Electronic wafer quality detection device

Abstract

An electronic wafer quality detection device disclosed by the present invention comprises an outer frame, a rotary type dynamic detection table, a wafer edge detection assembly and a turnover adjustment mechanism, the outer frame is a frame type structure composed of a plurality of groups of metal rods, and the rotary type dynamic detection table is installed in the outer frame and comprises a machine body, a placing disc, a driving motor and a tray. One side of the machine body is connected with a control cabinet, the placing disc is installed at the top of the machine body, the driving motor is installed at the center of the placing disc, the power output end of the driving motor is connected with the tray, the tray is located at the center of the swing disc, and the wafer edge detection assembly comprises a transverse displacement device, a vertical plate, an edge burr detection disc and a telescopic image acquisition plate. The transverse shifter is installed at the top of the machine body, the vertical plate is installed at the inner end of the transverse shifter, and the edge burr detection disc is installed on the vertical plate. The electronic wafer physical quality detection equipment designed by the invention can detect and process all-around physical defects of the edge, the upper surface and the lower surface of the electronic wafer, and the detection effect is improved.

Description

Technical Field

[0001] This invention relates to the field of electronic wafer technology, specifically to an electronic wafer quality inspection device. Background Technology

[0002] Electronic wafers refer to silicon wafers used to fabricate silicon semiconductor circuits. Their raw material is silicon; high-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, then slowly pulled out to form cylindrical single-crystal silicon. After grinding, polishing, and slicing, the silicon ingot forms a silicon wafer, or wafer. Domestic wafer production lines mainly use 8-inch and 12-inch wafers. The main wafer processing methods are wafer fabrication and batch processing, which involves processing one or more wafers simultaneously. As semiconductor feature sizes become smaller and processing and measurement equipment becomes more advanced, new data characteristics have emerged in wafer processing. Simultaneously, the reduction in feature size increases the impact of airborne particles on the quality and reliability of the processed wafer. Furthermore, with improved cleanliness, new data characteristics regarding particle count have emerged. During the production and processing of electronic wafers, quality inspection is required, including the detection of physical defects on the surface of the electronic wafer.

[0003] However, existing electronic wafer quality inspection equipment has the following problems in the process of detecting physical defects in electronic wafers: it mainly targets physical defects on the surface of the wafer body, lacks targeted detection methods for wafer edges, and often requires specific wafer inspection equipment for different wafer sizes. Furthermore, the automation and intelligence levels for wafer physical defect detection are not high. Therefore, it is necessary to design corresponding technical solutions to address these problems. Summary of the Invention

[0004] The purpose of this invention is to provide an electronic wafer quality inspection device that solves the technical problem of mainly detecting physical defects on the surface of the wafer body, lacking a targeted detection method for the edge position of the wafer body, and often requiring corresponding wafer inspection equipment for quality inspection of wafers of different sizes, resulting in low automation and intelligence in wafer physical defect detection.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an electronic wafer quality inspection device, comprising an outer frame, a rotating dynamic inspection stage, a wafer edge detection assembly, and a flipping adjustment mechanism. The outer frame is a frame structure composed of several sets of metal rods. The rotating dynamic inspection stage is installed inside the outer frame and includes a body, a placement tray, a drive motor, and a pallet. A control cabinet is connected to one side of the body. The placement tray is installed on the top of the body. The drive motor is installed at the center of the placement tray, and its power output end is connected to the pallet. The pallet is located at the center of the oscillating disk. The wafer edge detection assembly includes a lateral displacement device, a vertical plate, an edge burr detection disk, and a telescopic image acquisition plate. The lateral displacement device is installed on the top of the body, and the vertical plate is installed at the inner end of the lateral displacement device. The edge burr detection disk... Mounted on a vertical plate, the telescopic image acquisition plate includes a telescopic plate, a driver, and image acquisition cameras. The telescopic plate has a two-section structure, including a hollow plate and a pull plate that is movably inserted through the hollow plate. The driver is mounted on the hollow plate and works in conjunction with the pull plate. The image acquisition cameras are arranged in several groups and evenly installed at the bottom of the hollow plate and the pull plate. The flip adjustment mechanism includes a guide plate, a guide, a collar, an electric push rod, a drive motor, and a clamp. The guide plate has a hollow internal structure and a guide groove on its surface. The guide is mounted on one end of the guide plate. The collar is movably fitted onto the guide plate and works in conjunction with the guide. The electric push rod is vertically mounted below the collar and its lower end is connected to the drive motor. The power output end of the drive motor is connected to the clamp.

