Display substrate, preparation method thereof and display device

Abstract

The invention provides a display substrate. The display substrate comprises a substrate body; a driving circuit layer; the light-emitting device layer comprises a plurality of light-emitting devices, each light-emitting device comprises a first electrode, a light-emitting function part and a second electrode, the light-emitting device layer comprises at least one light-emitting unit, each light-emitting unit comprises at least two light-emitting devices and a connecting electrode, and the at least two light-emitting devices and the connecting electrode are sequentially connected in series; the conductive layer comprises a conductive part, and the conductive part comprises at least two first conductive sub-parts which are distributed at intervals; in the light-emitting unit, among two adjacent and electrically connected light-emitting devices, the second electrode of one light-emitting device is electrically connected to the first electrode of the other light-emitting device through the first conductive section, and in the connection electrode and the light-emitting device electrically connected to the connection electrode, the second electrode of the other light-emitting device is electrically connected to the first conductive section through the second conductive section. The connecting electrode is electrically connected with the second electrode of the light-emitting device through the first conductive sub-part; the display substrate further comprises partition parts, and at least one partition part is arranged between every two adjacent first conductive sub parts.

Description

Display substrate, manufacturing method thereof and display device TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular, to a display substrate, a manufacturing method thereof and a display device. BACKGROUND

[0002] Micro Light-Emitting Diode (Micro LED) is a light-emitting diode with a micron-level size. Since the size of the Micro LED is small, it can be used as a pixel on a display panel. A display substrate prepared by using the Micro LED can be referred to as a Micro LED display substrate. In the Micro LED product, the Micro LED technology is to miniaturize the size of the existing LED to less than 100 um, which is about 1% of the size of the existing LED. Then, through a mass transfer technology, the Micro LED with a micron level is transferred to a driving substrate, thereby forming various Micro LED displays with different sizes. How to optimize the related structure of the display product to improve the display resolution is one of the important topics for researchers to study.

[0003] The above information disclosed in this section is only for the purpose of understanding the background of the inventive concept of the present disclosure, and therefore, the above information can include information that does not constitute prior art.

[0004] SUMMARY

[0005] In one aspect, a display substrate is provided, the display substrate comprising:

[0006] a substrate substrate;

[0007] a driving circuit layer on the substrate substrate;

[0008] a light-emitting device layer on a side of the driving circuit layer away from the substrate substrate, comprising a plurality of light-emitting devices arranged in an array along a first direction and a second direction, the light-emitting device comprising a first electrode on the driving circuit layer, a light-emitting functional part on a side of the first electrode away from the substrate substrate, and a second electrode on a side of the light-emitting functional part away from the substrate substrate, the light-emitting device layer comprising at least one light-emitting unit, the light-emitting unit comprising at least two light-emitting devices and one connecting electrode, the at least two light-emitting devices and the one connecting electrode being connected in series in sequence; and

[0009] a conductive layer located on a side of the plurality of light emitting devices away from the substrate, the conductive layer comprising at least one conductive portion, a projection of the conductive portion on the substrate at least partially overlapping a projection of the light emitting unit on the substrate, the conductive portion comprising at least two first conductive sub-portions spaced apart;

[0010] wherein, in the light emitting unit, in two adjacent and electrically connected light emitting devices, a second electrode of one light emitting device is electrically connected to a first electrode of another light emitting device through the first conductive sub-portion, and, in the connecting electrode and the light emitting device electrically connected to the connecting electrode, the connecting electrode is electrically connected to a second electrode of the light emitting device through the first conductive sub-portion; and

[0011] the display substrate further comprises a partition portion, at least one partition portion being between two adjacent first conductive sub-portions.

[0012] According to some exemplary embodiments, the partition portion comprises a first partition portion, at least one first partition portion being between two adjacent first conductive sub-portions in the conductive portion; and / or

[0013] the partition portion comprises a second partition portion, at least one second partition portion being between two adjacent conductive portions.

[0014] According to some exemplary embodiments, in two adjacent light emitting devices in the light emitting unit, a first electrode of one light emitting device has an extension portion extending out of an edge of a light emitting functional portion, the extension portion being electrically connected to a second electrode of another light emitting device through the first conductive sub-portion.

[0015] According to some exemplary embodiments, at least a portion of the first partition portion is located on a side of the extension portion away from the substrate, a size of the first partition portion along an extension direction of the first partition portion being greater than or equal to a size of the extension portion.

[0016] According to some exemplary embodiments, the partition portion has a first surface away from the substrate and a second surface close to the substrate, a projection of the second surface on the substrate being located within a projection of the first surface on the substrate.

[0017] According to some exemplary embodiments, the display substrate further comprises a cover layer, the cover layer being located between the plurality of light emitting devices and the conductive layer, the cover layer comprising a plurality of cover portions, the plurality of cover portions respectively covering at least a portion of surfaces of the plurality of light emitting devices; and

[0018] The cover portion includes a first opening exposing at least a portion of a second electrode of the light emitting device, and the first conductive sub-portion is electrically connected to the second electrode of the light emitting device through the first opening.

[0019] The partition portion is located in the cover layer.

[0020] According to some exemplary embodiments, two adjacent first conductive sub-portions have one partition portion, the partition portion is integrally connected with one adjacent cover portion and is spaced apart from another adjacent cover portion, and the two adjacent first conductive sub-portions are disconnected at the partition portion.

[0021] According to some exemplary embodiments, two adjacent first conductive sub-portions have two partition portions spaced apart, and the two adjacent first conductive sub-portions are disconnected at the spaced apart positions of the two partition portions.

[0022] One of the partition portions is integrally connected with the adjacent cover portion, and the other partition portion is spaced apart from the adjacent cover portion; and / or

[0023] One of the partition portions is integrally connected with the adjacent cover portion, and the other partition portion is integrally connected with the adjacent cover portion; and / or

[0024] One of the partition portions is spaced apart from the adjacent cover portion, and the other partition portion is spaced apart from the adjacent cover portion.

[0025] According to some exemplary embodiments, the conductive portion further includes a second conductive sub-portion located between two partition portions spaced apart, and the second conductive sub-portion is disconnected with two adjacent first conductive sub-portions at the two partition portions, respectively.

[0026] According to some exemplary embodiments, two adjacent first conductive sub-portions have one partition portion, the partition portion is integrally connected with one adjacent cover portion and is spaced apart from another adjacent cover portion, and the two adjacent first conductive sub-portions are disconnected at the partition portion.

[0027] According to some exemplary embodiments, the cover layer comprises a passivation layer, the passivation layer comprises a first passivation sub-layer located on a side of the plurality of light emitting devices away from the substrate, and a second passivation sub-layer located on a side of the first passivation sub-layer away from the substrate, the partition portion comprises a first partition sub-portion and a second partition sub-portion located on a side of the first partition sub-portion away from the substrate, the first partition sub-portion is located on the first passivation sub-layer, the second partition sub-portion is located on the second passivation sub-layer, and a projection of the first partition sub-portion on the substrate is located within a projection of the second partition sub-portion on the substrate.

[0028] According to some exemplary embodiments, the cover layer comprises an organic protective layer, the partition portion is located on the organic protective layer, and a cross-sectional shape of the partition portion along a direction perpendicular to the substrate is an inverted trapezoid.

[0029] According to some exemplary embodiments, the connection electrode is located on a side of the driving circuit layer away from the substrate, and the connection electrode is arranged apart from the adjacent light emitting device.

[0030] According to some exemplary embodiments, the connection electrode is located on the same layer as the first electrode.

[0031] According to some exemplary embodiments, the connection electrode is located on a side of the conductive layer away from the substrate, the connection electrode is electrically connected to the first conductive sub-portion, and a projection of the connection electrode on the substrate at least partially overlaps with a projection of the light emitting functional portion on the substrate.

[0032] According to some exemplary embodiments, the display substrate further comprises at least one auxiliary electrode, the auxiliary electrode is electrically connected to the connection electrode, and a projection of the auxiliary electrode on the substrate does not overlap with a projection of the light emitting functional portion on the substrate.

[0033] According to some exemplary embodiments, the at least one light emitting unit comprises a first light emitting unit, a second light emitting unit, and a third light emitting unit, and the light emitting device emits third color light rays.

[0034] The display substrate further comprises a color conversion layer, the color conversion layer is located on a side of the conductive layer away from the substrate, or the color conversion layer is located on a side of the substrate away from the light emitting device layer; and

[0035] The color conversion layer includes a first color conversion portion and a second color conversion portion, a projection of the first color conversion portion on the substrate is at least partially overlapped with a projection of the first light emitting unit on the substrate, the first color conversion portion is configured to convert third color light into first color light, a projection of the second color conversion portion on the substrate is at least partially overlapped with a projection of the second light emitting unit on the substrate, and the second color conversion portion is configured to convert third color light into second color light.

[0036] According to some example embodiments, the cover layer includes a reflective layer, the reflective layer includes a plurality of reflective portions, the plurality of reflective portions cover at least a portion of sidewalls of the plurality of light emitting devices, the light emitting devices emit third color light, and the reflective portions reflect third color light and transmit first color light and second color light.

[0037] According to some example embodiments, the partition portion is located in the reflective layer.

[0038] According to some example embodiments, the reflective layer includes at least two layers of first reflective sub-layers and at least two layers of second reflective sub-layers, the at least two layers of first reflective sub-layers and the at least two layers of second reflective sub-layers are arranged alternately in a direction away from the substrate, a refractive index of the first reflective sub-layers is less than a refractive index of the second reflective sub-layers.

[0039] The partition portion includes at least two first partition sub-portions and at least two second partition sub-portions, the at least two first partition sub-portions are respectively located in the at least two layers of first reflective sub-layers, and the at least two second partition sub-portions are respectively located in the at least two layers of second reflective sub-layers.

[0040] In adjacent first partition sub-portions and second partition sub-portions, a projection of the first partition sub-portion on the substrate is located within a projection of the second partition sub-portion on the substrate, or a projection of the second partition sub-portion on the substrate is located within a projection of the first partition sub-portion on the substrate.

[0041] According to some example embodiments, the display substrate further includes a planarization layer, the planarization layer is located on a side of the conductive layer away from the reflective layer, the planarization layer has a second opening, and the second opening exposes at least a portion of a first conductive sub-portion that is electrically connected only to a second electrode of the light emitting device.

[0042] The connection electrode is located on a side of the planarization layer away from the substrate, and the connection electrode is electrically connected to the first conductive sub-portion through the second opening.

[0043] According to some exemplary embodiments, the at least one light emitting unit comprises a first light emitting unit, a second light emitting unit and a third light emitting unit, and the light emitting device emits third color light rays;

[0044] The display substrate further comprises a color conversion layer located on a side of the substrate away from the light emitting device layer; and

[0045] The color conversion layer comprises a first color conversion portion, a second color conversion portion and a light transmission portion, a projection of the first color conversion portion on the substrate at least partially overlaps with a projection of the first light emitting unit on the substrate, the first color conversion portion is configured to convert third color light rays into first color light rays, a projection of the second color conversion portion on the substrate at least partially overlaps with a projection of the second light emitting unit on the substrate, the second color conversion portion is configured to convert third color light rays into second color light rays, a projection of the light transmission portion on the substrate at least partially overlaps with a projection of the third light emitting unit on the substrate, and the light transmission portion is configured to transmit third color light rays.

[0046] According to some exemplary embodiments, the side of the substrate away from the light emitting device layer has a plurality of grooves, the plurality of grooves comprises a first groove, and at least a portion of the first color conversion portion is embedded in the first groove; and / or

[0047] The plurality of grooves comprises a second groove, and at least a portion of the second color conversion portion is embedded in the second groove; and / or

[0048] The plurality of grooves comprises a third groove, and at least a portion of the light transmission portion is embedded in the third groove.

[0049] According to some exemplary embodiments, at least a portion of the grooves is provided with a metal reflection portion between the substrate and the color conversion layer, and the metal reflection portion covers at least a portion of the sidewall of the groove.

[0050] According to some exemplary embodiments, the display substrate further comprises a semi-transmissive and semi-reflective layer located on a side of the color conversion layer away from the substrate, the semi-transmissive and semi-reflective layer transmits first color light rays and second color light rays and reflects third color light rays;

[0051] A projection of the semi-transmissive and semi-reflective layer on the substrate at least partially overlaps with a projection of the first color conversion portion on the substrate; and / or

[0052] A projection of the semi-transmissive and semi-reflective layer on the substrate at least partially overlaps with a projection of the second color conversion portion on the substrate.

[0053] According to some exemplary embodiments, in at least one of the light emitting units, the at least two light emitting devices are arranged along the first direction, and the first partition portion is arranged along the second direction; and / or

[0054] In at least one of the light emitting units, the at least two light emitting devices are arranged along the second direction, and the first partition portion is arranged along the first direction.

[0055] According to some exemplary embodiments, in at least one of the light emitting units, the at least two light emitting devices are arranged along the first direction and the at least two light emitting devices are arranged along the second direction;

[0056] In the at least one of the light emitting units, between two light emitting devices adjacent along the first direction, the first partition portion is arranged along the second direction; and / or

[0057] In the at least one of the light emitting units, between two light emitting devices adjacent along the second direction, the first partition portion is arranged along the first direction.

[0058] According to some exemplary embodiments, a shape of a normal projection of the light emitting device on the substrate is circular, elliptical, rectangular, or rounded rectangular.

