Defect repairing equipment and repairing system for integrated circuit packaging process

Abstract

The invention relates to the technical field of integrated circuits, in particular to defect repairing equipment and a defect repairing system for an integrated circuit packaging process, the equipment comprises a central disc, one side wall of the central disc is fixedly connected to a movable rotating arm, and the cambered surface side wall of the central disc is provided with a sleeve sleeving mechanism, the sleeve sleeving mechanism is used for sleeving the fault pin with the sleeve; and the shaping mechanism is used for controlling the temperature of the sleeve, the low-temperature sleeve is connected to the fault pin in a sleeving mode, and when the temperature of the sleeve rises, the sleeve recovers to the preset shape, and the pin is shaped and repaired. According to the invention, through the innovative design of cooperation of the memory alloy sleeve and multiple modules, lossless and accurate repair of the bending defect of the pin is realized. Pin damage and stress residue caused by traditional mechanical correction are effectively avoided, and the reliability of the repaired chip is remarkably improved. The whole process is automatically operated, the complete link from defect detection to effect verification is covered, and the repairing efficiency is greatly improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of integrated circuits, in particular to a defect repair device and system for integrated circuit packaging process. BACKGROUND

[0002] Integrated circuit packaging is a key process for realizing electrical connection and physical protection of chips. Pins, as the core connection carrier of chips and external circuits, are prone to bending defects in packaging, handling and subsequent processes due to factors such as equipment precision deviation, mechanical collision and process parameter fluctuation. Such defects can cause poor chip conduction and abnormal signal transmission, seriously affecting product reliability and yield. Existing repair technologies mostly rely on manual correction or mechanical hard-top resetting, which not only has low operation efficiency, but also easily causes pin brittle fracture, surface damage and stress residue, and is difficult to adapt to pins of different specifications and complex bending shapes. At the same time, the traditional method lacks precise defect detection and customized adaptation mechanism, and the repair consistency is poor, especially for high-density and high-value packaged chips, which cannot meet the needs of industrial mass production for efficient and non-destructive repair, and therefore an intelligent and versatile pin bending defect repair scheme is urgently needed. SUMMARY

[0003] The present application aims to provide a defect repair device and system for integrated circuit packaging process to solve the problems raised in the background.

[0004] To achieve the above-mentioned purpose, the present application provides the following technical scheme: a defect repair device for integrated circuit packaging process, comprising a center disc, one side wall of the center disc is fixedly connected to a movable rotating arm, and an arc side wall of the center disc is provided with: a sleeve fitting mechanism, which is used for fitting a sleeve on a faulty pin; a shaping mechanism, which is used for controlling the temperature of the sleeve, fitting the sleeve on the faulty pin at low temperature, and shaping and repairing the pin when the sleeve restores to a preset shape at a high temperature.

[0005] Preferably, the movable rotating arm is installed on a moving device, which can be a six-axis mechanical arm or other device, used for controlling and adjusting the position of the center disc to facilitate feeding and repairing operations.

[0006] Preferably, the sleeve is a customized Ti-Ni memory alloy micro sleeve, which has a cylindrical semi-wrapped structure and is made by micro-nano 3D printing.

[0007] Preferably, the sleeve fitting mechanism comprises a first telescopic rod, the first telescopic rod is installed on a rotating seat, the end of the first telescopic rod is fixedly connected with a L-shaped frame, a connecting block is installed in the middle of the L-shaped frame, and a clamping assembly is installed on the connecting block.

[0008] Preferably, the rotating seat is embeddedly installed on the central disc, and an adjusting motor one is arranged in the central disc and used for controlling the rotating of the rotating seat.

[0009] Preferably, the connecting block is rotatably installed in the L-shaped frame through a metal shaft, a connecting block adjusting motor is installed on a side wall of the L-shaped frame, an output end of the connecting block adjusting motor is connected with the metal shaft, and the connecting block adjusting motor is used for controlling the rotation of the connecting block.

