IME laminated cover plate module, preparation method thereof and light source

Abstract

The invention discloses an IME attached cover plate module, a preparation method thereof and a light source, and relates to the technical field of IME. The IME attached cover plate module comprises a substrate provided with a light-emitting element; the dam glue layer is coated along the end face, provided with the light-emitting elements, of the substrate and is provided with a glue injection port and an exhaust port; the plastic part is attached to the face, away from the base plate, of the box dam glue layer; a glue pouring area is defined by the substrate, the box dam glue layer and the plastic part, and glue is injected into the glue pouring area through the glue injection opening to form a pouring glue layer; the IME attached cover plate module is prepared in a glue pouring forming mode, and the problems that in traditional IME and cover plate combination, an injection molding process is complex in design and manufacturing, the mold cost is high, multiple forming defects exist, and double-faced adhesive tape attachment is poor in environmental protection property, poor in attachment reliability, tedious in assembly procedure and the like are solved; the heat dissipation efficiency of the whole module is improved while the mechanical performance of the whole module is guaranteed, and it is guaranteed that the module can stably operate for a long time.

Description

Technical Field

[0001] This invention relates to the field of IME technology, specifically to an IME bonding cover module, its preparation method, and a light source. Background Technology

[0002] IME is an advanced manufacturing technology that integrates electronic circuits, touch functions, antennas, etc. into a mold. It can directly set functional conductive and dielectric materials or electronic components on a substrate to form a circuit, and then use processes such as thermoforming and in-mold injection molding to form an integrated component with both structural support and electronic functions.

[0003] Traditionally, the IME (Integrated Circuit) and cover plate are bonded using injection molding and double-sided adhesive. The injection molding process requires consideration of both IME circuit design and manufacturing, as well as injection molding requirements. This involves complex material selection, process parameter setting, and production flow, resulting in high mold costs, demanding skilled technicians, and increased development and debugging costs and time. Double-sided adhesive bonding is prone to air bubbles, and its stickiness easily attracts dust and impurities, causing secondary contamination and affecting appearance and usability. Summary of the Invention

[0004] The purpose of this invention is to provide an IME bonding cover plate module, its preparation method, and a light source to solve the problems existing in the prior art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: An IME bonding cover module, characterized in that it comprises: A substrate having a light-emitting element; The dammed adhesive layer is coated along the end face of the substrate with the light-emitting element, and has an injection port and an exhaust port; Plastic parts are bonded to the surface of the dammed adhesive layer away from the substrate; The substrate, the surrounding adhesive layer, and the plastic parts form the potting area. Adhesive is injected into the potting area through the injection port to form the potting adhesive layer.

[0006] Preferably, the substrate is a PCBA, and the light-emitting element is an LED. The LED forms a circuit with the PCBA through electrical connection.

[0007] Preferably, the width of the damming adhesive layer is 0.6mm to 1.2mm, the height is 2mm to 3mm, and the damming adhesive layer is made by curing liquid optical adhesive.

[0008] Preferably, the dam adhesive layer has a first sidewall and a second sidewall disposed opposite to each other, with the injection port located at the end of the first sidewall and the vent located at the other end of the second sidewall opposite to the injection port.

[0009] Preferably, the injection port is located at the center of the side wall of the dam adhesive layer, and the vent is located at the center of the side wall of the dam adhesive layer relative to the injection port and / or symmetrically arranged on both sides of the corner of the dam adhesive layer.

[0010] Preferably, the injection port is located at the middle position of the end of the first sidewall, and the vent is located at the middle position of the second sidewall relative to the other end of the injection port and / or the two sides of the corner are symmetrical about the middle position.

[0011] Preferably, the injection port and vent are sealed with silicone and / or silicone rubber sealant.

[0012] Preferably, the plastic part has heat dissipation fins with a thickness of 0.5mm to 1mm, a height of 5mm to 10mm, and a spacing of 3mm to 5mm between two adjacent heat dissipation fins.

[0013] Preferably, the heat dissipation fins have a prismatic structure and protrude from the surface of the plastic part. A method for preparing an IME bonding cover plate module includes the following steps: Clean the substrate and light-emitting elements to remove impurities; The substrate is placed in the mold, and the adhesive is applied along the periphery of the light-emitting element to form a dammed adhesive layer. During the adhesive application, an injection port and an vent are reserved. Plastic components are bonded to the top of the dam's adhesive layer using a patch process and then cured. The glue is injected through the injection port, and the gas inside the module is discharged through the vent, forming a potting glue layer; After the injection is completed, the module is placed in a vacuum environment, and the air bubbles in the liquid glue are expelled by vacuum pressure. The module is placed in the curing space for curing.

