Multi-physics coupling analysis method and device for millimeter wave radar front-end array antenna

Abstract

The invention provides a multi-physics coupling analysis method and device for a millimeter wave radar front-end array antenna. The method provided by the invention comprises the following steps: constructing a three-dimensional model comprising a millimeter-wave radar front-end array antenna and a matched chip; performing electrical performance simulation on the three-dimensional model by adopting an electromagnetic simulation tool to obtain power loss data and initial electrical performance parameters of the antenna and the chip; inputting the power loss data as a heat source into a multi-physical field simulation tool, performing thermal field simulation to obtain temperature distribution data, and performing force field simulation in combination with the temperature distribution data, power density and electromagnetic force distribution to obtain structural deformation and stress distribution data; temperature distribution, structural deformation and stress distribution data are fed back to the electromagnetic simulation tool through bidirectional coupling, electrical performance simulation is conducted again, coupled electrical performance parameters are obtained, and multi-physics coupling analysis is conducted by comparing the electrical performance parameters with initial electrical performance parameters.

Description

Technical Field

[0001] This application relates to the field of radio frequency microsystems technology, and in particular to a multi-physics coupling analysis method and apparatus for millimeter-wave radar front-end array antennas. Background Technology

[0002] With the rapid development of modern technology, millimeter-wave radar front-end array antennas play a crucial role in many fields, making multi-physics coupling analysis of them essential.

[0003] Currently, the analysis methods for millimeter-wave radar front-end array antennas are mainly divided into three categories: electromagnetic simulation, thermal simulation, and circuit simulation. Electromagnetic simulation is based on fundamental laws such as Maxwell's equations and uses numerical methods such as the finite element method (FEM), finite-difference time-domain method (FDTD), and method of moments (MoM) to accurately describe the electromagnetic field distribution and obtain the electromagnetic characteristics of the antenna. However, it has high computational complexity and is difficult to meet the needs of large-scale or real-time simulation. In terms of thermal simulation, the thermal resistance network model compares heat conduction to a circuit system, using thermal resistance and thermal capacity to represent heat transfer and storage, achieving rapid thermal analysis. However, the modeling relies on experience, has poor versatility, and is difficult to reflect complex thermal effects. Analytical methods are based on the mathematical analytical solutions of the heat conduction equations and are suitable for problems with simple structures and well-defined boundary conditions. However, they are difficult to solve for complex structures. The finite element method discretizes the thermal domain into elements and solves the temperature field through variational principles. It is suitable for high-precision thermal simulation of complex geometries and material distributions, but it has high requirements for computational resources and modeling expertise, and its efficiency is relatively low. Circuit simulation, on the other hand, is highly efficient because it establishes an electrical model and couples it with an equivalent RC thermal network for joint simulation. However, the thermal model is simplified and cannot truly reflect the internal temperature distribution of the chip, making the analysis of thermal failure mechanisms less intuitive and accurate.

[0004] However, current analytical methods have many shortcomings. Single-physics models cannot meet the complex requirements of modern three-dimensional radio frequency microsystems. For example, physical models are computationally expensive, behavioral models rely on data and lack interpretability, and semi-physical models, while seeking a balance, still face challenges. In the field of thermal simulation, each technology also has its applicable scope and limitations. Specifically, in the multi-physics coupling analysis of millimeter-wave radar front-end array antennas, existing methods struggle to fully consider the interactions of multiple physics fields. Electromagnetic simulations cannot update input power in real time and cannot reflect the dynamic impact of electromagnetic behavior on heating at different times; while thermal simulations can accurately simulate temperature distribution, they cannot effectively link with electromagnetic simulations and cannot reflect the reverse effect of thermal field changes on antenna electromagnetic parameters (such as dielectric constant and impedance); simplified thermal models of circuit simulations cannot support the analysis of thermo-mechanical coupling effects, leading to the neglect of the impact of structural deformation and stress distribution on antenna radiation performance. This current state of "isolated single-field simulation" or "weakly coupled simulation" makes it impossible to accurately capture the synergistic effects between multiple physics fields, ultimately resulting in significant deviations between simulation results and actual operating conditions, making it difficult to effectively guide antenna structural optimization and performance improvement.

[0005] Therefore, there is an urgent need for a method to quantify the impact of multi-physics coupling on antenna performance, so as to provide a scientific basis for the high-reliability design of millimeter-wave radar front-end array antennas. Summary of the Invention

[0006] In view of this, this application provides a multi-physics coupling analysis method and apparatus for millimeter-wave radar front-end array antennas, which is used to quantify the influence of multi-physics coupling on antenna performance and provide a scientific basis for the high-reliability design of millimeter-wave radar front-end array antennas.

[0007] Specifically, this application is implemented through the following technical solution:

[0008] The first aspect of this application provides a multi-physics coupling analysis method for a millimeter-wave radar front-end array antenna, the method comprising:

[0009] A three-dimensional model is constructed, which includes the millimeter-wave radar front-end array antenna and supporting chips. The three-dimensional model includes the structure and material parameters of the metal layer, dielectric layer, feed line, solder balls and chips.

[0010] Electromagnetic simulation tools were used to simulate the electrical performance of the three-dimensional model to obtain power loss data and initial electrical performance parameters of the antenna and chip.

[0011] The power loss data is used as a heat source input to a multiphysics simulation tool. First, thermal field simulation is performed to obtain temperature distribution data. Then, force field simulation is performed by combining the temperature distribution data, power density, and electromagnetic force distribution to obtain structural deformation and stress distribution data.

[0012] The temperature distribution, structural deformation, and stress distribution data are fed back to the electromagnetic simulation tool through bidirectional coupling, and the electrical performance is simulated again to obtain the coupled electrical performance parameters. By comparing the electrical performance parameters with the initial electrical performance parameters, multiphysics coupling analysis is performed.

[0013] A second aspect of this application provides a multiphysics coupling analysis device for a millimeter-wave radar front-end array antenna, the device comprising a construction module and a simulation module;

[0014] The construction module is used to construct a three-dimensional model including a millimeter-wave radar front-end array antenna and supporting chips. The three-dimensional model includes the structure and material parameters of the metal layer, dielectric layer, feed line, solder balls and chips.

[0015] The simulation module is used to perform electrical performance simulation on the three-dimensional model using electromagnetic simulation tools, and to obtain power loss data and initial electrical performance parameters of the antenna and chip.