[0010] Preferably, the clamping assembly comprises two clamping arms arranged symmetrically, a square slot is arranged at the bottom of the connecting block, the top end of the clamping arm is located in the square slot, a rotating shaft is arranged at the top of the clamping arm, the rotating shaft is rotatably inserted into the inner side wall of the square slot, one synchronous gear is arranged on each rotating shaft, the two synchronous gears are meshed and connected, an adjusting motor two is arranged in the connecting block, an output end of the adjusting motor two is connected with the rotating shaft, and the adjusting motor two is used for controlling the opening and closing of the two clamping arms. The bottom of the two clamping arms is rotatably provided with a clamping block, the clamping block is controlled by an adjusting motor three, and the clamping block is used for clamping the contact sleeve.

[0011] Preferably, the shaping mechanism comprises a second telescopic rod, and a heat isolation cover is connected to the end of the second telescopic rod and used for covering the heating area to reduce the heat diffusion to the surrounding air. An installation block is arranged on the side wall of the heat isolation cover, an air pipe is connected to the outside of the installation block, a micro fan is arranged in the air pipe, an inner rotating disc is rotatably installed on the inside of the installation block, an air outlet is arranged at one end of the inner rotating disc, an air inlet hose is connected to the other end of the inner rotating disc and communicates with the installation block, and an inner rotating disc adjusting motor is arranged in the installation block and connected with the inner rotating disc.

[0012] Preferably, the temperature detection device comprises a plurality of infrared thermometers and is used for monitoring the temperature of the pin root and the sleeve.

[0013] A defect repair system of an integrated circuit packaging process, the system comprises a central control system, and a full-automatic feeding and positioning module, a 3D defect detection and parameter extraction module, a sleeve customization and storage module, an intelligent sleeve joint execution module, a phase change heating shaping module, a gradient cooling and fixed-point temperature control module, and a repair effect verification module which are bidirectionally communicated with the central control system. The central control system is used for sending control instructions to each module and receiving working state data fed back by each module, so as to realize full-process collaborative scheduling; the full-automatic feeding and positioning module is used for batch feeding, posture calibration and fixing of the chip, and outputs the chip positioning coordinates to the 3D defect detection and parameter extraction module; The 3D defect detection and parameter extraction module is used for scanning and identifying the pin bending shape, extracting the pin parameters and the 3D bending model, and outputting the pin parameters and the 3D bending model to the sleeve customization and storage module and the intelligent sleeve connection execution module respectively; The sleeve customization and storage module is used for customizing the memory alloy sleeve according to the pin parameters and intelligently scheduling, and outputs the sleeve specifications and the ready signal to the intelligent sleeve connection execution module; The intelligent sleeve connection execution module is used for planning a sleeve connection path according to the 3D bending model, and completes the pre-shaping, accurate sleeve insertion and fixing of the sleeve, and outputs the sleeve positioning coordinates to the phase change heating shaping module; The phase change heating shaping module is used for heating the sleeve to the phase change temperature according to the sleeve positioning coordinates, triggering the shape memory effect to drive the pin to reset, and outputs the heating completion signal and the temperature abnormal information to the gradient cooling and fixed-point temperature control module; The gradient cooling and fixed-point temperature control module is used for performing gradient cooling and abnormal position fixed-point cooling, and outputs the cooling completion signal to the repair effect verification module; The repair effect verification module is used for detecting the shape and performance of the repaired pin, and feeds back the repair result to the central control system.

