Rapid design method and platform for processing module structure
By using process automation and data structuring design methods, the structural features of processing modules are automatically generated, solving the problems of large repetitive workload and poor consistency in traditional design. This achieves efficient and accurate module structure design and shortens the development cycle.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-23
- Publication Date
- 2026-04-07
AI Technical Summary
Traditional processing module structure design suffers from problems such as large repetitive workload, poor design consistency, and low collaborative efficiency. Furthermore, existing 3D modeling software lacks professional design templates and relies on manual operation, resulting in low efficiency and poor accuracy.
The design methodology employs process automation, data structuring, and model standardization. Parameters are obtained through a structured task book input tool, circuit design files are parsed, and a parametric modeling engine is used to automatically generate heat dissipation bosses, slots, and nameplates. Combined with a standard module template library and a chip structure element database, automated design is achieved.
It improved design efficiency, shortened the development cycle, enhanced design accuracy and standardization, reduced human experience errors, and strengthened the effectiveness of design data management.
Smart Images
Figure CN121809385A_ABST
Abstract
Description
Technical Field
[0001] This invention relates primarily to the field of industrial design technology, and in particular to a method and platform for rapid design of processing module structures. Background Technology
[0002] With the diversification and increasing complexity of demands for electronic equipment products, the shortening of product development cycles, and the intensification of market competition, there is an urgent need for designers to develop products that meet requirements, are reliable in quality, and have excellent performance within a short period of time. The processing module structure of electronic equipment such as radar is an important component, and the structural design cycle has a significant impact on the overall development cycle.
[0003] In the field of electronic equipment design and manufacturing, processing modules need to be adapted to the installation requirements of standard boxes. Their external dimensions, heat dissipation interfaces, connector layouts, etc., must all conform to industry standards (such as VPX, CPCI, etc.). Traditional design methods have the following defects: (1) Large amount of repetitive design work: Each PCB layout adjustment requires manual remodeling of structural features such as heat dissipation bosses and opening positions; (2) Poor design consistency: It is difficult to guarantee the standardization of manual modeling operations, which may cause design errors, resulting in excessive tolerance of interface positions and affecting the interchangeability of modules; (3) Low collaboration efficiency: Structural engineers and telecommunications design teams need to iterate and confirm parameters multiple times. Existing solutions such as general-purpose 3D modeling software (Pro / E, SolidWorks, etc.) provide parametric design functions, but lack specialized design templates for processing modules, and still require manual setting of feature parameters. Summary of the Invention
[0004] To address the core problems of low efficiency, poor accuracy, and reliance on manual experience in the development of traditional processing module structures in existing technologies, this invention provides a rapid design method and platform for processing module structures. Through innovative design involving process automation, data structuring, and model standardization, it improves design efficiency, enhances design quality, and shortens the development cycle.
[0005] To achieve the above objectives, the present invention provides a rapid design method for processing module structures, comprising the following steps: Step 1: Obtain module design parameters, including module name, nameplate information, heat dissipation method and environmental conditions, through the structured task book entry tool, and import the circuit design file; Step 2: Parse the circuit design file, extract the chip material code, location coordinates, and structural elements, and generate a structural design element table by associating it with the chip structural element database. The structural elements include external dimensions, soldering method, and heat dissipation data. External dimensions include chip height. Step 3: Based on the heat dissipation method, call the corresponding standard module template from the standard module template library. The standard module template includes a heat dissipation plate, a front panel, a puller, and predefined boss reference surface coordinates. Step 4: Based on the structural design element table and standard module template, automatically generate heat dissipation bosses, slots and nameplates through the parametric modeling engine; The height of the heat dissipation protrusion is calculated based on the chip height, soldering tolerance, and heat flux density. The slotting is divided into slotting that requires heat dissipation and slotting that does not require heat dissipation, and the slotting depth is calculated according to the heat flux density or safety margin respectively.
[0006] Furthermore, step 5 is included: Design verification and output: Verification is performed, including interference checks, thermal simulation verification, and manufacturability verification. Two-dimensional engineering drawings and three-dimensional assembly models containing external dimension annotations and welding method tolerance specifications are generated and pushed to the PDM system for archiving.