[0016] The simulation module is also used to input the power loss data as a heat source into a multiphysics simulation tool, first perform thermal field simulation to obtain temperature distribution data, and then combine the temperature distribution data, power density and electromagnetic force distribution to perform force field simulation to obtain structural deformation and stress distribution data.

[0017] The simulation module is also used to feed back the temperature distribution, structural deformation and stress distribution data to the electromagnetic simulation tool through bidirectional coupling, perform electrical performance simulation again, obtain the coupled electrical performance parameters, and perform multiphysics coupling analysis by comparing the electrical performance parameters with the initial electrical performance parameters.

[0018] The multiphysics coupling analysis method and apparatus for millimeter-wave radar front-end array antennas provided in this application ensures that the structure, materials, and connection relationships (such as solder balls connecting chips and metal ground) of the simulation object are consistent with those of the actual product by constructing an integrated three-dimensional model (rather than a single component model) that includes the millimeter-wave radar front-end array antenna and its supporting chips. This provides a realistic physical carrier for multiphysics coupling analysis. Electromagnetic simulation tools are used to obtain power loss data and initial electrical performance parameters. Power loss serves as a precise heat source for thermal field simulation (connecting the electric field and the thermal field), and the initial electrical performance parameters serve as a benchmark for subsequent coupling analysis, solving the problem of lacking associated input in single-physics field simulation. Thermal field simulation is first performed using multiphysics simulation tools to obtain temperature distribution data, and then force field simulation is performed by combining temperature, power density, and electromagnetic force, realizing the electric field... The progressive coupling of loss, thermal field distribution, and force field deformation / stress captures the impact of heat transfer on structural mechanical properties. Finally, through bidirectional coupling, temperature, deformation, and stress data are fed back to electromagnetic simulation tools to obtain coupled electrical performance parameters, which are then compared with the initial parameters. This forms a closed-loop analysis of electric field-thermal field-force field-electric field. This not only quantifies the impact of temperature-induced changes in dielectric properties and structural deformation-induced changes in geometric dimensions on electrical performance (such as S-parameter shift and gain attenuation), but also reveals the laws governing multi-field interactions. Compared to isolated single-field simulations or weakly coupled analyses, this approach ensures the accuracy of parameter transfer across physical fields and achieves comprehensive quantification of multi-field coupling effects. This makes the analysis results closer to the actual operating state of the antenna, providing a precise and reliable theoretical basis for the structural optimization and performance improvement of millimeter-wave radar front-end array antennas. Attached Figure Description

[0019] Figure 1 A flowchart of the multiphysics coupling analysis method for a millimeter-wave radar front-end array antenna provided in Embodiment 1 of this application;

[0020] Figure 2 This is a schematic diagram of the structure of the millimeter-wave radar front-end array antenna shown in this application;

[0021] Figure 3This is a schematic diagram of the multiphysics coupling analysis device for a millimeter-wave radar front-end array antenna provided in Embodiment 2 of this application. Detailed Implementation

[0022] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application.

[0023] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used herein are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

[0024] It should be understood that although the terms first, second, third, etc., may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."

[0025] The following specific embodiments are given to illustrate the technical solution of this application in detail.

[0026] Figure 1 This is a flowchart illustrating the multiphysics coupling analysis method for a millimeter-wave radar front-end array antenna provided in Embodiment 1 of this application. Please refer to... Figure 1 The method provided in this embodiment may include:

[0027] S101. Construct a three-dimensional model that includes the millimeter-wave radar front-end array antenna and supporting chips.

[0028] The three-dimensional model includes the structure and material parameters of the metal layer, dielectric layer, feed line, solder balls, and chip.

[0029] The metal layer includes a top patch and five metal ground layers. The top patch is an 8×8 array of copper rectangular structures, and every 2×2 rectangular structures form an antenna element. The dielectric layer is a five-layer dielectric substrate made of GHPL970LFLFD82 material, which is arranged alternately with the metal layer, and the first dielectric substrate has a built-in T-type probe. The chip is a stacked structure of silicon dioxide and copper, with one chip corresponding to every 2×2 antenna elements, and is connected to the bottom metal ground layer through solder balls.

[0030] Specifically, the millimeter-wave radar front-end array antenna is the core functional component responsible for transmitting and receiving millimeter-wave signals. It is an array structure formed by arranging multiple antenna elements according to a specific pattern. Through signal coordination between elements, the radiation gain, directivity, and detection accuracy of millimeter-wave signals are improved. The 3D model is a digital replica of the millimeter-wave radar front-end array antenna and its supporting chips, serving as the basis for subsequent multiphysics coupling simulation analysis. The essence of the 3D model is to use 3D modeling tools to transform the actual structure, material properties, and connection relationships of the antenna and chip into a computer-recognizable digital model. The 3D model includes structural parameters (such as patch size, interlayer thickness, and solder ball positions) and material parameters (such as the electrical conductivity of metals, the dielectric constant of dielectrics, and the thermal conductivity of chips), and must fully reflect the integrated relationship between the two. The 3D model is an integrated model of the antenna-chip-connection structure.

[0031] Furthermore, Figure 2 This is a schematic diagram of the structure of the millimeter-wave radar front-end array antenna provided in this application. Please refer to... Figure 2The 3D model includes a metal layer, a dielectric layer, a feed line, solder balls, and a chip. The metal layer, responsible for the transmission and radiation of millimeter-wave signals, is the core conductive component of the antenna. The metal layer consists of a top patch and five ground planes. The top patch, made of copper, is arranged in an 8×8 rectangular array, with each 2×2 rectangle forming an antenna element that directly transmits and receives millimeter-wave signals. The five ground planes alternate with the dielectric layer, serving as a signal reference ground to ensure signal transmission stability, isolating electromagnetic interference between different layers, and providing an electrical connection interface for the chip (the bottom ground plane is connected to the chip via solder balls). The dielectric layer serves a dual purpose of structural support and signal isolation. It is made of GHPL970LFLFD82 (a low-loss dielectric material specifically for millimeter-wave bands) and consists of five layers, alternating with the metal layers (forming a metal-dielectric-metal stacked structure). This structure both fixes the spatial position of the metal layers and prevents signal short circuits between adjacent metal layers. The first dielectric layer contains a T-shaped probe, which is the core of the antenna feed, responsible for precisely coupling the signal transmitted from the feed line to the top patch, achieving efficient signal transmission from the feed line to the antenna element. The feed line is the transmission channel for millimeter-wave signals, connecting the external signal source and the antenna element. It needs to be strategically positioned in conjunction with the metal and dielectric layers to ensure minimal signal loss during transmission and to avoid electromagnetic interference with other components (the specific layout is implicit in the stacked structure of the metal and dielectric layers, providing signal input for the T-shaped probe). Solder balls serve as the physical connection and energy transfer bridge between the antenna and the chip. They are typically made of a highly thermally and electrically conductive metal alloy (such as tin-lead alloy). One end connects to the bottom of the chip, and the other end connects to the underlying metal ground. Functionally, they enable electrical signal conduction between the chip and the antenna (ensuring signal transmission) and facilitate heat transfer from the chip to the metal ground (providing a heat transfer path for subsequent thermal simulation). The chip is the core component for signal driving and processing. Its structure is a stack of silicon dioxide and copper. The silicon dioxide layer acts as an insulating substrate, separating the internal conductive structures of the chip and preventing signal short circuits. The copper layer acts as a conductive layer, enabling signal transmission within the chip. Simultaneously, it connects to the underlying metal ground via solder balls, facilitating signal and energy interaction with the antenna.

