An integrated tile-composite integrated phased array antenna architecture

Abstract

The embodiment of the application provides a kind of integrated tile composite integrated phased array antenna architecture, it is related to the field of phased array antenna front-end equipment, the antenna includes: from top to bottom sequentially arranged mixed pressure antenna composite board, brick module, feed module, frequency conversion component, wave control motherboard and power component, mixed pressure antenna composite board is provided with tile type antenna array unit, vertical polarization transceiving link and horizontal polarization transceiving link are provided in brick module, low frequency band polarization transceiving link and high frequency band polarization transceiving link are provided in feed module.The technical scheme integrates brick module and surface-mounted tile module, solves the problem that existing single radio frequency module architecture cannot simultaneously meet the needs of miniaturization, high power, multi-function and other requirements, has higher application value of integrated degree.

Description

Technical Field

[0001] This application relates to the field of phased array antenna front-end equipment technology, and more specifically, to a phased array antenna that integrates brick-type modules and tile-type modules into a single unit. Background Technology

[0002] As phased array antenna radar / communication systems become increasingly powerful and support wider frequency bands, the performance requirements for radio frequency (RF) modules also rise. As an indispensable component, RF modules face increasingly diverse functional demands within limited space. For mid-to-long-range communication radar applications, high-frequency loss at the far end necessitates the use of high-power mid-to-low-frequency signals, while medium-power high-frequency signals are employed for precise positioning at the near and mid-range ends. RF modules often incorporate multiple complex functions, such as simultaneously supporting dual-band, dual-polarization, high-power, and transceiver modes. In traditional phased array antennas, the RF module is built using a single brick or tile structure. The brick-type RF module is laid out vertically along the antenna normal, which has the advantages of large power capacity and fast heat dissipation. However, the addition of multi-functional links in the module results in a large space size and weight. This means that the antenna channel spacing cannot be too small, the operating frequency band and antenna scanning angle range are limited, and the antenna part is independently molded. The RF module and the antenna are connected through RF connectors or RF cables, which increases the overall size and assembly difficulty. The tile-type RF module is laid out horizontally perpendicular to the antenna normal, which has the advantages of small space volume and light weight. The surface-mount tile structure also has the advantage of high integration of antenna multi-functionality. However, due to the difficulty of heat dissipation, the power capacity is generally not high.

[0003] In applications requiring high power and high density composite functions, choosing a single brick or tile architecture is no longer sufficient to meet the diverse mid-to-long-range application scenarios. Existing brick architecture modules use a single-sided RF composite multi-layer layout, resulting in a large space-consuming multi-functional link layout that struggles to achieve multi-band interference isolation. While a double-sided layout can effectively isolate two frequency bands of RF signals, it occupies space on the control sub-board and requires reserving space for high-power heat dissipation in the cavity structure, which is not conducive to antenna miniaturization applications. Existing tile architecture uses single-layer or double-layer cavity modules. Since antenna spacing primarily determines the RF layout space, with higher frequency bands requiring smaller spacing, it cannot meet the complex and diverse link layout requirements. Surface-mount tile architecture integrates the RF TR section and antenna onto a hybrid composite PCB board. The TR RF section requires packaged chips, but due to limitations in package size, process, and materials, heat dissipation is difficult, limiting the chip's maximum power to 1-2W, which is insufficient for high-power applications. Summary of the Invention

[0004] The embodiments of this application provide an integrated phased array antenna architecture that combines brick and tile components, in order to solve the problem that existing single radio frequency module architectures cannot simultaneously meet the requirements of miniaturization, high power, and multi-functionality.

[0005] Other features and advantages of this application will become apparent from the following detailed description, or may be learned in part from practice of this application.

[0006] According to a first aspect of the embodiments of this application, an integrated brick-and-tile composite phased array antenna architecture is provided, including: a hybrid voltage antenna composite board, a brick-type module, a feed module, a frequency conversion component, a wave control motherboard, and a power supply component;

[0007] The hybrid antenna composite plate is located on the outermost layer of the phased array antenna and is used to radiate dual-band, dual-polarized antenna signals or receive signals transmitted through the air.

