Tin pick-up device for wire harness production

Abstract

The invention provides a tin pick-up device for wire harness production. The tin pick-up device comprises a wire feeding module, a tin pick-up module and a cooling module. The wire feeding module moves along the conveying rail and sequentially passes through the welding aid pool, the tin dipping module and the cooling module; the wire feeding module comprises a sliding block and a clamping part, the wire feeding module is connected with the conveying rail through the sliding block, the clamping part is arranged on the lower portion of the wire feeding module, and the clamping part is used for clamping a wire harness; the tin pick-up module comprises a scraping plate and a baffle, the scraping plate is arranged on the upper portion of the tin pool, the baffle is arranged on one side of the tin pool, and the scraping plate is used for scraping tin slag on the surface of tin liquid; nitrogen sprayed by the cooling module faces the surface of the tin pool, and the baffle is used for retaining the nitrogen on the surface of tin liquid. Through cooperation of the baffle and the cooling module, a nitrogen layer is formed on the surface of the tin liquid, generation of an oxide layer on the surface of the tin liquid is effectively prevented, and then the tinning quality of the wire harness is improved.

Description

Technical Field

[0001] This invention relates to the field of wire harness production, specifically a tinning device for wire harness production. Background Technology

[0002] In today's electronics manufacturing industry, the connection quality of wire harnesses plays a crucial role in the overall performance and stability of electronic devices. During the wire harness manufacturing process, especially in the cutting and fabrication stages, tinning the exposed portions of the wire cores is an indispensable step. This operation aims to improve conductivity and ensure reliable connections. The entire process is quite complex, involving several delicate steps such as stripping, cutting, and wire twisting, culminating in tinning. The core of the tinning process lies in evenly covering the exposed connection areas of the wire harness with molten solder, forming a robust metallic transition layer. This provides a solid foundation for subsequent soldering operations or direct electrical connections.

[0003] However, under current technological levels, wire harness soldering has certain drawbacks. First, when molten solder is exposed to air, its surface easily reacts chemically with oxygen, leading to oxidation. This oxidation not only increases consumable usage but also reduces the quality of soldering. Second, after soldering, if the cooling process is not rapid enough, the molten solder continues to flow on the wire core surface, resulting in uneven solder layer thickness, especially at the bottom of the wire harness, where solder may accumulate and form solder nodules. These problems negatively impact the quality of wire harness soldering, thereby affecting the performance and reliability of the entire electronic device. Summary of the Invention

[0004] In order to overcome some of the problems mentioned in the background above, the present invention provides a tinning apparatus for wire harness production.

[0005] The technical solution adopted by the present invention is as follows: a tinning device for wire harness production, comprising a wire feeding module, a tinning module and a cooling module, wherein the wire feeding module moves along a conveyor rail and passes sequentially through a solder bath, a tinning module and a cooling module; The wire feeding module includes a slider and a clamping part. The wire feeding module is connected to the conveying rail through the slider. The clamping part is disposed at the lower part of the wire feeding module and is used to clamp the wire bundle. The tin-dipping module includes a scraper and a baffle. The scraper is disposed at the upper part of the tin bath, and the baffle is disposed on one side of the tin bath. The scraper is used to scrape off the tin dross on the surface of the molten tin. The nitrogen gas ejected from the cooling module is directed toward the clamping part and the surface of the molten solder, and the baffle is used to retain the nitrogen gas on the surface of the molten solder.

[0006] Furthermore, it also includes a support module, wherein the conveyor rail is disposed on the surface of the support module; The support module includes a support platform, a flux tank, a soldering tank, a connecting hole, and a support plate. The conveyor rail and the support plate are respectively disposed on both sides of the support platform. The flux tank and the soldering tank are disposed on the side closer to the conveyor rail. The connecting hole is disposed on the rear side of the soldering tank. The cooling module passes through the support platform through the connecting hole. The flux tank is connected to the flux pool, the soldering tank is connected to the solder pool, and the support plate is used to support the movable end of the wire harness.

