Preparation method of low-power ultraviolet curing adhesive, curing adhesive and curing method
By introducing ultraviolet light transmission nanomaterials into the UV-curable adhesive and constructing a light transmission network, the problems of high energy consumption and uneven curing in traditional UV curing technology are solved, achieving efficient and uniform curing effect at low power, which is suitable for thick layers and complex structures.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-31
- Publication Date
- 2026-04-03
AI Technical Summary
Traditional UV curing technology suffers from high energy consumption, insufficient curing depth and uniformity, and limited substrate applicability, especially in thick layers and complex structures.
By introducing ultraviolet light transmission nanomaterials, a light transmission network is constructed through nanowires and nanosheets. Low-power ultraviolet light sources are used to achieve directional transmission and uniform distribution of light, thereby reducing energy consumption and improving curing efficiency.
It achieves efficient and uniform curing under low power conditions, reduces energy consumption by more than 50%, improves curing speed and material applicability, is suitable for thick layers and complex structures, and meets green manufacturing standards.
Smart Images
Figure CN121780084A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the technical field of UV-curable adhesives, and more specifically, relates to a method for preparing a low-power UV-curable adhesive, a curing adhesive, and a curing method. Background Technology
[0002] Ultraviolet (UV) curing technology, as a highly efficient and environmentally friendly method for curing materials, has been widely used in fields such as electronic packaging, optical device manufacturing, and medical device assembly. Traditional UV curing technologies mainly rely on high-power UV light sources (typically greater than 100 mW / cm²). 2 This high-energy-input curing method uses photoinitiators in colloids to generate free radicals or cations, thereby initiating a polymerization reaction and achieving material curing. However, this method faces numerous technical bottlenecks and limitations in practical applications, severely restricting its wider application.
[0003] This high-energy curing method has the following significant problems. First, high energy consumption is one of the main bottlenecks restricting the development of traditional UV curing technology. The UV light sources commonly used in existing technologies, such as high-pressure mercury lamps or metal halide lamps, typically have power outputs of 500W to 10kW. This not only consumes a huge amount of energy but also requires complex cooling systems to maintain normal equipment operation. This high energy consumption not only increases production costs but also contradicts the current development concepts of green manufacturing and energy conservation and emission reduction. Second, traditional technologies also have significant shortcomings in terms of curing depth and uniformity. Due to the limited penetration of UV light, for adhesive layers thicker than 1mm or composite materials containing pigments, the surface layer often over-cures while the underlying layer remains incompletely cured. Especially during the curing process of complex three-dimensional structures, the geometric shading effect can lead to insufficient illumination in localized areas, severely affecting the consistency of product quality. Simultaneously, high-power UV light generates a large amount of heat during curing, which may cause heat-sensitive materials (such as flexible circuit boards, biocompatible films, or certain plastics) to deform, yellow, or degrade in performance. In addition, some materials (such as polypropylene (PP) and polyethylene (PE) have low UV light absorption rates, making it difficult to achieve effective curing and requiring additional surface treatment. Summary of the Invention
[0004] To address the above-mentioned deficiencies or improvement needs of existing technologies, this invention provides a method for preparing a low-power UV-curable adhesive, a curing adhesive, and a curing method. This method solves the problems of traditional UV curing technology, which relies on high-power UV light sources, resulting in high energy consumption, limited uniformity of curing depth, and limited substrate applicability. The invention proposes to introduce UV light transmission nanomaterials into the UV-curable adhesive and achieve low-power curing by utilizing UV irradiation.
[0005] To achieve the above objectives, according to a first aspect of the present invention, a method for preparing a low-power UV-curable adhesive is provided, comprising: A UV-curable adhesive system is prepared, and ultraviolet light transmission nanomaterials are uniformly dispersed in the UV-curable adhesive system to form a low-power UV-curable adhesive; wherein, the ultraviolet light transmission nanomaterials have the ability to transmit ultraviolet light, thereby guiding ultraviolet light to form a uniformly distributed light field in the adhesive to reduce the ultraviolet light power requirement.
