RGBWW double-bowl cup LED lamp bead and manufacturing method thereof

Abstract

This application discloses an RGBWW dual-bowl LED chip and its manufacturing method. The RGBWW dual-bowl LED chip includes an LED bracket, an RGB light-emitting component, and a dual-color-temperature white light component. The RGB light-emitting component is disposed in a first bowl; the dual-color-temperature white light component is disposed in a second bowl. The bottom of the second bowl is divided into a first region and a second region by an isolation barrier, where a first and a second white light chip are fixed respectively. The first region is filled with a first phosphor layer flush with the barrier, and a second phosphor layer continuously covers the first phosphor layer and the second white light chip, filling the second bowl. This application, through its unique double-layer phosphor structure and isolation barrier design, allows light of different color temperatures to be fully mixed inside the colloid and at the interface, effectively eliminating the polarization phenomenon of traditional structures, achieving a circular light spot with uniform color distribution, and providing a compact device structure and improved packaging flexibility.

Description

Technical Field

[0001] This application relates to the field of LED lamp bead manufacturing technology, specifically to an RGBWW double-bowl LED lamp bead and its manufacturing method. Background Technology

[0002] In the field of modern intelligent lighting applications, lighting technology has continuously developed and advanced, bringing great convenience and improvement to people's lives and work. As people's demands for lighting quality and effects continue to increase, LED beads capable of mixing multiple colors have become a hot topic in research and application. RGBW LED beads, because they can achieve five-color mixing of red (R), green (G), blue (B), and two different white light temperatures, have been widely used in many fields such as intelligent lighting and landscape lighting.

[0003] In existing technologies, a three-cup support structure is typically used to achieve RGBWW five-color mixing. Specifically, two independent cups are coated with different phosphors to achieve different white light color temperatures, while the RGB chip is encapsulated in a third cup. This structure mechanically separates light sources of different colors, utilizing the characteristics of each cup to excite and control the color and color temperature of the light.

[0004] However, this existing technology has significant drawbacks. Because the warm white and cool white light sources are physically far apart and separated by a mechanical structure, the emitted light is difficult to mix fully, resulting in poor light mixing. Especially when used with secondary optical devices such as lenses, the separation of the light sources often leads to severe polarization—one side is yellowish, the other white—resulting in an imperfectly circular aperture and significantly impacting the visual experience. Furthermore, the difference in light spot size can only be barely eliminated when the LEDs are arranged extremely closely, greatly limiting packaging flexibility. Summary of the Invention

[0005] To address the technical problems in the prior art, this application provides an RGBWW double-bowl LED bead and its manufacturing method.

[0006] The technical solution adopted in this application for an RGBWW double-bowl LED bead and its manufacturing method is as follows:

[0007] An RGBWW dual-bowl LED light bead, comprising:

[0008] An LED bracket, on which a first bowl and a second bowl are mounted;

[0009] An RGB lighting component is disposed inside the first bowl-shaped cup;

[0010] A dual-color temperature white light component is installed inside the second bowl.

[0011] The second bowl / cup has an isolation barrier at its bottom, the height of which is less than the overall depth of the second bowl / cup, dividing the bottom area of ​​the second bowl / cup into a first area and a second area. The dual-color temperature white light component includes a first white light chip, a second white light chip, a first fluorescent adhesive layer, and a second fluorescent adhesive layer. The first white light chip is fixed in the first area; the second white light chip is fixed in the second area; the first fluorescent adhesive layer fills the first area and covers the first white light chip, with the top surface of the first fluorescent adhesive layer flush with the top surface of the isolation barrier; the second fluorescent adhesive layer continuously covers the first fluorescent adhesive layer inside the second bowl / cup and the second white light chip in the second area.

[0012] In some embodiments, the color temperature of the first fluorescent adhesive layer after excitation is lower than the color temperature of the second fluorescent adhesive layer after excitation.

