Photoelectric co-packaging adapter plate and photoelectric co-packaging device

Abstract

The invention discloses a photoelectric co-packaging adapter plate and a photoelectric co-packaging device. A photoelectric co-packaging adapter plate comprises a first coating layer and a second coating layer which are formed on a substrate, and an optical waveguide arranged between the first coating layer and the second coating layer, and the refractive index of the optical waveguide is larger than the refractive index of the first coating layer and the refractive index of the second coating layer; a light emitting window is formed in the second coating layer, an aspherical lens is arranged on the light emitting window, a first reflecting part is arranged at the first end part of the optical waveguide, and the first reflecting part is used for forming a light path between the optical waveguide and the aspherical lens. According to the technical scheme provided by the invention, loss caused by mismatching of a micro-nano optical chip mode field and a silicon optical waveguide mode field is reduced, and alignment precision requirements between different modules are reduced.

Description

Technical Field

[0001] This application belongs to the field of semiconductor technology, and in particular relates to an optoelectronic co-packaging adapter board and an optoelectronic co-packaging device. Background Technology

[0002] Co-Packaged Optics (CPO) technology is a technique that directly encapsulates optical components (such as microlenses, lasers, and detectors) around a semiconductor chip. Compared to traditional discrete-packaged optical components, CPO can reduce losses in the optical signal transmission path and improve data transmission speed, especially in high-speed data communication and data center applications.

[0003] CPO (Chip-on-Poly) is a development trend in semiconductor optoelectronic devices. In CPO technology, optical devices can include semiconductor silicon photonic chips and micro / nano optical chips. The coupling and packaging between these two has always been a challenge in on-chip integration processes. Related technologies offer close-fit coupling and fiber coupling schemes. However, these two schemes may result in higher mode field matching losses or require higher alignment accuracy. Summary of the Invention

[0004] This application provides an optoelectronic co-packaged adapter board and an optoelectronic co-packaged device, which aim to reduce the loss caused by the mismatch between the mode field of the micro-nano optical chip and the mode field of the silicon waveguide, and reduce the alignment accuracy requirements between different modules.

[0005] This application provides an optoelectronic co-packaged adapter board, including a first cladding layer and a second cladding layer formed on a substrate, and an optical waveguide disposed between the first cladding layer and the second cladding layer, wherein the refractive index of the optical waveguide is greater than the refractive index of the first cladding layer and the second cladding layer; a light-emitting window is formed on the second cladding layer, an aspherical lens is disposed on the light-emitting window, and a first reflective portion is disposed at a first end of the optical waveguide, wherein the first reflective portion is used to form an optical path between the optical waveguide and the aspherical lens.

[0006] In some embodiments, the first cladding layer is located on the side of the optical waveguide closer to the substrate, and the second cladding layer is located on the side of the optical waveguide farther from the substrate, wherein the refractive index of the first cladding layer is greater than or equal to the refractive index of the second cladding layer.

[0007] In some embodiments, the first coating layer and the second coating layer are respectively made of at least one of silicon, silicon carbide, lithium niobate, silicon oxynitride, silicon oxide III-V semiconductor compound, silicon-on-insulator and polymer.

[0008] In some embodiments, the aspherical lens is manufactured by processing the second coating layer.

[0009] In some embodiments, the aspherical lens is bonded to the optical waveguide via a bonding process.

[0010] In some embodiments, the aspherical lens is a rotationally symmetric aspherical lens, or the aspherical lens is a non-rotationally symmetric aspherical lens.

[0011] In some embodiments, the above-mentioned rotationally symmetric aspherical lens includes a second-order rotationally symmetric aspherical lens or a higher-order rotationally symmetric aspherical lens; The aforementioned non-rotationally symmetric aspherical lenses include regular non-rotationally symmetric aspherical lenses or freeform surface lenses.

[0012] In some embodiments, the second end of the optical waveguide is further provided with a second reflective portion, which is used to form an optical path between the optical waveguide and an external device.

[0013] In some embodiments, the optical waveguide is a planar dielectric waveguide or a strip-shaped dielectric waveguide.

