Display screen and manufacturing method thereof

Abstract

The invention provides a display screen and a manufacturing method of the display screen. The display screen comprises a PCB, a plurality of display devices and a mask. Each display device comprises a substrate, a display chip and colloid; the colloid is coated on the display chip and covers above part of the assembly surface; a plurality of through holes are formed in the mask. The colloid of each display device can penetrate through the corresponding through hole, and a gap is formed between the colloids of the adjacent display devices, so that the face mask can enclose the multiple colloids, and the face mask is contained in the gap. According to the display screen and the manufacturing method of the display screen, the mask installation efficiency can be improved, the blank screen effect of the display screen is improved, the contrast ratio of the display screen is improved, and then the display effect of the display screen is improved. In addition, the mask can protect the display device from being collided, and the reliability of the display screen product is improved.

Description

Technical Field

[0001] This invention relates to the field of display screen technology, specifically to a display screen and a method for manufacturing the display screen. Background Technology

[0002] With the development of LED display technology and the increasing demand from users for high-quality display effects, the requirements for high contrast, high reliability, and color consistency of LED devices are becoming increasingly stringent. Especially in the field of high-density, small-pitch LED displays, users have placed higher demands on the clarity of the displayed image, color consistency, and equipment reliability.

[0003] The existing small-pitch LED displays have densely distributed LED beads with small gaps between them. There is not enough space to cover them with a black mask, resulting in low contrast and affecting the display effect. Summary of the Invention

[0004] The purpose of this invention is to solve the technical problems of low contrast and poor display effect of the display screen in related technologies.

[0005] To address the aforementioned technical problems, the present invention provides a display screen, comprising: a PCB board; a plurality of display devices, wherein the plurality of display devices are arranged in an array on the PCB board; each display device includes a substrate, a display chip, and an adhesive, wherein a mounting surface is formed on one side of the substrate, the display chip is mounted on the mounting surface of the substrate and electrically connected to the substrate; the adhesive covers the display chip and is disposed above a portion of the mounting surface; a mask having a plurality of spaced perforations; wherein the adhesive of each display device is capable of passing through the corresponding perforations, a gap is formed between the adhesives of adjacent display devices, the mask is accommodated within the gap and is disposed above the mounting surface.

[0006] In some embodiments, the colloid adjacent to the display device forms a receiving groove with the mounting surface, and the mask is received in the receiving groove.

[0007] In some embodiments, the cross-section of the colloid is adapted to the perforation so that the periphery of the colloid fits tightly against the inner periphery of the perforation.

[0008] In some embodiments, a welding surface is formed on the side of the substrate away from the mounting surface, and a plurality of pads are provided on the welding surface. The plurality of pads are arranged at intervals, and the display device is mounted on the PCB board through the plurality of pads. The welding surface includes a first pad and a second pad, the first pad being located at the corner of the welding surface and the second pad being located at the center of the welding surface.

[0009] A method for manufacturing a display screen, the method comprising the following steps: providing a PCB board, a mask, and a plurality of first display devices; manufacturing a plurality of second display devices using the plurality of first display devices; arranging and mounting the plurality of second display devices in an array on the PCB board, wherein accommodating slots are formed between adjacent second display devices; and placing the mask in the accommodating slots to form the display screen.

[0010] In some embodiments, the first display device includes a substrate, a display chip, and an colloid. A mounting surface is formed on one side of the substrate, the display chip is mounted on the mounting surface of the substrate and electrically connected to the substrate, and the colloid covers the display chip and completely covers the mounting surface.

[0011] In some embodiments, fabricating a plurality of second display devices using a plurality of first display devices includes: ensuring that the colloid covers the display chip, removing the outer portion of the colloid of the first display devices by a process.

[0012] In some embodiments, the receiving groove is a gap formed between the colloids of adjacent second display devices after the second display device array is mounted on the PCB board; the mask has perforations matching the number of second display devices and the cross-sectional shape of their colloids, so that the mask can be mounted in the receiving groove.