[0014] Preferably, the surface mount technology (SMT) process includes the following steps: Positioning and calibration: Fix the substrate with the dammed adhesive layer, mark the edge of the dammed adhesive layer, and use a suction nozzle to pick up the plastic part; Pre-pressure bonding involves applying pre-pressure and holding it for time t when the plastic part contacts the top of the dam adhesive layer, so that the plastic part and the dam adhesive layer are initially bonded together. After pre-pressurization, the bonding pressure is increased and the material is cured to ensure a firm bond between the plastic parts and the dam adhesive.

[0015] Preferably, when injecting the adhesive from the injection port, the module is tilted at 5° to 15°, with the injection port located at the high point of the module and the vent located at the low point of the module.

[0016] Preferably, after the potting is completed, the module is placed in a vacuum environment of -0.095 MPa to -0.1 MPa and kept at room temperature of 25℃-40℃ for 2-5 minutes. The vacuum negative pressure is used to completely extract the micro-bubbles remaining in the liquid potting compound, and then the normal pressure is slowly restored to complete the degassing.

[0017] Preferably, the module after potting and degassing is placed in a constant temperature environment of 60°C and cured for 120 minutes to allow the potting adhesive layer to be completely cross-linked and cured from the surface to the inside.

[0018] After the module has been cured following the completion of injection and degassing, the injection port and vent are sealed with silicone and / or silicone rubber sealant.

[0019] A light source includes the above-described IME bonding cover plate module or an IME bonding cover plate module prepared by the above-described IME bonding cover plate module preparation method.

[0020] Compared with the prior art, the beneficial effects of the present invention are: This invention uses a potting molding method to prepare the IME bonding cover plate module, which not only solves the problems of complex design and manufacturing process, high mold cost and many molding defects in the traditional injection molding process for bonding IME and cover plate, but also overcomes the problems of poor environmental protection, poor bonding reliability and cumbersome assembly process of double-sided adhesive bonding. At the same time, the IME bonding cover plate module of this invention can not only ensure good structural strength and stability, but also has excellent optical performance and better heat dissipation effect. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the IME bonding cover module structure in Embodiment 1 of the present invention; Figure 2 This is a schematic diagram of the glue injection port structure of the IME bonding cover plate module in Embodiment 1 of the present invention; Figure 3 This is a schematic diagram of the IME bonding cover plate module structure in Embodiment 3 of the present invention; Figure 4 This is a schematic diagram of the IME in-mold injection molding module structure in Comparative Example 1 of the present invention; Figure 5 This is a schematic diagram of the tilting and glue pouring process of the IME bonding cover module in the present invention.

[0022] Reference numerals: 100, substrate; 110, light-emitting element; 120, damming adhesive layer; 121, injection port; 122, vent; 130, plastic part; 131, heat dissipation fins; 140, potting compound layer; 200, lamp board; 210, LSR soft rubber; 220, outer shell. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] To achieve the above objectives, the present invention provides the following technical solution: A first aspect of the present invention provides an IME bonding cover module according to an embodiment, comprising, A substrate having a light-emitting element; The dammed adhesive layer is coated along the end face of the substrate with the light-emitting element, and has an injection port and an exhaust port; Plastic parts are bonded to the surface of the dammed adhesive layer away from the substrate; The substrate, the surrounding adhesive layer, and the plastic parts form the potting area. Adhesive is injected into the potting area through the injection port to form the potting adhesive layer.

[0025] In some embodiments, the substrate is a PCBA, the light-emitting element is an LED, the LED forms a circuit with the PCBA through an electrical connection, the PCBA controls the light-emitting state of the LED, and the light emitted by the LED passes through the dammed adhesive layer, the potting adhesive layer and the plastic parts to reach the outside of the module.

[0026] In some embodiments, the width of the damming adhesive layer is 0.6 mm to 1.2 mm, the height is 2 mm to 3 mm, and the damming adhesive layer is made by curing liquid optical adhesive.