[0014] Compared with the prior art, the beneficial effects of the present application are: The present application realizes the lossless and accurate repair of the pin bending defect through the innovative design of the memory alloy sleeve and the multi-module cooperation. The pin damage and stress residue caused by traditional mechanical correction are effectively avoided, and the reliability of the repaired chip is significantly improved. The full-process automation operation covers the complete links from defect detection to effect verification, and greatly improves the repair efficiency. The sleeve can be customized according to the pin specifications and bending shape, and is suitable for various packaging types and complex bending scenarios, and has strong universality. Through accurate temperature control and path planning, the repair consistency is ensured, the rework rate is reduced, and reliable technical support is provided for the repair of high-value and high-density packaged chips, which helps to improve the overall yield and economic benefits of integrated circuit manufacturing. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a device structure schematic view of the present application.

[0016] Figure 2 It is another perspective structure schematic view of the device of the present application.

[0017] Figure 3It is a sleeve sleeve joint mechanism structure schematic diagram of the application.

[0018] Figure 4 It is a sleeve sleeve joint mechanism bottom structure schematic diagram of the application.

[0019] Figure 5 It is a clamping assembly structure schematic diagram of the application.

[0020] Figure 6 It is a clamping arm 8 bottom structure schematic diagram of the application.

[0021] Figure 7 It is a shaping mechanism structure schematic diagram of the application.

[0022] Figure 8 It is an inner rotating disc 18 connection structure schematic diagram of the application.

[0023] Figure 9 It is a repair system structure block diagram of the application.

[0024] In the figure: center disc 1, movable rotating arm 2, rotating seat 3, first telescopic rod 4, type frame 5, connecting block 6, connecting block adjusting motor 7, clamping arm 8, rotating shaft 9, synchronous gear 10, clamping block 11, second telescopic rod 12, thermal isolation cover 13, medium wave infrared laser 14, mounting block 15, air pipe 16, temperature detection device 17, inner rotating disc 18, air jet 19, air inlet hose 20, inner rotating disc adjusting motor 21. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the application will be clearly and completely described below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the application.

[0026] Please refer to Figures 1 to 9 The application provides a technical solution: a defect repair device for an integrated circuit packaging process, which comprises a center disc 1, one side wall of the center disc 1 is fixedly connected to a movable rotating arm 2, the movable rotating arm 2 is installed on a moving device, the moving device can be a six-axis mechanical arm or the like device, which is used for controlling and adjusting the position of the center disc 1 and rotating the center disc 1, so as to facilitate feeding and repairing work, and a sleeve sleeve joint mechanism and a shaping mechanism are arranged on the arc side wall of the center disc 1.

[0027] The sleeve sleeve mechanism is used for sleeving the sleeve on the fault pin, the sleeve is a customized Ti-Ni memory alloy micro sleeve, the sleeve is a cylindrical semi-wrapped structure, the sleeve is made by micro-nano 3D printing, and about 10 mainstream specifications are stored according to common specifications, and quick access is supported; according to the special pin size, 3D printing is instantaneously formed, at room temperature (martensite phase), the mechanical arm clamps the sleeve clamping area, preforms the sleeve into a shape consistent with the pin bending, and sleeves into the inclined path; the slight interference fit generates a radial shrinkage force of about 0.02-0.03N, combined with the self-locking effect of the flexible deformation of the sleeve, there is no loosening before heating; at 70-80 DEG C (austenite phase), the sleeve automatically recovers the preset vertical shape, the pin is synchronously reset through the inner wall friction force, the restoring force is uniformly transmitted, and the vertical shape is kept after complete phase change, helping the pin to be stably shaped and avoiding elastic rebound; after cooling below 50 DEG C, the flexibility is restored, and the mechanical arm can be removed without damage through the action of axial micro pulling and rotation.