[0013] In some embodiments, the first fluorescent adhesive layer is a warm white fluorescent adhesive, and the second fluorescent adhesive layer is a neutral white fluorescent adhesive; the light emitted by the first white light chip passes through the first fluorescent adhesive layer and the second fluorescent adhesive layer in sequence and presents a first color temperature; the light emitted by the second white light chip passes through the second fluorescent adhesive layer and presents a second color temperature; wherein, the first color temperature is lower than the second color temperature.

[0014] In some embodiments, the second fluorescent adhesive layer fills the second bowl, and the top surface of the second fluorescent adhesive layer is flush with the top surface of the LED bracket.

[0015] In some embodiments, the RGB light-emitting component includes a red light chip, a green light chip, and a blue light chip, and the first bowl is filled with transparent encapsulating adhesive, which covers the red light chip, the green light chip, and the blue light chip.

[0016] In some embodiments, the light emitted by the first white light chip and the light emitted by the second white light chip are mixed within and after exiting the second phosphor layer to form a circular light spot with uniform color distribution.

[0017] This application also provides a method for manufacturing RGBWW double-bowl LED beads, which includes the following steps:

[0018] Provide an LED stand with a first bowl and a second bowl, wherein the second bowl has an insulating barrier inside that is lower than the depth of the stand;

[0019] The RGB chip is die-bonded in the first bowl, and the first white light chip and the second white light chip are die-bonded on both sides of the isolation barrier in the second bowl, and the wire bonding is completed.

[0020] The first fluorescent adhesive is applied to one side of the first white light chip in the second bowl, and the amount of the first fluorescent adhesive is controlled so that the height of the first fluorescent adhesive after curing is level with the isolation barrier.

[0021] A second fluorescent adhesive is applied into the second bowl, so that the second fluorescent adhesive covers the cured first fluorescent adhesive and the second white light chip, and fills the entire second bowl.

[0022] Apply transparent sealing glue to the first bowl.

[0023] In some embodiments, the color temperature setting value of the first fluorescent adhesive is lower than that of the second fluorescent adhesive; and by controlling the thickness ratio of the first fluorescent adhesive (33) to the second fluorescent adhesive (34), the emitted color temperature of the area where the first white light chip (31) is located after two layers of fluorescent adhesive are superimposed is between 2700K and 3500K.

[0024] In some embodiments, the color temperature setting value of the first fluorescent adhesive The color temperature setting value of the second fluorescent adhesive The following quantitative relationship is satisfied:

[0025]

[0026] Among them, the color temperature setting value of the first fluorescent adhesive The range is The color temperature setting value of the second fluorescent adhesive The range is .

[0027] In some embodiments, the specific quantitative relationship between the ratio of the first fluorescent adhesive to the second fluorescent adhesive is achieved by controlling the thickness ratio of the fluorescent adhesive layers, satisfying the following formula:

[0028]

[0029] in, This is the preset warm white light color temperature requirement; The intrinsic color temperature when the first phosphor layer is excited alone; The intrinsic color temperature when the second fluorescent adhesive layer is excited alone; The thickness of the first fluorescent adhesive layer The corresponding first weighting coefficient; The thickness of the second fluorescent adhesive layer The corresponding second weighting coefficient; The thickness is a correction constant for the color shift caused by scattering at the interface of the bilayer colloidal layer; the thickness satisfies .

[0030] In summary, this application includes at least one of the following beneficial technical effects:

[0031] 1. The RGBWW dual-bowl LED lamp bead of this embodiment, through the special dual-bowl structure and dual-color temperature white light component design, abandons the traditional three-bowl independent cup design and adopts a "single cup double layer" structure. In the second bowl, the bottom area is divided into two areas by an isolation barrier, and the first white light chip and the second white light chip are set in the two areas respectively, and different fluorescent adhesive layers are used to cover them. This design allows the light of different color temperatures to be fully mixed inside the adhesive and at the interface, eliminating the polarization phenomenon and making the light spot more rounded.

