Display module with direct illumination type backlight unit

Abstract

The invention relates to a display module with a direct illumination type backlight unit. More specifically, disclosed herein is a display that may have an array of pixels, such as an array of liquid crystal pixels. The pixel array can be illuminated with backlight illumination from a direct illumination backlight unit. The backlight unit may include an array of light emitting diodes (LEDs) on a printed circuit board. The display may have a recess that accommodates an input-output component. A reflective layer may be included in the recess. The backlight may include a color conversion layer having properties that vary according to position. The light emitting diode may be covered by an encapsulant plate having a recess in an upper surface.

Description

[0001] This application is a divisional application of Chinese Patent Application No. 202211044488.9, filed on August 30, 2022, entitled "Display Module with Direct Illumination Backlight Unit".

[0002] This application claims priority to U.S. Patent Application No. 17 / 519,344, filed November 4, 2021; U.S. Patent Application No. 17 / 519,358, filed November 4, 2021; U.S. Patent Application No. 17 / 519,221, filed November 4, 2021; U.S. Provisional Patent Application No. 63 / 247,715, filed September 23, 2021; U.S. Provisional Patent Application No. 63 / 247,722, filed September 23, 2021; and U.S. Provisional Patent Application No. 63 / 247,735, filed September 23, 2021, the entire contents of which are hereby incorporated herein by reference. Technical Field

[0003] This disclosure relates in general to displays, and more specifically to backlit displays. Background Technology

[0004] Electronic devices typically include displays. For example, computers and cell phones sometimes have backlit liquid crystal displays. An edge-lit backlight unit has light-emitting diodes that emit light onto the edge surface of a light guide plate. The light guide plate then distributes the emitted light laterally across the display for backlight illumination.

[0005] Direct-illuminated backlight units have an array of light-emitting diodes that emit light vertically through the display. However, if not carefully managed, direct-illuminated backlights can be bulky or produce non-uniform backlighting. Summary of the Invention

[0006] This document discloses a display that may have a pixel array, such as a liquid crystal pixel array. The pixel array may be illuminated by backlighting from a direct-illumination backlight unit. The backlight unit may include an array of light-emitting diodes (LEDs) on a printed circuit board.

[0007] The backlight unit may include a first light diffusion layer, a second light diffusion layer, and a third light diffusion layer formed above the light-emitting diode array. A color conversion layer may be formed above the first, second, and third light diffusion layers. A first brightness enhancement film and a second brightness enhancement film may be formed above the color conversion layer. A diffuser film may be formed above the brightness enhancement film.

[0008] The display may have a recess for accommodating input-output components. A reflective layer may be included in the recess. The inner surface of the housing sidewall may have a portion with reduced reflectivity. A bracket and foam may be included in the recess between the optical film and the liquid crystal display panel. A shielding ring may be included in the liquid crystal display panel to reduce electrostatic discharge. Foam may be included in the upper housing, which has the same area as the high-rigidity portion of the lower housing.

[0009] The color conversion layer may have properties that vary depending on its location. These properties could be the thickness of the phosphor layer in the color conversion layer, the concentration of red quantum dots in the color conversion layer, the concentration of green quantum dots in the color conversion layer, or the concentration of scattering dopants in the color conversion layer. Protrusions in the optical film may have rounded tips to reduce scratching and friction between adjacent optical films.

[0010] The light-emitting diodes (LEDs) can be covered by an encapsulant plate with recesses in its upper surface. Each recess can overlap with a corresponding LED. The LEDs can be arranged in cells. The cells can have different sizes in different parts of the backlight. An adhesive layer and adhesive tape with a low dielectric constant can attach the LED substrate to the housing wall. Conductive adhesive can also attach the LED substrate to the housing wall. Attached Figure Description

[0011] Figure 1 It is a diagram of an exemplary electronic device with a display according to the implementation scheme.

[0012] Figure 2 This is a cross-sectional side view of an exemplary display according to one implementation scheme.

[0013] Figure 3 This is a top view of an exemplary array of light-emitting diodes for a direct-illumination backlight unit according to one embodiment.

[0014] Figure 4 This is a cross-sectional side view of an exemplary display with a direct-illumination backlight unit according to an embodiment, the direct-illumination backlight unit having three light diffusion layers, a color conversion layer, two brightness enhancement films and a diffuser film.

[0015] Figure 5 This is a top view of an exemplary light diffusion layer according to an implementation scheme, showing the layout of pyramidal protrusions in the light diffusion layer.

[0016] Figure 6 This is a top view of an exemplary display having a recess for accommodating input-output components, according to an embodiment.

[0017] Figure 7A This is a top view of an exemplary display having a notch including a reflective patch, according to an embodiment.

[0018] Figure 7B This is a top view of an exemplary diffuse film including a reflective patch according to the implementation scheme.

[0019] Figure 8 This is a top view of an exemplary display with a notch according to an embodiment, the notch having a reflective wall.

[0020] Figure 9A It is a cross-sectional side view of an exemplary display having adhesive patches, brackets and foam between optical films according to the embodiment.

[0021] Figure 9B This is a top view of an exemplary optical film with an adhesive patch according to an embodiment.

[0022] Figure 9C This is a top view of an exemplary diffuser film with stacked brackets according to the implementation scheme.

[0023] Figure 10 It is a cross-sectional side view of an exemplary device with a housing according to an embodiment, the housing having an inner wall having a region with reduced reflectivity.

[0024] Figure 11 This is a cross-sectional side view of an exemplary device with a shielding ring to reduce electrostatic discharge, according to the implementation scheme.

[0025] Figure 12A This is a top view of an exemplary lower housing with a rigid portion according to the implementation scheme.

[0026] Figure 12B It is a top view of an exemplary upper shell having a foam structure that overlaps with a rigid portion of the lower shell, according to the implementation scheme.

[0027] Figure 13 This is a top view of an exemplary display having electronic components along the lower edge of an LED substrate, according to an embodiment.

[0028] Figure 14 This is a cross-sectional side view of an exemplary display according to an embodiment, the exemplary display having a base with a curved portion that protects electronic components along the edge of the substrate.

[0029] Figure 15 It is a cross-sectional side view of a color conversion layer with quantum dots and scattering dopants according to the implementation scheme.

[0030] Figure 16The diagram, according to the embodiment, shows the color change from the light-emitting diode unit, expressed in terms of -Δv' (negative Δv'), which quantifies the blueness of the light across the width of the light-emitting diode unit.

[0031] Figure 17 The diagram, based on the implementation scheme, shows how -Δv' (negative Δv') of the blueness of light from the display varies across the width of the display.

[0032] Figure 18 It is a curve of the color conversion layer properties based on the position change within the LED unit according to the implementation plan.

[0033] Figure 19 It is a graph showing the color conversion layer attributes based on the positional changes across displays, according to the implementation plan.

[0034] Figure 20A It is a cross-sectional side view of an exemplary color conversion layer having a phosphor layer of varying thickness and being covered by an additional film of varying thickness, according to an embodiment.

[0035] Figure 20B It is a cross-sectional side view of an exemplary color conversion layer having a phosphor layer of varying thickness and covered by an additional film of uniform thickness, according to an embodiment.

[0036] Figure 21 This is a cross-sectional side view of an exemplary color conversion layer with a light redirection structure having different shapes according to the implementation scheme.

[0037] Figure 22 It is a cross-sectional side view of an exemplary backlight having a color conversion patch formed on the upper surface of an encapsulant plate, according to the implementation scheme.

[0038] Figure 23 This is a cross-sectional side view of an exemplary light redirection structure with a rounded top, according to the implementation scheme.

[0039] Figure 24 This is a cross-sectional side view of an exemplary backlight unit having multiple optical films according to an embodiment, the multiple optical films having a light redirection structure with rounded tops.

[0040] Figure 25 This is a cross-sectional side view of an exemplary light-emitting diode that emits light with peak brightness at a non-zero angle according to an embodiment.

[0041] Figure 26This is a cross-sectional side view of an exemplary backlight unit according to an embodiment, the backlight unit having a light-emitting diode covered by an encapsulant layer having a recess above the light-emitting diode.

[0042] Figures 27A to 27E It is a cross-sectional side view showing exemplary recesses in encapsulants of various shapes according to various embodiments.

[0043] Figure 28 This is a top view of an exemplary LED array with LED units having varying spacing, according to an embodiment.

[0044] Figure 29 This is a cross-sectional side view of an exemplary electronic device according to an embodiment, showing how multiple adhesive layers can attach an LED array to a housing wall.

[0045] Figure 30 This is a top view of an exemplary electronic device showing an adhesive tape according to an embodiment.

[0046] Figure 31 This is a rear view of an exemplary LED array according to an embodiment, showing how a conductive adhesive is formed around the periphery of the array and how an adhesive layer with an array of holes is attached to the central portion of the LED array. Detailed Implementation

[0047] Electronic devices may provide backlit displays. Backlit displays may include liquid crystal pixel arrays or other display structures illuminated by light from direct-illuminated backlight units. Figure 1 A perspective view of an exemplary electronic device of the type that may provide a display with a direct-illumination backlight unit is shown. Figure 1 The electronic device 10 may be a computing device such as a laptop computer, a computer monitor containing an embedded computer, a tablet computer, a cellular phone, a media player, or other handheld or portable electronic device, a smaller device (such as a wristwatch), a hanging device, a headset or handset device, a device embedded in glasses or other equipment worn on a user's head, or other wearable or micro-devices, a television, a computer monitor that does not contain an embedded computer, a gaming device, a navigation device, an embedded system (such as a system in which electronic equipment with a display is installed in an information kiosk or a car), equipment that performs two or more of the functions of these devices, or other electronic equipment.

[0048] like Figure 1As shown, device 10 may have a display such as display 14. Display 14 may be mounted in housing 12. Housing 12, sometimes referred to as a shell or enclosure, may be formed of plastic, glass, ceramic, fiber composite material, metal (e.g., stainless steel, aluminum, etc.), other suitable materials, or any combination of two or more of these materials. Housing 12 may be formed using a one-piece configuration, in which part or all of housing 12 is machined or molded into a single structure, or it may be formed using multiple structures (e.g., an internal frame structure, one or more structures forming the surface of the outer housing, etc.).

[0049] The housing 12 may have a support frame, may have multiple components (e.g., housing portions that move relative to each other to form a laptop computer or other device with movable parts), may have the shape of a cellular phone or tablet, and / or may have other suitable configurations. Figure 1 In this arrangement, housing 12 includes an upper housing 12A rotatably connected to a lower housing 12B. The upper housing 12A houses the display 14 and is therefore sometimes referred to as the display housing 12A. The lower housing 12B houses the keyboard 8 and is therefore sometimes referred to as the keyboard housing 12B. The upper housing 12A is connected to the lower housing 12B via a hinge structure 18. The upper housing 12A is rotatable relative to the lower housing 12B about a bending axis collinear with the hinge structure 18.

[0050] Each of the lower housing 12B and the upper housing 12A may be formed of plastic, glass, ceramic, fiber composite material, metal (e.g., stainless steel, aluminum, etc.), other suitable materials, or any combination of two or more of these materials. Each of the lower housing 12B and the upper housing 12A may be formed in a monolithic configuration, wherein some or all of the housings are machined or molded as a single structure, or may be formed using multiple structures (e.g., an internal frame structure, one or more structures forming the surface of the outer housing, etc.). Figure 1 The arrangement of the housing 12 shown is exemplary.

[0051] The display 14 may be a touchscreen display incorporating a conductive capacitive touch sensor electrode layer or other touch sensor components (e.g., resistive touch sensor components, acoustic touch sensor components, force-based touch sensor components, light-based touch sensor components, etc.) or may be a non-touchscreen display. The capacitive touchscreen electrodes may be formed from an array of indium tin oxide pads or other transparent conductive structures.

[0052] In addition to the display 14, the electronic device 10 may also include additional input-output components. For example... Figure 1As shown, the electronic device 10 may include a keyboard 8 (including multiple keys pressed by a user to provide input) and a touch-sensitive area 6 (which a user can touch to control the position of a mouse on the display 14). The touch-sensitive area 6 may sometimes be referred to as a touchpad or trackpad. The touch-sensitive area 6 is formed on the surface of the lower housing 12B, which is exposed when the upper housing 12A is opened to expose the display 14.

