Temperature control system and package testing method

Abstract

The present disclosure provides a temperature control system and a packaging test method, comprising: a bottom opening of a cover body is used for sealingly connecting to a test machine; a first bin body is detachably embedded in a first mounting gap and has an openable and closable first entrance and is provided with a first communication part extending to outside of the cover body; a second bin body is detachably embedded in a second mounting gap and has an openable and closable second entrance and is provided with a second communication part extending to outside of the cover body; a first temperature control device is arranged in the first mounting part and is communicated with the accommodation space, and is used for controlling the temperature of the test cavity; a second temperature control device is communicated with the first communication part; a third temperature control device is communicated with the second communication part; a conveying device is arranged in the cover body and has an execution part in the cover body for taking and placing a chip. The feeding and discharging operations are independent and can be performed in parallel, supporting efficient automatic test of small batch and multi-specification chips, and making the replacement efficiency of the chips to be tested higher.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor technology, and in particular to temperature control systems and packaging and testing methods. Background Technology

[0002] Packaging and testing is a critical step in the semiconductor manufacturing process. It refers to the comprehensive verification of the electrical performance, functional logic, and reliability of a chip after it has been fabricated into a wafer (front-end process) and packaged (back-end process) to form an independent device. This process typically involves placing the packaged chip in a specific environment (such as high temperature, low temperature, or temperature cycling), applying electrical signals through a testing machine, and collecting response data to determine whether it meets design specifications and application standards. Because chips face complex temperature, voltage, and timing conditions in actual use, packaging and testing must not only ensure their functional correctness at room temperature but also verify their stability and durability under extreme temperature environments. However, existing packaging and testing systems generally suffer from technical bottlenecks such as insufficient temperature control accuracy, low efficiency in replacing chips under test, and difficulty in supporting small-batch automated testing. On the one hand, traditional equipment often uses a single temperature control chamber, which cannot independently regulate the temperature environment during pretreatment, testing, and unloading stages, resulting in significant thermal shock and poor test repeatability. On the other hand, chip loading and unloading usually rely on manual or semi-automatic operations, requiring frequent opening of the main test chamber, which not only disrupts temperature field stability and prolongs the testing cycle but also easily introduces contamination or electrostatic damage. Summary of the Invention

[0003] In view of the shortcomings of the prior art described above, the purpose of this disclosure is to provide a temperature control system and a packaging and testing method to solve the problems in the related technology.

[0004] The first aspect of this disclosure provides a temperature control system for packaging testing, comprising:

[0005] The cover includes a bottom opening, a receiving space communicating with the bottom opening, a first mounting part disposed on the cover and communicating with the receiving space, a first mounting notch and a second mounting notch; the bottom opening of the cover is for sealingly engaging with a testing machine, so that the testing table of the testing machine is included in the receiving space to enclose a testing cavity constructed based on the receiving space.

[0006] A first compartment is detachably fitted into the first mounting notch and has an openable and closable first inlet and outlet, and is provided with a first connecting portion extending out of the cover; wherein, the first compartment is used to insert the chip to be tested when detached from the first mounting notch;

[0007] The second compartment is detachably fitted into the second mounting notch and has an openable and closable second inlet and outlet, and is provided with a second connecting portion extending out of the cover; wherein, the second compartment is used to remove the tested chip when detached from the second mounting notch;

[0008] A first temperature control device is disposed in the first mounting part and connected to the accommodating space, and is used to control the temperature of the test chamber;

[0009] The second temperature control device is connected to the first connecting part and is used to control the temperature of the first chamber to perform pre-cooling or preheating treatment on the chip to be tested.

[0010] The third temperature control device is connected to the second connecting part and is used to control the temperature of the second chamber to perform heat preservation / cooling treatment on the tested chips before they are discharged.

[0011] At least one transport device is disposed in the housing and has an execution unit located inside the housing for picking up / placing chips, for transporting chips between the first compartment, the test bench, and the second compartment.

[0012] In a first aspect embodiment, the conveying device includes:

[0013] A moving track is provided in the receiving space, and a picking member equipped with the actuator can move closer to or away from the first compartment and the second compartment along the moving track; the actuator is located at the end of the picking member;

[0014] A driving device, disposed on the moving track and connected to the picking member, is configured to drive the picking member to move along the moving track, so that the chip moves between a picking position, a placement position and a feeding position on a movement path;

[0015] When the picking component approaches the first compartment and reaches the picking position, the driving device enables the actuator to be in a suitable first posture for entering the first compartment and to take out the chip from the first compartment.

[0016] When the pick-up component reaches the placement position, the drive device can cause the actuator to be in a second posture of placing or picking up the chip, and place the chip on the test table, or remove the chip from the test table;

[0017] When the pick-up component approaches the second compartment and reaches the insertion position, the drive device enables the actuator to be in a suitable third posture for entering the second compartment and places the chip into the second compartment.

[0018] In an embodiment of the first aspect, the execution unit is further provided with at least one positioning sensor for positioning the chip to determine the position where the execution unit can pick up / place the chip;

[0019] And / or, the actuator is implemented as at least one of the following: a suction cup, a claw.

[0020] In a first aspect embodiment, the first temperature control device controls the temperature inside the test chamber by inputting high-temperature or low-temperature gas into the test chamber;

[0021] The temperature control system further includes a sealing assembly, which comprises:

[0022] A sealing element is provided at the bottom opening for connecting the testing machine, so that a sealed connection is formed between the bottom opening and the testing machine;

[0023] A pressure sensor is installed in the accommodating space to detect the internal pressure of the accommodating space;

[0024] An airtight controller is communicatively connected to the first temperature control device and the air pressure sensor. It is used to acquire the airflow of the first temperature control device and the internal air pressure, and generate a warning message to reflect the airtightness of the test chamber based on the difference between the two.

[0025] In the first aspect of the embodiment, a plurality of temperature detection sensors are also included, respectively disposed in the test chamber, the first chamber and the second chamber, for detecting the temperature inside the chamber and generating alarm information based on the detected temperature to notify the outside.

[0026] In the embodiments of the first aspect, the first temperature control device, and / or the second temperature control device, and / or the third temperature control device includes at least one of the following: a heat flow meter, a compressed air gun, and a liquid-cooled heat exchanger.

[0027] In the first aspect of the embodiment, a first gas equalizer is further included, disposed within the accommodating space and covering the first mounting portion, for uniformly equalizing the gas output from the first temperature control device; and / or,

[0028] A second gas equalizer, disposed within the first chamber and covering the first connecting portion, is used to evenly distribute the gas output by the second temperature control device; and / or,

[0029] The third gas equalizer is disposed in the second chamber and covers the second connecting part, and is used to even out the gas output by the third temperature control device.

