Composition for ceramic tile glue, ceramic tile glue and preparation method of ceramic tile glue
By addressing the issues of cracking and weak bonding strength of existing tile adhesives under direct sunlight, this invention solves these problems while also providing sound insulation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-09
- Publication Date
- 2026-04-03
AI Technical Summary
Existing tile adhesives are prone to cracking under direct sunlight, have weak bonding strength, and have limited sound insulation properties.
The mixture is formulated with a specific ratio of components A, B, and C. Component A contains aromatic isocyanate and polymerization inhibitor, component B contains water, negative catalyst and preservative, and component C contains water-absorbing resin (SAP), diatomaceous earth, silicate, adhesive powder, filler and thixotropic agent. The mixture forms a polyurethane gel material, which enhances the bonding strength and sound insulation effect.
Tile adhesive is not prone to drying or cracking under direct sunlight, has high bonding strength and sound insulation and vibration reduction effects, and is easy to work with.
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Abstract
Description
Technical Field
[0001] This invention relates to the field of tile adhesive technology, and more specifically to tile adhesive compositions, tile adhesives, and their preparation methods. Background Technology
[0002] As an excellent decorative material, ceramic tiles are one of the most common building wall and floor decoration materials today. Currently, the market mainly uses cement-based tile adhesives for tile installation.
[0003] The main components of cement-based tile adhesive are cement, adhesive powder, sand, and additives. The cement or adhesive powder penetrates into the cement wall and the interior of the tile to form a mechanical anchoring force. After curing, it bonds the tile to the wall, thus achieving the effect of tile installation.
[0004] However, cement tile adhesive has low water retention. If used outdoors under direct sunlight, the moisture in the tile adhesive evaporates too quickly, causing the adhesive to thicken and dry out, thus losing its adhesiveness. This makes it difficult for the tiles to bond effectively to the substrate, significantly reducing the bonding strength and creating a hidden danger of hollowing and detachment. Alternatively, due to the loss of moisture from the surface of the tile adhesive, it becomes dry, reducing its wetting effect on the wall and tiles, making it easy for the adhesive surface to peel off from the tiles, leading to detachment. Furthermore, when tile adhesive is used in high-temperature environments, the workable time (airing time) is drastically shortened. The adhesive may form a skin prematurely, losing its plasticity. Workers do not have enough time to lay the tiles flat and compact them, making it difficult to expel air and easily causing hollowing. At the same time, the rapid loss of water from the cement causes excessive shrinkage of the tile adhesive, making it very easy for the tile adhesive to crack, resulting in weak adhesion.
[0005] As society pays increasing attention to environmental noise, soundproofing materials are generally applied to the interior of houses or the surfaces of buildings that require sound insulation in order to block sound transmission or reduce sound reflection and thus reduce sound energy.
[0006] Currently, vitrified microspheres are generally used as sound insulation materials in soundproof tile adhesives. These types of tile adhesives require a thickness of 2-3cm. The vitrified microspheres and the thicker coating increase the sound propagation time within the coating. However, vitrified microspheres are very easy to break during production and construction, resulting in a significant reduction in sound insulation effect.
[0007] Therefore, it is of great significance to develop a tile adhesive that is suitable for use in environments exposed to direct sunlight and has a certain sound insulation effect. Summary of the Invention
[0008] The purpose of this invention is to overcome the problems of existing tile adhesives being unsuitable for use in environments exposed to direct sunlight and having limited sound insulation effects.
[0009] To achieve the above objectives, a first aspect of the present invention provides a composition for tile adhesive, the composition comprising component A, component B and component C in a mass ratio of 1:2-3:4-6; Based on the total mass of component A, component A contains 95-99.5 wt% aromatic isocyanate and 0.5-5 wt% polymerization inhibitor; Based on the total mass of component B, component B contains 95-99 wt% water, 0.5-5 wt% negative catalyst and 0.05-0.1 wt% preservative; Based on the total mass of component C, component C contains 1-5 wt% of superabsorbent polymer (SAP), 10-20 wt% of diatomaceous earth, 15-25 wt% of silicate, 10-20 wt% of adhesive powder, 25-50 wt% of filler, 5-10 wt% of aluminum powder, and 0.5-2 wt% of thixotropic agent. The water absorption rate of the water-absorbing resin SAP is 100-110 g / g; the adhesive powder is selected from at least one of EVA adhesive powder and styrene-acrylic adhesive powder, and the glass transition temperature Tg of the adhesive powder is 0-15℃.
