Packaging process for high-stability LED

By employing radial crosslinking gradient treatment and interface activation technology with annular limiting adhesive layers in LED packaging, the problems of uneven filling of phosphor adhesive and insufficient interface fusion are solved, achieving LED packaging with high stability and reliability.

CN121865766APending Publication Date: 2026-04-14SHENZHEN SILVERLIGHT TECH CO LTD
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Patent Information

Application Number
CN202610078255.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-01-21
Publication Date
2026-04-14

AI Technical Summary

Technical Problem

In existing LED packaging processes, phosphor adhesives tend to spread, collapse, or accumulate before curing, resulting in uneven thickness and positional shifts. Furthermore, the interfaces of adhesives in different curing states do not fully fuse, affecting the continuity and reliability of the packaging structure.

Method used

A ring-shaped limiting adhesive layer is used for pre-curing to form a radial cross-linking gradient. Then, interface activation treatments such as vacuum decompression cycling, vibration, or ultrasound are used to promote the fusion of the fluorescent adhesive and the limiting adhesive layer, forming a continuous fluorescent adhesive layer.

Benefits of technology

It improves the filling area limitation effect and interface fusion stability of fluorescent adhesive, avoids the adverse effects of permanent limiting structures, and enhances the overall continuity and long-term reliability of the encapsulation structure.

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Abstract

The invention relates to the technical field of LED packaging, and provides a packaging process for a high-stability LED, which comprises the following steps: mounting an LED chip on a packaging carrier; forming an annular limiting glue layer in the circumferential direction of the LED chip in a dispensing manner; the limiting glue layer is subjected to pre-curing treatment, so that the limiting glue layer forms a cross-linking degree gradient in the radial direction, and the cross-linking degree of the area close to the outer side is higher than that of the area close to the inner side; when the inner side of the limiting glue layer is still in a wettable state, filling an area defined by the limiting glue layer with liquid fluorescent glue; after the fluorescent glue is filled, executing interface activation treatment on a contact interface of the limiting glue layer and the fluorescent glue; then the limiting glue layer and the fluorescent glue are jointly cured, so that the limiting glue layer and the fluorescent glue are fused at an interface, and a continuous fluorescent glue layer is formed; by means of the process, effective limiting is achieved in the fluorescent glue filling stage, meanwhile, it is avoided that a distinguishable limiting structure is reserved after packaging is completed, and the continuity and interface reliability of the packaging structure can be improved.
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