[0007] Furthermore, the tin-dipping module also includes a first telescopic column, a melting furnace, and a tin dross tank. The first telescopic column is connected to the support platform via a fixing block. The movable end of the first telescopic column is fixed to the scraper through the fixing plate. The tin dross tank is connected to the tin pool. The melting furnace is located outside the tin pool. The solder pool is connected to the soldering tank via a connecting plate. The connecting plate is provided with a clearance groove. The scraper moves along the clearance groove. The solder dross tank is connected to the solder pool via the clearance groove.

[0008] Furthermore, the wire feeding module also includes a second telescopic column, a guide plate, and a stabilizing plate. The second telescopic column is fixedly connected to the slider. The guide plate is disposed between the stabilizing plate and the slider. The guide plate is provided with a slide rail. The movable end of the second telescopic column is fixedly connected to the connecting block of the stabilizing plate. The connecting block is slidably connected to the slide rail. The end of the guide plate is connected to the clamping part. The second telescopic column drives the clamping part to move.

[0009] Furthermore, the bottom of the scraper has a serrated structure, and it is inserted into the molten tin when scraping slag. The scraped slag falls into the slag tank through the clearance groove.

[0010] Furthermore, the cooling module includes an air pump and an air jet pipe, with the nozzle of the air jet pipe facing the solder-soaked end of the wire harness and the surface of the solder pool; The jet pipe is equipped with an array of micropores.

[0011] Furthermore, the baffle is at an angle to the horizontal plane, forming a semi-enclosed nitrogen chamber with the surface of the molten tin.

[0012] Compared with the prior art, the beneficial effects of the present invention are as follows: The solder dross on the surface of the molten solder is scraped off with a scraper to maintain the purity of the molten solder and thus ensure the quality of soldering.

[0013] The baffle works in conjunction with the cooling module. Specifically, the cooling module cools the wire harness after soldering. Nitrogen gas is sprayed directly onto the soldered end of the wire harness for rapid cooling. Subsequently, the nitrogen gas is blown onto the surface of the solder bath, forming a semi-enclosed nitrogen chamber with the solder surface through the baffle. This significantly reduces the oxygen content on the solder surface, effectively preventing oxidation and improving the quality of the soldering process. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of a tinning device for wire harness production according to an embodiment of the present invention; Figure 2 This is a front view schematic diagram of a wire harness production tinning device according to an embodiment of the present invention; Figure 3 This is a top view schematic diagram of a tinning device for wire harness production according to an embodiment of the present invention; Figure 4 for Figure 1 Schematic diagram of the middle support module; Figure 5 for Figure 1 Schematic diagram of the tin-coated module; Figure 6 for Figure 1 Top view of the tin-coated module; Figure 7 for Figure 6 Schematic diagram of the AA section along the middle edge; Figure 8 for Figure 1 Schematic diagram of the central transmission line module.

[0015] In the picture: 1. Support module; 11. Support platform; 12. Flux tank; 13. Soldering tank; 14. Connecting hole; 15. Fixing block; 16. Support plate; 2. Flux pool; 3. Conveyor rail; 4. Soldering module; 41. First telescopic column; 42. Scraper; 43. Baffle; 44. Connecting plate; 45. Melting furnace; 46. Fixing plate; 47. Solder dross tank; 48. Solder pool; 5. Wire feeding module; 51. Slider; 52. Second telescopic column; 53. Guide plate; 54. Stabilizing plate; 55. Clamping part; 6. Cooling module; 61. Jet pipe; 62. Air pump; 7. Wire harness. Detailed Implementation

[0016] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0017] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0018] like Figures 1-4 As shown, in some embodiments, the present invention relates to a soldering apparatus for wire harness production, comprising a wire feeding module 5, a soldering module 4, and a cooling module 6. The wire feeding module 5 moves along a conveyor rail 3, its path sequentially passing through a flux pool 2, the soldering module 4, and the cooling module 6, thereby completing the entire soldering process. This apparatus is designed to improve production efficiency and soldering quality by precisely controlling the operation of each module to ensure the stability and reliability of the wire harness 7 during the production process. On the production line, the production efficiency and soldering quality of the wire harness 7 are crucial, as they directly affect the performance and quality of the final product. Therefore, the soldering apparatus of the present invention, through optimized design, not only improves production efficiency but also ensures high-quality output during the soldering process.