[0027] In some embodiments, the liquid optical adhesive of the damming layer comprises components A and B in equal proportions. Component A comprises 35-45 parts of high-viscosity vinyl silicone oil and 15-25 parts of low-viscosity vinyl silicone oil, while component B comprises 35-45 parts of high-viscosity vinyl silicone oil and 15-25 parts of hydrogen-containing silicone oil. The damming layer prepared with this ratio has an elastic modulus of 1.5-3 MPa, a Shore D hardness of 55-70, and an elongation at break of 80%-150%, exhibiting good support capabilities. It can prevent deformation, collapse, or adhesive overflow, ensuring the stability of the overall module.

[0028] In some embodiments, the liquid optical adhesive comprises 40-60 parts of low-viscosity vinyl silicone oil, 10-20 parts of high-viscosity vinyl silicone oil, 5-15 parts of low-hydrogen silicone oil, 5-10 parts of fumed silica, and 5-15 parts of flexible silicone resin. The elastic modulus of the dammed adhesive layer in this formulation is ≤1MPa, which has good buffering ability and can deform with the bending of the flexible substrate without breaking due to bending stress.

[0029] In some embodiments, the dam adhesive layer has a first sidewall and a second sidewall disposed opposite to each other, with the injection port located at the end of the first sidewall and the vent located at the other end of the second sidewall opposite to the injection port.

[0030] In one specific embodiment, the injection port is located at the middle position of the end of the first sidewall, and the vent is located on the second sidewall symmetrically about the middle position on both sides of the other end corner of the injection port.

[0031] In some embodiments, the plastic part has heat dissipation fins with a thickness of 0.5 mm to 1 mm, a height of 5 mm to 10 mm, and a spacing of 3 mm to 5 mm between two adjacent heat dissipation fins.

[0032] In some embodiments, the plastic part comprises a polycarbonate / acrylonitrile-butadiene-styrene copolymer alloy, which consists of the following components by weight: 60-80 parts PC resin, 20-40 parts ABS resin, 10-15 parts flame retardant, 15-25 parts glass fiber, 0.5-1 part antioxidant, and 2-5 parts compatibilizer. The PC resin, as the core matrix, has good heat resistance and rigidity. The ABS resin is used to improve the injection molding performance of the plastic part. Flame retardants, such as phosphate esters, give the plastic part flame retardant properties. The glass fiber, antioxidant, and compatibilizer are used to improve the structural strength and stability of the plastic part and extend its service life. The heat dissipation fins on the plastic part are formed in one step with the plastic part matrix through an injection molding process.

[0033] In some embodiments, the potting compound layer comprises 100 parts of vinyl-terminated polydimethylsiloxane, 5-10 parts of hydrogen-containing silicone oil, 0.1-0.5 parts of platinum catalyst, and 120-180 parts of alumina. The vinyl-terminated polydimethylsiloxane, as the matrix of the potting compound layer, has good insulation and flexibility, while also giving the potting compound layer excellent high and low temperature resistance, ensuring that it will not harden, become brittle, or yellow under the long-term hot and cold cycling environment of LED operation. The hydrogen-containing silicone oil, under the catalysis of the platinum catalyst, allows the liquid potting compound layer to solidify into an elastomer. Alumina has high thermal conductivity, which can quickly transfer the heat generated when the LED is working, improving the heat dissipation performance of the entire module.

[0034] A second aspect of the present invention provides a method for preparing an IME bonding cover plate module according to an embodiment, which is a method for preparing a dimming component according to the above embodiment, comprising the following steps: S110 cleans the substrate and light-emitting elements to remove impurities.

[0035] In some embodiments, a lint-free cloth dampened with isopropyl alcohol can be used to gently wipe the substrate and the dust and oil stains on the substrate.

[0036] S120: The substrate is placed in the mold, and the adhesive is applied along the periphery of the light-emitting element to form a dammed adhesive layer. During the adhesive application, an injection port and an vent are reserved.

[0037] In some embodiments, an automatic dispensing machine is used to apply adhesive to the PCBA along the periphery of the LED, with the adhesive width being 0.6mm to 1.2mm and the height being 2mm to 3mm.

[0038] S130 involves bonding plastic parts to the top of the dam's adhesive layer using a patch process and then curing them.