[0059] In another aspect, a manufacturing method of a display substrate is provided, the manufacturing method comprising the following steps:

[0060] forming a driving circuit layer on a substrate;

[0061] forming a light emitting device layer on a side of the driving circuit layer away from the substrate, the light emitting device layer comprising a plurality of light emitting devices arranged in an array along a first direction and a second direction, the light emitting device comprising a first electrode on the driving circuit layer, a light emitting functional portion on a side of the first electrode away from the substrate, and a second electrode on a side of the light emitting functional portion away from the substrate, the light emitting device layer comprising at least one light emitting unit, the light emitting unit comprising at least two light emitting devices and a connecting electrode;

[0062] forming a partition portion on a side of the driving circuit layer away from the substrate; and

[0063] A conductive layer is formed on the light emitting device layer and the partition portion away from the substrate, the conductive layer comprising at least one conductive portion, a projection of the conductive portion on the substrate at least partially overlaps with a projection of the light emitting unit on the substrate, the conductive portion comprises at least two first conductive sub-portions which are spaced apart, and at least one partition portion is between two adjacent first conductive sub-portions, in the light emitting unit, in two adjacent light emitting devices, a second electrode of one light emitting device is electrically connected to a first electrode of another light emitting device through the first conductive sub-portion, and in the connecting electrode and the light emitting device adjacent to the connecting electrode, the connecting electrode is electrically connected to the second electrode of the light emitting device through the first conductive sub-portion.

[0064] In yet another aspect, a display device is provided, comprising the display substrate according to any one of the above. BRIEF DESCRIPTION OF DRAWINGS

[0065] The features and advantages of the present disclosure will become more apparent from the detailed description of example embodiments thereof in conjunction with the accompanying drawings.

[0066] FIG. 1 schematically shows a plan view of a display substrate according to some embodiments of the present disclosure.

[0067] FIG. 2A schematically shows an enlarged view of the area A1 in FIG. 1 according to some embodiments of the present disclosure.

[0068] FIG. 2B schematically shows a cross-sectional view taken along BB’ in FIG. 2A.

[0069] FIG. 2C schematically shows an enlarged view of the area A1 in FIG. 1 according to some other embodiments of the present disclosure.

[0070] FIG. 3A schematically shows an enlarged view of the area A1 in FIG. 1 according to some embodiments of the present disclosure.

[0071] FIG. 3B schematically shows a cross-sectional view taken along CC’ in FIG. 3A.

[0072] FIG. 4 schematically shows a cross-sectional view of a display substrate taken along NN’ in FIG. 1 according to some embodiments of the present disclosure.

[0073] FIG. 5A schematically shows an enlarged view of the area A1 in FIG. 1 according to some embodiments of the present disclosure.

[0074] FIG. 5B schematically shows a cross-sectional view taken along DD’ in FIG. 5A.

[0075] FIG. 6A schematically illustrates an enlarged view of the display substrate in region Al of FIG. 1, according to some embodiments of the present disclosure.

[0076] FIG. 6B schematically illustrates a cross-sectional view taken along EE’ in FIG. 6A.

[0077] FIG. 7 schematically illustrates a cross-sectional view of the display substrate taken along MM’ in FIG. 1, according to some embodiments of the present disclosure.

[0078] FIG. 8A schematically illustrates a cross-sectional view of the display substrate taken along MM’ in FIG. 1, according to some embodiments of the present disclosure.

[0079] FIG. 8B schematically illustrates a cross-sectional view of the etched first opening of the alternating arrangement of silicon oxide thin films and niobium oxide thin films characterized by a scanning electron microscope.

[0080] FIG. 8C schematically illustrates a cross-sectional view of the etched second opening of the alternating arrangement of silicon oxide thin films and niobium oxide thin films characterized by a scanning electron microscope.

[0081] FIG. 9 schematically illustrates a cross-sectional view of the display substrate taken along MM’ in FIG. 1, according to some embodiments of the present disclosure.

[0082] FIG. 10A schematically illustrates an enlarged view of the display substrate in region Al of FIG. 1, according to some embodiments of the present disclosure.

[0083] FIG. 10B schematically illustrates an enlarged view of the display substrate in region A2 of FIG. 1, according to some embodiments of the present disclosure.

[0084] FIG. 10C schematically illustrates an enlarged view of the display substrate in region A3 of FIG. 1, according to some embodiments of the present disclosure.

[0085] FIG. 10D schematically illustrates a cross-sectional view taken along FF’ in FIG. 10A.

[0086] FIG. 11 schematically illustrates a flowchart of a method of fabricating a display substrate, according to some embodiments of the present disclosure.

[0087] FIGS. 12A-12I schematically illustrate process diagrams of forming a display substrate, according to some embodiments of the present disclosure.

[0088] FIGS. 13A-13K schematically illustrate process diagrams of forming a display substrate, according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0089] In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are some but not all of the embodiments of the present disclosure. Based on the described embodiments of the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without creative effort belong to the protection scope of the present disclosure.

[0090] It should be noted that in the drawings, the size and relative size of the elements can be exaggerated for clarity and / or descriptive purposes. Thus, the size and relative sizes of the elements in the drawings are not necessarily drawn to scale. In the description and drawings, identical or similar reference numerals indicate identical or similar components.

[0091] When an element is described as being "on" another element, "connected to" another element, or "coupled to" another element, it can be directly on, directly connected to, or directly coupled to the other element, or intervening elements can be present. However, when an element is described as being "directly on," "directly connected to," or "directly coupled to" another element, there are no intervening elements present. Other terms and / or expressions used herein to describe relationships between elements should be interpreted in a like manner, such as "between" versus "directly between," "adjacent" versus "directly adjacent," or "on" versus "directly on" and the like. In addition, the term "connected" can refer to physical or electrical connectivity, communicative connectivity, and / or fluidic connectivity. Furthermore, the X-axis, Y-axis, and Z-axis are not limited to the three axes of a rectangular coordinate system, and can be interpreted in a broader sense. For example, the X-axis, Y-axis, and Z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other. For the purposes of the present disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted to mean only X, only Y, only Z, or any combination of two or more of X, Y, and Z such as XYZ, XY, YZ, and XZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated items.

[0092] It should be noted that, although the terms "first," "second," etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. Rather, these terms are used only to distinguish one element, component, region, layer and / or section from another element, component, region, layer and / or section. Thus, a first element, component, region, layer and / or section discussed below could be termed a second element, component, region, layer and / or section without departing from the teachings of the present disclosure.

[0093] Spatially relative terms, such as "upper," "lower," "left," "right," and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. For example, if a device described is turned over in the figure, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features.

[0094] In this document, the terms "substantially," "approximately," "about," "generally," and other similar terms are used as terms of approximation, and not as terms of degree, and they are intended to account for the inherent deviations in measured or calculated values that would be recognized by those of ordinary skill in the art. "About" or "approximately," as used herein when used in relation to a particular value, includes the stated value, plus or minus 30%, 20%, 10%, 5%, or within one or more standard deviations, as determined by one of ordinary skill in the art. For example, "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value.

[0095] It should be noted that, in this document, the term "same layer" refers to a layer structure formed by using the same film formation process to form a film layer for forming a specific pattern, and then patterning the film layer by a one-time patterning process using the same mask. Depending on the specific pattern, the one-time patterning process can include multiple exposure, development or etching processes, and the specific pattern in the formed layer structure can be continuous or discontinuous. That is, the plurality of elements, components, structures and / or parts located in the "same layer" are composed of the same material and are formed by the same one-time patterning process, and generally, the plurality of elements, components, structures and / or parts located in the "same layer" have substantially the same thickness.

[0096] It should be understood by those skilled in the art that, herein, the expression "height" or "thickness" refers to the dimension along the surface of each film layer arranged perpendicularly to the display substrate, i.e. the dimension along the light-out direction of the display substrate, or the dimension along the normal direction of the display device, unless otherwise specified.

[0097] In this document, the expression "transistor" can be a triode, a thin-film transistor or a field-effect transistor or other devices with the same characteristics. In the embodiments of the present disclosure, in order to distinguish the two poles of the transistor other than the control pole, one of the poles is referred to as the first pole and the other is referred to as the second pole. In actual operation, when the transistor is a thin-film transistor or a field-effect transistor, the first pole can be the drain and the second pole can be the source, or the first pole can be the source and the second pole can be the drain.

[0098] FIG. 1 schematically shows a plan view of a display substrate according to some embodiments of the present disclosure.

[0099] FIG. 2A schematically shows an enlarged view of the display substrate in region A1 in FIG. 1 according to some embodiments of the present disclosure, wherein FIG. 2A only schematically shows the first electrode of the light-emitting device, the second electrode of the light-emitting device, the connecting electrode, the conductive layer, the first opening and the third opening of the cover layer, and the partition.

[0100] FIG. 2B schematically shows a cross-sectional view taken along BB' in FIG. 2A.

[0101] With reference to FIGS. 1 and 2A, 2B, the display substrate includes a substrate 100, a drive circuit layer 200, a light-emitting device layer 300, and a conductive layer 400. The drive circuit layer 200 is located on the substrate 100, the light-emitting device layer 300 is located on the side of the drive circuit layer 200 away from the substrate 100 and is electrically connected to the drive circuit layer 200, and the conductive layer 400 is located on the side of the light-emitting device layer 300 away from the substrate 100 and is electrically connected to the light-emitting device layer 300.

[0102] The light-emitting device layer 300 includes a plurality of light-emitting devices 310 arranged in an array along a first direction X and a second direction Y. The light-emitting device 310 includes a first electrode 311 located on the drive circuit layer 200, a light-emitting functional part 312 located on the side of the first electrode 311 away from the substrate 100, and a second electrode 313 located on the side of the light-emitting functional part 312 away from the substrate 100. The light-emitting device layer 300 includes at least one light-emitting unit 300G, and the light-emitting unit 300G includes at least two light-emitting devices 310 and one connecting electrode 320. Each light-emitting device 310 in the light-emitting unit 300G and one connecting electrode 320 are connected in series.

[0103] The conductive layer 400 includes at least one conductive part 410, a projection of the conductive part 410 on the substrate 100 at least partially overlaps a projection of the light emitting unit 300G on the substrate 100, and the conductive part 410 is electrically connected to the light emitting unit 300G to realize series connection of each light emitting device 310 in the light emitting unit 300G and one connection electrode 320.

[0104] The conductive part 410 includes at least two first conductive sub-parts 411 distributed at intervals, in the light emitting unit 300G, the second electrode 313 of one light emitting device 310 is electrically connected to the first electrode 311 of another light emitting device 310 through the first conductive sub-part 411, and in the connection electrode 320 and the light emitting device 310 electrically connected to the connection electrode 320, the connection electrode 320 is electrically connected to the second electrode 313 of the light emitting device 310 through the first conductive sub-part 411, that is, through the bridging of the first conductive part 410, so that each light emitting device 310 and the connection electrode 320 are connected in series.

[0105] In the embodiments of the present disclosure, the display substrate further includes a partition part 500, and at least one partition part 500 is arranged between two adjacent first conductive sub-parts 411. By arranging the partition part 500 at a predetermined position, the conductive layer 400 formed is partitioned into a plurality of first conductive sub-parts 411 at intervals by the partition part 500, so that the conductive layer 400 with a predetermined pattern can be formed only by a thin film deposition process without performing a patterning process, saving the preparation process, thereby reducing the manufacturing cost of the display substrate. On the other hand, compared with the plurality of first conductive sub-parts 411 formed by the patterning process, the distance between the two adjacent first conductive sub-parts 411 partitioned by the partition part 500 can be significantly reduced, that is, the distance between the adjacent light emitting devices 310 can be narrowed, thereby realizing the improvement of the resolution of the display substrate.

[0106] For example, the light emitting device 310 can be a micro light emitting diode (Micro LED), and the light emitting functional part 312 includes a first semiconductor part 3121 on the first electrode 311, a light emitting part 3122 on a side of the first semiconductor part 3121 away from the first electrode 311, and a second semiconductor part 3123 on a side of the light emitting part 3122 away from the substrate 100.

[0107] For example, one of the first semiconductor part 3121 and the second semiconductor part 3123 is an N-type semiconductor part, and the other is a P-type semiconductor part. The material of the N-type semiconductor part can include N-type gallium nitride, and the material of the P-type semiconductor part can include P-type gallium nitride.

[0108] For example, the light emitting part 3122 can include a multiple quantum well (MQW) structure, which can be a periodic structure in which gallium nitride (GaN) and indium gallium nitride (InGaN) are alternately arranged, but is not limited thereto.

[0109] According to some exemplary embodiments, with reference to FIGS. 2A and 2B in conjunction, the partition part 500 includes a first partition part 510, and in the conductive part 410, at least one first partition part 510 is between two adjacent first conductive sub-parts 411. By arranging the first partition part 510 at the interval position of the adjacent first conductive sub-parts 411 in the conductive part 410, the conductive part 410 formed is naturally partitioned into at least two first conductive sub-parts 411 by the first partition part 510.

[0110] According to some exemplary embodiments, with reference to FIGS. 2A and 2B in conjunction, the partition part 500 includes a second partition part 520, and at least one second partition part 520 is between two adjacent conductive parts 410. By arranging the second partition part 520 at the interval position of the adjacent conductive parts 410, the conductive layer 400 formed is naturally partitioned into at least two conductive parts 410 by the second partition part 520.

[0111] According to some exemplary embodiments, with reference to FIGS. 2A and 2B in conjunction, in two adjacent and electrically connected light emitting devices 310 in the light emitting unit 300G, the first electrode 311 of one light emitting device 310 has an extension part 3111 extending out of the edge of the light emitting functional part 312, the orthographic projection of the extension part 3111 on the substrate 100 does not overlap with the orthographic projection of the light emitting functional part 312 of the light emitting device 310 on the substrate 100, and the extension part 3111 is electrically connected to the second electrode 313 of the other light emitting device 310 through the first conductive sub-part 411, thereby realizing the series connection of the two adjacent light emitting devices 310.