[0053] The display 14 may include an array of pixels 16 formed by a liquid crystal display (LCD) component or may have a pixel array based on other display technologies. Figure 2 The image shows a cross-sectional side view of the display 14.

[0054] like Figure 2 As shown, the display 14 may include a pixel array such as pixel array 24. Pixel array 24 (sometimes referred to as a display panel or liquid crystal display panel) may include a pixel array, such as... Figure 1 The pixel array 24 may be formed from a liquid crystal display module (sometimes referred to as a liquid crystal display or liquid crystal layer) or other suitable pixel array structure. The liquid crystal display panel used to form the pixel array 24 may include, for example, an upper polarizer and a lower polarizer, a color filter layer and a thin-film transistor layer interposed between the upper and lower polarizers, and a liquid crystal material layer interposed between the color filter layer and the thin-film transistor layer. Other types of liquid crystal display structures may be used to form the pixel array 24 if desired.

[0055] During operation of display 14, an image can be displayed on pixel array 24. Backlight unit 42 (sometimes referred to as a backlight source, direct-illumination backlight source, direct-illumination backlight unit, backlight layer, backlight structure, backlight module, backlight system, etc.) can be used to generate backlight illumination 45 through pixel array 24. This illuminates any image on pixel array 24 for viewing by a viewer, such as viewer 20 viewing display 14 in direction 22.

[0056] The backlight unit 42 may include a plurality of optical films 26 formed above the light-emitting diode array 36. The light-emitting diode array 36 may include a two-dimensional light source array, such as light-emitting diodes 38 that generate backlight illumination 45. For example, the light-emitting diodes 38 may be arranged in rows and columns and may be located in... Figure 2 In the XY plane. The light-emitting diode 38 can be mounted on a printed circuit board 50 (sometimes referred to as substrate 50) and can be encapsulated by an encapsulant 52 (sometimes referred to as transparent encapsulant 52, encapsulant plate 52, etc.). The encapsulant plate 52 can be formed continuously across the LED array and can have a flat upper surface.

[0057] The light-emitting diodes 38 can be uniformly controlled by the control circuitry in device 10 or can be individually controlled (e.g., to implement a local dimming scheme that helps improve the dynamic range of the image displayed on pixel array 24). The light generated by each light-emitting diode 38 can propagate upward in the Z direction through optical film 26 before passing through pixel array 24.

[0058] The optical film 26 may include films such as one or more light diffusion layers 28, color conversion layers 34, one or more brightness enhancement films 44 (sometimes referred to as collimation layers 44), diffuser films 30 and / or other optical films.

[0059] The light-emitting diode 38 can emit light of any suitable color (e.g., blue, red, green, white, etc.). According to an exemplary configuration described herein, the light-emitting diode 38 emits blue light. To help provide uniform backlighting across the backlight unit 42, the light from the light-emitting diode 38 can be diffused by a light-diffusing layer 28. The light from at least one light-diffusing layer 28 then passes through a color conversion layer 34 (which may sometimes be referred to as a photoluminescent layer).

[0060] Color conversion layer 34 can convert light from LED 38 from a first color to a different color. For example, when the LED emits blue light, color conversion layer 34 may include a phosphor layer (e.g., a white phosphor material layer or other photoluminescent material layer) that converts blue light to white light. If desired, other photoluminescent materials can be used to convert blue light into different colors of light (e.g., red, green, white, etc.). For example, a layer 34 may have a phosphor layer including quantum dots that convert blue light into red and green light (e.g., to produce white backlight illumination including red, green, and blue components, etc.). A configuration in which the light-emitting diode 38 emits white light may also be used (e.g., making layer 34 optional if desired).

[0061] When light from the light-emitting diode 38 reaches one or more brightness enhancement films 44, the light has already been converted from blue to white and has been homogenized (e.g., through a light diffusion layer). The brightness enhancement film 44 can then collimate the off-axis light to increase the brightness of the display when a viewer views the display in direction 22. The diffuser film 30 can further diffuse the light to homogenize the light ultimately provided to the pixel array 24.

[0062] Figure 3 This is a top view of an exemplary array of light-emitting diodes for the backlight 42. Figure 3As shown, the LED array 36 may contain rows and columns of LEDs 38. Each LED 38 may be associated with a corresponding cell (tile area) 38C. The length D of the edge of cell 38C may be 2 mm, 18 mm, 1 mm to 10 mm, 1 mm to 4 mm, 10 mm to 30 mm, greater than 5 mm, greater than 10 mm, greater than 15 mm, greater than 20 mm, less than 25 mm, less than 20 mm, less than 15 mm, less than 10 mm, less than 1 mm, less than 0.1 mm, greater than 0.01 mm, greater than 0.1 mm, or any other desired size. If desired, hexagonal tile arrays and arrays with LEDs 38 organized in other suitable array patterns may be used. In an array with rectangular cells, each cell may have two sides of equal length (e.g., each cell may have a square outline in which four cell edges of equal length surround the corresponding LED) or each cell may have two sides of different length (e.g., a non-square rectangular shape). The LED array 36 may have rows and columns of square LED regions (such as cell 38C). Figure 3 The configuration is merely illustrative.

[0063] If desired, each unit 38C may have a light source formed by an array of light-emitting diode dies (e.g., multiple individual light-emitting diodes 38 arranged in an array, such as a 2×2 cluster of light-emitting diodes in unit 38C). For example, Figure 3 The light sources 38' in the leftmost and bottommost units 38C are formed by a 2×2 array of light-emitting diodes 38 (e.g., four individual light-emitting diode dies). Generally, each unit 38C may include a light source 38' having a single light-emitting diode 38, a pair of light-emitting diodes 38, 2 to 10 light-emitting diodes 38, at least two light-emitting diodes 38, at least four light-emitting diodes 38, at least eight light-emitting diodes 38, fewer than five light-emitting diodes 38, or other suitable number of light-emitting diodes. An exemplary configuration in which each unit 38C has a single light-emitting diode 38 may sometimes be described herein as an example. An exemplary configuration in which each unit 38C has four light-emitting diodes 38 may also sometimes be described herein as an example. However, these examples are merely illustrative. Each unit 38C may have a light source 38 having any suitable number of one or more light-emitting diodes 38. When multiple LEDs are included in a single unit, the multiple LEDs can be controlled consistently (e.g., to have the same brightness). The diodes 38 of the light-emitting diode array 36 may be mounted on a printed circuit board substrate (50) extending across the array 36, or may be mounted in the array 36 using other suitable arrangements.

[0064] As mentioned above, the optical film 26 of the backlight unit 42 may include one or more light diffusion layers 28 and one or more brightness enhancement films. Figure 4 This is a cross-sectional side view of an exemplary display having three light diffusion layers, two brightness enhancement films, and one diffuser film.

[0065] like Figure 4 As shown, a first light diffusion layer 28-1, a second light diffusion layer 28-2, and a third light diffusion layer 28-3 are formed between the light-emitting diode array 36 and the color conversion layer 34. Each light diffusion layer has a similar structure, having protrusions (sometimes referred to as prisms or light redirection structures) extending from the substrate (base film). Light diffusion layer 28-1 includes a protrusion 102-1 extending from the substrate 104-1. Light diffusion layer 28-2 includes a protrusion 102-2 extending from the substrate 104-2. Light diffusion layer 28-3 includes a protrusion 102-3 extending from the substrate 104-3.

[0066] Substrates 104-1, 104-2, and 104-3, sometimes referred to as base film portions, may be formed of a transparent material such as polyethylene terephthalate (PET) or any other desired material. Light redirection structures 102-1, 102-2, and 102-3 may be formed of the same material as base film portions 104-1, 104-2, and 104-3, or they may be formed of a different material. If desired, different materials may be used in each light diffusion layer, or the light diffusion layers may be formed of the same material.

[0067] For each light diffusion layer, protrusions 102 can form an array across the light diffusion layer. Each protrusion 102 (sometimes referred to as light redirection structure 102 or prism 102) can divide an incident point light source into three or more points. These protrusions can have a pyramidal shape (e.g., having a square base and four triangular faces intersecting at the vertices), a triangular pyramidal shape (e.g., having a triangular base and three triangular faces intersecting at the vertices), a partially cubic shape (e.g., a angular cube formed by three square faces intersecting at the vertices), a conical pyramidal structure (where each face of the pyramid has an upper and lower portion at an angle relative to each other), or any other desired shape. A square-based pyramidal protrusion can divide a point light source into four points, while a triangular pyramidal protrusion can divide a point light source into three points.

[0068] Figure 5 This is a top view of the light diffusion layer 28-1, showing how the protrusions 102-1 can be arranged in an array. In this case, each protrusion has a pyramidal shape consisting of a square base and four triangular faces intersecting at vertices 106.

[0069] Figure 4 and Figure 5The example of the light redirection structure 102 formed by protrusions from the substrate is merely illustrative. In another possible arrangement, the light redirection structure can be formed as a recess in the corresponding substrate film 104. This recess can have any desired shape (e.g., a pyramidal shape based on a square, a pyramidal shape based on a triangle, etc.). Furthermore, Figure 4 The example of the light redirection structure 102 formed on the lower surface of the light redirection layer is merely illustrative. The light redirection structure 102 may alternatively be formed on the upper surface of one or more light redirection layers.

[0070] Figure 4 The substrates 104-1, 104-2, and 104-3 may each have a matte upper surface (e.g., the surface higher in the positive Z direction may be matte). This matte upper surface can reduce unwanted reflections in the backlight unit.

[0071] The light diffusion layer 28-3 (e.g., substrate 104-3 and / or prism 102-3) may be formed of a diffuser material, such that light propagating along the Z-axis is diffused by the light diffusion layer 28-3. In contrast, light diffusion layers 28-1 and 28-2 are not formed of a diffuser material. In one arrangement, substrate 104-3 is formed of a material that is completely different (and more diffuse) from substrates 104-2 and 104-1. In another possible arrangement, substrates 104-1, 104-2, and 104-3 are formed of the same base material, and substrate 104-3 includes additives that increase the diffuseness of substrate 104-3 relative to substrates 104-1 and 104-2 (which do not include diffuser-enhancing additives).

[0072] like Figure 4 As shown, the color conversion layer 34 may include a phosphor layer 40 (e.g., a white phosphor material layer or other photoluminescent material layer) that converts blue light into white light. If desired, other photoluminescent materials may be used to convert the blue light from the LED 38 into different colors of light (e.g., red, green, white, etc.). For example, the phosphor layer 40 may include a red quantum dot 112-R that converts blue light into red light and a green quantum dot 112-G that converts blue light into green light (e.g., to produce white backlight illumination including red, green, and blue components, etc.).

[0073] In addition to the phosphor layer 40, the color conversion layer 34 may also include a partially reflective layer 41. For example, the partially reflective layer 41 (sometimes called a dichroic layer or dichroic filter layer) reflects all red and green light and partially reflects blue light. Therefore, the partially reflective layer 41 allows some blue light to be recycled through the optical film 26.

[0074] Additional films, such as film 108, may also be included in the color conversion layer. The additional film 108 (sometimes referred to as an optical film, substrate, base film, etc.) may be formed of a polymeric material (e.g., polyethylene terephthalate). Light redirection structures, such as protrusions 102-4, may be formed on the upper surface of the additional film 108. Protrusions 102-4 may have any of the arrangements described above in conjunction with protrusions 102-1, 102-2, and 102-3 (e.g., as...). Figure 5 (The pyramidal array shown). The light redirection structure 102-4 can be formed of the same material as the film 108, or it can be formed of a different material than the film 108.

[0075] exist Figure 4 In the example, the backlight unit includes a first brightness enhancement film 44-1 and a second brightness enhancement film 44-2. Each brightness enhancement film has a similar structure, having protrusions (sometimes referred to as prisms or light redirection structures) extending from the substrate (base film). Brightness enhancement film 44-1 includes protrusions 110-1 extending from the substrate 114-1. Brightness enhancement film 44-2 includes protrusions 110-2 extending from the substrate 114-2.