[0032] 2. The use of a double-cup design instead of a triple-cup design reduces the packaging volume and makes the structure more compact;

[0033] 3. The manufacturing method of this embodiment, through precise control of each step and the parameters of the fluorescent adhesive, can produce RGBWW dual-cup LED beads with excellent light mixing effect. By reasonably setting the color temperature difference and thickness ratio of the first fluorescent adhesive 33 and the second fluorescent adhesive 34, and using a quantitative formula for proportioning adjustment, warm white light that meets the preset requirements can be modulated, and the light spot quality is optimal. This manufacturing method can solve the problems of uneven white light mixing and easy polarization in the prior art, thus improving the quality and performance of the product. Attached Figure Description

[0034] Figure 1 This is a top view of an RGBWW dual-bowl LED bead provided in one embodiment of this application;

[0035] Figure 2 yes Figure 1 A cross-sectional structural diagram along the AA direction (showing the dispensing status of the first region);

[0036] Figure 3 yes Figure 1 A cross-sectional structural diagram along the BB direction (showing the second region and the overall dispensing status);

[0037] Explanation of reference numerals in the attached drawings: 1. LED bracket; 11. First bowl / cup; 12. Second bowl / cup; 121. First area; 122. Second area; 13. Isolation barrier; 2. RGB light-emitting component; 21. Red light chip; 22. Green light chip; 23. Blue light chip; 24. Transparent encapsulating adhesive; 3. Dual-color temperature white light component; 31. First white light chip; 32. Second white light chip; 33. First fluorescent adhesive layer; 34. Second fluorescent adhesive layer; 4. Wire. Detailed Implementation

[0038] The technical solutions in the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. The described embodiments are only possible technical implementations of the present invention, but are not limited thereto. Other embodiments obtained by those skilled in the art in conjunction with the embodiments of the present invention without creative effort are also within the protection scope of the present invention.

[0039] This application mainly adopts a double-bowl cup structure and a secondary dispensing process to achieve five-color mixing, which achieves the effects of eliminating polarization, making the light spot round and the structure compact. The following is a further detailed description of this application.

[0040] Example 1

[0041] Please refer to Figures 1-3 The RGBWW dual-bowl LED lamp provided in this application embodiment includes an LED bracket 1, an RGB light-emitting component 2, and a dual-color-temperature white light component 3. The LED bracket 1 is provided with a first bowl 11 and a second bowl 12. The RGB light-emitting component 2 is disposed within the first bowl 11, and the dual-color-temperature white light component 3 is disposed within the second bowl 12. This layout allows for the rational distribution of different colored light sources in their respective areas, laying the foundation for subsequent light mixing effects. An isolation barrier 13 at the bottom of the second bowl 12 divides its bottom area into a first region 121 and a second region 122. The isolation barrier 13 and the LED bracket 1 are integrally injection-molded structures, and the isolation barrier 13 spans the bottom of the second bowl 12. This achieves a partitioned arrangement of the dual-color-temperature white light component 3, facilitating the independent excitation and initial mixing of light of different color temperatures, thereby achieving a better light mixing effect.

[0042] In this embodiment, the integrally injection-molded isolation barrier 13 not only enhances the structural strength of the support but also defines two independent phosphor coating areas in physical space. The barrier spans the bottom, ensuring that the warm white fluorescent adhesive is strictly confined within the first area 121 during the first dispensing step and does not overflow into the second area 122, providing the necessary structural foundation for subsequent realization of "double-layer + single-layer" differentiated spectral excitation.

[0043] Specifically, the RGB light-emitting component 2 includes a red light chip 21, a green light chip 22, and a blue light chip 23. These chips are the core components for realizing the emission of red, green, and blue light. The red light chip 21 is typically made of a semiconductor material that emits red light of a specific wavelength. It is generally a small square or rectangular chip, fixed inside the first cup 11 by conductive silver paste or similar methods. The green light chip 22 and the blue light chip 23 are similar; they each have unique spectral characteristics to ensure the emission of pure green and blue light. The first cup 11 is filled with a transparent encapsulating adhesive 24, which can be made of materials with high light transmittance and stability, such as silicone. It covers the red light chip 21, green light chip 22, and blue light chip 23, protecting the chips from external environmental influences while ensuring smooth light emission. The transparent encapsulating adhesive 24 adheres tightly to the chips, ensuring that light does not undergo excessive refraction and scattering during propagation, thus guaranteeing the normal emission of the three RGB colors.

