Lateral glue injection mold for notebook computer shell

Abstract

The invention relates to the technical field of glue injection, in particular to a notebook computer shell side face glue injection mold which comprises a left mold body and a right mold body, the left mold body comprises a containing base, an adsorption assembly and a cooling assembly, the adsorption assembly is arranged in the containing base and used for adsorbing and pre-fixing a notebook computer shell, and the cooling assembly is used for cooling the notebook computer shell after glue injection; the right mold comprises a moving seat, a glue injection disc and a glue guide assembly, the moving seat is slidably arranged on one side of the placing seat, the glue injection disc is arranged on one side of the moving seat, the moving seat slides to enable the glue injection disc to be close to the placing seat to form a glue injection space, and the glue guide assembly is used for guiding glue into a plurality of glue injection holes in the glue injection disc; and the glue flows into a plurality of holes in the notebook computer shell under the action of glue injection pressure. Through adsorption fixing and cooling functions of the left mold and precise glue injection and sealing cooperation of the right mold, the mold can be automatically positioned, glue injection is carried out, and the working efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of injection molding technology, and more particularly to an injection molding mold for the side of a laptop shell. Background Technology

[0002] Side coating of laptop casings is a precision process that involves injecting sealant, structural adhesive, or thermally conductive adhesive into openings or gaps in the sidewalls of the casing. It is mainly used to achieve functions such as waterproofing and dustproofing, enhancing structural strength, improving electromagnetic shielding performance, or assisting in heat dissipation.

[0003] The existing method of applying glue to the side of laptop casings requires manual fixation of the laptop casing in a designated position before glue is applied, which is inefficient. Summary of the Invention

[0004] The purpose of this invention is to provide a side injection mold for a laptop casing, which aims to improve work efficiency by using the adsorption, fixation and cooling functions of the left mold and the precise injection and sealing of the right mold to automatically position the mold and perform injection.

[0005] To achieve the above objectives, the present invention provides a side injection mold for a laptop casing, comprising a left mold and a right mold. The left mold includes a placement seat, an adsorption component, and a cooling component. The adsorption component is disposed within the placement seat for adsorbing and pre-fixing the laptop casing. The cooling component is used to dissipate heat from the laptop casing after injection. The right mold includes a movable seat, an injection tray, and an injection guiding component. The movable seat is slidably disposed on one side of the placement seat, and the injection tray is disposed on one side of the movable seat. Sliding the movable seat brings the injection tray closer to the placement seat to form an injection space. The injection guiding component is used to guide the glue into multiple injection holes on the injection tray, and under injection pressure, the glue flows into multiple openings on the laptop casing.

[0006] The cooling assembly includes multiple air inlets, multiple air outlets, a temperature sensor, and a controller. The multiple air inlets are respectively connected to air holes on the mounting base, and the multiple air outlets are respectively connected to air holes on the mounting base. The temperature sensor is located on one side of the air inlet, and the controller is connected to the temperature sensor.

[0007] The adsorption assembly includes a negative pressure tube and a negative pressure pump. A negative pressure hole is provided in the center of the placement seat. The negative pressure tube is connected to the negative pressure hole, and the negative pressure pump is connected to the negative pressure tube.

[0008] The glue injection hole has a first flow channel on one side, through which the glue flows evenly into the opening on the laptop shell.

[0009] The adhesive guiding assembly includes an adhesive inlet tube, an adhesive dispensing disc, and multiple connecting tubes. The adhesive inlet tube is fixed on the movable base, the adhesive dispensing disc is fixed between the movable base and the adhesive dispensing disc, and the multiple connecting tubes communicate with the adhesive dispensing disc and the movable base.

[0010] The adhesive guiding assembly also includes multiple maintenance plugs. Maintenance holes are provided on the movable seat at positions corresponding to the multiple connecting pipes. The multiple maintenance plugs are respectively disposed in the multiple maintenance holes and are used to open the corresponding maintenance plugs to unclog the connecting pipes when they are blocked.