[0032] In practice, the construction benchmark of the three-dimensional model is determined based on the engineering design parameters of the actual millimeter-wave radar front-end module; an integrated solid model is constructed using three-dimensional modeling software under the construction benchmark; and for each component in the integrated solid model, the geometric dimensions, relative positions and material properties are set according to the actual product specifications to form a three-dimensional model.

[0033] Specifically, engineering design parameters of the actual millimeter-wave radar front-end module are collected, including component structural layout schemes, antenna and chip interface dimensions, and assembly tolerance requirements for each component, which serve as the basis for constructing the 3D model; 3D modeling software (such as SolidWorks, ANSYS) is selected. DesignModeler, under the constraints of the baseline, builds an integrated solid model. The model must fully include the antenna patch array, five-layer high-frequency dielectric substrate, multi-layer metal ground, T-type probe feed structure, chip equivalent layer stacked package, and bottom solder ball array. According to the actual product specifications, the parameters of each component in the integrated solid model are set one by one: In terms of geometry, the length, width, and thickness of the top patch, the number of dielectric substrate layers and the thickness of each layer, and the diameter and height of the solder balls are determined; in terms of relative position, the alternating spacing of the metal layers and dielectric layers, the embedding position of the T-type probes in the first dielectric substrate, the alignment relationship between the chip and the corresponding antenna element, and the distribution position of the solder balls between the bottom of the chip and the bottom metal ground are determined; in terms of material properties, copper is specified for the metal layers, GHPL970LFLFD82 is specified for the dielectric layers, and silicon dioxide and copper are specified for the chip stack material. After completing the above parameter settings, the integrated solid model is checked for integrity to ensure that there are no geometric conflicts and the parameter settings are consistent, and finally a three-dimensional model containing the structure and material parameters of the metal layers, dielectric layers, feed lines, solder balls, and chips is formed.

[0034] Optionally, the method further includes: based on the physical law of electromagnetic energy conversion to thermal energy, determining to first obtain power loss data through electromagnetic simulation, and using the power loss data as the core energy input for thermal field simulation; based on the principle of mechanical effects caused by temperature changes, determining to perform force field simulation after thermal field simulation; and according to the influence law of temperature changes on the electrical parameters of materials and the law of structural deformation on the change of antenna geometry, determining to perform secondary electrical performance simulation after force field simulation.

[0035] Specifically, from the perspective of the coupling logic analysis between electromagnetic and thermal fields, during the operation of the millimeter-wave radar front-end array antenna and its supporting chips, the transmission and radiation of electromagnetic signals are accompanied by power loss. This loss is the core source of the conversion of electromagnetic energy into thermal energy. The formation of the thermal field is based on electromagnetic energy loss. Without power loss data obtained from electromagnetic simulation, the thermal field simulation will lack accurate energy input that conforms to actual working conditions. Therefore, electromagnetic performance simulation needs to be a prerequisite for thermal field simulation. From the perspective of the interaction between thermal and force fields, the core driving factor for structural deformation and stress generation is the difference in thermal expansion of materials caused by uneven temperature distribution. At the same time, the power density and electromagnetic force distribution output by electromagnetic simulation need to be coupled with the temperature field distribution to accurately characterize the actual mechanical load state. Without the temperature distribution data output from the thermal field simulation, the load input for the force field simulation will lack key driving parameters, making it difficult to realistically simulate the structural mechanical response. Therefore, the thermal field simulation must be conducted before the force field simulation. From the perspective of the inverse influence mechanism between the force field and the electromagnetic field, temperature changes directly regulate core electrical parameters such as the dielectric constant of the dielectric layer and the conductivity of the metal layer, while structural deformation directly alters key geometric dimensions such as the antenna patch spacing and feed line length. Changes in these parameters and dimensions significantly affect the electromagnetic field distribution and the antenna's electromagnetic performance. Without force field simulation to obtain data on structural deformation and stress distribution, the secondary electrical performance simulation cannot accurately reflect the true changes in geometric parameters and material properties. Therefore, a secondary electrical performance simulation must be conducted after the force field simulation. In summary, the simulation sequence follows a physical chain of "electromagnetic energy loss → thermal field formation → mechanical effect generation → electromagnetic performance feedback." The output results of the preceding simulation provide necessary and crucial input parameters for the subsequent simulation, forming an indispensable and non-reversible coupled analysis process.

[0036] The method provided in this embodiment determines the simulation sequence by following the physical chain of "electromagnetic energy loss → thermal field formation → mechanical effect generation → electromagnetic performance feedback," and is based on the inherent coupling logic between each field (the power loss data output by the electromagnetic simulation serves as the core energy input for the thermal field simulation; the temperature distribution data of the thermal field simulation, together with the power density and electromagnetic force distribution of the electromagnetic simulation, serve as the joint load for the force field simulation; and the structural deformation and stress distribution data of the force field simulation, along with the temperature distribution data, are fed back to the electromagnetic simulation tool). This ensures that the output of the preceding simulation provides the necessary and accurate key input parameters for the subsequent simulation, avoiding load loss or data corruption caused by reversed sequence or logical breaks. It overcomes distortion issues while fully capturing the bidirectional coupling between electromagnetic, thermal, and force fields. It accurately reproduces the effects of temperature changes on material electrical parameters, structural deformation on antenna geometry, and the combined impact of these factors on electromagnetic performance. This solves the shortcomings of traditional single-field isolated simulations or disordered coupling simulations that cannot reflect the synergistic effects of multiple physics fields. The simulation results are closer to the actual working state of millimeter-wave radar front-end array antennas. At the same time, a closed-loop process enables quantitative analysis of the impact of multi-physics field coupling on antenna performance. This provides a logically rigorous and data-reliable theoretical support for antenna structure optimization design, performance improvement, and reliability assurance, enhancing the engineering practicality and scientific rigor of the analysis method.