[0044] In this embodiment, the RGB light-emitting component 2 is independently disposed within the first cup 11 and filled with transparent encapsulating adhesive 24. This design allows RGB light to be emitted directly without undergoing phosphor conversion. During operation, by independently controlling the current of the red, green, and blue chips, and utilizing the principle of three-primary-color mixing, a myriad of colored lights can be mixed. Separating the white light component from the white light component prevents the phosphor in the white light area from absorbing or scattering RGB light, thus ensuring the color gamut, color saturation, and light emission efficiency in color mode.

[0045] Specifically, the dual-color-temperature white light component 3 includes a first white light chip 31, a second white light chip 32, a first phosphor layer 33, and a second phosphor layer 34. The first white light chip 31 is fixed within the first region 121. It is generally a blue LED chip that produces white light by combining with specific phosphors. The first white light chip 31 is electrically connected to the LED bracket 1 via wires 4 (such as gold wires) to form an independent control circuit, allowing for individual control of its light emission state. The second white light chip 32 is fixed within the second region 122. It is also a blue LED chip and is electrically connected to the LED bracket 1 via wires 4, forming an independent control circuit for independent control. The first phosphor layer 33 fills the first region 121 and covers the first white light chip 31, with its top surface flush with the top surface of the isolation barrier 13. The first phosphor layer 33 is a warm white phosphor, composed of a mixture of phosphors and colloids. The type and concentration of the phosphors determine its color temperature after excitation. When the blue light emitted by the first white light chip 31 illuminates the first phosphor layer 33, the phosphor is excited and emits a warm white light. The second phosphor layer 34 continuously covers the first phosphor layer 33 within the second cup 12 and the second white light chip 32 in the second region 122, filling the second cup 12 completely, with its top surface flush with the top surface of the LED bracket 1. The second phosphor layer 34 is a pure white phosphor, also composed of phosphor and colloid, and its color temperature after excitation is higher than that of the first phosphor layer 33. When the blue light emitted by the second white light chip 32 illuminates the second phosphor layer 34, it emits pure white light. The light emitted by the first white light chip 31 passes through the first phosphor layer 33 and the second phosphor layer 34 sequentially, exhibiting a first color temperature; the light emitted by the second white light chip 32 passes through the second phosphor layer 34, exhibiting a second color temperature, and the first color temperature is lower than the second color temperature. The light emitted by the first white light chip 31 and the light emitted by the second white light chip 32 mix within and after exiting the second fluorescent adhesive layer 34, forming a circular light spot with uniform color distribution. This is because the outermost layer is the second fluorescent adhesive layer 34, and the two parts of the light are scattered and fused inside the adhesive and at the interface, resulting in a uniform color distribution of the final emitted light spot and eliminating the "yellow-white separation" phenomenon.

[0046] Working process and technical effects: When lit, if the second white light chip 32 is lit alone, the blue light excites the upper layer of pure white fluorescent adhesive, emitting pure white light; if the first white light chip 31 is lit alone, the blue light is first excited by the bottom layer of warm white fluorescent adhesive, converting into warm light. This warm light then penetrates the upper layer of pure white fluorescent adhesive again for secondary scattering and mixing, ultimately presenting the set warm white light. Because the entire light-emitting surface of the second cup 12 is uniformly covered by the second fluorescent adhesive layer 34, the light-emitting medium is continuous and consistent on the surface for both warm white and pure white light. This structure allows the two beams of light to undergo sufficient physical fusion within the adhesive before exiting the support, eliminating the obvious physical boundary caused by the traditional left-right cup structure. Therefore, when adding secondary optical devices such as lenses, there will be no polarization phenomenon of "one side being yellowish and the other side being white" due to the separation of light source positions; the light spot presents a perfect circle with excellent color uniformity.