[0014] In some embodiments, the device includes a micro-nano optical chip and a silicon photonics chip, as well as an optoelectronic co-packaging adapter plate disposed between the micro-nano optical chip and the silicon photonics chip.

[0015] The technical solution provided in this application embodiment includes an optoelectronic co-packaging adapter plate comprising a first cladding layer and a second cladding layer formed on a substrate, and an optical waveguide disposed between the first cladding layer and the second cladding layer. The refractive index of the optical waveguide is greater than that of the first cladding layer and the second cladding layer. A light-emitting window is formed on the first cladding layer, an aspherical lens is disposed on the light-emitting window, and a first reflective portion is disposed at the first end of the optical waveguide. The first reflective portion is used to form an optical path between the optical waveguide and the aspherical lens. This technical solution, by setting an optoelectronic co-packaging adapter plate with an aspherical microlens, achieves coupling between a semiconductor silicon photonic chip and a micro / nano optical chip. Compared with traditional fiber coupling schemes and close-fitting end-face coupling schemes, it has a smaller size, lower theoretical loss, and by setting the optical waveguide and the aspherical microlens on the same packaging substrate, the alignment requirements between the optical waveguide and the optical device are reduced.

[0016] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0017] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1This is a schematic diagram of the structure of an optoelectronic co-packaged adapter board provided in an embodiment of this application; Figure 2 This is a schematic diagram of another optoelectronic co-packaging adapter board provided in an embodiment of this application; Figure 3 This application provides an example of an optical transmission path diagram in an optoelectronic co-packaged adapter board. Figure 4 This is a schematic diagram of the structure of an optoelectronic co-packaged device provided in an embodiment of this application. Detailed Implementation

[0018] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0019] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0020] In the description of this application, "multiple" means two or more.

[0021] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0022] In describing some embodiments, the term "connection" and its derivative expressions may be used. The term "connection" should be interpreted broadly; for example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. The term "electrical connection" indicates, for example, that two or more components have direct physical or electrical contact, but may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content of this document.

[0023] In addition, the use of “based on” implies openness and inclusivity, because processes, steps, calculations or other actions “based on” one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0024] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0025] This document describes exemplary embodiments with reference to cross-sectional views, which are intended as idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations caused, for example, by manufacturing processes. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0026] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0027] Optoelectronic co-packaging is a development trend in semiconductor optoelectronic devices. The coupling and packaging between semiconductor silicon photonic chips and micro / nano optical chips has always been a challenge in on-chip integration processes. Traditional technical solutions mainly include two approaches: First, a tight bonding method is used to couple the semiconductor silicon photonic chip and the micro / nano optical chip across their cross-sections. This method suffers losses due to the mismatch between the micro / nano optical chip mode field and the silicon waveguide mode field. Furthermore, this approach requires extremely high alignment accuracy between the silicon waveguide and the optical device. Second, a portion of the electrical wiring in the electrical wiring substrate is replaced with optical fiber, and the micro / nano optical chip is coupled to the optical fiber, using the optical fiber assembly for optical signal processing. This approach is relatively large and not conducive to the efficient integration of optical modules at the micro / nano scale. Therefore, how to achieve high-density information transmission in optical waveguides, reduce the space between the substrate and optical components, and simultaneously simplify the operation process and improve positioning accuracy are problems that need to be solved in existing technologies. In addition, existing technologies use spherical microlenses on the substrate surface to achieve the focusing or diverging of light. Spherical microlenses have advantages such as simple design and easy fabrication, and are widely used in simple optical applications. However, in applications that require high-quality imaging, wide viewing angles and lightweight construction, spherical aberration and other higher-order aberrations in spherical microlenses become major disadvantages.

[0028] To address the aforementioned problems in related technologies, embodiments of this application provide an optoelectronic co-packaged adapter board. Figure 1 This is a schematic diagram of the structure of an optoelectronic co-packaged adapter board provided in an embodiment of this application.