[0039] In some embodiments, the surface mount technology (SMT) process includes the following steps: S131, Preparation before bonding: Place the cured substrate with the dammed adhesive layer and the plastic part to be bonded in a Class 100 cleanroom, with the ambient temperature controlled at 23±2℃ and humidity at 45%±5%, to avoid dust or moisture affecting the bonding effect; use a lint-free cloth dipped in isopropyl alcohol to gently wipe the bonding surface of the plastic part and the top of the dammed adhesive layer to remove residual oil or particulate impurities on the surface, and let it stand for 5 minutes after wiping to allow the isopropyl alcohol to completely evaporate.

[0040] S132, Positioning Calibration: Fix the substrate on the stage of the high-precision laminator, identify the edge positioning marks of the dammed adhesive layer through the machine vision system, adsorb the plastic part onto the nozzle end of the laminator, adjust the nozzle pressure to 0.03-0.05MPa to ensure that the plastic part is not deformed, and align the lamination baseline of the plastic part with the top baseline of the dammed adhesive layer through the vision alignment system, with the alignment accuracy controlled within ±0.02mm.

[0041] S133, Pre-press bonding: Set the descent speed of the bonding machine to 5mm / s. When the bonding surface of the plastic part is 1mm away from the top of the dam adhesive layer, slow down to 1mm / s and press down slowly. After contact, apply pre-pressure (0.1-0.2MPa) and hold for 3-5 seconds to allow the plastic part to initially bond with the dam adhesive layer and expel a small amount of air between the bonding surfaces.

[0042] S134, Pressure Curing: After pre-pressing, increase the bonding pressure to 0.3-0.5MPa. You can choose either UV curing adhesive or heat curing for curing. If using UV curing adhesive, turn on the built-in UV lamp (wavelength 365nm, power 80-100mW / cm²) of the laminator and irradiate for 10-20 seconds. If using heat curing adhesive, raise the temperature of the bonding area to 60-80℃ and keep it warm for 15-20 minutes to ensure that the plastic parts and the surrounding adhesive layer are firmly bonded.

[0043] S135, Exhaust test: After curing, release the pressure and check the airtightness of the glue injection port and exhaust port through the vacuum detection module of the laminating machine to ensure that there are no air bubbles left on the bonding surface; if air bubbles are detected, a small amount of suitable glue can be added through the glue injection port, and then the air bubbles can be discharged through the exhaust port before secondary curing.

[0044] S136. Wipe the surface of the module with a lint-free cloth dampened with anhydrous ethanol to remove excess adhesive that overflowed during the bonding process; check the flatness of the plastic parts to ensure there is no warping or offset (offset ≤ 0.03mm). If it passes the test, proceed to the next adhesive injection process.

[0045] S140, the glue is injected through the injection port, and the gas inside the module is discharged through the exhaust port to form a potting glue layer.

[0046] In some embodiments, when injecting adhesive, the module is tilted at 5° to 15°, with the injection port at the highest point and the vent at the lowest point. This utilizes gravity to assist the flow of the adhesive, smoothly pushing it from the injection port to the vent, thereby more effectively expelling and expelling air from the injection area and preventing air bubbles from accumulating. In this operation, the injection port should be located at the highest point of the tilted module, while the vent is at the lowest point. This arrangement ensures a smooth gas venting path and follows the principle of "subsurface venting," meaning that as the adhesive fills from the bottom up, air is completely expelled through the vent. By precisely controlling the amount of adhesive injected and stopping the injection just as the adhesive fills the cavity and is about to reach the vent, adhesive leakage can be avoided, while ensuring the injection area is completely filled.

[0047] S150, after the injection is completed, the module is placed in a vacuum environment and the air bubbles in the liquid glue are removed by vacuum pressure; In some embodiments, after potting is completed, the module is placed in a vacuum environment of -0.095 MPa to -0.1 MPa and kept at room temperature of 25°C to 40°C for 2-5 minutes. The residual microbubbles in the liquid potting compound are completely extracted by vacuum negative pressure, and then the normal pressure is slowly restored to complete the degassing.

[0048] S160, place the module into the curing space for curing.

[0049] In some embodiments, the module that has been potted and degassed is placed in a constant temperature environment of 60°C and cured for 120 minutes to allow the potting adhesive layer to be completely cross-linked and cured from the surface to the inside.