[0076] Substrates 114-1 and 114-2 may sometimes be referred to as base film portions and may be formed of a transparent material such as polyethylene terephthalate (PET) or any other desired material. Light redirection structures 110-1 and 110-2 may be formed of the same material as base film portions 114-1 and 114-2, or they may be formed of a different material. If desired, different materials may be used in each brightness enhancement film, or the light diffusion layer may be formed of the same material.

[0077] In each brightness enhancement film, the protrusion 110 can extend across the light diffusion layer in the form of a band. For example, the protrusion 110-1 can extend across the layer along the longitudinal axis (e.g., parallel to the longitudinal axis). Figure 4 Parallel elongated protrusions (sometimes called ridges) along the Y-axis. Protrusion 110-2 may have a similar structure to protrusion 110-1 (having parallel elongated protrusions extending across the brightening film). Protrusion 110-2 may be rotated relative to protrusion 110-1 (e.g., rotated 90°).

[0078] As another possible arrangement, protrusion 110-1 may have any of the arrangements described above in conjunction with protrusions 102-1, 102-2 and 102-3 (e.g., as Figure 5 (as shown in the pyramidal array). Similarly, protrusion 110-2 may have any of the arrangements described above in conjunction with protrusions 102-1, 102-2 and 102-3 (e.g., as shown in the pyramidal array). Figure 5 (The pyramidal array shown).

[0079] Figure 4The example of the light redirection structure 110 formed by protrusions from the substrate is merely illustrative. In another possible arrangement, the light redirection structure 110 may be formed as a recess in the corresponding substrate film 114. Furthermore, Figure 4 The example of the light redirection structure 110 formed on the upper surface of the brightness enhancement film is merely illustrative. The light redirection structure 110 may alternatively be formed on the lower surface of one or more brightness enhancement films.

[0080] exist Figure 4 In this configuration, each pair of adjacent optical films can be separated by an air gap. The air gap provides a refractive index difference as light enters and exits each optical film, thereby ensuring that light from LED 38 is diffused by light diffusion layer 28 (e.g., via refraction and / or diffraction). Alternatively, instead of including air gaps between the optical films, a low-refractive-index filler material can be formed between each adjacent optical film.

[0081] Figure 6 This is a top view of display 14, showing how the display can have an area occupied by a notch along one of its edges. Figure 6 As shown, the display 14 has a left edge and a right edge connected by a top edge and a bottom edge. A notch 62 is present along the top edge of the display. One or more input-output components 64 are included in the area of ​​the notch 62. The input-output components 64 may include sensor components, such as a camera or ambient light sensor, a light-emitting component, or any other desired input-output component.

[0082] LEDs for the backlight unit 42 and / or other display components are omitted in the notch 62. In other words, each layer of the display 14 (e.g., liquid crystal display panel, optical film, LED array, etc.) may optionally have a corresponding notch in region 62 to accommodate the input-output component 64. Therefore, the display 14 does not emit light in the notch 62. Additionally, the region of the display 14 adjacent to the notch 62 (e.g., Figure 6 Region 66 in the display 14 may be darker than the rest of the display 14. To better illuminate this region and ensure that the display has uniform brightness adjacent to the notch 62 in the rest of the display, one or more reflective layers may be incorporated into the notch 62.

[0083] Figure 7A This is a top view of the display 14 showing the LED array 36. Figure 7AAs shown, a notch exists in the LED array (e.g., a notch in the printed circuit board 50), but no backlight LED component exists in the LED array. An input-output component 64 may be formed in the notch 62. The input-output component may be formed on the substrate 72 (e.g., a printed circuit board or other desired substrate). The display may also include a protrusion 68 (sometimes referred to as an alignment structure 68, attachment structure 68, alignment protrusion 68, attachment structure 68, etc.). The protrusion 68 may protrude into a recess in one or more optical films 26 for the backlight unit 42. In this way, the protrusion 68 aligns with the optical films 26 for the backlight unit and ensures that the optical films 26 do not undesirably shift during operation of the electronic device. The protrusion 68 may be integrally formed with the upper housing 12A (see [reference]). Figure 1 Alternatively, it could be a separate structure attached to the upper outer casing 12A.

[0084] To increase the brightness in the display area adjacent to the notch 62, a reflective layer 70 can be formed in the notch 62. Figure 7A In the example, the first and second reflective layers (sometimes referred to as reflective patches) are bonded to either side of the substrate 72. Therefore, the first and second reflective layers are formed on opposite first and second sides of the notch 62. The reflective layer 70 and the substrate 72 may be coplanar. The reflective layer 70 and the LED array (e.g., substrate 50, LED 38, and / or encapsulant 52) ​​may be coplanar. Each reflective layer 70 may have an opening to receive a corresponding protrusion 68. In other words, each protrusion 68 protrudes through an opening in the corresponding reflective layer.

[0085] The reflective layer 70 can be formed of white ink, metal, or any other desired material. The reflective layer 70 can have a reflectivity greater than 50%, greater than 60%, greater than 70%, greater than 80%, greater than 90%, etc. Therefore, the reflective layer 70 can recycle light emitted from the effective area of ​​the backlight unit / display back into the effective area to increase the brightness in the area 66 adjacent to the notch, thereby increasing the display uniformity around the notch.

[0086] Figure 7B This is a top view of the diffuser film 30 for the backlight unit 42. In addition to the reflective layer 70, the display 14 may include a reflective layer 74 on the diffuser film 30. The diffuser film 30 may have an opening 76 for receiving a protrusion 68. In other words, the protrusion 68 protrudes through the opening 76 in the diffuser film 30, thereby holding the diffuser film 30 in position.

[0087] The dashed line shows the position of the LED array 36 relative to the diffuse film 30. As shown, the diffuse film 30 includes portions that overlap with the notches 62 in the LED array. These portions of the diffuse film 30 may overlap with the reflective layer 70. The width of the notches in the diffuse film 30 is therefore smaller than the width of the notches in the LED array 36.

[0088] A first reflective layer and a second reflective layer 74 (sometimes referred to as reflective patches 74) are formed on either side of a notch in the diffuse film 30. Each reflective layer 74 may have a occupancy area overlapping the occupancy area of ​​its corresponding underlying reflective layer 70. The reflective layer 74 may be formed of white ink, metal, or any other desired material. The reflective layer 74 may have a reflectivity greater than 50%, greater than 60%, greater than 70%, greater than 80%, greater than 90%, etc. Therefore, the reflective layer 74 can recycle light emitted from the effective area of ​​the backlight / display back into the effective area to increase the brightness in the area 66 adjacent to the notch, thereby increasing the display uniformity around the notch.

[0089] like Figure 7B As shown, each reflective patch 74 can accommodate a corresponding opening 76 in the diffuse film 30. In other words, the diffuse film 30 has an upper edge. A notch is formed in the upper edge of the diffuse film 30. The diffuse film 30 has side edges and insertion edges defining the notch in the diffuse film 30. A first portion of the reflective patch 74 is formed between the corresponding opening 76 and the upper edge of the diffuse film 30. A second portion of the reflective layer 74 is formed between the corresponding opening 76 and the corresponding side (notch-defined) edge of the diffuse film 30.

[0090] exist Figure 7A In this context, the reflective layer 70 may have a width (e.g., a dimension parallel to the X-axis), a length (e.g., a dimension parallel to the Y-axis), and a height / thickness (e.g., a dimension parallel to the Z-axis). Figure 7A In this example, the width and length of the reflective layer 70 are greater than the thickness of the reflective layer. However, this example is merely illustrative. Figure 8 In another desired arrangement, the width and / or length of the reflective layer 70 is less than the thickness of the reflective layer.

[0091] like Figure 8As shown, the reflective layer 70 can be formed in the notch 62 at the interface between the notch and the effective area of ​​the display 14. In other words, the reflective layer 70 is formed within the notch along the boundary of the LED array 36. In addition to the LED array 36, the reflective layer 70 can be thick enough to be adjacent to the edge of one or more optical films 26. In other words, the height of the reflective layer 70 can be equal to or greater than the height of the optical film stack, such that the edge of each optical film is adjacent to a portion of the reflective layer 70. This can result in the same boundary conditions for the display 14 along the notch 62 as for the remaining display edges (where the display and optical films are adjacent to the housing wall of the upper housing 12A). Therefore, the reflective properties in the notch 62 are consistent with the edges of the other effective areas, resulting in uniform brightness adjacent to the notch 62.

[0092] Figure 8 The reflective layer 70 (sometimes referred to as reflective wall 70) can be integrally formed with the display housing 12A, or it can be formed by a separate structure attached to the display housing 12A. Figure 8 The reflective layer 70 in the middle can have a reflectivity greater than 40%, greater than 50%, greater than 60%, greater than 70%, greater than 80%, greater than 90%, etc.

[0093] Figure 8 The reflective wall in the recess 62 may extend along the entire length of the recess 62 (e.g., the first, second, and third edges of the display defining the recess 62), or it may be discontinuous within the recess 62. For example, the reflective wall may have two or more portions separated by gaps. As an example, the first and second portions of the reflective wall may be composed of... Figure 8 The gaps in region 80 are separated.

[0094] exist Figure 8 In this arrangement, the reflective wall 70 can be used as a protrusion to align the optical film 26 within the backlight unit. In other words, the optical film 26 can have an opening aligned with the reflective wall 70, allowing the reflective wall 70 to fix the position of the optical film 26.

[0095] Figure 7A An example is shown of using protrusion 68 to secure the optical film within the display. However, other structures may be used additionally or alternatively to secure the optical film 26 within the display 14.

[0096] Figure 9A This is a cross-sectional side view of the display 14 in the notch region 62, showing how adhesive patches may be included between the optical films in the display to ensure that the optical films do not move or rotate during operation of the electronic device. Figure 9A An LED array 36 is shown formed above the wall of the housing 12A. A portion of the LED array 36 is omitted in the recessed region 62. (With...) Figure 7AThe substrate 72 and reflective patch 70 of the input-output component 64 shown are included in the recess of the LED array 36.

[0097] An optical film 26 is formed above the LED array 36, comprising a light diffusion layer 28-1, a light diffusion layer 28-2, a light diffusion layer 28-3, a color conversion layer 34, a brightness enhancement film 44-1, a brightness enhancement film 44-2, and a diffuser film 30. The optical film may have one or more portions overlapping with some notched regions 62 (e.g., such as...). Figure 7B (As shown in the diffuse film 30).

[0098] To prevent rotation, movement, and / or wrinkling of the optical film, first and second adhesive patches 82 are formed between the brightness enhancement film 44-1 and the brightness enhancement film 44-2. Additionally, a first adhesive patch and a second adhesive patch 84 are formed between the brightness enhancement film 44-2 and the diffuser film 30. The first reflective patch 70, the first adhesive patch 82, and the first adhesive patch 84 (e.g., in...) Figure 9A The left side) may have an overlapping area in the Z direction. The second reflective patch 70, the second adhesive patch 82, and the second adhesive patch 84 (e.g., in...) Figure 9A The right side of the area can also have an area that overlaps along the Z direction.

[0099] like Figure 9A As shown, the display 14 may also include a bracket 86 and a foam 88 between the uppermost optical film (diffuse film 30) and the bottom of the pixel array 24 (sometimes referred to as display panel 24). A first layer of adhesive 90 is interposed between the upper surface of the diffuse film 30 and the lower surface of the bracket 86. The bracket 86 may apply compressive force to the optical film 26 (e.g., along the negative Z direction) to prevent the optical film from slipping off the alignment protrusion 68. The bracket 86 may have one or more openings to receive input-output components 64 formed in the recessed area. The bracket 86 may be formed of stainless steel or other desired rigid material. A second layer of adhesive 92 is interposed between the upper surface of the bracket 86 and the lower surface of the foam 88. The foam 88 may be formed of a compressible material and applies compressive force to the optical film 26 (e.g., along the negative Z direction) to prevent the optical film from slipping off the alignment protrusion 68. The foam 88 also fills the gap between the pixel array 24 and the optical film 26, thus preventing the pixel array from deflecting in the Z direction and improving the structural integrity of the display.

[0100] Similar to Figure 7B As shown in the opening 76 in the intermediate diffuser film 30, each optical film 26 may have an opening to accommodate the protrusion 68 (e.g., in...). Figure 7A (Middle). The alignment of the optical film is maintained by protrusions 68.