[0011] The right mold also includes a pipe cooling structure, which is used to regulate the temperature of the glue entering the connecting pipe.

[0012] The pipeline cooling structure includes multiple cooling chambers, multiple first cooling pipes, and a first connecting pipe. The multiple cooling chambers are respectively positioned on the movable seat corresponding to the multiple connecting pipes. The multiple first cooling pipes are respectively connected to the multiple cooling chambers, and the first connecting pipe is connected to the multiple first cooling pipes.

[0013] The right mold further includes a plate cooling structure, and the movable seat has multiple second flow channels. The plate cooling structure is used to communicate with the multiple second flow channels to cool the movable seat.

[0014] The plate cooling structure includes multiple second cooling pipes and a second connecting pipe. The multiple second cooling pipes are respectively connected to multiple second flow channels, and the second connecting pipe is connected to multiple second cooling pipes.

[0015] This invention discloses a side-mounted adhesive injection mold for a laptop casing. A placement base is used to support the laptop casing to be injected with adhesive. Its structure is adapted to the casing's shape to ensure stable placement and accurate positioning. An adsorption component is embedded within the placement base, preferably employing vacuum adsorption. Multiple reasonably distributed suction holes adsorb and fix the bottom surface or inner cavity of the laptop casing, effectively preventing displacement of the casing due to external force or adhesive flow during the injection process, thus achieving a pre-fixation function. A cooling component is integrated inside the placement base or its surrounding area. It can take the form of a circulating cooling water channel, thermoelectric cooling plate, or air-cooled structure, etc., to quickly dissipate heat and cool the casing and adhesive after injection, accelerating adhesive curing, shortening the production cycle, and preventing casing deformation or adhesive performance degradation due to localized overheating.

[0016] The movable base is slidably mounted on one side of the placement base via slide rails, guide pillars, or linear modules, enabling smooth horizontal movement. The dispensing tray is fixedly installed on the side of the movable base near the placement base, its outline matching the dispensing area on the side of the laptop casing. The tray surface has multiple dispensing holes corresponding one-to-one with the openings on the side of the casing. When the movable base slides into position towards the placement base, the dispensing tray fits tightly against the side of the casing on the placement base, forming a closed dispensing space to prevent glue overflow. The dispensing guide assembly is connected to the glue inlet end of the dispensing tray, including a main channel, branch channels, and multiple branch channels communicating with the dispensing holes. Its function is to evenly and stably guide the glue provided by the external dispensing equipment into each dispensing hole. Under dispensing pressure, the glue is precisely injected through the dispensing holes into the corresponding openings on the side wall of the laptop casing, achieving synchronous and uniform filling, effectively improving dispensing quality and product consistency.

[0017] This invention utilizes the adsorption, fixation, and cooling functions of the left mold and the precise injection and sealing of the right mold to construct a reasonable, convenient, efficient, and high-yield side injection molding system for laptop shells. It is particularly suitable for the manufacturing of consumer electronics shells where high precision and appearance are required. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a structural diagram of the laptop casing processed according to the present invention.

[0021] Figure 2 This is a structural diagram of a side injection molding mold for a laptop shell according to the present invention.

[0022] Figure 3 This is an internal structural diagram of a side injection mold for a laptop shell according to the present invention.

[0023] Figure 4 yes Figure 3 A magnified view of detail A.

[0024] Figure 5 This is a structural diagram of the placement base of the present invention.

[0025] Figure 6 This is a structural diagram of the dispensing tray of the present invention.

[0026] Figure 7This is a cross-sectional structural diagram of the dispensing disc of the present invention.

