Liquid cooling plate performance test method, system, device, equipment, medium and product

Abstract

The invention relates to a liquid cooling plate performance test method, system, device and equipment, a medium and a product. The method is applied to a controller of a liquid cooling plate performance test system. Comprising the following steps: in response to a test instruction of a to-be-tested liquid cooling plate, obtaining a heat change parameter of a heating sheet corresponding to the liquid cooling plate and a preset liquid flow of the liquid cooling plate; the heat change parameters comprise a plurality of continuous moments and heat parameters corresponding to the moments; under the condition that the flow of the liquid cooling plate is maintained at the preset liquid flow, based on the heat parameters corresponding to all moments, the current value of a direct-current power source corresponding to the heating piece is adjusted to control the heating piece to conduct heating; and determining a performance test result of the liquid cooling plate according to the state change parameters of the liquid cooling plate in the heating process. By adopting the method, the working state of the server chip can be accurately simulated, so that the precision of a performance test result of the liquid cooling plate is improved.

Description

Technical Field

[0001] This application relates to the field of testing technology, and in particular to a method, system, apparatus, equipment, medium, and product for testing the performance of a liquid-cooled plate. Background Technology

[0002] With the development of power electronic devices, the power density of chips is increasing, generating more and more heat. Heat dissipation devices are used to cool these high-power-density chips. For example, liquid cooling plates are installed in servers. The liquid flowing within these plates provides a stable operating environment for the server chips. Therefore, the performance of liquid cooling plates is crucial to the normal operation of servers.

[0003] In related technologies, when performing performance tests on liquid cooling plates, heating elements are typically used to simulate server chips. By setting the voltage of the heating elements, the working state of the server chips is simulated, and the performance parameters of the liquid cooling plate under the working state of the heating elements are then tested.

[0004] However, the relevant technologies cannot accurately simulate the working state of server chips, resulting in low accuracy of liquid cooling plate performance test results. Summary of the Invention

[0005] Therefore, it is necessary to provide a liquid cooling plate performance testing method, system, device, equipment, medium, and product to address the above-mentioned technical problems, which can accurately simulate the working state of server chips, thereby improving the accuracy of liquid cooling plate performance testing results.

[0006] In a first aspect, this application provides a method for testing the performance of a liquid-cooled plate, applied to the controller of a liquid-cooled plate performance testing system; the method includes:

[0007] In response to the test command of the liquid cooling plate to be tested, the heat change parameters of the heating element corresponding to the liquid cooling plate and the preset liquid flow rate of the liquid cooling plate are obtained; the heat change parameters include multiple consecutive time moments and the heat parameters corresponding to each time moment.

[0008] While maintaining the flow rate of the liquid cooling plate at the preset liquid flow rate, the heating element is controlled to heat by adjusting the current value of the DC power supply corresponding to the heating element based on the heat parameters at each time.

[0009] The performance test results of the liquid cooling plate are determined based on the state change parameters of the liquid cooling plate during the heating process.

[0010] In one embodiment, the liquid cooling plate is connected in series with an electric regulating valve and a power pump; maintaining the flow rate of the liquid cooling plate at a preset liquid flow rate includes:

[0011] Get the current flow rate of the liquid cooling plate;

[0012] Based on the difference between the current flow rate of the liquid cooling plate and the preset liquid flow rate, the opening of the electric regulating valve and / or the frequency of the power pump are adjusted to maintain the flow rate of the liquid cooling plate at the preset liquid flow rate; the opening of the electric regulating valve is within the preset opening range.

[0013] In one embodiment, the power pump includes multiple pumps; the method further includes:

[0014] Monitor the operating status of each power pump;

[0015] If the currently operating power pump fails, stop the failed power pump and start any normal power pump other than the failed one.

[0016] In one embodiment, the performance test results include temperature test results; the performance test results of the liquid cooling plate are determined based on the state change parameters of the liquid cooling plate during the heating process, including:

[0017] Monitor the temperature of the liquid cooling plate at various heating moments during the heating process;

[0018] If all temperature values ​​are less than the upper limit of the liquid cooling plate temperature, then the temperature test result of the liquid cooling plate is determined to be a pass.

[0019] If any temperature value exceeds the upper temperature limit, the temperature test result for the liquid cooling plate is determined to be a failed test.

[0020] In one embodiment, the method further includes:

[0021] If any temperature value exceeds the upper temperature limit, heating of the heating element will be stopped.

[0022] In one embodiment, the performance test results include pressure test results; the performance test results of the liquid cooling plate are determined based on the state change parameters of the liquid cooling plate during the heating process, including:

[0023] During the heating process, the pressure difference of the liquid cooling plate is monitored at preset intervals;

[0024] If the test pressure difference is greater than the preset pressure difference value, the pressure test result is determined to be a failure.

[0025] If the test pressure difference is less than or equal to the preset pressure difference value, the pressure test result is determined to be a pass.

[0026] In one embodiment, the method further includes:

[0027] Obtain the liquid level in the reservoir connected to the liquid cooling plate;

[0028] If the liquid level is lower than the preset liquid level threshold, heating of the heating element will stop and the water pump corresponding to the liquid cooling plate will be turned off.

[0029] Secondly, this application also provides a liquid-cooled plate performance testing system, which includes: a controller, a liquid-cooled plate to be tested, a heating element, and a DC power supply; the controller is connected to the liquid-cooled plate and the DC power supply respectively; one end of the heating element is connected to the liquid-cooled plate, and the other end of the heating element is connected to the DC power supply.

[0030] The controller is used to maintain the flow rate of the liquid cooling plate at a preset liquid flow rate, and to control the heating element to heat based on the corresponding heat parameters at each time by adjusting the current value of the DC power supply, so as to determine the performance test results of the liquid cooling plate.

[0031] In one embodiment, the system further includes an electrically controlled regulating valve and a power pump frequency regulating valve; the liquid cooling plate is connected in series with the electrically controlled regulating valve and the power pump frequency regulating valve, respectively.

[0032] An electric regulating valve is used to control the liquid supply flow rate of the liquid cooling plate;

[0033] The power pump frequency regulating valve is used to control the return flow rate of the liquid cooling plate.

[0034] In one embodiment, the liquid cooling plates to be tested include multiple liquid cooling plates; the system also includes: a liquid reservoir, a liquid distributor, and a liquid collector; the liquid reservoir is connected to the liquid distributor, the liquid distributor is connected to the flow channel inlet of each liquid cooling plate respectively; the liquid collector is connected to the flow channel outlet of each liquid cooling plate respectively.

[0035] In one embodiment, the system further includes: a heat exchanger and multiple power pumps; one end of the heat exchanger is connected to a liquid collector, and the other end of the heat exchanger is connected to a liquid reservoir;

[0036] A heat exchanger is used to release liquid from a collector and store liquid in a reservoir.

[0037] Thirdly, this application also provides a liquid-cooled plate performance testing device, comprising:

[0038] The data acquisition module is used to respond to the test command of the liquid cooling plate to be tested, and acquire the heat change parameters of the heating element corresponding to the liquid cooling plate and the preset liquid flow rate of the liquid cooling plate; the heat change parameters include multiple consecutive time moments and the heat parameters corresponding to each time moment.