[0008] The brick-shaped module is disposed below the hybrid antenna composite board. The channel ports of the brick-shaped module are connected to the hybrid antenna composite board, and the common port is connected to the feed module.

[0009] The power supply module is located below the brick-shaped module. The power supply module is equipped with a low-frequency polarized transceiver link and a high-frequency polarized transceiver link. The transmit excitation input port and receive synthesis output port of the power supply module are connected to the frequency conversion component. The low-frequency polarized transceiver link is connected to the brick-shaped module, and the high-frequency polarized transceiver link is connected to the hybrid antenna composite board.

[0010] The frequency conversion component is located below the power supply module and connected to the power supply module, and is used to realize the frequency conversion of radio frequency signals;

[0011] The wave control motherboard is located below the frequency converter assembly and is connected to the hybrid antenna composite board, the brick module, the power supply module and the frequency converter assembly, providing multi-functional control and power supply signals;

[0012] The power supply component is located below the wave controller motherboard and is connected to the wave controller motherboard to provide power.

[0013] In some embodiments of this application, based on the aforementioned scheme, the upper surface of the hybrid antenna composite board is provided with a tile-type antenna array unit, and the lower surface is provided with an RF chip, an RF link, a surface-mount RF connector, and a sub-board circuit that provides control and power supply signals to the RF link.

[0014] In some embodiments of this application, based on the aforementioned scheme, the hybrid antenna composite board is made by composite pressing of high-frequency microwave board and low-frequency board.

[0015] In some embodiments of this application, based on the aforementioned scheme, the tile-type antenna array unit adopts a structure with the same physical aperture and common radiation unit for both low-frequency and high-frequency bands.

[0016] In some embodiments of this application, based on the foregoing scheme, the surface-mount RF connector includes a high-frequency RF connector and a low-frequency RF connector;

[0017] The high-frequency radio frequency connector is connected to the power supply module;

[0018] The low-frequency RF connector is connected to the brick-type module.

[0019] In some embodiments of this application, based on the foregoing scheme, the brick module includes multiple brick modules;

[0020] Each brick module is equipped with a vertically polarized transceiver link and a horizontally polarized transceiver link.

[0021] The vertically polarized transceiver link is provided with a vertically polarized port, and the horizontally polarized transceiver link is provided with a horizontally polarized port.

[0022] The vertical polarization port and the horizontal polarization port are connected to the surface-mount RF connector;

[0023] The vertically polarized transceiver link and the horizontally polarized transceiver link are respectively cascaded through a power divider network to generate a common port, and the common port is connected to the power supply module.

[0024] Each brick module is also equipped with a low-frequency connector, which is connected to the wave controller motherboard.

[0025] In some embodiments of this application, based on the foregoing scheme, a heat dissipation pad is provided between the hybrid antenna composite board and the brick module;

[0026] The heat dissipation pad plate is provided with alignment slots for alignment and KK heads or button plugs used for interconnection of the channel feed port of the brick module and the surface-mount RF connectors on the mixed-pressure antenna composite board.

[0027] A boss is provided on the heat dissipation pad pressure plate at the position corresponding to the RF chip on the hybrid antenna composite plate;

[0028] A partition wall is provided at the blank position corresponding to the RF link on the heat dissipation pad pressure plate along the hybrid antenna composite plate.

[0029] In some embodiments of this application, based on the aforementioned scheme, the low-frequency polarized transceiver link is provided with a 1:32 power divider network for dividing the signal into 32 transmission paths and a 32:1 power divider network for combining the signal into one path.

[0030] The high-frequency polarized transceiver link is equipped with a 1:4 power divider network for splitting the signal into four transmission paths and a 4:1 power divider network for combining the signal into one path.

[0031] In some embodiments of this application, based on the aforementioned scheme, the low-frequency polarized transceiver link is provided with 32 low-frequency sub-ports, and the 32 low-frequency sub-ports are connected to the brick-type module;

[0032] The high-frequency polarized transceiver link is provided with four high-frequency sub-ports, which are connected to the hybrid antenna composite board.