[0028] The sleeve sleeve mechanism comprises a first telescopic rod 4, the first telescopic rod 4 is installed on a rotating seat 3, the rotating seat 3 is embeddedly installed on a center disc 1, an adjusting motor one is arranged in the center disc 1, and the adjusting motor one is used for controlling the rotating seat 3 to rotate, a plurality of adjusting motors required in the application can be selected to adopt a micro stepping motor, such as NEMA, the rotating angle of each step is fixed, the pulse number corresponding to the target angle is calculated through a microcontroller, the motor is driven by a driving board to amplify current, the pulse number directly determines the rotating amount, and accurate control is realized by cooperating with an encoder calibration. The end of the first telescopic rod 4 is fixedly connected with a type frame 5, the type frame 5 is provided with a connecting block 6 in the middle, the connecting block 6 is rotatably installed in the type frame 5 through a metal shaft, a connecting block adjusting motor 7 is installed on one side wall of the type frame 5, the output end of the connecting block adjusting motor 7 is connected with the metal shaft, and the connecting block adjusting motor 7 is used for controlling the connecting block 6 to rotate. A clamping assembly is installed on the connecting block 6, the clamping assembly comprises two clamping arms 8 which are symmetrically arranged, a square groove is formed in the bottom of the connecting block 6, the top end of the clamping arm 8 is located in the square groove, a rotating shaft 9 is arranged at the top of the clamping arm 8, the rotating shaft 9 is rotatably inserted into the inner side wall of the square groove, one synchronous gear 10 is arranged on each rotating shaft 9, the two synchronous gears 10 are meshed and connected, an adjusting motor two is arranged in the connecting block 6, the output end of the adjusting motor two is connected with the rotating shaft 9, and the adjusting motor two is used for controlling the opening and closing of the two clamping arms 8, so that the sleeve is clamped and taken; the clamping block 11 is rotatably installed on the opposite surface of the bottom of the two clamping arms 8, the clamping block 11 is controlled by an adjusting motor three, and the clamping block 11 is used for clamping the sleeve. The clamping block 11 is made of silica gel, and the contact surface of the clamping block 11 with the sleeve is engraved with anti-skid lines for increasing the friction force with the sleeve. When clamping, the sleeve is wrapped by the elastic deformation of the silica gel, and the force is used to stably clamp the sleeve without exceeding the yield strength of the sleeve.

[0029] The shaping mechanism is used for controlling the temperature of the sleeve, the sleeve is sleeved on the fault pin at low temperature, when the temperature of the sleeve is raised, the sleeve restores to the preset shape to shape the pin. When the sleeve is sleeved, the position of the shaping mechanism is changed to the chip through the control of the rotating center disc 1, and the shaping process can be performed.

[0030] The shaping mechanism comprises a second telescopic rod 12, the end of the second telescopic rod 12 is connected with a heat isolation cover 13 for covering the heating area to reduce the heat diffusion to the surrounding air, a middle wave infrared laser 14 and a temperature detection device 17 are arranged in the heat isolation cover 13, the middle wave infrared laser 14 is used for heating the sleeve after the sleeve is sleeved on the pin, the relative position of the pin and the sleeve is scanned through the 3D visual camera, the heating target area, i.e. the pin segment covered by the sleeve, is generated, and the coordinates are synchronized to the infrared heat source device. The focusing lens of the infrared heat source is automatically calibrated to ensure that the heat only acts on the sleeve area, and the normal pin and the packaging body around the sleeve area maintain a safety distance of more than 0.5 mm to avoid the influence of heat conduction. When the sleeve is heated, the sleeve is preheated at low temperature first, the middle wave infrared laser 14 starts at a power of 3W, and the heating rate is controlled at 5℃ / s. The temperature of the sleeve is slowly raised to avoid the thermal stress difference between the sleeve and the pin caused by the sudden temperature rise. Then the temperature is quickly raised, and the power is raised to 5W. The temperature reaches the upper limit of the phase change temperature of the memory alloy, triggers the austenite phase change, the sleeve starts to change from the bending adaptive shape to the preset vertical shape, the internal crystal structure is reorganized, and the shape recovery force is generated. The temperature rises gradually, and the pin is slowly reset synchronously. Then the power is reduced to 3W, and the temperature of the sleeve is maintained at 75±2℃ for 30s to ensure that the sleeve completely completes the phase change and the shape is restored to the preset vertical state. At the same time, the pin is stably reset under the action of the continuous recovery force, and the elastic rebound trend is eliminated. Finally, the infrared heat source is turned off, and the miniature air cooling system is started to perform gradient cooling.