[0039] The parameter control module is used to control the heating element to heat the liquid cooling plate by adjusting the current value of the DC power supply corresponding to the heating element based on the heat parameters at each time while maintaining the flow rate of the liquid cooling plate at the preset liquid flow rate.

[0040] The result determination module is used to determine the performance test results of the liquid cooling plate based on the state change parameters of the liquid cooling plate during the heating process.

[0041] Fourthly, this application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps of the method in any of the embodiments of the first aspect described above.

[0042] Fifthly, this application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the method in any of the embodiments of the first aspect described above.

[0043] In a sixth aspect, this application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the method in any of the embodiments of the first aspect described above.

[0044] The aforementioned liquid-cooled plate performance testing method, system, apparatus, equipment, medium, and product, wherein the controller of the liquid-cooled plate performance testing system responds to the test command of the liquid-cooled plate under test, acquires the heat change parameters of the heating element corresponding to the liquid-cooled plate and the preset liquid flow rate of the liquid-cooled plate; the heat change parameters include multiple consecutive moments and the heat parameters corresponding to each moment; while maintaining the flow rate of the liquid-cooled plate at the preset liquid flow rate, the heating element is controlled to heat by adjusting the current value of the DC power supply corresponding to the heating element based on the heat parameters corresponding to each moment; the performance test result of the liquid-cooled plate is determined according to the state change parameters of the liquid-cooled plate during the heating process. In this way, by maintaining the flow rate of the liquid-cooled plate at the preset liquid flow rate and heating the heating element through the DC power supply, the liquid-cooled plate is placed in a single-variable test environment of heating element temperature change, thus improving the reliability of the liquid-cooled plate test environment. Furthermore, based on the thermal parameters at each moment, the current value of the DC power supply corresponding to the heating element can be flexibly and dynamically adjusted to heat the heating element. This can more realistically simulate the thermal change characteristics of the chip during actual operation, further improving the realism of the liquid cooling plate test environment, thereby improving the realism of the state change parameters of the liquid cooling plate during the heating process and obtaining more accurate performance test results. Attached Figure Description

[0045] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0046] Figure 1 This is a diagram of the internal structure of the controller in one embodiment;

[0047] Figure 2 This is a flowchart illustrating a liquid cooling plate performance testing method in one embodiment;

[0048] Figure 3 This is a flowchart illustrating a liquid cooling plate temperature testing method in one embodiment;

[0049] Figure 4 This is a flowchart illustrating a liquid cooling plate pressure testing method in one embodiment;

[0050] Figure 5 This is a flowchart illustrating the liquid cooling plate pressure testing method in another embodiment;

[0051] Figure 6 This is a schematic diagram of the architecture of a liquid cooling plate performance testing system in one embodiment;

[0052] Figure 7 This is a schematic diagram of the architecture of the liquid cooling plate performance testing system in another embodiment;

[0053] Figure 8 This is a schematic diagram of the architecture of the liquid cooling plate performance testing system in another embodiment;

[0054] Figure 9 This is a schematic diagram of the architecture of the liquid cooling plate performance testing system in another embodiment;

[0055] Figure 10 This is a schematic diagram of the architecture of the liquid cooling plate performance testing system in another embodiment;

[0056] Figure 11 This is a structural block diagram of a liquid-cooled plate performance testing device in one embodiment. Detailed Implementation

[0057] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0058] The liquid cooling plate performance testing method provided in this application embodiment can be applied to the controller of a liquid cooling plate performance testing system. The controller 102 can be, but is not limited to, various personal computers, laptops, smartphones, tablets, IoT devices, and portable wearable devices. IoT devices can be smart speakers, smart TVs, smart air conditioners, smart vehicle devices, projection devices, etc. Portable wearable devices can be smartwatches, smart bracelets, head-mounted devices, etc. Head-mounted devices can be virtual reality (VR) devices, augmented reality (AR) devices, smart glasses, etc.

[0059] Figure 1This is an internal structure diagram of the controller, which includes a processor, memory, input / output interfaces, a communication interface, a display unit, and input devices. The processor, memory, and input / output interfaces are connected via a system bus, and the communication interface, display unit, and input devices are also connected to the system bus via the input / output interfaces. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system and computer programs. The internal memory provides the environment for the operation of the operating system and computer programs stored in the non-volatile storage media. The input / output interfaces are used for exchanging information between the processor and external devices. The communication interface is used for wired or wireless communication with external terminals; wireless communication can be achieved through Wi-Fi, mobile cellular networks, Near Field Communication (NFC), or other technologies. When the computer program is executed by the processor, it implements a liquid-cooled plate performance testing method. The display unit is used to form a visually visible image and can be a display screen, a projection device, or a virtual reality imaging device. The display screen can be an LCD screen or an e-ink screen. The input device of the computer device can be a touch layer covering the display screen, or buttons, trackballs, or touchpads set on the casing of the computer device, or external keyboards, touchpads, or mice, etc.

[0060] Those skilled in the art will understand that Figure 1 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0061] In testing scenarios, when performing performance tests on liquid cooling plates, a test environment can be directly built using high-power chips to test the performance of the liquid cooling plate. However, this method is costly. Therefore, heating elements are typically used to simulate high-power chips. The heating element's voltage is adjusted to control its heating, simulating chip heat generation. However, this method cannot accurately simulate the working state of server chips, resulting in low accuracy in the performance test results of the liquid cooling plate.

[0062] In summary, this application provides a liquid cooling plate performance testing method. Based on heat change parameters, by adjusting the DC value flowing through the heating element, the heating element is controlled to generate irregular heat, simulating the sudden heating characteristics of the chip, providing a more realistic testing environment for the liquid cooling plate, and obtaining more accurate liquid cooling plate performance test results.

[0063] The technical solution of this application and how it solves the above-mentioned technical problems will be described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will be described below with reference to the accompanying drawings.

[0064] In one exemplary embodiment, such as Figure 2 As shown, a method for testing the performance of a liquid-cooled plate is provided, applied to the controller of a liquid-cooled plate performance testing system; the method includes the following steps:

[0065] S201, in response to the test command of the liquid cooling plate to be tested, acquire the heat change parameters of the heating element corresponding to the liquid cooling plate and the preset liquid flow rate of the liquid cooling plate; the heat change parameters include multiple consecutive time moments and the heat parameters corresponding to each time moment.

[0066] A liquid cooling plate is a device that uses indirect contact liquid cooling to dissipate heat from heat-generating equipment. Specifically, based on the contact between the liquid cooling plate and the heat-generating device (heating element), liquid coolant is introduced into the liquid cooling plate through one or more inlets, flows through plate-type pipes, and is discharged after absorbing the heat generated by the heat-generating device, thus forming a circulation flow to dissipate the heat generated by the heat-generating device.

[0067] When testing a liquid cooling plate, at least two factors need to be considered: test variables and test constants in the test environment. In this embodiment, a single-variable test environment is provided for the liquid cooling plate. Furthermore, the test variable is the heat change of the heating element, while the test constants, such as the liquid flow rate and pressure of the liquid cooling plate, are controlled within a preset range and kept stable.

[0068] In practical applications, test commands can carry test variables (heat change parameters of the heating element) and test constants (preset liquid flow rate, pressure, temperature, etc. of the liquid cooling plate). In this case, in response to the test command of the liquid cooling plate under test, the parameters in the test command are parsed to obtain the heat change parameters of the heating element corresponding to the liquid cooling plate and the preset liquid flow rate of the liquid cooling plate.