[0101] Figure 9BThis is a top view of an exemplary optical film with an adhesive patch on its top surface. Specifically, Figure 9B This is a top view of the brightness enhancement film 44-1 used in the backlight unit 42. As shown, the brightness enhancement film 44-1 may have an opening 94 for receiving a protrusion 68. In other words, the protrusion 68 protrudes through the opening 94 in the brightness enhancement film 44-1, thereby holding the brightness enhancement film 44-1 in position.

[0102] The dashed line indicates the position of the LED array 36 relative to the brightness enhancement film 44-1. As shown, the brightness enhancement film 44-1 includes portions that overlap with the notches 62 in the LED array. These portions of the brightness enhancement film 44-1 may overlap with the reflective layer 70 (see Figure 1). Figure 7A and Figure 9A The width of the notch in the brightness enhancement film 44-1 is smaller than the width of the notch in the LED array 36. All optical films can have the same... Figure 9B The notches shown are of the same or similar size.

[0103] A first adhesive patch and a second adhesive patch 82 (sometimes referred to as adhesive layer 82) are formed on either side of the notch in the brightness enhancement film 44-1. Each adhesive layer 82 may have a coverage area that covers the corresponding underlying reflective layer 70.

[0104] like Figure 9B As shown, each adhesive patch 82 can accommodate a corresponding opening 94 in the brightness enhancement film 44-1. In other words, the brightness enhancement film 44-1 has an upper edge. A notch is formed in the upper edge of the brightness enhancement film 44-1. The brightness enhancement film 44-1 has side edges and insertion edges defining the notch in the brightness enhancement film 44-1. A first portion of the adhesive layer 82 is formed between the corresponding opening 94 and the upper edge of the brightness enhancement film 44-1. A second portion of the adhesive layer 82 is formed between the corresponding opening 94 and the corresponding side (notch-defined) edge of the brightness enhancement film 44-1.

[0105] The brightness enhancement film 44-2 may have the same or similar area as the brightness enhancement film 44-1. Similarly, the adhesive patches 84 on the brightness enhancement film 44-2 may have the same or similar arrangement as the adhesive patches 82 on the brightness enhancement film 44-1. In other words, each adhesive patch 84 may accommodate a corresponding opening and may overlap with the corresponding reflective layer 70 (and the corresponding adhesive patch 82).

[0106] Figure 9CThis is a top view of the diffuse film 30, showing the position of the bracket 86 relative to the notches and openings in the diffuse film. As shown, the bracket 86 extends above the notches and has a portion of the notch covering the optical film and the LED array. The portion of the bracket 86 in the notch has an opening 96 for accommodating an input-output component 64 positioned within the notch. In other words, the input-output component 64 may have a thickness protruding through the opening 96 in the bracket 86 along the Z-direction. Opposite first and second sides of the bracket 86 overlap with the diffuse film 30 and other optical films 26 in the backlight unit. The bracket does not overlap with the opening 76 in the diffuse film (and other corresponding openings in the optical films aligned with the opening 76).

[0107] Simultaneously, foam 88 extends above the notch and has a portion of the notch covering the optical film and LED array. The portion of foam in the notch has an opening with the same area as the bracket opening 96. The opening in the foam accommodates an input-output component 64 positioned in the notch. In other words, the input-output component 64 may have a thickness protruding through the opening in the foam 88 along the Z direction. Opposite first and second sides of foam 88 overlap with the diffuse film 30 and other optical films 26 in the backlight unit. Unlike the bracket 86, foam 88 overlaps with the opening 76 in the diffuse film (and other corresponding openings in the optical films aligned with the opening 76).

[0108] Figure 10 This is a cross-sectional side view of display 14. Figure 10 The diagram illustrates how a display 14 is formed within a display housing 12A. The display 12A has an outer surface 142 and an inner surface 144 that form the outermost surface of the electronic device 10. The inner surface 144 may define a cavity that includes a pixel array 24 containing a backlight unit 42 and the display 14.

[0109] like Figure 10 As shown, the optical film 26 can be formed above the LED array 36 within the display housing 12A. The optical film 26 and the LED array 36 can be parallel to the rear wall 146 of the display housing. The rear wall 146 (sometimes referred to as rear wall portion 146) extends parallel to the XY plane. In addition to the rear wall 146, the display housing 12A also has a side wall portion 148 (sometimes referred to as side wall 148) extending in the Z direction. The side wall portion 148 has a portion 150 facing the inner surface 144 of the optical film 26.

[0110] Figure 10The diagram also illustrates how a spacer 152 can be formed between the LED array 36 and the optical film 26. The spacer 152 may optionally be an adhesive spacer. Similarly, a spacer 154 may be formed between the housing 12A and the pixel array 24. The spacer 154 may optionally be an adhesive spacer. The electronic device also includes a decorative structure 156. The decorative structure 156 may have a circular upper surface.

[0111] To minimize the width of the display's boundary area, the edge of the optical film 26 can be positioned very close to a portion 150 of the inner surface 144 of the display housing 12A. The value of the gap 158 between the edge of the film 26 and the inner surface 144 can be less than 30 mm, less than 15 mm, less than 10 mm, less than 5 mm, less than 3 mm, less than 2 mm, less than 1 mm, less than 0.5 mm, less than 0.3 mm, less than 0.1 mm, less than 0.05 mm, etc.

[0112] If not careful, light can escape from the edge of the optical film 26 and reflect off the inner surface 144 of the display housing 12A towards the viewer. This can cause a bluish tint to appear at the edges of the display, especially at off-axis viewing angles. To mitigate this problem, a portion 150 of the inner surface 144 of the housing 12A can be treated or coated to reduce reflections in that portion 150.

[0113] As an example, portion 150 of housing 12A may be laser-treated to reduce the reflectivity of housing 12A. Housing 12A may be formed of a metallic material such as aluminum. Laser darkening may be performed on the aluminum housing to reduce reflectivity. The example of using laser darkening to reduce reflectivity in portion 150 of housing 12A is merely illustrative. If desired, a dual anodizing technique may be used. As yet another example, black or gray ink or a metal with lower reflectivity than the rest of housing 12A may be coated / plated onto area 150 of the housing.

[0114] Finally, a portion 150 of the inner surface 144 of housing 12A may have a lower reflectivity (in visible light wavelengths) than adjacent portions of the inner surface 144. A portion 150 of the inner surface 144 of housing 12A may also have a lower reflectivity than the outer surface 142 of housing 12A. The reflectivity in portion 150 may be selected to be low enough to reduce blue tones in the display when viewed off-axis without causing dark edges in the display. The reflectivity of portion 150 may be greater than 20%, greater than 30%, greater than 35%, greater than 40%, greater than 50%, less than 80%, less than 60%, less than 50%, less than 45%, less than 40%, between 35% and 45%, between 30% and 50%, etc. The reflectivity difference between portion 150 of housing 12A and adjacent / remaining portions of housing 12A may be greater than 10%, greater than 20%, greater than 30%, greater than 40%, greater than 50%, between 30% and 50%, etc. As a concrete example, portion 150 may have a reflectivity between 35% and 45%, while the remaining portion of housing 12A may have a reflectivity between 70% and 80%. In some cases, the volume of housing 12A may have a reflectivity within the target range of portion 150. Therefore, portion 150 can be matched to the rest of the housing (because no modifications are needed to optimize the reflectivity in portion 150). For example, the entire housing 12A may have a reflectivity between 35% and 45%.

[0115] Figure 11 This is a cross-sectional side view of the display 14, showing additional details about the decorative structure 156 and the pixel array 24. (See attached image.) Figure 11 As shown, the pixel array 24 includes a polarizer 172, a first substrate 160 (e.g., a thin-film transistor substrate), one or more layers 162 formed over the substrate 160, a sealant 164 formed over the layers 162, one or more layers 166 formed over the sealant 164, a second substrate 168 formed over the layers 166 (e.g., and a polarizer 170 formed over the substrate 168).

[0116] Polarizers 170 and 172 can be linear polarizers that control the light emitted by the liquid crystal display. Polarizer 172 (sometimes referred to as a lower polarizer or a rear polarizer) ensures that light enters the display panel with uniform polarization. A liquid crystal layer can be formed between substrate 168 and substrate 160 (e.g., coplanar with sealant 164). Thin-film transistor circuitry within substrate 160 can control the liquid crystal layer in the display to selectively rotate or not rotate the polarization of light. Light leaving the liquid crystal layer with a polarization aligned with the through-axis of polarizer 170 will leave the display and be visible to the user. Light leaving the liquid crystal layer with a polarization not aligned with the through-axis of polarizer 170 will be blocked and not visible to the user. Layer 162 may include multiple dielectric layers (e.g., passivation layer, liquid crystal alignment layer, etc.). Layer 166 may include multiple dielectric layers (e.g., adhesive layer, liquid crystal alignment layer, black mask layer, etc.). Additional encapsulant material 174 (sometimes referred to as potting compound 174) may be formed along the edge of the display panel 24. The color filter substrate 168 may include an array of color filter elements that impart the desired color to light emitted by pixels within the display panel.

[0117] A first spacer 154 may be formed between the housing 12A and the display panel 24. Spacer 154 may optionally be an adhesive spacer. A second spacer 176 may be formed between the housing 12A and the display panel 24. Spacer 176 may optionally be an adhesive spacer. Spacers 154 and 176 may directly contact the substrate 160. A decorative structure 156 may be attached to the housing 12A using an adhesive layer 178. The decorative structure 156 may have a circular upper surface.

[0118] To minimize the width of the non-emissive boundary of the display 14, the pixel array 24 may include traces near the edge of the display, making the display susceptible to electrostatic discharge (ESD) damage. To prevent ESD damage, a shielding ring 180 may be formed around the perimeter of the display. The shielding ring 180 may be an annular shape with a footprint matching the perimeter of the display edge (e.g., the shielding ring extends around the entire perimeter of the display and accommodates a notch). The shielding ring 180 thus has a central opening, in which an effective area of ​​the display is formed. The shielding ring 180 may be electrically connected to ground and is therefore sometimes referred to as a grounding ring 180.

[0119] Additionally, to prevent damage from electrostatic discharge, the sealant 164 may overlap with the metal traces on the edge of the substrate 160. The thin-film transistor substrate 160 may include multiple metal traces forming thin-film transistor circuitry for a display. The sealant 164 may extend to the edge of the display panel to overlap with the ground ring 180 and other traces at the edge of the display panel. As previously described, the sealant 164 may be a liquid crystal sealant containing a liquid crystal layer within the display.

[0120] The decorative structure 156 can be positioned such that an air gap exists between the decorative structure 156 and the adjacent display panel structure to prevent damage from electrostatic discharge. For example... Figure 11 As shown, the trimming structure 156 is separated from the substrate 160 by gaps 182 along the X direction and gaps 184 along the Z direction. Gap 182 and gap 184 can be greater than 5 micrometers, greater than 10 micrometers, greater than 20 micrometers, greater than 50 micrometers, greater than 100 micrometers, between 10 micrometers and 50 micrometers, etc. In some embodiments, the trimming structure 156 can be formed of a plastic material. Alternatively, the trimming structure 156 can be formed of a conductive material and electrically connected to the housing 12A using a conductive adhesive 178. This type of arrangement can provide an electrostatic discharge path from the trimming structure 156 to the housing 12A (via the adhesive 178).

[0121] Figure 12A This is a top view of the lower housing 12B of the electronic device 10. As previously described, the lower housing 12B includes a keyboard 8 and a touch-sensitive area (touchpad) 6. To maintain the structural integrity of the lower housing 12B and the input-output devices (e.g., keyboard 8 and touchpad 6) within it, a wall structure may be included inside the housing 12B. The wall structure may be aligned with the lower edge of the keyboard 8 and the left and right edges of the touchpad 6. The wall structure may have an area that results in high rigidity of the lower housing 12B in region 186 of the housing. The rigidity of the housing 12B (and associated internal components) is higher in region 186 than in the surrounding portion of the housing 12B. Region 186 has a first portion extending along (and overlapping with) the lower edge of the keyboard 8, a second portion extending from the first portion along (and overlapping with) the left edge of the touchpad 6 and orthogonal to the first portion, and a third portion extending from the first portion along (and overlapping with) the right edge of the touchpad 6 and orthogonal to the first portion.