[0031] An installation block 15 is arranged on the side wall of the heat isolation cover 13, an air pipe 16 is connected to the outer side of the installation block 15, a miniature fan is arranged in the air pipe 16, an inner rotating disc 18 is rotatably arranged on the inner side of the installation block 15, a gas injection port 19 is arranged on one end of the inner rotating disc 18, an air inlet hose 20 is connected to the other end of the inner rotating disc 18, the air inlet hose 20 is in communication with the installation block 15, an inner rotating disc adjusting motor 21 is arranged in the installation block 15, and the output end of the inner rotating disc adjusting motor 21 is connected with the inner rotating disc 18. When the sleeve needs to be cooled or the chip is overheated and needs to be cooled, the fan in the air pipe 16 is started to suck the low-temperature air outside and then blow it out through the gas injection port 19 to the inside of the heat isolation cover 13. The inner rotating disc adjusting motor 21 is started to drive the inner rotating disc 18 to rotate, and then the blowing direction of the gas injection port 19 is changed to accurately cool the target position.

[0032] The temperature detection device 17 comprises a plurality of infrared temperature detectors for monitoring the temperature of the pin root and the sleeve, monitoring the temperature of the pin to ensure that the pin is below the temperature threshold of the packaging plastic sealing material, avoiding the failure of the internal bonding of the chip, and monitoring the surface temperature of the sleeve to ensure that it does not exceed 80 DEG C.

[0033] Referring to Figure 9 The application also provides a defect repair system for an integrated circuit packaging process, which comprises a central control system and an automatic feeding and positioning module, a 3D defect detection and parameter extraction module, a sleeve customization and storage module, an intelligent sleeve connection execution module, a phase change heating and shaping module, a gradient cooling and fixed-point temperature control module, and a repair effect verification module in bidirectional communication connection with the central control system.

[0034] The automatic feeding and positioning module is used for batch feeding, attitude calibration and fixation of chips, and the feeding and fixation of chips are realized through a high-precision XYθ platform and a vacuum suction chuck.

[0035] The central control system is used for sending control instructions to each module and receiving working state data fed back by each module to realize full-process collaborative scheduling; the automatic feeding and positioning module is used for batch feeding, attitude calibration and fixation of chips and outputs chip positioning coordinates to the 3D defect detection and parameter extraction module.

[0036] The 3D defect detection and parameter extraction module is used for scanning and identifying the bending shape of the pin, extracting the pin parameters and the 3D bending model through the existing 3D laser contour imaging and AI defect analysis model technology, and outputting the pin parameters and the 3D bending model to the sleeve customization and storage module and the intelligent sleeve connection execution module.

[0037] The sleeve customization and storage module is used for customizing and intelligently scheduling the memory alloy sleeve according to the pin parameters, outputting the sleeve specifications and a ready signal to the intelligent sleeve connection execution module, customizing the memory alloy sleeve according to the pin parameters such as diameter, length and bending shape, realizing "just-in-time production and intelligent scheduling", and ensuring the accurate adaptation of the sleeve to the defective pin; adopting selective laser melting (SLM) technology, using Ti-Ni alloy powder (Ni content 55%) as raw material, printing a half-wrapped sleeve with an opening of 120 DEG, which is convenient for lateral insertion; being equipped with 100-position micro storage, recording the specifications of the sleeve through an RFID tag, and automatically calling the matching sleeve according to the parameters of the pin to be repaired; and supporting "segmented sleeve" customization through 3D printing, which is used for complex S-shaped bending, each segment can independently adapt to the bending radius of the pin, and the sleeve connection degree is improved.