[0069] The heat change parameter of the heating element refers to the time-varying heat change sequence obtained by simulating the characteristic of heat change over time during the actual operation of a high-power chip. As shown in Table 1, Table 1 is a schematic diagram of the heat change parameter of the heating element.

[0070] Table 1

[0071]

[0072] In Table 1, the heating element is set to generate 100W of heat in the first second, 200W of heat in the second second, and 400W of heat in the third second, in order to simulate the heat dissipation characteristics of high-power chips as much as possible.

[0073] The preset liquid flow rate of a liquid cooling plate refers to the volume of liquid flowing through the liquid cooling plate per unit time, such as 500ml / s, 20L / min, etc.

[0074] In another feasible scenario, the controller's memory space pre-stores the identifier of the liquid cooling plate to be tested, the heat change parameters of the corresponding heating element, and the mapping relationship of the preset liquid flow rate of the liquid cooling plate. In this case, in response to the test command of the liquid cooling plate to be tested, the controller retrieves the heat change parameters corresponding to the identifier from the memory space as the heat change parameters of the corresponding heating element; and retrieves the preset liquid flow rate corresponding to the identifier from the memory space.

[0075] S202, while maintaining the flow rate of the liquid cooling plate at a preset liquid flow rate, the heating element is controlled to heat by adjusting the current value of the DC power supply corresponding to the heating element based on the heat parameters at each time.

[0076] The liquid cooling plate includes a flow channel inlet and a flow channel outlet. In this case, the flow rate of the liquid cooling plate can be controlled at a preset liquid flow rate and maintained dynamically stable by adjusting the valve opening of the flow channel inlet and the valve opening of the flow channel outlet.

[0077] With the flow rate of the liquid cooling plate continuously maintained at the preset liquid flow rate, the current value of the DC power supply at each time is determined based on the heat parameters at each time. The current flowing from the DC power supply to the heating element is controlled so that the heating element releases heat that matches the heat parameters, thereby simulating the sudden heating characteristics of a high-power chip.

[0078] S203, determine the performance test results of the liquid cooling plate based on the state change parameters of the liquid cooling plate during the heating process.

[0079] The state change parameters include the real-time state values ​​of the liquid cooling plate at multiple moments, such as temperature values ​​and pressure values ​​at multiple moments. State change parameters can be temperature change parameters or pressure change parameters.

[0080] During the heating process, the state change parameters of the liquid cooling plate at various times are monitored, and the state change curve of the liquid cooling plate is constructed. Based on the state change curve, the performance test parameters of the liquid cooling plate are determined. The performance test parameters are compared with the reference test parameters to determine the performance test results of the liquid cooling plate.

[0081] Using the state change parameter as the temperature parameter and the performance test result as the temperature test result as an example, a temperature change curve is constructed based on the temperature value of the liquid cooling plate during the heating process. The maximum temperature change rate of the liquid cooling plate is calculated, and the maximum temperature change rate is compared with the reference temperature change rate threshold. The temperature test result of the liquid cooling plate is determined based on the comparison result.

[0082] In this embodiment, the flow rate of the liquid cooling plate is maintained at a preset liquid flow rate, and the heating element is heated by a DC power supply. This places the liquid cooling plate in a single-variable test environment based on the temperature change of the heating element, improving the reliability of the liquid cooling plate test environment. Furthermore, based on the thermal parameters at each moment, the current value of the DC power supply corresponding to the heating element is flexibly and dynamically adjusted to heat the heating element. This more realistically simulates the thermal change characteristics of the chip during actual operation, further improving the realism of the liquid cooling plate test environment. Consequently, the realism of the state change parameters of the liquid cooling plate during the heating process is improved, resulting in more accurate performance test results.

[0083] As can be seen from the foregoing embodiments, in the testing environment of the liquid cooling plate, the heat emitted by the heating element corresponding to the liquid cooling plate is a variable, controlled by the controller adjusting the current value of the DC power supply. Furthermore, the flow rate of the liquid cooling plate needs to be continuously maintained at a preset liquid flow rate, which can be controlled using various methods, including but not limited to valve control and water pump control. The following embodiment illustrates one feasible method for controlling the flow rate of the liquid cooling plate.

[0084] In one exemplary embodiment, the liquid cooling plate is connected in series with an electric regulating valve and a power pump; maintaining the flow rate of the liquid cooling plate at a preset liquid flow rate includes:

[0085] Obtain the current flow rate of the liquid cooling plate; based on the difference between the current flow rate of the liquid cooling plate and the preset liquid flow rate, adjust the opening of the electric regulating valve and / or the frequency of the power pump to maintain the flow rate of the liquid cooling plate at the preset liquid flow rate; the opening of the electric regulating valve is within the preset opening range.

[0086] The current flow rate of the liquid cooling plate refers to the volume of liquid flowing through the liquid cooling plate within the rated time closest to the current moment. In the liquid cooling plate performance testing system, a flow meter can be installed in the pipes of the liquid cooling plate to obtain the liquid flow velocity of the liquid cooling plate. The controller determines the current flow rate of the liquid cooling plate based on the test results of the flow meter.

[0087] The preset liquid flow rate refers to the volume of liquid flowing through the liquid cooling plate within a predetermined rated time. The difference between the current flow rate of the liquid cooling plate and the preset liquid flow rate is calculated. Based on the sign of the difference, the adjustment strategy for the current flow rate is quickly and clearly determined until the flow rate of the liquid cooling plate is maintained at the preset liquid flow rate, that is, the difference is 0 or within a small threshold range.

[0088] For example, if the difference is negative, it means that the current flow rate is less than the preset liquid flow rate. The opening of the electric regulating valve can be kept constant, the speed of the power pump can be increased, and the amount of liquid flowing into the liquid cooling plate can be increased. If the difference is positive, it means that the current flow rate is greater than the preset liquid flow rate. The speed of the power pump can be kept constant, and the opening of the electric regulating valve can be reduced within the preset opening range to reduce the amount of liquid flowing into the liquid cooling plate.

[0089] For example, if the difference is negative, it means that the current flow rate is less than the preset liquid flow rate. The opening of the electric regulating valve can be increased within the preset opening range, and the speed of the power pump can be increased to increase the amount of liquid flowing into the liquid cooling plate. If the difference is positive, it means that the current flow rate is greater than the preset liquid flow rate. The opening of the electric regulating valve can be decreased within the preset opening range, and the speed of the power pump can be reduced to decrease the amount of liquid flowing into the liquid cooling plate.

[0090] In this embodiment, based on the difference between the current flow rate of the liquid cooling plate and the preset liquid flow rate, the opening of the electric regulating valve and / or the frequency of the power pump are adjusted within a preset opening range to maintain the flow rate of the liquid cooling plate at the preset liquid flow rate. Through the cascade liquid supply strategy, the liquid supply flow rate of the liquid cooling plate is quickly and accurately maintained at a constant preset liquid flow rate, providing a reliable testing environment for the performance testing of the liquid cooling plate.