[0019] Specifically, the wire feeding module 5 includes a slider 51 and a clamping part 55. The slider 51 ensures that the wire feeding module 5 remains connected to the conveyor rail 3, guaranteeing smooth movement. The slider 51 moves along the conveyor rail 3, which in turn drives the clamping part 55 to move, accommodating the repetitive soldering operation. The clamping part 55, located at the bottom of the wire feeding module 5, primarily clamps the wire harness 7, ensuring its stability and accuracy during the soldering process. The clamping part 55 can be replaced and adjusted according to the size of different wire harnesses 7, achieving compatibility with various wire harnesses. This design allows the device to flexibly meet the production needs of different specifications of wire harnesses, greatly improving its applicability and production flexibility.

[0020] Secondly, the soldering module 4 includes a scraper 42 and a baffle 43. The scraper 42 is carefully installed above the solder bath 48, and its main function is to scrape away solder dross from the surface of the molten solder to maintain its purity and ensure the quality of the soldering operation. This design takes into account that during prolonged use, the molten solder will accumulate impurities due to various factors. If these impurities are not removed in time, they will seriously affect the soldering quality. The accumulation of solder dross not only contaminates the molten solder but also leads to soldering defects. Therefore, the design of the scraper 42 is crucial for maintaining soldering quality.

[0021] It is important to note that during the soldering process, the surface of the molten solder, due to prolonged exposure to air, reacts with oxygen to form an oxide layer. This oxide layer reduces the adhesion between the solder and the wire, thus affecting the soldering quality. Furthermore, during soldering, dust, grease, and other impurities may fall into the molten solder and float on its surface, similarly hindering contact between the solder and the wire and affecting soldering quality. Therefore, removing these impurities from the surface of the molten solder is crucial for the soldering operation. In this embodiment, the design of the scraper 42 effectively solves this problem, ensuring soldering quality.

[0022] The core purpose of scraper 42 is to effectively remove impurities and oxide layers from the surface of the molten solder. By designing scraper 42, impurities on the surface of the molten solder can be removed in a timely manner, thus providing a clean and high-quality environment for the soldering operation. This design ensures the purity of the molten solder, providing a foundation for high-quality soldering.

[0023] Baffle 43 is positioned on one side of the solder bath 48, primarily working in conjunction with the cooling module 6. Specifically, the cooling module 6 cools the wire harness 7 after soldering. Nitrogen gas is sprayed directly onto the solder-soaked end of the wire harness 7 through the cooling module 6, rapidly cooling it. The nitrogen gas is then blown onto the surface of the solder bath 48, forming a semi-enclosed nitrogen chamber with the solder surface through baffle 43, significantly reducing the oxygen content on the solder surface and effectively preventing oxidation.

[0024] Furthermore, in some embodiments, the tinning device also includes a support module 1, on which the conveyor rail 3 is mounted to ensure smooth movement and precise positioning of the wire harness 7 during the production process. The support module 1 provides a stable support foundation for the entire tinning device, ensuring the continuity and stability of the production process.

[0025] Specifically, the support module 1 includes a support platform 11, a flux tank 12, a soldering tank 13, a connecting hole 14, and a support plate 16. The conveyor rail 3 and the support plate 16 are respectively arranged on both sides of the support platform 11, providing a solid foundation for the stable conveying of the wire harness 7. The flux tank 12 and the soldering tank 13 are located on the side closer to the conveyor rail 3. This layout facilitates the soldering operation, allowing the soldering end of the wire harness 7 to be coated with a solder layer quickly and evenly.