[0050] S170, after the module has been cured after filling and degassing, the injection port and vent are sealed with silicone and / or silicone rubber sealant.

[0051] Example 1 like Figure 1 As shown, this embodiment provides an IME bonding cover module, including a substrate 100 having a light-emitting element 110, a dammed adhesive layer 120 having an injection port 121 and an exhaust port 122, a plastic part 130 bonded to the surface of the dammed adhesive layer 120 away from the substrate 100, and a potting adhesive layer 140 formed by injecting adhesive into the potting area through the injection port 121.

[0052] The substrate 100 is a PCBA, and the light-emitting element 110 is an LED.

[0053] like Figure 2 As shown, the width of the dammed adhesive layer 120 is 0.6 mm and the height is 2 mm. The injection port 121 is located at the middle position of the end of the first side wall, and the vent 122 is located on both sides of the corner of the second side wall relative to the other end of the injection port 121. The liquid optical adhesive of the dammed adhesive layer 120 includes components A and B in equal proportions. Component A includes 40 parts of high-viscosity vinyl silicone oil and 20 parts of low-viscosity vinyl silicone oil, and component B includes 40 parts of high-viscosity vinyl silicone oil and 20 parts of hydrogen-containing silicone oil.

[0054] The upper surface of the plastic part 130 is provided with heat dissipation fins 131. The heat dissipation fins 131 are integrally formed with the plastic part 130 injection molding substrate. The heat dissipation fins 131 have a prismatic structure, a thickness of 0.5 mm, a height of 5 mm, and a spacing of 3 mm between two adjacent heat dissipation fins 131. The plastic part 130 includes a polycarbonate / acrylonitrile-butadiene-styrene copolymer alloy, which is composed of the following components by weight: 70 parts PC resin, 30 parts ABS resin, 12.5 parts phosphate ester, 20 parts glass fiber, 0.75 parts antioxidant, and 3.5 parts compatibilizer.

[0055] The potting compound 140 comprises 100 parts of vinyl-terminated polydimethylsiloxane, 7.5 parts of hydrogen-containing silicone oil, 0.35 parts of platinum catalyst, and 150 parts of alumina.

[0056] The specific preparation process of the IME bonding cover plate module in this embodiment includes the following: S110: Use a lint-free cloth dampened with isopropyl alcohol to gently wipe the PCBA and LED to remove impurities from the PCBA and LED.

[0057] S120, the substrate 100 is placed in the mold, and the adhesive is applied along the periphery of the light-emitting element 110 to form a dam adhesive layer 120. An automatic dispensing machine is used to apply adhesive to the PCBA along the periphery of the LED. The width of the adhesive is 0.9mm and the height is 2.5mm. When applying adhesive, a glue injection port 121 and an exhaust port 122 are reserved.

[0058] S130, a plastic part 130 is bonded to the top of the dam adhesive layer 120 using a patch bonding process and then cured.

[0059] In this embodiment, the surface mount technology (SMT) process includes the following steps: S131, Preparation before bonding: Select a plastic part 130 with heat dissipation fins 131 on its upper surface. The thickness of the heat dissipation fins 131 is 0.75mm, the height is 7.5mm, and the spacing between two adjacent heat dissipation fins 131 is 4mm. Place the cured substrate 100 with the dammed adhesive layer 120 and the plastic part 130 to be bonded in a Class 100 cleanroom. The ambient temperature is controlled at 23±2℃ and the humidity is 45%±5% to avoid dust or moisture affecting the bonding effect. Use a lint-free cloth dipped in isopropyl alcohol to gently wipe the bonding surface of the plastic part 130 and the top of the dammed adhesive layer 120 to remove residual oil or particulate impurities. After wiping, let it stand for 5 minutes to allow the isopropyl alcohol to completely evaporate.

[0060] S132, Positioning Calibration: Fix the substrate 100 on the stage of the high-precision laminator, identify the edge positioning marks of the dammed adhesive layer 120 through the machine vision system, adsorb the plastic part 130 onto the nozzle end of the laminator, adjust the nozzle pressure to 0.03MPa to ensure that the plastic part 130 is not deformed, and align the lamination reference line of the plastic part 130 with the top reference line of the dammed adhesive layer 120 through the vision alignment system, with the alignment accuracy controlled within ±0.02mm.