[0047] The implementation principle of this embodiment is as follows: The RGBWW dual-cup LED lamp beads of this embodiment, through a special dual-cup structure and the design of the dual-color-temperature white light component 3, abandon the traditional three-cup independent design and adopt a "single-cup double-layer" structure. Within the second cup 12, the bottom area is divided into two regions by an isolation barrier 13, where a first white light chip 31 and a second white light chip 32 are respectively placed and covered with different phosphor layers. This design allows light of different color temperatures to mix fully within the colloid and at the interface, eliminating polarization and resulting in a more rounded light spot. Simultaneously, using a dual-cup instead of a three-cup reduces the packaging volume and makes the structure more compact.

[0048] Example 2

[0049] Please refer to Figures 1-3 The manufacturing method of RGBWW dual-bowl LED beads provided in this application includes the following steps:

[0050] S1, an LED bracket 1 is provided, comprising a first bowl 11 and a second bowl 12. The second bowl 12 has an internal partition wall 13 whose height is less than the depth of the bracket. The partition wall 13 and the LED bracket 1 are integrally injection molded, and the partition wall 13 spans the bottom of the second bowl 12. The LED bracket 1 can be made of materials such as PPA and manufactured through injection molding or other processes. During manufacturing, it is essential to ensure that the dimensions and shapes of the first bowl 11 and the second bowl 12 meet the design requirements, and the height and position of the partition wall 13 must also be precisely controlled.

[0051] S2, the RGB chip is die-bonded inside the first cup 11, and the first white LED chip 31 and the second white LED chip 32 are die-bonded on both sides of the isolation barrier 13 of the second cup 12, and wire bonding is completed. During die bonding, conductive silver paste is used to fix the chip in the designated position inside the cup, ensuring that the chip position is accurate. During wire bonding, gold wire or other conductors 4 are used to connect the chip to the pins of the LED bracket 1 to form an independent control circuit, ensuring that the chip can work normally.

[0052] S3, in the second cup 12, apply the first fluorescent adhesive 33 to one side of the first white light chip 31, controlling the amount of the first fluorescent adhesive 33 injected so that the height of the cured first fluorescent adhesive 33 is level with the isolation barrier 13. During application, the application pressure and time must be precisely controlled so that the height of the adhesive after natural leveling is exactly level with the top of the isolation barrier 13. The first fluorescent adhesive 33 is a warm white fluorescent adhesive, and its color temperature setting value is lower than that of the second fluorescent adhesive.

[0053] S4, apply the second fluorescent adhesive 34 into the second cup 12, so that the second fluorescent adhesive 34 covers the cured first fluorescent adhesive 33 and the second white light chip 32, and fills the entire second cup 12 (i.e., fills the encapsulation area of ​​the second cup 12). After the first layer of adhesive has initially solidified, apply the second layer of adhesive, the second fluorescent adhesive 34 being pure white fluorescent adhesive, filling it to be flush with the top surface of the bracket.

[0054] S5, apply transparent encapsulating adhesive 24 into the first bowl 11. The transparent encapsulating adhesive 24 can be made of materials such as silicone, and covers the red light chip 21, green light chip 22 and blue light chip 23 to protect the chips and ensure that the light is emitted smoothly.

[0055] During the manufacturing process, the color temperature setting value of the first fluorescent adhesive 33 Color temperature setting value of the second fluorescent adhesive 34 The following quantitative relationship is satisfied: Among them, the color temperature setting value of the first fluorescent adhesive 33 The range is The color temperature setting value of the second fluorescent adhesive 34 The range is .

[0056] The specific quantitative relationship between the ratio of the first fluorescent adhesive 33 and the second fluorescent adhesive 34 is achieved by controlling the thickness ratio of the fluorescent adhesive layers, satisfying the following formula: ,in: This is the preset warm white light color temperature requirement; The intrinsic color temperature when the first fluorescent adhesive layer 33 is excited alone; The intrinsic color temperature when the second fluorescent adhesive layer 34 is excited alone; The first fluorescent adhesive layer is 33mm thick. The corresponding first weighting coefficient; The second fluorescent adhesive layer is 34 mm thick. The corresponding second weighting coefficient; The thickness is a correction constant for the color shift caused by scattering at the interface of the bilayer colloidal layer; the thickness satisfies .