[0033] In some embodiments of this application, based on the aforementioned scheme, the wave controller motherboard is provided with an external low-frequency interface.

[0034] The technical solution of this application has the following beneficial effects:

[0035] 1. Compared with the traditional single brick-type module architecture, the composite architecture of the present invention makes full use of the horizontal radio frequency layout space, with higher integration, and can simultaneously realize the integrated functions of multi-band, multi-polarization, and transceiver working modes, solving the problem of limited radio frequency layout space under the requirements of multiple functional applications.

[0036] 2. Compared with the traditional single-walled module architecture, the composite architecture of this invention makes use of the vertical RF layout space, which can accommodate high-power RF chips while meeting the requirements of multi-functional integration. It also utilizes the rapid heat dissipation structure of the brick-shaped module to meet the needs of high-power application scenarios.

[0037] 3. The integrated phased array antenna architecture of the present invention adopts the form of multi-band common physical aperture and common antenna radiating element. Without changing the original antenna channel spacing, a part of the multi-functional radio frequency link and the antenna array are designed on a hybrid composite board, which meets the requirements of miniaturization and lightweighting of the antenna system, reduces the complexity of the system, simplifies the assembly difficulty of the phased array antenna, and has good mass production applicability.

[0038] 4. The composite brick-and-tile module architecture of the present invention has a compact layout but a simple structure, with one-to-one correspondence between the brick-type modules and the tile-type antenna composite plate. Under the same channel number requirement, the composite module architecture of the present invention can reduce the channel spacing, that is, reduce the antenna element spacing. The antenna element spacing is the main determining factor affecting the scanning angle range of the phased array antenna, thus solving the problem of narrow antenna scanning angle range.

[0039] 5. The composite brick-and-tile module architecture of the present invention can separate radio frequency links of multiple frequency bands into two modules, with excellent isolation and anti-interference effect.

[0040] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0041] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort. In the drawings:

[0042] Figure 1 A schematic diagram of an integrated brick and tile composite phased array antenna architecture according to an embodiment of this application is shown;

[0043] Figure 2 A layout diagram of a hybrid antenna composite board device according to an embodiment of this application is shown;

[0044] Figure 3 A hybrid antenna composite board antenna surface layout diagram according to an embodiment of this application is shown;

[0045] Figure 4 A schematic diagram of the channel port surface of a brick-type module according to an embodiment of this application is shown;

[0046] Figure 5 A schematic diagram of the common port face of a brick module according to an embodiment of this application is shown;

[0047] Figure 6 A schematic diagram of a heat dissipation pad pressure plate according to an embodiment of this application is shown;

[0048] Figure 7 A block diagram illustrating the principle architecture of Ku-band signal flow according to an embodiment of this application is shown;

[0049] Figure 8 A block diagram illustrating the principle architecture of Ka-band signal flow according to an embodiment of this application is shown.

[0050] Explanation of reference numerals in the attached figures

[0051] 1- Hybrid antenna composite board, 2- Heat dissipation pad, 3- Brick-type module, 4- Feed module, 5- Frequency conversion component, 6- Waveguide motherboard, 7- Power supply component, 8- Overall structural component, 11- High-frequency microwave board, 12- Low-frequency board, 13- Tile-type antenna array unit, 14- 1-to-16 power divider network, 15- Multifunctional RF chip, 16- Ka RF connector, 17- Ku RF connector, 18- Daughter board circuit, 19- First low-frequency connector, 21- Alignment slot, 22- Boss, 23- Partition wall, 31- Brick-type module, 311- Vertical polarization port, 312- Horizontal polarization port, 313- Vertical polarization common port, 314- Horizontal polarization common port, 315- Second low-frequency connector. Detailed Implementation

[0052] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided to make this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.

[0053] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.