[0026] The connecting hole 14 is located on the rear side of the soldering bath 13, providing a channel for the cooling module 6 to pass through the support platform 11. The flux tank 12 is connected to the flux pool 2, while the soldering bath 13 is connected to the solder pool 48. This connection ensures the stability of the soldering process. Finally, the support plate 16 supports the movable end of the wire harness 7, ensuring the stability of the movable end of the wire harness 7 during the soldering process. Through this design, all aspects of the soldering process are effectively connected, ensuring the smooth operation of the production process.

[0027] like Figure 5 , Figure 6 and Figure 7 As shown, in some embodiments, the soldering module 4 further includes a first telescopic column 41, a melting furnace 45, and a solder dross tank 47. The first telescopic column 41 is connected to the support platform 11 via a fixing block 15, ensuring its stable fixation. The movable end of the first telescopic column 41 passes through a fixing plate 46 and is fixedly connected to the back of a scraper 42, ensuring the scraper 42 moves with the telescopic movement of the first telescopic column 41. Specifically, after producing a predetermined number of wire harnesses 7, the first telescopic column 41 is activated, driving the scraper 42 forward to push the solder dross on the surface of the solder pool 48 out of the molten solder and into the solder dross tank 47. This design makes solder dross removal more efficient and convenient, ensuring the purity of the molten solder.

[0028] The melting furnace 45 is located outside the solder bath 48, ensuring that the solder within the solder bath 48 can be fully melted. Furthermore, the melting furnace 45 ensures that the solder reaches an ideal molten state within the solder bath 48, further improving the efficiency and quality of the soldering process. The design of the melting furnace 45 not only improves the melting efficiency of the solder but also ensures the melting quality of the solder, providing a guarantee for high-quality soldering operations.

[0029] The solder pool 48 is connected to the soldering tank 13 via a connecting plate 44, ensuring that the solder pool 48 can be stably installed on the support platform 11. Specifically, the connecting plate 44 is provided with a clearance groove, which allows the scraper 42 to move smoothly along the clearance groove without obstruction. The solder dross tank 47 is connected to the solder pool 48 via the clearance groove, so that solder dross can flow smoothly from the solder pool 48 into the solder dross tank 47, facilitating subsequent cleaning and maintenance. In addition, the clearance groove ensures that the scraper 42 will not collide with the solder pool 48 during the dross removal process, thereby protecting the stability and durability of the soldering device. Through this design, the soldering device can complete the soldering work of the wire harness 7 more efficiently and stably, greatly improving production efficiency and product quality.

[0030] like Figure 8As shown, in some embodiments, the wire feeding module 5 further includes a second telescopic post 52, a guide plate 53, and a stabilizing plate 54. Specifically, the second telescopic post 52 is fixedly connected to the slider 51, forming a stable structure to ensure the stability of the second telescopic post 52. The guide plate 53 is disposed between the stabilizing plate 54 and the slider 51, serving to connect the stabilizing plate 54 and the slider 51. Through this design, the movement of the wire feeding module 5 is more stable and precise, providing a solid foundation for soldering operations.

[0031] Furthermore, to ensure the stability of the stabilizing plate 54's movement, a slide rail is provided on the guide plate 53, and a connecting block is provided on the back of the stabilizing plate 54. The movable end of the second telescopic column 52 can be fixedly connected to the connecting block, driving the stabilizing plate 54 to move up and down reciprocally. The connecting block and the slide rail are slidably connected, ensuring greater stability of the stabilizing plate 54 during its up-and-down reciprocating movement. This design makes the movement of the stabilizing plate 54 smoother and more precise, providing a guarantee for the up-and-down movement of the soldering end of the wire harness 7.

[0032] It should be noted that the end of the stabilizing plate 54 is connected to the clamping part 55, and the second telescopic column 52 can drive the clamping part 55 to move precisely. Through the coordinated work of the second telescopic column 52 and the stabilizing plate 54, the movement of the clamping part 55 is made smoother. This design allows the wire feeding module 5 to more stably and accurately control the position of the soldering end of the wire harness 7 when performing soldering operations, thereby improving production efficiency and soldering quality. In addition, this structural design can effectively reduce soldering defects caused by inaccurate positioning of the wire harness 7, ensuring the continuity and consistency of the soldering process.