[0057] To verify the rationality of the above formula and parameter range, multiple sets of experiments were conducted. Please refer to Table 1; the experimental data shows that when the thickness ratio of the first fluorescent adhesive layer 33 to the second fluorescent adhesive layer 34 (… When the color temperature is controlled between 0.3 and 0.8, the color temperature compliance rate of warm white light and the overall luminous efficacy can be most effectively balanced. Specifically, when At times, the base layer of warm-colored adhesive was too thin, resulting in a final finish that was too cool, making it difficult to achieve the intended warm white effect; when When the bottom layer of warm-colored adhesive is too thick, it leads to significant light transmission loss, reduced luminous flux, and a tendency for yellow rings to appear at the edges of the mixed light spot. Only within the preferred range of 0.3 to 0.8 does the superposition of the two layers of adhesive achieve the best light mixing effect, resulting in a rounded light spot with minimal color difference.

[0058] Table 1: Experimental Records of Light Mixing Effects at Different Thickness Ratios

[0059] experimental group CCT1 CCT2 thickness ratio h1 / h2 Final W1 color temperature Results of light spot observation in conclusion Control group 1 2400K 6000K 0.1 5200K Too white, does not meet the requirements for warm white. Too low thickness ratio Example A 2400K 6000K 0.4 3000K The light spot is round and smooth with no color difference. Meets requirements Example B 2400K 6000K 0.6 2700K The light spot is round and the color is uniform. Meets requirements Control group 2 2400K 6000K 1.0 2300K It has a yellowish tint and a significant loss of brightness. Thickness than

[0060] The implementation principle of this embodiment is as follows: By precisely controlling the parameters of each step and the fluorescent adhesive, the manufacturing method of this embodiment can produce RGBWW dual-cup LED beads with good light mixing effect. By reasonably setting the color temperature difference and thickness ratio of the first fluorescent adhesive 33 and the second fluorescent adhesive 34, and using a quantitative formula for proportioning adjustment, warm white light that meets the preset requirements can be modulated, and the light spot quality is optimal. This manufacturing method can solve the problems of uneven white light mixing and easy polarization in the prior art, thus improving the quality and performance of the product.

[0061] The specific embodiments described above do not constitute a limitation on the scope of protection of this application. Any other corresponding changes and modifications made based on the technical concept of this application should be included within the scope of protection of this application.

Claims

1. An RGBWW double-bowl LED light bead, characterized in that, include: LED bracket (1), on which a first bowl (11) and a second bowl (12) are provided; An RGB light-emitting component (2) is disposed inside the first bowl (11); A dual-color temperature white light component (3) is disposed inside the second bowl (12); The bottom of the second bowl (12) is provided with an isolation barrier (13), the height of which is less than the overall depth of the second bowl (12), dividing the bottom area of ​​the second bowl (12) into a first area (121) and a second area (122); the dual-color temperature white light component (3) includes a first white light chip (31), a second white light chip (32), a first fluorescent adhesive layer (33) and a second fluorescent adhesive layer (34), the first white light chip (31) being fixed in the first area. Within the domain (121); the second white light chip (32) is fixed within the second region (122); the first fluorescent adhesive layer (33) fills the first region (121) and covers the first white light chip (31), the top surface of the first fluorescent adhesive layer (33) is flush with the top surface of the isolation barrier (13); the second fluorescent adhesive layer (34) continuously covers the first fluorescent adhesive layer (33) in the second bowl (12) and the second white light chip (32) in the second region (122).

2. The RGBWW double-bowl LED bead according to claim 1, characterized in that, The color temperature of the first fluorescent adhesive layer (33) after excitation is lower than that of the second fluorescent adhesive layer (34) after excitation.