[0029] For details, see Figure 1 As shown, the optoelectronic co-packaged adapter board 10 provided in this application embodiment may include: A first cladding layer 103 and a second cladding layer 101 are formed on the substrate 100, and an optical waveguide 102 is disposed between the first cladding layer 103 and the second cladding layer 101. The refractive index of the optical waveguide 102 is greater than that of the first cladding layer 103 and the second cladding layer 101, so that when light can be transmitted inside the optical waveguide 102, it can be totally internally reflected at the interface between the optical waveguide 102 and the first cladding layer 103 and the second cladding layer 101, thereby confining the light to be transmitted inside the optical waveguide 102. A light-emitting window 107 is formed on the second cladding layer 101, an aspherical lens 106 is disposed on the light-emitting window 107, and a first reflective portion 105 is disposed at the first end 109 of the optical waveguide 102. The first reflective portion 105 is used to form an optical path between the optical waveguide 102 and the aspherical lens 106.

[0030] In this embodiment, the aspherical microlens 106 refers to an optical lens designed and manufactured on a microscale, whose surface shape is not a perfect sphere but an optimized aspherical surface. This lens, by changing the curvature of its surface, can better focus light, reduce or eliminate optical aberrations, thereby achieving higher optical performance. The aspherical microlens 106 is characterized by: One is aspherical curvature, which means that the surface curvature of an aspherical lens varies radially. This means that different parts of the lens surface have different curvatures. This design can better control the propagation path of light, allowing light to be focused more precisely on a single point.

[0031] Secondly, it reduces aberrations. Due to its aspherical design, aspherical microlenses can effectively eliminate spherical aberration and other higher-order aberrations found in spherical lenses, especially at large viewing angles and high numerical apertures. This significantly improves the imaging quality of the optical system.

[0032] Thirdly, aspherical lenses offer lightweight and compact design. They simplify optical system design by reducing the number and size of optical components. They can often replace multiple spherical lenses, thereby reducing the weight and size of the system, making them particularly suitable for applications such as portable devices and optical communication systems.

[0033] Fourth, the complex surface shape of aspherical lenses requires more sophisticated manufacturing processes than spherical lenses. These processes, such as precision molding, ion beam polishing, or nanoimprint lithography, enable high-precision surface curvature control. In this embodiment, an aspherical lens 106 is placed on the substrate 100 to replace a traditional spherical microlens, thereby improving imaging quality while reducing overall weight.

[0034] The technical solution provided in this application embodiment includes an optoelectronic co-packaging adapter board comprising a first cladding layer 103 and a second cladding layer 101 formed on a substrate, and an optical waveguide 102 disposed between the first cladding layer 103 and the second cladding layer 101, wherein the refractive index of the optical waveguide 102 is greater than the refractive index of the first cladding layer 103 and the second cladding layer 101; a light-emitting window 107 is formed on the first cladding layer 103, an aspherical lens 106 is disposed on the light-emitting window 107, and a first reflective portion 105 is disposed at the first end of the optical waveguide 102, wherein the first reflective portion 105 is used to form an optical path between the optical waveguide 102 and the aspherical lens 106. The optoelectronic co-packaged adapter board provided by this technical solution couples semiconductor silicon photonic chips and micro / nano optical chips through aspherical microlenses set on it. Compared with traditional fiber coupling schemes and close-fitting end-face coupling schemes, it is smaller in size and has lower theoretical loss. Furthermore, by setting the optical waveguide and the aspherical microlens on the same packaging substrate, the alignment requirements between the optical waveguide and the optical device are reduced.

[0035] In some embodiments, a first cladding layer 103 is located on the side of the optical waveguide 102 closer to the substrate 100, and a second cladding layer 101 is located on the side of the optical waveguide 102 farther from the substrate 100. The refractive index of the first cladding layer 103 is greater than or equal to the refractive index of the second cladding layer 101. The substrate 100 can be made of a material with good stability and mechanical strength, such as silicon, silicon dioxide, or other suitable semiconductor or insulating materials. The optical waveguide 102 is the core component for optical signal transmission and is typically made of a material with a higher refractive index than its surrounding cladding layers to ensure that the optical signal can propagate within the optical waveguide 102 via total internal reflection, reducing optical signal loss. The first cladding layer 103, located on the side of the optical waveguide 102 close to the substrate 100, mainly functions to provide a refractive index difference between the optical waveguide 102 and the substrate 100, helping the optical signal to propagate inside the optical waveguide 102 without easily leaking into the substrate 100. The second cladding layer 101, located on the side of the optical waveguide 102 away from the substrate 100, also plays the role of maintaining the propagation of the optical signal inside the optical waveguide 102, and its interface is more likely to form total internal reflection with the optical waveguide 102.