[0030] A second aspect of this disclosure provides a packaging testing method, wherein the temperature control system described in any embodiment of the first aspect above is applied; the packaging testing method includes:

[0031] The chip to be tested is placed into the first chamber, and the first chamber is sealed and fitted into the first mounting notch;

[0032] The temperature inside the first chamber is controlled by a second temperature control device to perform pre-cooling or preheating treatment on the chip to be tested.

[0033] The pre-processed chip is transferred to the test station by a conveying device, and the temperature inside the test chamber is controlled by a first temperature control device to perform packaging test on the chip.

[0034] The tested chip is transferred to the second chamber by the transport device. After the second chamber is sealed, the temperature inside the second chamber is controlled by the third temperature control device to perform heat preservation or cooling treatment on the chip.

[0035] After the chip has completed the heat preservation or cooling process, the second chamber is removed from the cover, and the chip after the test is completed is taken out.

[0036] A third aspect of this disclosure provides a computer apparatus, comprising:

[0037] Processor and memory;

[0038] The memory stores program instructions;

[0039] The processor is configured to run the program instructions to perform the packaging test method described in the second aspect above.

[0040] This disclosure provides a fourth aspect of a computer-readable storage medium storing program instructions that are executed to perform the packaging test method described in the second aspect above.

[0041] The beneficial effects of this disclosure are as follows: By sealing the enclosure and the test chamber to form an independent test chamber, and by setting up a detachable first chamber (feed chamber) and a second chamber (discharge chamber), along with their respective independent second and third temperature control devices, precise temperature control is achieved in the three stages of chip feeding pre-processing, testing, and discharge post-processing. The feeding and discharging operations are independent of each other and can be executed in parallel, supporting efficient automated testing of small batches and multiple types of chips, and making the replacement efficiency of the chips to be tested higher. Attached Figure Description

[0042] Figure 1 This is a front sectional view of a temperature control system in one embodiment of the present disclosure.

[0043] Figure 2 The embodiment is a cross-sectional view of a temperature control system in yet another embodiment of this disclosure.

[0044] Figure 3The embodiment is a schematic diagram of the electrical control module of the sealing component in one embodiment of this disclosure.

[0045] Figure 4 This is a schematic diagram illustrating the process of a driving device picking up a chip and placing it on a test bench in one embodiment of the present disclosure.

[0046] Figure 5 This is a schematic diagram illustrating the process of a driving device picking up a chip on a test bench in one embodiment of this disclosure.

[0047] Figure 6 This is a schematic diagram illustrating the process of storing chips in a driving device according to an embodiment of the present disclosure.

[0048] Figure 7 This is a schematic diagram of the overall process of the packaging and testing method in one embodiment of the present disclosure.

[0049] Figure 8 A schematic diagram of the structure of a computer device according to an embodiment of the present disclosure is shown. Detailed Implementation

[0050] The following specific examples illustrate the implementation of this disclosure. Those skilled in the art can easily understand other advantages and effects of this disclosure from the information disclosed herein. This disclosure can also be implemented or applied through other different specific embodiments, and various details in this disclosure can be modified or changed according to different viewpoints and application modules without departing from the spirit of this disclosure. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this disclosure can be combined with each other.

[0051] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings, so that those skilled in the art to which this disclosure pertains can readily implement it. This disclosure may be embodied in many different forms and is not limited to the embodiments described herein.

[0052] In this disclosure, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic represented in connection with that embodiment or example is included in at least one embodiment or example of this disclosure. Furthermore, the specific features, structures, materials, or characteristics represented may be combined in any suitable manner in any one or a group of embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples represented in this disclosure, as well as the features of those different embodiments or examples.

[0053] Furthermore, the terms "first" and "second" are used for illustrative purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the representation of this disclosure, "a set" means two or more, unless otherwise explicitly specified.

[0054] For the purpose of clarity, devices unrelated to the description are omitted, and the same or similar components throughout the specification are given the same reference numerals.

[0055] Throughout this specification, when it is said that a device is "connected" to another device, this includes not only "direct connection" but also "indirect connection" by placing other components in between. Furthermore, when it is said that a device "comprises" a certain constituent element, unless otherwise stated otherwise, this does not exclude other constituent elements, but rather implies that other constituent elements may be included.

[0056] While the terms first, second, etc., are used in some examples herein to refer to various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, first interface and second interface, etc., are used. Furthermore, as used herein, the singular forms “a,” “an,” and “the” are intended to also include the plural forms unless the context indicates otherwise. It should be further understood that the terms “comprising,” “including,” indicate the presence of features, steps, operations, elements, modules, items, kinds, and / or groups, but do not exclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, modules, items, kinds, and / or groups. The terms “or” and “and / or” as used herein are interpreted as inclusive, or mean any one or any combination thereof. Thus, “A, B, or C” or “A, B, and / or C” means “any one of: A; B; C; A and B; A and C; B and C; A, B, and C.” Exceptions to this definition will only occur if the combination of elements, functions, steps, or operations is inherently mutually exclusive in some way.

[0057] The technical terms used herein are for reference only to specific embodiments and are not intended to limit the scope of this disclosure. The singular form used herein includes the plural form unless the statement explicitly indicates otherwise. The word "comprising" as used in this specification means to specify a particular characteristic, region, integer, step, operation, element, and / or component, and does not exclude the presence or addition of other characteristics, regions, integers, steps, operations, elements, and / or components.

[0058] Although not explicitly defined, all terms, including technical and scientific terms used herein, shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Terms defined in commonly used dictionaries shall be further interpreted as having a meaning consistent with the relevant technical literature and the message of the present disclosure, and shall not be over-interpreted as having an ideal or overly formulaic meaning unless otherwise defined.

[0059] In semiconductor packaging testing, to ensure the reliability of chips in real-world application environments, electrical performance verification is typically performed under different temperature conditions. However, traditional packaging testing equipment generally uses a single-cavity structure, requiring frequent opening of the main test cavity for chip loading and unloading. This not only leads to temperature variations and long recovery times, affecting test consistency, but also makes it difficult to decouple the processes of material pre-processing, testing, and post-processing. Especially when dealing with small batches and diverse types of packaged chips, problems such as low chip replacement efficiency, high reliance on manual labor, and slow temperature control response exist.

[0060] Therefore, in order to solve the above problems, one embodiment of this disclosure provides a temperature control system for packaging testing.

[0061] in, Figure 1 This is a front sectional view of a temperature control system in one embodiment of the present disclosure.

