9. The intelligent alignment and bonding system for a precision optical element array according to claim 1, characterized in that, The mechanical actuation module includes: A macroscopic positioning unit, connected to the closed-loop control module, is used to move the optical element to the target working area based on the coordinate data; The component handling unit, connected to the macroscopic positioning unit, is used to perform the picking, transferring and placing operations of the optical components; A precision attitude adjustment unit is connected to the macro positioning unit and the closed-loop control module, respectively, and is used to perform nanometer-level precision angle fine-tuning of the optical element based on the coordinate data. The macroscopic positioning unit includes: The platform moving subunit is used to drive the optical element to perform two-dimensional translation in the horizontal plane with a repeatability accuracy not lower than a preset positioning accuracy threshold. The adsorption and fixing subunit is used to stably fix the optical element to the platform moving subunit with a controllable adsorption force during movement and adjustment.

10. The intelligent alignment and bonding system for a precision optical element array according to claim 9, characterized in that, The component handling unit includes: A robot motion subunit is used to transfer the optical element in three-dimensional space with a repeatability accuracy not lower than a preset handling accuracy threshold. A flexible gripper subunit is disposed at the end of the robot motion subunit, used to adaptively adhere to and hold the optical element during the picking and placing process, and its material hardness is lower than that of the surface material of the optical element; The precision attitude adjustment unit includes: The micro-displacement driving subunit is used to drive the optical element to perform micro-movements in a direction perpendicular to the horizontal plane with a displacement resolution not lower than a preset resolution threshold. An angle calculation and control subunit is used to calculate the driving amount required by the micro-displacement drive subunit for each point based on the angle deviation information contained in the coordinate data, so as to adjust the pitch angle and roll angle of the optical element, and the adjustment accuracy is not lower than the preset angle accuracy threshold.

Images