[0013] The present invention also provides a method for manufacturing a display screen, the method being used to manufacture a display screen as described in any one of the preceding claims, comprising the following steps: providing a PCB board, a mask, and a plurality of first display devices; arranging and mounting the plurality of first display devices in an array on the PCB board; fabricating a plurality of second display devices from the plurality of first displays on the PCB board, such that accommodating slots are formed between adjacent second display devices on the PCB board; and placing the mask in the accommodating slots to form the display screen.

[0014] In some embodiments, fabricating several second display devices from several first displays on a PCB board includes: ensuring that the colloid covers the display chip, removing the outer portion of the colloid on several first display devices through a process.

[0015] As can be seen from the above technical solution, the present invention has at least the following beneficial effects: This invention provides a display screen and a method for manufacturing the display screen. The display screen includes a PCB board, multiple display devices, and a mask. Each display device includes a substrate, a display chip, and an adhesive. The adhesive covers the display chip and is positioned above a portion of the mounting surface. The mask has multiple perforations. Multiple adhesives can be perforated through the perforations, allowing the mask to enclose the adhesives, with gaps formed between the adhesives, and the mask is accommodated within these gaps. By using perforations on the adhesives to enclose them, and by directly placing the mask between the adhesives, the installation efficiency of the mask is improved. Simultaneously, the mask absorbs stray light emitted by the display chip and prevents interference between the light emitted by the multiple display chips, thereby enhancing the black-out effect and improving the contrast ratio of the display screen, thus improving the display effect. Furthermore, the mask protects the display devices from impacts, improving the reliability of the display product. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a display screen provided by the present invention in one embodiment.

[0017] Figure 2 yes Figure 1 A schematic diagram of the structure of multiple display devices and PCB boards.

[0018] Figure 3 yes Figure 1 A schematic diagram of the structure of the face shield.

[0019] Figure 4 yes Figure 2 A schematic diagram of the structure of a single display device.

[0020] Figure 5 yes Figure 4 A structural diagram from another perspective.

[0021] Figure 6 This is a schematic diagram of the structure of the mask covering the assembly surface.

[0022] Figure 7 This is a schematic diagram of the welding surface of the substrate.

[0023] Figure 8 This is a flowchart of a manufacturing method for a display screen provided in one embodiment of the present invention.

[0024] Figure 9 yes Figure 8 This is a schematic diagram of the fabrication of a second display device using the first display device.

[0025] Figure 10 This is a flowchart of a manufacturing method for a display screen provided in another embodiment of the present invention.

[0026] The reference numerals in the attached figures are explained as follows: 100, display screen; 1, PCB board; 2, display device; 21, substrate; 211, assembly surface; 212, soldering surface; 2121, first solder pad; 2122, second solder pad; 22, display chip; 23, colloid; 24, receiving groove; 3, mask; 31, perforation. Detailed Implementation

[0027] Typical embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various variations in different embodiments without departing from the scope of the present invention, and the descriptions and illustrations herein are for illustrative purposes only and not intended to limit the present invention.

[0028] In the description of this application, it should be understood that, in the embodiments shown in the accompanying drawings, the indications of direction or positional relationships (such as up, down, left, right, front, and back, etc.) are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. These descriptions are appropriate when these elements are in the positions shown in the accompanying drawings. If the description of the positions of these elements changes, these directional indications also change accordingly.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0030] With the development of LED display technology and the increasing demand from users for high-quality display effects, the requirements for high contrast, high reliability, and color consistency of LED devices are becoming increasingly stringent. Especially in the field of high-density, small-pitch LED displays, users have placed higher demands on the clarity of the displayed image, color consistency, and equipment reliability.

[0031] The existing small-pitch LED displays have densely distributed LED beads with small gaps between them. There is not enough space to cover them with a black mask, resulting in low contrast and affecting the display effect.

[0032] Please see Figure 1 , Figure 2 and Figure 3As shown, in some embodiments, the display screen 100 provided by the present invention may include a PCB board 1, display devices 2, and a mask 3. The PCB board 1 is used to carry electronic components and circuits, and the material can be various moldable materials such as resins, fiberglass, aluminum, or aluminum alloys. The display devices 2 can be arranged in an array on the PCB board 1 and electrically connected to the PCB board 1. The display devices 2 are capable of emitting light outwards, and the display devices 2 may have a light-emitting surface, which may be located on the side of the display devices 2 facing away from the PCB board 1. The mask 3 can be placed on the PCB board 1 to improve the contrast of the light emitted by the display devices 2 and improve the display effect of the display screen 100.