[0062] Specifically, in Figure 1 In this embodiment, the temperature control system includes: a housing 100, a first compartment 200, a second compartment 300, a first temperature control device 400, a second temperature control device 500, a third temperature control device 600, and a conveying device 700. The first temperature control device 400 is used to control the temperature inside the housing 100, the second temperature control device 500 is used to control the temperature of the first compartment 200, the third temperature control device 600 is used to control the temperature of the second compartment, and the conveying device 700 is used to transport the chip within the housing 100. Figure 1 The embodiment uses the first chamber 200 to preheat / precool the chip, the cover 100 to package and test the chip, and the second chamber 300 to keep the chip warm / cool it down after the test is completed.

[0063] Specifically, the cover 100 includes a bottom opening 110, a receiving space 120 communicating with the bottom opening 110, a first mounting portion 130 disposed on the cover 100 and communicating with the receiving space 120, a first mounting notch 140, and a second mounting notch 150; the bottom opening 110 of the cover 100 is for sealingly engaging with the testing machine 800, so that the testing platform 810 of the testing machine 800 is included in the receiving space 120 to enclose a testing chamber constructed based on the receiving space 120. A first temperature control device 400, disposed on the first mounting portion 130 and communicating with the receiving space 120, is used to control the temperature of the testing chamber.

[0064] exist Figure 1 In the described embodiment, the first mounting part 130 is used to connect the first temperature control device 400, the first mounting notch 140 is used to embed into the first chamber 200, and the second mounting notch 150 is used to embed into the second chamber 300. The first mounting part 130, the first mounting notch 140, and the second mounting notch 150 can be located at any part of the cover 100, such as the side wall, top, or rear end face, depending on the actual structural layout and functional requirements. This application does not limit this, as long as it enables reliable installation of the temperature control device, detachable fitting of the chamber, and effective airflow / signal communication.

[0065] exist Figure 1 In the illustrated embodiment, the first mounting portion 130 is disposed on the top of the cover 100 and faces the test platform 810 of the testing machine 800 below. This arrangement allows the airflow output by the first temperature control device 400 to cover the entire test chamber more evenly.

[0066] exist Figure 1 In the illustrated embodiment, the first mounting notch 140 and the second mounting notch 150 are respectively disposed on the left and right sides (or two opposite sidewalls) of the internal storage space 120 of the housing 100, and are distributed symmetrically or asymmetrically to accommodate chip feeding from one side and outputting from the other side. It is worth noting that the dimensions of these two mounting notches do not occupy the entire area of ​​their respective sidewalls, but leave sufficient margin in height and width.

[0067] It should be noted that this application does not limit the first mounting notch 140 and the second mounting notch 150 to be located on opposite sides of the cover 100; in other embodiments, they can also be arranged on the same side wall, or their positions can be flexibly adjusted according to actual needs such as the layout of the testing machine 800. Furthermore, the structure of the first mounting notch 140 and the second mounting notch 150 is similar to a drawer slide-type insertion interface: the first compartment 200 can be horizontally inserted or pulled out along the first mounting notch 140 to achieve quick loading, unloading, and sealed connection.

[0068] In an optional embodiment, the first temperature control device 400 controls the temperature inside the test chamber by inputting high-temperature or low-temperature gas into the test chamber. As an example, the first temperature control device 400 includes at least one of the following: a heat flow meter, a compressed air gun, and a liquid-cooled heat exchanger.

[0069] Specifically, the first temperature control device 400 introduces high-temperature gas (e.g., below 200°C) or low-temperature gas (e.g., down to -55°C) into the test chamber to simulate the extreme temperature environment that the chip may encounter in actual applications. To ensure the safe and stable operation of the system under high-temperature conditions, all kinds of devices arranged inside the test chamber (including sensors, cable connectors, conveying device 700, etc.) are made of high-temperature resistant materials, or their surfaces are covered with high-temperature resistant coatings / insulation layers (e.g., ceramic coatings, polyimide films, stainless steel cladding, etc.) to prevent aging, deformation, insulation failure, or mechanical performance degradation due to long-term exposure to high-temperature environments.

[0070] Figure 2 The embodiment is a cross-sectional view of a temperature control system in yet another embodiment of this disclosure.

[0071] exist Figure 2 In the embodiment shown, the temperature control system further includes a first gas equalization element 160, which is disposed within the accommodating space 120 and covers the first mounting portion 130, for uniformly distributing the gas output by the first temperature control device 400.

[0072] Specifically, the first gas equalization element 160 can take the form of a perforated plate, a honeycomb flow guide structure, or a metal mesh. Its material is preferably a material resistant to high and low temperatures and with a low coefficient of thermal expansion (such as stainless steel, ceramic, or special engineering plastics) to adapt to a wide temperature range testing environment. When the temperature-regulating gas enters the test chamber from the first temperature control device 400 through the first mounting part 130, it first passes through the first gas equalization element 160, which disperses the airflow evenly, thereby creating a more uniform temperature distribution testing environment within the test chamber.

[0073] exist Figure 1 In the illustrated embodiment, the transport device 700 is disposed on one side wall of the housing 100, and its actuator 740 extends into the receiving space 120 to complete the chip loading and unloading operation. The arrangement of the transport device 700 avoids the first mounting portion 130 located at the top of the housing 100 and the first gas equalizer 160 covering it, ensuring that the temperature-controlled airflow can be uniformly diffused through the first gas equalizer 160 without obstruction after entering the test chamber from the top, avoiding airflow turbulence or uneven temperature distribution caused by the structure of the transport device 700.

[0074] It should be noted that, Figure 1The position and shape of the conveying device 700 are shown only schematically to illustrate its relative layout with the enclosure 100, the test platform 810, and the chamber, and are not intended to limit the specific structure or installation orientation. In other embodiments, the conveying device 700 may also be located at the rear of the enclosure 100 or other positions according to system integration requirements, as long as its movement path does not interfere with the airflow field of the first air distribution element 160 and the test within the test chamber.

[0075] refer to Figure 2 and Figure 3 , Figure 3 The embodiment is a schematic diagram of the electrical control module in the sealing assembly 900 in one embodiment of this disclosure.

[0076] To ensure the airtightness of the enclosure 100 when gas is introduced into the first temperature control device 400, the temperature control system also includes a sealing component 900. The sealing component 900 ensures that the temperature control system maintains an airtight environment during the input of high-temperature or low-temperature gas, preventing external air from seeping in or internal gas from leaking, thereby affecting the test accuracy.

[0077] Specifically, the sealing assembly 900 includes: a seal 910, a pressure sensor 920, and an airtight controller 930.

[0078] The sealing element 910 is disposed at the bottom opening 110 and is used to connect the testing machine 800, so that a sealed connection is formed between the bottom opening 110 and the testing machine 800.