[0010] A second aspect of the present invention provides a method for preparing tile adhesive, the method comprising using the components of the composition described in the first aspect above, including: (1) The components in component A are first mixed to obtain mixture I; and The components in component B are mixed a second time to obtain mixture II; and The components in component C are mixed in a third step to obtain mixture III; (2) The mixture I, the mixture II and the mixture III are brought into contact and mixed to obtain the tile adhesive.
[0011] The third aspect of the present invention provides a tile adhesive prepared by the method described in the second aspect above.
[0012] The tile adhesive composition provided by the present invention is obtained by compounding components A, B and C in a mass ratio of 1:2-3:4-6, which overcomes the problems of traditional tile adhesives being prone to cracking and having weak bonding strength when used in the sun. At the same time, it also has a shock absorption effect and provides sound insulation.
[0013] The method for preparing tile adhesive provided by this invention is simple, easy to operate, and readily applicable to industrial production. Detailed Implementation
[0014] The endpoints and any values of the ranges disclosed herein are not limited to the precise ranges or values, and these ranges or values should be understood to include values close to these ranges or values. For numerical ranges, the endpoint values of the various ranges, the endpoint values of the various ranges and individual point values, and individual point values can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed herein.
[0015] It should be noted that in this invention, the unit "g / g" for water absorption rate represents the mass (grams) of water absorbed by each gram of dry water-absorbing resin (SAP).
[0016] As previously described, a first aspect of the present invention provides a composition for tile adhesive, the composition comprising component A, component B and component C in a mass ratio of 1:2-3:4-6; Based on the total mass of component A, component A contains 95-99.5 wt% aromatic isocyanate and 0.5-5 wt% polymerization inhibitor; Based on the total mass of component B, component B contains 95-99 wt% water, 0.5-5 wt% negative catalyst and 0.05-0.1 wt% preservative; Based on the total mass of component C, component C contains 1-5 wt% of superabsorbent polymer (SAP), 10-20 wt% of diatomaceous earth, 15-25 wt% of silicate, 10-20 wt% of adhesive powder, 25-50 wt% of filler, 5-10 wt% of aluminum powder, and 0.5-2 wt% of thixotropic agent. The water absorption rate of the water-absorbing resin SAP is 100-110 g / g; the adhesive powder is selected from at least one of EVA adhesive powder and styrene-acrylic adhesive powder, and the glass transition temperature Tg of the adhesive powder is 0-15℃.
[0017] The aromatic isocyanate in the tile adhesive composition provided by this invention reacts with water to form a polyurethane gel material, which can act as a shock absorber and encapsulate the powder in the composition. The negative catalyst can effectively slow down the reaction rate of aromatic isocyanate with water, thus slowing down the rapid loss of water. The water-absorbing resin SAP can prevent the tile adhesive from losing water rapidly under exposure to sunlight, which can lead to problems such as short construction time, insufficient cement hydration, and cracking. Diatomaceous earth can encapsulate and dilute the water-absorbing resin SAP, weakening the water absorption capacity of SAP and preventing excessive water absorption by the water-absorbing resin SAP. At the same time, diatomaceous earth has water storage and water absorption effects, which can help prevent the tile adhesive from being subjected to stress during construction. Under stress, diatomaceous earth releases moisture, improving the smoothness of construction; silicates become alkaline when exposed to water, reacting with aluminum powder to form hydrogen gas and aluminate gel, enhancing the foaming and bonding effects of tile adhesive; adhesive powder can encapsulate silicates, fillers, and other powders, filling the gaps between the powders to make the entire structure denser and integrated; in addition, adhesive powder has a certain degree of toughness, which can reduce the rigidity of potassium silicate and play a shock-absorbing role; fillers can fill the gaps in the paint film, increasing the density of the paint film and adjusting the rheological properties of the product; thixotropic agents can improve the workability and thixotropy of the product; the synergistic effect of the above components allows the resulting tile adhesive to still be used well under direct sunlight.