[0033] In some embodiments, multiple display devices 2 may be provided. These multiple display devices 2 may be spaced apart on the PCB, and this spaced arrangement maintains good light emission performance and viewing angle uniformity. The multiple display devices 2 and the PCB board 1 together constitute the lamp board of the display screen 100.

[0034] Please see Figure 4 As shown, in some embodiments, the display device 2 may include a substrate 21, a display chip 22, and a colloid 23.

[0035] In some embodiments, the substrate 21 may include a mounting surface 211 and a welding surface 212 disposed opposite to each other. The mounting surface 211 and the welding surface 212 are disposed on opposite sides of the substrate 21, the mounting surface 211 may be represented as the upper surface of the substrate 21, and the welding surface 212 may be represented as the lower surface of the substrate 21.

[0036] In some embodiments, the display chip 22 may be mounted on the mounting surface 211 of the substrate 21. Multiple display chips 22 may be disposed on the mounting surface 211 of the substrate 21. An array of multiple display chips 22 is arranged on the mounting surface 211 of the substrate 21 and electrically connected to the substrate 21. The display chip 22 is capable of emitting light outwards.

[0037] In some embodiments, each substrate 21 may have a display chip 22. The display chip 22 may be an RGB chip. An RGB chip may consist of three color channels: R (red), G (green), and B (blue).

[0038] It should be noted that in some other embodiments, each substrate 21 may be provided with multiple display chips 22, which are connected in parallel and can be driven to light up simultaneously by a driving circuit, thereby improving the driving effect.

[0039] In some embodiments, the colloid 23 may be coated onto the display chip 22. The colloid 23 may cover the display chip 22 and be disposed above the mounting surface 211. After curing, the colloid 23 can form a hard and transparent or translucent shell on the surface of the display chip 22. The colloid 23 can provide waterproofing, moisture protection, shockproofing, dustproofing, heat dissipation, and security for the display chip 22.

[0040] In some embodiments, the light emitted by the display chip 22 can be emitted through the colloid 23, thereby forming the light-emitting surface of the display device 2 on the colloid 23.

[0041] In the prior art, multiple display devices 2 are mounted on a PCB board 1, and the multiple display devices 2 are arranged at intervals, with gaps between the multiple display devices 2. Because the existing display devices 2 are densely distributed, the gaps between the colloids 23 are relatively small, resulting in insufficient space for the mask 3 to be installed.

[0042] Please see Figures 1 to 4 As shown, in some embodiments, the colloid 23 can be applied to a portion of the mounting surface 211, and gaps can be formed between multiple colloids 23. The width of the gap is greater than the width of the existing spacing between multiple display devices 2. This allows the mask 3 to be accommodated within the gap, and consequently, allows the mask 3 to be arranged around the colloid 23.

[0043] In some embodiments, the mask 3 may have a plurality of spaced-apart perforations 31. Multiple adhesives 23 can pass through the perforations 31 respectively, allowing the mask 3 to enclose the multiple adhesives 23. The mask 3 can be directly placed between the multiple adhesives 23, thereby improving the installation efficiency of the mask 3. Simultaneously, the mask 3 can absorb stray light emitted by the display chip 22 and prevent interference between the light emitted by multiple display chips 22, thereby enhancing the black-screen effect of the display 100 and improving the contrast of the display 100, thus improving the display effect of the display 100. In addition, the mask 3 can also protect the display device 2 from impacts, improving the reliability of the display 100.

[0044] In some embodiments, the face mask 3 can be a one-piece molded structure. The one-piece molded face mask 3 can be directly placed between multiple colloids 23, thereby reducing installation steps and improving installation efficiency.

[0045] Please see Figure 4 and Figure 5As shown, in some embodiments, the colloid 23 can be applied to the middle of the assembly surface 211, and a receiving groove 24 is formed between the periphery of the colloid 23 and the assembly surface 211. The mask 3 can be received in the receiving groove 24, so that the mask 3 can be applied to the assembly surface 211, and the space formed between each periphery of the colloid 23 and the assembly surface 211 is the same.