[0006] In a preferred embodiment of the present invention, the placement tray has a disc-shaped structure and several sets of embedded holes are evenly distributed along its edge. Ball bearings are movably embedded in the embedded holes, and the top height of the ball bearings is the same as the top height of the tray.

[0007] In a preferred embodiment of the present invention, the lateral displacement device includes a guide block and a rack horizontally inserted within the guide block. A motor is provided on one side of the guide block, and a drive gear is installed at the power output end of the motor. The drive gear meshes with the rack, and the inner end of the rack is connected to the vertical plate.

[0008] In a preferred embodiment of the present invention, the edge burr detection disc includes an upper disc body, a lower disc body, a vibration sensor, and a contact plate. The upper disc body and the lower disc body are arranged symmetrically above and below each other and a movable groove is formed between them. The vibration sensor is installed on the inner wall of the movable groove and its detection end is connected to the contact plate.

[0009] In a preferred embodiment of the present invention, the surface of the contact plate has a smooth arc structure and is in contact with the edge of the electronic wafer to be tested.

[0010] In a preferred embodiment of the present invention, the driver includes an electric push rod II and a connecting block installed on the power output end of the electric push rod II. The electric push rod II is installed on a hollow plate, and the connecting block is fixed to a pull plate.

[0011] In a preferred embodiment of the present invention, the guide includes a second motor and a screw mounted on the power output end of the second motor, wherein a slider is fitted on the screw and the slider is connected to a collar.

[0012] In a preferred embodiment of the present invention, the clamp includes a disc body with a floating groove on its surface and two sets of clamping plates movably disposed in the floating groove. A micro hydraulic cylinder is installed at the upper and lower ends of the floating groove. The power output end of the micro hydraulic cylinder is connected to the clamping plate. A pressure sensor is embedded in the inner side of the clamping plate.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0014] 1. This invention designs a device specifically for physical quality inspection of electronic wafers. The device includes an outer frame, a rotating dynamic inspection stage, a wafer edge detection component, and a flipping adjustment mechanism. When surface defects of an electronic wafer need to be detected, the electronic wafer is placed on the rotating dynamic inspection stage. The stage rotates the wafer body, while the wafer edge detection component automatically adjusts according to the wafer's diameter and edge position. This allows the wafer edge detection component to acquire and detect images of burrs and the surface of the wafer edge. After one side is inspected, the flipping adjustment mechanism flips the wafer and inspects the other side, greatly improving the comprehensiveness and automation of electronic wafer surface inspection.

[0015] 2. The electronic wafer physical quality inspection equipment designed in this invention can detect and process physical defects in all directions on the edges and upper and lower surfaces of electronic wafers, thereby improving the inspection effect. Attached Figure Description

[0016] Figure 1 This is an overall structural diagram of the present invention;

[0017] Figure 2 This is a structural diagram of the wafer edge detection component described in this invention;

[0018] Figure 3 This is a structural diagram of the edge burr detection disk in its split state as described in this invention;

[0019] Figure 4 This is a partial structural diagram of the present invention (A section).

[0020] Figure 5 This is a structural diagram of the clamp described in this invention.