[0006] According to the preparation method of the low-power UV-curable adhesive provided by the present invention, the UV-curable adhesive system includes a UV-curable adhesive matrix resin and a photoinitiator; the UV-curable adhesive matrix resin is at least one of the photocurable monomers of acrylate, epoxy resin, polyurethane, silicone and phenol, at least one of the oligomers of acrylate, epoxy resin, polyurethane, silicone and phenol, or a combination of at least one photocurable monomer and at least one oligomer.
[0007] According to the preparation method of the low-power UV-curable adhesive provided by the present invention, the ultraviolet light transmission nanomaterial is a nanowire, a nanosheet, or a combination thereof.
[0008] According to the preparation method of the low-power UV-curable adhesive provided by the present invention, the UV light transmission nanomaterial is one or more of CdS, GaN, ZnSe, InP nanowires, h-BN, MgF2, and WS2 nanosheets.
[0009] According to the preparation method of the low-power UV-curable adhesive provided by the present invention, the mass fraction of the ultraviolet light transmission nanomaterial in the low-power UV-curable adhesive is 5%-30%. And / or, the nanowires have a diameter of 10-100 nm, and the nanosheets have a diameter of 50-1000 nm.
[0010] According to the preparation method of the low-power UV-curable adhesive provided by the present invention, the nanowire or nanosheet morphology of the ultraviolet-transmitting nanomaterial is obtained by hydrothermal method, vapor deposition method or mechanical exfoliation method.
[0011] According to the preparation method of the low-power UV-curable adhesive provided by the present invention, the nanowire morphology of the UV-transmitting nanomaterial is prepared by hydrothermal method or metal-organic chemical vapor deposition method; wherein the heating temperature of the hydrothermal method is 140-180℃ and the reaction time is 4-8 hours; the heating temperature of the metal-organic chemical vapor deposition method is 500-600℃ and the reaction time is 50-70 minutes. The nanosheet morphology of the ultraviolet transmission nanomaterial is prepared by physical vapor deposition or mechanical exfoliation; wherein, the heating temperature of physical vapor deposition is 1100-1300℃ and the deposition rate is about 0.1-0.2nm / s.
[0012] According to a second aspect of the present invention, a low-power UV-curable adhesive is provided, which is prepared by the above-described preparation method.
[0013] According to a third aspect of the present invention, a curing method for a low-power UV-curable adhesive is provided, wherein the low-power UV-curable adhesive is prepared by the above-described preparation method, and the curing method includes: Apply low-power UV-curable adhesive to the surface of the substrate to be cured; A low-power ultraviolet light source emits ultraviolet light with a wavelength of 200-400 nanometers to irradiate the low-power ultraviolet curing adhesive. The ultraviolet light is guided by the ultraviolet transmission nanomaterial to be evenly distributed in the adhesive, thereby initiating a curing reaction in the ultraviolet curing adhesive system and achieving curing.
[0014] According to the curing method of the low-power UV-curable adhesive provided by the present invention, the thickness of the low-power UV-curable adhesive applied to the surface of the substrate to be cured is 0.05-2 mm. The ultraviolet light source is a UV-LED array with a power density of 20-50 mW / cm²; The curing process is carried out in a temperature range of <60℃, and the curing time is 10-60 seconds.