[0091] It should be noted that during the liquid-cooled plate testing process, a power pump needs to operate normally, working in conjunction with an electric regulating valve to control the flow rate of the liquid-cooled plate. However, the power pump may be affected by various factors during the testing process, leading to its failure and inability to operate normally. Therefore, to maintain the normal operation of the liquid-cooled plate testing system, multiple power pumps are usually set up for redundancy. In an exemplary embodiment, multiple power pumps are included; the method further includes:

[0092] Monitor the operating status of each power pump; if a currently operating power pump fails, stop the operation of the failed power pump and start any normal power pump other than the failed power pump.

[0093] The operating status of the power pump includes parameters such as operating time, rated load, whether there is leakage, starting frequency, and operating voltage. If the currently operating power pump has been running for too long, or is overloaded, leaking, or has an excessively high starting frequency, or if the operating voltage does not match the rated voltage, it is determined that the currently operating power pump has failed. In this case, the failed power pump is stopped, and any normal power pump other than the failed one is started to replace the failed power pump, thus maintaining the liquid flow rate of the liquid cooling plate at the preset liquid flow rate.

[0094] In this embodiment, multiple power pumps are provided so that if the currently running power pump fails, the faulty power pump can be stopped and any normal power pump other than the faulty power pump can be quickly started to replace the faulty power pump and restore the normal operation of the liquid cooling plate testing system in a timely manner.

[0095] After setting up the test environment for the liquid cooling plate, multiple performance tests were conducted, including but not limited to temperature testing and pressure resistance testing. The temperature testing method for the liquid cooling plate will be explained below.

[0096] In one exemplary embodiment, such as Figure 3 As shown, the performance test results include temperature test results; based on the state change parameters of the liquid cooling plate during the heating process, the performance test results of the liquid cooling plate are determined, including:

[0097] S301 monitors the temperature of the liquid cooling plate at various heating moments during the heating process.

[0098] During the heating process of the heating element, the real-time temperature value of the liquid cooling plate is monitored at various times by a temperature sensor installed on the liquid cooling plate.

[0099] A temperature sensor can be placed at the center of the surface of the liquid cooling plate, and the monitoring result of the temperature sensor can be used as the temperature value of the liquid cooling plate at each heating moment during the heating process.

[0100] S302, if all temperature values ​​are less than the upper limit of the liquid cooling plate temperature, then the temperature test result of the liquid cooling plate is determined to be a pass.

[0101] If all temperature values ​​are less than the upper temperature limit of the liquid cooling plate, it means that the liquid cooling plate can absorb the heat from the heating element in time and dissipate the heat in time. Therefore, the temperature test result of the liquid cooling plate is determined to be a pass.

[0102] S303, if any temperature value is greater than the upper temperature limit, the temperature test result of the liquid cooling plate is determined to be a failed test.

[0103] In one exemplary embodiment, the method further includes: stopping heating the heating element if any temperature value is greater than the upper temperature limit.

[0104] If any temperature value exceeds the upper temperature limit, it means that the liquid cooling plate can absorb heat from the heating element, but cannot discharge the absorbed coolant in time, resulting in an excessively high surface temperature of the liquid cooling plate. In this case, the temperature test result of the liquid cooling plate is determined to be a failure, and heating of the heating element is stopped to prevent the liquid cooling plate from overheating and causing damage to the pipeline, thus ensuring the safety of the liquid cooling plate testing system.

[0105] In this embodiment, the upper temperature limit is compared with the temperature value of the liquid cooling plate at various heating moments during the heating process to objectively evaluate the temperature performance of the liquid cooling plate and improve the accuracy and reliability of the liquid cooling plate temperature test results.

[0106] Because the pressure of the coolant inside the liquid cooling pipes is affected by thermal expansion and contraction, the pressure inside the liquid cooling pipes will fluctuate to a certain extent with temperature changes. Therefore, in addition to testing the temperature performance of the liquid cooling plate in the above embodiments, the pressure resistance of the liquid cooling plate can also be tested.

[0107] In one exemplary embodiment, such as Figure 4 As shown, the performance test results include pressure test results; based on the state change parameters of the liquid cooling plate during the heating process, the performance test results of the liquid cooling plate are determined, including:

[0108] S401, during the heating process, monitor the test pressure difference of the liquid cooling plate at a preset cycle.

[0109] The preset cycle refers to the testing cycle when performing a pressure test on a liquid cooling plate. In actual testing, the preset cycle is often a relatively long time period.

[0110] During the heating process, the liquid cooling plate is kept at a constant temperature during the pressure test. The liquid cooling plate test system maintains the temperature of the supply and return liquids at a constant temperature and obtains the initial pressure of the liquid cooling plate before the pressure test and the actual pressure after the pressure test. The absolute value of the difference between the initial pressure and the actual pressure is taken as the test pressure difference of the liquid cooling plate in the preset cycle.

[0111] S402, if the test pressure difference is greater than the preset pressure difference value, the pressure test result is determined to be a test failure.

[0112] S403, if the test pressure difference is less than or equal to the preset pressure difference value, the pressure test result is determined to be a pass.

[0113] The preset pressure difference value is the standard threshold K, which refers to the critical value at which the pressure drops by K within the rated pressure holding time under standard liquid cooling pipeline locking conditions, but there is no coolant leakage. The rated pressure holding time is determined by the accuracy of the pressure sensor installed on the liquid cooling plate; the higher the accuracy class of the pressure sensor, the shorter the rated pressure holding time; conversely, the lower the accuracy class of the pressure sensor, the longer the pressure holding time.

[0114] The test pressure difference is compared with the preset pressure difference value. If the test pressure difference is less than or equal to the standard threshold K, it is considered that the coolant in the liquid cooling plate has not leaked, and the pressure test result is determined to be a pass. If the test pressure difference is greater than the standard threshold K, it is considered that the coolant in the liquid cooling plate has leaked, and the pressure test result is determined to be a fail.

[0115] In this embodiment, after setting up a test environment, the actual operating environment of a high-power chip is simulated by a heating element, and the test pressure difference of the liquid cooling plate at a preset cycle is obtained. Then, the test pressure difference is compared with the preset pressure difference value, and the coolant in the liquid cooling plate is determined based on the comparison result. Thus, the pressure test result of the liquid cooling plate is determined. Since the test environment is close to the actual operating environment, the pressure test result obtained in this environment is also accurate and reliable.

[0116] It should be noted that before conducting the pressure test on the liquid cooling plate, pretreatment can be performed on the pipes of the liquid cooling plate to be tested, such as purging the air inside the liquid cooling pipes, to ensure the reliability of the test results. After the pressure test of the liquid cooling plate, pressure relief should be performed in a timely manner to restore the usability of the liquid cooling plate. In an exemplary embodiment, such as... Figure 5 As shown, the withstand voltage test procedure includes the following steps:

[0117] S501, inject cooling circulating medium into the pipes of the liquid cooling plate and vent the air in the circulating pipes.

[0118] S502 sets the pressure resistance test time, multiple test temperatures, and initial test pressure for the liquid cooling plate to be tested.

[0119] Each test temperature refers to a combination of the liquid supply temperature and the liquid return temperature of the liquid cooling plate, while multiple test temperatures refer to multiple sets of liquid supply temperature and liquid return temperature data pairs set for the liquid cooling plate.