[0079] Specifically, the sealing element 910 is located around the bottom opening 110 of the cover 100, including but not limited to annular sealing rings (such as O-rings or irregular cross-section sealing gaskets).

[0080] In some embodiments, mechanical clamping mechanisms (such as quick-release latches, bolted flanges) can be provided to enhance the seal, ensuring that the sealing interface remains intact even under drastic temperature changes or internal pressure fluctuations, preventing leakage of high-temperature or low-temperature gases, and also preventing external air or moisture from seeping into the test chamber. During installation, the cover 100 is tightly fitted to the upper surface of the test machine 800 via the sealing element 910: a sealing ring is fitted at the connection between the bottom of the cover 100 and the test machine 800, thus sealing the cover 100 and the test machine 800.

[0081] The pressure sensor 920 is disposed in the accommodating space 120 and is used to detect the internal pressure of the accommodating space 120.

[0082] Specifically, the pressure sensor 920 is preferably installed in a non-directly blowing area on the side wall or top of the cavity to avoid interference from high-speed airflow disturbances on measurement accuracy. The pressure sensor 920 is configured to monitor the absolute or relative pressure changes inside the test cavity in real time and transmit the collected pressure signal to the airtight controller 930. During temperature control, when the first temperature control device 400 introduces high-temperature or low-temperature gas into the accommodating space 120, the pressure inside the cavity will change dynamically accordingly. Furthermore, as described above, the pressure sensor 920 is also made of a high-temperature resistant material, or is encased in a high-temperature resistant material with only the detection part exposed.

[0083] The airtightness controller 930 is communicatively connected to the first temperature control device 400 and the air pressure sensor 920. It is used to obtain the ventilation volume of the first temperature control device 400 and the internal air pressure, and generate a warning message to feed back the airtightness of the test chamber based on the difference between the two.

[0084] Specifically, the airtight controller 930 acquires the airflow rate (including parameters such as set flow rate, actual output flow rate, or valve opening) of the first temperature control device 400 in real time. During system operation, the airtight controller 930 performs dynamic analysis based on the principle of fluid mass conservation: when the first temperature control device 400 stably introduces gas into the test chamber at a known rate, if the cover 100 is well sealed, the air pressure in the accommodating space 120 should rise according to the expected pattern and tend to stabilize to reach the theoretical air pressure; conversely, if there is a leak, the actual internal air pressure will be significantly lower than the theoretical air pressure, or show a continuous and slow downward trend under steady-state gas supply.

[0085] In one embodiment, the airtightness controller 930 compares and judges the above parameters through threshold comparison logic. Once it detects that the deviation between the actual internal air pressure change and the theoretical air pressure obtained by the ventilation volume exceeds the preset tolerance range (e.g., insufficient pressure rise per unit time or steady-state pressure drop exceeding the safety threshold), it determines that there is an airtightness abnormality in the test chamber, immediately generates a corresponding warning message, and notifies the staff through a notification module 940. This warning message may manifest as a local audible and visual alarm, a pop-up prompt on the host computer, a test process pause command, or a shutdown signal sent to the main control system.

[0086] Furthermore, the theoretical pressure is calculated from the intake volume, which is the product of the intake volume and a preset coefficient, where the preset coefficient can be a pre-set value. The difference between the ventilation volume and the internal pressure is the difference between the theoretical pressures.

[0087] In some preferred embodiments, the cover 100 is raised and lowered by a drive mechanism, which can also continue to descend if the airtightness is insufficient based on a warning message from the airtightness controller. If the airtightness is still insufficient after further descent, personnel are notified to conduct further testing.

[0088] exist Figure 1 In this embodiment, the first compartment 200 is set up to hold the chip before testing, and the second compartment 300 is set up to hold the chip after testing. The first compartment and the second compartment solve the problems of low chip replacement efficiency and frequent test process interruption in related technologies.

[0089] The first chamber 200 is detachably fitted into the first mounting notch 140 and has an openable and closable first inlet and outlet, and is provided with a first connecting portion extending outside the cover 100; wherein, the first chamber 200 is used to insert the chip to be tested in a state of being detached from the first mounting notch 140.

[0090] Specifically, in actual operation, the user can completely remove the first chamber 200 from the first mounting notch 140 of the cover 100 (in some embodiments, the first chamber 200 may not be completely detached from the first mounting notch 140). While detached, the user adds the chip to be tested into the chamber through its first inlet / outlet. After adding the chip, the first inlet / outlet is closed and sealed, and then the entire first chamber 200 is re-fitted back into the first mounting notch 140 of the cover 100, thereby enabling chip testing preparation in a controlled environment (such as preheating or cooling).

[0091] The first entrance / exit is equipped with an openable and closable door, which can be opened flexibly, either by sliding left or right or by flipping upwards, without structural interference. This is because the first compartment 200 does not occupy the entire space on one side of the enclosure 100, leaving sufficient operating clearance for the door's movement and ensuring smooth opening and closing in various usage scenarios.

[0092] exist Figure 1 In the illustrated embodiment, the first compartment 200 has multiple chip storage platforms arranged vertically inside. Each platform surface has at least one protrusion for positioning and supporting the chip. This protrusion not only stabilizes the chip's position but also facilitates the transport device 700 to lift the chip from below, enabling pick-and-place operations. The chips are arranged in a stacked manner along the vertical direction within the compartment.

[0093] In addition, in some preferred embodiments, the orientation of the first entrance / exit is set to face the test station 810, so that the chip can be directly and quickly transferred to the test station after being taken out from the first compartment 200, reducing the handling path and time, and improving the overall testing efficiency.

[0094] It should be noted that the second compartment 300 described below is basically the same as the first compartment 200 in structure, including the detachable fitting method, the openable and closable entrance and exit, the internal platform layout and the protrusion design, etc. The only difference is in the function and purpose (such as temporary storage of tested chips or processing of different temperature zones, etc.), so its structure will not be described again.

[0095] Chips typically require pre-cooling or pre-heating before testing to match their initial temperature with the test environment, thus preventing problems caused by excessive temperature differences. For example, when testing is conducted in a high-temperature environment (e.g., 125°C), directly placing a chip at room temperature (e.g., 25°C) with potentially trace amounts of moisture on its surface into a high-temperature chamber can cause the moisture on the chip or its package surface to rapidly vaporize due to sudden heating, potentially forming condensation droplets or vapor pressure, which could lead to short circuits, corrosion, or abnormal test signals. Conversely, in low-temperature testing (e.g., -40°C), if a room-temperature chip is directly introduced into the low-temperature environment, water vapor in the air will condense into frost or ice crystals on the chip surface or test fixture, affecting the chip. By pre-cooling or pre-heating the chip before it enters the packaging test, allowing its temperature to gradually transition to the target test temperature, the risks associated with condensation or vaporization can be effectively avoided.