[0021] In the diagram: 1. Outer frame; 2. Machine body; 3. Placement tray; 4. Drive motor; 5. Pallet; 6. Control cabinet; 7. Lateral displacement device; 8. Vertical plate; 9. Edge burr detection tray; 10. Telescopic image acquisition plate; 11. Telescopic plate; 12. Driver; 13. Image acquisition camera; 14. Hollow plate; 15. Pull plate; 16. Guide plate; 17. Guide; 18. Collar; 19. Electric push rod one; 20. Drive motor; 21. Clamping device; 2 2. Guide groove; 23. Embedded hole; 24. Ball bearing; 25. Guide block; 26. Rack; 27. Motor 1; 28. Drive gear; 29. ​​Upper plate; 30. Lower plate; 31. Vibration sensor; 32. Contact plate; 33. Movable groove; 34. Electric push rod 2; 35. Connecting block; 36. Motor 2; 37. Screw; 38. Slider; 39. Floating groove; 40. Plate; 41. Clamping plate; 42. Miniature hydraulic cylinder; 43. Pressure sensor. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] Please see Figure 1-5This invention provides a technical solution: an electronic wafer quality inspection device, comprising an outer frame 1, a rotating dynamic inspection stage, a wafer edge detection assembly, and a flipping adjustment mechanism. The outer frame 1 is a frame structure composed of several sets of metal rods. The rotating dynamic inspection stage is installed inside the outer frame 1 and includes a body 2, a placement tray 3, a drive motor 4, and a tray 5. A control cabinet 6 is connected to one side of the body 2. The placement tray 3 is installed on the top of the body 2. The drive motor 4 is installed at the center of the placement tray 3, and its power output end is connected to the tray 5. The tray 5 is located at the center of the swing plate. The wafer edge detection assembly includes a lateral displacement device 7, a vertical plate 8, an edge burr detection tray 9, and a telescopic image acquisition plate 10. The lateral displacement device 7 is installed on the top of the body 2. The vertical plate 8 is installed at the inner end of the lateral displacement device 7. The edge burr detection tray 9 is installed on the vertical plate 8. The telescopic image acquisition plate 10 is installed on the vertical plate 8. The upper part includes a telescopic plate 11, a driver 12, and an image acquisition camera 13. The telescopic plate 11 has a two-section structure and includes a hollow plate 14 and a pull plate 15 that is movably inserted into the hollow plate 14. The driver 12 is installed on the hollow plate 14 and works in conjunction with the pull plate 15. The image acquisition camera 13 is divided into several groups and evenly installed at the bottom of the hollow plate 14 and the pull plate 15. The flip adjustment mechanism includes a guide plate 16, a guide 17, a collar 18, an electric push rod 19, a drive motor 20, and a clamp 21. The guide plate 16 has a hollow structure inside and a guide groove 22 is opened on its surface. The guide 17 is installed at one end of the guide plate 16. The collar 18 is movably fitted on the guide plate 16 and works in conjunction with the guide 17. The electric push rod 19 is vertically installed below the collar 18 and its lower end is connected to the drive motor 20. The power output end of the drive motor 20 is connected to the clamp 21.

[0024] Further improvements, such as Figure 1 As shown, the placement tray 3 has a disc-shaped structure and several sets of embedded holes 23 are evenly opened on the edge. The embedded holes 23 are movably embedded with ball bearings 24. The top height of the ball bearings 24 is the same as the top height of the tray 5. The electronic wafer is placed on the tray 5 and the ball bearings 24 to keep the electronic wafer in a horizontal state for processing.

[0025] Further improvements, such as Figure 2 As shown, the lateral displacement device 7 includes a guide block 25 and a rack 26 horizontally inserted in the guide block 25. A motor 27 is provided on one side of the guide block 25. A drive gear 28 is installed at the power output end of the motor 27. The drive gear 28 meshes with the rack 26. The inner end of the rack 26 is connected to the vertical plate 8. The motor 27 drives the drive gear 28 to rotate. During the rotation, the drive gear 28 drives the rack 26 to move laterally, thereby adjusting the position of the edge burr detection disk 9.

[0026] Further improvements, such as Figure 3As shown, the edge burr detection disk 9 includes an upper disk 29, a lower disk 30, a vibration sensor 31, and a contact plate 32. The upper disk 29 and the lower disk 30 are symmetrically arranged vertically and a movable groove 33 is formed between them. The vibration sensor 31 is installed on the inner wall of the movable groove 33 and its detection end is connected to the contact plate 32. The edge of the electronic wafer rotates along the movable groove 33. When there are burrs or protrusions on the edge of the electronic wafer, they act on the contact plate 32 and the vibration sensor 31. The vibration sensor 31 senses and provides feedback, indicating that there is a problem with the edge of the electronic wafer.

[0027] Further improvements, such as Figure 3 As shown, the surface of the contact plate 32 has a smooth arc structure and is in contact with the edge of the electronic wafer to be tested. This design allows the vibration sensor 31 to detect and provide feedback when burrs or protrusions on the edge of the electronic wafer come into contact with the contact plate 32.