[0112] According to some exemplary embodiments, with reference to FIGS. 2A and 2B in conjunction, at least a part of the first partition part 510 is located on the side of the extension part 3111 away from the substrate 100, and along the extension direction of the first partition part 510, the size H1 of the first partition part 510 is greater than or equal to the size H2 of the extension part 3111, so as to ensure that the first partition part 510 completely partitions the two adjacent first conductive sub-parts 411.

[0113] It is additionally explained that the extension direction of the first partition part 510 should be understood as the extension direction of the edge of the conductive part 410 formed by the first partition part 510.

[0114] According to some exemplary embodiments, referring to FIG. 2B, the partition 500 has a first surface away from the substrate 100 and a second surface close to the substrate 100, and a projection of the second surface on the substrate 100 is within a projection of the first surface on the substrate 100. That is, the partition 500 has an undercut structure at the sidewall, which can achieve a better partition effect, so that the conductive layer 400 can be disconnected at the sidewall of the partition 500.

[0115] According to some exemplary embodiments, referring to FIGS. 2A and 2B, the display substrate further includes a cover layer 600 between the plurality of light emitting devices 310 and the conductive layer 400, and the cover layer 600 includes a plurality of cover portions 610 arranged at intervals, and the plurality of cover portions 610 respectively cover at least part of the surface of the plurality of light emitting devices 310. The cover portion 610 has a first opening K1, and the first opening K1 exposes at least part of the second electrode 313 of the light emitting device 310, and the first conductive sub-portion 411 is electrically connected to the second electrode 313 of the light emitting device 310 through the first opening K1.

[0116] According to some exemplary embodiments, referring to FIGS. 2A and 2B, the connecting electrode 320 is between the driving circuit layer 200 and the cover layer 600, and the connecting electrode 320 is electrically connected to the driving circuit layer 200. The connecting electrode 320 is arranged at intervals with the adjacent light emitting device 310, and the cover layer 600 covers at least part of the surface of the connecting electrode 320, and the cover layer 600 has a third opening K3, and the third opening K3 exposes at least part of the connecting electrode 320. In the light emitting device 310 electrically connected to the connecting electrode 320, one end of the first conductive sub-portion 411 is electrically connected to the connecting electrode 320 through the third opening K3, and the other end of the first conductive sub-portion 411 is electrically connected to the second electrode 313 of the light emitting device 310 through the first opening K1.

[0117] According to some exemplary embodiments, referring to FIG. 2B, the connecting electrode 320 and the first electrode 311 are in the same layer, that is, the connecting electrode 320 and the first electrode 311 are formed by the same thin film deposition process and patterning process, which can simplify the preparation process of the display substrate.

[0118] According to some exemplary embodiments, the light emitting device 310 has a circular, elliptical, rectangular or rounded rectangular shape in projection on the substrate 100.

[0119] For example, referring to FIG. 2A, the light emitting device has a circular shape in projection on the substrate 100, and the first electrode 311 and the third electrode 313 of the light emitting device are schematically shown in FIG. 2A, and the first electrode 311 has a circular shape in projection on the substrate 100, and the third electrode 313 has a circular shape in projection on the substrate 100.

[0120] FIG. 2C schematically shows an enlarged view of the area A1 in FIG. 1, according to some embodiments of the present disclosure.

[0121] For example, referring to FIG. 2C, the shape of the orthographic projection of the light emitting device on the substrate 100 is a rectangle, and FIG. 2C schematically shows the first electrode 311 and the third electrode 313 of the light emitting device, the shape of the orthographic projection of the first electrode 311 on the substrate 100 is a rectangle, and the shape of the orthographic projection of the third electrode 313 on the substrate 100 is a rectangle. In this way, the light emitting area of the light emitting device 310 can be improved.

[0122] FIG. 3A schematically shows an enlarged view of the area A1 in FIG. 1, according to some embodiments of the present disclosure, wherein FIG. 3A only schematically shows the first electrode of the light emitting device, the second electrode of the light emitting device, the conductive layer, the first opening of the cover layer, and the partition portion.

[0123] FIG. 3B schematically shows a cross-sectional view taken along CC’ in FIG. 3A.

[0124] According to some exemplary embodiments, referring to FIG. 3B, the connecting electrode 320 is located on the side of the conductive layer 400 away from the substrate 100, the connecting electrode 320 is electrically connected to the first conductive sub-portion 411, and the orthographic projection of the connecting electrode 320 on the substrate 100 at least partially overlaps with the orthographic projection of the light emitting functional portion 312 on the substrate 100. In this way, the distance between adjacent light emitting units 300G can be narrowed, and the resolution of the display substrate can be further improved.

[0125] According to some exemplary embodiments, referring to FIG. 3B, the light emitting device 310 can be configured to emit light from the side of the second electrode 313. Since the orthographic projection of the connecting electrode 320 on the substrate 100 at least partially overlaps with the orthographic projection of the light emitting functional portion 312 on the substrate 100, in order to avoid the connecting electrode 320 blocking the light emitting device 310, the material of the connecting electrode 320 can be a transparent conductive material, for example, the material of the connecting electrode 320 can include indium tin oxide. The plurality of connecting electrodes 320 in the plurality of light emitting units 300G can be connected to each other to form a grid-shaped electrode structure, and the grid-shaped electrode structure can be electrically connected to the driving circuit layer 200 in the peripheral area of the display substrate.

[0126] According to some exemplary embodiments, referring to FIG. 3B, the display substrate further comprises at least one auxiliary electrode 910, the auxiliary electrode 910 is electrically connected with the connecting electrode 320, and a projection of the auxiliary electrode 910 on the substrate 100 does not overlap with a projection of the light-emitting functional unit 312 on the substrate 100. The auxiliary electrode 910 can comprise a metal material with a high resistivity, for example, the material of the auxiliary electrode 910 can comprise at least one of titanium, aluminum, chromium, platinum, gold, silver, and copper. For another example, the auxiliary electrode 910 has a stack structure of titanium / aluminum / titanium, or the auxiliary electrode 910 has a stack structure of chromium / platinum / gold. The auxiliary electrode 910 is connected in parallel with the connecting electrode 320, which is conducive to reducing the voltage drop generated by the connecting electrode 320 when transmitting a voltage signal, thereby improving the display uniformity of the display substrate.

[0127] According to some exemplary embodiments, referring to FIG. 2B, the partition unit 500 is located in the cover layer 600, that is, the partition unit 500 and the cover unit 610 are formed by the same thin film deposition process and patterning process, which can simplify the preparation process of the display substrate. According to some exemplary embodiments, referring to FIGS. 3A and 3B, two adjacent first conductive sub-units 411 have a partition unit 500 therebetween, the partition unit 500 is connected in an integral structure with one adjacent cover unit 610 and is spaced apart from the other adjacent cover unit 610, and the two adjacent first conductive sub-units 411 are disconnected at the partition unit 500. In this way, the distance between the adjacent light-emitting units 300G can be narrowed, and the resolution of the display substrate can be further improved.

[0128] The “integral structure” in the embodiments of the present disclosure refers to structures connected to each other formed by the same deposition process and patterned by the same patterning process, and the materials thereof can be the same or different.

[0129] According to some exemplary embodiments, referring to FIGS. 3A and 3B, in two adjacent light-emitting devices 310 that are electrically connected, a first partition unit 510 is arranged between the two light-emitting devices 310, the first partition unit 510 is located on the epitaxial unit 3111 of the first electrode 311 of one light-emitting device 310 and is connected in an integral structure with the cover unit 610 covering the light-emitting device 310, the epitaxial unit 3111 protrudes toward the other light-emitting device 310 compared to the first partition unit 510, and the portion of the epitaxial unit 3111 protruding compared to the first partition unit 510 is electrically connected with the second electrode 313 of the other light-emitting device 310 through the first conductive sub-unit 411. The two first conductive sub-units 411 electrically connected with the two light-emitting devices 310, respectively, are disconnected at the first partition unit 510.

[0130] According to some exemplary embodiments, referring to FIGS. 3A and 3B, in the two adjacent light emitting units 300G, at least one light emitting device 310 of one light emitting unit 300G is adjacent to at least one light emitting device 310 of the other light emitting unit 300G, and a second partition 520 is arranged adjacent to and between the two light emitting devices 310 of the two light emitting units 300G, the second partition 520 is connected to the cover 610 covering one of the light emitting devices 310 as an integral structure, and is arranged apart from the cover 610 covering the other light emitting device 310, and the two first conductive sub-units 411 electrically connected to the two light emitting devices 310 are disconnected at the second partition 520. According to some exemplary embodiments, referring to FIGS. 2A and 2B, the two first conductive sub-units 411 are arranged apart from each other by two partitions 500, and the two first conductive sub-units 411 are disconnected at the spaced positions of the two partitions 500, wherein one of the partitions 500 is connected to the adjacent cover 610 as an integral structure, and the other partition 500 is arranged apart from the adjacent cover 610. The arrangement of the two partitions 500 between the two first conductive sub-units 411 can further improve the partitioning effect.

[0131] FIG. 4 schematically shows a cross-sectional view of a display substrate taken along the line NN’ in FIG. 1, according to some embodiments of the present disclosure.

[0132] According to some exemplary embodiments, referring to FIG. 4, in the two adjacent light emitting units 300G, the connection electrode 320 of one light emitting unit 300G is adjacent to at least one light emitting device 310 of the other light emitting unit 300G, and a second partition 520 is arranged adjacent to and between the connection electrode 320 and the light emitting device 310 of the two light emitting units 300G, the second partition 520 can be connected to the cover 610 covering the light emitting device 310 as an integral structure, and the first conductive sub-unit 411 electrically connected to the connection electrode 320 is disconnected from the first conductive sub-unit 411 electrically connected to the light emitting device 310 at the side wall of the second partition 520.

[0133] According to some exemplary embodiments, referring to FIGS. 2A and 2B, in two adjacent and electrically connected light emitting devices 310, two first partitioning portions 510 are disposed between the two light emitting devices 310, the two first partitioning portions 510 are located on the epitaxial portion 3111 of the first electrode 311 of one light emitting device 310, and one of the partitioning portions 500 is connected to the covering portion 610 covering the light emitting device 310 as an integral structure, and the other partitioning portion 500 is spaced apart from the covering portion 610 covering the other light emitting device 310. The epitaxial portion 3111 protrudes towards the other light emitting device 310 compared to the two first partitioning portions 510, and the portion of the epitaxial portion 3111 protruding compared to the two first partitioning portions 510 is electrically connected to the second electrode 313 of the other light emitting device 310 through the first conductive sub-portion 411. The two first conductive sub-portions 411 electrically connected to the two light emitting devices 310 are disconnected at the spaced positions of the two first partitioning portions 510.

[0134] According to some exemplary embodiments, referring to FIGS. 2A and 2B, the two adjacent first conductive sub-portions 411 have two partitioning portions 500 disposed therebetween, and the two adjacent first conductive sub-portions 411 are disconnected at the spaced positions of the two partitioning portions 500.

[0135] According to some exemplary embodiments, referring to FIGS. 2A and 2B, in two adjacent light emitting units 300G, the connecting electrode 320 of one light emitting unit 300G is adjacent to at least one light emitting device 310 of the other light emitting unit 300G, and two second partitioning portions 520 are disposed between the connecting electrode 320 and the light emitting device 310 of the two light emitting units 300G, respectively, one second partitioning portion 520 is connected to the covering portion 610 covering the connecting electrode 320 as an integral structure, and the other second partitioning portion 520 is connected to the covering portion 610 covering the light emitting device 310 as an integral structure, and the first conductive sub-portion 411 electrically connected to the connecting electrode 320 and the first conductive sub-portion 411 electrically connected to the light emitting device 310 are disconnected at the spaced positions of the two second partitioning portions 520.

[0136] According to some exemplary embodiments, referring to FIG. 2B, the conductive portion 410 further includes a second conductive sub-portion 412, the second conductive sub-portion 412 is located between the two spaced partitioning portions 500, and the second conductive sub-portion 412 is disconnected from the two adjacent first conductive sub-portions 411 at the two partitioning portions 500, respectively. Since the conductive layer 400 is formed only by a thin film deposition process, a portion of the film layer will be deposited between the two spaced partitioning portions 500, i.e., the second conductive sub-portion 412 is formed. However, due to the partitioning effect of the partitioning portion 500, the second conductive sub-portion 412 is spaced apart from the adjacent first conductive sub-portion 411, and even if the patterning process is not performed to remove the second conductive sub-portion 412, it will not cause display defects.

[0137] FIG. 5A schematically shows an enlarged view of the area A1 in FIG. 1, where FIG. 5A schematically shows only the first electrode of the light emitting device, the second electrode of the light emitting device, the conductive layer, the first opening of the cover layer, and the partition portion.

[0138] FIG. 5B schematically shows a cross-sectional view taken along DD' in FIG. 5A.

[0139] According to some example embodiments, with reference to FIGS. 5A and 5B in combination, there is a partition portion 500 between two adjacent first conductive sub-portions 411, and the partition portion 500 is spaced apart from two adjacent cover portions 610. The two adjacent first conductive sub-portions 411 are located on two sides of the partition portion 500.

[0140] According to some example embodiments, with reference to FIGS. 5A and 5B in combination, in two adjacent and electrically connected light emitting devices 310, there is a first partition portion 510 between the two light emitting devices 310, and the first partition portion 510 is spaced apart from two cover portions 610 covering the two light emitting devices 310. The first partition portion 510 is located on an epitaxial portion 3111 of the first electrode 311 of one light emitting device 310, and the epitaxial portion 3111 protrudes toward the other light emitting device 310 compared to the first partition portion 510. The portion of the epitaxial portion 3111 protruding compared to the first partition portion 510 is electrically connected to the second electrode 313 of the other light emitting device 310 through a first conductive sub-portion 411. The two first conductive sub-portions 411 electrically connected to the two light emitting devices 310, respectively, are disconnected at the first partition portion 510, and the two first conductive sub-portions 411 are located on two sides of the first partition portion 510, respectively.