[0038] The intelligent sleeve joint execution module is used for planning a sleeve joint path according to a 3D bending model, completing pre-shaping, accurate sleeve insertion and fixing of the sleeve, and outputting sleeve positioning coordinates to the phase change heating shaping module; the optimal sleeve joint path is calculated in the pin bending shape, the mechanical arm is driven to complete flexible clamping, pre-shaping and accurate sleeve insertion of the sleeve, and it is ensured that the normal pins are not disturbed; the improved A* algorithm is used to plan the path of "Z-axis lifting→oblique cutting→fitting along the bending line": first, the mechanical arm is lifted to 0.5 mm above the normal pin, and then obliquely inserted along the tangent direction of the pin bending trajectory. The path algorithm generates a sleeve joint path through "three-dimensional modeling→global planning→local fitting→dynamic correction" in four steps, and the core is to let the path avoid the normal pins and fit the bending shape of the faulty pins: 1. Three-dimensional obstacle modeling: the normal pins and the chip edge are converted into "non-entry areas", such as the normal pins being regarded as cylindrical obstacles with a diameter of +0.02 mm, a safety distance is reserved, and a "free passage area" in the local three-dimensional space is constructed. 2. Global path search (through improved A* algorithm): a global obstacle avoidance path is planned from the initial position of the sleeve to the head of the faulty pin, and the heuristic function is optimized as: Wherein, h(n) is a heuristic function for estimating the "comprehensive cost" of the current path node to the target endpoint, which is the core of the A* algorithm and guides the path to search in the optimal direction; n is the current path node, which is a coordinate point in three-dimensional space, containing position and attitude information; distance(n, endpoint) is the Euclidean distance (spatial straight line distance, unit: mm) from the current node n to the sleeve insertion endpoint (near the root of the pin); path curvature(n) is the bending degree of the planned path at the current node n (unit: 1 / mm, reflecting the bending of the path); pin curvature is the bending curvature of the faulty pin itself (extracted from the 3D model, unit: 1 / mm, reflecting the natural bending state of the pin); 0.7, 0.3 are weight coefficients, representing the priority of "shortest distance" and "curvature matching pin" respectively (priority to ensure short path, while considering adaptation to pin shape). The path of "short distance + curvature matching pin bending" is preferentially selected to avoid rigid collision between the sleeve and the pin. 3. Local fitting and adaptation: a path is generated by offsetting 0.03 mm along the normal direction of the pin bending trajectory from the pin head to the root (sleeve insertion endpoint), to ensure that the sleeve inner wall closely fits the pin surface. 4. Dynamic correction: real-time deviation is monitored through vision (30 frames per second) and force control during sleeve insertion, and the path is fine-tuned (replanned when the deviation exceeds 0.05 mm), to ensure accurate sleeve insertion. Finally, a safe and shape-fitting sleeve joint path is output, which is suitable for bending pins and does not touch the normal pins.

[0039] The position of the sleeve needs to be adjusted when sleeving the sleeve, the movable rotating arm 2 drives the device to move to the sleeve storage place, the sleeve is clamped by the clamping assembly, then moves to the pin sleeving place, the sleeve is controlled to move up and down by controlling the extension and contraction of the first telescopic rod 4, the angle of the sleeve is adjusted by controlling the rotation of the connecting block driven by the motor 7, and the connecting block 6 is adjusted, and the sleeve is fine-tuned by controlling the rotation of the adjusting clamping block 11, so that the sleeve is sleeved more accurately.

[0040] The phase change heating shaping module is used for heating the sleeve to a phase change temperature according to the sleeve positioning coordinates, triggering the shape memory effect to drive the pin to reset, and outputting a heating completion signal and temperature abnormality information to the gradient cooling and fixed-point temperature control module.