[0122] The high-rigidity portion 186 may be susceptible to damage to the display 14 within the upper housing 12A in the event of an impact. To prevent this type of damage, the housing 12A may include a foam structure. Figure 12B This is a top view of the upper housing 12A with a foam structure. As shown, a foam structure 188 is formed in the upper housing 12A. The foam structure 188 may, for example, be embedded in a recess in the rear wall 146 of the housing 12A. In one possible arrangement, the rear wall of the housing 12A may cover the foam structure 188 on both sides. Alternatively, the rear wall portion 146 of the housing 12A may cover the foam structure 188 on the outside of the device, but not the inside of the device. In other words, the foam structure 188 may be exposed inside the device if desired.

[0123] like Figure 12BAs shown, foam 188 has a lower outer shell 12B ( Figure 12A The area occupied by the high-stiffness region 186 in the diagram overlaps with the area occupied by the high-stiffness region 186. When Figure 1 When the laptop computer is closed, foam 188 aligns with and overlaps with the high-rigidity area 186. The presence of foam in this area helps prevent damage to the display 14 during operation of the electronic device. For example, foam 188 reduces damage to the display during an impact event on the upper casing 12A when the laptop computer is closed.

[0124] To further improve the mechanical strength of the electronic device, the recesses of foam 188 in the display housing 12A can be rounded to prevent the formation of areas of high stress concentration.

[0125] Figure 13 This is a top view of an exemplary LED array having LEDs 38 formed across a printed circuit board 50. As shown, the LEDs 38 may be distributed across the effective area (AA) of the display. This effective area is the area occupied by the display that actually emits light and may optionally be defined by an opaque mask layer in the display's stack-up structure. In this document, the display panel, printed circuit board, backlight unit, optical film, and other desired display layers may all be referred to as having an effective area. The effective area of ​​each layer may simply refer to the area occupied by each layer that overlaps with the light-emitting area of ​​the display. Figure 13 In the example, the active area has a right-angled corner and a notch 62. This example is merely illustrative. In general, the active area can have any desired shape. In addition to the active area, the printed circuit board 50 may also have inactive areas (e.g., areas that do not perpendicularly overlap with the light-emitting area of ​​the display).

[0126] In addition to mounting LEDs onto printed circuit board 50, additional electronic components 190 (sometimes referred to as surface mount components) can also be mounted onto printed circuit board 50. The printed circuit board may have an edge 50E in an inactive area including component 190. Component 190 may include, for example, driving circuitry (e.g., one or more display driver integrated circuits) for controlling LEDs 38 in an LED array. Component 190 can be attached to the upper surface of the printed circuit board using solder. Figure 13 As shown, component 190 is secured within one edge 50E of the printed circuit board. This allows for a large gap (e.g., between the edge of the printed circuit board and the effective area) at only one edge of the printed circuit board. Figure 13 The distance in the middle is 192). The remaining three edges of the printed circuit board have small gaps between the edges of the printed circuit board and the effective area (e.g., Figure 13 The distance is 194. In other words, the distance 194 is less than the distance 192.

[0127] During a drop or impact event, one or more optical films 26 in the backlight unit may shift along with the electronic component 190 into the edge of the printed circuit board. If carelessly, one of the optical films could strike the electronic component 190 and remove it from the printed circuit board. To ensure the reliability of the electronic component 190, mechanical structures may be included along the edge of the printed circuit board to prevent the electronic component from being removed or damaged during a drop event.

[0128] Figure 14 This is a cross-sectional side view of display 14. (Example) Figure 14 As shown, the substrate 50 (for the LED array 36) extends across the display parallel to the rear wall of the housing 12A. The LED array is mounted on the substrate 50. Additionally, additional electronic components 190 are mounted along the edge 50E of the substrate 50.

[0129] The display panel 24 can be mounted to the reinforcing member 196. The reinforcing member 196 may sometimes be referred to as a base, reinforcement, bracket, etc. The base 196 may have a first portion (e.g., portion 196-1) parallel to the substrate 50, a rear housing wall, and an XY plane serving as a mounting base for the display panel 24. In other words, the edge of the display panel 24 is mounted on portion 196-1 of the member 196 (e.g., ...). Figure 14 (As shown). Component 196 can be formed of metal (e.g., stainless steel) and can have high rigidity.

[0130] To protect the electronic component 190 along edge 50E, the base frame 196 includes an additional portion 196-2 orthogonal to the substrate 50, a rear housing wall, portion 196-1, and an XY plane. Portion 196-2 is parallel to the XZ plane. Portion 196-2 extends between the edge of the optical film 26 and the electronic component 190. Therefore, portion 196-2 acts as a physical barrier to prevent the optical film 26 from impacting the electronic component 190. If a drop event causes the optical film 26 to shift in the negative Y direction, the optical film will be blocked by portion 196-2 of the base frame 196 (and therefore will not reach or contact the electronic component 190 along the edge 50E of the substrate 50).

[0131] Figure 15 This is a cross-sectional side view of an exemplary color conversion layer 34 having scattering dopants for increasing the amount of off-axis blue light. (See also...) Figure 15As shown in the illustration, the red quantum dot 112-R emits light in a random direction (e.g., the direction of outputting red light is unrelated to the direction of receiving blue light). Similarly, the green quantum dot 112-G emits light in a random direction (e.g., the direction of outputting green light is unrelated to the direction of receiving blue light). To further randomize the emission direction of blue light (and thus equalize the off-axis emission of blue light with the off-axis emission of red and green light), a scattering dopant 130 may be included in the phosphor layer. The scattering dopant 130 can elastically scatter blue light. This means that there is no energy loss when the scattering dopant 130 receives blue light, and the wavelength of the light is not changed by the scattering dopant. However, the scattering dopant randomizes the direction of blue light, so that blue light will be scattered by the scattering dopant, while red and green light will not tend to be scattered by the scattering dopant. Therefore, the distribution of red, blue, and green light can be equalized both coaxially and off-axis.

[0132] The average diameter of the scattering dopant can be between 5 nm and 20 nm, less than 500 nm, less than 100 nm, less than 50 nm, less than 20 nm, greater than 5 nm, greater than 1 nm, or any other desired diameter. The average diameter of quantum dots 112-R and 112-G can be greater than 500 nm, greater than 1 μm, greater than 2 μm, between 1 μm and 3 μm, less than 5 μm, or any other desired diameter.

[0133] Quantum dots 112-R and 112-G, along with scattering dopant 130, may be distributed within resin 132 (sometimes referred to as host resin 132). Resin 132 may have a refractive index within the following ranges: less than 1.5, less than 1.45 and 1.55, less than 1.6, less than 1.55, greater than 1.4, between 1.4 and 1.6, or any other desired refractive index. To achieve desired scattering using the scattering dopant, a transparent material with a refractive index within the following ranges may be used to form the scattering dopant: greater than 1.5, greater than 1.55, greater than 1.6, greater than 1.65, greater than 1.7, between 1.6 and 1.7, between 1.55 and 1.7, or any other desired refractive index. The refractive index difference between resin 132 and scattering dopant 130 can be greater than 0.05, greater than 0.1, greater than 0.15, greater than 0.2, between 0.1 and 0.2, between 0.15 and 0.2, or any other desired value.

[0134] Generally, scattering dopants can be formed from any desired material (e.g., organosilicon, melamine, etc.). As an example, the scattering dopant can be formed from melamine (C3H6N6, with a refractive index of 1.66), while resin 132 can have a refractive index of 1.49. The density of the scattering dopant 130 within the phosphor layer can be less than 10 g / m³. 3 Less than 5g / m3 Less than 3g / m 3 Less than 2g / m 3 Greater than 1g / m 3 Greater than 2g / m 3 Greater than 3g / m 3 Between 1g / m 3 and 3g / m 3 Between, between 1.5g / m 3 and 2.5g / m 3 Between, between 1g / m 3 and 5g / m 3 Between or any other desired density.

[0135] It should be noted that the examples of including red and green quantum dots in the color conversion layer are merely illustrative. In general, any desired red / green conversion material can be included (e.g., red and green phosphors, quantum dots, perovskites, etc.).

[0136] The return shows the LED unit 38C. Figure 3 Light from the edge of cell 38C tends to be recycled more than light emitted from the center of the cell. Therefore, light from the edge of the cell has less blue light compared to light from the center of the cell. Figure 16 This is a graph illustrating the effect. For example... Figure 16 As shown in curve 442, light from the center of the cell is bluer than light from the edge of the cell. Figure 16 The shape of the distribution shown is merely illustrative. In general, the distribution can have any desired shape.

[0137] Within a display (e.g., in the center), light from a given cell is mixed with light from adjacent cells to produce display light of a uniform color (with a specific amount of blue light). However, at the edges of the display, there may be a lack of yellow light (because at the edges, there is no yellow light from adjacent cells at their boundaries). This makes the light from the edges of the display bluer than the light from the center. This effect is present in… Figure 17 The graph illustrates this. As shown by curve 444, light from the edge of the display is bluer than light from the center of the display. Each mark along the X-axis indicates the boundary of the corresponding cell 38C. As shown, light leaving from the two cells closest to the edge of the display is bluer than the remaining cells in the display. This example is merely illustrative, and depending on the specific display design, light leaving from any desired number of cells may be bluer than the remaining cells in the display. Figure 17 The curves shown are merely illustrative and may have different shapes if desired.

[0138] To reduce color inhomogeneity of light emitted from the display, the color conversion layer 34 can have inhomogeneity across the effective area of ​​the display. Figure 15 In this configuration, the phosphor layer 40 has a uniform thickness (e.g., the dimension across the phosphor layer is uniform along the Z direction). To reduce non-uniformity, the phosphor may alternatively have a varying thickness.

[0139] Figure 18 This is a graph illustrating how the color conversion layer properties can vary across the width of cells in the LED array 36. This property can follow a distribution of 200. Figure 18 In the example, the cell has two LEDs along its width. For example, the cell may include a total of four LEDs arranged in a 2×2 grid. Distribution 200 has a local maximum value on each LED. Between these LEDs (e.g., in portions not overlapping with these LEDs), the distribution decreases and the property has a lower magnitude.

[0140] Considering the phosphor thickness is Figure 18 Examples of the changing properties are shown. In the region above the LED, the phosphor thickness is greater than the phosphor thickness in the portion between the LEDs. The greater phosphor thickness results in more blue light being converted into red and green light, thus mitigating the high blue intensity of the light above the LED (e.g., ...). Figure 16 (As shown).

[0141] Phosphor thickness is just one of many properties that can be varied in the color conversion layer to increase the uniformity of light in a display. As another example, the concentration of the red quantum dot 112R can be... Figure 18 The changing properties of the green quantum dots (higher concentration of red quantum dots above the LED) can be varied. Figure 18 The changing properties of the light (high concentration of green quantum dots above the LED), the concentration of scattering particles 130 can be... Figure 18 The changing properties of the light (high concentration of scattering particles above the LED), the recycling percentage achieved by the light redirection structure 102-4, can be... Figure 18 The changing properties of the light redirection structure (where the shape of the light redirection structure causes the percentage of recycling above the LED to be higher than the percentage of recycling in the portion that does not overlap with the LED), etc.

[0142] Figure 19 This is a graph showing how the color conversion layer properties can vary across the width of the display. The properties can follow distribution 202. Figure 19 In the example, distribution 202 increases toward the edge of the display.

[0143] Considering the phosphor thickness is as follows Figure 19Examples of varying properties are shown. Towards the edge of the LED array, the phosphor thickness is greater than the phosphor thickness in a portion of the central region of the LED array. This greater phosphor thickness results in more blue light being converted into red and green light, thus reducing the high blue intensity of light at the display edges (e.g., ...). Figure 17 (As shown).