[0061] S133, Pre-press bonding: Set the descent speed of the bonding machine to 5mm / s. When the bonding surface of the plastic part 130 is 1mm away from the top of the dam adhesive layer 120, slow down to 1mm / s and press down slowly. After contact, apply a pre-pressure of 0.1MPa and hold for 3-5 seconds to make the plastic part 130 and the dam adhesive layer 120 initially bonded and expel a small amount of air between the bonding surfaces.

[0062] S134, Pressure Curing: After pre-pressing, increase the bonding pressure to 0.3MPa, turn on the built-in UV lamp of the laminator, wavelength 365nm, power 80-100mW / cm², and irradiate for 10-20 seconds.

[0063] S135, Exhaust test: After curing, release the pressure and check the airtightness of the glue injection port 121 and exhaust port 122 through the vacuum detection module of the laminating machine to ensure that there are no air bubbles left on the bonding surface; if air bubbles are detected, a small amount of suitable glue can be added through the glue injection port 121, and then the air bubbles can be discharged through the exhaust port 122 before secondary curing.

[0064] S136, Wipe the module surface with a lint-free cloth dampened with anhydrous ethanol to remove excess adhesive that overflowed during the bonding process; check the flatness of the plastic part 130 to ensure no warping and an offset of ≤0.03mm. If qualified, proceed to the next adhesive injection process.

[0065] S140, the glue is injected through the injection port 121, and the gas in the module is discharged through the exhaust port 122, forming the potting glue layer 140.

[0066] In this embodiment, as Figure 4As shown, when injecting glue, the module is tilted at 5°, with the glue injection port 121 located at the high point of the module and the vent port 122 located at the low point of the module.

[0067] After the S150 is filled, place the module in a vacuum environment and use the vacuum pressure to remove the air bubbles in the liquid glue.

[0068] In this embodiment, after the potting is completed, the module is placed in a vacuum environment of -0.095MPa to -0.1MPa and kept at room temperature of 25℃-40℃ for 2-5 minutes. The vacuum negative pressure is used to completely extract the micro-bubbles remaining in the liquid potting compound, and then the normal pressure is slowly restored to complete the degassing.

[0069] S160, place the module into the curing space for curing.

[0070] In this embodiment, the module that has been potted and degassed is placed in a constant temperature environment of 60°C and cured for 120 minutes to allow the potting adhesive layer 140 to be completely cross-linked and cured from the surface to the inside.

[0071] S170, after the module has been cured after injection and degassing, the injection port 121 and the vent port 122 are sealed with silicone.

[0072] Example 2 This embodiment provides an IME bonding cover module, including a substrate 100 having a light-emitting element 110, a dammed adhesive layer 120 having an injection port 121 and an exhaust port 122, a plastic part 130 bonded to the surface of the dammed adhesive layer 120 away from the substrate 100, and a potting adhesive layer 140 formed by injecting adhesive into the potting area through the injection port 121.

[0073] The substrate 100 is a PCBA, and the light-emitting element 110 is an LED.

[0074] The width of the dammed adhesive layer 120 is 0.6 mm and the height is 2 mm. The injection port 121 is located at the middle position of the end of the first side wall, and the vent 122 is located on both sides of the corner of the second side wall relative to the other end of the injection port 121. The liquid optical adhesive of the dammed adhesive layer 120 includes components A and B in equal proportions. Component A includes 40 parts of high viscosity vinyl silicone oil and 20 parts of low viscosity vinyl silicone oil, and component B includes 40 parts of high viscosity vinyl silicone oil and 20 parts of hydrogen-containing silicone oil.

[0075] The upper surface of the plastic part 130 is provided with heat dissipation fins 131. The heat dissipation fins 131 and the plastic part 130 are formed in one step by injection molding. The thickness of the heat dissipation fins 131 is 0.5mm, the height is 5mm, and the distance between two adjacent heat dissipation fins 131 is 3mm. The liquid optical adhesive includes 50 parts of low viscosity vinyl silicone oil, 15 parts of high viscosity vinyl silicone oil, 10 parts of low hydrogen content silicone oil, 7.5 parts of fumed silica, and 10 parts of flexible silicone resin.

[0076] The potting compound 140 comprises 100 parts of vinyl-terminated polydimethylsiloxane, 7.5 parts of hydrogen-containing silicone oil, 0.35 parts of platinum catalyst, and 150 parts of alumina.