[0037] S102. Use electromagnetic simulation tools to perform electrical performance simulation on the three-dimensional model to obtain power loss data and initial electrical performance parameters of the antenna and chip.

[0038] Specifically, electromagnetic simulation tools are specialized software tools that use Maxwell's equations (the core equations describing the fundamental laws of electromagnetic fields) to digitally simulate and analyze the electromagnetic characteristics of three-dimensional models through numerical calculation methods (such as the finite element method (FEM), the finite-difference time-domain method (FDTD), and the method of moments (MoM). Common electromagnetic simulation tools include HFSS (a high-frequency structural simulation software, specializing in electromagnetic analysis in the high-frequency millimeter-wave field). Power loss data is the quantified data of energy loss caused by material properties and structural design during electromagnetic signal transmission and radiation in the three-dimensional model of the antenna and chip. From the perspective of sources, it mainly includes two parts: first, the ohmic loss of the antenna part (such as the top patch, feed line, T-type probe) due to the resistive effect of the metal material, and the dielectric loss of the dielectric layer due to the dielectric properties; second, the circuit loss of the chip part (copper layer, silicon dioxide stack) due to internal circuit conduction and signal processing.

[0039] Furthermore, initial electrical performance parameters are the core electromagnetic performance indicators of the 3D model output by the electromagnetic simulation tool under ideal conditions without considering the effects of thermal and force fields. Initial electrical performance parameters include three categories: first, signal reflection and isolation parameters, such as reflection coefficient S11 (reflecting the degree of signal reflection at the antenna port; typically ≤-10dB within the target frequency band to ensure effective signal transmission) and port isolation S22 / S33 (reflecting the degree of signal interference between different antenna elements / ports; lower values ​​indicate less interference); second, signal radiation parameters, such as antenna gain (reflecting the antenna's ability to convert electrical energy into electromagnetic wave radiation; higher gain indicates a longer detection range) and radiation pattern (reflecting the spatial radiation distribution of the antenna's electromagnetic waves, determining the directional coverage area of ​​radar detection); and third, signal transmission parameters, such as transmission coefficient S21 (reflecting the signal transmission efficiency between different ports).

[0040] Optionally, the frequency band for the electrical performance simulation is 60-85GHz, and the simulation parameters include antenna size, chip size, and input power.

[0041] In specific implementation, based on the application scenario requirements of the millimeter-wave radar front-end array antenna, the simulation frequency band is determined; based on the simulation frequency band, boundary conditions are matched and set in the electromagnetic simulation tool; the boundary conditions include feed port boundary conditions and electromagnetic wave radiation boundaries; the electrical parameters of each material in the three-dimensional model are input into the electromagnetic simulation tool, and the simulation is performed in combination with the simulation frequency band and boundary conditions to obtain the power loss data of the antenna and the chip, as well as the initial electrical performance parameters.

[0042] Specifically, considering the application scenarios of millimeter-wave radar front-end array antennas (such as short-range detection in intelligent driving and high-precision positioning in industrial sensing), the required operating frequency band range was determined, and 60-85GHz was ultimately selected as the simulation frequency band, which can meet the target resolution requirements under high-frequency signals. Furthermore, in the electromagnetic simulation tool, a 50Ω characteristic impedance was set for the T-shaped probe interface connecting the feed line and the antenna unit in the 3D model to ensure impedance matching during signal transmission and reduce reflection loss. Using the center wavelength of the selected frequency band (e.g., 77GHz corresponds to approximately 3.89mm), a spherical radiation boundary was set around the 3D model, with the boundary distance from the edge of the top antenna patch not less than 1 / 4 of the center wavelength (approximately 0.97mm) to simulate the antenna's radiation environment in free space and avoid interference from boundary reflections on the simulation results. Using the material library function of the simulation tool, the electrical parameters of each structure were entered: the conductivity of the copper metal layer was set to 5.8 × 10⁻⁶. 7 The dielectric constant of the dielectric layer GHPL970LFLFD82 is set to 3.0, and the loss tangent is set to 0.002. The relative dielectric constant of silicon dioxide in the chip stack is set to 3.9, and the volume resistivity is set to 1×10⁻⁶. 14Ω•cm. Import the 3D model into the electromagnetic simulation tool, associate the set frequency band, boundary conditions, and material parameters, select a high-frequency electromagnetic simulation algorithm (such as the finite element method), set the solution frequency point interval to 1 GHz (covering the entire 60-85 GHz frequency band), and start the simulation calculation. After the solution is completed, export the following results from the post-processing module of the electromagnetic simulation tool: global power loss distribution cloud map (including loss values ​​of the chip area and various antenna components), reflection coefficient S11 curve, port isolation S22 / S33 data, antenna gain values, and radiation pattern.

[0043] S103. The power loss data is used as a heat source input to a multiphysics simulation tool. First, thermal field simulation is performed to obtain temperature distribution data. Then, force field simulation is performed by combining the temperature distribution data, power density, and electromagnetic force distribution to obtain structural deformation and stress distribution data.

[0044] Specifically, multiphysics simulation tools integrate modules for analyzing various physical fields such as electromagnetics, heat, and force, enabling parameter transfer and coupled calculations between different physical fields. Their core function is to use a unified model interface to take the simulation results of a single physical field (such as power loss in electromagnetic simulations) as input conditions for other physical fields (such as heat sources in thermal fields), and calculate the interactions between fields (such as the effect of temperature changes on structural stress). Common multiphysics simulation tools include ANSYS Workbench.