[0036] In some embodiments, the first coating layer 103 and the second coating layer 101 are respectively made of at least one of silicon, silicon carbide, lithium niobate, silicon oxynitride, silicon oxide III-V semiconductor compound, silicon-on-insulator and polymer.

[0037] In some embodiments, such as Figure 2 As shown, the aspherical lens 206 is fabricated by processing the second cladding layer 201. That is, the aspherical microlens 206 is also part of the second cladding layer 201, eliminating the need for additional lenses and avoiding positional deviations associated with such installations. This allows for low-loss, high-quality, and high-efficiency light propagation. As in the above embodiment, the second cladding layer 201 is typically made of materials with excellent optical properties, such as silicon, silicon carbide, lithium niobate, and silicon oxynitride. These materials should possess good light transmittance, a stable refractive index, and appropriate hardness to facilitate subsequent processing. The second cladding layer 201 is precisely processed and shaped according to the designed aspherical shape. This may involve various processing techniques, such as single-point diamond turning, laser processing, precision grinding, and polishing. After processing, the aspherical lens 206 requires necessary post-processing, such as cleaning, coating, and inspection. These processing steps further improve the optical performance and stability of the aspherical lens 206.

[0038] In some embodiments, such as Figure 1As shown, the aspherical lens 106 can also be bonded to the optical waveguide 102 via a bonding process. The bonding process uses physical or chemical methods to tightly connect the aspherical lens and the optical waveguide together. This bonding process enables efficient connection between the aspherical lens 106 and the optical waveguide 102, ensuring efficient transmission of optical signals within the device, while the bonding interface exhibits good stability and reliability.

[0039] In some embodiments, the aspherical lens 106 can be of various types, such as a rotationally symmetric aspherical lens or a non-rotationally symmetric aspherical lens. A rotationally symmetric aspherical lens is one whose surface shape is rotationally symmetric about a central axis; that is, rotating the lens along the principal optical axis will not change its surface shape. Compared to non-rotationally symmetric aspherical lenses, the manufacturing process for rotationally symmetric aspherical lenses is generally simpler and more mature. A non-rotationally symmetric aspherical lens is one whose surface shape is not rotationally symmetric about any central axis. The surface shape of such a lens may differ in the x and y directions, thus offering greater design freedom.

[0040] In some embodiments, rotationally symmetric aspherical lenses include second-order rotationally symmetric aspherical lenses or higher-order rotationally symmetric aspherical lenses; non-rotationally symmetric aspherical lenses include regular non-rotationally symmetric aspherical lenses or freeform lenses. Specifically, a second-order rotationally symmetric aspherical lens is a rotationally symmetric aspherical lens whose surface shape can be described by a quadratic equation; a higher-order rotationally symmetric aspherical lens is a rotationally symmetric aspherical lens whose surface shape is described by a higher-order equation, i.e., a equation higher than the quadratic equation; a regular non-rotationally symmetric aspherical lens, whose surface shape, although not rotationally symmetric about any central axis, still follows some rule or predictable pattern; and a freeform lens, whose surface shape is completely irregular and does not follow any predictable pattern or rule.

[0041] In some embodiments, such as Figure 3 As shown, the second end 111 of the optical waveguide 102 is also provided with a second reflector 110, which forms the optical path between the optical waveguide 102 and external devices. The light ray L passes through a pre-coupled device and becomes parallel or converging light before entering the optical waveguide 102, where it travels axially. The light ray L is reflected by the second reflector 110 of the optical waveguide 102, and after passing through the optical window 107 formed in the second cladding layer 101, it is shaped into a converging light with high imaging quality and reaches the image plane 108 by means of the aspherical microlens 106.