[0015] In summary, compared with the prior art, the preparation method, curing adhesive, and curing method of the low-power UV-curable adhesive provided by this invention are as follows: 1. Significantly Reduced Energy Consumption and Improved Curing Efficiency: Traditional UV curing technology requires high-power (>100mW / cm²) UV light sources for effective curing, resulting in high energy consumption and complex equipment. This invention introduces UV light-directing nanomaterials into the UV-curing adhesive system. Through the waveguide effect and scattering enhancement of the nanomaterials, energy consumption is reduced at low power (20-50mW / cm²). 2 Under these conditions, efficient light energy transmission can be achieved, increasing the utilization rate of ultraviolet light by 3-5 times, significantly reducing energy consumption and equipment costs, while maintaining a curing speed comparable to traditional high-power systems. Combined with a low-power ultraviolet light source system, this innovative approach achieves a highly efficient and uniform ultraviolet curing technology route. 2. Overcoming the limitations of curing depth and uniformity: Conventional UV curing technology is prone to uneven curing in thick layers (>1mm) or systems containing fillers due to limited light penetration. The three-dimensional light transmission network constructed by nanomaterials in this invention enables more uniform distribution of UV light within the colloid, achieving complete curing of adhesive layers thicker than 1mm, with a curing degree difference of less than 10% between the surface and the bottom layer. This solves the problem of gradient curing in traditional technologies and is particularly suitable for thick-layer applications such as electronic packaging and composite materials. 3. Expanded Material Applicability and Process Compatibility: This technology exhibits excellent adaptability to low surface energy materials (such as PP and PE), heat-sensitive substrates (flexible circuits, biomaterials), and pigment-containing systems. The introduction of nanomaterials not only enhances light transmission but also simultaneously improves the mechanical strength (shear strength increased by 40-60%) and thermal conductivity (up to 3 times), achieving multifunctional integration. The curing process temperature is controlled below 60℃, avoiding the risk of substrate thermal damage caused by traditional high-power UV curing. 4. Green Manufacturing and Sustainable Development: Compared with traditional mercury lamp systems, this technology reduces energy consumption by more than 50%, produces no ozone, and extends the lifespan of the UV-LED light source in the ultraviolet irradiation equipment to more than 20,000 hours; the entire curing process releases no harmful substances, complies with RoHS and REACH environmental standards, and helps achieve the goal of carbon neutrality; the programmability of process parameters also provides a technical foundation for personalized customization and digital production. Attached Figure Description
[0016] Figure 1 A 5000x magnified SEM image of the GaN nanowire surface prepared by the hydrothermal method according to Example 1 of this invention.
[0017] Figure 2 This is a 10,000x magnified SEM image of the surface of MgF2 nanosheets prepared by physical vapor deposition according to Example 3 of this invention.
[0018] Figure 3 This is a schematic diagram of the process flow in an embodiment of the UV-curable adhesive and its curing method provided by the present invention. Detailed Implementation
[0019] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, the technical features involved in the various embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.
[0020] Please see Figures 1-3 This embodiment provides a method for preparing a low-power UV-curable adhesive, the method comprising: A UV-curable adhesive system is prepared, and ultraviolet light transmission nanomaterials are uniformly dispersed in the UV-curable adhesive system to form a low-power UV-curable adhesive; wherein, the ultraviolet light transmission nanomaterials have the ability to transmit ultraviolet light, thereby guiding ultraviolet light to form a uniformly distributed light field in the adhesive to reduce the ultraviolet light power requirement.
[0021] This embodiment proposes a method for preparing low-power UV-curable adhesives based on nanomaterial-enhanced light transmission. This method innovatively utilizes the optical waveguide effect and scattering enhancement properties of UV-transmitting nanomaterials to achieve efficient transmission and uniform distribution of UV light under low-power conditions, thereby enabling deep and uniform curing of thick, complex-structured adhesives.
[0022] This embodiment provides a method for preparing a low-power UV-curable adhesive based on nanomaterial-enhanced UV light transport, the low-power UV-curable adhesive and its curing method, and verifies its performance through experiments. The main components are as follows: (1) Mold and substrate preparation: Select or customize the substrate or mold for the required colloid curing, ensuring that its surface is clean and dry, and pre-apply release agent as needed to prevent subsequent curing of the colloid from adhering.