[0045] Temperature distribution data refers to the temperature values ​​and spatial distribution of various regions within the 3D model (antenna and chip). The data is typically presented as temperature cloud maps or temperature values ​​at key locations (such as the chip center, solder balls, and antenna patches), directly reflecting areas of concentrated heat generation, such as the "high-temperature chip zone" and the "temperature rise zone of the antenna feeder." Structural deformation and stress distribution data are the spatial distribution of deformation and internal stress in the 3D model caused by temperature changes, electromagnetic forces, and other loads. Structural deformation data refers to the displacement (e.g., micrometer-level expansion or offset) of various components (such as chips, antenna patches, and solder balls) within the 3D model, primarily caused by differences in thermal expansion due to uneven temperature distribution and electromagnetic forces, reflecting changes in the structural geometry. Stress distribution data refers to the forces (e.g., tensile and compressive stress) exerted on the 3D model due to deformation, concentrated at material interfaces (e.g., the contact between metal and dielectric layers, and the connection points between solder balls and chips), reflecting the mechanical load state borne by the structure.

[0046] In specific implementation, the power loss data is input into the multiphysics simulation tool as a heat source. Thermal field simulation is then performed to obtain temperature distribution data. This includes: combining the structural partitioning characteristics of the three-dimensional model, allocating the power loss data to the thermal field analysis module of the multiphysics simulation tool according to the corresponding regions; wherein the chip region is the primary heat source, and the power loss of the antenna feed line and patch region is the secondary heat source; inputting the thermal parameters of each material into the multiphysics simulation tool, and setting thermal boundary conditions matching actual operating conditions; wherein convective boundaries are applied to the air-contact portions of the upper and lower surfaces of the antenna, and thermal conduction boundaries are set at the interface between the metal layer and the dielectric layer; using the partitioned power loss data as a heat source driver, combined with the thermal parameters and thermal boundary conditions, a transient thermal field simulation is initiated, monitoring temperature changes in real time during the simulation until the temperature fluctuation is less than a preset value, at which point the temperature distribution data is output.

[0047] Specifically, open a multiphysics simulation tool (such as ANSYS Workbench), import the constructed 3D model, enable the region mapping function in the thermal field analysis module, and allocate the acquired power loss data to each region according to the structural partitions of the 3D model (chip region, antenna feed line region, and antenna patch region). The chip region is designated as the primary heat source by importing its complete power loss data (≥60%), while the antenna feed line region and patch region are designated as secondary heat sources by importing their respective power loss data. In the material property library of the multiphysics simulation tool, thermal parameters are entered for each structural component. Then, thermal boundary conditions are set: for the areas where the upper and lower surfaces of the antenna are in contact with air, select the convection type in the boundary condition setting interface, and input a convection heat transfer coefficient of 15 W / (m²•K) and an ambient temperature of 22℃; for the contact interface between the metal layer and the dielectric layer, select the heat conduction type and establish a heat conduction path based on the default material contact thermal resistance (input 0.0005 m²•K / W). In the solution settings of the thermal field analysis module, select the transient analysis type, set the time step to 10s and the total simulation time to 300s (which can be adjusted according to the actual heating stabilization time), and check the temperature change monitoring option. Set the preset temperature fluctuation threshold to 0.1℃ / s. After starting the simulation, the multiphysics simulation tool uses the partition power loss as the heat source and calculates the temperature change by combining thermal parameters and boundary conditions. The temperature curves of each region are displayed in real time on the interface. When the temperature fluctuation is less than 0.1℃ / s for three consecutive time steps, it is determined that thermal steady state has been reached, the simulation is stopped, and the global temperature distribution cloud map and the temperature values ​​of key areas (chip center, solder balls, antenna patch) are exported from the post-processing module to form temperature distribution data.

[0048] Optionally, the step of combining the temperature distribution data, power density, and electromagnetic force distribution to perform force field simulation to obtain structural deformation and stress distribution data includes: inputting the temperature distribution data as a thermal load into the force field analysis module of a multiphysics simulation tool, and simultaneously importing the power density and electromagnetic force distribution data as additional loads for the force field simulation; inputting the mechanical parameters of each material, and setting force boundary conditions based on the structural constraint characteristics of the three-dimensional model; wherein, fixed constraints are applied to the metal fixed area of ​​the feed port and the mounting edges around the antenna; using the temperature distribution data, power density, and electromagnetic force distribution as a joint driving load, combined with the mechanical parameters and boundary conditions, starting the transient force field simulation, monitoring the structural deformation and stress changes in real time until the deformation increment stabilizes within a preset range, and outputting the structural deformation data and stress distribution data.

[0049] In practice, the force field analysis module of a multiphysics simulation tool (such as ANSYS Workbench) is opened. Through the built-in load transfer function of the tool, the temperature distribution data output by the thermal simulation module is directly associated and automatically loaded as a thermal load onto the corresponding area of ​​the 3D model. At the same time, the power density data and electromagnetic force distribution data are exported. In the force field module, the external load import function is used to map the power density to the metal conductive area of ​​the chip and the antenna feed line, and the electromagnetic force distribution to the radiation area of ​​the top patch of the antenna, thus completing the configuration of the joint driving load. In the material property library of the multiphysics simulation tool, the mechanical parameters of each component are entered. For example, the elastic modulus of the copper metal layer is set to 110 GPa and the Poisson's ratio is set to 0.34; the elastic modulus of the dielectric layer GHPL970LFLFD82 is set to 3.2 GPa and the Poisson's ratio is set to 0.3; and the elastic modulus of the silicon dioxide in the chip stack is set to 72 GPa and the Poisson's ratio is set to 0.17. Then, enter the boundary condition setting interface, select the fixed constraint type, and click on the metal pad area of ​​the feed port (approximately 0.5 mm × 0.5 mm) and the edges of the mounting holes around the antenna (4 in total, with a hole diameter of 0.2 mm). Check the options to restrict X / Y / Z axis translation and restrict X / Y / Z axis rotation to ensure that there is no displacement or deformation in the constrained area. In the solution parameter settings of the force field module, the transient analysis mode is selected, the time step is set to 5s, and the total simulation time is set to 150s. At the same time, the deformation and stress monitoring functions are enabled, and the preset stable range of deformation increment is set to ≤0.01μm. After the simulation is started, the tool uses thermal load, power density, and electromagnetic force as joint drivers to calculate the deformation and stress changes in each region of the model. The deformation curve at the chip solder ball and the stress curve at the metal-dielectric interface are displayed in real time on the interface. When the maximum deformation increment of the model is ≤0.01μm for four consecutive time steps, it is determined that the structure has reached a steady state, the simulation is stopped, and the global structural deformation cloud map (marking the location and value of the maximum deformation, such as 1.209μm at the solder ball) and the global stress distribution cloud map (marking the region and value of the maximum stress, such as 50MPa at the contact between the dielectric layer and the metal via) are exported from the post-processing module to form structural deformation data and stress distribution data.