[0007] Furthermore, the two-dimensional engineering drawings are in DWG format, and the three-dimensional assembly model is in STEP format.
[0008] Furthermore, in step 2, when parsing the circuit design file, the chip material code is identified by the circuit diagram parsing tool, and the chip structure element database is linked to extract the external dimensions, welding method tolerance compensation value and heat dissipation data. The external dimensions include the chip height. Select the chips that require heat dissipation, input the heat dissipation data, and generate a structural design element table that includes heat dissipation requirement tags.
[0009] Furthermore, in step 3, the templates in the standard module template library conform to the VITA46 standard.
[0010] Furthermore, in step 4, the calculation logic for the height of the heat dissipation boss is as follows: heat dissipation boss height = chip height + soldering method tolerance compensation value + thermal pad thickness. The thermal pad thickness is obtained by matching the heat flux density from the preset thermal conductive material selection library, and the heat flux density is the ratio of heat loss to contact area.
[0011] Furthermore, in step 4, the grooving process includes: For slots requiring heat dissipation, the slot depth = chip height + soldering tolerance compensation value + thermal pad thickness; For slots that do not require heat dissipation, the slot depth = chip height + soldering tolerance compensation value + safety margin; The thickness of the thermally conductive pad is matched from a preset thermally conductive material selection library based on the heat flux density, which is the ratio of heat loss to contact area.
[0012] This invention also provides a rapid design platform for processing module structures, comprising: The structured task book entry module is used to input module design parameters and import circuit design files; The circuit diagram parsing module is used to extract the chip's material code, location coordinates, and structural elements, and to generate a structural design element table by associating it with the chip structural element database. Standard module template library, storing heat dissipation structure templates that conform to the VITA46 standard; The parametric modeling engine automatically generates heat dissipation bosses, slots, and nameplates based on the structural design element table and templates. The chip structure element database stores data including chip height, soldering method, and heat dissipation, and is linked to the PDM system and matched through material codes.
[0013] Furthermore, the parametric modeling engine integrates the following functions: The heat dissipation protrusion is located based on the mapping relationship between the chip's position coordinates and the template reference plane coordinates; The slot size is generated according to the stepped widening rule, with a margin of 1-2mm on each side.
[0014] Beneficial effects: This invention provides a method and platform for rapid design of processing module structures, which has the following beneficial effects: (1) Improve design efficiency and shorten development cycle: By inputting structured task book and intelligently parsing circuit diagrams, the cumbersome design process of traditional document transmission and manual extraction of design elements is replaced, reducing repetitive work; the heat dissipation boss and slotting machine nameplate are automatically generated based on the parsed structural elements (chip size, welding method, thermal parameters, etc.), and the design time is shortened from several days to hours; the VTIA46 standard module template library (air cooling / liquid cooling / conduction, etc.) is pre-set, and the adapter template is directly called and the reference coordinate is matched, saving the basic structure design link. (2) Improve design accuracy and standardization: The key parameters of the task book are forcibly standardized to avoid information omissions or format chaos in traditional documents; the circuit diagram parsing tool ensures accurate matching of chip size, welding tolerance and other data by matching chip material codes with the structural element library one by one; the height of the heat dissipation boss is calculated by comprehensively considering the chip height, welding method and heat flux density, and the slotting size is a step widening rule with a safety margin reserved to reduce human experience error. (3) Strengthen collaboration and improve data management efficiency: The entire process from task input to model archiving is online, and design data is traceable; standardized templates and databases reduce repetitive design and reduce reliance on designers' experience. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the architecture of the rapid design method for the processing module structure involved in this invention; Figure 2 This is a flowchart of the rapid design method for the processing module structure involved in this invention; Figure 3This is a schematic diagram of the interface of the rapid design platform for the processing module structure involved in the embodiments of the present invention; Figure 4 This is a schematic diagram of a standard template for an air-cooled processing module involved in an embodiment of the present invention. Detailed Implementation
[0016] The preferred mechanisms and implementation methods of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.