[0054] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0055] The following detailed description of some embodiments of this application will be provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0056] To address the technical problems existing in the prior art, this application provides an integrated brick-and-tile composite phased array antenna architecture, which includes: a hybrid voltage antenna composite board, a brick-type module, a feed module, a frequency conversion component, a wave control motherboard, and a power supply component;

[0057] The hybrid antenna composite plate is located on the outermost layer of the phased array antenna and is used to radiate dual-band, dual-polarized antenna signals or receive signals transmitted through the air.

[0058] The brick-shaped module is disposed below the hybrid antenna composite board. The channel ports of the brick-shaped module are connected to the hybrid antenna composite board, and the common port is connected to the feed module.

[0059] The power supply module is located below the brick-shaped module. The power supply module is equipped with a low-frequency polarized transceiver link and a high-frequency polarized transceiver link. The transmit excitation input port and receive synthesis output port of the power supply module are connected to the frequency conversion component. The low-frequency polarized transceiver link is connected to the brick-shaped module, and the high-frequency polarized transceiver link is connected to the hybrid antenna composite board.

[0060] The frequency conversion component is located below the power supply module and connected to the power supply module, and is used to realize the frequency conversion of radio frequency signals;

[0061] The wave control motherboard is located below the frequency converter assembly and is connected to the hybrid antenna composite board, the brick module, the power supply module and the frequency converter assembly, providing multi-functional control and power supply signals;

[0062] The power supply component is located below the wave controller motherboard and is connected to the wave controller motherboard to provide power.

[0063] In some feasible embodiments, based on the aforementioned scheme, the upper surface of the hybrid antenna composite board is provided with a tile-type antenna array unit, and the lower surface is provided with an RF chip, an RF link, a surface-mount RF connector, and a sub-board circuit that provides control and power supply signals to the RF link.

[0064] It should be noted that, in this embodiment, the tile-type antenna array unit is used to radiate dual-band, dual-polarized antenna signals or receive signals transmitted through the air.

[0065] In this embodiment, the radio frequency chip on the board can be a multi-channel transceiver chip with high-density integrated amplitude and phase control function. The chip channel port is directly interconnected with the tile-type antenna array unit through feed lines and vertical transition signal holes. The inside of the mixed-voltage antenna composite board is isolated through shielded ground holes, and the surface layer of the mixed-voltage antenna composite board device is isolated through partition walls.

[0066] In some feasible embodiments, based on the aforementioned scheme, the hybrid antenna composite board is made by composite pressing of high-frequency microwave board and low-frequency board.

[0067] In some feasible embodiments, based on the aforementioned scheme, the tile-type antenna array unit adopts a structure with the same physical aperture and common radiation unit for both low-frequency and high-frequency bands.

[0068] In some feasible embodiments, based on the foregoing scheme, the surface-mount RF connector includes a high-frequency RF connector and a low-frequency RF connector;

[0069] The high-frequency radio frequency connector is connected to the power supply module;

[0070] The low-frequency RF connector is connected to the brick-type module.

[0071] In some feasible embodiments, based on the foregoing scheme, the brick module includes multiple brick modules;

[0072] Each brick module is equipped with a vertically polarized transceiver link and a horizontally polarized transceiver link.

[0073] The vertically polarized transceiver link is provided with a vertically polarized port, and the horizontally polarized transceiver link is provided with a horizontally polarized port.

[0074] The vertical polarization port and the horizontal polarization port are connected to the surface-mount RF connector;

[0075] The vertically polarized transceiver link and the horizontally polarized transceiver link are respectively cascaded through a power divider network to generate a common port, and the common port is connected to the power supply module.

[0076] Each brick module is also equipped with a low-frequency connector, which is connected to the wave controller motherboard.

[0077] It should be noted that in this embodiment, each brick module has the same structure, and multiple brick modules with the same structure are arranged in an array to form a brick module.

[0078] In some feasible embodiments, based on the aforementioned scheme, a heat dissipation pad is provided between the hybrid antenna composite board and the brick-type module;

[0079] The heat dissipation pad plate is provided with alignment slots for alignment and KK heads or button plugs used for interconnection of the channel feed port of the brick module and the surface-mount RF connectors on the mixed-pressure antenna composite board.