[0141] According to some example embodiments, with reference to FIGS. 5A and 5B in combination, in two adjacent light emitting units 300G, at least one light emitting device 310 of one light emitting unit 300G is adjacent to at least one light emitting device 310 of the other light emitting unit 300G, and there is a second partition portion 520 between the two light emitting devices 310 of the two light emitting units 300G, and the second partition portion 520 is spaced apart from two cover portions 610 covering the two light emitting devices 310. The two first conductive sub-portions 411 electrically connected to the two light emitting devices 310, respectively, are disconnected at the second partition portion 520, and the two first conductive sub-portions 411 are located on two sides of the second partition portion 520, respectively.

[0142] According to some exemplary embodiments, referring to FIG. 5B, the conductive layer 410 further comprises a third conductive sub-layer 413 located on the side of the partition layer 500 away from the substrate 100, the third conductive sub-layer 413 is disconnected from the two adjacent first conductive sub-layers 411 at the sidewall of the partition layer 500. Since the conductive layer 400 is formed by a thin film deposition process, a portion of the film layer is deposited on the side of the partition layer 500 away from the substrate 100, i.e., the third conductive sub-layer 413 is formed. However, due to the partitioning effect of the partition layer 500, the third conductive sub-layer 413 is spaced apart from the adjacent first conductive sub-layers 411, and even if the patterning process is not performed to remove the third conductive sub-layer 413, it will not cause display defects.

[0143] FIG. 6A schematically shows an enlarged view of the area A1 in FIG. 1, according to some embodiments of the present disclosure, wherein FIG. 6A schematically shows only the first electrode of the light emitting device, the second electrode of the light emitting device, the conductive layer, the first opening of the cover layer, and the partition layer.

[0144] FIG. 6B schematically shows a cross-sectional view taken along EE’ in FIG. 6A.

[0145] According to some exemplary embodiments, referring to FIGS. 6A and 6B, the two first conductive sub-layers 411 are disconnected at the spaced positions of the two partition layers 500, one partition layer 500 is spaced apart from the adjacent cover layer 610, and the other partition layer 500 is spaced apart from the adjacent cover layer 610.

[0146] According to some exemplary embodiments, referring to FIGS. 6A and 6B, in the two adjacent and electrically connected light emitting devices 310, the two first partition layers 510 are spaced apart between the two light emitting devices 310, the two first partition layers 510 are located on the epitaxial layer 3111 of the first electrode 311 of one light emitting device 310, and one partition layer 500 closer to the light emitting device 310 is spaced apart from the cover layer 610 covering the light emitting device 310, and the other partition layer 500 is spaced apart from the cover layer 610 covering the other light emitting device 310. The epitaxial layer 3111 protrudes towards the other light emitting device 310 compared to the two first partition layers 510, and the portion of the epitaxial layer 3111 protruding compared to the two first partition layers 510 is electrically connected to the second electrode 313 of the other light emitting device 310 through the first conductive sub-layer 411. The two first conductive sub-layers 411 electrically connected to the two light emitting devices 310 are disconnected at the spaced positions of the two first partition layers 510. For example, the two first conductive sub-layers 411 are located on both sides of the two first partition layers 510.

[0147] According to some exemplary embodiments, referring to FIGS. 6A and 6B in combination, in two adjacent light emitting units 300G, at least one light emitting device 310 of one light emitting unit 300G is adjacent to at least one light emitting device 310 of another light emitting unit 300G, two second partition portions 520 are arranged adjacent to each other and between the two light emitting devices 310 of the two light emitting units 300G respectively, one second partition portion 520 is arranged apart from the cover portion 610 covering one of the light emitting devices 310, and the other second partition portion 520 is arranged apart from the cover portion 610 covering the other light emitting device 310, and the two first conductive sub-portions 411 electrically connected to the two light emitting devices 310 are disconnected at the apart positions of the second partition portions 520. For example, the two first conductive sub-portions 411 are located on two sides of the two second partition portions 520 respectively.

[0148] According to some exemplary embodiments, referring to FIG. 2B, the cover layer 600 includes a passivation layer PVX, the passivation layer PVX includes a first passivation sub-layer PVX1 located on a side of the plurality of light emitting devices 310 away from the substrate 100, and a second passivation sub-layer PVX2 located on a side of the first passivation sub-layer PVX1 away from the substrate 100, and the partition portion 500 includes a first partition sub-portion 500a and a second partition sub-portion 500b located on a side of the first partition sub-portion 500a away from the substrate 100, the first partition sub-portion 500a is located on the first passivation sub-layer PVX1, and the second partition sub-portion 500b is located on the second passivation sub-layer PVX2, and the orthographic projection of the first partition sub-portion 500a on the substrate 100 is located within the orthographic projection of the second partition sub-portion 500b on the substrate 100.

[0149] According to some exemplary embodiments, the material of the first passivation sub-layer PVX1 can include silicon oxide, and the material of the second passivation sub-layer PVX2 can include aluminum oxide. In the etching process of forming the passivation layer PVX, the etching rate of the first passivation sub-layer PVX1 can be greater than that of the second passivation sub-layer PVX2 by adjusting the etching process parameters, so that the edge of the first partition sub-portion 500a is recessed compared to the second partition sub-portion 500b.

[0150] According to some exemplary embodiments, referring to FIG. 2B, in at least one partition portion 500, one side edge of the first partition sub-portion 500a is recessed compared to the second partition sub-portion 500b, and the other side edge of the first partition sub-portion 500a is substantially flush with the edge of the second partition sub-portion 500b.

[0151] According to some exemplary embodiments, referring to FIG. 2B, in the two adjacent first partition portions 510, in the first partition portion 510 connected to the cover portion 610 as an integral structure, the first partition sub-portion 500a is recessed inward compared to the second partition sub-portion 500b from the edge of the side of the first partition portion 510 away from the connected cover portion 610, and in the first partition portion 510 arranged apart from the cover portion 610, the first partition sub-portion 500a is recessed inward compared to the second partition sub-portion 500b from the edge of the side of the first partition portion 510 close to the other first partition portion 510. That is, a "U-shaped" groove is formed between the two adjacent first partition portions 510.

[0152] According to some exemplary embodiments, referring to FIG. 2B, in the two adjacent second partition portions 520, in any one of the second partition portions 520, the first partition sub-portion 500a is recessed inward compared to the second partition sub-portion 500b from the edge of the side of the first partition portion 510 close to the other first partition portion 510. That is, a "U-shaped" groove is formed between the two adjacent second partition portions 520.

[0153] According to some exemplary embodiments, referring to FIG. 5B, the cover layer 600 includes a passivation layer PVX and an organic protective layer OC located on the side of the passivation layer PVX away from the substrate 100, and the partition portion 500 is located on the organic protective layer OC. The passivation layer PVX and the organic protective layer OC have a first opening K1, the first opening K1 exposes at least a part of the second electrode 313 of the light emitting device 310, and the first conductive sub-portion 411 is electrically connected to the second electrode 313 of the light emitting device 310 through the first opening K1.

[0154] According to some exemplary embodiments, referring to FIG. 5B, the cross-sectional shape of the partition portion 500 along the direction perpendicular to the substrate 100 is an inverted trapezoid.

[0155] According to some exemplary embodiments, referring to FIG. 5B, in the two adjacent and electrically connected light emitting devices 310, the passivation layer PVX on one light emitting device 310 extends from the side surface of the light emitting functional portion 312 to the epitaxial portion 3111 of the first electrode 311, the passivation layer PVX covers a part of the epitaxial portion 3111, and the first partition portion 510 is located on the side of the passivation layer PVX away from the substrate 100. The part of the epitaxial portion 3111 not covered by the passivation layer PVX is electrically connected to the second electrode 313 of the other light emitting device 310 through the first conductive sub-portion 411.

[0156] FIG. 7 schematically shows a cross-sectional view of a display substrate taken along MM' in FIG. 1 according to some embodiments of the present disclosure.

[0157] According to some exemplary embodiments, referring to FIG. 7, the at least one light emitting unit 300G includes a first light emitting unit 301G, a second light emitting unit 302G, and a third light emitting unit 303G, and the light emitting device 310 is configured to emit light of a third color toward the side of the second electrode 313. The display substrate further includes a color conversion layer 700 located on the side of the conductive layer 400 away from the substrate 100, and the color conversion layer 700 includes a first color conversion part 710, a second color conversion part 720, and a light transmission part 730. The first color conversion part 710 has a footprint on the substrate 100 that at least partially overlaps with a footprint of the first light emitting unit 301G on the substrate 100, and the first color conversion part 710 is configured to convert light of the third color into light of a first color. The second color conversion part 720 has a footprint on the substrate 100 that at least partially overlaps with a footprint of the second light emitting unit 302G on the substrate 100, and the second color conversion part 720 is configured to convert light of the third color into light of a second color. The light transmission part 730 has a footprint on the substrate 100 that at least partially overlaps with a footprint of the third light emitting unit 303G on the substrate 100, and the light transmission part 730 is configured to allow light of the third color to transmit.

[0158] For example, the first color is red, the second color is green, and the third color is blue. That is, the light emitting device 310 in the first light emitting unit 301G is part of a red sub-pixel, the light emitting device 310 in the second light emitting unit 302G is part of a green sub-pixel, and the light emitting device 310 in the third light emitting unit 303G is part of a blue sub-pixel, thereby realizing color display.

[0159] For example, the first color conversion part 710 includes a quantum dot material that emits red light under blue light irradiation, and the second color conversion part 720 includes a quantum dot material that emits green light under blue light irradiation.

[0160] According to some exemplary embodiments, the light emitting device is configured to emit light of the third color toward the side of the first electrode, and the color conversion layer is located on the side of the substrate away from the light emitting device layer.

[0161] According to some exemplary embodiments, referring to FIG. 7, the display substrate further includes a planarization layer PLN located between the conductive layer 400 and the color conversion layer 700.

[0162] For example, the material of the planarization layer PLN includes an organic glue material resistant to high temperature of 300°C or above, and the thickness of the planarization layer PLN is 1-5um.

[0163] According to some exemplary embodiments, referring to FIG. 7, the display substrate further comprises a color filter layer CF located on the side of the color conversion layer 700 away from the substrate 100, the color filter layer CF comprising a first color filter part CF1, a second color filter part CF2 and a third color filter part CF3. The first color filter part CF1 is located on the side of the first color conversion part 710 away from the substrate 100, the second color filter part CF2 is located on the side of the second color conversion part 720 away from the substrate 100, and the third color filter part CF3 is located on the side of the light transmission part 730 away from the substrate 100.

[0164] According to some exemplary embodiments, referring to FIG. 7, the display substrate further comprises a black matrix layer BM, the black matrix layer BM filling the interval regions in the color conversion layer 700 and the color filter layer CF.

[0165] According to some exemplary embodiments, referring to FIG. 7, the display substrate further comprises a protective cover plate CG located on the side of the color filter layer CF away from the substrate 100.

[0166] FIG. 8A schematically shows a cross-sectional view of the display substrate taken along MM' in FIG. 1 according to some embodiments of the present disclosure.

[0167] According to some exemplary embodiments, referring to FIG. 8A, the cover layer 600 comprises a reflection layer REF, the reflection layer REF comprising a plurality of reflection parts REFa, the plurality of reflection parts REFa covering at least part of the sidewalls of the plurality of light emitting devices 310, the light emitting devices 310 emitting third color light, the reflection parts REFa reflecting the third color light and transmitting the first color light and the second color light. By arranging the reflection parts REFa on the sidewalls of the light emitting devices 310, the light emitting efficiency of the light emitting devices 310 can be effectively improved, and thus the display brightness of the display substrate can be improved and the display power consumption of the display substrate can be reduced.

[0168] According to some exemplary embodiments, the reflection layer REF has a structure of a distributed Bragg reflector (DBR). The DBR structure is a periodic structure formed by alternately arranging two materials with different refractive indices, and the optical thickness of each layer of material arranged alternately is one quarter of the center reflection wavelength. By designing the DBR material and structure, selective reflection of light of a specific wavelength band can be achieved. Referring to FIG. 8A, the reflection layer REF comprises at least two first reflection sub-layers REF1 and at least two second reflection sub-layers REF2, the at least two first reflection sub-layers REF1 and the at least two second reflection sub-layers REF2 being arranged alternately in a direction away from the substrate 100, the refractive index of the first reflection sub-layer REF1 being smaller than the refractive index of the second reflection sub-layer REF2.

[0169] According to some exemplary embodiments, the material of the first reflective sub-layer REF1 includes at least one of silicon oxide, aluminum oxide and magnesium fluoride, and the material of the second reflective sub-layer REF2 includes at least one of niobium oxide, titanium dioxide, titanium trioxide and silicon nitride. For example, the material of the first reflective sub-layer REF1 includes silicon oxide, and the material of the second reflective sub-layer REF2 includes niobium oxide. Of course, other low refractive index materials and high refractive index materials can be selected according to the wavelength band of the reflected light, which is not limited in the embodiments of the present disclosure.

[0170] According to some exemplary embodiments, referring to FIG. 8A, the cover layer 600 further includes a passivation layer PVX between the reflective layer REF and the light emitting device 310, the passivation layer PVX and the reflective layer REF have a first opening K1 exposing at least a portion of the second electrode 313 of the light emitting device 310, and the first conductive sub-section 411 is electrically connected to the second electrode 313 of the light emitting device 310 through the first opening K1.