[0046] Please see Figure 6 As shown, in some embodiments, the height of the mask 3 is the same as the height of the colloid 23. Therefore, when the mask 3 is disposed around the periphery of the colloid 23, the upper surface of the mask 3 can be flush with the upper surface of the colloid 23, allowing the mask 3 to absorb light reflected peripherally from the display chip 22, and causing the light emitted by the display chip 22 to be emitted from the upper surface of the colloid 23, thereby improving the contrast of the display screen 100 and enhancing its display effect.

[0047] In some embodiments, the cross-section of the colloid 23 is adapted to the perforation 31. Thus, when the mask 3 is wrapped around the periphery of the colloid 23, the periphery of the colloid 23 can adhere to the inner wall of the periphery of the perforation 31, thereby improving the stability of the mask 3 surrounding the periphery of the plurality of colloids 23.

[0048] Please see Figure 7 As shown, in some embodiments, solder pads may be provided on the soldering surface 212. Multiple solder pads may be provided, and these pads may be spaced apart. The multiple solder pads can be soldered onto the PCB board 1 using solder paste. The display device 2 can be mounted onto the PCB board 1 via the multiple solder pads. The substrate 21 can be electrically connected to the PCB board 1 via the multiple solder pads.

[0049] In some embodiments, the soldering surface 212 may include first solder pads 2121 and second solder pads 2122. Multiple first solder pads 2121 may be provided, and these pads may be located at the corners of the soldering surface 212. Second solder pads 2122 may be located in the center of the soldering surface 212. Specifically, four first solder pads 2121 may be provided, the soldering surface 212 is square, and the four first solder pads 2121 are located at the four corners of the soldering surface 212. The second solder pads 2122 are circular and located in the center of the soldering surface 212. Therefore, by setting the first solder pad 2121 and the second solder pad 2122, the soldering area between the substrate 21 soldering surface 212 and the PCB board 1 can be increased, thereby increasing the adhesion between the substrate 21 and the PCB board 1. This avoids insufficient thrust between the display device 2 and the PCB board 1, thus preventing the display device 2 from detaching from the PCB board 1 due to uneven force or insufficient thrust when the display screen 100 is subjected to external impact during installation, transportation, or daily use, which could lead to dark spots or dead pixels on the display screen 100. At the same time, when the display screen 100 is working, the heat generated by the display device 2 emitting light can be conducted away more quickly through multiple solder pads, thereby reducing the temperature of the light-emitting surface of the display device 2, improving the color deviation problem of bluish or reddish light emission, and making the color consistency of the LED display screen 100 better.

[0050] Please see Figure 8 and Figure 9 As shown, in some embodiments, the present invention also provides a method for manufacturing a display screen 100, specifically including the following steps: S1: Provides PCB board 1, mask 3 and several first display devices; S2: Fabricate a plurality of second display devices using a plurality of the first display devices; S3: Arrange and mount a plurality of second display devices in an array on the PCB board 1, with a receiving slot 24 formed between adjacent second display devices; S4: The mask 3 is placed in the receiving groove 24 to form the display screen 100.

[0051] Please see Figure 8 and Figure 9 As shown, in some embodiments, the first display device can be an existing display device 2. The first display device includes a substrate 21, a display chip 22, and an colloid 23. A mounting surface 211 is formed on one side of the substrate 21. The display chip 22 is mounted on the mounting surface of the substrate 21 and is electrically connected to the substrate 21. The colloid 23 covers the display chip 22 and completely covers the mounting surface 211.

[0052] In some embodiments, when installing the encapsulating colloid 23, the colloid 23 is sealed onto the mounting surface 211 of a portion of the substrate 21. This allows the first display device to be fabricated as a second display device, forming a receiving groove 24 between the colloid 23 and the mounting surface 211. This reduces the space required for the mask 3 to be installed through the receiving groove 24, allowing the mask 3 to be installed among multiple colloids 23. The mask 3 absorbs stray light emitted by the display chip 22 and prevents interference between light emitted from multiple display chips 22, thereby improving the black-screen effect of the display 100 and enhancing its contrast, thus improving the display effect of the display 100. Furthermore, the mask 3 also protects the display device 2 from impacts, improving the reliability of the display 100.