[0144] Phosphor thickness is just one of many properties that can be varied in the color conversion layer to increase the uniformity of light in a display. As another example, the concentration of the red quantum dot 112R can be... Figure 19 The changing properties (higher concentration of red quantum dots at the edges of the color conversion layer), the concentration of green quantum dots 112G can be... Figure 19 The changing properties of the particles (higher concentration of green quantum dots at the edges of the color conversion layer) and the concentration of scattering particles 130 can be... Figure 19 The changing properties in the color conversion layer (with a higher concentration of scattering particles at the edges) and the recycling percentage achieved by the light redirection structure 102-4 can be... Figure 19 The changing properties of the light redirection structure (the shape of the light redirection structure causes a higher percentage of recirculation at the edges of the color conversion layer than at the center of the color conversion layer), etc.

[0145] exist Figure 18 and Figure 19 In this example, both distributions 200 and 202 exhibit gradual changes. This example is merely illustrative. If desired, the distributions may alternatively have one or more step changes. In general, distributions 200 and 202 can have any desired shape.

[0146] If needed, Figure 18 Techniques (e.g., non-uniformity of color conversion layers within cells) and Figure 19 Techniques such as inter-unit color conversion layer non-uniformity can all be used for a single color conversion layer.

[0147] When the phosphor layer has a varying thickness, the additional film 108 formed above the phosphor layer can also have a varying thickness, such that the additional film has a flat upper surface (e.g., Figure 20A (As shown). Alternatively, the color conversion layer 34 can be imprinted such that the phosphor layer 40 has a varying thickness, and the additional film 108 has a uniform thickness across the color conversion layer (e.g., Figure 20B (As shown).

[0148] Figure 21 It is a cross-sectional side view of an exemplary color conversion layer 34, including a light redirection structure with varying shapes. In other words, for Figure 21In color conversion layer 34, the recycling percentage of the light redirection structure is as follows: Figure 18 or Figure 19 The properties of the light redirection structure vary. A first subset 204-1 of the light redirection structure may have a first shape with a first corresponding reflectivity (e.g., the reflectivity of light received from the underlying optical film, sometimes referred to as the recycling percentage). A first second 204-2 of the light redirection structure may have a second shape with a second corresponding reflectivity (recycling percentage). The shape of the light redirection structure can be changed according to a step function or can be gradually changed.

[0149] Reduce color uniformity in the backlight unit Figure 18-21 The examples are merely illustrative. As an alternative or supplement to these techniques, a color conversion material may be formed on the encapsulant layer 52 of the LED array 36. Figure 22 This is a cross-sectional side view illustrating this type of arrangement. In this example, the color conversion layer 34 is uniform across the entire display. Color non-uniformity is reduced using a color conversion patch 206 formed on the upper surface of the encapsulant 52 above the LED 38. The color conversion patch can convert the color of the light emitted by the LED 38 (e.g., blue) to a different color (e.g., white). In other words, for light received by the color conversion patch 206, the wavelength of light with peak brightness is different from the wavelength of light leaving the color conversion patch. The color conversion patch can be formed from ink, quantum dots (as in the phosphor layer 40), or any other desired material.

[0150] exist Figure 22 In this arrangement, color-changing patches 206 are formed in a recess in the upper surface 208 of the encapsulant 52. In this arrangement, some or all of the color-changing patches 206 may be formed below the plane defined by the upper surface 208. In one example, such as... Figure 22 As shown, the upper surface of patch 206 and upper surface 208 are coplanar (thus defining a smooth, continuous upper surface). As another possible arrangement, encapsulant 52 may have a flat upper surface without recesses. The color-changing patch 206 is then formed on the upper surface (e.g., above the plane defined by surface 208). Regardless of whether the color-changing patch is formed entirely below, partially below, partially above, or entirely above the upper surface 208, the color-changing patch 206 may have a uniform or non-uniform thickness (e.g., ...). Figure 22 (As shown).

[0151] like Figure 4As shown, the color conversion layer 34 includes a light redirection structure 102-4 on the upper surface of the film 108. The brightness enhancement film 44-1 includes a light redirection structure 110-1 on the upper surface of the film 114-1. The brightness enhancement film 44-2 includes a light redirection structure 110-2 on the upper surface of the film 114-2. Due to this arrangement, the lower surface of the film 114-1 may be easily scratched by the tip of the light redirection structure 102-4, the lower surface of the film 114-2 may be easily scratched by the tip of the light redirection structure 110-1, and the lower surface of the film 30 may be easily scratched by the tip of the light redirection structure 110-2. This type of scratching can lead to damage to the optical films, resulting in optical artifacts in the display.

[0152] To reduce scratches caused by protrusions within the backlight unit, the protrusions may have rounded tips. Figure 23 This is a cross-sectional side view of the exemplary light redirection structure 102-4. (See example...) Figure 23 As shown, each light redirection structure 102-4 has a rounded tip 210. The rounded tip 210 is less likely to scratch the stacked film than when a non-rounded tip is used.

[0153] The circular tip 210 may have a radius of curvature greater than 0.3 micrometers, greater than 0.4 micrometers, greater than 0.5 micrometers, greater than 0.7 micrometers, greater than 1.0 micrometers, less than 1.5 micrometers, less than 3 micrometers, less than 1.0 micrometers, or between 0.4 micrometers and 1.5 micrometers.

[0154] Figure 24 This illustrates how the light redirection structure 102-4 in the color conversion layer 34 and the light redirection structure 110-1 in the brightness enhancement film 44-1 can have similar characteristics. Figure 23 The diagram shows a cross-sectional side view of an exemplary backlight unit with a circular apex. The circular apex of both structures 102-4 and 110-1 may have radii of curvature greater than 0.3 μm, greater than 0.4 μm, greater than 0.5 μm, greater than 0.7 μm, greater than 1.0 μm, less than 1.5 μm, less than 3 μm, less than 1.0 μm, or between 0.4 μm and 1.5 μm. Structures 102-4 and 110-1 may have circular apexes regardless of whether they have a pyramidal shape (e.g., having a square base and four intersecting triangular faces at the vertices), a triangular pyramidal shape (e.g., having a triangular base and three intersecting triangular faces at the vertices), a partially cubic shape (e.g., a angular cube formed by three intersecting square faces at the vertices), a conical pyramidal structure, an elongated structure (as discussed above in conjunction with structures 110-1 and 110-2), etc.

[0155] In some cases, the optical redirection structure 110-2 may have a similar Figure 23 (as well as Figure 24 The structure 110-2 (as shown in structures 110-1 and 102-4) has a circular tip. However, scratching the lower surface of the diffuse film 30 may not produce harmful optical artifacts in the display. Therefore, structure 110-2 may have a sharp tip (e.g., a non-circular tip). In other words, the radius of curvature of the tip of structure 110-2 may be smaller than that of the tips of structures 110-1 and 102-4 (e.g., greater than 0.1 μm, greater than 0.2 μm, greater than 0.3 μm, greater than 0.4 μm, greater than 0.5 μm, greater than 0.7 μm, greater than 1.0 μm, less than 1.5 μm, less than 3 μm, less than 1.0 μm, between 0.4 μm and 1.5 μm, etc.). The radius of curvature of the tip of structure 110-2 may be less than 0.1 μm, less than 0.2 μm, less than 0.3 μm, less than 0.4 μm, etc.

[0156] In addition to preventing scratches, the circular tips of structures 110-1 and 102-4 can reduce the coefficient of friction between adjacent optical films in the backlight unit (e.g., between films 34 and 44-1 and between films 44-1 and 44-2). This reduction in friction can reduce the likelihood of the optical films wrinkling during device operation (e.g., due to displacement from impact events or thermal expansion). The coefficient of friction between adjacent optical films can be further reduced by including transparent dots 212 on the bottom surface of base films 114-1 and / or 114-2. The transparent dots 212 can be optically invisible (e.g., the transparent dots do not affect the optical performance of the backlight). However, the transparent dots 212 further reduce the coefficient of friction between adjacent optical films in the backlight unit. The transparent dots can have a uniform distribution across the optical films (e.g., uniformly distributed across a given optical film), can be concentrated at the edges of the optical films (e.g., included in an annular shape around the periphery of a given optical film, but not in the central portion of that optical film), and so on. The transparent dots 212 can be formed of transparent ink or any other desired material.

[0157] Figure 25 This is a cross-sectional side view of an exemplary light-emitting diode in LED array 36. As shown, LED 38 can be mounted on substrate 50. LED 38 may have conductive contact pads 214 that are physically and electrically connected to corresponding conductive contact pads 216 on substrate 50 via solder 218. Each light-emitting diode may be formed in a corresponding package (e.g., sapphire-based) attached to substrate 50.

[0158] A distributed Bragg reflector (DBR) 220 may be included above the upper surface of each LED 38. In some cases, the DBR 220 may reflect substantially all of the light produced by the LED 38, such that the LEDs act as side emitters (and emit light primarily in a direction parallel to the XY plane and the substrate 50). Alternatively, the reflectivity of the DBR 220 may be adjusted to allow some, but not all, of the light to pass through the DBR 220. For example, angled light 222 may pass through the DBR 220 instead of being reflected.

[0159] Tuning the DBR 220 can result in the LED 38 having a peak emission angle 224 (e.g., the light intensity emitted from the LED 38 is highest relative to the angle between the substrate 50 and the XY plane) that is greater than 0 degrees, greater than 10 degrees, greater than 20 degrees, greater than 30 degrees, greater than 45 degrees, greater than 60 degrees, greater than 70 degrees, less than 10 degrees, less than 20 degrees, less than 30 degrees, less than 45 degrees, less than 60 degrees, less than 70 degrees, less than 90 degrees, between 5 degrees and 85 degrees, between 5 degrees and 45 degrees, between 1 degree and 30 degrees, between 45 degrees and 85 degrees, and between 60 degrees and 89 degrees. Tuning the DBR 220 in this way can increase the efficiency of the display (relative to the side-emitting arrangement of the LED 38).

[0160] A reflective layer 226 may be formed on the upper surface of the substrate 50 to increase the efficiency of the display. The reflective layer 226 may have a reflectivity greater than 60%, 70%, 80%, 90%, 95%, 99%, etc. The reflective layer 226 may be formed from any desired material (e.g., a white solder resist). Each LED may be formed in a corresponding opening in the reflective layer 226.

[0161] To reduce hot spots in the display caused by LED 38, encapsulant 52 may have a recess formed above the LED. Figure 26 This is a cross-sectional side view of an exemplary backlight unit 42 of this type. (See example...) Figure 26 As shown, recesses 228 are formed above each LED 38 within the LED array 36. Each recess increases the amount of light reflected from the LED 38 via total internal reflection (at the encapsulant-air interface). This better disperses the light from the LED 38 in the XY plane, thereby reducing hot spots caused by the LEDs.

[0162] The recess 228 can have any desired shape. Figure 26 In this design, the recess 228 has a conical shape. In other words, the edge surface 230 extends in a circular (or elliptical) shape around the area occupied by the LED 38. This example is merely illustrative. Figure 27AAn alternative example is shown where the recess 228 has a hemispherical shape (e.g., the recess has a spherical curvature). Figure 26 In the middle, the conical shape of the recess 228 terminates at the flat surface 232. This example is merely illustrative. Figure 27B An alternative example is shown, in which the recess 228 has a tapered shape, and its edge surfaces 230 intersect at the apex (instead of...). Figure 26 (flat surface in the middle).

[0163] exist Figure 27C In the middle, the edge surface 230 of the recess is curved and intersects at the apex. Figure 27D In the recessed portion, the edge surface 230 is curved and intersects at the flat surface 232. The recessed portion 228 may have multiple sections with different widths. Figure 27E In the example, the first portion of the recess has a first width 234, while the second portion of the recess has a second width 236. The second (lower) portion may have a smaller width than the first (upper) portion of the recess. In other words, the width 236 is smaller than the width 234.

[0164] Generally, each encapsulant recess 228 can have any desired shape. Regardless of the shape of the recess, a portion of the encapsulant 52 can remain between the upper surface of the LED 38 (and DBR 220) and the recess. The width of each recess can be greater than the width of the LED, and can be greater than 1.5 times the width of the LED, greater than 2 times the width of the LED, less than 3 times the width of the LED, etc.

[0165] Regardless of the shape of the recess, the recess can optionally be filled with filler material 238 (e.g., such as...). Figure 27A (As shown). As a possible example, the filler material can be gray ink or a color-changing material. When the filler material is omitted, the recess can be filled with air instead.