[0120] S503: For each test temperature, obtain the pressure difference of the liquid cooling plate before and after the pressure resistance test at that test temperature, compare the pressure difference with the pressure difference threshold, and obtain the pressure test result of the liquid cooling plate.

[0121] S504, disconnect the valve circulation pump of the liquid cooling plate test system to depressurize the pipeline.

[0122] In this embodiment, from the perspective of actual operation of the liquid cooling plate, the drawback of the liquid cooling plate being greatly affected by temperature during the pressure test and unable to simulate the actual operating environment is solved, so as to simulate a more realistic test environment and obtain more accurate pressure test results.

[0123] It should be understood that, during operation, the coolant in the liquid cooling plate is dynamically flowing. A reservoir supplies coolant to the liquid cooling plate, and a collector collects the coolant flowing out of the liquid cooling plate. In an exemplary embodiment, the method further includes:

[0124] Obtain the liquid level of the reservoir connected to the liquid cooling plate. If the liquid level is less than the preset liquid level threshold, stop heating the heating element and turn off the water pump corresponding to the liquid cooling plate.

[0125] The reservoir provides coolant to the liquid cooling plate. If the liquid level in the reservoir is lower than the preset liquid level threshold, it means that the reservoir cannot provide the preset coolant to the liquid cooling plate. Therefore, heating of the heating element is stopped, and the water pump corresponding to the liquid cooling plate is turned off to reduce the heat dissipation pressure of the liquid cooling plate.

[0126] In this embodiment, when the liquid level in the reservoir is lower than a preset liquid level threshold, heating of the heating element is stopped to prevent the liquid cooling plate from being damaged due to excessively high coolant temperature. The water pump corresponding to the liquid cooling plate is also turned off to ensure the safety of the liquid cooling plate testing system.

[0127] In one specific embodiment, the liquid cooling plate performance testing method includes the following steps:

[0128] (1) In response to the test command of the liquid cooling plate to be tested, obtain the heat change parameters of the heating element corresponding to the liquid cooling plate and the preset liquid flow rate of the liquid cooling plate; the heat change parameters include multiple consecutive time moments and the heat parameters corresponding to each time moment.

[0129] (2) Based on the difference between the current flow rate of the liquid cooling plate and the preset liquid flow rate, adjust the opening of the electric regulating valve and / or the frequency of the power pump to maintain the flow rate of the liquid cooling plate at the preset liquid flow rate; the opening of the electric regulating valve is within the preset opening range.

[0130] (3) While maintaining the flow rate of the liquid cooling plate at the preset liquid flow rate, the heating element is controlled to heat by adjusting the current value of the DC power supply corresponding to the heating element based on the heat parameters at each time.

[0131] (4) Monitor the temperature of the liquid cooling plate at each heating moment during the heating process.

[0132] (5) If all temperature values ​​are less than the upper limit of the temperature of the liquid cooling plate, the temperature test result of the liquid cooling plate is determined to be a pass; if any temperature value is greater than the upper limit of the temperature, the temperature test result of the liquid cooling plate is determined to be a fail, and heating of the heating element is stopped.

[0133] (6) Measure the pressure difference of the liquid cooling plate during the preset cycle.

[0134] (7) If the test pressure difference is greater than the preset pressure difference value, the pressure test result is determined to be a test failure; if the test pressure difference is less than or equal to the preset pressure difference value, the pressure test result is determined to be a test success.

[0135] (8) During the test, obtain the liquid level of the reservoir connected to the liquid cooling plate; if the liquid level is less than the preset liquid level threshold, stop heating the heating element and turn off the water pump corresponding to the liquid cooling plate.

[0136] In this embodiment, the flow rate of the liquid cooling plate is maintained at a preset liquid flow rate, and the heating element is heated by a DC power supply. This places the liquid cooling plate in a single-variable test environment based on the temperature change of the heating element, improving the reliability of the liquid cooling plate test environment. Furthermore, based on the thermal parameters at each moment, the current value of the DC power supply corresponding to the heating element is flexibly and dynamically adjusted to heat the heating element. This more realistically simulates the thermal change characteristics of the chip during actual operation, further improving the realism of the liquid cooling plate test environment. Consequently, the realism of the state change parameters of the liquid cooling plate during the heating process is improved, resulting in more accurate performance test results.

[0137] It should be understood that although the steps in the flowcharts of the embodiments described above are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the embodiments described above may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0138] Based on the same inventive concept, this application also provides a liquid-cooled plate performance testing system for implementing the liquid-cooled plate performance testing method described above. The embodiments of this application will now be described with reference to the accompanying drawings.

[0139] In one exemplary embodiment, such as Figure 6 As shown, a liquid-cooled plate performance testing system is provided. The system includes: a controller 101, a liquid-cooled plate 102 to be tested, a heating element 103, and a DC power supply 104. The controller 101 is connected to the liquid-cooled plate 102 and the DC power supply 104 respectively. One end of the heating element 103 is connected to the liquid-cooled plate 102, and the other end of the heating element 103 is connected to the DC power supply 104.

[0140] The controller 101 is used to maintain the flow rate of the liquid cooling plate 102 at a preset liquid flow rate, and based on the heat parameters corresponding to each time, to control the heating element 103 to heat by adjusting the current value of the DC power supply 104, so as to determine the performance test results of the liquid cooling plate 102.

[0141] Figure 6In the liquid-cooled plate performance testing system shown, the controller 101 is connected to a DC power supply 104, which is an adjustable power supply. The controller 101 controls the current flowing through the heating element 103 by adjusting the current value of the DC power supply 104, thereby heating the heating element 103. Additionally, the controller 101 is connected to the liquid-cooled plate 102. The controller 101 can be connected to the inlet and outlet of the liquid-cooled plate 102 to control the flow rate of the liquid-cooled plate 102 to maintain a preset liquid flow rate. The controller 101 can also be connected to various sensors corresponding to the liquid-cooled plate 102 to acquire the state change parameters of the liquid-cooled plate 102 during the heating process of the heating element 103, and determine the performance test results of the liquid-cooled plate 102 based on the state change parameters.

[0142] The solution provided by controller 101 is similar to the solution described in the above method. Please refer to the limitations of the liquid cooling plate performance test method above, which will not be repeated here.

[0143] It should be noted that in practical applications, the controller 101 can also test multiple liquid cooling plates 102 in parallel. Each liquid cooling plate 102 has its own DC power supply 104 and heating element 103, and the test environment of each liquid cooling plate 102 is independent of each other.

[0144] In this embodiment, the liquid-cooled plate performance testing system includes: a controller 101, a liquid-cooled plate 102 to be tested, a heating element 103, and a DC power supply 104. The controller 101 is connected to both the liquid-cooled plate 102 and the DC power supply 104. One end of the heating element 103 is connected to the liquid-cooled plate 102, and the other end is connected to the DC power supply 104. The controller 101 is used to maintain the flow rate of the liquid-cooled plate 102 at a preset liquid flow rate, and based on the heat parameters corresponding to each moment, controls the heating element 103 to heat by adjusting the current value of the DC power supply 104, thereby determining the performance test results of the liquid-cooled plate 102. By maintaining the flow rate of the liquid-cooled plate 102 at the preset liquid flow rate and heating the heating element 103 through the DC power supply 104, the liquid-cooled plate 102 is placed in a single-variable test environment of heating element 103 temperature change, thus improving the reliability of the test environment for the liquid-cooled plate 102. Furthermore, based on the heat parameters corresponding to each moment, the current value of the DC power supply 104 corresponding to the heating element 103 is flexibly and dynamically adjusted to heat the heating element 103. This can more realistically simulate the heat change characteristics of the chip during actual operation, further improve the realism of the test environment of the liquid cooling plate 102, and thus improve the realism of the state change parameters of the liquid cooling plate 102 during the heating process, obtaining more accurate performance test results.