[0050] S104. The temperature distribution, structural deformation and stress distribution data are fed back to the electromagnetic simulation tool through bidirectional coupling, and the electrical performance is simulated again to obtain the coupled electrical performance parameters. By comparing the electrical performance parameters with the initial electrical performance parameters, multiphysics coupling analysis is performed.

[0051] Specifically, the coupled electrical performance parameters are the core electromagnetic performance indicators of the antenna and chip, incorporating the effects of thermal and force fields. These parameters are of the same type as the initial electrical performance parameters, but their values ​​have changed due to the effects of heat and force fields: for example, temperature distribution alters the dielectric constant of the dielectric layer GHPL970LFLFD82 and the conductivity of the metal layer, causing a shift in the S11 curve within the 60-85GHz frequency band; structural deformation (such as changes in antenna patch spacing and solder ball displacement) affects the antenna's radiation path, causing antenna gain attenuation or broadening of the main lobe of the radiation pattern; stress distribution may further alter the electrical properties of the material, indirectly exacerbating fluctuations in port isolation.

[0052] In practice, an electromagnetic simulation tool (such as HFSS) is opened. Through the tool's multiphysics coupling interface, temperature distribution data (in temperature cloud map file format), structural deformation data (in displacement coordinate file format), and stress distribution data (in stress field file format) are imported. The tool's built-in mapping algorithm establishes spatial coordinate relationships between these data and corresponding regions of the 3D model (such as chips, antenna patches, and dielectric layers). Based on the temperature distribution data, a preset temperature-electrical parameter correlation formula is called in the tool's material property editing module. For example, the dielectric constant of the dielectric layer GHPL970LFLFD82 increases by 0.001 for every 1°C increase in temperature, while the conductivity of the copper metal layer decreases by 0.3% for every 1°C increase in temperature. The dielectric constant and conductivity parameters of the corresponding materials are automatically updated based on the actual temperature values ​​of each region. Simultaneously, combined with stress distribution data, the equivalent resistance of the interface between the metal layer and the dielectric layer is corrected (contact resistance increases by 0.01Ω for every 10MPa increase in stress). In the tool's 3D modeling interface, the deformation-driven geometry update function is enabled, automatically adjusting the size and position of key parts of the model based on the structural deformation data. If the top antenna patch undergoes a 0.5μm displacement due to deformation, the tool automatically corrects its coordinate parameters; if the solder ball undergoes a 1.2μm deformation due to thermal expansion, its height and diameter parameters are automatically adjusted to ensure that the model geometry is consistent with the force field simulation results. The simulation frequency band (60-85GHz), feed port boundary conditions (50Ω impedance), and electromagnetic radiation boundary (center wavelength 1 / 4 distance) are reused. The coupled field analysis mode is selected in the tool's solver settings, and the electrical performance simulation is started. After the simulation is complete, the indices corresponding to the initial electrical performance parameters are exported from the tool's post-processing module, including the coupled reflection coefficient S11 curve, port isolation S22 / S33 data, antenna gain values, and radiation patterns, forming the coupled electrical performance parameters.

[0053] Furthermore, the multiphysics coupling analysis by comparing the electrical performance parameters with the initial electrical performance parameters includes: extracting the reflection coefficient, port isolation, antenna gain, and radiation pattern within the simulation frequency band from the initial electrical performance parameters; comparing the initial electrical performance parameters and the electrical performance parameters item by item according to the corresponding performance indicators, comparing the curve shifts of the reflection coefficient and port isolation within the simulation frequency band, and analyzing the impact of temperature-induced changes in dielectric material properties on the curve shifts; comparing the attenuation of antenna gain and the changes in the main lobe width of the radiation pattern, and analyzing the impact of structural deformation-induced changes in antenna geometry on the changes; combining the correspondence between temperature distribution and structural deformation, analyzing the indirect impact of temperature-induced structural deformation on electrical performance parameters; and determining the degree of influence of temperature factors, structural deformation factors, and their interaction on each electrical performance indicator based on the comparison results, and establishing the correlation between multiphysics coupling and antenna performance.

[0054] In practice, the reflection coefficient S11 curve, port isolation S22 / S33 curve, antenna gain values ​​(recorded at 1 GHz intervals), and radiation pattern (including main lobe width data) within the 60-85 GHz frequency band are exported from the initial electrical performance parameter file and saved as a baseline dataset. Simultaneously, corresponding parameters of the same frequency band and format are exported from the electrical performance parameters and saved as a coupled dataset. The two sets of S11 and S22 / S33 curves are imported into a data processing tool (such as MATLAB), and a comparison chart is generated using the curve overlay function. The maximum offset point within the target frequency band (e.g., an S11 offset of 0.8 dB at 77 GHz) is marked. At the same time, a temperature distribution cloud map is associated, and the frequency band offset corresponding to high-temperature regions (e.g., the 95°C region of the chip) is marked in the comparison chart to clarify the spatial correspondence between temperature and curve offset. Calculate the attenuation of the antenna gain relative to the initial value after coupling (e.g., from 24dBi to 22.8dBi, an attenuation of 1.2dBi), and convert it to an attenuation percentage. In the radiation pattern comparison, measure the change in the main lobe width (e.g., from 8° to 8.6°, an attenuation of 0.6°). Then, overlay the structural deformation cloud map to locate the region with the maximum gain attenuation (e.g., at the point where the antenna patch deforms by 0.8μm) and the corresponding geometric change location (e.g., at the point where the patch spacing changes by 0.5μm). In the post-processing module of the simulation tool, spatially overlay the temperature distribution cloud map and the structural deformation cloud map, marking the overlapping regions with temperatures ≥85℃ and deformations ≥0.5μm (e.g., the chip edge and solder ball connection area). Extract the corresponding electrical performance parameters of this region (e.g., S22 offset of 0.5dB near this region), compare them with the parameter offsets of regions with only high temperature and no significant deformation, and regions with only deformation and no significant high temperature, and calculate the proportion of the interaction effect to the total offset (e.g., 30%). The proportions of temperature-dependent effects (e.g., 70% of the total S11 offset is caused by temperature), structural deformation-dependent effects (e.g., 40% of gain attenuation is caused by deformation), and interactive effects of various performance indicators are statistically analyzed and a quantitative table is generated. Based on the table data, patterns are summarized, including temperature dominating S-parameter offset, deformation dominating radiation pattern changes, and the interaction between the two exacerbating high-frequency performance fluctuations. A correlation pattern report is then generated.

