Head-mounted device

Abstract

The invention provides a head-mounted device which comprises a device body and glasses legs arranged on the two sides of the device body respectively, the glasses legs are connected with the device body through elastic supports to achieve opening and closing of the glasses legs, and the glasses legs are electrically connected with the device body through a printed circuit board. The printed circuit board penetrates through the internal space of the elastic support. Therefore, the wearing requirements of users with different head forms are met, the larger-area fitting of the glasses and the heads of the different users is increased, the more comfortable and reliable wearing experience is provided for the users, and the problem that the service life is short due to the fact that the printed circuit board in the AR glasses is easily damaged due to the fact that wiring is conducted through the rotating shaft can be solved.

Description

Technical Field

[0001] This invention relates to the field of smart electronic products technology, and more specifically, to a head-mounted device. Background Technology

[0002] Currently, head-mounted devices such as smart glasses, AR headsets, and VR headsets are increasingly appearing in daily life. Many existing head-mounted devices mainly consist of a main body and temples installed on the left and right sides of the main body, which are worn on the user's head.

[0003] Taking AR glasses as an example, the frame and temples of AR glasses need to be electrically connected for signal transmission. Currently, this is generally achieved by combining printed circuit boards and hinges. However, due to the winding path and complex channels of this wiring method, the printed circuit board is easily damaged during the wiring process, thereby reducing the service life of the printed circuit board.

[0004] In order to solve the above problems, the present invention urgently needs to provide a new head-mounted device. Summary of the Invention

[0005] In view of the above problems, the purpose of this invention is to provide a head-mounted device to solve the problem of short service life of printed circuit boards in traditional head-mounted devices due to easy damage caused by the routing of traces through the hinge.

[0006] The present invention provides a head-mounted device, comprising: a device body and temples respectively disposed on both sides of the device body, the temples being connected to the device body via an elastic bracket to realize the opening and closing of the temples, the temples being electrically connected to the device body via a printed circuit board, the printed circuit board being penetrating the internal space of the elastic bracket.

[0007] Furthermore, in a preferred configuration, fixed supports are provided at both ends of the elastic support, the printed circuit board passes through the fixed supports, and is fixed to the fixed supports by positioning posts; wherein,

[0008] The printed circuit board located in the elastic bracket moves elastically with the elastic bracket.

[0009] Furthermore, a preferred structure is that the printed circuit board is a flexible circuit board, and the length of the printed circuit board is greater than the length of the elastic support.

[0010] Furthermore, in a preferred configuration, the elastic support rotates at an angle when subjected to an external force, and when the elastic support rotates to its maximum angle, the length of the elastic support is A1.

[0011] When the external force disappears, the elastic support resets, and the length of the reset elastic support is A0.

[0012] The length of the printed circuit board is greater than A1.

[0013] In addition, a preferred structure is to provide a sealing ring on the outer periphery of the fixed bracket, the sealing ring being used to seal the gaps between the elastic bracket and the device body and the temple respectively.

[0014] Furthermore, a preferred structure is that a heat sink is provided on the printed circuit board, and double-sided adhesive is provided on one side of the heat sink. The heat sink is bonded to the printed circuit board by the double-sided adhesive and passes through the fixed bracket and the elastic bracket along with the printed circuit board.

[0015] Furthermore, a preferred structure is that the elastic support includes a spring and a soft rubber covering the outer periphery of the spring, wherein the spring and the soft rubber are injection molded as a single unit.

[0016] Furthermore, a preferred configuration is that the spring is a helical structure, with a helical gap between the helical structures.

[0017] When the temple is subjected to an external force, the temple rotates by a preset angle along the direction of the force under the action of the helical gap.

[0018] Furthermore, a preferred structure is that connecting ends are provided at both ends of the spring, and the connecting ends are connected to the device body and the temple of the mirror.

[0019] Furthermore, a preferred configuration is that the connecting end is connected to the device body or the temple of the mirror via screws or glue; or,

[0020] A plastic part is embedded in the connecting end, and the connecting end is injection molded to the main body of the device or the temple of the mirror through the plastic part.

[0021] As can be seen from the above technical solution, the head-mounted device provided by this invention connects the main body of the device to the temples via an elastic bracket. The elastic bracket is used to adjust the angle of the temples to achieve opening and closing. When the user wears the glasses, the elastic bracket can flip outward or upward at a certain angle according to the actual size of the user's head, adjusting the angle of the temple rotation, thereby meeting the wearing needs of users with different head shapes and providing a more comfortable and reliable wearing experience; while maintaining the same wearing comfort, it allows the glasses to have more functions. In addition, the temples and the main body of the device are electrically connected via a printed circuit board, which runs through the internal space of the elastic bracket and moves elastically with the elastic bracket, thereby solving the problem of short service life of printed circuit boards in existing AR glasses due to easy damage caused by wiring through the hinge.