[0171] According to some exemplary embodiments, the first conductive sub-section 411 covers at least a portion of the sidewall of the light emitting device 310, the first conductive sub-section 411 includes a metal material with high reflectivity, and the first conductive sub-section 411 and the reflective section REFa form a composite reflective structure with high reflectivity, which can further improve the light extraction efficiency of the light emitting device 310. For example, the first conductive sub-section 411 has a stacked film layer structure of Ti / Al / Ti with a thickness of 50 / 1000 / 100 angstroms or a stacked film layer structure of TiN / Al / Ti with a thickness of 50 / 1000 / 100 angstroms.

[0172] According to some exemplary embodiments, referring to FIG. 8A, the partition section 500 is located in the reflective layer REF, and the partition section 500 includes at least two first partition sub-sections 500a and at least two second partition sub-sections 500b, the at least two first partition sub-sections 500a are respectively located in the at least two first reflective sub-layers REF1, and the at least two second partition sub-sections 500b are respectively located in the two second reflective sub-layers REF2, in the adjacent first partition sub-section 500a and second partition sub-section 500b, the orthographic projection of the first partition sub-section 500a on the substrate 100 is located in the orthographic projection of the second partition sub-section 500b on the substrate 100, or the orthographic projection of the second partition sub-section 500b on the substrate 100 is located in the orthographic projection of the first partition sub-section 500a on the substrate 100.

[0173] For example, the material of the first reflective sub-layer REF1 includes silicon oxide, and the material of the second reflective sub-layer REF2 includes niobium oxide. In the etching process for forming the reflective layer REF, the etching rate of the first reflective sub-layer REF1 can be adjusted to be less than that of the second reflective sub-layer REF2, so that the edge of the second partition sub-portion 500b is inwardly recessed compared with the first partition sub-portion 500a, i.e., the orthographic projection of the second partition sub-portion 500b on the substrate 100 is located within the orthographic projection of the first partition sub-portion 500a on the substrate 100.

[0174] According to some exemplary embodiments, referring to FIG. 8A, in the two adjacent and electrically connected light emitting devices 310, there are two first partition portions 510 between the two first conductive sub-portions 411 electrically connected to the two light emitting devices 310 respectively, and the two first partition portions 510 are both located in the reflective layer REF. The maximum distance between the two first partition portions 510 is D1, and the maximum aperture of the first opening K1 in the reflective layer REF is D2. The inventors have found that when the size difference between D1 and D2 is large, for example, D1≤1 / 2*D2, the sidewall of the first partition portion 510 formed by the etching process has an undercut structure, and the reflective portion REFa at the first opening K1 has a smooth sidewall structure, by adjusting the etching process parameters.

[0175] It is additionally explained that, in the first partition portion 510, when the edge of the second partition sub-portion 500b is inwardly recessed compared with the first partition sub-portion 500a, the maximum distance D1 between the two first partition portions 510 is the distance between the two second partition sub-portions 500b located in the same layer of the second reflective sub-layer REF2; when the edge of the first partition sub-portion 500a is inwardly recessed compared with the second partition sub-portion 500b, the maximum distance D1 between the two first partition portions 510 is the distance between the two first partition sub-portions 500a located in the same layer of the first reflective sub-layer REF1. The cross-sectional shape of the first opening K1 in the reflective layer REF is approximately inverted trapezoidal, and the maximum aperture D2 of the first opening K1 in the reflective layer REF is the opening aperture on the side of the first opening K1 away from the substrate 100.

[0176] FIG. 8B shows a cross-sectional view of the etched cross section of the alternating silicon oxide film and niobium oxide film at the first opening, characterized by a scanning electron microscope. FIG. 8C shows a cross-sectional view of the etched cross section of the alternating silicon oxide film and niobium oxide film at the second opening, characterized by a scanning electron microscope.

[0177] In order to achieve the formation of the partition portion with an undercut structure and the opening without an undercut structure in one etching process, the inventors have conducted the following experimental verification:

[0178] Depositing silicon oxide thin film and niobium oxide thin film alternately on a glass substrate, and forming a photoresist layer on the film layer by a photolithography process, the photoresist layer has a first opening with an aperture of 0.4 μm and a second opening with an aperture of 10 μm, and finally performing dry etching process on the lower film layer under the shielding of the photoresist layer.

[0179] Performing structural characterization on the etched substrate under a scanning electron microscope, the cross-sectional morphology of the film layer after etching at the first opening is shown in FIG. 8B, it can be seen that the edge of the niobium oxide thin film is obviously retracted compared with the edge of the silicon oxide thin film, i.e. undercut structure is formed; the cross-sectional morphology of the film layer after etching at the second opening is shown in FIG. 8C, it can be seen that the edge of the niobium oxide thin film is smoothly connected with the silicon oxide thin film, and no undercut structure is formed.

[0180] According to some exemplary embodiments, referring to FIG. 8A, in the two adjacent light emitting units 300G, at least one light emitting device 310 of one light emitting unit 300G is adjacent to at least one light emitting device 310 of another light emitting unit 300G, two second partition portions 520 are arranged adjacent to each other and respectively between the two light emitting devices 310 of the two light emitting units 300G, and the maximum distance between the two second partition portions 520 is substantially equal to the maximum distance between the two first partition portions 510.

[0181] According to some exemplary embodiments, referring to FIG. 8A, the display substrate further includes a planarization layer PLN located on the side of the conductive layer 400 away from the reflective layer REF, the planarization layer PLN has a second opening K2 exposing at least a portion of the first conductive sub-portion 411 electrically connected only to the second electrode 313 of the light emitting device 310. The connecting electrode 320 is located on the side of the planarization layer PLN away from the substrate 100, and the connecting electrode 320 is electrically connected to the first conductive sub-portion 411 through the second opening K2.

[0182] According to some exemplary embodiments, the material of the connecting electrode 320 includes a metal material with relatively low resistivity, for example, the material of the connecting electrode 320 includes at least one of molybdenum, copper and aluminum.

[0183] According to some exemplary embodiments, referring to FIG. 8A, the display substrate further includes an encapsulation layer EPL located on the side of the connecting electrode 320 away from the substrate 100. The encapsulation layer EPL can include at least one inorganic film layer, and the material of the inorganic film layer includes at least one of SiO, SiN and SiCN. For example, the encapsulation layer EPL has a stacked film layer structure of SiO / SiN / SiCN.

[0184] According to some exemplary embodiments, referring to FIG. 8A, the at least one light emitting unit 300G includes a first light emitting unit 301G, a second light emitting unit 302G, and a third light emitting unit 303G, and the light emitting device 310 is configured to emit light of a third color toward the side of the first electrode 311. The display substrate further includes a color conversion layer 700 located on the side of the substrate 100 away from the light emitting device layer 300, and the color conversion layer 700 includes a first color conversion part 710, a second color conversion part 720, and a light transmission part 730. The first color conversion part 710 has a footprint on the substrate 100 that at least partially overlaps with a footprint of the first light emitting unit 301G on the substrate 100, and the first color conversion part 710 is configured to convert light of the third color into light of a first color. The second color conversion part 720 has a footprint on the substrate 100 that at least partially overlaps with a footprint of the second light emitting unit 302G on the substrate 100, and the second color conversion part 720 is configured to convert light of the third color into light of a second color. The light transmission part 730 has a footprint on the substrate 100 that at least partially overlaps with a footprint of the third light emitting unit 303G on the substrate 100, and the light transmission part 730 is configured to allow light of the third color to be transmitted.

[0185] For example, the first color is red, the second color is green, and the third color is blue. That is, the light emitting device 310 in the first light emitting unit 301G is part of a red sub-pixel, the light emitting device 310 in the second light emitting unit 302G is part of a green sub-pixel, and the light emitting device 310 in the third light emitting unit 303G is part of a blue sub-pixel, thereby realizing color display.

[0186] According to some exemplary embodiments, referring to FIG. 8A, the display substrate further includes a black matrix layer BM that fills the spacing regions in the color conversion layer 700.

[0187] According to some exemplary embodiments, referring to FIG. 8, the display substrate further includes a semi-transparent semi-reflective layer 800 located on the side of the color conversion layer 700 away from the substrate 100, the semi-transparent semi-reflective layer 800 transmits light of the first color and light of the second color and reflects light of the third color, and the semi-transparent semi-reflective layer 800 has a footprint on the substrate 100 that at least partially overlaps with a footprint of the first color conversion part 710 on the substrate 100. The semi-transparent semi-reflective layer 800 reflects the light of the third color that may exist in the light emitted by the first light emitting unit 301G, and only allows the light of the first color converted by the first color conversion part 710 to be emitted, thereby improving the color purity of the light emitted by the first light emitting unit 301G.

[0188] According to some exemplary embodiments, referring to FIG. 8, the orthogonal projection of the semi-transmission semi-reflection layer 800 on the substrate 100 at least partially overlaps with the orthogonal projection of the second color conversion unit 720 on the substrate 100, the semi-transmission semi-reflection layer 800 can reflect the third color light that may exist in the light emitted by the second light emitting unit 302G, and only allow the second color light converted by the second color conversion unit 720 to be emitted, thereby improving the color purity of the light emitted by the second light emitting unit 302G.

[0189] According to some exemplary embodiments, referring to FIG. 8, the orthogonal projection of the semi-transmission semi-reflection layer 800 on the substrate 100 covers the orthogonal projection of the first color conversion unit 710 on the substrate 100, the orthogonal projection of the semi-transmission semi-reflection layer 800 on the substrate 100 covers the orthogonal projection of the second color conversion unit 720 on the substrate 100, and the orthogonal projection of the semi-transmission semi-reflection layer 800 on the substrate 100 does not overlap with the orthogonal projection of the light transmission unit 730 on the substrate 100.

[0190] According to some exemplary embodiments, the semi-transmission semi-reflection layer 800 can have a structure of a distributed Bragg reflector, that is, the structure of the semi-transmission semi-reflection layer 800 is similar to the structure of the reflection layer REF, both of which are periodic structures formed by alternately arranging materials with two different refractive indexes. Through the design of the material and structure of the semi-transmission semi-reflection layer 800, the selective reflection of the third color light can be realized.

[0191] According to some exemplary embodiments, referring to FIG. 8, the surface of the semi-transmission semi-reflection layer 800 away from the substrate 100 is substantially flush with the surface of the light transmission unit 730 away from the substrate 100.

[0192] According to some exemplary embodiments, referring to FIG. 8, the side of the semi-transmission semi-reflection layer 800 away from the substrate 100 is further provided with a buffer layer BUF and a protective cover plate CG.

[0193] FIG. 9 schematically shows a cross-sectional view of a display substrate taken along MM' in FIG. 1 according to some embodiments of the present disclosure.

[0194] According to some exemplary embodiments, referring to FIG. 9, the side of the substrate 100 away from the light emitting device layer 300 has a plurality of grooves G, and the plurality of grooves G includes a first groove G1, and at least a portion of the first color conversion unit 710 is embedded in the first groove G1. In this way, the distance between the light emitting device 310 located in the first light emitting unit 301G and the first color conversion unit 710 can be reduced, and the light color crosstalk problem between the light emitting device 310 located in the first light emitting unit 301G and the light emitting device 310 located in the adjacent second light emitting unit 302G or third light emitting unit 303G can be improved.

[0195] According to some exemplary embodiments, referring to FIG. 9, the depth of the first groove G1 along the direction perpendicular to the substrate substrate 100 is substantially equal to the thickness of the first color conversion part 710 along the direction perpendicular to the substrate substrate 100, and the surface of the first color conversion part 710 is substantially flush with the surface of the substrate substrate 100.

[0196] According to some exemplary embodiments, referring to FIG. 9, the plurality of grooves G includes a second groove G2, and at least a portion of the second color conversion part 720 is embedded in the second groove G2. In this way, the distance between the light emitting device 310 located in the second light emitting unit 302G and the second color conversion part 720 can be reduced, and the light color crosstalk problem between the light emitting device 310 located in the second light emitting unit 302G and the light emitting device 310 located in the adjacent first light emitting unit 301G or third light emitting unit 303G can be improved.

[0197] According to some exemplary embodiments, referring to FIG. 9, the depth of the second groove G2 along the direction perpendicular to the substrate substrate 100 is substantially equal to the thickness of the second color conversion part 720 along the direction perpendicular to the substrate substrate 100, and the surface of the second color conversion part 720 is substantially flush with the surface of the substrate substrate 100.

[0198] According to some exemplary embodiments, referring to FIG. 9, the plurality of grooves G includes a third groove G3, and at least a portion of the light-transmitting part 730 is embedded in the third groove G3.

[0199] According to some exemplary embodiments, referring to FIG. 9, the metal reflecting part 920 is arranged in at least a portion of the groove G, the metal reflecting part 920 is located between the substrate substrate 100 and the color conversion layer 700, the metal reflecting part 920 covers at least a portion of the sidewall of the groove G, and the metal reflecting part 920 can reflect the light emitted to the area where the adjacent light emitting unit 300G is located back to the collection, thereby further improving the light color crosstalk problem between the adjacent light emitting units 300G.

[0200] According to some exemplary embodiments, referring to FIG. 9, the metal reflecting part 920 extends from the sidewall of the groove G to the bottom surface of the groove G, and the orthographic projection of the metal reflecting part 920 on the substrate substrate 100 does not overlap with the orthographic projection of the light emitting functional part 312 on the substrate substrate 100.

[0201] According to some exemplary embodiments, the metal reflecting part 920 is arranged in the first groove G1, the second groove G2, and the third groove G3.

[0202] According to some exemplary embodiments, the material of the metal reflecting part 920 includes silver.