[0080] A boss is provided on the heat dissipation pad pressure plate at the position corresponding to the RF chip on the hybrid antenna composite plate;

[0081] A partition wall is provided at the blank position corresponding to the RF link on the heat dissipation pad pressure plate along the hybrid antenna composite plate.

[0082] It should be noted that the protrusions can be directly attached to the RF chip, or a heat-conducting pad can be added to solve the heat dissipation problem of the RF chip; the partitions can be directly attached to the composite board to achieve physical isolation of the RF signals on the board surface.

[0083] In some feasible embodiments, based on the aforementioned scheme, the low-frequency polarized transceiver link is provided with a 1:32 power divider network for dividing the signal into 32 transmission paths and a 32:1 power divider network for combining the signal into one path.

[0084] The high-frequency polarized transceiver link is equipped with a 1:4 power divider network for splitting the signal into four transmission paths and a 4:1 power divider network for combining the signal into one path.

[0085] In some feasible embodiments, based on the aforementioned scheme, the low-frequency polarized transceiver link is provided with 32 low-frequency sub-ports, and the 32 low-frequency sub-ports are connected to the brick-type module;

[0086] The high-frequency polarized transceiver link is provided with four high-frequency sub-ports, which are connected to the hybrid antenna composite board.

[0087] In some feasible embodiments, based on the aforementioned scheme, the wave controller motherboard is provided with an external low-frequency interface.

[0088] For example, see Figure 1 The diagram shows a schematic of the architecture of an integrated brick and tile composite phased array antenna according to an embodiment of this application.

[0089] like Figure 1 As shown, the phased array antenna includes: a hybrid antenna composite board 1, a heat dissipation pad 2, a brick-type module 3, a feed module 4, a frequency converter 5, a wave control motherboard 6, a power supply assembly 7, and overall structural components 8. It contains a total of 256 antenna elements, each required to have dual-polarization or circular polarization capabilities in both Ku and Ka bands. The Ku antenna element spacing is 8.5mm. 8.5mm; Ka antenna element spacing 4.25mm 4.25mm. The hybrid antenna composite board 1, heat dissipation pad 2, brick-type module 3, feed module 4, frequency conversion component 5, wave control motherboard 6, and power supply component 7 are all located in the overall structural component 8.

[0090] like Figure 2 and Figure 3As shown, the hybrid-voltage antenna composite board 1 is made of high-frequency microwave board 11 and low-frequency board 12 through a composite bonding process, and is located on the outermost layer of the phased array antenna. A tile-type antenna array unit 13 is set on the uppermost copper surface of the hybrid-voltage antenna composite board 1 for radiating antenna signals or receiving signals conducted through the air. The antenna array adopts a common physical aperture (with dummy elements added for the Ka band) and common radiating element configuration for both Ku and Ka bands. There are a total of 256 antenna elements, with horizontal and vertical dimensions of 16 × 8.5 mm = 136 mm. Due to limitations in board processing technology, a whole-board design is considered. A Ka-band dual-polarized transceiver link is set on the lowermost copper surface of the hybrid-voltage antenna composite board 1. The link mainly consists of a 1-to-16 power divider network 14, a multi-functional RF chip 15, a Ka RF connector 16, a Ku RF connector 17, and a sub-board circuit 18 that provides control and power signals to the RF link. The multi-functional RF chip 15 is an 8-channel transceiver chip (GaAs and SOI three-dimensional heterogeneous integrated chip) integrating amplitude and phase control, low-noise receiver amplification, and transmit drive amplification. Four of the transceiver channels are Ka-band vertical polarization channels, and the other four are Ka-band horizontal polarization channels. The chip channel ports are directly interconnected with the antenna elements via feed lines and vertical transition signal holes. Isolation within the composite board is achieved through shielded ground holes. Two types of surface-mount RF connectors are installed on the composite board: one is a Ka RF connector 16, where the on-board link is divided into four subarrays according to quadrants, each subarray containing 16 × 4 = 64 antenna channels. These are combined into a common port using a 1-to-16 power splitter / combiner network. The entire board has four Ka common ports cascaded to the back-end feed module via RF cables. The second type is a Ku RF connector 17, which directly interconnects with the antenna elements via on-board feed lines and vertical transition signal holes. The mixed-voltage antenna composite board 1 is interconnected with the wave control motherboard 6 via the first low-frequency connector 19 to achieve control and power signal transmission. Furthermore, if the number of antenna array elements is large, the processing of the hybrid antenna composite board 1 as a whole board may be limited by the PCB material and processing technology. It can be divided into multiple standard sub-array boards and spliced ​​together.