3. The RGBWW double-bowl LED bead according to claim 2, characterized in that, The first fluorescent adhesive layer (33) is a warm white fluorescent adhesive, and the second fluorescent adhesive layer (34) is a neutral white fluorescent adhesive; the light emitted by the first white light chip (31) passes through the first fluorescent adhesive layer (33) and the second fluorescent adhesive layer (34) in sequence and presents a first color temperature; the light emitted by the second white light chip (32) passes through the second fluorescent adhesive layer (34) and presents a second color temperature; wherein, the first color temperature is lower than the second color temperature.

4. The RGBWW double-bowl LED bead according to claim 1, characterized in that, The second fluorescent adhesive layer (34) fills the second bowl (12), and the top surface of the second fluorescent adhesive layer (34) is flush with the top surface of the LED bracket (1).

5. The RGBWW double-bowl LED bead according to claim 1, characterized in that, The RGB light-emitting component (2) includes a red light chip (21), a green light chip (22) and a blue light chip (23). The first bowl (11) is filled with transparent encapsulant (24), which covers the red light chip (21), the green light chip (22) and the blue light chip (23).

6. The RGBWW double-bowl LED bead according to claim 1, characterized in that, The light emitted by the first white light chip (31) and the light emitted by the second white light chip (32) are mixed in the second fluorescent adhesive layer (34) and after exiting the second fluorescent adhesive layer (34).

7. A method for manufacturing an RGBWW double-bowl LED bead, used to manufacture the RGBWW double-bowl LED bead as described in any one of claims 1-6, characterized in that, Includes the following steps: An LED holder (1) is provided with a first bowl (11) and a second bowl (12), wherein the second bowl (12) has an isolation barrier (13) whose height is less than the depth of the holder; In the first bowl (11), the RGB chip is die bonded, and in the second bowl (12), the first white light chip (31) and the second white light chip (32) are die bonded on both sides of the isolation barrier (13), and the wire bonding is completed. In the second bowl (12), the first fluorescent adhesive (33) is applied to one side of the first white light chip (31). The amount of the first fluorescent adhesive (33) is controlled so that the height of the first fluorescent adhesive (33) after curing is level with the isolation barrier (13). A second fluorescent adhesive (34) is applied into the second bowl (12) so that the second fluorescent adhesive (34) covers the cured first fluorescent adhesive (33) and the second white light chip (32) and fills the entire second bowl (12); Apply transparent encapsulating adhesive (24) into the first bowl (11).

8. The manufacturing method of the RGBWW double-bowl LED lamp bead according to claim 7, characterized in that, The color temperature setting value of the first fluorescent adhesive (33) is lower than that of the second fluorescent adhesive (34); and by controlling the thickness ratio of the first fluorescent adhesive (33) to the second fluorescent adhesive (34), the light output color temperature of the area where the first white light chip (31) is located after two layers of fluorescent adhesive are superimposed is between 2700K and 3500K.

9. The manufacturing method of the RGBWW double-bowl LED lamp bead according to claim 7, characterized in that, Color temperature setting value of the first fluorescent adhesive (33) The color temperature setting value of the second fluorescent adhesive (34) The following quantitative relationship is satisfied: ， Among them, the color temperature setting value of the first fluorescent adhesive (33) The range is The color temperature setting value of the second fluorescent adhesive (34) The range is .

10. The manufacturing method of the RGBWW double-bowl LED lamp bead according to claim 8, characterized in that, The specific quantitative relationship between the ratio of the first fluorescent adhesive (33) and the second fluorescent adhesive (34) is achieved by controlling the thickness ratio of the fluorescent adhesive layers, satisfying the following formula: ， in, This is the preset warm white light color temperature requirement; The intrinsic color temperature when the first fluorescent adhesive layer (33) is excited alone; The intrinsic color temperature when the second fluorescent adhesive layer (34) is excited alone; The thickness of the first fluorescent adhesive layer (33) The corresponding first weighting coefficient; The thickness of the second fluorescent adhesive layer (34) The corresponding second weighting coefficient; The thickness is a correction constant for the color shift caused by scattering at the interface of the bilayer colloidal layer; the thickness satisfies .

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