[0203] According to some exemplary embodiments, referring to FIG. 9, the display substrate further comprises a semi-transmissive and semi-reflective layer 800 on the side of the color conversion layer 700 away from the substrate 100, the semi-transmissive and semi-reflective layer 800 transmits the first color light and the second color light and reflects the third color light, the orthogonal projection of the semi-transmissive and semi-reflective layer 800 on the substrate 100 at least partially overlaps with the orthogonal projection of the first color conversion part 710 on the substrate 100, the semi-transmissive and semi-reflective layer 800 will reflect the third color light possibly existing in the light emitted by the first light emitting unit 301G, and only allow the first color light converted by the first color conversion part 710 to be emitted, thereby improving the color purity of the light emitted by the first light emitting unit 301G.

[0204] According to some exemplary embodiments, referring to FIG. 9, the orthogonal projection of the semi-transmissive and semi-reflective layer 800 on the substrate 100 at least partially overlaps with the orthogonal projection of the second color conversion part 720 on the substrate 100, the semi-transmissive and semi-reflective layer 800 will reflect the third color light possibly existing in the light emitted by the second light emitting unit 302G, and only allow the second color light converted by the second color conversion part 720 to be emitted, thereby improving the color purity of the light emitted by the second light emitting unit 302G.

[0205] According to some exemplary embodiments, referring to FIG. 9, the orthogonal projection of the semi-transmissive and semi-reflective layer 800 on the substrate 100 covers the orthogonal projection of the first color conversion part 710 on the substrate 100, the orthogonal projection of the semi-transmissive and semi-reflective layer 800 on the substrate 100 covers the orthogonal projection of the second color conversion part 720 on the substrate 100, and the orthogonal projection of the semi-transmissive and semi-reflective layer 800 on the substrate 100 does not overlap with the orthogonal projection of the light-transmissive part 730 on the substrate 100.

[0206] According to some exemplary embodiments, the semi-transmissive and semi-reflective layer 800 can have a structure of a distributed Bragg reflector, that is, the structure of the semi-transmissive and semi-reflective layer 800 is similar to the structure of the reflective layer REF, both of which are periodic structures formed by alternately arranging materials with two different refractive indexes, and through the design of the material and structure of the semi-transmissive and semi-reflective layer 800, selective reflection of the third color light can be achieved.

[0207] According to some exemplary embodiments, referring to FIG. 9, the surface of the semi-transmissive and semi-reflective layer 800 away from the substrate 100 is substantially flush with the surface of the light-transmissive part 730 away from the substrate 100.

[0208] According to some exemplary embodiments, referring to FIG. 9, the side of the semi-transmissive and semi-reflective layer 800 away from the substrate 100 is further provided with a buffer layer BUF and a protective cover plate CG.

[0209] FIG. 10A schematically illustrates an enlarged view of the display substrate in region A1 in FIG. 1, according to some embodiments of the present disclosure, wherein FIG. 10A schematically illustrates only the first electrode of the light emitting device, the second electrode of the light emitting device, the first opening of the cover layer, the first conductive sub-portion, and the first partition portion.

[0210] FIG. 10B schematically illustrates an enlarged view of the display substrate in region A2 in FIG. 1, according to some embodiments of the present disclosure, wherein FIG. 10B schematically illustrates only the first electrode of the light emitting device, the second electrode of the light emitting device, the first opening of the cover layer, the first conductive sub-portion, and the first partition portion.

[0211] FIG. 10C schematically illustrates an enlarged view of the display substrate in region A3 in FIG. 1, according to some embodiments of the present disclosure, wherein FIG. 10C schematically illustrates only the first electrode of the light emitting device, the second electrode of the light emitting device, the first opening of the cover layer, the first conductive sub-portion, and the first partition portion.

[0212] FIG. 10D schematically illustrates a cross-sectional view taken along FF’ in FIG. 10A.

[0213] According to some example embodiments, in the at least one light emitting unit 300G, the at least two light emitting devices 310 are arranged along the first direction X, and the first partition portion 510 is disposed extending along the second direction Y. With reference to FIGS. 10A and 10D, the light emitting unit 300G includes four light emitting devices 310 arranged along the first direction X and connected in series in sequence, and the first partition portion 510 is disposed extending along the second direction Y.

[0214] According to some example embodiments, in the at least one light emitting unit 300G, the at least two light emitting devices 310 are arranged along the second direction Y, and the first partition portion 510 is disposed extending along the first direction X. With reference to FIG. 10B, the light emitting unit 300G includes four light emitting devices 310 arranged along the second direction Y and connected in series in sequence, and the first partition portion 510 is disposed extending along the first direction X.

[0215] According to some exemplary embodiments, in the at least one light emitting unit 300G, the at least two light emitting devices 310 are arranged along the first direction X and the at least two light emitting devices 310 are arranged along the second direction Y; wherein between two light emitting devices 310 adjacent along the first direction X, the first partition portion 510 is arranged extending along the second direction Y; and between two light emitting devices 310 adjacent along the second direction Y, the first partition portion 510 is arranged extending along the first direction X. Referring to FIG. 10C, the light emitting unit 300G includes four light emitting devices 310, which are arranged in a manner of 2 rows x 2 columns, the first electrode 311 of the light emitting device 310 located at the first row and the first column is electrically connected to the second electrode 313 of the light emitting device 310 located at the first row and the second column through the first conductive sub-portion 411, the first electrode 311 of the light emitting device 310 located at the first row and the second column is electrically connected to the second electrode 313 of the light emitting device 310 located at the second row and the second column through the first conductive sub-portion 411, and the first electrode 311 of the light emitting device 310 located at the second row and the second column is electrically connected to the second electrode 313 of the light emitting device 310 located at the second row and the first column through the first conductive sub-portion 411, so as to realize the series connection of the four light emitting devices 310. Between the light emitting device 310 located at the first row and the first column and the light emitting device 310 located at the first row and the second column, the first partition portion 510 is arranged extending along the second direction Y. Between the light emitting device 310 located at the second row and the first column and the light emitting device 310 located at the second row and the second column, the first partition portion 510 is arranged extending along the second direction Y. Between the light emitting device 310 located at the first row and the second column and the light emitting device 310 located at the second row and the second column, the first partition portion 510 is arranged extending along the first direction X.

[0216] FIG. 11 schematically shows a flowchart of a preparation method of a display substrate according to an embodiment of the present disclosure.

[0217] According to some exemplary embodiments, the preparation method of the display substrate includes steps S10-S40.

[0218] In step S10, a driving circuit layer is formed on a substrate substrate.

[0219] In step S20, a light emitting device layer is formed on a side of the driving circuit layer away from the substrate substrate, the light emitting device layer including a plurality of light emitting devices arranged in an array along a first direction and a second direction, the light emitting device including a first electrode located on the driving circuit layer, a light emitting functional portion located on a side of the first electrode away from the substrate substrate, and a second electrode located on a side of the light emitting functional portion away from the substrate substrate, the light emitting device layer including at least one light emitting unit, the light emitting unit including at least two light emitting devices and one connecting electrode.

[0220] In step S30, a partition portion is formed on a side of the driving circuit layer away from the substrate substrate.

[0221] In step S40, a conductive layer is formed on the light emitting device layer and the partition portion away from the substrate substrate, the conductive layer including at least one conductive portion, a projection of the conductive portion on the substrate substrate at least partially overlaps a projection of the light emitting unit on the substrate substrate, the conductive portion includes at least two first conductive sub-portions spaced apart, at least one partition portion is between two adjacent first conductive sub-portions, in the light emitting unit, in two adjacent light emitting devices, the second electrode of one light emitting device is electrically connected to the first electrode of the other light emitting device through the first conductive sub-portion, and in the connecting electrode and the light emitting device adjacent to the connecting electrode, the second electrode of the light emitting device is electrically connected to the connecting electrode through the first conductive sub-portion.

[0222] FIGS. 12A-12I schematically show a process diagram of forming a display substrate according to some embodiments of the present disclosure.

[0223] Referring to FIG. 12A, a driving circuit layer 200 is formed on a substrate substrate 100, a first bonding layer BL1 is formed on a side of the driving circuit layer 200 away from the substrate substrate 100, and a driving backplane is obtained.

[0224] For example, the first bonding layer BL1 can be formed by a physical vapor deposition process, and the first bonding layer BL1 includes a stack film layer of titanium / aluminum / titanium / indium tin oxide.

[0225] Referring to FIG. 12B, a light emitting diode epitaxial wafer is provided, which includes an epitaxial substrate SUB, a first buffer layer BUF1 on the epitaxial substrate SUB, a second semiconductor layer SEL2 on a side of the first buffer layer BUF1 away from the epitaxial substrate SUB, a light emitting layer LUM on a side of the second semiconductor layer SEL2 away from the epitaxial substrate SUB, and a first semiconductor layer SEL1 on a side of the light emitting layer LUM away from the epitaxial substrate SUB. A second bonding layer BL2 is formed on a side of the first semiconductor layer SEL1 away from the epitaxial substrate SUB.

[0226] For example, the epitaxial substrate SUB can be a silicon-based substrate or a sapphire substrate, the material of the second semiconductor layer SEL2 includes N-type gallium nitride, the light emitting layer LUM includes a multi-quantum well, and the material of the second semiconductor layer SEL2 includes P-type gallium nitride.

[0227] For example, the second bonding layer BL2 is an indium tin oxide film layer, an indium zinc oxide film layer, or a stack film layer of tin / platinum / gold.

[0228] Referring to FIG. 12C, the first bonding layer BL1 on the driving backplane is bonded to the second bonding layer BL2 on the light emitting diode epitaxial wafer, and the first bonding layer BL1 and the second bonding layer BL2 are bonded as a bonding layer BL.

[0229] Referring to FIGS. 12C and 12D, the epitaxial substrate SUB and the first buffer layer BUF1 are removed, the second semiconductor layer SEL2 is thinned, a second electrode layer 313a is formed on the thinned second semiconductor layer SEL2 away from the substrate 100, and the second electrode layer 313a is annealed.

[0230] For example, the epitaxial substrate SUB is removed by a chemical-mechanical planarization (CMP) process and a wet etching process.

[0231] For example, the first buffer layer BUF1 is removed by a chemical-mechanical planarization process or a dry etching process, and the second semiconductor layer SEL2 is thinned.

[0232] For example, the thickness of the thinned second semiconductor layer SEL2 is 0.5-2 um.

[0233] For example, the second electrode layer 313a is an indium tin oxide film layer, and the thickness of the second electrode layer 313a is 0.1-0.3 um.

[0234] Referring to FIGS. 12D and 12E, the second electrode layer 313a, the second semiconductor layer SEL2, the light-emitting layer LUM, and the first semiconductor layer SEL1 are patterned to form a plurality of first semiconductor portions 3121, a plurality of light-emitting portions 3122 on the side of the plurality of first semiconductor portions 3121 away from the substrate 100, a plurality of second semiconductor portions 3123 on the side of the plurality of light-emitting portions 3122 away from the substrate 100, and a plurality of second electrodes 313 on the side of the plurality of second semiconductor portions 3123 away from the substrate 100. The first semiconductor portion 3121, the light-emitting portion 3122, and the second semiconductor portion 3123 connected in series form a light-emitting functional portion 312.

[0235] For example, the shape of the orthographic projection of the light-emitting functional portion 312 on the substrate 100 is circular, elliptical, or rectangular. The size of the orthographic projection of the light-emitting functional portion 312 on the substrate 100 in the first direction X or the second direction Y is 2-20 um. The distance between two adjacent light-emitting functional portions 312 is 2-20 um. The angle between the sidewall and the bottom surface of the light-emitting portion 3122 is 60-80°.

[0236] Referring to FIGS. 12E and 12F, the bonding layer BL is patterned to form a plurality of first electrodes 311 and a plurality of connection electrodes 320. The plurality of first electrodes 311 are located on the side of the plurality of first semiconductor portions 3121 close to the substrate 100, and the plurality of first electrodes 311, the plurality of light emitting portions 3122, and the plurality of second electrodes 313 constitute the plurality of light emitting devices 310. The plurality of light emitting devices 310 and the plurality of connection electrodes 320 constitute part of the plurality of light emitting units 300G, and the light emitting unit 300G includes at least two light emitting devices 310 and one connection electrode 320. In the two adjacent light emitting devices 310 in the light emitting unit 300G, the first electrode 311 of one light emitting device 310 has an extension portion 3111 extending to the outside of the edge of the light emitting functional portion 312, and the orthogonal projection of the extension portion 3111 on the substrate 100 does not overlap the orthogonal projection of the light emitting functional portion 312 of the light emitting device 310 on the substrate 100.

[0237] Referring to FIG. 12G, a passivation layer PVX is formed on the side of the plurality of light emitting devices 310 away from the substrate 100. The passivation layer PVX includes a plurality of passivation portions PVXa and a plurality of partition portions 500. Some of the passivation portions PVXa cover at least part of the surface of the light emitting device 310, and the passivation portion PVXa has a first opening K1 exposing at least part of the second electrode 313 of the light emitting device 310. Some of the passivation portions PVXa cover at least part of the surface of the light emitting device 310 and the adjacent connection electrode 320, and the passivation portion PVXa has a first opening K1 exposing at least part of the second electrode 313 of the light emitting device 310 and a third opening K3 exposing at least part of the connection electrode 320.

[0238] The plurality of partition portions 500 includes a plurality of first partition portions 510 and a plurality of second partition portions 520. For example, there are two first partition portions 510 between the two adjacent light emitting devices 310 in the light emitting unit 300G, and a "U-shaped" groove is formed between the two first partition portions 510. For example, there are two second partition portions 520 between the connection electrode 320 of one light emitting unit 300G and the adjacent light emitting device 310 in another light emitting unit 300G, and a "U-shaped" groove is formed between the two second partition portions 520.