[0027] Placement base 101, adsorption assembly 102, cooling assembly 103, moving base 104, dispensing tray 105, dispensing guide assembly 106, air inlet duct 107, air outlet duct 108, temperature sensor 109, controller 110, negative pressure pipe 111, negative pressure pump 112, negative pressure hole 113, first flow channel 114, dispensing pipe 115, dispensing tray 116, connecting pipe 117, maintenance plug 118, maintenance hole 119, cooling cavity 120, first cooling pipe 121, first connecting pipe 122, second flow channel 123, second cooling pipe 124, second connecting pipe 125, laptop casing 126, opening 127. Detailed Implementation

[0028] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0029] In the description of this invention, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, in the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0030] Please see Figures 1-7 This invention provides a side-mounted glue injection mold for a laptop casing, comprising a left mold and a right mold. The left mold includes a placement base 101, an adsorption component 102, and a cooling component 103. The adsorption component 102 is disposed within the placement base 101 for adsorbing and pre-fixing the laptop casing. The cooling component 103 is used to dissipate heat from the laptop casing after glue injection. The right mold includes a movable base 104, a glue injection tray 105, and a glue guiding component 106. The movable base 104 is slidably disposed on one side of the placement base 101, and the glue injection tray 105 is disposed on one side of the movable base 104. Sliding the movable base 104 causes the glue injection tray 105 to approach the placement base 101, forming a glue injection space. The glue guiding component 106 is used to guide glue into multiple glue injection holes on the glue injection tray 105, and under the action of glue injection pressure, the glue flows into multiple openings on the laptop casing.

[0031] In this embodiment, the placement base 101 is used to support the laptop shell to be glued. Its structure is adapted to the shape of the shell to ensure that the shell is placed stably and positioned accurately. The adsorption component 102 is embedded inside the placement base 101, preferably using a vacuum adsorption method. It uses multiple reasonably distributed air suction holes to adsorb and fix the bottom surface or inner cavity of the laptop shell, thereby effectively preventing the shell from shifting due to external force or glue flow during the glue injection process, achieving a pre-fixation function. The cooling component 103 is integrated inside the placement base 101 or its surrounding area. It can take the form of a circulating cooling water channel, thermoelectric cooling plate, or air cooling structure, etc., to quickly dissipate heat and cool down the shell and glue after glue injection, accelerate glue curing, shorten the production cycle, and at the same time avoid shell deformation or glue performance degradation due to local overheating.

[0032] The movable base 104 is slidably mounted on one side of the placement base 101 via a slide rail, guide post, or linear module, enabling smooth horizontal movement. The dispensing tray 105 is fixedly installed on the side of the movable base 104 near the placement base 101. Its outline matches the dispensing area on the side of the laptop casing, and the tray surface has multiple dispensing holes corresponding one-to-one with the openings on the side of the casing. When the movable base 104 slides into position towards the placement base 101, the dispensing tray 105 fits tightly against the side of the casing on the placement base 101, forming a closed dispensing space to prevent glue overflow. The glue guiding assembly 106 is connected to the glue inlet end of the dispensing tray 105, including a main channel, branch channels, and multiple branch channels communicating with the dispensing holes. Its function is to evenly and stably guide the glue provided by the external dispensing equipment into each dispensing hole. Under the action of dispensing pressure, the glue is precisely injected into the multiple openings corresponding to the side wall of the laptop casing through the dispensing holes, achieving synchronous and uniform filling, effectively improving dispensing quality and product consistency.

[0033] In summary, this invention, through the adsorption, fixation, and cooling functions of the left mold and the precise injection and sealing of the right mold, constructs a set of notebook computer shell side injection molding system with reasonable structure, convenient operation, high efficiency, and high yield. It is particularly suitable for the manufacturing of consumer electronics shells with high requirements for precision and appearance.

[0034] The cooling assembly 103 includes multiple air inlets 107, multiple air outlets 108, a temperature sensor 109, and a controller 110. The multiple air inlets 107 are respectively connected to air holes on the placement base 101, and the multiple air outlets 108 are respectively connected to air holes on the placement base 101. The temperature sensor 109 is disposed on one side of the air inlet 107, and the controller is connected to the temperature sensor 109.