[0023] (2) Preparation and dispersion of ultraviolet-transmitting nanomaterials: The preferred ultraviolet light-transmitting nanomaterials are nanowires, nanosheets, or a combination thereof. Specifically, the ultraviolet light-transmitting nanomaterials are one or more of CdS, GaN, ZnSe, InP nanowires, and h-BN, MgF2, and WS2 nanosheets. The nanowires have a diameter of 10-100 nm, and the nanosheets have a diameter of 50-1000 nm. The nanowires form a one-dimensional optical waveguide channel, enabling the directional transmission of ultraviolet light along the nanowire axis, reducing lateral energy loss. The nanosheets construct multi-dimensional transmission paths through a layered structure, extending the light transmission distance within the colloid and increasing the probability of interaction between the photoinitiator and ultraviolet light. This technical solution replaces traditional reflection and scattering through a directional transmission mechanism, achieving deep, efficient, and uniform curing while reducing energy consumption and cost.
[0024] The ultraviolet-transmitting nanomaterials, in nanowire or nanosheet form, are synthesized via hydrothermal methods, vapor deposition, or mechanical exfoliation. Conventional nanomaterial preparation processes such as sol-gel methods, vapor deposition, and solvent methods can also be employed. The ultraviolet-transmitting nanomaterials must possess excellent ultraviolet transmission performance and exhibit good dispersibility and chemical stability.
[0025] Optionally, the nanowire morphology of the ultraviolet-transmitting nanomaterial is prepared by hydrothermal method or metal-organic chemical vapor deposition; wherein the heating temperature of the hydrothermal method is 140-180℃ and the reaction time is 4-8 hours; the heating temperature of the metal-organic chemical vapor deposition method is 500-600℃ and the reaction time is 50-70 minutes; the nanosheet morphology of the ultraviolet-transmitting nanomaterial is prepared by physical vapor deposition or mechanical exfoliation; wherein the heating temperature of the physical vapor deposition method is 1100-1300℃ and the deposition rate is approximately 0.1-0.2 nm / s.
[0026] (3) UV-curable adhesive preparation: A low-power UV-curable adhesive is provided, prepared by the aforementioned method, comprising a UV-curable adhesive system and UV light-transmitting nanomaterials uniformly dispersed within the UV-curable adhesive system. The nanomaterials, acting as light-pathing nanomaterials, enhance the transmission efficiency of UV light within the adhesive. The UV-curable adhesive system comprises a UV-curable adhesive matrix resin and a photoinitiator; conventional UV-curable adhesive components can be used as the matrix resin, and commonly used photoinitiators and additives can also be added. The UV-curable adhesive matrix resin is at least one of the photocurable monomers selected from acrylates, epoxy resins, polyurethanes, silicones, and phenols; at least one of the oligomers selected from acrylates, epoxy resins, polyurethanes, silicones, and phenols; or a combination of at least one photocurable monomer and at least one oligomer.
[0027] Weigh out the UV-curable adhesive matrix resin (such as polyurethane acrylate, epoxy acrylate, etc.), diluent, photoinitiator, and UV light-transmitting nanomaterials (CdS nanowires, h-BN nanosheets, etc.) according to the formula. Slowly add the nanomaterials to the resin system, ensuring uniform dispersion and no visible agglomeration through high-speed shear dispersion combined with ultrasonic treatment. The mass fraction of the UV light-transmitting nanomaterials in the low-power UV-curable adhesive is 5%-30%; this fraction is optimized according to the required curing depth and efficiency. After mixing, vacuum degassing is used to eliminate air bubbles, obtaining a homogeneous and transparent UV-curable adhesive. This adhesive has a transmittance >85% at 365nm / 395nm wavelengths and is suitable for low-power (20-50mW / cm²) UV-curable adhesives. 2 UV curing system. (4) Colloid application and molding: The prepared low-power UV-curable adhesive is applied to the substrate surface according to the actual application requirements. It can be applied evenly to the substrate surface to be bonded, coated, or encapsulated using processes such as dispensing, coating, scraping, injection molding, spin coating, and screen printing. The thickness of the low-power UV-curable adhesive applied to the substrate surface to be cured is 0.05-2 mm. For deep cavities or three-dimensional structures, a step-by-step injection and layered curing process is preferred to ensure uniform distribution of the upconversion material throughout the adhesive layer.