[0022] To achieve the foregoing and related objectives, one or more aspects of the invention include the features that will be described in detail below. The following description and accompanying drawings illustrate certain exemplary aspects of the invention. However, these aspects indicate only a few of the various ways in which the principles of the invention can be used. Furthermore, the invention is intended to encompass all such aspects and their equivalents. Attached Figure Description

[0023] Other objects and results of the invention will become more apparent and readily understood with reference to the following description taken in conjunction with the accompanying drawings. In the drawings:

[0024] Figure 1 This is a schematic diagram of the overall structure of the head-mounted device according to an embodiment of the present invention;

[0025] Figure 2 This is an exploded view of a head-mounted device according to an embodiment of the present invention;

[0026] Figure 3 This is a schematic diagram of an explosion of an elastic support according to an embodiment of the present invention;

[0027] Figure 4 This is a schematic diagram of the three-dimensional structure of the elastic support according to an embodiment of the present invention;

[0028] Figure 5 This is a schematic cross-sectional view of an elastic support according to an embodiment of the present invention;

[0029] Figure 6 This is a schematic cross-sectional view of a printed circuit board penetrating an elastic support according to an embodiment of the present invention.

[0030] Figure 7 This is a schematic diagram of a head-mounted device flipped outwards according to an embodiment of the present invention;

[0031] Figure 8 This is a schematic diagram of a head-mounted device flipping up according to an embodiment of the present invention.

[0032] The reference numerals in the figures include:

[0033] 1. Main body of the device; 2. First elastic bracket; 3. First temple; 5. Second temple; 6. Second elastic bracket; 7. Nose pad; 21. Spring; 22. Soft rubber; 211. First connecting end; 212. Second connecting end; 10. Printed circuit board; 11. Heat sink; 81. First fixed bracket; 82. Second fixed bracket; 91. First sealing ring; 92. Second sealing ring.

[0034] In all the accompanying drawings, the same reference numerals indicate similar or corresponding features or functions. Detailed Implementation

[0035] In the following description, numerous specific details are set forth for illustrative purposes and to provide a thorough understanding of one or more embodiments. However, it will be apparent that these embodiments may also be implemented without these specific details. In other instances, well-known structures and devices are shown in block diagram form for ease of description of one or more embodiments.

[0036] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0037] In response to the aforementioned problem of short lifespan due to damage to printed circuit boards in traditional head-mounted devices caused by routing traces through a hinge, this invention proposes a head-mounted device.

[0038] The specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0039] To illustrate the structure of the head-mounted device provided by the present invention, Figures 1 to 8 The structure of the head-mounted device is illustrated by way of example from different angles. Specifically, Figure 1 The overall structure of the head-mounted device according to an embodiment of the present invention is shown; Figure 2 An exploded structure of a head-mounted device according to an embodiment of the present invention is shown; Figure 3 An explosive structure of an elastic support according to an embodiment of the present invention is shown; Figure 4 A three-dimensional structure of an elastic support according to an embodiment of the present invention is shown; Figure 5 A cross-sectional structure of an elastic support according to an embodiment of the present invention is shown; Figure 6 A cross-sectional structure of a printed circuit board penetrating a flexible support according to an embodiment of the present invention is shown; Figure 7 An outward-folding structure of a head-mounted device according to an embodiment of the present invention is shown; Figure 8 A head-mounted device flip-up structure according to an embodiment of the present invention is shown.

[0040] like Figures 1 to 8As shown in the figure, the head-mounted device provided by the present invention includes: a device body 1, a nose pad 7 disposed in the middle part of the device body 1, and temples respectively disposed on the left and right sides of the device body 1. The temples are connected to the device body 1 through an elastic bracket to realize the opening and closing of the temples. The temples are electrically connected to the device body through a printed circuit board 10, and the printed circuit board 10 passes through the internal space of the elastic bracket.

[0041] In this invention, the main body 1 of the device has a symmetrical structure on both sides. The left and right temples located on both sides of the main body 1 are respectively referred to as the first temple and the second temple, and the left and right temples correspond to the first temple 3 or the second temple 5, respectively, without limitation. The first temple 3 is connected to the main body 1 of the device through a first elastic bracket 2, and the second temple 5 is connected to the main body 1 of the device through a second elastic bracket 6. Each elastic bracket adjusts the angle of the connected temple. Due to the elastic structure of the elastic bracket, the temple can be adjusted not only left and right but also up and down to meet the needs of the user's head. That is, when the temple is subjected to external force, the elastic bracket supports the corresponding temple to rotate a certain angle in four directions (inward or outward, upward or downward), so that the temple can adapt to users with different head widths and head shapes, while increasing the contact area between the temple and the head, improving the stability and comfort when wearing it; when the external force is removed, the temple will automatically return to its original position under the action of the elastic bracket.