[0028] Further improvements, such as Figure 4 As shown, the driver 12 includes an electric push rod 34 and a connecting block 35 installed on the power output end of the electric push rod 34. The electric push rod 34 is installed on the hollow plate 14, and the connecting block 35 is fixed on the pull plate 15. The length of the telescopic plate 11 can be adjusted by pushing the pull plate 15 to move laterally through the electric push rod 34.

[0029] Further improvements, such as Figure 1 and 4 As shown, the guide 17 includes a second motor 36 and a screw 37 installed at the power output end of the second motor 36. A slider 38 is fitted on the screw 37 and the slider 38 is connected to the collar 18. The second motor 36 drives the screw 37 to rotate. During the rotation, the screw 37 drives the slider 38 and the collar 18 to move laterally, which can move the clamp 21 to the edge of the electronic wafer and perform clamping operation.

[0030] Specifically, the clamp 21 includes a disc 40 with a floating groove 39 on its surface and two sets of clamping plates 41 movably disposed within the floating groove 39. A micro hydraulic cylinder 42 is installed at both the upper and lower ends of the floating groove 39. The power output end of the micro hydraulic cylinder 42 is connected to the clamping plate 41. A pressure sensor 43 is embedded in the inner side of the clamping plate 41. The clamping plate 41 is moved longitudinally by the micro hydraulic cylinder 42, and the electronic wafer can be clamped by the two sets of clamping plates 41. During the clamping process, the clamping force is detected by the pressure sensor 43 to avoid damage to the electronic wafer.

[0031] In use: When physical defect detection of an electronic wafer is required, the electronic wafer to be inspected is placed on tray 5 and ball bearing 24. Simultaneously, the dimensions of the electronic wafer are input into the detection device. Control cabinet 6 adjusts the position of the wafer edge detection component according to the radius of the electronic wafer. Motor 1 27 drives drive gear 28 to rotate. During rotation, drive gear 28 drives rack 26 to move laterally, thereby adjusting the position of edge burr detection disk 9 so that the edge of the electronic wafer is placed within the movable slot 33. Simultaneously, according to the radius of the electronic wafer, electric push rod 2 34 pushes pull plate 15 laterally, adjusting the length of telescopic plate 11 so that its length equals the radius of the electronic wafer. Image acquisition camera 13 faces the electronic wafer below. At this time, drive motor 4 drives tray 5 to rotate, and tray 5 drives the electronic wafer to rotate slowly and synchronously. During rotation, edge burr detection disk 9 and telescopic image acquisition plate 10 are used to detect defects in the electronic wafer. The edges and surface of the electronic wafer are inspected. When burrs or protrusions are present on the edge of the electronic wafer, they are applied to the contact plate 32 and vibration sensor 31. The vibration sensor 31 detects and provides feedback, indicating that there is a problem with the edge of the electronic wafer. The image acquisition camera 13 acquires an image of the surface of the electronic wafer and compares it with the background database to determine whether there is a defect. After one side of the electronic wafer is inspected, the screw 37 is rotated by the motor 36. During the rotation of the screw 37, the slider 38 and the collar 18 move laterally, which can move the clamp 21 to the edge of the electronic wafer and perform a clamping operation. The clamping plate 41 is pushed longitudinally by the micro hydraulic cylinder 42. The electronic wafer can be clamped by two sets of clamping plates 41. During the clamping process, the clamping force is detected by the pressure sensor 43 to avoid damage to the electronic wafer. Then, the drive motor 20 drives the clamp 21 and the electronic wafer to rotate, so that the electronic wafer is flipped and placed on the platform for further inspection.

[0032] In the description of this invention, it should be understood that the terms "coaxial," "bottom," "one end," "top," "middle," "other end," "upper," "side," "top," "inner," "front," "center," "both ends," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0033] Furthermore, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first," "second," "third," or "fourth" may explicitly or implicitly include at least one of those features.