[0018] According to a preferred embodiment, in component C, the mass ratio of the water-absorbing resin SAP to the diatomaceous earth is 1:5-5.5. The inventors of this invention have discovered that, under this preferred embodiment, the prepared tile adhesive exhibits excellent adhesion to tiles or cement substrates. When applied outdoors in high-temperature, direct sunlight environments, the tile adhesive surface is not prone to drying or cracking, and it demonstrates strong adhesion and excellent workability while also providing sound insulation and vibration damping effects.
[0019] In a preferred embodiment, the composition contains component A, component B, and component C in a mass ratio of 1:2.5-2.8:4.5-5.5. The inventors of this invention have discovered that, under this preferred embodiment, the prepared tile adhesive, while ensuring ease of application, exhibits superior bonding performance and sound insulation properties.
[0020] Preferably, the absorbent resin SAP is selected from at least one of polyacrylamide SAP and polyacrylate SAP.
[0021] In a preferred embodiment, the aromatic isocyanate is selected from at least one of diphenylmethane diisocyanate and toluene diisocyanate.
[0022] Preferably, the polymerization inhibitor is selected from at least one of di(2-ethylhexyl) phosphate and tri(3-chloropropyl) phosphate.
[0023] In a preferred embodiment, the negative catalyst is selected from at least one of benzoic acid and triphenyl phosphate.
[0024] Preferably, the preservative is Kathon preservative.
[0025] Preferably, the filler is selected from a combination of titanium dioxide, heavy calcium carbonate and quartz sand, and based on the total mass of component C, component C contains 5-15 wt% of the titanium dioxide, 15-20 wt% of the heavy calcium carbonate and 5-15 wt% of the quartz sand.
[0026] In a preferred embodiment, the silicate is selected from at least one of potassium silicate, lithium silicate, and sodium silicate.
[0027] Preferably, the titanium dioxide has an average particle diameter of 10-15 μm; In a preferred embodiment, the average particle diameter of the aluminum powder is 15-40 μm; Preferably, the average particle diameter of the quartz sand is 125-400 μm; In a preferred embodiment, the average particle diameter of the heavy calcium carbonate is 35-80 μm.
[0028] As previously described, a second aspect of the present invention provides a method for preparing tile adhesive, the method comprising using the components of the composition described in the first aspect, including: (1) The components in component A are first mixed to obtain mixture I; and The components in component B are mixed a second time to obtain mixture II; and The components in component C are mixed in a third step to obtain mixture III; (2) The mixture I, the mixture II and the mixture III are brought into contact and mixed to obtain the tile adhesive.
[0029] In a preferred embodiment, the conditions for the first mixing include: a rotation speed of 400-600 rpm and a time of 5-15 min.
[0030] Preferably, the conditions for the second mixing include: a rotation speed of 400-600 rpm and a time of 5-15 min.
[0031] In a preferred embodiment, the conditions for the third mixing include: a rotation speed of 800-1200 rpm and a time of 15-25 min.
[0032] Preferably, the contact mixing conditions include: a rotation speed of 800-1000 rpm and a time of 5-10 min.
[0033] As previously stated, the third aspect of the present invention provides a tile adhesive prepared by the method described in the second aspect.
[0034] The present invention will be described in detail below through examples. Unless otherwise specified, the instruments, reagents, and materials involved in the following examples are all conventional instruments, reagents, and materials, which can be obtained through legitimate commercial channels. Unless otherwise stated, all reagents used are commercially available analytical grade products.
[0035] Aromatic isocyanates: Aromatic isocyanate I: diphenylmethane diisocyanate (MDI), purchased from Wanhua Chemical Group Co., Ltd., brand name MDI-50.
[0036] Aromatic isocyanate II: Toluene diisocyanate (TDI), purchased from Wanhua Chemical Group Co., Ltd., brand name WANNATE® TDI-80.
[0037] Aliphatic isocyanates: Standard HDI polyisocyanate, purchased from Wanhua Chemical Group Co., Ltd., brand name Tolonate™ HDB.
[0038] Superabsorbent polymer (SAP): SAP-1, a water-absorbing resin: sodium polyacrylate water-absorbing resin with a water absorption rate of 100-110 g / g, purchased from Guangzhou Bofeng Chemical Technology Co., Ltd., grade 100 mesh.