[0055] The method provided in this embodiment, firstly, constructs an integrated three-dimensional model including a millimeter-wave radar front-end array antenna and supporting chips. This model clearly defines the specific structure of the metal layer, dielectric layer, feed line, solder balls, and chips, and specifies the material parameters of each component. This structural design, on the one hand, completely reproduces the physical connection (such as the solder balls simultaneously conducting electrical signals and heat) and spatial layout of the antenna and chip during actual operation, avoiding the problem of traditional single-component models neglecting the interaction between components. This provides a digital carrier that closely reflects actual working conditions for multi-physics coupling analysis. On the other hand, the model's structure is divided into... The regional characteristics (chip region, antenna feeder region, patch region) can directly support the allocation of power loss heat sources according to the region in subsequent thermal field simulation (the chip as the main heat source, and the feeder and patch as secondary heat sources), ensuring that the heat source distribution is consistent with the actual heat-generating parts. The structural design of the T-shaped probe and feeder ensures the accuracy of the signal transmission path in electromagnetic simulation, laying the foundation for the accurate acquisition of initial electrical performance parameters. Meanwhile, the clear material parameters (such as the dielectric layer and the thermal / mechanical parameters of the chip) avoid simulation deviations caused by ambiguity in material properties, ensuring the reliability of subsequent thermal and force field simulation results.

[0056] Secondly, an electromagnetic simulation tool is used to simulate the electrical performance of the 3D model, obtaining power loss data and initial electrical performance parameters. The power loss data is then used as a heat source input to a multiphysics simulation tool to obtain temperature distribution data. This temperature distribution, power density, and electromagnetic force distribution are then combined to perform force field simulation, yielding structural deformation and stress distribution data. Through bidirectional coupling, the temperature, deformation, and stress data are fed back to the electromagnetic simulation tool for another electrical performance simulation, resulting in a closed-loop process for obtaining coupled electrical performance parameters and comparing them with the initial parameters. This achieves a progressive coupling of the electric field, thermal field, and force field. Using the power loss data output from the electromagnetic simulation as the heat source for the thermal field simulation establishes a connection between the electric and thermal fields, solving the problem of inaccurate heat source input in traditional thermal simulations. The force field simulation incorporates temperature distribution (thermal load), power density, and electromagnetic force (additional load), ensuring that the mechanical analysis comprehensively reflects the effects of multiphysics loads and avoiding the one-sided deformation and stress analysis caused by a single load. Furthermore, the bidirectional coupling feeds back the simulation results of the thermal and force fields to the electromagnetic simulation, ensuring that the coupled parameters obtained from the secondary electrical performance simulation are accurate. This study reflects the influence of temperature (such as changes in dielectric constant) and structural deformation (such as patch displacement and solder ball deformation) on electromagnetic performance. By comparing these parameters with the initial electrical performance parameters, the study quantifies the specific effects of temperature factors, structural deformation factors, and their interaction on reflection coefficient shift, gain attenuation, and radiation pattern changes. It establishes the correlation between multi-physics coupling and antenna performance, solving the problems of traditional single-field simulation or weakly coupled simulation failing to capture the synergistic effects of multiple fields and the large deviation between simulation results and actual operating conditions. This provides a precise theoretical basis for the structural optimization and performance improvement of millimeter-wave radar front-end array antennas.

[0057] Corresponding to the aforementioned embodiment of the multiphysics coupling analysis method for a millimeter-wave radar front-end array antenna, this application also provides an embodiment of a multiphysics coupling analysis device for a millimeter-wave radar front-end array antenna.

[0058] Figure 3 This is a schematic diagram of the multiphysics coupling analysis device for a millimeter-wave radar front-end array antenna provided in Embodiment 2 of this application. Please refer to... Figure 3 The apparatus provided in this embodiment includes a construction module 310 and a simulation module 320;

[0059] The construction module 310 is used to construct a three-dimensional model including a millimeter-wave radar front-end array antenna and supporting chips. The three-dimensional model includes the structure and material parameters of the metal layer, dielectric layer, feed line, solder balls and chip.

[0060] The simulation module 320 is used to perform electrical performance simulation on the three-dimensional model using electromagnetic simulation tools, and to obtain power loss data and initial electrical performance parameters of the antenna and chip.

[0061] The simulation module 320 is also used to input the power loss data as a heat source into a multiphysics simulation tool, first perform thermal field simulation to obtain temperature distribution data, and then combine the temperature distribution data, power density and electromagnetic force distribution to perform force field simulation to obtain structural deformation and stress distribution data.

[0062] The simulation module 320 is also used to feed back the temperature distribution, structural deformation and stress distribution data to the electromagnetic simulation tool through bidirectional coupling, perform electrical performance simulation again, obtain the coupled electrical performance parameters, and perform multiphysics coupling analysis by comparing the electrical performance parameters with the initial electrical performance parameters.

[0063] The apparatus of this embodiment can be used to perform... Figure 1 The steps of the method embodiment shown are similar in principle and process, and will not be repeated here.

[0064] The specific implementation process of the functions and roles of each unit in the above device can be found in the implementation process of the corresponding steps in the above method, and will not be repeated here.

[0065] For the device embodiments, since they basically correspond to the method embodiments, the relevant parts can be referred to in the description of the method embodiments. The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this application according to actual needs. Those skilled in the art can understand and implement this without creative effort.

[0066] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A multiphysics coupling analysis method for a millimeter-wave radar front-end array antenna, characterized in that, The method includes: A three-dimensional model is constructed, which includes the millimeter-wave radar front-end array antenna and supporting chips. The three-dimensional model includes the structure and material parameters of the metal layer, dielectric layer, feed line, solder balls and chips. Electromagnetic simulation tools were used to simulate the electrical performance of the three-dimensional model to obtain power loss data and initial electrical performance parameters of the antenna and chip. The power loss data is used as a heat source input to a multiphysics simulation tool. First, thermal field simulation is performed to obtain temperature distribution data. Then, force field simulation is performed by combining the temperature distribution data, power density, and electromagnetic force distribution to obtain structural deformation and stress distribution data. The temperature distribution, structural deformation, and stress distribution data are fed back to the electromagnetic simulation tool through bidirectional coupling, and the electrical performance is simulated again to obtain the coupled electrical performance parameters. By comparing the electrical performance parameters with the initial electrical performance parameters, multiphysics coupling analysis is performed.