[0077] The preparation process of the IME bonding cover plate module in this embodiment is the same as that in Embodiment 1, and will not be repeated here.

[0078] Example 3 like Figure 3 As shown, this embodiment provides an IME bonding cover module, including a substrate 100 having a light-emitting element 110, a dammed adhesive layer 120 having an injection port 121 and an exhaust port 122, a plastic part 130 bonded to the surface of the dammed adhesive layer 120 away from the substrate 100, and a potting adhesive layer 140 formed by injecting adhesive into the potting area through the injection port 121.

[0079] The substrate 100 is a PCBA, and the light-emitting element 110 is an LED.

[0080] The width of the dammed adhesive layer 120 is 0.6 mm and the height is 2 mm. The injection port 121 is located at the middle position of the end of the first side wall, and the vent 122 is located on both sides of the corner of the second side wall relative to the other end of the injection port 121. The liquid optical adhesive of the dammed adhesive layer 120 includes components A and B in equal proportions. Component A includes 40 parts of high-viscosity vinyl silicone oil and 20 parts of low-viscosity vinyl silicone oil, and component B includes 40 parts of high-viscosity vinyl silicone oil and 20 parts of hydrogen-containing silicone oil.

[0081] The plastic part 130 has a flat design on both the upper and lower surfaces and no heat dissipation fins 131. The plastic part 130 includes a polycarbonate / acrylonitrile-butadiene-styrene copolymer alloy, which is composed of the following components by weight: 70 parts PC resin, 30 parts ABS resin, 12.5 parts phosphate ester, 20 parts glass fiber, 0.75 parts antioxidant and 3.5 parts compatibilizer.

[0082] The potting compound 140 comprises 100 parts of vinyl-terminated polydimethylsiloxane, 7.5 parts of hydrogen-containing silicone oil, 0.35 parts of platinum catalyst, and 150 parts of alumina.

[0083] The preparation process of the IME bonding cover plate module in this embodiment is the same as that in Embodiment 1, and will not be repeated here.

[0084] Comparative Example 1 like Figure 5 As shown, this comparative example provides an LED light board prepared by in-mold injection molding process, including a light board 200, an LED electrically connected to the light board 200, an LSR soft rubber 210 covering the LED, and an adhesive plate 220 injection molded onto the LSR soft rubber.

[0085] The preparation process of the LED light panel in this comparative example is as follows.

[0086] S1: LED light board 200 pretreatment: The LED light board 200, after LED chip soldering and circuit connection, is cleaned to remove dust, oil and other impurities from the surface, ensuring that the subsequent LSR soft adhesive 210 can adhere well to the surface of the LED light board 200.

[0087] S2: LSR soft adhesive pre-coating. The pre-treated LED board is placed in a special mold. LSR soft adhesive 210 is evenly coated on the surface of the LED chip and some electrode circuits using precision dispensing equipment. The parameters of the dispensing equipment are controlled to form a uniform coating layer of LSR soft adhesive 210 with a thickness of 0.2-0.5 mm. After coating, the mold is placed in a curing oven and cured for 10-20 minutes at a temperature of 120-150℃ and a pressure of 0.5-1.0MPa to allow the LSR soft adhesive 210 to fully cure and form a buffer protection structure that tightly wraps the LED device. The curing equipment uses a special curing oven with temperature and pressure control functions to ensure the stability and consistency of the curing process.

[0088] S3: IME Injection Molding. The LED light panel 200, pre-wrapped in LSR soft rubber 210, is placed into the injection cavity of the IME injection mold. Polycarbonate and other injection molding materials are used. Injection molding is carried out at an injection temperature of 200-250℃ and an injection pressure of 80-120MPa. The injection molding equipment is an injection molding machine with high-precision temperature and pressure control to ensure that the material can fill the mold cavity evenly during the injection process and bond tightly with the LSR soft rubber 210 wrapping layer to form a complete LED light panel shell 220. After injection molding, the product is demolded to obtain the final IME injection molded LED light panel product.

[0089] The light transmittance, sealing performance, mechanical properties, and heat dissipation performance of the examples and comparative examples were tested.

[0090] Table 1 shows a data comparison between the examples and comparative examples.