[0028] (5) Selection and arrangement of ultraviolet irradiation equipment: A low-power UV-LED array is used as the ultraviolet irradiation source. Specifically, the ultraviolet light source is a UV-LED array with a power density of 20-50 mW / cm². The device consists of high-efficiency ultraviolet LED chips (365nm or 395nm) and a precision optical lens assembly, coupled with a high thermal conductivity aluminum substrate to ensure stable heat dissipation. The ultraviolet irradiation equipment can include a UV-LED array and an intelligent control system, enabling multi-angle irradiation. The LED array can be modularly combined and bent to fit various substrate surfaces, forming point, line, or area light sources, with the power density precisely controlled at 20-50 mW / cm². 2 Within the specified range. Depending on the curing requirements, single-sided or dual-sided beam systems can be configured, with an intelligent control system enabling programmed adjustment of irradiation time (10-60 seconds) and light intensity. Specially designed filters eliminate visible light interference, ensuring UV light purity and curing efficiency.
[0029] (6) UV curing process: A curing method for a low-power UV-curable adhesive is provided. The low-power UV-curable adhesive is prepared by the aforementioned method. The curing method includes: applying the low-power UV-curable adhesive to the surface of a substrate to be cured; irradiating the low-power UV-curable adhesive with UV light of wavelength 200-400 nm emitted by a low-power UV light source; the UV light is guided by the UV transmission nanomaterial to be uniformly distributed within the adhesive, thereby initiating a curing reaction in the UV-curable adhesive system to achieve curing.
[0030] Start the low-power UV-LED system and set the appropriate light intensity (20-50mW / cm²). 2 The UV light (365nm or 395nm) is uniformly applied to the colloidal surface by adjusting the irradiation time and intensity. The UV light is then directed and efficiently transmitted through a light transport network constructed from nanomaterials (such as CdS nanowires and h-BN nanosheets) within the colloidal layer. The nanowires and nanosheets guide the light energy deep into the colloidal layer, forming a uniformly distributed light field within the colloidal body. This avoids energy scattering and loss, exciting photoinitiators at various locations to generate free radicals or cations, triggering polymerization reactions, and achieving simultaneous curing of thick (1-2mm), deep, and complex structures from the surface to the depths.
[0031] The curing process takes place within a temperature range of <60℃, with a curing time of 10-60 seconds. Curing can be performed under nitrogen protection or in air. The curing time can be adjusted according to the adhesive layer thickness, UV light power, and nanomaterial content, typically completing curing in 10-60 seconds while maintaining the temperature below 60℃, making it suitable for heat-sensitive materials. For complex structures, multi-angle UV-LED arrays can be used for simultaneous irradiation, or a movable light source can be used to achieve three-dimensional uniform curing. The system is equipped with real-time temperature monitoring to ensure that heat-sensitive substrates are not damaged.
[0032] To further improve the uniform dispersion and curing uniformity of nanomaterials in the colloid, process parameters can be optimized. These parameters include the nanomaterial dispersion process, which can employ a combination of staged dispersion and vacuum degassing to ensure uniform distribution of nanomaterials and maintain the integrity of the light transmission network. Photocuring parameters can be adjusted to match light intensity and irradiation method to the adhesive layer thickness. Infrared thermal imaging is used to monitor and control the curing temperature below 60℃ to prevent overheating or volatilization of the substrate. This curing method is suitable for curing UV-curable adhesives used in electronic packaging, optical device bonding, and medical device assembly.
[0033] (7) Demolding and inspection: After curing, the colloid undergoes routine testing, including evaluating its curing depth, shear strength, and flexural strength. Depending on the specific application, further testing methods such as peel strength, impact strength, tensile strength, and aging resistance may be used to ensure the stable and reliable performance of the cured product. Once cured, allow the colloid to cool to room temperature, then carefully remove the mold or auxiliary devices to obtain the complete cured product. Perform further performance tests on the cured product, including curing depth, mechanical strength, adhesion, peel strength, and aging resistance, to ensure it meets product design requirements.