2. The method according to claim 1, characterized in that, The process involves using electromagnetic simulation tools to perform electrical performance simulation on the three-dimensional model, obtaining power loss data and initial electrical performance parameters for the antenna and chip, including: Based on the application scenario requirements of millimeter-wave radar front-end array antennas, the simulation frequency band is determined; Based on the simulation frequency band, boundary conditions are matched and set in the electromagnetic simulation tool; the boundary conditions include feed port boundary conditions and electromagnetic wave radiation boundaries; The electrical parameters of each material in the three-dimensional model are input into an electromagnetic simulation tool, and the simulation is performed in combination with the simulation frequency band and boundary conditions to obtain the power loss data of the antenna and the chip, as well as the initial electrical performance parameters.

3. The method according to claim 1, characterized in that, The process of inputting the power loss data as a heat source into a multiphysics simulation tool, first performing thermal field simulation to obtain temperature distribution data, includes: Based on the structural partitioning characteristics of the three-dimensional model, the power loss data is allocated to the thermal field analysis module of the multiphysics simulation tool according to the region; among them, the chip region is the main heat source, and the power loss of the antenna feed line and patch region is the secondary heat source. Input the thermal parameters of each material into the multiphysics simulation tool and set thermal boundary conditions that match the actual working conditions; among them, apply convective boundaries to the parts of the antenna's upper and lower surfaces in contact with air, and set thermal conduction boundaries to the contact interface between the metal layer and the dielectric layer. Using the partitioned power loss data as the heat source driver, and combining the aforementioned thermal parameters and thermal boundary conditions, a transient thermal field simulation is initiated. During the simulation, temperature changes are monitored in real time until the temperature fluctuation is less than the preset value, at which point the temperature distribution data is output.

4. The method according to claim 1, characterized in that, The force field simulation is then performed by combining the temperature distribution data, power density, and electromagnetic force distribution to obtain structural deformation and stress distribution data, including: Temperature distribution data is input as a thermal load into the force field analysis module of a multiphysics simulation tool, while power density and electromagnetic force distribution data are imported as additional loads for the force field simulation. Input the mechanical parameters of each material and set force boundary conditions based on the structural constraint characteristics of the three-dimensional model; among them, apply fixed constraints to the metal fixing area of ​​the feed port and the mounting edges around the antenna. Using the temperature distribution data, power density, and electromagnetic force distribution as a combined driving load, and combining mechanical parameters and boundary conditions, a transient force field simulation is initiated to monitor structural deformation and stress changes in real time until the deformation increment stabilizes within a preset range, and then output structural deformation data and stress distribution data.

5. The method according to claim 1, characterized in that, The step of performing multiphysics coupling analysis by comparing the electrical performance parameters with the initial electrical performance parameters includes: Extract the reflection coefficient, port isolation, antenna gain, and radiation pattern within the simulation frequency band from the initial electrical performance parameters; For the initial electrical performance parameters and the electrical performance parameters, each item is compared according to the corresponding performance index. The curve shift of reflection coefficient and port isolation in the simulation frequency band is compared, and the influence of temperature-induced changes in dielectric material properties on the curve shift is analyzed. By comparing the attenuation of antenna gain and the change in the main lobe width of the radiation pattern, the influence of the change in antenna geometry caused by structural deformation on the changes is analyzed. By combining the correlation between temperature distribution and structural deformation, the indirect effects of temperature-induced structural deformation on electrical performance parameters are analyzed. Based on the comparison results, the influence of temperature factors, structural deformation factors, and their interaction on various electrical performance indicators is determined, and the correlation between multi-physics coupling and antenna performance is established.

6. The method according to claim 1, characterized in that, The construction of the three-dimensional model, which includes the millimeter-wave radar front-end array antenna and its supporting chips, includes: Based on the engineering design parameters of the actual millimeter-wave radar front-end module, the construction benchmark of the three-dimensional model is determined; An integrated solid model was constructed using 3D modeling software based on the aforementioned construction benchmark. For each component in the integrated solid model, the geometric dimensions, relative positions, and material properties are set according to the actual product specifications to form a three-dimensional model.

7. The method according to claim 1, characterized in that, The method further includes: Based on the physical laws of electromagnetic energy conversion into thermal energy, it is determined that power loss data should first be obtained through electromagnetic simulation, and the power loss data should be used as the core energy input for thermal field simulation. Based on the principle that temperature changes induce mechanical effects, force field simulation is performed after determining the thermal field simulation. Based on the influence of temperature changes on the electrical parameters of materials and the changes in antenna geometry caused by structural deformation, a secondary electrical performance simulation was performed after determining the force field simulation.

8. The method according to claim 1, characterized in that, The metal layer includes a top patch and five metal ground layers. The top patch is an 8×8 array of copper rectangular structures, and every 2×2 rectangular structures form an antenna element. The dielectric layer is a five-layer dielectric substrate made of GHPL970LFLFD82 material, which is arranged alternately with the metal layer, and the first dielectric substrate has a built-in T-type probe. The chip is a stacked structure of silicon dioxide and copper, with one chip corresponding to every 2×2 antenna elements, and is connected to the bottom metal ground layer through solder balls.

9. The method according to claim 1, characterized in that, The frequency band for the electrical performance simulation is 60-85GHz, and the simulation parameters include antenna size, chip size, and input power.

10. A multiphysics coupling analysis device for a millimeter-wave radar front-end array antenna, characterized in that, The device includes a construction module and a simulation module; The construction module is used to construct a three-dimensional model including a millimeter-wave radar front-end array antenna and supporting chips. The three-dimensional model includes the structure and material parameters of the metal layer, dielectric layer, feed line, solder balls and chips. The simulation module is used to perform electrical performance simulation on the three-dimensional model using electromagnetic simulation tools, and to obtain power loss data and initial electrical performance parameters of the antenna and chip. The simulation module is also used to input the power loss data as a heat source into a multiphysics simulation tool, first perform thermal field simulation to obtain temperature distribution data, and then combine the temperature distribution data, power density and electromagnetic force distribution to perform force field simulation to obtain structural deformation and stress distribution data. The simulation module is also used to feed back the temperature distribution, structural deformation and stress distribution data to the electromagnetic simulation tool through bidirectional coupling, perform electrical performance simulation again, obtain the coupled electrical performance parameters, and perform multiphysics coupling analysis by comparing the electrical performance parameters with the initial electrical performance parameters.

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