[0039] SAP-D1 water-absorbing resin: potassium polyacrylate water-absorbing resin with a water absorption rate of 80-90 g / g, purchased from Shandong Linchuan Water Technology Co., Ltd., brand name 6123.
[0040] EVA powder: EVA powder-1: glass transition temperature Tg is 13℃, purchased from Celanese (Nanjing) Chemical Co., Ltd., grade HD2000.
[0041] EVA powder-D1: glass transition temperature Tg is 16℃, purchased from Foshan Shunde District Badefu Industrial Co., Ltd., grade 6878.
[0042] Polymerization inhibitor: di(2-ethylhexyl) phosphate.
[0043] Negative catalyst: benzoic acid.
[0044] Preservative: Kathon preservative, purchased from Jinan Kathon Chemical Co., Ltd., brand name Kathon Preservative 15.
[0045] Diatomaceous earth: purchased from Foshan Zhaojing Environmental Protection Technology Co., Ltd., brand name K287.
[0046] Silicate: Potassium silicate, powder.
[0047] Titanium dioxide: The average particle diameter is 10μm.
[0048] Aluminum powder: The average particle diameter is 35μm.
[0049] Quartz sand: The average particle diameter is 125-375μm.
[0050] Trihydrate: The average particle diameter is 75 μm.
[0051] Thixotropic agent: Bentonite, purchased from Jiheng Mineral Products Processing Plant in Lingshou County, brand name PRT-02.
[0052] Unless otherwise specified, in the following examples, each part by weight = 10g.
[0053] Example 1 This embodiment illustrates the composition formulation for tile adhesive in Table 1 and describes the preparation of tile adhesive according to a method including the following steps: (1) The components in component A are first mixed (stirred at 500 rpm for 10 min) to obtain mixture I; and The components in component B are then subjected to a second mixing (stirred at 500 rpm for 10 min) to obtain mixture II; and The components in component C are mixed for the third time (stirred at 1000 rpm for 20 min) to obtain mixture III; (2) The mixture I, the mixture II, and the mixture III are contact-mixed (stirred at 800 rpm for 10 min) to obtain the tile adhesive; The mass ratio of mixture I, mixture II, and mixture III is 1:2.5:5.
[0054] Unless otherwise specified, Examples 2-3 were carried out using a method similar to that of Example 1, except that the formulations are shown in Table 1; and the parts not listed are the same as in Example 1, and the resulting tile adhesive was prepared.
[0055] Table 1
[0056] Example 4 This embodiment uses a method similar to that of Embodiment 1, except that, while keeping the total mass of components A, B, and C constant, the mass ratio of components A, B, and C is adjusted to 1:2:6. For any parts not listed, the same method as in Example 1 was used to prepare the tile adhesive.
[0057] Comparative Example 1 This comparative example was conducted using a method similar to that of Example 1, except that an equal mass of aliphatic isocyanate was used to replace aromatic isocyanate I in Example 1. For any parts not listed, the same method as in Example 1 was used to prepare the tile adhesive.
[0058] Comparative Example 2 This comparative example was conducted using a method similar to that of Example 1, except that an equal mass of absorbent resin SAP-D1 was used to replace the absorbent resin SAP-1 in Example 1. For any parts not listed, the same method as in Example 1 was used to prepare the tile adhesive.
[0059] Comparative Example 3 This comparative example was conducted using a method similar to that of Example 1, except that an equal mass of EVA adhesive powder-D1 was used to replace the EVA adhesive powder-D1 in Example 1. For any parts not listed, the same method as in Example 1 was used to prepare the tile adhesive.
[0060] Comparative Example 4 This comparative example was conducted using a method similar to that of Example 1, except that, while keeping the total mass of components A, B, and C constant, the mass ratio of components A, B, and C was adjusted to 1:4:3.5. For any parts not listed, the same method as in Example 1 was used to prepare the tile adhesive.
[0061] Test case 1. The bonding performance of the tile adhesives prepared in the above examples was tested according to the C1 type standard requirements of JCT 547-2017 for ceramic tile adhesives. The results are shown in Table 2. 2. The sound insulation performance of the tile adhesives prepared in the aforementioned examples was tested using the method specified in GB / T 19889.8-2006 (sound insulation effect of 5mm thick coating on impact with floor slab). The results are shown in Table 2.