[0145] The following example illustrates the liquid flow control device and its connection method for the liquid cooling plate 102. In an exemplary embodiment, as shown... Figure 7As shown, the system also includes an electric regulating valve 105 and a power pump frequency regulating valve 106; the liquid cooling plate 102 is connected in series with the electric regulating valve 105 and the power pump frequency regulating valve 106 respectively.

[0146] An electric regulating valve 105 is used to control the liquid supply flow rate and the liquid return flow rate of the liquid cooling plate 102;

[0147] The power pump frequency regulating valve 106 is used to adjust the flow rate of the liquid cooling plate 102.

[0148] Figure 7 In the liquid-cooled plate performance testing system shown, the liquid-cooled plate 102 is connected to an electric regulating valve 105. The electric regulating valve 105 is typically distributed on both sides of the liquid-cooled plate, including a main regulating valve and a secondary regulating valve. A controller 101 is connected to the electric regulating valve 105. The controller 101 controls the liquid supply flow rate of the liquid-cooled plate 102 by adjusting the opening of the main regulating valve, and controls the liquid return flow rate of the liquid-cooled plate 102 by adjusting the opening of the secondary regulating valve. Simultaneously, the liquid-cooled plate 102 is connected to a power pump, and the controller 101 is also connected to the power pump. The controller 101 adjusts the flow rate of the liquid-cooled plate 102 by regulating the frequency of the power pump.

[0149] In this embodiment, the liquid cooling plate 102 is connected in series with the electric regulating valve 105 and the power pump frequency regulating valve 106. The controller 101 adjusts the flow rate of the liquid cooling plate 102 by controlling the electric regulating valve 105 and by controlling the power pump frequency regulating valve 106. Thus, through the coordinated operation of the electric regulating valve 105 and the power pump frequency regulating valve 106, precise control of the flow rate of the liquid cooling plate 102 is achieved.

[0150] In one exemplary embodiment, such as Figure 8 As shown, the liquid cooling plate 102 to be tested includes multiple liquid cooling plates; the system also includes: a liquid reservoir 107, a liquid distributor 108, and a liquid collector 109; the liquid reservoir 107 is connected to the liquid distributor 108, and the liquid distributor 108 is connected to the flow channel inlet of each liquid cooling plate 102 respectively; the liquid collector 109 is connected to the flow channel outlet of each liquid cooling plate 102 respectively.

[0151] Figure 8 The dashed box in the diagram represents a test unit for a liquid cooling plate 102. This test unit includes the liquid cooling plate 102, a regulating valve connected to the liquid cooling plate 102, a heating element 103, and a DC power supply 104. In practical applications, the controller 101 can also test multiple liquid cooling plates 102 in parallel. Each liquid cooling plate 102 has its own DC power supply 104 and heating element 103, and the test environment of each test unit to which the liquid cooling plate 102 belongs is independent of each other.

[0152] Figure 8In the liquid cooling plate performance testing system shown, the reservoir 107 is connected in series with the distributor 108 via a power pump corresponding to the power pump frequency regulating valve 106. The reservoir 107 supplies coolant to the distributor 108 via the power pump. The distributor 108 determines the volume of coolant flowing into each liquid cooling plate 102 and directs coolant into each liquid cooling plate 102 through the flow channel inlet, matching the corresponding coolant volume. The flow channel outlet of each liquid cooling plate 102 is connected to the collector 109. After absorbing heat from the heating element 103, the coolant in each liquid cooling plate 102 flows into the collector 109 through the corresponding flow channel outlet. In other words, the coolant in the reservoir 107 and distributor 108 is the coolant that has not absorbed heat, while the coolant collected by the collector 109 is the coolant that has absorbed heat.

[0153] In this embodiment of the application, the liquid cooling plate 102 to be tested includes multiple liquid reservoirs 107 and distributors 108. The distributors 108 are connected to the flow channel inlets of each liquid cooling plate 102 to provide coolant to the liquid cooling plate 102. The collectors 109 are connected to the flow channel outlets of each liquid cooling plate 102 to provide a circulation outlet for the coolant to the liquid cooling plate 102, thereby realizing the circulation of coolant in the liquid cooling plate 102 and giving full play to the heat dissipation performance of the liquid cooling plate 102.

[0154] In one exemplary embodiment, see [link to example]. Figure 9 The system also includes: a heat exchanger 110 and multiple power pumps; one end of the heat exchanger 110 is connected to the liquid collector 109, and the other end of the heat exchanger 110 is connected to the liquid reservoir 107.

[0155] Heat exchanger 110 is used to release liquid from collector 109 and store liquid from distributor 108.

[0156] exist Figure 9 In the liquid-cooled plate performance testing system shown, the liquid in the collector 109 flows into the heat exchanger 110. The heat exchanger 110 discharges the flowing liquid and simultaneously receives coolant at a preset temperature that has not absorbed heat, thus realizing the heat conversion of the coolant. Further, the heat exchanger 110 flows the heat-converted coolant into the reservoir 107, and from the reservoir 107, it flows through the main pump or a backup pump to the distributor 108, and then into each liquid-cooled plate 102.

[0157] In addition, multiple power pumps are connected in parallel, and each power pump is redundant. In actual operation, one of the multiple power pumps will be selected to work. Figure 9 Taking a power pump, which includes a main pump and a standby pump, as an example, in Figure 9 When the power pump shown includes a main pump and a standby pump, the main pump can be in operation. If the main pump fails, the system will switch to the standby pump and the main pump will be maintained or replaced in a timely manner to ensure the reliability and safety of the liquid-cooled plate 102 test system.

[0158] In one embodiment, such as Figure 10 The diagram shown illustrates the working principle of a liquid-cooled plate performance testing system. Figure 10 In the diagram, the dashed lines represent the control links of the controller 101, and the arrows represent the flow direction of the coolant.

[0159] Figure 10 The liquid cooling plate performance testing system shown includes a controller 101, a control valve controller 101, an actuator for the main and backup power pumps, a liquid cooling plate 102, a heating element 103, a DC power supply 104, a power pump frequency control valve 106, a heat exchanger 110, a liquid receiver 107, a liquid distributor 108, and a liquid collector 109.

[0160] The heating element 103 can be configured in multiple groups to test the liquid cooling plate 102 as needed. The heating element 103 is attached to the bottom of the liquid cooling plate 102 using thermally conductive silicone to provide a heat source for the liquid cooling plate 102. A temperature sensor is provided between each group of heating elements 103 and the liquid cooling plate 102. The temperature sensor is connected to the controller 101 to detect the surface temperature of the liquid cooling plate 102. Each group of heating elements 103 is connected to an adjustable DC power supply 104, which is used to adjust the heat output of the heating element 103.