[0053] In some embodiments, when the colloid 23 is sealed onto the substrate 21, the colloid 23 is sealed onto the mounting surfaces 211 of all substrates 21. The fabrication of several second display devices from several first display devices includes processing the colloid 23 of a single first display device using a cold processing method with ultraviolet laser ablation. This process removes the outer portion of the colloid 23, creating a receiving groove 24 between adjacent second display devices, thereby reducing the space required for mounting the mask 3 through the receiving groove 24. The ultraviolet laser ablation process precisely removes the outer portion of the colloid 23 without contact or thermal damage, resulting in excellent edge perpendicularity and roughness. In this ultraviolet laser ablation process, the laser power is controlled between 1W and 5W, the scanning speed is 50mm / s to 200mm / s, the focused spot is less than 50μm, and a visual alignment system is used.

[0054] It should be noted that in some other embodiments, the outer periphery of the colloid 23 can also be removed using a plasma etching process. In this process, the oxygen plasma power is 50W-200W, the vacuum degree is 1Pa-5Pa, and the etching time can be adjusted according to the thickness of the colloid 23. The plasma etching process is suitable for scenarios with high environmental protection requirements and where the colloid 23 has a uniform thickness.

[0055] It should also be noted that in some other embodiments, the colloid 23 can also be manufactured using CNC precision cutting technology. CNC milling is low-cost and highly efficient, and can be used for large-scale mass production. Combined with vacuum adsorption and vision positioning, CNC milling can prevent LED displacement and edge chipping.

[0056] Please see Figure 10 As shown, according to other embodiments of the present invention, the present invention also provides a method for manufacturing a display screen 100, specifically including the following steps: S1: Provides PCB board 1, mask 3 and several first display devices; S2: Arrange and mount a plurality of first display device arrays on the PCB board 1; S3: Several first displays on PCB board 1 are fabricated into several second display devices, so that a receiving groove 24 is formed between adjacent second displays on PCB board 1. S4: Place the mask 3 in the receiving groove 24 to form the display screen 100.

[0057] In this embodiment, when the colloid 23 is sealed onto the substrate 21, the colloid 23 is sealed onto the mounting surface 211 of the entire substrate 21, thereby forming a first display device. After the first display device is fabricated, it is soldered onto the PCB board 1. Then, several second display devices are fabricated from the several first display devices mounted on the PCB board 1, so that a receiving groove 24 is formed between adjacent second display devices on the PCB board 1, thereby allowing the mask 2 to be disposed within the receiving groove 24 to form a display screen 100.

[0058] In some embodiments, when several first displays on PCB board 1 are used to fabricate several second display devices, a UV laser ablation process is employed to remove the outer portions of the adhesive 23 of the several first display devices on PCB board 1. This creates a receiving groove 24 between the adhesive 23 and the mounting surface 211, thereby providing mounting space for the mask 3. By utilizing the UV laser ablation process, the outer portions of the adhesive 23 can be precisely removed without contact or thermal damage, resulting in excellent edge perpendicularity and roughness.

[0059] It should be noted that in some other embodiments, the periphery of the colloid 23 can also be removed by plasma etching process.

[0060] It should also be noted that in some other embodiments, the colloid 23 may also be produced using CNC precision cutting technology.

[0061] As can be seen from the above technical solution, the present invention has at least the following beneficial effects: This invention provides a display screen 100 and a method for manufacturing the display screen 100. The display screen 100 includes a PCB board 1, multiple display devices 2, and a mask 3. Each display device 2 includes a substrate 21, a display chip 22, and an adhesive 23. The adhesive 23 covers the display chip 22 and is disposed above a portion of the mounting surface 211. Each display device 2's adhesive 23 can be perforated with corresponding perforations 31, and gaps are formed between the adhesive 23 of adjacent display devices 2, with the mask 3 housed within the gaps. By using multiple adhesive 23s perforated with multiple perforations 31, the mask 3 can enclose the multiple adhesive 23s, and the mask 3 can be directly disposed between the multiple adhesive 23s, thereby improving the installation efficiency of the mask 3. At the same time, the mask 3 can absorb stray light emitted by the display chip 22 and prevent mutual interference between the light emitted by the multiple display chips 22, thereby increasing the black screen effect of the display screen 100 and improving the contrast of the display screen 100, thus improving the display effect of the display screen 100. In addition, the mask 3 can also protect the display device 2 from bumps and knocks, and improve the reliability of the display screen 100.