[0035] Room temperature air or low-temperature gas that has been refrigerated is introduced into the area near the bottom or side wall of the laptop casing. Correspondingly, the multiple air outlets 108 are also connected to the corresponding exhaust holes on the placement base 101 to promptly discharge the hot air after absorbing heat, thereby forming a directional and circulating airflow channel around the casing, effectively removing the heat generated during the glue application process, and preventing excessively high local temperatures from affecting the glue curing quality or causing casing deformation.

[0036] The temperature sensor 109 is located on one side of the air intake duct 107 (e.g., near the air inlet or at a critical node in the airflow path) to monitor the temperature of the airflow entering the cooling area or the surface temperature of the casing in real time, and transmits the collected temperature signal to the controller 110. The controller 110 is electrically connected to the temperature sensor 109 and has a built-in preset temperature threshold and control logic, which can automatically adjust the operating status of the cooling system according to real-time temperature data. For example, when the detected temperature is higher than the set upper limit, the controller 110 can start or increase the fan power, turn on the cooling device, or adjust the air intake flow; when the temperature drops to a safe range, it can reduce the air volume or stop cooling, thereby achieving the purpose of on-demand cooling and energy-saving efficiency.

[0037] The adsorption assembly 102 includes a negative pressure tube 111 and a negative pressure pump 112. A negative pressure hole 113 is provided in the center of the placement seat 101. The negative pressure tube 111 is connected to the negative pressure hole 113, and the negative pressure pump 112 is connected to the negative pressure tube 111.

[0038] The adsorption component 102 is used to reliably adsorb and pre-fix the laptop casing during the glue injection process, preventing it from shifting, warping, or vibrating during glue injection pressure or mold movement, thereby ensuring glue injection accuracy and product consistency. The adsorption component 102 mainly includes a negative pressure tube 111 and a negative pressure pump 112. Specifically, one or more negative pressure holes 113 are provided in the central region of the placement base 101. The positions of these negative pressure holes 113 are optimized according to the structural characteristics of the laptop casing, typically located in non-functional areas at the bottom of the casing or below reinforcing ribs to avoid affecting appearance or structural strength. One end of the negative pressure tube 111 is sealed and connected to the negative pressure hole 113, and the other end is connected to the negative pressure pump 112. When the negative pressure pump 112 is activated, a stable negative pressure area is formed at the negative pressure hole 113 through the negative pressure tube 111, thereby firmly adsorbing and fixing the laptop casing placed on the placement base 101. This structure is not only easy to install and quick to respond, but also has adjustable adsorption force, making it suitable for shells of different materials (such as metal, plastic or composite materials) and different sizes, with good versatility and adaptability.

[0039] A first flow channel 114 is provided on one side of the glue injection hole, through which the glue flows evenly into the opening on the laptop shell.

[0040] To ensure that the adhesive is evenly and stably filled into the multiple openings on the side of the laptop casing, avoiding defects such as insufficient adhesive, air bubbles, or uneven filling, the present invention provides a first flow channel 114 on one side of each injection hole. This first flow channel 114 has an annular, arc-shaped, or multi-branched structure, with one end connected to the outlet of the adhesive guiding component 106, and the other end connected to the inlet of each injection hole. Through the buffering and diversion effect of the first flow channel 114, the adhesive is sufficiently pressure-equalized and flow-stabilized before entering the injection holes, effectively reducing flow deviations caused by differences in injection path length or uneven resistance. Simultaneously, the cross-sectional dimensions and orientation of the first flow channel 114 are optimized by fluid dynamics, enabling it to guide the adhesive to flow synchronously into each opening at similar speeds and pressures under injection pressure, achieving multi-point synchronous and uniform filling.

[0041] The adhesive guiding assembly 106 includes an adhesive inlet tube 115, an adhesive dispensing disc 116, and a plurality of connecting tubes 117. The adhesive inlet tube 115 is fixed on the movable seat 104, the adhesive dispensing disc 116 is fixed between the movable seat 104 and the adhesive dispensing disc 105, and the plurality of connecting tubes 117 are connected to the adhesive dispensing disc 116 and the movable seat 104.