[0096] Therefore, to solve the above problems, the temperature control system is equipped with a second temperature control device 500. The second temperature control device 500 is connected to the first connecting portion on the first chamber 200 via a pipe or interface, and is used to regulate the temperature inside the first chamber 200, thereby achieving pre-cooling or pre-heating treatment of the chip to be tested. The second temperature control device 500 is structurally and functionally identical to the aforementioned first temperature control device 400; its specific construction can be found in the preceding description of the first temperature control device 400, and will not be repeated here.

[0097] exist Figure 2 In the illustrated embodiment, to improve temperature control uniformity, the temperature control system further includes a second gas equalization component 210, disposed within the first chamber 200 and covering the inner opening of the first connecting portion. Its function is to evenly diffuse the temperature-regulating gas (such as hot or cold air) output by the second temperature control device 500, preventing concentrated airflow from impacting the chip and ensuring a uniform and stable temperature distribution across the storage platforms and the chip area within the chamber. Specifically, the second gas equalization component 210 is identical to the aforementioned first gas equalization component 160, and can be directly referred to as the first gas equalization component 160; therefore, it will not be described in detail again here.

[0098] exist Figure 1In the embodiment shown, the second compartment 300 is detachably fitted into the second mounting notch 150 and has an openable and closable second inlet and outlet, and is provided with a second connecting portion extending outside the cover 100; wherein, the second compartment 300 is used to remove the tested chip in a state of being detached from the second mounting notch 150.

[0099] Specifically, after the testing process is completed, the user can pull the second compartment 300 out of the second mounting notch 150 as a whole, open its second inlet and outlet, and remove the tested chip inside for subsequent sorting, packaging, or rework operations. When the second compartment 300 is fitted back into the second mounting notch 150, its second inlet and outlet can be sealed closed, and the second connecting part is used to interface with the third temperature control device 600 to perform post-processing such as cooling, inert gas protection, or environmental isolation on the tested chip when necessary.

[0100] After high-temperature testing, the chip temperature may reach over 125°C. Direct exposure to room temperature not only poses a risk of burns or damage to handling equipment, but also may cause structural damage such as package cracking and solder joint breakage due to thermal stress caused by sudden cooling. On the other hand, if the high-temperature chip comes into contact with humid air during the cooling process, moisture can easily condense on the surface or pins, leading to oxidation and corrosion. Therefore, controlled cooling in a dry or inert gas environment is often necessary. Thus, to prevent damage to the chip from suddenly moving it from the testing environment to room temperature, a third temperature control device 600 is included in the temperature control system, connected to the second connecting part, to control the temperature of the second chamber 300, performing heat preservation / cooling treatment on the chip before unloading after testing.

[0101] exist Figure 2 In the illustrated embodiment, the temperature control device further includes a third gas equalizer 310, which is disposed within the second chamber 300 and covers the second connecting portion, for uniformly distributing the gas output by the third temperature control device 600. The third gas equalizer 310 is identical to the aforementioned first gas equalizer 160, and can be directly referred to as the first gas equalizer 160, and will not be described in detail here.

[0102] Overall, the parallel configuration of the first compartment 200 and the second compartment 300 improves the chip replacement rate. During actual testing, when the first compartment 200 is removed to load a new batch of chips, the second compartment 300 can simultaneously perform post-processing operations such as cooling, heat preservation, or inert atmosphere protection on the chips that have already been tested; and vice versa. This dual-compartment alternating operation mechanism avoids the waiting mode of testing-cooling-reloading found in traditional single-compartment testing systems. That is, there is no need to stop the system and wait for the chips to cool to a safe temperature after each batch of chips is tested before unloading and loading new chips.

[0103] Because a first compartment 200 and a second compartment 300 are set up, the chip needs to be transferred in an orderly manner between the first compartment 200, the test station 810, and the second compartment 300: that is, the chip under test needs to be transferred from the first compartment 200 to the test station 810 for testing, and the chip after testing needs to be transferred from the test station 810 to the second compartment 300 for temporary storage or further processing. To achieve this automated transfer process, in Figure 1 In the illustrated embodiment, the conveying device 700 is provided. The conveying device 700 is responsible for the precise picking, placing, and transporting of chips between different workstations, thereby ensuring that the entire testing process is continuous, stable, and requires no manual intervention.

[0104] Specifically, the operating device is located in the housing 100 and has an execution unit 740 located inside the housing 100 for picking up / placing chips, for transporting chips between the first compartment 200, the test bench 810, and the second compartment 300.

[0105] Specifically, the conveying device 700 is entirely mounted on the housing 100, with some of its structure fixed inside the housing 100 or partially embedded in the side wall of the housing 100. Therefore, the entire conveying device 700 is made of high-temperature resistant material, and in order to adapt to low-temperature testing environments, the conveying device 700 is also suitable for low-temperature environments. The conveying device 700 is provided with an actuator 740 (e.g., a multi-axis robotic arm, a lifting and placing head, or a vacuum nozzle assembly) located inside the housing 100. The actuator 740 can be driven to move in the horizontal and / or vertical directions, thereby efficiently and reliably transferring chips between the first chamber 200, the test table 810, and the second chamber 300.

[0106] In the workflow, after the first compartment 200 has completed preheating or precooling and is properly fitted, the actuator 740 extends into the first compartment 200, picks up the chip under test from the protrusion on the storage platform, and transfers it to the test bench 810 for testing. After the test is completed, the actuator 740 removes the chip from the test bench 810, transfers it, and places it on the corresponding platform inside the already positioned second compartment 300. The entire transportation process is completed in the sealed environment of the enclosure 100, avoiding interference from external temperature, humidity, dust, etc.

[0107] Furthermore, in order to facilitate the execution unit 740 in picking up / placing the chip, a protrusion for holding the chip is also provided on the test stage 810.

[0108] In a preferred embodiment of this disclosure, the execution unit 740 is further provided with at least one positioning sensor for positioning the chip to determine the position where the execution unit 740 can pick up / place the chip.

[0109] Specifically, the positioning sensor can be at least one of an optical sensor, a vision camera, an infrared photocell, or a contact probe, and all of these are made of high-temperature resistant materials or are encapsulated in high-temperature resistant materials. It is positioned near the pick-and-place end of the actuator 740 to position the target chip before performing the pick-and-place operation. By collecting feedback signals from the chip edge, protrusions, or marker points, the positioning sensor can determine whether the chip is in the preset pick-and-place position and fine-tune the movement trajectory of the actuator 740 to ensure accurate alignment and reliable chip gripping or placement.