[0017] like Figures 1-4 As shown, the present invention provides a method and platform for rapid design of processing module structures. Figure 1 This is a schematic diagram of the architecture of the rapid design method for the processing module structure involved in this invention; Figure 2 This is a flowchart of the rapid design method for the processing module structure involved in this invention; Figure 3 This is a schematic diagram of the interface of the rapid design platform for the processing module structure involved in the embodiments of the present invention; Figure 4 This is a schematic diagram of a standard template for an air-cooled processing module involved in an embodiment of the present invention.
[0018] Example 1: This invention provides a method for rapid design of a processing module structure, comprising the following steps: Step 1: Obtain module design parameters, including module name, nameplate information, heat dissipation method and environmental conditions, through the structured task book entry tool, and import the circuit design file.
[0019] Step 2: Parse the circuit design file, extract the chip material code, location coordinates, and structural elements, and generate a structural design element table by associating it with the chip structural element database. The structural elements include external dimensions, soldering method, and heat dissipation data. External dimensions include chip height. When parsing circuit design documents, the chip material code is identified by the circuit diagram parsing tool, and the chip structure element database is linked to extract the external dimensions, soldering method tolerance compensation value and heat dissipation data. The external dimensions include the chip height. Select the chips that require heat dissipation, input the heat dissipation data, and generate a structural design element table that includes heat dissipation requirement tags.
[0020] Step 3: Based on the heat dissipation method, call the corresponding standard module template from the standard module template library. The standard module template includes a heat dissipation plate, a front panel, a puller, and predefined boss reference surface coordinates. In this embodiment, the templates in the standard module template library conform to the VITA46 standard.
[0021] Step 4: Based on the structural design element table and standard module template, automatically generate heat dissipation bosses, slots and nameplates through the parametric modeling engine; The height of the heat dissipation protrusion is calculated based on the chip height, soldering tolerance, and heat flux density. The slotting is divided into slotting that requires heat dissipation and slotting that does not require heat dissipation, and the slotting depth is calculated according to heat flux density or safety margin respectively. The calculation logic for the height of the heat dissipation bump is: Heat dissipation bump height = chip height + soldering method tolerance compensation value + thermal pad thickness; The grooving process includes: For slots requiring heat dissipation, the slot depth = chip height + soldering tolerance compensation value + thermal pad thickness; For slots that do not require heat dissipation, the slot depth = chip height + soldering tolerance compensation value + safety margin; The thickness of the thermally conductive pad is matched from a preset thermally conductive material selection library based on the heat flux density, which is the ratio of heat loss to contact area.
[0022] Step 5: Design Verification and Output: Perform verification, including interference checks, thermal simulation verification, and manufacturability verification. Generate DWG format 2D engineering drawings and STEP format 3D assembly models containing external dimension annotations and welding method tolerance specifications, and push them to the PDM system for archiving.
[0023] Example 2: This example is basically the same as Example 1, except that this example takes the structural design of a certain air-cooled VITA46 standard processing module as an example to illustrate the rapid design process based on the process-driven platform.
[0024] Step 1: Create a structured task description and import circuit diagrams (1) Task entry Telecommunications designers log into the design platform and enter the following information in the structured task description interface: Module Name: XX Type Radar Signal Processing Module; Nameplate information: Model: VITA46-X1; Version: Rev2.0; Drawing number: STR-2023-001; Heat dissipation method: Air cooling (forced convection); Environmental conditions: Operating temperature -40℃~85℃; wind speed 3m / s.
[0025] (2) Circuit diagram analysis Import the circuit diagram file (e.g., '.brd' format). The platform will then use the circuit diagram parsing tool to perform the following operations: Chip identification: Extract the material code (e.g., 'IC-001'), position coordinates (X1=15mm, Y1=20mm), external dimensions (10mm×10mm), and soldering method (e.g., BGA package) of all chips in the circuit diagram.
[0026] Structural element generation: Based on the material code and the associated chip structural element database, a structural design element table (such as Table 1) is automatically generated, which includes information such as chip height, welding tolerance, and heat dissipation (such as chip A heat dissipation of 5W).