[0034] The following will provide further details with reference to specific embodiments.
[0035] Example 1: Taking cadmium sulfide nanowires (CdS) synthesized by hydrothermal method, epoxy acrylate-based UV-curable adhesive and photoinitiator as examples, the method described in this embodiment is used to prepare and cure low-power UV-curable adhesive for thick-layer optical device encapsulation.
[0036] Process steps (taking CdS as an example): The specific steps are as follows: The silicon wafer is ultrasonically cleaned sequentially with acetone, ethanol, and deionized water for 15 minutes, then dried for later use. 0.343g of cadmium chloride and 0.158g of thiourea are weighed and dissolved in 50ml of deionized water. The solution is stirred until completely dissolved, and 0.5ml of ammonia is added to adjust the pH to 9-10. The precursor solution and the pretreated silicon wafer are then placed in a reaction vessel and reacted at 160℃ for 6 hours. After natural cooling, the sample is removed and repeatedly rinsed with deionized water and ethanol. It is then dried in a vacuum drying oven at 60℃ for 4 hours to obtain uniformly grown CdS nanowires.
[0037] (1) Select a glass substrate with a thickness of 1.5 mm as the packaging substrate for optical devices; (2) Mix epoxy acrylate-based UV curing adhesive main agent and photoinitiator at a mass ratio of 95:5, add 5wt% CdS nanowires, and disperse through a three-step process: first mechanical stirring (1000rpm, 10min), then ultrasonic treatment (40kHz, 30min), and finally three-roll milling to ensure uniform dispersion. (3) Apply the mixed colloid to the bonding surface of the device using a precision dispensing device, and control the thickness of the colloid layer to be 0.05 mm; (4) Use a low-power UV-LED array (365 nm, 30 mW / cm²) 2 Place it 10 cm directly above the colloid and irradiate for 10 seconds; (5) Turn off the light source and allow the colloid to cool naturally to room temperature; (6) Performance tests show that the colloid is fully cured, with a light transmittance of >90%, a hardness deviation of <5% between the upper and lower layers of the cured layer, and no signs of thermal damage. Compared with traditional high-power curing, energy consumption is reduced by 60% and curing uniformity is improved by 40%.
[0038] Example 2: This embodiment is the same as the steps in Embodiment 1, except that: (1) Taking GaN nanowires, polyurethane acrylate-based UV-curable adhesive and photoinitiator prepared by metal-organic chemical vapor deposition as an example, the precision bonding of microlens array optical modules is cured. Process steps: A 2 nm thick gold catalyst was prepared on a Si substrate. The substrate was placed in an MOCVD reaction chamber and heated to 550 °C under nitrogen carrier gas. A gallium source (trimethylgallium, typical molar flow rate of 50 µmol / min) and a nitrogen source (ammonia) were introduced, controlling the nitrogen / gallium source ratio at 1000, and the reaction was carried out for 60 minutes. After the reaction was completed, the sample was cooled in nitrogen and removed to obtain GaN nanowires.
[0039] (2) Take a quartz glass lens array as the substrate, and clean it with plasma (O2, 100W, 5min) for later use; (3) Prepare polyurethane acrylate-based UV-curable adhesive and 20wt% GaN nanowires; (4) Use a precision dispensing system (positioning accuracy ±2μm) to apply the adhesive to the lens bonding surface and control the adhesive layer thickness to 1.0mm; (5) Use a low-power UV-LED array (365 nm, 30 mW / cm²) 2 Place it 10cm directly above the colloid and irradiate for 30 seconds; (6) Remove the ultraviolet source and test the curing effect. It was found that there were no bubbles, the bonding strength was high, and the curing stress was reduced.