[0239] In some embodiments, the step of forming the passivation layer PVX can specifically include the following:

[0240] A first passivation material layer is formed on the side of the plurality of light emitting devices 310 away from the substrate 100, and a second passivation material layer is formed on the side of the first passivation material layer away from the substrate 100.

[0241] For example, forming the first passivation material layer includes: first forming a silicon oxide layer with a thickness of 500 angstroms by an atomic layer deposition process, and then forming a silicon oxide layer with a thickness of 0.3-0.6 μm by a chemical vapor deposition process.

[0242] For example, forming the second passivation material layer includes: forming an aluminum oxide layer with a thickness of 50-200 nm or a silicon nitride layer with a thickness of 50-200 nm by a chemical vapor deposition process.

[0243] The first passivation material layer and the second passivation material layer are subjected to a patterning process and a dry etching process, thereby forming a passivation layer PVX, which includes a first passivation sub-layer PVX1 obtained by patterning the first passivation material layer and a second passivation sub-layer PVX2 obtained by patterning the second passivation material layer.

[0244] For example, the first passivation material layer and the second passivation material layer are subjected to two times of patterning process and dry etching process respectively. In the first time of patterning process and dry etching process, a first opening K1 and a third opening K3 are formed, and by adjusting the etching process parameters, the edge of the first passivation sub-layer PVX1 and the edge of the second passivation sub-layer PVX2 are smoothly connected at the first opening K1 and the third opening K3. In the second time of patterning process and dry etching process, by adjusting the etching process parameters, a "Chinese character Keng" shaped groove is formed between the two adjacent first partition portions 510 and a "Chinese character Keng" shaped groove is formed between the two adjacent second partition portions 520, i.e., at the "Chinese character Keng" shaped groove, the edge of the second passivation sub-layer PVX2 is protruded compared with the edge of the first passivation sub-layer PVX1.

[0245] For another example, the first passivation material layer and the second passivation material layer are subjected to only one time of patterning process and dry etching process, and by designing the size of the first opening K1, the size of the third opening K3, the interval between the two adjacent first partition portions 510 and the interval between the two adjacent second partition portions 520, and on this basis, the etching process parameters are adjusted, the passivation layer PVX with the above-mentioned topography can be formed in one etching process.

[0246] Referring to FIG. 12H, the conductive layer 400 is formed on the side of the substrate 100 away from the plurality of partitions 500, the conductive layer 400 is partitioned into a plurality of conductive portions 410 by the plurality of second partitions 520, the conductive portions 410 are partitioned into at least two first conductive sub-portions 411 by the at least one first partition 510, and the conductive layer 400 further includes a second conductive sub-portion 412 between two adjacent first partitions 510 and a second conductive sub-portion 412 between two adjacent second partitions 520. In one light emitting unit 300G, two adjacent light emitting devices 310 are connected in series by the first conductive sub-portions 411, i.e., the first electrode 311 of one light emitting device 310 is electrically connected to the second electrode 313 of another light emitting device 310 by the first conductive sub-portions 411, and the connecting electrode 320 is electrically connected to the second electrode 313 of the adjacent light emitting device 310 by the first conductive sub-portions 411.

[0247] For example, the conductive layer 400 is formed by a physical vapor deposition process, the material of the conductive layer 400 includes indium tin oxide, and the thickness of the conductive layer 400 is 0.1-0.2 μm.

[0248] Referring to FIG. 12I, the planarization layer PLN is formed on the side of the conductive layer 400 away from the substrate 100.

[0249] The protective cover plate CG is provided, the black matrix layer BM is formed on the protective cover plate CG, and the black matrix layer BM has a plurality of openings. The color filter layer CF is formed in the plurality of openings of the black matrix layer BM, and the color filter layer CF includes the first color filter portion CF1, the second color filter portion CF2, and the third color filter portion CF3. The color conversion layer 700 is formed on the side of the color filter layer CF away from the protective cover plate CG, and the color conversion layer 700 includes the first color conversion portion 710, the second color conversion portion 720, and the light-transmitting portion 730. The first color conversion portion 710 is located on the first color filter portion CF1, the second color conversion portion 720 is located on the second color filter portion CF2, and the light-transmitting portion 730 is located on the third color filter portion CF3. Thus, the color filter substrate is obtained.

[0250] The color filter substrate is combined with the substrate shown in FIG. 12H, and a packaging process is performed to obtain the display substrate.

[0251] FIGS. 13A-13K schematically show a process diagram of forming a display substrate according to some embodiments of the present disclosure.

[0252] Referring to FIG. 13A, the driving circuit layer 200 is formed on the substrate 100, and the first bonding layer BL1 is formed on the side of the driving circuit layer 200 away from the substrate 100. Thus, the driving backplane is obtained.

[0253] For example, the first bonding layer BL1 is an indium tin oxide film layer or an indium zinc oxide film layer.

[0254] Referring to FIG. 13B, a light emitting diode epitaxial wafer is provided, which includes an epitaxial substrate SUB, a first buffer layer BUF1 on the epitaxial substrate SUB, a second semiconductor layer SEL2 on the first buffer layer BUF1 away from the epitaxial substrate SUB, a light emitting layer LUM on the second semiconductor layer SEL2 away from the epitaxial substrate SUB, and a first semiconductor layer SEL1 on the light emitting layer LUM away from the epitaxial substrate SUB. A second bonding layer BL2 is formed on the first semiconductor layer SEL1 away from the epitaxial substrate SUB.

[0255] For example, the epitaxial substrate SUB can be a silicon-based substrate or a sapphire substrate, the material of the second semiconductor layer SEL2 includes N-type gallium nitride, the light emitting layer LUM includes a multi-quantum well, and the material of the second semiconductor layer SEL2 includes P-type gallium nitride.

[0256] For example, the second bonding layer BL2 is an indium tin oxide film layer or an indium zinc oxide film layer.

[0257] Referring to FIG. 13C, the first bonding layer BL1 on the driving backplane is bonded to the second bonding layer BL2 on the light emitting diode epitaxial wafer, and the first bonding layer BL1 and the second bonding layer BL2 are bonded to form a bonding layer BL.

[0258] Referring to FIG. 13C and FIG. 13D, the epitaxial substrate SUB and the first buffer layer BUF1 are removed, the second semiconductor layer SEL2 is uniformly thinned, a second electrode layer 313a is formed on the thinned second semiconductor layer SEL2 away from the substrate substrate 100, and finally the second electrode layer 313a is subjected to a heat annealing treatment.

[0259] For example, the second electrode layer 313a is an indium tin oxide film layer, and the thickness of the second electrode layer 313a is 0.1-0.3 um.

[0260] Referring to FIG. 13D and FIG. 13E, the second electrode layer 313a, the second semiconductor layer SEL2, the light emitting layer LUM, and the first semiconductor layer SEL1 are patterned to form a plurality of first semiconductor portions 3121, a plurality of light emitting portions 3122 on the plurality of first semiconductor portions 3121 away from the substrate substrate 100, a plurality of second semiconductor portions 3123 on the plurality of light emitting portions 3122 away from the substrate substrate 100, and a plurality of second electrodes 313 on the plurality of second semiconductor portions 3123 away from the substrate substrate 100. The first semiconductor portion 3121, the light emitting portion 3122, and the second semiconductor portion 3123 connected in series form a light emitting functional portion 312.

[0261] Referring to FIGS. 13E and 13F, the bonding layer BL is patterned to form a plurality of first electrodes 311 on the side of the plurality of first semiconductor portions 3121 close to the substrate 100, the plurality of first electrodes 311, the plurality of light emitting portions 3122, and the plurality of second electrodes 313 forming a plurality of light emitting devices 310. The plurality of light emitting devices 310 form part of a plurality of light emitting units 300G, and the light emitting unit 300G includes at least two light emitting devices 310. In the two adjacent light emitting devices 310 in the light emitting unit 300G, the first electrode 311 of one light emitting device 310 has an extension portion 3111 extending beyond the edge of the light emitting functional portion 312, and the orthogonal projection of the extension portion 3111 on the substrate 100 does not overlap the orthogonal projection of the light emitting functional portion 312 of the light emitting device 310 on the substrate 100.

[0262] Referring to FIG. 13G, a cover layer 600 is formed on the side of the plurality of light emitting devices 310 away from the substrate 100, and the cover layer 600 includes a passivation layer PVX on the side of the plurality of light emitting devices 310 away from the substrate 100 and a reflective layer REF on the side of the passivation layer PVX away from the substrate 100. The cover layer 600 includes a plurality of cover portions 610 on the passivation layer PVX and the reflective layer REF and a plurality of partition portions 500 on the reflective layer REF. The cover portion 610 covers at least part of the surface of the light emitting device 310, and the cover portion 610 has a first opening K1 exposing at least part of the second electrode 313 of the light emitting device 310.

[0263] The plurality of partition portions 500 includes a plurality of first partition portions 510 and a plurality of second partition portions 520. For example, there are two first partition portions 510 between the two adjacent light emitting devices 310 in the light emitting unit 300G, and the opposite sides of the two first partition portions 510 have undercut structures. For example, there are two second partition portions 520 between the light emitting device 310 of one light emitting unit 300G and the adjacent light emitting device 310 in another light emitting unit 300G, and the opposite sides of the two second partition portions 520 have undercut structures.

[0264] In some embodiments, the step of forming the passivation layer PVX can specifically include the following:

[0265] A passivation material layer is formed on the side of the plurality of light emitting devices 310 away from the substrate 100, and at least two layers of first reflective material layers and at least two layers of second reflective material layers are formed on the side of the passivation material layer away from the substrate 100. The at least two layers of first reflective material layers and the at least two layers of second reflective material layers are arranged alternately in the direction away from the substrate 100, and the refractive index of the first reflective material layer is smaller than the refractive index of the second reflective material layer.

[0266] For example, the forming of the passivation material layer includes: first forming a silicon oxide layer with a thickness of 500 angstroms by an atomic layer deposition process, and then forming a silicon oxide layer with a thickness of 0.2-0.3 μm by a chemical vapor deposition process.

[0267] For example, the material of the first reflective material layer includes at least one of silicon oxide, aluminum oxide and magnesium fluoride, and the material of the second reflective material layer includes at least one of niobium oxide, titanium dioxide, titanium trioxide and silicon nitride.

[0268] The passivation material layer, the at least two layers of the first reflective material layer and the at least two layers of the second reflective material layer are subjected to a patterning process and a dry etching process, i.e., the passivation layer PVX and the reflective layer REF are formed, and the reflective layer REF includes the first reflective sub-layer REF1 patterned from the first reflective material layer and the second reflective sub-layer REF2 patterned from the second reflective material layer.

[0269] For example, the passivation material layer, the at least two layers of the first reflective material layer and the at least two layers of the second reflective material layer are subjected to only one patterning process and dry etching process. Through the design of the size of the first opening K1, the interval between the two adjacent first partition portions 510 and the interval between the two adjacent second partition portions 520, and on the basis of the adjustment of the etching process parameters, the edge of the first reflective sub-layer REF1 and the edge of the second reflective sub-layer REF2 are smoothly connected at the first opening K1 in one etching process, and at the same time, the edge of the first reflective sub-layer REF1 protrudes compared with the edge of the second reflective sub-layer REF2 or the edge of the second reflective sub-layer REF2 protrudes compared with the edge of the first reflective sub-layer REF1 at the partition portion 500.

[0270] Referring to FIG. 13H, the conductive layer 400 is formed on the side of the plurality of partition portions 500 away from the substrate 100, and the conductive layer 400 is partitioned into a plurality of conductive portions 410 by the plurality of second partition portions 520, the conductive portions 410 are partitioned into at least two first conductive portions 411 by the at least one first partition portion 510, and the conductive layer 400 further includes a second conductive portion 412 between the two adjacent first partition portions 510 and a second conductive portion 412 between the two adjacent second partition portions 520. In one light emitting unit 300G, the two adjacent light emitting devices 310 are connected in series by the first conductive portion 411, i.e., the epitaxial portion 3111 of the first electrode 311 of one light emitting device 310 is electrically connected to the second electrode 313 of another light emitting device 310 by the first conductive portion 411.

[0271] For example, the conductive layer 400 is formed by a physical vapor deposition process, and the conductive layer 400 has a stack film layer structure of Ti / Al / Ti with thicknesses of 50 / 1000 / 100 angstroms or a stack film layer structure of TiN / Al / Ti with thicknesses of 50 / 1000 / 100 angstroms.

[0272] Referring to FIG. 13I, a planarization layer PLN is formed on a side of the conductive layer 400 distal from the substrate 100, and the planarization layer PLN has a second opening K2 that exposes at least a portion of the first conductive sub-portion 411 that is electrically connected only to the second electrode 313 of the light emitting device 310.

[0273] Referring to FIG. 13J, a connection electrode 320 is formed on a side of the planarization layer PLN distal from the substrate 100, and an encapsulation layer EPL is formed on a side of the connection electrode 320 distal from the substrate 100. The connection electrode 320 is electrically connected to the first conductive sub-portion 411 through the second opening K2.

[0274] Referring to FIG. 13K, a protective cover plate CG is provided, and a second buffer layer BUF2 is formed on the protective cover plate CG. A black matrix layer BM having a plurality of openings is formed on a side of the second buffer layer BUF2 distal from the protective cover plate CG. A semi-transparent semi-reflective layer 800 is formed in some of the openings of the black matrix layer BM. A color conversion layer 700 is formed on a side of the semi-transparent semi-reflective layer 800 distal from the protective cover plate CG, and the color conversion layer 700 is located in the plurality of openings of the black matrix layer BM and includes a first color conversion portion 710, a second color conversion portion 720, and a light-transmissive portion 730, thereby obtaining a color filter substrate.