[0027] Heat dissipation requirement annotation: Designers select the chips that need heat dissipation (such as chips A and B) and enter the heat dissipation value and heat flux density requirements.
[0028] Step 2: Call the standard module template library (1) Template selection Based on the "air cooling" requirement in the task description, the platform retrieves the VITA46 air cooling standard module template (such as...) from the template library. Figure 3 As shown), the template pre-sets the following components: Heat dissipation plate (material: 6061 aluminum alloy; thickness: 8mm; fin spacing: 3mm...); Panel (interface layout conforms to VITA46 specification); Puller, cover plate and mounting holes.
[0029] (2) Benchmark definition matching The platform reads the coordinates of the boss reference surface of the heat dissipation plate in the template (such as the origin O(0,0,0)) and the ID identifier (such as 'Ref_Surface1'), and performs spatial mapping with the chip position coordinates analyzed from the circuit diagram to provide a positioning reference for parametric modeling.
[0030] Step 3: Parametric modeling engine generates structural features (1) Formation of heat dissipation bosses Position and Dimensions: Based on the position coordinates (X1, Y1) and external dimensions (10mm × 10mm) of chip A, a corresponding boss is generated on the heat sink, with the planar dimensions extended to 12mm × 12mm (including a 1mm margin on one side). Height Calculation: Base height: Chip A height 2.0mm (including solder balls).
[0031] Soldering impact: The soldering tolerance for BGA packages is ±0.1mm, and a compensation height of 0.2mm needs to be reserved.
[0032] Heat flux density correction: Chip A has a heat dissipation of 5W, a contact area of 144mm², a heat flux density of 34.7W / m², and a matching thermal pad thickness of 0.5mm (matched by thickness-thermal resistance relationship in the selection library).
[0033] Final boss height: 2.0mm (chip) + 0.2mm (tolerance) + 0.5mm (pad) = 2.7mm.
[0034] (2) Grooving treatment Thermal slotting required: Chip C height 4.0mm (exceeding the cold plate's safety clearance), a slot needs to be cut in the cold plate and a thermal pad needs to be attached. The slot size is 2mm wider than the chip size (1mm margin on each side), and the depth calculation is the same as for the boss logic, with a final depth of 4.5mm.
[0035] No heat dissipation slotting required: The chip D height is 3.5mm. Based on the chip height + soldering tolerance (0.1mm) + safety margin (0.4mm), the slotting depth is 3.5 + 0.1 + 0.4 = 4.0mm.
[0036] (3) Nameplate automatically generated The platform reads the nameplate information "VITA46-X1" from the task sheet and fills it into the preset nameplate area (upper right corner of the panel). The font and font size are automatically matched according to the standard template parameters.
[0037] Step 4: Design Verification and Output (1) Design verification Export the model and perform interference checks, thermal simulation verification, and manufacturability verification.
[0038] (2) Engineering drawing output Generate 2D engineering drawings (DWG format) and 3D assembly models (STEP format) containing dimensions and tolerances, and push them to the PDM system for archiving.
[0039] Example 3: This embodiment of the invention provides a rapid design platform for processing module structures, including: The structured task description input module is used to input module design parameters and import circuit design files.
[0040] The circuit diagram analysis module is used to extract the chip's material code, location coordinates, and structural elements, and to generate a structural design element table by associating it with the chip structural element database.
[0041] A standard module template library stores heat dissipation structure templates that conform to the VITA46 standard.
[0042] The parametric modeling engine automatically generates heat dissipation bosses, slots, and nameplates based on the structural design element table and templates. The parametric modeling engine integrates the following features: The heat dissipation protrusion is located based on the mapping relationship between the chip's position coordinates and the template reference plane coordinates; The slot size is generated according to the stepped widening rule, with a margin of 1-2mm on each side.
[0043] The chip structure element database stores data including chip height, soldering method, and heat dissipation. It is linked to the PDM system and matched using material codes. The chip data in the chip structure element database includes 3D models, soldering tolerance ranges, and heat flux density-thermal pad thickness matching tables.