[0042] exist Figure 3 , Figure 4 and Figure 5 In the illustrated embodiment, the elastic support includes a spring 21 and a soft rubber 22 surrounding the spring 21. The spring 21 and the soft rubber 22 are injection molded as a single unit. Connecting ends for connection to the device body 1 and the temple are respectively provided at both ends of the spring 21. These connecting ends are not injection molded to the soft rubber 22. The two ends of the spring 21 are a first connecting end 211 and a first connecting end 212. The first connecting end 211 is connected to the device body 1, and the first connecting end 212 is connected to the corresponding temple.

[0043] It should be noted that during the injection molding of spring 21 and soft rubber 22, the first connecting ends 211 and 212 are not injection molded together with the soft rubber 22. The first connecting end 211 can be connected to the main body 1 of the device using glue and screws, and the first connecting end 212 can be connected to the corresponding temple using glue and screws. Alternatively, injection molded parts can be provided on both the first connecting ends 211 and 212. The first connecting end 211 is injection molded to the main body 1 through the injection molded part, and the first connecting end 212 is injection molded to the corresponding temple through the injection molded part. In specific applications, depending on the actual situation, appropriate connection methods can be selected to connect the connecting ends to the main body 1 and the corresponding temple respectively, and it is not limited to a specific method.

[0044] exist Figure 5 In the illustrated embodiment, spring 21 has a helical structure with a helical gap C1 between the helical structures. When the temple is subjected to an external force, the temple rotates by a preset angle along the direction of the force under the action of the helical gap. The helical gap C1 supports the temple's rotation in four directions (inward or outward, upward or downward). The spring diameter C2 determines the magnitude of the spring force of spring 21. The overall shape of spring 21 controls the difference in the magnitude of the spring force in the four directions. The inner diameter C3 formed by the spring accommodates the seam between the temple and the frame.

[0045] Spring 21 is made of metal, such as steel, stainless steel, titanium alloy, high-carbon steel, or high-strength steel. The appropriate material can be selected for the specific application. Soft rubber 22 can be made of silicone, liquid silicone, fluororubber, TPE, TPU, TPSIV, or other soft rubber materials. Spring 21 is injection molded to soft rubber 22 using inserts, such as… Figure 4 As shown, the elastic part of the spring 21 is completely embedded in the soft rubber 22. When the spring 21 deforms, it will pull the soft rubber 22 to deform together, thus completing the adjustment of the temple angle.

[0046] exist Figure 6 In the illustrated embodiment, a first fixed bracket 81 and a second fixed bracket 82 are respectively provided at both ends of each elastic bracket. The printed circuit board 10 passes through the first fixed bracket 81, the elastic bracket, and the second fixed bracket 82. The printed circuit board 10 is fixed on the first fixed bracket 81 and the second fixed bracket 82 by positioning posts. That is, the printed circuit board 10 is fixed on the fixed brackets on both sides of the elastic bracket by positioning posts at both ends of the elastic bracket. The printed circuit board 10 passing through the elastic bracket moves elastically with the elastic bracket. In other words, the printed circuit board 10 located in the elastic bracket is in a free movement state and is not fixed inside the elastic bracket.

[0047] In this embodiment, the printed circuit board 10 is a flexible circuit board, and the length of the printed circuit board 10 is greater than the length of the elastic support. When the elastic support is subjected to an external force, it rotates by an angle. When the elastic support rotates to its maximum angle, the length of the elastic support is A1. When the external force disappears, the elastic support resets, and the length of the reset elastic support is A0. The length of the printed circuit board 10 is greater than A1. Only when the length of the printed circuit board 10 is greater than A1 can the printed circuit board 10 move together with the elastic support.

[0048] like Figure 6 As shown, the elastic support area is the deformation area of ​​the printed circuit board 10. The printed circuit board 10 moves elastically within this area, following the elastic support; therefore, the printed circuit board 10 is not fixed to the elastic support. The first fixed support 81 and the second fixed support 82 areas are fixed areas, where the printed circuit board 10 is fixed. In this embodiment, the printed circuit board extends through the internal space of the elastic support, moving elastically with the elastic support, thereby solving the problem of short service life of printed circuit boards in existing AR glasses due to easy damage caused by wiring through the hinge.

[0049] like Figure 6 As shown, a sealing ring is provided on the outer periphery of each fixed bracket. A first sealing ring 91 is provided on the outer periphery of the first fixed bracket 81, and a second sealing ring 92 is provided on the outer periphery of the second fixed bracket 82. Each sealing ring is used to seal the gap between the corresponding elastic bracket and the device body 1 and the corresponding temple, respectively. The first sealing ring 91 is used to seal the gap between the first elastic bracket 2 and the device body 1 and the first temple 3, and the second sealing ring 92 is used to seal the gap between the second elastic bracket 6 and the second temple 5.