[0034] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "setting," "connection," "fixing," "screw connection," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0035] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An electronic wafer quality inspection device, characterized in that: The system includes an outer frame (1), a rotating dynamic inspection stage, a wafer edge inspection assembly, and a flip adjustment mechanism. The outer frame (1) is a frame structure composed of several sets of metal rods. The rotating dynamic inspection stage is installed inside the outer frame (1) and includes a body (2), a placement tray (3), a drive motor (4), and a pallet (5). A control cabinet (6) is connected to one side of the body (2). The placement tray (3) is installed on the top of the body (2). The drive motor (4) is installed at the center of the placement tray (3), and its power output end is connected to the pallet (6). 5) Connected, the tray (5) is located at the center of the swing disk, the wafer edge detection assembly includes a lateral displacement device (7), a vertical plate (8), an edge burr detection disk (9) and a telescopic image acquisition plate (10), the lateral displacement device (7) is installed on the top of the body (2), the vertical plate (8) is installed at the inner end of the lateral displacement device (7), the edge burr detection disk (9) is installed on the vertical plate (8), and the telescopic image acquisition plate (10) is installed on the vertical plate (8) and includes a telescopic plate (11) and a driver. (12) and image acquisition camera (13), the telescopic plate (11) is a two-section structure including a hollow plate (14) and a pull plate (15) that is movably inserted on the hollow plate (14), the driver (12) is installed on the hollow plate (14) and used in conjunction with the pull plate (15), the image acquisition camera (13) is divided into several groups and evenly installed at the bottom of the hollow plate (14) and the pull plate (15), the flip adjustment mechanism includes a guide plate (16), a guide (17), a collar (18), and an electric push rod. (19), drive motor (20) and clamp (21), the guide plate (16) has a hollow structure inside and a guide groove (22) is opened on the surface, the guide (17) is installed at one end of the guide plate (16), the collar (18) is movably fitted on the guide plate (16) to cooperate with the guide (17), the electric push rod (19) is vertically installed below the collar (18) and its lower end is connected to the drive motor (20), and the power output end of the drive motor (20) is connected to the clamp (21).

2. The electronic wafer quality inspection device according to claim 1, characterized in that: The placement tray (3) has a disc-shaped structure and several sets of embedded holes (23) are evenly opened on the edge. A ball bearing (24) is movably embedded in the embedded hole (23). The top height of the ball bearing (24) is the same as the top height of the tray (5).

3. The electronic wafer quality inspection device according to claim 1, characterized in that: The lateral displacement device (7) includes a guide block (25) and a rack (26) horizontally inserted in the guide block (25). A motor (27) is provided on one side of the guide block (25). A drive gear (28) is installed at the power output end of the motor (27). The drive gear (28) meshes with the rack (26). The inner end of the rack (26) is connected to the vertical plate (8).

4. The electronic wafer quality inspection device according to claim 1, characterized in that: The edge burr detection disc (9) includes an upper disc body (29), a lower disc body (30), a vibration sensor (31), and a contact plate (32). The upper disc body (29) and the lower disc body (30) are arranged symmetrically above and below each other and a movable groove (33) is formed between them. The vibration sensor (31) is installed on the inner wall of the movable groove (33) and its detection end is connected to the contact plate (32).

5. The electronic wafer quality inspection device according to claim 4, characterized in that: The surface of the contact plate (32) is a smooth arc structure and is in contact with the edge of the electronic wafer to be tested.

6. The electronic wafer quality inspection device according to claim 1, characterized in that: The driver (12) includes an electric push rod two (34) and a connecting block (35) installed on the power output end of the electric push rod two (34). The electric push rod two (34) is installed on the hollow plate (14), and the connecting block (35) is fixed on the pull plate (15).

7. The electronic wafer quality inspection device according to claim 1, characterized in that: The guide (17) includes a second motor (36) and a screw (37) installed at the power output end of the second motor (36). A slider (38) is fitted on the screw (37), and the slider (38) is connected to the collar (18).

8. The electronic wafer quality inspection device according to claim 1, characterized in that: The clamp (21) includes a disc (40) with a floating groove (39) on its surface and two sets of clamps (41) movably disposed in the floating groove (39). A micro hydraulic cylinder (42) is installed at the upper and lower ends of the floating groove (39). The power output end of the micro hydraulic cylinder (42) is connected to the clamp (41). A pressure sensor (43) is embedded in the inner side of the clamp (41).

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