[0110] Figure 4 This describes the process by which the drive device 720 picks up a chip and places it on the test bench 810 in one embodiment of this disclosure.

[0111] exist Figure 1 as well as Figure 4 In the embodiment shown, the transport device 700 includes a moving track 710 and a drive device 720.

[0112] The moving track 710 is provided in the accommodating space 120, and the picking member 730 with the execution part 740 can move closer to or away from the first compartment 200 and the second compartment 300 along the moving track 710; the execution part 740 is provided at the end of the picking member 730.

[0113] exist Figure 1 In the illustrated embodiment, the moving track 710 is disposed within the accommodating space 120 inside the housing 100, and has an overall mesh structure, consisting of a horizontal track and multiple vertical tracks intersecting and connecting each other. (This application only illustrates one structure; in other embodiments, the moving track 710 can also be configured according to actual needs, as long as it can meet the requirements for chip placement and removal between the first compartment 200, the test platform 810, and the second compartment 300.)

[0114] The pick-up component 730 is slidably mounted on the moving track 710 and can reciprocate horizontally between the first compartment 200, the test platform 810 and the second compartment 300 to realize the lateral movement of the chip; at the same time, the pick-up component 730 can also move up and down along multiple vertical tracks corresponding to the positions of the first compartment 200 or the second compartment 300, thereby matching the chip storage platform at different heights in each compartment.

[0115] The actuator 740 is located at the end of the pick-up component 730 and is used to directly contact and pick up / place the chip. During operation, the control system drives the pick-up component 730 to move along the mesh track according to the location of the target chip (such as the third platform of the first compartment 200 or the first platform of the second compartment 300)—first moving horizontally to the front of the target compartment, then vertically rising and falling to the corresponding platform height, and finally the actuator 740 completes the chip picking or placing action.

[0116] In some embodiments, the grasping member 730 may be implemented as a structure similar to a robotic hand, such as a multi-joint robotic arm or an end effector with biomimetic grasping function.

[0117] Optionally, the actuator 740 is implemented as at least one of the following: a suction cup or a claw.

[0118] Specifically, when the actuator 740 is implemented as a suction cup, it is connected to a vacuum generator and grips the chip by adsorbing its upper surface through negative pressure. The suction cup is suitable for package types with flat, unobstructed surfaces, and can effectively avoid pin deformation or surface damage caused by clamping.

[0119] When the actuator 740 is implemented as a claw, it is generally located on both sides or below the bottom of the chip, and lifts the chip as a whole by lifting the bottom of the chip upward.

[0120] exist Figure 4 In the illustrated embodiment, when the picking member 730 approaches the first compartment 200 and reaches the picking position, the driving device 720 enables the execution unit 740 to be in a suitable first posture for entering the first compartment 200 and to take out the chip from the first compartment 200.

[0121] Specifically, when the retrieval component 730 travels along the moving track 710 to a retrieval position adjacent to the first compartment 200, the drive device 720, through multi-axis coordinated control, adjusts the actuator 740 to a first posture adapted to the internal structure of the first compartment 200. This first posture includes: horizontally aligning the actuator 740 with the chip storage platform where the target chip is located; vertically lowering it to a height level with or slightly below the raised support point of the platform; and adjusting the pitch or rotation angle of the actuator 740 as needed to ensure it can smoothly extend into the first compartment 200 without interfering with the compartment wall or adjacent chips.

[0122] Subsequently, the actuator 740 (e.g., a suction cup or a claw) contacts the chip in this posture—if it is a suction cup, it activates a vacuum to adsorb the upper surface of the chip; if it is a claw, it lifts the chip upward from the bottom sides or the gaps between the positioning protrusions. After confirming stable gripping, the drive device 720 drives the pick-up component 730 to exit the first compartment 200 along the original path, and then moves it along the horizontal track to the test station 810. During this process, the actuator 740 can simultaneously adjust to a second posture suitable for placement, ultimately placing the chip accurately and stably on the test station of the test station 810.

[0123] Figure 5 This describes the process by which the drive device 720 picks up a chip from the test stand 810 in one embodiment of this disclosure.

[0124] When the pick-up member 730 reaches the placement position, the drive device 720 enables the actuator 740 to be in a second posture of placing or picking up the chip, and places the chip on the test stage 810, or removes the chip from the test stage 810.

[0125] Specifically, in Figure 5 In the illustrated embodiment, when the pick-up component 730 moves along the moving track 710 to the chip pick-up / placement station, the drive device 720 controls the execution unit 740 to adjust to the corresponding second posture according to the current operating mode (picking up). In the case of picking up a chip, the execution unit 740 first approaches the tested chip in the second posture, adsorbs its upper surface with a suction cup or lifts it from the bottom with a claw, and after confirming a firm grip, vertically lifts it away from the test socket. Then, the drive device 720 drives the pick-up component 730 to leave the test area, preparing to transfer it to the second compartment 300.

[0126] In some alternative embodiments, when the pick-up unit 730 places the chip, the actuator 740 carries the chip and slowly descends in a second posture to ensure that the chip pins or solder balls fall accurately onto the test stage 810, and then releases the chip (e.g., by closing the vacuum or retracting the claws) to complete the placement.

[0127] Figure 6 This describes the process of storing chips in the drive device 720 in one embodiment of the present disclosure.

[0128] When the picking member 730 approaches the second compartment 300 and reaches the insertion position, the driving device 720 enables the execution unit 740 to be in a suitable third posture for entering the second compartment 300 and places the chip into the second compartment 300.

[0129] exist Figure 6 In the illustrated embodiment, when the picking member 730 moves along the moving track 710 to the delivery position adjacent to the second compartment 300, the driving device 720 controls the execution unit 740 to adjust to a suitable third posture according to the position of the target storage platform in the second compartment 300 corresponding to the chip. The third posture includes: aligning with the second entrance / exit of the second compartment 300 and the target chip storage platform in the horizontal direction, lowering to a position consistent with the height of the target chip storage platform in the vertical direction, and finely adjusting the pitch angle, rotation angle, or opening / closing state according to the chip size and the type of execution unit 740 (such as a suction cup or claw) to ensure that the execution unit 740 can smoothly extend into the second compartment 300 without touching the compartment wall or other stored chips.

[0130] Subsequently, the actuator 740, carrying the tested chip, smoothly enters the second compartment 300 in a third orientation and accurately places the chip on the positioning protrusion of the designated storage platform. After placement, the actuator 740 releases the chip (e.g., by disabling vacuum suction or retracting the gripper) and slowly exits the second compartment 300.

[0131] In order to achieve controllable temperature within the test chamber, the first chamber 200, and the second chamber 300, the temperature control system also includes multiple temperature detection sensors, which are respectively installed within the test chamber, the first chamber 200, and the second chamber 300, to detect the temperature within the chamber and generate alarm information based on the detected temperature to notify the outside.