[0050] like Figure 6 As shown, a heat sink 11 is provided on the printed circuit board 10. Double-sided adhesive is provided on one side of the heat sink 11. The heat sink 11 is bonded to the printed circuit board 10 by the double-sided adhesive and passes through the corresponding fixed bracket and the corresponding elastic bracket along with the printed circuit board 10. The heat sink is used to dissipate heat from the heat-generating components of the head-mounted device.

[0051] In an embodiment of the present invention, an elastic bracket is provided between the device body 1 and the temple, giving the temple two degrees of freedom: one degree of freedom is outward or inward rotation, and the other degree of freedom is upward or downward rotation. In other words, the elastic bracket allows the temple to deform in two free directions (four directions). When the temple is subjected to an external force, the temple rotates by a preset angle along the direction of the force under the action of the elastic bracket.

[0052] exist Figure 7In the illustrated embodiment, when a user wears the glasses, the flexible frame flips outward at a certain angle according to the actual size of the user's head, allowing the temples to fit snugly against the user's head. The outward angle D2 of the flexible frame can be designed as a large outward angle of 10-45 degrees as needed, thus well accommodating different head sizes D1, generally ranging from 136mm to 172mm. Furthermore, within this degree of freedom, it can also be flipped inward at a certain angle according to the user's head shape, satisfying the wearing comfort of users with different head shapes.

[0053] exist Figure 8 In the illustrated embodiment, because the flexible frame has another degree of freedom, when a user wears the glasses, the flexible frame will adjust the upward tilt angle D3 of the second temple according to different head shapes, generally from 0 to 30 degrees, thereby meeting the wearing needs of users with different head shapes. Furthermore, within this degree of freedom, it can also tilt downwards at a certain angle according to the user's head shape, thereby meeting the wearing comfort needs of users with different head shapes.

[0054] pass Figure 7 and Figure 8 The two degrees of freedom adjustment in the embodiment can increase the fit of the head-mounted device to a larger area of ​​different user head shapes, providing users with a more comfortable and reliable wearing experience; while maintaining the same wearing feel, it allows the glasses to have more functions (such as increasing weight).

[0055] The above description is merely an optional embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made under the concept of the present invention using the description and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A head-mounted device, comprising: The device body and the temples respectively disposed on both sides of the device body are characterized in that the temples are connected to the device body by an elastic bracket to realize the opening and closing of the temples, and the temples are electrically connected to the device body by a printed circuit board, the printed circuit board passing through the internal space of the elastic bracket.

2. The head-mounted device according to claim 1, characterized in that, Fixed brackets are respectively provided at both ends of the elastic bracket, and the printed circuit board passes through the fixed brackets and is fixed to the fixed brackets by positioning posts; wherein, The printed circuit board located in the elastic bracket moves elastically with the elastic bracket.

3. The head-mounted device according to claim 2, characterized in that, The printed circuit board is a flexible circuit board, and the length of the printed circuit board is greater than the length of the elastic support.

4. The head-mounted device according to claim 3, characterized in that, When the elastic support is subjected to an external force, it rotates by an angle. When the elastic support rotates to its maximum angle, the length of the elastic support is A1. When the external force disappears, the elastic support resets, and the length of the reset elastic support is A0. The length of the printed circuit board is greater than A1.

5. The head-mounted device according to claim 2, characterized in that, A sealing ring is provided on the outer periphery of the fixed bracket, which is used to seal the gaps between the elastic bracket and the device body and the temple of the mirror.

6. The head-mounted device according to claim 3, characterized in that, A heat sink is provided on the printed circuit board, and double-sided adhesive is provided on one side of the heat sink. The heat sink is bonded to the printed circuit board by the double-sided adhesive and passes through the fixed bracket and the elastic bracket along with the printed circuit board.

7. The head-mounted device according to claim 1, characterized in that, The elastic support includes a spring and a soft rubber covering the outer periphery of the spring, wherein the spring and the soft rubber are injection molded as a single structure.

8. The head-mounted device according to claim 7, characterized in that, The spring has a helical structure, with a helical gap between the helical components. When the temple is subjected to an external force, the temple rotates by a preset angle along the direction of the force under the action of the helical gap.

9. The head-mounted device according to claim 7, characterized in that, A connecting end is provided at each end of the spring, and the connecting end is connected to the main body of the device and the temple of the mirror, respectively.

10. The head-mounted device according to claim 7, characterized in that, The connecting end is connected to the device body or the temple of the mirror by screws or glue; or, A plastic part is embedded in the connecting end, and the connecting end is injection molded to the main body of the device or the temple of the mirror through the plastic part.

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