[0033] like Figure 5 , Figure 6 and Figure 7 As shown, in some embodiments, the bottom of the scraper 42 is designed with a serrated structure. During the slag removal operation, the scraper 42 inserts into the interior of the molten solder, effectively scraping away the slag adhering to the surface of the molten solder. Subsequently, the scraped slag falls into a specially designed slag tank 47 through a clearance groove. This serrated design increases the contact area between the scraper 42 and the molten solder, improves slag removal efficiency, and ensures the purity of the molten solder.

[0034] like Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, in some embodiments, the cooling module 6 includes an air pump 62 and an air jet pipe 61. The nozzle of the air jet pipe 61 is carefully arranged towards the soldering end of the wire harness 7 and the surface of the solder pool 48. This design aims to effectively cool the soldering area of ​​the wire harness 7, and the nitrogen gas ultimately remains on the surface of the solder pool 48, forming a nitrogen protective layer, reducing the oxygen content on the surface of the molten solder, thereby effectively preventing oxidation of the molten solder surface. Through this cooling process, the wire harness 7 can be rapidly cooled after soldering, effectively preventing the flow of molten solder at the soldering end and improving the soldering quality.

[0035] Furthermore, the exhaust port of the jet pipe 61 features a specially designed array of micropores. This design ensures that the cooling gas is evenly sprayed onto the target area, effectively cooling the soldering end. This micropore structure also results in a more uniform distribution of the cooling gas, improving cooling efficiency while reducing the amount of cooling gas used and lowering production costs.

[0036] Furthermore, in some embodiments, a specific angle is set between the baffle 43 and the horizontal plane. This design creates a semi-enclosed nitrogen chamber between the baffle 43 and the surface of the molten solder. This semi-enclosed nitrogen chamber effectively protects the molten solder from oxidation, reduces molten solder evaporation, lowers production costs, and effectively improves the soldering quality of the wire harness 7. Through this design, the molten solder is effectively protected during the cooling process, avoiding unnecessary oxidation and thus improving the soldering quality.

[0037] The typical working process of the above embodiments is as follows: I. Preparation Stage - Start the melting furnace 45 to preheat the tin pool 48 to ensure that the tin is fully melted.

[0038] - Flux is injected into the flux pool 2, and the air pump 62 of the cooling module 6 prepares the nitrogen supply.

[0039] - Adjust the clamping part 55 according to the size of the wire harness 7, and load the wire harness 7 into the clamping part 55 of the wire feeding module 5.

[0040] II. Wire feeding and soldering treatment - The wire feeding module 5 moves along the conveyor rail 3 to above the welding pool 2. - The second telescopic column 52 drives the clamping part 55 to descend, so that the solder-soaked end of the wire harness 7 is immersed in flux.

[0041] III. Tinning - The wire feeding module 5 moves above the solder pool 48, and the clamping part 55 descends to immerse the wire harness 7 in the molten solder.

[0042] IV. Cooling - The wiring harness 7 is moved to the cooling module 6, and the jet pipe 61 sprays nitrogen gas through the array of micropores: - Directly cool the soldered end of wire harness 7.

[0043] - The ejected nitrogen gas covers the tin pool 48 in the semi-enclosed nitrogen gas chamber formed by the baffle 43 and the surface of the molten tin, reducing the oxygen content.

[0044] V. Conclusion - Remove wire harness 7 after it has cooled, and the soldering process is complete.

[0045] VI. Maintenance - Regularly activate scraper 42 to remove solder dross and keep the molten solder pure.

[0046] - The first telescopic column 41 pushes the scraper 42 to move along the surface of the molten tin, and the serrated bottom scrapes away the oxide layer and impurities.

[0047] - The tin dross is discharged into the tin dross tank 47 via the clearance tank.

[0048] Repeat the above operations to achieve batch processing of wire harness 7.