[0132] Specifically, the temperature sensors are also made of high-temperature resistant materials to monitor the temperature status of various areas in real time, such as the ambient temperature of the chip test environment in the test chamber, the preheating / precooling temperature of the chip under test in the first chamber 200, and the heat preservation or cooling temperature of the tested chip in the second chamber 300. When any temperature sensor detects that the temperature exceeds the preset safety threshold (such as abnormal conditions such as excessively rapid heating, cooling failure, or local overheating), the temperature control system will immediately generate an alarm message and send an alarm to external operators or the host computer through audible and visual prompts, human-machine interface pop-ups, or remote communication interfaces, prompting intervention or shutdown for inspection, thereby preventing the chip from being damaged due to temperature runaway.

[0133] Figure 7 This is a schematic diagram of the overall process of the packaging and testing method in one embodiment of the present disclosure.

[0134] exist Figure 7 The packaging test method includes:

[0135] Step S101: Place the chip to be tested into the first chamber 200 and seal the first chamber 200 into the first mounting notch 140.

[0136] Specifically, the operator or automated loading equipment first removes the first chamber 200 from the first mounting notch 140 of the cover 100 (or uses a pre-installed spare first chamber 200). With the first chamber 200 open, multiple chips to be tested are stacked in a predetermined order on multiple storage platforms inside the chamber, either manually or mechanically. Each chip is positioned on a raised structure on the platform to ensure stable positioning and facilitate subsequent handling. After the chips are loaded, the first inlet / outlet is closed. Then, the entire first chamber 200 is aligned with the first mounting notch 140 on the cover 100 and pushed in along the fitting direction until it is completely fitted and airtightly connected to the cover 100.

[0137] Step S102: The temperature inside the first chamber 200 is controlled by the second temperature control device 500 to perform pre-cooling or preheating treatment on the chip to be tested.

[0138] Specifically, after the first chamber 200 is sealed and fitted into the first mounting notch 140, the second temperature control device 500 is activated. Through a pipe connected to the first connecting portion on the first chamber 200, a temperature-regulating gas (such as heated dry air, cooled inert gas, or constant-temperature nitrogen) is introduced into the chamber. After entering the first chamber 200, the temperature-regulating gas is evenly distributed via a second gas-distributing element 210 located inside the connecting portion, preventing direct airflow from blowing directly onto the chip and causing displacement or localized temperature differences. This ensures that all storage platforms and the chips within the chamber are in a consistent and stable temperature environment.

[0139] Step S103: The pre-processed chip is transferred to the test stage 810 by the transport device 700, and the temperature inside the test chamber is controlled by the first temperature control device 400 to perform packaging test on the chip.

[0140] Specifically, after the chip in the first compartment 200 has completed pre-cooling or pre-heating and reached the target temperature, the picking component 730 of the conveying device 700 moves along the moving track 710 to the front of the first compartment 200 and adjusts the execution unit 740 to a suitable first posture, picking up a single chip from the target chip storage platform using a suction cup or claw; subsequently, the picking component 730 exits the first compartment 200 and moves smoothly along the horizontal track to the test stage 810. At the same time, the first temperature control device 400 has been activated in advance to adjust the temperature of the test chamber inside the cover 100 for packaging testing.

[0141] Step S105: The chip after testing is transferred to the second chamber 300 by the transport device 700. After sealing the second chamber 300, the temperature inside the second chamber 300 is controlled by the third temperature control device 600 to perform heat preservation or cooling treatment on the chip.

[0142] Specifically, after the chip completes all packaging tests on the test bench 810, the pick-up part 730 of the transport device 700 moves along the moving track 710 to above the test bench 810, and the execution part 740 adjusts to the appropriate second posture. The tested chip is then smoothly removed from the test platform by suction cup adsorption or claw lifting, avoiding damage to the pins.

[0143] Subsequently, the pick-up unit 730, carrying the chip, moves along a preset path to the location of the second compartment 300. At this time, the second compartment 300 is pre-fitted into the second mounting notch 150 of the cover 100, and its second inlet / outlet is open. The actuator 740 extends into the second compartment 300 in a suitable third posture, precisely placing the chip onto the positioning protrusion of the target chip storage platform. If multiple chips need to be stored consecutively, the transport device 700 can move sequentially to platforms of different heights to achieve layered and orderly placement.

[0144] After all chips have been placed, the second inlet and outlet of the second chamber 300 automatically closes and seals. Immediately, the third temperature control device 600 activates, introducing temperature-regulating gas into the chamber through a pipe connected to the second connecting portion on the second chamber 300. The gas diffuses evenly through a uniform gas distribution structure within the chamber, allowing the chips to undergo controlled cooling (e.g., programmed cooling from 125°C to below 60°C to ensure safe removal) or insulation treatment. This effectively prevents thermal shock, moisture condensation, or material degradation, ensuring safe disassembly and chip transfer in the future.

[0145] Step S106: After the chip has completed the heat preservation or cooling process, the second chamber 300 is removed from the cover 100, and the chip after the test is completed is taken out.

[0146] Specifically, when the temperature detection sensor inside the second compartment 300 confirms that the chip has completed the preset heat preservation or cooling process (e.g., the temperature has stabilized and dropped below the safe operating threshold, or the heat preservation time has reached the process requirements), the operator or automated robotic arm will then pull out the second compartment 300.

[0147] like Figure 8 The diagram shown illustrates the structure of a computer device according to an embodiment of the present disclosure.

[0148] The computer device 1000 may be exemplified as a processing terminal, such as a server, desktop computer, laptop computer, tablet computer, smartphone, or other terminal.

[0149] The computer device 1000 includes a bus 1010, a processor 1020, and a memory 1030. The processor 1020 and the memory 1030 can communicate via the bus 1010. The memory 1030 can store program instructions. The processor 1020 implements the steps in the packaging test method in the previous embodiment by running the program instructions in the memory 1030, for example... Figure 1 or Figure 4 .

[0150] Bus 1010 can be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. Buses can be categorized as address buses, data buses, control buses, etc. For ease of representation, although only one thick line is used in the diagram, this does not indicate that there is only one bus or one type of bus.

[0151] In some embodiments, the processor 1020 may be implemented as a central processing unit (CPU), a microprocessor unit (MCU), a system-on-chip (System-on-Chip), or a field-programmable array (FPGA). The memory 1030 may include volatile memory for temporary data storage during program execution, such as random access memory (RAM).

[0152] The memory 1030 may also include non-volatile memory for data storage, such as read-only memory (ROM), flash memory, hard disk drive (HDD), or solid-state disk (SSD).