[0166] Combination Figure 26 The recesses of the type shown in Figure 27 can reduce hot spots surrounded by LEDs 38 in the LED array 36. This allows one or more optical films to be omitted from the backlight unit, thereby reducing the thickness of the display, lowering manufacturing costs and complexity. For example, when the encapsulant 52 includes the recesses 228, only five or six optical films may be needed to provide sufficiently uniform backlighting to the display panel 24 (instead of...). Figure 4 The seven excluding the encapsulant recesses.

[0167] like Figure 26As shown, an opaque baffle 240 may optionally be formed between adjacent LEDs in the LED array 36. Alternatively, an opaque baffle 240 may be formed at the boundary between adjacent LED units 38C (see [reference]). Figure 3 The baffle 240 may have the same thickness 242 as the encapsulant 52 or may have a smaller thickness than the encapsulant 52 (such that the encapsulant forms above the upper surface of each baffle 240 and covers the upper surface of each baffle).

[0168] An air gap can also be formed to replace the baffle 240. The air gap can extend completely through the encapsulant 52 (so that the encapsulant has a thickness of 0 242) or only partially through the encapsulant 52 (so that the encapsulant has a non-zero thickness 242 that overlaps with the air gap).

[0169] Figure 28 This is a top view of LED array 36, showing how to adjust the spacing of the LEDs and / or baffles to reduce non-uniformity in the display. Figure 28 As shown, the LEDs 38 in the LED array 36 are arranged in multiple units 38C. Figure 28 In the example, each cell includes a 2×2 grid of LEDs 38. The LEDs have a horizontal spacing of 244 and a vertical spacing of 246. Cell 38C is defined by a baffle (e.g., an opaque baffle) having a horizontal spacing of 248 and a vertical spacing of 250.

[0170] Displays may be prone to having lower than desired brightness at the edges. To reduce this non-uniformity, the spacing between the LEDs and / or baffles can be reduced at the edges of the display. Figure 28 In the example, there are m rows and n columns of LED cells 38C. The leftmost column (column 1) and the rightmost column (column N) of the LED cells may have a lower horizontal baffle spacing 248 (and correspondingly, a lower cell width) than the remaining central columns of the LED cells. Similarly, the row of LED cells below the notch 62 (row 2) may have a lower vertical baffle spacing 250 (and correspondingly, a lower cell height) than the remaining central rows of the LED cells. The last row of LED cells in the LED array ( Figure 28 (Not explicitly shown) It can also have a vertical baffle spacing of 250 that is lower than the remaining center row of the LED units. Reducing the baffle spacing adjacent to the edge of the display in this way can reduce non-uniformity at the edge of the display.

[0171] exist Figure 28In this arrangement, the vertical baffle spacing 250 in the first row of LED units (interrupted by the notch) is greater than the vertical baffle spacing in the second row and the center row. The vertical baffle spacing in the first row is set to match the height 252 of the notch 62. This example is merely illustrative. In an alternative arrangement, the multi-row LED units 38C may be interrupted by the notch 62 (instead of...). Figure 28 (only 1 in the row of LEDs), and these row LED units 38C may have a vertical baffle spacing 250 below the notch height 262.

[0172] exist Figure 28 In the example, LEDs 38 have a uniform spacing across the LED array (regardless of whether the LEDs are in smaller edge cells). Alternatively, LEDs 38 at the edges of the array (e.g., in smaller edge cells) may also have a smaller LED spacing (in the horizontal and / or vertical directions) than in the central portion of the array.

[0173] Figures 29 to 31 An adhesive layer is shown that can be used to attach the LED array 36 to the display housing 12A. Figure 29 This is a cross-sectional side view of device 10. As shown, a first adhesive layer 254 is attached to the lower surface of the LED array 36 (e.g., the lower surface of the substrate 50 in the LED array 36). The adhesive layer 254 (sometimes referred to as spacer layer 254) may be a single-sided adhesive, wherein the surface bonded to the LED array 36 is adhesive and the opposing surfaces are not adhesive. A plurality of adhesive tapes 256 attach the spacer layer 254 to the rear wall 146 of the housing 12A. The adhesive tapes 256 may be formed of discrete, elongated, and double-sided adhesive tapes. A first side of each adhesive tape is attached to the spacer 254, and a second side of each adhesive tape is attached to the inner surface of the rear wall of the housing 12A.

[0174] Additionally, conductive adhesive 258 can be attached between the inner surface of the rear wall of housing 12A and the LED array 36 (e.g., the lower surface of substrate 50 in LED array 36). Specifically, conductive adhesive 258 can be physically and electrically connected to ground trace 260 in LED array 36. Ground trace 260 can extend partially or completely around the periphery of LED array 36. Conductive adhesive 258 thus electrically connects ground trace 260 to housing 12A (which may be conductive and serve as a grounding structure). The thickness of conductive adhesive 258 is equal to the sum of the thickness of adhesive layer 254 and adhesive tape 256. In addition to serving as a grounding structure, conductive adhesive 258 can reduce unwanted electrostatic discharge in device 10.

[0175] The adhesive layer 256 can be formed as a strip (instead of a continuous planar layer 254) to increase the reprocessability of the display. In other words, stretching and heating can be used to intentionally remove the adhesive strip 256 if needed.

[0176] The adhesive layer 254 can be formed of a layer with a low dielectric constant to reduce parasitic capacitance and corresponding system power loss. The dielectric constant of the adhesive layer 254 can be less than 10, less than 6.0, less than 5.0, less than 4.0, less than 3.0, less than 2.0, etc.

[0177] The thickness of strip 256 (e.g., the dimension parallel to the Z direction) can be less than 100 micrometers, less than 80 micrometers, less than 60 micrometers, greater than 30 micrometers, between 30 and 70 micrometers, etc. The thickness of spacer 254 (e.g., the dimension parallel to the Z direction) can be less than 150 micrometers, less than 100 micrometers, less than 80 micrometers, less than 60 micrometers, greater than 50 micrometers, greater than 70 micrometers, between 50 and 100 micrometers, etc. The thickness of conductive adhesive 258 (e.g., the dimension parallel to the Z direction) can be less than 250 micrometers, less than 150 micrometers, less than 100 micrometers, greater than 100 micrometers, greater than 120 micrometers, between 100 and 150 micrometers, etc.

[0178] Figure 30 The diagram illustrates how the adhesive tape 256 can be extended along the Y-direction. Each tape extends along a longitudinal axis parallel to the Y-direction. In other words, the length of each tape can be longer than the width of each tape, and the length of each tape can extend parallel to the Y-axis. This example is merely illustrative. If desired, the adhesive tape can alternatively extend parallel to the X-axis. Each tape can have a length that is more than 3 times, 5 times, 10 times, 20 times, or 50 times greater than the width, etc.

[0179] Figure 31 This is a rear view of the LED array 36, showing the relative positions of the conductive adhesive 258 and the adhesive layer 254. As shown, the conductive adhesive 258 extends around the periphery of the LED array. Figure 31 In the example, conductive adhesive 258 extends along the left, top, and right edges of the LED array (but not the bottom edge). Therefore, conductive adhesive 258 surrounds the LED array on three of the four sides. The area occupied by ground trace 260 (in...) Figure 29(As explicitly shown in the diagram) the area occupied by the conductive adhesive 258 can be the same as or approximately the same. In other words, the ground trace 260 also surrounds the LED array on three of the four sides (along the left edge, top edge, and right edge). The conductive adhesive 258 (and the ground trace 260) can be wired around the notch 62 in the LED array 36, as... Figure 31 As shown.

[0180] Adhesive layer 254 covers the central region of LED array 36. Adhesive layer 254 may have notches to accommodate notches 62 in LED array 36. Adhesive layer 254 may have an array of openings 264. Each opening 264 may be a through-hole extending completely through the adhesive layer (e.g., from a first surface of the adhesive layer to an opposite second surface of the adhesive layer). Openings 264 allow air to pass through during lamination, thereby reducing bubble formation. Each opening 264 may have a diameter (or width) greater than 0.1 mm, greater than 0.5 mm, greater than 1.0 mm, greater than 1.5 mm, greater than 3.0 mm, less than 0.1 mm, less than 0.5 mm, less than 1.0 mm, less than 1.5 mm, less than 3.0 mm, between 1.0 mm and 2.0 mm, etc. The total number of openings 264 in the adhesive layer 254 can be greater than 200, greater than 300, greater than 400, greater than 500, greater than 750, greater than 1000, less than 200, less than 300, less than 400, less than 500, less than 750, less than 1000, between 250 and 750, etc.

[0181] It should be noted that any adhesive layer mentioned herein (e.g., layer 82, layer 84, layer 90, layer 92, layer 152, layer 154, layer 176, layer 178, layer 254, layer 256, and layer 258) may be formed from pressure-sensitive adhesive (PSA), optically clear adhesive (OCA), liquid optically clear adhesive (LOCA), curing adhesive, or any other desired type of adhesive.

[0182] According to an embodiment, an electronic device is provided, comprising: a liquid crystal display panel; a backlight unit for providing backlight for the liquid crystal display panel, the backlight unit including an array of light-emitting diodes disposed in a light-emitting region, the light-emitting region having a notch and the notch having opposing first and second sides, a first reflective layer formed on the first side of the notch and a second reflective layer formed on the second side of the notch; and an input-output component formed in the notch between the first reflective layer and the second reflective layer.

[0183] According to another embodiment, the electronic device includes a housing in which the liquid crystal display panel and the backlight unit are formed. The electronic device includes a first protrusion and a second protrusion extending from the housing. The first reflective layer includes a first opening, and the second reflective layer includes a second opening. The first protrusion extends through the first opening, and the second protrusion extends through the second opening. The backlight unit includes an optical film formed above the light-emitting diode array, a third reflective layer formed on the optical film and overlapping the first reflective layer, and a fourth reflective layer formed on the optical film and overlapping the second reflective layer.

[0184] According to another embodiment, the backlight unit includes a first optical film, a second optical film, and a third optical film formed above the light-emitting diode array; a first adhesive patch formed between the first and second optical films and overlapping the first reflective layer; a second adhesive patch formed between the first and second optical films and overlapping the second reflective layer; a third adhesive patch formed between the second and third optical films and overlapping the first reflective layer and the first adhesive patch; and a fourth adhesive patch formed between the second and third optical films and overlapping the second reflective layer and the second adhesive patch.

[0185] According to another embodiment, the backlight unit includes a bracket overlapping the notch and a foam inserted between the bracket and the liquid crystal display panel. The electronic device includes an optical film formed above the light-emitting diode array, a first adhesive layer inserted between the bracket and the optical film, and a second adhesive layer inserted between the bracket and the foam. The bracket has an opening for accommodating the input-output component.

[0186] According to an embodiment, an electronic device is provided, comprising: a housing having a sidewall with an inner surface having a first portion and a second portion; a liquid crystal display panel in the housing; and a backlight unit in the housing providing backlight for the liquid crystal display panel, the backlight unit including an array of light-emitting diodes and a plurality of optical films formed above the array of light-emitting diodes, the edges of the plurality of optical films being adjacent to the first portion of the inner surface of the sidewall, and the first portion having a lower reflectivity than the second portion.

[0187] According to another embodiment, the backlight unit includes: a substrate on which the array of light-emitting diodes is formed; electronic components formed along the edge of the substrate; and a base having an orthogonal first portion and a second portion, wherein the liquid crystal display panel is mounted on the first portion of the base, the second portion of the base extends between the plurality of optical films and the electronic components, the edge of the substrate is a first edge, the substrate has a second edge opposite to the first edge, a notch is formed in the second edge, and the electronic device includes an input-output component formed in the notch.

[0188] According to an embodiment, an electronic device is provided, comprising: a lower housing; a keyboard in the lower housing, the lower housing having a high-rigidity portion; an upper housing having a housing wall connected to the lower housing via a hinge structure; a display in the upper housing, the display being parallel to the housing wall; and foam embedded in the housing wall, the foam having an area aligned with the high-rigidity portion of the lower housing when the lower housing and the upper housing are parallel.