[0041] The gradient cooling and fixed-point temperature control module is used for performing gradient cooling and abnormal position fixed-point cooling, and outputting a cooling completion signal to the repair effect verification module; during cooling, external low-temperature air is sucked in through the fan started in the air pipe 16 and then sprayed out through the air outlet 19 to blow to the inside of the heat isolation cover 13, the rotation of the inner rotating disc 18 is driven by controlling the start of the inner rotating disc adjusting motor 21, and then the blowing direction of the air outlet 19 is changed, so that the target position is accurately cooled.

[0042] The repair effect verification module is used for detecting the shape and performance of the repaired pin, and feeding back the repair result to the central control system, and a plurality of 3D industrial cameras are arranged in the device to shoot the upper part of the pin, such as the chip mounting part, the bottom of the connecting block 6 and the heat isolation cover 13, in order to obtain more comprehensive information, the technical personnel in the art can increase / decrease the setting of the camera according to the needs.

[0043] The application discloses a kind of integrated circuit packaging process's defect repair equipment and system, core is in the shape memory effect of memory alloy, combined with intelligent detection, customized adaptation and accurate control technology, solve many pain points of traditional repair method.Equipment is realized accurate sleeveing of memory alloy sleeve by sleeve sleeveing mechanism, complete heating shaping and cooling shaping with the aid of shaping mechanism;System takes central control system as core, overall planning feeding positioning, defect detection, sleeve customization, intelligent sleeving, heating shaping, cooling temperature control and effect verification module collaborative work, form closed loop repair process.The application is compact in structure, accurate in operation, high in automation, can realize non-destructive repair of different specifications, complex bending pin, can also guarantee repair consistency and efficiency, applicable to various integrated circuit packaging scenes, especially suitable for high value, high density packaging chip quality repair needs.It provides efficient, reliable defect solution for integrated circuit manufacturing industry, helps to reduce production cost, improve product competitiveness, with wide application prospect and practical value.

[0044] While embodiments of the application have been shown and described, it is to be understood that the embodiments described are merely exemplary of the principles and application of the present application. Numerous modifications and adaptions can be effected without departing from the spirit and scope of the present application, which is not limited to the exact construction and arrangement described. It is intended, therefore, to cover all modifications and adaptions that fall within the scope of the claims and their equivalents.

Claims

1. A defect repair device for integrated circuit packaging process, comprising a central disk, wherein one side wall of the central disk is fixedly connected to a movable rotating arm, characterized in that: The arc-shaped sidewall of the central disk is provided with: A sleeve connection mechanism is used to connect a sleeve to a fault pin; A shaping mechanism is used to control the temperature of the sleeve. When the temperature of the sleeve is low, it is fitted onto the faulty pin. When the temperature of the sleeve is increased, the sleeve returns to the preset shape to repair the pin.

2. The defect repair equipment for integrated circuit packaging process according to claim 1, characterized in that: The movable rotating arm is mounted on the mobile device.

3. The defect repair equipment for integrated circuit packaging process according to claim 1, characterized in that: The sleeve is a customized Ti-Ni shape memory alloy micro sleeve with a cylindrical semi-enclosed structure, and it is fabricated by micro-nano 3D printing.

4. The defect repair equipment for integrated circuit packaging process according to claim 1, characterized in that: The sleeve connection mechanism includes a first telescopic rod, which is mounted on a rotating seat. A C-shaped frame is fixedly connected to the end of the first telescopic rod. A connecting block is installed in the middle of the C-shaped frame, and a clamping assembly is installed on the connecting block.

5. The defect repair equipment for integrated circuit packaging process according to claim 4, characterized in that: The rotating seat is embedded in the central plate, and an adjusting motor is installed in the central plate to control the rotation of the rotating seat.

6. The defect repair equipment for integrated circuit packaging process according to claim 4, characterized in that: The connecting block is rotatably mounted in the C-shaped frame via a metal shaft. A connecting block adjusting motor is installed on one side wall of the C-shaped frame. The output end of the connecting block adjusting motor is connected to the metal shaft, and the connecting block adjusting motor is used to control the rotation of the connecting block.