[0161] In practical applications, the host computer can be connected to the controller 101 to directly set the running time, running heat, and temperature threshold; it can run automatically, monitor the temperature in real time and protect itself, automatically record running data, and generate time, heat and time-temperature curves; thereby improving safety, authenticity, accuracy and reducing costs.

[0162] When supplying coolant to the liquid cooling plate 102, a cascade supply strategy is adopted. The electric regulating valve 105 is set to the branch supply flow rate to keep the branch supply flow rate constant at the set value. The adjustment amount is the opening degree of the electric regulating valve 105 of the branch supply. The opening degree of each branch electric regulating valve 105 is calculated in real time and maintained between the minimum opening degree of 30% and the maximum opening degree of 70%. The setting value of the power pump opening regulating valve is the return liquid of each branch electric regulating valve 105. The adjustment output is the frequency of the variable frequency power pump. By adding feedforward, the dynamic stability of the system is ensured, and the problem of large fluctuations when multiple variables are adjusted at the same time is solved.

[0163] During temperature testing, the controller 101 determines the primary side inlet water temperature of the water-cooled heat exchanger 110 based on the required liquid supply temperature of the liquid-cooled plate 102. By analyzing the liquid supply temperature of each liquid-cooled plate 102 and calculating the average liquid supply temperature of each line in real time, the controller controls the opening of the primary side inlet water valve to ensure the stability of the branch liquid supply temperature. At the same time, the controller calculates the difference between the branch liquid supply temperature and the average value in real time. When the difference is large, the branch with the large difference is removed, and the cause is analyzed.

[0164] During the pressure test, the pressure of the coolant in the liquid-cooled pipes fluctuates due to thermal expansion and contraction. To ensure constant supply and return temperatures before and after the pressure test, the liquid supply system of the liquid-cooled plate 102 is used. This is achieved through a power pump, an electric supply regulating valve 105, and an electric return regulating valve 105. Pressurization is increased by increasing the power pump frequency and closing the electric return valve.

[0165] During the above temperature and pressure tests, the surface temperature of multiple sets of liquid cooling plates 102, the actual voltage, current and power of heating elements 103, the supply and return liquid temperature, supply and return liquid pressure, supply liquid flow rate and liquid level of reservoir 107 are collected in real time during operation. The frequency of the power pump and the opening of the electric regulating valve 105 are continuously and automatically adjusted according to the supply liquid flow rate. The voltage and current values ​​of the adjustable DC power supply 104 are automatically adjusted according to the preset time and heat. The electric regulating valve 105 on the primary return water side is automatically adjusted according to the preset supply liquid temperature.

[0166] Furthermore, when the liquid level in the reservoir 107 is detected to be too low, the heating program is automatically stopped and the water pump is shut off to prevent cavitation of the power pump; the main and backup power pumps are redundant and automatically switch over in case of failure, thus achieving fault protection; when the temperature of the liquid cooling plate 102 is too high, the heating power is automatically reduced; when the current of the heating element 103 is too high, the heating is automatically shut off; the adjustable DC power supply 104 has a setting and feedback system, and if there is a large deviation between the setting and the feedback, it will intervene in time to protect the safety of the system.

[0167] In addition, the host computer connects to the controller 101 to centrally display the above monitoring results, and at the same time realizes the functions of historical data storage and curve display.

[0168] In the liquid cooling plate 102 testing system provided in this application embodiment, the controller 101 performs interlocked control and multiple systems operate independently, achieving centralized control. It has at least the following advantages: (1) By inputting time and heating amount according to the program and steps, the chip heating is simulated more realistically. You only need to wait for the program to finish running and then view the automatically generated time-heat and time-temperature curves to further analyze the heat dissipation effect of the liquid cooling plate. (2) Through the cascade liquid supply strategy, you only need to input the required flow rate, which is simpler to achieve. Moreover, the controller can autonomously deal with interference and quickly reach a steady state without human intervention. (3) It directly simulates the operating environment of the liquid cooling plate, making it simpler and more realistic to judge the pressure resistance of the liquid cooling plate under different working conditions.

[0169] In summary, the liquid-cooled plate testing system provided in this application effectively solves the problems of low accuracy, long testing time, and complex operation in chip heat dissipation testing during liquid-cooled plate testing; it also solves the problems of unstable liquid supply flow and poor safety due to external influences during testing; and from the perspective of actual liquid-cooled plate operation, it addresses the drawback of significant temperature influence during withstand pressure testing, which cannot simulate the actual operating environment. Test results show that the testing system and solution of this invention have high reliability, high integration, simple operation, high accuracy, low cost, and intuitive and real-time experimental results.

[0170] Based on the same inventive concept, this application also provides a liquid-cooled plate performance testing device for implementing the liquid-cooled plate performance testing method described above. The solution provided by this device is similar to the solution described in the above method; therefore, the specific limitations in one or more embodiments of the liquid-cooled plate performance testing device provided below can be found in the limitations of the liquid-cooled plate performance testing method described above, and will not be repeated here.

[0171] In one exemplary embodiment, such as Figure 11 As shown, a liquid-cooled plate performance testing device is provided, comprising: a data acquisition module 1101, a parameter control module 1102, and a result determination module 1103, wherein:

[0172] The data acquisition module 1101 is used to respond to the test command of the liquid cooling plate to be tested, and acquire the heat change parameters of the heating element corresponding to the liquid cooling plate and the preset liquid flow rate of the liquid cooling plate; the heat change parameters include multiple consecutive time moments and the heat parameters corresponding to each time moment.

[0173] The parameter control module 1102 is used to control the heating element to heat the liquid cooling plate by adjusting the current value of the DC power supply corresponding to the heating element based on the heat parameters at each time while maintaining the flow rate of the liquid cooling plate at a preset liquid flow rate.

[0174] The result determination module 1103 is used to determine the performance test results of the liquid cooling plate based on the state change parameters of the liquid cooling plate during the heating process.

[0175] In an exemplary embodiment, the liquid cooling plate is connected in series with an electric regulating valve and a power pump; the parameter control module 1102 is also used to obtain the current flow rate of the liquid cooling plate; based on the difference between the current flow rate of the liquid cooling plate and the preset liquid flow rate, the opening degree of the electric regulating valve and / or the frequency of the power pump are adjusted to maintain the flow rate of the liquid cooling plate at the preset liquid flow rate; the opening degree of the electric regulating valve is within the preset opening degree range.

[0176] In one exemplary embodiment, the power pumps include multiple pumps; the liquid cooling plate performance testing device includes: a fault pump switching module for monitoring the operating status of each power pump; if the currently operating power pump fails, the faulty power pump is stopped and any normal power pump other than the faulty power pump is started.

[0177] In an exemplary embodiment, the performance test results include temperature test results; the result determination module 1103 includes: a temperature detection unit, a first temperature test unit, and a second temperature test unit, wherein:

[0178] The temperature detection unit is used to monitor the temperature value of the liquid cooling plate at various heating moments during the heating process.

[0179] The first temperature testing unit is used to determine that the temperature test result of the liquid cooling plate is a pass if all temperature values ​​are less than the upper limit of the liquid cooling plate temperature.

[0180] The second temperature testing unit is used to determine that the temperature test result of the liquid cooling plate is a failure if any temperature value is greater than the upper temperature limit.