[0042] The glue inlet pipe 115 is fixedly installed on the outside or top of the movable base 104, serving as the main input channel for the glue. One end of it is connected to external glue injection equipment (such as a glue injection machine or metering pump), and the other end passes through the movable base 104 and communicates with the internal glue distribution plate 116, used to stably deliver high-pressure glue into the mold. The glue distribution plate 116 is located between the movable base 104 and the glue injection plate 105, and is usually made of high-rigidity, corrosion-resistant materials (such as stainless steel or engineering plastics). It has a precisely designed flow distribution chamber or flow channel network inside. The function of the glue distribution plate 116 is to evenly distribute the glue from the glue inlet pipe 115 to multiple outlets, ensuring the consistency of flow rate and pressure in each glue injection path.

[0043] Multiple connecting tubes 117 are respectively connected between each outlet of the dispensing plate 116 and the corresponding dispensing hole on the dispensing plate 105. Their number corresponds one-to-one with the dispensing holes or they are grouped by region. The connecting tubes 117 can be flexible metal hoses, pressure-resistant silicone tubes, or rigid microchannel structures, flexibly selected according to process requirements to adapt to mold assembly tolerances and reduce adhesive flow resistance. These connecting tubes 117 penetrate the interior of the moving base 104 and seal with the through holes on the moving base 104, ensuring that the adhesive path remains unobstructed and leak-free during the sliding of the moving base 104.

[0044] The adhesive guiding assembly 106 also includes a plurality of maintenance plugs 118. Maintenance holes 119 are provided on the movable seat 104 at positions corresponding to the plurality of connecting pipes 117. The plurality of maintenance plugs 118 are respectively disposed in the plurality of maintenance holes 119, and are used to open the corresponding maintenance plugs 118 to unclog the connecting pipes 117 when the connecting pipes 117 are blocked.

[0045] To further improve the maintainability and operational stability of the equipment, the adhesive guiding assembly 106 is also specially equipped with multiple maintenance plugs 118. Specifically, maintenance holes 119 communicating with the interior of each connecting pipe 117 are provided on the movable seat 104 at the positions where each connecting pipe 117 passes through or connects. These maintenance holes 119 are usually threaded holes or tapered insertion holes for easy disassembly and assembly. Multiple maintenance plugs 118 are respectively embedded in the corresponding maintenance holes 119, using sealing screws, quick-connect plugs, or magnetic caps, etc., and are normally in a closed state to prevent adhesive leakage or impurities from entering. When a connecting pipe 117 affects normal adhesive injection due to adhesive curing, impurities clogging, or long-term use causing scale buildup, the operator can quickly remove the maintenance plug 118 at the corresponding position and flush, clear, or partially replace the blocked connecting pipe 117 through the maintenance hole 119 without disassembling the entire mold or shutting down for major repairs, significantly improving the equipment's maintenance efficiency and production continuity.

[0046] The right mold also includes a pipe cooling structure for regulating the temperature of the adhesive entering the connecting pipe 117.

[0047] The pipeline cooling structure includes multiple cooling chambers 120, multiple first cooling pipes 121, and a first connecting pipe 122. The multiple cooling chambers 120 are respectively positioned on the movable seat 104 corresponding to the multiple connecting pipes 117. The multiple first cooling pipes 121 are respectively connected to the multiple cooling chambers 120, and the first connecting pipe 122 is connected to the multiple first cooling pipes 121.

[0048] Multiple cooling chambers 120 are respectively embedded inside the movable base 104, and their positions correspond one-to-one with the direction or arrangement area of ​​each connecting pipe 117. They are usually arranged around or close to the outer wall of the connecting pipe 117 to maximize heat exchange efficiency. The cooling chambers 120 can be integrally formed in the body of the movable base 104 by milling, drilling or 3D printing, or they can be realized by an embedded metal sleeve structure, forming a closed or semi-closed cooling channel between their inner wall and the outer wall of the connecting pipe 117.