7. The defect repair equipment for integrated circuit packaging process according to claim 4, characterized in that: The clamping assembly includes two symmetrically arranged clamping arms. A square groove is provided at the bottom of the connecting block, and the top of the clamping arm is located in the square groove. A rotating shaft is provided at the top of the clamping arm and is rotatably inserted into the inner wall of the square groove. Each rotating shaft is provided with a synchronous gear, and the two synchronous gears are meshed and connected. An adjustment motor is provided in the connecting block, and the output end of the adjustment motor is connected to the rotating shaft. The adjustment motor is used to control the opening and closing of the two clamping arms. Clamping blocks are rotatably mounted on the bottom opposing surfaces of the two clamping arms. The clamping blocks are controlled by adjusting the motor. The clamping blocks are used to clamp the contact sleeve. The clamping blocks are made of silicone, and the contact surface with the sleeve is engraved with anti-slip texture to increase the friction with the sleeve.

8. The defect repair equipment and system for integrated circuit packaging process according to claim 1, characterized in that: The shaping mechanism includes a second telescopic rod, the end of which is connected to a heat insulation cover to cover the heating area and reduce the heat diffusion to the surrounding air. A mid-wave infrared laser and a temperature detection device are installed inside the heat insulation cover. The mid-wave infrared laser is used to heat the sleeve after the sleeve is fitted onto the pin. A mounting block is provided on the side wall of the thermal isolation cover. An air pipe is connected to the outside of the mounting block, and a miniature fan is installed inside the air pipe. An inner turntable is rotatably installed on the inside of the mounting block. One end of the inner turntable has an air jet port, and the other end of the inner turntable is connected to an air inlet hose. The air inlet hose is connected to the mounting block. An inner turntable adjustment motor is provided in the mounting block, and the output end of the inner turntable adjustment motor is connected to the inner turntable.

9. A defect repair device for integrated circuit packaging process according to claim 5, characterized in that: The temperature detection device includes multiple sets of infrared thermometers for monitoring the temperature at the root of the pin and the temperature of the sleeve.

10. A defect repair system for integrated circuit packaging processes, characterized in that, The system is used in the defect repair equipment according to any one of claims 1-9. The system includes: a central control system, and a fully automatic feeding and positioning module, a 3D defect detection and parameter extraction module, a sleeve customization and storage module, an intelligent sleeve execution module, a phase change heating and shaping module, a gradient cooling and fixed-point temperature control module, and a repair effect verification module that are bidirectionally connected to the central control system. The central control system is used to send control commands to each module and receive working status data from each module to achieve full-process collaborative scheduling; the fully automatic feeding and positioning module is used for batch feeding, posture calibration and fixation of chips, and outputs chip positioning coordinates to the 3D defect detection and parameter extraction module. The 3D defect detection and parameter extraction module is used to scan and identify the pin bending shape, extract pin parameters and 3D bending model, and output the pin parameters and 3D bending model to the sleeve customization and storage module and the intelligent socketing execution module, respectively. The sleeve customization and storage module is used to customize shape memory alloy sleeves according to the pin parameters and intelligently schedule them, and output sleeve specifications and ready signals to the intelligent sleeve execution module. The intelligent socketing execution module is used to plan the socketing path according to the 3D bending model, complete the pre-shaping, precise insertion and fixing of the sleeve, and output the sleeve positioning coordinates to the phase change heating shaping module. The phase change heating and shaping module is used to heat the sleeve to the phase change temperature according to the sleeve positioning coordinates, trigger the shape memory effect to drive the pin to reset, and output the heating completion signal and temperature abnormality information to the gradient cooling and fixed-point temperature control module. The gradient cooling and fixed-point temperature control module is used to perform gradient cooling and fixed-point cooling at abnormal locations, and outputs a cooling completion signal to the repair effect verification module. The repair effect verification module is used to detect the shape and performance of the pins after repair and to feed back the repair results to the central control system.

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