[0091] like Figure 1 As shown, the brick-type module 3 is located below the hybrid antenna composite board and consists of 32 identical, modularly combinable 8-channel brick-type modules 31. See also Figure 7 The diagram shown illustrates the signal flow principle architecture of the Ku-band. The two polarized transmit / receive links of the Ku-band are housed within a single-layer brick-like module. Each channel link mainly includes a high-power amplifier, a low-noise amplifier, a digitally controlled attenuator, a digitally controlled phase shifter, and a switching switch. (See also...) Figure 4 and Figure 5As shown, the module channel port is equipped with two polarization ports (vertical polarization port 311 and horizontal polarization port 312). Vertical polarization and horizontal polarization transceiver links are respectively set within the module. The transmit and receive links are switched via a switch to achieve simultaneous high-power output with dual polarization. The eight channels of the two polarizations of the module are combined into a common port using a 1-to-2 power divider stage. The bare chip of the 10W high-power amplifier at the end of the transmit link is directly mounted on the cavity. Water-cooling pipes or heat dissipation fins are provided on the back of the cavity for rapid heat conduction and dissipation. The vertical polarization port 311 and horizontal polarization port 312 of the brick-type module 31 are directly interconnected with the Ku-port RF connector 17 on the composite board 1 via KK connectors or RF cables to achieve signal transmission between the antenna and the brick-type module 31. The 32 eight-channel brick-type modules 31, with a total of 32 vertical polarization common ports 313 and 32 horizontal polarization common ports 314, are interconnected with the back-end feed module via KK connectors or RF cables. The brick-type module 31 is interconnected with the wave controller motherboard 6 via the second low-frequency connector 315 to achieve control and power supply signal transmission. Furthermore, the compact single-sided layout allows some RF traces to be routed onto the daughterboard, which can be configured as a multi-layer composite board, or the brick-type module 31 can be configured as a double-layer staggered layout.

[0092] See Figure 1 and Figure 6 The heat dissipation pad 2 is located between the hybrid antenna composite board 1 and the brick-type module 3. It is provided with alignment slots 21 for aligning and fixing the KK head or button used for interconnecting the channel feed port of the brick-type module 3 with the split port RF connector 17 on the composite board 1. A boss 22 is made on the heat dissipation pad 2 at the position corresponding to the composite board RF chip 15, which is directly attached to the chip to solve the chip's heat dissipation problem. A partition wall 23 is made on the heat dissipation pad 2 along the blank position corresponding to the RF link on the composite board 1, which is directly attached to the composite board 1 to achieve the physical isolation effect of the RF signal on the board surface.

[0093] See appendix Figure 1The power supply module 4 is located below the brick-type module 3. Depending on the layout, it can be configured as two single-layer modules or one double-layer module. One side has two polarized transceiver links for the Ku band. The transmit signal is split into 32 paths via a 1:32 power divider network, and the receive signal is combined into one path via a 32:1 power divider network. The other side has a Ka band transceiver link. The transmit signal is split into 4 paths via a 1:4 power divider network, and the receive signal is combined into one path via a 4:1 power divider network. The two frequency band links do not interfere with each other, achieving power division of the transmit signal and synthesis of the receive signal. Appropriate amplifiers are added to the power divider network according to the signal strength. The transmit excitation input port and receive synthesis output port of the power supply module 4 are connected to the back-end frequency converter component 5 via RF cables. The 32 Ku band sub-ports of the power supply module 4 are connected to the front-end brick-type module 3 via KK connectors or RF cables. The four Ka band sub-ports of the power supply module 4 are connected to the front-end hybrid antenna composite board 1 via RF cables.