[0153] In some embodiments, the computer device 1000 may further include a communicator 1040. The communicator 1040 is used for communication with external devices. In specific examples, the communicator 1040 may include one or more wired and / or wireless communication circuit modules. For example, the communicator 1040 may include one or more of, such as a wired network card, a USB module, a serial interface module, etc. The wireless communication protocols followed by the wireless communication module include, for example, Nearfield communication (NFC) technology, Infrared (IR) technology, Global System for Mobile Communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Time-Division Code Division Multiple Access (TD-SCDMA), Long Term Evolution (LTE), Bluetooth (BT), Global Navigation Satellite System (GNSS), etc.

[0154] This disclosure also provides a computer-readable storage medium storing program instructions that, when run, implement the encapsulation and testing method of any of the previous embodiments.

[0155] That is, the method steps in the above embodiments are implemented as software or computer code that can be stored in a recording medium (such as CD ROM, RAM, floppy disk, hard disk or magneto-optical disk), or implemented as computer code that is originally stored in a remote recording medium or a non-transitory machine-readable medium and will be stored in a local recording medium after being downloaded via a network, so that the method represented herein can be stored in such software processing on a recording medium using a general-purpose computer, a special processor or programmable or special hardware (such as ASIC or FPGA).

[0156] The above embodiments are merely illustrative of the principles and effects of this disclosure and are not intended to limit this disclosure. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this disclosure. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this disclosure should still be covered by the protection scope of this disclosure.

Claims

1. A temperature control system for packaging and testing, characterized in that, include: The cover includes a bottom opening, a receiving space communicating with the bottom opening, a first mounting part disposed on the cover and communicating with the receiving space, a first mounting notch and a second mounting notch; The bottom opening of the cover is for a sealed connection with the testing machine, so that the testing table of the testing machine is included in the receiving space to form a testing cavity constructed based on the receiving space. A first compartment is detachably fitted into the first mounting notch and has an openable and closable first inlet and outlet, and is provided with a first connecting portion extending out of the cover; wherein, the first compartment is used to insert the chip to be tested when detached from the first mounting notch; The second compartment is detachably fitted into the second mounting notch and has an openable and closable second inlet and outlet, and is provided with a second connecting portion extending out of the cover; wherein, the second compartment is used to remove the chip after testing when it is detached from the second mounting notch; A first temperature control device is disposed in the first mounting part and connected to the accommodating space, and is used to control the temperature of the test chamber; The second temperature control device is connected to the first connecting part and is used to control the temperature of the first chamber to perform pre-cooling or preheating treatment on the chip to be tested. The third temperature control device is connected to the second connecting part and is used to control the temperature of the second chamber to perform heat preservation / cooling treatment on the tested chips before they are discharged. At least one transport device is disposed in the housing and has an execution unit located inside the housing for picking up / placing chips, for transporting chips between the first compartment, the test bench, and the second compartment.

2. The temperature control system according to claim 1, characterized in that, The conveying device includes: A moving track is provided in the receiving space, and a picking member equipped with the actuator can move closer to or further away from the first compartment and the second compartment along the moving track; the actuator is located at the end of the picking member; A driving device, disposed on the moving track and connected to the picking member, is configured to drive the picking member to move along the moving track, so that the chip moves between a picking position, a placement position and a feeding position on a movement path; When the picking component approaches the first compartment and reaches the picking position, the driving device enables the actuator to be in a suitable first posture for entering the first compartment and to take out the chip from the first compartment. When the pick-up component reaches the placement position, the drive device can cause the actuator to be in a second posture of placing or picking up the chip, and place the chip on the test table, or remove the chip from the test table; When the picking component approaches the second compartment and reaches the insertion position, the driving device enables the actuator to be in a suitable third posture for entering the second compartment and places the chip into the second compartment.

3. The temperature control system according to claim 1, characterized in that, The actuator is also provided with at least one positioning sensor for locating the chip to determine the position where the actuator can pick up / place the chip; And / or, the actuator is implemented as at least one of the following: a suction cup, a claw.

4. The temperature control system according to claim 1, characterized in that, The first temperature control device controls the temperature inside the test chamber by inputting high-temperature or low-temperature gas into the test chamber; The temperature control system further includes a sealing assembly, which comprises: A sealing element is provided at the bottom opening for connecting the testing machine, so that a sealed connection is formed between the bottom opening and the testing machine; A pressure sensor is installed in the accommodating space to detect the internal pressure of the accommodating space; An airtight controller is communicatively connected to the first temperature control device and the air pressure sensor. It is used to acquire the airflow of the first temperature control device and the internal air pressure, and generate a warning message to reflect the airtightness of the test chamber based on the difference between the two.

5. The temperature control system according to claim 1, characterized in that, It also includes multiple temperature detection sensors, which are respectively installed in the test chamber, the first chamber, and the second chamber, to detect the temperature inside the chamber and generate alarm information based on the detected temperature to notify the outside.

6. The temperature control system according to claim 1, characterized in that, The first temperature control device, and / or the second temperature control device, and / or the third temperature control device, includes at least one of the following: a heat flow meter, a compressed air gun, and a liquid-cooled heat exchanger.

7. The temperature control system according to claim 1, characterized in that, It also includes a first gas equalizer, disposed within the accommodating space and covering the first mounting portion, for uniformly distributing the gas output from the first temperature control device; and / or, A second gas equalizer, disposed within the first chamber and covering the first connecting portion, is used to evenly distribute the gas output by the second temperature control device; and / or, The third gas equalizer is disposed in the second chamber and covers the second connecting part, and is used to even out the gas output by the third temperature control device.

8. A packaging testing method, characterized in that, The temperature control system according to any one of claims 1-7 is applied; the packaging test method includes: The chip to be tested is placed into the first chamber, and the first chamber is sealed and fitted into the first mounting notch; The temperature inside the first chamber is controlled by a second temperature control device to perform pre-cooling or preheating treatment on the chip to be tested. The pre-processed chip is transferred to the test station by a conveying device, and the temperature inside the test chamber is controlled by a first temperature control device to perform packaging test on the chip. The tested chip is transferred to the second chamber by the transport device. After the second chamber is sealed, the temperature inside the second chamber is controlled by the third temperature control device to perform heat preservation or cooling treatment on the chip. After the chip has completed the heat preservation or cooling process, the second chamber is removed from the cover, and the chip after the test is completed is taken out.

9. A computer device, characterized in that, include: Processor and memory; The memory stores program instructions; The processor is configured to run the program instructions to perform the packaging test method as described in claim 8.

10. A computer-readable storage medium, characterized in that, The system stores program instructions that are executed to perform the packaging test method as described in claim 8.

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