[0189] According to another embodiment, the electronic device includes a touchpad in a lower housing, the high-rigidity portion having a first portion extending along the lower edge of the keyboard, a second portion extending along the left edge of the touchpad orthogonally to the first portion, and a third portion extending along the right edge of the touchpad orthogonally to the first portion, and the area occupied by the foam having a fourth portion aligned with the first portion, a fifth portion aligned with the second portion, and a sixth portion aligned with the third portion.

[0190] According to an embodiment, an electronic device is provided, the electronic device including a liquid crystal display panel and a backlight unit for providing backlight for the liquid crystal display panel, the backlight unit including: an array of light-emitting diodes, each light-emitting diode emitting blue light; and a color conversion layer that converts the blue light into white light, and the color conversion layer having properties that vary according to position across the color conversion layer.

[0191] According to another embodiment, the color conversion layer has a phosphor layer comprising red quantum dots and green quantum dots distributed in a resin, and the property is the thickness of the phosphor layer.

[0192] According to another embodiment, the thickness increases toward the edge of the color conversion layer.

[0193] According to another embodiment, the light-emitting diode array is arranged in multiple cells, and the thickness varies across the width of each cell.

[0194] According to another embodiment, the color conversion layer has a phosphor layer comprising red quantum dots, green quantum dots and scattering dopants distributed in a resin, and the property includes properties selected from the group consisting of: the concentration of the red quantum dots in the phosphor layer, the concentration of the green quantum dots in the phosphor layer, and the concentration of the scattering dopants in the phosphor layer.

[0195] According to an embodiment, an electronic device is provided, the electronic device including a liquid crystal display panel and a backlight unit for providing backlight for the liquid crystal display panel, the backlight unit including: a light-emitting diode array, at least one light diffusion layer formed above the light-emitting diode array, a color conversion layer formed above the at least one light diffusion layer, and a first brightness enhancement film formed above the color conversion layer, the color conversion layer including a first plurality of protrusions extending toward the first brightness enhancement film, and each of the first plurality of protrusions having a circular tip with a radius of curvature between 0.4 micrometers and 1.5 micrometers.

[0196] According to another embodiment, the backlight unit includes: a second brightness enhancement film formed above the first brightness enhancement film, the first brightness enhancement film including a second plurality of protrusions extending toward the second brightness enhancement film, and each of the second plurality of protrusions having a rounded tip with a radius of curvature between 0.4 micrometers and 1.5 micrometers; and a diffuser film formed above the second brightness enhancement film, the second brightness enhancement film including a third plurality of protrusions extending toward the diffuser film, and each of the third plurality of protrusions having a tip with a radius of curvature less than 0.3 micrometers.

[0197] According to an embodiment, an electronic device is provided, the electronic device including a liquid crystal display panel and a backlight unit for providing backlight for the liquid crystal display panel, the backlight unit including: an array of light-emitting diodes; an encapsulant plate formed above the array of light-emitting diodes; a plurality of color conversion patches formed on the upper surface of the encapsulant plate, each color conversion patch overlapping a corresponding light-emitting diode in the array of light-emitting diodes; at least one light diffusion layer formed on the array of light-emitting diodes; and a color conversion layer formed on the at least one light diffusion layer.

[0198] According to an embodiment, an electronic device is provided, the electronic device including a liquid crystal display panel and a backlight unit for providing backlight for the liquid crystal display panel, the backlight unit including: an array of light-emitting diodes; an encapsulant plate formed above the array of light-emitting diodes, the encapsulant plate including a plurality of recesses, each of the plurality of recesses being formed above a corresponding light-emitting diode of the array of light-emitting diodes; and at least one light diffusion layer formed above the array of light-emitting diodes.

[0199] According to an embodiment, an electronic device is provided, the electronic device including a liquid crystal display panel and a backlight unit for providing backlight for the liquid crystal display panel, the backlight unit including: an array of light-emitting diodes arranged in a plurality of units, each unit including at least one light-emitting diode, and the plurality of units including a first unit having a first size and a second unit having a second size different from the first size; and at least one light diffusion layer formed above the array of light-emitting diodes.

[0200] According to another embodiment, the plurality of units are arranged in rows and columns, with a first unit in the leftmost column of the column having a first width, a second unit in the center column of the column having a second width greater than the first width, and a third unit in the rightmost column of the column having the first width. The light-emitting diode array is arranged in a light-emitting region having an upper edge extending between the leftmost and rightmost columns of the column, and the light-emitting region having a notch along the upper edge. The top row of the row is interrupted by the notch, with a fourth unit in the top row having a first height, a fifth unit in the center row of the row having a second height less than the first height, an additional row of the row positioned below and adjacent to the notch, and a sixth unit in the additional row having a third height less than the second height.

[0201] According to an embodiment, an electronic device is provided, comprising: a housing having a housing wall; a liquid crystal display panel within the housing; and a backlight unit within the housing providing backlight for the liquid crystal display panel. The backlight unit includes: a substrate parallel to the housing wall; a light-emitting diode array mounted to the substrate; at least one light-diffusing layer formed above the light-emitting diode array; a first adhesive layer attached to the substrate and interposed between the substrate and the housing wall; a plurality of adhesive tapes attached between the first adhesive layer and the housing wall; and a conductive adhesive layer attached between the substrate and the housing wall.

[0202] The foregoing description is merely illustrative and various modifications can be made to the described implementation scheme. The described implementation scheme can be implemented independently or in any combination.

Claims

1. An electronic device, comprising: An outer casing having sidewalls having an inner surface, wherein the inner surface has a first portion and a second portion; The liquid crystal display panel in the housing; as well as The backlight unit in the housing provides backlighting for the liquid crystal display panel, wherein the backlight unit includes: LED array; Multiple optical films are formed above the light-emitting diode array, wherein the edges of the multiple optical films are adjacent to a first portion of the inner surface of the sidewall, and wherein the first portion has a lower reflectivity than the second portion; A substrate, wherein the array of light-emitting diodes is formed on the substrate; Electronic components formed along the edge of the substrate; and A base frame having orthogonal first and second portions, wherein the liquid crystal display panel is mounted on the first portion of the base frame, and wherein the second portion of the base frame extends between the plurality of optical films and the electronic components.

2. The electronic device of claim 1, wherein the edge of the substrate is a first edge, wherein the substrate has a second edge opposite to the first edge, wherein a notch is formed in the second edge, and wherein the electronic device includes an input-output component formed in the notch.

3. The electronic device of claim 1, wherein the first portion has a reflectivity between 35% and 45%.

4. The electronic device according to claim 1, wherein the liquid crystal display panel further comprises: Thin-film transistor substrate; as well as A conductive shielding ring extending around the periphery of the thin-film transistor substrate.

5. The electronic device according to claim 1, further comprising: The conductive decoration between the outer casing and the liquid crystal display panel; as well as A conductive adhesive is used to attach the conductive decoration to the housing.

6. The electronic device of claim 1, wherein the second portion of the inner surface of the sidewall comprises a metallic material, and wherein the first portion of the inner surface comprises a laser-darkened portion of the metallic material.

7. An electronic device, comprising: Lower outer shell; The keyboard is located in the lower housing, wherein the lower housing has a high-rigidity portion; An upper housing having a housing wall, wherein the upper housing is connected to the lower housing via a hinge structure; The display in the upper housing, wherein the display is parallel to the housing wall; Foam embedded in the outer shell wall, wherein when the lower outer shell and the upper outer shell are parallel, the foam has an area aligned with the high-rigidity portion of the lower outer shell; as well as The touchpad in the lower housing, wherein the high-rigidity portion has a first portion extending along the lower edge of the keyboard, a second portion extending along the left edge of the touchpad orthogonally to the first portion, and a third portion extending along the right edge of the touchpad orthogonally to the first portion, and wherein the area occupied by the foam has a fourth portion aligned with the first portion, a fifth portion aligned with the second portion, and a sixth portion aligned with the third portion.

8. An electronic device, comprising: LCD display panel; as well as A backlight unit that provides backlight for the liquid crystal display panel, wherein the backlight unit includes: An array of light-emitting diodes, wherein each light-emitting diode emits blue light; as well as A color conversion layer, wherein the color conversion layer converts the blue light into white light, wherein the color conversion layer has a central region and an edge, wherein the central region overlaps with a plurality of light-emitting diodes of the light-emitting diode array, wherein the color conversion layer has a thickness that varies according to its position across the color conversion layer, wherein the thickness is uniform in the central region of the color conversion layer, and wherein the thickness increases from the central region toward the edge.

9. An electronic device, comprising: LCD display panel; as well as A backlight unit that provides backlight for the liquid crystal display panel, wherein the backlight unit includes: LED array; At least one light diffusion layer is formed above the light-emitting diode array; A color conversion layer is formed above the at least one light diffusion layer; A first brightness enhancement film is formed above the color conversion layer, wherein the color conversion layer includes a first plurality of protrusions extending toward the first brightness enhancement film, and wherein each of the first plurality of protrusions has a rounded tip with a radius between 0.4 micrometers and 1.5 micrometers; A second brightness enhancement film formed above the first brightness enhancement film; and A diffusion film is formed above the second brightness enhancement film, wherein the second brightness enhancement film includes a second plurality of protrusions extending toward the diffusion film, and wherein each of the second plurality of protrusions has a tip with a radius of less than 0.3 micrometers.

10. An electronic device, comprising: LCD display panel; as well as A backlight unit that provides backlight for the liquid crystal display panel, wherein the backlight unit includes: LED array; An encapsulant plate is formed above the light-emitting diode array, wherein the encapsulant plate conforms to and directly contacts the light-emitting diode array; Multiple color-changing patches are formed directly on the upper surface of the encapsulant plate, wherein each color-changing patch overlaps with a corresponding light-emitting diode in the light-emitting diode array; At least one light diffusion layer formed above the light-emitting diode array; and A color conversion layer is formed above the at least one light diffusion layer.

11. An electronic device, comprising: LCD display panel; as well as A backlight unit that provides backlight for the liquid crystal display panel, wherein the backlight unit includes: An array of light-emitting diodes (LEDs) arranged in multiple units, wherein the multiple units are arranged in rows and columns, wherein the rows extend along a first direction, wherein the columns extend along a second direction orthogonal to the first direction, wherein each unit has a width extending along the first direction and a height extending along the second direction, wherein each unit includes at least one LED, wherein the LED array is arranged in a light-emitting region, wherein the light-emitting region has an edge extending along the first direction, wherein the light-emitting region has a notch in the edge, wherein the notch extends along the second direction, wherein a first row of the rows is interrupted by the notch, wherein a second row of the rows is not interrupted by the notch, wherein all units in the first row have a first height, and wherein all units in the second row have a second height less than the first height; and At least one light diffusion layer is formed above the light-emitting diode array.

12. The electronic device of claim 11, wherein all cells in the leftmost column of the column have a first width, and all cells in the central column of the column have a second width greater than the first width.

13. The electronic device of claim 12, wherein all cells in the rightmost column of the column have the first width.

14. The electronic device of claim 11, wherein the third row is not interrupted by the notch, wherein the third row is positioned adjacent to the notch, and wherein all units in the third row have a third height less than the second height.

15. An electronic device comprising: A shell with outer walls; The liquid crystal display panel in the housing; as well as The backlight unit in the housing provides backlighting for the liquid crystal display panel, wherein the backlight unit includes: A substrate parallel to the outer casing wall; An array of light-emitting diodes mounted on the substrate; At least one light diffusion layer is formed above the light-emitting diode array; A first adhesive layer is attached to the substrate, wherein the first adhesive layer is located between the substrate and the outer casing wall; A plurality of adhesive tapes attached between the first adhesive layer and the outer casing wall; and A conductive adhesive layer is attached between the substrate and the housing wall.

16. The electronic device of claim 15, wherein the first adhesive layer has a dielectric constant of less than 4.0, and wherein the first adhesive layer includes a plurality of through-holes.

17. The electronic device of claim 15, wherein the conductive adhesive layer has a first thickness, wherein each adhesive strip has a second thickness, wherein the first adhesive layer has a third thickness, wherein the first thickness is equal to the sum of the second thickness and the third thickness, wherein the substrate has a ground trace, and wherein the conductive adhesive electrically connects the ground trace to the housing wall.

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