[0040] Example 3: This embodiment is the same as the steps in Embodiment 1, except that: (1) Taking MgF2 nanosheets prepared by physical vapor deposition, high refractive index silicone-based UV curing adhesive and photoinitiator as examples, the assembly of thick optical lenses is cured; Process steps: Clean and dry the silicon or glass substrate. Place 2g of high-purity MgF2 particles into a tungsten boat evaporation source. Evacuate the system and heat the evaporation source to 1200℃ to sublimate the MgF2. Control the deposition rate to approximately 0.1-0.2nm / s, monitored by a quartz crystal oscillator. Stop deposition when the desired thickness (10-50 nm) is reached.
[0041] (2) Take an optical lens with a diameter of 50 mm as the substrate, and clean it with plasma before use; (3) Prepare silicone-based UV-curable adhesive and 30wt% MgF2 nanosheets; (4) Inject the colloid into the lens assembly gap, control the colloid thickness to 2.0 mm, and use a special fixture for positioning; (5) A ring-shaped UV-LED array (385nm, 30mW / cm²) is used. 2 Irradiate from multiple angles, curing time 60 seconds; (6) After cooling, the product is removed. The adhesive layer is cured, dense and uniform, and completely cured.
[0042] Example 4: This embodiment is the same as the steps in Embodiment 1, except that: (1) Taking the h-BN nanosheets prepared by mechanical exfoliation, biocompatible acrylate UV curing adhesive and photoinitiator as examples, low-temperature deep curing of implantable medical devices was carried out.
[0043] Process steps: Disperse 0.3g of h-BN powder in a mixed solvent of water, ethanol, and acetone (volume ratio 45:3:2). Immerse the mixture in liquid nitrogen to completely freeze, then remove and sonicate until completely thawed. Repeat the "freeze-sonicate" cycle 5 times. Finally, centrifuge the solution at 1500rpm for 10 minutes, collect the supernatant to obtain the h-BN nanosheet dispersion, and dry it to obtain the powder. (2) Select medical implants made of PEEK polymer material as the substrate and coat them with 1.5 mm thick biocompatible acrylate adhesive + 15 wt% h-BN nanosheets; (3) A double-sided UV-LED array (385nm, 30mW / cm²) is used. 2 Irradiate from multiple angles, curing time 45 seconds; (4) After curing, the adhesive layer showed no residual monomers, and the tensile and peel strengths met medical requirements, with minimal heat-affected zone.
[0044] Implementation Case 1 and Implementation Case 3 demonstrate that the low-power UV curing technology of this embodiment can adapt to the curing requirements of adhesive layers of different thicknesses. Implementation Case 3, through the addition of 30wt% MgF2 nanosheets and a ring-shaped UV-LED array design, successfully achieved complete uniformity of a 2.0mm ultra-thick adhesive layer. To demonstrate that this invention has energy-saving, high-efficiency, and environmentally friendly characteristics, the energy consumption of Implementation Case 1 and commonly used UV curing equipment on the market was compared. Specific data are shown in the table below.
[0045]
[0046] Examples 1, 2, 3, and 4 were specifically studied for different application scenarios, including optical packaging, microlens arrays, optical components, and medical devices. These studies demonstrated that the present technology has a wider range of applicability than traditional UV curing, and that the light transmission enhancement effect of nanomaterials reduces the dependence on high-power UV light sources. Figure 1 and Figure 2 It can be clearly seen from the embodiments of the present invention that the ultraviolet-transported gallium nitride nanowires and MgF2 nanosheets synthesized have good morphology and can meet the requirements.
[0047] The above embodiments develop a novel UV curing technology that can replace reflection and scattering through a directional transport mechanism, achieving efficient and uniform curing under low power input. By incorporating optical pathway nanomaterials into commonly used UV-curable adhesive systems, and irradiating the surface of the mixture with UV light, a highly efficient light transport network is constructed using the optical waveguide effect of nanowires and the multidimensional transport characteristics of nanosheets. This allows UV light to be directionally transported and uniformly distributed within the adhesive, improving UV light transmission efficiency and achieving deep, uniform curing under low power conditions. The aim is to solve the problems of high energy consumption, limited curing depth, low curing efficiency, and high equipment cost in traditional UV curing technologies by replacing reflection and scattering through the directional transport mechanism of UV light, thus optimizing the curing effect. Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.