[0091] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An IME bonding cover module, characterized in that: include, A substrate having a light-emitting element; The dammed adhesive layer is coated along the end face of the substrate with the light-emitting element, and has an injection port and an exhaust port; Plastic parts are bonded to the surface of the dammed adhesive layer away from the substrate; The substrate, the surrounding adhesive layer, and the plastic parts form a potting area, and the adhesive is injected into the potting area through the injection port to form a potting adhesive layer.

2. The IME bonding cover module according to claim 1, characterized in that: The substrate is a PCBA, and the light-emitting element is an LED. The LED forms a circuit with the PCBA through electrical connection.

3. The IME bonding cover module according to claim 1, characterized in that: The width of the dam-forming adhesive layer is 0.6mm to 1.2mm, the height is 2mm to 3mm, and the dam-forming adhesive layer is made by curing liquid optical adhesive.

4. The IME bonding cover module according to claim 1, characterized in that: The dam adhesive layer has a first sidewall and a second sidewall that are arranged opposite to each other. The injection port is located at the end of the first sidewall, and the vent is located at the other end of the second sidewall opposite to the injection port.

5. The IME bonding cover module according to claim 4, characterized in that: The glue injection port is located at the middle position of the end of the first side wall, and the vent is located at the middle position of the other end of the second side wall relative to the glue injection port and / or the two sides of the corner are symmetrical about the middle position.

6. The IME bonding cover module according to claim 1, characterized in that: The injection port and vent are sealed with silicone and / or silicone rubber sealant.

7. The IME bonding cover module according to claim 1, characterized in that: The plastic part has a heat dissipation fin array on the surface away from the substrate. The heat dissipation fins have a thickness of 0.5mm to 1mm, a height of 5mm to 10mm, and a spacing of 3mm to 5mm between two adjacent heat dissipation fins.

8. The IME bonding cover module according to claim 7, characterized in that: The heat dissipation fins have a prismatic structure and protrude from the surface of the plastic part.

9. A method for preparing an IME bonding cover plate module, characterized in that, Includes the following steps: Clean the substrate and light-emitting elements to remove impurities; A dammed adhesive layer is formed by applying adhesive along the periphery of the light-emitting element on the substrate, with a glue injection port and an venting port reserved during the adhesive application process. Plastic components are bonded to the top of the dam's adhesive layer using a patch bonding process; The glue is injected through the injection port, and the gas inside the module is discharged through the vent, forming a potting glue layer; After the injection is completed, the module is placed in a vacuum environment, and the air bubbles in the liquid glue are expelled by vacuum pressure. The modules that have been filled and degassed are then cured.

10. The method for preparing the IME bonding cover module according to claim 9, characterized in that: The patch process includes the following steps: Fix the substrate with the dammed adhesive layer, mark the edge of the dammed adhesive layer, and use a suction nozzle to pick up the plastic part; When the plastic part comes into contact with the top of the dam's adhesive layer, apply pre-pressure and hold it to allow the plastic part to initially adhere to the dam's adhesive layer; After pre-pressing, increase the bonding pressure and allow it to cure to ensure that the plastic parts are firmly bonded to the dam adhesive.

11. The method for preparing the IME bonding cover plate module according to claim 9, characterized in that: When injecting the glue through the injection port, tilt the module at a 5° to 15° angle so that the injection port is at the highest point of the module and the vent is at the lowest point of the module.

12. The method for preparing the IME bonding cover module according to claim 9, characterized in that: After the potting is completed, the module is placed in a vacuum environment of -0.095MPa to -0.1MPa and kept at room temperature of 25℃-40℃ for 2-5 minutes. The vacuum negative pressure is used to completely extract the micro air bubbles remaining in the liquid potting compound, and then the normal pressure is restored to complete the degassing.

13. The method for preparing the IME bonding cover plate module according to claim 9, characterized in that: The completed potting and degassing modules are placed in a constant temperature environment of 60°C and cured for 120 minutes to allow the potting adhesive layer to fully cross-link and cure from the surface to the inside.

14. The method for preparing the IME bonding cover plate module according to claim 9, characterized in that: After the module has been cured following the completion of injection and degassing, the injection port and vent are sealed with silicone and / or silicone rubber sealant.

15. A light source, characterized in that, Includes the IME bonding cover plate module as described in any one of claims 1-8 or the IME bonding cover plate module prepared by the method described in any one of claims 9-14.

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