[0042] In some embodiments, the optical waveguide is a 102 planar dielectric waveguide or a strip dielectric waveguide. The planar dielectric waveguide is the simplest type, constructed using silicon with a refractive index of n2 as a substrate, depositing a dielectric film with a refractive index of n1 on it using microelectronic processes, and then adding a capping layer with a refractive index of n3. Typically, n1 > n2 > n3 is chosen to confine the light wave propagation within the dielectric film. The strip dielectric waveguide is created by creating a strip with a refractive index of n1 within a substrate with a refractive index of n2. Again, n1 > n2 is chosen to confine the light wave propagation within the strip. This type of waveguide is commonly used as a functional device such as an optical splitter, coupler, or switch.

[0043] This invention also provides an optoelectronic co-packaged device. Figure 4 This is a schematic diagram of the optoelectronic co-packaged device in the embodiments of this application, as shown below. Figure 4 As shown, the optoelectronic co-packaging device includes a micro-nano optical chip 113 and a silicon photonic chip 114, as well as an optoelectronic co-packaging adapter plate disposed between the micro-nano optical chip 113 and the silicon photonic chip 114. The optoelectronic co-packaging adapter plate is the same as that described in the above embodiment. The optoelectronic co-packaging device provided in this application also possesses the advantages and technical effects of the optoelectronic co-packaging adapter plate described in the above embodiment, which will not be elaborated upon in this embodiment.

[0044] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A photoelectric co-packaged adapter board, characterized in that, The device includes a first cladding layer and a second cladding layer formed on a substrate, and an optical waveguide disposed between the first cladding layer and the second cladding layer, wherein the refractive index of the optical waveguide is greater than the refractive index of the first cladding layer and the second cladding layer; the optoelectronic co-packaging adapter board is used to couple a micro / nano optical chip and a silicon photonic chip. A light-emitting window is formed on the second cladding layer, an aspherical lens is disposed on the light-emitting window, and a first reflective portion is disposed at the first end of the optical waveguide, the first reflective portion being used to form an optical path between the optical waveguide and the aspherical lens.

2. The optoelectronic co-packaged adapter board according to claim 1, characterized in that, The first cladding layer is located on the side of the optical waveguide closer to the substrate, and the second cladding layer is located on the side of the optical waveguide farther from the substrate. The refractive index of the first cladding layer is greater than or equal to the refractive index of the second cladding layer.

3. The optoelectronic co-packaged adapter board according to claim 2, characterized in that, The first coating layer and the second coating layer are respectively made of at least one of silicon, silicon carbide, lithium niobate, silicon oxynitride, silicon oxide III-V semiconductor compound, silicon-on-insulator and polymer.

4. The optoelectronic co-packaged adapter board according to claim 1, characterized in that, The aspherical lens is manufactured by processing the second coating layer.

5. The optoelectronic co-packaged adapter board according to claim 1, characterized in that, The aspherical lens is bonded to the optical waveguide using a bonding process.

6. The optoelectronic co-packaged adapter board according to any one of claims 1-5, characterized in that, The aspherical lens is either a rotationally symmetric aspherical lens or a non-rotationally symmetric aspherical lens.

7. The optoelectronic co-packaged adapter board according to claim 6, characterized in that, The rotationally symmetric aspherical lens includes a second-order rotationally symmetric aspherical lens or a higher-order rotationally symmetric aspherical lens; The non-rotationally symmetric aspherical lens includes a regular non-rotationally symmetric aspherical lens or a freeform surface lens.

8. The optoelectronic co-packaged adapter board according to claim 6, characterized in that, The second end of the optical waveguide is also provided with a second reflective part, which is used to form an optical path between the optical waveguide and the external device.

9. The optoelectronic co-packaged adapter board according to any one of claims 1-5, characterized in that, The optical waveguide is either a planar dielectric waveguide or a strip-shaped dielectric waveguide.

10. A photoelectric co-packaged device, characterized in that, It includes a micro-nano optical chip and a silicon photonic chip, and an optoelectronic co-packaging adapter board disposed between the micro-nano optical chip and the silicon photonic chip, wherein the optoelectronic co-packaging adapter board adopts any one of the optoelectronic co-packaging adapter boards described in claims 1-9.

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