[0062] Although the invention has been described with reference to several typical embodiments, it should be understood that the terminology used is illustrative and exemplary, and not restrictive. Since the invention can be embodied in many forms without departing from the spirit or essence of the invention, it should be understood that the above embodiments are not limited to any of the foregoing details, but should be interpreted broadly within the spirit and scope defined by the appended claims. Therefore, all variations and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.

Claims

1. A display screen, characterized in that, include: PCB board; Multiple display devices are arranged in an array on the PCB board; each display device includes a substrate, a display chip, and an adhesive; a mounting surface is formed on one side of the substrate; the display chip is mounted on the mounting surface of the substrate and electrically connected to the substrate; the adhesive covers the display chip and is disposed above a portion of the mounting surface. A face mask having multiple spaced-apart perforations. In this embodiment, the colloid of each display device is provided with corresponding perforations, and a gap is formed between the colloids of adjacent display devices. The mask is accommodated in the gap and covers the top of the assembly surface.

2. The display screen according to claim 1, characterized in that, The colloid adjacent to the display device forms a receiving groove with the mounting surface, and the mask is received in the receiving groove.

3. The display screen according to claim 1, characterized in that, The cross-section of the colloid is adapted to the perforation so that the periphery of the colloid fits tightly against the inner periphery of the perforation.

4. The display screen according to claim 1, characterized in that, A welding surface is formed on the side of the substrate away from the mounting surface. A plurality of pads are provided on the welding surface, and the plurality of pads are arranged at intervals. The display device is mounted on the PCB board through the plurality of pads. The welding surface includes a first pad and a second pad, the first pad being located at a corner of the welding surface and the second pad being located in the middle of the welding surface.

5. A method for manufacturing a display screen, characterized in that, The method for manufacturing the display screen is for manufacturing a display screen as described in any one of claims 1-4, comprising the following steps: Provide PCB boards, face masks, and several primary display devices; Several second display devices are fabricated using several of the first display devices; A plurality of second display devices are arranged and mounted on the PCB board, and a receiving slot is formed between adjacent second display devices; The mask is placed in the receiving groove to form the display screen.

6. The method for manufacturing a display screen according to claim 5, characterized in that: The first display device includes a substrate, a display chip, and an colloid. A mounting surface is formed on one side of the substrate. The display chip is mounted on the mounting surface of the substrate and is electrically connected to the substrate. The colloid covers the display chip and completely covers the mounting surface.

7. The method for manufacturing a display screen according to claim 5, characterized in that: Fabricating a plurality of second display devices using a plurality of first display devices includes: ensuring that the colloid covers the display chip, and removing the outer portion of the colloid of the first display devices by means of a process.

8. The method for manufacturing a display screen according to claim 5, characterized in that: The receiving groove is the gap formed between the colloids of adjacent second display devices after the second display device array is mounted on the PCB board; The mask has perforations that match the number of the second display devices and the cross-sectional shape of the colloid, so that the mask can be installed in the receiving groove.

9. A method for manufacturing a display screen, characterized in that, The method for manufacturing the display screen is for manufacturing a display screen as described in any one of claims 1-4, comprising the following steps: Provide PCB boards, face masks, and several primary display devices; A plurality of first display device arrays are arranged and mounted on the PCB board; Several first displays on a PCB board are fabricated into several second display devices, such that accommodating slots are formed between adjacent second display devices on the PCB board. The mask is placed in the receiving groove to form the display screen.

10. The method for manufacturing a display screen according to claim 9, characterized in that: Fabricating several second display devices from several first displays on a PCB board includes: ensuring that the colloid covers the display chip, and removing the outer portion of the colloid on several first display devices through a process.

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