[0062] Table 2
[0063] Continued from Table 2
[0064] The results above show that when the tile adhesive prepared using the tile adhesive composition provided by the present invention is applied in an outdoor high-temperature exposure environment, the surface of the tile adhesive is not easy to dry or crack, it has strong workability, and it has extremely high bonding strength with the tile or cement substrate, while also having sound insulation and vibration reduction effects.
[0065] The preferred embodiments of the present invention have been described in detail above; however, the present invention is not limited thereto. Within the scope of the inventive concept, various simple modifications can be made to the technical solutions of the present invention, including combinations of various technical features in any other suitable manner. These simple modifications and combinations should also be considered as the content disclosed in the present invention and are all within the protection scope of the present invention.
Claims
1. A composition for use in tile adhesive, characterized in that, The composition contains components A, B, and C in a mass ratio of 1:2-3:4-6; Based on the total mass of component A, component A contains 95-99.5 wt% aromatic isocyanate and 0.5-5 wt% polymerization inhibitor; Based on the total mass of component B, component B contains 95-99 wt% water, 0.5-5 wt% negative catalyst and 0.05-0.1 wt% preservative; Based on the total mass of component C, component C contains 1-5 wt% of superabsorbent polymer (SAP), 10-20 wt% of diatomaceous earth, 15-25 wt% of silicate, 10-20 wt% of adhesive powder, 25-50 wt% of filler, 5-10 wt% of aluminum powder, and 0.5-2 wt% of thixotropic agent. The water absorption rate of the water-absorbing resin SAP is 100-110 g / g; the adhesive powder is selected from at least one of EVA adhesive powder and styrene-acrylic adhesive powder, and the glass transition temperature Tg of the adhesive powder is 0-15℃.
2. The composition according to claim 1, characterized in that, In component C, the mass ratio of the absorbent resin SAP to the diatomaceous earth is 1:5-5.
5.
3. The composition according to claim 1 or 2, characterized in that, The composition contains component A, component B, and component C in a mass ratio of 1:2.5-2.8:4.5-5.
5.
4. The composition according to claim 1 or 2, characterized in that, The absorbent resin SAP is selected from at least one of polyacrylamide SAP and polyacrylate SAP.
5. The composition according to claim 1 or 2, characterized in that, The aromatic isocyanate is selected from at least one of diphenylmethane diisocyanate and toluene diisocyanate; And / or, the polymerization inhibitor is selected from at least one of di(2-ethylhexyl) phosphate and tri(3-chloropropyl) phosphate.
6. The composition according to claim 1 or 2, characterized in that, The negative catalyst is selected from at least one of benzoic acid and triphenyl phosphate; And / or, the preservative is Kathon preservative; And / or, the filler is selected from a combination of titanium dioxide, heavy calcium carbonate and quartz sand, and based on the total mass of the C component, the C component contains 5-15 wt% of the titanium dioxide, 15-20 wt% of the heavy calcium carbonate and 5-15 wt% of the quartz sand.
7. The composition according to claim 6, characterized in that, The silicate is selected from at least one of potassium silicate, lithium silicate, and sodium silicate; And / or, the average particle diameter of the titanium dioxide is 10-15 μm; And / or, the average particle diameter of the aluminum powder is 15-40 μm; And / or, the average particle diameter of the quartz sand is 125-400 μm; And / or, the average particle diameter of the heavy calcium carbonate is 35-80 μm.
8. A method for preparing tile adhesive, characterized in that, This method is performed using any of the components in the composition according to any one of claims 1-7, comprising: (1) The components in component A are first mixed to obtain mixture I; and The components in component B are mixed a second time to obtain mixture II; and The components in component C are mixed in a third step to obtain mixture III; (2) The mixture I, the mixture II and the mixture III are brought into contact and mixed to obtain the tile adhesive.
9. The method according to claim 8, characterized in that, The conditions for the first mixing include: a rotation speed of 400-600 rpm and a time of 5-15 min; And / or, the conditions for the second mixing include: a rotation speed of 400-600 rpm and a time of 5-15 min; And / or, the conditions for the third mixing include: a rotation speed of 800-1200 rpm and a time of 15-25 min; And / or, the conditions for contact mixing include: a rotation speed of 800-1000 rpm and a time of 5-10 min.
10. The tile adhesive prepared by the method of claim 8 or 9.