[0275] The color filter substrate is combined with the substrate shown in FIG. 13J, and an encapsulation process is performed, thereby obtaining a display substrate.

[0276] At least some embodiments of the present disclosure also provide a display device including the display substrate as described above. The display device can include any device or product having a display function. For example, the display device can be a smart phone, a mobile phone, an e-book reader, a desktop PC, a laptop PC, a netbook PC, a personal digital assistant (PDA), a portable multimedia player (PMP), a digital audio player, a mobile medical device, a camera, a wearable device (e.g., a head-mounted device, electronic clothing, an electronic bracelet, an electronic necklace, electronic accessories, electronic tattoos, or a smart watch), a television, etc.

[0277] It should be understood that the display panel and the display device according to the embodiments of the present disclosure have all the features and advantages of the display substrate described above, and specific reference can be made to the description above, which will not be repeated here. Although some embodiments of the overall technical concept of the present disclosure have been shown and described, those of ordinary skill in the art will understand that changes can be made to these embodiments without departing from the principles and spirit of the overall technical concept, and the scope of the present disclosure is limited by the claims and their equivalents.

Claims

1. A display substrate, wherein, The display substrate includes: Substrate; The driving circuit layer is located on the substrate. A light-emitting device layer, located on the side of the driving circuit layer away from the substrate, includes a plurality of light-emitting devices arranged in an array along a first direction and a second direction. Each light-emitting device includes a first electrode on the driving circuit layer, a light-emitting functional portion located on the side of the first electrode away from the substrate, and a second electrode located on the side of the light-emitting functional portion away from the substrate. The light-emitting device layer includes at least one light-emitting unit, which includes at least two light-emitting devices and a connecting electrode. The at least two light-emitting devices and the connecting electrode are connected in series. A conductive layer is located on the side of the plurality of light-emitting devices away from the substrate. The conductive layer includes at least one conductive portion, the orthographic projection of the conductive portion on the substrate at least partially coincides with the orthographic projection of the light-emitting unit on the substrate, and the conductive portion includes at least two first conductive sub-parts spaced apart. In the light-emitting unit, among two adjacent and electrically connected light-emitting devices, the second electrode of one light-emitting device is electrically connected to the first electrode of the other light-emitting device through the first conductive part; and in the connecting electrode and the light-emitting device electrically connected to the connecting electrode, the connecting electrode is electrically connected to the second electrode of the light-emitting device through the first conductive part; and The display substrate further includes a partition portion, and at least one partition portion is provided between two adjacent first conductive electronic portions.

2. The display substrate according to claim 1, wherein, The partition portion includes a first partition portion, and in the conductive portion, at least one first partition portion is provided between two adjacent first conductive portions; and / or The partition includes a second partition, and at least one second partition is present between two adjacent conductive parts.

3. The display substrate according to claim 2, wherein, In two adjacent light-emitting devices in the light-emitting unit, the first electrode of one light-emitting device has an epitaxial portion extending beyond the edge of the light-emitting functional portion, and the epitaxial portion is electrically connected to the second electrode of the other light-emitting device through the first conductive portion.

4. The display substrate according to claim 3, wherein, At least a portion of the first partition is located on the side of the epitaxial portion away from the substrate, and the size of the first partition is greater than or equal to the size of the epitaxial portion along the extending direction of the first partition.

5. The display substrate according to any one of claims 2-4, wherein, The partition portion has a first surface away from the substrate and a second surface close to the substrate, wherein the orthographic projection of the second surface on the substrate is within the orthographic projection of the first surface on the substrate.

6. The display substrate according to any one of claims 2-5, wherein, The display substrate further includes a cover layer, which is located between the plurality of light-emitting devices and the conductive layer. The cover layer includes a plurality of cover portions, each of which covers at least a portion of the surface of the plurality of light-emitting devices. as well as The covering portion includes a first opening that exposes at least a portion of the second electrode of the light-emitting device, and the first conductive portion is electrically connected to the second electrode of the light-emitting device through the first opening; The partition portion is located in the covering layer.

7. The display substrate according to claim 6, wherein, There is a partition between two adjacent first conductive parts, the partition is connected to an adjacent cover as an integral structure, and is spaced apart from the other adjacent cover, and the two adjacent first conductive parts are disconnected at the partition.

8. The display substrate according to claim 6, wherein, Two partitions are spaced apart between two adjacent first conductive parts, and the two adjacent first conductive parts are disconnected at the interval of the two partitions. Wherein, one of the partition portions is connected to the adjacent covering portion as an integral structure, and the other partition portion is spaced apart from the adjacent covering portion; and / or One of the partition portions is integrally connected to the adjacent cover portion, and the other partition portion is integrally connected to the adjacent cover portion; and / or One of the partition portions is spaced apart from the adjacent covering portion, and the other partition portion is spaced apart from the adjacent covering portion.

9. The display substrate according to claim 8, wherein, The conductive part further includes a second conductive sub-part, which is located between two spaced-apart partitions and is disconnected from the two adjacent first conductive sub-parts at the two partitions respectively.

10. The display substrate according to claim 6, wherein, A partition is provided between two adjacent first conductive parts, and the partition is spaced apart from two adjacent covering parts, with the two adjacent first conductive parts located on both sides of the partition.

11. The display substrate according to any one of claims 6-10, wherein, The cover layer includes a passivation layer, the passivation layer includes a first passivation sub-layer located on the side of the plurality of light-emitting devices away from the substrate and a second passivation sub-layer located on the side of the first passivation sub-layer away from the substrate, the partition portion includes a first partition portion and a second partition portion located on the side of the first partition portion away from the substrate, the first partition portion is located in the first passivation sub-layer, the second partition portion is located in the second passivation sub-layer, and the orthographic projection of the first partition portion on the substrate is located within the orthographic projection of the second partition portion on the substrate.

12. The display substrate according to any one of claims 6-10, wherein, The cover layer includes an organic protective layer, the partition portion is located in the organic protective layer, and the cross-sectional shape of the partition portion along the direction perpendicular to the substrate is an inverted trapezoid.

13. The display substrate according to any one of claims 1-12, wherein, The connection electrode is located on the side of the driving circuit layer away from the substrate, and the connection electrode is spaced apart from the adjacent light-emitting device.

14. The display substrate according to claim 13, wherein, The connecting electrode is located on the same layer as the first electrode.

15. The display substrate according to any one of claims 6-10, wherein, The connecting electrode is located on the side of the conductive layer away from the substrate. The connecting electrode is electrically connected to the first conductive part. The orthographic projection of the connecting electrode on the substrate overlaps at least partially with the orthographic projection of the light-emitting part on the substrate.

16. The display substrate according to claim 15, wherein, The display substrate further includes at least one auxiliary electrode, which is electrically connected to the connecting electrode. The orthographic projection of the auxiliary electrode on the substrate does not overlap with the orthographic projection of the light-emitting functional part on the substrate.

17. The display substrate according to any one of claims 1-16, wherein, The at least one light-emitting unit includes a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit, and the light-emitting device emits light of a third color; The display substrate further includes a color conversion layer, which is located on the side of the conductive layer away from the substrate, or the color conversion layer is located on the side of the substrate away from the light-emitting device layer. as well as The color conversion layer includes a first color conversion part and a second color conversion part. The orthographic projection of the first color conversion part on the substrate at least partially overlaps with the orthographic projection of the first light-emitting unit on the substrate. The first color conversion part is used to convert third color light into first color light. The orthographic projection of the second color conversion part on the substrate at least partially overlaps with the orthographic projection of the second light-emitting unit on the substrate. The second color conversion part is used to convert third color light into second color light.

18. The display substrate according to any one of claims 6-10, wherein, The covering layer includes a reflective layer, which includes a plurality of reflective portions. The plurality of reflective portions cover at least a portion of the sidewalls of the plurality of light-emitting devices. The light-emitting devices emit third-color light, and the reflective portions reflect the third-color light and transmit first-color light and second-color light.

19. The display substrate according to claim 18, wherein, The partition is located in the reflective layer.

20. The display substrate according to claim 19, wherein, The reflective layer includes at least two first reflective sublayers and at least two second reflective sublayers, which are arranged alternately along a direction away from the substrate. The refractive index of the first reflective sublayer is less than that of the second reflective sublayer. The partition includes at least two first partition sub-parts and at least two second partition sub-parts, wherein the at least two first partition sub-parts are respectively located in the at least two first reflective sub-layers, and the at least two second partition sub-parts are respectively located in the two second reflective sub-layers; and In the adjacent first partition sub-section and second partition sub-section, the first partition sub-section is in the liner The orthographic projection on the substrate is located within the orthographic projection of the second partition sub-part on the substrate, or the orthographic projection of the second partition sub-part on the substrate is located within the orthographic projection of the first partition sub-part on the substrate.

21. The display substrate according to any one of claims 18-20, wherein, The display substrate further includes a planarization layer located on the side of the conductive layer away from the reflective layer, the planarization layer having a second opening that exposes at least a portion of a first conductive portion electrically connected only to the second electrode of the light-emitting device; and The connection electrode is located on the side of the planarization layer away from the substrate, and the connection electrode is electrically connected to the first conductive part through the second opening.

22. The display substrate according to any one of claims 18-21, wherein, The at least one light-emitting unit includes a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit, and the light-emitting device emits light of a third color; The display substrate further includes a color conversion layer, which is located on the side of the substrate away from the light-emitting device layer. as well as The color conversion layer includes a first color conversion section, a second color conversion section, and a light-transmitting section. The orthographic projection of the first color conversion section on the substrate at least partially overlaps with the orthographic projection of the first light-emitting unit on the substrate. The first color conversion section is used to convert third-color light into first-color light. The orthographic projection of the second color conversion section on the substrate at least partially overlaps with the orthographic projection of the second light-emitting unit on the substrate. The second color conversion section is used to convert third-color light into second-color light. The orthographic projection of the light-transmitting section on the substrate at least partially overlaps with the orthographic projection of the third light-emitting unit on the substrate. The light-transmitting section is used to transmit third-color light.

23. The display substrate according to claim 22, wherein, The substrate has a plurality of grooves on the side away from the light-emitting device layer, the plurality of grooves including a first groove, and at least a portion of the first color conversion portion is embedded in the first groove; and / or The plurality of grooves includes a second groove, and at least a portion of the second color conversion portion is embedded in the second groove; and / or The plurality of grooves includes a third groove, and at least a portion of the light-transmitting portion is embedded in the third groove.

24. The display substrate according to claim 23, wherein, At least a portion of the groove is provided with a metal reflective portion, the metal reflective portion being located between the substrate and the color conversion layer, and the metal reflective portion covering at least a portion of the sidewall of the groove.

25. The display substrate according to any one of claims 22-24, wherein, The display substrate further includes a semi-transparent and semi-reflective layer located on the side of the color conversion layer away from the substrate, wherein the semi-transparent and semi-reflective layer transmits a first color light and a second color light and reflects a third color light; The orthographic projection of the semi-transparent and semi-reflective layer on the substrate at least partially overlaps with the orthographic projection of the first color conversion part on the substrate; and / or The orthographic projection of the semi-transparent and semi-reflective layer on the substrate at least partially overlaps with the orthographic projection of the second color conversion part on the substrate.

26. The display substrate according to any one of claims 1-25, wherein, In at least one of the light-emitting units, the at least two light-emitting devices are arranged along the first direction, and the first partition extends along the second direction; and / or In at least one of the light-emitting units, at least two light-emitting devices are arranged along the second direction, and the first partition extends along the first direction.

27. The display substrate according to any one of claims 1-25, wherein, In at least one of the light-emitting units, at least two of the light-emitting devices are arranged along the first direction and at least two of the light-emitting devices are arranged along the second direction; Wherein, between two adjacent light-emitting devices along the first direction, the first partition extends along the second direction; and / or Between two adjacent light-emitting devices along the second direction, the first partition extends along the first direction.

28. The display substrate according to any one of claims 1-27, wherein, The shape of the orthographic projection of the light-emitting device on the substrate is circular, elliptical, rectangular, or rounded rectangular.

29. A method for preparing a display substrate, wherein, The preparation method includes the following steps: A driving circuit layer is formed on the substrate. A light-emitting device layer is formed on the side of the driving circuit layer away from the substrate. The light-emitting device layer includes a plurality of light-emitting devices arranged in an array along a first direction and a second direction. Each light-emitting device includes a first electrode located on the driving circuit layer, a light-emitting functional part located on the side of the first electrode away from the substrate, and a second electrode located on the side of the light-emitting functional part away from the substrate. The light-emitting device layer includes at least one light-emitting unit, and the light-emitting unit includes at least two light-emitting devices and a connecting electrode. A partition is formed on the side of the drive circuit layer away from the substrate; and A conductive layer is formed on the side of the light-emitting device layer and the partition portion away from the substrate. The conductive layer includes at least one conductive portion, the orthographic projection of the conductive portion on the substrate at least partially coincides with the orthographic projection of the light-emitting unit on the substrate. The conductive portion includes at least two first conductive sub-parts spaced apart, and at least one partition portion is provided between two adjacent first conductive sub-parts. In the light-emitting unit, in two adjacent light-emitting devices, the second electrode of one light-emitting device is electrically connected to the first electrode of the other light-emitting device through the first conductive sub-part. Furthermore, in the connecting electrode and the light-emitting device adjacent to the connecting electrode, the connecting electrode is electrically connected to the second electrode of the light-emitting device through the first conductive sub-part.

30. A display device comprising a display substrate according to any one of claims 1-28.

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