[0094] See Figure 1 The frequency conversion component 5 is located below the power supply module 4 and is mainly responsible for the frequency conversion of radio frequency signals. The transmitter is responsible for upconverting the externally input intermediate frequency signal to the two target transmission frequencies, Ku and Ka, and outputting it to the power supply module 4 through the radio frequency cable; the receiver is responsible for downconverting the Ku and Ka radio frequency signals received from the power supply module 4 to the intermediate frequency respectively, so that they can be output to the external signal processing system.

[0095] See Figure 1 The beam control motherboard 6 is located below the frequency converter component 5. It provides multi-functional control and power supply signals to the front-end hybrid antenna composite board 1, brick module 3, power supply module 4, and frequency converter component 5 through low-frequency cables. This ensures the normal operation of the RF chip and enables the switching of working modes and beamforming of the transmit and receive signals in conjunction with the FPGA control software program. The beam control motherboard 6 is equipped with an external low-frequency interface to realize the external control transmission of the phased array antenna.

[0096] See Figure 1 The power supply component 7 is located below the wave control motherboard 6, converting the externally supplied AC power into the stable operating voltage and current required by the phased array antenna. Typically, the power supply component transforms, regulates, and rectifies the voltage before transmitting it to the wave control motherboard 6, which further processes the voltage before outputting it internally.

[0097] A schematic block diagram illustrating the working principle of a dual-band, dual-polarization, high-power transceiver phased array antenna containing 256 elements is shown below. Figure 7 and Figure 8As shown. In transmit mode, two intermediate frequency (IF) signals with different polarization controls are received and converted into two Ku and Ka band signals by the frequency conversion component, which are then output to the feed module. The Ku band signal is split into 32 paths by the feed module and fed to the brick module. After amplitude and phase processing and amplification by the brick module, it is output to the Ku dual-polarized feed port of the 256 antenna elements on the composite board. Finally, a high-power signal is transmitted to the far end through the antenna array on the composite board. The Ka band signal is split into 4 paths by the feed module and fed to the composite board. After power division, amplitude and phase processing and amplification by the composite board, it is output to the Ka dual-polarized feed port of the 256 antenna elements. Finally, a signal is transmitted to the mid-range or near-range through the antenna array on the composite board. In receive mode, the phased array antenna receives electromagnetic wave signals from external space. The antenna array converts the received electromagnetic wave signals into Ku and Ka RF signals. The Ku RF signal is transmitted to the brick module via the composite board. After low-noise amplification and amplitude / phase processing by the brick module, it is synthesized 8:1 and output to the feed module. The Ku receiving link of the feed module synthesizes the signal and outputs it to the frequency converter. Finally, it is down-converted to an intermediate frequency signal and output to the back-end system. The Ka RF signal is directly transmitted to the Ka multi-functional RF chip on the composite board via the antenna array. After low-noise amplification and amplitude / phase processing, it is synthesized and output to the feed module. The Ka receiving link of the feed module synthesizes the signal and outputs it to the frequency converter. It is down-converted to an intermediate frequency signal and output to the back-end system. Meanwhile, the beam control motherboard and power supply components are responsible for stepping down the external power supply to different voltages to power each module, and for calculating and configuring the beam control commands and mode control commands input from the external signal processor to control the internal modules, thereby achieving beamforming of the phased array antenna under different commands.