[0049] Multiple first cooling pipes 121 are connected to corresponding cooling chambers 120 to introduce cooling media (such as cooling water, low-temperature ethylene glycol solution, or refrigerant gas) into each cooling chamber 120. These first cooling pipes 121 are rationally arranged inside the movable seat 104 to avoid interference with connecting pipes 117, adhesive guide channels, or other functional components, while ensuring a short cooling path and fast response. The first connecting pipe 122 serves as the main channel for transporting the cooling media, passing through the movable seat 104 laterally or longitudinally, and is connected to one end of all the first cooling pipes 121 to form a parallel cooling circuit. The cooling media is supplied uniformly by an external cooling system (such as a chiller) through the first connecting pipe 122, then distributed to each first cooling pipe 121, and then enters the corresponding cooling chamber 120 to efficiently cool the connecting pipe 117 and the adhesive flowing inside it; the heat-absorbing media is discharged through the return pipe, completing the circulation.

[0050] In some preferred embodiments, the pipe cooling structure may further be equipped with a temperature sensor 109 and a flow regulating valve, and linked with the aforementioned controller 110 to achieve closed-loop control of the adhesive temperature. For example, when the adhesive temperature is detected to be too high, the system can automatically increase the flow rate of the cooling medium or decrease its temperature; conversely, it can reduce the cooling intensity to avoid over-cooling. In addition, the shape of the cooling chamber 120 can be designed as a spiral, jacketed, or porous microchannel type to enhance the heat exchange area and uniformity.

[0051] The right mold also includes a plate cooling structure. The movable seat 104 has multiple second flow channels 123. The plate cooling structure is used to communicate with the multiple second flow channels 123 to cool the movable seat 104.

[0052] The plate cooling structure includes a plurality of second cooling pipes 124 and a second connecting pipe 125. The plurality of second cooling pipes 124 are respectively connected to a plurality of second flow channels 123, and the second connecting pipe 125 is connected to the plurality of second cooling pipes 124.

[0053] The movable seat 104 has multiple second flow channels 123 inside. These flow channels are optimized according to the geometry, heat load distribution, and structural strength requirements of the movable seat 104, and are usually arranged in a mesh, serpentine, or parallel pattern, penetrating key areas of the movable seat 104 (such as near the glue injection plate 105, dense areas of connecting pipes 117, or sliding mating surfaces, etc., which are prone to heat accumulation). The second flow channels 123 serve as the flow channels for the cooling medium, and their inner walls are precision machined to ensure sealing and controllable flow resistance.

[0054] The plate cooling structure includes multiple second cooling pipes 124 and a second connecting pipe 125. The multiple second cooling pipes 124 are respectively sealed to the inlet or outlet of a corresponding second flow channel 123, used to introduce or export external cooling media (such as circulating cooling water, low-temperature heat transfer fluid, etc.) into or out of the second flow channel 123. The second cooling pipes 124 can adopt pressure-resistant metal hoses, quick-connect fittings, or embedded rigid pipe structures to ensure reliable connection and sealing performance during the reciprocating sliding of the movable seat 104.

[0055] The second connecting pipe 125 serves as the main distribution or collection pipe for the cooling medium, connecting to one end of all the second cooling pipes 124 to form a parallel or series-parallel hybrid cooling circuit. In actual operation, the cooling medium is supplied uniformly by the external temperature control system through the second connecting pipe 125, and then diverted through each of the second cooling pipes 124 into the corresponding second flow channel 123. It circulates within the moving seat 104, absorbing heat from the mold body, and is then discharged through the return path, completing the heat exchange process. This design not only improves cooling efficiency but also ensures the uniformity of the overall temperature field of the moving seat 104, effectively suppressing local overheating.

[0056] In summary, by integrating a plate cooling structure into the right mold and organically combining it with the second flow channel 123 inside the movable seat 104, this invention constructs a comprehensive, efficient, and adjustable mold body cooling system. This not only significantly improves the thermal stability of the equipment during continuous production but also extends the service life of the mold, ensuring high precision and consistency in the glue injection process for laptop shells.