[0049] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0050] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

[0051] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the spirit of the invention, such designs should fall within the protection scope of the present invention.

Claims

1. A tinning device for wire harness production, characterized in that, It includes a wire feeding module (5), a soldering module (4) and a cooling module (6). The wire feeding module (5) moves along the conveyor rail (3) and passes through the soldering pool (2), the soldering module (4) and the cooling module (6) in sequence. The wire feeding module (5) includes a slider (51) and a clamping part (55). The wire feeding module (5) is connected to the conveying rail (3) through the slider (51). The clamping part (55) is located at the lower part of the wire feeding module (5) and is used to clamp the wire harness (7). The tin-dipping module (4) includes a scraper (42) and a baffle (43). The scraper (42) is located on the upper part of the tin pool (48), and the baffle (43) is located on one side of the tin pool (48). The scraper (42) is used to scrape off the tin dross on the surface of the molten tin. The nitrogen gas ejected from the cooling module (6) is directed toward the surface of the clamping part (55) and the tin pool (48), and the baffle (43) is used to retain the nitrogen gas on the surface of the molten tin.

2. The tinning apparatus for wire harness production according to claim 1, characterized in that, It also includes a support module (1), wherein the conveying rail (3) is disposed on the surface of the support module (1); The support module (1) includes a support platform (11), a flux tank (12), a tin-dipping tank (13), a connecting hole (14), and a support plate (16). The conveyor rail (3) and the support plate (16) are respectively arranged on both sides of the support platform (11). The flux tank (12) and the tin-dipping tank (13) are arranged on the side close to the conveyor rail (3). The connecting hole (14) is arranged on the rear side of the tin-dipping tank (13). The cooling module (6) passes through the support platform (11) through the connecting hole (14). The flux tank (12) is connected to the flux pool (2). The tin-dipping tank (13) is connected to the tin pool (48). The support plate (16) is used to support the movable end of the wire harness (7).

3. The tinning apparatus for wire harness production according to claim 2, characterized in that, The tin-dipping module (4) also includes a first telescopic column (41), a melting furnace (45), and a tin dross tank (47). The first telescopic column (41) is connected to the support platform (11) through a fixing block (15). The movable end of the first telescopic column (41) is fixed to the scraper (42) through the fixing plate (46). The melting furnace (45) is located outside the tin pool (48). The tin pool (48) is connected to the tin-dipping tank (13) through a connecting plate (44). The connecting plate (44) is provided with a clearance groove. The scraper (42) moves along the clearance groove. The tin dross tank (47) is connected to the tin pool (48) through the clearance groove.

4. The tinning apparatus for wire harness production according to claim 1, characterized in that, The wire feeding module (5) further includes a second telescopic column (52), a guide plate (53), and a stabilizing plate (54). The second telescopic column (52) is fixedly connected to the slider (51). The guide plate (53) is disposed between the stabilizing plate (54) and the slider (51). The guide plate (53) is provided with a slide rail. The movable end of the second telescopic column (52) is fixedly connected to the connecting block of the stabilizing plate (54). The connecting block is slidably connected to the slide rail. The end of the guide plate (53) is connected to the clamping part (55). The second telescopic column (52) drives the clamping part (55) to move.

5. The tinning apparatus for wire harness production according to claim 1, characterized in that, The bottom of the scraper (42) has a serrated structure. When scraping slag, it is inserted into the molten tin. The scraped slag falls into the slag tank (47) through the clearance groove.

6. The tinning apparatus for wire harness production according to claim 1, characterized in that, The cooling module (6) includes an air pump (62) and an air jet pipe (61), with the nozzle of the air jet pipe (61) facing the soldering end of the wire harness (7) and the surface of the solder pool (48). The jet pipe (61) is provided with an array of micropores.

7. The tinning apparatus for wire harness production according to claim 1, characterized in that, The baffle (43) is at an angle to the horizontal plane, forming a semi-closed nitrogen chamber with the surface of the molten tin.

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