[0044] This invention provides a method and platform for rapid design of processing module structures. Through innovative design methods such as process automation, data structuring, and model standardization, it improves design efficiency, enhances design quality, and shortens the development cycle.
[0045] Finally, it should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. However, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A method for rapid design of processing module structure, characterized in that, Includes the following steps: Step 1: Obtain module design parameters, including module name, nameplate information, heat dissipation method and environmental conditions, through the structured task book entry tool, and import the circuit design file; Step 2: Parse the circuit design file, extract the chip material code, location coordinates, and structural elements, and generate a structural design element table by associating it with the chip structural element database. The structural elements include external dimensions, soldering method, and heat dissipation data. External dimensions include chip height. Step 3: Based on the heat dissipation method, call the corresponding standard module template from the standard module template library. The standard module template includes a heat dissipation plate, a front panel, a puller, and predefined boss reference surface coordinates. Step 4: Based on the structural design element table and standard module template, automatically generate heat dissipation bosses, slots and nameplates through the parametric modeling engine; The height of the heat dissipation protrusion is calculated based on the chip height, soldering tolerance, and heat flux density. The slotting is divided into slotting that requires heat dissipation and slotting that does not require heat dissipation, and the slotting depth is calculated according to heat flux density or safety margin respectively.
2. The rapid design method for processing module structure according to claim 1, characterized in that, It also includes step 5: Design verification and output: Perform verification, including interference check, thermal simulation verification, and manufacturability verification, generate two-dimensional engineering drawings and three-dimensional assembly models containing external dimension annotations and welding method tolerance specifications, and push them to the PDM system for archiving.
3. The rapid design method for the processing module structure according to claim 2, characterized in that, Two-dimensional engineering drawings are in DWG format, and three-dimensional assembly models are in STEP format.
4. The rapid design method for processing module structure according to claim 1, characterized in that, In step 2, when parsing the circuit design file, the chip material code is identified by the circuit diagram parsing tool, and the chip structure element database is linked to extract the external dimensions, soldering method tolerance compensation value and heat dissipation data. The external dimensions include the chip height. Select the chips that require heat dissipation, input the heat dissipation data, and generate a structural design element table that includes heat dissipation requirement tags.
5. The rapid design method for the processing module structure according to claim 4, characterized in that, In step 3, the templates in the standard module template library conform to the VITA46 standard.
6. The rapid design method for the processing module structure according to claim 4, characterized in that, In step 4, the calculation logic for the height of the heat dissipation bump is as follows: Heat dissipation bump height = chip height + soldering method tolerance compensation value + thermal pad thickness. The thermal pad thickness is obtained by matching the heat flux density from the preset thermal material selection library. The heat flux density is the ratio of heat loss to contact area.
7. The rapid design method for the processing module structure according to claim 4, characterized in that, Step 4, the grooving process includes: For slots requiring heat dissipation, the slot depth = chip height + soldering tolerance compensation value + thermal pad thickness; For slots that do not require heat dissipation, the slot depth = chip height + soldering tolerance compensation value + safety margin; The thickness of the thermally conductive pad is matched from a preset thermally conductive material selection library based on the heat flux density, which is the ratio of heat loss to contact area.
8. A rapid design platform for processing module structures, characterized in that, include: The structured task book entry module is used to input module design parameters and import circuit design files; The circuit diagram parsing module is used to extract the chip's material code, location coordinates, and structural elements, and to generate a structural design element table by associating it with the chip structural element database. Standard module template library, storing heat dissipation structure templates that conform to the VITA46 standard; The parametric modeling engine automatically generates heat dissipation bosses, slots, and nameplates based on the structural design element table and templates. The chip structure element database stores data including chip height, soldering method, and heat dissipation, and is linked to the PDM system and matched through material codes.
9. The rapid design platform for the processing module structure according to claim 8, characterized in that, The parametric modeling engine integrates the following features: The heat dissipation protrusion is located based on the mapping relationship between the chip's position coordinates and the template reference plane coordinates; The slot size is generated according to the stepped widening rule, with a margin of 1-2mm on each side.