[0098] Other embodiments of this application will readily conceive of by those skilled in the art upon consideration of the specification and practice of the embodiments disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. It should be understood that this application is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A phased array antenna architecture integrating brick and tile composite components, characterized in that, include: Hybrid antenna composite board, brick-type module, feed module, frequency converter assembly, wave control motherboard and power supply assembly; The hybrid antenna composite plate is located on the outermost layer of the phased array antenna and is used to radiate dual-band, dual-polarized antenna signals or receive signals transmitted through the air. The brick-shaped module is disposed below the hybrid antenna composite board. The channel ports of the brick-shaped module are connected to the hybrid antenna composite board, and the common port is connected to the feed module. The power supply module is located below the brick-shaped module. The power supply module is equipped with a low-frequency polarized transceiver link and a high-frequency polarized transceiver link. The transmit excitation input port and receive synthesis output port of the power supply module are connected to the frequency conversion component. The low-frequency polarized transceiver link is connected to the brick-shaped module, and the high-frequency polarized transceiver link is connected to the hybrid antenna composite board. The frequency conversion component is located below the power supply module and connected to the power supply module, and is used to realize the frequency conversion of radio frequency signals; The wave control motherboard is located below the frequency converter assembly and is connected to the hybrid antenna composite board, the brick module, the power supply module and the frequency converter assembly, providing multi-functional control and power supply signals; The power supply component is located below the wave controller motherboard and is connected to the wave controller motherboard to provide power; The upper surface of the hybrid antenna composite board is provided with a tile-type antenna array unit, and the lower surface is provided with an RF chip, an RF link, a surface-mount RF connector, and a sub-board circuit that provides control and power supply signals to the RF link. The brick-type module includes multiple brick modules; Each brick module is equipped with a vertically polarized transceiver link and a horizontally polarized transceiver link. The vertically polarized transceiver link is provided with a vertically polarized port, and the horizontally polarized transceiver link is provided with a horizontally polarized port. The vertical polarization port and the horizontal polarization port are connected to the surface-mount RF connector; The vertically polarized transceiver link and the horizontally polarized transceiver link are respectively cascaded through a power divider network to generate a common port, and the common port is connected to the power supply module. Each brick module is also equipped with a low-frequency connector, which is connected to the wave controller motherboard.

2. The phased array antenna architecture according to claim 1, characterized in that, The hybrid antenna composite board is made by bonding high-frequency microwave board and low-frequency board together.

3. The phased array antenna architecture according to claim 1, characterized in that, The tile-type antenna array unit adopts a structure with the same physical aperture and common radiation unit for both low-frequency and high-frequency bands.

4. The phased array antenna architecture according to claim 1, characterized in that, The surface-mount RF connector includes a high-frequency RF connector and a low-frequency RF connector. The high-frequency radio frequency connector is connected to the power supply module; The low-frequency RF connector is connected to the brick-type module.

5. The phased array antenna architecture according to claim 4, characterized in that, A heat dissipation pad is provided between the hybrid antenna composite plate and the brick module. The heat dissipation pad plate is provided with alignment slots for alignment and KK heads or button plugs used for interconnection of the channel feed port of the brick module and the surface-mount RF connectors on the mixed-pressure antenna composite board. A boss is provided on the heat dissipation pad pressure plate at the position corresponding to the RF chip on the hybrid antenna composite plate; A partition wall is provided at the blank position corresponding to the RF link on the heat dissipation pad pressure plate along the hybrid antenna composite plate.

6. The phased array antenna architecture according to claim 1, characterized in that, The low-frequency polarized transceiver link is equipped with a 1:32 power divider network for splitting the signal into 32 transmission paths and a 32:1 power divider network for combining the signal into one path. The high-frequency polarized transceiver link is equipped with a 1:4 power divider network for splitting the signal into four transmission paths and a 4:1 power divider network for combining the signal into one path.

7. The phased array antenna architecture according to claim 6, characterized in that, The low-frequency polarized transceiver link is equipped with 32 low-frequency sub-ports, which are connected to the brick-type module. The high-frequency polarized transceiver link is provided with four high-frequency sub-ports, which are connected to the hybrid antenna composite board.

8. The phased array antenna architecture according to claim 1, characterized in that, The wave controller motherboard is equipped with an external low-frequency interface.

Images