Claims
1. A method for preparing a low-power UV-curable adhesive, characterized in that, include: A UV-curable adhesive system is prepared, and ultraviolet light transmission nanomaterials are uniformly dispersed in the UV-curable adhesive system to form a low-power UV-curable adhesive; wherein, the ultraviolet light transmission nanomaterials have the ability to transmit ultraviolet light, thereby guiding ultraviolet light to form a uniformly distributed light field in the adhesive to reduce the ultraviolet light power requirement.
2. The preparation method of the low-power UV-curable adhesive as described in claim 1, characterized in that, The UV-curable adhesive system includes a UV-curable adhesive matrix resin and a photoinitiator; the UV-curable adhesive matrix resin is at least one of the photocurable monomers of acrylate, epoxy resin, polyurethane, silicone and phenol, at least one of the oligomers of acrylate, epoxy resin, polyurethane, silicone and phenol, or a combination of at least one photocurable monomer and at least one oligomer.
3. The preparation method of the low-power UV-curable adhesive as described in claim 1, characterized in that, The ultraviolet light transmission nanomaterial is a nanowire, a nanosheet, or a combination thereof.
4. The method for preparing the low-power UV-curable adhesive as described in claim 3, characterized in that, The ultraviolet light transmission nanomaterial is one or more of CdS, GaN, ZnSe, InP nanowires, h-BN, MgF2, and WS2 nanosheets.
5. The method for preparing the low-power UV-curable adhesive as described in claim 3, characterized in that, The mass fraction of the ultraviolet light transmission nanomaterial in the low-power UV-curable adhesive is 5%-30%. And / or, the nanowires have a diameter of 10-100 nm, and the nanosheets have a diameter of 50-1000 nm.
6. The method for preparing the low-power UV-curable adhesive as described in claim 3, characterized in that, The nanowire or nanosheet morphology of the ultraviolet-transmitting nanomaterial is synthesized by hydrothermal method, vapor deposition method or mechanical exfoliation method.
7. The method for preparing the low-power UV-curable adhesive as described in claim 6, characterized in that, The nanowire morphology of the ultraviolet-transmitting nanomaterial is prepared by hydrothermal method or metal-organic chemical vapor deposition method; wherein the heating temperature of the hydrothermal method is 140-180℃ and the reaction time is 4-8 hours; the heating temperature of the metal-organic chemical vapor deposition method is 500-600℃ and the reaction time is 50-70 minutes. The nanosheet morphology of the ultraviolet transmission nanomaterial is prepared by physical vapor deposition or mechanical exfoliation; wherein, the heating temperature of physical vapor deposition is 1100-1300℃ and the deposition rate is about 0.1-0.2nm / s.
8. A low-power UV-curable adhesive, characterized in that, Prepared by the preparation method according to any one of claims 1-7.
9. A curing method for a low-power UV-curable adhesive, characterized in that, The low-power UV-curable adhesive is prepared by the preparation method described in any one of claims 1-7, wherein the curing method includes: Apply low-power UV-curable adhesive to the surface of the substrate to be cured; A low-power ultraviolet light source emits ultraviolet light with a wavelength of 200-400 nanometers to irradiate the low-power ultraviolet curing adhesive. The ultraviolet light is guided by the ultraviolet transmission nanomaterial to be evenly distributed in the adhesive, thereby initiating a curing reaction in the ultraviolet curing adhesive system and achieving curing.
10. The curing method for the low-power UV-curable adhesive as described in claim 9, characterized in that, The thickness of the low-power UV-curable adhesive applied to the surface of the substrate to be cured is 0.05-2 mm; The ultraviolet light source is a UV-LED array with a power density of 20-50 mW / cm²; The curing process is carried out in a temperature range of <60℃, and the curing time is 10-60 seconds.