[0181] In one exemplary embodiment, the liquid cooling plate performance testing device includes a heating control module, configured to stop heating the heating element if any temperature value exceeds the upper temperature limit.

[0182] In an exemplary embodiment, the performance test results include stress test results; the result determination module 1103 includes: a stress detection unit, a first stress test unit, and a second stress test unit, wherein:

[0183] The pressure detection unit is used to monitor the test pressure difference of the liquid cooling plate during a preset period during the heating process;

[0184] The first pressure test unit is used to determine that the pressure test result is a failure when the test pressure difference is greater than the preset pressure difference value.

[0185] The second pressure testing unit is used to determine the pressure test result as a pass if the test pressure difference is less than or equal to the preset pressure difference value.

[0186] In one exemplary embodiment, the liquid-cooled plate performance testing device includes: a liquid level monitoring module and a device protection module, wherein:

[0187] The liquid level monitoring module is used to obtain the liquid level of the liquid reservoir connected to the liquid cooling plate.

[0188] The device protection module is used to stop heating the heating element and shut down the water pump corresponding to the liquid cooling plate when the liquid level is lower than the preset liquid level threshold.

[0189] Each module in the aforementioned liquid-cooled plate performance testing device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of a computer device in hardware form or independent of it, or stored in the memory of a computer device in software form, so that the processor can call and execute the corresponding operations of each module.

[0190] In one exemplary embodiment, a computer device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps in the above-described method embodiments.

[0191] In one exemplary embodiment, a computer-readable storage medium is provided having a computer program stored thereon, which, when executed by a processor, implements the steps in the above-described method embodiments.

[0192] In one exemplary embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the steps in the above-described method embodiments.

[0193] It should be noted that the data involved in this application (including but not limited to data used for analysis, data stored, data displayed, etc.) are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of the relevant data must comply with relevant regulations.

[0194] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, artificial intelligence (AI) processors, etc., and are not limited to these.

[0195] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0196] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A method for testing the performance of a liquid-cooled plate, characterized in that, A controller for a liquid-cooled plate performance testing system; the method includes: In response to the test command of the liquid cooling plate to be tested, the heat change parameters of the heating element corresponding to the liquid cooling plate and the preset liquid flow rate of the liquid cooling plate are obtained; the heat change parameters include multiple consecutive time moments and the heat parameters corresponding to each time moment; While maintaining the flow rate of the liquid cooling plate at the preset liquid flow rate, the heating element is controlled to heat by adjusting the current value of the DC power supply corresponding to the heating element based on the heat parameters corresponding to each time point. The performance test results of the liquid cooling plate are determined based on the state change parameters of the liquid cooling plate during the heating process.

2. The method according to claim 1, characterized in that, The liquid cooling plate is connected in series with an electric regulating valve and a power pump; maintaining the flow rate of the liquid cooling plate at the preset liquid flow rate includes: Obtain the current flow rate of the liquid cooling plate; Based on the difference between the current flow rate of the liquid cooling plate and the preset liquid flow rate, the opening degree of the electric regulating valve and / or the frequency of the power pump are adjusted to maintain the flow rate of the liquid cooling plate at the preset liquid flow rate; the opening degree of the electric regulating valve is within the preset opening degree range.

3. The method according to claim 2, characterized in that, The power pump includes multiple pumps; the method further includes: Monitor the operating status of each of the aforementioned power pumps; If the currently operating power pump fails, stop the operation of the failed power pump and start any normal power pump other than the failed power pump.

4. The method according to any one of claims 1-3, characterized in that, The performance test results include temperature test results; determining the performance test results of the liquid cooling plate based on the state change parameters of the liquid cooling plate during the heating process includes: Monitor the temperature value of the liquid cooling plate at each heating moment during the heating process; If all the temperature values ​​are less than the upper temperature limit of the liquid cooling plate, then the temperature test result of the liquid cooling plate is determined to be a pass. If any of the temperature values ​​exceeds the upper temperature limit, the temperature test result of the liquid cooling plate is determined to be a failed test.

5. The method according to claim 4, characterized in that, The method further includes: If any temperature value exceeds the upper temperature limit, heating of the heating element shall be stopped.

6. The method according to any one of claims 1-3, characterized in that, The performance test results include pressure test results; determining the performance test results of the liquid cooling plate based on the state change parameters of the liquid cooling plate during the heating process includes: During the heating process, the pressure difference of the liquid cooling plate is monitored at preset intervals; If the test pressure difference is greater than the preset pressure difference value, then the pressure test result is determined to be a test failure. If the test pressure difference is less than or equal to the preset pressure difference value, then the pressure test result is determined to be a pass.

7. The method according to any one of claims 1-3, characterized in that, The method further includes: Obtain the liquid level of the reservoir connected to the liquid cooling plate; If the liquid level is lower than the preset liquid level threshold, heating of the heating element is stopped, and the water pump corresponding to the liquid cooling plate is turned off.

8. A liquid-cooled plate performance testing system, characterized in that, The system includes: a controller, a liquid cooling plate to be tested, a heating element, and a DC power supply; the controller is connected to the liquid cooling plate and the DC power supply respectively; one end of the heating element is connected to the liquid cooling plate, and the other end of the heating element is connected to the DC power supply. The controller is used to maintain the flow rate of the liquid cooling plate at a preset liquid flow rate, and based on the heat parameters corresponding to each time, to control the heating element to heat by adjusting the current value of the DC power supply, so as to determine the performance test results of the liquid cooling plate.

9. The system according to claim 8, characterized in that, The system also includes an electric regulating valve and a power pump frequency regulating valve; the liquid cooling plate is connected in series with the electric regulating valve and the power pump frequency regulating valve respectively; The electric regulating valve is used to control the liquid supply flow rate of the liquid cooling plate; The power pump frequency regulating valve is used to control the return flow rate of the liquid cooling plate.

10. The system according to claim 8, characterized in that, The liquid cooling plates to be tested include multiple ones; the system also includes: a liquid reservoir, a liquid distributor, and a liquid collector; the liquid reservoir is connected to the liquid distributor, the liquid distributor is connected to the flow channel inlet of each of the liquid cooling plates respectively; the liquid collector is connected to the flow channel outlet of each of the liquid cooling plates respectively.

11. The system according to claim 10, characterized in that, The system also includes a heat exchanger and multiple power pumps; one end of the heat exchanger is connected to the liquid collector, and the other end of the heat exchanger is connected to the liquid reservoir. The heat exchanger is used to release the liquid in the liquid collector and store the liquid in the liquid reservoir.

12. A liquid-cooled plate performance testing device, characterized in that, The device includes: The data acquisition module is used to respond to the test command of the liquid cooling plate to be tested, and acquire the heat change parameters of the heating element corresponding to the liquid cooling plate and the preset liquid flow rate of the liquid cooling plate; the heat change parameters include multiple consecutive time moments and the heat parameters corresponding to each time moment; The parameter control module is used to control the heating element to heat the liquid cooling plate by adjusting the current value of the DC power supply corresponding to the heating element based on the heat parameters corresponding to each time point, while maintaining the flow rate of the liquid cooling plate at the preset liquid flow rate. The result determination module is used to determine the performance test results of the liquid cooling plate based on the state change parameters of the liquid cooling plate during the heating process.

13. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 8.

14. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 8.

15. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 8.

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