[0057] The above description discloses only one preferred embodiment of the present invention, and should not be construed as limiting the scope of the present invention. Those skilled in the art will understand that all or part of the processes of the above embodiments can be implemented, and equivalent changes made in accordance with the claims of the present invention are still within the scope of the invention.

Claims

1. A mold for injecting adhesive into the side of a laptop casing, characterized in that, The device includes a left mold and a right mold. The left mold includes a placement seat, an adsorption component, and a cooling component. The adsorption component is disposed within the placement seat and is used to adsorb and pre-fix the laptop shell. The cooling component is used to dissipate heat from the laptop shell after glue injection. The right mold includes a movable seat, a glue injection tray, and a glue guiding component. The movable seat is slidably disposed on one side of the placement seat, and the glue injection tray is disposed on one side of the movable seat. Sliding the movable seat brings the glue injection tray closer to the placement seat to form a glue injection space. The glue guiding component is used to guide glue into multiple glue injection holes on the glue injection tray, and under the action of glue injection pressure, the glue flows into multiple openings on the laptop shell.

2. The side injection mold for a laptop casing as described in claim 1, characterized in that, The cooling assembly includes multiple air inlets, multiple air outlets, a temperature sensor, and a controller. The multiple air inlets are respectively connected to air holes on the mounting base, and the multiple air outlets are respectively connected to air holes on the mounting base. The temperature sensor is located on one side of the air inlet, and the controller is connected to the temperature sensor.

3. The side injection mold for a laptop casing as described in claim 2, characterized in that, The adsorption assembly includes a negative pressure tube and a negative pressure pump. A negative pressure hole is provided in the center of the placement seat. The negative pressure tube is connected to the negative pressure hole, and the negative pressure pump is connected to the negative pressure tube.

4. The side injection mold for a laptop casing as described in claim 3, characterized in that, A first flow channel is provided on one side of the glue injection hole, through which the glue flows evenly into the opening on the laptop shell.

5. The side injection mold for a laptop casing as described in claim 4, characterized in that, The glue guiding assembly includes a glue inlet tube, a glue dispensing disc, and multiple connecting tubes. The glue inlet tube is fixed on the movable base, the glue dispensing disc is fixed between the movable base and the glue dispensing disc, and the multiple connecting tubes communicate with the glue dispensing disc and the movable base.

6. The side injection mold for a laptop casing as described in claim 5, characterized in that, The adhesive guiding assembly also includes multiple maintenance plugs. Maintenance holes are provided on the movable base at positions corresponding to the multiple connecting pipes. The multiple maintenance plugs are respectively disposed in the multiple maintenance holes and are used to open the corresponding maintenance plugs to unclog the connecting pipes when they are blocked.

7. The side injection mold for a laptop casing as described in claim 6, characterized in that, The right mold also includes a pipe cooling structure for regulating the temperature of the adhesive entering the connecting pipe.

8. The side injection mold for a laptop casing as described in claim 7, characterized in that, The pipeline cooling structure includes multiple cooling chambers, multiple first cooling pipes, and a first connecting pipe. The multiple cooling chambers are respectively positioned on the movable base corresponding to the multiple connecting pipes. The multiple first cooling pipes are respectively connected to the multiple cooling chambers, and the first connecting pipe is connected to the multiple first cooling pipes.

9. The side injection mold for a laptop casing as described in claim 8, characterized in that, The right mold also includes a plate cooling structure. The movable seat has multiple second flow channels, and the plate cooling structure is used to communicate with the multiple second flow channels to cool the movable seat.

10. A side injection mold for a laptop casing as described in claim 9, characterized in that, The plate cooling structure includes multiple second cooling pipes and a second connecting pipe. The multiple second cooling pipes are respectively connected to multiple second flow channels, and the second connecting pipe is connected to multiple second cooling pipes.

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